WO2025016348A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2025016348A1
WO2025016348A1 PCT/CN2024/105398 CN2024105398W WO2025016348A1 WO 2025016348 A1 WO2025016348 A1 WO 2025016348A1 CN 2024105398 W CN2024105398 W CN 2024105398W WO 2025016348 A1 WO2025016348 A1 WO 2025016348A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting groove
light
electrode
electronic device
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/105398
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English (en)
French (fr)
Inventor
李发军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2025016348A1 publication Critical patent/WO2025016348A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Definitions

  • the present application belongs to the field of electronic equipment, and specifically relates to an electronic equipment.
  • Electronic devices are equipped with a variety of photoelectric sensors that realize the conversion of optical signals and electrical signals.
  • the light-emitting element in the photoelectric sensor emits outgoing light, which is then emitted back to the photoelectric sensor after encountering an object and received by the photosensitive element in the photoelectric sensor.
  • the photosensitive element converts the received optical signal into an electrical signal, so that information can be obtained by analyzing the electrical signal.
  • the light emitting element and the photosensitive element are arranged together on the first circuit board, and a light shielding cover is arranged on the light emitting element and the photosensitive element to prevent or reduce the emitted light of the light emitting element from directly entering the photosensitive element and interfering with the photosensitive element receiving the reflected light.
  • a second circuit board and a wound charging coil are arranged on the side of the first circuit board away from the light emitting element and the photosensitive element.
  • the charging coil is used to charge the electronic device, and the second circuit board is used to set components such as a control chip that controls the charging of the charging coil.
  • the purpose of the embodiments of the present application is to provide an electronic device that can solve the technical problem of complicated assembly steps of electronic devices in the related art.
  • an electronic device including:
  • a circuit board comprising a dielectric layer and a plurality of conductive layers arranged at intervals, wherein the dielectric layer is insulated and spaced between adjacent conductive layers, a first electrode, a second electrode and a charging coil are arranged in the plurality of conductive layers, and the circuit board has a first mounting groove exposing the first electrode, a second mounting groove exposing the second electrode, and a groove wall spaced between the first mounting groove and the second mounting groove;
  • a light emitting element received in the first mounting groove and electrically connected to the first electrode
  • the photosensitive element is received in the second mounting groove and electrically connected to the second electrode, and the groove wall is shielded between the light-emitting element and the photosensitive element.
  • the light-emitting component and the photosensitive component are shielded by the groove wall, and the outgoing light emitted by the light-emitting component can be partially shielded by the circuit board, thereby preventing the outgoing light emitted by the light-emitting component from directly entering the photosensitive component, improving the accuracy of the electrical signal generated by the photosensitive component, eliminating the step of additionally installing a light shield, and simplifying the assembly steps of the electronic device; the circuit board can be used to shield the light-emitting component and the photosensitive component.
  • Protection can avoid or reduce the external force directly acting on the light-emitting parts and the photosensitive parts to a certain extent to damage the light-emitting parts and the photosensitive parts; by laying the charging coil on at least one layer of the multiple conductive layers, when assembling the electronic device, it is unnecessary to wind the charging coil on one side of the circuit board and weld the charging coil and the circuit board, thereby simplifying the assembly steps of the electronic device.
  • FIG1 is a schematic diagram of a structure of an electronic device provided by an embodiment of the present application.
  • FIG2 is a schematic diagram of a cross-sectional structure of an electronic device provided by an embodiment of the present application.
  • FIG3 is a second schematic cross-sectional structure diagram of an electronic device provided by an embodiment of the present application.
  • FIG4 is a third schematic diagram of a cross-sectional structure of an electronic device provided by an embodiment of the present application.
  • FIG5 is a fourth schematic cross-sectional structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 6 is a second schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • first, second, etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first”, “second”, etc. are generally of one type, and the number of objects is not limited.
  • the first object can be one or more.
  • “and/or” in the specification and claims represents at least one of the connected objects, and the character “/" generally indicates that the objects associated with each other are in an "or” relationship.
  • an embodiment of the present application provides an electronic device 100, which includes: a circuit board 1, a photosensitive member 3 and a light-emitting member 2, the circuit board 1 includes a dielectric layer 11 and a plurality of conductive layers 12 arranged at intervals, the dielectric layer 11 is insulated and spaced between adjacent conductive layers 12, a first electrode 121, a second electrode 122 and a charging coil 123 are arranged in the plurality of conductive layers 12, the circuit board 1 has a first mounting groove 13 exposing the first electrode 121 and a second mounting groove 14 exposing the second electrode 122, and a groove wall 17 spaced between the first mounting groove 13 and the second mounting groove 14; the light-emitting member 2 is accommodated in the first mounting groove 13 and electrically connected to the first electrode 121; the photosensitive member 3 is accommodated in the second mounting groove 14 and electrically connected to the second electrode 122, and the groove wall 17 is between the light-emitting member 2 and the photosensitive member 3.
  • the outgoing light emitted by the light emitting element 2 can be emitted through the opening of the first mounting groove 13, and the photosensitive element 3 can receive the reflected light of the outgoing light through the opening of the second mounting groove 14.
  • the photosensitive element 3 and the light emitting element 2 in the electronic device 100 provided in the present application can cooperate to form an optical distance sensor, a biological information collector, an optical air detector, a photoelectric counter, etc.
  • the biological information collector can be used to collect biological information such as heart rate, respiratory rate, blood oxygen, and blood pressure.
  • the light-emitting element 2 may be an element that can convert an electrical signal into an optical signal, such as an LED lamp bead (light-emitting diode).
  • the photosensitive element 3, as a photosensitive element, can convert an optical signal into an electrical signal.
  • the emitted light of the light-emitting element 2 is physically reflected, and the reflected light is projected onto the photosensitive element 3, causing the resistance value of the photosensitive element 3 to change.
  • the resistance change can be used to perform a step analysis to obtain the required biological information, distance information, air information, etc.
  • the electronic device 100 may be provided with only one light-emitting element 2 and one photosensitive element 3, or the electronic device 100 may be provided with multiple light-emitting elements 2 and multiple photosensitive elements 3.
  • the light-emitting elements 2 and the photosensitive elements 3 may be provided in a one-to-one correspondence, or in a one-to-many manner.
  • the light emitting element 2 and the photosensitive element 3 cooperate to collect biological information based on photoplethysmo graphy (PPG).
  • PPG photoplethysmo graphy
  • the light emitting element 2 and the photosensitive element 3 are close to the skin, and the light emitting element 2 emits light waves of a specific wavelength to the skin.
  • the skin has different absorption rates for light waves of a specific wavelength under different conditions, so the photosensitive element 3 can obtain reflected light of different intensities.
  • the photosensitive element 3 converts the reflected light into an electrical signal.
  • the obtained electrical signal can be used to calculate biological information such as changes in blood flow rate, changes in skin melanin, changes in skin water content, and blood oxygen content.
  • the circuit board 1 includes a dielectric layer 11 and a plurality of conductive layers 12.
  • the patterned conductive layer 12 can form a variety of conductive structures, which may include a first electrode 121 for connecting the photosensitive member 3, a second electrode 122 for connecting the light-emitting member 2, and a charging coil 123.
  • the first electrode 121, the second electrode 122, and the charging coil 123 can be arranged on the same conductive layer 12, that is, the same conductive material is patterned to obtain the first electrode 121, the second electrode 122, and the charging coil 123 at the same time.
  • the first electrode 121, the second electrode 122, and the charging coil 123 can also be arranged in different conductive layers 12, that is, different conductive materials are patterned to obtain the first electrode 121, the second electrode 122, and the charging coil 123 in each conductive layer 12.
  • the light-emitting component 2 and the photosensitive component 3 are arranged on one side of the circuit board 1, and the electrical connection end of the light-emitting component 2 and the electrical connection end of the photosensitive component 3 are electrically connected to the first electrode 121 and the second electrode 122 respectively, so that the light emission of the light-emitting component 2 can be controlled by the first electrode 121, and the electrical signal generated by the photosensitive component 3 can be transmitted through the second electrode 122.
  • the first mounting groove 13 and the second mounting groove 14 may be recessed portions formed by recessing from the surface of the circuit board 1, and the unrecessed portion of the circuit board 1 between the first mounting groove 13 and the second mounting groove 14 forms a groove wall 17.
  • Two oppositely disposed wall surfaces in the groove wall 17 respectively define the wall surface of the first mounting groove 13 and the wall surface of the second mounting groove 14.
  • the first mounting groove 13 exposes the first electrode 121 to facilitate the connection between the light-emitting element 2 accommodated in the first mounting groove 13 and the first electrode 121
  • the second mounting groove 14 exposes the second electrode 122 to facilitate the connection between the photosensitive element 3 accommodated in the second mounting groove 14 and the second electrode 122.
  • the light-emitting element 2 and the photosensitive element 3 are accommodated in the first mounting groove 13 and the second mounting groove 14, respectively, and the groove wall 17 is spaced between the photosensitive element 3 and the light-emitting element 2, so that the circuit board 1 can replace the light shield, to a certain extent shield or reduce the direct entry of the emitted light into the photosensitive element 3, thereby eliminating the need to install an additional light shield on the circuit board 1, which is conducive to simplifying the assembly steps of the electronic device 100.
  • the circuit board 1 can protect the light-emitting component 2 and the photosensitive component 3, and to a certain extent avoid or reduce external forces directly acting on the light-emitting component 2 and the photosensitive component 3 to damage the light-emitting component 2 and the photosensitive component 3.
  • a conductive layer 12 in the circuit board 1 is patterned to form a wound charging coil 123, or multiple conductive layers 12 are patterned to form a plurality of wound charging coils 123.
  • the charging coil 123 is used to charge the electronic device.
  • the charging coil 123 can be electrically connected to an external charging device by electromagnetic coupling, thereby receiving electrical energy from the external charging device by electromagnetic induction.
  • a battery can be provided in the electronic device 100 to store the electrical energy received from the external charging device.
  • the electric coil 123 is used to charge the electronic device 100, which can be understood as the external charging device charging the battery in the electronic device 100 through the charging coil 123. It can be understood that the external charging device may also include a charging coil.
  • the charging coil in the external charging device can be used to radiate electrical energy.
  • the charging coil 123 in the electronic device 100 When the charging coil 123 in the electronic device 100 is close enough to the charging coil in the external charging device, the charging coil 123 in the electronic device 100 can establish electromagnetic coupling with the charging coil in the external charging device, and the charging coil 123 in the electronic device 100 can receive electrical energy from the external charging device through electromagnetic induction.
  • the light emitting element 2 and the photosensitive element 3 are arranged on the first side of the circuit board 1, and the light waves emitted by the light emitting element 2 are emitted from the first side, and the photosensitive element 3 receives the light waves emitted from the first side.
  • the first component 4 other than the light emitting element 2 and the photosensitive element 3 in the electronic device 100 can be arranged on the second side of the circuit board 1, so as to avoid or reduce the mutual interference between the light emitting element 2, the photosensitive element 3 and the first component 4 to a certain extent.
  • the first side and the second side can be arranged along the first direction X, and the dielectric layer 11 and the conductive layer 12 can also be arranged along the first direction X.
  • the first component 4 is a wireless charging management chip that controls the charging of the charging coil 123, or a data processing chip that processes the electrical signal generated by the photosensitive element 3.
  • the dielectric layer 11 is spaced between adjacent conductive layers 12 to avoid unwanted electrical connection between adjacent conductive layers 12.
  • the first conductive layer 12 is patterned to form a first electrode 121, and the photosensitive element 3 is connected to the first electrode 121;
  • the second conductive layer 12 is patterned to form a second electrode 122, and the light-emitting element 2 is connected to the second electrode 122;
  • the third conductive layer 12 is patterned to form a conductive circuit, and the conductive circuit is used to connect to the first component 4 other than the light-emitting element 2 and the photosensitive element 3 in the electronic device 100.
  • the first conductive layer 12 and the second conductive layer 12 can be the same conductive layer 12, or different conductive layers 12, and the first conductive layer 12 and the second conductive layer 12 are respectively located on the side of the third conductive layer 12 away from the first component 4.
  • the light-emitting component 2 is arranged in the first installation groove 13, and the photosensitive component 3 is arranged in the second installation groove 14, so that the light-emitting component 2 and the photosensitive component 3 are shielded by the groove wall 17, and the outgoing light emitted by the light-emitting component 2 can be partially blocked by the circuit board 1, thereby avoiding the outgoing light emitted by the light-emitting component 2 from directly entering the photosensitive component 3, improving the accuracy of the electrical signal generated by the photosensitive component 3, eliminating the step of additionally installing a light shield, and simplifying the assembly steps of the electronic device 100; the circuit board 1 can protect the light-emitting component 2 and the photosensitive component 3, to a certain extent avoid or reduce external forces directly acting on the light-emitting component 2 and the photosensitive component 3 to damage the light-emitting component 2 and the photosensitive component 3; by laying the charging coil 123 on at least one layer of the multiple conductive layers 12, when assembling the electronic device 100, it is omitted to
  • the charging coil 123 is disposed around the first mounting groove 13 and the second mounting groove 14 .
  • the charging coil 123 is arranged around the first mounting groove 13 and the second mounting groove 14, so that the charging coil 123 has a larger diameter.
  • the charging coil 123 has a larger diameter, and the greater the magnetic flux passing through the charging coil 123, the better it is to improve the charging power of the charging coil 123.
  • the charging coil 123 in one conductive layer 12 can be arranged spirally around the first mounting groove 13 and the second mounting groove 14 in a plane as needed to increase the number of turns of the charging coil 123 in the conductive layer 12.
  • the multiple charging coils 123 can be arranged in sequence along the first direction X.
  • the first direction X can be the thickness direction of the circuit board 1.
  • the charging coil 123 is spirally arranged in a plane, and the plane can be aligned with the first direction X.
  • a direction X is set vertically.
  • the first mounting groove 13 and the second mounting groove 14 can be spaced apart along the second direction Y, and a conductive structure can be distributed in the dielectric layer 11 between the first mounting groove 13 and the second mounting groove 14 as required to improve the density of circuit distribution in the circuit board 1 .
  • the circuit board 1 also includes a first shielding layer 15 and a second shielding layer 16.
  • the first shielding layer 15 is arranged along the wall of the first mounting groove 13 and surrounds the light-emitting component 2.
  • the first shielding layer 15 separates the light-emitting component 2 and the charging coil 123.
  • the second shielding layer 16 is arranged along the wall of the second mounting groove 14 and surrounds the photosensitive component 3.
  • the second shielding layer 16 separates the photosensitive component 3 and the charging coil 123.
  • the first shielding layer 15 and the second shielding layer 16 can both be made of metal materials.
  • the first shielding layer 15 and the second shielding layer 16 can both reduce or prevent the magnetic field generated by the external charging device and the electric field generated by the charging coil 123 from affecting the operation of the light-emitting element 2 and the photosensitive element 3.
  • the first shielding layer 15 and the second shielding layer 16 may be formed on the wall surface of the first mounting groove 13 and the wall surface of the second mounting groove 14 respectively by copper electroplating technology.
  • the electrode and the shielding layer are spaced apart. Since the first shielding layer 15 covers the side wall of the first mounting groove 13 defined by the circuit board 1, and the second shielding layer 16 covers the side wall of the second mounting groove 14 defined by the circuit board 1, the first electrode 121 can be set on the bottom wall of the first mounting groove 13 defined by the circuit board 1, and the second electrode 122 can be set on the bottom wall of the second mounting groove 14 defined by the circuit board 1.
  • a first mounting groove 13 can expose multiple first electrodes 121, and the multiple first electrodes 121 can be electrically connected to the same light-emitting component 2, or they can be electrically connected to different light-emitting components 2 respectively.
  • a second mounting groove 14 can expose multiple second electrodes 122, and the multiple second electrodes 122 can be electrically connected to the same photosensitive component 3, or they can be electrically connected to different photosensitive components 3 respectively.
  • one first mounting groove 13 exposes two first electrodes 121, and the positive and negative poles of the same light-emitting component 2 are electrically connected to the two first electrodes 121 respectively.
  • One second mounting groove 14 exposes two second electrodes 122 , and the positive electrode and the negative electrode of the same photosensitive element 3 are electrically connected to the two second electrodes 122 , respectively.
  • the first mounting groove 13 and the second mounting groove 14 can respectively penetrate one layer of the dielectric layer 11, or respectively penetrate multiple layers of the dielectric layer 11.
  • the number of dielectric layers 11 penetrated by the first mounting groove 13 and the number of dielectric layers 11 penetrated by the second mounting groove 14 can be determined based on the thickness of the dielectric layer 11, the length of the light-emitting component 2 along the first direction X, the length of the photosensitive component 3 along the first direction X, etc.
  • the depths of the first mounting groove 13 and the second mounting groove 14 along the first direction X may be different, that is, the number of layers of the dielectric layer 11 penetrated by the first mounting groove 13 and the second mounting groove 14 may be different. Since the sizes of the light-emitting element 2 and the photosensitive element 3 are different, the sizes of the first mounting groove 13 adapted to the light-emitting element 2 and the second mounting groove 14 adapted to the photosensitive element 3 may also be different, so the depths of the first mounting groove 13 and the second mounting groove 14 may be adjusted according to the sizes of the light-emitting element 2 and the photosensitive element 3, so that the light-emitting element 2 is accommodated in the first mounting groove 13 and the distance from the light-emitting element 2 to the opening of the first mounting groove 13 meets the requirements, and the photosensitive element 3 is accommodated in the second mounting groove 14 and the distance from the photosensitive element 3 to the opening of the second mounting groove 14 meets the requirements.
  • the exposed second dielectric layer 112 supports the light emitting member 2.
  • the exposed second dielectric layer 112 supports the photosensitive member 3.
  • the first dielectric layer 111 and the second dielectric layer 112 can be made of the same material, except that the second dielectric layer 112 does not penetrate at least a portion of the first mounting groove 13 and at least a portion of the second mounting groove 14.
  • the prepared first dielectric layer 111 can be opened until the second dielectric layer 112 is exposed.
  • the first electrode 121 is embedded in the second dielectric layer 112 exposed from the first mounting groove 13
  • the second electrode 122 is embedded in the second dielectric layer 112 exposed from the second mounting groove 14 .
  • the exposed second dielectric layer 112 supports the light-emitting element 2, and the first electrode 121 is embedded in the exposed second dielectric layer 112.
  • the exposed surface of the first electrode 121 and the exposed surface of the second dielectric layer 112 may be in the same reference plane.
  • the exposed second dielectric layer 112 supports the photosensitive element 3, and the second electrode 122 is embedded in the exposed second dielectric layer 112.
  • the exposed surface of the second electrode 122 and the exposed surface of the second dielectric layer 112 may be in the same reference plane.
  • the conductive layer 12 having any one of the first electrode 121, the second electrode 122 and the charging coil 123 other conductive structures may be arranged as needed, for example: conductive lines connecting the electrodes, capacitors, etc.
  • the first electrode 121, the second electrode 122, the charging coil 123 and other conductive structures may be obtained by patterning the same layer of conductive material.
  • a dielectric layer, a patterned conductive layer 12, a dielectric layer 11, a patterned conductive layer 12, etc. may be prepared in sequence.
  • the prepared first dielectric layer 111 may be subjected to an opening treatment until the second dielectric layer 112 and the electrode embedded in the second dielectric layer 112 are exposed, thereby obtaining a first mounting groove 13 exposing the first electrode 121 or a second mounting groove 14 exposing the second electrode 122.
  • the dielectric layer 11 has through holes, and adjacent charging coils 123 are connected in series through the through holes.
  • the charging coil 123 is used to charge the electronic device 100, when arranging each layer of the charging coil 123, the current direction in each layer of the charging coil 123 is ensured to be consistent through circuit design. Multiple charging coils 123 are connected in series through through holes to increase the number of turns of the charging coils 123 distributed on the circuit board 1.
  • the electronic device 100 includes:
  • a plurality of first components 4 are arranged on a side of the circuit board 1 away from the photosensitive element 3 , and the first components 4 are electrically connected to at least one conductive layer 12 .
  • the conductive layer 12 located away from the photosensitive element 3 in the spaced-apart multilayer conductive layers 12 is electrically connected to the first component 4.
  • the photosensitive element 3, the light-emitting element 2 and the first component 4 can all be bound to the same circuit board 1, thereby eliminating the step of soldering multiple circuit boards 1, which is beneficial to reducing the size of the electronic device 100.
  • the number of the light emitting member 2 and the light sensing member 3 can be set to multiple as needed.
  • the number of the first mounting slots 13 is multiple
  • the number of the light emitting members 2 is multiple
  • the multiple light emitting members 2 form a light emitting group.
  • the optical groups are arranged in a one-to-one correspondence in the plurality of first mounting grooves 13.
  • the number of the second mounting grooves 14 is plural
  • the number of the photosensitive members 3 is plural
  • the plurality of photosensitive members 3 are arranged in a one-to-one correspondence in the plurality of second mounting grooves 14.
  • different light-emitting elements 2 can be controlled to emit light of different colors.
  • different photosensitive elements 3 can receive reflected light of different colors.
  • the electronic device 100 can analyze the electrical signals generated by different photosensitive elements 3 receiving reflected light of different colors to obtain more information.
  • a light-emitting group includes a red light-emitting element 2R for emitting red light, a green light-emitting element 2G for emitting green light, and a blue light-emitting element 2B for emitting blue light.
  • the number of light-emitting elements 2 is 12
  • the number of photosensitive elements 3 is 4
  • the red light-emitting element 2R, the green light-emitting element 2G and the blue light-emitting element 2B form a group and are placed in the same first mounting groove 13
  • the 12 light-emitting elements 2 form 4 light-emitting groups and are placed in 4 first mounting grooves 13 respectively.
  • the 4 photosensitive elements 3 are placed in 4 second mounting grooves 14 respectively.
  • the first mounting grooves 13 and the second mounting grooves 14 are arranged in a ring in sequence.
  • the circuit board 1 When preparing the electronic device 100 provided in the present application, the circuit board 1 can be prepared first, and then the light-emitting element 2 and the photosensitive element 3 are respectively assembled into the first mounting groove 13 and the second mounting groove 14, and the light-emitting element 2 and the first electrode 121 are bound, and the photosensitive element 3 and the second electrode 122 are bound.
  • the circuit board 1 is turned over, and one or more first components 4 are bound on the surface of the circuit board 1 facing away from the light-emitting element 2 and the photosensitive element 3.
  • a dielectric layer 11 can be provided first, and a conductive material is arranged on the dielectric layer 11, and the conductive material is patterned to form the desired conductive layer 12.
  • a dielectric material is arranged on the prepared conductive layer 12 to form another dielectric layer, and the dielectric layer covers the conductive layer 12.
  • a conductive material is arranged on the newly prepared dielectric layer 11, and the conductive material is patterned to form another desired conductive layer 12, and so on, until the desired number of dielectric layers 11 and conductive layers 12 are completed.
  • the circuit board 1 is grooved by controlled depth milling, laser, etc.
  • the grooved circuit board 1 is subjected to copper plating to form a shielding layer attached to the first mounting groove 13 and the second mounting groove 14.

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  • Microelectronics & Electronic Packaging (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本申请公开了一种电子设备，属于电子设备领域。电子设备包括电路板、发光件和感光件，电路板包括介质层和多个间隔设置的导电层，介质层绝缘间隔设置在相邻导电层之间，多个导电层中设置有第一电极、第二电极和充电线圈，电路板具有露出第一电极的第一安装槽、露出第二电极的第二安装槽以及间隔在第一安装槽和第二安装槽之间的槽壁；发光件收容于第一安装槽内并与第一电极电连接；感光件收容于第二安装槽内并与第二电极电连接，槽壁遮蔽在发光件与感光件之间。

Description

电子设备
交叉引用
本申请要求在2023年07月17日提交中国专利局、申请号为202310876682.1、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请属于电子设备领域，具体涉及一种电子设备。
背景技术
电子设备中设置有多种实现光信号和电信号转换的光电传感器。光电传感器中的发光件向外发射出射光，出射光遇到物体后发射回到光电传感器，被光电传感器中的感光件接收，感光件将接收的光信号转换为电信号，从而可通过分析电信号检测得到信息。
相关技术的电子设备中，发光件和感光件一并设置在第一电路板上，并设置挡光罩盖设在发光件和感光件上，以避免或减小发光件的出射光直接进入感光件，干扰感光件接收反射光。在第一电路板背离发光件和感光件的一侧设置有第二电路板和绕制的充电线圈，充电线圈用于对电子设备充电，第二电路板用于设置控制充电线圈充电的控制芯片等元器件。在装配电子设备时，需要绕制充电线圈、焊接第二电路板和充电线圈，使得装配步骤繁琐。
发明内容
本申请实施例的目的是提供一种电子设备，可解决相关技术中电子设备的装配步骤繁琐的技术问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种电子设备，包括：
电路板，包括介质层和多个间隔设置的导电层，介质层绝缘间隔设置在相邻导电层之间，多个导电层中设置有第一电极、第二电极和充电线圈，电路板具有露出第一电极的第一安装槽、露出第二电极的第二安装槽、以及间隔在第一安装槽和第二安装槽之间的槽壁；
发光件，收容于第一安装槽内并与第一电极电连接；
感光件，收容于第二安装槽内并与第二电极电连接，槽壁遮蔽在发光件与感光件之间。
在本申请提供的实施例中，通过将发光件设置在第一安装槽内，将感光件设置在第二安装槽内，使得发光件和感光件被槽壁遮蔽，发光件发出的出射光可被电路板的部分遮挡，从而避免发光件发出的出射光直接射入感光件中，提高感光件生成的电信号的准确性，省去额外安装遮光罩的步骤，简化电子设备的装配步骤；电路板可以对发光件和感光件进行 保护，在一定程度上避免或减小外力直接作用于发光件和感光件损伤发光件和感光件；通过在多个导电层中的至少一层铺设充电线圈，从而在装配电子设备时，省去在电路板的一侧绕制充电线圈、焊接充电线圈和电路板，简化电子设备的装配步骤。
附图说明
图1是本申请一个实施例提供的电子设备的结构示意图之一；
图2是本申请一个实施例提供的电子设备的剖面结构示意图之一；
图3是本申请一个实施例提供的电子设备的剖面结构示意图之二；
图4是本申请一个实施例提供的电子设备的剖面结构示意图之三；
图5是本申请一个实施例提供的电子设备的剖面结构示意图之四；
图6是本申请一个实施例提供的电子设备的结构示意图之二。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
如图1、图2和图3所示，本申请实施例提供一种电子设备100，该电子设备100包括：电路板1、感光件3和发光件2，电路板1包括介质层11和多个间隔设置的导电层12，介质层11绝缘间隔设置在相邻导电层12之间，多个导电层12中设置有第一电极121、第二电极122和充电线圈123，电路板1具有露出第一电极121的第一安装槽13和露出第二电极122的第二安装槽14、以及间隔在第一安装槽13和所述第二安装槽14之间的槽壁17；发光件2收容于第一安装槽13内并与第一电极121电连接；感光件3收容于第二安装槽14内并与第二电极122电连接，槽壁17在发光件2与感光件3之间。
发光件2发出的出射光能够通过第一安装槽13的开口射出，感光件3能够通过第二安装槽14的开口接收出射光的反射光。本申请提供的电子设备100中的感光件3和发光件2可以配合形成光学距离感应器、生物信息采集器、光学空气检测器、光电计数器等。在电子设备100为生物信息采集器的情况下，该生物信息采集器可以用于采集心率、呼吸率、血氧、血压等生物信息。
发光件2可以是能够将电信号转化为光信号的元件，例如：LED灯珠(light-emitting diode)。感光件3作为光敏元件，可将光信号转化为电信号。发光件2的出射光被物理反射，反射光投射至感光件3上，引起感光件3的阻值发生变化，通过该阻值变化可以进行一步分析得到所需的生物信息、距离信息、空气信息等。电子设备100中可以仅设置一个发光件2和一个感光件3，电子设备100中也可以设置多个发光件2和多个感光件3，发光件2和感光件3可以一一对应设置，也可以一对多设置。
可选地，发光件2和感光件3相配合以基于光电容积脉搏波描记法(photo plethysmo graphy，PPG)采集生物信息。发光件2和感光件3靠近皮肤，发光件2向皮肤发射特定波长的光波，皮肤在不同状态下对特定波长的光波的吸收率不同，因此感光件3可以得到不同强度的反射光，感光件3将反射光转换为电信号，通过得到的电信号可以计算血液的流速变化、皮肤黑色素变化、皮肤含水量变化、血液中血氧含量等生物信息。
电路板1包括介质层11、以及多个导电层12，图案化的导电层12可以形成多种导电结构，该多种导电结构可以包括用于连接感光件3的第一电极121、用于连接发光件2的第二电极122、以及充电线圈123。第一电极121、第二电极122和充电线圈123可以设置在同一导电层12，即对同一导电材料进行图案化处理，同时得到第一电极121、第二电极122和充电线圈123。第一电极121、第二电极122和充电线圈123也可以分设在不同的导电层12，即对不同导电材料进行图案化处理，各导电层12分别得到第一电极121、第二电极122和充电线圈123。发光件2和感光件3设置于电路板1的一侧，发光件2的电连接端和感光件3的电连接端分别与第一电极121和第二电极122电连接，以使得通过第一电极121可以控制发光件2的发光，通过第二电极122传导感光件3生成的电信号。
第一安装槽13和第二安装槽14可以为自电路板1的表面凹陷形成的凹部，电路板1中间隔在第一安装槽13和第二安装槽14之间未凹陷的部分形成槽壁17。槽壁17中两相对设置的壁面分别为定义第一安装槽13的壁面和第二安装槽14的壁面。第一安装槽13露出第一电极121，以方便收容在第一安装槽13内的发光件2与第一电极121连接，第二安装槽14露出第二电极122，以方便收容在第二安装槽14内的感光件3与第二电极122连接。将发光件2和感光件3分别收容在第一安装槽13和第二安装槽14内，槽壁17间隔在感光件3和发光件2之间，使得电路板1可以替代遮光罩，在一定程度上遮蔽或减小出射光直接射入感光件3，从而可以省去额外在电路板1上安装遮光罩，有利于简化电子设备100的装配步骤。由于发光件2和感光件3分别收容在第一安装槽13和第二安装槽14内，使得电路板1可以保护发光件2和感光件3，在一定程度上避免或减小外力直接作用于发光件2和感光件3损伤发光件2和感光件3。
电路板1中的一层导电层12图案化形成绕制的充电线圈123，或多层导电层12分别图案化形成绕制的多个充电线圈123。充电线圈123用于对电子设备进行充电。充电线圈123可以通过电磁耦合的方式与外部充电设备实现电连接，从而通过电磁感应从外部充电设备接收电能。电子设备100中可以设置电池，通过电池储存从外部充电设备接收的电能。充 电线圈123用于对电子设备100充电可以理解为外部充电设备通过充电线圈123对电子设备100中的电池充电。可以理解的，外部充电设备也可以包括充电线圈。外部充电设备中的充电线圈可以用于辐射电能。电子设备100中的充电线圈123与外部充电设备中的充电线圈足够接近的情况下，电子设备100中的充电线圈123可以与外部充电设备中的充电线圈建立电磁耦合，电子设备100中的充电线圈123即可通过电磁感应从外部充电设备接收电能。
导电层12为一层的情况下，发光件2和感光件3设置在电路板1的第一侧，发光件2发出的光波从第一侧射出，感光件3接收从第一侧射入的光波。电子设备100中除发光件2和感光件3以外的第一元器件4可以设置于电路板1的第二侧，在一定程度上避免或减小发光件2、感光件3和第一元器件4相互干扰。第一侧和第二侧可以沿第一方向X设置，介质层11和导电层12也可以沿第一方向X设置。可选地，第一元器件4是控制充电线圈123充电的无线充电管理芯片，或是处理感光件3生成的电信号的数据处理芯片。
导电层12为多层的情况下，介质层11间隔在相邻导电层12之间，以避免相邻导电层12之间发生不需要的电连通。多层导电层12中，第一导电层12图案化形成第一电极121，感光件3与第一电极121连接；多层导电层12中，第二导电层12图案化形成第二电极122，发光件2与第二电极122连接；多层导电层12中，第三导电层12图案化形成导电电路，导电电路用于与电子设备100中的除发光件2和感光件3以外的第一元器件4连接。第一导电层12和第二导电层12可以为同一导电层12，也可以为不同导电层12，第一导电层12和第二导电层12分别位于第三导电层12背离第一元器件4的一侧。
在本申请提供的实施例中，通过将发光件2设置在第一安装槽13内，将感光件3设置在第二安装槽14内，使得发光件2和感光件3被槽壁17遮蔽，发光件2发出的出射光可被电路板1的部分遮挡，从而避免发光件2发出的出射光直接射入感光件3中，提高感光件3生成的电信号的准确性，省去额外安装遮光罩的步骤，简化电子设备100的装配步骤；电路板1可以对发光件2和感光件3进行保护，在一定程度上避免或减小外力直接作用于发光件2和感光件3损伤发光件2和感光件3；通过在多个导电层12中的至少一层铺设充电线圈123，从而在装配电子设备100时，省去在电路板1的一侧绕制充电线圈123，、焊接充电线圈123和电路板1，简化电子设备100的装配步骤。
在一些实施例中，充电线圈123环绕第一安装槽13和第二安装槽14设置。
充电线圈123环绕第一安装槽13和第二安装槽14设置，使得充电线圈123具有更大的直径。在外部磁场一定的情况下，充电线圈123具有更大的直径，通过该充电线圈123的磁通量越大，有利于提高充电线圈123的充电功率。
一个导电层12中的充电线圈123可以根据需要在一平面内螺旋环绕第一安装槽13和第二安装槽14设置，以提高位于该导电层12中的充电线圈123的匝数。多个导电层12均设置有充电线圈123的情况下，多个充电线圈123可以沿第一方向X依次排列设置。第一方向X可以为电路板1的厚度方向。充电线圈123在一平面内螺旋环绕，该平面可以与第 一方向X垂直设置。
第一安装槽13和第二安装槽14可以沿第二方向Y间隔设置，位于第一安装槽13和第二安装槽14之间的介质层11内还可以根据需求分布导电结构，以提高电路板1内电路分布的密集度。
在一些实施例中，电路板1还包括第一屏蔽层15和第二屏蔽层16，第一屏蔽层15沿第一安装槽13的壁面设置并环绕发光件2，第一屏蔽层15间隔发光件2和充电线圈123，第二屏蔽层16沿第二安装槽14的壁面设置并环绕感光件3，第二屏蔽层16间隔感光件3和充电线圈123。
第一屏蔽层15和第二屏蔽层16均可以采用金属材料制备。充电线圈123用于对电子设备100充电时，第一屏蔽层15和第二屏蔽层16均可以减小或避免外部充电设备产生的磁场、充电线圈123产生的电场影响发光件2和感光件3的工作。
可选地，第一屏蔽层15和第二屏蔽层16可以通过沉铜电镀技术分别形成在第一安装槽13的壁面上和第二安装槽14的壁面上。
为了保证电极的正常工作，电极与屏蔽层间隔设置。由于第一屏蔽层15覆盖在电路板1定义第一安装槽13的侧壁上，第二屏蔽层16覆盖在电路板1定义第二安装槽14的侧壁上，所以第一电极121可以设置在电路板1定义第一安装槽13的底壁，第二电极122可以设置在电路板1定义第二安装槽14的底壁。一个第一安装槽13可以露出多个第一电极121，多个第一电极121可以与同一发光件2电连接，也可以分别与不同发光件2电连接。一个第二安装槽14可以露出多个第二电极122，多个第二电极122可以与同一感光件3电连接，也可以分别与不同感光件3电连接。如图4所示的实施例中，一个第一安装槽13露出2个第一电极121，同一发光件2的正极和负极分别与2个第一电极121电连接。一个第二安装槽14露出2个第二电极122，同一感光件3的正极和负极分别与2个第二电极122电连接。
请参阅图5，在一些实施例中，电路板1包括多个沿第一方向X依次叠设的介质层11，第一安装槽13贯穿至少一个介质层11，第二安装槽14贯穿至少一个介质层11。
第一安装槽13和第二安装槽14可以分别贯穿一层介质层11，也可以分别贯穿多层介质层11，可以根据介质层11的厚度、发光件2沿第一方向X的长度、感光件3沿第一方向X的长度等确定第一安装槽13贯穿几层介质层11，以及第二安装槽14贯穿几层介质层11。
第一安装槽13和第二安装槽14沿第一方向X的深度可以不相同，即第一安装槽13和第二安装槽14贯穿的介质层11的层数可以不相同。由于发光件2和感光件3的尺寸不相同，与发光件2适配的第一安装槽13和与感光件3适配的第二安装槽14的尺寸也可以不相同，所以可以根据发光件2和感光件3的尺寸调节第一安装槽13和第二安装槽14的深度，使得发光件2收容在第一安装槽13内并且发光件2到第一安装槽13的开口处的距离符合需求，感光件3收容在第二安装槽14内并且感光件3到第二安装槽14的开口处的距离符合需求。
在一些实施例中，多个介质层11包括至少一个第一介质层111和至少一个第二介质层 112，第一介质层111和第二介质层112沿第一方向X叠设，第一安装槽13或第二安装槽14中的至少一个贯穿第一介质层111并露出第二介质层112。
在第一安装槽13露出第二介质层112的情况下，露出的第二介质层112支撑发光件2。在第二安装槽14露出第二介质层112的情况下，露出的第二介质层112支撑感光件3。第一介质层111和第二介质层112可以采用同一材料制备，区别在于第二介质层112未贯穿形成第一安装槽13的至少部分、以及第二安装槽14的至少部分。在设置第一安装槽13或第二安装槽14时，可以对已制备的第一介质层111做开孔处理，直至露出第二介质层112为止。
在一些实施例中，第一电极121嵌设在从第一安装槽13露出的第二介质层112内，或第二电极122嵌设在从第二安装槽14露出的第二介质层112内。
在第一安装槽13露出第二介质层112的情况下，露出的第二介质层112支撑发光件2，并且第一电极121嵌设在该露出的第二介质层112。第一电极121露出的表面和第二介质层112露出的表面可以在同一参考平面内。在第二安装槽14露出第二介质层112的情况下，露出的第二介质层112支撑感光件3，并且第二电极122嵌设在该露出的第二介质层112。第二电极122露出的表面和第二介质层112露出的表面可以在同一参考平面内。
具有第一电极121、第二电极122和充电线圈123中任一者的导电层12中，还可以根据需要布置其他导电结构，例如：连接电极的导电线路、电容等。第一电极121、第二电极122、充电线圈123和其他导电结构可以通过对同一层导电材料进行图案化处理得到。在制备电路板1时，可以一层介质层、一层图案化的导电层12、一层介质层11、一层图案化的导电层12等依次制备。在设置第一安装槽13或第二安装槽14时，可以对已制备的第一介质层111做开孔处理，直至露出第二介质层112以及嵌设在第二介质层112上的电极为止，从而得到露出第一电极121的第一安装槽13或者露出第二电极122的第二安装槽14。
在一些实施例中，充电线圈123的数量为多个，多个充电线圈123沿第一方向X间隔设置，介质层11具有通孔，相邻充电线圈123通过通孔过孔串联。
本领域技术人员可以理解的是，由于充电线圈123用于对电子设备100进行充电，所以布设各层充电线圈123时，通过电路设计确保各层充电线圈123内电流方向一致。将多个充电线圈123通过通孔过孔串联，以提高电路板1分布充电线圈123的匝数。
在一些实施例中，电子设备100包括：
多个第一元器件4，设置在电路板1背离感光件3的一侧，第一元器件4与至少一层导电层12电连接。
可选地，间隔排列的多层导电层12中位于远离感光件3的导电层12与第一元器件4电连接。通过设置多个导电层12，使得感光件3、发光件2和第一元器件4均可以绑定在同一电路板1上，从而省去多个电路板1焊接的步骤，有利于减小电子设备100的尺寸。
请参阅图6，发光件2和感光件3的数量可以根据需要设置为多个。在一些实施例中，第一安装槽13的数量为多个，发光件2的数量为多个，多个发光件2形成发光组，多个发 光组一一对应的设置在多个第一安装槽13内。在另一安装槽内，第二安装槽14的数量为多个，感光件3的数量为多个，多个感光件3一一对应的设置在多个第二安装槽14内。
通过设置多个发光件2，从而可以控制不同发光件2发出不同颜色的发射光，通过设置多个感光件3，从而可以通过不同感光件3接收不同颜色的反射光，电子设备100对不同感光件3接收不同颜色的反射光生成的电信号，可以分析得到更多信息。
可选地，一个发光组包括用于发出红光的红色发光件2R、用于发出绿光的绿色发光件2G、以及用于发出蓝光的蓝色发光件2B。如图6所示的实施例中，发光件2的数量为12个，感光件3的数量为4个，红色发光件2R、绿色发光件2G和蓝色发光件2B形成一组放置于同一第一安装槽13内，12个发光件2分别形成4个发光组放置于4个第一安装槽13内。4个感光件3分别放置在4个第二安装槽14内。第一安装槽13和第二安装槽14依次间隔成环状排列。
在制备本申请提供的电子设备100时，可以先制备电路板1，再将发光件2和感光件3分别装配至第一安装槽13和第二安装槽14内，绑定发光件2和第一电极121，绑定感光件3和第二电极122。翻转电路板1，在电路板1背离发光件2和感光件3的表面上绑定一个或多个第一元器件4。
制备电路板1时，可以先提供一介电层11，在介电层11上设置导电材料，对导电材料进行图案化处理形成所需的导电层12。在电路板1具有多层介电层的情况下，在已制备的导电层12上设置介电材料，形成另一介电层，该介电层覆盖在导电层12上。再在新制备的介电层11上设置导电材料，对导电材料进行图案化处理形成另一所需的导电层12，依次类推，直至完成所需层数的介电层11和导电层12。通过控深铣、激光等方式对电路板1进行开槽处理，形成露出第一电极121的第一安装槽13、以及露出第二电极122的第二安装槽14。对已开槽的电路板1进行沉铜电镀处理，形成贴附在第一安装槽13和第二安装槽14内的屏蔽层。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括：
    电路板，包括介质层和多个间隔设置的导电层，所述介质层绝缘间隔设置在相邻所述导电层之间，所述多个导电层中设置有第一电极、第二电极和充电线圈，所述电路板具有露出所述第一电极的第一安装槽、露出所述第二电极的第二安装槽、以及间隔在所述第一安装槽和所述第二安装槽之间的槽壁；
    发光件，收容于所述第一安装槽内并与所述第一电极电连接；
    感光件，收容于所述第二安装槽内并与所述第二电极电连接，所述槽壁遮蔽在所述发光件与所述感光件之间。
  2. 根据权利要求1所述的电子设备，其中，所述充电线圈环绕所述第一安装槽和所述第二安装槽设置。
  3. 根据权利要求2所述的电子设备，其中，所述电路板还包括第一屏蔽层和第二屏蔽层，所述第一屏蔽层沿所述第一安装槽的壁面设置并环绕所述发光件，所述第一屏蔽层间隔所述发光件和所述充电线圈，所述第二屏蔽层沿所述第二安装槽的壁面设置并环绕所述感光件，所述第二屏蔽层间隔所述感光件和所述充电线圈。
  4. 根据权利要求1所述的电子设备，其中，所述电路板包括多个沿第一方向依次叠设的介质层，所述第一安装槽贯穿至少一个所述介质层，所述第二安装槽贯穿至少一个所述介质层。
  5. 根据权利要求4所述的电子设备，其中，所述多个介质层包括至少一个第一介质层和至少一个第二介质层，所述第一安装槽或所述第二安装槽中的至少一个贯穿所述第一介质层并露出所述第二介质层。
  6. 根据权利要求5所述的电子设备，其中，所述第一电极嵌设在从所述第一安装槽露出的所述第二介质层内，或所述第二电极嵌设在从所述第二安装槽露出的所述第二介质层内。
  7. 根据权利要求1所述的电子设备，其中，所述充电线圈的数量为多个，多个所述充电线圈沿第一方向间隔设置，所述介质层具有通孔，相邻所述充电线圈通过所述通孔过孔串联。
  8. 根据权利要求1所述的电子设备，其中，所述电子设备包括：
    多个第一元器件，设置在所述电路板背离所述感光件的一侧，所述第一元器件与至少一层所述导电层电连接。
  9. 根据权利要求1所述的电子设备，其中，所述第一安装槽的数量为多个，所述发光件的数量为多个，多个所述发光件形成发光组，多个所述发光组一一对应的设置在多个所述第一安装槽内。
  10. 根据权利要求1所述的电子设备，其中，所述第二安装槽的数量为多个，所述感光件的数量为多个，多个所述感光件一一对应的设置在多个所述第二安装槽内。
PCT/CN2024/105398 2023-07-17 2024-07-15 电子设备 Pending WO2025016348A1 (zh)

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