WO2024157337A1 - 荷電粒子ビーム装置 - Google Patents

荷電粒子ビーム装置 Download PDF

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Publication number
WO2024157337A1
WO2024157337A1 PCT/JP2023/001973 JP2023001973W WO2024157337A1 WO 2024157337 A1 WO2024157337 A1 WO 2024157337A1 JP 2023001973 W JP2023001973 W JP 2023001973W WO 2024157337 A1 WO2024157337 A1 WO 2024157337A1
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WIPO (PCT)
Prior art keywords
holder
axis
sample
sample piece
charged particle
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Application number
PCT/JP2023/001973
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English (en)
French (fr)
Japanese (ja)
Inventor
佳▲徳▼ 東
衛 岡部
Original Assignee
株式会社日立ハイテク
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社日立ハイテク filed Critical 株式会社日立ハイテク
Priority to JP2024572555A priority Critical patent/JPWO2024157337A1/ja
Priority to PCT/JP2023/001973 priority patent/WO2024157337A1/ja
Publication of WO2024157337A1 publication Critical patent/WO2024157337A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support

Definitions

  • This disclosure relates to a charged particle beam device for processing and observing samples.
  • TEM transmission electron microscope
  • STEM scanning transmission electron microscope
  • a focused ion beam (FIB) device is used to thin specified areas of a wafer. This thinning process creates a sample piece (also called a lamella or thin film sample) that exposes the cross-sectional structure of the device. The sample piece is then transferred to a carrier, and the cross-sectional structure of the sample piece is observed (TEM measurement) using, for example, a TEM device.
  • FIB focused ion beam
  • sample pieces prepared by the FIB device which is a pre-processing step, need to be transported efficiently to the TEM device.
  • Patent Document 1 discloses an apparatus in which a wafer holder on which a wafer can be placed is provided with a sample holder that holds a sample piece made from the wafer. Once the preparation and collection of the sample piece is complete, the wafer and sample piece are transported to the outside.
  • the charged particle beam device includes a sample stage on which a sample is mounted, a charged particle beam lens barrel that irradiates the sample with a charged particle beam, a sample piece stage having a tilt mechanism that tilts a sample piece holder on which a sample piece made from the sample is mounted independently of the sample, a sample chamber that stores the sample stage and the sample piece stage, and a transport mechanism that transports the sample piece holder from the sample piece stage to outside the sample chamber independently of the sample.
  • the carrier can be transported efficiently in and out of the sample chamber.
  • FIG. 1 is a diagram showing a configuration of an inspection system according to an embodiment. 1 is a flowchart showing an overview of an inspection process in the inspection system.
  • FIG. 1 is an external view of a charged particle beam device.
  • FIG. 1 is a diagram showing the configuration of a charged particle beam device.
  • FIG. 2 is an external perspective view of a wafer stage and a sub-stage.
  • FIG. 2 is an external perspective view of a substage.
  • 1A and 1B are diagrams illustrating an example of the structure of a holder.
  • 3A and 3B are diagrams illustrating an example of the structure of a carrier.
  • FIG. 2 is a diagram illustrating an example of a structure inside a transfer chamber.
  • FIG. 2 is an external perspective view of the LLC arm in an extended state.
  • FIG. 1 is an external view of
  • FIG. 2 is an external perspective view of a carrier transport mechanism.
  • FIG. 13 is a diagram showing the inside of the transfer chamber during a delivery process.
  • 11 is a cross-sectional view illustrating a mounting surface and a holder during a delivery process.
  • FIG. FIG. 2 is a diagram illustrating an LLC arm, a holder, and a substage in a sample chamber.
  • 11 is a flowchart illustrating an operation flow performed by the charged particle beam device during a load process.
  • 11 is a flowchart illustrating an operation flow performed by the charged particle beam device during a load process.
  • FIG. 2 is a diagram showing a schematic structure of the formed sample piece.
  • 13A to 13C are diagrams illustrating a process of transferring a sample piece to a carrier.
  • 11 is a flowchart illustrating an operation flow performed by the charged particle beam device during an unloading process.
  • 11 is a flowchart illustrating an operation flow performed by the charged particle beam device during an unloading process
  • the program, functions, processing units, etc. may be described as the main focus, but the main hardware focus for these is the processor, or a controller, device, computer, system, etc. that is composed of the processor.
  • the computer executes processing according to the program read into the memory by the processor, appropriately using resources such as memory and communication interfaces. This realizes the specified functions, processing units, etc.
  • the processor is composed of semiconductor devices such as a CPU or GPU, for example.
  • the processor is composed of devices or circuits that are capable of performing specified calculations. Processing is not limited to software program processing, and can also be implemented by dedicated circuits. Dedicated circuits that can be used include FPGAs, ASICs, CPLDs, etc.
  • the program may be pre-installed as data on the target computer, or may be distributed as data from a program source to the target computer.
  • the program source may be a program distribution server on a communication network, or a non-transient computer-readable storage medium (e.g., a memory card).
  • the program may be composed of multiple modules.
  • the computer system may be composed of multiple devices.
  • the computer system may be composed of a cloud computing system, an IoT system, or the like.
  • the various types of data and information are composed of structures such as tables and lists, but are not limited to these.
  • Fig. 1 is a schematic diagram showing a schematic configuration of an inspection system 1 according to an embodiment.
  • the inspection system 1 includes a sample piece preparation mechanism 1a, a sample piece observation mechanism 1c, and a host control unit 101 as a control mechanism.
  • the sample piece preparation mechanism 1a is a charged particle beam device 10.
  • the charged particle beam device 10 as the sample piece preparation mechanism 1a is, for example, an FIB-SEM device.
  • the sample piece observation mechanism 1c is, for example, a sample piece observation device 30 such as a TEM device.
  • the upper level control unit 101 as a control mechanism controls each controller, which is a control unit provided for each device, for example.
  • the controller of each device manages information about the device and controls the processing operation of the device. These controllers may be built into each device or may be connected externally.
  • the controllers of each device may communicate with each other as appropriate.
  • the controllers of each device may be configured to communicate with each other and control their corresponding devices.
  • the inspection system 1 receives inspection instructions and information on the location to be inspected from the manufacturing management system 150 of the semiconductor manufacturing factory.
  • the inspection system 1 receives the wafer 3, which is the sample to be inspected, from the semiconductor manufacturing line 1d of the semiconductor manufacturing factory by transportation.
  • the transported wafer 3 is set in the charged particle beam device 10.
  • the wafer 3 is transported between the semiconductor manufacturing line 1d and the charged particle beam device 10 of the inspection system 1 by a specified transport mechanism.
  • a FOUP which is a container that stores the wafer 3, is transported by an automatic transport system or manually by an operator.
  • the FIB-SEM device which is a charged particle beam device 10, forms and creates a sample piece 4 by thinning a specified location (site) of the transported wafer 3.
  • the charged particle beam device 10 removes the formed and created sample piece 4 from the wafer 3 and transfers it to a carrier (LC: Lamella Carrier) 5.
  • the TEM device which is a sample piece observation device 30, observes and analyzes the cross section or plane of the sample piece 4 on the carrier 5, and generates and outputs the resultant data 9, etc.
  • the various types of data and information include, for example, data indicating the position of the inspection target on the surface of the wafer 3, data indicating the position where the sample piece 4 was successfully created, and data indicating the position of the sample piece 4 mounted on the carrier 5.
  • the inspection result data 9 includes detection signals relating to secondary electrons etc. generated from the sample piece 4 irradiated with the beam, images obtained from the detection signals, data obtained as a result of processing the images, data relating to X-rays generated from the sample piece 4, and the like.
  • the inspection system 1 performs processing operations such as preparing a sample piece 4 at a specified position on a specified wafer 3 and transferring the sample piece 4 to a specified position on a specified carrier 5, with each device taking responsibility for the operations, and keeps track of information such as the processing operations, status, and position for control purposes.
  • the inspection system 1 then outputs the inspection results of the sample piece 4 as data 9.
  • the charged particle beam device 10 has a transport mechanism 90, which transports the sample pieces 4 between the sample piece observation device 30.
  • the carrier 5 to which the sample pieces 4 have been transferred is transported by an automatic transport system. It is also possible to transport the wafers 3 back from the charged particle beam device 10 to the semiconductor production line 1d by a transport mechanism (not shown).
  • a FOUP or carrier 5 is used for various types of transport.
  • a FOUP is a container filled with an inert gas such as nitrogen, and wafers 3 can be put in and taken out of the container for storage.
  • the wafer 3 used in the embodiment is composed of a semiconductor substrate in which a p-type or n-type impurity region is formed, semiconductor elements such as transistors formed on the semiconductor substrate, and wiring layers formed on the semiconductor elements.
  • the sample piece 4 is a portion formed on the wafer 3 and is extracted.
  • the sample piece 4 similarly includes the structures of the semiconductor substrate, semiconductor elements, wiring layers, etc. of the wafer 3.
  • the embodiment is also directed to the inspection of the sample piece 4 of the wafer 3 used mainly in semiconductor manufacturing lines, but is not limited to this, and the sample may be a structure used in a field other than semiconductor technology.
  • FIG. 2 is a flowchart explaining the process flow of the inspection system 1.
  • Each process shown in the flowchart in Fig. 2 is preferably automatically executed and controlled by the upper control unit 101, but some of the processes may also be partially controlled manually. For example, in each step shown below, an operator may press a start button when starting the process of the apparatus.
  • a FOUP containing the inspection target i.e., the wafer 3 to be subjected to cross-sectional or surface analysis
  • the charged particle beam device 10 receives the FOUP and places the wafer 3 on the stage.
  • the upper control unit 101 of the charged particle beam device 10 also obtains data and information such as information on the inspection target location of the wafer 3 and inspection instructions from the manufacturing management system 150.
  • step S102 the upper control unit 101 causes the FIB-SEM device included in the charged particle beam device 10 to perform a thinning process operation to form and fabricate one or more sample pieces 4 on the wafer 3.
  • the charged particle beam device 10 positions the field of view at the inspection target position (site) of the wafer 3 by moving the stage.
  • the charged particle beam device 10 then irradiates the inspection target position with a beam, which is an FIB, to form the sample piece 4.
  • step S103 the upper control unit 101 causes the charged particle beam device 10 to perform a transfer process to transfer the sample piece 4 formed on the wafer 3 onto the carrier 5.
  • step S104 the upper control unit 101 causes the transport mechanism 90 to perform a transport process to transport the carrier 5 carrying the sample piece 4 from the charged particle beam device 10 to the sample piece observation device 30.
  • step S105 the upper control unit 101 causes the TEM device provided in the sample piece observation device 30 to perform cross-sectional observation or planar observation using TEM images. The results of the analysis and inspection performed by the cross-sectional observation or planar observation are stored and output as data 9.
  • Fig. 3 is an external view of the charged particle beam device 10.
  • the following description will be given using an orthogonal coordinate system consisting of an x-axis, a y-axis, and a z-axis as shown in Fig. 3.
  • the z-axis is set along the vertical direction of the charged particle beam device 10, with the upper side being the z-axis + side and the lower side being the z-axis - side.
  • the x-axis is set in a direction perpendicular to the z-axis
  • the y-axis is set in a direction perpendicular to the x-axis and z-axis. Therefore, the external view in Fig. 3 shows the external appearance of the charged particle beam device 10 as seen from the z-axis + side.
  • the charged particle beam device 10 has a sample chamber 20, a transfer chamber 29, and a storage chamber 31.
  • the transfer chamber 29 is disposed on the x-axis + side of the sample chamber 20 and is connected to the sample chamber 20.
  • the transfer chamber 29 houses a transfer mechanism 90.
  • the storage chamber 31 is disposed on the y-axis + side of the transfer chamber 29 and is connected to the transfer chamber 29.
  • [Sample chamber] 4 is a schematic diagram showing an outline of the configuration of the charged particle beam device 10.
  • the charged particle beam device 10 includes an ion beam column 11, an ion beam column controller 131, an electron beam column 12, an electron beam column controller 132, a wafer stage 21, a wafer stage controller 133, a substage 22, a substage controller 134, a needle 112, a needle controller 142, and the like. That is, the sample chamber 20 houses the wafer stage 21 and the substage 22.
  • the charged particle beam device 10 also includes a charged particle detector 109, a detector controller 136, a sample chamber controller 137, an integrated control unit 130, a computer system 100, and the like.
  • the above-mentioned ion beam column 11, electron beam column 12, wafer stage 21, substage 22, charged particle detector 109, and the like are provided in the sample chamber 20.
  • the charged particle beam device 10 also includes a wafer loading mechanism (not shown).
  • the wafer loading mechanism is a mechanism for loading the wafer 3 in the FOUP into the sample chamber 20 and unloading the wafer 3 in the sample chamber 20 into the FOUP.
  • the sample chamber 20 also includes other components, such as a gas supply unit (not shown) that supplies gases used for etching and deposition processing.
  • a gas supply unit (not shown) that supplies gases used for etching and deposition processing.
  • the degree of vacuum in the sample chamber 20 is controlled by a sample chamber controller 137.
  • the sample chamber 20 may be placed on a vibration isolation table 201 to prevent vibration.
  • the inside of the sample chamber 20 may also be provided with a pressure reduction device for evacuating the chamber, a cold trap, or an optical microscope.
  • the ion beam column 11 is arranged with its optical axis OA1 (shown by a dashed line) aligned vertically.
  • An ion beam b11 which is an FIB, is emitted from the ion beam column 11 toward a cross point CP1.
  • the ion beam column 11 emits the ion beam b11 from the + side of the z axis toward the - side of the z axis.
  • the optical axis OA1 of the ion beam column 11 is parallel to the z axis.
  • the electron beam column 12 is arranged such that its optical axis OA2 (shown by a dashed line) is inclined relative to the optical axis OA1 of the ion beam column 11.
  • An electron beam b12 is irradiated from the electron beam column 12 toward the cross point CP1.
  • the electron beam column 12 irradiates the electron beam b12 from the z-axis + side and the y-axis + side toward the z-axis - side and the y-axis - side.
  • the optical axis OA2 of the electron beam column 12 is inclined relative to the xy plane.
  • the ion beam b11 emitted from the ion beam column 11 and the electron beam b12 emitted from the electron beam column 12 are focused at a cross point CP1, which is the intersection of their respective optical axes.
  • the optical axis of the electron beam column 12 is arranged at an angle to the optical axis of the ion beam column 11, but the present invention is not limited to this configuration.
  • the ion beam column 11 includes the components necessary for an FIB device, such as an ion source 11a that generates an ion beam b11, lenses 11b and 11c that focus the ion beam b11, an objective lens 11d, and a deflector 11e for scanning the ion beam b11.
  • the ion beam column 11 is a charged particle beam tube that irradiates a charged particle beam.
  • the electron beam column 12 includes the components necessary for an SEM device, such as an electron source 12a that generates an electron beam b12, lenses 12b and 12c that focus the electron beam b12, an objective lens 12d, and a deflector 12e for scanning the electron beam b12.
  • the electron beam column 12 is a charged particle beam tube that irradiates a charged particle beam.
  • the wafer stage 21 is a movable stage on which a wafer 3, which is a sample, can be placed.
  • the substage 22 is a movable stage on which a sample piece 4 or a carrier 5 can be placed. Details of the wafer stage 21 and substage 22 will be described later.
  • the wafer stage 21, substage 22, etc. can move in a plane and in a rotation.
  • the integrated control unit 130 controls the movement of the wafer stage 21 via a wafer stage controller 133, thereby positioning the target area on the surface of the wafer 3 (e.g., the area where the sample piece 4 is formed) so that the beam can be irradiated.
  • the integrated control unit 130 controls the movement of the substage 22 via a substage controller 134, thereby controlling the attitude of the carrier 5 mounted on the substage 22.
  • the charged particle detector 109 detects, as detection signals, the charged particles generated when the ion beam b11 is irradiated onto the sample, and the charged particles generated when the electron beam b12 is irradiated onto the sample.
  • the detector controller 136 performs arithmetic processing on the detection signal of the charged particle detector 109 to generate an image.
  • the detector controller 136 includes an arithmetic processing unit that is realized by circuit or program processing.
  • the sample chamber 20 may also be equipped with other types of detectors, such as an X-ray detector and a backscattered electron detector that detect backscattered electrons generated from the sample.
  • detectors such as an X-ray detector and a backscattered electron detector that detect backscattered electrons generated from the sample.
  • the needle 112 is provided inside the sample chamber 20 so that it can reach the cross point CP1.
  • the needle 112 is controlled and driven by the needle controller 142 to hold the sample piece 4 that has been separated and extracted (lifted out) from the wafer 3, and functions as a sample piece transfer section that transports and transfers the sample piece 4 to the carrier 5.
  • the needle 112 can move in a plane, vertically, and rotationally, so that when the needle 112 is holding the sample piece 4, the attitude of the sample piece 4 can be freely changed.
  • the charged particle beam device 10 is not limited to the FIB-SEM device described above, but may be an FIB device that does not have an SEM mechanism, or an FIB device that has an optical microscope instead of an SEM mechanism.
  • the integrated control unit 130 controls the entire charged particle beam device 10 and each part.
  • the integrated control unit 130 is electrically connected to the controllers of each part, such as the wafer stage controller 133 and the substage controller 134, and can communicate with each other.
  • the integrated control unit 130 controls the controllers of each part using control signals. Multiple controllers may be integrated into one controller. Each controller may be implemented by a computer system or a dedicated circuit.
  • the integrated control unit 130 is connected to the computer system 100.
  • the integrated control unit 130 controls the operation of the entire charged particle beam device 10 and each part according to instructions from the computer system 100.
  • the computer system 100 provides a user interface including a GUI to a user who uses the charged particle beam device 10, and accepts input of various instructions, settings, etc. from the user.
  • the computer system 100 has an input device 162, an output device 161, a storage device, etc. built in or externally connected. Examples of the input device 162 include a keyboard, mouse, touch panel, microphone, etc. Examples of the output device 161 include a display, printer, speaker, lamp, etc.
  • the display displays a screen with a GUI, etc. The screen displays images captured by the charged particle beam device 10, setting information, user instruction information, etc.
  • the user can check various information and images on the screen displayed on the display.
  • the user inputs various instructions and settings to the screen using a keyboard or the like.
  • the computer system 100 transmits instructions to the integrated control unit 130 based on the input instructions and settings.
  • the integrated control unit 130 and the computer system 100 may be integrated into a configuration.
  • FIG. 5(A) and 5(B) are external perspective views of the wafer stage 21 and the substage 22 provided in the sample chamber 20.
  • Fig. 5(A) shows the case where the rotation angle about the T axis, which will be described later, is 0°
  • Fig. 5(B) shows the case where the rotation angle about the T axis is 20°.
  • the wafer stage 21 is a sample stage configured to be movable with a wafer 3, which is a sample, placed thereon.
  • the wafer stage 21 has an x-base 210, a y-base 211, a z-base 212, a rotation base 213, and a support mechanism 214.
  • the rotation angle of the T-axis which will be described later, is 0°
  • the x-base 210, the y-base 211, the z-base 212, and the rotation base 213 are provided in the sample chamber 20 in the above order from the lower side, i.e., the negative side of the z-axis.
  • the x-base 210 is a plate-like member having a long side extending in the y-axis direction.
  • An x-axis drive mechanism 215 having, for example, a motor, a ball screw, and a guide member extending along the x-axis is provided below the x-base 210.
  • the motor of the x-axis drive mechanism 215 is driven, the ball screw rotates and the x-base 210 moves along the x-axis, which is the first direction.
  • the y-base 211, z-base 212, and rotation base 213 provided above the x-base 210 also move together with the x-base 210 along the x-axis, which is the first direction.
  • the drive of the x-axis drive mechanism 215 is controlled by the integrated control unit 130 via the wafer stage controller 133.
  • the movement of the x-base 210 by the x-axis drive mechanism 215 is controlled by, for example, encoder control or linear scale control, and the x-base 210 is positioned with high precision.
  • the range over which the x-base 210 can move is 0 to 327 mm, which is large enough to accommodate, for example, a 300 mm-sized wafer 3.
  • a y-axis drive mechanism 216 that moves the y-base 211 is provided on the top surface of the x-base 210.
  • the y-base 211 is a plate-shaped member and is provided on the upper surface side of the x-base 210. More specifically, the y-base 211 is provided on the y-axis drive mechanism 216 provided on the upper surface of the x-base 210.
  • the y-axis drive mechanism 216 has, for example, a motor, a ball screw, and a guide member extending along a second direction intersecting (perpendicular to) the x-axis.
  • the second direction is the y-axis direction when the rotation angle of the T-axis described later is 0° (see FIG. 5(A)).
  • the motor of the y-axis drive mechanism 216 is driven, the ball screw rotates and the y-base 211 moves along the second direction.
  • the z-base 212 and the rotation base 213 provided on the upper side of the y-base 211 also move along the second direction together with the y-base 211.
  • the drive of the y-axis drive mechanism 216 is controlled by the integrated control unit 130 via the wafer stage controller 133.
  • the movement of the y-base 211 by the y-axis drive mechanism 216 is controlled by, for example, encoder control or linear scale control, and the y-base 211 is positioned with high precision.
  • the range over which the y-base 211 can move is 0 to 327 mm, which is large enough to accommodate a wafer 3 of 300 mm size, for example.
  • a z-axis drive mechanism 217 that moves the z-base 212 is provided on the upper surface side of the y-base 211.
  • the z base 212 is a plate-like member and is provided on the upper surface side of the y base 211. More specifically, the z base 212 is provided on the z-axis drive mechanism 217 provided on the upper surface of the y base 211.
  • the z-axis drive mechanism 217 has, for example, a motor, a ball screw, and a wedge-shaped guide member that extends along the x-axis and is inclined with respect to the y base 211. When the motor of the z-axis drive mechanism 217 is driven, the ball screw rotates and the z base 212 moves along the inclined surface of the wedge-shaped guide member.
  • the z base 212 moves along a direction perpendicular to the y base 211, that is, a third direction perpendicular to the first direction and the second direction.
  • the third direction is the z-axis direction when the rotation angle of the T-axis described later is 0° (see FIG. 5A).
  • the rotation base 213 provided on the upper side of the z base 212 also moves along the third direction together with the z base 212. That is, as shown in FIG. 5(A), when the rotation angle around the T axis is 0°, the z base 212 moves along the z axis, and accompanying this movement, the rotating base 213 also moves along the z axis.
  • the z-axis drive mechanism 217 is controlled by the integrated control unit 130 via the wafer stage controller 133.
  • the movement of the z-base 212 by the z-axis drive mechanism 217 is controlled by, for example, encoder control or linear scale control, and the z-base 212 is positioned with high precision.
  • the rotating base 213 is provided on the z-base 212.
  • the rotating base 213 is a mounting table on which the wafer 3 is placed, and is arranged to be rotatable about the R-axis, which is a first axis that intersects (is perpendicular to) the z-base 212.
  • the R-axis which is the first axis, is parallel to the z-axis when the rotation angle of the T-axis, which will be described later, is 0° (see FIG. 5A).
  • the rotating base 213 is rotated by a drive mechanism whose drive is controlled by the integrated control unit 130 via the wafer stage controller 133.
  • the rotating base 213 is rotated by rotating a ceramic ring, for example, with an ultrasonic motor, and the rotating base 213 can be positioned in the rotation direction with high accuracy.
  • the rotating base 213 has an electrostatic chuck.
  • the wafer 3 is placed on the rotating base 213 by being attracted by the electrostatic force of the electrostatic chuck.
  • the support mechanism 214 is rotatably held via gears or the like on two side walls of the sample chamber 20 that intersect with the x-axis.
  • the support mechanism 214 rotates around the T-axis, which is a second axis parallel to the x-axis, by synchronously driving the gears provided on the two side surfaces of the sample chamber 20.
  • the support mechanism 214 supports the x-axis drive mechanism 215 provided on the underside of the x-base 210, and thereby integrally supports the x-base 210, y-base 211, z-base 212, and rotation base 213 provided above it.
  • the T-axis is a tilt axis that tilts the wafer stage 21 on which the wafer 3 is placed with respect to the xy plane.
  • the substage 22 is a sample piece stage to which the holder 6, which will be described later, is detachably attached and which can move independently of the wafer 3 placed on the wafer stage 21.
  • the substage 22 is provided on the z-base 212 of the wafer stage 21 described above. Therefore, when the wafer stage 21 moves along the first directional axis, the second direction, and the third direction as described above, the substage 22 also moves along the first direction, the second direction, and the third direction together with the wafer stage 21. Also, when the wafer stage 21 rotates around the T-axis and tilts with respect to the xy plane, the substage 22 also rotates around the T-axis together with the wafer stage 21 and tilts with respect to the xy plane.
  • FIG. 6 is an external perspective view of the substage 22. Note that FIG. 6 shows the substage 22 when the rotation angle of the T-axis described above is 0°, the rotation angle of the F-axis described below is 0°, and the rotation angle of the ⁇ -axis described below is 0°. Below, the positional relationship of each component of the substage 22 will be explained based on the positional relationship when the rotation angle of the T-axis is 0°, the rotation angle of the F-axis is 0°, and the rotation angle of the ⁇ -axis is 0°.
  • the substage 22 has an attachment portion 221, an attachment support portion 222 that supports the attachment portion 221, and a tilting mechanism 223.
  • the attachment portion 221 is a holding mechanism that detachably holds the holder 6, which will be described in detail below, and is fixed to the tilting mechanism 223.
  • the attachment portion 221 has a mounting surface 224 and two biasing members 225.
  • the mounting surface 224 is parallel to the xy plane, and the holder 6 is placed on this mounting surface 224.
  • the biasing member 225 is a leaf spring that is provided opposite the mounting surface 224. When the holder 6 is placed on the mounting surface 224, the biasing member 225 biases the holder 6 towards the - side of the z axis.
  • biasing member 225 The end of the biasing member 225 on the + side of the x axis is bent so that a protrusion 225a is formed towards the - side of the z axis. Furthermore, the number of biasing members 225 is not limited to two, but may be one, or three or more.
  • the mounting support part 222 is attached to the z base 212 so as to be rotatable around the ⁇ -axis, which is the third axis intersecting (orthogonal) with the z base 212.
  • the mounting support part 222 is rotated by a drive mechanism controlled by the substage controller 134.
  • the tilt mechanism 223 is an arm member fixed to the mounting part 221, and is attached to the mounting support part 222 so as to be rotatable around the F-axis, which is the fourth axis intersecting (orthogonal) with the ⁇ -axis, at one end, and has a gear formed at the other end.
  • the F-axis is an axis parallel to the arrangement direction in which multiple sample pieces 4 are arranged when the holder 6 described later is attached to the substage 22.
  • the mounting part 221 fixed to the tilt mechanism 223 rotates around the F-axis.
  • the mounting portion 221 and the holder 6 are tilted with respect to a plane parallel to the z-base 212, centering on the arrangement direction of the sample pieces 4 on the holder 6.
  • the tilt mechanism 223 and the mounting part 221 rotate around the ⁇ axis together with the rotation of the mounting support part 222.
  • the mounting part 221 rotates around an axis perpendicular to the z base 212 in a plane parallel to the z base 212.
  • the substage 22 moves (rotates) around the ⁇ axis and moves (tilts) around the F axis independently of the wafer stage 21.
  • the tilt mechanism 223 can tilt the mounting portion 221 of the substage 22 independently of the wafer 3 placed on the rotation base 213 of the wafer stage 21.
  • the holder 6 is a specimen holder that mounts a plurality of carriers 5, and is detachably attached to a sub-stage 22, which is a stage for the specimen holder.
  • FIG. 7(A) is an external perspective view of the holder 6, and
  • FIG. 7(B) is a cross-sectional view of the holder 6 taken along line B-B in FIG. 7(A).
  • the holder 6 has a columnar shape.
  • an orthogonal coordinate system consisting of u-axis, v-axis, and w-axis will be used for explanation.
  • the u-axis is an axis set along the longitudinal direction of the holder 6.
  • the v-axis is an axis that is perpendicular to the u-axis and that is set along the lateral direction of the holder 6.
  • the w-axis is an axis that is perpendicular to the u-axis and v-axis and that is set along the height direction of the holder 6.
  • a carrier holding portion 61 for holding the mounted carrier 5 is provided on the surface 60a on the w-axis + side of the holder 6.
  • the four carrier holding portions 61 are arranged along the u-axis. That is, the holder 6 arranges the multiple carriers 5 to which the sample pieces 4 are attached along an arrangement direction along the u-axis.
  • the carrier holding portion 61 is a plate-shaped member, and a biasing force toward the w-axis - direction is applied by a biasing portion 62 such as a coil spring provided on the w-axis - side.
  • the carrier 5 is mounted on the holder 6 by being sandwiched between the w-axis - side surface of the carrier holding portion 61 and the surface 60a.
  • the carrier holding portions 61 are arranged along the u-axis, when the sample pieces 4 are transferred to the carrier 5 mounted on the carrier holding portions 61 as described below, the multiple sample pieces 4 are arranged along the arrangement direction.
  • the holder 6 is shown to have four carrier holding parts 61, but the number of carrier holding parts 61 may be three or less, or five or more.
  • connection hole 63 extending along the v-axis is formed on face 60b on the v-axis + side perpendicular to face 60a.
  • the connection holes 63 are formed on the u-axis + side and u-axis - side of face 60b, respectively.
  • the connection hole 63 functions as a first connection mechanism that connects the holder 6 to the transport mechanism 90, which will be described later.
  • the number of connection holes 63 is not limited to two, and may be three or more.
  • the connection hole 63 is an elongated hole whose diameter in the w-axis direction is larger than its diameter in the u-axis direction.
  • connection hole 63 has a first region 63a on the + side of the v-axis and a second region 63b on the - side of the v-axis.
  • the length (diameter) d2 of the second region 63b in the w-axis direction is greater than the length (diameter) d1 of the first region 63a in the w-axis direction.
  • the holder 6 has a through hole 64 formed through the surface 60a and the surface 60c along the w-axis direction.
  • the through hole 64 is formed on the u-axis + side and the u-axis - side of the surface 60a.
  • the through hole 64 functions as a second connection mechanism that connects the holder 6 to the holder transport mechanism 320 described below.
  • the number of through holes 64 is not limited to two, and may be three or more.
  • the end of the surface 60a on the u-axis positive side and the end on the u-axis negative side are formed with an inclined surface 66, part of which protrudes toward the w-axis positive side.
  • the inclined surface 66 has a slope 66a on the v-axis positive side and a slope 66b on the v-axis negative side.
  • the surface 60a becomes the surface facing the biasing member 225, and the inclined surface 66 protrudes toward the biasing member 225.
  • the inclined surface 66 and the biasing member 225 face each other.
  • the tilt mechanism 223 of the substage 22 can tilt the mounting part 221 of the substage 22 independently of the wafer 3 placed on the rotating base 213 of the wafer stage 21. Therefore, the tilt mechanism 223 of the substage 22 can tilt the holder 6 attached to the mounting part 221 independently of the wafer 3 placed on the rotating base 213 of the wafer stage 21.
  • the carrier 5 mounted on the holder 6 attached to the mounting part 221 and the wafer 3 placed on the rotating base 213 are designed to have the same height, i.e., the same distance from the z base 212 in the third direction.
  • [Career 5] 8 is a diagram showing an example of the structure of the carrier 5.
  • This carrier 5 may also be called a lamellar grid, a TEM mesh, or the like.
  • This carrier 5 includes a half-moon shaped base 50 and a plurality of pillars 53 protruding from a linear portion 51 within the surface of the base 50.
  • Each pillar 53 is a sample piece support portion having a structure capable of mounting and holding a sample piece 4.
  • Marks 55 consisting of holes penetrating the base 50 are provided at both ends of the base 50 where pillars 53 are not provided (circumferential portions when the top surface of the carrier 5 is viewed in plan).
  • the marks 55 are provided as marks of different shapes, and circular and triangular marks 55 are exemplified here.
  • the marks 55 make it easy to distinguish between the front and rear of the carrier 5.
  • the desired pillar 53 can be found using the marks 55 as a reference, making it easy to identify the relocation position.
  • the transfer chamber 29 houses a transfer mechanism 90 controlled by a transfer mechanism controller 135 shown in Fig. 4.
  • the transfer chamber 29 is also called a load lock chamber (LLC).
  • FIG. 9 is a diagram explaining the structure of the transfer chamber 29, and is a cross-sectional view taken along line A-A in FIG. 3.
  • the transfer chamber 29 is connected to the sample chamber 20 on the negative side of the x-axis, and to the storage chamber 31 on the positive side of the y-axis.
  • the transfer chamber 29 has an opening 301 at the point where it connects to the sample chamber 20, and an opening 302 at the point where it connects to the storage chamber 31.
  • the opening 301 is configured to be able to be opened and closed by a gate valve.
  • the opening 302 is configured to be able to be opened and closed by a gate valve 302a.
  • the gate valve 302a opens and closes under the control of the transfer chamber controller 139 (see FIG. 4).
  • the degree of vacuum in the transfer chamber 29 is controlled by the transfer chamber controller 139.
  • the inside of the transfer chamber 29 may also be provided with a pressure reducing device for evacuating the chamber, a cold trap, an optical microscope, or the like.
  • the transport mechanism 90 has an LLC arm 91 and an elevator 92.
  • the elevator 92 is provided on the negative x-axis side of the LLC arm 91, i.e., the side closer to the sample chamber 20, and on the negative y-axis side of an opening 302 communicating with the storage chamber 31.
  • the elevator 92 is a mounting table on which the holder 6 is temporarily mounted when the holder 6 is transferred between the LLC arm 91 and the holder transport mechanism 320 (see FIG. 11, FIG. 12(A) and (B)), as will be described in detail later.
  • the elevator 92 is controlled by the transport mechanism controller 135, and moves (lifts and lowers) along the z-axis direction.
  • the elevator 92 has, on the positive z-axis side, a mounting surface 920 on which the holder 6 is mounted, and a pin 921 protruding from the mounting surface 920 toward the positive z-axis side.
  • the pin 921 is inserted into a through hole 64 formed in the holder 6 when the holder 6 is placed on the placement surface 920 as described below.
  • the LLC arm 91 is a transport arm configured to be extendable and retractable along the x-axis direction by a telescopic mechanism while holding the holder 6 at the end on the negative side of the x-axis.
  • the LLC arm 91 transports the holder 6 along the x-axis direction (transport direction) between the sample chamber 20 and the transport chamber 29.
  • This transport direction intersects (is perpendicular to) the arrangement direction of the multiple carriers 5 in the holder 6 when the holder 6 is attached to the LLC arm 91 as described below.
  • the LLC arm 91, elevator 92, opening 301, and substage 22 in the sample chamber 20 are arranged on approximately the same straight line along the x-axis.
  • FIG 10 is an external view of the LLC arm 91 extended along the x-axis.
  • the LLC arm 91 has an arm base 910 attached to the bottom surface of the transfer chamber 29, a first extension portion 911 provided above the arm base 910 (the z-axis + side), a second extension portion 912 provided above the first extension portion 911 (the z-axis + side), and a mounting surface 913 provided at the x-axis - side end of the second extension portion 912.
  • the arm base 910, the first extension portion 911, and the second extension portion 912 are plate-shaped members with long sides along the x-axis.
  • a first drive mechanism 910a is provided on the upper surface of the arm base 910, and has, for example, a guide member extending along the x-axis, a rack, etc.
  • the first extension section 911 is provided with a second drive mechanism 911a.
  • the second drive mechanism 911a has, for example, a motor, a first gear that meshes with the rack of the first drive mechanism 910a and is provided near the end on the + side of the x-axis, a guide member that extends along the x-axis on the surface on the + side of the z-axis, and a second gear that is provided at the end on the - side of the x-axis.
  • the second extension section 912 is provided with a third drive mechanism 912a.
  • the third drive mechanism 912a has, for example, a rack that meshes with the second gear of the second drive mechanism 911a and extends along the x-axis.
  • the second drive mechanism 911a is controlled by the integrated control unit 130 via the transport mechanism controller 135.
  • the motor of the second drive mechanism 911a When the motor of the second drive mechanism 911a is driven, the first gear and the second gear rotate.
  • the rotational force of the first gear is transmitted to the rack of the first drive mechanism 910a, and the first extension portion 911 is guided by the guide member of the first drive mechanism 910a and moves in the x-axis direction relative to the arm base 910.
  • the rotational force of the second gear is transmitted to the rack of the third drive mechanism 912a, and the second extension portion 912 is guided by the guide member of the second drive mechanism 911a and moves in the x-axis direction relative to the first extension portion 911.
  • the LLC arm 91 When the LLC arm 91 is extended along the x-axis as shown in FIG. 10 with the above configuration, the mounting surface 913 provided at the end of the second extension section 912 on the negative x-axis side reaches the substage 22 in the sample chamber 20 through the opening 301. That is, the LLC arm 91 can transport the holder 6 along the x-axis between the elevator 92 and the substage 22. In this case, the transport distance of the holder 6 is, for example, about 750 mm. Note that the LLC arm 91 is not limited to being extended in a three-stage configuration consisting of the arm base 910, the first extension section 911, and the second extension section 912, but may be extended in a four or more stages depending on the transport distance of the holder 6.
  • the mounting surface 913 is a plate-like member having a surface parallel to the yz plane, and is attached to the end of the second extension 912 on the negative x-axis side as described above.
  • Mounting pins 914 are provided on the mounting surface 913 near the ends on the positive y-axis side and the negative y-axis side.
  • the mounting pins 914 are protrusions that protrude from the mounting surface 913 toward the negative x-axis side, i.e., toward the conveying direction.
  • the mounting pins 914 have a tip protrusion 914a at their tip, i.e., the end on the negative x-axis side, that protrudes toward the positive z-axis side, i.e., in a direction intersecting (perpendicular to) the conveying direction.
  • the mounting pin 914 is inserted into the connection hole 63 of the holder 6 described above, whereby the holder 6 is attached to the mounting surface 913.
  • the connection hole 63 of the holder 6 extends along the x-axis, which is the conveying direction.
  • the number of mounting pins 914 is not limited to two, but may be any number according to the number of connection holes 63 formed in the holder 6.
  • the storage chamber 31 houses a carrier transfer system (CTS) 319 controlled by a carrier transfer system controller 138 shown in FIG. 4 and a holder transfer system 320 (see FIG. 11) controlled by a holder transfer system controller 141.
  • the carrier transfer system 319 is a transfer system that transfers the carrier 5 or the sample piece 4 between the holder 6 and an LCC (carrier cartridge).
  • the holder transfer system 320 transfers the carrier 5 mounted on the holder 6 between the storage chamber 31 and the transfer chamber 29.
  • the storage chamber 31 is connected to the transfer chamber 29 via the opening 302 on the negative side of the y-axis. Each device in the storage chamber 31 operates under atmospheric conditions.
  • FIG. 11 is an external perspective view of the holder transport mechanism 320.
  • the holder transport mechanism 320 has an arm 321 and a holder holding part 322 provided at the end of the arm 321 on the negative side of the y-axis.
  • the arm 321 moves along the y-axis by the holder transport mechanism controller 141 controlling a drive mechanism (not shown).
  • the holder holding part 322 has a surface that is parallel to the xy plane and faces the negative side of the z axis, and holds the holder 6 from the positive side of the z axis by chucking the surface 60a of the holder 6 with this surface.
  • the holder holding part 322 is provided with a pin that extends toward the negative side of the z axis.
  • This pin is, for example, an air-expanding pin that is configured so that its diameter can be changed by supplying compressed air.
  • the storage chamber 31 is also provided with a stage on which the holder 6 transported by the holder transport mechanism 320 or the holder 6 to be transported by the holder transport mechanism 320 is temporarily placed.
  • This stage is provided with a pin extending toward the + side of the z axis.
  • This pin is an air expansion pin similar to the pin possessed by the holder holding part 322, and is inserted into the through hole 64 of the holder 6 from the - side of the z axis. Therefore, the holder 6 placed on the stage is chucked and held from the - side of the z axis.
  • This stage is configured to be able to move up and down in the z axis direction under the control of the storage chamber controller 140.
  • the arm 321 moves to the negative side of the y-axis, the holder holding part 322 reaches the top (positive side of the z-axis) of the elevator 92 in the transport chamber 29 through the opening 302. In other words, the arm 321 can transport the holder 6 along the y-axis between the stage in the storage chamber 31 and the elevator 92.
  • the charged particle beam device 10 performs a loading process, a sampling process, and an unloading process.
  • the loading process the holder 6 in the storage chamber 31 and the carrier 5 mounted on the holder 6 are transported to the sample chamber 20, and the holder 6 is attached to the substage 22.
  • the sampling process the sample piece 4 is formed and produced from the wafer 3, and the sample piece 4 is transferred to the carrier 5.
  • the unloading process the sample piece 4 is transferred to the carrier 5, and then the holder 6 on which the carrier 5 is mounted is transported into the storage chamber 31.
  • the load process includes a preparation process, a delivery process, and a mounting process. Each of the preparation process, the delivery process, and the mounting process will be described below.
  • the preparation process is mainly performed in the storage chamber 31.
  • the storage chamber controller 140 recognizes the presence and posture of the carrier 5 based on the acquired image, and then the carrier transport mechanism 319 is controlled by the carrier transport mechanism controller 138 to mount the carrier 5 on the holder 6 placed on the stage in the storage chamber 31.
  • the carrier 5 is held by the carrier holding portion 61 of the holder 6.
  • the holder 6 is chucked to the stage from the lower side (z-axis negative side) of the through hole 64 formed in the holder 6 with the surface 60a facing upward (z-axis positive side) and the surface 60b facing the x-axis positive side.
  • the stage controlled by the storage chamber controller 140 moves to the + side of the z axis.
  • This movement causes the surface 60a of the holder 6 to come into contact with the holder holder 322 located above the stage.
  • the holder holder 322 chucks the upper side (+ side of the z axis) of the through hole 64 of the holder 6, and the stage releases the chucking from the lower side of the through hole 64.
  • the holder holder 322 holds the holder 6.
  • the holder 6 is held by the holder holder 322 in a holding position in which the u-axis shown in FIG.
  • the stage controlled by the storage chamber controller 140 then moves to the - side of the z axis.
  • the transfer chamber controller 139 opens the gate valve 302a and the opening 302 to connect the storage chamber 31 to the transfer chamber 29.
  • the holder transfer mechanism controller 141 moves the arm 321 of the holder transfer mechanism 320 to the - side of the y-axis. With this movement, the holder holding part 322 provided at the end of the arm 321 on the - side of the y-axis and the holder 6 held by the holder holding part 322 are transferred through the opening 302 into the transfer chamber 29.
  • the holder holding part 322 and the holder 6 transported into the transport chamber 29 are positioned above (on the +z-axis side) the elevator 92 while maintaining the above-mentioned holding posture.
  • the holder 6 held by the holder holding part 322 is transferred to the LLC arm 91 via the elevator 92 by a transfer process.
  • FIG. 12(A) and 12(B) are diagrams of the inside of the transport chamber 29 during the transfer process.
  • the elevator 92 controlled by the transport mechanism controller 135 moves upward (to the + side of the z axis).
  • the pin 921 protruding from the mounting surface 920 of the elevator 92 to the + side of the z axis is inserted into the through hole 64 of the holder 6 from below as the elevator 92 rises.
  • the holder transport mechanism controller 141 releases the chucking of the holder holding portion 322.
  • the holder 6 moves downward by gravity and is seated and placed on the mounting surface 920 of the elevator 92.
  • the elevator 92 moves to the - side of the z axis. Then, the arm 321, controlled by the holder transport mechanism controller 141, moves to the + side of the y axis, and the arm 321 and the holder holding part 322 retreat into the storage chamber 31.
  • the transfer chamber controller 139 closes the gate valve 302a and closes the opening 302.
  • the transfer chamber controller 139 then evacuates (draws a vacuum) the transfer chamber 29, which has become atmospheric by communicating with the storage chamber 31, which is in atmospheric condition, to change it to a vacuum state. This causes the atmosphere in the transfer chamber 29 to become the same as the vacuum state of the sample chamber 20, which it will be connected to in subsequent processing.
  • the holder 6 placed on the elevator 92 is attached to the LLC arm 91. Specifically, as shown in FIG. 12(B), the elevator 92 moves (rises) toward the + side of the z axis. At this time, the position to which the elevator 92 rises is substantially the same as the position of the elevator 92 when the holder 6 is placed on the placement surface 920 from the holder holding portion 322 described above.
  • the transport mechanism controller 135 drives the second drive mechanism 911a a predetermined amount to extend the LLC arm 91 toward the negative side of the x-axis toward the holder 6 placed on the elevator 92 while in the holding position.
  • the mounting surface 913 abuts against the surface 60b of the holder 6.
  • the mounting pin 914 protruding from the mounting surface 913 toward the negative side of the x-axis is inserted into the connection hole 63 formed on the surface 60b of the holder 6.
  • the holder 6 is connected to the transport mechanism 90.
  • FIG. 13(A) is a cross-sectional view taken along line CC in FIG. 12(B), and shows a schematic diagram of the connection hole 63 and the mounting pin 914 inserted into the connection hole 63.
  • the connection hole 63 has a first region 63a and a second region 63b with different diameters.
  • the first region 63a is located on the x-axis + side relative to the second region 63b.
  • the tip protrusion 914a which is provided at the end of the mounting pin 914 on the x-axis - side and protrudes toward the z-axis + side, is accommodated in the second region 63b.
  • the elevator 92 moves (descends) toward the negative side of the z-axis.
  • the holder 6 also descends as the elevator 92 descends, the holder 6 moves toward the negative side of the z-axis relative to the mounting pin 914 on the mounting surface 913.
  • This descent causes the upper part of the mounting pin 914 to abut against the upper wall surface 63c of the first region 63a of the connection hole 63, and the positive side of the x-axis of the tip projection 914a to abut against the side wall surface 63d of the second region 63b, as shown in the cross-sectional view of FIG. 13(B).
  • the holder 6 is supported by the mounting pin 914. In other words, the holder 6 is attached to the mounting surface 913. This completes the process of transferring the holder 6 to the LLC arm 91.
  • the transfer chamber controller 139 opens the gate valve to open the opening 301, thereby connecting the transfer chamber 29 to the sample chamber 20.
  • the transfer mechanism controller 135 drives the second drive mechanism 911a by a predetermined amount to extend the LLC arm 91 toward the negative x-axis side. As a result, the attachment surface 913 and the holder 6 are transferred into the sample chamber 20 via the opening 301. In other words, since the holder 6 is attached to the attachment surface 913 in the holding position, the LLC arm 91 transfers the holder 6 in a transfer direction that intersects with the arrangement direction in which the sample pieces 4 are arranged.
  • the substage controller 134 moves the substage 22 to a position where the rotation angles of the F and ⁇ axes are 0°.
  • the wafer stage controller 133 also adjusts the height of the z-base 212 so that the height (position on the z-axis) of the mounting surface 224 of the mounting portion 221 of the substage 22 is approximately the same as the height of the bottom surface of the holder 6 transported by the LLC arm 91.
  • FIG. 14 is a diagram explaining the LLC arm 91, holder 6, and substage 22 in the sample chamber 20, with Fig. 14(A) being an external perspective view of the LLC arm 91, holder 6, and substage 22 in the sample chamber 20, and Fig. 14(B) being a cross-sectional view taken along line D-D in Fig. 14(A).
  • the holder 6 transported into the sample chamber 20 moves as the LLC arm 91 extends toward the negative x-axis side until the surface 60c of the holder 6 is positioned on the mounting surface 224 of the mounting portion 221 of the substage 22.
  • the protrusion 225a formed on the biasing member 225 of the substage 22 moves in the z-axis direction along the shape of the inclined surface 66 formed on the surface 60a of the holder 6 as the holder 6 moves in the transport direction. That is, as the holder 6 moves toward the negative side of the x-axis, the protrusion 225a moves toward the positive side of the z-axis along the inclined surface 66a of the inclined surface 66, and then moves toward the negative side of the z-axis along the inclined surface 66b. Then, when the holder 6 is moved to the mounting position on the mounting surface 224, the biasing member 225 biases the holder 6 toward the negative side of the z-axis via the protrusion 225a.
  • the wafer stage controller 133 moves the z base 212 toward the + side of the z axis, thereby raising the substage 22 toward the + side of the z axis.
  • Figure 14 (B) is a cross-sectional view showing the state in which the substage 22 has moved to the + side of the z-axis with the holder 6 placed on the mounting surface 224.
  • the holder 6 rises relative to the LLC arm 91, i.e., the mounting pin 914. Therefore, as shown in the cross-sectional view of Figure 14 (B), the mounting pin 914 no longer abuts against the upper wall surface 63c of the second region 63b of the connection hole 63, and the tip protrusion 914a no longer abuts against the side wall surface 63d of the first region 63a.
  • the tip protrusion 914a becomes movable along the x-axis within the first region 63a, and the mounting surface 913 becomes movable toward the - side of the x-axis relative to the holder 6.
  • the transport mechanism controller 135 shortens the LLC arm 91 and moves the mounting surface 913 toward the + side of the x-axis.
  • the holder 6 does not engage with the mounting surface 913, and the holder 6 is biased toward the negative z-axis side by the biasing member 225, so the holder 6 remains placed on the mounting surface 224.
  • the attachment of the holder 6 to the substage 22 is completed.
  • the storage chamber controller 140 closes the gate valve to close the opening 301. This completes the process of mounting the holder 6 to the substage 22.
  • FIGS. 15 and 16 are flowcharts that explain the operational flow during the load process of the charged particle beam device 10. Each process shown in FIGS. 15 and 16 is automatically executed and controlled by the integrated control unit 130.
  • step S201 of FIG. 15 the integrated control unit 130 controls the storage chamber controller 140 to set the LCC (carrier cartridge) on which the carrier 5 is mounted, and recognizes the presence and posture of the carrier 5 set in the LCC based on the acquired image.
  • step S202 the integrated control unit 130 controls the carrier transport mechanism controller 138 to have the carrier transport mechanism 319 mount the carrier 5 on the holder 6.
  • step S203 the integrated control unit 130 controls the storage chamber controller 140 to raise the stage in the storage chamber 31.
  • the integrated control unit 130 controls the holder transport mechanism controller 141 to hold the holder 6 on the stage by chucking it in the holder holding unit 322 of the holder transport mechanism 320.
  • the integrated control unit 130 then controls the storage chamber controller 140 to release the chucking between the stage and the holder 6, and to lower the stage.
  • step S204 the integrated control unit 130 controls the transfer chamber controller 139 to open the gate valve 302a.
  • step S205 the integrated control unit 130 controls the holder transfer mechanism controller 141 to transfer the arm 321 and holder holding unit 322 of the holder transfer mechanism 320 into the transfer chamber 29 through the opening 302.
  • the above steps S201 to S205 constitute the preparation process.
  • step S206 the integrated control unit 130 controls the transport mechanism controller 135 to raise the elevator 92 and insert the pin 921 protruding from the mounting surface 920 into the through hole 64 from below the holder 6.
  • step S207 the integrated control unit 130 controls the holder transport mechanism controller 141 to release the chucking of the holder holding unit 322.
  • step S208 the integrated control unit 130 controls the transport mechanism controller 135 to lower the elevator 92.
  • step S209 the integrated control unit 130 controls the holder transport mechanism controller 141 to move the arm 321 and the holder holding unit 322 to the + side of the y axis and to retract and store them in the storage chamber 31.
  • step S210 the integrated control unit 130 controls the transport chamber controller 139 to close the gate valve 302a.
  • step S211 the integrated control unit 130 controls the transfer chamber controller 139 to start evacuation of the transfer chamber 29.
  • step S212 of FIG. 16 the integrated control unit 130 controls the transport mechanism controller 135 to raise the elevator 92.
  • step S213 the integrated control unit 130 controls the transport mechanism controller 135 to extend the LLC arm 91 toward the negative x-axis side and insert the mounting pin 914 protruding from the mounting surface 913 toward the negative x-axis side into the connection hole 63 formed in the surface 60b of the holder 6.
  • step S214 the integrated control unit 130 controls the transport mechanism controller 135 to lower the elevator 92.
  • the above steps S206 to S214 constitute the transfer process.
  • step S215 the integrated control unit 130 and the substage controller 134 move the substage 22 to a position where the rotation angle of the F axis and the ⁇ axis is 0°.
  • step S216 the integrated control unit 130 determines whether or not the evacuation of the transfer chamber 29 has been completed. If the inside of the transfer chamber 29 is in a vacuum state and the evacuation has been completed, the integrated control unit 130 makes a positive determination and the process proceeds to step S217. If the transfer chamber 29 is not in a vacuum state, the determination process is repeated.
  • step S217 the integrated control unit 130 controls the transfer chamber controller 139 to open the gate valve and open the opening 301.
  • step S218, the integrated control unit 130 controls the transfer mechanism controller 135 to extend the LLC arm 91, transfer the mounting surface 913 and holder 6 into the sample chamber 20, and place the holder 6 on the mounting surface 224 of the mounting portion 221 of the substage 22.
  • step S219 the integrated control unit 130 controls the wafer stage controller 133 to raise the z-base 212 and raise the substage 22.
  • step S220 the integrated control unit 130 controls the transfer mechanism controller 135 to shorten the LLC arm 91 towards the +x-axis side, and retract the LLC arm 91 and mounting surface 913 into the transfer chamber 29, to the stored state shown in FIG. 9.
  • step S221 the integrated control unit 130 controls the transfer chamber controller 139 to close the gate valve to close the opening 301, and ends the process.
  • the above processes from step S215 to step S221 are the mounting process.
  • sampling process In the sampling process, the wafer 3 is processed to form and prepare the sample piece 4 (processing process). The formed and prepared sample piece 4 is transferred to the carrier 5 mounted on the holder 6 attached to the substage 22 in the above-mentioned loading process (transfer process).
  • FIG. 17 is a schematic diagram showing the structure of the sample piece 4 that is formed and fabricated.
  • FIG. 17 shows the sample piece 4 that is formed and fabricated when observing the cross-sectional structure of the wafer 3 (cross-sectional observation).
  • the sample piece 4 is a thin piece whose width in the y-axis direction is thinner than its widths in the x-axis and z-axis directions.
  • the cross-section of the wafer 3 becomes the observation surface 40 of the sample piece 4, which will be described later.
  • the sample piece 4 When the sample piece 4 is formed and fabricated for observing the planar structure of the wafer 3 (planar observation), the sample piece 4 may be a thin piece whose width in the z-axis direction is thinner than its widths in the x-axis and y-axis directions. In this case, the plane of the wafer 3 becomes the observation surface of the sample piece 4, which will be described later.
  • a protective film is formed on the wafer 3 based on the shape of the sample piece 4.
  • the ion beam b11 is irradiated onto the wafer 3 from the ion beam column 11, and while the position where the sample piece 4 is formed/produced is observed, a protective film material such as carbon gas is poured in to form the protective film on the surface of the wafer 3.
  • the ion beam column 11 irradiates the wafer 3 outside the protective film with the ion beam b11, and etches a part of the wafer 3. In this way, the sample piece 4 is formed/produced.
  • the wafer 3 is irradiated with the ion beam b11, and a sample piece 4 is processed, with the plane or cross section of the wafer 3 as the observation surface.
  • the sample piece 4 is connected to the wafer 3 by the connection point 4a.
  • the sample piece 4, the connection point 4a, and the wafer 3 are integrated, and as described below, when the sample piece 4 is transferred to the carrier 5 by the needle 112, the sample piece 4 is separated from the connection point 4a.
  • a needle 112 which is a sample piece transfer part, is attached to the sample piece 4 that has been processed in the processing process, and the sample piece 4 is extracted and separated (lifted out) from the wafer 3.
  • the lifted-out sample piece 4 is then attached to a carrier 5 on a holder 6 attached to a substage 22 so that the observation surface 40 of the sample piece 4 is parallel to the surface of the carrier 5.
  • This process is performed by an automatic micro-sampling method.
  • FIG. 18 is an explanatory diagram explaining the transfer process.
  • the needle 112 is controlled by the needle controller 142 to approach the sample piece 4.
  • the needle 112 is adhered to a part of the sample piece 4 by a deposition process performed in the sample chamber 20.
  • the needle 112 is adhered to the side 4b of the sample piece 4 opposite the connection point 4a.
  • the ion beam column 11 irradiates the connection point 4a connecting the sample piece 4 and the wafer 3 with an ion beam b11 to perform an etching process.
  • the sample piece 4 is cut, extracted, and separated from the wafer 3.
  • the sample piece 4 held by the needle 112 is moved to the position of the pillar 53 on the carrier 5 by the movement of the needle 112 controlled by the needle controller 142.
  • the carrier 5 is mounted on the holder 6 attached to the substage 22, so the carrier 5 is placed in a position different from the wafer 3.
  • the substage 22 is driven to a position where the rotation angles of the F axis and the ⁇ axis are both 90°.
  • the substage 22 is driven to a position where the angles of the F axis and the ⁇ axis are 0° and 90°, respectively. Then, the movement of the needle 112 is controlled by the needle controller 142, and the sample piece 4 approaches the position of the pillar 53.
  • the side 4c of the sample piece 4 opposite to the side 4b where the sample piece 4 is connected to the needle 112 is close to the pillar 53.
  • a deposition process is performed near this side 4c, thereby bonding the pillar 53 and the sample piece 4.
  • the observation surface 40 of the sample piece 4, which is a cross section or plane of the wafer 3 is attached so as to be parallel to the surface of the carrier 5.
  • the ion beam column 11 irradiates the ion beam b11 to the part of the side 4b where the sample piece 4 and the needle 112 are connected, thereby etching the sample piece 4. This causes the sample piece 4 to be cut off from the needle 112. This completes the sampling process of the sample piece 4.
  • FIG. 18 shows a case where one sample piece 4 is supported by one pillar 53.
  • multiple sample pieces 4 may be supported by one pillar 53.
  • the substage controller 134 moves the substage 22 to a position where the rotation angles about the F and ⁇ axes are 0°.
  • the wafer stage controller 133 adjusts the z-axis position of the z-base 212 so that the height (position on the z-axis) of the mounting surface 224 of the mounting portion 221 of the substage 22 becomes the height at which the LLC arm 91 starts to retract during the above-mentioned load process.
  • the transport mechanism controller 135 extends the LLC arm 91 toward the negative side of the x-axis.
  • the mounting surface 913 which has been brought into the sample chamber 20 by the extension of the LLC arm 91, comes into contact with the surface 60b of the holder 6, and the mounting pin 914 protruding from the mounting surface 913 is inserted into the connection hole 63.
  • the mounting pin 914 and the connection hole 63 are in the state shown in FIG. 14(B). In this state, the wafer stage controller 133 moves the z-base 212 toward the negative side of the z-axis and lowers it.
  • the holder 6 also begins to move toward the positive side of the x-axis due to the abutment of the tip protrusion 914a and the side wall surface 63d.
  • the protrusion 225a formed on the biasing member 225 of the substage 22 moves in the z axis direction along the shape of the inclined surface 66 formed on the face 60a of the holder 6. That is, as the holder 6 moves toward the + side of the x axis, the protrusion 225a moves toward the + side of the z axis along the inclined surface 66b of the inclined surface 66, and then moves toward the - side of the z axis along the inclined surface 66a. Then, when the holder 6 moves toward the + side of the x axis beyond the biasing member 225, the holder 6 is removed from the substage 22.
  • the transport mechanism controller 135 shortens the LLC arm 91, positioning the holder 6 attached to the mounting surface 913 above (the z-axis + side) the placement surface 920 of the elevator 92.
  • the elevator 92 then moves toward the z-axis + side and rises, and the pin 921 protruding from the placement surface 920 toward the z-axis + side is inserted into the through hole 64 of the holder 6.
  • the connection hole 63 and the mounting pin 914 of the holder 6 are in the state shown in FIG. 13(B). That is, the mounting pin 914 abuts against the upper wall surface 63c of the first region 63a of the connection hole 63, and the tip projection 914a abuts against the side wall surface 63d of the second region 63b.
  • the elevator 92 rises a predetermined amount toward the z-axis + side.
  • the holder 6 moves toward the z-axis + side relative to the mounting surface 913, and the connection hole 63 and mounting pin 914 of the holder 6 move to the state shown in FIG. 13 (A). That is, the mounting pin 914 no longer abuts against the upper wall surface 63c of the first region 63a of the connection hole 63, and the tip protrusion 914a no longer abuts against the side wall surface 63d of the second region 63b.
  • the tip protrusion 914a becomes movable along the x-axis within the first region 63a, and the mounting surface 913 becomes movable toward the x-axis - side relative to the holder 6.
  • the transport mechanism controller 135 shortens the LLC arm 91 to move the mounting surface 913 toward the x-axis + side and store it in a storage state.
  • the holder 6 is placed on the placement surface 920 of the elevator 92. After that, the elevator 92 descends to the negative side of the z-axis.
  • the arm 321 controlled by the holder transport mechanism controller 141 is transported into the transport chamber 29, and the holder holding part 322 is positioned above the holder 6.
  • the elevator 92 rises and brings the surface 60a of the holder 6 into contact with the underside of the holder holding part 322.
  • the holder holding part 322 chucks the holder 6 from the upper side (the z-axis + side) of the through hole 64.
  • the elevator 92 is then lowered to the z-axis - side.
  • the holder 6 is transferred from the elevator 92 to the holder holding part 322 of the holder transport mechanism 320.
  • the holder 6 moves together with the holder holding part 322 as the arm 321 moves to the y-axis + side, and is retracted into the storage chamber 31.
  • the holder 6 held by the holder holding part 322 is placed on the stage of the storage chamber 31 by performing the reverse procedure of the preparation process in the load process. Then, the carrier 5 mounted on the holder 6 is removed from the holder 6.
  • the holder transport mechanism 320 is provided with a pin that moves up and down along the z-axis, and this pin drives the biasing part 62 of the holder 6 to release the biasing force of the biasing part 62 acting on the carrier 5. In this state, the carrier 5 is removed from the holder 6.
  • the removed carrier 5 is housed in a cartridge or the like for storage.
  • FIGS. 19 and 20 are flowcharts that explain the operational flow during the load process of the charged particle beam device 10. Each process shown in FIGS. 19 and 20 is automatically executed and controlled by the integrated control unit 130.
  • step S301 of FIG. 19 the integrated control unit 130 and the substage controller 134 move the substage 22 to a position where the rotation angle of the F axis and the ⁇ axis is 0°.
  • step S302 the integrated control unit 130 controls the transfer chamber controller 139 to open the gate valve and open the opening 301.
  • step S303 the integrated control unit 130 controls the transfer mechanism controller 135 to extend the LLC arm 91, to carry the mounting surface 913 into the sample chamber 20, and to insert the mounting pin 914 into the connection hole 63.
  • step S304 the integrated control unit 130 controls the wafer stage controller 133 to lower the z base 212, thereby lowering the substage 22.
  • step S305 the integrated control unit 130 controls the transfer mechanism controller 135 to shorten the LLC arm 91 and to retract the holder 6 from the sample chamber 20.
  • step S306 the integrated control unit 130 controls the transfer chamber controller 139 to close the gate valve and the opening 301.
  • the above processes from step S301 to step S306 are the removal process.
  • step S307 the integrated control unit 130 controls the transport mechanism controller 135 to shorten the LLC arm 91 and position the holder 6 above the elevator 92.
  • step S308 the integrated control unit 130 controls the transport mechanism controller 135 to raise the elevator 92 and insert the pin 921 protruding from the mounting surface 920 into the through hole 64 from below the holder 6.
  • step S309 the integrated control unit 130 controls the transport mechanism controller 135 to shorten the LLC arm 91 and place the LLC arm 91 in a stored state.
  • step S310 the integrated control unit 130 controls the transport mechanism controller 135 to lower the elevator 92.
  • step S311 the integrated control unit 130 controls the transport chamber controller 139 to evacuate the transport chamber 29.
  • step S312 in FIG. 20 the integrated control unit 130 controls the transport chamber controller 139 to open the gate valve 302a.
  • step S313 the integrated control unit 130 controls the carrier transport mechanism controller 138 to transport the arm 321 and holder holding part 322 of the holder transport mechanism 320 into the transport chamber 29 through the opening 302.
  • step S314 the integrated control unit 130 controls the transport mechanism controller 135 to raise the elevator 92 and insert the pin 921 protruding from the mounting surface 920 into the through hole 64 from below the holder 6.
  • step S315 the integrated control unit 130 controls the carrier transport mechanism controller 138 to hold the holder 6 by chucking the holder holding unit 322.
  • step S316 the integrated control unit 130 controls the transport mechanism controller 135 to lower the elevator 92.
  • step S317 the integrated control unit 130 controls the holder transport mechanism controller 141 to transport the arm 321, holder holding unit 322, and holder 6 of the holder transport mechanism 320 into the storage chamber 31 through the opening 302.
  • step S3108 the integrated control unit 130 controls the transport chamber controller 139 to close the gate valve 302a.
  • the integrated control unit 130 may control the transport chamber controller 139 to evacuate (vacuum) the transport chamber 29.
  • the above processes from step S307 to step S318 constitute the transfer process.
  • step S319 the integrated control unit 130 controls the storage chamber controller 140 to raise the stage in the storage chamber 31.
  • the integrated control unit 130 controls the storage chamber controller 140 to place the holder 6 held by the holder holding unit 322 on the stage by chucking it.
  • the integrated control unit 130 controls the holder transport mechanism controller 141 to release the chucking of the holder holding unit 322.
  • the integrated control unit 130 controls the storage chamber controller 140 to lower the stage in the storage chamber 31. As a result, the holder 6 is stored in the storage chamber 31.
  • step S320 the integrated control unit 130 controls the carrier transport mechanism controller 138 to remove the carrier 5 from the holder 6 and store it in a cartridge or the like. This allows the carrier 5 to be collected and the process to end.
  • the above steps S319 and S320 constitute the collection process. According to the embodiment described above, at least one of the following advantageous effects can be obtained.
  • the charged particle beam device 10 includes a wafer stage 21 and a substage 22 stored in the sample chamber 20, and a transport mechanism 90.
  • the substage 22 has a tilt mechanism 223 that tilts the holder 6 carrying the sample piece 4 made from the wafer 3, independently of the wafer 3.
  • the transport mechanism 90 transports the holder 6 from the substage 22 to the outside of the sample chamber 20, independently of the wafer 3. This allows the transport chamber 29 connected to the sample chamber 20 to be evacuated when transporting the holder 6, and reduces the time required for evacuation compared to the case where the sample chamber 20 is evacuated, contributing to improved work efficiency. In addition, there is no need to transport the wafer 3 and the sample piece 4 out of the sample chamber 20 by an integrated mechanism, and the demand for only the holder 6 to which the sample piece 4 is attached can be fulfilled.
  • a plurality of carriers 5 with sample pieces 4 attached are arranged along the arrangement direction.
  • the tilting mechanism 223 tilts the sample piece 4 around the F axis, which is an axis parallel to the arrangement direction.
  • the transport mechanism 90 transports the holder 6 in a direction (transport direction) intersecting the arrangement direction. This makes it possible to control the posture and transport the holder 6 carrying a plurality of carriers 5. Therefore, compared to conventional technology that allows the transport of a holder that can be tilted by carrying a single carrier, it is possible to increase the number of sample pieces 4 that can be measured and transported, and improve the measurement and transport efficiency.
  • the transport mechanism 90 has an LLC arm 91 that expands and contracts using a telescopic mechanism. This improves the linearity of the transport direction when transporting the holder 6. In addition, even if the transport distance of the holder 6 is long, the LLC arm 91 can be shortened and stored, making it possible to reduce the size of the transport chamber 29 compared to, for example, using a transport rod or the like. In addition, the holder 6 can be transported with a less expensive configuration compared to, for example, using a robot arm or the like.
  • the storage chamber 31 has a holder transport mechanism 320 that transports the holder 6 between the transport chamber 29 and the storage chamber 31. This allows the storage chamber 31 and the transport chamber 29 to be separate chambers, making it possible to reduce the volume of the transport chamber 29, making it possible to evacuate only the transport chamber 29, thereby reducing the time required for evacuation.
  • the holder 6 has a connection hole 63 that connects to the LLC arm 91 of the transport mechanism 90 and a through hole 64 that connects to the holder holding portion 322 of the holder transport mechanism 320. This makes it possible to transfer the holder 6 between the transport mechanism 90 and the holder transport mechanism 320 with a simple configuration.
  • connection hole 63 is a hole formed along the transport direction of the holder 6.
  • An attachment pin 914 which is a protrusion extending along the transport direction, is provided on the attachment surface 913 of the transport mechanism 90.
  • the holder 6 is connected to the transport mechanism 90 by inserting the attachment pin 914 into the connection hole 63. This makes it possible to connect the holder 6 to the transport mechanism 90 with a simple configuration.
  • the tip of the mounting pin 914 has a tip protrusion 914a extending in the z-axis direction intersecting the transport direction.
  • the tip protrusion 914a is accommodated in the second region 63b of the connection hole 63, which has a larger diameter than the first region 63a.
  • the tip protrusion 914a abuts against the side wall surface 63d, which is the step between the first region 63a and the second region 63b. Therefore, the holder 6 is restricted from moving in the x-axis direction relative to the LLC arm 91 of the transport mechanism 90.
  • the holder 6 is prevented from falling off the transport mechanism 90 during transport.
  • the transfer process, mounting process, and removal process of the holder 6 are performed by the movement of the LLC arm 91 in the transport direction and the movement of the elevator 92 or the substage 22 in the z-axis direction, so there is no need to use a complex mechanism.
  • the substage 22 has an attachment portion 221 as a holding mechanism that detachably holds the holder 6.
  • the attachment portion 221 has a mounting surface 224 on which the holder 6 is placed, and a biasing member 225 that biases the placed holder 6 toward the mounting surface 224.
  • the holder 6 has an inclined surface 66 that protrudes toward the biasing member 225 on the surface 60a. When the holder 6 is placed on the mounting surface 224, the inclined surface 66 and the biasing member 225 face each other. As a result, the holder 6 is attached and fixed in a simple configuration so that it is sandwiched between the mounting surface 224 and the biasing member 225 from the z-axis + side and - side.
  • the protrusion 225a protruding downward from the biasing member 225 and the inclined surface 66 protruding upward from the holder 6 suppress the movement of the placed holder 6 along the transport direction relative to the attachment portion 221. As a result, even if the wafer stage 21 and substage 22 move and rotate in various directions during the sampling process, the holder 6 is prevented from falling off the substage 22.
  • 1 inspection system 1a sample piece preparation mechanism, 3 wafer, 4 sample piece, 5 carrier, 6 holder, 10 charged particle beam device, 11 ion beam column, 12 electron beam column, 20 sample chamber, 21 wafer stage, 22 substage, 29 transfer chamber, 31 storage chamber, 61 carrier holding section, 62 biasing section, 63 connection hole, 63a first region, 63b second region, 63c upper wall surface, 63d side wall surface, 64 through hole, 66 inclined surface, 66a, 66b inclined surface, 90 transfer mechanism, 91 LLC arm, 92 elevator, 100 computer system, 101 upper control section, 130 integrated control section, 133 wafer stage controller, 134 substage controller, 13 5.
  • Transport mechanism controller 137. Sample chamber controller, 138. Carrier transport mechanism controller, 139.
  • Transport chamber controller 140. Storage chamber controller, 141. Holder transport mechanism controller, 221. Mounting section, 222. Mounting support section, 223. Tilt mechanism, 224. Mounting surface, 225. Pressing member, 225a. Protrusion, 301, 302. Opening, 302a. Gate valve, 319. Carrier transport mechanism, 320. Holder transport mechanism, 321. Arm, 322. Holder holding section, 910. Arm base, 910a. First drive mechanism, 911. First extension section, 911a. Second drive mechanism, 912. Second extension section, 912a. Third drive mechanism, 913. Mounting surface, 914. Mounting pin, 914a. Tip protrusion, 920. Mounting surface, 921. Pin

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PCT/JP2023/001973 2023-01-23 2023-01-23 荷電粒子ビーム装置 WO2024157337A1 (ja)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000214056A (ja) * 1999-01-21 2000-08-04 Hitachi Ltd 平面試料の作製方法及び作製装置
JP2018163825A (ja) * 2017-03-27 2018-10-18 株式会社日立ハイテクサイエンス 試料保持具、部材装着用器具、および荷電粒子ビーム装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000214056A (ja) * 1999-01-21 2000-08-04 Hitachi Ltd 平面試料の作製方法及び作製装置
JP2018163825A (ja) * 2017-03-27 2018-10-18 株式会社日立ハイテクサイエンス 試料保持具、部材装着用器具、および荷電粒子ビーム装置

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