WO2024119892A1 - 电控组件、电控装置、电控柜及电梯设备 - Google Patents

电控组件、电控装置、电控柜及电梯设备 Download PDF

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Publication number
WO2024119892A1
WO2024119892A1 PCT/CN2023/114044 CN2023114044W WO2024119892A1 WO 2024119892 A1 WO2024119892 A1 WO 2024119892A1 CN 2023114044 W CN2023114044 W CN 2023114044W WO 2024119892 A1 WO2024119892 A1 WO 2024119892A1
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WO
WIPO (PCT)
Prior art keywords
electric control
main body
control module
circuit board
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/114044
Other languages
English (en)
French (fr)
Inventor
郭腾飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GD Midea Heating and Ventilating Equipment Co Ltd
Winone Elevator Co Ltd
Original Assignee
GD Midea Heating and Ventilating Equipment Co Ltd
Winone Elevator Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202223281230.9U external-priority patent/CN219437380U/zh
Priority claimed from CN202223281142.9U external-priority patent/CN219372752U/zh
Application filed by GD Midea Heating and Ventilating Equipment Co Ltd, Winone Elevator Co Ltd filed Critical GD Midea Heating and Ventilating Equipment Co Ltd
Publication of WO2024119892A1 publication Critical patent/WO2024119892A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention belongs to the technical field of elevator equipment, and in particular relates to an electric control component, an electric control device, an electric control cabinet and elevator equipment.
  • the driver generally includes a board, an electronic heating element, and a heat sink.
  • the electronic heating element generates a high amount of heat when in operation, so it is necessary to fit the electronic heating element to the heat sink, and use the heat sink to conduct heat and dissipate heat from the electronic heating element. Due to the large size and weight of the heat sink, it is necessary to set support members for the heat sink and the board respectively to prevent the gravity of the heat sink from directly acting on the electronic heating element during transportation or use, causing stress on the electronic heating element or the board, resulting in bending, deformation, or even damage.
  • the purpose of the present disclosure is to at least solve the problem of stress between the circuit board and the electronic heating element caused by the assembly error of different support members. This purpose is achieved through the following technical solutions:
  • an electric control component which includes: a support plate, the support plate includes a main body and a bending structure arranged on the main body; a first circuit board, installed on the main body; a first electric control module, installed on the bending structure; a first electronic heating element, installed on the first circuit board, and the end of the first electronic heating element facing away from the capacitor plate is thermally connected to the first electric control module.
  • a first mounting structure and a bending structure are formed on a support plate of an integrated structure to respectively support the first circuit board and the first electric control module, thereby avoiding assembly errors of different supporting members when different supporting members are used to respectively support the first electric control module and the first circuit board, and by setting the bending structure, the first electronic heating element is adapted to the first electric control module, so that the first electric control module installed on the bending structure can be thermally connected to the first electronic heating element, thereby improving the matching accuracy between the first electric control module and the first electronic heating element, so as to reduce the stress in the first circuit board and the first electronic heating element.
  • the electric control assembly according to the present disclosure may also have the following additional technical features:
  • the bending structure includes at least two oppositely disposed bending edges, and a first avoidance structure is formed between the at least two oppositely disposed bending edges; wherein at least a portion of the first electronic control module is disposed in the first avoidance structure, or at least a portion of the first electronic heating element is disposed in the first avoidance structure.
  • the bending edge includes a first bending portion connected to the main body portion and a second bending portion connected to a side of the first bending portion facing away from the main body portion, and the first electric control module is installed on the second bending portion, and along a direction perpendicular to the support plate, the first circuit board and the first electric control module are respectively located on both sides of the second bending portion.
  • the main body is further provided with a first mounting structure, and the first circuit board is mounted on the main body through the first mounting structure.
  • the end of the first electronic heating element facing away from the first circuit board has a first heat-conducting surface, and the first heat-conducting surface abuts against the first electronic control module; along a direction perpendicular to the first circuit board, the sum of the size of the first mounting structure, the size of the main body, and the size of the bending structure is equal to the distance between the first heat-conducting surface and the first circuit board.
  • an electric control device which includes: a support plate including a first main body part and a second main body part connected to each other, and the first main body part and the second main body part are not in the same plane; a first electric control module, installed on the first main body part; a second electric control module, installed on the second main body part; wherein the first electric control module and the second electric control cabinet module are both arranged on the same side of the support plate, and along the direction perpendicular to the support plate, the absolute value of the difference in height between one end of the first electric control module away from the support plate and one end of the second electric control module away from the support plate is H, and the absolute value of the difference in size between the first electric control module and the second electric control module is L, then H is less than L; or the first electric control module and the second electric control module are respectively located on both sides of the support plate, and along the direction parallel to the support plate, the first electric control module and the second electric control module are at least partially overlapped.
  • the absolute value of the difference in height between one end of the first electric control module away from the support plate and the other end of the second electric control module away from the support plate is H
  • the absolute value of the difference in size between the first electric control module and the second electric control module is L.
  • the first main body portion and the second main body portion are arranged in parallel, and along a direction perpendicular to the support plate, a size of the second electric control module is larger than a size of the first electric control module.
  • the first main body portion and the second main body portion do not overlap.
  • the electronic control device also includes: a first heating module installed in the first main body part and thermally connected to the first electronic control module; a second electronic heating element installed in the second main body part and thermally connected to the second electronic control module.
  • the first heating module includes: a first circuit board, installed on a side of the first main body away from the first electric control module; a first electronic heating element, installed on the first circuit board, and the first electronic heating element is thermally connected to the first electric control module; and/or the second electronic heating element includes: a second circuit board, installed on a side of the second main body away from the second electric control module; an IGBT module, installed on the second circuit board, and the IGBT module is thermally connected to the second electric control module; wherein, along a direction perpendicular to the second main body, the second circuit board is located on a side of the first circuit board away from the second main body and is stacked with the first circuit board.
  • the first main body part is provided with a first avoidance structure, and the first electronic heating element of the first heating module is thermally connected to the first electronic control module through the first avoidance structure;
  • the second main body part is provided with a second avoidance structure, and the IGBT module of the second electronic heating element is thermally connected to the second electronic control module through the second avoidance structure.
  • the first main body part is provided with a bending edge
  • the first electronic control module is installed on the side of the bending edge away from the first circuit board; wherein, part of the plate body of the first main body part is bent toward the side away from the first circuit board to form the bending edge and the first avoidance structure located on one side of the bending edge.
  • a partial area of the second main body portion is provided with an opening penetrating through the plate body of the support plate to form the second avoidance structure.
  • the first heating module further includes: a third electronic heating element installed on the first circuit board; and the first main body portion is further provided with a third avoidance structure for avoiding the third electronic heating element.
  • the second circuit board is arranged on a side of the first circuit board facing away from the support plate and is stacked with the first circuit board, the first main body portion and the second main body portion are parallel and do not overlap, and an end of the first electronic control module facing away from the first circuit board is flush with an end of the second electronic control module facing away from the second circuit board.
  • an electric control cabinet comprising the Electronic control device.
  • an elevator device is also proposed, the elevator device includes the electric control cabinet described in the third technical solution
  • FIG1 schematically shows an exploded view of some parts of an electric control assembly according to an embodiment of the present disclosure from a first viewing angle
  • FIG2 schematically shows an exploded view of some parts of an electric control assembly according to a second viewing angle of an embodiment of the present disclosure
  • FIG3 schematically shows a schematic structural diagram of an electric control device at a front view angle according to an embodiment of the present disclosure
  • FIG4 schematically shows a structural diagram of a support plate at a first viewing angle according to an embodiment of the present disclosure
  • FIG5 schematically shows a structural diagram of a support plate at a second viewing angle according to an embodiment of the present disclosure
  • FIG6 schematically shows a schematic structural diagram of an electric control device from a lower left perspective according to an embodiment of the present disclosure
  • FIG7 schematically shows a schematic structural diagram of an electric control device from a front view perspective according to an exemplary embodiment of the present disclosure
  • FIG8 schematically shows a schematic structural diagram of an electric control device from a front view perspective according to an exemplary embodiment of the present disclosure
  • FIG. 9 schematically shows a partial structural diagram of an electric control component from a front view perspective according to an embodiment of the present disclosure.
  • a first circuit board 20.
  • a first electronic control module
  • a second electronic control module 70.
  • first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as “first”, “second”, etc. may be used to refer to a plurality of elements, components, regions, layers and/or sections. Generic terms and other numerical terms do not imply a sequence or order when used herein. Thus, a first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section without departing from the teachings of the exemplary embodiments.
  • spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as “inside”, “outside”, “inner side”, “outer side”, “below”, “below”, “above”, “above”, etc.
  • Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as “below other elements or features” or “below other elements or features” will subsequently be oriented as “above other elements or features" or “above other elements or features”. Therefore, the example term “below" can include both upper and lower orientations.
  • the device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.
  • an electric control component is provided.
  • the electric control assembly includes a support plate 10, a first circuit board 20, a first electronic heating element 40 and a first electric control module 30.
  • the support plate 10 is a plate-shaped member.
  • the support plate 10 includes a main body 11, a first mounting structure 101 and a bending structure 12.
  • the first mounting structure 101 is arranged on a side plate surface of the main body 11.
  • the bending structure 12 is connected to the main body 11.
  • the bending structure 12 can be formed by bending a part of the support plate 10, or the bending structure 12 can be integrally cast with the main body 11 through an injection molding process.
  • the first mounting structure 101 is used to install and support the first circuit board 20, and the bending structure 12 is used to install and support the first electric control module 30.
  • the first mounting structure 101 includes a plurality of screw columns arranged on the main body 11.
  • the screw columns are hollow columnar structures, and the inner diameter of the screw columns is provided with internal threads.
  • the first mounting structure 101 and the main body 11 are integrally formed structures.
  • the first circuit board 20 is parallel to the support plate 10, and the first circuit board 20 is installed on the screw columns through a connector.
  • the first electric control module 30 is installed at one end of the bending structure 12 away from the main body 11.
  • the first electronic heating element 40 is located between the first circuit board 20 and the first electric control module 30, and the first electronic heating element 40 is installed on the first circuit board 20 and electrically connected to the wiring in the first circuit board 20.
  • the end of the first electronic heating element 40 away from the first circuit board 20 is thermally connected to the first electric control module 30, specifically, the first electric control module 30 is used to dissipate heat for the first electronic heating element 40.
  • the first electronic heating element 40 is directly abutted against the first electric control module 30 to achieve a thermal connection between the first electronic heating element 40 and the first electric control module 30.
  • a gap is provided between the first electronic heating element 40 and the first electric control module 30, and a thermally conductive material such as silicone grease is filled in the gap to achieve a thermal connection between the first electronic heating element 40 and the first electric control module 30.
  • the first circuit board 20 is a capacitor plate
  • the first electronic heating element 40 is a rectifier bridge module
  • the first electronic control module 30 is specifically a radiator, which can be a fin-type radiator made of materials such as copper and aluminum alloy.
  • the bending structure 12, the first mounting structure 101 and the main body 11 are integrally processed and formed to avoid assembly errors between the bending structure 12, the first mounting structure 101 and the main body 11, thereby improving the matching accuracy between the first electric control module 30 and the first electronic heating element 40, and further reducing the stress in the first circuit board and the first electronic heating element.
  • the bending structure 12 includes two oppositely arranged bending edges.
  • the bending edge includes a first bending portion 1201 connected to the main body 11 and a second bending portion 1202 connected to the first bending portion 1201, the first bending portion 1201 is arranged perpendicular to the main body 11, the second bending portion 1202 is arranged parallel to the main body 11, and the second bending portion 1202 is used to fix the first electric control module 30.
  • the second bending portion 1202 is provided with a connecting hole, and the first electric control module 30 is fixed to the second bending portion 1202 by passing a connecting member such as a bolt through the connecting hole.
  • the two bending edges are arranged in parallel and at intervals, and a first avoidance structure is formed between the two bending edges.
  • the first circuit board 20 and the first electric control module 30 are respectively located on both sides of the second bending portion 1202, and the first electronic heating element 40 is thermally connected to the first electric control module 30 through the first avoidance structure, so that at least one of the first electronic heating element 40 or the first electric control module 30 passes through the support plate 10 and is thermally connected to the other, thereby avoiding the support plate 10 from overlapping with the first electronic heating element 40 and the first electric control module 30 in the thickness direction (i.e., the direction perpendicular to the first circuit board 20), thereby reducing the overall size of the electric control component in the thickness direction.
  • the bending structure 12 and the first mounting structure 101 are both located on the same side of the main body 11, that is, the first bending portion 1201 is folded from the main body 11 to the side close to the first circuit board 20.
  • At least a portion or all of the first electric control module 30 is disposed in the first avoidance structure (not shown in the figure), so that the first electric control module 30 is mounted on the support plate 10 in a form of sinking as a whole relative to the support plate 10.
  • disposing at least a portion of the first electric control module 30 in the first avoidance structure facilitates the matching of the first electric control module 30 with the first electronic heating element 40 for heat dissipation of the first electronic heating element 40, and on the other hand, the two The first avoidance structure defined between the bent edges can form an independent heat dissipation duct to independently dissipate heat for the first electric control module 30 , thereby reducing the effect of heat emitted by the first electric control module 30 on the operation of other components in the electric control assembly.
  • the bending structure 12 and the first mounting structure 101 are respectively located on both sides of the main body 11, that is, the first bending portion 1201 is folded from the main body 11 to the side away from the first circuit board 20. At least part of the area or the entire area of the first electronic heating element 40 is arranged in the first avoidance structure 1111. In this embodiment, at least part of the first electronic heating element 40 is arranged in the first avoidance structure 1111.
  • the first electronic control module 30 it is convenient for the first electronic control module 30 to match the first electronic heating element 40 for heat dissipation of the first electronic heating element 40, and on the other hand, it can avoid the support plate 10 from overlapping with the first electronic heating element 40 and the first electronic control module 30 in the thickness direction (i.e., the direction perpendicular to the first circuit board 20), thereby reducing the overall size of the electronic control component in the thickness direction.
  • a first heat conducting surface 41 is provided on the side facing the first electric control module 30 , and the first heat conducting surface 41 abuts against the first electric control module 30 , so that the heat generated by the first electronic heating element 40 is transferred to the first electric control module 30 through the first heat conducting surface 41 , thereby achieving heat dissipation of the first electronic heating element 40 .
  • the distance between the first heat conducting surface 41 and the main body 11 matches the height of the bending structure 12 protruding from the main body 11 , so that the first electric control module 30 mounted on the bending structure 12 can abut against the first heat conducting surface 41 of the first electronic heating element 40 .
  • the height of the bending structure 12 protruding from the main body 11 can be determined by using the dimension chain calculation method, and then the size of the bending structure 12 can be determined. It can be understood that, taking the board surface of the first circuit board 20 facing the side of the support plate 10 as a reference, along the direction perpendicular to the first circuit board 20, the distance from the first heat conducting surface 41 to the reference is set as L, the height dimension of the bending structure 12 protruding from the main body 11 is A (i.e., the size of the bending structure 12), the thickness of the support plate 10 is B, and the length dimension of the first mounting structure 101 is C. The specific size A of the bending structure 12 is calculated based on the dimension chain.
  • the size A of the bending structure 12 corresponding to modules of different sizes can be calculated based on the above-mentioned dimension chain, so that the support plate 10 proposed in the present disclosure is suitable for different types of modules.
  • an electric control device is provided.
  • the electric control device includes a support plate 10, a first electric control module 30 and a second electric control module 70.
  • the support plate 10 is in a rectangular plate shape as a whole and is bent along two parallel fold lines (the fold line direction is perpendicular to the length direction of the support plate), so that the support plate 10 has a bent structure and includes a first main body part 111, a second main body part 112 and a transition connection part 113.
  • the first main body part 111 and the second main body part 112 are connected by the transition connection part 113.
  • the plate body of the transition connection part 113 is perpendicular to the first main body part 111 and the second main body part 112.
  • the first main body part 111 and the second main body part 112 are parallel to each other, and along the direction perpendicular to the support plate 10, the first main body part 111 and the second main body part 112 are spaced and do not overlap, so that installation spaces with different heights are respectively formed in the first main body part 111 and the second main body part 112 for matching radiators with different height sizes.
  • the absolute value of the difference in height between one end of the first electric control module 30 away from the support plate 10 and the other end of the second electric control module 70 away from the support plate 10 is H
  • the absolute value of the difference between the size A of the first electric control module 30 and the size B of the second electric control module 70 is l.
  • the support plate 10 By making the support plate 10 as a whole to form a first main body part 111 and a second main body part 112, installation spaces of different heights are formed in a direction perpendicular to the support plate 10, and are used to match the first electric control module 30 and the second electric control module 70 of different sizes, so that H is less than l, so as to reduce the volume of useless free space generated on the side of the smaller electronic components, make the overall structure of the electric control device more compact, and improve space utilization.
  • the first electric control module 30 and the second electric control module 70 are respectively located on both sides of the support plate 10 (please refer to FIG. 5 ), and along a direction parallel to the support plate 10, the first electric control module 30 and the second electric control module 70 are at least partially overlapped.
  • the overall thickness dimension of the electric control device i.e., the dimension perpendicular to the direction of the support plate
  • the first main body portion 111 is used to install the first electric control module 30, and the second main body portion 112 is used to install the second electric control module 70, and the first electric control module 30 and the second electric control module 70 are made flush with one end facing away from the support plate, thereby avoiding useless free space on one side of the first electric control module 30 with a smaller size, making the overall structure of the electric control device more compact and improving space utilization.
  • the first electric control module 30 and the second electric control module 70 are both radiators.
  • the electric control device further includes a first heating module and a second electronic heating element 60.
  • the first heating module and the second electronic heating element 60 are specifically an electronic heating element or a combination of multiple electronic heating elements in the electric control device.
  • the first heating module is installed in the first main body part 111
  • the second electronic heating element 60 is installed in the second main body part 112.
  • the first heating module is thermally connected to the first electric control module 30, so that the first heating module is dissipated by the first electric control module 30, and the second electronic heating element 60 is thermally connected to the second electric control module 70, so that the second electronic heating element 60 is dissipated by the second electric control module 70.
  • the case space formed by the first main body part 111 and the second main body part 112 is used to arrange the first heating module and the second electronic heating element 60 respectively.
  • the first heating module and the second electronic heating element 60 are respectively arranged in different space blocks, which is conducive to improving the heat dissipation efficiency.
  • the first heating module and the second electronic heating element 60 can be arranged on the same side of the support plate 10 as the first electric control module 30 and the second electric control module 70, or the first heating module and the second electronic heating element 60 can be arranged on the side of the support plate 10 away from the first electric control module 30 and the second electric control module 70.
  • the first heating module is directly connected to the first electric control module 30 to achieve a thermal connection between the first heating module and the first electric control module 30, or in other embodiments, a gap is provided between the first heating module and the first electric control module 30, and a thermal conductive material such as silicone grease is filled inside the gap to achieve a thermal connection between the first heating module and the first electric control module 30.
  • a thermal conductive material such as silicone grease
  • the first heating module includes a first circuit board 20 and a first electronic heating element 40
  • the second electronic heating element 60 includes a second circuit board 50 and an IGBT module.
  • the second circuit board 50 is a driving board
  • the second electronic control module 70 is specifically a radiator, which can be a finned radiator made of copper, aluminum alloy or other materials.
  • a first mounting structure 101 is provided on a side of the first main body 111 away from the first electric control module 30, and the first mounting structure 101 is used to install and support the first circuit board 20.
  • the first mounting structure 101 includes a plurality of screw columns provided on the first main body 111, the screw columns are hollow columnar structures, the inner diameter of the screw columns is provided with internal threads, the first mounting structure 101 and the first main body 111 are an integrally formed structure, the first circuit board 20 is parallel to the first main body 111, and the first circuit board 20 is installed on the screw columns through a connector.
  • the first electronic heating element 40 is located between the first circuit board 20 and the first electric control module 30, and the first electronic heating element 40 is installed on the first circuit board 20 and is electrically connected to the wiring in the first circuit board 20, and the first electronic heating element 40 is provided with a first heat conducting surface 41 on the side facing the first electric control module 30, and the first heat conducting surface 41 is in contact with the first electric control module 30, so that the heat generated by the first electronic heating element 40 is transferred to the first electric control module 30 through the first heat conducting surface 41, so as to achieve heat dissipation of the first electronic heating element 40.
  • a second mounting structure 102 is provided on a side of the second main body portion 112 away from the second electric control module 70.
  • the second mounting structure 102 and the first mounting structure 101 are provided on the same side of the support plate 10.
  • the second mounting structure 102 includes a plurality of screw columns provided on the second main body portion 112.
  • a heat dissipation mounting surface 1121 is provided on a side of the second main body portion 112 away from the second mounting structure 102.
  • the heat dissipation mounting surface 1121 and the bending structure 12 are located on the other side of the first main body portion 111 relative to the first mounting structure 101.
  • the second circuit board 50 is installed on the second mounting structure 102 through a connector, and the second electric control module 70 is installed on the heat dissipation mounting surface 1121.
  • the IGBT module is mounted on the second circuit board 50 and is electrically connected to the wiring on the second circuit board 50, and the IGBT module is located between the second circuit board 50 and the second electric control module 70, and the end of the IGBT module away from the second circuit board 50 forms a second heat-conducting surface (not shown in the figure), and the second heat-conducting surface is arranged toward the second electric control module 70 and abuts against the second electric control module 70, so that the IGBT module can transfer heat to the second electric control module 70 through the second heat-conducting surface to achieve heat dissipation.
  • the second heat-conducting surface is flush with the heat dissipation mounting surface 1121 to ensure that after the assembly of the electric control device is completed, the second heat-conducting surface can accurately abut against the second electric control module 70.
  • the second circuit board 50 and the first circuit board 20 are stacked, and in the overlapping area of the second circuit board 50 and the first circuit board 20, the two are electrically connected by a copper stud, and the copper stud has the function of providing support for the second circuit board 50 and the first circuit board 20 to improve the stability of the overall installation of the second circuit board 50 and the first circuit board 20, and the copper stud can also establish an electrical connection between the second circuit board 50 and the first circuit board 20 to transmit electrical signals.
  • the second circuit board 50 is arranged on the side of the first circuit board 20 away from the support plate 10, and the stacking of the first circuit board 20 and the second circuit board 50 can make the overall structure of the electric control device more compact, which is conducive to the miniaturization of the electric control device as a whole.
  • the first main body portion 111 and the second main body portion 112 are parallel and do not overlap, that is, along the direction parallel to the second circuit board 50, the first main body portion 111 and the second main body portion 112 are respectively located in different areas, so as to facilitate the first electronic heating element 40 and the first electric control module 30, the IGBT module and the second electric control module 70 to be respectively arranged in different areas, avoiding Mutual interference between components is avoided, and each component is integrated on the support plate 10, thereby improving the integration of the electronic control device.
  • first main body portion 111 and the second main body portion 112 are parallel and not coplanar, and the relative position of the second main body portion 112 to the first main body portion 111 is determined by the position of the second heat-conducting surface.
  • the thickness of the second electronic heating element 60 i.e., the dimension of the second electronic heating element 60 in a direction perpendicular to the second circuit board 50
  • the plate body of the second main body portion 112 area of the support plate 10 is bent relative to the first main body portion 111 toward the side away from the second circuit board 50, that is, the second main body portion 112 is located on the side of the first main body portion 111 away from the second circuit board 50
  • the thickness of the second electronic heating element 60 is small, so that the second heat-conducting surface is located on the side of the first main body portion 111 close to the second circuit board 50
  • the plate body of the second main body portion 112 area of the support plate 10 is bent relative to the first main body portion 111 toward the side close to the second circuit board 50, that is, the second main body portion 112 is located on the side of the first main body portion 111 close to
  • the first main body part 111 and the second main body part 112 are formed by bending the main body part 11 as a whole, so that the first main body part 111 and the second main body part 112 can be matched and adjusted according to the specific size of the first electronic heating element 40 and the second electronic heating element 60.
  • the supporting plate 10 with an integrated structure can simultaneously support the second circuit board 50, the first circuit board 20, the first electric control module 30 and the second electric control module 70 and other devices, avoiding the influence of assembly errors between different supporting structures when multiple supporting structures are used, thereby improving the assembly accuracy of the electric control component.
  • the assembly space of each device can be reasonably arranged, reducing the interference and overlap between the supporting structure and each device, thereby saving space and making the overall structure of the electric control component more compact.
  • the second heat-conducting surface is located on the side of the first main body portion 111 close to the second circuit board 50, and therefore, the second main body portion 112 of the support plate 10 is bent relative to the first main body portion 111 toward the side close to the second circuit board 50, that is, the second main body portion 112 is located on the side of the first main body portion 111 close to the second circuit board 50.
  • the second electric control module 70 can be attached to the second heat-conducting surface, and on the other hand, a larger space is provided on the side of the second main body portion 112 away from the second circuit board 50, so as to facilitate the installation of a larger volume of the heat sink, so as to meet the higher heat dissipation requirements of the second electronic heating element 60.
  • first main body part 111 is provided with a first avoidance structure 1111
  • second main body part 112 is provided with a second avoidance structure 1122.
  • the first avoidance structure 1111 is used to avoid the first electronic heating element 40, so that the first electronic heating element 40 can pass through the support plate 10 and be thermally connected to the first electric control module 30.
  • the second avoidance structure 1122 is used to avoid the IGBT module, so that the IGBT module can pass through the support plate 10 and be connected to the second electric control module 70.
  • the first electric control module 30 and the second electric control module 70 are both installed on the side of the support plate 10 away from the first circuit board 20 and the second circuit board 50.
  • the support plate 10 is prevented from overlapping with the first electronic heating element 40 and the first electric control module 30 in the thickness direction, and the support plate 10 is prevented from overlapping with the IGBT module and the second electric control module 70 in the thickness direction, thereby reducing the size of the entire electric control device in the thickness direction.
  • the first avoidance structure and the second avoidance structure can be a groove-shaped structure formed on the support plate, and the groove-shaped structure runs through the front and back sides of the support plate.
  • the first avoidance structure 1111 and the second avoidance structure 1122 may also be configured as hole-shaped structures, which is not specifically limited here.
  • the first main body portion 111 is provided with a bending structure 12, which is formed by bending a part of the plate body of the first main body portion 111 toward the side away from the second circuit board, and the end of the bending structure 12 away from the first circuit board 20 is used to install and support the first electric control module 30.
  • the distance between the first heat-conducting surface 41 and the first main body portion 111 matches the height of the bending structure 12 protruding from the first main body portion 111, so that the first electric control module 30 installed on the bending structure 12 can abut against the first heat-conducting surface 41 of the first electronic heating element 40, and the bending structure 12, the first mounting structure 101 and the first main body portion 111 are integrally processed and formed, thereby avoiding the assembly error of the bending structure 12, the first mounting structure 101 and the first main body portion, thereby improving the matching accuracy between the first electric control module 30 and the first electronic heating element 40, and reducing the stress in the first circuit board and the first electronic heating element.
  • the bending structure 12 includes a first bending edge 121 and a second bending edge 122.
  • the first bending edge 121 and the second bending edge 122 are arranged in parallel and at intervals.
  • a first opening is formed in the first main body part 111 between the first bending edge 121 and the second bending edge 122.
  • the first opening is the first avoidance structure 1111.
  • the first electronic heating element 40 can pass through the first main body part 111 through the first opening and abut against the first electric control module 30.
  • the first electronic heating element 40 can be placed in the space between the first bending edge 121 and the second bending edge 122, so that the first bending edge 121, the second bending edge 122 and at least part of the first electronic heating element 40 are in the thickness direction (i.e., perpendicular to the first circuit board 20).
  • the support plate 10 is prevented from overlapping with the first electronic heating element 40 and the first electronic control module 30 in the thickness direction, thereby reducing the overall size of the electronic control device in the thickness direction.
  • the first bending edge 121 and the second bending edge 122 both include a first bending portion 1201 connected to the first main body portion 111 and a second bending portion 1202 connected to the first bending portion 1201, the first bending portion 1201 is vertically arranged with the first main body portion 111, the second bending portion 1202 is parallelly arranged with the first main body portion, and the second bending portion 1202 is used to fix the first electric control module 30.
  • the second bending portion 1202 is provided with a connecting hole, and the first electric control module 30 is fixed to the second bending portion 1202 by passing a connecting member such as a bolt through the connecting hole.
  • the second main body portion 112 is provided with a second opening, and the second opening is the second avoidance structure 1122.
  • the heat dissipation mounting surface 1121 is arranged around the second opening, and the edge area of the second electric control module 70 facing the IGBT module is connected to the heat dissipation mounting surface 1121, and the IGBT module passes through the second opening and abuts against the middle area of the second electric control module 70 facing the IGBT module.
  • the first heating module also includes a third electronic heating element 90, which is installed on the first circuit board 20, and a third avoidance structure 1112 is provided in the area of the first main body part 111 corresponding to the third electronic heating element 90.
  • the third avoidance structure 1112 is a third opening provided in the first main body part, so that the third electronic heating element 90 can pass through the third avoidance structure 1112 and extend into the side of the support plate 10 away from the first circuit board 20.
  • the electric control device further includes a support connector 80, which is detachably connected to the first mounting structure 101.
  • the first mounting structure 101 is a screw column, which is tubular as a whole and has a threaded hole with an internal thread.
  • the support connector 80 includes a tubular main body (not shown in the figure) and a columnar connecting part (not shown in the figure), which is provided with an external thread, and the columnar connecting part can be inserted into the threaded hole of the first mounting structure 101, so that the support connector 80 is detachably connected to the first mounting structure 101.
  • One end of the support connector 80 that is away from the first main body part 111 is flush with one end of the second mounting structure 102 that is away from the second main body part 112, so as to facilitate the installation of the second circuit board 50 on the first support column and the support connector 80.
  • the supporting connector 80 in this embodiment is used to support the second circuit board 50 and to fix the first circuit board 20 to the first mounting structure 101.
  • the columnar connecting portion passes through the first circuit board 20 and is connected to the first mounting structure 101, and the tubular main body is pressed against the first circuit board 20, thereby fixing the first circuit board 20.
  • a third bent edge 13 is provided on the circumferential edge of the support plate 10, and the third bent edge 13 is provided with a plurality of mounting holes 131.
  • the entire electric control device is connected to an external carrier through the mounting holes 131 on the third bent edge 13, so as to facilitate the overall disassembly and assembly of the electric control device, which is beneficial to subsequent inspection and maintenance.
  • the external carrier may be a cabinet of an electric control cabinet.
  • the electric control component in the present disclosure is specifically an electric control component, wherein the first circuit board is a capacitor board, the second circuit board is a drive board, the first electronic heating element is a rectifier bridge module, and the third electronic heating element 90 is an electrolytic capacitor.
  • IGBT Insulated Gate Bipolar Transistor
  • BJT bipolar junction transistor
  • MOS metal oxide semiconductor
  • the IGBT module is a modular semiconductor product formed by packaging an IGBT (insulated gate bipolar transistor chip) and a FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in inverters and other equipment.
  • the IGBT module integrates multiple IGBT single tubes into the second circuit board 50 to replace the packaged IGBT module to reduce costs.
  • the second circuit board 50 is used as a circuit board carrier of the IGBT module and the first circuit board 20.
  • the electronic control device has various functions such as rectification, inversion and drive control, which improves the integration of the electronic control device, makes the wiring between the components of the electronic control device more concise, prevents the cables from being entangled with each other, and reduces the volume occupied by the electronic control device.
  • the second circuit board 50 is spaced apart from the first circuit board 20 to prevent breakdown, or an insulating member (such as insulating paper) is set between the second circuit board 50 and the first circuit board 20 to separate the second circuit board 50 from the first circuit board 20, thereby preventing breakdown.
  • an electric control cabinet is also proposed, the electric control cabinet includes a cabinet body and an electric control device, the third bent edge abuts against the cabinet body and is fixedly connected to the cabinet body through a mounting hole by a connecting piece.
  • the electric control cabinet proposed in the present disclosure has the same technical effect as the electric control device, which will not be repeated here.
  • the present disclosure also proposes an elevator device, which includes the electric control cabinet in any of the above technical solutions.
  • the elevator device proposed in the present disclosure has the same technical effect as the electric control cabinet, which will not be described in detail here.

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Abstract

一种电控组件、电控装置、电控柜和电梯设备，其中，电控组件包括：支撑板，支撑板包括本体部以及设于本体部的折弯结构；第一电路板，安装于本体部；第一电控模块，安装于折弯结构；第一电子发热元件，安装于第一电路板，第一电子发热元件背离第一电路板的一端与第一电控模块导热连接。电控组件，提高第一电控模块与第一电子发热元件之间的配合精度，减小第一电路板以及第一电子发热元件中的应力。

Description

电控组件、电控装置、电控柜及电梯设备
相关申请的交叉引用
本申请要求于以下专利申请的优先权和权益，其全部内容通过引用结合在本申请中：
2022年12月05日提交至中国国家知识产权局的、申请号为202223281230.9、名称为“驱动器以及电控柜”和申请号为202223281142.9、名称为“电控组件以及电控柜”的中国专利申请。
技术领域
本公开属于电梯设备技术领域，具体涉及一种电控组件、电控装置、电控柜及电梯设备。
背景技术
本部分提供的仅仅是与本公开相关的背景信息，其并不必然是现有技术。
驱动器一般包括板卡、电子发热元件和散热器等部分，电子发热元件运行时产生较高的热量，需要使电子发热元件与散热器贴合，利用散热器导热并对电子发热元件散热。由于散热器的体积和重量较大，需分别对散热器和板卡设置支撑件，以避免运输或使用过程中散热器的重力直接作用于电子发热元件，使电子发热元件或板卡产生应力，导致弯折变形甚至损坏。
但是，由于不同支撑件在装配中存在装配误差，使散热器和电子发热元件在完成组装后的相对位置存在偏差，从而导致电子发热元件或板卡中存在应力，若装配误差较大可能导致电子发热元件或板卡损坏。
申请内容
本公开的目的是至少解决不同支撑件的装配误差导致电路板与电子发热元件存在应力的问题。该目的是通过以下技术方案实现的：
根据本公开的第一方面技术方案，提出了一种电控组件，所述电控组件包括：支撑板，所述支撑板包括本体部以及设于所述本体部的折弯结构；第一电路板，安装于所述本体部；第一电控模块，安装于所述折弯结构；第一电子发热元件，安装于所述第一电路板，所述第一电子发热元件背离所述电容板的一端与所述第一电控模块导热连接。
根据本公开提出的电控组件，通过在一体结构的支撑板形成第一安装结构和弯折结构分别支撑第一电路板和第一电控模块，避免了采用不同支撑件分别支撑第一电控模块和第一电路板时不同支撑件的装配误差，并通过设置弯折结构使第一电子发热元件与第一电控模块相适配，使安装于折弯结构上的第一电控模块能够与第一电子发热元件导热连接，提高第一电控模块与第一电子发热元件之间的配合精度，以减小第一电路板以及第一电子发热元件中的应力。
另外，根据本公开的电控组件，还可具有如下附加的技术特征：
在本公开的一些实施方式中，所述折弯结构包括至少两个相对设置的折弯边，至少两个相对设置的所述折弯边之间形成第一避让结构；其中，至少部分所述第一电控模块设于所述第一避让结构内，或至少部分所述第一电子发热元件设于所述第一避让结构内。
在本公开的一些实施方式中，所述折弯边包括与所述本体部相连的第一折弯部和与所述第一折弯部背离所述本体部的一侧相连的第二折弯部，所述第一电控模块安装于所述第二折弯部，沿垂直于所述支撑板的方向，所述第一电路板和所述第一电控模块分别位于所第二折弯部的两侧。
在本公开的一些实施方式中，所述本体部还设有第一安装结构，所述第一电路板通过所述第一安装结构安装于所述本体部。
在本公开的一些实施方式中，所述第一电子发热元件背离所述第一电路板的一端具有第一导热面，所述第一导热面与所述第一电控模块抵接；沿垂直于所述第一电路板的方向，所述第一安装结构的尺寸、所述本体部的尺寸以及所述折弯结构的尺寸之和等于所述第一导热面与所述第一电路板之间的距离。
根据本公开的第二方面技术方案，提出了一种电控装置，所述电控装置包括：支撑板包括相连的第一主体部分和第二主体部分，且所述第一主体部分和所述第二主体部分不在同一平面内；第一电控模块，安装于所述第一主体部分；第二电控模块，安装于所述第二主体部分；其中，所述第一电控模块和所述第二电控柜模块均设于所述支撑板的同一侧，沿垂直于所述支撑板的方向，所述第一电控模块背离所述支撑板的一端与所述第二电控模块背离所述支撑板的一端的高度之差的绝对值为H，所述第一电控模块的尺寸与所述第二电控模块的尺寸之差的绝对值为L，则H小于L；或所述第一电控模块和所述第二电控模块分别位于所述支撑板的两侧，沿平行于所述支撑板的方向，所述第一电控模块和所述第二电控模块至少部分重叠设置。
根据本公开提出的电控装置，第一电控模块背离支撑板的一端与第二电控模块背离支撑板的一端的高度之差的绝对值为H，第一电控模块的尺寸与第二电控模块的尺寸之差的绝对值为L，通过将支撑板整体形成第一主体部分和第二主体部分，沿垂直于支撑板的方向分别形成高度不同的安装空间，并用于匹配高度尺寸不同的散热器，使得H小于L，以减小尺寸较小的电子元器件的一侧产生无用的空余空间的体积，使电控装置的整体结构更加紧凑，提高空间利用率。
在本公开的一些实施方式中，所述第一主体部分和所述第二主体部分平行设置，且沿垂直于所述支撑板的方向，所述第二电控模块的尺寸大于所述第一电控模块的尺寸。
在本公开的一些实施方式中，沿垂直于所述支撑板的方向，所述第一主体部分和所述第二主体部分不重合。
在本公开的一些实施方式中，所述电控装置还包括：第一发热模块，安装于所述第一主体部分并与所述第一电控模块导热连接；第二电子发热元件，安装于所述第二主体部分并与所述第二电控模块导热连接。
在本公开的一些实施方式中，所述第一发热模块包括：第一电路板，安装于所述第一主体部分背离所述第一电控模块的一侧；第一电子发热元件，安装于所述第一电路板，所述第一电子发热元件与所述第一电控模块导热连接；并且/或者所述第二电子发热元件包括：第二电路板，安装于所述第二主体部分背离所述第二电控模块的一侧；IGBT模块，安装于所述第二电路板，所述IGBT模块与所述第二电控模块导热连接；其中，沿垂直于所述第二主体部分的方向，所述第二电路板位于所述第一电路板背离所述第二主体部分的一侧并与所述第一电路板层叠设置。
在本公开的一些实施方式中，所述第一主体部分设有第一避让结构，所述第一发热模块的第一电子发热元件穿过所述第一避让结构与所述第一电控模块导热连接；所述第二主体部分设有第二避让结构，所述第二电子发热元件的IGBT模块穿过所述第二避让结构与所述第二电控模块导热连接。
在本公开的一些实施方式中，所述第一主体部分设有折弯边，所述第一电控模块安装于所述折弯边背离所述第一电路板的一侧；其中，所述第一主体部分的部分板体板体朝向背离所述第一电路板一侧弯折形成所述折弯边和位于所述折弯边一侧的所述第一避让结构。
在本公开的一些实施方式中，所述第二主体部分的部分区域设置贯穿所述支撑板的板体的开口以形成所述第二避让结构。
在本公开的一些实施方式中，所述第一发热模块还包括：第三电子发热元件，安装于所述第一电路板；所述第一主体部分还设有用于避让所述第三电子发热元件的第三避让结构。
在本公开的一些实施方，沿垂直于所述支撑板的方向，所述第二电路板设于所述第一电路板背离所述支撑板的一侧并与所述第一电路板层叠设置，所述第一主体部分和所述第二主体部分平行且不重合，所述第一电控模块背离所述第一电路板的一端与所述第二电控模块背离所述第二电路板的一端平齐。
根据本公开的第三方面技术方案，还提出一种电控柜，所述电控柜包括第一方面技术方案中所述的 电控装置。
根据本公开的第四方面技术方案，还提出一种电梯设备，电梯设备包括第三方面技术方案中所述的电控柜
附图说明
通过阅读下文优选实施方式的详细描述，各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的，而并不认为是对本公开的限制。而且在整个附图中，用相同的附图标记表示相同的部件。在附图中：
图1示意性地示出了根据本公开实施方式的第一视角的电控组件的部分零件爆炸示意图；
图2示意性地示出了根据本公开实施方式的第二视角的电控组件的部分零件爆炸示意图；
图3示意性地示出了根据本公开实施方式的正视视角的电控装置的结构示意图；
图4示意性地示出了根据本公开实施方式的第一视角的支撑板的结构示意图；
图5示意性地示出了根据本公开实施方式的第二视角的支撑板的结构示意图；
图6示意性地示出了根据本公开实施方式的左下视角的电控装置的结构示意图；
图7示意性地示出了根据本公开的一个示例性的实施方式的正视视角的电控装置的结构示意图；
图8示意性地示出了根据本公开的一个示例性的实施方式的正视视角的电控装置的结构示意图；
图9示意性地示出了根据本公开实施方式的正视视角的电控组件的部分结构示意图。
附图标记如下：
10、支撑板；11、本体部；111、第一主体部分；1111、第一避让结构；112、第二主体部分；1121、散热安装面；1122、第二避让结构；113、过渡连接部分；12、折弯结构；121、第一折弯边；122、第二折弯边；1201、第一折弯部；1202、第二折弯部；101、第一安装结构；102、第二安装结构；13、第三折弯边；131、安装孔；1112、避让结构；
20、第一电路板；
30、第一电控模块；
40、第一电子发热元件；41、第一导热面；
50、第二电路板；
60、第二电子发热元件；
70、第二电控模块；
80、支撑连接件；
90、第三电子发热元件。
具体实施方式
下面将参照附图更详细地描述本公开的示例性实施方式。虽然附图中显示了本公开的示例性实施方式，然而应当理解，可以以各种形式实现本公开而不应被这里阐述的实施方式所限制。相反，提供这些实施方式是为了能够更透彻地理解本公开，并且能够将本公开的范围完整的传达给本领域的技术人员。
应理解的是，文中使用的术语仅出于描述特定示例实施方式的目的，而无意于进行限制。除非上下文另外明确地指出，否则如文中使用的单数形式“一”、“一个”以及“所述”也可以表示包括复数形式。术语“包括”、“包含”、“含有”以及“具有”是包含性的，并且因此指明所陈述的特征、步骤、操作、元件和/或部件的存在，但并不排除存在或者添加一个或多个其它特征、步骤、操作、元件、部件、和/或它们的组合。文中描述的方法步骤、过程、以及操作不解释为必须要求它们以所描述或说明的特定顺序执行，除非明确指出执行顺序。还应当理解，可以使用另外或者替代的步骤。
尽管可以在文中使用术语第一、第二、第三等来描述多个元件、部件、区域、层和/或部段，但是，这些元件、部件、区域、层和/或部段不应被这些术语所限制。这些术语可以仅用来将一个元件、部件、区域、层或部段与另一区域、层或部段区分开。除非上下文明确地指出，否则诸如“第一”、“第二”之 类的术语以及其它数字术语在文中使用时并不暗示顺序或者次序。因此，以下讨论的第一元件、部件、区域、层或部段在不脱离示例实施方式的教导的情况下可以被称作第二元件、部件、区域、层或部段。
为了便于描述，可以在文中使用空间相对关系术语来描述如图中示出的一个元件或者特征相对于另一元件或者特征的关系，这些相对关系术语例如为“内部”、“外部”、“内侧”、“外侧”、“下面”、“下方”、“上面”、“上方”等。这种空间相对关系术语意于包括除图中描绘的方位之外的在使用或者操作中装置的不同方位。例如，如果在图中的装置翻转，那么描述为“在其它元件或者特征下面”或者“在其它元件或者特征下方”的元件将随后定向为“在其它元件或者特征上面”或者“在其它元件或者特征上方”。因此，示例术语“在……下方”可以包括在上和在下的方位。装置可以另外定向(旋转90度或者在其它方向)并且文中使用的空间相对关系描述符相应地进行解释。
如图1和图2所示，根据本公开的实施方式，提出了一种电控组件。
电控组件包括支撑板10、第一电路板20、第一电子发热元件40和第一电控模块30，支撑板10为板状件，支撑板10包括本体部11、第一安装结构101和折弯结构12，第一安装结构101设于本体部11的一侧板面上，折弯结构12与本体部11相连，折弯结构12可以是支撑板10的部分区域通过弯折形成，或者折弯结构12还可以是通过注塑工艺与本体部11一体浇筑成型。第一安装结构101用于安装并支撑第一电路板20，折弯结构12用于安装并支撑第一电控模块30。本实施方式中，第一安装结构101包括多个设于本体部11上的螺丝柱，螺丝柱外形呈空心的柱状结构，螺丝柱的内径设有内螺纹，第一安装结构101与本体部11为一体成型结构，第一电路板20与支撑板10平行，第一电路板20通过连接件安装于螺丝柱上。第一电控模块30安装于折弯结构12背离本体部11的一端。第一电子发热元件40位于第一电路板20和第一电控模块30之间，且第一电子发热元件40安装于第一电路板20并与第一电路板20中的走线电连接，第一电子发热元件40背离第一电路板20的一端与第一电控模块30导热连接，具体地，从而利用第一电控模块30对第一电子发热元件40进行散热。在一些实施方式中，第一电子发热元件40与第一电控模块30直接抵接，以实现第一电子发热元件40和第一电控模块30的导热连接。或者在其他实施方式中，第一电子发热元件40和第一电控模块30之间设有间隙，在间隙内部填充导热材料如硅脂等实现第一电子发热元件40和第一电控模块30的导热连接。
其中，第一电路板20为电容板，第一电子发热元件40为整流桥模块，第一电控模块30具体为散热器，散热器可以是以铜、铝合金等材料制成的翅片式散热器。
本实施方式中，折弯结构12、第一安装结构101和本体部11一体加工成型的方式，避免了折弯结构12和第一安装结构101与本体部11的装配误差，从而提高第一电控模块30与第一电子发热元件40之间的配合精度，进而减小第一电路板以及第一电子发热元件中的应力。
在本公开的一些实施方式中，如3和图4所示，折弯结构12包括两个相对设置的折弯边。折弯边包括与本体部11相连的第一折弯部1201以及与第一折弯部1201相连的第二折弯部1202，第一折弯部1201与本体部11垂直设置，第二折弯部1202与本体部11平行设置，第二折弯部1202用于固定第一电控模块30。具体地，第二折弯部1202设有连接孔，利用螺栓等连接件穿过连接孔将第一电控模块30固定于第二折弯部1202上。其中，两个折弯边平行且间隔地设置，在两个折弯边之间形成第一避让结构，第一电路板20和第一电控模块30分别位于第二折弯部1202的两侧，并且第一电子发热元件40通过第一避让结构与第一电控模块30导热连接，使得第一电子发热元件40或第一电控模块30两者中的至少一者穿过支撑板10与另一者导热连接，从而避免支撑板10在厚度方向(即垂直于第一电路板20的方向)与第一电子发热元件40和第一电控模块30重叠，从而减小电控组件整体在厚度方向上的尺寸。
在一个示例性的实施方式中，如图9所示，折弯结构12与第一安装结构101均位于本体部11的同一侧，即第一折弯部1201自本体部11向靠近第一电路板20的一侧翻折。第一电控模块30的至少部分区域或者全部区域设于第一避让结构(图中未示出)内，使第一电控模块30相对于支撑板10以整体下沉的形式安装于支撑板10上。本实施方式中，将至少部分第一电控模块30设于第一避让结构内一方面便于第一电控模块30与第一电子发热元件40匹配用于第一电子发热元件40的散热，另一方面，两个 折弯边之间限定的第一避让结构可以形成一个独立的散热风道，对第一电控模块30独立地散热，减小第一电控模块30散发的热量影响电控组件中其他器件的运行。
在本公开的一些实施方式中，请结合图2和图3所示，折弯结构12与第一安装结构101分别位于本体部11的两侧，即第一折弯部1201自本体部11向背离第一电路板20的一侧翻折。第一电子发热元件40的至少部分区域或者全部区域设于第一避让结构1111内。本实施方式中，将至少部分第一电子发热元件40设于第一避让结构1111内一方面便于第一电控模块30与第一电子发热元件40匹配用于第一电子发热元件40的散热，另一方面，可以避免支撑板10在厚度方向(即垂直于第一电路板20的方向)与第一电子发热元件40和第一电控模块30重叠，从而减小电控组件整体在厚度方向上的尺寸。
朝向第一电控模块30的一侧设有第一导热面41，第一导热面41与第一电控模块30抵接，以使第一电子发热元件40产生的热量经第一导热面41传递至第一电控模块30，实现第一电子发热元件40的散热。
其中，第一导热面41与本体部11之间的距离和折弯结构12凸出本体部11的高度相匹配，使安装于折弯结构12上的第一电控模块30能够与第一电子发热元件40的第一导热面41抵接。
需要说明的是，如图3所示，利用尺寸链计算的方法能够确定折弯结构12凸出本体部11的高度，进而确定折弯结构12的尺寸。可理解地，以第一电路板20朝向支撑板10一侧的板面作为基准，沿垂直于第一电路板20的方向，设定第一导热面41到基准的距离为L，折弯结构12凸出本体部11的高度尺寸为A(即折弯结构12的尺寸)，支撑板10的厚度为B，第一安装结构101的长度尺寸为C。基于尺寸链计算出折弯结构12的具体尺寸A。例如，在本实施方式中，第一安装结构101和折弯结构12分别设于本体部11的两侧，折弯结构12由本体部11朝向背离第一安装结构101的一侧弯折，则L＝A+B+C，因此通过测得L、B和C的尺寸即可推导出折弯结构12凸出本体部11的高度尺寸A(即折弯结构12的尺寸)。
可理解地，可以基于上述尺寸链计算得到与不同尺寸的模块相对应的折弯结构12的尺寸A，使本公开提出的支撑板10适用于不同种类的模块。
如图1和图3所示，根据本公开的实施方式，提出了一种电控装置。
电控装置包括支撑板10、第一电控模块30和第二电控模块70，具体地，支撑板10整体呈长方形的板状形状，并沿两个相互平行的折线(折线方向与支撑板的长度方向垂直)弯折，使支撑板10呈折弯结构，并包括第一主体部分111、第二主体部分112和过渡连接部分113，第一主体部分111和第二主体部分112通过过渡连接部分113相连，过渡连接部分113的板体与第一主体部分111和第二主体部分112均垂直，第一主体部分111和第二主体部分112相互平行，且沿垂直于支撑板10的方向，第一主体部分111和第二主体部分112间隔并不重合，使得在第一主体部分111和第二主体部分112分别形成具有不同高度的安装空间，以用于匹配高度尺寸不同的散热器。详细地，如图7所示，第一电控模块30背离支撑板10的一端与第二电控模块70背离支撑板10的一端的高度之差的绝对值为H，第一电控模块30的尺寸A与第二电控模块70的尺寸B之差的绝对值为l，通过使支撑板10整体形成第一主体部分111和第二主体部分112，沿垂直于支撑板10的方向分别形成高度不同的安装空间，并用于匹配尺寸不同的第一电控模块30和第二电控模块70，使得H小于l，以减小在尺寸较小的电子元器件一侧产生无用的空余空间的体积，使电控装置的整体结构更加紧凑，提高空间利用率。
在本公开的一些实施方式中，如图8所示，第一电控模块30和第二电控模块70分别位于支撑板10(请参照图5)的两侧，沿平行于支撑板10的方向，第一电控模块30和第二电控模块70至少部分重叠设置，利用第一电控模块30和第二电控模块70的重叠，减小电控装置的整体厚度尺寸(即垂直于支撑板方向的尺寸)。
在一些示例性的实施方式中，如图3所示，第一主体部分111用于安装第一电控模块30，第二主体部分112用于安装第二电控模块70，并使第一电控模块30和第二电控模块70背离支撑板的一端平齐，避免尺寸较小的第一电控模块30的一侧产生无用的空余空间，使电控装置的整体结构更加紧凑，提高空间利用率。
在本公开的一些实施方式中，第一电控模块30和第二电控模块70均为散热器，进一步地，电控装置还包括第一发热模块和第二电子发热元件60，第一发热模块和第二电子发热元件60具体为电控装置中的一个电子发热元件或多个电子发热元件的组合。本实施方式中，第一发热模块安装于第一主体部分111，第二电子发热元件60安装于第二主体部分112，第一发热模块与第一电控模块30导热连接，从而利用第一电控模块30对第一发热模块进行散热，第二电子发热元件60与第二电控模块70导热连接，从而利用第二电控模块70对第二电子发热元件60进行散热。利用第一主体部分111和第二主体部分112形成的案子空间分别用于布置第一发热模块和第二电子发热元件60，将第一发热模块和第二电子发热元件60分别设于不同的空间区块中有利于提高散热效率。需要说明的是，本实施方式中，第一发热模块和第二电子发热元件60可以与第一电控模块30和第二电控模块70设于支撑板10的同一侧，或者第一发热模块和第二电子发热元件60设于支撑板10背离第一电控模块30和第二电控模块70的一侧。
其中，第一发热模块与第一电控模块30直接抵接，以实现第一发热模块和第一电控模块30的导热连接，或者在其他实施方式中，第一发热模块和第一电控模块30之间设有间隙，在间隙内部填充导热材料如硅脂等实现第一发热模块和第一电控模块30的导热连接。可理解地，第二电子发热元件60与第二电控模块70的导热连接方式与第一发热模块与第一电控模块30的导热连接方式相同或不同。
在本公开的一些实施例方式中，第一发热模块包括第一电路板20和第一电子发热元件40，第二电子发热元件60包括第二电路板50和IGBT模块。其中，第二电路板50为驱动板，第二电控模块70具体为散热器，散热器可以是以铜、铝合金等材料制成的翅片式散热器。
详细地，第一主体部分111背离第一电控模块30的一侧设有第一安装结构101，第一安装结构101用于安装并支撑第一电路板20。本实施方式中，第一安装结构101包括多个设于第一主体部分111上的螺丝柱，螺丝柱外形呈空心的柱状结构，螺丝柱的内径设有内螺纹，第一安装结构101与第一主体部分111为一体成型结构，第一电路板20与第一主体部分111平行，第一电路板20通过连接件安装于螺丝柱上。第一电子发热元件40位于第一电路板20和第一电控模块30之间，且第一电子发热元件40安装于第一电路板20并与第一电路板20中的走线电连接，第一电子发热元件40朝向第一电控模块30的一侧设有第一导热面41，第一导热面41与第一电控模块30抵接，以使第一电子发热元件40产生的热量经第一导热面41传递至第一电控模块30，实现第一电子发热元件40的散热。
第二主体部分112背离第二电控模块70的一侧设有第二安装结构102，第二安装结构102与第一安装结构101设于支撑板10的同一侧，第二安装结构102包括多个设于第二主体部分112上的螺丝柱，第二主体部分112背离第二安装结构102的一侧面设有散热安装面1121，散热安装面1121与折弯结构12相对于第一安装结构101位于第一主体部分111的另一侧。第二电路板50通过连接件安装于第二安装结构102上，第二电控模块70安装于散热安装面1121上。IGBT模块安装于第二电路板50并与第二电路板50上的走线电连接，并且IGBT模块位于第二电路板50和第二电控模块70之间，IGBT模块背离第二电路板50的一端形成第二导热面(图中未示出)，第二导热面朝向第二电控模块70设置并与第二电控模块70相抵，使得IGBT模块能够通过第二导热面将热量传递至第二电控模块70以实现散热。本实施方式中，第二导热面与散热安装面1121平齐，以确保完成电控装置的装配后，第二导热面能够精准地与第二电控模块70相抵。
在本施方式中，请结合图3和图6所示，沿垂直于第二电路板50的方向，第二电路板50与第一电路板20层叠设置，在第二电路板50与第一电路板20重叠的区域，两者之间通过铜螺柱电连接，铜螺柱具有为第二电路板50和第一电路板20提供支撑的作用，以提高第二电路板50和第一电路板20整体安装的稳定性，并且铜螺柱还能使第二电路板50和第一电路板20建立电连接，以传递电信号。其中，第二电路板50设于第一电路板20背离支撑板10的一侧，第一电路板20与第二电路板50层叠设置能够使电控装置整体结构更加紧凑，有利于电控装置整体的小型化。
本实施方式中，请结合图3和图4所示，第一主体部分111和第二主体部分112平行且不重合，即沿平行于第二电路板50的方向，第一主体部分111和第二主体部分112分别位于不同的区域，以便于将第一电子发热元件40和第一电控模块30、IGBT模块和第二电控模块70分别设于不同的区域内，避 免各器件之间的相互干涉，并将各器件均集成于支撑板10上，提高电控装置的集成度。
还需说明的是，本实施方式中，第一主体部分111和第二主体部分112平行且不共面，第二主体部分112的与第一主体部分111的相对位置由第二导热面所在位置决定。若第二电子发热元件60的厚度(即第二电子发热元件60沿垂直于第二电路板50方向的尺寸)较大，使得第二导热面位于第一主体部分111背离第二电路板50的一侧，则支撑板10的第二主体部分112区域的板体相对于第一主体部分111朝向背离第二电路板50的一侧弯折，即第二主体部分112位于第一主体部分111远离第二电路板50的一侧；若第二电子发热元件60的厚度较小，使得第二导热面位于第一主体部分111靠近第二电路板50的一侧，则支撑板10的第二主体部分112区域的板体相对于第一主体部分111朝向靠近第二电路板50的一侧弯折，即第二主体部分112位于第一主体部分111靠近第二电路板50的一侧。
需要强调的是，本实施方式中，通过本体部11整体弯折的方式形成第一主体部分111和第二主体部分112，使得第一主体部分111和第二主体部分112能够根据第一电子发热元件40和第二电子发热元件60的具体尺寸进行匹配调整，一方面，通过一体结构的支撑板10能够同时支撑第二电路板50、第一电路板20、第一电控模块30和第二电控模块70等器件，避免采用多个支撑结构时不同支撑结构之间装配误差的影响，提高了电控组件的装配精度。另一方面，能够合理布局各器件的装配空间，减少支撑结构与各器件之间的干涉与重叠从而节省空间，使电控组件整体结构更加紧凑。
在本实施方式中，如图3所示，由于第二电子发热元件60的厚度较小，第二导热面位于第一主体部分111靠近第二电路板50的一侧，因此，使支撑板10的第二主体部分112板体相对于第一主体部分111朝向靠近第二电路板50的一侧弯折，即第二主体部分112位于第一主体部分111靠近第二电路板50的一侧。一方面，确保第二电控模块70能够与第二导热面贴合，另一方面，使第二主体部分112背离第二电路板50的一侧具有较大的空间，以便于安装较大体积的散热器，以满足于第二电子发热元件60较高的散热需求。
进一步地，第一主体部分111设有第一避让结构1111，第二主体部分112设有第二避让结构1122。第一避让结构1111用于避让第一电子发热元件40，使第一电子发热元件40能够穿过支撑板10并与第一电控模块30导热连接。第二避让结构1122用于避让IGBT模块，使IGBT模块能够穿过支撑板10并与第二电控模块70连接。本实施方式中，第一电控模块30和第二电控模块70均安装于支撑板10背离第一电路板20和第二电路板50的一侧，因此，通过设置避让结构的方式，避免支撑板10在厚度方向与第一电子发热元件40和第一电控模块30重叠，以及避免支撑板10在厚度方向与IGBT模块和第二电控模块70重叠，从而减小电控装置整体在厚度方向上的尺寸。可理解地，第一避让结构和第二避让结构可以是在支撑板上形成的槽状结构，该槽状结构贯穿支撑板的正反两面。或者，第一避让结构1111和第二避让结构1122也可以设置为孔状结构，再此不做具体限定。
在一个示例性的实施方式中，第一主体部分111设有折弯结构12，折弯结构12为第一主体部分111的部分板体朝向背离第二电路板的一侧弯折形成，折弯结构12背离第一电路板20的一端用于安装并支撑第一电控模块30。其中，第一导热面41与第一主体部分111之间的距离和折弯结构12凸出第一主体部分111的高度相匹配，使安装于折弯结构12上的第一电控模块30能够与第一电子发热元件40的第一导热面41抵接，折弯结构12、第一安装结构101和第一主体部分111一体加工成型，避免了折弯结构12和第一安装结构101与第一主体部分的装配误差，从而提高第一电控模块30与第一电子发热元件40之间的配合精度，减小第一电路板以及第一电子发热元件中的应力。
还需说明的是，在第一主体部分111的部分板体朝向背离第一电路板20的一侧弯折以形成折弯结构12并在第一主体部分111形成第一避让结构1111，详细地，如3和图4所示，折弯结构12包括第一折弯边121和第二折弯边122，第一折弯边121和第二折弯边122平行且间隔地设置，在第一折弯边121和第二折弯边122之间的第一主体部分111形成第一开口，第一开口即为第一避让结构1111，第一电子发热元件40能够通过第一开口穿过第一主体部分111与第一电控模块30相抵。需要说明的是，通过形成第一开口，使第一电子发热元件40能够置于第一折弯边121和第二折弯边122之间的空间内部，使第一折弯边121、第二折弯边122与至少部分第一电子发热元件40在厚度方向(即垂直于第一电路 板20的方向)重合，并避免支撑板10在厚度方向与第一电子发热元件40和第一电控模块30重叠，从而减小电控装置整体在厚度方向上的尺寸。
本实施方式中，请结合图3和图5所示，第一折弯边121和第二折弯边122均包括与第一主体部分111相连的第一折弯部1201以及与第一折弯部1201相连的第二折弯部1202，第一折弯部1201与第一主体部分111垂直设置，第二折弯部1202与第一主体部分平行设置，第二折弯部1202用于固定第一电控模块30。具体地，第二折弯部1202设有连接孔，利用螺栓等连接件穿过连接孔将第一电控模块30固定于第二折弯部1202上。
在本公开的一些实施方式中，请结合图3和图4所示，第二主体部分112设有第二开口，第二开口即为第二避让结构1122。具体地，散热安装面1121围绕第二开口设置，第二电控模块70朝向IGBT模块的一侧面的边缘区域与散热安装面1121相连，IGBT模块穿过第二开口并与第二电控模块70朝向IGBT模块的一侧面的中间区域相抵。本实施方式通过设置第二开口，避免了支撑板10在厚度方向上与IGBT模块和第二电控模块70重叠，有利于减小电控装置在厚度方向上的尺寸。
在本公开的一些实施方式中，第一发热模块还包括第三电子发热元件90，第三电子发热元件90安装于第一电路板20上，第一主体部分111对应于第三电子发热元件90的区域设有第三避让结构1112，具体地，第三避让结构1112为设于第一主体部分的第三开口，使第三电子发热元件90能够穿过第三避让结构1112伸入至支撑板10背离第一电路板20的一侧。
在本公开的一些实施方式中，如图5和图6所示，电控装置还包括支撑连接件80，支撑连接件80与第一安装结构101可拆卸地相连。具体地，第一安装结构101为螺丝柱，第一安装结构101整体呈管状并具有内螺纹的螺纹孔，支撑连接件80包括管状主体部(图中未示出)和柱状连接部(图中未示出)，柱状连接部设有外螺纹，柱状连接部能够插入第一安装结构101的螺纹孔内，从而使支撑连接件80与第一安装结构101可拆卸的相连。支撑连接件80背离所述第一主体部分111的一端与第二安装结构102背离第二主体部分112的一端平齐，以便于将第二电路板50安装到第一支撑柱和支撑连接件80上。
其中，本实施例中的支撑连接件80既用于支撑第二电路板50，也用于将第一电路板20固定安装于第一安装结构101。详细地，支撑连接件80安装于第一安装结构101时，柱状连接部穿过第一电路板20与第一安装结构101相连，管状主体部抵压在第一电路板20上，从而将第一电路板20固定。
在本公开的一些实施方式中，如图4所示，支撑板10的周向边缘设有第三折弯边13，第三折弯边13设有多个安装孔131，电控装置整体通过第三折弯边13上的安装孔131与外部载体相连，以便于电控装置的整体拆装，有利于后续检修和维护。其中，外部载体可以是电控柜的柜体。
本公开中的电控组件具体为电控组件，其中，第一电路板为电容板，第二电路板为驱动板，第一电子发热元件为整流桥模块，第三电子发热元件90为电解电容。
需要说明的是，IGBT(Insulated Gate Bipolar Transistor)，为绝缘栅双极型晶体管，是由(Bipolar Junction Transistor，BJT)双极型三极管和绝缘栅型场效应管(Metal Oxide Semiconductor，MOS)组成的复合全控型电压驱动式功率半导体器件。IGBT模块是由IGBT(绝缘栅双极型晶体管芯片)与FWD(续流二极管芯片)通过特定的电路桥接封装而成的模块化半导体产品；封装后的IGBT模块直接应用于变频器等设备上。本公开中，IGBT模块采用将多个IGBT单管集成到第二电路板50上，替代封装好的IGBT模块，降低成本。
需要指出的是，第二电路板50作为IGBT模块、第一电路板20的电路板载体，通过将IGBT模块、第一电路板20集成于第二电路板50上，使电控装置具备整流、逆变以及驱动控制等各项功能，提高了电控装置的集成度，使得电控装置各部件之间接线更加简洁，防止电缆相互缠绕，并减小电控装置占用体积。具体地，第二电路板50与第一电路板20间隔设置，以防止击穿，或者在第二电路板50与第一电路板20之间设置绝缘件(如绝缘纸)以将第二电路板50与第一电路板20间隔开，从而防止击穿。
根据本公开的实施方式，还提出一种电控柜，电控柜包括柜体和电控装置，第三折弯边与柜体相抵并利用连接件通过安装孔与柜体固定连接。本公开提出的电控柜具有与电控装置相同的技术效果，在此不再赘述。
本公开还提出一种电梯设备，电梯设备包括上述任一技术方案中的电控柜。本公开提出的电梯设备具有与电控柜相同的技术效果，在此不再赘述。
以上所述，仅为本公开的一些具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种电控组件，其中，所述电控组件包括：
    支撑板，所述支撑板包括本体部以及设于所述本体部的折弯结构；
    第一电路板，安装于所述本体部；
    第一电控模块，安装于所述折弯结构；
    第一电子发热元件，安装于所述第一电路板，所述第一电子发热元件背离所述第一电路板的一端与所述第一电控模块导热连接。
  2. 根据权利要求1所述的电控组件，其中，
    所述折弯结构包括至少两个相对设置的折弯边，至少两个相对设置的所述折弯边之间形成第一避让结构；
    其中，至少部分所述第一电控模块设于所述第一避让结构内，或至少部分所述第一电子发热元件设于所述第一避让结构内。
  3. 根据权利要求2所述的电控组件，其中，
    所述折弯边包括与所述本体部相连的第一折弯部和与所述第一折弯部背离所述本体部的一侧相连的第二折弯部，所述第一电控模块安装于所述第二折弯部，沿垂直于所述支撑板的方向，所述第一电路板和所述第一电控模块分别位于所第二折弯部的两侧。
  4. 根据权利要求2所述的电控组件，其中，
    所述本体部还设有第一安装结构，所述第一电路板通过所述第一安装结构安装于所述本体部。
  5. 根据权利要求4所述的电控组件，其中，
    所述第一电子发热元件背离所述第一电路板的一端具有第一导热面，所述第一导热面与所述第一电控模块抵接；
    沿垂直于所述第一电路板的方向，所述第一安装结构的尺寸、所述本体部的尺寸以及所述折弯结构的尺寸之和等于所述第一导热面与所述第一电路板之间的距离。
  6. 一种电控装置，其中，所述电控装置包括：
    如权利要求1-5中任一项所述的电控组件，所述电控组件中的支撑板包括相连的第一主体部分和第二主体部分，且所述第一主体部分和所述第二主体部分不在同一平面内；
    第一电控模块，安装于所述第一主体部分；
    第二电控模块，安装于所述第二主体部分；
    其中，所述第一电控模块和所述第二电控柜模块均设于所述支撑板的同一侧，沿垂直于所述支撑板的方向，所述第一电控模块背离所述支撑板的一端与所述第二电控模块背离所述支撑板的一端的高度之差的绝对值为H，所述第一电控模块的尺寸与所述第二电控模块的尺寸之差的绝对值为L，则H小于L；
    或所述第一电控模块和所述第二电控模块分别位于所述支撑板的两侧，沿平行于所述支撑板的方向，所述第一电控模块和所述第二电控模块至少部分重叠设置。
  7. 根据权利要求6所述的电控装置，其中，所述第一主体部分和所述第二主体部分平行设置，且沿垂直于所述支撑板的方向，所述第二电控模块的尺寸大于所述第一电控模块的尺寸。
  8. 根据权利要求7所述的电控装置，其中，沿垂直于所述支撑板的方向，所述第一主体部分和所述第二主体部分不重合。
  9. 根据权利要求6-8中任一项所述的电控装置，其中，
    所述第一电控模块和所述第二电控模块均为散热器；
    所述电控装置还包括：
    第一发热模块，安装于所述第一主体部分并与所述第一电控模块导热连接；
    第二电子发热元件，安装于所述第二主体部分并与所述第二电控模块导热连接。
  10. 根据权利要求9所述的电控装置，其中，
    所述第一发热模块包括：
    第一电路板，安装于所述第一主体部分背离所述第一电控模块的一侧；
    第一电子发热元件，安装于所述第一电路板，所述第一电子发热元件与所述第一电控模块导热连接；
    并且/或者所述第二电子发热元件包括：
    第二电路板，安装于所述第二主体部分背离所述第二电控模块的一侧；
    IGBT模块，安装于所述第二电路板，所述IGBT模块与所述第二电控模块导热连接；
    其中，沿垂直于所述第二主体部分的方向，所述第二电路板位于所述第一电路板背离所述第二主体部分的一侧并与所述第一电路板层叠设置。
  11. 根据权利要求10所述的电控装置，其中，
    所述第一主体部分设有第一避让结构，所述第一发热模块的第一电子发热元件穿过所述第一避让结构与所述第一电控模块导热连接；
    所述第二主体部分设有第二避让结构，所述第二电子发热元件的IGBT模块穿过所述第二避让结构与所述第二电控模块导热连接。
  12. 根据权利要求11所述的电控装置，其中，
    所述第一主体部分设有折弯边，所述第一电控模块安装于所述折弯边背离所述第一电路板的一侧；
    其中，所述第一主体部分的部分板体朝向背离所述第一电路板一侧弯折形成所述折弯边和位于所述折弯边一侧的所述第一避让结构。
  13. 根据权利要求11所述的电控装置，其中，
    所述第二主体部分的部分区域设置贯穿所述支撑板的板体的开口以形成所述第二避让结构。
  14. 根据权利要求11所述的电控装置，其中，
    所述第一发热模块还包括：
    第三电子发热元件，安装于所述第一电路板；
    所述第一主体部分还设有用于避让所述第三电子发热元件的第三避让结构。
  15. 根据权利要求6所述的电控装置，其中，
    沿垂直于所述支撑板的方向，所述第二电路板设于所述第一电路板背离所述支撑板的一侧并与所述第一电路板层叠设置，所述第一主体部分和所述第二主体部分平行且不重合，所述第一电控模块背离所述第一电路板的一端与所述第二电控模块背离所述第二电路板的一端平齐。
  16. 一种电控柜，其中，所述电控柜包括如权利要求6-15中任一项所述的电控装置。
  17. 一种电梯设备，其中，所述电梯设备包括权利要求16所述的电控柜。
PCT/CN2023/114044 2022-12-05 2023-08-21 电控组件、电控装置、电控柜及电梯设备 Ceased WO2024119892A1 (zh)

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CN219372752U (zh) * 2022-12-05 2023-07-18 菱王电梯有限公司 电控组件以及电控柜
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