WO2024255155A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2024255155A1
WO2024255155A1 PCT/CN2023/136863 CN2023136863W WO2024255155A1 WO 2024255155 A1 WO2024255155 A1 WO 2024255155A1 CN 2023136863 W CN2023136863 W CN 2023136863W WO 2024255155 A1 WO2024255155 A1 WO 2024255155A1
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WO
WIPO (PCT)
Prior art keywords
light
layer
substrate
electrode
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/136863
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English (en)
French (fr)
Inventor
王守坤
张治超
延妮
张秀玉
潘新叶
李俊峰
邢汝博
刘翔
陈曼丽
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Publication of WO2024255155A1 publication Critical patent/WO2024255155A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes

Definitions

  • the present application relates to a display panel and a display device, and belongs to the field of display technology.
  • UDC Under Display Camera
  • transparent screens and stretch screens have emerged on the basis of conventional display solutions.
  • UDC, transparent screens, stretch screens and other related technologies all require the display screen to have high light transmittance, so how to improve the light transmittance of the screen has become an urgent problem to be solved.
  • the present application provides a display panel and a display device to solve the problem of how to improve the light transmittance of a screen.
  • an embodiment of the present application provides a display panel, which is divided into a light-emitting area and a light-transmitting area, wherein the light-emitting area and the light-transmitting area are adjacently arranged.
  • the display panel comprises:
  • a protective structure disposed on the substrate and between the light-emitting area and the light-transmitting area;
  • a light-emitting layer located on the same side of the substrate as the protection structure, the light-emitting layer comprising a light-emitting unit, and the light-emitting unit is arranged in the light-emitting area;
  • the first electrode layer is located at a side of the light-emitting layer away from the substrate, and the first electrode layer includes a first electrode, which is arranged in the light-emitting area.
  • the embodiment of the present application further provides another display panel, which includes:
  • a protective structure disposed on one side of the substrate, the protective structure encloses a protective opening
  • a light-emitting layer located on the same side of the substrate as the protection structure, the light-emitting layer comprising a light-emitting unit;
  • the first electrode layer is arranged on the side of the light-emitting layer away from the substrate.
  • the first electrode layer is provided with a first electrode opening.
  • the orthographic projection of the first electrode opening on the substrate is located within the orthographic projection range of the protective opening on the substrate and is staggered with the orthographic projection of the light-emitting unit on the substrate.
  • an embodiment of the present application further provides a display device, characterized in that it includes a display panel as described in any one of the first aspect or the second aspect;
  • the display device further includes a photosensitive element, and the photosensitive element is located on a side of the substrate away from the light-emitting layer.
  • the display panel includes a substrate and a protective structure, a light-emitting layer and a first electrode layer arranged on one side of the substrate, the protective structure encloses to form a protective opening, the first electrode layer is provided with a first electrode opening, and the orthographic projection of the first electrode opening on the substrate is located within the orthographic projection range of the protective opening on the substrate.
  • the protective opening is formed by setting the protective structure to enclose, and the first electrode opening corresponding to the position of the protective opening is set on the first electrode layer, that is, the first electrode layer is imaged so that it is not a continuous film layer on the entire surface. Based on this, in the area corresponding to the first electrode opening, there is no longer any shielding of the first electrode layer, so the light transmittance of the area can be effectively improved, and the requirements of technologies such as UDC, transparent screen and stretched screen can be better met.
  • FIG. 1 is a schematic diagram of a top view of the structure of a display panel provided in one embodiment of the present application.
  • FIG. 2 is a schematic diagram of a cross-sectional structure of a display panel provided in one embodiment of the present application.
  • FIG. 3 is a schematic diagram of a top view of the structure of a display panel provided in another embodiment of the present application.
  • FIG. 4 is a schematic diagram of a top view of the structure of a display panel provided in another embodiment of the present application.
  • FIG5 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment of the present application.
  • FIG. 9 is a schematic diagram of a cross-sectional structure of a protection structure provided by multiple embodiments of the present application along the thickness direction of the display panel.
  • FIG. 10 is a schematic diagram of the cross-sectional structure of a display panel during the preparation process in one embodiment of the present application.
  • FIG. 11 is a schematic diagram of a top view of the structure of a display panel provided in another embodiment of the present application.
  • FIG. 12 is a schematic diagram of a top view of the structure of a display panel provided in another embodiment of the present application.
  • FIG. 13 is a schematic diagram of a cross-sectional structure of a display panel provided in another embodiment of the present application.
  • FIG. 14 is a schematic diagram of the structure of a display device provided in one embodiment of the present application.
  • UDC technology is about to hide the camera under the screen, thereby eliminating the "bangs" area or punch-hole area corresponding to the front camera, and realizing a true full screen.
  • Transparent screen is also called transparent display screen, which is a new display technology that allows the display screen to remain transparent while displaying images. This technology can display images and text without affecting the background landscape.
  • Stretch screen means that the screen can be stretched and deformed as needed to achieve display effects of different sizes and proportions.
  • the present application provides a solution for graphically designing the light-emitting electrode layer, that is, by adjusting the structure of the light-emitting electrode layer so that it is not a whole continuous film layer, thereby reducing the blocking of light and improving the light transmittance of the display panel.
  • the specific implementation scheme is described in a non-limiting manner through several examples or embodiments.
  • FIG. 1 is a schematic diagram of a top view of a display panel provided in an embodiment of the present application
  • FIG. 2 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application, wherein the cross-sectional position corresponds to the cross-sectional line AA′ in FIG. 1 .
  • FIG. 1 and FIG. 2 are schematic diagrams of a cross-sectional structure of a display panel provided in an embodiment of the present application, wherein the cross-sectional position corresponds to the cross-sectional line AA′ in FIG. 1 .
  • the display panel of the present embodiment is divided into a light-emitting area AA1 and a light-transmitting area AA2, and the light-emitting area AA1 and the light-transmitting area AA2 are arranged adjacent to each other;
  • the display panel includes: a substrate 10, a light-emitting layer 12, a first electrode layer 11, a second electrode layer 13 and a protective structure 14.
  • the substrate 10 mainly plays the role of support and bearing, and can be made of flexible materials such as stainless steel (Stainless Use Steel, referred to as SUS) or flexible polyimide (Polyimide, PI), or rigid materials such as glass or silicon.
  • SUS Stainless Use Steel
  • PI flexible polyimide
  • rigid materials such as glass or silicon.
  • the light-emitting layer 12 includes a plurality of light-emitting units 12a, and the light-emitting units 12a are arranged in the light-emitting area AA1.
  • the first electrode layer 11 is located on the side of the light-emitting layer 12 away from the substrate 10, and the first electrode layer 11 includes a plurality of first electrodes 11a, and the first electrodes 11a are also arranged in the light-emitting area AA1.
  • the second electrode layer 13 is located on the side of the light-emitting layer 12 close to the substrate 10, and the second electrode layer 13 includes a plurality of second electrodes 13a, and the second electrodes 13a are also arranged in the light-emitting area AA1.
  • each light-emitting unit 12a may include a material having electroluminescence (EL) properties (hereinafter referred to as light-emitting material), and each light-emitting unit 12a and the first electrode layer 11 and the second electrode layer 13 on both sides thereof may constitute a basic light-emitting structure.
  • EL electroluminescence
  • the light-emitting unit 12a may be stimulated to emit light.
  • different voltages may be applied to the plurality of light-emitting units 12a through the first electrode layer 11 and the second electrode layer 13, respectively, so that the light-emitting brightness and color of different light-emitting units 12a are different.
  • the display panel can display a specific picture.
  • the first electrode layer 11 can be a cathode layer for providing a negative power signal to the light-emitting layer 12
  • the second electrode layer 13 can be an anode layer for providing a positive power signal to the light-emitting layer 12.
  • the display panel of the present embodiment is further provided with a protective structure 14, which is located on the same side of the substrate 10 as the light-emitting layer 12, and is used to separate the light-emitting area AA1 and the light-transmitting area AA2.
  • the light-emitting area AA1 is also the area in the display panel that can emit light and display, and the area is provided with a light-emitting structure composed of film layers such as the first electrode layer 11, the light-emitting layer 12 and the second electrode layer 13.
  • the light-transmitting area AA2 is also the area in the display panel that can facilitate better transmission of light, that is, the light-transmitting area AA2 has a higher light transmittance than the light-emitting area AA1.
  • the display panel in this embodiment can be used in scenarios such as UDC so that photosensitive elements such as cameras can more easily obtain more light, or can be used in scenarios such as transparent screens so that more light can pass through the display panel to improve the transparency effect.
  • the principle of separating the light-emitting area AA1 and the light-transmitting area AA2 based on the protective structure 14 is as follows: first, a plurality of second electrodes 13a spaced apart from each other are prepared on the substrate 10 according to a conventional process; then, a protective structure 14 is prepared in the spaced area between at least a portion of the second electrodes 13a, and the side of the protective structure 14 where the second electrode 13a is located is used as the light-emitting area AA1, and the other side is used as the light-transmitting area AA2; then, the light-emitting unit 12a is evaporated on the side of each second electrode 13a away from the substrate 10, and the material of the first electrode layer 11 is evaporated on the entire surface of the side of the light-emitting unit 12a away from the second electrode 13a, and a part of the evaporated material will adhere to the side of the protective structure 14 away from the substrate 10 (the upper side in FIG.
  • the protective structure 14 can make the film layers of the light-emitting area AA1 and the light-transmitting area AA2 different, and the film layers of the light-transmitting area AA2 are relatively less, so it has a higher light transmittance.
  • the first electrode layer 11 can be graphically designed so that the light-transmitting area AA2 of the display panel does not have the material of the first electrode layer 11, that is, the first electrode layer 11 is not a continuous film layer on the entire surface, thereby making the light-transmitting area AA2 of the display panel have a higher light transmittance.
  • the light-emitting structure may include other auxiliary light-emitting film layers in addition to the second electrode 13a, the light-emitting unit 12a and the first electrode 11a, such as a hole injection layer, a hole transport layer and an electron blocking layer arranged between the second electrode 13a and the light-emitting unit 12a, and an electron injection layer, an electron transport layer and a hole blocking layer arranged between the first electrode 11a and the light-emitting unit 12a.
  • auxiliary light-emitting film layers in addition to the second electrode 13a, the light-emitting unit 12a and the first electrode 11a, such as a hole injection layer, a hole transport layer and an electron blocking layer arranged between the second electrode 13a and the light-emitting unit 12a, and an electron injection layer, an electron transport layer and a hole blocking layer arranged between the first electrode 11a and the light-emitting unit 12a.
  • the light-emitting structure may also be a stacked light-emitting structure, that is, it may include a plurality of light-emitting units 12a and a charge generation layer arranged between adjacent light-emitting units 12a. Since the solutions of the subsequent embodiments of the present application do not involve improvements to the above-mentioned film layers, these film layers will no longer be illustrated and described when the implementation scheme of the present application is described in conjunction with the accompanying drawings.
  • the distance from the first side of the protective structure 14 to the substrate 10 is greater than or equal to the distance from the first side of the edge of the first electrode 11a to the substrate 10.
  • the first side of the protective structure 14 refers to the side (surface) of the protective structure 14 away from the substrate 10
  • the edge of the first electrode 11a refers to the portion of the first electrode 11a adjacent to the protective structure 14
  • the first side of the first electrode 11a refers to the side (surface) of the first electrode 11a away from the substrate 10.
  • the "height" of the protective structure 14 must be greater than or equal to the "height" of the edge of the first electrode 11a, so that the first electrode layer 11 can form a break at the protective structure 14.
  • the protective structure 14 can be arranged around the light-emitting area AA1. That is, the area surrounded by the protective structure 14 is the light-emitting area AA1, and the area outside the area surrounded by the protective structure 14 is the light-transmitting area AA2. This arrangement can make the area of the light-transmitting area AA2 larger.
  • only one light-emitting unit 12a is provided in the light-emitting area AA1.
  • One dotted box in FIG1 corresponds to one light-emitting unit 12a. That is, only one light-emitting unit 12a is provided in one light-emitting area AA1 surrounded by each protective structure 14, and different light-emitting units 12a are located in light-emitting areas AA1 surrounded by different protective structures 14. In this way, the total area of the light-transmitting area AA2 can be increased, and the light-transmitting effect can be improved.
  • FIG. 3 is a schematic diagram of the top view structure of the display panel provided in another embodiment of the present application, wherein the schematic diagram of the cross-sectional structure in FIG. 2 may correspond to the cross-sectional line AA′ in FIG. 3.
  • the light-emitting area AA1 is provided with at least two light-emitting units 12a (FIG. 3 shows the case of two light-emitting units 12a).
  • a dotted box in FIG. 3 corresponds to a light-emitting unit 12a. That is, in a light-emitting area AA1 surrounded by each protective structure 14, two or more light-emitting units 12a are correspondingly provided. With such a configuration, the number of protective structures 14 can be reduced, and the difficulty and complexity of the process can be reduced.
  • FIG. 4 is a schematic diagram of the top view structure of a display panel provided in another embodiment of the present application, wherein the schematic diagram of the cross-sectional structure in FIG. 2 may correspond to the cross-sectional line BB′ in FIG. 4 .
  • the protective structure 14 may be arranged around the light-transmitting area AA2. That is, the area surrounded by the protective structure 14 is the light-transmitting area AA2, and the area outside the area surrounded by the protective structure 14 is the light-emitting area AA1.
  • the coverage area of the first electrode layer 11 can be correspondingly larger, so the impedance of the first electrode layer 11 is lower.
  • the first electrode layer 11 further includes a first electrode opening Q, and the first electrode opening Q is located in the light-transmitting area AA2. That is, by removing the material of the first electrode layer 11 in the area corresponding to the area surrounded by the protective structure 14, one or more first electrode openings Q penetrating the first electrode layer 11 can be formed on the first electrode layer 11, and the number and shape of the first electrode openings Q are related to the number and shape of each light-transmitting area AA2 defined by the protective structure 14.
  • part of the first electrode layer 11 is also located on the side of the protective structure 14 away from the substrate 10. That is, when the first electrode layer 11 is evaporated on the entire surface, the material that falls on the side of the protective structure 14 away from the substrate 10 is not etched and removed, which can reduce the difficulty and complexity of the process.
  • the display panel may include a plurality of spaced-apart light-emitting areas AA1
  • the first electrode layer 11 may include a plurality of spaced-apart first electrodes 11a, and the first electrodes 11a are disposed corresponding to the light-emitting areas AA1. That is, the portion of the first electrode layer 11 corresponding to each light-emitting area AA1 is the first electrode 11a. In this way, the portion between adjacent light-emitting areas AA1 may be used as the light-transmitting area AA2, thereby increasing the area of the light-transmitting area AA2.
  • the display panel further includes a connecting line 11 b , and the connecting line 11 b is electrically connected to the first electrodes 11 a corresponding to the adjacent light-emitting area AA1 .
  • the first electrode layer 11 in the display panel further includes a plurality of connection lines 11b, and the connection lines 11b are used to electrically connect adjacent first electrodes 11a, and finally make all first electrodes 11a conduct with each other. In this way, the first electrodes 11a in each region can finally be connected to the external power signal.
  • the connection lines 11b are used to electrically connect adjacent first electrodes 11a, and finally make all first electrodes 11a conduct with each other. In this way, the first electrodes 11a in each region can finally be connected to the external power signal.
  • connecting wires 11b between all adjacent first electrodes 11a, but only a part of adjacent first electrodes 11a can be electrically connected through connecting wires 11b, as long as all first electrodes 11a are finally connected to each other. In this way, the blocking of light by connecting wires 11b can be reduced, and the light transmittance can be further improved.
  • the fewer the number of connecting wires 11b the higher the overall impedance of the first electrode layer 11. Therefore, in practice, the number and setting positions of connecting wires 11b can be reasonably designed based on the actual requirements for the impedance and light transmittance of the first electrode 11a.
  • connection line 11b and other parameters can be adjusted according to actual needs, and the extension direction of the connection line 11b can be a straight line, a broken line or a curve, etc. according to actual conditions.
  • the connecting wire 11b includes a transparent connecting wire. That is, part or all of the connecting wire 11b can be made of a transparent and conductive material, so as to avoid the connecting wire 11b affecting the light transmittance.
  • the material of the transparent connecting wire includes but is not limited to indium tin oxide (Indium Tin Oxide, ITO) or indium gallium zinc oxide (Indium Gallium Zinc Oxide, IGZO) and other conductive transparent materials.
  • the connecting wire 11b can be provided in the same layer as the first electrode 11a. That is, the connecting wire 11b and the first electrode 11a are formed using the same material in the same process step. Specifically, in the process, the first electrode 11a can be formed by etching the first electrode layer 11 formed on the entire surface and retaining the required portion. Based on this, the portion required to form the connecting wire 11b can be retained at the same time. In this way, the process steps can be simplified and the manufacturing efficiency can be improved.
  • At least one conductive layer is included between the light emitting layer 12 and the substrate 10.
  • These conductive layers are used to form electrodes, Routing or connecting layer and other structures.
  • the connecting line 11b can be set in the same layer as any conductive layer.
  • the structural parameters such as the structure, area and arrangement of different conductive layers may be different. Therefore, in practice, the film layer, setting position and structure of the connecting line 11b can be reasonably set according to the actual situation of the conductive layer to ensure that the setting of the connecting line 11b will not interfere with the structure of the original conductive layer.
  • the structure of the original conductive layer can also be adjusted so that the connecting line 11b can be set more conveniently.
  • the connecting line 11b is no longer set in the same layer as the first electrode 11a, but is set in the film layer between the light-emitting layer 12 and the substrate 10. In this way, the area of the first electrode opening Q can be expanded, and it is also more convenient to adjust the actual position and routing direction of the connecting line 11b and other parameters according to actual conditions.
  • the second electrode layer 13 is a conductive layer between the light-emitting layer 12 and the substrate 10 .
  • the connecting wire 11 b may be disposed in the same layer as the second electrode 13 a .
  • the conductive layer includes a first metal layer, the first metal layer is located on the side of the second electrode layer 13 facing the substrate 10, and the first metal layer is provided with a source and a drain of a thin film transistor.
  • the connecting line 11b can be provided in the same layer as the first metal layer, that is, provided in the same layer as the source and the drain of the thin film transistor in the display panel.
  • the conductive layer may further include other film layers, which will not be described one by one here.
  • At least one insulating layer is disposed between the conductive layer and the first electrode layer 11. These insulating layers can insulate the conductive layer and the first electrode layer 11 from each other.
  • the protection structure 14 may be disposed on a side of at least one insulating layer facing away from the substrate 10 .
  • the insulating layer includes a first insulating layer 15, the first insulating layer 15 includes a pixel definition portion 152 and a pixel opening 151 formed by the pixel definition portion 152, and the light-emitting unit 12a is disposed in the pixel opening 151.
  • the first insulating layer 15 may also be referred to as a pixel definition layer, and the pixel opening 151 included in the first insulating layer 15 is used to define the position of the light-emitting unit 12a.
  • the protective structure 14 may be disposed on a side of the pixel definition portion 152 away from the substrate 10.
  • the mainstream design is to use the light-emitting units 12a of the optical three primary colors of red (R), green (G) and blue (B) to form pixel units, so as to achieve full-color display of the display panel.
  • each light-emitting unit 12a needs to be arranged in a specific form to meet the display requirements.
  • the pixel definition layer 15 can be used to achieve the purpose of limiting the position of the light-emitting structure (sub-pixel), wherein when the light-emitting layer 12 is prepared on the side of the second electrode 13a away from the substrate 10, the pixel definition layer 15 can be first formed and a plurality of pixel openings 151 arranged in a specific form can be formed by an etching process, and then evaporated, so that the light-emitting unit 12a is formed in the pixel opening 151. Afterwards, the first electrode layer 11 is formed by evaporation on the entire surface of the light-emitting layer 12 and the pixel definition layer 15 away from the substrate 10, and the first electrode layer 11 is etched to obtain a plurality of first electrodes 11a arranged at intervals.
  • FIG. 5 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.
  • at least one insulating layer is provided with an insulating hole 17, and the protective structure 14 is located in the insulating hole 17.
  • the protective structure 14 is disposed on the side of the insulating layer away from the substrate 10, the overall thickness of the display panel will increase.
  • an insulating hole 17 is provided on at least one insulating layer, and the protective structure 14 is entirely or partially disposed in the insulating hole 17 ( FIG.
  • FIG. 5 shows the case where the protective structure 14 is entirely disposed in the insulating hole 17), so that the height of the protective structure 14 relative to the substrate 10 can be reduced, and the overall thickness of the display panel can be completely avoided from increasing, or the increase in the overall thickness of the display panel can be reduced to a certain extent.
  • the insulating hole 17 may include a through hole penetrating the insulating layer or a blind hole not penetrating the insulating layer.
  • the orthographic projection of the insulating hole 17 on the substrate 10 is annular, so the protection structure 14 disposed in the insulating hole 17 is also annular.
  • the first insulating layer 15 is provided with a first insulating hole 171, and the protective structure 14 is at least partially located in the first insulating hole 171.
  • the protective structure 14 it is equivalent to embedding the protective structure 14 in the first insulating hole 171, so that the height of the protective structure 14 relative to the substrate 10 can be reduced, thereby avoiding an increase in the overall thickness of the display panel or reducing the increase in the overall thickness of the display panel.
  • the insulating layer between the conductive layer and the first electrode layer 11 may further include a second insulating layer 19 , and the second insulating layer 19 is located on a side of the second electrode layer 13 facing the first metal layer.
  • the second insulating layer 19 can be a planarization layer (PLN), which has a relatively large thickness. On the one hand, it can play an insulating role, and on the other hand, it can form a flat contact surface, thereby facilitating the setting of the second electrode layer 13 and other film layers thereon.
  • PPN planarization layer
  • FIG6 is a schematic diagram of the cross-sectional structure of a display panel provided by another embodiment of the present application.
  • the display panel further includes a circuit array layer 16 disposed between the light-emitting layer 12 and the substrate 10, and the circuit array layer 16 includes a buffer layer 160 (buffer), an active layer 161 (poly), a gate insulating layer 162 (GI), a gate 163 (G), a capacitor insulating layer 164 (CI), a capacitor layer 165 (C), an interlayer dielectric layer 166 (ILD), a source electrode 167 (S), a drain electrode 168 (D) and a planarization layer 169 (PLN), and the planarization layer 169 can be used as the above-mentioned second insulating layer 19.
  • the active layer 161, the gate electrode 163, the source electrode 167, the drain electrode 168 and the insulating layer therebetween together constitute a thin film transistor for controlling the on and off of a signal.
  • the protective structure 14 may be located on the side of the second insulating layer 19 facing away from the substrate 10. That is, the first insulating hole 171 on the first insulating layer 15 is a through hole, and the protective structure 14 is disposed in the through hole and is disposed on the second insulating layer 19 between the first insulating layer 15 and the substrate 10.
  • the second insulating layer 19 is provided with a second insulating hole 172, and the protective structure 14 is at least partially located in the second insulating hole 172. That is, similar to the first insulating layer 15 being provided with the first insulating hole 171, in this embodiment, the second insulating layer 19 is provided with a second insulating hole 172, and the protective structure 14 is at least partially located in the second insulating hole 172. In this way, the thickness of the display panel may be better prevented from increasing due to the provision of the protective structure 14.
  • the orthographic projection of the first insulating hole 171 on the substrate 10 coincides with the orthographic projection of the second insulating hole 172 on the substrate 10.
  • the first insulating hole 171 and the second insulating hole 172 can be formed at one time in the same process, simplifying the process steps.
  • Figure 7 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application
  • the insulating layer is provided with a connecting hole 18 penetrating the insulating layer
  • the first electrode 11a is electrically connected to the connecting line 11b through the connecting hole 18.
  • the first electrode 11 a is located in the pixel opening and extends to a side of the pixel defining portion 152 facing away from the substrate 10 .
  • connection hole 18 when the connection hole 18 is provided to electrically connect the first electrode 11a with the connection line 11b, the connection hole 18 needs to penetrate the insulating layer between the first electrode 11a and the connection line 11b.
  • the first electrode 11a extends outward from the inside of the pixel opening 151 to the side of the pixel definition portion 152 away from the substrate 10, so that when the connection hole 18 is formed, it can be easily avoided.
  • connection hole 18 on the substrate 10 is staggered from the orthographic projection of the insulating hole 17 on the substrate 10. That is, the connection hole 18 is opened to avoid the insulating hole 17 and penetrate all the insulating layers between the first electrode 11a and the connection line 11b.
  • FIG. 6 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.
  • the orthographic projection of the connection hole 18 on the substrate 10 is located within the orthographic projection range of the insulating hole 17 on the substrate 10.
  • the first electrode 11a also extends into the insulating hole 17 and is electrically connected to the connecting wire 11b through the connection hole 18.
  • the connection hole 18 no longer penetrates all the insulating layers between the first electrode 11a and the connecting wire 11b, but only penetrates a portion of the film layer under the protective structure 14, so the punching depth of the connection hole 18 can be effectively reduced, thereby reducing the difficulty of punching.
  • FIG8 is a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the present application.
  • the first electrode 11a also extends into the insulating hole 17 and overlaps with the protective structure 14, and the first electrode 11a is electrically connected to the connecting line 11b through the protective structure 14; wherein the protective structure 14 is a conductive structure.
  • the protective structure 14 can be made of conductive material in whole or in part to make it conductive, so that the protective structure 14 can be used as a connecting structure to electrically connect the first electrode 11a and the connecting line 11b.
  • the length of the connecting line 11b can be shortened to a certain extent, thereby better avoiding the connection line 11b from affecting other original structures.
  • the connecting line 11b is arranged in the same layer as the source and drain of the thin film transistor, it can better avoid that the connecting line 11b squeezes the setting space of the source and drain.
  • the first electrode 11a may overlap only the side of the protection structure 14 facing the light-emitting area AA1.
  • the first electrode 11a may also extend to the side of the protection structure 14 facing away from the substrate 10, and overlap with the side of the protection structure 14 facing away from the substrate 10 (not shown), thereby increasing the overlap area and ensuring Overlap effect.
  • the insulating hole 17 shown in the above embodiment is only exemplary. In fact, the insulating hole 17 can continue to extend in a direction gradually approaching the substrate 10 as long as it does not affect the necessary structure in the existing film layer.
  • the insulating hole 17 may penetrate into the planarization layer 169 .
  • the insulating hole 17 may also penetrate the planarization layer 169, so that the protection structure 14 may be disposed on the film layer below the planarization layer 169.
  • the number of film layers penetrated by the insulating hole 17, is no limitation on the number of film layers penetrated by the insulating hole 17, as long as it does not affect the arrangement of other necessary structures (such as thin film transistors).
  • the protective structure 14 includes a first surface close to the substrate 10 and a second surface away from the substrate 10, and the orthographic projection of the first surface on the substrate 10 is located within the orthographic projection range of the second surface on the substrate 10. That is, taking the protective structure 14 located on the upper side of the substrate 10 as an example, the protective structure 14 can adopt a "wide at the top and narrow at the bottom" design, which can better ensure that the first electrode layer 11 is disconnected at the protective structure 14.
  • Fig. 9 is a schematic diagram of a cross-sectional structure of a protective structure 14 provided in multiple embodiments of the present application along the thickness direction of the display panel.
  • the cross-sectional shape of the protective structure 14 can be an isosceles or an isosceles inverted trapezoid.
  • the protective structure 14 includes a first layer and a second layer stacked in a direction away from the substrate 10, and the orthographic projection of the first layer on the substrate 10 is located within the orthographic projection range of the second layer on the substrate 10. That is, as shown in FIG9(d), the cross-sectional figure of the protective structure 14 is a "T"-shaped protective structure 14, and the "T"-shaped protective structure 14 includes a first layer and a second layer stacked, wherein the width of the first layer on the side relatively closer to the substrate 10 is smaller than the width of the second layer on the side relatively farther from the substrate 10.
  • the protective structure 14 may also be other structures.
  • the cross-sectional diagram of the protective structure 14 is a structure similar to an I-shaped structure.
  • Figure 9 only shows a part of the feasible structures in the cross-sectional diagram of the protective structure 14.
  • the cross-sectional diagram of the protective structure 14 may also be other diagrams, as long as it can form a structure similar to an "eaves" so that the first electrode layer 11 can be better disconnected at the protective structure 14.
  • the material of the protective structure 14 can be an organic material, such as PI, or an inorganic material.
  • an inorganic material can be a metal material, such as metal molybdenum or a metal laminate, or a non-metallic material, such as silicon oxide (SiOx). The specific selection can be made according to actual needs.
  • the material of the protective structure 14 can be a transparent material, so as to avoid the light transmittance here being significantly reduced due to the protective structure 14 blocking the light.
  • the display panel may further include an encapsulation layer, which is disposed on the side of the light-emitting layer 12 away from the substrate 10 and is continuous on the entire surface, thereby effectively blocking external water vapor from entering the light-emitting unit 12a.
  • the encapsulation layer may be formed by a CVD (Chemical Vapor Deposition) process, and the encapsulation layer film formed by this process may be well attached to other structural surfaces, has good adhesion, and has a uniform film thickness, and the film thickness may be adjusted as needed.
  • protection structure 14 can also be used to cooperate with the packaging layer to encapsulate the light-emitting structure and protect the side wall of the light-emitting structure to better prevent the light-emitting structure from failing due to the intrusion of water vapor.
  • the encapsulation layer includes a first encapsulation layer 21, the first encapsulation layer 21 includes a first encapsulation portion 21a, at least the first encapsulation portion 21a is disposed in the light-emitting area AA1 and in contact with the protective structure 14.
  • the first encapsulation layer 21 also includes an encapsulation opening, which is disposed in the light-transmitting area AA2.
  • the first encapsulation layer 21 can be formed by a CVD process.
  • the first encapsulation layer 21 is an inorganic material.
  • the first electrode layer 11 is generally formed and the first encapsulation layer 21 is first formed on the side of the first electrode layer 11 facing away from the substrate 10, and then the first encapsulation layer 21 and the first electrode layer 11 corresponding to the light-transmitting area AA2 are etched to obtain the required first electrodes 11a arranged at intervals. Therefore, the portion of the first encapsulation layer 21 located in the light-transmitting area AA2 will be removed to form an encapsulation opening, while the portion of the first encapsulation layer 21 located in the light-emitting area AA1 will be retained to form the first encapsulation portion 21a. The material of the first electrode layer 11 at the position corresponding to the encapsulation opening is removed.
  • FIG. 10 is a schematic diagram of the cross-sectional structure of a display panel during the preparation process in one embodiment of the present application.
  • FIG. 10 by setting the protective structure 14 , when the entire first electrode layer 11 is formed, the first electrode The layer 11 can be disconnected at the protective structure 14 (as shown in (a) in FIG.
  • the cathode material will fall on the side of the protective structure 14 facing away from the substrate 10, so that the first electrode layer 11 is no longer continuous), and, when the first encapsulation layer 21 is formed thereafter, the first encapsulation layer 21 can fill in the area S between the protective structure 14 and the first electrode 11a, forming regional independent encapsulation for different light-emitting areas AA1, thereby improving the packaging reliability (even if part of the light-emitting area AA1 fails, it will not further cause the failure of all the light-emitting areas AA1). Furthermore, as shown in (b) in FIG.
  • the first encapsulation portion 21a is in contact with at least one side of the protective structure 14 facing the light-emitting area AA1. In this way, effective encapsulation protection can be ensured for the light-emitting structure. Further preferably, as shown in Figures 5 to 8, the first encapsulation portion 21a is in contact with the side of the protective structure 14 facing away from the substrate 10. That is, in this embodiment, the portion of the first encapsulation portion 21a located on the side of the protective structure 14 facing away from the substrate 10 is also retained. In this way, effective encapsulation protection can be further ensured for the light-emitting structure.
  • the encapsulation layer further includes a second encapsulation layer 22, which is located on the side of the first encapsulation layer 21 away from the substrate 10, and is disposed in the light-emitting area AA1 and the light-transmitting area AA2 at the same time, and covers the protective structure 14. That is, in order to further improve the reliability of the encapsulation, as shown in (c) of FIG. 10 , after etching the first electrode layer 11, a continuous second encapsulation layer 22 can be formed on the side of the first encapsulation layer 21 and the protective structure 14 away from the substrate 10, thereby achieving multiple encapsulation protection.
  • the second encapsulation layer 22 can also be formed by a CVD process.
  • the second encapsulation layer 22 is an inorganic material.
  • the light-transmitting area AA2 may correspond only to a portion of the display area corresponding to the camera, that is, only the first electrode layer 11 of a portion of the display area corresponding to the camera may be patterned to include a plurality of first electrodes 11a to improve the light transmittance of the portion of the display area, while the remaining display areas may not be adjusted and the original structure may be maintained.
  • the first electrode layer 11 of the entire display area of the display panel using UDC technology may also be patterned, and the present application does not limit this.
  • the first electrode layer 11 of the entire display area of the display panel can be patterned, so that the light transmittance of the entire display area is increased.
  • the portion of the insulating layer located in the light-transmitting area AA2 is provided with an insulating opening 173.
  • the portion of the first insulating layer 15 located in the light-transmitting area AA2 is provided with an insulating opening 173.
  • a portion of the first insulating layer 15 in the light-transmitting area AA2 is also removed, so that the portion of the first insulating layer 15 located in the light-transmitting area AA2 forms an insulating opening 173.
  • the light transmittance can be further improved.
  • etching and removing the first insulating layer 15 in the light-transmitting area AA2 when etching and removing the first insulating layer 15 in the light-transmitting area AA2, a portion of the film layer below the first insulating layer 15 can be further etched and removed, thereby further improving the light transmittance.
  • the more film layers are etched and removed the higher the requirements for the etching process, the more complex the steps, and the greater the difficulty, so a reasonable selection can be made according to actual needs during specific implementation.
  • the display panel also includes other structures necessary to realize its functions, but the present application does not need to improve these structures, so they will not be described one by one.
  • Figures 11 and 12 are respectively schematic diagrams of the top view structure of the display panel provided in other embodiments of the present application
  • Figure 13 is a schematic diagram of the cross-sectional structure of the display panel provided in another embodiment of the present application, wherein the cross-sectional position corresponding to Figure 13 is the cross-sectional line CC' in Figure 11 or the cross-sectional line DD' in Figure 12.
  • the display panel includes: a substrate 10, a protective structure 14, a light-emitting layer 12, a first electrode layer 11 and a second electrode layer 13.
  • the protection structure 14 is disposed on one side of the substrate 10 , and the protection structure 14 encloses a protection opening P.
  • the first electrode layer 11 is arranged on the side of the light-emitting layer 12 away from the substrate 10.
  • the first electrode layer 11 is provided with a first electrode opening Q.
  • the orthographic projection of the first electrode opening Q on the substrate 10 is located within the orthographic projection range of the protective opening P on the substrate 10, and is staggered with the orthographic projection of the light-emitting unit 12a on the substrate 10.
  • the substrate 10, protective structure 14, light-emitting layer 12, first electrode layer 11 and second electrode layer 13 in this embodiment are consistent with the same structures in the previous embodiments, and their functions and materials are not repeated here.
  • the first electrode opening Q i.e., the portion where the first electrode layer 11 is removed, has a higher light transmittance in the corresponding area. That is, the protective opening P formed by the protective structure 14 can separate the light-emitting area and the light-transmitting area in the aforementioned embodiment.
  • the first electrode opening Q is located in the light-transmitting area, and the light-emitting unit 12a is located in the light-emitting area.
  • the first electrode layer 11 includes a plurality of first electrodes 11a disposed at intervals and a connecting line 11b electrically connecting adjacent first electrodes 11a, wherein the orthographic projection of the first electrode 11a on the substrate 10 is staggered from the orthographic projection of the first electrode opening Q on the substrate 10. That is, the portion of the first electrode layer 11 other than the first electrode opening Q forms the first electrode 11a.
  • the orthographic projection of the connecting wire 11b on the substrate 10 is staggered from the orthographic projection of the first electrode opening Q on the substrate 10. That is, the connecting wire 11b does not run through the area of the first electrode opening Q, so that the connecting wire 11b can be prevented from affecting the light transmittance.
  • the first electrode 11a and the connecting wire 11b are arranged in the same layer.
  • connection line 11b are consistent with those of the above-mentioned embodiment, and are used to electrically connect the first electrodes 11a that are spaced apart from each other to ensure that each first electrode 11a can work normally, that is, normally receive the power signal (ELVSS).
  • EVSS normally receive the power signal
  • At least one conductive layer is included between the light-emitting layer 12 and the substrate 10, and at least one insulating layer is provided between the conductive layer and the first electrode layer 11.
  • these conductive layers are used to form structures such as electrodes, wiring or connection layers.
  • these conductive layers can be used to form power wiring, signal wiring, capacitor plates, source and drain electrodes and anodes of thin film transistors, etc.
  • the insulating layer between the conductive layer and the first electrode layer 11 is used to insulate the conductive layer from the first electrode layer 11.
  • These insulating layers may include, for example, a pixel definition layer, a planarization layer, and an insulating layer between the source, drain and gate of a thin film transistor, etc.
  • the conductive layer includes a conductive portion, and the orthographic projection of the conductive portion on the substrate 10 is staggered from the orthographic projection of the first electrode opening Q on the substrate 10.
  • these conductive portions can be the above-mentioned wiring or electrodes, etc. That is, the conductive portion does not pass through the corresponding position of the area where the first electrode opening Q is located, so that the conductive portion can be prevented from affecting the light transmittance of the area.
  • the protection structure 14 is located on the side of the insulating layer away from the substrate 10.
  • the protection structure 14 may be located on the side of the pixel definition layer away from the substrate 10.
  • an insulating hole is provided on the insulating layer, and the protective structure 14 is at least partially disposed in the insulating hole.
  • the insulating hole may be the first insulating hole provided in the first insulating layer and the second insulating hole provided in the second insulating layer in the aforementioned embodiment.
  • the orthographic projection of the insulating hole on the substrate 10 is annular.
  • the protective structure 14 arranged in the annular insulating hole is also arranged in annular shape.
  • the insulating hole is a through hole or a blind hole. The specific design can be based on actual needs.
  • the insulating layer includes an insulating opening
  • the orthographic projection of the insulating opening on the substrate 10 is located within the orthographic projection range of the protection opening P on the substrate 10.
  • the insulating opening is obtained by etching and removing a portion of the insulating layer between the first electrode opening Q and the substrate 10 when the first electrode layer 11 is etched to obtain the first electrode opening Q.
  • the protective structure 14 includes a first surface close to the substrate 10 and a second surface away from the substrate 10, and the orthographic projection of the first surface on the substrate 10 is located within the orthographic projection range of the second surface on the substrate 10. In this way, when the first electrode layer 11 is formed, it can be better ensured that the first electrode layer 11 is disconnected at the protective structure 14.
  • the display panel also includes an encapsulation layer, which is located on the side of the light-emitting layer away from the substrate 10 and is used to encapsulate and protect the light-emitting structure composed of the light-emitting layer and other film layers to prevent water and oxygen intrusion from causing failure of the light-emitting structure.
  • an encapsulation layer which is located on the side of the light-emitting layer away from the substrate 10 and is used to encapsulate and protect the light-emitting structure composed of the light-emitting layer and other film layers to prevent water and oxygen intrusion from causing failure of the light-emitting structure.
  • the structures such as the connecting lines, conductive layers, insulating layers, and packaging layers or the specific structures of the film layers in the above embodiments are consistent with the previous embodiments, and can be referred to the corresponding contents in the previous embodiments, which will not be described in detail here.
  • an embodiment of the present application further provides a display device, which includes the display panel described in any of the above embodiments, wherein the display device can be a smart phone, a tablet computer, or a laptop computer.
  • the display device includes the display panel described in any of the above embodiments, it has corresponding advantages, which will not be described in detail here.
  • the display device further includes a photosensitive element, which is located on a side of the substrate away from the light-emitting layer.
  • the photosensitive element may be, for example, a camera.
  • Exemplary embodiments are described herein with reference to plan views that are idealized exemplary drawings.
  • the sizes of the regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and/or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

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Abstract

本申请提供一种显示面板及显示装置。显示面板划分为发光区和透光区，发光区和透光区相邻设置，显示面板包括：基板；防护结构，设置于基板上，且设置于发光区和透光区之间；发光层，与防护结构位于基板的同一侧，发光层包括发光单元，发光单元设置于发光区；第一电极层，位于发光层背离基板的一侧，第一电极层包括第一电极，设置于发光区。通过本申请的方案，可以有效提高显示面板的光透过率。

Description

显示面板及显示装置 技术领域
本申请涉及一种显示面板及显示装置，属于显示技术领域。
发明背景
随着工艺技术的发展和人们使用需求的提升，在常规的显示方案的基础上，出现了UDC(Under Display Camera，屏下摄像头)技术等新的显示技术以及透明屏和拉伸屏等新的产品形态。UDC、透明屏和拉伸屏等相关技术都需要显示屏具有高的光透过率，因此如何提高屏体的光透过率成为亟待解决的问题。
发明内容
本申请提供一种显示面板及显示装置，以解决如何提高屏体的光透过率的问题。
第一方面，本申请实施例提供一种显示面板，其划分为发光区和透光区，所述发光区和所述透光区相邻设置，
所述显示面板包括：
基板；
防护结构，设置于所述基板上，且设置于所述发光区和所述透光区之间；
发光层，与所述防护结构位于所述基板的同一侧，所述发光层包括发光单元，所述发光单元设置于所述发光区；
第一电极层，位于所述发光层背离所述基板的一侧，所述第一电极层包括第一电极，设置于所述发光区。
第二方面，本申请实施例还提供另一种显示面板，其包括：
基板；
防护结构，设置于所述基板一侧，所述防护结构围合形成防护开口；
发光层，与所述防护结构位于所述基板的同一侧，所述发光层包括发光单元；
第一电极层，设置于所述发光层背离所述基板的一侧，所述第一电极层设有第一电极开口，所述第一电极开口在所述基板上的正投影位于所述防护开口在所述基板上的正投影范围内，且与所述发光单元在所述基板上的正投影错开。
第三方面，本申请实施例还提供一种显示装置，其特征在于，包括如第一方面或第二方面任意一项所述的显示面板；
一个实施例中，优选的，所述显示装置还包括感光元件，所述感光元件位于所述基板背离所述发光层的一侧。
本申请提供的显示面板及显示装置中，显示面板包括基板以及设置在基板一侧的防护结构、发光层和第一电极层，防护结构围合形成防护开口，第一电极层设有第一电极开口，且第一电极开口在基板上的正投影位于防护开口在基板上的正投影范围内。如此设置，通过设置防护结构围合形成防护开口，并在第一电极层上设置与防护开口位置对应的第一电极开口，也即对第一电极层进行了图像化，使得其不为整面连续的膜层，基于此，在第一电极开口对应的区域，不再有第一电极层的遮挡，因此可以有效提高该区域的光透过率，更好地满足UDC、透明屏和拉伸屏等技术的需求。
附图简要说明
图1为本申请一个实施例中提供的显示面板的俯视结构示意图。
图2为本申请一个实施例提供的显示面板的剖面结构示意图。
图3为本申请另一个实施例中提供的显示面板的俯视结构示意图。
图4为本申请另一个实施例中提供的显示面板的俯视结构示意图。
图5为本申请另一个实施例提供的显示面板的剖面结构示意图。
图6为本申请另一个实施例提供的显示面板的剖面结构示意图。
图7为本申请另一个实施例提供的显示面板的剖面结构示意图。
图8为本申请另一个实施例提供的显示面板的剖面结构示意图。
图9为本申请多个实施例提供的防护结构沿显示面板的厚度方向的剖面结构示意图。
图10为本申请一个实施例中制备过程中的显示面板的剖面结构示意图。
图11为本申请另一个实施例提供的显示面板的俯视结构示意图。
图12为本申请另一个实施例提供的显示面板的俯视结构示意图。
图13为本申请另一个实施例提供的显示面板的剖面结构示意图。
图14为本申请一个实施例提供的显示装置的结构示意图。
实施本发明的方式
随着工艺技术的发展以及人们对显示装置的使用需求的提高，出现了UDC技术等新的显示技术以及透明屏和拉伸屏等新的产品形态。
UDC技术也即将摄像头隐藏在屏幕下方，从而省去前置摄像头对应的“刘海”区或打孔区，实现真正的全面屏。透明屏也即透明显示屏，是一种新型的显示技术，可以使显示屏在显示图像的同时，保持透明的状态。该技术可以在不影响背景景观的情况下，显示图像和文字等。拉伸屏，也即可以将屏幕按照需要拉伸变形，达到不同尺寸和比例的显示效果。
上述技术都要求显示屏具有高的光透过率，常规的显示面板方案不能满足要求。
针对上述问题，考虑到目前对显示面板光透过率影响最大的因素是发光电极层，因此本申请提供一种对发光电极层进行图形化设计的方案，也即通过调整发光电极层的结构，使得其不为整层连续的膜层，从而减小对光线的阻挡，提高显示面板的光透过率。以下通过几个示例或实施例对具体实现方案进行非限制性说明。
参照图1和图2，图1为本申请一个实施例中提供的显示面板的俯视结构示意图，图2为本申请一个实施例提供的显示面板的剖面结构示意图，其中剖面位置对应于图1中的剖面线AA′。如图1和图2所示，本实施例的显示面板划分为发光区AA1和透光区AA2，发光区AA1和透光区AA2相邻设置；显示面板包括：基板10、发光层12、第一电极层11、第二电极层13和防护结构14。
其中，基板10主要起到支撑和承载等作用，可采用如不锈钢(Stainless Use Steel，简称SUS)或者柔性聚酰亚胺(Polyimide，PI)等柔性材质，也可采用玻璃或硅等刚性材质。
发光层12包括多个发光单元12a，发光单元12a设置于发光区AA1。第一电极层11位于发光层12背离基板10的一侧，第一电极层11包括多个第一电极11a，第一电极11a也设置于发光区AA1。第二电极层13位于发光层12靠近基板10的一侧，第二电极层13包括多个第二电极13a，且第二电极13a也设置于发光区AA1。
具体的，每个发光单元12a可以包括具有电致发光(Electroluminescence，EL)性能的材料(简称发光材料)，且每个发光单元12a与其两侧的第一电极层11和第二电极层13可以构成基本的发光结构。当在第一电极层11和第二电极层13之间施加合适的电压时，发光单元12a即可以受激发光。进一步地，可以通过第一电极层11和第二电极层13向多个发光单元12a分别施加不同的电压，使得不同的发光单元12a的发光亮度和颜色等不同，进而，当多个发光 单元12a按照特定的组合进行发光时，显示面板即可显示特定的画面。其中，第一电极层11可以为阴极层，用于向发光层12提供负电源信号，第二电极层13可以为阳极层，用于向发光层12提供正电源信号。
另外，本实施例的显示面板还设置有防护结构14，防护结构14与发光层12位于基板10的同一侧，用于分隔发光区AA1和透光区AA2。发光区AA1也即显示面板中能够发光显示的区域，该区域设有由第一电极层11、发光层12和第二电极层13等膜层构成的发光结构。透光区AA2也即显示面板中能够方便光线更好透过的区域，也即透光区AA2相比发光区AA1具有更高的光透过率。其中，本实施例中，由于发光层12、第一电极层11和第二电极层13均位于发光区AA1，也即不位于透光区AA2，因此光线通过透光区AA2时，没有发光层12、第一电极层11和第二电极层13等膜层的阻挡，因而透光区AA2具有更高的光透过率。如此，本实施例中的显示面板可以应用在UDC等场景中，以便摄像头等感光元件能够更容易获取到更多光线，或者可以应用于透明屏等场景中，以便更多光线能够穿过显示面板，提高透明效果。
其中，一些实施例中，基于防护结构14分隔发光区AA1和透光区AA2的原理如下：首先按照常规工艺制程在基板10上制备多个相互间隔设置的第二电极13a；然后在至少一部分第二电极13a之间的间隔区域制备防护结构14，防护结构14的第二电极13a所在侧作为发光区AA1，另一侧作为透光区AA2；之后在各个第二电极13a背离基板10的一侧蒸镀发光单元12a，以及在发光单元12a背离第二电极13a的一侧整面蒸镀第一电极层11的材料，且蒸镀的材料中，一部分会附着在防护结构14的背离基板10的侧面(图2中的上侧面)上，其余的材料会落在防护结构14的侧壁的两侧，由此使得防护结构14侧壁的两侧的第一电极层11的材料不连续。再之后，可通过刻蚀工艺去除透光区AA2部分的第一电极层11的材料。如此，通过防护结构14可以使得发光区AA1和透光区AA2的膜层不同，透光区AA2的膜层相对更少，因此具有更高的光透过率。
如上所述，通过设置防护结构14可以对第一电极层11进行图形化设计，使得在显示面板的透光区AA2不具有第一电极层11的材料，也即第一电极层11不为整面连续的膜层，从而可以使得显示面板的透光区AA2具有更高的光透过率。
另外，需要说明的是，一些实施例中，发光结构除了包括第二电极13a、发光单元12a和第一电极11a之外，还可以包括其他辅助发光的膜层，比如设置在第二电极13a与发光单元12a之间的空穴注入层、空穴传输层以及电子阻挡层等，又比如设置在第一电极11a与发光单元12a之间的电子注入层、电子传输层以及空穴阻挡层等。或者，另一些实施例中，发光结构也可以为叠层发光结构，也即可以包括多个发光单元12a以及设置在相邻发光单元12a之间的电荷生成层。由于本申请后续实施例的方案均不涉及对上述膜层的改进，因此后续结合附图对本申请的实施方案进行说明时，不再对这些膜层进行图示和说明。
需要注意的是，一些实施例中，为了使第一电极层11在防护结构14处断开，如图2所示，防护结构14的第一侧面至基板10的距离，大于或等于第一电极11a的边缘部分的第一侧面至基板10的距离。其中，防护结构14的第一侧面指的是防护结构14背离基板10的侧面(表面)，第一电极11a的边缘部分指的是第一电极11a与防护结构14相邻的部分，第一电极11a的第一侧面指的是第一电极11a背离基板10的侧面(表面)。也即，以基板10的其中一个侧面为参考平面时，防护结构14的“高度”须大于或等于第一电极11a的边缘部分的“高度”，从而第一电极层11在防护结构14处可以形成断差。
此外，一些实施例中，如图1所示，防护结构14可以围绕发光区AA1设置。也即，防护结构14包围的区域为发光区AA1，防护结构14包围区域之外的区域为透光区AA2。如此设置，可以使得透光区AA2的面积更大。
在此基础上，进一步优选的，一些实施例中，如图1所示，发光区AA1仅设有一个发光单元12a。图1中的一个虚线框对应一个发光单元12a。也即，每个防护结构14包围的一个发光区AA1中，仅对应设置有一个发光单元12a，不同的发光单元12a位于不同的防护结构14包围的发光区AA1中。如此设置，可以增加透光区AA2的总面积，提高透光效果。
另一些实施例中优选的，参照图3，图3为本申请另一个实施例中提供的显示面板的俯视结构示意图，其中，图2中的剖面结构示意图可以对应于图3中的剖面线AA′。如图3所示，发光区AA1设有至少两个发光单元12a(图3示出了两个发光单元12a的情况)。图3中的一个虚线框对应一个发光单元12a。也即，每个防护结构14包围的一个发光区AA1中，对应设置有两个或以上的发光单元12a。如此设置，可以减少防护结构14的数量，降低工艺难度和复杂度。
此外，参照图4，图4为本申请另一个实施例中提供的显示面板的俯视结构示意图，其中图2中的剖面结构示意图可以对应于图4中的剖面线BB′。如图4所示，一些实施例中，防护结构14可以围绕透光区AA2设置。也即，防护结构14包围的区域为透光区AA2，防护结构14包围区域之外的区域为发光区AA1。如此设置，虽然透光区AA2的面积相对防护结构14围绕发光区AA1的方案更小，但相应的可以使得第一电极层11的覆盖面积更大，因此第一电极层11的阻抗更低。
在此基础上，进一步优选的，一些实施例中，如图2所示，第一电极层11还包括第一电极开口Q，第一电极开口Q位于透光区AA2。也即，通过将防护结构14对应包围的区域的第一电极层11的材料去除，可以在第一电极层11上形成一或多个贯穿第一电极层11的第一电极开口Q，第一电极开口Q的数量和形状等与防护结构14限定出的各个透光区AA2的数量和形状相关。
在此基础上，进一步优选的，一些实施例中，如图2所示，部分第一电极层11还位于防护结构14背离基板10的一侧。也即，整面蒸镀第一电极层11时落在防护结构14背离基板10的一侧的材料，不进行刻蚀去除，如此可以降低工艺难度和复杂度。
继续参照图1至图4，一些实施例中，显示面板可以包括多个间隔设置的发光区AA1，第一电极层11包括多个间隔设置的第一电极11a，第一电极11a与发光区AA1对应设置。也即，第一电极层11的对应设在各个发光区AA1中的部分即为第一电极11a。如此，相邻发光区AA1之间的部分可以作为透光区AA2，从而可以增加透光区AA2的面积。
在此基础上，进一步优选的，如图2所示，显示面板还包括连接线11b，连接线11b电连接相邻发光区AA1对应的第一电极11a。
具体的，为了保证各个第一电极11a都能够正常工作，也即正常接收电源信号(ELVSS)，本实施例中，显示面板中的第一电极层11还包括多条连接线11b，连接线11b用于将相邻的第一电极11a电连接，最终使得所有第一电极11a都相互导通。这样，各个区域的第一电极11a最终都能与外部的电源信号相连接。
需要说明的是，实际中，并不必须在所有相邻的第一电极11a之间都设置连接线11b，而是可以只将一部分相邻的第一电极11a通过连接线11b电连接，只要最终保证所有第一电极11a都相互导通即可。这样可以减少连接线11b对光线的阻挡，进一步提高光透过率。不过，连接线11b的数量越少，则第一电极层11整体的阻抗越高，因此实际中可以根据实际对第一电极11a阻抗和光透过率的要求进行综合考虑，合理设计连接线11b的数量和设置位置。
另外，可以根据实际需要调整连接线11b的长度和宽度等参数，且根据实际情况，连接线11b的延伸方向可以是直线、折线或者曲线等等。
进一步优选的，连接线11b包括透明连接线。也即部分或全部连接线11b可以采用透明且导电的材料制成，从而避免连接线11b影响光透过率。其中，透明连接线的材料包括但不限于氧化铟锡(Indium Tin Oxide，ITO)或氧化铟镓锌(Indium Gallium Zinc Oxide，IGZO)等可导电的透明材料。
一些实施例中，连接线11b可以与第一电极11a同层设置。也即，连接线11b与第一电极11a采用相同的材料在同一工艺步骤中形成。具体的，在工艺制程中，通常可以通过对整面形成的第一电极层11进行刻蚀，保留需要的部分而形成第一电极11a，基于此，可以同时保留需要形成连接线11b的部分。如此，可以简化工艺步骤，提高制作效率。
一些实施例中，发光层12和基板10之间包括至少一层导电层。这些导电层用于形成电极、 走线或者连接层等结构。在此基础上，连接线11b可以与任意一层导电层同层设置。其中，不同的导电层的结构、面积以及排布方式等结构参数可能不同，因此，实际中，可根据导电层的实际情况来合理设置连接线11b的所在膜层、设置位置和结构等，确保设置连接线11b后不会对原有的导电层的结构造成干扰。当然，必要时，也可以调整原有导电层的结构，以便能够更方便地设置连接线11b。本实施例中，连接线11b不再和第一电极11a同层设置，而是设置在发光层12与基板10之间的膜层中。如此，可以扩大第一电极开口Q的面积，同时还更方便根据实际情况调整连接线11b的实际位置和走线方向等参数。
比如，第二电极层13即为发光层12和基板10之间的一层导电层，基于此，一些实施例中，连接线11b可以与第二电极13a同层设置。
又比如，一些实施例中，导电层包括第一金属层，第一金属层位于第二电极层13朝向基板10的一侧，且该第一金属层设有薄膜晶体管的源极和漏极。基于此，一些实施例中，连接线11b可以与第一金属层同层设置，也即与显示面板中的薄膜晶体管的源极和漏极同层设置。
可以理解，另一些实施例中，导电层还可以包括其他膜层，此处不再一一赘述。
此外，一些实施例中，导电层与第一电极层11之间设有至少一层绝缘层。这些绝缘层可以使得导电层与第一电极层11之间相互绝缘。
在此基础上，一些实施例中，防护结构14可以设置于至少一层绝缘层背离基板10的一侧。
比如，继续参照图2所示，一些实施例中，绝缘层包括第一绝缘层15，第一绝缘层15包括像素定义部152和像素定义部152围合形成的像素开口151，发光单元12a设置于像素开口151内。第一绝缘层15也可以称为像素定义层，第一绝缘层15包括的像素开口151用于限定发光单元12a的位置。防护结构14可以设置于像素定义部152背离基板10的一侧。
具体的，显示面板中，主流的设计是利用光学三原色红色(R)、绿色(G)和蓝色(B)的发光单元12a组成像素单元，从而实现显示面板的全彩显示。这种情况下需要各个发光单元12a以特定的形式进行排布，以满足显示需求。像素定义层15即可以用于实现限定发光结构(子像素)的位置的目的，其中，在第二电极13a背离基板10一侧制备发光层12时，可以首先形成像素定义层15并通过刻蚀工艺形成多个按照特定形式排布的像素开口151，然后再进行蒸镀，从而将发光单元12a形成在像素开口151中。之后，再在发光层12和像素定义层15背离基板10的一侧整面蒸镀形成第一电极层11，并对第一电极层11刻蚀得到多个间隔设置的第一电极11a。
另一些实施例中，参照图5，图5为本申请另一个实施例提供的显示面板的剖面结构示意图。如图5所示，至少一层绝缘层设有绝缘孔17，防护结构14位于绝缘孔17内。具体的，由图2可知，当防护结构14设置于绝缘层背离基板10的一侧时，会导致显示面板的整体厚度增加。为了解决该问题，本实施例中，在至少一层绝缘层上设有绝缘孔17，并将防护结构14全部或部分设于绝缘孔17内(图5示出了防护结构14全部设于绝缘孔17内的情况)，从而可以降低防护结构14相对基板10的高度，完全避免显示面板的整体厚度增加，或者在一定程度上减少显示面板的整体厚度的增加量。
其中，绝缘孔17可以包括贯穿绝缘层的通孔或不贯穿绝缘层的盲孔。一些实施例中，绝缘孔17在基板10上的正投影呈环状，如此，设置在绝缘孔17中的防护结构14也呈环状。
比如，一些实施例中，参照图5，第一绝缘层15设有第一绝缘孔171，防护结构14至少部分位于第一绝缘孔171内。如此，相当于将防护结构14嵌设于第一绝缘孔171内，因此可以降低防护结构14相对基板10的高度，避免显示面板的整体厚度增加或减少显示面板的整体厚度的增加量。
此外，一些实施例中，导电层与第一电极层11之间的绝缘层还可以包括第二绝缘层19，第二绝缘层19位于第二电极层13朝向第一金属层的一侧。
进一步地，一些实施例中，该第二绝缘层19可以为平坦化层(PLN)，平坦化层具有较大的厚度，一方面可以起到绝缘的作用，另一方面可以形成平坦的接触面，从而便于在其上设置第二电极层13等膜层。
更具体地，参照图6，图6为本申请另一个实施例提供的显示面板的剖面结构示意图。如图6所示，显示面板还包括设置于发光层12与基板10之间的电路阵列层16，电路阵列层16包括缓冲层160(buffer)、有源层161(poly)、栅极绝缘层162(GI)、栅极163(G)、电容绝缘层164(CI)、电容层165(C)、层间介质层166(ILD)、源极167(S)、漏极168(D)和平坦化层169(PLN)，平坦化层169即可以作为上述的第二绝缘层19。其中，有源层161、栅极163、源极167、漏极168及其之间的绝缘层共同组成薄膜晶体管，用于控制信号的通断。
在此基础上，一些实施例中，防护结构14可以位于第二绝缘层19背离基板10的一侧。也即，第一绝缘层15上的第一绝缘孔171为通孔，防护结构14设于该通孔内，并设置在第一绝缘层15与基板10之间的第二绝缘层19上。
另一些实施例中，继续参照图6，第二绝缘层19设有第二绝缘孔172，防护结构14至少部分位于第二绝缘孔172内。也即，与第一绝缘层15设有第一绝缘孔171类似，本实施例中，在第二绝缘层19上设有第二绝缘孔172，并将防护结构14至少部分设于第二绝缘孔172内。如此，可以更好地避免设置防护结构14后导致显示面板的厚度增加。
进一步地，一些实施例中，第一绝缘孔171在基板10上的正投影与第二绝缘孔172在基板10上的正投影重合。如此，可以在相同的工艺中一次形成第一绝缘孔171和第二绝缘孔172，简化工艺步骤。
在上述各实施例的方案的基础上，一些实施例中，如图2、图5、图6和图7所示，其中图7为本申请另一个实施例提供的显示面板的剖面结构示意图，绝缘层设有贯穿绝缘层的连接孔18，第一电极11a通过连接孔18与连接线11b电连接。
进一步地，继续参照图2所示，一些实施例中，第一电极11a位于像素开口内并延伸至像素定义部152背离基板10的一侧。
具体的，当设置连接孔18将第一电极11a与连接线11b电连接时，连接孔18需要贯穿第一电极11a与连接线11b之间的绝缘层。并且，为了避免开设连接孔18时影响到发光单元12a和第二电极13a，因此，本实施例中，第一电极11a从像素开口151内向外延伸至像素定义部152背离基板10的一侧，如此再形成连接孔18时，可以很方便地避开发光单元12a和第二电极13a。
一些实施例中，继续参照图5，连接孔18在基板10上的正投影与绝缘孔17在基板10上的正投影错开。也即，开设的连接孔18避开绝缘孔17，贯穿第一电极11a与连接线11b之间的所有绝缘层。
而另一些实施例中，参照图6，图6为本申请另一个实施例提供的显示面板的剖面结构示意图。如图6所示，连接孔18在基板10上的正投影位于绝缘孔17在基板10上的正投影范围内。在此基础上，第一电极11a还延伸至绝缘孔17内，与连接线11b通过连接孔18电连接。如此设置，连接孔18不再贯穿第一电极11a与连接线11b之间的所有绝缘层，而是仅贯穿防护结构14下方的一部分膜层，因此可以有效降低连接孔18的打孔深度，从而降低打孔难度。
另一些实施例中，参照图8，图8为本申请另一个实施例提供的显示面板的剖面结构示意图。如图8所示，第一电极11a还延伸至绝缘孔17内与防护结构14搭接，第一电极11a通过防护结构14与连接线11b电连接；其中，防护结构14为导电结构。
也即，本实施例中，可以将防护结构14整体或部分采用导电材料制成，使其可以导电，从而由防护结构14作为连接结构将第一电极11a与连接线11b电连接。如此设置，可以在一定程度上缩短连接线11b的长度，从而更好地避免连接线11b对其他原有结构造成影响。比如，当连接线11b与薄膜晶体管的源漏极同层设置时，可以更好地避免连接线11b挤占源漏极的设置空间。
其中，一些实施例中，如图8所示，第一电极11a可以仅与防护结构14朝向发光区AA1的一侧搭接。在此基础上，另一些实施例中，第一电极11a还可以延伸至防护结构14背离基板10的一侧，与防护结构14背离基板10的一侧搭接(未图示)，从而增加搭接面积，保证 搭接效果。
需要说明的是，以上的实施例中示出的绝缘孔17仅是示例性的，实际上，绝缘孔17可以继续向逐渐靠近基板10的方向延伸，只要不影响像现有膜层中的必要结构即可。
比如，在图6所示结构的基础上，绝缘孔17可以深入平坦化层169。
另一些实施例中，绝缘孔17也可以贯穿平坦化层169，从而防护结构14可以设置在平坦化层169下方的膜层上。本申请中对绝缘孔17的贯穿的膜层的数量不进行限制，只要不影响其他必要结构(比如薄膜晶体管)的设置即可。
此外，一些实施例中，防护结构14包括靠近基板10的第一表面和远离基板10的第二表面，第一表面在基板10的正投影位于第二表面在基板10的正投影范围内。也即，以防护结构14位于基板10上侧为例，防护结构14可以采用“上宽下窄”的设计，这样可以更好地保证第一电极层11在防护结构14处断开。
比如，参照图9，图9为本申请多个实施例提供的防护结构14沿显示面板的厚度方向的剖面结构示意图。如图9(a)、图9(b)和图9(c)所示，防护结构14的剖面图形可以为等腰或不等腰的倒梯形。
进一步地，另一些实施例中，防护结构14沿着远离基板10方向包括层叠设置的第一层和第二层，第一层在基板10上的正投影位于第二层在基板10上的正投影范围内。也即如图9(d)所示，防护结构14的剖面图形为类“T”字形，“T”字形的防护结构14包括层叠设置的第一层和第二层，其中，相对更靠近基板10一侧的第一层的宽度小于相对更远离基板10一侧的第二层的宽度。
此外，另一些实施例中，为了使得第一电极层11更好地在防护结构14处断开，防护结构14也可以为其他结构，比如图9(e)所示，防护结构14的剖面图形为类似“工”字形的结构。
可以理解的是，图9仅示出了防护结构14的剖面图形中一部分可行的结构，另一些实施例中防护结构14的剖面图形也可以是其他图形，只要能够形成类似“屋檐”的结构，以便使得第一电极层11能够更好地在防护结构14处断开即可。
此外，一些实施例中，防护结构14的材料可以是有机材料，比如PI等，也可以是无机材料。当采用无机材料时，可以是金属材料，比如金属钼或者金属叠层等，也可以是非金属材料，比如氧化硅(SiOx)等。具体可以根据实际需要进行选择。进一步的，防护结构14的材料可以是透明材料，从而避免因防护结构14阻挡光线而导致此处的光线透过率明显降低。
此外，一些实施例中，为了保护发光单元12a，避免水汽入侵导致发光单元12a失效，显示面板中还可以包括封装层，封装层设置在发光层12背离基板10的一侧且整面连续，从而可以有效阻挡外界水汽进入到发光单元12a中。其中，封装层可以采用CVD(Chemical Vapor Deposition，化学气相沉积)工艺形成，这种工艺形成的封装层薄膜可以很好地附着在其他结构表面，具有良好的附着力，膜层厚度均匀，且膜层厚度可以根据需要进行调节。
并且，防护结构14还可以用于配合封装层对发光结构进行封装，对发光结构的侧壁进行保护，更好地避免水汽入侵导致发光结构失效。
进一步地，一些实施例中，如图5至图8所示，封装层包括第一封装层21，第一封装层21包括第一封装部21a，至少第一封装部21a设置于发光区AA1，且和防护结构14接触。第一封装层21还包括封装开口，封装开口设置于透光区AA2。第一封装层21可以采用CVD工艺形成。优选的，第一封装层21为无机材料。
具体的，在实际中，一般是在形成第一电极层11并在第一电极层11背离基板10的一侧先形成第一封装层21，再对透光区AA2对应的第一封装层21和第一电极层11进行刻蚀，从而得到所需的间隔设置的第一电极11a。因此，第一封装层21的位于透光区AA2的部分会被去除，形成封装开口，而第一封装层21的位于发光区AA1的部分会被保留，形成第一封装部21a。封装开口对应位置的第一电极层11的材料被去除。
为了更好地理解，参照图10，图10为本申请一个实施例中制备过程中的显示面板的剖面结构示意图。如图10所示，通过设置防护结构14，当形成整层的第一电极层11时，第一电极 层11可以在防护结构14处断开(如图10中的(a)所示，一部分阴极材料会落在防护结构14的背离基板10的侧面上，从而第一电极层11不再连续)，并且，再之后形成第一封装层21时，第一封装层21可以填补到防护结构14与第一电极11a之间的区域S内，形成针对不同发光区AA1的区域独立封装，提高封装可靠性(即使部分发光区AA1失效，也不会进一步导致所有发光区AA1均失效)。并且，如图10中的(b)所示，在通过刻蚀工艺对第一电极层11进行图形化时，只去除相邻的两个防护结构14之间的第一封装层21和第一电极层11的材料(具体位置参见图10中(a)中的区域R)，从而即使对第一电极层11进行图形化时需要将第一封装层21的位于透光区AA2的部分去除，去除该部分后，第一电极11a也不会暴露在第一封装层21的第一封装部21a之外，也即发光结构整体全都在第一封装层21的第一封装部21a的保护之下。
一些实施例中优选的，第一封装部21a至少与防护结构14朝向发光区AA1的一侧接触。如此，可以确保对发光结构形成有效的封装防护。进一步优选的，如图5至图8所示，第一封装部21a与防护结构14背离基板10的一侧接触。也即，本实施例中，第一封装部21a的位于防护结构14背离基板10的一侧的部分也被保留。如此，可以进一步确保对发光结构形成有效的封装防护。
一些实施例中优选的，继续参照图5至图8，封装层还包括第二封装层22，第二封装层22位于第一封装层21背离基板10的一侧，且同时设置于发光区AA1和透光区AA2，并覆盖防护结构14。也即，为了进一步地提高封装可靠性，如图10中的(c)所示，可以在对第一电极层11进行刻蚀后，在第一封装层21以及防护结构14背离基板10的一侧，形成连续的第二封装层22，从而实现多重封装保护。其中，第二封装层22也可以采用CVD工艺形成。优选的，第二封装层22为无机材料。
需要说明的是，若将本申请各实施例的改进方案应用到采用UDC技术的显示面板或显示装置中，则透光区AA2可以仅与摄像头对应的一部分显示区对应，也即可以仅对与摄像头对应的一部分显示区的第一电极层11进行图形化，使其包括多个第一电极11a，以提高该部分显示区的光线透过率，而其余显示区可不进行调整，保持原有的结构即可。当然，另一些实施方案中，也可以对采用UDC技术的显示面板的整个显示区的第一电极层11都进行图形化，本申请对此不进行限制。
此外，若将本申请各实施例的方案应用到透明屏或拉伸屏中时，则可以对显示面板的整个显示区的第一电极层11都进行图形化，使得整个显示区的光线透过率都增加。
此外，一些实施例中，绝缘层位于透光区AA2的部分开设有绝缘开口173。继续参照图8，图8所示的显示面板结构中，第一绝缘层15位于透光区AA2的部分开设有绝缘开口173。也即，在对阴极进行图形化时，除了去除了透光区AA2的一部分第一封装层21和一部分第一电极层11的材料之外，还将透光区AA2的一部分第一绝缘层15进行去除，使得第一绝缘层15位于透光区AA2的部分形成绝缘开口173。如此设置，该区域由于没有第一绝缘层15对光线进行反射和折射，因此可以进一步提高光线透过率。另外，可以理解的是，另一些实施例中，在刻蚀去除透光区AA2的第一绝缘层15时，可以进一步将第一绝缘层15下方的膜层也刻蚀去除一部分，从而进一步提高光线透过率。不过，刻蚀去除的膜层越多，则对刻蚀工艺的要求越高，步骤越复杂，难度越大，因此具体实施时可以根据实际需要进行合理选择。
此外，需要说明的是，显示面板除了上述各实施例提及的结构外，还包括实现其功能所必须的其他结构，但本申请可不对这些结构进行改进，因此不再进行一一说明。
此外，参照图11、图12和图13，图11和图12分别为本申请其他实施例提供的显示面板的俯视结构示意图，图13为本申请另一个实施例提供的显示面板的剖面结构示意图，其中，图13对应的剖面位置为图11中的剖面线CC′或者为图12中的剖面线DD′。如图11至图13所示，本实施例中，显示面板包括：基板10、防护结构14、发光层12、第一电极层11和第二电极层13。
其中，防护结构14设置于基板10一侧，防护结构14围合形成防护开口P。
第一电极层11设置于发光层12背离基板10的一侧，第一电极层11设有第一电极开口Q，第一电极开口Q在基板10上的正投影位于防护开口P在基板10上的正投影范围内，且与发光单元12a在基板10上的正投影错开。
首先需要说明的是，本实施例中的基板10、防护结构14、发光层12、第一电极层11和第二电极层13与前述实施例中的相同结构一致，其功能和材料等不再赘述。
此外，第一电极开口Q也即第一电极层11被去除的部分，其对应的区域具有更高的光透过率。也即，通过防护结构14围合形成的防护开口P，可以分隔前述实施例中的发光区和透光区。其中，第一电极开口Q位于透光区，发光单元12a位于发光区。
进一步地，一些实施例中，第一电极层11包括多个间隔设置的第一电极11a以及电连接相邻第一电极11a的连接线11b，其中，第一电极11a在基板10上的正投影和第一电极开口Q在基板10上的正投影错开。也即，第一电极层11的除第一电极开口Q之外的部分形成第一电极11a。
优选的，连接线11b在基板10上的正投影与第一电极开口Q在基板10的正投影错开。也即，连接线11b不从第一电极开口Q的区域走线，如此可以避免连接线11b影响光透过率。进一步地，一些实施例中，优选的，第一电极11a和连接线11b同层设置。
具体地，连接线11b的作用和结构等与前述实施例一致，用于将相互间隔设置的第一电极11a电连接，以保证各个第一电极11a都能够正常工作，也即正常接收电源信号(ELVSS)。
此外，一些实施例中，发光层12和基板10之间包括至少一层导电层，导电层与第一电极层11之间至少设有至少一层绝缘层。其中，这些导电层用于形成电极、走线或者连接层等结构，比如，这些导电层可以用于形成电源走线、信号走线、电容极板、薄膜晶体管的源漏电极以及阳极，等等。导电层与第一电极层11之间的绝缘层用于使得导电层与第一电极层11之间相互绝缘。这些绝缘层比如可以包括像素定义层、平坦化层以及薄膜晶体管的源漏极与栅极之间的绝缘层，等等。
优选的，导电层包括导电部，导电部在基板10的正投影与第一电极开口Q在基板10的正投影错开。比如，这些导电部可以是上述的走线或者电极等。也即，导电部不从第一电极开口Q所在区域的对应位置穿过，如此可以避免导电部影响该区域的光透过率。
优选的，防护结构14位于绝缘层背离基板10的一侧。比如，当绝缘层包括前述实施例中的像素定义层时，防护结构14可以位于像素定义层背离基板10的一侧。
优选的，绝缘层上开设有绝缘孔，防护结构14至少部分设置绝缘孔内。其中，该绝缘孔可以是前述实施例中开设在第一绝缘层的第一绝缘孔，以及开设在第二绝缘层的第二绝缘孔等。
优选的，绝缘孔在基板10上的正投影呈环状。如此，设置在环状绝缘孔中的防护结构14也成环状设置。优选的，绝缘孔为通孔或者盲孔。具体可以根据实际需要进行设计。
此外，一些实施例中，绝缘层包括绝缘开口，绝缘开口在基板10上的正投影位于防护开口P在基板10的正投影范围内。该绝缘开口也即在对第一电极层11进行刻蚀以得到第一电极开口Q时，将第一电极开口Q与基板10之间的部分绝缘层也进行刻蚀去除后得到，通过设置该绝缘开口，可以提高该区域的光透过率。
此外，一些实施例中，防护结构14包括靠近基板10的第一表面和远离基板10的第二表面，第一表面在基板10的正投影位于第二表面在基板10的正投影范围内。如此，可以在形成第一电极层11时，更好地保证第一电极层11在防护结构14处断开。
此外，一些实施例中，显示面板还包括封装层，封装层位于发光层背离基板10的一侧，用于对发光层等膜层构成的发光结构进行封装防护，避免水氧入侵导致发光结构失效。
具体地，上述各实施例中的连接线、导电层、绝缘层以及封装层等结构或膜层的具体结构等与前述实施例一致，可以参照前述实施例中的相应内容，此处不再进行详述。
参照图14，本申请实施例还提供了一种显示装置，该显示装置包括以上任一实施例所述的显示面板。其中，该显示装置可以为智能手机、平板电脑或者笔记本电脑等。
由于该显示装置包含以上任一实施例所述的显示面板，因此具有相应的优点，此处不再赘述。
进一步地，一些实施例中，显示装置还包括感光元件，感光元件位于基板背离发光层的一侧。其中，感光元件比如可以是摄像头。
本文参照作为理想化示例性附图的平面图描述了示例性实施方式。在附图中，为了清楚，放大了区域的大小。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。

Claims (22)

  1. 一种显示面板，其特征在于，划分为发光区和透光区，所述发光区和所述透光区相邻设置，
    所述显示面板包括：
    基板；
    防护结构，设置于所述基板上，且设置于所述发光区和所述透光区之间；
    发光层，与所述防护结构位于所述基板的同一侧，所述发光层包括发光单元，所述发光单元设置于所述发光区；
    第一电极层，位于所述发光层背离所述基板的一侧，所述第一电极层包括第一电极，设置于所述发光区。
  2. 根据权利要求1所述的显示面板，其特征在于，所述防护结构围绕所述发光区设置。
  3. 根据权利要求1所述的显示面板，其特征在于，所述防护结构围绕所述透光区设置，所述第一电极层还包括第一电极开口，所述第一电极开口位于所述透光区。
  4. 根据权利要求1至3中任一项所述的显示面板，其特征在于，所述显示面板包括多个间隔设置的所述发光区，所述第一电极层包括多个间隔设置的所述第一电极，所述第一电极与所述发光区对应设置。
  5. 根据权利要求4所述的显示面板，其特征在于，所述显示面板还包括连接线，所述连接线电连接相邻所述发光区对应的所述第一电极。
  6. 根据权利要求5所述的显示面板，其特征在于，所述连接线与所述第一电极同层设置；
    或者，所述发光层和所述基板之间包括至少一层导电层，所述连接线与所述至少一层导电层中任意一层导电层同层设置。
  7. 根据权利要求6所述的显示面板，其特征在于，所述导电层与所述第一电极层之间设有至少一层绝缘层，所述防护结构设置于所述至少一层绝缘层背离所述基板的一侧，
    或者，所述导电层与所述第一电极层之间设有至少一层绝缘层，所述至少一层绝缘层中的至少一层设有绝缘孔，所述防护结构至少部分位于所述绝缘孔内。
  8. 根据权利要求7所述的显示面板，其特征在于，所述至少一层导电层包括第二电极层，所述第二电极层包括第二电极，所述第二电极位于所述发光单元朝向所述基板的一侧，所述连接线与所述第二电极同层设置。
  9. 根据权利要求7所述的显示面板，其特征在于，所述至少一层绝缘层包括第一绝缘层，所述第一绝缘层包括像素定义部和所述像素定义部围合形成的像素开口，所述发光单元设置于所述像素开口内，所述第一电极位于所述像素开口内并延伸至所述像素定义部背离所述基板的一侧，所述防护结构位于所述像素定义部背离所述基板的一侧；
    或者，所述至少一层绝缘层包括第一绝缘层，所述第一绝缘层包括像素定义部和所述像素定义部围合形成的像素开口，所述发光单元设置于所述像素开口内，所述第一电极位于所述像素开口内并延伸至所述像素定义部背离所述基板的一侧，所述像素定义部设有第一绝缘孔，所述防护结构至少部分位于所述第一绝缘孔内。
  10. 根据权利要求9所述的显示面板，其特征在于，所述至少一层导电层包括第二电极层，所述第二电极层包括第二电极，所述第二电极位于所述发光单元朝向所述基板的一侧；
    所述至少一层导电层还包括第一金属层，所述第一金属层位于所述第二电极层朝向所述基板的一侧，所述第一金属层设有薄膜晶体管的源极和漏极，所述连接线与所述第一金属层同层设置。
  11. 根据权利要求10所述的显示面板，其特征在于，所述至少一层绝缘层还包括第二绝缘层，所述第二绝缘层位于所述第二电极层朝向所述第一金属层的一侧，
    其中，所述防护结构位于所述第二绝缘层背离所述基板的一侧，或者，所述第二绝缘层设有第二绝缘孔，所述防护结构至少部分位于所述第二绝缘孔内，所述第一绝缘孔在所述基板上的正投影与所述第二绝缘孔在所述基板上的正投影重合。
  12. 根据权利要求7至11中任一项所述的显示面板，其特征在于，所述至少一层绝缘层位于所述透光区的部分开设有绝缘开口。
  13. 根据权利要求7至12中任一项所述的显示面板，其特征在于，
    所述防护结构为导电结构，所述第一电极还延伸至所述绝缘孔内与所述防护结构搭接，所述第一电极通过所述防护结构与所述连接线电连接。
  14. 根据权利要求7至12中任一项所述的显示面板，其特征在于，所述至少一层绝缘层设有贯穿所述至少一层绝缘层的连接孔，所述第一电极通过所述连接孔与所述连接线电连接。
  15. 根据权利要求14所述的显示面板，其特征在于，所述第一电极还延伸至所述绝缘孔内，与所述连接线通过所述连接孔电连接。
  16. 根据权利要求1至15中任一项所述的显示面板，其特征在于，所述防护结构包括靠近所述基板的第一表面和远离所述基板的第二表面，所述第一表面在所述基板的正投影位于所述第二表面在所述基板的正投影范围内。
  17. 根据权利要求1至16中任一项所述的显示面板，其特征在于，还包括封装层，位于所述发光层背离所述基板的一侧，所述封装层包括第一封装层，所述第一封装层包括第一封装部，至少所述第一封装部设置于所述发光区，且和所述防护结构接触，所述封装层还包括第二封装层，所述第二封装层位于所述第一封装层背离所述基板的一侧，且同时设置于所述发光区和所述透光区，并覆盖所述防护结构。
  18. 根据权利要求17所述的显示面板，其特征在于，所述第一封装层还包括封装开口，所述封装开口设置于所述透光区，所述第一封装部与所述防护结构朝向所述发光区的一侧接触，所述第一封装部与所述防护结构背离所述基板的一侧接触。
  19. 一种显示面板，其特征在于，包括：
    基板；
    防护结构，设置于所述基板一侧，所述防护结构围合形成防护开口；
    发光层，与所述防护结构位于所述基板的同一侧，所述发光层包括发光单元；
    第一电极层，设置于所述发光层背离所述基板的一侧，所述第一电极层设有第一电极开口，所述第一电极开口在所述基板上的正投影位于所述防护开口在所述基板上的正投影范围内，且与所述发光单元在所述基板上的正投影错开。
  20. 根据权利要求19所述的显示面板，其特征在于，所述第一电极层包括多个间隔设置的第一电极以及电连接相邻所述第一电极的连接线，其中，所述第一电极在所述基板上的正投影和所述第一电极开口在所述基板上的正投影错开。
  21. 根据权利要求20所述的显示面板，其特征在于，所述连接线在所述基板上的正投影与所述第一电极开口在所述基板的正投影错开。
  22. 一种显示装置，其特征在于，包括如权利要求1至21任意一项所述的显示面板。
PCT/CN2023/136863 2023-06-16 2023-12-06 显示面板及显示装置 Ceased WO2024255155A1 (zh)

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CN116723741A (zh) * 2023-06-16 2023-09-08 云谷（固安）科技有限公司 显示面板及显示装置
CN119012824B (zh) * 2024-07-23 2026-02-06 合肥维信诺科技有限公司 显示面板、显示面板的制备方法及显示设备
CN119855442A (zh) * 2025-01-02 2025-04-18 京东方科技集团股份有限公司 显示基板和显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140042301A (ko) * 2012-09-28 2014-04-07 엘지디스플레이 주식회사 유기전기발광소자용 어레이 기판 및 그의 제조 방법
CN106601768A (zh) * 2016-12-22 2017-04-26 Tcl集团股份有限公司 透明显示装置及其制备方法
CN108231826A (zh) * 2016-12-22 2018-06-29 乐金显示有限公司 显示设备
CN114649367A (zh) * 2020-12-18 2022-06-21 乐金显示有限公司 显示装置
CN116723741A (zh) * 2023-06-16 2023-09-08 云谷（固安）科技有限公司 显示面板及显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140042301A (ko) * 2012-09-28 2014-04-07 엘지디스플레이 주식회사 유기전기발광소자용 어레이 기판 및 그의 제조 방법
CN106601768A (zh) * 2016-12-22 2017-04-26 Tcl集团股份有限公司 透明显示装置及其制备方法
CN108231826A (zh) * 2016-12-22 2018-06-29 乐金显示有限公司 显示设备
CN114649367A (zh) * 2020-12-18 2022-06-21 乐金显示有限公司 显示装置
CN116723741A (zh) * 2023-06-16 2023-09-08 云谷（固安）科技有限公司 显示面板及显示装置

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