WO2024175392A1

WO2024175392A1 - Optoelectronic device with damage probing system

Info

Publication number: WO2024175392A1
Application number: PCT/EP2024/053448
Authority: WO
Inventors: Andrea DI CHELE; Alessandro PIOTTO; Nicolino STASIO
Original assignee: Ams International Ag
Priority date: 2023-02-22
Filing date: 2024-02-12
Publication date: 2024-08-29

Abstract

The present disclosure relates to an optoelectronic device (100) including an optical component (102) with an optical substrate (106), and a probing system (108). The probing system (108) includes a light detector (110), an optical system (116), and a processor (124). The optical system (116) directs probing light (114) into the optical substrate (106) to cause propagation along the optical substrate (106) via total internal reflection, collects the probing light (114b) after propagation, and directs the collected probing light (114b) towards the light detector (110). The light detector (110) generates a detection signal (112) representative of the received probing light (114b). The processor (124) receives the detection signal (112), and detects a damaged condition of the optical component (102) based on a variation of one or more properties of the probing light (114b) with respect to one or more predefined properties of the probing light (114).

Description

OPTOELECTRONIC DEVICE WITH DAMAGE PROBING SYSTEM

Technical Field

[0001] The present disclosure relates generally to an optoelectronic device including a probing system to detect a damaged condition of an optical component of the optoelectronic device, and to methods thereof (e.g., a method of detecting a damaged condition of an optical component of an optoelectronic device).

Background

[0002] In general, optoelectronic devices are devices capable of converting electrical energy into light, or vice versa, thus providing light emission functionalities and/or light detection functionalities. Common examples of optoelectronic components for use in optoelectronic devices may include light emitting diodes and laser diodes for light emission, photo diodes for light detection, and/or solar cells for converting solar light into electrical energy. Optoelectronic devices may therefore be used in a variety of application scenarios, both in industrial- as well as in home-settings. Application examples of optoelectronic devices may include telecommunications (e.g., fiber optic communications), three-dimensional sensing, medical instruments, optical memories, optical control systems, and/or the like. Improvements in optoelectronic devices may thus be of particular relevance for the further advancement of several technologies.

Brief Description of the Drawings

[0003] In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various aspects of the invention are described with reference to the following drawings, in which:

FIG.1A to FIG. ID show an optoelectronic device in a schematic representation, according to various aspects;

FIG. IE shows various scenarios for total internal reflection in an optical component in a schematic representation, according to various aspects;

FIG.2A to FIG.2D show an optical system of the optoelectronic device in a schematic representation, according to various aspects;

FIG.3A to FIG.3E show an optoelectronic device in a schematic representation, according to various aspects; and

FIG.4 shows a schematic flow diagram of a method of detecting a damaged condition of an optical component of an optoelectronic device, according to various aspects. Description

[0004] The following detailed description refers to the accompanying drawings that show, by way of illustration, specific details and aspects in which the invention may be practiced. These aspects are described in sufficient detail to enable those skilled in the art to practice the invention. Other aspects may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the invention. The various aspects are not necessarily mutually exclusive, as some aspects may be combined with one or more other aspects to form new aspects. Various aspects are described in connection with methods and various aspects are described in connection with devices (e.g., in connection with an optoelectronic device, in connection with a probing system, and/or in connection with an optical system). However, it is understood that aspects described in connection with methods may similarly apply to the devices, and vice versa.

[0005] Optoelectronics is a research field at the intersection between optics and electronics, and deals with devices capable of emitting, detecting, and/or otherwise controlling light. Optoelectronic devices are used in a wide range of application areas. For example, in the current market, there is a growing trend towards three-dimensional (3D) sensing. For this type of application, optoelectronic illuminators may flood the targets with light, or optoelectronic projectors may project light dots onto the targets, and the light impinging onto the targets is imaged and measured (e.g., in a time-of-flight system). This application may provide, for example, face recognition, world facing, etc.

[0006] In general, there are several desirable properties for an optoelectronic device. As an example, there is a constant trend towards miniaturization, aimed at minimizing the overall size of an optoelectronic module. As another example, an optoelectronic device may have a high configurability of the orientation of the field of illumination (Fol), e.g. to match the field of illumination of a camera in a mobile phone or tablet (e.g., landscape orientation or portrait orientation). As a further example of particular importance for customer application, an optoelectronic device may be designed to ensure eye safety for a user.

[0007] Eye safety in an optoelectronic device may be related to the properties of an optical path along which the light propagates. In particular, eye safety in an optoelectronic device may be related to the presence of damages (e.g., cracks) in an optical component of the optoelectronic device, e.g. an optical component to direct emitted light towards the field of illumination. The optical component may include, for example, a lens array, a diffractive optical element, and/or the like. Illustratively, the presence of defects along the optical path (e.g., the presence of a crack in the optical component) may cause emitting light in undesired directions, and/or may cause emitting light having excessive power, thus leading to a potential risk for a user.

[0008] Emission optical modules may thus include an eye safety feature. To satisfy this need, designers may design an optical component with an electrical interlock feature by depositing a conductive trace loop. This works as an electrical interlock feature when connected to an integrated circuit able to detect a variation of a physical parameter (e.g., a resistance or a capacitance) occurring when the optical component is detached or damaged. This solution is however prone to some disadvantages, such as a production yield loss due to low robustness, an increase in dimension and cost of assembly components, and a high cost of coated substrates and spacers.

[0009] In addition, a short circuit in the electrical interlock would result in a wrong measurement of the monitored parameter. For this reason, a certain clearance is provided between loop traces on the same surface. Illustratively, the electrically conductive trace may be designed as an “open-loop” to avoid short circuits. However, the presence of a gap leaves one or more areas of the optical component not covered by the trace, illustratively a non-detection area in which the presence of cracks may not be detected. To mitigate this issue, frequently the conductive trace is designed with a labyrinth shape, which increases the overall size of the trace and thus the overall occupation of the substrate area. This configuration may however lead to an increase of the bill of material and to an engineering overhead.

[0010] The present disclosure relates to an optical probing system for use in an optoelectronic device to detect the presence or the occurrence of a damaged condition of an optical component of the optoelectronic device. The probing system is based on an optical detection of possible damages occurring to the optical component. The proposed configuration does therefore not rely on an electrically conductive trace, but is rather based on total internal reflection of probing light into an optical substrate of the optical component. Detection of the light after propagation in the optical substrate allows monitoring variations in the behavior of the light, and thus detecting whether the optical component (e.g., an optical element of the optical component, and/or the optical substrate) suffer from a damaged condition. The configuration described herein provides thus an increase in the damage detection area compared to a conventional configuration based on a conductive trace, and provides area saving for the optical component and accordingly a reduction of the overall cost of the optoelectronic device.

[0011] According to various aspects, an optoelectronic device may include an optical component. The optical component may include an optical substrate configured to be transparent for light with wavelength in a predefined wavelength range. The optoelectronic device may further include a probing system including a light detector. The probing system may further include an optical system configured to: direct probing light into the transparent optical substrate to cause propagation of the probing light along the transparent optical substrate via total internal reflection; collect the probing light after propagation along the transparent optical substrate; and direct the collected probing light towards the light detector. The light detector may be configured to generate a detection signal representative of the probing light received at the light detector. The probing system may further include a processor configured to: receive the detection signal from the light detector; and identify a damaged condition of the optical component based on a variation of one or more properties of the probing light with respect to one or more predefined properties of the probing light. In some aspects, the optical component may further include an optical element disposed on the optical substrate and configured to allow transmission of light with wavelength in the predefined wavelength range. [0012] According to various aspects, a method of detecting a damaged condition of an optical component of an optoelectronic device is provided. The optical component includes an optical substrate configured to be transparent for light with wavelength in a predefined wavelength range. The method includes: causing propagation of probing light along the transparent optical substrate via total internal reflection. The method further includes: detecting the probing light after propagation along the transparent optical substrate; and identifying a damaged condition of the optical component based on a variation of one or more properties of the probing light with respect to one or more predefined properties of the probing light. In some aspects, the optical component may further include an optical element disposed on the optical substrate and configured to allow transmission of light with wavelength in the predefined wavelength range.

[0013] The probing system and probing method described herein are thus based on optical radiation as monitored parameter, rather than on a capacitance or a resistivity, which allows avoiding the issues related to complex designs of electrically conductive traces. Illustratively, the optical probing system may provide an interlock feature without using a conductive electrical circuit that connects the optical component and an integrated circuit. The optical radiation is conveyed by means of optical elements to a monitoring element (illustratively, a light detector). The monitoring element receives only the monitoring optical radiation, so that the measurement is not affected by stray light or by ambient light, thus increasing the signal to noise ratio and the overall efficiency of the detection.

[0014] The probing system and probing method described herein enable detection of various possible damaged conditions of the optical component. As an example, the probing system may enable detection of cracks and damages in any sub-components of the optical component (e.g., in the substrate itself and/or in a micro lens array, diffractive optical element, etc.). As another example, the probing system may enable detection of whether the optical component is in place (e.g., may enable detection of whether some micro-lenses are missing). As a further example, the probing system may enable detection of contaminations in the optical element and/or optical substrate, such as a stain, a liquid droplet, a powder contamination or other pollution, e.g. in or on the inner/outer surfaces of the optical component.

[0015] In a preferred configuration, an optoelectronic device configured for light emission may include the probing system described herein. In this scenario, the probing system allows monitoring the integrity of the optical component, thus allowing to trigger an eye-safety mechanism (e.g., an interruption of the light emission, a decrease in the power of the emitted light, and/or the like) in a reliable and precise manner. Exemplary optoelectronic devices, in which the probing system may be integrated, may include world and front facing illuminators for 3D sensing (e.g., time-of-flight, pattern, stereo), or for augmented reality (gaming, industrial, educational, driver monitoring, etc.). Illustratively, in various aspects the probing system may be an optical eye safety interlock capable of enacting an eye safety interlock feature without using a conductive electrical circuit that connects the optical component and an integrated circuit. [0016] It is however understood that, in general, the probing system described herein may also be part of an optoelectronic device configured for light collection (e.g., a solar cell) and/or light detection (e.g., an optoelectronic device including a photo diode). In this scenario, the probing system allows monitoring the presence of damages in the optical component, thus prompting maintenance or replacement of the damaged portions, and ensuring a smooth and reliable operation of the optoelectronic device.

[0017] The optoelectronic device including the probing system may be integrated in a host device that exploits the optoelectronic device to implement one or more functionalities (e.g., telecommunications, distance measurements, object tracking, and the like). Exemplary host devices may include a mobile communication device (e.g., a smartphone, a tablet, a laptop), a vehicle (e.g., a car), an automated machine (e.g., a drone, a robot), and the like.

[0018] FIG .1A and FIG.1B show an optoelectronic device 100a, 100b (collectively referred to as optoelectronic device 100) in a schematic representation, according to various aspects. In general, the optoelectronic device 100 may be configured for any desired application. As an example, the optoelectronic device 100 may be configured as a three-dimensional sensor, illustratively as a depth sensor. As other examples, the optoelectronic device 100 may be configured as a time-of-flight sensor, a proximity sensor, a stereo vision sensor, and the like. It is understood that the representation of the optoelectronic device 100 in FIG. 1A and FIG. IB (and further in FIG.1C and FIG. ID) may be simplified for purpose of illustration, and that the optoelectronic device 100 may include additional components with respect to those shown. As examples, the optoelectronic device 100 may further include one or more capacitors, one or more optical filters, one or more processors, one or more lenses, and/or the like. [0019] The optoelectronic device 100 may include an optical component 102. The optical component 102 may be disposed (e.g., integrated) in the optical path along which the optoelectronic device 100 emits and/or receives light (see also FIG. IB). Illustratively, the optical component 102 may be configured to direct light into the field of illumination of the optoelectronic device 100 and/or may be configured to collect light from the field of view of the optoelectronic device 100.

[0020] The optical component 102 may include an optical element 104 configured to allow transmission of light. For example, the optical element 104 may be configured to be transmissive for light with wavelength in a predefined wavelength range, for example in the range of emission of the optoelectronic device 100 or in the range of detection of the optoelectronic device 100. Illustratively, the optical element 104 may be configured to allow light to pass through the optical element 104, from one side of the optical element 104 to the other side of the optical element 104. As an example, the optical element 104 may be configured to collimate light (e.g., for light emission), or the optical element 104 may be configured to focus light (e.g., onto a light sensor, for example for light detection). In various aspects, the optical element 104 may be a lens element, e.g. a micro-lens array (MLA). As another example, the optical element 104 may be configured to receive light and output (e.g., generate) a light pattern, such as for example a stripe pattern or a dot pattern. In various aspects, the optical element 104 may be a diffractive optical element (DOE). [0021] The optical component 102 may further include an optical substrate 106 configured to be transparent for light with wavelength in the predefined wavelength range, e.g. in the range of emission/detection of the optoelectronic device 100. The optical substrate 106 may include or may consist of any suitable material that is transmissive for the desired wavelengths. As examples, the optical substrate 106 may include or may consist of glass, such as borosilicate glass, or plastic (e.g., a transparent polymer).

[0022] The optical element 104 may be disposed the optical substrate 106, e.g. the optical element 104 may be formed or placed on the optical substrate 106, which thus provides support for the optical element 104. In various aspects, the optical element 104 may be directly coupled to the optical substrate 106, e.g. the optical element 104 may be in direct physical contact with the optical substrate 106. In another configuration, a spacer may be interposed between the optical element 104 and the optical substrate 106, e.g. to provide a mounting support for the optical element 104. For example, an optical filter may be interposed between the optical element 104 and the optical substrate 106, and the optical filter may be configured to allow light with wavelength in the predefined wavelength range to pass through, and to block light with wavelength outside of the predefined wavelength range.

[0023] In an exemplary configuration, the optical substrate 106 may be disposed facing the field of illumination and/or field of view of the optoelectronic device 100. Considering light emission, the optical substrate 106 may be disposed optically downstream of the optical element 104 along the emission direction of light emitted by the optoelectronic device 100. Considering light detection, the optical substrate 106 may be disposed optically upstream of the optical element 104 along the detection direction/reception direction of light received at the optoelectronic device 100. It is however understood that also the opposite configuration may be provided.

[0024] The optoelectronic device 100 may further include a probing system 108 configured to monitor the integrity of the optical component 102. Illustratively, the probing system 108 may be configured to optically inspect the state of the optical component 102 and detect the presence or the occurrence of possible defects or damages that may impair the operation of the optoelectronic device 100. The probing system 108 may thus be a damage detection system to detect a damaged condition of the optical component 102, as discussed in further detail below. In some aspects, the probing system 108 may be referred to as optical eye safety interlock, e .g . in the case that the optoelectronic device 100 is configured for light emission.

[0025] As an abridged overview, the probing system 108 may be configured to use probing light 114 to determine the state of the optical component 102. The probing system 108 may be configured to detect and analyze variations in the probing light 114 with respect to a predefined (e.g., known, reference, or expected) behavior of the probing light 114. Such variations in the probing light 114 may be caused by a damaged condition of the optical component 102, so that if the probing system 108 detects a variation in the probing light 114, the probing system 108 may determine that the optical component 102 is currently damaged and/or detached. The probing light 114 may also be referred to herein as monitoring light, or monitoring radiation.

[0026] The probing system 108 may include a light detector 110 configured to detect light (illustratively, the probing light 114b collected after propagation in the optical substrate 106). The light detector 110 may be adapted according to the properties of interest of the probing light 114b to be monitored/detected. According to various aspects, the light detector 110 may include one or more photo diodes, for example a one-dimensional array of photo diodes or a two-dimensional array of photo diodes. As examples, the light detector 110 may include at least one of a PIN photo diode, an avalanche photo diode (APD), a single-photon avalanche photo diode (SPAD), or a silicon photomultiplier (SiPM). The light detector 110 (e.g., the one or more photo diodes) may be configured to be sensitive for the probing light 114. In general, the light detector 110 may be configured to generate a detection signal 112 representative of the light received (and detected) at the light detector 110, as discussed in further detail below.

[0027] The probing system 108 may further include an optical system 116 configured to direct the probing light 114 into the transparent optical substrate 106 to cause propagation of the probing light 114 along the transparent optical substrate 106 via total internal reflection. The optical system 116 may be configured to introduce the probing light 114 into the optical substrate 106 in such a way that the probing light 114 remains within the optical substrate 106 and propagates for total internal reflection along the optical substrate 106. Illustratively, the optical system 116 may be configured such that the probing light 114 reaches the inner surfaces 118a, 118b of the optical substrate 106 at an angle of incidence equal to or greater than the critical angle. In this regard, the optical substrate 106 may be configured to enable propagation of (probing) light within the optical substrate 106 via total internal reflection. In general, strategies and components to obtain total internal reflection are known in the art, in the present disclosure (e.g., see FIG.2A to FIG.2D, and FIG.3A to FIG.3E) implementations that have been found particularly suitable for integration in an optoelectronic device will be discussed.

[0028] In principle, the probing described herein may be carried out with or without the optical element 104 being disposed on the optical substrate 106 (see also FIG. IE). In some aspects, the probing system 108 may thus be configured to carry out the probing on the optical substrate 106 alone. In this scenario, a damaged condition of the optical component 102 may be a damaged condition of the optical substrate 106. In other aspects, the probing system 108 may be configured to carry out the probing with the optical element 104 disposed on the substrate 106. In this scenario, additionally or alternatively, a damaged condition of the optical component 102 may be a damaged condition of the optical element 104. In some aspects, a plurality of probing operations may be carried out, e.g. a first probing on the optical substrate 106 alone, and a second probing with the optical element 104 disposed on the substrate 106, to evaluate different conditions of the optical component 102.

[0029] In FIG. 1A to FIG. ID the optical component 102 is shown as including the optical element 104 for illustration purposes, but it is understood that the aspects described in relation to FIG. 1 A to FIG. ID may apply in a corresponding manner to a configuration in which the optical element 104 is not (yet) disposed on the optical substrate 106.

[0030] In absence of the optical element 104, and considering an undamaged (in other words, intact) condition of the optical component 102, the probing light 114 injected into the optical substrate 106 may propagate undisturbed along the extension of the optical substrate 106 (see also the first configuration 150a in FIG. IE). The total internal reflection provides that the probing light 114 is reflected back at the surface 118a, 118b of the optical substrate 106, rather than passing through the surface 118a, 118b. Illustratively, the total internal reflection may provide that the probing light 114 reaching the interface defined by the surface 118a, 118b of the optical substrate 106 with the outside of the optical substrate 106 is reflected back in the volume of the optical substrate 106. In this connection, the optical substrate 106 (illustratively, the material of the optical substrate 106) may have an index of refraction greater than index of refraction of the environment surrounding the optical substrate 106. For example, the optical substrate 106 may have an index of refraction greater than the index of refraction of the medium around the optical substrate 106 (e.g., air).

[0031] According to various aspects, when the conditions for total internal reflection are met, the probing light 114 may propagate within the volume defined by the surfaces 118a, 118b of the optical substrate 106. Illustratively, the probing light 114 may propagate within the volume defined by a first plane corresponding to the first surface 118a, and a second plane corresponding to the second surface 118b. The first plane and the second plane may be orthogonal to the optical axis of the optical component 102, e.g. orthogonal to the optical axis of the optical element 104. The direction along which the probing light 114 propagates within the optical substrate 106 may thus be, in some aspects, orthogonal to the optical axis of the optical element 104.

[0032] If, however, the optical substrate 106 is damaged (e.g., scratched) or includes a surface contamination, part of the probing light 114 may escape the optical substrate 106. Illustratively, the presence of a surface damage or a surface contamination may cause a local disruption of the conditions for total internal reflection, so that at least part of the probing light 114 may leak outside. In some aspects, the decrease in light intensity when the optical substrate 106 alone is investigated may thus represent a damaged condition of the optical substrate 106.

[0033] In presence of the optical element 104 (see the second configuration 150b in FIG. IE), the probing light 114 may escape the optical substrate 106 in correspondence of the regions in which the optical element 104 is disposed. For example, considering an array of micro-lenses 152, the presence of a micro-lens 152 on the substrate 106 may cause a local disruption of the conditions for total internal reflection, so that the probing light 114 may leak outside of the optical substrate 106. Thus, when the optical element 104 is disposed on the optical substrate 106, ideally all the probing light 114 (or at least the most part, for example more than 50% or more than 70%, or more than 90%) should escape the optical substrate 106. In this scenario, a decrease in the light intensity (or even an absence of probing light at the receiver side) indicates that the optical element 104 is in place and it is not damaged (e.g., no parts are missing, no scratches are present, etc.).

[0034] On the other hand, as shown in the third configuration 150c in FIG. IE, damages in the optical element 104 may lead to the condition for total internal reflection to be maintained in correspondence of the damaged (e.g., contaminated) areas. For example, in case of a missing part of the optical element 104 (e.g., a gap 154 in the array of micro-lenses 152), the probing light 114 does not leave the optical substrate 106 upon impinging onto the surface of the optical substrate 106 in correspondence of the gap 154. A damaged condition of the optical element 104 may thus lead to a higher intensity of the probing light 114 at the receiver side compared to the scenario in which the optical element 104 is undamaged (e.g., intact, free of contamination, etc.).

[0035] A damaged condition of the optical component 102 may thus affect the probing light 114 during propagation within the optical substrate 106. For example, a damaged condition of the optical substrate 106 (without the optical element 104) may cause part of the probing light 114 to leak outside of the optical substrate 106. Illustratively, a damaged condition of the optical substrate 106 may cause a partial disruption of the conditions for total internal reflection, e .g . at one surface or at both surfaces 118a, 118b of the optical substrate 106. As another example, a damaged condition of the optical element 104 may cause the probing light 114 to remain within the optical substrate 106.

[0036] The optical system 116 may be further configured to collect the probing light 114 after propagation along the transparent optical substrate 106, and direct the collected probing light 114b towards the light detector 110. Illustratively, the optical system 116 may be configured to collect the probing light 114 exiting the optical substrate 106 after propagation, and may be configured to deliver (e.g., transmit) the collected probing light 114b to the light detector 110. Various implementations may be provided for collecting the probing light 114 exiting the optical substrate 106, which will be discussed in further detail in relation to FIG.2A to FIG.2D, and FIG.3A to FIG.3E.

[0037] By way of illustration, the optical system 116 may be configured to introduce (e.g., inject) the probing light at a first side (in other words, a first edge) of the optical substrate 106, and to collect the probing light at a second side (in other words, a second edge) of the optical substrate 106. The first side may be opposite the second side, illustratively in the direction along which the probing light propagates within the optical substrate 106.

[0038] In general, the optical system 116 may include a light transmission portion 120 for bringing (e.g., directing) the probing light 114 to the optical substrate 106. The optical system 116 may further include a light collection portion 122 to collect the probing light 114 after propagation in the optical substrate 106 and bring (e.g., direct) the collected probing light 114b to the light detector 110. Various possible implementations have been found suitable for providing the light transmission portion 120 and the light collection portion 122, and will be described in further detail in relation to FIG.2A to FIG.2D, and FIG.3A to FIG.3E. [0039] As mentioned above, the light detector 110 may be configured to generate a detection signal 112 representative of the probing light 114b received at the light detector 110. The detection signal 112 may represent one or more properties of the light (e.g., of the collected probing light 114b) received (and detected) at the light detector 110. In some aspects, the detection signal 112 may represent an intensity of the collected probing light 114b, as this has been found to provide a simple, yet efficient implementation of the strategy proposed herein. As other examples, additionally or alternatively, the detection signal 112 may represent an arrival time of the probing light 114b, a phase of the probing light 114b, a wavelength of the probing light 114b, a polarization of the probing light 114b, a dimension (e.g., a diameter) of the beam, and/or the like.

[0040] The probing system 108 may further include a processor 124 configured to receive the detection signal 112 from the light detector 110. In general, the detection signal 112 may be a digital signal and the processor 124 may be configured to carry out digital signal processing of the (digital) detection signal 112. For example, the light detector 110 may be configured to generate an electrical signal, such as a current, in response to light (e.g., the probing light 114b) arriving at the light detector 110, and the light detector 110 may include an analog-to-digital converter configured to convert the analog electrical signal into a digital signal for processing by the processor 124. It is however understood that, in principle, the processor 124 may be configured for analog signal processing, e.g. the detection signal 112 may be delivered as analog signal to the processor 124.

[0041] The processor 124 may be further configured to determine (e.g., to identify, or detect) a damaged condition of the optical component 102 based on a variation of one or more properties of the probing light 114, 114b with respect to one or more predefined properties of the probing light 114, 114b. Illustratively, the processor 122 may be configured to determine whether one or more properties of the probing light 114 introduced into the optical substrate 106 varied during propagation in the optical substrate 106, e.g. whether one or more properties of the probing light 114 have been affected during the propagation.

[0042] The processor 124 may be configured to compare one or more properties of the collected probing light 114b with one or more predefined (e.g., known, or expected) of the injected probing light 114, e.g. with one or more properties that the collected probing light 114b should have in case of an undamaged condition of the optical component 102. The one or more predefined properties may illustratively be the properties of the probing light 114 initially directed into the optical substrate 106. The processor 124 may be configured to determine (e.g., identify) a variation of the properties of the probing light 114 based on the comparison. Illustratively, the processor 124 may be configured to determine a difference between the one or more properties of the collected probing light 114b and the one or more predefined properties (e.g., the one or more initial properties of the probing light 114).

[0043] For example, the processor 124 may configured to determine the occurrence of a damaged condition of the optical component 102 if the value (e.g., the magnitude) of the variation is in a predefined range. For example, the processor 124 may configured to determine the occurrence of a damaged condition if the value of a respective variation of one or more of the properties of the probing light 114, 114b is greater than a predefined threshold. The predefined range may be a range of values for the variation of one or more of the properties of the probing light 114, 114b that are known to be associated with a damaged condition of the component 102. In a corresponding manner, the processor 124 may configured to determine the occurrence of a damaged condition if the variation of one or more of the properties of the probing light 114, 114b is outside a different type of predefined range, e.g. a range of acceptable values for the variation.

[0044] In a preferred configuration, the detection of the damaged condition of the optical component 102 may be based on the variation of the intensity of the probing light 114, 114b with respect to a predefined (e.g., initial) intensity of the probing light 114. The intensity has been found to provide a direct and reliable indication of damages and/or impurities in the optical component 102. Illustratively, if the optical element 104 is not (yet) disposed on the optical substrate 106, the light intensity may decrease in case part of the probing light 114 escapes from the optical substrate 106, e.g. due to a crack, or a detachment, or a surface contamination. In a corresponding manner, if the optical element 104 is disposed on the optical substrate 106, the light intensity may decrease if the optical element 104 is in place and intact, and may decrease less if the optical element 104 has damages, e.g. missing parts, contaminations, etc.

[0045] In this scenario, the processor 124 may be configured to determine the presence of a damaged condition of the optical component 102 based on a variation of the intensity of the probing light 114, e.g. based on a difference between the intensity of the collected probing light 114b with respect to a predefined (initial) intensity of the probing light 114. For example, the processor 124 may be configured to determine the presence of a damaged condition of the optical component 102 if the difference between the intensity of the collected probing light 114b with respect to the predefined intensity is in a predefined range. It is however understood that in principle the detection of the damaged condition of the optical component 102 may be based on a variation of other properties of the probing light 114, such as polarization, phase, wavelength, dimension of the light beam, and the like.

[0046] As an example, considering the optical substrate 106 alone, the processor 124 may be configured to determine the presence of a damaged condition of the optical substrate 106 if the intensity of the collected probing light 114b is less than the intensity of the injected probing light 114 by a predefined amount, e.g. if the intensity of the collected probing light 114b is less than 90% of the intensity of the injected probing light 114, or less than 70%, or less than 50%, as numerical examples.

[0047] As another example, considering the optical element 104 disposed on the optical substrate 106 the processor 124 may be configured to determine the presence of a damaged condition of the optical element 104 if the intensity of the collected probing light 114b is greater than a reference intensity. The reference intensity may be the light intensity that the probing light 114b would have in case of an undamaged optical element 104 (e.g., ideally zero, or substantially zero). [0048] A damaged condition of the optical component 102 may be or include any variation in a state of the optical component 102 capable of causing a variation in the behavior of the probing light 114, e.g. capable of causing a variation in one or more properties of the probing light 114 (e.g., a decrease in the intensity for the optical substrate alone 106, or an increase in intensity if the optical element 104 is present).

[0049] As an example, a damaged condition of the optical component 102 may include a crack in the optical element 104 and/or in the optical substrate 106. As another example, a damaged condition of the optical component 102 may include a detaching of the optical element 104 from the optical substrate 106 (e.g., a detaching of one or more micro-lenses of a micro-lens array). As a further example, a damaged condition of the optical component 102 may include a misalignment of the optical element 104 with respect to the optical substrate 106. As a further example, a damaged condition of the optical component 102 may include a surface contamination of the optical element 104 and/or a surface contamination of the optical substrate 106.

[0050] By monitoring the signal variation of a probing light 114 that is guided through a transparent substrate 106 within which the light 114 is subject to total internal reflection, and finally to a light detector 110, it is possible to detect whether substrate 106 is damaged and/or whether the optical element 104 disposed on the face of the transparent substrate 106 is damaged. As another example, it is possible to detect whether the optical element 104 disposed on the face of the transparent substrate 106 is in place. As a further example, it is possible to detect whether any sub-component of the optical component 102 (e.g., the optical element 104 or the substrate 106 itself) has a stain, a liquid droplet, powder contamination or other pollution on the surface.

[0051] According to various aspects, the processor 124 may be configured to generate an output signal representative of the damaged condition of the optical component 102. The output signal may represent the occurrence of the damaged condition, e.g. to prompt maintenance or replacement of the optical component 102. Additionally or alternatively, the output signal may represent the type of damaged condition, e.g. a crack, a detaching, etc. In some aspects, the processor 124 may be configured to generate a control signal (e.g., as part of the output signal, or as separate signal) to instruct a safety procedure in the optoelectronic device 100, as discussed in further detail in relation to FIG. IB.

[0052] According to various aspects, the processor 124 may include or may be coupled with a memory (not shown). For example, the memory may be part of the processor 124. As another example, the memory may be external to the processor 124 and the processor 124 may be communicatively coupled with the memory (e.g., with the cloud). The memory may store predefined values of the properties of the probing light 114, e.g. predefined values of the variation of the properties of the probing light 114. For example, the memory may store the value of a variation of the properties of the probing light 114 associated with a corresponding damaged condition of the optical component 102 (e.g., as a look-up table). The processor 124 may be configured to compare a value of a detected variation of the properties of the probing light 114 with the values stored in the memory to identify a damaged condition of the optical component 102.

[0053] By way of illustration, the optical component 102 and the probing system 108 may provide together a smart optical system capable of prompting immediate action in case of damages occurring to the optical component 102. In the present disclosure reference is made to the integration of such smart optical system in an optoelectronic device, as this may be the most relevant use case, also in view of possible implementations of the probing system 108 (e.g., ofthe optical system 116), discussed in further detail below. It is however understood that in principle the optical component 102 and the probing system 108 may also be for use in other types of devices or scenarios.

[0054] According to various aspects, as shown in FIG. IB, the optoelectronic device 100b may include an optoelectronic component 130 configured for emitting light or for receiving light. The optical component 102 may be configured to define a field of illumination of the optoelectronic component 130 or a field of view of the optoelectronic component 130, respectively. It is understood that the optoelectronic device 100b may include more than one optoelectronic component 130, each associated with a corresponding optical component 102 (and, optionally, a corresponding probing system 108).

[0055] In a preferred configuration, the optoelectronic component 130 may be configured to emit light. In this type of application, the configuration of the probing system 108 allows monitoring the safety of the light emission through the optical component 102 with increased reliability. In this scenario, the optoelectronic component 130 may be or include a light source configured to emit light through the optical component 102 (e.g., through the optical element 104). Illustratively, the optical element 104 may be configured to direct the light emitted by the light source into a field of illumination of the optoelectronic device 100b. The optical element 104 may be configured to define a field of illumination for the light source. Additionally or alternatively, the optical element 104 may be configured to project the light emitted by the light source as a light pattern (e.g., as a dot pattern, for example for face recognition applications).

[0056] As an example, the light source may be or include a laser source, e.g. a Vertical Cavity Surface Emitting Laser (VCSEL) or a VCSEL-array. The light source may be configured to emit light having a predefined wavelength, for example in the visible range (e.g., from about 380 nm to about 700 nm), infrared and/or near-infrared range (e.g., in the range from about 700 nm to about 5000 nm, for example in the range from about 860 nm to about 1600 nm), or ultraviolet range (e.g., from about 100 nm to about 400 nm).

[0057] It is however understood that, in principle, the optoelectronic component 130 may alternatively be configured for receiving light and generating a corresponding electrical signal, e.g. a corresponding electrical current. In this scenario, the optoelectronic component 130 may be or include a light sensor (e.g., a photo diode), e.g. as part of a detection system or as part of a solar cell, as examples. The light sensor may be configured to be sensitive for light having wavelength in a predefined range, e.g. one of the ranges described above in relation to the light source. As examples, a light sensor may include at least one of a PIN photo diode, an avalanche photo diode (APD), a single-photon avalanche photo diode (SPAD), or a silicon photomultiplier (SiPM).

[0058] According to various aspects, the processor 124 may be configured to control the optoelectronic component 130 based on the monitoring of the probing light 114, 114b propagating in the optical substrate 106, e.g. based on the occurrence of a damaged condition of the optical component 102. Illustratively, the processor 124 may be configured to transmit a control signal to the optoelectronic component 130 (e.g., to a driver of the optoelectronic component 130, e.g. a laser driver). The control signal may instruct an adaptation of the operation of the optoelectronic component 130 in response to the processor 124 detecting a damaged condition of the optical component 102, e.g. the control signal may trigger a safety-procedure.

[0059] For example, the processor 124 may be configured to instruct the optoelectronic component 130 to stop operating in case the processor 124 detects a damaged condition of the optical component 102. In case the optoelectronic component 130 is a light source, the processor 124 may be configured to instruct the light source (e.g., a driver of the light source) to adapt the light emission in response to the detection of the damaged condition of the optical component 102. As an example, the processor 124 may be configured to instruct (via the control signal) an interruption of light emission by the light source upon detecting the damaged condition of the optical component 102. As another example, additionally or alternatively, the processor 124 may be configured to instruct the light source to reduce the power of the emitted light upon detecting the damaged condition of the optical component 102. As a further example, additionally or alternatively, the processor 124 may be configured to instruct the light source to change the wavelength of the emitted light (e.g., to a wavelength less likely to cause eye damage) upon detecting the damaged condition of the optical component 102.

[0060] FIG.1C and FIG.1D show two possible configurations for providing the probing light 114 in a schematic representation, according to various aspects.

[0061] According to various aspects, as shown in FIG.1C, part of the light emitted by the optoelectronic component 130 of the optoelectronic device 100c may be used as probing light 114. Illustratively, in this configuration the optoelectronic component 130 of the optoelectronic device 100c may be a light source having a dual function, i.e. the conventional function as part of the operation of the optoelectronic device 100c and the further function of providing light used as probing light 114 for monitoring the optical component 102. In this configuration, the optical system 116 may be configured to receive part of the light emitted by the light source 130 to be directed as probing light 114 into the transparent optical substrate 106 (see also FIG.3A to FIG.3C).

[0062] In principle, part of the light emitted by the light source 130 towards the field of illumination of the optoelectronic device 100c may be deflected to be collected by the optical system 116 and directed into the optical substrate 106. For example, the optoelectronic device 100c may include a beam splitter configured to direct a fraction of the light emitted by the light source 130 to the optical system 116, for example a fraction in the range from 10% to 40% of the emitted light, for example a fraction in the range from 15% to 25% of the emitted light.

[0063] In a preferred configuration, which provides a more efficient light emission of the optoelectronic device 100c (illustratively, without reducing the emitted intensity for providing the probing light 114), the light source 130 may be configured to emit light in more than one direction. The light source 130 may thus be configured to emit light in a first direction towards the field of illumination of the optoelectronic device 100c, and in a second direction towards the optical system 116 (e.g., towards the light transmission system 120).

[0064] For example, the light source 130 may include a first emitting surface 132 and a second emitting surface 134. The first emitting surface 132 may be configured (e.g., oriented) to emit light towards the optical component 102 (and accordingly towards the field of illumination of the optoelectronic device 100c). The second emitting surface 134 may be configured (e.g., oriented) to emit light towards the optical system 116. Illustratively, the optical system 116 may be configured to receive light from the second emitting surface 134 to be directed as probing light 114 into the transparent optical substrate 106. Such configuration provides an overall compact arrangement of the optoelectronic device 100c, with an efficient utilization of the various components.

[0065] In other aspects, as shown in FIG. ID, the probing system 108 may have a dedicated light source 136 configured to emit the probing light 114. The light source 136 may be additional to the optoelectronic component 130 (e.g., to the light source 130). For example, the light source 136 may be or include a laser source, e.g. a Vertical Cavity Surface Emitting Laser (VCSEL) or a VCSEL-array. Having a dedicated light source 136 allows more freedom in the operation of the optoelectronic device lOOd, illustratively by decoupling the operation of the probing system 108 from the operation of the optoelectronic component 130.

[0066] The monitoring optical radiation may thus be generated by means of an emission element with double-side emitting surfaces (as shown in FIG. 1C), collecting part of the emitted light. As an alternative configuration, the emission element 136 may be a dedicated component that is not used as main device emission component.

[0067] FIG.2A to FIG.2D show possible configurations of an optical system 200a, 200b, 200c, 200d. Illustratively, the optical systems 200a, 200b, 200c, 200d may be exemplary realizations of the optical system 116 (e.g., of the light transmission portion 120 and light collection portion 122) described in relation to FIG.1A to FIG. ID. For purpose of illustration, the other components of the probing system and/or optoelectronic device are not shown in FIG.2A to FIG.2D, but it is understood that the aspects discussed in relation to the optical systems 200a, 200b, 200c, 200d may apply to any of the configurations described in relation to FIG. 1 A to FIG. ID (see also FIG.3A to FIG.3E), and vice versa. [0068] In general, various possibilities exist to deliver the probing light 114 to the optical substrate 106 and to deliver the collected probing light 114b to the light detector 110 (not shown in FIG.2A to FIG.2D). In the context of optoelectronic devices it has been found to providing at least one optically guided path for the probing light 114, 114b ensures a robust integration of the optical system 116, 200a-200d. The optical system may thus include at least an optically guided path for guiding the probing light 114 into the optical substrate 106 and/or an optically guided path for guiding the probing light 114b to the light detector 110. An optically guided path may be integrated (e.g., embedded) in the optoelectronic device, e.g. in the substrate and/or the housing of the optoelectronic device, thus ensuring a robust structural support to the components of the optical system. The monitoring optical radiation may thus be delivered using: guided emitted light and guided collected light (FIG.2A and FIG.2B); free-space emitted light and guided collected light (FIG.2C); or guided emitted light and free-space collected light (FIG.2D).

[0069] An optically guided path from the source of probing light to the optical substrate may allow achieving a higher signal efficiency. Furthermore, an optically guided path may ensure that no stray light is generated in the module (illustratively, in the optoelectronic device). As another example, an optically guided path may allow a finer control over the area to probe. As a further example, an optically guided path may allow achieving a smaller module size.

[0070] At the collection/detection side, an optically guided path from the optical substrate to the light detector may allow to achieve higher signal efficiency and improve signal-to-noise ratio, since neither stray light nor ambient light can reach the light detector, and any variation can be traced back to the damaged condition of the optical component.

[0071] According to various aspects, as shown in FIG.2A, the optical system 200a may include two optical guiding elements 202, 204. The optical system 200a may include a first optical guiding element 202 configured to optically guide the probing light 114 to the transparent optical substrate 106. The optical system 200a may further include a second optical guiding element 204 configured to optically guide the probing light 114b collected after propagation along the transparent optical substrate 106 towards the detector 110.

[0072] In this configuration, the probing light generated by the main emission element or by a separate dedicated element is coupled into an optical guiding element that guides the light into the transparent substrate under test. The optical guiding element may be configured to guide the light to the transparent substrate under the total internal reflection condition. Considering an optical element 104 disposed on the substrate 106, the light 114 may exit through the optical element 104 disposed on the face of the transparent substrate 106, due to cracks or scratches on the substrate face (e.g., if no optical element 104 is present), due to the presence of contaminant agents on the surface, or more in general whenever the total internal reflection condition is not fulfilled anymore. On the other hand, if the optical element 104 is damaged or not in place, the probing light remains trapped inside the transparent substrate and more light can pass through the substrate and finally reach the detector (see the first configuration 150a in FIG. IE). The light that passes through the substrate without leaving it is coupled into another optical guiding element that guides the light to a detector element (illustratively, to the sensitive portion of the light detector). [0073] An optically guiding element 202, 204 may illustratively be a structure configured to confine the light and guide the light from an entrance point (an input) of the optically guiding element 202, 204 to an exit point (an output) of the optically guiding element 202, 204. Various structures or optical arrangements may be provided for optically guiding the probing light 114, 114b. As configurations that have been found to allow an efficient and robust integration in the context of optoelectronic devices, the first optically guiding element 202 and/or the second optically guiding element 204 may be an optical fiber, an optical waveguide, and/or a light guide. In general, to enable a simpler fabrication process, the first optically guiding element 202 and the second optically guiding element 204 may be of the same type (e.g., two optical fibers, two optical waveguides, etc.). It is however understood that in principle the first optically guiding element 202 and the second optically guiding element 204 may also be of different types.

[0074] In an exemplary configuration, which may provide for a simple fabrication of the optoelectronic device, the first optically guiding element 202 and/or the second optically guiding element 204 may be flexible, e.g. a flexible optical waveguide or a flexible optical fiber. The use of a flexible component allows a separate fabrication of the various parts of the optoelectronic device. Illustratively, a substrate with the optoelectronic component (and optionally with the dedicated light source of the probing system) may be provided first, and then the flexible optically guiding element allows a simple connection with the optical substrate to allow delivery/collection of the probing light.

[0075] In general, the first optically guiding element 202 may be configured to optically guide the probing light 114 at a first side of the optical substrate 106. In a preferred configuration, which allows a more efficient injection of the probing light 114 to achieve total internal reflection, the first optically guiding element 202 may be configured to optically guide the probing light 114 into a first side surface (in other words, a first lateral surface) of the transparent optical substrate 106.

[0076] In a corresponding manner, the second optically guiding element 204 may be configured to optically guide the probing light 114b collected at a second side of the optical substrate 106. In a preferred configuration, which allows a more efficient collection of the probing light 114b after propagation in the optical substrate 106, the second optically guiding element 204 may be configured to optically guide the probing light 114b collected at a second side surface (in other words, a second lateral surface) of the transparent optical substrate 106. The first side surface may be opposite the second side surface along the propagation direction of the probing light 114 in the optical substrate 106.

[0077] The coupling between an optically guiding element 202, 204 and the optical substrate 106 may be adapted depending on the desired configuration, e.g. depending on the type of optically guiding element 202, 204. In a simple configuration, the optically guiding element 202, 204 may be directly coupled with the optical substrate 106, illustratively without further intervening optical elements disposed between the optically guiding element 202, 204 and the optical substrate 106. In this configuration, an optically guiding element 202, 204 may be in direct contact with the optical substrate 106 (e.g., with the respective side surface), to provide a robust coupling. Alternatively, a gap may be present between the end portion of the optically guiding element 202, 204 and the optical substrate 106 (e.g., the respective side surface). For example, a direct coupling with a side surface of the optical substrate 106 may be provided in case the optically guiding element 202, 204 is flexible (see also FIG.3 A).

[0078] In another configuration, as shown in FIG.2B, the optical system 200b may include an optical coupling element 206, 208 to couple an optically guiding element 202, 204 with the optical substrate 106.

[0079] The optical system 200b may include a first coupling element 206 configured to couple the first optical guiding element 202 with the transparent optical substrate 106 (e.g., with the first side surface of the optical substrate 106). The first coupling element 206 may be configured to allow transfer of probing light 114 from the first optical guiding element 202 into the transparent optical substrate 106. Illustratively, the first coupling element 206 may be configured to modify the propagation direction of the probing light 114 at the output of the first optical guiding element 202 to guide the probing light 114 into the transparent optical substrate 106 (e.g., into the first side surface). As an exemplary configuration, the first coupling element 206 may be or include a (first) prism.

[0080] In a corresponding manner, additionally or alternatively, the optical system 200b may include a second coupling element 208 configured to couple the second optical guiding element 204 with the transparent optical substrate 106 (e.g., with the second side surface of the optical substrate 106). The second coupling element 208 may be configured to allow transfer of probing light 114b from the transparent optical substrate 106 to the second optical guiding element 204. Illustratively, the second coupling element 208 may be configured to modify the propagation direction of the probing light 114b at the exit from the optical substrate 106 (e.g., at the second side surface) to guide the probing light 114b into the second optical guiding element 204. As an exemplary configuration, the second coupling element 208 may be or include a (second) prism.

[0081] The use of one or more coupling elements 206, 208 may allow a robust integration in the optoelectronic device, e.g. in case the coupling element(s) 206, 208 and/or the optical guiding element(s) 202, 204 are integrated (e.g., embedded) in a housing of the optoelectronic device (see also FIG.3B to 3E).

[0082] The representation in FIG.2B shows a configuration in which the optical system 200b includes a respective coupling element 206, 208 for both the first optical guiding element 202 and the second optical guiding element 204. It is however understood that in principle a different configuration may be provided for the two optical guiding elements 202, 204, e.g. a configuration in which one of the optical guiding elements 202, 204 is directly coupled with the optical substrate 106 and the other one is coupled to the optical substrate 106 via a coupling element 206, 208.

[0083] In some aspects, additionally or alternatively to the coupling element(s) 206, 208 to couple the optical guiding element(s) 202, 204 with the optical substrate, the optical system 200a, 200b, 200c, 200d may include further optical coupling elements. As an example, an optical system 200a, 200b, 200c, 200d may include a further (e.g., third) optical coupling element (e.g., a prism) to couple the first optical guiding element 202 with the light source generating the probing light 114. Illustratively, the third optical coupling element may be configured to direct the light emitted by the light source to the input of the first optical guiding element 202. As a further example, an optical system 200a, 200b, 200c, 200d may include a further (e.g., fourth) optical coupling element (e.g., a prism) to couple the second optical guiding element 202 with the light detector 110. Illustratively, the fourth optical coupling element may be configured to direct the light output by the second optical guiding element 204 to the light detector 110.

[0084] In general, the use of a prism as coupling element (e.g., a first, second, third, or fourth coupling element) may provide an efficient integration in an optoelectronic device (e.g., in the substrate or the housing of the device, see also FIG.3A to FIG.3E). It is however understood that other components may be used as coupling element. As other examples, a coupling element (e.g., the first, second, third, and/or fourth coupling element) may be or include a lens, a diffractive grating, a meta-surface grating, or a volume holographic grating.

[0085] As mentioned above, the optical guiding element(s) 202, 204 and/or the optical coupling element(s) 206, 208 may be integrated (e.g., embedded) within the structure of the optoelectronic device 100. In various aspects, the optoelectronic device 100 may include a substrate, and the optical guiding element(s) 202, 204 and/or optical coupling element(s) may be embedded (or deposited) in/on the substrate. As exemplary materials, the substrate may include FR4, polyimide, glass, silicon, and the like. For example, the substrate may be a printed circuit board. Illustratively, the optoelectronic component(s) of the optoelectronic device may be integrated on the substrate. In some aspects, the processor 124 of the probing system 108 may be integrated on the substrate.

[0086] In various aspects (see also FIG.3A), the first optical guiding element 202 and/or the second optical guiding element 204 may be at least partially embedded in the substrate. For example the substrate may have a flexible core in which the optical guiding element(s) 202, 204 may be embedded, surrounded by one or more rigid regions providing structural support. For example, in a configuration that has been found to provide a flexibly adaptable, yet robust arrangement, the first optical guiding element 202 may be a flexible optical waveguide (or fiber) partially embedded in the substrate and partially disposed in free space. Additionally or alternatively, the second optical guiding element 204 may be a flexible optical waveguide (or fiber) partially embedded in the substrate and partially disposed in free space.

[0087] In various aspects, the optoelectronic device may include a housing (see also FIG.3A to FIG.3E). The housing may enclose the components of the optoelectronic device, e.g. the optoelectronic component 130. For example, the housing may enclose the light detector 110 of the probing system 108. Illustratively, the light detector 110 may be disposed within the housing such that the light detector 110 is screened (in other words, protected) from external light, illustratively from light other than the probing light 114, 114b. The housing may thus provide structural support to the optoelectronic device and may improve the efficiency of the probing of the optical component 102 by avoiding that interfering light reaches the light detector 110. As examples, the housing may be made of plastic, ceramic, an organic material, and the like. The housing may also be referred to as package element.

[0088] In an exemplary configuration, the housing of the optoelectronic device may be monolithic. This may provide a more robust arrangement, and an overall simpler fabrication process. In another configuration, the housing may include a plurality of individual portions, e.g. a first housing portion and a second housing portion. The optical component 102 may be coupled to one of the housing portions (e.g., the first housing portion). The housing portions may then be mechanically coupled to one another, or may be bonded to one another (e.g., via an adhesive, such as glue, via soldering, and the like). A configuration with individual housing portions may provide a more flexible fabrication process, in which separate parts may be fabricated separately and then coupled together in a final stage of the fabrication. [0089] In various aspects, the optical guiding element(s) 202, 204 and/or the optical coupling element(s) 206, 208 (or the further, third and fourth, optical coupling elements) may be embedded in the housing, e.g. fully or at least partially. This configuration may provide a solid integration of the optical system 200a, 200b, 200c, 200d within the optoelectronic device. Illustratively, the housing may include one or more walls, and the optical guiding element(s) 202, 204 and/or the optical coupling element(s) 206, 208 may be embedded in a respective wall of the housing (see also FIG.3B to FIG.3E). For example, the first optical guiding element 202 may be at least partially embedded in the housing. Additionally or alternatively, the second optical guiding element 204 may be at least partially embedded in the housing. Although not limited to this configuration, the embedding in the housing may be particularly suitable in case the optical guiding element(s) 202, 204 is/are a light guide. In a corresponding manner, the first optical coupling element 206 and/or the second optical coupling element 208 (as well as the third optical coupling element and/or the fourth optical coupling element) may be embedded in the housing.

[0090] In case the housing includes a plurality of individual portion, the optical guiding element(s) 202, 204 may be embedded in each of the housing portions. In this scenario, an optical guiding element 202, 204 may include a plurality of separate portions, each disposed (embedded) in a respective housing portion, which are then aligned to form the desired path for the probing light.

[0091] In various aspects, as shown in FIG.2C and FIG.2D, the optical system 200c, 200d may include one free-space optical path replacing one of the optical guiding elements 202, 204. In FIG.2C and FIG.2D, the optical system 200c, 200d are shown without optical coupling element(s) 206, 208 but it is understood that the aspects discussed in relation to FIG.2C and FIG.2D may apply in a corresponding manner to a configuration in which the optical system 200c, 200d includes an optical coupling element 206, 208. A configuration with a free-space optical path may provide a simpler fabrication process with a reduced cost of the overall components of the optoelectronic device.

[0092] As shown in FIG.2C, the optical system 200c may include a (first) free-space optical path 210 configured to allow free space propagation of the probing light 114 towards the transparent optical substrate 106. Illustratively, the optical system 200c may be free of further optical elements along the path from the light source generating the probing light and the optical substrate 106. In an exemplary configuration, the optical system 200c may include one or more clear optical apertures 212 (e.g., a single optical aperture 212, or a plurality of optical apertures) along the free-space optical path 210. The clear optical aperture(s) 212 may provide a propagation region (e.g., a propagation volume) for the probing light 114 from the light source to the optical substrate 106, while blocking probing light 114 diverging outside of the aperture 212. For example, the clear optical aperture(s) 212 may be defined by one or more portions of the housing of the optoelectronic device (see also FIG.3E), thus providing a simple integration within the overall fabrication process.

[0093] To facilitate the coupling of the probing light 114 propagating in the free-space optical path 210 with the optical substrate 106, the optical substrate 106 may include a (first) deflection surface 214. The deflection surface 214 may illustratively be a surface of the optical substrate 106 tilted with respect to the propagation direction of the probing light 114 in the free-space optical path 210. The tilting angle of the deflection surface 214 may be configured to enable total internal reflection of the probing light 114 within the optical substrate 106. In this configuration, the (first) free-space optical path 210 may be configured to allow free-space propagation of the probing light 114 toward the (first) deflection surface 214 of the optical substrate 106.

[0094] In a corresponding manner, as shown in FIG.2D, the optical system 200d may include a (second) free-space optical path 216 configured to allow free space propagation of the probing light 114b, after propagation along the optical substrate 106, from the optical substrate 106 to the light detector 110. Illustratively, the optical system 200d may be free of further optical elements (e.g., lenses, optical fibers, etc.) along the path from the optical substrate 106 and the light detector. In an exemplary configuration, the optical system 200d may include one or more clear optical apertures 218 (e.g., a single optical aperture 218, or a plurality of optical apertures) along the free-space optical path 216. The clear optical aperture(s) 212 may provide a propagation region (e.g., a propagation volume) for the probing light 114b from the optical substrate 106 to the light detector 110, while blocking probing light 114 diverging outside of the aperture 218. For example, the clear optical aperture(s) 218 may be defined by one or more portions of the housing of the optoelectronic device.

[0095] To facilitate the coupling of the probing light 114b from the optical substrate 106 to the (second) free-space optical path 216, the optical substrate 106 may include a (second) deflection surface 220. The deflection surface 220 may illustratively be a surface of the optical substrate 106 tilted with respect to the propagation direction of the probing light 114 in the (second) free-space optical path 216. The tilting angle of the deflection surface 220 may be configured to enable the probing light 114 to exit from the optical path 106 and propagate along the (second) free-space optical path 216. In this configuration, the (second) free-space optical path 216 may be configured to allow free-space propagation of the probing light 114b from the (second) deflection surface 220 of the optical substrate 106 to the light detector 110. [0096] Having in mind the possible configurations discussed in relation to FIG.2A to FIG.2D it is understood that the orientation of the light detector 110 and the light source may be adapted according to the configuration of the optical system 200a, 200b, 200c, 200d. Illustratively, the orientation of the sensitive side of the light detector 110 and/or the direction into which the light source or the dedicated light source emit may be adapted according to the selected configuration of the optical system 200a, 200b, 200c, 200d.

[0097] FIG.3A to FIG.3E show an optoelectronic device 300a, 300b, 300c, 300d, 300e in a schematic representation, according to various aspects. Illustratively, the optoelectronic device 300a-300e may be an exemplary realization of the optoelectronic device 100, and illustrate exemplary implementations of the probing system 108, optical system 116, 200a, 200b, 200c, 200d described in relation to FIG.1A to FIG.2D. FIG.3A to FIG.3E.

[0098] The optoelectronic device 300a-300e may include an optical component 302. The optical component 302 may include an optical substrate 306 and an optical element 304 disposed on the substrate. The optical component 302, optical substrate 306, and optical element 304 may be configured as the optical component 102, optical substrate 106, and optical element 104 discussed in relation to FIG.1A to FIG.2D. For example, the optical element 304 may be a micro-lens array, or a diffractive optical element.

[0099] The optoelectronic device 300a-300e may include an optoelectronic component 308, e.g. configured as the optoelectronic component 130. In particular, in the configuration in FIG.3A to FIG.3E, the optoelectronic component 308 may be a light source (e.g., a laser source, such as a VCSEL). It is however understood that the aspects described in relation to FIG.3A to FIG.3E may apply in a corresponding manner to a configuration in which the optoelectronic component 308 is configured for receiving light, e.g. in case the optoelectronic component 308 is a light detector.

[00100] According to various aspects, the optoelectronic device 300a-300e may optionally include a lens 310 disposed in the optical path between the optoelectronic component 308 and the optical component 302. The lens 310 may enhance the collimation of the light emitted by the optoelectronic component 308 prior to the optical component 302 directing or projecting the light into the field of illumination of the optoelectronic device 300a-300e.

[00101] The optoelectronic device 300a-300e may include a housing 312a-312e that encloses the optoelectronic component 308 and provides structural support for the optoelectronic device 300a-300e. The optical component 302 may be coupled to the housing 312a-312e, e.g. may be placed or disposed in a corresponding supporting structure of the housing 312a-312e.

[00102] According to various aspects, as shown in FIG.3A and FIG.3B, the housing 312a, 312b may include a plurality of individual portions (in other words, parts), e.g. a first portion 314a, 314b and a second portion 316a, 316b as an example, or more than two portions. The individual portions may be coupled to one another, e.g. mechanically or via other type of bonding (e.g., soldering, adhesive, and the like). In this configuration, the optical component 302 may be coupled with one of the individual housing portions, e.g. with the first portion 314a, 314b. Optionally, the lens 310 may be coupled with the same housing portion 314a, 314b as the optical component 302. The optical component 302 and the corresponding housing portion 314a, 314b (and optionally the lens 310) may be understood as an optical assembly 318a, 318b (e.g., a lens assembly). Having separate individual housing portions allows fabricating the optical assembly separately from the rest of the optoelectronic device 300a, 300b, thus increasing the flexibility in the manufacturing process.

[00103] In this configuration, the module housing may illustratively, be used as reference for the lens assembly 318a, 318b. The lens assembly 318a, 318b may include a lens barrel (illustratively, the mechanical structure supporting the assembly, in this case the supporting part of the housing portion 314a, 314b), one or more lenses 310 (may be also not in place, illustratively not assembled), and the optical component 302.

[00104] In other aspects, as shown in FIG.3C to FIG.3E, the housing 312c-312e may be monolithic. Illustratively, in this configuration the housing 312c-312e may be a single piece (e.g., may include a single part). This configuration may provide a simpler fabrication process avoiding the step of coupling the separate housing portions with one another.

[00105] The optoelectronic device 300a-300e may include a probing system to monitor the integrity of the optical component 302. The probing system may include a light detector 320 configured to receive probing light after propagation via total internal reflection in the optical substrate 306. As mentioned above, the light detector 320 may be disposed within the housing 312a- 312e such that the light detector 320 is protected from light other than the probing light. For example the housing 312a-312e may include a protrusion (in other words, a protuberance) covering the light detector 320 from the light propagating along the optical path between the optoelectronic component 308 and the optical component 302.

[00106] FIG.3A to FIG.3E illustrate various possible configurations for generating the probing light, and for delivering the probing light to the optical substrate 306 and to the light detector 320. It is understood that the configurations in FIG.3A to FIG.3E are not intended to be limiting and other combinations of the aspects discussed in relation to FIG. 1A to FIG.2D may be provided.

[00107] In the optoelectronic device 300a in FIG.3A, the probing system may include, as optical guiding elements, a first optical waveguide 322 and a second optical waveguide 324. The first optical waveguide 322 and a second optical waveguide 324 may be directly coupled with a respective side surface of the optical substrate to inject and collect the probing light, respectively. In the configuration in FIG.3A, the optical waveguides 322, 324 may be partially embedded in the substrate of the optoelectronic device 300a. Illustratively, the optical waveguides 322, 324 may have a first (rigid) portion embedded in the substrate 326a and a second (flexible) portion disposed in free-space to enable a simple coupling with the optical substrate 306. The substrate may have, for example, a rigid-flexible-rigid configuration, wherein the optical waveguides 322, 324 are embedded (illustratively, layered) between an upper rigid portion and a lower rigid portion.

[00108] In the optoelectronic device 300a the optoelectronic component 308 may be a light source having a first emitting surface 328 configured (e.g., disposed, or oriented) to emit light towards the field of illumination of the optoelectronic device 300a. The light source 308 may have a second emitting surface 330 configured (e.g., disposed, or oriented) to emit light used as probing light in the probing system. The first optical waveguide 322 may thus receive the probing light from the second emitting surface 330 of the optoelectronic component 308.

[00109] The first optical waveguide 322 may be optically coupled with the second emitting surface 330 of the optoelectronic component 308 via a (first) optical coupling element 332, e.g. a prism. In a corresponding manner, the second optical waveguide 324 may be optically coupled with the light detector 320 via a (second) optical coupling element 334, e.g. a prism. For example, as shown in FIG.3A, the first optical coupling element 332 and/or the second optical coupling element 334 may be embedded in the substrate 326a. It is however understood that the relative disposition of the input/output of the optical waveguides 322, 324 and of the (optional) coupling elements 332, 334 maybe adapted depending on the disposition of the light source 308 and light detector 320.

[00110] The optoelectronic device 300a may thus be realized by means of a rigid-flex-rigid substrate 326a, in which the flex part is layered in between the rigid parts (could be also the opposite or different). The optical waveguides 322, 324 may be embedded in the flex part of the substrate 326a. In the exemplary configuration in FIG.3A, the substrate 326a may have two apertures (emission aperture/monitoring aperture), where two optical coupling elements 332, 334 (e.g., prisms, or may also be different lenses) are linked to the waveguides 322, 324. The flexible parts of the waveguides 322, 324 protrude to reach two opposite side of the optical substrate (this could be realized also passing through the lens assembly / barrel element, as shown in FIG.3 A).

[00111] A main emission element 308 of the optoelectronic device 300a, e.g. a double surface emitting VCSEL, may include a primary emitting surface 328 to serve the main optical function of the product and a secondary emitting surface 330 to be used as source for the monitoring light signal (illustratively, for the probing light). The double-side emitting VCSEL may be assembled on top of an aperture (emission aperture) on the substrate 326a.

[00112] A receiving element (illustratively, the light detector 320, e.g. a photo diode) may be used as monitoring device for the monitoring light signal. For example, the light detector 320 may be backside sensitive or may be assembled in order to have the sensitive surface facing downward an aperture (monitoring aperture) in the substrate 326a. In an exemplary configuration, the monitoring light signal is guided by means of waveguides 322, 324 and prisms 332, 334 through the optical substrate 306 to the receiving element 320.

[00113] The receiving element 320 may detect any variation of the monitoring light source. The receiving element 320 (also referred to as monitoring element) may communicate with a processor, e.g. an integrated circuit (e.g., an ASIC) that analyze (may also elaborate) the monitoring light signal and its variations. The processor may be configured to manage also the light emission from both surfaces (primary surface 328 and secondary surface 330) of the main emission element 308. The processor may be configured to compare the analyzed monitoring signal to established values (or guard band limits or thresholds) stored (with and/or without a calibration) in a memory of the processor. If the received monitoring is out of the established threshold, the processor may be configured to stop the light emission of the main emission element. As discussed above, a variation of the received monitoring light signal may happen in case of cracks and damages in any sub-components of the optical component 302 (e.g., the substrate itself and/or the micro lens array, diffractive optical element, etc.). A variation may also occur in case of a displacement of the optical element 304, or in case of contamination (e.g., stain, liquid drops, powder contamination, or other pollution) on the inner/outer surfaces of the optical component 302. Such damaged condition may pose an eye safety issue.

[00114] At the emitter side, ideally all the light from the light source (illustratively, from the second emitting surface 330) may be used to perform the measurement, so higher signal efficiency can be achieved. Since light is guided, there is no production of stray light in the module from light traveling in free space, so higher signal-to-noise ratio in the measurement may be achieved. The divergence of the light beam, which enters the optical substrate 306 under test, may be selected by engineering the waveguide 322. This allows to select which areaofthe optical component under test is probed, flexibility that is not achievable in free space without the complexity of adding extra optical elements (e.g., lenses, with their own manufacturing errors and tolerances)

[00115] At the collection/detection side, ideally all light exiting from the optical substrate may be collected and guided towards the detector 320, so higher signal efficiency can be achieved. The detector sees only light arriving via the waveguide 324, so that the signal-to-noise ratio is improved since neither stray light nor ambient light can reach the sensor 320.

[00116] FIG.3B shows another possible configuration of the probing system in an optoelectronic device 300b. In the configuration of FIG.3B, the substrate 326b may be a rigid substrate, and the probing system may include a first planar light guide 336 to convey the monitoring radiation to the optical substrate 306, and a second planar light guide 338 to convey the monitoring radiation to the light detector 320. In the arrangement of FIG.3B, the probing system may further include a first coupling element 340 (e.g., a first prism) to optically couple the first planar light guide 336 with the optical substrate 306 (e.g., with a first side surface). The probing system may further include a second coupling element 342 (e.g., a second prism) to optically couple the second planar light guide 338 with the optical substrate 306 (e.g., with a second side surface). In this configuration, the module housing 312b may have integrated light guides, and the lens assembly 318b may have integrated light guides and prisms (or other optical coupling elements). This configuration enables a potential product size reduction due to a reduction of the substrate width/length.

[00117] FIG.3C shows another possible configuration of the probing system in an optoelectronic device 300c. In the configuration of FIG.3C, the housing 312c is a single module housing (illustratively, is monolithic) used as holder for lenses 310 and optical component 302. This configuration may allow a cheaper fabrication process.

[00118] FIG.3D shows another possible configuration of the probing system in an optoelectronic device 300d. In the configuration of FIG.3D, the double-sided main emission element may be replaced by a single-side main emission element 308d (illustratively, with a single emitting surface 328). In this scenario the probing system may include a single-side dedicated emitting element 344d, e.g. a light source with a light emitting surface 346. As an exemplary disposition, the light emitting surface 346 may be oriented facing downwards, or the light source 344d may be backside emitting. This configuration may be provided when dimensions are not a constraint and/or in case of cheaper procurement costs.

[00119] FIG.3E shows another possible configuration of the probing system in an optoelectronic device 300e. In the configuration of FIG.3E, instead of one of the optically guided paths, the probing system may include a free-space optical path 348 between the dedicated light source 344e (e.g., front-side emitting) and the optical substrate 306. In this configuration, the probing light emitted by the dedicated light source 344e may be allowed to travel to the optical substrate 306 without further intervening optical elements along the optical path. The probing system may include one or more clear optical apertures 350 along the free-space optical path 348 to define the propagation region for the probing light. For example, the one or more clear optical apertures 350 may be provided in the material of the housing 312e, e.g. as holes (e.g., circular holes). In this configuration, the optical substrate 306 may have a deflection surface 352 to facilitate the fulfilling of the total internal reflection condition. It is understood that the aspects described in relation to FIG.3E apply in a corresponding manner to a configuration in which the free-space optical path is at the receiver side of the probing system.

[00120] The probing system described herein in relation to FIG. 1 A to FIG.3E provides thus an efficient approach to monitoring the integrity of an optical component, e.g. in an optoelectronic device. Compared to conventional “electrical” approaches, the probing system avoids the complexity of an electrical interlock. Furthermore, the use of optical guiding elements improve the efficiency of the measurement (e.g., in terms of signal -to-noise ratio) compared to a configuration in which the probing light propagates only in free-space both at the emitter side and receiver side. As mentioned above, in various aspects the probing light may be guided from the light source to the optical component under test.

[00121] In the probing system described herein, the emission element may be a single component that is the main device emission component (e.g., with double-side emitting surfaces, collecting part of the emitted light, etc.), or may be dedicated component that is not used as main device emission component. The monitoring optical radiation may be conveyed by mean of optical transmitting elements (e.g., optical waveguides, optical fibers, light guides, prisms, optical coupling elements, etc.), thus ensuring a reliable and robust operation of the probing system.

[00122] FIG.4 shows a schematic flow diagram of a method 400 of detecting a damaged condition of an optical component of an optoelectronic device (e.g., the optical component 102, 302 in the optoelectronic device 100, 300a-300e). Illustratively, the method may be for detecting of a damaged condition of an optical component that includes an optical substrate alone, or an optical element disposed on the (transparent) optical substrate. It is understood that the aspects described in connection with the probing system may apply in a corresponding manner to the method 400, and vice versa. [00123] The method 400 may include, in 410, causing propagation of probing light along the transparent optical substrate via total internal reflection. For example, the method 400 may include conveying the probing light to the optical substrate via an optical guiding element (e.g., an optical fiber, an optical waveguide, a light guide, etc.), e.g. delivering the probing light to a side surface of the optical substrate via the optical guiding element. As another example, the method 400 may include allowing free-space propagation of the probing light to the optical substrate, e.g. to a deflection surface of the optical substrate.

[00124] The method 400 may further include, in 420, detecting the probing light after propagation along the transparent optical substrate. For example, the method 400 may include collecting the probing light after propagation along the transparent optical substrate and directing the collected probing light to a light detector. For example, the method 400 may include collecting the probing light at a side surface of the optical substrate (e.g., opposite to the side surface into which the probing light was introduced). In an exemplary configuration, the method 400 may include conveying the collected probing light to the light detector via an optical guiding element (e.g., an optical fiber, an optical waveguide, a light guide, etc.). As another example, the method 400 may include allowing free-space propagation of the probing light to the light detector, e.g. from a deflection surface of the optical substrate.

[00125] The method 400 may further include, in 430, identifying a damaged condition of the optical component based on a variation of one or more properties of the (detected) probing light with respect to one or more predefined properties of the probing light. For example, the method 400 may include comparing one or more properties of the probing light detected after propagation in the optical substrate with one or more predefined (e.g., initial) properties of the probing light delivered to the optical substrate. The method 400 may include determining the occurrence of a damaged condition based on the result of the comparison, e.g. in case the variation is in a predefined range (e.g., above a predefined threshold). As an exemplary configuration, the method 400 may include identifying the damaged condition of the optical component based on a variation of the intensity of the probing light, e.g. based on a comparison of the intensity of the detected probing light with the initial intensity of the probing light.

[00126] The term “processor” as used herein may be understood as any kind of technological entity that allows handling of data. The data may be handled according to one or more specific functions that the processor may execute. Further, a processor as used herein may be understood as any kind of circuit, e.g., any kind of analog or digital circuit. A processor may thus be or include an analog circuit, digital circuit, mixed-signal circuit, logic circuit (e.g., a hard-wired logic circuit or a programmable logic circuit), microprocessor, Central Processing Unit (CPU), Graphics Processing Unit (GPU), Digital Signal Processor (DSP), Field Programmable Gate Array (FPGA), integrated circuit, Application Specific Integrated Circuit (ASIC), etc., or any combination thereof. [00127] The word “exemplary” is used herein to mean “serving as an example, instance, or illustration”. Any embodiment or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[00128] The phrase “at least one” and “one or more” may be understood to include a numerical quantity greater than or equal to one (e.g., one, two, three, four, [...], etc.). The phrase “at least one of’ with regard to a group of elements may be used herein to mean at least one element from the group consisting of the elements. For example, the phrase “at least one of’ with regard to a group of elements may be used herein to mean a selection of: one of the listed elements, a plurality of one of the listed elements, a plurality of individual listed elements, or a plurality of a multiple of individual listed elements.

[00129] All acronyms defined in the above description additionally hold in all claims included herein. [00130] While the invention has been particularly shown and described with reference to specific aspects, it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is thus indicated by the appended claims and all changes, which come within the meaning and range of equivalency of the claims, are therefore intended to be embraced.

List of reference signs

100 Optoelectronic device

100a Optoelectronic device

100b Optoelectronic device

100c Optoelectronic device lOOd Optoelectronic device

102 Optical component

104 Optical element

106 Optical substrate

108 Probing system

110 Light detector

112 Detection signal

114 Probing light

114b Collected probing light

116 Optical system

118a First surface

118b Second surface

120 Light transmission portion

122 Light collection portion

124 Processor

130 Optoelectronic component

132 First emitting surface

134 Second emitting surface

136 Additional light source

150a First configuration 150b Second configuration 150c Third configuration 152 Micro-lens

154 Gap

200a Optical system

200b Optical system

200c Optical system

200d Optical system

202 First optical guiding element

204 Second optical guiding element

206 First optical coupling element

208 Second optical coupling element

210 First free-space optical path

212 First optical aperture

214 First deflection surface

216 Second free-space optical path

218 Second optical aperture

220 Second deflection surface

300 Optoelectronic device

300a Optoelectronic device

300b Optoelectronic device

300c Optoelectronic device

300d Optoelectronic device

300e Optoelectronic device

302 Optical component

304 Optical element

306 Optical substrate

308 Optoelectronic component

308d Optoelectronic component Lens a Housing b Housing c Housing d Housing e Housing a First housing portion b First housing portion a Second housing portion b Second housing portion a Optical assembly b Optical assembly Light detector First optical waveguide Second optical waveguide a Substrate b Substrate c Substrate d Substrate e Substrate First emitting surface Second emitting surface First optical coupling element Second optical coupling element First light guide Second light guide First optical coupling element Second optical coupling elementd Light source e Light source Light emitting surface Free-space optical path Optical aperture Deflection surface Method Method step Method step Method step

Claims

1. An optoelectronic device (100) comprising: an optical component (102), wherein the optical component (102) comprises an optical substrate (106) configured to be transparent for light with wavelength in a predefined wavelength range; and a probing system (108) comprising: a light detector (110); an optical system (116) configured to: direct probing light (114) into the optical substrate (106) to cause propagation of the probing light (114) along the optical substrate (106) via total internal reflection; collect the probing light (114b) after propagation along the optical substrate (106); and direct the collected probing light (114b) towards the light detector (110), wherein the light detector (110) is configured to generate a detection signal (112) representative of the probing light (114b) received at the light detector (110); and a processor (124) configured to: receive the detection signal (112) from the light detector (110); and detect a damaged condition of the optical component (102) based on a variation of one or more properties of the probing light (114b) with respect to one or more predefined properties of the probing light (114).

2. The optoelectronic device (100) according to claim 1, wherein the optical component (102) further comprises an optical element (104) disposed on the optical substrate (106) and configured to allow transmission of light with wavelength in the predefined wavelength range.

3. The optoelectronic device (100) according to claim 1 or 2, wherein the processor (124) is configured to detect the damaged condition of the optical component (102) based on a comparison of an intensity of the probing light (114b) detected at the light detector (110) with an intensity of the probing light (114) directed into the optical substrate (106).

4. The optoelectronic device (100) according to any one of claims 1 to 3, wherein the optical system (124, 200a) comprises: a first optical guiding element (202) configured to optically guide the probing light (114) to the optical substrate (106); and a second optical guiding element (204) configured to optically guide the probing light (114b) collected after propagation along the optical substrate (106) towards the light detector (HO).

5. The optoelectronic device (100) according to claim 1, wherein the optical system (124, 200d) comprises: a first optical guiding element (202) configured to optically guide the probing light (114) to the optical substrate (106); and a second free-space optical path (216) configured to allow free-space propagation of the probing light (114b) after propagation along the optical substrate (106) towards the light detector (HO).

6. The optoelectronic device (100) according to claim 5, wherein the optical substrate (106) has at least one deflection surface (220); and wherein the second free-space optical path (216) is configured to allow free-space propagation of the probing light (114b) from the at least one deflection surface (220) of the optical substrate (106) towards the light detector (110).

7. The optoelectronic device (100) according to claim 1, wherein the optical system (124, 200c) comprises: a first free-space optical path (212) configured to allow free space propagation of the probing light (114) towards the optical substrate (106); and a second optical guiding element (204) configured to optically guide the probing light (114b) collected after propagation along the optical substrate (106) towards the light detector (HO).

8. The optoelectronic device (100) according to claim 7, wherein the optical substrate (106) has at least one deflection surface (214); and wherein the first free-space optical path (212) is configured to allow free space propagation of the probing light (114) towards the at least one deflection surface (214) of the optical substrate (106).

9. The optoelectronic device (100) according to any one of claims 4 to 8, wherein the first optical guiding element (202) is or comprises one of: an optical fiber, an optical waveguide, or a light guide; and/or wherein the second optical guiding element (204) is or comprises one of: an optical fiber, an optical waveguide, or a light guide.

10. The optoelectronic device (100) according to any one of claims 4 to 9, wherein the optoelectronic device (100) further comprises a substrate; and wherein the first optical guiding element (202) and/or the second optical guiding element (204) are at least partially embedded in the substrate.

11. The optoelectronic device (100) according to claim 10, wherein the first optical guiding element (202) is or comprises a flexible optical waveguide partially embedded in the substrate and partially disposed in free space; and/or wherein the second optical guiding element (204) is or comprises a flexible optical waveguide partially embedded in the substrate and partially disposed in free space.

12. The optoelectronic device (100) according to any one of claims 4 to 11, wherein the first optical guiding element (202) is configured to optically guide the probing light (114) into a first side surface of the optical substrate (106); and wherein the second optical guiding element (204) is configured to collect the probing light (114b) at a second side surface of the optical substrate (106) and optically guide the collected probing light (114b) towards the light detector (110).

13. The optoelectronic device (100) according to any one of claims 4 to 12, wherein the optoelectronic device (100) further comprises a housing; wherein the first light guiding element (202) is at least partially embedded in the housing; and/or wherein the second light guiding element (204) is at least partially embedded in the housing.

14. The optoelectronic device (100) according to any one of claims 1 to 13, further comprising: a light source (130) configured to emit light through the optical component (102); wherein the processor (124) is configured to instruct an operation of the light source (130) based on the detecting of the damaged condition of the optical component (102).

15. The optoelectronic device (100) according to claim 14, wherein the light source (130) comprises a first emitting surface (132) and a second emitting surface (134), wherein the first emitting surface (132) is disposed to emit light towards the optical component (102); and wherein the optical system (116) is configured to receive light from the second emitting surface (134) to be directed as probing light (114) into the optical substrate (110).