WO2024254981A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2024254981A1
WO2024254981A1 PCT/CN2023/113808 CN2023113808W WO2024254981A1 WO 2024254981 A1 WO2024254981 A1 WO 2024254981A1 CN 2023113808 W CN2023113808 W CN 2023113808W WO 2024254981 A1 WO2024254981 A1 WO 2024254981A1
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WO
WIPO (PCT)
Prior art keywords
array substrate
display panel
connecting metal
substrate
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/113808
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English (en)
French (fr)
Inventor
潘海龙
查国伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
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Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Publication of WO2024254981A1 publication Critical patent/WO2024254981A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels

Definitions

  • the present application relates to the technical field of display panel manufacturing, and in particular to a display panel and a display device.
  • the market has increasingly narrowed the borders of display panels.
  • the borders of the non-display area of the display panel By reducing the borders of the non-display area of the display panel to increase the screen-to-body ratio of the display panel, the display effect is improved.
  • the width of the border area of the panel is usually reduced by changing the binding structure of the display panel, thereby achieving a narrow border.
  • the flexible chip (COF) technology uses COF technology to meet the needs of small-size electronic products.
  • the control chip IC is fixed on a flexible circuit board and the side binding method is used to reduce the border width of the binding area.
  • the binding metal traces set on the side are not reasonably designed when connected to the binding terminal, and the contact area between the two is small.
  • the binding metal traces are set on the side of the panel, their thickness is relatively thin. The contact area between the thinner binding metal traces and the binding terminals will be further reduced, resulting in poor contact between the side binding traces and the binding terminals, poor conductivity, and is not conducive to further improvement and improvement of the comprehensive performance of the display panel.
  • the structure of the binding metal traces in the frame area of the display panel and the contact effect between them are not ideal, which is not conducive to further improving the comprehensive performance of the narrow-frame display panel.
  • the embodiments of the present application provide a display panel and a display device to effectively improve the existing narrow-frame display panel frame area, where the structural design and contact effect between the binding metal traces are not ideal, thereby reducing the quality and overall performance of the display panel.
  • a display panel including:
  • a color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate;
  • binding terminals at least part of which is arranged in a region of the array substrate protruding from the color filter substrate;
  • the edge of the array substrate on the side where the binding terminal is provided is provided with a chamfer structure, one end of the connecting metal wire covers part of the surface of the binding terminal on the side opposite to the color filter substrate, and the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate;
  • the plurality of binding terminals are arranged at intervals, and each of the connecting metal wires is correspondingly arranged above each of the binding terminals and symmetrically arranged relative to the central axis of the binding terminal.
  • the display panel includes a display area and a non-display area arranged on one side of the display area;
  • the array substrate further comprises a protrusion arranged in the non-display area, the binding terminal is arranged on a surface of the protrusion facing the color film substrate, and an overlapping area between the connecting metal wire and the binding terminal is at least one third of an area of the binding terminal.
  • the display panel also includes a sealant, which is correspondingly arranged between the color film substrate and the array substrate, the sealant covers a portion of the binding terminals, and the edge of the sealant away from the display area is flush with the edge of the color film substrate.
  • the length of the protrusion is set to 20um ⁇ 35um.
  • the connecting metal wire includes a first connecting portion, a second connecting portion and a third connecting portion
  • the first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface in the thickness direction of the first substrate.
  • the thickness of the second connection portion is greater than the film thickness of the third connection portion.
  • the first substrate includes a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected through the chamfer structure, and the first bonding surface faces the second substrate;
  • the curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface.
  • a plurality of grooves are further arranged on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly arranged in each of the grooves.
  • the driving chip is arranged on a side surface of the flexible circuit board close to the first substrate, and one end of the flexible circuit board is electrically attached to the connecting metal wire on the side surface of the first substrate, and the other end of the flexible circuit board is electrically connected to the driving chip.
  • a display panel including:
  • a color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate;
  • binding terminals at least part of which is arranged in a region of the array substrate protruding from the color filter substrate;
  • the edge of the array substrate on one side of the binding terminal is provided with a chamfer structure
  • one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate
  • the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate.
  • the display panel includes a display area and a non-display area arranged on one side of the display area;
  • the array substrate further comprises a protrusion arranged in the non-display area, the binding terminal is arranged on a surface of the protrusion facing the color film substrate, and an overlapping area between the connecting metal wire and the binding terminal is at least one third of an area of the binding terminal.
  • the length of the protrusion is set to 20um ⁇ 35um.
  • the connecting metal wire includes a first connecting portion, a second connecting portion and a third connecting portion
  • the first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface in the thickness direction of the first substrate.
  • the thickness of the second connection portion is greater than the film thickness of the third connection portion.
  • the first substrate includes a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected through the chamfer structure, and the first bonding surface faces the second substrate;
  • the curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface.
  • a plurality of grooves are further arranged on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly arranged in each of the grooves.
  • the display panel further includes a flexible circuit board and a driving chip
  • the driving chip is arranged on a side surface of the flexible circuit board close to the first substrate, and one end of the flexible circuit board is electrically attached to the connecting metal wire on the side surface of the first substrate, and the other end of the flexible circuit board is electrically connected to the driving chip.
  • a color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate;
  • binding terminals at least part of which is arranged in a region of the array substrate protruding from the color filter substrate;
  • the edge of the array substrate on one side of the binding terminal is provided with a chamfer structure
  • one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate
  • the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate.
  • the connecting metal wire includes a first connecting portion, a second connecting portion and a third connecting portion
  • the first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface of the array substrate in the thickness direction.
  • the embodiment of the present application provides a display panel and a display device.
  • the display panel includes a first substrate, a second substrate arranged in a box with the first substrate, a binding terminal and a connecting metal wire.
  • a chamfered structure is arranged at the edge of the first substrate close to the binding terminal, one end of the connecting metal wire at least covers a portion of the binding terminal, and the other end of the connecting metal wire is bent relative to the chamfered structure and attached to a side surface of the first substrate.
  • a chamfered structure is arranged at the edge of the first substrate, and the connecting metal wire is directly electrically connected to the surface of the binding terminal, thereby ensuring the contact effect between the connecting metal wire and the binding terminal.
  • the chamfered structure effectively improves the bending effect of the connecting metal wire, and ensures the transfer stress and connection quality of the connecting metal wire, thereby effectively improving the quality and comprehensive performance of the narrow-frame display panel.
  • FIG1 is a schematic diagram of the structure of a display panel provided in the prior art
  • FIG2 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application.
  • FIG3 is a schematic plan view of a portion of the connection between the binding terminal and the connecting metal wire in the non-display area provided in an embodiment of the present application;
  • 4 to 8 are film layer structure diagrams corresponding to the manufacturing process of the display panel provided in the embodiments of the present application.
  • FIG12 is a schematic diagram of a film layer structure of another display panel provided in an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a film layer structure of another display panel provided in an embodiment of the present application.
  • the connecting metal wire 104 ′ is usually provided on one side of the array substrate 101 ′ and the color film substrate 102 ′, so that the side of the binding terminal 103 ′ is in contact with the side of the connecting metal wire 104 and is electrically connected, and the height of the contact area between the two is only about 0.7 um, and the contact area is small, and poor connection is likely to occur, which in turn leads to failure of the panel, which is not conducive to further improvement of the comprehensive performance of the panel.
  • the embodiments of the present application provide a display panel and a display device to effectively realize a narrow frame design of the display panel and effectively improve the electrical connection effect of the metal wiring in the binding area.
  • Fig. 2 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application.
  • the display panel includes a first substrate, a second substrate, a binding terminal 103, and a connecting metal wire 104.
  • the first substrate is an array substrate 101
  • the second substrate is a color filter substrate 102
  • the array substrate 101 is disposed on one side of the color filter substrate 102, such as the array substrate 101 and the color filter substrate 102 are arranged in a box.
  • the display panel may also include a display area 20 , a non-display area 21 , a frame glue 105 , and a sealant 106 .
  • the non-display area 21 of the display panel is arranged on at least one side of the display area 20.
  • the non-display area 21 may be arranged around the display area 20.
  • the non-display area 21 may be a frame area or a binding area of the display panel.
  • the frame glue 105 is provided at a corresponding position between the array substrate 101 and the color filter substrate 102. If the frame glue 105 is provided on a side close to the edge of the color filter substrate 102, the frame glue 105 is used to seal and support the array substrate 101 and the color filter substrate 102, thereby ensuring the lamination effect of other film layers between the array substrate and the color filter substrate.
  • the frame glue 105 and the sealant 106 are both arranged between the array substrate and the color filter substrate, and the sealant 106 is arranged on a side of the frame glue 105 away from the display area 20 and is adjacent to the frame glue 105.
  • the sealant covers part of the binding terminal, and the edge of the side of the sealant 106 away from the display area can be flush with the edge of the color filter substrate 102, thereby ensuring the sealing effect of the display panel and preventing external water vapor and other substances from entering the display panel.
  • the length of the array substrate 101 may be greater than the length of the color filter substrate 102.
  • the length of the array substrate 101 on the right side protrudes beyond the edge of the color filter substrate, that is, the length of the right side of the array substrate is greater than the length of the color filter substrate 102.
  • the binding terminal 103 of the display panel is arranged on the array substrate.
  • the binding terminal 103 is at least partially arranged in the non-display area 21.
  • the binding terminal 103 is arranged on the surface of the array substrate 101 facing the color filter substrate 102. And it is electrically connected to the wiring in the array substrate 101 to realize the transmission of the control signal.
  • the array substrate 101 when the array substrate 101 is provided, the array substrate 101 further includes a protrusion 204.
  • the protrusion 204 is provided in the non-display area 21, and the protrusion 204 protrudes from the edge of the color filter substrate 102.
  • the length of the array substrate 101 is greater than the length of the color filter substrate 102.
  • the binding terminal 103 is correspondingly arranged on the protruding portion 204, for example, the binding terminal 103 is arranged on the surface of the array substrate 101 facing the color filter substrate 102.
  • the edge of the binding terminal 103 close to the display area 20 can abut against the sealant 106, and at the same time, the edge of the binding terminal 103 away from the display area 20 extends toward the edge of the array substrate 101, thereby forming a binding terminal with a certain length on the array substrate 101.
  • the length of the protrusion 204 is set to D1.
  • the length D1 of the protrusion 204 can be set to 20um ⁇ 35um.
  • the length D1 of the protrusion 204 is set to 28um, thereby effectively increasing the area of the binding terminal 103 and ensuring its contact effect.
  • the connecting metal wire 104 when the connecting metal wire 104 is provided, the connecting metal wire 104 is electrically connected to the binding terminal 103. Specifically, the connecting metal wire 104 is provided on a side close to the edge of the array substrate 101. Since the non-display area is mainly the binding area of the display panel, the binding of the display panel and the transmission of the control signal in the display area of the display panel are realized through the binding terminal 103 and the connecting metal wire 104. At the same time, in order to achieve the effect of a narrow frame, the connecting metal wire 104 is fitted with the side of the array substrate 101 to reduce the frame width of the display panel as much as possible, thereby reducing the width of the frame while ensuring the connection effect of the connecting metal wire 104.
  • one end of the connecting metal wire 104 at least covers a portion of the binding terminal 103, and the other end of the connecting metal wire 104 extends to the second bonding surface 303 of the array substrate 101, fits tightly with the second bonding surface 303, and continues to extend downward and bind.
  • the projection of the connecting metal wire lapped on the binding terminal on the array substrate is located within the projection area of the binding terminal on the array substrate.
  • the area covered by the connecting metal wire 104 and the binding terminal 103 is at least one-third of the total area of the binding terminal 103.
  • the area covered by the connecting metal wire 104 is half of the total surface area of the binding terminal 103, so that the contact effect between the two different metal layers can be effectively increased, and the performance of the panel can be effectively improved.
  • the display panel when the display panel is set, the display panel further includes a chamfer structure 333.
  • the chamfer structure 333 is set on one side edge of the array substrate 101, such as the chamfer structure 333 is set on one side edge of the protrusion 204 in the non-display area.
  • the chamfer structure 333 is set between the upper surface of the array substrate 101 and the second bonding surface 303 of the array substrate 101.
  • the chamfer structure 333 is used to achieve a smooth transition between the array substrate 101 and the second bonding surface 303, thereby improving the connection effect between different film layers.
  • the second bonding surface 303 is mainly a side surface of the array substrate 101 in the thickness direction, and the second bonding surface 303 is mainly used to bind and bond the connecting metal wires 104 .
  • connection metal wire 104 may further include a first connection portion 4011, a second connection portion 4012 and a third connection portion 4013.
  • the first connection portion 4011 is provided on a side close to the display area 20
  • the third connection portion 4013 is provided on a side away from the display area, and the first connection portion 4011 and the third connection portion 4013 are connected through the second connection portion 4012, and finally form the connection metal wire 104 provided in the embodiment of the present application.
  • the first connection portion 4011 is correspondingly arranged on the upper surface of the array substrate 101 and covers at least a portion of the binding terminal 103.
  • the second connection portion 4012 is correspondingly arranged at the chamfer structure 333 and fits with the surface of the chamfer structure 333.
  • the third connection portion 4013 is arranged on the second fitting surface 303 of the array substrate 101 and fits tightly.
  • the chamfer structure can smoothly transition the connection metal wire 104 at the bending area, thereby reducing the bending stress of the connection metal wire 104.
  • the curved surface of the chamfer structure can further reduce the width of the frame corresponding to the area, thereby realizing a narrow frame.
  • the connecting metal wire 104 since the connecting metal wire 104 is electrically connected to the binding terminal 103, the connecting metal wire 104 can transmit the control signal on the array substrate, and there is a large coverage area between the binding terminal 103 and the connecting metal wire 104. At the same time, the connecting metal wire 104 has a smooth transition at the chamfer structure, thereby effectively ensuring the contact effect between different metal wires in the border area, and effectively reducing the stress of the connecting metal wire, thereby improving the overall performance of the display panel.
  • the film thickness of the second connecting part 4012 can be greater than the film thickness of the third connecting part 4013.
  • the film thickness of the third connecting part 4013 can be greater than the film thickness of the first connecting part 4011.
  • the chamfer structure 333 when the chamfer structure 333 is set, the chamfer structure 333 can be set as an arc transition surface or a circular transition surface, such as a rounded structure, or set as other structures according to the requirements of different products and processes. It will not be repeated here.
  • the structure of the chamfer structure 333 on different bonding surfaces is described by taking the arc transition surface as an example.
  • the side of the array substrate 101 facing the color filter substrate is a first bonding surface, and the first bonding surface is connected to the second bonding surface 303 through the chamfer structure 333, wherein the curvature between the chamfer structure 333 and the first bonding surface is smaller than the curvature between the chamfer structure and the second bonding surface.
  • the curvature of the chamfer structure 333 can be set to 0.1um -1 ⁇ 0.4um -1 .
  • the curvature of the chamfer structure 333 at the first bonding surface is set to 0.1um-1
  • the curvature at the second bonding surface is set to 0.3um -1 , so that the bonding surfaces at two different positions are set to different curvatures, so as to effectively ensure the bonding effect of the connecting metal wire 104, and reduce the stress problem generated inside the wiring after bonding, thereby improving its quality.
  • FIG3 is a partial plan view of the connection between the binding terminal 103 and the connecting metal wire 104 in the non-display area provided in the embodiment of the present application.
  • a plurality of binding terminals 103 can be arranged at intervals.
  • each binding terminal 103 is arranged at equal intervals on the surface of the array substrate.
  • each connection metal wire 104 is correspondingly arranged above each binding terminal 103.
  • the connection metal wire 104 can be symmetrically arranged relative to the central axis of the binding terminal 103, thereby ensuring the consistency and stability of signal transmission.
  • a plurality of grooves 456 may be provided on the surface of the chamfered structure 333 , and each groove 456 corresponds to each connecting metal wire 104 , that is, the extending direction of the groove 456 is the same as the bending direction of the connecting metal wire 104 , so that the connecting metal wire 104 may be fitted in the groove 456 , and the connecting metal wire 104 may be positioned by the groove 456 , thereby ensuring the reliability and comprehensive performance of the display panel.
  • FIG. 12 is a schematic diagram of the film structure of another display panel provided in an embodiment of the present application.
  • the display panel further includes a protective layer 888.
  • the protective layer 888 when the protective layer 888 is provided, at least part of the protective layer 888 is provided correspondingly on the binding terminal 103 between the connecting metal wire 104 and the color film substrate 102.
  • the protective layer 888 covers part of the binding terminal 103.
  • one end of the protective layer 888 abuts against the color film substrate 102, and the other end of the protective layer 888 covers the connecting metal wire 104.
  • the protective layer 888 can protect part of the connecting metal wire 104 and part of the binding terminal 103. At the same time, since the protective layer 888 covers one end of the connecting metal wire 104, the connecting metal wire 104 can be better protected, and the connecting metal wire 104 can be prevented from warping and other quality problems during the binding or bending process.
  • the thickness of the protective layer 888 may be greater than the thickness of the sealant 106.
  • the protective layer 888 may further seal the color filter substrate and the array substrate 101, thereby effectively preventing external impurities such as water vapor from entering the interior of the panel.
  • FIG. 13 is a schematic diagram of a film structure of another display panel provided in an embodiment of the present application.
  • one end of the protective layer 888 may also be attached to the side of the color filter substrate 102, and the other end of the protective layer 888 extends to one side of the connecting metal wire.
  • a certain gap is retained between the other end of the protective layer 888 and the connecting metal wire 104, or the connecting metal wire 104 is directly covered, and the details are not repeated here.
  • the protective layer 888 since the protective layer 888 is attached to the side of the color film substrate 102 and bent to the surface of the binding terminal 103, the protective layer 888 forms an angle structure, which can well seal the panel, thereby improving its protective effect on the panel.
  • a micro-bump 666 is further provided on the surface of the binding terminal 103 away from the color film substrate 102.
  • the micro-bump 666 can be provided as a convex-concave structure, and correspondingly, a concave or convex structure matching the convex or concave structure is provided on the connecting metal wire 104, and the two are matched and matched with each other, so that the contact area between the connecting metal wire 104 and the binding terminal 103 is effectively increased through the micro-bump 666, thereby further improving the connection effect between the binding terminal and the connecting metal wire, and ensuring the reliability and comprehensive performance of the display panel.
  • the display panel further includes a flexible circuit board 401 and a driving chip 402. Specifically, one end of the flexible circuit board 401 is electrically connected to the third connecting portion of the connecting metal wire 104, and the other end of the flexible circuit board 401 is electrically connected to the driving chip 402, thereby forming a side binding structure, and the transmission of the control signal is realized through the flexible circuit board and the corresponding connecting metal wire.
  • FIGS. 4-8 are film layer structure diagrams corresponding to the preparation process of the display panel provided in an embodiment of the present application.
  • the array substrate 101 and the color filter substrate 102 are paired to form a box, they are cut in an offset manner. Specifically, the color filter substrate 102 is cut in the non-display area. In the embodiment of the present application, the cutting position is outside the frame glue 105. After the cutting is completed, the excess color filter substrate is removed to form a step structure. At this time, outside the frame glue 105, that is, in the non-display area, the binding terminal 103 is exposed.
  • the sealant 106 is set. At this time, the sealant 106 is set on the side of the frame glue 105 away from the display area, and the sealant 106 is in contact with the frame glue 105 and covers the binding terminals 103 in the corresponding area. In the embodiment of the present application, the sealant 106 is set to further improve the sealing effect and quality of the display panel.
  • the sealant 106 is further processed, such as cutting and shaping the sealant 106. Specifically, since the shape and structure of the sealant 106 are not ideal when it is applied, the excess sealant 106 can be cut and removed by laser cutting process, thereby ensuring the structure of the sealant 106 and effectively avoiding the problem of mutual interference between the sealant 106 and other film layers. After the cutting is completed, the sealant 106 is flush with the side of the color filter substrate 102.
  • a chamfer structure 333 is set at the side position of the array substrate.
  • the binding terminal 103 is processed, and the redundant binding terminal 103 at the chamfer structure 333 can be removed.
  • the array substrate is further processed.
  • the chamfer structure 333 can be set to a fillet R.
  • the setting parameters of the chamfer structure 333 can be set according to the parameters provided in the embodiment of the present application. For example, the fillet radius of the chamfer structure 333 is set to 5um ⁇ 10um, or it is set according to the requirements of different products. In this way, by setting the chamfer structure 333 and processing the binding terminal 103, the foundation is laid for the subsequent setting of other routings.
  • connection metal wire 104 is prepared at the corresponding position of the non-display area.
  • a coating process can also be used for preparation, so as to further improve its preparation efficiency and precision.
  • Figures 9-11 Figures 9 to 11 are the corresponding structures of the connecting metal wire provided in the embodiment of the present application in the coating process.
  • a protective film 666 is set on the display panel.
  • the protective film 666 is set on the upper surface of the color filter substrate 102 and the upper surface of the binding terminal 103. The protective film 666 is used to protect them and prevent other structures from being formed on unnecessary film layers.
  • the materials selected in the coating are mainly metal materials such as Cu, Al, TiAlTi, etc., and the metal wiring of the specified structure and shape size is formed by coating.
  • the chamfered structure 333 and the second bonding surface 303 and the first bonding surface 302 of the array substrate 101 are coated, and finally the connecting metal wire 104 in the embodiment of the present application is formed.
  • the connecting metal wire of the required structure is directly deposited at the corresponding position, thereby effectively improving the preparation process of the display panel, improving the preparation efficiency and the quality and comprehensive performance of the film layer.
  • the protective film 666 is removed, and the binding terminal 103 and the connecting metal wire 104 are further processed.
  • the binding terminal and the connecting metal wire 104 are processed by a laser process, and different connecting terminals and corresponding binding structures are formed by laser.
  • a one-to-one binding and connection structure between the binding terminal 103 and the connecting metal wire 104 provided in the embodiment of the present application is formed.
  • the preparation efficiency is effectively improved, and the preparation accuracy of the above process is higher, thereby effectively ensuring the preparation accuracy and connection effect between the film layers.
  • a display device is provided in an embodiment of the present application, which includes the display panel in the embodiment of the present application, and when preparing the display panel in the embodiment of the present application, the preparation process provided above is adopted, thereby effectively improving the preparation effect, while improving the binding structure of the display panel and improving the comprehensive performance of the display device.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

公开了一种显示面板及显示装置。显示面板包括阵列基板（101）、彩膜基板（102）、绑定端子（103）、连接金属线（104）及倒角结构（333），连接金属线（104）的一端至少覆盖部分绑定端子（103），连接金属线（104）的另一端相对该倒角结构（333）弯折，并贴设于阵列基板（101）的一侧侧面上。通过倒角结构（333），并使连接金属线（104）直接与绑定端子（103）的表面电性连接，从而提高窄边框面板的综合性能。

Description

显示面板及显示装置 技术领域
本申请涉及显示面板的制造技术领域，尤其涉及到一种显示面板及显示装置。
 背景技术
随着显示面板制备技术的不断发展，人们对显示面板及装置的各种性能均提出了更高的要求。
目前，市面上对显示面板的边框要求越来越窄，通过降低显示面板非显示区域的边框以提高显示面板的屏占比，从而提高其显示效果。传统的面板结构中，通常通过改变显示面板的绑定结构，以达到降低面板的边框区域的宽度，进而实现窄边框。如柔性芯片（chip on flexible，COF）技术，通过COF技术实现电子产品小尺寸化的需求，通过将控制芯片IC固定在柔性电路板上，并使用侧面绑定的方式，以缩小绑定区域的边框宽度。但是，在上述技术方案中，由于现有显示面板中预留的绑定区域的宽度一般较窄，侧面设置的绑定金属走线在与绑定端子进行连接时，结构设计不合理，两者之间的接触面积较小，且由于绑定金属走线设置在面板的侧面上，其厚度均较薄，较薄的绑定金属走线与绑定端子之间的接触面积会进一步减小，从而导致侧边的绑定进行走线与绑定端子之间接触效果较差，导电性较差，不利于显示面板综合性能的进一步提高及改善。
因此需要对现有技术中的问题提出解决方法。
 发明概述
综上所述，现有技术中在设置窄边框型显示面板时，显示面板边框区域处的绑定金属走线的结构以及相互之间的接触效果不理想，不利于窄边框显示面板综合性能的进一步提高。
为解决上述问题，本申请实施例提供一种显示面板及显示装置，以有效的改善现有的窄边框型显示面板边框区域处绑定金属走线之间结构设计以及接触效果不理想，进而降低显示面板的质量及综合性能的问题。
为解决上述技术问题，本申请实施例的第一方面，提供一种显示面板，包括：
阵列基板；
彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
连接金属线，所述连接金属线与所述绑定端子电性连接；
其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上；
多个所述绑定端子间隔设置，且每一所述连接金属线对应的设置在每一所述绑定端子上方并相对所述绑定端子的中轴线对称设置。
根据本申请一实施例，所述显示面板包括显示区域以及设置于所述显示区域一侧的非显示区域；
其中，所述阵列基板还包括设置在所述非显示区域内的突出部，所述绑定端子设置于所述突出部朝向所述彩膜基板的一侧表面，且所述连接金属线与所述绑定端子重叠的面积至少为所述绑定端子面积的三分之一。
根据本申请一实施例，所述显示面板还包括密封胶，所述密封胶对应设置在所述彩膜基板与所述阵列基板之间，所述密封胶覆盖部分所述绑定端子，且所述密封胶远离所述显示区域的一侧边缘与所述彩膜基板的边缘平齐。
根据本申请一实施例，所述突出部的长度设置为20um~35um。
根据本申请一实施例，所述连接金属线包括第一连接部、第二连接部以及第三连接部；
其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述第一基板厚度方向的侧面相贴合。
根据本申请一实施例，所述第二连接部的厚度大于所述第三连接部的膜层厚度。
根据本申请一实施例，所述第一基板包括第一贴合面以及第二贴合面，所述第一贴合面与所述第二贴合面通过所述倒角结构相连接，且所述第一贴合面朝向所述第二基板；
其中，所述倒角结构与所述第一贴合面之间的曲率小于所述倒角结构与所述第二贴合面之间的曲率。
根据本申请一实施例，所述倒角结构的表面上还设置有多个凹槽，所述凹槽的延伸方向与所述连接金属线的弯折方向相同，且每一所述连接金属线对应的设置在每一所述凹槽内。
根据本申请一实施例，所述显示面板还包括柔性电路板以及驱动芯片；
其中，所述驱动芯片设置在所述柔性电路板靠近所述第一基板的一侧面上，且所述柔性电路板的一端与所述第一基板侧面上的所述连接金属线电性贴合，所述柔性电路板的另一端与所述驱动芯片电性连接。
本申请本申请本申请实施例的第二方面，提供一种显示面板，包括：
阵列基板；
彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
连接金属线，所述连接金属线与所述绑定端子电性连接；
其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上。
根据本申请一实施例，所述显示面板包括显示区域以及设置于所述显示区域一侧的非显示区域；
其中，所述阵列基板还包括设置在所述非显示区域内的突出部，所述绑定端子设置于所述突出部朝向所述彩膜基板的一侧表面，且所述连接金属线与所述绑定端子重叠的面积至少为所述绑定端子面积的三分之一。
根据本申请一实施例，所述显示面板还包括密封胶，所述密封胶对应设置在所述彩膜基板与所述阵列基板之间，所述密封胶覆盖部分所述绑定端子，且所述密封胶远离所述显示区域的一侧边缘与所述彩膜基板的边缘平齐。
根据本申请一实施例，所述突出部的长度设置为20um~35um。
根据本申请一实施例，所述连接金属线包括第一连接部、第二连接部以及第三连接部；
其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述第一基板厚度方向的侧面相贴合。
根据本申请一实施例，所述第二连接部的厚度大于所述第三连接部的膜层厚度。
根据本申请一实施例，所述第一基板包括第一贴合面以及第二贴合面，所述第一贴合面与所述第二贴合面通过所述倒角结构相连接，且所述第一贴合面朝向所述第二基板；
其中，所述倒角结构与所述第一贴合面之间的曲率小于所述倒角结构与所述第二贴合面之间的曲率。
根据本申请一实施例，所述倒角结构的表面上还设置有多个凹槽，所述凹槽的延伸方向与所述连接金属线的弯折方向相同，且每一所述连接金属线对应的设置在每一所述凹槽内。
根据本申请一实施例，所述显示面板还包括柔性电路板以及驱动芯片；
其中，所述驱动芯片设置在所述柔性电路板靠近所述第一基板的一侧面上，且所述柔性电路板的一端与所述第一基板侧面上的所述连接金属线电性贴合，所述柔性电路板的另一端与所述驱动芯片电性连接。
根据本申请实施例的第三方面，还提供一种显示装置，所述显示装置包括本申请实施例中提供的显示面板，所述显示面板包括：
阵列基板；
彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
连接金属线，所述连接金属线与所述绑定端子电性连接；
其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上。
根据本申请一实施例，其中所述连接金属线包括第一连接部、第二连接部以及第三连接部；
其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述阵列基板厚度方向的侧面相贴合。
有益效果
综上所述，本申请实施例的有益效果为：
本申请实施例提供一种显示面板及显示装置。显示面板包括第一基板、与第一基板对盒设置的第二基板、绑定端子以及连接金属线。其中，在该第一基板靠近绑定端子一侧的边缘设置有倒角结构，该连接金属线的一端至少覆盖部分绑定端子，连接金属线的另一端相对该倒角结构弯折，并贴设于第一基板的一侧侧面上。本申请实施例中，通过在第一基板的边缘位置处设置倒角结构，并使连接金属线直接与绑定端子的表面电性连接，从而保证该连接金属线与绑定端子之间的接触效果，同时，通过倒角结构有效的提高了该连接金属线的弯折效果，并保证了该连接金属线的转接应力及连接质量，从而有效的提高了窄边框显示面板的质量及综合性能。
 附图说明
图1为现有技术中提供的显示面板的结构示意图；
图2为本申请实施例中提供的显示面板的结构示意图；
图3为本申请实施例中提供的该绑定端子与连接金属线在该非显示区域处的部分连接平面示意图；
图4~图8为本申请实施例中提供的显示面板的制备工艺对应的膜层结构图；
图9~图11为本申请实施例中提供的连接金属线在镀膜工艺中对应的结构；
图12为本申请实施例中提供的另一显示面板的膜层结构示意图；
图13为本申请实施例中提供的又一种显示面板的膜层结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本揭示可用以实施的特定实施例。
如图1所示，图1为现有技术中提供的显示面板的结构示意图。现有技术中，该阵列基板101’与彩膜基板102’对组成盒完成后，通常会在一侧的边缘进行切割，从而形成图1中的面板结构。在对该显示面板进行绑定时，通过设置在阵列基板101’一侧的绑定端子103’以及设置在侧边出的连接金属线104’。其中，该连接金属线104’通常设置在阵列基板101’以及彩膜基板102’的一侧侧面上，这样，绑定端子103’的侧面与该连接金属线104的侧面相接触并电连接，而两者的接触面积的高度仅有0.7um左右，接触面积较小，很容易出现连接不良，进而导致面板失效，不利于面板综合性能的进一步提高。
本申请实施例提供一种显示面板及显示装置，以有效的实现显示面板的窄边框设计，同时有效的提高绑定区域内金属走线的电性连接效果。
如图2所示，图2为本申请实施例中提供的显示面板的结构示意图。本申请实施例中，该显示面板包括第一基板、第二基板、以及绑定端子103、连接金属线104。
具体的，本申请实施例中，该第一基板以阵列基板101为例，同时，该第二基板以彩膜基板102为例进行说明。具体的，该阵列基板101设置在该彩膜基板102的一侧，如阵列基板101与彩膜基板102对盒设置。
进一步的，在设置本申请实施例中提供的显示面板时，该显示面板还可包括显示区域20、非显示区域21以及框胶105、密封胶106。
具体的，该显示面板的非显示区域21设置在显示区域20的至少一侧，如本申请实施例中，该非显示区域21可围绕该显示区域20进行设置。本申请实施例中，该非显示区域21可为显示面板的边框区域或者绑定区域，通过在该边框区域或绑定区域内设置其他绑定结构，如在该边框区域内设置金属走线，通过金属走线实现对显示区域内像素的控制，并驱动该显示面板的正常发光显示。
进一步的，在设置本申请实施例中的框胶105以及密封胶106时，该框胶105设置在阵列基板101与彩膜基板102之间对应位置处。如框胶105设置在靠近彩膜基板102边缘的一侧，通过该框胶105实现对阵列基板101与彩膜基板102的密封与支撑作用，从而保证阵列基板与彩膜基板之间的其他膜层的层叠效果。
具体的，该框胶105与密封胶106均设置在阵列基板与彩膜基板之间，且该密封胶106设置在框胶105远离显示区域20的一侧，并与该框胶105相邻。本申请实施例中，该密封胶覆盖部分绑定端子，且该密封胶106远离显示区域的一侧边缘可与彩膜基板102的边缘齐平，从而保证该显示面板的密封效果，并防止外界的水汽等物质进入到显示面板内。
本申请实施例中，在设置上述阵列基板101以及彩膜基板102时，该阵列基板101的长度可大于该彩膜基板102的长度。详见图1，该阵列基板101在右侧的长度突出于彩膜基板的边缘，即该阵列基板的右侧长度大于该彩膜基板102的长度。
进一步的，该显示面板的绑定端子103设置在该阵列基板上。其中，该绑定端子103至少部分设置在非显示区域21内。以下实施例中，该绑定端子103设置在阵列基板101朝向彩膜基板102一侧的表面上。并与该阵列基板101内的走线电性连接，以实现控制信号的传输。
本申请实施例中，详见图2中，在设置该阵列基板101时，该阵列基板101还包括一突出部204。其中，该突出部204设置在非显示区域21内，且该突出部204突出于该彩膜基板102的边缘。这样，在显示面板的右侧，该阵列基板101的长度大于彩膜基板102的长度。
同时，该绑定端子103对应设置在该突出部204上，如该绑定端子103设置在该阵列基板101朝向彩膜基板102一侧的表面上。本申请实施例中，在设置上述绑定端子103时，该绑定端子103靠近显示区域20一侧的边缘可与密封胶106相抵接，同时，该绑定端子103远离显示区域20一侧的边缘向该阵列基板101的边缘处延伸，从而在该阵列基板101上形成具有一定长度的绑定端子。
本申请实施例中，在设置上述突出部204时，该突出部204的长度设置为D1，具体的，该突出部204的长度D1可设置为20um~35um。可选的，突出部204的长度D1设置为28um，从而有效的提高了该绑定端子103的面积，并保证其接触效果。
进一步的，本申请实施例中，在设置连接金属线104时，该连接金属线104与绑定端子103电性连接。具体的，该连接金属线104设置在靠近阵列基板101边缘的一侧。由于该非显示区域主要为显示面板的绑定区域，通过该绑定端子103与连接金属线104实现显示面板的绑定以及对显示面板显示区域内控制信号的传输作用。同时，为了实现窄边框的效果，该连接金属线104通过与阵列基板101的侧面相贴合，以尽可能的降低显示面板的边框宽度，从而在保证连接金属线104连接效果的同时，降低边框的宽度。
具体的，在设置上述连接金属线104时，该连接金属线104的一端至少覆盖部分绑定端子103，该连接金属线104的另一端延伸至该阵列基板101的第二贴合面303上，与第二贴合面303紧密贴合，并继续向下延伸并绑定。
本申请实施例中，为了提高其接触效果，搭接在所述绑定端子上的所述连接金属线在所述阵列基板上的投影位于所述绑定端子在所述阵列基板上的投影区域内。具体的，该连接金属线104与绑定端子103之间覆盖区域的面积至少为该绑定端子103总面积的三分之一。优选的，该连接金属线104所覆盖的面积为绑定端子103表面总面积的一半，这样，可有效地增加两不同金属层之间的接触效果，同时有效的提高面板的性能。
进一步的，本申请实施例中，在设置该显示面板时，该显示面板还包括一倒角结构333。具体的，该倒角结构333设置在阵列基板101的一侧边缘，如该倒角结构333设置在非显示区域内的突出部204的一侧的边缘。且该倒角结构333设置在阵列基板101的上表面与阵列基板101的第二贴合面303之间。通过该倒角结构333实现阵列基板101与第二贴合面303之间的平缓过渡，进而提高不同膜层之间的连接效果。
本申请实施例中，该第二贴合面303主要为该阵列基板101的厚度方向上的侧面，且该第二贴合面303主要用来对连接金属线104进行绑定贴合。
具体的，在设置上述连接金属线104时，该连接金属线104还可包括第一连接部4011、第二连接部4012以及第三连接部4013。该第一连接部4011设置在靠近显示区域20的一侧，该第三连接部4013设置在远离显示区域的一侧，且该第一连接部4011与第三连接部4013通过第二连接部4012相连接，并最终形成本申请实施例中提供的连接金属线104。
详见图2所示，该第一连接部4011对应设置在该阵列基板101的上表面上，并至少覆盖部分该绑定端子103。该第二连接部4012对应设置在该倒角结构333处，并与倒角结构333的表面相贴合，同时该第三连接部4013设置在阵列基板101的第二贴合面303上，并紧密贴合。本申请实施例中，通过设置上述倒角结构，该倒角结构可将该弯折区域处的连接金属线104平缓过渡，进而减小连接金属线104的弯折应力，同时，该倒角结构的弯曲面还可进一步降低该区域对应的边框的宽度，进而实现窄边框。
本申请实施例中，由于该连接金属线104与绑定端子103电性连接，因此，该连接金属线104可将阵列基板上的控制信号进行传输，且该绑定端子103与连接金属线104之间具有较大的覆盖面积，同时连接金属线104在倒角结构处平缓过渡，从而有效的保证来在该边框区域处，不同金属线之间的接触效果，并有效的降低了连接金属线的应力，提高了显示面板的综合性能。
进一步的，在设置上述不同的连接部时，为了保证面板的综合性能及质量，该第二连接部4012的膜层厚度可大于该第三连接部4013的膜层厚度，同时，该第三连接部4013的膜层厚度可大于该第一连接部4011的膜层厚度。
本申请实施例中，在设置上述倒角结构333时，该倒角结构333可设置为弧形过渡曲面或者圆形过渡曲面，如圆角结构，或者根据不同产品及制程的需求设置为其他结构。这里不再赘述。以下实施例中，该倒角结构333在不同贴合面上的结构以弧形过渡面为例进行说明。
具体的，该阵列基板101朝向彩膜基板一侧为第一贴合面，该第一贴合面与第二贴合面303通过该倒角结构333相连接，其中，该倒角结构333与第一贴合面之间的曲率小于倒角结构与第二贴合面之间的曲率。可选的，该倒角结构333的曲率可设置为0.1um -1~0.4um -1。具体的，该倒角结构333在第一贴合面处的曲率设置为0.1um-1，在第二贴合面处的曲率设置为0.3um -1，从而将两不同位置处的贴合面设置为不同的曲率，以有效的保证该连接金属线104的贴合效果，并降低贴合后走线内部产生的应力问题，从而提高其质量。
进一步的，如图3所示，图3为本申请实施例中提供的该绑定端子103与连接金属线104在该非显示区域处的部分连接平面示意图。结合图2中的膜层结构，在设置上述绑定端子与连接金属线104时，多个绑定端子103可间隔设置。如各绑定端子103等间距的设置在该阵列基板的表面。
同时，每一连接金属线104对应的设置在每一绑定端子103上方。为了保证其一致性，该连接金属线104可相对绑定端子103的中轴线对称设置，从而保证信号传输的一致及稳定性。
详见图3，并结合图2中的结构，在设置上述倒角结构333以及对应的连接金属线104时，该倒角结构333的表面上还可设置多个凹槽456，每一凹槽456与每一连接金属线104相对应，即凹槽456的延伸方向与连接金属线104的弯折方向相同，这样，该连接金属线104可对于的贴合在所述凹槽456内，通过该凹槽456以对连接金属线104进行定位，从而保证该显示面板的可靠性及综合性能。
进一步的，如图12所示，图12为本申请实施例中提供的另一显示面板的膜层结构示意图。结合图2-图3中的结构，本申请实施例中，该显示面板还包括保护层888。其中，在设置保护层888时，至少部分保护层888对应设置在连接金属线104与彩膜基板102之间的绑定端子103上。如该保护层888覆盖部分该绑定端子103。详见图12中，该保护层888的一端与该彩膜基板102相抵接，保护层888的另一端覆盖至连接金属线104上，这样，该保护层888可对部分连接金属线104以及部分绑定端子103保护，同时，由于该保护层888覆盖在该连接金属线104的一端，从而能够更好的对该连接金属线104保护，并防止该连接金属线104在绑定或者弯折过程中，出现翘起等质量问题。
本申请实施例中，该保护层888的厚度可大于该密封胶106的厚度，这样，该保护层888还可对该彩膜基板与阵列基板101进一步密封，从而有效的防止外界的水汽等杂质进入到面板内部。
详见图13所示，图13为本申请实施例中提供的又一种显示面板的膜层结构示意图。结合其他实施例，在设置上述保护层888时，该保护层888的一端还可贴设于所述彩膜基板102的侧面上，且保护层888的另一端延伸至连接金属线的一侧。如该保护层888的另一端与该连接金属线104之间保留一定的间隙，或者直接覆盖在连接金属线104上，具体的不在赘述。
本申请实施例中，由于该保护层888贴设在在彩膜基板102的侧面上，且弯折至绑定端子103的表面，这样，保护层888形成一折角结构，该折角结构能够很好的对面板密封，进而提高其对面板的保护效果。
进一步的，该绑定端子103远离彩膜基板102的一侧的表面还设置有微凸起666。该微凸起666可设置为凸凹相间的结构，对应的在该连接金属线104上，设置有与该凸起或者凹陷相匹配的凹陷或者凸起，两者相互匹配吻合，从而通过上述微凸起666，有效的增大连接金属线104与绑定端子103之间的接触面积，从而进一步提高绑定端子与连接金属线之间的连接效果，并保证显示面板的可靠性及综合性能。
进一步的，本申请实施例中，该显示面板还包括柔性电路板401以及驱动芯片402。具体的，该柔性电路板401的一端与该连接金属线104的第三连接部相电性连接，且该柔性电路板401的另一端与驱动芯片402电性连接，从而形成侧面绑定的结构，并通过该柔性电路板以及对应的连接金属线实现控制信号的传输。
本申请实施例中，还提供一种显示面板及显示装置的制备方法，如图4-8所示，图4~图8为本申请实施例中提供的显示面板的制备工艺对应的膜层结构图。
详见图4，在将阵列基板101与彩膜基板102对组成盒后，对其进行错位切割。具体的，在该非显示区域内对彩膜基板102进行切割。本申请实施例中，该切割位置在框胶105的外侧，切割完成后，将切割多余的彩膜基板去除，并形成一种台阶结构。此时，在该框胶105外侧，即非显示区域内，绑定端子103随之裸露出来。
详见图5，错位切割完成后，继续设置密封胶106。此时，该密封胶106设置在框胶105远离显示区域的一侧，且该密封胶106与框胶105相接触，并覆盖对应区域内的绑定端子103。本申请实施例中，通过设置密封胶106以进一步提高显示面板的密封效果及质量。
详见图6，密封胶106设置完成后，对该密封胶106进一步处理，如对该密封胶106进行切割整形。具体的，由于在涂布密封胶106时，其涂布的形状及结构不理想，此时，可通过激光切割工艺，将多余的密封胶106进行切割并去除，从而保证该密封胶106的结构，并有效的避免密封胶106与其他膜层之间出现相互干涉的问题。切割完成后，使该密封胶106与彩膜基板102的侧边相平齐。
详见图7所示，本申请实施例中，密封胶106处理完成后，在该阵列基板的侧边位置处设置倒角结构333。首先对该绑定端子103进行处理，可将倒角结构333处的多余的绑定端子103去除，去除完成后，对阵列基板进一步处理。具体的，上述倒角结构333可设置为圆角R，具体的，该倒角结构333的设置参数可按照本申请实施例中提供的参数进行设置。如该倒角结构333的圆角半径设置为5um~10um，或者根据不同产品的需求进行设置。这样，通过设置倒角结构333并对绑定端子103进行处理，从而为后续其他走线的设置奠定基础。
详见图8所示，倒角结构333处理完成后，继续设置其他膜层。具体的，再在该非显示区域对应位置处，采用移印工艺制备连接金属线104。
本申请实施例中，在制备形成该连接金属线104时，还可采用镀膜的工艺进行制备，从而进一步提高其制备效率及精度。具体的，如图9-11所示，图9~图11为本申请实施例中提供的连接金属线在镀膜工艺中对应的结构。结合图4~图8，倒角结构处理完成后，再在该显示面板上设置一保护膜666。本申请实施例中，该保护膜666设置在彩膜基板102的上表面、绑定端子103的上表面上，通过该保护膜666以对其进行保护，并防止在不必要的膜层上形成其他结构。
详见图10所示，保护膜666铺设完成后，进行镀膜处理，其中，通过镀膜中所选用的材料主要为Cu、Al、TiAlTi等金属材料，通过镀膜以形成规定结构及形状尺寸的金属走线。此时，在倒角结构333以及该阵列基板101的第二贴合面303、第一贴合面302上进行镀膜，并最终形成本申请实施例中的连接金属线104。本申请实施例中，通过采用镀膜工艺，直接在对应位置处沉积从而形成所需要结构的连接金属线，从而有效的改善来显示面板的制备工艺，提高制备效率以及膜层的质量和综合性能。
详见图11所示，镀膜完成后，去除保护膜666，并对绑定端子103以及连接金属线104继续处理。具体的，采用镭射工艺对该绑定端子以及连接金属线104进行处理，通过镭射形成不同的连接端子以及对应的绑定结构。并最终形成本申请实施例中提供的绑定端子103与连接金属线104之间的一对一的绑定以及连接结构。本申请实施例中，通过采用镀膜工艺，并结合镭射工艺对不同的膜层进行处理，从而有效的提高了制备效率，并且上述工艺的制备精度更高，从而有效的保证来膜层之间的制备精度以及连接效果。
进一步的，本申请实施例中还提供一种显示装置，该显示装置包括本申请实施例中的显示面板，且在制备形成本申请实施例中的显示面板时，采用以上提供的制备工艺进行制备，从而有效的提高了制备效果，同时改善来显示面板的绑定结构，并提高了显示装置的综合性能。
综上所述，以上对本申请实施例所提供的一种显示面板及显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；虽然本申请以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为基准。

Claims (20)

  1. 一种显示面板，包括：
    阵列基板；
    彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
    绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
    连接金属线，所述连接金属线与所述绑定端子电性连接；
    其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上；
    多个所述绑定端子间隔设置，且每一所述连接金属线对应的设置在每一所述绑定端子上方并相对所述绑定端子的中轴线对称设置。
  2. 根据权利要求1所述的显示面板，其中所述连接金属线包括第一连接部、第二连接部以及第三连接部；
    其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述阵列基板厚度方向的侧面相贴合。
  3. 根据权利要求2所述的显示面板，其中所述第二连接部的厚度大于所述第三连接部的膜层厚度。
  4. 根据权利要求1所述的显示面板，其中所述阵列基板包括第一贴合面以及第二贴合面，所述第一贴合面与所述第二贴合面通过所述倒角结构相连接，且所述第一贴合面朝向所述彩膜基板；
    其中，所述倒角结构与所述第一贴合面之间的曲率小于所述倒角结构与所述第二贴合面之间的曲率。
  5. 根据权利要求1所述的显示面板，其中所述倒角结构的表面上还设置有多个凹槽，所述凹槽的延伸方向与所述连接金属线的弯折方向相同，且每一所述连接金属线对应的设置在每一所述凹槽内。
  6. 根据权利要求1所述的显示面板，其中所述显示面板还包括显示区域以及设置于所述显示区域一侧的非显示区域；
    其中，所述阵列基板还包括设置在所述非显示区域内的突出部，所述绑定端子设置于所述突出部朝向所述彩膜基板的一侧表面，且搭接在所述绑定端子上的所述连接金属线在所述阵列基板上的投影位于所述绑定端子在所述阵列基板上的投影区域内。
  7. 根据权利要求6所述的显示面板，其中所述显示面板还包括密封胶，所述密封胶对应设置在所述彩膜基板与所述阵列基板之间，所述密封胶覆盖部分所述绑定端子，且所述密封胶远离所述显示区域的一侧边缘与所述彩膜基板的边缘平齐。
  8. 根据权利要求1所述的显示面板，其中所述显示面板还包括保护层；
    其中，至少部分所述保护层对应设置在所述连接金属线与所述彩膜基板之间的所述绑定端子上。
  9. 根据权利要求8所述的显示面板，其中所述保护层的一端贴设于所述彩膜基板的侧面上，所述保护层的另一端延伸至所述连接金属线的一侧。
  10. 一种显示面板，包括：
    阵列基板；
    彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
    绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
    连接金属线，所述连接金属线与所述绑定端子电性连接；
    其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上。
  11. 根据权利要求10所述的显示面板，其中所述连接金属线包括第一连接部、第二连接部以及第三连接部；
    其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述阵列基板厚度方向的侧面相贴合。
  12. 根据权利要求11所述的显示面板，其中所述第二连接部的厚度大于所述第三连接部的膜层厚度。
  13. 根据权利要求10所述的显示面板，其中所述阵列基板包括第一贴合面以及第二贴合面，所述第一贴合面与所述第二贴合面通过所述倒角结构相连接，且所述第一贴合面朝向所述彩膜基板；
    其中，所述倒角结构与所述第一贴合面之间的曲率小于所述倒角结构与所述第二贴合面之间的曲率。
  14. 根据权利要求10所述的显示面板，其中所述倒角结构的表面上还设置有多个凹槽，所述凹槽的延伸方向与所述连接金属线的弯折方向相同，且每一所述连接金属线对应的设置在每一所述凹槽内。
  15. 根据权利要求10所述的显示面板，其中所述显示面板还包括显示区域以及设置于所述显示区域一侧的非显示区域；
    其中，所述阵列基板还包括设置在所述非显示区域内的突出部，所述绑定端子设置于所述突出部朝向所述彩膜基板的一侧表面，且搭接在所述绑定端子上的所述连接金属线在所述阵列基板上的投影位于所述绑定端子在所述阵列基板上的投影区域内。
  16. 根据权利要求15所述的显示面板，其中所述显示面板还包括密封胶，所述密封胶对应设置在所述彩膜基板与所述阵列基板之间，所述密封胶覆盖部分所述绑定端子，且所述密封胶远离所述显示区域的一侧边缘与所述彩膜基板的边缘平齐。
  17. 根据权利要求10所述的显示面板，其中所述显示面板还包括保护层；
    其中，至少部分所述保护层对应设置在所述连接金属线与所述彩膜基板之间的所述绑定端子上。
  18. 根据权利要求17所述的显示面板，其中所述保护层的一端贴设于所述彩膜基板的侧面上，所述保护层的另一端延伸至所述连接金属线的一侧。
  19. 一种显示装置，包括显示面板，所述显示面板包括：
    阵列基板；
    彩膜基板，与所述阵列基板对盒设置，且所述阵列基板的一端边缘突出于所述彩膜基板；
    绑定端子，至少部分所述绑定端子设置在所述阵列基板突出于所述彩膜基板的区域内；以及，
    连接金属线，所述连接金属线与所述绑定端子电性连接；
    其中，所述阵列基板设置有所述绑定端子一侧的边缘设置有倒角结构，所述连接金属线的一端覆盖部分所述绑定端子相对所述彩膜基板一侧的表面，所述连接金属线的另一端沿所述倒角结构弯折，并延伸至所述阵列基板的侧面上。
  20. 根据权利要求19所述的显示装置，其中所述连接金属线包括第一连接部、第二连接部以及第三连接部；
    其中，所述第一连接部与所述绑定端子的表面相贴合，所述第二连接部与所述倒角结构的表面相贴合，且所述第三连接部与所述阵列基板厚度方向的侧面相贴合。
PCT/CN2023/113808 2023-06-14 2023-08-18 显示面板及显示装置 Ceased WO2024254981A1 (zh)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150211707A1 (en) * 2012-07-09 2015-07-30 Sharp Kabushiki Kaisha Display device
CN107247355A (zh) * 2017-07-31 2017-10-13 深圳市华星光电技术有限公司 显示面板、电子设备及显示面板的制作方法
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
CN112130385A (zh) * 2020-10-15 2020-12-25 武汉华星光电技术有限公司 一种超窄边框显示面板及其制造方法
US20210343758A1 (en) * 2019-06-28 2021-11-04 Yungu (Gu' An) Technology Co., Ltd. Display panel and manufacturing method thereof
CN113721381A (zh) * 2021-07-02 2021-11-30 深圳市华星光电半导体显示技术有限公司 显示面板
CN113946077A (zh) * 2020-07-15 2022-01-18 荣耀终端有限公司 一种显示面板和显示装置
CN115598891A (zh) * 2022-09-28 2023-01-13 苏州华星光电技术有限公司（Cn） 显示面板及显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4845749B2 (ja) * 2006-01-31 2011-12-28 株式会社半導体エネルギー研究所 表示装置
CN108957878B (zh) * 2018-07-19 2022-03-11 武汉天马微电子有限公司 显示模组及其制备方法和显示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150211707A1 (en) * 2012-07-09 2015-07-30 Sharp Kabushiki Kaisha Display device
CN107247355A (zh) * 2017-07-31 2017-10-13 深圳市华星光电技术有限公司 显示面板、电子设备及显示面板的制作方法
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
US20210343758A1 (en) * 2019-06-28 2021-11-04 Yungu (Gu' An) Technology Co., Ltd. Display panel and manufacturing method thereof
CN113946077A (zh) * 2020-07-15 2022-01-18 荣耀终端有限公司 一种显示面板和显示装置
CN112130385A (zh) * 2020-10-15 2020-12-25 武汉华星光电技术有限公司 一种超窄边框显示面板及其制造方法
CN113721381A (zh) * 2021-07-02 2021-11-30 深圳市华星光电半导体显示技术有限公司 显示面板
CN115598891A (zh) * 2022-09-28 2023-01-13 苏州华星光电技术有限公司（Cn） 显示面板及显示装置

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