Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F17/00—Fixed inductances of the signal type
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
  • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
  • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors

Definitions

• the present invention relates to a method for manufacturing multilayer ceramic electronic components.
• Patent Document 1 A conventional method for manufacturing multilayer ceramic electronic components is described, for example, in Patent Document 1.
• a method for manufacturing a multilayer ceramic electronic component includes a preparation step of preparing a first laminate having a plurality of first conductive layers and a plurality of first ceramic layers alternately stacked, the first laminate having a pair of first main surfaces, a pair of first end surfaces, and a pair of first side surfaces, the distance between the pair of first main surfaces being smaller than the distance between the pair of first side surfaces, and the plurality of first conductive layers being exposed from the first side surfaces, and a second laminate having a plurality of second conductive layers and a plurality of second ceramic layers alternately stacked, the second laminate having a pair of second main surfaces, a pair of second end surfaces, and a pair of second side surfaces, the distance between the pair of second main surfaces being smaller than the distance between the pair of second side surfaces, and the plurality of second conductive layers being exposed from the second side surfaces, an arrangement step of arranging the first laminate and the second laminate such that the first side surfaces and the second side surfaces are open surfaces and the direction perpendicular to
• FIG. 1 is a schematic diagram of a multilayer ceramic electronic component according to an embodiment of the present disclosure.
• FIG. 2 is a schematic diagram of an element body according to an embodiment of the present disclosure. 2 is a schematic diagram showing each component of an element body according to an embodiment of the present disclosure, separated from one another.
• FIG. 1 is a flowchart showing a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present disclosure.
• FIG. 2 is a schematic diagram showing a ceramic sheet and a conductive sheet disposed thereon according to an embodiment of the present disclosure.
• FIG. 2 is a schematic diagram showing a ceramic sheet and a conductive sheet disposed thereon according to an embodiment of the present disclosure.
• FIG. 2 is a schematic diagram showing a ceramic sheet and a conductive sheet disposed thereon according to an embodiment of the present disclosure.
• FIG. 2 is a perspective view showing a schematic view of a layering state of a base laminate according to an embodiment of the present disclosure.
• FIG. 2 is a schematic perspective view of a base laminate according to an embodiment of the present disclosure.
• FIG. 1 is a schematic perspective view of a laminate according to an embodiment of the present disclosure.
• FIG. 2 is a schematic diagram of a first laminate and a second laminate according to an embodiment of the present disclosure.
• 4A and 4B are diagrams illustrating a housing member and a stack housed in the housing member.
• 4A and 4B are diagrams illustrating a housing member and a stack housed in the housing member.
• FIG. 13 is a diagram showing a schematic diagram of the process of the fifth step.
• FIG. 13 is a diagram showing a schematic diagram of the process of the fifth step.
• FIG. 13 is a diagram showing a schematic diagram of the process of the fifth step.
• FIG. 13 is a diagram showing a schematic diagram of the process of the fifth step.
• FIG. 2 is a schematic perspective view of an element precursor according to an embodiment of the present disclosure.
• Patent Document 1 discloses that a mother block containing multiple ceramic green sheets and multiple internal electrode patterns is produced, the mother block is cut, a green chip is prepared with the internal electrodes exposed on the cut side, and a ceramic green sheet for the side is attached to the cut side.
• the method of Patent Document 1 makes it possible to form a thin and uniform side margin portion while ensuring insulation around the internal electrodes.
• Patent Document 1 can cause the green chip to tilt during the process of attaching the side ceramic green sheet to the cut side of the green chip, which is an open surface, and can cause problems with the side margins that are formed.
• multilayer ceramic electronic component 1 according to an embodiment of the present disclosure and a method for manufacturing the multilayer ceramic electronic component 1 will be described with reference to the drawings.
• a multilayer ceramic capacitor will be described as an example of the multilayer ceramic electronic component 1, but the multilayer ceramic electronic components that are the subject of this disclosure are not limited to multilayer ceramic capacitors and can be applied to various multilayer ceramic electronic components such as multilayer piezoelectric elements, multilayer thermistor elements, multilayer coils, and multilayer ceramic multilayer substrates.
• FIG. 1 is a schematic diagram of a multilayer ceramic electronic component 1 according to an embodiment of the present disclosure.
• the multilayer ceramic electronic component 1 has an element body 2 and external electrodes 3.
• the shape of the element body 2 is set as appropriate, but as one example, the element body 2 has a substantially rectangular parallelepiped shape.
• the external electrodes 3 are located on a pair of end faces of the element body 2 and may be formed to extend around to other faces adjacent to the end faces.
• the external electrode located on one end face is referred to as external electrode 3a, and the external electrode located on the other end face is referred to as external electrode 3b.
• any direction may be the first direction, the second direction, or the third direction.
• the lamination direction of the internal electrode layers 212 and the dielectric layers 211 described below is defined as the first direction.
• a direction intersecting with the first direction and approximately parallel to the short side of the element body 2 having a substantially rectangular parallelepiped shape is defined as the second direction.
• a direction intersecting with the second direction and approximately parallel to the long side of the element body 2 having a substantially rectangular parallelepiped shape is defined as the third direction.
• the first direction may be the up-down direction
• the second direction may be the left-right direction
• the third direction may be the front-rear direction.
• the element body 2 is roughly rectangular and has six faces.
• the faces located above and below the element body 2 in the first direction are defined as main faces
• the faces located to the left and right of the element body 2 in the second direction are defined as side faces
• the faces located to the front and rear of the element body 2 in the third direction are defined as end faces.
• the main faces, side faces, and end faces are similarly defined for the laminate section 21 constituting the element body 2, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the element body precursor 200 before firing, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the laminate 50 before firing, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the mother laminate 500 before firing, which will be described later.
• the low-profile components required for multilayer ceramic electronic components are those that have a low component height when mounted, and as shown in Figure 1, are those whose dimension in a first direction, which is the height when mounted, is relatively smaller than the dimension in a second direction.
• the "principal surface” does not necessarily have to be strictly flat.
• the principal surface may be slightly warped overall, or may have some unevenness in some areas.
• the "side surface” and “end surface” are also defined in the same way as the “principal surface.”
• the external electrodes 3 are formed from a conductor and function as terminals of the multilayer ceramic electronic component 1.
• Examples of conductors that form the external electrodes 3 include metals such as nickel (Ni), copper (Cu), palladium (Pd), tin (Sn), zinc (Zn), platinum (Pt), silver (Ag) and gold (Au), or alloys of these metals.
• the external electrode 3 may have a single layer structure or a multi-layer structure.
• the multi-layer structure of the external electrode 3 may be configured as a two-layer structure of a base film and a surface film, or a three-layer structure of a base film, an intermediate film, and a surface film.
• the base film may be a baked film of a metal whose main component is Ni, Cu, Pd, Pt, Ag, Au, etc., or an alloy of these.
• the intermediate film may be a plated film of a metal or alloy whose main component is Pt, Pd, Au, Cu, Ni, etc., for example.
• the surface film may be a plated film of a metal or alloy whose main component is Cu, Sn, Pd, Au, Zn, etc., for example.
• FIGS. 2A and 2B are schematic diagrams of element body 2.
• Element body 2 has a laminated portion 21, a side margin portion 22, and a cover portion 23.
• FIG. 2A is a schematic diagram showing laminated portion 21, side margin portion 22, and cover portion 23 as a whole
• FIG. 2B is a schematic diagram showing laminated portion 21, side margin portion 22, and cover portion 23 separated.
• FIGs. 2A and 2B are both diagrams showing element body 2 before firing, and diagrams showing element body 2 after firing.
• Element body 2 after firing has shrunk due to firing, but has approximately the same structure as element body 2 before firing.
• the laminated section 21 includes a plurality of dielectric layers 211 and a plurality of internal electrode layers 212 laminated in a first direction.
• the plurality of dielectric layers 211 may include various ceramic dielectrics. Examples of the ceramic dielectrics include barium titanate (BaTiO 3 ) and calcium zirconate (CaZrO 3 ).
• the multiple internal electrode layers 212 may contain various metals such as Ni, Pd, Ag, and Cu.
• the multiple stacked internal electrode layers 212 are alternately exposed from a pair of end faces of the laminated section 21 and connected to the external electrode 3.
• those connected to the external electrode 3a are referred to as internal electrode layers 212a
• those connected to the external electrode 3b are referred to as internal electrode layers 212b.
• the side margin portions 22 are located on both sides of the laminate portion 21 in the second direction.
• the side margin portions 22 may contain various ceramic dielectrics.
• the main component of the side margin portions 22 may be the same as the main component of the dielectric layer 211 of the laminate portion 21. In this case, manufacturing efficiency is improved, and internal stress in the element body 2 is reduced, improving reliability.
• the cover portion 23 is located on both main surfaces of the laminate portion 21 in the first direction.
• the cover portion 23 may contain various ceramic dielectrics.
• the main component of the cover portion 23 may be the same as the main component of the dielectric layer 211 of the laminate portion 21. In this case, manufacturing efficiency is improved, and internal stress in the element body 2 is reduced, improving reliability.
• the configuration of the multilayer ceramic electronic component 1 is not limited to a specific configuration, and any known configuration can be appropriately adopted depending on the size and performance required for the multilayer ceramic electronic component 1.
• the number of layers of the internal electrode layers 212 in the laminate section 21 can be appropriately determined.
• FIG. 3 is a flowchart showing a method for manufacturing the multilayer ceramic electronic component 1.
• Fig. 4A to Fig. 10C are diagrams showing the manufacturing process of the multilayer ceramic electronic component 1. The method for manufacturing the multilayer ceramic electronic component 1 will be described below with reference to Figs. 4A to 10C.
• a base laminate 500 is prepared in which a plurality of ceramic sheets 400 and a plurality of conductor sheets 410 are alternately laminated.
• FIGS. 4A to 4C show ceramic sheets 400 and a conductive sheet 410 arranged thereon.
• FIG. 4A shows a first ceramic sheet 401 and a first conductive sheet 411
• FIG. 4B shows a second ceramic sheet 402 and a second conductive sheet 412
• FIG. 4C shows a third ceramic sheet 403.
• the first ceramic sheet 401 and the second ceramic sheet 402 become the dielectric layer 211 of the laminated section 21 after firing.
• the third ceramic sheet 403 becomes the cover section 23 after firing.
• the first conductor sheet 411 and the second conductor sheet 412 become the internal electrode layer 212 after firing.
• the first ceramic sheet 401, the second ceramic sheet 402, and the third ceramic sheet 403 are sometimes collectively referred to as the ceramic sheet 400.
• the first conductor sheet 411 and the second conductor sheet 412 are sometimes collectively referred to as the conductor sheet 410.
• the ceramic sheet 400 is placed on, for example, a carrier film. This placement is performed using, for example, a die coater, but is not limited to this. For example, it may be performed using a doctor blade coater or a gravure coater.
• the thickness of the ceramic sheet 400 can be set appropriately. For example, the thickness of the ceramic sheet 400 may be about 1 to 10 ⁇ m. The thinner the ceramic sheet is, the higher the electrostatic capacitance of the multilayer ceramic electronic component 1 can be.
• the ceramic sheet 400 may be made of various ceramic dielectric materials.
• the ceramic sheet 400 is made by wet grinding and mixing a ceramic powder mixture of BaTiO3 and an additive in a bead mill, and mixing the ground and mixed slurry with a polyvinyl butyral binder, a plasticizer, and an organic solvent.
• a first conductive sheet 411 which will become the internal electrode layer 212a after firing, is placed at a distance on the first ceramic sheet 401 created above.
• a second conductive sheet 412 which will become the internal electrode layer 212b after firing, is placed at a distance on the second ceramic sheet 402.
• conductive sheet 410 is printed with two types of conductive patterns with different polarities.
• screen printing or gravure printing can be used to form conductive sheet 410.
• Conductive sheet 410 may be made from conductive paste containing various metals.
• the third ceramic sheet 403 corresponding to the cover portion 23 after firing may not necessarily have the conductive sheet 410 formed thereon. However, this is not limited to this example, and for example, the third ceramic sheet 403 may have a conductive sheet 410 disposed thereon that will become a dummy internal electrode layer after firing.
• the thickness of the conductive sheet 410 can be set as appropriate. As long as the characteristics as a capacitor can be ensured, the thinner the conductive sheet 410, the more the internal defects caused by internal stress can be prevented. For example, in a capacitor with a high number of layers, the thickness of the conductive sheet 410 may be 1 ⁇ m or less. Furthermore, the spacing at which the first conductive sheet 411 and the second conductive sheet 412 are arranged does not necessarily need to be constant, and can be set as appropriate. For example, the spacing between the first conductive sheet 411 and the second conductive sheet 412 may be different.
• the first ceramic sheet 401 on which the first conductive sheet 411 is formed may be referred to as the first sheet
• the second ceramic sheet 402 on which the second conductive sheet 412 is formed may be referred to as the second sheet
• the third ceramic sheet 403 may be referred to as the third sheet.
• FIG. 5 is a schematic perspective view of the mother laminate 500.
• each ceramic sheet 400 is shown exploded in Figure 5.
• the mother laminate 500 is formed by compressing and integrating the ceramic sheets 400 using hydrostatic pressure, uniaxial pressure or the like. This results in a high-density mother laminate 500.
• first sheets and second sheets corresponding to the laminated portion 21 after firing are alternately stacked in the first direction.
• third sheets corresponding to the cover portion 23 after firing are stacked on the top and bottom surfaces in the first direction of the alternately stacked first and second sheets, respectively.
• the numbers of first sheets, second sheets, and third sheets can each be changed as appropriate.
• the base laminate 500 is cut so as to form unfired laminates 50 having side and end faces from which the conductive sheets 410 are exposed.
• FIGS. 6A and 6B are perspective views of the mother laminate 500 and the individual laminates 50.
• FIG. 6A shows the mother laminate 500, which is cut along cutting lines CL1 and CL2 while attached to tape as a holding member. This results in the mother laminate 500 being cut into individual laminates 50 as shown in FIG. 6B.
• the resulting multiple laminates 50 include a first laminate 51 and a second laminate 52, which will be described later.
• the cut surface of the base laminate 500 formed by cutting along the cutting line CL1 becomes the side surface of the laminate 50 in the second direction.
• the cut surface of the base laminate 500 formed by cutting along the laminate cutting line CL2 becomes the end surface of the laminate 50 in the third direction.
• the conductive sheet 410 is exposed from the side surface and end surface of the laminate 50.
• the configuration of the cutting blade used to cut the base laminate 500 in the second step may be changed as appropriate.
• the cutting blade may be a push blade or a rotary blade.
• a technique that does not require a cutting blade may be used to cut the base laminate 500, such as laser cutting or water jet cutting.
• the first laminate 51 comprises a plurality of first ceramic layers 511 and a plurality of first conductor layers 512 that are alternately stacked.
• the first ceramic layers 511 correspond to the ceramic sheets 400 in the base laminate 500.
• the first conductor layers 512 correspond to the conductor sheets 410 in the base laminate 500.
• the main surface of the first laminate 51 is called the first main surface, the end surface is called the first end surface, and the side surface is called the first side surface.
• the first laminate 51 has a pair of first main surfaces, a pair of first end surfaces, and a pair of first side surfaces.
• the distance L1M between the pair of first main surfaces of the first laminate 51 is smaller than the distance L1S between the pair of first side surfaces. In other words, L1M ⁇ L1S.
• the distance L1M between the pair of first main surfaces of the first laminate 51 may be smaller than the distance L1T between the pair of first end surfaces. In other words, L1M ⁇ L1T.
• the longest distance can be defined as L1M. Also, if there are multiple L1Ss and L1Ts, they can be defined in the same way as L1M.
• the multiple first conductive layers 512 are exposed from both sides of the pair of first side surfaces of the first laminate 51 formed by cutting in the second process. In addition, the multiple stacked first conductive layers 512 are alternately exposed from both sides of the pair of first end surfaces of the first laminate 51 formed by cutting in the second process.
• the second laminate 52 comprises a plurality of second ceramic layers 521 and a plurality of second conductor layers 522 that are alternately stacked.
• the second ceramic layers 521 correspond to the ceramic sheets 400 in the base laminate 500.
• the second conductor layers 522 correspond to the conductor sheets 410 in the base laminate 500.
• the main surface of the second laminate 52 is called the second main surface
• the end surface is called the second end surface
• the side surface is called the second side surface.
• the second laminate 52 has a pair of second main surfaces, a pair of second end surfaces, and a pair of second side surfaces.
• the distance L2M between the pair of second main surfaces of the second laminate 52 is smaller than the distance L2S between the pair of second side surfaces. In other words, L2M ⁇ L2S.
• the distance L2M between the pair of second main surfaces of the second laminate 52 may be smaller than the distance L2T between the pair of second end surfaces. In other words, L2M ⁇ L2T.
• the second principal surface is not a plane and there are multiple L2Ms, the smallest distance can be represented by L2M. Also, if there are multiple L2Ss and L2Ts, they can be defined in the same way as L2M.
• the plurality of second conductive layers 522 are exposed from both sides of the pair of second side faces of the second laminate 52 formed by cutting in the second process. In addition, the plurality of stacked second conductive layers 522 are alternately exposed from both sides of the pair of second end faces of the second laminate 52 formed by cutting in the second process.
• the first laminate 51 and the second laminate 52 are arranged so that one first side surface of the first laminate 51 and one second side surface of the second laminate 52 are open surfaces.
• the first laminate 51 and the second laminate 52 are arranged so that a direction D1 perpendicular to the first main surface of the first laminate 51 and a direction D2 perpendicular to the second main surface of the second laminate 52 intersect with each other.
• the "open surface” refers to the surface that is located on the opposite side to the surface on which the component, such as a container member or sheet member, is placed, and that is not in contact with the surface on which the component is placed, when the laminate 50 is placed on the surface on which the component, such as a container member or sheet member, is placed.
• the arrangement of the first laminate 51 and the second laminate 52 may be performed using the storage member 6 and the magnet 7.
• Figures 8A and 8B show the state of the storage member 6 and the laminate 50 stored in the storage member 6 after the storage step.
• the storage member 6 has a first recess 61 and a second recess 62.
• the first laminate 51 is stored in the first recess 61
• the second laminate 52 is stored in the second recess 62.
• the storage member 6 may have multiple first recesses 61 or multiple second recesses 62.
• Figure 8A shows the state in which the first laminate 51 is stored in the first recess 61, and the second laminate 52 is stored in the second recess 62.
• Figure 8B shows the state after the first laminate 51 and the second laminate 52 have been rolled by the magnet 7.
• first recess 61 and the second recess 62 may be set as appropriate.
• first recess 61 may be a rectangular parallelepiped having a first short wall 611 and a first long wall 612 that is longer than the first short wall 611.
• the second recess 62 may be a rectangular parallelepiped having a second short wall 621 and a second long wall 622 that is longer than the second short wall 621.
• first short wall 611 and the second short wall 621 intersect, and the first long wall 612 and the second long wall 622 intersect.
• FIGS. 9A to 9D show the rolling process by the magnet 7, with the laminate 50 rolling in the order of FIG. 9A to FIG. 9D.
• FIG. 9A to FIG. 9D are cross-sectional views taken along the line VIV-VIV in FIG. 8A.
• the first short wall 611 and the first long wall 612 of the first recess 61 are connected via the first bottom surface 610.
• the second short wall 621 and the second long wall 622 of the second recess 62 are connected via the second bottom surface 620.
• the length of the first longitudinal wall 612 may be greater than L1S and less than L1T.
• the longitudinal direction of the first laminate 51 is accommodated along the first longitudinal wall 612 of the first recess 61.
• the length of the second longitudinal wall 622 may be greater than L2S and less than L2T.
• the longitudinal direction of the second laminate 52 is accommodated along the second longitudinal wall 622 of the second recess 62.
• the laminate 50 when the laminate 50 is randomly placed in the first recess 61 and the second recess 62, it will either be placed so that the first main surface of the first laminate 51 faces the first bottom surface 610 of the first recess 61, or it will be placed so that the first side surface of the first laminate 51 faces the first bottom surface 610.
• the second recess 62 can be stored so that the second main surface of the second laminate 52 faces the second bottom surface 620, or the second side surface of the second laminate 52 faces the second bottom surface 620.
• the sides of the laminate 50 are often processed, it is necessary to align the sides of all the laminates so that they are open faces. In other words, they need to be stored so that the first side faces the first bottom surface 610, and the second side faces the second bottom surface 620.
• a magnetic field is applied using magnets 7 to cause the laminate 50 to roll.
• Two magnets 7 are arranged above and below the housing member 6 so that their opposite magnetic poles face each other.
• the bottom surface of the upper magnet 7 is the south pole
• the top surface of the lower magnet 7 is the north pole.
• the first laminate 51 and the second laminate 52 rotate about their longitudinal axis so that the surface direction of the conductive layer is parallel to the magnetic flux lines.
• the first laminate 51 rotates in the first recess 61 so that the first side surface becomes an open surface, while the first laminate 51, which originally had the first side surface as an open surface, remains as it is. Therefore, the first side surfaces of all the first laminates 51 can be aligned so that they are open surfaces.
• the second laminate 52 rotates so that the second side becomes an open surface, while the second laminate 52 that originally had the second side as an open surface remains as is. Therefore, the second side surfaces of all the second laminates 52 can be aligned so that they are open surfaces. This allows the side surfaces of all the laminates 50, including the first laminate 51 and the second laminate 52, to be aligned so that they are open surfaces.
• the first laminate 51 after rolling contacts the first short wall 611 and the first long wall 612.
• the first main surface of the first laminate 51 after rolling contacts the first long wall 612
• the first end face of the first laminate 51 after rolling contacts the first short wall 611.
• the second laminate 52 after rolling contacts the second short wall 621 and the second long wall 622.
• the second main surface of the second laminate 52 after rolling contacts the second long wall 622, and the second end face of the second laminate 52 after rolling contacts the second short wall 621.
• first short wall 611 and the second short wall 621 intersect, and the first long wall 612 and the second long wall 622 intersect, so that the direction D1 perpendicular to the first main surface of the first laminate 51 after rolling and the direction D2 perpendicular to the second main surface of the second laminate 52 intersect.
• the first laminate 51 has a configuration in which L1M ⁇ L1S and is narrower in width than in height when viewed from the first end face side. Therefore, the moment of inertia is smaller when the first main surface rotates in a direction inclined relative to the adhesive sheet 8, so the first laminate 51 tends to fall over uniformly in the direction D1.
• the second laminate 52 like the first laminate 51, has a configuration in which L2M ⁇ L2S and is narrower in width than in height when viewed from the second end face side. Therefore, the moment of inertia is smaller when the second main surface rotates in a direction inclined relative to the adhesive sheet 8, so the second laminate 52 tends to fall over uniformly in the direction D2.
• the first laminate 51 and the second laminate 52 contained in the containing member 6 are aligned in the same direction, there is a possibility that the first laminate 51 and the second laminate 52 may easily tip over in the same direction when attached to the adhesive sheet 8 as shown in FIG. 9D.
• the functional member 404 is pressed against the side of the laminate 50 in the fifth step described below while the laminate 50 is in a tipping state, there may be some places on the side of the laminate 50 where the pressure applied to the functional member 404 is insufficient, and the functional member 404 will not be formed uniformly, which may cause a defect in the side margin portion 22 after firing.
• the first stack 51 and the second stack 52 are arranged so that the direction D1 of the first stack 51 after rolling and the direction D2 of the second stack 52 after rolling intersect.
• the direction D1 in which the first stack 51 is likely to tip over no longer coincides with the direction D2 in which the second stack 52 is likely to tip over.
• tipping over of the first stack 51 can be reduced.
• the direction D2 in which the second stack 52 is likely to tip over no longer coincides with the direction D1 in which the first stack 51 is likely to tip over.
• tipping over of the second stack 52 can be reduced.
• the first laminate 51 and the second laminate 52 can reduce tipping over due to their mutual presence. Therefore, in the fifth step described below, the entire side surface of the laminate 50 can be sufficiently pressed against the functional member 404, and the functional member 404 can be uniformly formed on the side surface of the laminate 50, thereby reducing the possibility of defects occurring in the side margin portion 22 after firing.
• the stack 50 is accommodated in the storage member 6, and then the cover member 63 is placed on the storage member 6. This allows the first stack 51 to be securely held in the first recess 61, and the second stack 52 to be securely held in the second recess 62.
• the first short wall 611 and the second short wall 621 may be perpendicular to each other, and the first long wall 612 and the second long wall 622 may be perpendicular to each other.
• the first long wall 612 and the second short wall 621 may be parallel to each other, and the first short wall 611 and the second long wall 622 may be parallel to each other.
• the first laminate 51 after rolling contacts both the first short wall 611 and the first long wall 612
• the second laminate 52 after rolling contacts both the second short wall 621 and the second long wall 622
• the first laminate 51 after rolling does not have to contact the first short wall 611 and the first long wall 612.
• the second laminate 52 does not have to contact the second short wall 621 and the second long wall 622. Even in this case, if the direction D1 of the first laminate 51 after rolling and the direction D2 of the second laminate 52 after rolling intersect, the occurrence of tipping over can be reduced.
• first laminate 51 after rolling may be in contact with either the first short wall 611 or the first long wall 612
• second laminate 52 after rolling may be in contact with either the second short wall 621 or the second long wall 622.
• the first end face of the first laminate 51 after rolling may contact only the first short wall 611
• the second main face of the second laminate 52 after rolling may contact only the second long wall 622.
• the first short wall 611 and the second long wall 622 are parallel, they can be arranged so that the direction D1 of the first laminate 51 after rolling and the direction D2 of the second laminate 52 after rolling intersect with each other. Therefore, compared to a case in which the first laminate 51 after rolling does not contact the first short wall 611 and the first long wall 612, and the second laminate 52 does not contact the second short wall 621 and the second long wall 622, it is possible to more effectively reduce tipping over of each other.
• the first main surface of the first laminate 51 after rolling may contact only the first long wall 612
• the second end surface of the second laminate 52 after rolling may contact only the second short wall 621.
• the first long wall 612 and the second short wall 621 are parallel, they can be arranged so that the direction D1 of the first laminate 51 after rolling and the direction D2 of the second laminate 52 after rolling intersect with each other. Therefore, compared to a case in which the first laminate 51 after rolling is not in contact with the first short wall 611 and the first long wall 612, and the second laminate 52 is not in contact with the second short wall 621 and the second long wall 622, it is possible to more effectively reduce mutual tipping.
• the first laminate 51 after rolling may be in contact with both the first short wall 611 and the first long wall 612
• the second laminate 52 after rolling may be in contact with both the second short wall 621 and the second long wall 622.
• the first end face of the first laminate 51 after rolling may be in contact with the first short wall 611
• the first main surface may be in contact with the first long wall 612
• the second main surface of the second laminate 52 after rolling may be in contact with the second long wall 622
• the second end face may be in contact with the second short wall 621.
• the direction D1 of the first laminate 51 after rolling and the direction D2 of the second laminate 52 after rolling can be arranged to be more reliably perpendicular or close to perpendicular.
• the occurrence of the two laminates tipping over can be more effectively reduced.
• the fourth step may further include a tilting step of tilting the storage member 6.
• the first laminate 51 after rolling can be brought into contact with the first short wall 611, the first long wall 612, or both.
• the second laminate 52 after rolling can be brought into contact with the second short wall 621, the second long wall 622, or both.
• the storage member 6 is tilted in a direction in which the first end face of the first laminate 51 after rolling contacts the first short wall 611, the second main surface of the second laminate 52 after rolling contacts the second long wall 622 at the same time.
• the storage member 6 is tilted in a direction in which the first main surface of the first laminate 51 after rolling contacts the first long wall 612, the second end face of the second laminate 52 after rolling contacts the second short wall 621 at the same time.
• the tilting step may be performed simultaneously with the accommodation step in which the laminate 50 is accommodated in the accommodation member 6, or may be performed after the accommodation step.
• the tilting step may be performed simultaneously with the rolling step in which the laminate 50 is rolled by the magnet 7, or may be performed after the rolling step.
• FIGS 9B and 9C an example is shown in which two magnets 7 are arranged above and below the housing member 6 to generate a magnetic field, but this is not limiting.
• one magnet 7 may be arranged either above or below the housing member 6.
• the orientation of the north and south poles of the magnet 7 may be set as appropriate.
• the direction of the magnetic flux lines going from the north pole to the south pole in the next time may be set as appropriate.
• FIGS. 10A to 10C are diagrams that show the process of the fifth step in the order of FIGS. 10A to 10C.
• the functional member 404 is placed on a flat plate 420.
• the laminate 50 is placed so that the side that is the open surface faces the functional member 404.
• the flat plate 420 may be a rigid body such as metal or resin, or an elastic body such as rubber, and can be selected appropriately according to the characteristics of the functional member 404.
• the functional member 404 examples include a protective ceramic green sheet, a protective ceramic paste, and a terminal electrode paste.
• the functional member 404 may be made of various ceramic dielectric materials, similar to the ceramic sheet 400 prepared in the first step.
• the functional member 404 is made of the same material as the ceramic sheet 400.
• the functional member 404 is formed into a sheet using, for example, a roll coater or a doctor blade.
• the side of the laminate 50 is pressed against the functional member 404.
• the flat plate 420 may be made of an elastic material so that the functional member 404 is punched out when the side of the laminate 50 is pressed against the functional member 404. This allows the functional member 404 to be provided on one side of the laminate 50, which will become the side margin portion 22 after firing.
• the functional member 404 is also provided on the other side of the laminate 50 by the same or a similar process.
• a body precursor 200 as shown in FIG. 11 can be obtained.
• the body precursor 200 becomes the body 2 after firing.
• the shape and size of the body precursor 200 can be set appropriately depending on the shape and properties of the body 2 after firing.
• the obtained unsintered element precursor 200 is sintered to produce the element 2 as shown in Fig. 2.
• the sintering can be carried out, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.
• unsintered electrode material is applied so as to cover both end faces in the third direction of the element body 2.
• the unsintered electrode material applied to the element body 2 is baked, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere, to form a base film on the element body 2.
• an intermediate film and a surface film are formed on the base film baked on the element body 2 by a plating process such as electrolytic plating, to complete the external electrode 3.
• unsintered electrode material may be applied to both end faces in the third direction of the unsintered element precursor 200, and in the sixth step, the element precursor 200 may be sintered and the unsintered electrode material may be baked at the same time to form a base layer for the external electrode 3.
• the multilayer ceramic electronic component 1 shown in Figure 1 can be obtained.
• the manufacturing method for multilayer ceramic electronic components described above can reduce the occurrence of defects in the side margins that are formed.
• This disclosure can be implemented in the following aspects (1) to (7).
• a method for manufacturing a multilayer ceramic electronic component comprising: a preparation step of preparing a first laminate having a plurality of first conductive layers and a plurality of first ceramic layers stacked alternately, the first laminate having a pair of first main surfaces, a pair of first end surfaces, and a pair of first side surfaces, the distance between the pair of first main surfaces being smaller than the distance between the pair of first side surfaces, and the plurality of first conductive layers being exposed from the first side surfaces; and a second laminate having a plurality of second conductive layers and a plurality of second ceramic layers stacked alternately, the second laminate having a pair of second main surfaces, a pair of second end surfaces, and a pair of second side surfaces, the distance between the pair of second main surfaces being smaller than the distance between the pair of second side surfaces, and the plurality of second conductive layers being exposed from the second side surfaces; an arrangement step of arranging the first laminate and the second laminate such that the first side surfaces and the second side surfaces are open surfaces and the direction perpendicular to the first main surfaces
• a method for manufacturing a multilayer ceramic electronic component according to the above aspect (5) in which the first recess has a first short wall and a first long wall longer than the first short wall, the second recess has a second short wall and a second long wall longer than the second short wall, the first long wall and the second short wall are parallel, and in the arrangement process, one of the pair of first main surfaces of the first laminate after rolling contacts the first long wall, and one of the pair of second end surfaces of the second laminate after rolling contacts the second short wall.
• Multilayer ceramic electronic component 2 Element body 21: Laminated portion 211: Dielectric layer 212: Internal electrode layer 22: Side margin portion 23: Cover portion 200: Element body precursor 3, 3a, 3b: External electrode 400: Ceramic sheet 404: Functional member 410: Conductive sheet 420: Flat plate 50: Laminate 51: First laminate 511: First ceramic layer 512: First conductive layer 52: Second laminate 521: Second ceramic layer 522: Second conductive layer 500: Base laminate 6: Housing member 61: First recess 611: First short wall 612: First longitudinal wall 62: Second recess 621: Second short wall 622: Second longitudinal wall 63: Lid member 7: Magnet 8: Adhesive sheet

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• 2024
  • 2024-05-08 JP JP2025522289A patent/JPWO2024241888A1/ja active Pending
  • 2024-05-08 WO PCT/JP2024/017180 patent/WO2024241888A1/ja not_active Ceased

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