WO2025007417A1 - 一种变温部件的加载强度设计方法及相关产品 - Google Patents

一种变温部件的加载强度设计方法及相关产品 Download PDF

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WO2025007417A1
WO2025007417A1 PCT/CN2023/117904 CN2023117904W WO2025007417A1 WO 2025007417 A1 WO2025007417 A1 WO 2025007417A1 CN 2023117904 W CN2023117904 W CN 2023117904W WO 2025007417 A1 WO2025007417 A1 WO 2025007417A1
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temperature
component
variable
analysis
changing component
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French (fr)
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李凯
胡浩
邵晴
刘洪涛
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CRRC Changchun Railway Vehicles Co Ltd
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CRRC Changchun Railway Vehicles Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces

Definitions

  • the present application relates to the technical field of superconducting magnets, and in particular to a loading strength design method for a temperature-variable component and related products.
  • Superconducting magnets are the key core subsystem of electric levitation trains, mainly composed of superconducting magnetic poles and cryogenic thermostats.
  • the design of the on-board superconducting magnet cryogenic thermostat is different from the traditional static application cryogenic thermostat structure, which requires stronger load-bearing capacity, lower conduction heat leakage power and better lightweight design.
  • the present application provides a loading strength design method and related products for variable temperature components.
  • the structure of the variable temperature components is optimized, so that the variable temperature components can achieve the optimal structural size, thereby solving the problem that the existing technology cannot simultaneously take into account the load-bearing capacity, conduction heat leakage power and lightweight design.
  • the present application provides a method for designing the loading strength of a temperature-variable component, comprising:
  • the temperature-changing component is optimized according to the analysis result to realize the structural design of the temperature-changing component.
  • the temperature field analysis and stress field analysis of the temperature-changing component are performed using finite element software to obtain Before the temperature and Mises stress of each grid node of the temperature-changing component are obtained, it also includes:
  • a finite element model of the temperature-changing component is obtained according to the simplified geometric modeling model.
  • the simplifying the temperature-changing component to obtain a simplified geometric model of the temperature-changing component includes:
  • the target features include: bolt holes.
  • obtaining a finite element model of the temperature-changing component according to the simplified geometric modeling model includes:
  • Each of the split structural components is discretized in the form of grid units, and the grid units are connected by common nodes.
  • the temperature field analysis and stress field analysis of the temperature-changing component are performed using finite element software to obtain the temperature and Mises stress of each grid node of the temperature-changing component, including:
  • parameters of each grid node of the temperature-changing component are set in finite element software
  • temperature field analysis and stress field analysis are performed on the temperature-variable component to determine the temperature and Mises stress of each grid node.
  • the temperature and Mises stress of each grid node are substituted into the loading strength function in combination with the material yield strength function for analysis to obtain analysis results, including:
  • the temperature and Mises stress of each grid node are substituted into the loading strength function for analysis to obtain an analysis result of whether the loading strength meets the first preset threshold or does not meet the first preset threshold;
  • the first preset threshold value ranges from greater than or equal to 0.8 to less than or equal to 1.
  • optimizing the temperature-changing component according to the analysis result to realize the structural design of the temperature-changing component includes:
  • the grid node When the loading strength of the grid node is less than 0.8, the grid node is thinned along the direction of the conduction heat flow. deal with;
  • the grid nodes are thickened along the force line direction.
  • the present application provides a device for designing the loading strength of a temperature-variable component, comprising:
  • An acquisition module is used to obtain a material yield strength function of a variable temperature component related to temperature
  • the first analysis module is used to perform temperature field analysis and stress field analysis on the temperature-changing component using finite element software to obtain the temperature and Mises stress of each grid node of the temperature-changing component;
  • the second analysis module is used to combine the material yield strength function, substitute the temperature and Mises stress of each grid node into the loading strength function for analysis, and obtain the analysis result;
  • the optimization module is used to optimize the temperature-changing component according to the analysis result to realize the structural design of the temperature-changing component.
  • the present application provides a loading strength design device for a variable temperature component, characterized in that it includes:
  • a processor is used to implement the steps of the method for designing the loading strength of a temperature-changing component as described in any one of the above items when executing the computer program.
  • the present application provides a readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method for designing the loading strength of a variable temperature component as described in any one of the above items are implemented.
  • This application first obtains the material yield strength function of the variable temperature component related to temperature, and uses finite element software to perform temperature field analysis and stress field analysis on the variable temperature component to obtain the temperature and Mises stress of each grid node of the variable temperature component. Then, in combination with the material yield strength function, the temperature and Mises stress of each grid node are substituted into the loading intensity function for analysis to obtain the analysis result. Finally, the variable temperature component is optimized according to the analysis results to realize the structural design of the variable temperature component.
  • variable temperature component achieves the optimal structural size, and the lightweight level is improved under the premise of ensuring the reduction of heat leakage.
  • FIG1 is a flow chart of a method for designing the loading strength of a temperature-variable component provided by the present application
  • FIG2 is a schematic structural diagram of a device for designing the loading strength of a temperature-variable component provided in the present application.
  • the existing design methods cannot take into account the load-bearing capacity, conduction heat leakage power and lightweight design at the same time. Specifically, the existing design methods of temperature-variable components do not consider the favorable conditions of the change of mechanical properties of materials at low temperatures. In order to ensure the load-bearing capacity and conduction heat leakage power of the cryostat, the lightweight design of the cryostat is often ignored, resulting in the problem of the designed cryostat being too heavy.
  • the present application provides a loading strength design method for a variable temperature component, including: first obtaining the material yield strength function of the variable temperature component related to temperature, and using finite element software to perform temperature field analysis and stress field analysis on the variable temperature component to obtain the temperature and Mises stress of each grid node of the variable temperature component. Then, combined with the material yield strength function, the temperature and Mises stress of each grid node are substituted into the loading strength function for analysis to obtain the analysis results. Finally, the variable temperature component is optimized according to the analysis results to realize the structural design of the variable temperature component.
  • the temperature field and stress field of the variable temperature component are analyzed, and the loading strength function is used to analyze the material yield strength function, thereby optimizing the structure of the variable temperature component so that the variable temperature component can achieve the optimal structural size, thereby improving the lightweight level while ensuring that heat leakage is reduced.
  • the method for designing the loading strength of a variable temperature component and related products provided in this application can be applied to the field of superconducting magnet technology.
  • the above is only an example and does not limit the application field of the method for designing the loading strength of a variable temperature component and related products provided in this application.
  • FIG1 is a flow chart of a method for designing the loading strength of a temperature-variable component provided by the present application.
  • a method for designing the loading strength of a temperature-variable component provided by the present application may include:
  • superconducting magnets are the key core subsystems of electric levitation trains, mainly composed of superconducting magnetic poles and cryostat.
  • Some components in the cryostat structure are between the low-temperature environment and the external normal temperature environment, which are called variable temperature components. These components bear all the dynamic and static loads of the internal low-temperature zone. At the same time, due to its heat conduction function, it continuously affects the internal low-temperature zone.
  • the strength curve of the material changing with temperature is obtained, that is, the material yield strength function related to the temperature of the variable temperature components is obtained, which is recorded as ⁇ s (T).
  • S102 Perform temperature field analysis and stress field analysis on the temperature-variable component using finite element software to obtain the temperature and Mises stress of each grid node of the temperature-variable component.
  • finite element software can be used as the main analysis software.
  • the analysis model of the variable temperature component is input into the finite element software according to the structural design of the load-bearing component, the design domain and the parameters of each grid node are defined, and the temperature field analysis and stress field analysis are carried out to obtain the temperature and Mises stress of each grid node of the variable temperature component.
  • S102 using finite element software to perform temperature field analysis and stress field analysis on the temperature-changing component to obtain the temperature and Mises stress of each grid node of the temperature-changing component, including:
  • parameters of each grid node of the temperature-changing component are set in finite element software
  • temperature field analysis and stress field analysis are performed on the temperature-variable component to determine the temperature and Mises stress of each grid node.
  • corresponding application conditions should be added when using finite element software to analyze variable temperature components.
  • the analysis scenario in the finite element software is set to the service condition, and the parameters corresponding to each grid node under the service condition are entered.
  • This analysis can determine the temperature and stress distribution of all grid nodes of the variable temperature component under the service condition.
  • the temperature corresponding to the i-th grid node is recorded as Ti, and the Mises stress is recorded as ⁇ i .
  • the method further includes:
  • a finite element model of the temperature-changing component is obtained according to the simplified geometric modeling model.
  • variable temperature component can be preprocessed. Specifically, the variable temperature component can be simplified first to obtain a simplified geometric model of the variable temperature component, and then the simplified geometric model is substituted into the finite element software to obtain the finite element model of the variable temperature component.
  • the temperature-changing component is simplified to obtain a simplified geometric model of the temperature-changing component, including:
  • the target features include: bolt holes.
  • variable temperature components In practical applications, to achieve structural simplification of variable temperature components, it is necessary to first obtain the three-dimensional structural model of the variable temperature components, which can be achieved using three-dimensional modeling software. For example, technicians can use three-dimensional modeling software to construct a three-dimensional structural model of the variable temperature component based on the structural drawings of the variable temperature component, and then send it to the loading strength design device of the variable temperature component. After obtaining the three-dimensional structural model of the variable temperature component, the three-dimensional structural model is split using three-dimensional modeling software, and the target features of each split structural component are removed, and only the key structural units are retained, thereby obtaining a simplified geometric modeling model of the variable temperature component. It should be noted that the target features include small components such as bolt holes and bolts.
  • the method of obtaining the finite element model of the temperature-changing component according to the simplified geometric modeling model includes:
  • Each of the split structural components is discretized in the form of grid units, and the grid units are connected by common nodes.
  • each split structural component is discretized in the form of grid units, and the grid units are connected by common nodes.
  • the temperature of the i-th grid node is recorded as Ti, and the Mises stress is recorded as ⁇ i .
  • ⁇ s (T) the loading intensity function and combine it with the above-mentioned material yield strength function: ⁇ s (T) to determine the loading intensity of the i-th grid node.
  • the temperature and Mises stress of each grid node are substituted into the loading strength function for analysis to obtain an analysis result of whether the loading strength meets the first preset threshold or does not meet the first preset threshold;
  • the first preset threshold value ranges from greater than or equal to 0.8 to less than or equal to 1.
  • the optimization interval is determined by setting a first preset threshold.
  • the temperature of the i-th grid node is recorded as Ti, and the Mises stress is recorded as ⁇ i .
  • substitute the loading strength function: F(i) k ⁇ i / ⁇ s (T i ) and combine the above-mentioned material yield strength function: ⁇ s (T) to determine the value of the loading strength of the i-th grid node, and then compare it with the first preset threshold to determine whether it needs to be optimized.
  • the application sets the range of the first threshold to be greater than or equal to 0.8 to less than or equal to 1.
  • the value of the loading strength obtained by analysis falls into this interval, it means that the loading strength of the i-th grid node meets the requirements and no optimization is required, thereby obtaining an analysis result that the loading strength meets the first preset threshold. If the value of the loading strength obtained by analysis does not fall into this interval, it means that the loading strength of the i-th grid node does not meet the requirements and needs to be optimized, thereby obtaining an analysis result that the loading strength does not meet the first preset threshold.
  • variable temperature component has a load-bearing function.
  • the maximum stress is generally considered to meet the allowable stress requirements, and the magnitude of the stress depends on the cross-sectional area of the component, that is, the minimum cross-sectional area is limited.
  • Their internal thermal resistance state determines the size of the conduction heat flux per unit time.
  • the maximum heat flux per unit time is required to be less than the cooling work of the refrigeration system, and the thermal resistance is inversely proportional to the cross-sectional area, that is, the cross-sectional area of the load-bearing component has restrictions. Therefore, according to the specific analysis results, the variable temperature component is optimized accordingly to realize the structural design of the variable temperature component.
  • S104 optimize according to the analysis result.
  • the temperature-changing component is optimized to realize the structural design of the temperature-changing component, which specifically includes:
  • the grid node When the loading strength of the grid node is less than 0.8, the grid node is thinned along the direction of the conduction heat flow;
  • the grid nodes are thickened along the force line direction.
  • the range of the first preset threshold is greater than or equal to 0.8 to less than or equal to 1. Determine the positions where the loading intensity is higher than 1 and the positions where the loading intensity is less than 0.8 in all grid nodes, and use them as subsequent optimization objects. The positions where the loading intensity is higher than 1 are thickened along the direction of the force line, and the positions where the loading intensity is less than 0.8 are thinned along the direction of the conduction heat flow. Until the loading intensity of all grid nodes meets the first preset threshold, the structural design of the temperature variable component is considered to be completed.
  • the present application first obtains the temperature-dependent material yield strength function of the variable temperature component, and uses finite element software to perform temperature field analysis and stress field analysis on the variable temperature component to obtain the temperature and Mises stress of each grid node of the variable temperature component. Then, in combination with the material yield strength function, the temperature and Mises stress of each grid node are substituted into the loading intensity function for analysis to obtain the analysis results. Finally, the variable temperature component is optimized according to the analysis results to realize the structural design of the variable temperature component.
  • variable temperature component achieves the optimal structural size, and the lightweight level is improved under the premise of ensuring the reduction of heat leakage.
  • the present application further provides a device for designing the loading strength of a temperature-changing component.
  • the device for designing the loading strength of a temperature-changing component is described below in conjunction with the embodiments and drawings.
  • FIG2 is a schematic diagram of the structure of a device for designing the loading strength of a temperature-variable component provided in an embodiment of the present application.
  • the device 200 for designing the loading strength of a temperature-variable component provided in an embodiment of the present application includes:
  • An acquisition module 201 is used to acquire a material yield strength function of a temperature-variable component related to temperature
  • the first analysis module 202 is used to perform temperature field analysis and stress field analysis on the temperature-changing component using finite element software to obtain the temperature and Mises stress of each grid node of the temperature-changing component;
  • the second analysis module 203 is used to combine the material yield strength function, substitute the temperature and Mises stress of each grid node into the loading strength function for analysis, and obtain the analysis result;
  • the optimization module 204 is used to optimize the temperature-changing component according to the analysis results to achieve the structural design of the temperature-changing component. count.
  • the first analysis module 202 is specifically used for:
  • parameters of each grid node of the temperature-changing component are set in finite element software
  • temperature field analysis and stress field analysis are performed on the temperature-variable component to determine the temperature and Mises stress of each grid node.
  • the second analysis module 203 is specifically used for:
  • the temperature and Mises stress of each grid node are substituted into the loading strength function for analysis to obtain an analysis result of whether the loading strength meets the first preset threshold or does not meet the first preset threshold;
  • the first preset threshold value ranges from greater than or equal to 0.8 to less than or equal to 1.
  • the optimization module 204 is specifically used to:
  • the grid node When the loading strength of the grid node is less than 0.8, the grid node is thinned along the direction of the conduction heat flow;
  • the grid nodes are thickened along the force line direction.
  • the temperature-variable component loading strength design device 200 further includes: a simplification module and an acquisition submodule;
  • a simplification module used for simplifying the temperature-changing component to obtain a simplified geometric model of the temperature-changing component
  • An acquisition submodule is used to acquire a finite element model of the temperature-changing component according to the simplified geometric modeling model.
  • the simplified module is specifically used for:
  • the target features include: bolt holes.
  • the acquisition submodule is specifically used for:
  • Each of the split structural components is discretized in the form of grid units, and the grid units are connected by common nodes.
  • the present application first obtains the temperature-dependent material yield strength function of the variable temperature component, and uses finite element software to perform temperature field analysis and stress field analysis on the variable temperature component to obtain the temperature and Mises stress of each grid node of the variable temperature component. Then, in combination with the material yield strength function, the temperature and Mises stress of each grid node are substituted into the loading intensity function for analysis to obtain the analysis results. Finally, the variable temperature component is optimized according to the analysis results to realize the structural design of the variable temperature component.
  • variable temperature component achieves the optimal structural size, and the lightweight level is improved under the premise of ensuring the reduction of heat leakage.
  • the present application also provides a loading strength design device for a variable temperature component, comprising: a memory for storing a computer program; and a processor for implementing the steps of the loading strength design method for a variable temperature component as described in any of the above items when executing the computer program.
  • the present application also provides a readable storage medium, on which a computer program is stored.
  • a computer program is stored.
  • the steps of the method for designing the loading strength of a temperature-changing component as described in any one of the above items are implemented.

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Abstract

本申请公开了一种变温部件的加载强度设计方法及相关产品，可应用于超导磁体技术领域，该方法包括：获取变温部件与温度相关的材料屈服强度函数；利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；根据分析结果优化所述变温部件，实现所述变温部件的结构设计。由此，对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，在保证减少漏热的前提下提高了轻量化水平。

Description

一种变温部件的加载强度设计方法及相关产品
本发明要求于2023年07月06日提交中华人民共和国国家知识产权局、申请号为202310823455.2、申请名称为“一种变温部件的加载强度设计方法及相关产品”的中国专利申请的优先权，其全部内容通过引用结合在本发明中。
技术领域
本申请涉及超导磁体技术领域，特别是涉及一种变温部件的加载强度设计方法及相关产品。
背景技术
超导磁体是电动悬浮列车的关键核心子系统，主要由超导磁极及低温恒温器构成，对于车载超导磁体低温恒温器的设计有别于传统静态应用的低温恒温器结构，要求具备较强的承载能力、更低的传导漏热功率以及较好的轻量化设计。
现有的设计方法无法同时兼顾承载能力、传导漏热功率以及轻量化设计，为了保证低温恒温器的承载能力以及传导漏热功率往往会忽视低温恒温器的轻量化设计，从而出现设计的低温恒温器过重的问题。
因此，如何在保证低温恒温器减少漏热的前提下提高轻量化水平，是本领域技术人员急需解决的问题。
发明内容
基于上述问题，本申请提供了一种变温部件的加载强度设计方法及相关产品，通过对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，从而解决了现有技术无法同时兼顾承载能力、传导漏热功率以及轻量化设计的问题。
第一方面，本申请提供了一种变温部件的加载强度设计方法，包括：
获取变温部件与温度相关的材料屈服强度函数；
利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；
结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；
根据分析结果优化所述变温部件，实现所述变温部件的结构设计。
可选的，所述利用有限元软件对所述变温部件进行温度场分析和应力场分析，得 到所述变温部件各个网格节点的温度和米赛斯应力之前，还包括：
对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型；
根据所述简化几何建模模型获取所述变温部件的有限元模型。
可选的，所述对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型，包括：
获取所述变温部件的三维结构模型；
利用建模软件对所述三维结构模型进行拆分，去除各个拆分结构部件的目标特征，得到所述变温部件的简化几何建模模型；
所述目标特征包括：螺栓孔。
可选的，所述根据所述简化几何建模模型获取所述变温部件的有限元模型，包括：
将所述简化几何建模模型导入有限元软件；
将所述各个拆分结构部件的材料参数输入有限元软件，得到所述变温部件的有限元模型；
所述各个拆分结构部件以网格单元的形式离散化，网格单元之间采用共节点连接。
可选的，所述利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力，包括：
结合所述变温部件运行时的实际状况，在有限元软件中对所述变温部件的各个网格节点进行参数设置；
结合所述参数设置，对所述变温部件进行温度场分析和应力场分析，确定各个网格节点的温度和米赛斯应力。
可选的，所述结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果，包括：
结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到加载强度符合第一预设阈值或不符合第一预设阈值的分析结果；
所述第一预设阈值的范围为大于等于0.8至小于等于1。
可选的，所述根据分析结果优化所述变温部件，实现所述变温部件的结构设计，包括：
确定不符合第一预设阈值的网格节点的具体加载强度；
当所述网格节点的加载强度小于0.8时，对所述网格节点沿传导热流方向进行减薄 处理；
当所述网格单元的加载强度大于1时，对所述网格节点沿力线方向进行加厚处理。
第二方面，本申请提供了一种变温部件的加载强度设计装置，包括：
获取模块，用于获取变温部件与温度相关的材料屈服强度函数；
第一分析模块，用于利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；
第二分析模块，用于结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；
优化模块，用于根据分析结果优化所述变温部件，实现所述变温部件的结构设计。
第三方面，本申请提供了一种变温部件的加载强度设计设备，其特征在于，包括：
存储器，用于存储计算机程序；
处理器，用于执行所述计算机程序时实现如上述任一项所述变温部件的加载强度设计方法的步骤。
第四方面，本申请提供了一种可读存储介质，所述可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如上述任一项所述变温部件的加载强度设计方法的步骤。
从以上技术方案可以看出，相较于现有技术，本申请具有以下优点：
本申请首先获取变温部件与温度相关的材料屈服强度函数，并利用有限元软件对变温部件进行温度场分析和应力场分析，得到变温部件各个网格节点的温度和米赛斯应力。然后结合材料屈服强度函数，将各个网格节点的温度和米赛斯应力代入加载强度函数进行分析，得到分析结果。最后根据分析结果优化变温部件，实现变温部件的结构设计。由此，对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，在保证减少漏热的前提下提高了轻量化水平。
附图说明
图1为本申请提供的一种变温部件的加载强度设计方法的流程图；
图2为本申请提供的一种变温部件的加载强度设计装置的结构示意图。
具体实施方式
正如前文所述，现有的设计方法无法同时兼顾承载能力、传导漏热功率以及轻量化设计。具体来说，现有的变温部件的设计方法不考虑低温下材料机械性能改变的有利条件，为了保证低温恒温器的承载能力以及传导漏热功率往往会忽视低温恒温器的轻量化设计，从而出现设计的低温恒温器过重的问题。
为了解决上述问题，本申请提供了一种变温部件的加载强度设计方法，包括：首先获取变温部件与温度相关的材料屈服强度函数，并利用有限元软件对变温部件进行温度场分析和应力场分析，得到变温部件各个网格节点的温度和米赛斯应力。然后结合材料屈服强度函数，将各个网格节点的温度和米赛斯应力代入加载强度函数进行分析，得到分析结果。最后根据分析结果优化变温部件，实现变温部件的结构设计。
如此，对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，在保证减少漏热的前提下提高了轻量化水平。
需要说明的是，本申请提供的一种变温部件的加载强度设计方法及相关产品可应用于超导磁体技术领域。上述仅为示例，并不对本申请提供的一种变温部件的加载强度设计方法及相关产品的应用领域进行限定。
为了使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
图1为本申请提供的一种变温部件的加载强度设计方法的流程图。结合图1所示，本申请提供的一种变温部件的加载强度设计方法，可以包括：
S101：获取变温部件与温度相关的材料屈服强度函数。
在实际应用中，超导磁体是电动悬浮列车的关键核心子系统，主要由超导磁极及低温恒温器构成，其中低温恒温器结构中有一些部件是介于低温环境与外部常温环境之间的，被称为变温部件，这些部件起到承载内部低温区全部动静载荷。同时由于其传导热流作用，持续影响内部低温区。结合变温部件的组成材料，通过材料低温性能测试，得到材料随温度变化的强度曲线，即获取变温部件与温度相关的材料屈服强度函数，记为σs(T)。
S102：利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力。
在实际应用中，有限元软件可作为主要的分析软件。具体的，将变温部件按照承载部件进行结构设计的分析模型输入有限元软件中，定义设计域以及各个网格节点的参数，开展温度场分析和应力场分析，得到变温部件各个网格节点的温度和米赛斯应力。
另外，由于得到变温部件各个网格节点的温度和米赛斯应力的方式不尽相同，因此本申请可以就可能的得到方式进行说明。
在一种情况下，针对如何得到各个网格节点的温度和米赛斯应力。相应的，S102：利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力，包括：
结合所述变温部件运行时的实际状况，在有限元软件中对所述变温部件的各个网格节点进行参数设置；
结合所述参数设置，对所述变温部件进行温度场分析和应力场分析，确定各个网格节点的温度和米赛斯应力。
在实际应用中，利用有限元软件对变温部件进行分析时应添加对应的应用条件。具体的，将有限元软件中分析场景设置为服役条件，并将服役条件下各个网格节点对应的参数录入，如此分析便可确定服役条件下变温部件全部网格节点的温度和应力分布，对应第i个网格节点的温度记为Ti，米赛斯应力记为σi。
另外，由于变温部件的处理方式不尽相同，因此本申请可以就一种可能的处理方式进行说明。
在一种情况下，针对如何对变温部件进行处理。相应的，所述利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力之前，还包括：
对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型；
根据所述简化几何建模模型获取所述变温部件的有限元模型。
在实际应用中，需要用到有限元软件进行温度场和应力场的分析，但为了分析效率，可以对变温部件进行预处理。具体的，可以先对变温部件进行简化处理，得到变温部件的简化几何建模模型，然后将得到的简化几何建模模型代入有限元软件，从而获取变温部件的有限元模型。
另外，由于对变温部件进行简化的方式不尽相同，因此本申请可以就可能的简化方式进行说明。
在一种情况下，针对如何对变温部件进行简化处理。相应的，所述对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型，包括：
获取所述变温部件的三维结构模型；
利用建模软件对所述三维结构模型进行拆分，去除各个拆分结构部件的目标特征，得到所述变温部件的简化几何建模模型；
所述目标特征包括：螺栓孔。
在实际应用中，实现变温部件的结构简化需要先获取变温部件的三维结构模型，可以利用三维建模软件实现。例如，技术人员可以根据变温部件的结构图纸，利用三维建模软件进行变温部件的三维结构模型的构建，然后发送给变温部件的加载强度设计装置。当获取到变温部件的三维结构模型后，利用三维建模软件对该三维结构模型进行拆分，去除各个拆分结构部件的目标特征，只保留关键结构单元，从而得到变温部件的简化几何建模模型。需要注意的是，目标特征包括螺栓孔、螺栓等细小部件。
另外，由于获取有限元模型的方式不尽相同，因此本申请可以就可能的获取方式进行说明。
在一种情况下，针对如何获取有限元模型。相应的，所述根据所述简化几何建模模型获取所述变温部件的有限元模型，包括：
将所述简化几何建模模型导入有限元软件；
将所述各个拆分结构部件的材料参数输入有限元软件，得到所述变温部件的有限元模型；
所述各个拆分结构部件以网格单元的形式离散化，网格单元之间采用共节点连接。
在实际应用中，在得到简化几何建模模型后可以直接将其导入有限元模型中，然后对已拆分的各个结构部件进行材料参数的定义，从而得到变温部件的有限元模型。需要注意的是，材料参数包括但不限于密度、弹性模量和泊松比。另外，各个拆分结构部件均以网格单元的形式离散化，且网格单元之间采用共节点连接。
S103：结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果。
在实际应用中，结合上述而言，经过分析得到第i个网格节点的温度记为Ti，米赛斯应力记为σi。建立加载强度函数：F(i)＝kσi/σs(Ti)并写入有限元后处理程序，其 中k为安全系数一般取1.5，当有限元软件分析得到第i个网格节点的温度和米赛斯应力后，代入加载强度函数并结合上述材料屈服强度函数：σs(T)，即可确定出第i个网格节点的加载强度。
另外，由于分析方式不尽相同，因此本申请可以就一种可能的分析方式进行说明。
在一种情况下，针对如何对各个网格节点的加载强度进行分析。相应的，S103：结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果，具体包括：
结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到加载强度符合第一预设阈值或不符合第一预设阈值的分析结果；
所述第一预设阈值的范围为大于等于0.8至小于等于1。
在实际应用中，通过设置第一预设阈值从而确定优化区间。相应的，经过分析得到第i个网格节点的温度记为Ti，米赛斯应力记为σi。然后代入加载强度函数：F(i)＝kσi/σs(Ti)并结合上述材料屈服强度函数：σs(T)，确定出第i个网格节点的加载强度的值，然后与第一预设阈值进行比较，确定是否需要进行优化。具体的，本申请设置第一阈值的范围为大于等于0.8至小于等于1。若分析得到的加载强度的值落入该区间，则表明第i个网格节点的加载强度符合要求，不用进行优化，从而得到加载强度符合第一预设阈值的分析结果。若分析得到的加载强度的值未落入该区间，则表明第i个网格节点的加载强度不符合要求，需要进行优化，从而得到加载强度不符合第一预设阈值的分析结果。
S104：根据分析结果优化所述变温部件，实现所述变温部件的结构设计。
在实际应用中，变温部件具有承载功能，设计时一般考虑最大应力满足许用应力要求，而应力的大小取决于部件的截面积，即最小截面积受到限制。但对于低温系统的支撑部件，需要工作在低温和常温之间，其内部热阻状态决定了单位时间内传导热流大小，一般要求单位时间的最大热流小于制冷系统的冷功，而热阻与截面积成反比，即承载部件的截面积具有限制条件。因此，根据具体的分析结果，对变温部件进行对应的优化，实现所述变温部件的结构设计。
另外，由于变温部件的优化方式不尽相同，因此本申请可以就可能的优化方式进行说明。
在一种情况下，针对如何对变温部件进行优化。相应的，S104：根据分析结果优 化所述变温部件，实现所述变温部件的结构设计，具体包括：
确定不符合第一预设阈值的网格节点的具体加载强度；
当所述网格节点的加载强度小于0.8时，对所述网格节点沿传导热流方向进行减薄处理；
当所述网格单元的加载强度大于1时，对所述网格节点沿力线方向进行加厚处理。
在实际应用中，如上所述，通过加载强度函数：F(i)＝kσi/σs(Ti)可以确定第i个网格节点的加载强度。另外第一预设阈值的范围为大于等于0.8至小于等于1。确定所有网格节点中加载强度高于1的位置以及小于0.8的位置，将其作为后续的优化对象。对加载强度高于1的位置沿力线方向进行加厚处理，对加载强度小于0.8的位置沿传导热流方向进行减薄处理。直至所有的网格节点的加载强度均符合第一预设阈值时，视为完成变温部件的结构设计。
综上所述，本申请首先获取变温部件与温度相关的材料屈服强度函数，并利用有限元软件对变温部件进行温度场分析和应力场分析，得到变温部件各个网格节点的温度和米赛斯应力。然后结合材料屈服强度函数，将各个网格节点的温度和米赛斯应力代入加载强度函数进行分析，得到分析结果。最后根据分析结果优化变温部件，实现变温部件的结构设计。由此，对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，在保证减少漏热的前提下提高了轻量化水平。
基于上述实施例提供的一种变温部件的加载强度设计方法，本申请还提供了一种变温部件的加载强度设计装置。下面分别结合实施例和附图，对该变温部件的加载强度设计装置进行描述。
图2为本申请实施例提供的一种变温部件的加载强度设计装置的结构示意图。结合图2所示，本申请实施例提供的变温部件的加载强度设计装置200，包括：
获取模块201，用于获取变温部件与温度相关的材料屈服强度函数；
第一分析模块202，用于利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；
第二分析模块203，用于结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；
优化模块204，用于根据分析结果优化所述变温部件，实现所述变温部件的结构设 计。
作为一种实施方式，针对如何利用有限元软件对变温部件进行分析，上述第一分析模块202具体用于：
结合所述变温部件运行时的实际状况，在有限元软件中对所述变温部件的各个网格节点进行参数设置；
结合所述参数设置，对所述变温部件进行温度场分析和应力场分析，确定各个网格节点的温度和米赛斯应力。
作为一种实施方式，针对如何结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果，上述第二分析模块203具体用于：
结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到加载强度符合第一预设阈值或不符合第一预设阈值的分析结果；
所述第一预设阈值的范围为大于等于0.8至小于等于1。
作为一种实施方式，针对如何确定如何优化变温部件，上述优化模块204具体用于：
确定不符合第一预设阈值的网格节点的具体加载强度；
当所述网格节点的加载强度小于0.8时，对所述网格节点沿传导热流方向进行减薄处理；
当所述网格单元的加载强度大于1时，对所述网格节点沿力线方向进行加厚处理。
作为一种实施方式，针对如何高效优化变温部件，上述变温部件的加载强度设计装置200还包括：简化模块和获取子模块；
简化模块，用于对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型；
获取子模块，用于根据所述简化几何建模模型获取所述变温部件的有限元模型。
作为一种实施方式，针对如何高效优化变温部件，上述简化模块具体用于：
获取所述变温部件的三维结构模型；
利用建模软件对所述三维结构模型进行拆分，去除各个拆分结构部件的目标特征，得到所述变温部件的简化几何建模模型；
所述目标特征包括：螺栓孔。
作为一种实施方式，针对如何高效优化变温部件，上述获取子模块具体用于：
将所述简化几何建模模型导入有限元软件；
将所述各个拆分结构部件的材料参数输入有限元软件，得到所述变温部件的有限元模型；
所述各个拆分结构部件以网格单元的形式离散化，网格单元之间采用共节点连接。
综上所述，本申请首先获取变温部件与温度相关的材料屈服强度函数，并利用有限元软件对变温部件进行温度场分析和应力场分析，得到变温部件各个网格节点的温度和米赛斯应力。然后结合材料屈服强度函数，将各个网格节点的温度和米赛斯应力代入加载强度函数进行分析，得到分析结果。最后根据分析结果优化变温部件，实现变温部件的结构设计。由此，对变温部件进行温度场和应力场分析，结合材料屈服强度函数，利用加载强度函数进行分析，进而优化变温部件的结构，使变温部件实现最优的结构尺寸，在保证减少漏热的前提下提高了轻量化水平。
另外，本申请还提供了一种变温部件的加载强度设计设备，包括：存储器，用于存储计算机程序；处理器，用于执行所述计算机程序时实现如上述任一项所述变温部件的加载强度设计方法的步骤。
另外，本申请还提供了一种可读存储介质，所述可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如上述任一项所述变温部件的加载强度设计方法的步骤。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本申请。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本申请的精神或范围的情况下，在其它实施例中实现。因此，本申请将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

  1. 一种变温部件的加载强度设计方法，其特征在于，所述方法包括：
    获取变温部件与温度相关的材料屈服强度函数；
    利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；
    结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；
    根据分析结果优化所述变温部件，实现所述变温部件的结构设计。
  2. 根据权利要求1所述的方法，其特征在于，所述利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力之前，还包括：
    对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型；
    根据所述简化几何建模模型获取所述变温部件的有限元模型。
  3. 根据权利要求2所述的方法，其特征在于，所述对所述变温部件进行简化处理，得到所述变温部件的简化几何建模模型，包括：
    获取所述变温部件的三维结构模型；
    利用建模软件对所述三维结构模型进行拆分，去除各个拆分结构部件的目标特征，得到所述变温部件的简化几何建模模型；
    所述目标特征包括：螺栓孔。
  4. 根据权利要求3所述的方法，其特征在于，所述根据所述简化几何建模模型获取所述变温部件的有限元模型，包括：
    将所述简化几何建模模型导入有限元软件；
    将所述各个拆分结构部件的材料参数输入有限元软件，得到所述变温部件的有限元模型；
    所述各个拆分结构部件以网格单元的形式离散化，网格单元之间采用共节点连接。
  5. 根据权利要求1所述的方法，其特征在于，所述利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力，包括：
    结合所述变温部件运行时的实际状况，在有限元软件中对所述变温部件的各个网格节点进行参数设置；
    结合所述参数设置，对所述变温部件进行温度场分析和应力场分析，确定各个网格节点的温度和米赛斯应力。
  6. 根据权利要求1所述的方法，其特征在于，所述结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果，包括：
    结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到加载强度符合第一预设阈值或不符合第一预设阈值的分析结果；
    所述第一预设阈值的范围为大于等于0.8至小于等于1。
  7. 根据权利要求6所述的方法，其特征在于，所述根据分析结果优化所述变温部件，实现所述变温部件的结构设计，包括：
    确定不符合第一预设阈值的网格节点的具体加载强度；
    当所述网格节点的加载强度小于0.8时，对所述网格节点沿传导热流方向进行减薄处理；
    当所述网格单元的加载强度大于1时，对所述网格节点沿力线方向进行加厚处理。
  8. 一种变温部件的加载强度设计装置，其特征在于，包括：
    获取模块，用于获取变温部件与温度相关的材料屈服强度函数；
    第一分析模块，用于利用有限元软件对所述变温部件进行温度场分析和应力场分析，得到所述变温部件各个网格节点的温度和米赛斯应力；
    第二分析模块，用于结合所述材料屈服强度函数，将各个网格节点的所述温度和米赛斯应力代入加载强度函数进行分析，得到分析结果；
    优化模块，用于根据分析结果优化所述变温部件，实现所述变温部件的结构设计。
  9. 一种变温部件的加载强度设计设备，其特征在于，包括：
    存储器，用于存储计算机程序；
    处理器，用于执行所述计算机程序时实现如权利要求1至7任一项所述变温部件的加载强度设计方法的步骤。
  10. 一种可读存储介质，其特征在于，所述可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如权利要求1至7任一项所述变温部件的加载强度设计方法的步骤。
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