WO2024127720A1

WO2024127720A1 - Antenna module and communication device equipped with same

Info

Publication number: WO2024127720A1
Application number: PCT/JP2023/030488
Authority: WO
Inventors: 薫須藤
Original assignee: 株式会社村田製作所
Priority date: 2022-12-16
Filing date: 2023-08-24
Publication date: 2024-06-20

Abstract

This antenna module (100) comprises a dielectric board (130), dielectric blocks (121), a tabular ground electrode (GND1), and electric power supply wiring (140, 145). The dielectric blocks (121) have mutually perpendicular surfaces (122, 123) and are positioned so that the surfaces (122) face a mounting surface of the dielectric board (130). The ground electrode (GND1) is positioned so as to be perpendicular to the dielectric board (130) and to face the surfaces (123) of the dielectric blocks (121). The electric power supply wiring (140, 145) is positioned on the dielectric board (130) and transmits high-frequency signals to the dielectric blocks (121). When seen in plan view from the direction normal to the dielectric board (130), end portions of the electric power supply wiring (140, 145) are positioned at positions that overlap the dielectric blocks (121).

Description

Antenna module and communication device equipped with same

This disclosure relates to an antenna module and a communication device equipped with the same, and more specifically to a configuration for adjusting the radiation direction of a dielectric resonator antenna.

JP 2000-209020 A (Patent Document 1) discloses a dielectric resonator antenna (DRA) that radiates radio waves by supplying a high-frequency signal to a rectangular parallelepiped (dielectric block) made of dielectric material placed on a flat substrate.

In the dielectric resonator antenna disclosed in Patent Document 1, a supplied high-frequency signal (electric field) resonates within the dielectric block, causing radio waves to be emitted in the opposite direction to the ground electrode placed on the substrate, i.e., in the normal direction of the substrate. The frequency characteristics of the radio waves radiated from the dielectric resonator antenna are determined by the shape, dimensions and dielectric constant of the dielectric block. Furthermore, in the dielectric resonator antenna of Patent Document 1, there is only one supply path for the high-frequency signal to the dielectric block, so radio waves are radiated from the dielectric block in only one specific polarization direction.

JP 2000-209020 A

Antenna devices such as those described above may be used in mobile communication devices such as mobile phones or smartphones. In mobile communication devices, in order to ensure reliable communication with other devices such as base stations or routers, multiple antennas are arranged within the device, and a configuration is used that allows radio waves to be emitted in different directions.

If the dielectric resonator antenna disclosed in Patent Document 1 is applied to such a communication device, radio waves can only be emitted in the normal direction of the substrate on which the dielectric block is placed.

The present disclosure has been made to solve these problems, and its purpose is to provide a dielectric resonator antenna that can radiate radio waves in a direction different from the normal direction of the substrate.

The antenna module according to the present disclosure comprises a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power supply wiring. The dielectric block has a first surface and a second surface that intersect with each other, and is disposed facing the mounting surface of the substrate on the first surface. The first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block. The power supply wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, the end of the power supply wiring is disposed in a position that overlaps with the dielectric block.

The antenna module disclosed herein has a flat ground electrode in a direction intersecting with the substrate, and the dielectric block is arranged opposite the mounting surface of the substrate so that a surface other than the surface facing the substrate faces the ground electrode. By arranging the dielectric block in this manner, when a high-frequency signal is supplied to the dielectric block, radio waves can be radiated in the normal direction of the ground electrode. Therefore, radio waves can be radiated in a direction different from the normal direction of the substrate on which the dielectric block is arranged.

1 is a block diagram of a communication device to which an antenna module according to a first embodiment is applied; FIG. 2 is a perspective view of the antenna module of FIG. 1 . FIG. 2 is a side perspective view of the antenna module of FIG. 1 . 11A and 11B are diagrams for explaining modified examples 1 and 2 of the arrangement of power supply wiring in a dielectric block. 13A and 13B are diagrams for explaining modified examples 3 and 4 of the coupling state between the dielectric block and the power supply line. FIG. 13 is a side perspective view of an antenna module according to a fifth modified example. FIG. 13 is a side perspective view of an antenna module according to a sixth modified example. FIG. 11 is a block diagram of a communication device to which an antenna module according to a second embodiment is applied. FIG. 9 is a perspective view of the antenna module of FIG. 8 . FIG. 9 is a side perspective view of the antenna module of FIG. 8 . FIG. 13 is a side perspective view of an antenna module according to a seventh modified example. FIG. 23 is a side perspective view of an antenna module according to an eighth modified example. FIG. 11 is a partial side perspective view of a communication device according to a third embodiment. 14 is a partial plan view of the communication device of FIG. 13 as viewed from the positive direction of the X-axis.

Below, the embodiments of the present disclosure will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings will be given the same reference numerals and their description will not be repeated.

[First embodiment]
(Basic configuration of communication device)
1 is a block diagram of a communication device 10 to which an antenna module 100 according to the present embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone, or a tablet, or a personal computer equipped with a communication function. An example of the frequency band of radio waves used in the antenna module 100 according to the present embodiment is a millimeter wave band radio wave having a center frequency of, for example, 28 GHz, 39 GHz, or 60 GHz, but radio waves of other frequency bands are also applicable.

Referring to FIG. 1, the communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120. The communication device 10 upconverts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 to a high frequency signal and radiates the high frequency signal from the antenna device 120, and downconverts a high frequency signal received by the antenna device 120 to an intermediate frequency signal and processes the signal in the BBIC 200.

The antenna device 120 includes a flat dielectric substrate 130 having a substantially rectangular shape, and a plurality of dielectric blocks 121 arranged on the dielectric substrate 130. In FIG. 1, an example of an array configuration in which four dielectric blocks 121 are arranged in a row on the dielectric substrate 130 is shown, but the number of dielectric blocks 121 is not limited to this. A single dielectric block 121 may be arranged on the dielectric substrate 130, or a configuration in which a plurality of dielectric blocks 121 other than four are arranged may be used. In addition, an array configuration in which the dielectric blocks 121 are arranged two-dimensionally may be used. When the dielectric blocks 121 are arranged in a one-dimensional array configuration, it is desirable to set the center-to-center distance between adjacent dielectric blocks to approximately λ/2, assuming that the wavelength in free space of the radio wave radiated from the dielectric block 121 is λ.

The dielectric block 121 has a substantially rectangular parallelepiped shape. When a high-frequency signal in a predetermined frequency band is supplied to the dielectric block 121, an electric field resonates inside the dielectric block 121, and radio waves corresponding to the resonant frequency are radiated from the dielectric block 121 to the outside. In other words, the antenna module 100 is a dielectric resonator antenna (DRA). The resonant frequency of the resonance occurring in the dielectric block 121 is determined by the shape and dimensions of the dielectric block 121 and the dielectric constant of the dielectric that constitutes the block. The dielectric constant of the dielectric block 121 is set higher than the dielectric constant of the dielectric substrate 130. The relative dielectric constant of the dielectric block 121 is, for example, 10 or more, and preferably 15 to 20. By setting the dielectric constant of the dielectric block 121 higher than the dielectric constant of the dielectric substrate 130, the wavelength of the electric field that resonates in the dielectric block 121 can be shortened, and the size of the dielectric block 121 can be reduced.

In the antenna module 100 of the first embodiment, high-frequency signals are supplied to each dielectric block 121 via two power supply wirings. As will be described later with reference to FIG. 2 etc., the polarization direction of the radiated radio waves differs depending on the power supply position of the high-frequency signal to the dielectric block 121. In other words, the antenna module 100 is a so-called dual-polarized type antenna module capable of radiating radio waves in two different polarization directions.

The RFIC 110 includes two

power feed circuits

110A and 110B. The power feed circuit 110A is a circuit for supplying a high-frequency signal for a first polarization direction. The power feed circuit 110B is a circuit for supplying a high-frequency signal for a second polarization direction. Note that since the internal configuration of the power feed circuit 110B is similar, in order to facilitate explanation, in FIG. 1, only the detailed configuration of the power feed circuit 110A is shown, and the configuration of the power feed circuit 110B is omitted. Below, the function of the power feed circuit 110A will be explained as a representative.

The power supply circuit 110A includes switches 111A-111D, 113A-113D, and 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, a signal combiner/distributor 116, a mixer 118, and an amplifier circuit 119.

When transmitting a high-frequency signal, switches 111A-111D and 113A-113D are switched to the power amplifiers 112AT-112DT side, and switch 117 is connected to the transmitting amplifier of amplifier circuit 119. When receiving a high-frequency signal, switches 111A-111D and 113A-113D are switched to the low-noise amplifiers 112AR-112DR side, and switch 117 is connected to the receiving amplifier of amplifier circuit 119.

The intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118. The up-converted high frequency signal, the transmission signal, is split into four by the signal combiner/distributor 116, passes through the corresponding signal paths, and is fed to different dielectric blocks 121. By individually adjusting the phase shift of the phase shifters 115A-115D arranged on each signal path, the directivity of the radio waves output from the dielectric block 121 can be adjusted. In addition, the attenuators 114A-114D adjust the strength of the transmission signal.

The received signal, which is a high-frequency signal received by each dielectric block 121, is transmitted to the power supply circuit 110A of the RFIC 110 and is combined in the signal combiner/distributor 116 via four different signal paths. The combined received signal is down-converted to an intermediate frequency signal by the mixer 118, and further amplified by the amplifier circuit 119 before being transmitted to the BBIC 200.

The RFIC 110 is formed, for example, as a one-chip integrated circuit component including the above circuit configuration. Alternatively, it may be formed as an individual integrated circuit component for each power supply circuit. Furthermore, for the devices corresponding to each dielectric block (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), it may be formed as a one-chip integrated circuit component for each corresponding dielectric block.

(Antenna module structure)
Next, the configuration of the antenna module 100 in the first embodiment will be described in detail with reference to Fig. 2 and Fig. 3. Fig. 2 is a perspective view of the antenna module 100 according to the first embodiment. Fig. 3 is a side view of the antenna module 100 when viewed from the Y-axis direction in Fig. 2. In the following description, the normal direction of the flat plate-shaped dielectric substrate 130 is the Z-axis direction, the direction along the short side of the dielectric substrate 130 is the X-axis direction, and the direction along the long side of the dielectric substrate 130 is the X-axis direction. In each figure, the positive direction of the Z-axis may be referred to as the upper side, and the negative direction may be referred to as the lower side.

In addition to the RFIC 110, the dielectric block 121, and the dielectric substrate 130, the antenna module 100 further includes ground electrodes GND1 and GND2 and

power supply wiring

140 and 145.

The dielectric substrate 130 may be, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of resins such as epoxy and polyimide, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (Polyethylene Terephthalate), or a ceramic multilayer substrate other than LTCC. Note that the dielectric substrate 130 does not necessarily have to have a multilayer structure and may be a single-layer substrate.

The dielectric substrate 130 has an upper surface 131 and a lower surface 132. In an inner layer of the dielectric substrate 130, a ground electrode GND2 is disposed over the entire surface of the dielectric substrate 130. A flat ground electrode GND1 is disposed on the end side of the dielectric substrate 130 in the positive direction of the X-axis in a direction intersecting the dielectric substrate 130. In the example of the antenna module 100, the ground electrode GND1 extends from the upper surface 131 of the dielectric substrate 130 in the positive direction of the Z-axis and has a flat shape disposed so as to be parallel to the YZ plane. Each of the ground electrodes GND1 and GND2 is electrically connected to a ground terminal on a mounting substrate (not shown). The ground electrodes GND1 and GND2 may be connected to each other.

The dielectric blocks 121 are arranged on the dielectric substrate 130 at a distance from each other along the Y-axis direction, further toward the end in the positive direction of the X-axis than the ground electrode GND1. The dielectric blocks 121 are arranged so that the lower surface 122 of the approximately rectangular parallelepiped faces the upper surface 131 of the dielectric substrate 130 and protrudes further in the X-axis direction from the end surface in the positive direction of the X-axis of the dielectric substrate 130. The surface 123 of the dielectric block 121 in the negative direction of the X-axis is arranged to face the main surface of the ground electrode GND1. The surface 123 of the dielectric block 121 has an approximately square shape. The dielectric block 121 may be in contact with the ground electrode GND1 or may be spaced apart from it.

A SiP (System In Package) module 105 is disposed on the upper surface 131 of the dielectric substrate 130. The SiP module 105 is a control device that incorporates an RFIC 110, as well as a circuit in which a power module IC for a power supply and a power inductor (not shown) are mounted on the substrate. As shown in FIG. 3, the circuit is sealed with resin 106, and is mounted on the dielectric substrate 130 by a connecting member such as a solder bump 160. Note that the SiP module 105 is omitted in FIG. 2.

Furthermore,

power supply wiring

140, 145 for transmitting high frequency signals from the RFIC 110 to the dielectric block 121 is arranged on the upper surface 131 of the dielectric substrate 130.

The power supply wiring 140 includes a wiring electrode 141 connected to the solder bumps 160 that connect the SiP module 105 to the dielectric substrate 130 and to the dielectric block 121, and a stub 142 branching off from the wiring electrode 141. The wiring electrode 141 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP1 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y-axis. The stub 142 branches off in the negative direction of the Y-axis from midway through the wiring electrode 141 on the dielectric substrate 130.

Similarly, the power supply wiring 145 includes a wiring electrode 146 connected to the solder bump 160 and the dielectric block 121, and a stub 147 branching off from the wiring electrode 146. The wiring electrode 146 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP2 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y-axis. The stub 147 branches off in the positive direction of the Y-axis from midway along the wiring electrode 146 on the dielectric substrate 130.

The

wiring electrodes

141 and 146 are spaced apart from each other in a direction parallel to the surface 123 of the dielectric block 121 (the Y-axis direction). The

wiring electrodes

141 and 146 are arranged opposite the ground electrode GND2 of the dielectric substrate 130, and function as strip lines.

The

stubs

142 and 147 are provided for impedance matching with the dielectric block 121. Note that the

stubs

142 and 147 are not essential components, and if impedance matching with the dielectric block 121 can be achieved, the

stubs

142 and 147 can be omitted.

In the antenna module 100 of the first embodiment, an example is shown in which the

power supply wiring

140, 145 is arranged on the upper surface 131 of the dielectric substrate 130, but the

power supply wiring

140, 145 may be arranged on an inner layer of the dielectric substrate 130.

In an antenna module 100 configured as described above, when a high-frequency signal is supplied to the power supply wiring 140, radio waves polarized in the direction of the arrow AR1 in FIG. 2, i.e., one diagonal direction of the substantially square end face 123, are radiated in the positive direction of the X-axis (the direction of the arrow AR3 in FIG. 3). When a high-frequency signal is supplied to the power supply wiring 145, radio waves polarized in the direction of the arrow AR2 in FIG. 2, i.e., the other diagonal direction of the substantially square end face 123, are radiated in the positive direction of the X-axis.

In this way, by supplying high-frequency signals to different positions on the cross section of the dielectric block 121, two radio waves having different polarization directions can be radiated. In other words, the antenna module 100 is a dual-polarized type antenna module. In the antenna module 100, the surface 123 of the dielectric block 121 is approximately square, so that the polarization directions of the two radiated radio waves are perpendicular to each other.

As described above, in the antenna module 100 of the first embodiment, by arranging the dielectric block 121 opposite the main surface of the ground electrode GND1 that is arranged crosswise to the dielectric substrate 130, it is possible to radiate radio waves in a direction different from the normal direction of the dielectric substrate 130. Furthermore, by supplying high-frequency signals to different positions on the surface of the dielectric block 121 that faces the ground electrode GND1, it is possible to make a dual-polarized type antenna module. Note that by making the polarization directions of the two radio waves radiated from the dielectric block 121 orthogonal to each other, it is possible to improve the cross-polarization discrimination ratio (XPD).

In the example of the antenna module 100, the ground electrode GND1 for the dielectric block 121 is arranged so as to be perpendicular to the dielectric substrate 130, i.e., so that the angle between the ground electrode GND1 and the dielectric substrate 130 is 90°; however, the angle between the ground electrode GND1 and the dielectric substrate 130 does not necessarily have to be 90°.

The "ground electrode GND1" and "ground electrode GND2" in embodiment 1 correspond to the "first ground electrode" and "second ground electrode" in this disclosure, respectively. The "wiring electrode 141" and "wiring electrode 146" in embodiment 1 correspond to the "first wiring" and "second wiring" in this disclosure, respectively. The "lower surface 122" and "surface 123" of the dielectric block 121 in embodiment 1 correspond to the "first surface" and "second surface" in this disclosure, respectively.

(Modifications 1 and 2)
In the first and second modifications, a description will be given of variations in the power feed position in the dielectric block 121. Fig. 4 is a diagram for explaining the first and second modifications of the arrangement of the

power feed wirings

140 and 145 in the dielectric block 121.

As explained in the first embodiment, by arranging the

power supply wirings

140, 145 at a distance in a direction parallel to the surface 123 of the dielectric block 121 facing the ground electrode GND1, two radio waves with different polarization directions can be radiated from the dielectric block 121. In the antenna module 100 of the first embodiment, the power supply wiring 145 is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y axis, and the power supply wiring 140 is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y axis.

The connection portions of the

power supply wirings

140A, 145A with the dielectric block 121 in the antenna module 100A of the first modification have a substantially L-shaped cross section when viewed in a plan view from the X-axis direction. That is, the power supply wiring 140A extends from the bottom surface 122 to the side surface 125 at the end of the bottom surface 122 of the dielectric block 121 in the negative direction of the Y-axis. The power supply wiring 145A extends from the bottom surface 122 to the side surface 124 at the end of the bottom surface 122 of the dielectric block 121 in the positive direction of the Y-axis. By adopting a configuration like that of the first modification, the symmetry of the electric field in the diagonal direction of the dielectric block 121 is stabilized, thereby improving the polarization characteristics of the two radio waves.

The

power supply wiring

140B, 145B in the antenna module 100B of the second modification has a cross-sectional shape similar to that of the

power supply wiring

140, 145 in the first embodiment, but is connected to the dielectric block 121 at a position slightly offset inward from the end of the lower surface 122 in the Y-axis direction.

Even when a high-frequency signal is supplied to the power supply position as in variants 1 and 2, two radio waves with different polarization directions can be emitted.

(Modifications 3 and 4)
In the third and fourth modified examples, a description will be given of variations in the state of coupling between the dielectric block 121 and the

power supply lines

140 and 145. Fig. 5 is a diagram for explaining the third and fourth modified examples of the state of coupling between the dielectric block 121 and the

power supply lines

140 and 145.

In the antenna module 100 of the first embodiment, a configuration in which the dielectric block 121 and the

power supply wirings

140 and 145 are directly connected has been described. In the antenna module 100C of the third modification (the left diagram of FIG. 5), a small gap is provided between the lower surface 122 of the dielectric block 121 and the

power supply wirings

140 and 145, and the dielectric block 121 and the

power supply wirings

140 and 145 are in a non-contact state. If the attenuation of the high-frequency signal due to this gap is less than a predetermined amount, the high-frequency signal can be transmitted to the dielectric block 121 even in a non-contact state, and radio waves can be emitted from the dielectric block 121. In addition, the impedance can be adjusted by adjusting the gap amount between the dielectric block 121 and the

power supply wirings

140 and 145. If the free space wavelength of the radio waves emitted from the dielectric block 121 is λ, the gap amount between the dielectric block 121 and the

power supply wirings

140 and 145 is set to within λ/10.

The gap may be an air space, or another dielectric such as a resist may be disposed in the gap.

In the antenna module 100D of the fourth modified example (the right diagram in FIG. 5), the power supply wiring 140 is connected to a flat plate electrode 150 arranged on the lower surface 122 of the dielectric block 121 via a solder bump 155. Although not shown, the power supply wiring 145 is also connected to a flat plate electrode arranged on the dielectric block 121 via a solder bump in a similar manner.

By configuring the

power supply wiring

140, 145 and the dielectric block 121 to be connected by solder bumps, as in the antenna module 100D, the connection strength between the

power supply wiring

140, 145 and the dielectric block 121 can be increased.

(Variation 5)
In the fifth modification, variations in the arrangement of the dielectric substrate and the dielectric block will be described. Fig. 6 is a side perspective view of an antenna module 100E of the fifth modification. In the antenna module 100E, the dielectric substrate 130 in the antenna module 100 of the first embodiment shown in Fig. 3 is replaced with a dielectric substrate 130A. The other configuration of the antenna module 100E is similar to that of the antenna module 100, and the description of the elements overlapping with Fig. 3 will not be repeated.

Referring to FIG. 6, the dielectric substrate 130A in the antenna module 100E has a dimension in the X-axis direction that is longer than the dielectric substrate 130 in the antenna module 100. As a result, the dielectric block 121 is positioned so that the end of the dielectric block 121 in the positive direction along the X-axis is substantially in the same position as the end of the dielectric substrate 130 in the positive direction along the X-axis.

On the other hand, the ground electrode GND2 arranged on the dielectric substrate 130A is arranged only up to the position where the

power supply wiring

140, 145 is arranged. In other words, the ground electrode GND2 is not arranged near the end of the dielectric substrate 130A in the positive direction of the X-axis. Therefore, when viewed in a plan view from the normal direction of the dielectric substrate 130A, at least a part of the area where the dielectric substrate 130A and the dielectric block 121 overlap does not overlap with the ground electrode GND2.

By configuring in this way, the electric field leaking out from the dielectric block 121 may cause the area of the dielectric substrate 130A where there is no ground electrode GND2 to resonate, which may improve the gain. Alternatively, it is possible to miniaturize the antenna module by miniaturizing the dielectric block 121 while maintaining the gain.

In addition, the connection between the dielectric block 121 and the dielectric substrate 130A can be stabilized by supporting the dielectric block 121 with resin or double-sided tape placed between the dielectric block 121 and the dielectric substrate 130A.

(Variation 6)
In the sixth modification, a configuration will be described in which a metal package of a SiP module is used as a ground electrode for a dielectric block. Fig. 7 is a side perspective view of an antenna module 100F of the sixth modification. In the antenna module 100F, the SiP module 105 in the antenna module 100 of the first embodiment is replaced with a SiP module 105A, and further the ground electrode GND1 is removed. In Fig. 7, the description of the elements that overlap with Fig. 3 will not be repeated.

Referring to FIG. 7, a conductive shielding member 107 configured to block electromagnetic waves is disposed around the outer periphery of the SiP module 105A in the antenna module 100F. The shielding member 107 is formed from a metal member such as copper, aluminum, or iron, and is electrically connected to a ground potential. This shielding member 107 prevents electromagnetic waves generated in the internal circuitry of the SiP module 105A from leaking to the outside, thereby suppressing the effects on external devices. The shielding member 107 also prevents electromagnetic noise from entering the internal circuitry of the SiP module 105A from the outside.

Furthermore, the dielectric block 121 is arranged so that the surface 123 in the negative direction of the X axis faces the shielding member 107 on the side of the SiP module 105A. This configuration can reduce the ground electrode GND1, lowering manufacturing costs and contributing to the miniaturization of the antenna module.

The "shield member 107" in variant example 6 corresponds to the "conductive member" in this disclosure.

[Embodiment 2]
(Basic configuration of communication device)
In the second embodiment, a configuration will be described in which a flat patch antenna is provided as a radio wave radiating element in addition to a dielectric block, and radio waves can be radiated in different directions.

FIG. 8 is a block diagram of a communication device to which an antenna module 100G according to embodiment 2 is applied. In the antenna module 100G of FIG. 8, the RFIC 110 in the antenna module 100 of FIG. 1 is replaced with an RFIC 110X, and a flat radiating element 127 is added to the dielectric substrate 130. Note that FIG. 8 shows an example in which four radiating elements 127 are arranged on the dielectric substrate 130.

Referring to FIG. 8, the radiating element 127 has a substantially square shape when viewed in a plan view from the normal direction of the dielectric substrate 130. The radiating element 127 has two feed points SP1 and SP2 arranged at positions offset in different directions from the center of the element, and a high-frequency signal is supplied to each of the feed points SP1 and SP2.

The RFIC 110X further includes

feed circuits

110C and 110D in addition to the

feed circuits

110A and 110B. The

feed circuits

110A and 110B are circuits for supplying a high-frequency signal to the dielectric block 121, similar to the antenna module 100 of the first embodiment. The feed circuit 110C is a circuit for supplying a high-frequency signal to the feed point SP1 of the radiating element 127. The feed circuit 110D is a circuit for supplying a high-frequency signal to the feed point SP2 of the radiating element 127. The internal configurations of the feed circuits 110B to 110D are the same as the feed circuit 110A, and FIG. 8 shows the detailed configuration only for the feed circuit 110A.

(Antenna module structure)
Next, the antenna module 100G will be described in detail with reference to Fig. 9 and Fig. 10. Fig. 9 is a perspective view of the antenna module 100G of Fig. 8, and Fig. 110 is a side perspective view of the antenna module 100G as viewed from the opposite direction of the Y axis. Note that the SiP module 105 is omitted in Fig. 9.

9 and 10, in the antenna module 100G, four dielectric blocks 121 are arranged spaced apart from one another along the Y-axis direction on the end side in the positive direction of the X-axis of a dielectric substrate 130. If the wavelength of the radio wave radiated from the dielectric block 121 is _λ1 , adjacent dielectric blocks 121 are arranged at a pitch of _λ1 /2.

Furthermore, four radiating elements 127 are arranged spaced apart from one another along the Y-axis direction on the lower surface 132 side of the dielectric substrate 130. If the wavelength of the radio waves radiated from the radiating elements 127 is _λ2 , adjacent radiating elements 127 are arranged at a pitch of _λ2 /2. The frequency band of the radio waves radiated from the radiating elements 127 may be the same as or different from the frequency band of the radio waves radiated from the dielectric block 121.

The radiating element 127 is disposed on the bottom surface 132 side of the ground electrode GND2 disposed on the dielectric substrate 130, facing the ground electrode GND2. The radiating element 127 may be disposed so as to be exposed on the bottom surface 122 of the dielectric substrate 130, as shown in FIG. 10, or may be disposed on an inner layer between the ground electrode GND2 and the bottom surface 132.

A high-frequency signal is transmitted from RFIC 110A to radiating element 127 via

power supply wiring

151, 152. Power supply wiring 151 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP1 of radiating element 127. Power supply wiring 152 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP2 of radiating element 127.

Feed point SP1 is located at a position offset in the Y-axis direction from the center of radiating element 127. When a high-frequency signal is supplied to feed point SP1, radio waves polarized in the Y-axis direction are radiated in the negative direction of the Z-axis (the direction of arrow AR4 in Figure 10). Feed point SP2 is located at a position offset in the negative direction of the X-axis from the center of radiating element 127. When a high-frequency signal is supplied to feed point SP2, radio waves polarized in the X-axis direction are radiated in the negative direction of the Z-axis.

Note that the configuration of the dielectric block 121 is similar to that of the antenna module 100 in embodiment 1, so its description will not be repeated.

In this way, by providing a patch antenna on the dielectric substrate in addition to the dielectric block, it is possible to radiate radio waves in two different directions.

(Variation 7)
Fig. 11 is a side perspective view of an antenna module 100H of Modification 7. The antenna module 100H has a configuration in which a flat patch antenna is provided on the dielectric substrate 130 in the configuration of Modification 6 described in Fig. 7. In Fig. 11, the description of elements that overlap with Fig. 7 will not be repeated.

Referring to FIG. 11, in the antenna module 100H, similar to the antenna module 100G of the second embodiment, a flat radiating element 127 is disposed on the lower surface 132 of the dielectric substrate 130. High-frequency signals are supplied from the RFIC 110 to the power supply points SP1 and SP2 of the radiating element 127 via the

power supply wirings

151 and 152, respectively.

By configuring the antenna module 100H, it is possible to eliminate the ground electrode GND1, thereby reducing manufacturing costs and miniaturizing the antenna module, and it is also possible to radiate radio waves in two different directions.

(Variation 8)
12 is a side perspective view of an antenna module 100I according to Modification 8. The antenna module 100I is an example in which the antenna module 100H shown in FIG.

Specifically, in antenna module 100I, the dimensions in the X-axis direction of dielectric substrate 130 and SiP module 105A are smaller than those in antenna module 100H. Radiating element 127 is disposed close to the end of dielectric substrate 130 in the positive direction of the X-axis. In other words, when viewed in a plan view from the normal direction of dielectric substrate 130, at least a portion of radiating element 127 overlaps dielectric block 121.

By using a configuration like antenna module 100I, it is possible to further reduce the size of the antenna module.

[Embodiment 3]
In the third embodiment, an example of the arrangement of antenna modules in a communication device will be described.

FIG. 13 is a partial side perspective view of a communication device 10 according to embodiment 3. In FIG. 13, the antenna module 100 described in FIG. 3 of embodiment 1 will be used for explanation. Also, FIG. 14 is a partial plan view of the communication device in FIG. 13 as viewed from the positive direction of the X-axis. Note that in the following explanation, the explanation of each element of the antenna module 100 that overlaps with FIG. 3 will not be repeated.

The communication device 10 includes a housing 20 for housing internal equipment including the antenna module 100. The housing 20 includes a first portion 21 formed of a material that contains metal, and a second portion 22 formed of a dielectric material that does not contain metal, such as a resin. The second portion 22 is disposed inside a through hole 23 formed in the first metal portion 21.

The antenna module 100 is arranged so that the entire surface 126 of the dielectric block 121 opposite surface 123, i.e., the radio wave radiation surface (the surface in the positive direction of the X-axis), is in contact with the second portion 22 of the housing 20. When the communication device 10 is viewed in a plan view from the positive direction of the X-axis as shown in FIG. 14, the entire surface 126 of the dielectric block 121 overlaps with the second portion 22.

In this way, by arranging a material that does not contain metal in the housing portion in the direction of radiation of the radio waves radiated from the dielectric block 121, it is possible to prevent the radiated radio waves from being blocked or partially interfered with by the housing 20. Therefore, it is possible to suppress deterioration of the antenna gain of the antenna module 100.

It is desirable to bring the dielectric block 121 into close contact with the second portion 22 of the housing 20. If there is a space between the dielectric block 121 and the second portion 22, the dielectric constant of the radiation path of the radio waves will change due to the air layer in the space, and reflections will occur at the boundary between the dielectric block 121 and the air layer, and at the boundary between the air layer and the second portion 22 of the housing 20, which can cause deterioration of the antenna gain. Therefore, by bringing the dielectric block 121 into close contact with the second portion 22, it is possible to reduce the reflection of radio waves and suppress deterioration of the antenna gain.

In addition, from the viewpoint of preventing reflections due to differences in dielectric constant, it is preferable to make the difference between the dielectric constant of the dielectric block 121 and the dielectric constant of the second portion 22 as small as possible.

In the above description, an example was described in which a portion of the housing 20 (first portion 21) was made of a material that contained metal, but as long as the strength of the housing 20 can be ensured, the entire housing 20 may be made of a material that does not contain metal.

The "second portion 22" in the third embodiment corresponds to the "specific portion" in the present disclosure.
[Aspects]
(Item 1) An antenna module according to one embodiment includes a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power feed wiring. The dielectric block has a first surface and a second surface that intersect with each other, and is disposed on the first surface facing a mounting surface of the substrate. The first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block. The power feed wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, an end of the power feed wiring is disposed in a position that overlaps with the dielectric block.

(2) In the antenna module described in 1, the power supply wiring includes a first wiring and a second wiring. The first wiring and the second wiring are arranged spaced apart from each other in a first direction parallel to the second surface.

(3) In the antenna module described in 2, the second surface of the dielectric block has a substantially square shape. The first surface of the dielectric block has a first end and a second end that face each other in the first direction. The first wiring is disposed at the first end, and the second wiring is disposed at the second end.

(4) The antenna module described in any one of paragraphs 1 to 3 further includes a second ground electrode and a flat radiating element. The second ground electrode is disposed on the substrate opposite the power supply wiring. The radiating element is disposed on the substrate opposite the second ground electrode.

(5) In the antenna module described in any one of paragraphs 1 to 4, the power supply wiring is arranged in contact with the dielectric block.

(6) In the antenna module described in any one of paragraphs 5, the dielectric block is disposed at a distance from the first ground electrode.

(7) In the antenna module described in any one of paragraphs 1 to 4, the power supply wiring is arranged at a distance from the dielectric block. If the free space wavelength of the radio wave radiated from the dielectric block is λ, the distance between the power supply wiring and the dielectric block is within λ/10.

(8) In the antenna module described in 7, the dielectric block is arranged in contact with the first ground electrode.

(Item 9) The antenna module described in any one of Items 1 to 8 further includes a second ground electrode disposed on the substrate opposite the power supply wiring. When viewed in a plan view from the normal direction of the substrate, at least a portion of the area where the substrate and the dielectric block overlap does not overlap with the second ground electrode.

(10) In the antenna module described in any one of paragraphs 1 to 9, the dielectric constant of the dielectric block is greater than the dielectric constant of the substrate.

(11) In the antenna module described in 10, the dielectric constant of the dielectric block is 10 or more.

(12) The antenna module described in any one of paragraphs 1 to 3 further includes a power supply device. The power supply device is disposed on the main surface of the substrate on which the dielectric block is mounted, and is configured to supply a high-frequency signal to the dielectric block. The power supply device is surrounded by a conductive member. A part of the conductive member is used as a first ground electrode.

(Clause 13) The antenna module described in clause 12 further includes a second ground electrode and a flat radiating element. The second ground electrode is disposed on the substrate opposite the power supply wiring. The radiating element is disposed on the substrate opposite the second ground electrode.

(14) In the antenna module described in 13, when viewed in a plan view from the normal direction of the substrate, at least a portion of the radiating element overlaps with the dielectric block.

(Clause 15) The antenna module described in clause 4 further includes a power supply circuit disposed on the substrate and configured to supply a high-frequency signal to the dielectric block and the radiating element.

(16) A communication device according to one embodiment is equipped with an antenna module as described in any one of the preceding paragraphs 1 to 15.

(Clause 17) The communication device described in clause 16 further includes a housing that houses the antenna module. The housing includes a specific portion that is at least partially formed of a material that does not contain metal. When viewed in a plan view from the normal direction of the radio wave radiation surface of the dielectric block, the entire radiation surface overlaps with the specific portion.

(Item 18) In the communication device described in item 17, the radiation surface is in contact with the specific portion.
The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims.

10 communication device, 20 housing, 21 first part, 22 second part, 23 through hole, 100, 100A to 100I antenna module, 105, 105A SiP module, 106 resin, 107 shielding member, 110, 100X RFIC, 110A to 110D power supply circuit, 111A to 111D, 113A to 113D, 117 switch, 112AR to 112DR low noise amplifier, 112AT to 112DT power amplifier, 114A to 114D attenuator, 115A to 115D phase shifter, 116 signal combiner/distributor, 11 8 mixer, 119 amplifier circuit, 120 antenna device, 121 dielectric block, 122, 132 bottom surface, 123, 126 top surface, 124, 125 side surface, 127 radiating element, 130, 130A dielectric substrate, 131 top surface, 140, 140A, 140B, 145, 145A, 145B, 151, 152 power supply wiring, 141, 146 wiring electrode, 142, 147 stub, 150 flat plate electrode, 155, 160 solder bump, 200 BBIC, GND1, GND2 ground electrode, OP1, OP2 opening, SP1, SP2 power supply point.

Claims

A substrate;
a dielectric block having a first surface and a second surface intersecting each other, the first surface being disposed facing a mounting surface of the substrate;
a first ground electrode having a flat plate shape arranged to intersect with the substrate and to face the second surface of the dielectric block;
a power supply wiring disposed on the substrate and configured to transmit a high-frequency signal to the dielectric block;
an end of the power supply wiring is disposed at a position overlapping with the dielectric block when viewed in a plan view from a normal direction of the substrate;
the power supply wiring includes a first wiring and a second wiring,
The antenna module according to claim 1 , wherein the first wiring and the second wiring are arranged spaced apart from each other in a first direction parallel to the second surface.
the second surface of the dielectric block has a substantially square shape,
the first surface of the dielectric block has a first end and a second end opposed to each other in the first direction,
The first wiring is disposed at the first end,
The antenna module according to claim 2 , wherein the second wiring is disposed at the second end portion.
a second ground electrode disposed on the substrate so as to face the power supply wiring;
The antenna module according to claim 1, further comprising a flat-plate shaped radiating element disposed on the substrate so as to face the second ground electrode.
An antenna module according to any one of claims 1 to 4, wherein the power supply wiring is arranged in contact with the dielectric block.
The antenna module of claim 5, wherein the dielectric block is disposed at a distance from the first ground electrode.
the power supply wiring is disposed at a distance from the dielectric block,
5. The antenna module according to claim 1, wherein, when the wavelength in free space of the radio wave radiated from the dielectric block is λ, the distance between the power supply wiring and the dielectric block is within λ/10.
The antenna module according to claim 7, wherein the dielectric block is disposed in contact with the first ground electrode.
The substrate further includes a second ground electrode disposed opposite the power supply wiring,
The antenna module according to any one of claims 1 to 8, wherein, when viewed in a plane from a normal direction of the substrate, at least a portion of an overlapping area between the substrate and the dielectric block does not overlap with the second ground electrode.
An antenna module according to any one of claims 1 to 9, wherein the dielectric constant of the dielectric block is greater than the dielectric constant of the substrate.
The antenna module according to claim 10, wherein the dielectric constant of the dielectric block is 10 or more.
a power supply device arranged on a main surface of the substrate on which the dielectric block is mounted and configured to supply a high-frequency signal to the dielectric block,
The power supply device is surrounded by a conductive member,
The antenna module according to claim 1, wherein a portion of the conductive member is used as the first ground electrode.
a second ground electrode disposed on the substrate so as to face the power supply wiring;
The antenna module according to claim 12 , further comprising: a flat-plate shaped radiating element disposed on the substrate so as to face the second ground electrode.
The antenna module according to claim 13, wherein at least a portion of the radiating element overlaps with the dielectric block when viewed in a plan view from the normal direction of the substrate.
The antenna module of claim 4, further comprising a power supply circuit disposed on the substrate and configured to supply a high-frequency signal to the dielectric block and the radiating element.
A communication device equipped with an antenna module according to any one of claims 1 to 15.
Further comprising a housing for accommodating the antenna module,
the housing includes a specific portion formed at least in part of a material that does not contain metal;
The communication device according to claim 16 , wherein, when viewed in a plan view from a normal direction of a radiation surface of the dielectric block for radio waves, the entire radiation surface overlaps with the specific portion.
The communication device according to claim 17, wherein the radiation surface is in contact with the specific portion.