WO2024255481A1 - 干燥介质回收系统和半导体干燥设备 - Google Patents

干燥介质回收系统和半导体干燥设备 Download PDF

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Publication number
WO2024255481A1
WO2024255481A1 PCT/CN2024/091288 CN2024091288W WO2024255481A1 WO 2024255481 A1 WO2024255481 A1 WO 2024255481A1 CN 2024091288 W CN2024091288 W CN 2024091288W WO 2024255481 A1 WO2024255481 A1 WO 2024255481A1
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WIPO (PCT)
Prior art keywords
drying medium
drying
pipeline
recovery system
organic solvent
Prior art date
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Ceased
Application number
PCT/CN2024/091288
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English (en)
French (fr)
Inventor
曾娟
金银花
王文军
张晓燕
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ACM Research Shanghai Inc
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ACM Research Shanghai Inc
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Priority to KR1020267001530A priority Critical patent/KR20260023061A/ko
Publication of WO2024255481A1 publication Critical patent/WO2024255481A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0003—Condensation of vapours; Recovering volatile solvents by condensation by using heat-exchange surfaces for indirect contact between gases or vapours and the cooling medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0078—Condensation of vapours; Recovering volatile solvents by condensation characterised by auxiliary systems or arrangements
    • B01D5/009—Collecting, removing and/or treatment of the condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/30—Controlling, e.g. regulating, parameters of gas supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/40—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air
    • F26B21/471—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air condensing vapours onto the surface of the materials to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/16—Drying solid materials or objects by processes not involving the application of heat by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Definitions

  • the present application relates to the field of semiconductor manufacturing, and in particular to a drying medium recovery system and a semiconductor drying device.
  • the embodiments of the present application provide a supercritical drying medium recovery system and a semiconductor drying device to at least solve the problem of how to recover the drying medium (such as carbon dioxide) in the process of drying wafers in the related art.
  • the drying medium such as carbon dioxide
  • an embodiment of the present application provides a drying medium recovery system, which is applied to semiconductor drying equipment, wherein the semiconductor drying equipment includes a drying device, wherein the drying device is used to dissolve the organic solvent on the wafer by means of a supercritical drying medium; the drying medium recovery system is used to recover the organic solvent discharged by the drying device.
  • the drying medium in the drying medium containing the organic solvent is recovered, the drying medium recovery system comprises a separation device, the separation device comprises a condensation pipeline and a first cavity, the lower side wall of the condensation pipeline is provided with a drain port, the drain port is communicated with the first cavity, the inlet of the condensation pipeline is used to receive the drying medium containing the organic solvent, and the outlet of the condensation pipeline is used to discharge the separated drying medium for recovery; wherein,
  • the condensation pipeline is used to condense the organic solvent in the drying medium containing the organic solvent, so that the organic solvent is condensed into a liquid and flows into the first cavity from the drain port.
  • the condensation pipeline is spiral.
  • the inlet of the condensation line and the outlet of the condensation line are located at different heights in the vertical direction.
  • the condensation pipeline is arranged in the first cavity, or arranged outside the first cavity.
  • a first liquid outlet is disposed at the bottom of the first cavity, and the first liquid outlet is used to discharge the organic solvent in the first cavity.
  • a first air outlet is disposed on a side wall of the first cavity for discharging the drying medium in the first cavity for recovery.
  • the drying medium recovery system further includes a first cooling device, which is connected to the condensation pipeline and is used to maintain the temperature of the condensation pipeline within a preset temperature range.
  • the first cooling device is spirally wound on the condensation pipeline.
  • the drying medium recovery system also includes a purification device, which includes a second cavity provided with a second air outlet, an air inlet pipeline and a drying medium filter membrane, wherein the drying medium filter membrane is arranged in the second cavity and divides the second cavity into an upper space and a lower space; the lower space of the second cavity is used to accommodate a purification solvent; the air inlet end of the air inlet pipeline is connected to the outlet of the condensation pipeline, and the air outlet end of the air inlet pipeline is inserted into the second cavity; the second air outlet is arranged in the upper space and is used to discharge the purified drying medium for recovery.
  • a purification device which includes a second cavity provided with a second air outlet, an air inlet pipeline and a drying medium filter membrane, wherein the drying medium filter membrane is arranged in the second cavity and divides the second cavity into an upper space and a lower space; the lower space of the second cavity is used to accommodate a purification solvent; the air inlet end of the air inlet pipeline is connected to the outlet of the condensation pipeline, and
  • the drying medium recovery system further includes a first pipeline, a second pipeline, a detection device, a switch device and a controller, wherein the pipeline through which the drying device discharges the drying medium containing the organic solvent is connected to the first pipeline and the second pipeline respectively through the switch device; the first pipeline is connected to the separation device; the second pipeline is connected to the purification device; wherein,
  • the detection device is used to detect the concentration of the organic solvent in the drying medium containing the organic solvent discharged by the drying device; the controller is used to control the switch device to switch the first pipeline and the second pipeline according to the concentration of the organic solvent detected by the detection device;
  • the controller controls the switch device to connect the first pipeline; when the organic solvent concentration detected by the detection device is less than the preset concentration, the controller controls the switch device to connect the second pipeline.
  • the drying medium recovery system further includes a dehumidification device, and the dehumidification device is connected to the outlet of the condensation pipeline or the second air outlet.
  • the drying medium recovery system further includes a filtering device, and the filtering device is connected to the dehumidification device.
  • the present application also provides a semiconductor drying device in an embodiment, comprising: a drying medium recovery system, a storage device, a supercritical drying medium preparation device and a drying device as described in the first aspect, wherein the drying medium recovery system, the storage device, the supercritical drying medium preparation device and the drying device are sequentially connected to form a circulation loop, wherein:
  • the storage device is used to store the dry medium recovered in the dry medium recovery system
  • the supercritical drying medium preparation device is used to prepare the drying medium discharged from the storage device into a supercritical drying medium
  • the drying device is configured to dissolve the organic solvent on the surface of the wafer through the supercritical drying medium to dry the wafer, and discharge the drying medium containing the organic solvent to the drying medium recovery system to recover the drying medium.
  • the supercritical drying medium preparation device comprises:
  • a second cooling device used to cool the drying medium discharged from the storage device into a liquid state
  • a pressurizing device used to pressurize the liquid drying medium to a pressure exceeding the critical pressure of the drying medium
  • the heating device is used to heat the drying medium exceeding the critical pressure to a temperature exceeding the critical temperature of the drying medium to obtain a supercritical drying medium.
  • the drying medium recovery system and semiconductor drying equipment provided in the embodiment of the present application include a drying device, the drying device is used to dissolve the organic solvent on the wafer through the supercritical drying medium; the drying medium recovery system is used to recover the drying medium in the drying medium containing the organic solvent discharged from the drying device.
  • the separation device By setting a separation device in the drying medium recovery system, the separation device includes A condensation pipeline and a first cavity, a drain port is provided on the lower side wall of the condensation pipeline, the drain port is connected to the first cavity, the inlet of the condensation pipeline is used to receive a drying medium containing an organic solvent, and the outlet of the condensation pipeline is used to discharge the drying medium after separation for recovery; wherein, the condensation pipeline is used to condense the organic solvent in the drying medium containing the organic solvent, so that the organic solvent is condensed into a liquid and flows into the first cavity from the drain port, thereby solving the problem of how to recover carbon dioxide in the process of drying wafers in the related technology and realizing the recovery of carbon dioxide in the process of drying wafers.
  • FIG1 is a schematic structural diagram of a first embodiment of a drying medium recovery system provided by the present application.
  • FIG2 is a schematic structural diagram of a second embodiment of a drying medium recovery system provided by the present application.
  • FIG3 is a schematic structural diagram of a third embodiment of a drying medium recovery system provided by the present application.
  • FIG4 is a schematic structural diagram of a fourth embodiment of a drying medium recovery system provided by the present application.
  • FIG5 is a schematic structural diagram of a fifth embodiment of a drying medium recovery system provided by the present application.
  • FIG6 is a schematic structural diagram of a sixth embodiment of a drying medium recovery system provided by the present application.
  • FIG7 is a schematic structural diagram of a seventh embodiment of a drying medium recovery system provided in the present application.
  • FIG8 is a schematic structural diagram of an eighth embodiment of a drying medium recovery system provided by the present application.
  • FIG9 is a schematic structural diagram of a semiconductor drying device according to an embodiment of the present application.
  • FIG. 10 is a structural block diagram of a semiconductor drying device according to an embodiment of the present application.
  • Figure numerals 10, separation device; 11, first cavity; 111, first liquid outlet; 112, first air outlet; 12, condensation pipeline; 121, drain outlet; 122, inlet of condensation pipeline; 123, outlet of condensation pipeline; 124, first cooling device; 30, purification device; 31, second cavity; 311, second air outlet; 312 second liquid outlet; 313, third air outlet; 314, upper space; 315, lower space; 32, air inlet pipeline; 33, drying Medium filter membrane; 20, controller; 40, first pipeline; 50, second pipeline; 60, switch device; 70, detection device; 80, dehumidification device; 90, filtering device; 100, drying medium recovery system; 200, supercritical drying medium preparation device; 201, second cooling device; 202, boosting device; 203, heating device; 300, drying device; 400, third pipeline; 500, fourth pipeline; 600, fifth pipeline; 700, storage device; 800, The sixth pipeline.
  • connection is not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
  • the “multiple” involved in this application refers to greater than or equal to two.
  • “And/or” describes the association relationship of associated objects, indicating that there can be three relationships, for example, “A and/or B” can represent: A exists alone, A and B exist at the same time, and B exists alone.
  • the terms “first”, “second”, “third” and the like involved in the present application are merely used to distinguish similar objects and do not represent a specific ordering of the objects.
  • This embodiment provides a drying medium recovery system 100 , which is applied to semiconductor drying equipment.
  • the semiconductor drying device includes a drying medium recovery system 100, a storage device 700, a supercritical drying medium preparation device 200, and a drying device 300, which are sequentially connected and form a circulation loop, wherein the drying medium recovery system 100 stores the recovered drying medium in the storage device 700 through the sixth pipeline 800; the storage device 700 passes the stored drying medium into the supercritical drying medium preparation device 200 through the fourth pipeline 500 to prepare the supercritical drying medium; the supercritical drying medium preparation device 200 passes the supercritical drying medium into the drying device 300 through the fifth pipeline 600 to dissolve the organic solvent remaining on the wafer to dry the wafer; the drying device 200 discharges the drying medium containing the organic solvent into the drying medium recovery system 100 through the third pipeline 400, thereby realizing the recycling of the drying medium.
  • the drying medium recovery system 100 stores the recovered drying medium in the storage device 700 through the sixth pipeline 800
  • the storage device 700 passes the stored drying medium into the supercritical drying medium preparation device 200 through the fourth pipeline 500 to prepare the supercritical drying medium
  • the supercritical drying medium preparation device 200 passes the supercritical drying medium into the
  • the drying medium containing the organic solvent discharged from the drying device 300 is basically in a gaseous state, because a pressure reducing valve is generally provided on the third pipeline 400, and the pressure is reduced by the pressure reducing valve so that most of the drying medium becomes a gaseous state.
  • drying medium recovery system 100 provided in this embodiment is described in detail with reference to FIG. 1 and FIG. 10 .
  • FIG1 is a schematic diagram of the structure of a drying medium recovery system 100 according to an embodiment of the present application.
  • the drying medium recovery system 100 includes a separation device 10.
  • the separation device 10 includes a condensation pipeline 12 and a first cavity 11, the condensation pipeline 12 is used to receive the drying medium containing the organic solvent and cool and liquefy the organic solvent, and the lower side wall of the condensation pipeline 12 is provided with a drain port 121, and the drain port 121 is connected to the first cavity 11 so that the liquefied organic solvent is discharged into the first cavity 11.
  • the inlet 122 of the condensation line is used to receive the drying medium containing the organic solvent.
  • the inlet 122 of the condensation line can be connected to the drying device 300 through the third pipeline 400, so as to receive the drying medium containing the organic solvent discharged by the drying device 300.
  • the outlet 123 of the condensation line is used to discharge the drying medium after separation for recycling.
  • the outlet 123 of the condensation line can be connected to the storage device 700 through the sixth pipeline 800, so as to recycle and store the drying medium after separation, so as to achieve the reuse of the drying medium.
  • the third pipeline 400 discharges a mixture of organic solvent and drying medium, such as a mixture of isopropyl alcohol and carbon dioxide, into the drying medium recovery system 100. Therefore, in this embodiment, the drying medium containing organic solvent is cooled by the condensation pipeline 12 in the separation device 10, so that the organic solvent can be liquefied and separated from the drying medium, and flow into the first cavity 11 from the drain port 121, and the drying medium can be liquefied and separated from the drying medium.
  • a mixture of organic solvent and drying medium such as a mixture of isopropyl alcohol and carbon dioxide
  • the substance is discharged through the outlet 123 of the condensation pipeline for recovery and/or storage, thereby realizing the separation of the organic solvent and the drying medium, solving the problem of how to recover the drying medium (such as carbon dioxide) in the process of drying the wafers in the related technology, realizing the recovery of carbon dioxide in the process of drying the wafers, and reducing the pollution of carbon dioxide to the environment and the waste of carbon dioxide resources.
  • the drying medium such as carbon dioxide
  • the condensation pipeline 12 is disposed inside the first cavity 11 , which can reduce the volume of the separation device 10 .
  • the inlet 122 of the condensation line is arranged at the bottom, and the outlet 123 of the condensation line is arranged at the top.
  • the inlet 122 of the condensation line is arranged at the top, and the outlet 123 of the condensation line is arranged at the bottom.
  • the flowability of the carbon dioxide containing isopropyl alcohol in the condensation pipeline 12 can be improved, thereby improving the condensation efficiency of isopropyl alcohol.
  • a first liquid outlet 111 is provided at the bottom of the first cavity 11, and the first liquid outlet 111 is used to discharge the organic solvent in the first cavity 11.
  • the first liquid outlet 111 is provided on the first cavity 11, it is possible to prevent excessive accumulation of isopropyl alcohol in the first cavity 11 from blocking the liquid outlet 121 and causing adverse effects on the separation of isopropyl alcohol and carbon dioxide.
  • the condensation line 12 may be spiral.
  • the condensation line 12 by setting the condensation line 12 in a spiral shape, the condensation line 12 can increase the contact area of isopropyl alcohol with the advantage of a small volume, thereby improving the condensation efficiency of isopropyl alcohol.
  • the drying medium recovery system 100 further includes a liquid recovery device (not shown), which is connected to the first liquid outlet 111 to collect the isopropyl alcohol discharged from the condensation line 12 into the first cavity 11 .
  • the organic solvent in this embodiment can be isopropanol, acetone, xylene, etc.
  • the drying medium can also be but not limited to carbon dioxide, ethylene, ethane, propane, chloroform, which is not specifically limited in the embodiments of this application.
  • the organic solvent is isopropanol and the drying medium is carbon dioxide for exemplary explanation, that is, in the specific example below, the drying medium containing the organic solvent received by the drying medium recovery system 100 is carbon dioxide containing isopropanol.
  • the difference in this embodiment is that the condensation pipeline 12 is arranged outside the first cavity 11 .
  • the condensation pipeline 12 is arranged outside the first cavity 11 .
  • condensation pipeline 12 in the second embodiment is arranged on the inner side of the first cavity 11 for exemplary explanation.
  • the drying medium recovery system 100 may further include a first cooling device 124 , which is sleeved on the outside of the condensation pipeline 12 and is used to cool the temperature of the condensation pipeline 12 within a preset temperature range.
  • the first cooling device 124 is mounted on the outside of the condensation line 12.
  • the temperature of the condensation line 12 is cooled within a preset temperature range by heat transfer, thereby enhancing the condensation capacity of the condensation line 12 and improving the liquefaction efficiency of isopropyl alcohol, thereby improving the separation effect of carbon dioxide and isopropyl alcohol.
  • the first cooling device 124 may be spirally wound on the condensation line 12 .
  • the side wall of the first cavity 11 is further provided with a first air outlet 112 for discharging the drying medium in the first cavity 11 for recycling.
  • the drying medium discharged from the first air outlet 112 and the outlet 123 of the condensation pipeline can be collected on the sixth pipeline 800 through the pipeline, so as to discharge and recycle the drying medium.
  • the first air outlet 112 on the side wall of the first cavity 11, it is possible to avoid the problem that when isopropyl alcohol and carbon dioxide are separated in the condensation line 12, part of the carbon dioxide is discharged into the first cavity 11 from the drain port 121, which causes excessive storage of carbon dioxide in the first cavity 11 and increases the internal air pressure, making it impossible for the isopropyl alcohol liquefied through the condensation line 12 to flow from the drain port 121 to the first cavity 12, thereby helping to improve the separation effect of isopropyl alcohol and carbon dioxide.
  • the drying medium recovery system 100 may also include a purification device 30.
  • the purification device 30 includes a second cavity 31 provided with a second gas outlet 311, an air inlet pipeline 32 and a drying medium filter membrane 33.
  • the drying medium filter membrane 33 is arranged in the second cavity 31, and the second cavity 31 is divided into an upper space 314 and a lower space 315, and the lower space 315 of the second cavity 31 is used to accommodate the purification solvent;
  • the air inlet end of the air inlet pipeline 32 is connected to the outlet 123 of the condensation pipeline, and the air outlet end of the air inlet pipeline 32 is inserted into the second cavity 31, and is inserted into the purification solvent when in use;
  • the second gas outlet 311 is arranged in the upper space 314 and is used to discharge the purified drying medium for recovery.
  • the organic solvent to be separated is soluble in the purification solvent, and the drying medium to be recovered is insoluble in the purification solvent.
  • the purification solvent is water, and isopropanol as an organic solvent is soluble in water, and carbon dioxide as a drying medium is insoluble in water. Therefore, in the present embodiment, by utilizing the purification solvent in the purification device 30 to further dissolve the isopropanol carried in the carbon dioxide, and filtering out other gases other than carbon dioxide through the drying medium filter membrane 33, further purification of carbon dioxide can be achieved, avoiding the problem of carrying other gases or isopropanol in carbon dioxide, and effectively improving the purity of carbon dioxide.
  • the dry medium filter membrane 33 in this embodiment is mainly used to filter out gases other than carbon dioxide;
  • the purification solvent in this embodiment can be water, or other solvents that can dissolve isopropanol, such as ethanol, ether, benzene, etc.
  • the second cavity 31 also includes a third gas outlet 313 and a second liquid outlet 312, the third gas outlet 313 is used to discharge the gas between the drying medium filter membrane 33 and the purification solvent, that is, the gas in the lower space 315, and the second liquid outlet 312 is used to discharge the liquid in the second cavity 31.
  • the drying medium recovery system 100 in this embodiment further includes a first pipeline 40, a second pipeline 50, a switch device 60, a detection device 70 and a controller 20.
  • the pipeline i.e., the third pipeline 400
  • the pipeline i.e., the third pipeline 400
  • the first pipeline 40 is connected to the separation device 10
  • the second pipeline 50 is connected to the purification device 30
  • the detection device 70 is used to detect the organic solvent concentration in the drying medium discharged from the drying device 300, for example, the detection device 70 can be arranged in the third pipeline 400 or on the drying device 300
  • the controller 20 is used to control the organic solvent concentration according to the organic solvent concentration detected by the detection device 70.
  • the switch device 60 is controlled to switch the first pipeline 40 and the second pipeline 50.
  • the controller 20 controls the switch device 60 to connect the first pipeline 40, so that the drying medium containing the organic solvent is recovered through the separation device 10 and the purification device 30 in sequence;
  • the controller 20 controls the switch device 60 to connect the first pipeline 50, so that the drying medium containing the organic solvent is directly recovered through the purification device 30.
  • FIG. 6 is only an example and is not intended to limit the arrangement of the switch device 60 between the third pipeline 400 of the drying medium containing the organic solvent discharged from the drying device 300 and the first pipeline 40 and the second pipeline 50.
  • two switch devices 60 are provided, and the third pipeline 400 is connected to the first pipeline 40 through one of the switch devices 60, and the third pipeline 400 is connected to the second pipeline 50 through the other switch device 60, so as to achieve precise control of the switch of each pipeline.
  • the switch device 60 may be a valve
  • the detection device 70 may be a sensor for detecting the concentration of a solution.
  • the supercritical dry medium recovery system 100 further includes a dehumidification device 80 , and the dehumidification device 80 is connected between the storage device 700 and the third gas outlet 313 .
  • the carbon dioxide purified by the purification device 30 is dried by the dehumidification device 80, thereby avoiding the influence of moisture on the purity of the carbon dioxide and improving the purity of the purified carbon dioxide.
  • particles may be generated during the separation or purification process in the semiconductor manufacturing process. For example, particles generated due to equipment aging and other reasons may contaminate the dry medium to be recycled, and ultimately affect the purity of the recycled dry medium, such as carbon dioxide.
  • the supercritical drying medium recovery system 100 further includes a filtering device 90 , and the filtering device 90 is connected between the storage device 700 and the dehumidification device 80 .
  • a filtering device 90 is provided to filter particulate pollutants mixed in the dry medium to be recovered, thereby reducing the influence of the particles on the purity of the recovered dry medium, such as carbon dioxide.
  • the filtering device 90 may be a filtering device 90 for filtering particles larger than 3 nm, or may be a filtering device 90 for filtering smaller particles according to a specific process.
  • the gas outlet, liquid outlet, gas inlet and liquid discharge port may be provided with a switch valve.
  • the dehumidification device 80 and the filtering device 90 may also be disposed at the outlet 123 of the condensation pipeline.
  • the purification device 40 in the above-mentioned fifth embodiment can also be combined with embodiments two to four.
  • the cooling device 124 can be configured in the fourth embodiment, other embodiments can also be configured as the cooling device 124 in the fourth embodiment.
  • FIG9 is a schematic diagram of the structure of semiconductor drying according to the embodiment of the present application.
  • the semiconductor drying device includes a drying medium recovery system 100, a storage device 700, a supercritical drying medium preparation device 200, and a drying device 300, which are sequentially connected and form a circulation loop.
  • the drying medium recovery system 100 can adopt the drying medium recovery system 100 in any of the above-mentioned embodiments 1 to 8.
  • the drying medium recovery system 100 stores the recovered drying medium in the storage device 700 through the sixth pipeline 800; the storage device 700 passes the stored drying medium into the supercritical drying medium preparation device 200 through the fourth pipeline 500 to prepare the supercritical drying medium; the supercritical drying medium preparation device 200 passes the supercritical drying medium into the drying device 300 through the fifth pipeline 600; the drying device 200 dries the wafers with the supercritical drying medium to dissolve the organic matter remaining on the wafers.
  • the organic solvent is removed to dry the wafer, and the drying medium containing the organic solvent is discharged to the drying medium recovery system 100 through the third pipeline 400; the drying medium recovery system 100 separates and recovers the drying medium containing the organic solvent, thereby realizing the recycling of the drying medium.
  • the drying medium transported from the storage device 700 is prepared into a supercritical drying medium by the supercritical drying medium preparation device 200, and then the prepared supercritical drying medium is transported to the drying device 300, so that the supercritical drying medium and the organic solvent on the surface of the wafer are fully miscible, and the wafer is dried.
  • the zero surface tension of the supercritical drying medium can effectively improve the adhesion and collapse of the high aspect ratio structure.
  • the drying medium containing the organic solvent is discharged from the drying device 300 and sent to the drying medium recovery system 100 to achieve the recovery of the drying medium, thereby reducing the pollution of the drying medium to the environment and improving the resource recovery and utilization of the drying medium.
  • FIG 10 is a structural block diagram of semiconductor drying according to an embodiment of the present application.
  • the supercritical dry medium preparation device 200 includes: a second cooling device 201, used to cool the dry medium discharged from the storage device 700 into a liquid state; a boosting device 202, used to boost the pressure of the liquid dry medium to a pressure exceeding the critical pressure of the dry medium; a heating device 203, used to heat the dry medium exceeding the critical pressure to a temperature exceeding the critical temperature of the dry medium to obtain a supercritical dry medium, and pass the supercritical dry medium into the drying device 300 through the fifth pipeline 600.
  • a second cooling device 201 used to cool the dry medium discharged from the storage device 700 into a liquid state
  • a boosting device 202 used to boost the pressure of the liquid dry medium to a pressure exceeding the critical pressure of the dry medium
  • a heating device 203 used to heat the dry medium exceeding the critical pressure to a temperature exceeding the critical temperature of the dry medium to obtain a supercritical dry medium, and pass the supercritical dry medium into the drying device
  • the preparation of supercritical drying medium is achieved through the above-mentioned device to ensure the recycling of supercritical drying medium.

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Abstract

本申请涉及一种超临界干燥介质回收系统和半导体晶圆干燥设备。该超临界干燥介质回收系统包括分离装置，分离装置包括冷凝管路和第一腔体，冷凝管路的下侧壁设置有排液口，排液口与第一腔体连通，冷凝管路的进口用于接收含有有机溶剂的干燥介质，冷凝管路的出口用于排放分离之后的干燥介质以便进行回收；其中，冷凝管路用于对含有有机溶剂的干燥介质中的有机溶剂进行冷凝，以使有机溶剂冷凝成液态从排液口流入至第一腔体。通过本申请解决了相关技术中如何回收干燥晶圆过程中的二氧化碳的问题，实现了干燥晶圆过程中的二氧化碳回收。

Description

干燥介质回收系统和半导体干燥设备 技术领域
本申请涉及半导体制造领域，特别是涉及干燥介质回收系统和半导体干燥设备。
背景技术
在集成电路的制造生产过程中，半导体器件的特征尺寸不断缩小，图形结构的深宽比也越来越大，从而对晶圆清洗技术的要求也越来越高。
在传统的晶圆清洗工艺中，通常需要用大量高纯水对晶圆进行冲洗，然后再用异丙醇(IPA)干燥晶圆。然而，随着晶圆上形成的图形结构的深宽比越来越大，传统的晶圆清洗工艺难以满足生产需求，主要是因为在采用IPA干燥晶圆时，气液界面的表面张力极容易导致高深宽比图形结构的粘连和塌陷。为了解决该问题，超临界二氧化碳干燥技术逐渐被应用到晶圆清洗工艺中。此干燥技术是采用表面张力为零的超临界二氧化碳对清洗完成的晶圆表面进行干燥，利用超临界二氧化碳的高溶解度、高扩散性和低粘度等特点，使处于超临界状态下的二氧化碳和异丙醇充分溶解，最后通过释放二氧化碳从而将晶圆表面的异丙醇带离晶圆表面，完成对晶圆图形结构无损伤的干燥。但是经研究发现，超临界二氧化碳干燥晶圆的过程中二氧化碳的使用量非常大。如果不对使用过的二氧化碳进行处理，直接排入大气，不仅造成环境污染，同时易造成二氧化碳的浪费。
发明内容
本申请实施例提供了一种超临界干燥介质回收系统和半导体干燥设备，以至少解决相关技术中如何回收干燥晶圆过程中的干燥介质(例如二氧化碳)的问题。
第一方面，本申请实施例提供了一种干燥介质回收系统，应用于半导体干燥设备，所述半导体干燥设备包括干燥装置，所述干燥装置用于通过超临界干燥介质对晶圆上的有机溶剂进行溶解；所述干燥介质回收系统用于对所述干燥装置排出的所 述含有有机溶剂的干燥介质中的干燥介质进行回收，所述干燥介质回收系统包括分离装置，所述分离装置包括冷凝管路和第一腔体，所述冷凝管路的下侧壁设置有排液口，所述排液口与所述第一腔体连通，所述冷凝管路的进口用于接收所述含有有机溶剂的干燥介质，所述冷凝管路的出口用于排放分离之后的干燥介质以便进行回收；其中，
所述冷凝管路用于对所述含有有机溶剂的干燥介质中的有机溶剂进行冷凝，以使有机溶剂冷凝成液态从所述排液口流入至所述第一腔体。
在其中的一些实施例中，所述冷凝管路为螺旋状。
在其中的一些实施例中，所述冷凝管路的进口和所述冷凝管路的出口位于竖直方向的不同高度。
在其中的一些实施例中，所述冷凝管路设置在所述第一腔体内，或者设置在所述第一腔体外。
在其中的一些实施例中，所述第一腔体的底部设置有第一出液口，所述第一出液口用于将所述第一腔体中的有机溶剂排出。
在其中的一些实施例中，所述第一腔体的侧壁设置有第一出气口，用于排放所述第一腔体内的干燥介质以便进行回收。
在其中的一些实施例中，所述干燥介质回收系统还包括第一冷却装置，所述第一冷却装置与所述冷凝管路连接，用于将所述冷凝管路的温度保持在预设温度范围。
在其中的一些实施例，所述第一冷却装置以螺旋状盘绕在所述冷凝管路上。
在其中的一些实施例中，所述干燥介质回收系统还包括提纯装置，所述提纯装置包括设置有第二出气口的第二腔体、进气管路和干燥介质过滤膜，其中，所述干燥介质过滤膜设置在所述第二腔体中，并将所述第二腔体分隔为上层空间和下层空间；所述第二腔体的下层空间用于容纳提纯溶剂；所述进气管路的进气端连通所述冷凝管路的出口，所述进气管路的出气端插入所述第二腔体中；所述第二出气口设置在所述上层空间并用于排放提纯之后的干燥介质以便进行回收。
在其中的一些实施例中，所述干燥介质回收系统还包括第一管路、第二管路、检测装置、开关装置和控制器，其中，所述干燥装置排出所述含有有机溶剂的干燥介质的管路通过所述开关装置分别与所述第一管路和第二管路连接；所述第一管路连接至所述分离装置；所述第二管路连接至所述提纯装置；其中，
所述检测装置用于检测所述干燥装置排出的所述含有有机溶剂的干燥介质中的有机溶剂浓度；所述控制器用于根据所述检测装置检测的所述有机溶剂浓度控制所述开关装置切换所述第一管路和所述第二管路；
当所述检测装置检测的所述有机溶剂浓度大于预设浓度的情况下，所述控制器控制所述开关装置接通所述第一管路；当所述检测装置检测的所述有机溶剂浓度小于所述预设浓度的情况下，所述控制器控制所述开关装置接通所述第二管路。
在其中的一些实施例中，所述干燥介质回收系统还包括除湿装置，所述除湿装置与所述冷凝管路的出口或第二出气口连接。
在其中的一些实施例中，所述干燥介质回收系统还包括过滤装置，所述过滤装置与所述除湿装置连接。
第二方面，本申请实施例中还提供了一种半导体干燥设备包括：如第一方面所述的干燥介质回收系统、存储装置、超临界干燥介质制备装置和干燥装置，所述干燥介质回收系统、所述存储装置、所述超临界干燥介质制备装置以及所述干燥装置依次连接且形成循环回路，其中，
所述存储装置，用于存储所述干燥介质回收系统中回收的干燥介质；
所述超临界干燥介质制备装置，用于将所述存储装置排放的干燥介质制备成超临界干燥介质；
所述干燥装置，配置为通过所述超临界干燥介质溶解晶圆表面的有机溶剂，以对晶圆进行干燥，并将含有有机溶剂的干燥介质排放至所述干燥介质回收系统，以对干燥介质进行回收。
在其中的一些实施例中，所述超临界干燥介质制备装置包括：
第二冷却装置，用于将所述存储装置排放的干燥介质冷却成液态；
增压装置，用于对液态的所述干燥介质增压至超过所述干燥介质的临界压力；
加热装置，用于对超过临界压力的干燥介质加热至超过干燥介质的临界温度，得到超临界干燥介质。
相比于相关技术，本申请实施例提供的干燥介质回收系统和半导体干燥设备，半导体干燥设备包括干燥装置，干燥装置用于通过超临界干燥介质对晶圆上的有机溶剂进行溶解；干燥介质回收系统用于对干燥装置排出的含有有机溶剂的干燥介质中的干燥介质进行回收。通过在干燥介质回收系统中设置分离装置，分离装置包括 冷凝管路和第一腔体，冷凝管路的下侧壁设置有排液口，排液口与第一腔体连通，冷凝管路的进口用于接收含有有机溶剂的干燥介质，冷凝管路的出口用于排放分离之后的干燥介质以便进行回收；其中，冷凝管路用于对含有有机溶剂的干燥介质中的有机溶剂进行冷凝，以使有机溶剂冷凝成液态从排液口流入至第一腔体的方式，解决了相关技术中如何回收干燥晶圆过程中的二氧化碳的问题，实现了干燥晶圆过程中的二氧化碳回收。
本申请的一个或多个实施例的细节在以下附图和描述中提出，以使本申请的其他特征、目的和优点更加简明易懂。
附图概述
本发明的特征、性能由以下的实施例及其附图进一步描述。
图1是根据本申请提供的干燥介质回收系统的第一实施例的结构示意图；
图2是根据本申请提供的干燥介质回收系统的第二实施例的结构示意图；
图3是根据本申请提供的干燥介质回收系统的第三实施例的结构示意图；
图4是根据本申请提供的干燥介质回收系统的第四实施例的结构示意图；
图5是根据本申请提供的干燥介质回收系统的第五实施例的结构示意图；
图6是根据本申请提供的干燥介质回收系统的第六实施例的结构示意图；
图7是根据本申请提供的干燥介质回收系统的第七实施例的结构示意图；
图8是根据本申请提供的干燥介质回收系统的第八实施例的结构示意图；
图9是根据本申请实施例的半导体干燥设备的结构示意图；
图10是根据本申请实施例的半导体干燥设备的结构框图。
附图标记：10、分离装置；11、第一腔体；111、第一出液口；112、第一出气口；12、冷凝管路；121、排液口；122、冷凝管路的进口；123、冷凝管路的出口；124、第一冷却装置；30、提纯装置；31、第二腔体；311、第二出气口；312第二出液口；313、第三出气口；314、上层空间；315、下层空间；32、进气管路；33、干燥介质过滤膜；20、控制器；40、第一管路；50、第二管路；60、开关装置；70、检测装置；80、除湿装置；90、过滤装置；100、干燥介质回收系统；200、超临界干燥介质制备装置；201、第二冷却装置；202、增压装置；203、加热装置；300、干燥装置；400、第三管路；500、第四管路；600、第五管路；700、存储装置；800、 第六管路。
本发明的较佳实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行描述和说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。基于本申请提供的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，还可以理解的是，虽然这种开发过程中所作出的努力可能是复杂并且冗长的，然而对于与本申请公开的内容相关的本领域的普通技术人员而言，在本申请揭露的技术内容的基础上进行的一些设计，制造或者生产等变更只是常规的技术手段，不应当理解为本申请公开的内容不充分。
除非另作定义，本申请所涉及的技术术语或者科学术语应当为本申请所属技术领域内具有一般技能的人士所理解的通常意义。本申请所涉及的“一”、“一个”、“一种”、“该”等类似词语并不表示数量限制，可表示单数或复数。本申请所涉及的术语“包括”、“包含”、“具有”以及它们任何变形，意图在于覆盖不排他的包含；例如包含了一系列步骤或模块(单元)的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可以还包括没有列出的步骤或单元，或可以还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。本申请所涉及的“连接”、“相连”、“耦接”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电气的连接，不管是直接的还是间接的。本申请所涉及的“多个”是指大于或者等于两个。“和/或”描述关联对象的关联关系，表示可以存在三种关系，例如，“A和/或B”可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。本申请所涉及的术语“第一”、“第二”、“第三”等仅仅是区别类似的对象，不代表针对对象的特定排序。
第一实施例：
请参见图1，本实施例提出了一种干燥介质回收系统100，应用于半导体干燥设备。
为便于理解，首先结合图9对包含干燥介质回收系统100的半导体干燥设 备进行简要说明。如图9所示，半导体干燥设备包括依次连接且构成循环回路的干燥介质回收系统100、存储装置700、超临界干燥介质制备装置200以及干燥装置300，其中，干燥介质回收系统100通过第六管路800将回收的干燥介质存储至存储装置700中；存储装置700通过第四管路500将存储的干燥介质通入至超临界干燥介质制备装置200中制备成超临界干燥介质；超临界干燥介质制备装置200通过第五管路600将超临界干燥介质通入至干燥装置300中，来溶解残留在晶圆上的有机溶剂以干燥晶圆；干燥装置200将含有有机溶剂的干燥介质通过第三管路400排放至干燥介质回收系统100中，从而实现干燥介质的循环使用。
在本实施例中，由干燥装置300排放出来的含有有机溶剂的干燥介质的中的干燥介质基本上为气态，因为在第三管路400上一般情况下会设置有减压阀，通过减压阀来进行减压以使得干燥介质绝大部分变为气态。
接下来，结合图1和图10对本实施例提供的干燥介质回收系统100进行详细介绍。
图1是根据本申请实施例的干燥介质回收系统100的结构示意图。如图1所示，该干燥介质回收系统100包括分离装置10。分离装置10包括冷凝管路12和第一腔体11，冷凝管路12用于接收含有有机溶剂的干燥介质，并对有机溶剂进行冷却液化，且冷凝管路12的下侧壁设置有排液口121，排液口121与第一腔体11连通，以使液化后的有机溶剂排放至第一腔体11中。
具体地，冷凝管路的进口122用于接收含有有机溶剂的干燥介质。结合图1和图9，冷凝管路的进口122可以通过第三管路400与干燥装置300相连，从而接收由干燥装置300排放的含有有机溶剂的干燥介质。冷凝管路的出口123用于排放分离之后的干燥介质以便进行回收。结合图1和图9，冷凝管路的出口123可以通过第六管路800与存储装置700相连，从而将分离之后的干燥介质进行回收和存储，实现干燥介质重复利用。
第三管路400排放至干燥介质回收系统100中的是含有有机溶剂和干燥介质的混合物，例如异丙醇和二氧化碳的混合物。因此本实施例通过分离装置10中的冷凝管路12对含有有机溶剂的干燥介质进行冷却的方式，可以使有机溶剂液化与干燥介质分离，并从排液口121流入第一腔体11内，以及使干燥介 质经过冷凝管路的出口123排放进行回收和/或存储，实现了有机溶剂和干燥介质的分离，解决了相关技术中如何回收干燥晶圆过程中的干燥介质(例如二氧化碳)的问题，实现了干燥晶圆过程中的二氧化碳回收，减少了二氧化碳对环境的污染和二氧化碳资源的浪费。
继续参照图1，在本实施例中，冷凝管路12设置在第一腔体11内部，可以减少分离装置10的体积。
继续参照图1，在本示例中，冷凝管路的进口122设置在下方，冷凝管路的出口123设置在上方。
在其他示例中，冷凝管路的进口122设置在上方，冷凝管路的出口123设置在下方。
在上述实施例中，通过将冷凝管路的进口122和出口123设置在不同高度的方式，可以提高含有异丙醇的二氧化碳在冷凝管路12的流通性，从而提高对异丙醇的冷凝效率。
继续参照图1，第一腔体11的底部设置有第一出液口111，第一出液口111用于把第一腔体11中的有机溶剂排出。在本实施例中，通过在第一腔体11上设置第一出液口111的方式，可以避免第一腔体11内部异丙醇积累过多堵住排液口121，而对异丙醇和二氧化碳的分离造成不利影响。
继续参照图1所示，冷凝管路12可以为螺旋状。在本实施例中，通过将冷凝管路12设置为螺旋状的方式，可以实现冷凝管路12在小体积优势下，提高异丙醇的接触面积，进而提高对异丙醇的冷凝效率。
在一些实施例中，干燥介质回收系统100还包括液体回收装置(未图示)，该液体回收装置与第一出液口111相连，以实现对冷凝管路12中排放至第一腔体11中的异丙醇进行收集。
需要说明的是，本实施例中的有机溶剂可以是异丙醇、丙酮、二甲苯等等，干燥介质也可以是但不限于二氧化碳、乙烯、乙烷、丙烷、三氯甲烷，本申请实施例中不做具体限定。
为了便于说明，在本申请的下述实施例中，以有机溶剂为异丙醇、干燥介质为二氧化碳，进行示例性说明，即下文具体示例中干燥介质回收系统100接收的含有机溶剂的干燥介质为含异丙醇的二氧化碳。
第二实施例：
如图2所示，相对第一实施例，本实施例中的区别在于将冷凝管路12设置在第一腔体11的外侧的方式，通过该方式的设置，可以减少第一腔体11的体积。
为了便于说明，在本申请的下述实施例中，以第二实施例中的冷凝管路12设在第一腔体11的内侧为例，进行示例性说明。
第三实施例：
如图3所示，在第一实施例的基础上，在本实施例中，干燥介质回收系统100还可以包括第一冷却装置124，第一冷却装置124套设在冷凝管路12外侧，用于将冷凝管路12的温度冷却在预设温度范围。
在本实施例中，将第一冷却装置124套设在冷凝管路12外侧，通过热传递以实现将冷凝管路12的温度冷却在预设温度范围的方式，可以增强冷凝管路12的冷凝能力，提高异丙醇的液化效率，从而提高二氧化碳和异丙醇分离的效果。
在一具体示例中，第一冷却装置124可以以螺旋状盘绕在冷凝管路12上。
第四实施例：
如图4所示，在第一实施例的基础上，在本实施例中，第一腔体11的侧壁还设置有第一出气口112，用于排放第一腔体11内的干燥介质以便进行回收。如图4所示，第一出气口112与冷凝管路的出口123排放的干燥介质可以通过管路汇集于第六管路800上，以便对干燥介质进行排放和回收。
在本实施例中，通过在第一腔体11的侧壁设置第一出气口112的方式，可以避免异丙醇与二氧化碳在冷凝管路12中进行分离时，存在部分二氧化碳从排液口121排放到第一腔体11，而导致第一腔体11中二氧化碳存储过多使得内部气压增大，致使经冷凝管路12液化的异丙醇无法从排液口121流到第一腔体12的问题，从而有利于提高异丙醇和二氧化碳的分离效果。
第五实施例：
为了避免二氧化碳分离过程中可能会携带异丙醇的问题，本申请实施例中还可以通过以下方式来解决上述问题。
如图5所示，在第四实施例的基础上，在本实施例中，干燥介质回收系统 100还可以包括提纯装置30。具体地，提纯装置30包括设置有第二出气口311的第二腔体31、进气管路32和干燥介质过滤膜33。干燥介质过滤膜33设置在第二腔体31中，并将第二腔体31分隔为上层空间314和下层空间315，第二腔体31的下层空间315用于容纳提纯溶剂；进气管路32的进气端连通冷凝管路的出口123，进气管路32的出气端插入第二腔体31中，并且在使用时插入提纯溶剂中；第二出气口311设置在上层空间314并用于排放提纯之后的干燥介质以便进行回收。
众所周知，待分离的有机溶剂可溶于提纯溶剂，待回收的干燥介质不溶于提纯溶剂。在本实施例中，提纯溶剂为水，作为有机溶剂的异丙醇可溶于水，作为干燥介质的二氧化碳不溶于水。因此，在本实施例中，通过利用提纯装置30中的提纯溶剂来进一步溶解二氧化碳中携带的异丙醇，以及通过干燥介质过滤膜33来过滤掉除二氧化碳以外的其他气体的方式，可以实现对二氧化碳的进一步提纯，避免二氧化碳中携带其他气体或异丙醇的问题，有效提高二氧化碳的纯度。
需要说明的是，本实施例中的干燥介质过滤膜33主要是用来过滤掉除二氧化碳以外的其他气体；本实施例中提纯溶剂可以是水，也可以是能够溶解异丙醇的其他溶剂，例如乙醇、乙醚、苯等。
继续参照图5，在一些实施例中，第二腔体31还包括第三出气口313和第二出液口312，第三出气口313用于将干燥介质过滤膜33与提纯溶剂之间的气体，即下层空间315中的气体排出，第二出液口312用于将第二腔体31中的液体排出。
第六实施例：
如图6所示，在第五实施例的基础上，本实施例中的干燥介质回收系统100还包括第一管路40、第二管路50、开关装置60、检测装置70以及控制器20。干燥装置300排出的含有有机溶剂的干燥介质的管路(即第三管路400)通过开关装置60与第一管路40和第二管路50连接；第一管路40连接至分离装置10；第二管路50连接至提纯装置30；检测装置70用于检测干燥装置300排放的干燥介质中的有机溶剂浓度，例如，检测装置70可以设置在第三管路400或者在干燥装置300上；控制器20用于根据检测装置70检测的有机溶剂浓度控 制开关装置60切换第一管路40和第二管路50，当检测装置70检测的有机溶剂浓度大于预设浓度的情况下，控制器20控制开关装置60接通第一管路40，以使含有有机溶剂的干燥介质依次通过分离装置10和提纯装置30进行回收；当检测装置70检测的有机溶剂浓度小于预设浓度的情况下，控制器20控制开关装置60接通第一管路50，以使含有有机溶剂的干燥介质直接通过提纯装置30进行回收。
在本实施例中，通过设置第一管路40来接收大于预设浓度的含有有机溶剂的干燥介质并依次输送至分离装置10和提纯装置30来进行二氧化碳的回收，以及设置第二管路40来接收小于预设浓度的含有有机溶剂的干燥介质并输送至提纯装置30来进行二氧化碳的回收的方式，实现了对含有不同浓度的异丙醇的二氧化碳的处理，节省了对二氧化碳回收时间，提高了二氧化碳回收的效率。
需要说明的是，图6仅为示例，不用于限制干燥装置300排出的含有有机溶剂的干燥介质的第三管路400与第一管路40和第二管路50之间开关装置60的设置形式。例如，在一些实施例中，开关装置60设置有两个，第三管路400通过其中一个开关装置60与第一管路40相连，第三管路400通过其中另一个开关装置60与第二管路50相连，以实现对每个管路开关的精准控制。
示例性的，开关装置60可以是阀门，检测装置70可以是一种用于检测溶液浓度的传感器。
第七实施例：
如图7所示，在第六实施例的基础上，在本实施例中，超临界干燥介质回收系统100还包括除湿装置80，除湿装置80连接在存储装置700和第三出气口313之间。
在本实施例中，通过除湿装置80对经提纯装置30提纯后的二氧化碳进行干燥，避免了水分对二氧化碳的纯度的影响，提高了二氧化碳的提纯纯度。
第八实施例：
在相关技术中，在半导体制备工艺中的分离或提纯过程中均有可能产生颗粒，例如，因设备老化等原因产生的颗粒，这些颗粒可能会对待回收的干燥介质造成污染，最终影响回收后的干燥介质例如二氧化碳的纯度。
为解决上述问题，如图8所示，在第七实施例的基础上，在本实施例中，超临界干燥介质回收系统100还包括过滤装置90，过滤装置90连接在存储装置700和除湿装置80之间。
在本实施例中，通过设置过滤装置90来过滤待回收干燥介质中掺杂的颗粒污染物，降低颗粒对回收后的干燥介质例如二氧化碳的纯度的影响。
需要说明的是，该过滤装置90可以是过滤3nm以上的颗粒的过滤装置90，也可以是根据具体的工艺选择过滤更小颗粒的过滤装置90。
进一步的，在上述干燥介质回收系统100的任意实施例中的出气口、出液口、进气口以及排液口处均可以设置有开关阀门。
需要说明的是，在如实施例一至实施例四所述的干燥介质回收系统100中，上述除湿装置80和过滤装置90还可以配置在冷凝管路的出口123。
需要说明的是，上述第一实施例至第八实施例，本领域的技术人员应该明白，以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。例如，上述第五实施例中的提纯装置40也可以与实施例二至实施例四进行结合。再例如，除第四实施例中可以配置有冷却装置124以外，其他实施例也可以配置如第四实施例中的冷却装置124。
第九实施例：
本申请实施例还提供了一种半导体干燥设备，图9是根据本申请实施例的半导体干燥的结构示意图，如图9所示，该半导体干燥设备包括依次连接且构成循环回路的干燥介质回收系统100、存储装置700、超临界干燥介质制备装置200以及干燥装置300。其中，干燥介质回收系统100可以采用上述实施例一至八中任一实施例中的干燥介质回收系统100。
继续参考图9，干燥介质回收系统100通过第六管路800将回收的干燥介质存储至存储装置700中；存储装置700通过第四管路500将存储的干燥介质通入至超临界干燥介质制备装置200中制备成超临界干燥介质；超临界干燥介质制备装置200通过第五管路600将超临界干燥介质通入至干燥装置300中；干燥装置200通过超临界干燥介质对晶圆进行干燥，以溶解残留在晶圆上的有 机溶剂以干燥晶圆，并将含有有机溶剂的干燥介质通过第三管路400排放至干燥介质回收系统100中；干燥介质回收100对含有有机溶剂的干燥介质进行分离和回收，从而实现干燥介质的循环使用。
在本实施例中，通过超临界干燥介质制备装置200将存储装置700中输送出来的干燥介质制备成超临界干燥介质，再将制备成的超临界干燥介质输送到干燥装置300中，以使得超临界干燥介质和与晶圆表面的有机溶剂充分互溶，实现对晶圆的干燥，利用超临界干燥介质的表面张力为零的性质，可以有效的改善高深宽比结构的粘连和塌陷的问题。并且在本实施例中还通过干燥装置300排放含有有机溶剂的干燥介质送入干燥介质回收系统100中，以实现对干燥介质的回收，减少了干燥介质对环境的污染，提高了干燥介质的资源回收利用。
第十实施例：
图10是根据本申请实施例的半导体干燥的结构框图，如图10所示，在第九实施例的基础上，在本实施例中，超临界干燥介质制备装置200包括：第二冷却装置201，用于将存储装置700排放的干燥介质冷却成液态；增压装置202，用于对液态的干燥介质增压至超过干燥介质的临界压力；加热装置203，用于对超过临界压力的干燥介质加热至超过干燥介质的临界温度，得到超临界干燥介质，并通过第五管路600将超临界干燥介质通入至干燥装置300中。
在本实施例中，通过上述装置，实现了超临界干燥介质的制备，以保证超临界干燥介质的循环利用。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (14)

  1. 一种干燥介质回收系统，应用于半导体干燥设备，所述半导体干燥设备包括干燥装置，所述干燥装置用于通过超临界干燥介质对晶圆上的有机溶剂进行溶解；所述干燥介质回收系统用于对所述干燥装置排出的含有所述有机溶剂的干燥介质中的干燥介质进行回收，其特征在于，所述干燥介质回收系统包括分离装置，所述分离装置包括冷凝管路和第一腔体，所述冷凝管路的下侧壁设置有排液口，所述排液口与所述第一腔体连通，所述冷凝管路的进口用于接收所述含有有机溶剂的干燥介质，所述冷凝管路的出口用于排放分离之后的干燥介质以便进行回收；其中，
    所述冷凝管路用于对所述含有有机溶剂的干燥介质中的有机溶剂进行冷凝，以使有机溶剂冷凝成液态从所述排液口流入至所述第一腔体。
  2. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述冷凝管路为螺旋状。
  3. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述冷凝管路的进口和所述冷凝管路的出口位于竖直方向的不同高度。
  4. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述冷凝管路设置在所述第一腔体内，或者设置在所述第一腔体外。
  5. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述第一腔体的底部设置有第一出液口，所述第一出液口用于将所述第一腔体中的有机溶剂排出。
  6. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述第一腔体的侧壁设置有第一出气口，用于排放所述第一腔体内的干燥介质以便进行回收。
  7. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述分离装置还包括第一冷却装置，所述第一冷却装置与所述冷凝管路连接，用于将所述冷凝管路的温度保持在预设温度范围。
  8. 根据权利要求7所述的干燥介质回收系统，其特征在于，所述第一冷却装置以螺旋状盘绕在所述冷凝管路上。
  9. 根据权利要求1所述的干燥介质回收系统，其特征在于，所述干燥介质回收系统还包括提纯装置，所述提纯装置包括设置有第二出气口的第二腔体、进气管路和干燥介质过滤膜，其中，所述干燥介质过滤膜设置在所述第二腔体中，并将所 述第二腔体分隔为上层空间和下层空间；所述第二腔体的下层空间用于容纳提纯溶剂；所述进气管路的进气端连通所述冷凝管路的出口，所述进气管路的出气端插入所述第二腔体中；所述第二出气口设置在所述上层空间并用于排放提纯之后的干燥介质以便进行回收。
  10. 根据权利要求9所述的干燥介质回收系统，其特征在于，所述干燥介质回收系统还包括第一管路、第二管路、检测装置、开关装置和控制器，其中，所述干燥装置排出所述含有有机溶剂的干燥介质的管路通过所述开关装置分别与所述第一管路和第二管路连接；所述第一管路连接至所述分离装置；所述第二管路连接至所述提纯装置；其中，
    所述检测装置用于检测所述干燥装置排出的所述含有有机溶剂的干燥介质中的有机溶剂浓度；所述控制器用于根据所述检测装置检测的所述有机溶剂浓度控制所述开关装置切换所述第一管路和所述第二管路；
    当所述检测装置检测的所述有机溶剂浓度大于预设浓度的情况下，所述控制器控制所述开关装置接通所述第一管路；当所述检测装置检测的所述有机溶剂浓度小于所述预设浓度的情况下，所述控制器控制所述开关装置接通所述第二管路。
  11. 根据权利要求1或9所述的干燥介质回收系统，其特征在于，所述干燥介质回收系统还包括除湿装置，所述除湿装置与所述冷凝管路的出口或第二出气口连接。
  12. 根据权利要求11所述的干燥介质回收系统，其特征在于，所述干燥介质回收系统还包括过滤装置，所述过滤装置与所述除湿装置连接。
  13. 一种半导体干燥设备，其特征在于，所述半导体干燥设备包括：如权利要求1至12中任一项所述的干燥介质回收系统、存储装置、超临界干燥介质制备装置和干燥装置，所述干燥介质回收系统、所述存储装置、所述超临界干燥介质制备装置以及所述干燥装置依次连接且形成循环回路，其中，
    所述存储装置，用于存储所述干燥介质回收系统中回收的干燥介质；
    所述超临界干燥介质制备装置，用于将所述存储装置排放的干燥介质制备成超临界干燥介质；
    所述干燥装置，配置为通过所述超临界干燥介质溶解晶圆表面的有机溶剂，以对晶圆进行干燥，并将含有有机溶剂的干燥介质排放至所述干燥介质回收系统，以 对干燥介质进行回收。
  14. 根据权利要求13的所述半导体干燥设备，其特征在于，所述超临界干燥介质制备装置包括：
    第二冷却装置，用于将所述存储装置排放的干燥介质冷却成液态；
    增压装置，用于对液态的所述干燥介质增压至超过所述干燥介质的临界压力；
    加热装置，用于对超过临界压力的干燥介质加热至超过干燥介质的临界温度，得到超临界干燥介质。
PCT/CN2024/091288 2023-06-16 2024-05-06 干燥介质回收系统和半导体干燥设备 Ceased WO2024255481A1 (zh)

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