Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Definitions

• This disclosure relates to an adhesive composition.
• a two-liquid adhesive composition containing an organoborane complex is known as an adhesive for bonding plastic substrates such as polyethylene and polypropylene (for example, Patent Document 1).
• the organoborane complex is decomplexed by mixing with a decomplexing agent to give an organoborane.
• the organoborane acts as an initiator that generates radicals by reacting with oxygen.
• the borinic acid radical generated here acts to generate dormant species for atom transfer radical polymerization (ATRP), which sustains the growth reaction including surface grafting while suppressing the chain transfer or termination reaction of compounds having radically polymerizable groups.
• ATRP atom transfer radical polymerization
• one-component adhesive compositions In regards to adhesive compositions containing organoborane complexes, there is also a demand for one-component adhesive compositions.
• a gradual reaction may progress during storage at room temperature (25°C) or at low temperatures, resulting in a decrease in adhesive strength, or an increase in viscosity may make application impossible, resulting in problems with workability.
• the objective of this disclosure is to provide an adhesive composition that can ensure a sufficient pot life (working time) at room temperature and can exhibit sufficient adhesive strength after curing.
• the inventors of the present disclosure conducted research to solve the above problems and discovered that by applying a thermal acid generator to an adhesive composition, it is possible to obtain an adhesive composition that can ensure a sufficient pot life (working time) at room temperature and exhibit sufficient adhesive strength after curing, and thus completed the invention of the present disclosure.
• the present disclosure provides the following adhesive compositions [1] to [3].
• An adhesive composition comprising an organoborane complex, a compound having a radically polymerizable group, and a thermal acid generator.
• the adhesive composition according to [1] further comprising at least one selected from the group consisting of metal halide salts and compounds having a thiocarbonylthio structure.
• the present disclosure provides an adhesive composition that can ensure a sufficient pot life (working time) at room temperature and exhibit sufficient adhesive strength after curing.
• a numerical range indicated using " ⁇ " indicates a range that includes the numerical values before and after " ⁇ " as the minimum and maximum values, respectively.
• the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages.
• the upper or lower limit value of the numerical range may be replaced with a value shown in an example.
• (meth)acrylate means acrylate or the corresponding methacrylate.
• (meth)acrylamide means acrylamide or the corresponding methacrylamide.
• the materials exemplified below may be used alone or in combination of two or more.
• the content of each component in the composition means the total amount of the multiple substances present in the composition, unless otherwise specified.
• the adhesive composition of one embodiment includes an organoborane complex, a compound having a radical polymerizable group (hereinafter, may be referred to as a "polymerizable compound”), and a thermal acid generator.
• the adhesive composition is a composition that exhibits thermosetting properties.
• the organoborane complex means an organoborane-Lewis base complex formed by coordinating a Lewis base to an organoborane to form a complex.
• the organoborane-Lewis base complex may be a compound that reacts with an acid or an electrophilic cation generated by a thermal acid generator described later to give an organoborane.
• the organoborane undergoes radical cleavage in the presence of oxygen to generate a borinic acid radical or the like, and therefore may act as an initiator of living radical polymerization.
• the organoborane may be, for example, an alkylborane (BR 3 , R: alkyl group).
• the Lewis base may be, for example, an amine.
• the amine may be, for example, a compound having a plurality of amino groups, or a compound having at least an amino group constituting the amine and a group (for example, an alkoxy group, etc.) containing an atom (for example, an oxygen atom, etc.) capable of coordinating to boron other than the nitrogen atom of the amino group.
• a group for example, an alkoxy group, etc.
• an atom for example, an oxygen atom, etc.
• the organoborane complex may be an alkylborane-amine complex or an alkylborane-multidentate amine complex.
• organoborane complex examples include triethylborane-1,3-diaminopropane complex, triethylborane-diethylenetriamine complex, tri-n-butylborane-3-methoxy-1-propylamine complex, tri-n-butylborane-1,3-diaminopropane complex, triisobutylborane-1,3-diaminopropane complex, triethylborane-1,6-diaminohexane complex, triisobutylborane-1,3-diaminopropane complex, and triisobutylborane-1,6-diaminohexane complex.
• the organoborane complex may be triethylborane-1,3-diaminopropane complex or tri-n-butylborane-3-methoxy-1-propylamine complex.
• the organoborane complex may be a commercially available product or a synthetic product.
• the content of the organoborane complex may be 0.01 mass% or more, 0.05 mass% or more, 0.1 mass% or more, or 0.2 mass% or more, based on the total amount of the adhesive composition, from the viewpoint of adhesive strength expression.
• the content of the organoborane complex may be 10 mass% or less, 5 mass% or less, 3 mass% or less, or 1 mass% or less, based on the total amount of the adhesive composition, from the viewpoint of toughness of the adhesive layer.
• the content of the organoborane complex may be 0.01 mol% or more, 0.05 mol% or more, 0.1 mol% or more, or 0.5 mol% or more based on the total amount of the polymerizable compounds from the viewpoint of adhesive strength expression.
• the content of the organoborane complex may be 10 mol% or less, 5 mol% or less, 2 mol% or less, or 1 mol% or less based on the total amount of the compounds having a radical polymerizable group from the viewpoint of toughness of the adhesive layer.
• the polymerizable compound is a compound having a polymerizable group that reacts with a radical.
• the radical polymerizable group include a (meth)acryloyl group, a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, and a maleimide group.
• the polymerizable compound may contain, for example, a compound having a (meth)acryloyl group.
• compounds having a (meth)acryloyl group include monofunctional (meth)acrylates having one (meth)acryloyl group, polyfunctional (meth)acrylates having two or more (meth)acryloyl groups, and (meth)acrylamide derivatives.
• the compound having a (meth)acryloyl group may be a monofunctional (meth)acrylate having one (meth)acryloyl group.
• Monofunctional (meth)acrylates include (meth)acrylic acid; methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate (n-lauryl (meth)acrylate), isomyristyl (meth)acrylate, stearyl (meth)acrylate, and isostearyl acrylate.
• acrylates ; (meth)acrylates having an isocyanate group such as 2-(2-methacryloyloxyethyloxy)ethyl isocyanate and 2-(meth)acryloyloxyethyl isocyanate; polyalkylene glycol mono(meth)acrylates such as tetraethylene glycol mono(meth)acrylate, hexaethylene glycol mono(meth)acrylate, octapropylene glycol mono(meth)acrylate, dipropylene glycol mono(meth)acrylate, tripropylene glycol mono(meth)acrylate, and octapropylene glycol mono(meth)acrylate; and (meth)acrylates having a siloxane skeleton.
• isocyanate group such as 2-(2-methacryloyloxyethyloxy)ethyl isocyanate and 2-(meth)acryloyloxyethyl isocyanate
• polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene ethylene glycol di(meth)acrylate, ethoxylated polypropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(
• aromatic (meth)acrylates such as ethoxylated propoxylated bisphenol F type di(meth)acrylate, ethoxylated fluorene type di(meth)acrylate, propoxylated fluorene type di(meth)acrylate, ethoxylated propoxylated fluorene type di(meth)acrylate; aromatic epoxy (meth)acrylates such as bisphenol type epoxy (meth)acrylate, phenol novolac type epoxy (meth)acrylate, cresol novolac type epoxy (meth)acrylate, etc.
• Examples of (meth)acrylamide derivatives include N,N-dimethylaminopropyl (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide, and 4-(meth)acryloylmorpholine.
• the polymerizable compound may contain, in addition to a compound having a (meth)acryloyl group, a copolymerizable compound that can be copolymerized with the compound.
• a copolymerizable compound examples include polymerizable compounds other than those having a (meth)acryloyl group, such as styrene, 4-methylstyrene, vinylpyridine, vinylpyrrolidone, vinyl acetate, cyclohexylmaleimide, and phenylmaleimide.
• the content of the polymerizable compound may be 40% by mass or more, 50% by mass or more, 60% by mass or more, or 65% by mass or more based on the total amount of the adhesive composition, from the viewpoint of improving the toughness of the adhesive layer and improving the adhesive strength.
• the content of the polymerizable compound may be 99% by mass or less, 98% by mass or less, 95% by mass or less, 90% by mass or less, 85% by mass or less, or 80% by mass or less based on the total amount of the adhesive composition, from the viewpoint of suppressing sagging of the applied adhesive composition and suppressing a decrease in the toughness of the adhesive layer.
• thermal acid generator is a compound that generates an acid or electrophilic cations by heating.
• a thermal acid generator in the adhesive composition, it is possible to ensure a sufficient pot life (working time) at room temperature, and to develop sufficient adhesive strength after curing. The reason for such an effect is not necessarily clear, but the present inventors believe it to be as follows.
• An organoborane complex organoborane-Lewis base complex
• reacts with an acid, an electrophilic cation, etc. reacts with an acid, an electrophilic cation, etc., and the Lewis base in the organoborane complex dissociates to generate an organoborane.
• a thermal acid generator generates an acid or electrophilic cation by heating, it is difficult to generate an acid or electrophilic cation near room temperature before heating. Therefore, it is considered that a sufficient pot life (working time) can be ensured near room temperature.
• an organoborane that can act as an initiator for living radical polymerization is generated, and the curing reaction proceeds sufficiently, making it possible to develop sufficient adhesive strength after curing.
• the thermal acid generator may be a salt compound composed of a cation and an anion.
• the thermal acid generator include onium salts having an anion such as BF 4 - , BR a 4 - (R a represents a phenyl group in which a hydrogen atom is substituted with two or more fluorine atoms or two or more trifluoromethyl groups), PF 6 - , PF n (R b ) 6-n - (R b represents an alkyl group in which a hydrogen atom is substituted with two or more fluorine atoms, and n represents 1 to 5), SbF 6 - , and AsF 6 - .
• the number of carbon atoms of the alkyl group represented by R b may be, for example, 1 to 8, 1 to 4, or 1 to 2.
• Examples of the alkyl group represented by R b include a trifluoromethyl group and a pentafluoroethyl group.
• n is 1 to 5, 2 to 4, or 2 to 3.
• PF n (R b ) 6-n - may be, for example, PF 3 (C 2 F 5 ) 3 - .
• the onium salt include sulfonium salts, phosphonium salts, ammonium salts (quaternary ammonium salts, anilinium salts), diazonium salts, iodonium salts, pyridinium salts, etc.
• the thermal acid generator may be, for example, a sulfonium salt or an ammonium salt.
• sulfonium salt cations include sulfonium salts with aryl groups, such as 4-hydroxyphenyl-methyl-benzylsulfonium ion, 4-hydroxyphenyl-methyl-(2-methylbenzyl)sulfonium ion, 4-hydroxyphenyl-methyl-1-naphthylmethylsulfonium ion, and p-methoxycarbonyloxyphenyl-benzyl-methylsulfonium ion.
• aryl groups such as 4-hydroxyphenyl-methyl-benzylsulfonium ion, 4-hydroxyphenyl-methyl-(2-methylbenzyl)sulfonium ion, 4-hydroxyphenyl-methyl-1-naphthylmethylsulfonium ion, and p-methoxycarbonyloxyphenyl-benzyl-methylsulfonium ion.
• ammonium salts examples include N-benzyl-N,N-dimethylanilinium ion, N-(4-nitrobenzyl)-N,N-dimethylanilinium ion, N-(4-methoxybenzyl)-N,N-dimethylanilinium ion, N-( ⁇ -phenylbenzyl)-N,N-dimethylanilinium ion, N-( ⁇ -methylbenzyl)-N,N-dimethylanilinium ion, N-(1-naphthylmethyl)-N,N-dimethylanilinium ion, and N-cinnamyl-N,N-dimethylanilinium ion.
• the thermal acid generator may be, for example, a salt compound having SbF 6 - from the viewpoint of improving adhesive strength.
• the thermal acid generator may be, for example, a salt compound having an anion containing boron as a constituent element, or a salt compound having an anion containing phosphorus as a constituent element from the viewpoint of environmental consideration and low-temperature curing property.
• the anion containing boron as a constituent element may be BR a 4 — , and more specifically, may be tetrakis(pentafluorophenyl)borate.
• the anion containing phosphorus as a constituent element may be PF n (R b ) 6-n — , and more specifically, may be tris(pentafluoroethyl)trifluorophosphate (PF 3 (C 2 F 5 ) 3 ⁇ ).
• the thermal acid generator may be a sulfonium salt having SbF 6 - .
• the thermal acid generator may be an ammonium salt having an anion containing boron as a constituent element, or a sulfonium salt having an anion containing phosphorus as a constituent element.
• the content of the thermal acid generator may be 0.1 mass% or more, 0.3 mass% or more, 0.5 mass% or more, or 0.7 mass% or more based on the total amount of the adhesive composition from the viewpoint of adhesive strength expression.
• the content of the thermal acid generator may be 10 mass% or less, 7 mass% or less, 5 mass% or less, or 3 mass% or less based on the total amount of the adhesive composition from the viewpoint of toughness of the adhesive layer.
• the content of the thermal acid generator may be 0.01 mol% or more, 0.05 mol% or more, 0.1 mol% or more, or 0.5 mol% or more based on the total amount of the polymerizable compounds from the viewpoint of adhesive strength expression.
• the content of the thermal acid generator may be 10 mol% or less, 5 mol% or less, 2 mol% or less, or 1 mol% or less based on the total amount of the polymerizable compounds from the viewpoint of toughness of the adhesive layer.
• the molar ratio of the thermal acid generator to the organoborane complex may be, for example, 0.3 or more, 0.5 or more, or 0.8 or more. When the molar ratio is 1 or more, more sufficient adhesive strength tends to be obtained.
• the molar ratio of the thermal acid generator to the organoborane complex (molar amount of thermal acid generator/molar amount of organoborane complex) may be, for example, 50 or less, 30 or less, 10 or less, 7 or less, 5 or less, or 3 or less. The smaller the molar ratio, the more sufficient the working time from applying the adhesive composition to the substrates until bonding them tends to be secured.
• the adhesive composition may further contain at least one member selected from the group consisting of metal halide salts and compounds having a thiocarbonylthio structure, which can act as a polymerization inhibitor.
• metal halide salts include copper(II) bromide, copper(II) chloride, iron(III) bromide, vanadium(III) bromide, chromium(III) bromide, ruthenium(III) bromide, copper(I) bromide, iron(II) bromide, manganese(II) bromide, cobalt(II) bromide, nickel(II) bromide, and palladium(II) bromide. These may be used alone or in combination of two or more.
• the metal halide salt may be, for example, copper(II) bromide.
• the compound having a thiocarbonylthio structure can be used without any particular restrictions as long as it has a thiocarbonylthio structure.
• a chain transfer agent used in the field of RAFT polymerization (Reversible Addition/Fragmentation Chain Transfer) can be suitably used.
• the content of the polymerization regulator may be 0.01% by mass or more, 0.02% by mass or more, or 0.03% by mass or more based on the total amount of the adhesive composition, from the viewpoint of ensuring the working time from applying the adhesive composition to the substrates until bonding and improving the adhesive strength.
• the content of the polymerization regulator may be 5% by mass or less, 3% by mass or less, 1% by mass or less, 0.5% by mass or less, or 0.1% by mass or less based on the total amount of the adhesive composition.
• the content of the polymerization regulator may be 0.01 mol% or more, 0.02 mol% or more, or 0.03 mol% or more based on the total amount of polymerizable compounds, from the viewpoint of ensuring the working time from applying the adhesive composition to the substrates until bonding and improving the adhesive strength.
• the content of the polymerization regulator may be 5 mol% or less, 3 mol% or less, 1 mol% or less, 0.7 mol% or less, 0.5 mol% or less, or 0.2 mol% or less based on the total amount of polymerizable compounds.
• the adhesive composition may further contain a compound represented by formula (1) which can act as a stabilizer for the organoborane complex.
• the compound represented by formula (1) has a radical polymerizable group, and therefore also acts as the compound having the above radical polymerizable group ((meth)acrylamide derivative).
• the compound represented by formula (1) as a stabilizer for the organoborane complex is not included in the compound having the above radical polymerizable group (polymerizable compound) and is excluded from the content of the polymerizable compound.
• R 1 represents a hydrogen atom or a methyl group.
• R 1 may be a hydrogen atom.
• R 2 and R 3 each independently represent an alkylene group.
• the number of carbon atoms in the alkylene group may be 1 to 20, 1 to 10, 1 to 6, or 1 to 3.
• the alkylene group may be either a linear alkylene group or a branched alkylene group.
• the number of carbon atoms in the linear alkylene group is usually 1 to 20, and may be 1 to 10, 1 to 6, or 1 to 3.
• the number of carbon atoms in the branched alkylene group is usually 3 to 20, and may be 3 to 10, or 3 to 6.
• Straight-chain alkylene groups include, for example, methylene, ethylene, propylene, butylene, pentylene, and hexylene groups.
• Branched alkylene groups include isopropylene, isobutylene, and dimethylpropylene groups.
• the alkylene group may be an ethylene group.
• Some of the hydrogen atoms of the alkylene group may be replaced by a substituent.
• the number of carbon atoms mentioned above includes the number of carbon atoms of the substituent.
• the ring (heterocycle) constituted by a nitrogen atom, an oxygen atom, R 2 , and R 3 may be, for example, a morpholine ring.
• compounds represented by formula (1) include 4-(meth)acryloylmorpholine.
• the compound represented by formula (1) may be 4-(meth)acryloylmorpholine or 4-acryloylmorpholine (ACMO).
• the stabilizer content may be 0.01 mass% or more, 0.05 mass% or more, 0.1 mass% or more, or 0.5 mass% or more based on the total amount of the adhesive composition, from the viewpoint of adhesive strength development in a short time.
• the stabilizer content may be 10 mass% or less, 7 mass% or less, 5 mass% or less, or 3 mass% or less based on the total amount of the adhesive composition, from the viewpoint of toughness of the adhesive layer.
• the stabilizer content may be 0.01 mol% or more, 0.05 mol% or more, 0.1 mol% or more, or 0.5 mol% or more based on the total amount of polymerizable compounds from the viewpoint of the adhesive composition's adhesive strength development in a short period of time.
• the stabilizer content may be 10 mol% or less, 7 mol% or less, 5 mol% or less, or 3 mol% or less based on the total amount of polymerizable compounds from the viewpoint of the toughness of the adhesive layer.
• the adhesive composition may further contain a filler.
• the filler may be, for example, either an inorganic filler or an organic filler.
• inorganic fillers include inorganic fine particles such as silica, alumina, silica-alumina, titania, zirconia, magnesia, kaolin, talc, calcium carbonate, bentonite, mica, sericite, glass flakes, glass fibers, graphite, magnesium hydroxide, aluminum hydroxide, antimony trioxide, barium sulfate, zinc borate, wollastonite, xonotlite, and whiskers.
• the inorganic filler may contain a silica filler.
• organic fillers examples include organic particles such as silicone, acrylic silicone, acrylic rubber, MBS (methacrylate butadiene styrene), polyamide, and polyimide. These fillers (particles) may have a uniform structure or a core-shell structure. When an organic filler is used as the filler, the organic filler may contain acrylic core-shell particles.
• the organic filler may contain an antioxidant in the organic filler.
• the content of the antioxidant in the organic filler may be, for example, 15,000 ppm by mass or less, 10,000 ppm by mass or less, 5,000 ppm by mass or less, or 3,000 ppm by mass or less.
• the filler content may be 1 mass% or more, 3 mass% or more, or 5 mass% or more, and may be 40 mass% or less, 30 mass% or less, or 30 mass% or less, based on the total amount of the adhesive composition.
• the adhesive composition may further contain a plasticizer, such as a phthalate ester compound, an alkylsulfonate ester compound, or an adipic acid ester compound.
• a plasticizer such as a phthalate ester compound, an alkylsulfonate ester compound, or an adipic acid ester compound.
• the plasticizer content may be 0.1 mass% or more, 0.3 mass% or more, or 1.0 mass% or more, and may be 30 mass% or less, 20 mass% or less, or 10 mass% or less, based on the total amount of the adhesive composition.
• the adhesive composition may further contain other components such as a crosslinking agent, an ultraviolet absorber, a dehydrating agent, a pigment, a dye, an antiaging agent, an antioxidant, an antistatic agent, a flame retardant, an adhesion promoter, a dispersant, and a solvent.
• a crosslinking agent such as an ultraviolet absorber, a dehydrating agent, a pigment, a dye, an antiaging agent, an antioxidant, an antistatic agent, a flame retardant, an adhesion promoter, a dispersant, and a solvent.
• the adhesive composition can be prepared by mixing the above components, such as the organoborane complex, the polymerizable compound, and the thermal acid generator.
• the temperature at which the above components are mixed may be, for example, 0 to 35°C or 10 to 25°C.
• the pot life (usable time) after mixing the above components may be, for example, more than 10 minutes, or may be 30 minutes or more, 60 minutes or more, 90 minutes or more, 120 minutes or more, 150 minutes or more, or 180 minutes or more.
• the adhesive composition can also be prepared by preparing a composition set including a first liquid (main agent) and a second liquid (initiator) and mixing the first liquid with the second liquid.
• the first liquid may include a polymerizable compound and a thermal acid generator.
• the second liquid may include an organoborane complex and may further include a stabilizer.
• At least one of the first liquid and the second liquid may include a polymerization control agent, a filler, a plasticizer, other components, etc.
• the temperature and pot life (usable time) when the first liquid and the second liquid are mixed may be the same as above.
• the method of mixing each component or the first liquid and the second liquid is not particularly limited as long as each component is mixed.
• methods for mixing each component include a method of mixing manually, a method of mixing by hand application using a normal caulking gun or the like, and a method of mixing using a mechanical rotary mixer, static mixer, or the like in combination with a pump (e.g., a gear pump, a plunger pump, etc.) with a constant volume for feeding the raw material and a throttle valve.
• a pump e.g., a gear pump, a plunger pump, etc.
• the first liquid and the second liquid may be placed separately, and the two liquids may be fed from each to a nozzle or the like, mixed inside the nozzle or the like, and the two liquids may be discharged from the tip of the nozzle using a dispenser, hand gun, or the like, which has a mechanism for continuously mixing the two liquids and applying the adhesive composition described below.
• the prepared adhesive composition can be applied to a desired location to form an adhesive layer.
• the formed adhesive layer acts as an adhesive layer that bonds substrates together as the polymerizable compound gradually becomes more polymeric and hardens.
• the method of application to a desired location can be a conventional method such as a method using a dispenser.
• the conditions for heating and curing the adhesive composition can be adjusted as desired, particularly by selecting the type of thermal acid generator.
• the heating temperature may be 40°C or higher, 45°C or higher, 50°C or higher, 55°C or higher, or 60°C or higher.
• the heating temperature may be, for example, 180°C or lower, 150°C or lower, or 120°C or lower.
• the maintenance time may be 10 minutes or more, 20 minutes or more, or 30 minutes or more.
• the maintenance time may be, for example, 300 minutes or less, 150 minutes or less, or 120 minutes or less.
• the adhesive structure includes a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate to each other.
• the adhesive layer contains a cured product of the adhesive composition.
• first substrate and the second substrate include plastic substrates such as polypropylene (PP), polyvinyl chloride, acrylonitrile/butadiene/styrene copolymer (ABS), polycarbonate (PC), polyamide (PA), polyphenylene sulfide (PPS), acrylonitrile butadiene styrene (ABS), polyether ether ketone (PEEK), polyamide imide (PAI), polyphenylene ether (PPE), ethylene vinyl acetate (EVA), polymethyl methacrylate (PMMA), polyester, epoxy resin, polyurethane (PUR), polyoxymethylene (POM), polyethylene (PE), ethylene/propylene copolymer (EPM), ethylene/propylene/diene polymer (EPDM), and metal substrates such as aluminum, steel, copper, and stainless steel.
• plastic substrates such as polypropylene (PP), polyvinyl chloride, acrylonitrile/butadiene/styrene copoly
• the thickness of the first substrate and the second substrate is not particularly limited, but may be, for example, 0.1 to 10,000 mm.
• adhesives examples include plastic laminate substrates, metal laminate substrates, electronic components, semiconductor components, display components, and automobile components.
• the method for producing an adhesive body in one embodiment includes a step of bonding a first substrate and a second substrate with the adhesive composition to obtain a laminate, and a step of heating the laminate to obtain an adhesive body.
• the conditions for preparing the adhesive composition may be the same as those described above.
• the conditions for heating the laminate may be the same as those for heating and curing the adhesive composition (adhesive layer).
• Examples 1 to 3 [Preparation of adhesive composition and production of laminate] Two polypropylene substrates (size: 100 mm x 25 mm, thickness: 2 mm) were prepared. On one of the polypropylene substrates, a spacer having a thickness of 0.5 mm was arranged so that the coating area of the adhesive composition was 0.5 mm thick, 12.5 mm in the longitudinal direction of the polypropylene substrate, and 25 mm in the transverse direction of the polypropylene substrate.
• the adhesive compositions of Examples 1 to 3 were prepared by mixing the first liquid and the second liquid by filling each of the first liquid and the second liquid in a manual dispenser. The prepared adhesive composition was applied to the adhesive coating area of the polypropylene substrate on which the spacer was arranged using a manual dispenser, and the other polypropylene substrate was attached to obtain a plurality of laminates of Production Examples 1 to 3.
• the laminates of Production Examples 1-0 to 1-3 were heated at 70 ° C., at which the adhesive composition of Example 1 showed the highest shear strength
• the laminates of Production Examples 2-0 to 2-3 were heated at 80 ° C., at which the adhesive composition of Example 2 showed the highest shear strength
• the laminates of Production Examples 3-0 to 3-3 were heated at 60 ° C., at which the adhesive composition of Example 3 showed the highest shear strength
• the laminates after heating were measured for shear strength in the same manner as in [Measurement of adhesive strength by heating temperature] above. The results are shown in Table 3.
• the adhesive compositions of Examples 1 to 3 were found to have a pot life (usable time) of at least 3 hours at room temperature.
• the adhesive composition disclosed herein can ensure a sufficient pot life (working time) at room temperature and can exhibit sufficient adhesive strength after curing.

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