WO2024111104A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2024111104A1
WO2024111104A1 PCT/JP2022/043436 JP2022043436W WO2024111104A1 WO 2024111104 A1 WO2024111104 A1 WO 2024111104A1 JP 2022043436 W JP2022043436 W JP 2022043436W WO 2024111104 A1 WO2024111104 A1 WO 2024111104A1
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WO
WIPO (PCT)
Prior art keywords
layer
display area
light
upper electrode
emitting
Prior art date
Application number
PCT/JP2022/043436
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French (fr)
Japanese (ja)
Inventor
敬之 主藤
Original Assignee
シャープディスプレイテクノロジー株式会社
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Priority to PCT/JP2022/043436 priority Critical patent/WO2024111104A1/en
Publication of WO2024111104A1 publication Critical patent/WO2024111104A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H05B33/28Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/15Hole transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17Carrier injection layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/816Multilayers, e.g. transparent multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/88Dummy elements, i.e. elements having non-functional features
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene

Definitions

  • This disclosure relates to a display device.
  • a charge transfer layer (at least one of a hole injection layer and a hole transport layer, or at least one of an electron injection layer and an electron transport layer) is often formed over the entire display area between the lower electrode and the light-emitting layer of the light-emitting element.
  • Patent document 1 describes a display device in which a hole injection layer and a hole transport layer are formed over the entire display area as charge transfer layers provided between the lower electrode and the light-emitting layer of an OLED.
  • Such a problem also occurs when at least one of an electron injection layer and an electron transport layer is formed over the entire display area as a charge transfer layer provided between the lower electrode and the light-emitting layer of the light-emitting element, resulting in bright lines being visible around the edges of the display area.
  • One aspect of the present disclosure has been made in consideration of the above problems, and aims to provide a display device that suppresses the phenomenon in which light emitting elements provided around the edges of a display area emit light brighter than intended, causing bright lines to become visible, even when a charge transfer layer provided between a lower electrode and a light emitting layer of the light emitting element is formed over the entire display area.
  • the display device of the present disclosure has: A substrate; a display region on the substrate, the display region including a plurality of pixels each including a plurality of sub-pixels; a non-display area on the substrate, the non-display area including a plurality of dummy sub-pixels provided along an edge of the display area and being continuous with the display area; A plurality of lower electrodes provided in each of the display area and the non-display area; a charge transport layer which is a single continuous layer provided across the display area and the non-display area; A first upper electrode layer provided in the display area; A second upper electrode layer provided in the non-display area; a light-emitting element provided in each of the plurality of sub-pixels, the light-emitting element including, in this order from the substrate side, the lower electrode, the charge transfer layer, a light-emitting layer, and the first upper electrode layer; a non-light-emitting charge transfer element provided in each of the plurality of dummy sub
  • One aspect of the present disclosure has been made in consideration of the above problems, and provides a display device that suppresses the phenomenon in which light emitting elements provided around the edges of the display area emit light brighter than intended, causing bright lines to be visible, even when a charge transfer layer provided between a lower electrode and a light emitting layer of the light emitting element is formed over the entire display area.
  • FIG. 1 is a plan view showing a schematic configuration of a display device according to a first embodiment.
  • 2 is a cross-sectional view showing a schematic configuration of a substrate provided in the display device of the first embodiment shown in FIG. 1.
  • 1 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 1.
  • FIG. 4 is a circuit diagram of the vicinity of the boundary between the display area and the non-display area of the display device of the first embodiment shown in FIG. 3.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of a display device as a comparative example in which light-emitting elements provided around the edge of a display area emit light brighter than intended, causing visible bright lines.
  • 6 is a circuit diagram for explaining the reason why bright lines are visible around the edges of the display area of the display device that is the comparative example shown in FIG. 5 .
  • 10 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 2.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 3.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 4.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 5.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 5.
  • FIG. 11 is a circuit diagram of the vicinity of the boundary between the display area and the non-display area of the display device of the fifth embodiment shown in FIG. 10.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of a display device as another comparative example in which light-emitting elements provided around the edge of a display area emit light brighter than intended, resulting in visible bright lines.
  • 13 is a circuit diagram for explaining the reason why bright lines are visible around the edges of the display area of the display device of the other comparative example shown in FIG. 12.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 6.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 7.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 8.
  • FIG. FIG. 13 is a plan view showing a schematic configuration of a display device according to a ninth embodiment.
  • FIG. 1 is a plan view showing a schematic configuration of a display device 1 according to the first embodiment.
  • the display device 1 includes a substrate 2, a display area DA on the substrate 2 including a plurality of pixels PIX, each of which includes a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel BSUB, a frame area GA on the substrate 2 provided outside the display area DA, and a non-display area (first non-display area) NDA1 on the substrate 2 which is a part of the frame area GA and is continuous with the display area DA, and which includes a plurality of dummy sub-pixels (see FIG. 3) provided along an end DAE of the display area DA.
  • the frame area GA outside the non-display area NDA1 is provided with a terminal section, a drive circuit, etc.
  • one pixel PIX is composed of a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel BSUB, but this is not limited to this.
  • one pixel PIX may include subpixels of other colors in addition to the red subpixel RSUB, the green subpixel GSUB, and the blue subpixel BSUB.
  • the non-display area NDA1 is included in the frame area GA, in order to realize a narrow frame of the display device 1, it is preferable that the non-display area NDA1 is not made wider than necessary. Therefore, when the shape of the pixel PIX is rectangular as in this embodiment, it is preferable that the width of the non-display area NDA1 is formed to be equal to or less than the length of the diagonal of the pixel PIX. In this embodiment, in order to make the width of the non-display area NDA1 equal to or less than the length of the diagonal of the pixel PIX, the width H1 of the rectangular right non-display area NDA1 shown in FIG.
  • the width H2 of the rectangular upper non-display area NDA1 shown in FIG. 1 and the width H2 of the rectangular lower non-display area NDA1 shown in FIG. 1 are each formed to be equal to or less than the width of the diagonal of the pixel PIX, and the four corners of the non-display area NDA1 shown in FIG.
  • the width H3 of the irregular part (upper right irregular part) connecting the upper non-display area and the rectangular right non-display area, the width H3 of the irregular part (lower right irregular part) connecting the rectangular right non-display area and the rectangular lower non-display area, the width H3 of the irregular part (lower left irregular part) connecting the rectangular lower non-display area and the rectangular left non-display area, and the width H3 of the irregular part (upper left irregular part) connecting the rectangular left non-display area and the rectangular upper non-display area are each formed with the length of the diagonal of the pixel PIX as an example, but are not limited to this.
  • the width of the non-display area NDA1 may be formed to be 50 ⁇ m or less, and is preferably formed to be 5 ⁇ m or more and 50 ⁇ m or less.
  • the width of the non-display area NDA1 may be formed to be 50 ⁇ m or less, and is preferably formed to be 5 ⁇ m or more and 50 ⁇ m or less.
  • the non-display area NDA1 is arranged to surround the display area DA is described as an example, but this is not limited thereto, and the non-display area NDA1 may be arranged to surround at least a portion of the display area DA.
  • the non-display area NDA1 may be arranged to surround only the four corners of the display area DA shown in FIG. 1, or may be arranged to surround at least one of the four sides excluding the four corners of the display area DA shown in FIG. 1.
  • FIG. 2 is a cross-sectional view showing the schematic configuration of the substrate 2 provided in the display device 1 shown in FIG. 1.
  • a barrier layer 3 and a thin-film transistor layer 4 including the transistor TR1 are provided on the support substrate 12 in this order from the support substrate 12 side.
  • an edge cover layer 23 that covers the lower electrode 22 and the edge portion of the lower electrode 22 is provided on the surface of the substrate 2 including the transistor TR1 in the display area DA and non-display area NDA1 of the display device 1.
  • the support substrate 12 may be, for example, a resin substrate made of a resin material such as polyimide, or a glass substrate.
  • a resin substrate made of a resin material such as polyimide is used as the support substrate 12 in order to make the display device 1 a flexible display device, a case in which a resin substrate made of a resin material such as polyimide is used as the support substrate 12 will be described as an example, but this is not limited to this. If the display device 1 is a non-flexible display device, a glass substrate can be used as the support substrate 12.
  • the barrier layer 3 is a layer that prevents foreign substances such as water and oxygen from penetrating the transistor TR1 and the light-emitting elements of each color described below, and can be composed of, for example, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film, or a laminate film of these, formed by a chemical vapor deposition (CVD) method.
  • CVD chemical vapor deposition
  • the transistor TR1 portion of the thin-film transistor layer 4 including the transistor TR1 includes the semiconductor film SEM and doped semiconductor films SEM' and SEM'', the inorganic insulating film 16, the gate electrode G, the inorganic insulating film 18, the inorganic insulating film 20, the source electrode S and the drain electrode D, and the planarization film 21, and the portion of the thin-film transistor layer 4 including the transistor TR1 other than the transistor TR1 portion includes the inorganic insulating film 16, the inorganic insulating film 18, the inorganic insulating film 20, and the planarization film 21.
  • the semiconductor films SEM, SEM', and SEM'' may be made of, for example, low-temperature polysilicon (LTPS) or an oxide semiconductor (for example, an In-Ga-Zn-O-based semiconductor).
  • LTPS low-temperature polysilicon
  • oxide semiconductor for example, an In-Ga-Zn-O-based semiconductor.
  • the gate electrode G and the source and drain electrodes S and D can be formed of a single layer or a multilayer film of a metal containing at least one of aluminum, tungsten, molybdenum, tantalum, chromium, titanium, and copper, for example.
  • Inorganic insulating film 16, inorganic insulating film 18, and inorganic insulating film 20 can be composed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminate film of these films formed by a chemical vapor deposition (CVD) method.
  • CVD chemical vapor deposition
  • the planarization film 21 can be made of a coatable organic material such as polyimide or acrylic.
  • the insulating edge cover layer 23 that covers the edge of the lower electrode 22 can be formed, for example, by applying an organic material such as polyimide or acrylic and then patterning it using a photolithography method.
  • a control circuit including a transistor TR1 that controls each of the multiple lower electrodes 22 is provided in the thin-film transistor layer 4 that includes the transistor TR1.
  • FIG. 3 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1 of embodiment 1, and a non-light-emitting charge-transfer element 6R with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • the red subpixel RSUB provided in the display area DA of the display device 1 includes a red light-emitting element 5R including a red light-emitting layer 8R
  • the green subpixel GSUB provided in the display area DA of the display device 1 includes a green light-emitting element 5G including a green light-emitting layer 8G
  • the blue subpixel BSUB provided in the display area DA of the display device 1 includes a blue light-emitting element 5B including a blue light-emitting layer 8B.
  • the red light-emitting element 5R includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • the green light-emitting element 5G includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • the blue light-emitting element 5B includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer that is a single continuous layer provided across the display area DA and the non-display area NDA1, for example, as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1.
  • both the hole injection layer 24 and the hole transport layer 25 are provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1, but this is not limited to this, and only one of the hole injection layer 24 and the hole transport layer 25 may be provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1.
  • the first dummy subpixel DRSUB provided in the non-display area NDA1 of the display device 1 is provided with a non-light-emitting charge transfer element 6R having a forward stack structure in which, from the substrate 2 side, a lower electrode 22 as an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a as a cathode are stacked in this order on the substrate 2, and the second dummy subpixel DGSUB is provided with a non-light-emitting charge transfer element 6R having a forward stack structure in which, from the substrate 2 side, a lower electrode 22 as an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a as a cathode are stacked in this order on the substrate 2.
  • a non-light-emitting charge transfer element 6G is provided in which a color light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a which is a cathode are stacked in this order, and the third dummy subpixel DBSUB is provided on the substrate 2 with a non-light-emitting charge transfer element 6B in a forward stack structure in which, from the substrate 2 side, a lower electrode 22 which is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a which is a cathode are stacked in this order, but the present invention is not limited to this.
  • the non-display area NDA1 of the display device 1 may include only one or two of the first dummy subpixel DRSUB including a non-light-emitting charge transfer element 6R having a forward stack structure, the second dummy subpixel DGSUB including a non-light-emitting charge transfer element 6G having a forward stack structure, and the third dummy subpixel DBSUB including a non-light-emitting charge transfer element 6B having a forward stack structure.
  • the non-light-emitting charge transfer elements 6R, 6G, and 6B having a forward stack structure one of the hole injection layer 24 and the hole transport layer 25 may be omitted.
  • the charge transfer layer (hole transfer layer), which is a continuous layer provided across the display area DA and non-display area NDA1 of the display device 1, may be at least one of the hole injection layer 24 and the hole transport layer 25.
  • At least one of the electron transport layer 26 and the electron injection layer 27 may be provided between the light-emitting layers 8R, 8G, and 8B in the display area DA of the display device 1 and the first upper electrode layer 28, and between the light-emitting layers 8R, 8G, and 8B in the non-display area NDA1 of the display device 1 and the second upper electrode layer 28a, or both the electron transport layer 26 and the electron injection layer 27 may be omitted.
  • the charge transfer layer (hole transfer layer) provided in the display area DA of the display device 1 and the charge transfer layer (hole transfer layer) provided in the non-display area NDA1 of the display device 1 are formed of the same material. That is, when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is only the hole injection layer 24, the hole injection layer 24 provided in the display area DA and the hole injection layer 24 provided in the non-display area NDA1 are made of the same material, when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is only the hole transport layer 25, the hole transport layer 25 provided in the display area DA and the hole transport layer 25 provided in the non-display area NDA1 are made of the same material, and when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is the hole injection layer 24 and the hole transport layer 25, the hole injection layer 24 and the hole transport layer 25 provided in the
  • the charge transfer layer (hole transfer layer) provided in the display area DA of the display device 1 and the charge transfer layer (hole transfer layer) provided in the non-display area NDA1 of the display device 1 may be formed of different materials as long as they are one continuous layer that allows holes to move from the display area DA to the non-display area NDA1.
  • the red subpixel RSUB and the first dummy subpixel DRSUB are formed in the same shape
  • the green subpixel GSUB and the second dummy subpixel DGSUB are formed in the same shape
  • the blue subpixel BSUB and the third dummy subpixel DBSUB are formed in the same shape, but this is not limiting.
  • the subpixels provided in the display area DA and the dummy subpixels provided in the non-display area NDA1 may have different shapes.
  • the lower electrode 22 as the anode may be formed from an electrode material that reflects visible light
  • the first upper electrode layer 28 as the cathode may be formed from an electrode material that transmits visible light, to form a top-emission type light-emitting element that emits light from the upper side, that is, the first upper electrode layer 28 side, or the lower electrode 22 as the anode may be formed from an electrode material that transmits visible light
  • the first upper electrode layer 28 as the cathode may be formed from an electrode material that reflects visible light, to form a bottom-emission type light-emitting element that emits light from the lower side, that is, the substrate 2 side.
  • the lower electrode 22 serving as the anode provided in the non-light-emitting charge transfer elements 6R, 6G, and 6B shown in FIG. 3 is formed of an electrode material that reflects visible light
  • the second upper electrode layer 28a serving as the cathode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1 ⁇ 10 9 ⁇ cm or less, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
  • the lower electrode 22 serving as the anode provided in the non-light-emitting charge transfer elements 6R, 6G, and 6B shown in FIG. 3 is formed of an electrode material that transmits visible light
  • the second upper electrode layer 28a serving as the cathode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and not more than 1 ⁇ 10 9 ⁇ cm, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
  • the electrode material that reflects visible light is not particularly limited as long as it can reflect visible light and has electrical conductivity.
  • metal materials such as Al, Mg, Li, Ag, etc., alloys of the above metal materials, laminates of the above metal materials and transparent metal oxides (e.g., indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc.), or laminates of the above alloys and the above transparent metal oxides can be used.
  • the electrode material that transmits visible light is not particularly limited as long as it can transmit visible light and has electrical conductivity, but examples that can be used include transparent metal oxides (e.g., indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc.), and thin films made of metal materials such as Al, Mg, Li, and Ag.
  • transparent metal oxides e.g., indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc.
  • thin films made of metal materials such as Al, Mg, Li, and Ag.
  • an electrode material that reflects visible light in which Ag and a transparent metal oxide (e.g., indium tin oxide) are laminated in this order from the substrate 2 side, is used as the lower electrode 22 which is the anode
  • an Al thin film (resistivity ⁇ : 2.65 x 10 -8 ⁇ cm) is used as the first upper electrode layer 28 which is the cathode
  • a Ti film (resistivity ⁇ : 4.20 x 10 -7 ⁇ cm) is used as the second upper electrode layer 28a which is the cathode
  • an Ag thin film (resistivity ⁇ : 1.59 ⁇ 10-8 ⁇ cm) or an Mg thin film (resistivity ⁇ : 4.42 ⁇ 10-8 ⁇ cm) may be used as the first upper electrode layer 28, which is the cathode
  • a Cr film (resistivity ⁇ : 1.29 ⁇ 10-7 ⁇ cm) or an Ni film (resistivity ⁇ : 6.99 ⁇ 10-8 ⁇ cm) may be used as the second upper electrode layer 28a, which is the cathode.
  • the resistance adjustment layer described above only needs to have a resistivity higher than that of the first upper electrode layer 28 and equal to or less than 1 ⁇ 10 9 ⁇ cm, and may be formed of, for example, a semiconductive material (resistivity ⁇ : 1 ⁇ 10 5 ⁇ cm or more and 1 ⁇ 10 9 ⁇ cm or less).
  • a semiconductive material resistivity ⁇ : 1 ⁇ 10 5 ⁇ cm or more and 1 ⁇ 10 9 ⁇ cm or less.
  • An example of the semiconductive material is, for example, a polymer material containing a conductive agent in an amount such that the resistivity is 1 ⁇ 10 5 ⁇ cm or more and 1 ⁇ 10 9 ⁇ cm or less, but is not limited thereto.
  • the non-light-emitting charge transfer elements 6R, 6G, 6B have a charge transfer layer (hole transfer layer), for example, a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and 1 x 10 9 ⁇ -cm or less between a first surface M1, which is the surface of the hole transport layer 25 facing the light-emitting layers 8R, 8G, 8B , and a second surface M2, which is the surface of the second upper electrode layer 28a opposite the substrate 2.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are electrically connected, and the resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and 1 x 10 9 ⁇ -cm or less is the second upper electrode layer 28a, but this is not limited to this.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are a single continuous layer made of the same material, and a resistance adjustment layer 28c having a resistivity higher than that of the first upper electrode layer 28 and equal to or less than 1 ⁇ 10 9 ⁇ cm may be provided between a first surface M1, which is the surface of the hole transport layer 25 facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3, which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G , and 8B.
  • the material used for the hole injection layer 24 is not particularly limited as long as it is a hole injection material that can stabilize the injection of holes into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B.
  • PEDOT can be given as an example, but is not limited to this.
  • the material used for the hole transport layer 25 is not particularly limited as long as it is a hole transport material that can transport holes injected from the lower electrode 22, which is the anode, into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B.
  • the hole transport material it is preferable for the hole transport material to have high hole mobility.
  • TFB ADS
  • the material is not limited to this.
  • the material used for the electron transport layer 26 is not particularly limited as long as it is an electron transport material capable of transporting electrons injected from the first upper electrode layer 28 or the second upper electrode layer 28a, which is the cathode, into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B.
  • the electron transport material has high electron mobility.
  • ZnMgO can be given as an example, but the present invention is not limited to this.
  • the material used for the electron injection layer 27 is not particularly limited as long as it is an electron injection material that can stabilize the injection of electrons into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B.
  • examples of the electron injection material include alkali metals or alkaline earth metals such as aluminum, strontium, calcium, lithium, cesium, magnesium oxide, aluminum oxide, strontium oxide, lithium oxide, lithium fluoride, magnesium fluoride, strontium fluoride, calcium fluoride, barium fluoride, cesium fluoride, polymethyl methacrylate polystyrene sodium sulfonate, oxides of alkali metals or alkaline earth metals, fluorides of alkali metals or alkaline earth metals, organic complexes of alkali metals, etc.
  • alkali metals or alkaline earth metals such as aluminum, strontium, calcium, lithium, cesium, magnesium oxide, aluminum oxide, strontium oxide, lithium oxide, lithium fluoride, magnesium fluoride, strontium fluoride, calcium fluoride, barium fluoride, cesium fluoride, polymethyl methacrylate polystyrene sodium sulfonate, oxides of alkali metals or
  • the sealing layer 29 provided on the first upper electrode layer 28 and the second upper electrode layer 28a is a light-transmitting film, and can be composed of, for example, an inorganic sealing film covering the first upper electrode layer 28 and the second upper electrode layer 28a, an organic film above the inorganic sealing film, and an inorganic sealing film above the organic film.
  • the sealing layer 29 prevents the penetration of water, oxygen, etc. into the light-emitting elements of each color.
  • the holes H+ that have moved from the display area DA to the non-display area NDA1 through at least one of the charge transfer layer (hole transfer layer) hole injection layer 24 and the hole transport layer 25 are accumulated in the non-display area NDA1 where they have nowhere to go.
  • the second upper electrode layer 28a is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1 ⁇ 10 9 ⁇ cm or less, and therefore, due to a decrease in the voltage applied between the lower electrode 22 and the second upper electrode layer 28a, the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the holes H + are allowed to flow to the second upper electrode layer 28a, allowing the holes H + accumulated in the non-display area NDA1 to escape.
  • the voltage applied between the lower electrode 22 and the second upper electrode layer 28a is smaller than the energy required for recombination of the holes H + and the electrons e in the light-emitting layers 8R, 8G, and 8B, so that light emission can be suppressed and the holes H + can flow to the second upper electrode layer 28a.
  • the accumulated holes H + move toward the second upper electrode layer 28a, and it is possible to suppress the accumulation of the holes H + in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
  • FIG. 4 is a circuit diagram of the display device 1 shown in FIG. 3 near the boundary between the display area DA and the non-display area NDA1.
  • FIG. 4 shows a schematic circuit configuration of a drive circuit for a blue subpixel BSUB including a blue light-emitting element 5B provided in the display area DA of the display device 1, and a drive circuit for a first dummy subpixel DRSUB including a non-light-emitting charge transfer element 6R provided in the non-display area NDA1 of the display device 1 adjacent to the blue light-emitting element 5B.
  • the drive circuit for the blue subpixel BSUB including the blue light-emitting element 5B and the drive circuit for the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R are provided on the substrate 2 shown in FIG. 3.
  • the drive circuit of the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R provided in the non-display area NDA1 of the display device 1 adjacent to the blue light-emitting element 5B includes one non-light-emitting charge transfer element 6R, two transistors TR1-TR2, and one holding capacitor C1.
  • the drive circuit of the blue subpixel BSUB including the blue light-emitting element 5B provided in the display area DA of the display device 1 has the same configuration as the drive circuit of the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R described above, except that it includes the blue light-emitting element 5B instead of the non-light-emitting charge transfer element 6R.
  • the drain electrode of transistor TR1 which is the drive transistor, is electrically connected to the lower electrode 22 of the non-light-emitting charge transfer element 6R
  • the gate electrode of transistor TR1 is electrically connected to one electrode of the holding capacitor C1 and the drain electrode of transistor TR2, which is the selection transistor
  • the source electrode of transistor TR1 is electrically connected to the other electrode of the holding capacitor C1 and an ELVDD wiring VL to which a high-level power supply voltage ELVDD is supplied from a power supply circuit (not shown).
  • first upper electrode layer 28 of the blue light-emitting element 5B and the second upper electrode layer 28a which is the above-mentioned resistance adjustment layer of the non-light-emitting charge transfer elements 6R, 6G, and 6B, are electrically connected to an ELVSS wiring (not shown) to which a low-level power supply voltage ELVSS is supplied from the power supply circuit.
  • the source electrode of transistor TR2 which is a selection transistor, is electrically connected to a data signal line DL to which a data signal output from a data side driving circuit (not shown) is supplied
  • the gate electrode of transistor TR2 is electrically connected to a scanning signal line SL to which a scanning signal output from a scanning side driving circuit (not shown) is supplied
  • the drain electrode of transistor TR2 is electrically connected to the gate electrode of transistor TR1 and one electrode of holding capacitor C1.
  • the non-light-emitting charge transfer elements 6R, 6G, and 6B are provided in the non-display area NDA1 of the display device 1, so that it is possible to prevent bright lines from appearing around the edges of the display area DA that is provided near the non-display area NDA1 of the display device 1.
  • FIG. 5 is a cross-sectional view showing the schematic configuration of a display device 100, which is a comparative example in which red light-emitting elements 5R, green light-emitting elements 5G, and blue light-emitting elements 5B provided around the edge periphery DAER of the display area DA emit light brighter than intended, resulting in visible bright lines.
  • the red subpixel RSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a red light-emitting element 5R including a red light-emitting layer 8R
  • the green subpixel GSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a green light-emitting element 5G including a green light-emitting layer 8G
  • the blue subpixel BSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a blue light-emitting element 5B including a blue light-emitting layer 8B.
  • the red light-emitting element 5R includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • the green light-emitting element 5G includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • the blue light-emitting element 5B includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
  • the display device 100 shown in FIG. 5 is a comparative example.
  • a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA.
  • FIG. 6 is a circuit diagram for explaining why bright lines are visible around the edge DAER of the display area DA of the display device 100, which is a comparative example shown in FIG. 5.
  • FIG. 6 shows a schematic circuit configuration of a drive circuit for a red sub-pixel RSUB including a red light-emitting element 5R provided around the edge DAER of the display area DA of the display device 100, which is a comparative example shown in FIG. 5, and a blue light-emitting element 5B arranged adjacent to the red light-emitting element 5R.
  • the drive circuit of the red subpixel RSUB including the red light-emitting element 5R provided in the edge periphery DAER of the display area DA of the display device 100 which is a comparative example, includes one light-emitting element, two transistors TR1-TR2, and one storage capacitor C1.
  • the transistor TR1 is a drive transistor
  • the transistor TR2 is a selection transistor.
  • the drive circuit of the green subpixel GSUB including the green light-emitting element 5G provided in the edge periphery DAER of the display area DA of the display device 100, which is a comparative example, and the drive circuit of the blue subpixel BSUB including the blue light-emitting element 5B provided in the edge periphery DAER of the display area DA of the display device 100, which is a comparative example, are also configured in the same way.
  • the drain electrode of the transistor TR1 which is the drive transistor, is electrically connected to the lower electrode 22 of the red light emitting element 5R
  • the gate electrode of the transistor TR1 is electrically connected to one side electrode of the holding capacitor C1 and the drain electrode of the transistor TR2, which is the selection transistor
  • the source electrode of the transistor TR1 is electrically connected to the other side electrode of the holding capacitor C1 and the ELVDD wiring VL to which the high-level power supply voltage ELVDD is supplied from a power supply circuit not shown.
  • the source electrode of the transistor TR2 which is the selection transistor, is electrically connected to the data signal line DL to which the data signal output from the data side drive circuit not shown is supplied
  • the gate electrode of the transistor TR2 is electrically connected to the scanning signal line SL to which the scanning signal output from the scanning side drive circuit not shown is supplied
  • the drain electrode of the transistor TR2 is electrically connected to the gate electrode of the transistor TR1 and one side electrode of the holding capacitor C1.
  • a bright line is seen in the edge periphery DAER of the display area DA.
  • the inventors of the present disclosure believe that one of the causes of this is that, as shown in Figs.
  • holes H + that have moved to the edge periphery DAER of the display area DA through the hole injection layer 24 and the hole transport layer 25 that are charge transfer layers (hole transfer layers) accumulate in the edge periphery DAER of the display area DA where there is nowhere to go, and in the light-emitting element provided in the edge periphery DAER of the display area DA, the accumulated holes H + move toward the first upper electrode layer 28, resulting in light emission that is brighter than the intended brightness.
  • the display device 100 has been described as an example in which a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer (hole transfer layer), which is a common layer formed over the entire surface of the display area DA.
  • this is not limited to this example, and even if only one of the hole injection layer 24 and the hole transport layer 25 is provided, a bright line will similarly be visible around the edge DAER of the display area DA.
  • the display device 1a of this embodiment is different from the first embodiment described above in that the first upper electrode layer 28 is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a and the first upper electrode layer 28 are stacked in this order from the substrate 2 side.
  • the rest is as described in the first embodiment.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the first embodiment, and their explanations are omitted.
  • FIG. 7 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1a of embodiment 2, and a non-light-emitting charge-transfer element 6Ra with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Ga with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Ba with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • the first upper electrode layer 28 is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a and the first upper electrode layer 28 are stacked in this order from the substrate 2 side to form the laminate 28b. In such a case, the laminate 28b becomes the cathode.
  • the second upper electrode layer 28a is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1 ⁇ 10 9 ⁇ cm or less, so that the voltage applied between the lower electrode 22 and the laminate 28b serving as the cathode is reduced, and the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the holes H + are allowed to flow to the laminate 28b serving as the cathode, and the holes H + accumulated in the non-display area NDA1 can be released.
  • the holes H + thus accumulated move toward the laminate 28b serving as the cathode, and the accumulation of the holes H + in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1 can be suppressed.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are one continuous layer formed of the same material, and the resistance adjustment layer 28c, which has a resistivity higher than that of the first upper electrode layer 28 and is 1 ⁇ 10 9 ⁇ cm or less, is provided between the first surface M1, which is the surface of the hole transport layer 25, which is the charge transfer layer (hole transfer layer), on the light emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a on the light emitting layers 8R, 8G, and 8B side.
  • the rest is as described in the first and second embodiments.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the first and second embodiments, and their explanations are omitted.
  • FIG. 8 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1b of embodiment 3, and a non-light-emitting charge-transfer element 6Rb with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Gb with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Bb with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are one continuous layer formed of the same material, and a resistance adjustment layer 28c having a resistivity higher than that of the first upper electrode layer 28 and being 1 ⁇ 10 9 ⁇ cm or less is provided between a first surface M1 which is the surface of the hole transport layer 25, which is a charge transfer layer (hole transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G, and 8B.
  • the resistance adjustment layer 28c may be provided between the second upper electrode layer 28a and the electron injection layer 27, between the electron transport layer 26 and the light-emitting layers 8R, 8G, and 8B, or between the light-emitting layers 8R, 8G, and 8B and the hole transport layer 25, or may be provided at multiple positions among the above positions.
  • the resistance adjustment layer 28c is provided between the first surface M1, which is the surface of the hole transport layer 25, which is a charge transfer layer (hole transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and the third surface M3, which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G, and 8B.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are electrically separated, and the second upper electrode layer 28a is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28, 1 ⁇ 10 9 ⁇ cm or less, and a first voltage is applied to the first upper electrode layer 28 through a first wiring, and a second voltage is applied to the second upper electrode layer 28a through a second wiring, and the first voltage and the second voltage are the same voltage.
  • This is different from the first to third embodiments described above. The rest is as described in the first to third embodiments.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the first to third embodiments, and their explanations are omitted.
  • FIG. 9 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1c of embodiment 4, and a non-light-emitting charge-transfer element 6R with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • a groove HOL for electrically isolating the first upper electrode layer 28 and the second upper electrode layer 28a is provided in an area including the end DAE of the display area DA, and the first upper electrode layer 28 and the second upper electrode layer 28a are electrically isolated.
  • the groove HOL is also provided in the electron transport layer 26 and the electron injection layer 27 as an example, but this is not limited thereto, and the groove HOL may be provided only between the first upper electrode layer 28 and the second upper electrode layer 28a.
  • the first upper electrode layer 28 and the second upper electrode layer 28a are electrically separated, and the second upper electrode layer 28a is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28, being 1 ⁇ 10 9 ⁇ cm or less.
  • a first voltage is applied to the first upper electrode layer 28 via a first wiring
  • a second voltage is applied to the second upper electrode layer 28a via a second wiring, and the first voltage and the second voltage are the same voltage.
  • the display device 1c can prevent the red light-emitting element 5R, green light-emitting element 5G, and blue light-emitting element 5B provided in the display area DA from being affected by the non-light-emitting charge transfer elements 6R, 6G, and 6B provided in the non-display area NDA1.
  • the display device 1d of this embodiment is different from the first to fourth embodiments in that the display area DA includes red light emitting element 5R', green light emitting element 5G', and blue light emitting element 5B', which are light emitting elements with an inverted stack structure, and the non-display area NDA1 includes non-light emitting charge transfer elements 6R', 6G', and 6B', which are non-light emitting charge transfer elements with an inverted stack structure.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the first to fourth embodiments, and their explanations are omitted.
  • FIG. 10 is a cross-sectional view showing the schematic configuration of red light-emitting element 5R', green light-emitting element 5G', and blue light-emitting element 5B', which are light-emitting elements with an inverted stack structure provided in display area DA of display device 1d of embodiment 5, and non-light-emitting charge-transfer elements 6R', 6G', and 6B', which are non-light-emitting charge-transfer elements with an inverted stack structure provided in non-display area NDA1.
  • the red subpixel RSUB provided in the display area DA of the display device 1d is provided with a red light-emitting element 5R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a red light-emitting layer 8R, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' serving as an anode are stacked in this order on the substrate 2'.
  • the green subpixel GSUB is provided with a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a green light-emitting layer 8R, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' serving as an anode on the substrate 2'.
  • a green light emitting element 5G' is provided with an inverted stack structure in which a light emitting layer 8G, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' that is an anode are stacked in this order
  • the blue subpixel BSUB is provided with a blue light emitting element 5B' with an inverted stack structure in which a lower electrode 22' that is a cathode, an electron injection layer 27, an electron transport layer 26, a blue light emitting layer 8B, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' that is an anode are stacked in this order from the substrate 2' side on the substrate 2', but the present invention is not limited to this.
  • the first dummy subpixel DRSUB provided in the non-display area NDA1 of the display device 1d is provided with a non-light-emitting charge transfer element 6R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' which is a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' which is an anode are stacked in this order on the substrate 2'.
  • the second dummy subpixel DGSUB is provided with a non-light-emitting charge transfer element 6R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' which is a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' which is an anode are stacked in this order on the substrate 2'.
  • the third dummy subpixel DBSUB is provided with a non-light-emitting charge transfer element 6G' having an inverted stack structure in which a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' serving as an anode are stacked in this order on the substrate 2'.
  • non-light-emitting charge transfer element 6B' having an inverted stack structure in which a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' serving as an anode are stacked in this order on the substrate 2', but the present invention is not limited to this.
  • the charge transfer layer which is a continuous layer provided across the display area DA and non-display area NDA1 of the display device 1d, may be at least one of the electron injection layer 27 and the electron transport layer 26.
  • At least one of the hole transport layer 25 and the hole injection layer 24 may be provided between the light emitting layers 8R, 8G, 8B and the first upper electrode layer 28' in the display area DA of the display device 1d, and between the light emitting layers 8R, 8G, 8B and the second upper electrode layer 28a' in the non-display area NDA1 of the display device 1d, or both the hole transport layer 25 and the hole injection layer 24 may be omitted.
  • the charge transfer layer (electron transfer layer) provided in the display area DA of the display device 1d and the charge transfer layer (electron transfer layer) provided in the non-display area NDA1 of the display device 1d are formed of the same material.
  • the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is only the electron injection layer 27, the electron injection layer 27 provided in the display area DA and the electron injection layer 27 provided in the non-display area NDA1 are made of the same material, when the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is only the electron transport layer 26, the electron transport layer 26 provided in the display area DA and the electron transport layer 26 provided in the non-display area NDA1 are made of the same material, and when the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is the electron injection layer 27 and the electron transport layer 26, the electron injection layer 27 and the electron transport layer 26 provided in the display area DA and the electron injection layer 27 and the electron transport layer 26 provided in the non-display area NDA1 are each made of the same material.
  • the charge transfer layer (electron transfer layer) provided in the display area DA of the display device 1d and the charge transfer layer (electron transfer layer) provided in the non-display area NDA1 of the display device 1d may be formed of different materials as long as they are one continuous layer that allows the movement of electrons from the display area DA to the non-display area NDA1.
  • the lower electrode 22' which is the cathode provided in the non-light-emitting charge transfer elements 6R', 6G', and 6B' shown in Figure 10 is formed of an electrode material that reflects visible light
  • the second upper electrode layer 28a' which is the anode may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light, as long as it is a resistance adjustment layer whose resistivity is higher than that of the first upper electrode layer 28' and is 1 x 10 9 ⁇ cm or less.
  • the lower electrode 22' serving as the cathode provided in the non-light-emitting charge transfer elements 6R', 6G', 6B' shown in FIG. 10 is formed of an electrode material that transmits visible light
  • the second upper electrode layer 28a' serving as the anode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and not more than 1 ⁇ 10 9 ⁇ cm, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
  • an Al film is used as the lower electrode 22' which is the cathode
  • an ITO (indium tin oxide) film which is a transparent metal oxide is used as the first upper electrode layer 28' which is the anode
  • an IZO (indium zinc oxide) film which is a transparent metal oxide having a higher resistivity than an ITO (indium tin oxide) film is used as the second upper electrode layer 28a' which is the anode.
  • the present invention is not limited to this example.
  • the non-light-emitting charge transfer elements 6R', 6G', 6B' have a charge transfer layer (electron transfer layer), for example, a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and 1 x 10 9 ⁇ -cm or less between a first surface M1 which is the surface of the electron transport layer 26 facing the light-emitting layers 8R, 8G , 8B, and a second surface M2 which is the surface of the second upper electrode layer 28a' opposite the substrate 2'.
  • a charge transfer layer electron transfer layer
  • a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and 1 x 10 9 ⁇ -cm or less is the second upper electrode layer 28a', this will be described as a case in which, however, the present invention is not limited to this.
  • the non-light-emitting charge transfer element may include a charge transfer layer (electron transfer layer), for example, a resistance adjustment layer 28c' having a resistivity higher than that of the first upper electrode layer 28' and equal to or less than 1 ⁇ 10 9 ⁇ cm, between a first surface M1 which is the surface of the electron transport layer 26 facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a' facing the light-emitting layers 8R, 8G , and 8B.
  • a charge transfer layer electron transfer layer
  • the electron injection layer 27 and the electron transport layer 26, which are charge transfer layers (electron transfer layers) accumulate in the non-display area NDA1 where they have nowhere to go.
  • the second upper electrode layer 28a' is provided as a resistance adjustment layer, and thus, in the light-emitting layers 8R, 8G, and 8B, the recombination of the holes H + and the electrons e is suppressed due to the reduction in the voltage applied between the lower electrode 22' and the second upper electrode layer 28a', and the electrons e that have accumulated in the non-display area NDA1 can be made to flow to the second upper electrode layer 28a'.
  • the voltage applied between the lower electrode 22' and the second upper electrode layer 28a' is smaller than the energy required for recombination of the holes H + and the electrons e in the light-emitting layers 8R, 8G, and 8B, so that light emission can be suppressed and the electrons e can flow to the second upper electrode layer 28a'.
  • the accumulated electrons e move toward the second upper electrode layer 28a', and it is possible to suppress the accumulation of the electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
  • FIG. 11 is a circuit diagram of the display device 1d shown in FIG. 10 near the boundary between the display area DA and the non-display area NDA1.
  • FIG. 11 shows a schematic circuit configuration of a drive circuit for a blue subpixel BSUB including a blue light-emitting element 5B' provided in the display area DA of the display device 1d, and a drive circuit for a first dummy subpixel DRSUB including a non-emissive charge transfer element 6R' provided in the non-display area NDA1 of the display device 1d adjacent to the blue light-emitting element 5B'.
  • the drive circuit for the blue subpixel BSUB including the blue light-emitting element 5B' and the drive circuit for the first dummy subpixel DRSUB including the non-emissive charge transfer element 6R' are provided on the substrate 2' shown in FIG. 10.
  • non-light-emitting charge transfer elements 6R', 6G', and 6B' are provided in the non-display area NDA1 of the display device 1d, so that it is possible to prevent bright lines from appearing around the edges of the display area DA that is provided near the non-display area NDA1 of the display device 1d.
  • FIG. 12 is a cross-sectional view showing the schematic configuration of a display device 101, which is a comparative example in which red light-emitting elements 5R', green light-emitting elements 5G', and blue light-emitting elements 5B' provided around the edge periphery DAER of the display area DA emit light brighter than intended, resulting in visible bright lines.
  • the red subpixel RSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a red light emitting element 5R' including a red light emitting layer 8R
  • the green subpixel GSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a green light emitting element 5G' including a green light emitting layer 8G
  • the blue subpixel BSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a blue light emitting element 5B' including a blue light emitting layer 8B.
  • an electron injection layer 27 and an electron transport layer 26 are provided as a charge transfer layer (electron transfer layer) that is a common layer formed over the entire display area DA between the lower electrode 22' and red light-emitting layer 8R of the red light-emitting element 5R', between the lower electrode 22' and green light-emitting layer 8G of the green light-emitting element 5G', and between the lower electrode 22' and blue light-emitting layer 8B of the blue light-emitting element 5B'.
  • a charge transfer layer electron transfer layer
  • FIG. 13 is a circuit diagram for explaining why bright lines are visible around the edge DAER of the display area DA of the display device 101, which is a comparative example shown in FIG. 12.
  • FIG. 13 shows a schematic circuit configuration of a drive circuit for a red sub-pixel RSUB including a red light-emitting element 5R' provided around the edge DAER of the display area DA of the display device 101, which is a comparative example shown in FIG. 12, and a blue light-emitting element 5B' arranged adjacent to the red light-emitting element 5R'.
  • the circuit configuration shown in FIG. 13 has been described above in embodiment 1, so a description thereof will be omitted here.
  • FIG. 12 which is a comparative example in which an electron injection layer 27 and an electron transport layer 26 are provided as a charge transfer layer (electron transfer layer) that is a common layer formed over the entire surface of the display area DA, bright lines are visible in the periphery DAER of the edge of the display area DA.
  • the inventors of the present disclosure believe that one of the causes of this is that, as shown in FIG. 12 and FIG.
  • the electron injection layer 27 and electron transport layer 26 which are charge transfer layers (electron transfer layers)
  • an electron injection layer 27 and an electron transport layer 26 are provided as a charge transport layer (electron transport layer) that is a common layer formed over the entire surface of the display area DA, but this is not limited to this, and even if only one of the electron injection layer 27 and the electron transport layer 26 is provided, a bright line will be visible around the edge DAER of the display area DA.
  • charge transport layer electron transport layer
  • the display device 1e of this embodiment is different from the fifth embodiment in that the first upper electrode layer 28' is also provided in the non-display area NDA1 as one continuous layer, and the second upper electrode layer 28a' and the first upper electrode layer 28' are stacked in this order from the substrate 2' side in the non-display area NDA1.
  • the rest is as described in the fifth embodiment.
  • the same reference numerals are used for the members having the same functions as those shown in the drawings of the fifth embodiment, and the explanation thereof will be omitted.
  • FIG. 14 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1e of embodiment 6, and a non-light-emitting charge-transfer element 6Ra' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Ga' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Ba' with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • the first upper electrode layer 28' is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a' and the first upper electrode layer 28' are stacked in this order from the substrate 2' side to form the laminate 28b'.
  • the laminate 28b' serves as the anode.
  • the second upper electrode layer 28a' is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and a resistivity of 1 ⁇ 10 9 ⁇ cm or less, so that the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B due to a decrease in the voltage applied between the lower electrode 22' and the anode stack 28b', and the electrons e can flow to the anode stack 28b' and the electrons e accumulated in the non-display area NDA1 can be released.
  • the accumulated electrons e move toward the anode stack 28b', and the accumulation of the electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1 can be suppressed.
  • the seventh embodiment of the present disclosure will be described based on FIG. 15.
  • the first upper electrode layer 28' and the second upper electrode layer 28a' are one continuous layer formed of the same material, and the resistance adjustment layer 28c', which has a resistivity higher than that of the first upper electrode layer 28' and is 1 ⁇ 10 9 ⁇ cm or less, is provided between the first surface M1, which is the surface of the electron transport layer 26, which is the charge transfer layer (electron transfer layer), on the light-emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a' on the light-emitting layers 8R, 8G, and 8B side.
  • the rest is as described in the fifth and sixth embodiments.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the fifth and sixth embodiments, and their explanations are omitted.
  • FIG. 15 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1f of embodiment 7, and a non-light-emitting charge-transfer element 6Rb' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Gb' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Bb' with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • the first upper electrode layer 28' and the second upper electrode layer 28a' are one continuous layer formed of the same material, and a resistance adjustment layer 28c' having a resistivity higher than that of the first upper electrode layer 28' and being 1 ⁇ 10 9 ⁇ cm or less is provided between a first surface M1 which is the surface of the electron transport layer 26, which is a charge transfer layer (electron transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a' facing the light-emitting layers 8R
  • the resistance adjustment layer 28c' may be provided between the second upper electrode layer 28a' and the hole injection layer 24, between the hole transport layer 25 and the light-emitting layers 8R, 8G, and 8B, or between the light-emitting layers 8R, 8G, and 8B and the electron transport layer 26, or may be provided at multiple positions among the above positions.
  • the resistance adjustment layer 28c' is provided between the first surface M1, which is the surface of the electron transport layer 26, which is the charge transfer layer (electron transfer layer), on the light-emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a' on the light-emitting layers 8R, 8G, and 8B side, so that the voltage applied between the lower electrode 22' and the second upper electrode layer 28a', which is the anode, is reduced, and the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the electrons e are caused to flow to the second upper electrode layer 28a', which is the anode, and the electrons e accumulated in the non-display area NDA1 can be released.
  • the accumulated electrons e move toward the second upper electrode layer 28a', which is the anode, and it is possible to suppress the accumulation of electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
  • the first upper electrode layer 28' and the second upper electrode layer 28a' are electrically separated, and the second upper electrode layer 28a' is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28', 1 ⁇ 10 9 ⁇ cm or less, and a first voltage is applied to the first upper electrode layer 28' through a first wiring, and a second voltage is applied to the second upper electrode layer 28a' through a second wiring, and the first voltage and the second voltage are the same voltage.
  • This embodiment differs from the fifth to seventh embodiments described above. The rest is as described in the fifth to seventh embodiments.
  • the same reference numerals are used for members having the same functions as the members shown in the drawings of the fifth to seventh embodiments, and their explanations are omitted.
  • FIG. 16 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1g of embodiment 8, and a non-light-emitting charge-transfer element 6R' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B' with a blue light-emitting layer 8B provided in the non-display area NDA1.
  • a groove HOL' for electrically isolating the first upper electrode layer 28' and the second upper electrode layer 28a' is provided in an area including the end DAE of the display area DA, and the first upper electrode layer 28' and the second upper electrode layer 28a' are electrically isolated.
  • the groove HOL' is also provided in the hole transport layer 25 and the hole injection layer 24, but this is not limiting, and the groove HOL' may be provided only between the first upper electrode layer 28' and the second upper electrode layer 28a'.
  • a first upper electrode layer 28' and a second upper electrode layer 28a' are electrically separated, and a second upper electrode layer 28a' is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and being 1 ⁇ 10 9 ⁇ cm or less, a first voltage is applied to the first upper electrode layer 28' via a first wiring, and a second voltage is applied to the second upper electrode layer 28a' via a second wiring, and the first voltage and the second voltage are the same voltage.
  • the display device 1g can prevent the red light-emitting element 5R', green light-emitting element 5G', and blue light-emitting element 5B' provided in the display area DA from being affected by the non-light-emitting charge transfer elements 6R', 6G', and 6B' provided in the non-display area NDA1.
  • the display device 1h of this embodiment is different from the above-described first to eighth embodiments in that an imaging region TH that transmits imaging light is further provided inside the display region DA, and includes a non-display region (first non-display region) NDA1 provided to surround the outer periphery of the display region DA and a non-display region (second non-display region) NDA2 provided to surround the imaging region TH.
  • the rest is as described in the first and second embodiments.
  • the same reference numerals are used for members having the same functions as those shown in the drawings of the first and second embodiments, and their explanations are omitted.
  • FIG. 17 is a plan view showing the schematic configuration of a display device 1h according to embodiment 9.
  • the display device 1h further includes an imaging area TH that transmits imaging light, located inside the display area DA, and includes a non-display area (first non-display area) NDA1 that is provided so as to surround the outer periphery of the display area DA, and a non-display area (second non-display area) NDA2 that is provided so as to surround the imaging area TH.
  • the imaging area TH that transmits imaging light may be a through hole that penetrates from the front surface to the back surface of the display device 1h, or may be an area made only of a transparent material so as to transmit imaging light.
  • the imaging light is arranged so as to overlap with the imaging area TH of the display device 1h in a plan view, and is reflected light from a subject that is necessary for capturing an image with an imaging element (not shown) that is arranged on the back side of the display device 1h.
  • the non-display area NDA1 and the non-display area NDA2 of the display device 1h may each have the same configuration as the non-display area NDA1 described above in embodiment 1, or may each have the same configuration as the non-display area NDA1 described above in embodiment 5.
  • the imaging area TH is circular and the non-display area NDA2 is also formed in a circular shape, but this is not limited to this, and the imaging area TH may be, for example, rectangular, and the non-display area NDA2 may also be formed in a rectangular shape.
  • the non-display area NDA2 is an area where no display is performed, it is preferable that the non-display area NDA2 is not provided wider than necessary. Therefore, when the shape of the pixel PIX is rectangular as in this embodiment, it is preferable that the width of the non-display area NDA2 is formed to be equal to or less than the diagonal length of the pixel PIX.
  • the widths H1', H2', and H3' of the non-display area NDA2 are formed to be equal to or less than the diagonal length of the pixel PIX, but this is not limited thereto, and the widths H1', H2', and H3' of the non-display area NDA2 may be formed to be equal to or less than the width in the second direction D2 of the pixel PIX, or may be formed to be equal to or less than the diagonal length of the pixel PIX.
  • the widths H1', H2', and H3' of the non-display area NDA2 may be formed to be equal to or less than 50 ⁇ m, and it is preferable that they are formed to be equal to or more than 5 ⁇ m and equal to or less than 50 ⁇ m.
  • the display area DA of the display device 1h can be made wider, and the display device 1h can be realized in which the light-emitting elements provided around the end DAE' of the display area DA emit light brighter than intended, suppressing the appearance of bright lines.
  • This disclosure can be used in display devices.

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Abstract

A display device (1) comprises: light emitting elements (5R·5G·5B) provided in respective ones of a plurality of sub-pixels (RSUB·GSUB·BSUB) and including a lower electrode (22), a hole transport layer (25), light emitting layers (8R·8G·8B), and a first upper electrode layer (28) in this order from the side of a substrate (2); and non-light emitting charge-transfer elements (6R·6G·6B) provided in respective ones of a plurality of dummy sub-pixels (DRSUB·DGSUB·SBSUB) and including the lower electrode (22), the hole transport layer (25), the light emitting layers (8R·8G·8B), and the second upper electrode layer (28a) in this order from the substrate (2) side. The non-light emitting charge-transfer elements (6R·6G·6B) comprise a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer (28) and less than or equal to 1×109Ω·cm between a first surface (M1), which is a surface on the light emitting layer (8R·8G·8B) side of the hole transport layer (25), and a second surface (M2), which is a surface on the opposite side of the second upper electrode layer (28a) from the substrate (2).

Description

表示装置Display device
 本開示は、表示装置に関する。 This disclosure relates to a display device.
 近年、発光素子を備えた様々な表示装置が開発されており、特に、OLED(Organic Light Emitting Diode:有機発光ダイオード)または、QLED(Quantum dot Light Emitting Diode:量子ドット発光ダイオード)を備えた表示装置は、低消費電力化、薄型化及び高画質化などを実現できる点から、高い注目を浴びている。 In recent years, various display devices equipped with light-emitting elements have been developed, and display devices equipped with OLEDs (Organic Light Emitting Diodes) or QLEDs (Quantum dot Light Emitting Diodes) in particular have attracted a great deal of attention because of their ability to achieve low power consumption, thinness, and high image quality.
 これらの表示装置の分野においては、発光素子に備えられた下部電極と発光層との間に設けられる電荷移動層(正孔注入層及び正孔輸送層の少なくとも一方、または、電子注入層及び電子輸送層の少なくとも一方)を表示領域の全面に形成する場合が多い。 In the field of these display devices, a charge transfer layer (at least one of a hole injection layer and a hole transport layer, or at least one of an electron injection layer and an electron transport layer) is often formed over the entire display area between the lower electrode and the light-emitting layer of the light-emitting element.
 特許文献1には、OLEDに備えられた下部電極と発光層との間に設けられる電荷移動層として、正孔注入層及び正孔輸送層のそれぞれを表示領域の全面に形成した表示装置について記載されている。 Patent document 1 describes a display device in which a hole injection layer and a hole transport layer are formed over the entire display area as charge transfer layers provided between the lower electrode and the light-emitting layer of an OLED.
日本国公開特許公報「特開2014-164829」Japanese Patent Publication "JP2014-164829"
 特許文献1に記載の表示装置のように、発光素子に備えられた下部電極と発光層との間に設けられる電荷移動層として、正孔注入層及び正孔輸送層の少なくとも一方を表示領域の全面に形成した場合、表示領域の端部周辺に輝線が見えてしまうという問題がある。 As in the display device described in Patent Document 1, when at least one of a hole injection layer and a hole transport layer is formed over the entire display area as a charge transfer layer provided between the lower electrode and the light-emitting layer of the light-emitting element, there is a problem that bright lines are visible around the edges of the display area.
 このような問題は、発光素子に備えられた下部電極と発光層との間に設けられる電荷移動層として、電子注入層及び電子輸送層の少なくとも一方を表示領域の全面に形成した場合にも生じ、表示領域の端部周辺に輝線が見えてしまう。 Such a problem also occurs when at least one of an electron injection layer and an electron transport layer is formed over the entire display area as a charge transfer layer provided between the lower electrode and the light-emitting layer of the light-emitting element, resulting in bright lines being visible around the edges of the display area.
 本開示の一態様は、前記の問題点に鑑みてなされたものであり、発光素子に備えられた下部電極と発光層との間に設けられる電荷移動層が表示領域の全面に形成された場合においても、表示領域の端部周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまう現象を抑制した表示装置を提供することを目的とする。 One aspect of the present disclosure has been made in consideration of the above problems, and aims to provide a display device that suppresses the phenomenon in which light emitting elements provided around the edges of a display area emit light brighter than intended, causing bright lines to become visible, even when a charge transfer layer provided between a lower electrode and a light emitting layer of the light emitting element is formed over the entire display area.
 本開示の表示装置は、前記の課題を解決するために、
 基板と、
 複数のサブ画素を含む画素が複数個備えられた前記基板上の表示領域と、
 前記表示領域の端部に沿って設けられた複数のダミーサブ画素を含み、かつ、前記表示領域から連続する領域である前記基板上の非表示領域と、
 前記表示領域及び前記非表示領域のそれぞれに設けられた複数の下部電極と、
 前記表示領域及び前記非表示領域に跨って設けられた一つの連続層である電荷移動層と、
 前記表示領域に設けられた第1上部電極層と、
 前記非表示領域に設けられた第2上部電極層と、
 前記複数のサブ画素のそれぞれに設けられた、前記下部電極と、前記電荷移動層と、発光層と、前記第1上部電極層とを、前記基板側からこの順に含む発光素子と、
 前記複数のダミーサブ画素のそれぞれに設けられた、前記下部電極と、前記電荷移動層と、発光層と、前記第2上部電極層とを、前記基板側からこの順に含む非発光電荷移動素子と、を含み、
 前記非発光電荷移動素子は、前記電荷移動層の前記発光層側の面である第1の面と、前記第2上部電極層の前記基板とは反対側の面である第2の面との間に、抵抗率が前記第1上部電極層よりは高く、1×10Ω・cm以下である抵抗調整層を備えている。
In order to solve the above problems, the display device of the present disclosure has:
A substrate;
a display region on the substrate, the display region including a plurality of pixels each including a plurality of sub-pixels;
a non-display area on the substrate, the non-display area including a plurality of dummy sub-pixels provided along an edge of the display area and being continuous with the display area;
A plurality of lower electrodes provided in each of the display area and the non-display area;
a charge transport layer which is a single continuous layer provided across the display area and the non-display area;
A first upper electrode layer provided in the display area;
A second upper electrode layer provided in the non-display area;
a light-emitting element provided in each of the plurality of sub-pixels, the light-emitting element including, in this order from the substrate side, the lower electrode, the charge transfer layer, a light-emitting layer, and the first upper electrode layer;
a non-light-emitting charge transfer element provided in each of the plurality of dummy sub-pixels, the non-light-emitting charge transfer element including, in this order from the substrate side, the lower electrode, the charge transfer layer, a light-emitting layer, and the second upper electrode layer;
The non-light-emitting charge transfer element includes a resistance adjustment layer between a first surface of the charge transfer layer facing the light-emitting layer and a second surface of the second upper electrode layer facing away from the substrate, the resistance adjustment layer having a resistivity higher than that of the first upper electrode layer and being 1 x 109 Ω-cm or less.
 本開示の一態様は、前記の問題点に鑑みてなされたものであり、発光素子に備えられた下部電極と発光層との間に設けられる電荷移動層が表示領域の全面に形成された場合においても、表示領域の端部周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまう現象を抑制した表示装置を提供できる。 One aspect of the present disclosure has been made in consideration of the above problems, and provides a display device that suppresses the phenomenon in which light emitting elements provided around the edges of the display area emit light brighter than intended, causing bright lines to be visible, even when a charge transfer layer provided between a lower electrode and a light emitting layer of the light emitting element is formed over the entire display area.
実施形態1の表示装置の概略的な構成を示す平面図である。1 is a plan view showing a schematic configuration of a display device according to a first embodiment. 図1に示す実施形態1の表示装置に備えられた基板の概略的な構成を示す断面図である。2 is a cross-sectional view showing a schematic configuration of a substrate provided in the display device of the first embodiment shown in FIG. 1. 実施形態1の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。1 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 1. FIG. 図3に示す実施形態1の表示装置の表示領域と非表示領域の境界付近の回路図である。4 is a circuit diagram of the vicinity of the boundary between the display area and the non-display area of the display device of the first embodiment shown in FIG. 3. 表示領域の端部周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまう比較例である表示装置の概略的な構成を示す断面図である。FIG. 11 is a cross-sectional view showing a schematic configuration of a display device as a comparative example in which light-emitting elements provided around the edge of a display area emit light brighter than intended, causing visible bright lines. 図5に示す比較例である表示装置の表示領域の端部周辺において輝線が見えてしまう理由を説明するための回路図である。6 is a circuit diagram for explaining the reason why bright lines are visible around the edges of the display area of the display device that is the comparative example shown in FIG. 5 . 実施形態2の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。10 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 2. FIG. 実施形態3の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。11 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 3. FIG. 実施形態4の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。11 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 4. FIG. 実施形態5の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 5. FIG. 図10に示す実施形態5の表示装置の表示領域と非表示領域の境界付近の回路図である。11 is a circuit diagram of the vicinity of the boundary between the display area and the non-display area of the display device of the fifth embodiment shown in FIG. 10. 表示領域の端部周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまう他の比較例である表示装置の概略的な構成を示す断面図である。FIG. 11 is a cross-sectional view showing a schematic configuration of a display device as another comparative example in which light-emitting elements provided around the edge of a display area emit light brighter than intended, resulting in visible bright lines. 図12に示す他の比較例である表示装置の表示領域の端部周辺において輝線が見えてしまう理由を説明するための回路図である。13 is a circuit diagram for explaining the reason why bright lines are visible around the edges of the display area of the display device of the other comparative example shown in FIG. 12. FIG. 実施形態6の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of a display device of embodiment 6. FIG. 実施形態7の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 7. FIG. 実施形態8の表示装置の表示領域に備えられた発光素子と非表示領域に備えられた非発光電荷移動素子の概略的な構成を示す断面図である。13 is a cross-sectional view showing a schematic configuration of a light-emitting element provided in a display region and a non-light-emitting charge transfer element provided in a non-display region of the display device of embodiment 8. FIG. 実施形態9の表示装置の概略的な構成を示す平面図である。FIG. 13 is a plan view showing a schematic configuration of a display device according to a ninth embodiment.
 本開示の実施の形態について、図1から図17に基づいて説明すれば、次の通りである。以下、説明の便宜上、特定の実施形態にて説明した構成と同一の機能を有する構成については、同一の符号を付記し、その説明を省略する場合がある。 The embodiment of the present disclosure will be described below with reference to Figs. 1 to 17. For ease of explanation, configurations having the same functions as those described in specific embodiments will be denoted by the same reference numerals, and descriptions thereof may be omitted.
 〔実施形態1〕
 図1は、実施形態1の表示装置1の概略的な構成を示す平面図である。
[Embodiment 1]
FIG. 1 is a plan view showing a schematic configuration of a display device 1 according to the first embodiment.
 図1に示すように、表示装置1は、基板2と、赤色サブ画素RSUBと緑色サブ画素GSUBと青色サブ画素BSUBとを含む画素PIXが複数個備えられた基板2上の表示領域DAと、表示領域DAの外側に設けられた基板2上の額縁領域GAと、額縁領域GAの一部であるとともに表示領域DAから連続する領域であり、かつ、表示領域DAの端部DAEに沿って設けられた複数のダミーサブ画素(図3参照)を含む基板2上の非表示領域(第1非表示領域)NDA1とを含む。なお、図示してないが、非表示領域NDA1の外側の額縁領域GAには、端子部及び駆動回路などが備えられている。本実施形態においては、1画素PIXが、赤色サブ画素RSUBと、緑色サブ画素GSUBと、青色サブ画素BSUBとで構成される場合を一例に挙げて説明するが、これに限定されることはなく、例えば、1画素PIXは、赤色サブ画素RSUB、緑色サブ画素GSUB及び青色サブ画素BSUBの他に、さらに他の色のサブ画素を含んでいてもよい。 1, the display device 1 includes a substrate 2, a display area DA on the substrate 2 including a plurality of pixels PIX, each of which includes a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel BSUB, a frame area GA on the substrate 2 provided outside the display area DA, and a non-display area (first non-display area) NDA1 on the substrate 2 which is a part of the frame area GA and is continuous with the display area DA, and which includes a plurality of dummy sub-pixels (see FIG. 3) provided along an end DAE of the display area DA. Although not shown, the frame area GA outside the non-display area NDA1 is provided with a terminal section, a drive circuit, etc. In this embodiment, an example will be described in which one pixel PIX is composed of a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel BSUB, but this is not limited to this. For example, one pixel PIX may include subpixels of other colors in addition to the red subpixel RSUB, the green subpixel GSUB, and the blue subpixel BSUB.
 図1に示すように、非表示領域NDA1は額縁領域GAに含まれることから、表示装置1の挟額縁化を実現するためには、非表示領域NDA1は必要以上に広く設けないことが好ましい。したがって、本実施形態のように、画素PIXの形状が矩形である場合には、非表示領域NDA1の幅は画素PIXの対角線の長さ以下で形成されていることが好ましい。本実施形態においては、非表示領域NDA1の幅が画素PIXの対角線の長さ以下となるように、図1に示す非表示領域NDA1の矩形状の右側非表示領域の幅H1及び矩形状の左側非表示領域の幅H1のそれぞれを画素PIXの第1方向D1の幅で形成し、図1に示す非表示領域NDA1の矩形状の上側非表示領域の幅H2及び矩形状の下側非表示領域の幅H2のそれぞれを画素PIXの第2方向D2の幅で形成し、図1に示す非表示領域NDA1の4つの隅、すなわち、矩形状の上側非表示領域と矩形状の右側非表示領域とを結ぶ異形部(右上異形部)の幅H3、矩形状の右側非表示領域と矩形状の下側非表示領域とを結ぶ異形部(右下異形部)の幅H3、矩形状の下側非表示領域と矩形状の左側非表示領域とを結ぶ異形部(左下異形部)の幅H3及び矩形状の左側非表示領域と矩形状の上側非表示領域とを結ぶ異形部(左上異形部)の幅H3のそれぞれを画素PIXの対角線の長さで形成した場合を一例に挙げて説明するがこれに限定されることはない。例えば、非表示領域NDA1の幅は50μm以下で形成されていてもよく、5μm以上、50μm以下で形成されていることが好ましい。非表示領域NDA1の幅を上述した範囲とすることで、表示装置1の挟額縁化を実現できるとともに、表示領域DAの端部DAE周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまうのを抑制した表示装置1を実現できる。 As shown in FIG. 1, since the non-display area NDA1 is included in the frame area GA, in order to realize a narrow frame of the display device 1, it is preferable that the non-display area NDA1 is not made wider than necessary. Therefore, when the shape of the pixel PIX is rectangular as in this embodiment, it is preferable that the width of the non-display area NDA1 is formed to be equal to or less than the length of the diagonal of the pixel PIX. In this embodiment, in order to make the width of the non-display area NDA1 equal to or less than the length of the diagonal of the pixel PIX, the width H1 of the rectangular right non-display area NDA1 shown in FIG. 1 and the width H2 of the rectangular upper non-display area NDA1 shown in FIG. 1 and the width H2 of the rectangular lower non-display area NDA1 shown in FIG. 1 are each formed to be equal to or less than the width of the diagonal of the pixel PIX, and the four corners of the non-display area NDA1 shown in FIG. 1, i.e., the rectangular The width H3 of the irregular part (upper right irregular part) connecting the upper non-display area and the rectangular right non-display area, the width H3 of the irregular part (lower right irregular part) connecting the rectangular right non-display area and the rectangular lower non-display area, the width H3 of the irregular part (lower left irregular part) connecting the rectangular lower non-display area and the rectangular left non-display area, and the width H3 of the irregular part (upper left irregular part) connecting the rectangular left non-display area and the rectangular upper non-display area are each formed with the length of the diagonal of the pixel PIX as an example, but are not limited to this. For example, the width of the non-display area NDA1 may be formed to be 50 μm or less, and is preferably formed to be 5 μm or more and 50 μm or less. By setting the width of the non-display area NDA1 to the above-mentioned range, it is possible to realize a narrow frame of the display device 1, and it is possible to realize a display device 1 that suppresses the light emitting element provided around the end DAE of the display area DA from emitting light brighter than the intended brightness and causing a bright line to be visible.
 本実施形態においては、非表示領域NDA1が表示領域DAを取り囲むように設けられている場合を一例に挙げて説明するが、これに限定されることはなく、非表示領域NDA1は、表示領域DAの少なくとも一部を取り囲むように設けられていればよい。例えば、非表示領域NDA1は、図1に示す表示領域DAの4つの隅のみを取り囲むように設けられていてもよく、図1に示す表示領域DAの4つの隅を除く4辺の少なくとも一つを取り囲むように設けられていてもよい。 In this embodiment, the case where the non-display area NDA1 is arranged to surround the display area DA is described as an example, but this is not limited thereto, and the non-display area NDA1 may be arranged to surround at least a portion of the display area DA. For example, the non-display area NDA1 may be arranged to surround only the four corners of the display area DA shown in FIG. 1, or may be arranged to surround at least one of the four sides excluding the four corners of the display area DA shown in FIG. 1.
 図2は、図1に示す表示装置1に備えられた基板2の概略的な構成を示す断面図である。 FIG. 2 is a cross-sectional view showing the schematic configuration of the substrate 2 provided in the display device 1 shown in FIG. 1.
 図2に示すように、表示装置1に備えられたトランジスタTR1を含む基板2においては、支持基板12上に、バリア層3と、トランジスタTR1を含む薄膜トランジスタ層4とが、支持基板12側からこの順に備えられている。そして、表示装置1の表示領域DA及び非表示領域NDA1のトランジスタTR1を含む基板2の表面には、下部電極22及び下部電極22のエッジ部分を覆うエッジカバー層23が設けられている。 As shown in FIG. 2, in the substrate 2 including the transistor TR1 provided in the display device 1, a barrier layer 3 and a thin-film transistor layer 4 including the transistor TR1 are provided on the support substrate 12 in this order from the support substrate 12 side. In addition, an edge cover layer 23 that covers the lower electrode 22 and the edge portion of the lower electrode 22 is provided on the surface of the substrate 2 including the transistor TR1 in the display area DA and non-display area NDA1 of the display device 1.
 支持基板12は、例えば、ポリイミドなどの樹脂材料からなる樹脂基板であってもよく、ガラス基板であってもよい。本実施形態においては、表示装置1を可撓性表示装置とするため、支持基板12として、ポリイミドなどの樹脂材料からなる樹脂基板を用いた場合を一例に挙げて説明するが、これに限定されることはない。表示装置1を非可撓性表示装置とする場合には、支持基板12として、ガラス基板を用いることができる。 The support substrate 12 may be, for example, a resin substrate made of a resin material such as polyimide, or a glass substrate. In this embodiment, in order to make the display device 1 a flexible display device, a case in which a resin substrate made of a resin material such as polyimide is used as the support substrate 12 will be described as an example, but this is not limited to this. If the display device 1 is a non-flexible display device, a glass substrate can be used as the support substrate 12.
 バリア層3は、水、酸素などの異物がトランジスタTR1及び後述する各色の発光素子に侵入することを防ぐ層であり、例えば、化学的蒸着(CVD)法により形成される、酸化シリコン膜、窒化シリコン膜、あるいは酸窒化シリコン膜、またはこれらの積層膜で構成することができる。 The barrier layer 3 is a layer that prevents foreign substances such as water and oxygen from penetrating the transistor TR1 and the light-emitting elements of each color described below, and can be composed of, for example, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film, or a laminate film of these, formed by a chemical vapor deposition (CVD) method.
 トランジスタTR1を含む薄膜トランジスタ層4のトランジスタTR1部分は、半導体膜SEM及びドープされた半導体膜SEM’・SEM’’と、無機絶縁膜16と、ゲート電極Gと、無機絶縁膜18と、無機絶縁膜20と、ソース電極S及びドレイン電極Dと、平坦化膜21とを含み、トランジスタTR1を含む薄膜トランジスタ層4のトランジスタTR1部分以外の部分は、無機絶縁膜16と、無機絶縁膜18と、無機絶縁膜20と、平坦化膜21とを含む。 The transistor TR1 portion of the thin-film transistor layer 4 including the transistor TR1 includes the semiconductor film SEM and doped semiconductor films SEM' and SEM'', the inorganic insulating film 16, the gate electrode G, the inorganic insulating film 18, the inorganic insulating film 20, the source electrode S and the drain electrode D, and the planarization film 21, and the portion of the thin-film transistor layer 4 including the transistor TR1 other than the transistor TR1 portion includes the inorganic insulating film 16, the inorganic insulating film 18, the inorganic insulating film 20, and the planarization film 21.
 半導体膜SEM・SEM’・SEM’’は、例えば、低温ポリシリコン(LTPS)あるいは酸化物半導体(例えば、In-Ga-Zn-O系の半導体)で構成してもよい。本実施形態においては、トランジスタTR1がトップゲート構造である場合を一例に挙げて説明するが、これに限定されることはなく、トランジスタTR1は、ボトムゲート構造であってもよい。 The semiconductor films SEM, SEM', and SEM'' may be made of, for example, low-temperature polysilicon (LTPS) or an oxide semiconductor (for example, an In-Ga-Zn-O-based semiconductor). In this embodiment, the case where the transistor TR1 has a top-gate structure is described as an example, but this is not limiting, and the transistor TR1 may have a bottom-gate structure.
 ゲート電極Gと、ソース電極S及びドレイン電極Dとは、例えば、アルミニウム、タングステン、モリブデン、タンタル、クロム、チタン、銅の少なくとも1つを含む金属の単層膜あるいは積層膜によって構成できる。 The gate electrode G and the source and drain electrodes S and D can be formed of a single layer or a multilayer film of a metal containing at least one of aluminum, tungsten, molybdenum, tantalum, chromium, titanium, and copper, for example.
 無機絶縁膜16、無機絶縁膜18及び無機絶縁膜20は、例えば、化学的蒸着(CVD)法によって形成された、酸化シリコン膜、窒化シリコン膜、酸窒化シリコン膜または、これらの積層膜によって構成することができる。 Inorganic insulating film 16, inorganic insulating film 18, and inorganic insulating film 20 can be composed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminate film of these films formed by a chemical vapor deposition (CVD) method.
 平坦化膜21は、例えば、ポリイミド、アクリルなどの塗布可能な有機材料によって構成することができる。 The planarization film 21 can be made of a coatable organic material such as polyimide or acrylic.
 なお、下部電極22のエッジを覆う絶縁性のエッジカバー層23は、例えば、ポリイミドまたはアクリルなどの有機材料を塗布した後にフォトリソグラフィー法によってパターニングすることで形成できる。 The insulating edge cover layer 23 that covers the edge of the lower electrode 22 can be formed, for example, by applying an organic material such as polyimide or acrylic and then patterning it using a photolithography method.
 図2に示すように、複数の下部電極22のそれぞれを制御するトランジスタTR1を含む制御回路が、トランジスタTR1を含む薄膜トランジスタ層4に設けられている。 As shown in FIG. 2, a control circuit including a transistor TR1 that controls each of the multiple lower electrodes 22 is provided in the thin-film transistor layer 4 that includes the transistor TR1.
 図3は、実施形態1の表示装置1の表示領域DAに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bと、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6R、緑色発光層8Gを備えた非発光電荷移動素子6G及び青色発光層8Bを備えた非発光電荷移動素子6Bの概略的な構成を示す断面図である。 FIG. 3 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1 of embodiment 1, and a non-light-emitting charge-transfer element 6R with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図3に示すように、表示装置1の表示領域DAに備えられた赤色サブ画素RSUBは、赤色発光層8Rを含む赤色発光素子5Rを含み、表示装置1の表示領域DAに備えられた緑色サブ画素GSUBは、緑色発光層8Gを含む緑色発光素子5Gを含み、表示装置1の表示領域DAに備えられた青色サブ画素BSUBは、青色発光層8Bを含む青色発光素子5Bを含む。赤色発光素子5Rは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、赤色発光層8Rと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28とを含み、緑色発光素子5Gは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、緑色発光層8Gと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28とを含み、青色発光素子5Bは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、青色発光層8Bと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28と、を含む。 As shown in FIG. 3, the red subpixel RSUB provided in the display area DA of the display device 1 includes a red light-emitting element 5R including a red light-emitting layer 8R, the green subpixel GSUB provided in the display area DA of the display device 1 includes a green light-emitting element 5G including a green light-emitting layer 8G, and the blue subpixel BSUB provided in the display area DA of the display device 1 includes a blue light-emitting element 5B including a blue light-emitting layer 8B. The red light-emitting element 5R includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode. The green light-emitting element 5G includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode. The blue light-emitting element 5B includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
 また、図3に示す表示装置1の赤色発光素子5Rに備えられた下部電極22と赤色発光層8Rとの間と、緑色発光素子5Gに備えられた下部電極22と緑色発光層8Gとの間と、青色発光素子5Bに備えられた下部電極22と青色発光層8Bとの間とには、表示領域DA及び非表示領域NDA1に跨って設けられた一つの連続層である電荷移動層、例えば、表示領域DA及び非表示領域NDA1の全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25が設けられている。本実施形態においては、表示領域DA及び非表示領域NDA1の全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25の両方が設けられている場合を一例に挙げて説明するが、これに限定されることはなく、表示領域DA及び非表示領域NDA1の全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25の一方のみが設けられていてもよい。 In addition, between the lower electrode 22 and red light-emitting layer 8R of the red light-emitting element 5R of the display device 1 shown in Figure 3, between the lower electrode 22 and green light-emitting layer 8G of the green light-emitting element 5G, and between the lower electrode 22 and blue light-emitting layer 8B of the blue light-emitting element 5B, a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer that is a single continuous layer provided across the display area DA and the non-display area NDA1, for example, as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1. In this embodiment, an example is given in which both the hole injection layer 24 and the hole transport layer 25 are provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1, but this is not limited to this, and only one of the hole injection layer 24 and the hole transport layer 25 may be provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA and the non-display area NDA1.
 本実施形態においては、図3に示すように、表示装置1の非表示領域NDA1に備えられた、第1ダミーサブ画素DRSUBには、基板2上に、基板2側から、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、赤色発光層8Rと、電子輸送層26と、電子注入層27と、カソードである第2上部電極層28aとが、この順に積層された順積構造の非発光電荷移動素子6Rが設けられており、第2ダミーサブ画素DGSUBには、基板2上に、基板2側から、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、緑色発光層8Gと、電子輸送層26と、電子注入層27と、カソードである第2上部電極層28aとが、この順に積層された順積構造の非発光電荷移動素子6Gが設けられており、第3ダミーサブ画素DBSUBには、基板2上に、基板2側から、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、青色発光層8Bと、電子輸送層26と、電子注入層27と、カソードである第2上部電極層28aとが、この順に積層された順積構造の非発光電荷移動素子6Bが設けられている場合を一例に挙げて説明するが、これに限定されることはない。例えば、表示装置1の非表示領域NDA1には、順積構造の非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUB、順積構造の非発光電荷移動素子6Gを含む第2ダミーサブ画素DGSUB及び順積構造の非発光電荷移動素子6Bを含む第3ダミーサブ画素DBSUBのうち1つまたは2つのみが備えられていてもよい。また、順積構造の非発光電荷移動素子6R・6G・6Bにおいては、正孔注入層24及び正孔輸送層25の一方を省いてもよい。 In this embodiment, as shown in FIG. 3, the first dummy subpixel DRSUB provided in the non-display area NDA1 of the display device 1 is provided with a non-light-emitting charge transfer element 6R having a forward stack structure in which, from the substrate 2 side, a lower electrode 22 as an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a as a cathode are stacked in this order on the substrate 2, and the second dummy subpixel DGSUB is provided with a non-light-emitting charge transfer element 6R having a forward stack structure in which, from the substrate 2 side, a lower electrode 22 as an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a as a cathode are stacked in this order on the substrate 2. A non-light-emitting charge transfer element 6G is provided in which a color light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a which is a cathode are stacked in this order, and the third dummy subpixel DBSUB is provided on the substrate 2 with a non-light-emitting charge transfer element 6B in a forward stack structure in which, from the substrate 2 side, a lower electrode 22 which is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a second upper electrode layer 28a which is a cathode are stacked in this order, but the present invention is not limited to this. For example, the non-display area NDA1 of the display device 1 may include only one or two of the first dummy subpixel DRSUB including a non-light-emitting charge transfer element 6R having a forward stack structure, the second dummy subpixel DGSUB including a non-light-emitting charge transfer element 6G having a forward stack structure, and the third dummy subpixel DBSUB including a non-light-emitting charge transfer element 6B having a forward stack structure. In addition, in the non-light-emitting charge transfer elements 6R, 6G, and 6B having a forward stack structure, one of the hole injection layer 24 and the hole transport layer 25 may be omitted.
 以上のように、表示装置1の表示領域DA及び非表示領域NDA1に跨って設けられた一つの連続層である電荷移動層(正孔移動層)は、正孔注入層24及び正孔輸送層25の少なくとも一方であればよい。 As described above, the charge transfer layer (hole transfer layer), which is a continuous layer provided across the display area DA and non-display area NDA1 of the display device 1, may be at least one of the hole injection layer 24 and the hole transport layer 25.
 また、表示装置1の表示領域DAの発光層8R・8G・8Bと第1上部電極層28との間と、表示装置1の非表示領域NDA1の発光層8R・8G・8Bと第2上部電極層28aとの間には、電子輸送層26及び電子注入層27の少なくとも一方が設けられていてもよく、電子輸送層26及び電子注入層27の両方を省いてもよい。 In addition, at least one of the electron transport layer 26 and the electron injection layer 27 may be provided between the light-emitting layers 8R, 8G, and 8B in the display area DA of the display device 1 and the first upper electrode layer 28, and between the light-emitting layers 8R, 8G, and 8B in the non-display area NDA1 of the display device 1 and the second upper electrode layer 28a, or both the electron transport layer 26 and the electron injection layer 27 may be omitted.
 本実施形態においては、表示装置1の表示領域DAに設けられた電荷移動層(正孔移動層)と、表示装置1の非表示領域NDA1に設けられた電荷移動層(正孔移動層)とは、同一材料で形成されている。すなわち、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(正孔移動層)が正孔注入層24のみである場合には、表示領域DAに設けられた正孔注入層24と非表示領域NDA1に設けられた正孔注入層24とが同一材料で形成されており、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(正孔移動層)が正孔輸送層25のみである場合には、表示領域DAに設けられた正孔輸送層25と非表示領域NDA1に設けられた正孔輸送層25とが同一材料で形成されており、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(正孔移動層)が正孔注入層24と正孔輸送層25とである場合には、表示領域DAに設けられた正孔注入層24及び正孔輸送層25のそれぞれと非表示領域NDA1に設けられた正孔注入層24及び正孔輸送層25のそれぞれとが同一材料で形成されている。 In this embodiment, the charge transfer layer (hole transfer layer) provided in the display area DA of the display device 1 and the charge transfer layer (hole transfer layer) provided in the non-display area NDA1 of the display device 1 are formed of the same material. That is, when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is only the hole injection layer 24, the hole injection layer 24 provided in the display area DA and the hole injection layer 24 provided in the non-display area NDA1 are made of the same material, when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is only the hole transport layer 25, the hole transport layer 25 provided in the display area DA and the hole transport layer 25 provided in the non-display area NDA1 are made of the same material, and when the charge transfer layer (hole transfer layer) provided in the display area DA and the non-display area NDA1 is the hole injection layer 24 and the hole transport layer 25, the hole injection layer 24 and the hole transport layer 25 provided in the display area DA and the hole injection layer 24 and the hole transport layer 25 provided in the non-display area NDA1 are each made of the same material.
 これに限定されることはなく、表示装置1の表示領域DAに設けられた電荷移動層(正孔移動層)と、表示装置1の非表示領域NDA1に設けられた電荷移動層(正孔移動層)とは、表示領域DAから非表示領域NDA1への正孔の移動が可能である一つの連続層であれば、異なる材料で形成されていてもよい。 Without being limited to this, the charge transfer layer (hole transfer layer) provided in the display area DA of the display device 1 and the charge transfer layer (hole transfer layer) provided in the non-display area NDA1 of the display device 1 may be formed of different materials as long as they are one continuous layer that allows holes to move from the display area DA to the non-display area NDA1.
 また、本実施形態においては、赤色サブ画素RSUBと第1ダミーサブ画素DRSUBとを同一形状で形成し、緑色サブ画素GSUBと第2ダミーサブ画素DGSUBとを同一形状で形成し、青色サブ画素BSUBと第3ダミーサブ画素DBSUBとを同一形状で形成した場合を一例に挙げて説明するが、これに限定されることはない。例えば、表示領域DAに備えられたサブ画素と、非表示領域NDA1に備えられたダミーサブ画素とは、異なる形状であってもよい。 In addition, in this embodiment, a case is described in which the red subpixel RSUB and the first dummy subpixel DRSUB are formed in the same shape, the green subpixel GSUB and the second dummy subpixel DGSUB are formed in the same shape, and the blue subpixel BSUB and the third dummy subpixel DBSUB are formed in the same shape, but this is not limiting. For example, the subpixels provided in the display area DA and the dummy subpixels provided in the non-display area NDA1 may have different shapes.
 図3に示す赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bの場合、アノードである下部電極22は可視光を反射する電極材料で形成し、カソードである第1上部電極層28は可視光を透過する電極材料で形成し、上方である第1上部電極層28側から光を出すトップエミッション型の発光素子としてもよく、アノードである下部電極22は可視光を透過する電極材料で形成し、カソードである第1上部電極層28は可視光を反射する電極材料で形成し、下方である基板2側から光を出すボトムエミッション型の発光素子としてもよい。 In the case of the red light-emitting element 5R, green light-emitting element 5G, and blue light-emitting element 5B shown in FIG. 3, the lower electrode 22 as the anode may be formed from an electrode material that reflects visible light, and the first upper electrode layer 28 as the cathode may be formed from an electrode material that transmits visible light, to form a top-emission type light-emitting element that emits light from the upper side, that is, the first upper electrode layer 28 side, or the lower electrode 22 as the anode may be formed from an electrode material that transmits visible light, and the first upper electrode layer 28 as the cathode may be formed from an electrode material that reflects visible light, to form a bottom-emission type light-emitting element that emits light from the lower side, that is, the substrate 2 side.
 赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bがトップエミッション型の発光素子である場合、図3に示す非発光電荷移動素子6R・6G・6Bに備えられたアノードである下部電極22は可視光を反射する電極材料で形成し、カソードである第2上部電極層28aは、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層であるならば、可視光を透過する電極材料で形成されてもよく、可視光を反射する電極材料で形成されてもよい。 When the red light-emitting element 5R, the green light-emitting element 5G, and the blue light-emitting element 5B are top-emission type light-emitting elements, the lower electrode 22 serving as the anode provided in the non-light-emitting charge transfer elements 6R, 6G, and 6B shown in FIG. 3 is formed of an electrode material that reflects visible light, and the second upper electrode layer 28a serving as the cathode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1×10 9 Ω·cm or less, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
 一方、赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bがボトムエミッション型の発光素子である場合、図3に示す非発光電荷移動素子6R・6G・6Bに備えられたアノードである下部電極22は可視光を透過する電極材料で形成し、カソードである第2上部電極層28aは、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層であるならば、可視光を透過する電極材料で形成されてもよく、可視光を反射する電極材料で形成されてもよい。 On the other hand, when the red light-emitting element 5R, the green light-emitting element 5G, and the blue light-emitting element 5B are bottom-emission type light-emitting elements, the lower electrode 22 serving as the anode provided in the non-light-emitting charge transfer elements 6R, 6G, and 6B shown in FIG. 3 is formed of an electrode material that transmits visible light, and the second upper electrode layer 28a serving as the cathode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and not more than 1×10 9 Ω cm, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
 可視光を反射する電極材料としては、可視光を反射でき、導電性を有するのであれば、特に限定されないが、例えば、Al、Mg、Li、Agなどの金属材料または、前記金属材料の合金、前記金属材料と透明金属酸化物(例えば、indium tin oxide、indium zinc oxide、indium gallium zinc oxideなど)との積層体または、前記合金と前記透明金属酸化物との積層体などを用いることができる。 The electrode material that reflects visible light is not particularly limited as long as it can reflect visible light and has electrical conductivity. For example, metal materials such as Al, Mg, Li, Ag, etc., alloys of the above metal materials, laminates of the above metal materials and transparent metal oxides (e.g., indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc.), or laminates of the above alloys and the above transparent metal oxides can be used.
 一方、可視光を透過する電極材料としては、可視光を透過でき、導電性を有するのであれば、特に限定されないが、例えば、透明金属酸化物(例えば、indium tin oxide、indium zinc oxide、indium gallium zinc oxideなど)、Al、Mg、Li、Agなどの金属材料からなる薄膜などを用いることができる。 On the other hand, the electrode material that transmits visible light is not particularly limited as long as it can transmit visible light and has electrical conductivity, but examples that can be used include transparent metal oxides (e.g., indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc.), and thin films made of metal materials such as Al, Mg, Li, and Ag.
 図3に示す本実施形態の表示装置1においては、トップエミッション型の発光素子を備えた表示装置を実現するため、アノードである下部電極22としてAgと透明金属酸化物(例えば、indium tin oxide)とが基板2側からこの順に積層された可視光を反射する電極材料を、カソードである第1上部電極層28としてAl薄膜(抵抗率ρ:2.65×10-8Ω・cm)を、カソードである第2上部電極層28aとしてTi膜(抵抗率ρ:4.20×10-7Ω・cm)を、それぞれ用いた場合を一例に挙げて説明するが、これに限定されることはない。例えば、カソードである第1上部電極層28としてAg薄膜(抵抗率ρ:1.59×10-8Ω・cm)またはMg薄膜(抵抗率ρ:4.42×10-8Ω・cm)などを用いてもよく、カソードである第2上部電極層28aとしてCr膜(抵抗率ρ:1.29×10-7Ω・cm)またはNi膜(抵抗率ρ:6.99×10-8Ω・cm)などを用いてもよい。 In the display device 1 of this embodiment shown in Figure 3, in order to realize a display device equipped with top-emission type light-emitting elements, an electrode material that reflects visible light, in which Ag and a transparent metal oxide (e.g., indium tin oxide) are laminated in this order from the substrate 2 side, is used as the lower electrode 22 which is the anode, an Al thin film (resistivity ρ: 2.65 x 10 -8 Ω·cm) is used as the first upper electrode layer 28 which is the cathode, and a Ti film (resistivity ρ: 4.20 x 10 -7 Ω·cm) is used as the second upper electrode layer 28a which is the cathode, will be described as an example, but the present invention is not limited to this. For example, an Ag thin film (resistivity ρ: 1.59× 10-8 Ω·cm) or an Mg thin film (resistivity ρ: 4.42× 10-8 Ω·cm) may be used as the first upper electrode layer 28, which is the cathode, and a Cr film (resistivity ρ: 1.29× 10-7 Ω·cm) or an Ni film (resistivity ρ: 6.99× 10-8 Ω·cm) may be used as the second upper electrode layer 28a, which is the cathode.
 上述した抵抗調整層は、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下であればよいので、例えば、半導電性材料(抵抗率ρ:1×10Ω・cm以上、1×10Ω・cm以下)で形成されてもよい。半導電性材料としては、例えば、抵抗率が1×10Ω・cm以上、1×10Ω・cm以下となるような量の導電剤を含んだ高分子材料などを一例に挙げることができるが、これに限定されることはない。 The resistance adjustment layer described above only needs to have a resistivity higher than that of the first upper electrode layer 28 and equal to or less than 1×10 9 Ω·cm, and may be formed of, for example, a semiconductive material (resistivity ρ: 1×10 5 Ω·cm or more and 1×10 9 Ω·cm or less). An example of the semiconductive material is, for example, a polymer material containing a conductive agent in an amount such that the resistivity is 1×10 5 Ω·cm or more and 1×10 9 Ω·cm or less, but is not limited thereto.
 図3に示す本実施形態の表示装置1においては、非発光電荷移動素子6R・6G・6Bが、電荷移動層(正孔移動層)、例えば、正孔輸送層25の発光層8R・8G・8B側の面である第1の面M1と、第2上部電極層28aの基板2とは反対側の面である第2の面M2との間に、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層を備えている場合の一例として、第1上部電極層28と第2上部電極層28aとは電気的に接続されており、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28aである場合を挙げて説明するが、これに限定されることはない。例えば、後述する実施形態3(図8参照)のように、第1上部電極層28と第2上部電極層28aとは、同一材料で形成された一つの連続層であり、正孔輸送層25の発光層8R・8G・8B側の面である第1の面M1と、第2上部電極層28aの発光層8R・8G・8B側の面である第3の面M3との間に、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層28cを備えていてもよい。 In the display device 1 of this embodiment shown in Figure 3, the non-light-emitting charge transfer elements 6R, 6G, 6B have a charge transfer layer (hole transfer layer), for example, a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and 1 x 10 9 Ω-cm or less between a first surface M1, which is the surface of the hole transport layer 25 facing the light-emitting layers 8R, 8G, 8B , and a second surface M2, which is the surface of the second upper electrode layer 28a opposite the substrate 2.As an example of this case, the first upper electrode layer 28 and the second upper electrode layer 28a are electrically connected, and the resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and 1 x 10 9 Ω-cm or less is the second upper electrode layer 28a, but this is not limited to this. For example, as in a third embodiment (see FIG. 8 ) described later, the first upper electrode layer 28 and the second upper electrode layer 28a are a single continuous layer made of the same material, and a resistance adjustment layer 28c having a resistivity higher than that of the first upper electrode layer 28 and equal to or less than 1×10 9 Ω cm may be provided between a first surface M1, which is the surface of the hole transport layer 25 facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3, which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G , and 8B.
 正孔注入層24に用いられる材料としては、赤色発光層8R、緑色発光層8G及び青色発光層8B内への正孔の注入を安定化させることができる正孔注入性材料であれば特に限定されるものではない。例えば、PEDOTを一例として挙げることができるがこれに限定されることはない。 The material used for the hole injection layer 24 is not particularly limited as long as it is a hole injection material that can stabilize the injection of holes into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B. For example, PEDOT can be given as an example, but is not limited to this.
 正孔輸送層25に用いられる材料としては、アノードである下部電極22から注入された正孔を赤色発光層8R、緑色発光層8G及び青色発光層8B内へ輸送することができる正孔輸送性材料であれば特に限定されない。中でも、正孔輸送性材料は、正孔易動度が高いものであることが好ましい。例えば、TFB(ADS)を一例として挙げることができるがこれに限定されることはない。 The material used for the hole transport layer 25 is not particularly limited as long as it is a hole transport material that can transport holes injected from the lower electrode 22, which is the anode, into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B. In particular, it is preferable for the hole transport material to have high hole mobility. For example, TFB (ADS) can be given as an example, but the material is not limited to this.
 電子輸送層26に用いられる材料としては、カソードである第1上部電極層28または第2上部電極層28aから注入された電子を赤色発光層8R、緑色発光層8G及び青色発光層8B内へ輸送することが可能な電子輸送性材料であれば特に限定されない。中でも、電子輸送性材料は、電子易動度が高いものであることが好ましい。例えば、ZnMgOを一例として挙げることができるがこれに限定されることはない。 The material used for the electron transport layer 26 is not particularly limited as long as it is an electron transport material capable of transporting electrons injected from the first upper electrode layer 28 or the second upper electrode layer 28a, which is the cathode, into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B. In particular, it is preferable that the electron transport material has high electron mobility. For example, ZnMgO can be given as an example, but the present invention is not limited to this.
 電子注入層27に用いられる材料としては、赤色発光層8R、緑色発光層8G及び青色発光層8B内への電子の注入を安定化させることができる電子注入性材料であれば特に限定されるものではない。例えば、電子注入性材料としては、アルミニウム、ストロンチウム、カルシウム、リチウム、セシウム、酸化マグネシウム、酸化アルミニウム、酸化ストロンチウム、酸化リチウム、フッ化リチウム、フッ化マグネシウム、フッ化ストロンチウム、フッ化カルシウム、フッ化バリウム、フッ化セシウム、ポリメチルメタクリレートポリスチレンスルホン酸ナトリウムなどのようなアルカリ金属またはアルカリ土類金属、アルカリ金属またはアルカリ土類金属の酸化物、アルカリ金属またはアルカリ土類金属のフッ化物、アルカリ金属の有機錯体などを挙げることができる。 The material used for the electron injection layer 27 is not particularly limited as long as it is an electron injection material that can stabilize the injection of electrons into the red light-emitting layer 8R, the green light-emitting layer 8G, and the blue light-emitting layer 8B. For example, examples of the electron injection material include alkali metals or alkaline earth metals such as aluminum, strontium, calcium, lithium, cesium, magnesium oxide, aluminum oxide, strontium oxide, lithium oxide, lithium fluoride, magnesium fluoride, strontium fluoride, calcium fluoride, barium fluoride, cesium fluoride, polymethyl methacrylate polystyrene sodium sulfonate, oxides of alkali metals or alkaline earth metals, fluorides of alkali metals or alkaline earth metals, organic complexes of alkali metals, etc.
 なお、第1上部電極層28及び第2上部電極層28a上に設けられた封止層29は、透光性膜であり、例えば、第1上部電極層28及び第2上部電極層28aを覆う無機封止膜と、前記無機封止膜よりも上層の有機膜と、前記有機膜よりも上層の無機封止膜とで構成することができる。封止層29は、水、酸素などの各色の発光素子への浸透を防いでいる。 The sealing layer 29 provided on the first upper electrode layer 28 and the second upper electrode layer 28a is a light-transmitting film, and can be composed of, for example, an inorganic sealing film covering the first upper electrode layer 28 and the second upper electrode layer 28a, an organic film above the inorganic sealing film, and an inorganic sealing film above the organic film. The sealing layer 29 prevents the penetration of water, oxygen, etc. into the light-emitting elements of each color.
 図3に示すように、表示装置1によれば、電荷移動層(正孔移動層)である正孔注入層24及び正孔輸送層25の少なくとも一方を介して表示領域DAから非表示領域NDA1に移動した正孔Hが行き場のない非表示領域NDA1に溜まっていく。非表示領域NDA1に備えられた非発光電荷移動素子6R・6G・6Bによれば、上述したように、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層として第2上部電極層28aを備えていることで、下部電極22と第2上部電極層28aとの間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、正孔Hを第2上部電極層28aに流し、非表示領域NDA1に溜まった正孔Hを逃がすことができる。すなわち、非発光電荷移動素子6R・6G・6Bにおいては、下部電極22と第2上部電極層28aとの間に印加される電圧が、発光層8R・8G・8Bにおける正孔Hと電子eの再結合に必要なエネルギーよりも小さいため、発光を抑制できるとともに、正孔Hを第2上部電極層28aに流すことができる。このように溜まった正孔Hが第2上部電極層28a方向に移動し、非表示領域NDA1に正孔Hが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 3, according to the display device 1, the holes H+ that have moved from the display area DA to the non-display area NDA1 through at least one of the charge transfer layer (hole transfer layer) hole injection layer 24 and the hole transport layer 25 are accumulated in the non-display area NDA1 where they have nowhere to go. According to the non-light-emitting charge transfer elements 6R, 6G, and 6B provided in the non-display area NDA1, as described above, the second upper electrode layer 28a is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1×10 9 Ω·cm or less, and therefore, due to a decrease in the voltage applied between the lower electrode 22 and the second upper electrode layer 28a, the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the holes H + are allowed to flow to the second upper electrode layer 28a, allowing the holes H + accumulated in the non-display area NDA1 to escape. That is, in the non-light-emitting charge transfer elements 6R, 6G, and 6B, the voltage applied between the lower electrode 22 and the second upper electrode layer 28a is smaller than the energy required for recombination of the holes H + and the electrons e in the light-emitting layers 8R, 8G, and 8B, so that light emission can be suppressed and the holes H + can flow to the second upper electrode layer 28a. In this way, the accumulated holes H + move toward the second upper electrode layer 28a, and it is possible to suppress the accumulation of the holes H + in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
 図4は、図3に示す表示装置1の表示領域DAと非表示領域NDA1の境界付近の回路図である。 FIG. 4 is a circuit diagram of the display device 1 shown in FIG. 3 near the boundary between the display area DA and the non-display area NDA1.
 図4は、表示装置1の表示領域DAに備えられた青色発光素子5Bを含む青色サブ画素BSUBの駆動回路と、青色発光素子5Bと隣接する表示装置1の非表示領域NDA1に備えられた非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUBの駆動回路との概略的な回路構成を示す。なお、青色発光素子5Bを含む青色サブ画素BSUBの駆動回路及び非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUBの駆動回路は、図3に示す基板2に備えられる。 FIG. 4 shows a schematic circuit configuration of a drive circuit for a blue subpixel BSUB including a blue light-emitting element 5B provided in the display area DA of the display device 1, and a drive circuit for a first dummy subpixel DRSUB including a non-light-emitting charge transfer element 6R provided in the non-display area NDA1 of the display device 1 adjacent to the blue light-emitting element 5B. The drive circuit for the blue subpixel BSUB including the blue light-emitting element 5B and the drive circuit for the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R are provided on the substrate 2 shown in FIG. 3.
 図4に示すように、青色発光素子5Bと隣接する表示装置1の非表示領域NDA1に備えられた非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUBの駆動回路は、1個の非発光電荷移動素子6Rと、2個のトランジスタTR1~TR2と、1個の保持キャパシタC1とを含む。図示してないが、表示装置1の表示領域DAに備えられた青色発光素子5Bを含む青色サブ画素BSUBの駆動回路は、非発光電荷移動素子6Rの代わりに青色発光素子5Bを含む点以外は、上述した非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUBの駆動回路と同様の構成である。 As shown in FIG. 4, the drive circuit of the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R provided in the non-display area NDA1 of the display device 1 adjacent to the blue light-emitting element 5B includes one non-light-emitting charge transfer element 6R, two transistors TR1-TR2, and one holding capacitor C1. Although not shown, the drive circuit of the blue subpixel BSUB including the blue light-emitting element 5B provided in the display area DA of the display device 1 has the same configuration as the drive circuit of the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R described above, except that it includes the blue light-emitting element 5B instead of the non-light-emitting charge transfer element 6R.
 図4に示す非発光電荷移動素子6Rを含む第1ダミーサブ画素DRSUBの駆動回路においては、駆動トランジスタであるトランジスタTR1のドレイン電極は非発光電荷移動素子6Rの下部電極22と電気的に接続されており、トランジスタTR1のゲート電極は保持キャパシタC1の一方側の電極と選択トランジスタであるトランジスタTR2のドレイン電極とに電気的に接続されており、トランジスタTR1のソース電極は保持キャパシタC1の他方側の電極と電源回路(図示せず)からハイレベル電源電圧ELVDDが供給されるELVDD配線VLと電気的に接続されている。なお、青色発光素子5Bの第1上部電極層28と非発光電荷移動素子6R・6G・6Bの上述した抵抗調整層である第2上部電極層28aとは、図示してないが、電源回路からローレベル電源電圧ELVSSが供給されるELVSS配線と電気的に接続されている。また、選択トランジスタであるトランジスタTR2のソース電極は図示していないデータ側駆動回路から出力されるデータ信号が供給されるデータ信号線DLと電気的に接続されており、トランジスタTR2のゲート電極は図示していない走査側駆動回路から出力される走査信号が供給される走査信号線SLと電気的に接続されており、トランジスタTR2のドレイン電極はトランジスタTR1のゲート電極と保持キャパシタC1の一方側の電極とに電気的に接続されている。 4, in the drive circuit of the first dummy subpixel DRSUB including the non-light-emitting charge transfer element 6R, the drain electrode of transistor TR1, which is the drive transistor, is electrically connected to the lower electrode 22 of the non-light-emitting charge transfer element 6R, the gate electrode of transistor TR1 is electrically connected to one electrode of the holding capacitor C1 and the drain electrode of transistor TR2, which is the selection transistor, and the source electrode of transistor TR1 is electrically connected to the other electrode of the holding capacitor C1 and an ELVDD wiring VL to which a high-level power supply voltage ELVDD is supplied from a power supply circuit (not shown). Note that the first upper electrode layer 28 of the blue light-emitting element 5B and the second upper electrode layer 28a, which is the above-mentioned resistance adjustment layer of the non-light-emitting charge transfer elements 6R, 6G, and 6B, are electrically connected to an ELVSS wiring (not shown) to which a low-level power supply voltage ELVSS is supplied from the power supply circuit. In addition, the source electrode of transistor TR2, which is a selection transistor, is electrically connected to a data signal line DL to which a data signal output from a data side driving circuit (not shown) is supplied, the gate electrode of transistor TR2 is electrically connected to a scanning signal line SL to which a scanning signal output from a scanning side driving circuit (not shown) is supplied, and the drain electrode of transistor TR2 is electrically connected to the gate electrode of transistor TR1 and one electrode of holding capacitor C1.
 表示領域DA及び非表示領域NDA1に、電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25が設けられている図3及び図4に示す表示装置1においては、上述したように、表示装置1の非表示領域NDA1に非発光電荷移動素子6R・6G・6Bが設けられているので、表示装置1の非表示領域NDA1の近くに設けられる表示領域DAの端部周辺に輝線が生じるのを抑制することができる。 In the display device 1 shown in Figures 3 and 4, in which the display area DA and non-display area NDA1 are provided with a hole injection layer 24 and a hole transport layer 25 as charge transfer layers (hole transfer layers), as described above, the non-light-emitting charge transfer elements 6R, 6G, and 6B are provided in the non-display area NDA1 of the display device 1, so that it is possible to prevent bright lines from appearing around the edges of the display area DA that is provided near the non-display area NDA1 of the display device 1.
 図5は、表示領域DAの端部周辺DAERに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bで、意図した輝度より明るく発光してしまい、輝線が見えてしまう比較例である表示装置100の概略的な構成を示す断面図である。 FIG. 5 is a cross-sectional view showing the schematic configuration of a display device 100, which is a comparative example in which red light-emitting elements 5R, green light-emitting elements 5G, and blue light-emitting elements 5B provided around the edge periphery DAER of the display area DA emit light brighter than intended, resulting in visible bright lines.
 図5に示すように、表示装置100の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた赤色サブ画素RSUBは、赤色発光層8Rを含む赤色発光素子5Rを含み、表示装置100の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた緑色サブ画素GSUBは、緑色発光層8Gを含む緑色発光素子5Gを含み、表示装置100の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた青色サブ画素BSUBは、青色発光層8Bを含む青色発光素子5Bを含む。赤色発光素子5Rは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、赤色発光層8Rと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28とを含み、緑色発光素子5Gは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、緑色発光層8Gと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28とを含み、青色発光素子5Bは、アノードである下部電極22と、正孔注入層24と、正孔輸送層25と、青色発光層8Bと、電子輸送層26と、電子注入層27と、カソードである第1上部電極層28と、を含む。 As shown in FIG. 5, the red subpixel RSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a red light-emitting element 5R including a red light-emitting layer 8R, the green subpixel GSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a green light-emitting element 5G including a green light-emitting layer 8G, and the blue subpixel BSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 100 includes a blue light-emitting element 5B including a blue light-emitting layer 8B. The red light-emitting element 5R includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a red light-emitting layer 8R, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode. The green light-emitting element 5G includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a green light-emitting layer 8G, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode. The blue light-emitting element 5B includes a lower electrode 22 that is an anode, a hole injection layer 24, a hole transport layer 25, a blue light-emitting layer 8B, an electron transport layer 26, an electron injection layer 27, and a first upper electrode layer 28 that is a cathode.
 図5に示す比較例である表示装置100の赤色発光素子5Rに備えられた下部電極22と赤色発光層8Rとの間と、緑色発光素子5Gに備えられた下部電極22と緑色発光層8Gとの間と、青色発光素子5Bに備えられた下部電極22と青色発光層8Bとの間とには、表示領域DAの全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25が設けられている。 The display device 100 shown in FIG. 5 is a comparative example. Between the lower electrode 22 and the red light-emitting layer 8R of the red light-emitting element 5R, between the lower electrode 22 and the green light-emitting layer 8G of the green light-emitting element 5G, and between the lower electrode 22 and the blue light-emitting layer 8B of the blue light-emitting element 5B, a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer (hole transfer layer) that is a common layer formed over the entire surface of the display area DA.
 図6は、図5に示す比較例である表示装置100の表示領域DAの端部周辺DAERにおいて輝線が見えてしまう理由を説明するための回路図である。図6においては、図5に示す比較例である表示装置100の表示領域DAの端部周辺DAERに備えられた赤色発光素子5Rを含む赤色サブ画素RSUBの駆動回路と、赤色発光素子5Rに隣接して配置された青色発光素子5Bとの概略的な回路構成を示す。 FIG. 6 is a circuit diagram for explaining why bright lines are visible around the edge DAER of the display area DA of the display device 100, which is a comparative example shown in FIG. 5. FIG. 6 shows a schematic circuit configuration of a drive circuit for a red sub-pixel RSUB including a red light-emitting element 5R provided around the edge DAER of the display area DA of the display device 100, which is a comparative example shown in FIG. 5, and a blue light-emitting element 5B arranged adjacent to the red light-emitting element 5R.
 図6に示すように、比較例である表示装置100の表示領域DAの端部周辺DAERに備えられた赤色発光素子5Rを含む赤色サブ画素RSUBの駆動回路は、1個の発光素子と、2個のトランジスタTR1~TR2と、1個の保持キャパシタC1とを含む。トランジスタTR1は駆動トランジスタであり、トランジスタTR2は選択トランジスタである。図示してないが、比較例である表示装置100の表示領域DAの端部周辺DAERに備えられた緑色発光素子5Gを含む緑色サブ画素GSUBの駆動回路及び比較例である表示装置100の表示領域DAの端部周辺DAERに備えられた青色発光素子5Bを含む青色サブ画素BSUBの駆動回路も同様の構成である。 As shown in FIG. 6, the drive circuit of the red subpixel RSUB including the red light-emitting element 5R provided in the edge periphery DAER of the display area DA of the display device 100, which is a comparative example, includes one light-emitting element, two transistors TR1-TR2, and one storage capacitor C1. The transistor TR1 is a drive transistor, and the transistor TR2 is a selection transistor. Although not shown, the drive circuit of the green subpixel GSUB including the green light-emitting element 5G provided in the edge periphery DAER of the display area DA of the display device 100, which is a comparative example, and the drive circuit of the blue subpixel BSUB including the blue light-emitting element 5B provided in the edge periphery DAER of the display area DA of the display device 100, which is a comparative example, are also configured in the same way.
 図6に示す赤色発光素子5Rを含む赤色サブ画素RSUBの駆動回路においては、駆動トランジスタであるトランジスタTR1のドレイン電極は赤色発光素子5Rの下部電極22と電気的に接続されており、トランジスタTR1のゲート電極は保持キャパシタC1の一方側の電極と選択トランジスタであるトランジスタTR2のドレイン電極とに電気的に接続されており、トランジスタTR1のソース電極は保持キャパシタC1の他方側の電極と図示していない電源回路からハイレベル電源電圧ELVDDが供給されるELVDD配線VLと電気的に接続されている。また、選択トランジスタであるトランジスタTR2のソース電極は図示していないデータ側駆動回路から出力されるデータ信号が供給されるデータ信号線DLと電気的に接続されており、トランジスタTR2のゲート電極は図示していない走査側駆動回路から出力される走査信号が供給される走査信号線SLと電気的に接続されており、トランジスタTR2のドレイン電極はトランジスタTR1のゲート電極と保持キャパシタC1の一方側の電極とに電気的に接続されている。 In the drive circuit of the red subpixel RSUB including the red light emitting element 5R shown in FIG. 6, the drain electrode of the transistor TR1, which is the drive transistor, is electrically connected to the lower electrode 22 of the red light emitting element 5R, the gate electrode of the transistor TR1 is electrically connected to one side electrode of the holding capacitor C1 and the drain electrode of the transistor TR2, which is the selection transistor, and the source electrode of the transistor TR1 is electrically connected to the other side electrode of the holding capacitor C1 and the ELVDD wiring VL to which the high-level power supply voltage ELVDD is supplied from a power supply circuit not shown. In addition, the source electrode of the transistor TR2, which is the selection transistor, is electrically connected to the data signal line DL to which the data signal output from the data side drive circuit not shown is supplied, the gate electrode of the transistor TR2 is electrically connected to the scanning signal line SL to which the scanning signal output from the scanning side drive circuit not shown is supplied, and the drain electrode of the transistor TR2 is electrically connected to the gate electrode of the transistor TR1 and one side electrode of the holding capacitor C1.
 表示領域DAの全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25が設けられている図5に示す比較例である表示装置100においては、表示領域DAの端部周辺DAERに輝線が見えてしまう。本開示の発明者らは、図5及び図6に示すように、電荷移動層(正孔移動層)である正孔注入層24及び正孔輸送層25を介して表示領域DAの端部周辺DAERに移動した正孔Hが行き場のない表示領域DAの端部周辺DAERに溜まっていき、表示領域DAの端部周辺DAERに備えられた発光素子では、このように溜まった正孔Hが第1上部電極層28方向に移動し、意図した輝度より明るく発光してしまうことが、このような原因の一つであると考えている。なお、比較例である表示装置100においては、表示領域DAの全面に形成された共通層である電荷移動層(正孔移動層)として、正孔注入層24及び正孔輸送層25を設けた場合を一例に挙げて説明したが、これに限定されることはなく、正孔注入層24及び正孔輸送層25の何れか一方のみが設けられている場合においても、同様に表示領域DAの端部周辺DAERに輝線が見えてしまう。 In the display device 100 shown in Fig. 5, which is a comparative example in which a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer (hole transfer layer) that is a common layer formed on the entire surface of the display area DA, a bright line is seen in the edge periphery DAER of the display area DA. The inventors of the present disclosure believe that one of the causes of this is that, as shown in Figs. 5 and 6, holes H + that have moved to the edge periphery DAER of the display area DA through the hole injection layer 24 and the hole transport layer 25 that are charge transfer layers (hole transfer layers) accumulate in the edge periphery DAER of the display area DA where there is nowhere to go, and in the light-emitting element provided in the edge periphery DAER of the display area DA, the accumulated holes H + move toward the first upper electrode layer 28, resulting in light emission that is brighter than the intended brightness. In the comparative example, the display device 100 has been described as an example in which a hole injection layer 24 and a hole transport layer 25 are provided as a charge transfer layer (hole transfer layer), which is a common layer formed over the entire surface of the display area DA. However, this is not limited to this example, and even if only one of the hole injection layer 24 and the hole transport layer 25 is provided, a bright line will similarly be visible around the edge DAER of the display area DA.
 〔実施形態2〕
 次に、図7に基づき、本開示の実施形態2について説明する。本実施形態の表示装置1aにおいては、第1上部電極層28が一つの連続層として非表示領域NDA1にも設けられており、非表示領域NDA1においては、第2上部電極層28aと第1上部電極層28とが、基板2側からこの順に積層されている点において、上述した実施形態1とは異なる。その他については実施形態1において説明したとおりである。説明の便宜上、実施形態1の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 2]
Next, a second embodiment of the present disclosure will be described with reference to FIG. 7. The display device 1a of this embodiment is different from the first embodiment described above in that the first upper electrode layer 28 is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a and the first upper electrode layer 28 are stacked in this order from the substrate 2 side. The rest is as described in the first embodiment. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the first embodiment, and their explanations are omitted.
 図7は、実施形態2の表示装置1aの表示領域DAに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bと、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Ra、緑色発光層8Gを備えた非発光電荷移動素子6Ga及び青色発光層8Bを備えた非発光電荷移動素子6Baの概略的な構成を示す断面図である。 FIG. 7 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1a of embodiment 2, and a non-light-emitting charge-transfer element 6Ra with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Ga with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Ba with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図7に示すように、表示装置1aの非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Ra、緑色発光層8Gを備えた非発光電荷移動素子6Ga及び青色発光層8Bを備えた非発光電荷移動素子6Baのそれぞれにおいては、第1上部電極層28が一つの連続層として非表示領域NDA1にも設けられており、非表示領域NDA1においては、第2上部電極層28aと第1上部電極層28とが基板2側からこの順に積層されて積層体28bを形成している。このような場合、積層体28bがカソードとなる。 As shown in FIG. 7, in each of the non-light-emitting charge transfer element 6Ra with a red light-emitting layer 8R, the non-light-emitting charge transfer element 6Ga with a green light-emitting layer 8G, and the non-light-emitting charge transfer element 6Ba with a blue light-emitting layer 8B provided in the non-display area NDA1 of the display device 1a, the first upper electrode layer 28 is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a and the first upper electrode layer 28 are stacked in this order from the substrate 2 side to form the laminate 28b. In such a case, the laminate 28b becomes the cathode.
 非表示領域NDA1に備えられた非発光電荷移動素子6Ra・6Ga・6Baによれば、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層として第2上部電極層28aを備えていることで、下部電極22とカソードである積層体28bとの間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、正孔Hをカソードである積層体28bに流し、非表示領域NDA1に溜まった正孔Hを逃がすことができる。このように溜まった正孔Hがカソードである積層体28b方向に移動し、非表示領域NDA1に正孔Hが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 According to the non-light-emitting charge transfer elements 6Ra, 6Ga, and 6Ba provided in the non-display area NDA1, the second upper electrode layer 28a is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28 and being 1×10 9 Ω·cm or less, so that the voltage applied between the lower electrode 22 and the laminate 28b serving as the cathode is reduced, and the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the holes H + are allowed to flow to the laminate 28b serving as the cathode, and the holes H + accumulated in the non-display area NDA1 can be released. The holes H + thus accumulated move toward the laminate 28b serving as the cathode, and the accumulation of the holes H + in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1 can be suppressed.
 〔実施形態3〕
 次に、図8に基づき、本開示の実施形態3について説明する。本実施形態の表示装置1bにおいては、第1上部電極層28と第2上部電極層28aとは、同一材料で形成された一つの連続層であり、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層28cが、電荷移動層(正孔移動層)である正孔輸送層25の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28aの発光層8R・8G・8B側の面である第3の面M3との間に備えられている点において、上述した実施形態1及び2とは異なる。その他については実施形態1及び2において説明したとおりである。説明の便宜上、実施形態1及び2の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 3]
Next, the third embodiment of the present disclosure will be described based on FIG. 8. In the display device 1b of this embodiment, the first upper electrode layer 28 and the second upper electrode layer 28a are one continuous layer formed of the same material, and the resistance adjustment layer 28c, which has a resistivity higher than that of the first upper electrode layer 28 and is 1×10 9 Ω·cm or less, is provided between the first surface M1, which is the surface of the hole transport layer 25, which is the charge transfer layer (hole transfer layer), on the light emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a on the light emitting layers 8R, 8G, and 8B side. The rest is as described in the first and second embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the first and second embodiments, and their explanations are omitted.
 図8は、実施形態3の表示装置1bの表示領域DAに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bと、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Rb、緑色発光層8Gを備えた非発光電荷移動素子6Gb及び青色発光層8Bを備えた非発光電荷移動素子6Bbの概略的な構成を示す断面図である。 FIG. 8 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1b of embodiment 3, and a non-light-emitting charge-transfer element 6Rb with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Gb with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Bb with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図8に示すように、表示装置1bの非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Rb、緑色発光層8Gを備えた非発光電荷移動素子6Gb及び青色発光層8Bを備えた非発光電荷移動素子6Bbのそれぞれにおいては、第1上部電極層28と第2上部電極層28aとは、同一材料で形成された一つの連続層であり、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層28cが、電荷移動層(正孔移動層)である正孔輸送層25の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28aの発光層8R・8G・8B側の面である第3の面M3との間に備えられている。 As shown in FIG. 8, in each of the non-light-emitting charge transfer element 6Rb having a red light-emitting layer 8R, the non-light-emitting charge transfer element 6Gb having a green light-emitting layer 8G, and the non-light-emitting charge transfer element 6Bb having a blue light-emitting layer 8B provided in the non-display area NDA1 of the display device 1b, the first upper electrode layer 28 and the second upper electrode layer 28a are one continuous layer formed of the same material, and a resistance adjustment layer 28c having a resistivity higher than that of the first upper electrode layer 28 and being 1×10 9 Ω·cm or less is provided between a first surface M1 which is the surface of the hole transport layer 25, which is a charge transfer layer (hole transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G, and 8B.
 本実施形態においては、抵抗調整層28cが、電子輸送層26と電子注入層27との間に設けられている場合を一例に挙げて説明するが、これに限定されることはない。例えば、抵抗調整層28cは、第2上部電極層28aと電子注入層27との間、電子輸送層26と発光層8R・8G・8Bとの間、または、発光層8R・8G・8Bと正孔輸送層25との間に設けられていてもよく、上述した位置の複数の位置に設けられていてもよい。 In this embodiment, the case where the resistance adjustment layer 28c is provided between the electron transport layer 26 and the electron injection layer 27 will be described as an example, but the present invention is not limited to this. For example, the resistance adjustment layer 28c may be provided between the second upper electrode layer 28a and the electron injection layer 27, between the electron transport layer 26 and the light-emitting layers 8R, 8G, and 8B, or between the light-emitting layers 8R, 8G, and 8B and the hole transport layer 25, or may be provided at multiple positions among the above positions.
 非表示領域NDA1に備えられた非発光電荷移動素子6Rb・6Gb・6Bbによれば、抵抗調整層28cが、電荷移動層(正孔移動層)である正孔輸送層25の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28aの発光層8R・8G・8B側の面である第3の面M3との間に備えられていることで、下部電極22とカソードである第2上部電極層28aとの間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、正孔Hをカソードである第2上部電極層28aに流し、非表示領域NDA1に溜まった正孔Hを逃がすことができる。このように溜まった正孔Hがカソードである第2上部電極層28a方向に移動し、非表示領域NDA1に正孔Hが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 In the non-light-emitting charge transfer elements 6Rb, 6Gb, and 6Bb provided in the non-display area NDA1, the resistance adjustment layer 28c is provided between the first surface M1, which is the surface of the hole transport layer 25, which is a charge transfer layer (hole transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and the third surface M3, which is the surface of the second upper electrode layer 28a facing the light-emitting layers 8R, 8G, and 8B. Due to a decrease in the voltage applied between the lower electrode 22 and the second upper electrode layer 28a, which is the cathode, recombination of holes H + and electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the holes H + are caused to flow to the second upper electrode layer 28a, which is the cathode, thereby allowing the holes H + accumulated in the non-display area NDA1 to escape. The accumulated holes H + move in the direction of the second upper electrode layer 28a, which is the cathode, and it is possible to suppress the accumulation of holes H + in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
 〔実施形態4〕
 次に、図9に基づき、本開示の実施形態4について説明する。本実施形態の表示装置1cにおいては、第1上部電極層28と第2上部電極層28aとは、電気的に分離されており、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28aであり、第1上部電極層28には、第1配線を介して第1電圧が印加され、第2上部電極層28aには、第2配線を介して第2電圧が印加され、前記第1電圧と前記第2電圧とは同じ電圧である点において、上述した実施形態1から3とは異なる。その他については実施形態1から3において説明したとおりである。説明の便宜上、実施形態1から3の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 4]
Next, a fourth embodiment of the present disclosure will be described with reference to FIG. 9. In the display device 1c of this embodiment, the first upper electrode layer 28 and the second upper electrode layer 28a are electrically separated, and the second upper electrode layer 28a is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28, 1×10 9 Ω·cm or less, and a first voltage is applied to the first upper electrode layer 28 through a first wiring, and a second voltage is applied to the second upper electrode layer 28a through a second wiring, and the first voltage and the second voltage are the same voltage. This is different from the first to third embodiments described above. The rest is as described in the first to third embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the first to third embodiments, and their explanations are omitted.
 図9は、実施形態4の表示装置1cの表示領域DAに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bと、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6R、緑色発光層8Gを備えた非発光電荷移動素子6G及び青色発光層8Bを備えた非発光電荷移動素子6Bの概略的な構成を示す断面図である。 FIG. 9 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R, a green light-emitting element 5G, and a blue light-emitting element 5B provided in the display area DA of the display device 1c of embodiment 4, and a non-light-emitting charge-transfer element 6R with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図9に示すように、表示装置1cにおいては、表示領域DAの端部DAEを含む領域に、第1上部電極層28と第2上部電極層28aとを電気的に分離するための溝HOLが設けられ、第1上部電極層28と第2上部電極層28aとは電気的に分離されている。 As shown in FIG. 9, in the display device 1c, a groove HOL for electrically isolating the first upper electrode layer 28 and the second upper electrode layer 28a is provided in an area including the end DAE of the display area DA, and the first upper electrode layer 28 and the second upper electrode layer 28a are electrically isolated.
 本実施形態においては、溝HOLが電子輸送層26及び電子注入層27にも設けられている場合を一例に挙げて説明するが、これに限定されることはなく、溝HOLは、第1上部電極層28と第2上部電極層28aとの間にのみ設けられていてもよい。 In this embodiment, a case where the groove HOL is also provided in the electron transport layer 26 and the electron injection layer 27 will be described as an example, but this is not limited thereto, and the groove HOL may be provided only between the first upper electrode layer 28 and the second upper electrode layer 28a.
 図9に示すように、表示装置1cにおいては、第1上部電極層28と第2上部電極層28aとは、電気的に分離されており、抵抗率が第1上部電極層28よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28aであり、第1上部電極層28には、第1配線を介して第1電圧が印加され、第2上部電極層28aには、第2配線を介して第2電圧が印加され、前記第1電圧と前記第2電圧とは同じ電圧である。 As shown in FIG. 9, in display device 1c, the first upper electrode layer 28 and the second upper electrode layer 28a are electrically separated, and the second upper electrode layer 28a is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28, being 1×10 9 Ω·cm or less. A first voltage is applied to the first upper electrode layer 28 via a first wiring, and a second voltage is applied to the second upper electrode layer 28a via a second wiring, and the first voltage and the second voltage are the same voltage.
 表示装置1cによれば、表示領域DAに備えられた赤色発光素子5R、緑色発光素子5G及び青色発光素子5Bが、非表示領域NDA1に備えられた非発光電荷移動素子6R・6G・6Bによって影響を受けることを抑制することができる。 The display device 1c can prevent the red light-emitting element 5R, green light-emitting element 5G, and blue light-emitting element 5B provided in the display area DA from being affected by the non-light-emitting charge transfer elements 6R, 6G, and 6B provided in the non-display area NDA1.
 〔実施形態5〕
 次に、図10から図13に基づき、本開示の実施形態5について説明する。本実施形態の表示装置1dは、表示領域DAに、逆積構造の発光素子である赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’を備えており、非表示領域NDA1に、逆積構造の非発光電荷移動素子である非発光電荷移動素子6R’・6G’・6B’を備えている点において、上述した実施形態1から4とは異なる。その他については実施形態1から4において説明したとおりである。説明の便宜上、実施形態1から4の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 5]
Next, a fifth embodiment of the present disclosure will be described with reference to Figs. 10 to 13. The display device 1d of this embodiment is different from the first to fourth embodiments in that the display area DA includes red light emitting element 5R', green light emitting element 5G', and blue light emitting element 5B', which are light emitting elements with an inverted stack structure, and the non-display area NDA1 includes non-light emitting charge transfer elements 6R', 6G', and 6B', which are non-light emitting charge transfer elements with an inverted stack structure. The rest is as described in the first to fourth embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the first to fourth embodiments, and their explanations are omitted.
 図10は、実施形態5の表示装置1dの表示領域DAに備えられた逆積構造の発光素子である赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’と、非表示領域NDA1に備えられた逆積構造の非発光電荷移動素子である非発光電荷移動素子6R’・6G’・6B’の概略的な構成を示す断面図である。 FIG. 10 is a cross-sectional view showing the schematic configuration of red light-emitting element 5R', green light-emitting element 5G', and blue light-emitting element 5B', which are light-emitting elements with an inverted stack structure provided in display area DA of display device 1d of embodiment 5, and non-light-emitting charge-transfer elements 6R', 6G', and 6B', which are non-light-emitting charge-transfer elements with an inverted stack structure provided in non-display area NDA1.
 本実施形態においては、図10に示すように、表示装置1dの表示領域DAに備えられた、赤色サブ画素RSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、赤色発光層8Rと、正孔輸送層25と、正孔注入層24と、アノードである第1上部電極層28’とが、この順に積層された逆積構造の赤色発光素子5R’が設けられており、緑色サブ画素GSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、緑色発光層8Gと、正孔輸送層25と、正孔注入層24と、アノードである第1上部電極層28’とが、この順に積層された逆積構造の緑色発光素子5G’が設けられており、青色サブ画素BSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、青色発光層8Bと、正孔輸送層25と、正孔注入層24と、アノードである第1上部電極層28’とが、が、この順に積層された逆積構造の青色発光素子5B’が設けられている場合を一例に挙げて説明するが、これに限定されることはない。 In this embodiment, as shown in FIG. 10, the red subpixel RSUB provided in the display area DA of the display device 1d is provided with a red light-emitting element 5R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a red light-emitting layer 8R, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' serving as an anode are stacked in this order on the substrate 2'. The green subpixel GSUB is provided with a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a green light-emitting layer 8R, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' serving as an anode on the substrate 2'. A green light emitting element 5G' is provided with an inverted stack structure in which a light emitting layer 8G, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' that is an anode are stacked in this order, and the blue subpixel BSUB is provided with a blue light emitting element 5B' with an inverted stack structure in which a lower electrode 22' that is a cathode, an electron injection layer 27, an electron transport layer 26, a blue light emitting layer 8B, a hole transport layer 25, a hole injection layer 24, and a first upper electrode layer 28' that is an anode are stacked in this order from the substrate 2' side on the substrate 2', but the present invention is not limited to this.
 また、本実施形態においては、図10に示すように、表示装置1dの非表示領域NDA1に備えられた、第1ダミーサブ画素DRSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、正孔輸送層25と、正孔注入層24と、アノードである第2上部電極層28a’とが、この順に積層された逆積構造の非発光電荷移動素子6R’が設けられており、第2ダミーサブ画素DGSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、正孔輸送層25と、正孔注入層24と、アノードである第2上部電極層28a’とが、この順に積層された逆積構造の非発光電荷移動素子6G’が設けられており、第3ダミーサブ画素DBSUBには、基板2’上に、基板2’側から、カソードである下部電極22’と、電子注入層27と、電子輸送層26と、正孔輸送層25と、正孔注入層24と、アノードである第2上部電極層28a’とが、この順に積層された逆積構造の非発光電荷移動素子6B’が設けられている場合を一例に挙げて説明するが、これに限定されることはない。 In addition, in this embodiment, as shown in FIG. 10, the first dummy subpixel DRSUB provided in the non-display area NDA1 of the display device 1d is provided with a non-light-emitting charge transfer element 6R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' which is a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' which is an anode are stacked in this order on the substrate 2'. The second dummy subpixel DGSUB is provided with a non-light-emitting charge transfer element 6R' having an inverted stack structure in which, from the substrate 2' side, a lower electrode 22' which is a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' which is an anode are stacked in this order on the substrate 2'. The third dummy subpixel DBSUB is provided with a non-light-emitting charge transfer element 6G' having an inverted stack structure in which a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' serving as an anode are stacked in this order on the substrate 2'. An example will be described in which a non-light-emitting charge transfer element 6B' having an inverted stack structure in which a lower electrode 22' serving as a cathode, an electron injection layer 27, an electron transport layer 26, a hole transport layer 25, a hole injection layer 24, and a second upper electrode layer 28a' serving as an anode are stacked in this order on the substrate 2', but the present invention is not limited to this.
 表示装置1dの表示領域DA及び非表示領域NDA1に跨って設けられた一つの連続層である電荷移動層(電子移動層)は、電子注入層27及び電子輸送層26の少なくとも一方であればよい。 The charge transfer layer (electron transfer layer), which is a continuous layer provided across the display area DA and non-display area NDA1 of the display device 1d, may be at least one of the electron injection layer 27 and the electron transport layer 26.
 また、表示装置1dの表示領域DAの発光層8R・8G・8Bと第1上部電極層28’との間と、表示装置1dの非表示領域NDA1の発光層8R・8G・8Bと第2上部電極層28a’との間には、正孔輸送層25及び正孔注入層24の少なくとも一方が設けられていてもよく、正孔輸送層25及び正孔注入層24の両方を省いてもよい。 In addition, at least one of the hole transport layer 25 and the hole injection layer 24 may be provided between the light emitting layers 8R, 8G, 8B and the first upper electrode layer 28' in the display area DA of the display device 1d, and between the light emitting layers 8R, 8G, 8B and the second upper electrode layer 28a' in the non-display area NDA1 of the display device 1d, or both the hole transport layer 25 and the hole injection layer 24 may be omitted.
 本実施形態においては、表示装置1dの表示領域DAに設けられた電荷移動層(電子移動層)と、表示装置1dの非表示領域NDA1に設けられた電荷移動層(電子移動層)とは、同一材料で形成されている。すなわち、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(電子移動層)が電子注入層27のみである場合には、表示領域DAに設けられた電子注入層27と非表示領域NDA1に設けられた電子注入層27とが同一材料で形成されており、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(電子移動層)が電子輸送層26のみである場合には、表示領域DAに設けられた電子輸送層26と非表示領域NDA1に設けられた電子輸送層26とが同一材料で形成されており、表示領域DA及び非表示領域NDA1に設けられた電荷移動層(電子移動層)が電子注入層27と電子輸送層26とである場合には、表示領域DAに設けられた電子注入層27及び電子輸送層26のそれぞれと非表示領域NDA1に設けられた電子注入層27及び電子輸送層26のそれぞれとが同一材料で形成されている。 In this embodiment, the charge transfer layer (electron transfer layer) provided in the display area DA of the display device 1d and the charge transfer layer (electron transfer layer) provided in the non-display area NDA1 of the display device 1d are formed of the same material. That is, when the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is only the electron injection layer 27, the electron injection layer 27 provided in the display area DA and the electron injection layer 27 provided in the non-display area NDA1 are made of the same material, when the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is only the electron transport layer 26, the electron transport layer 26 provided in the display area DA and the electron transport layer 26 provided in the non-display area NDA1 are made of the same material, and when the charge transfer layer (electron transfer layer) provided in the display area DA and the non-display area NDA1 is the electron injection layer 27 and the electron transport layer 26, the electron injection layer 27 and the electron transport layer 26 provided in the display area DA and the electron injection layer 27 and the electron transport layer 26 provided in the non-display area NDA1 are each made of the same material.
 これに限定されることはなく、表示装置1dの表示領域DAに設けられた電荷移動層(電子移動層)と、表示装置1dの非表示領域NDA1に設けられた電荷移動層(電子移動層)とは、表示領域DAから非表示領域NDA1への電子の移動が可能である一つの連続層であれば、異なる材料で形成されていてもよい。 Without being limited to this, the charge transfer layer (electron transfer layer) provided in the display area DA of the display device 1d and the charge transfer layer (electron transfer layer) provided in the non-display area NDA1 of the display device 1d may be formed of different materials as long as they are one continuous layer that allows the movement of electrons from the display area DA to the non-display area NDA1.
 図10に示す赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’がトップエミッション型の発光素子である場合、図10に示す非発光電荷移動素子6R’・6G’・6B’に備えられたカソードである下部電極22’は可視光を反射する電極材料で形成し、アノードである第2上部電極層28a’は、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層であるならば、可視光を透過する電極材料で形成されてもよく、可視光を反射する電極材料で形成されてもよい。 When the red light-emitting element 5R', green light-emitting element 5G', and blue light-emitting element 5B' shown in Figure 10 are top-emission type light-emitting elements, the lower electrode 22' which is the cathode provided in the non-light-emitting charge transfer elements 6R', 6G', and 6B' shown in Figure 10 is formed of an electrode material that reflects visible light, and the second upper electrode layer 28a' which is the anode may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light, as long as it is a resistance adjustment layer whose resistivity is higher than that of the first upper electrode layer 28' and is 1 x 10 9 Ω cm or less.
 一方、赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’がボトムエミッション型の発光素子である場合、図10に示す非発光電荷移動素子6R’・6G’・6B’に備えられたカソードである下部電極22’は可視光を透過する電極材料で形成し、アノードである第2上部電極層28a’は、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層であるならば、可視光を透過する電極材料で形成されてもよく、可視光を反射する電極材料で形成されてもよい。 On the other hand, when the red light-emitting element 5R', the green light-emitting element 5G' and the blue light-emitting element 5B' are bottom-emission type light-emitting elements, the lower electrode 22' serving as the cathode provided in the non-light-emitting charge transfer elements 6R', 6G', 6B' shown in FIG. 10 is formed of an electrode material that transmits visible light, and the second upper electrode layer 28a' serving as the anode is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and not more than 1×10 9 Ω·cm, and may be formed of an electrode material that transmits visible light or an electrode material that reflects visible light.
 図10に示す本実施形態の表示装置1dにおいては、トップエミッション型の発光素子を備えた表示装置を実現するため、カソードである下部電極22’としてAl膜を、アノードである第1上部電極層28’として透明金属酸化物であるITO(indium tin oxide)膜を、アノードである第2上部電極層28a’としてITO(indium tin oxide)膜よりも抵抗率が高い透明金属酸化物であるIZO(indium zinc oxide)膜を、それぞれ用いた場合を一例に挙げて説明するが、これに限定されることはない。 In the display device 1d of this embodiment shown in FIG. 10, in order to realize a display device equipped with top-emission type light-emitting elements, an Al film is used as the lower electrode 22' which is the cathode, an ITO (indium tin oxide) film which is a transparent metal oxide is used as the first upper electrode layer 28' which is the anode, and an IZO (indium zinc oxide) film which is a transparent metal oxide having a higher resistivity than an ITO (indium tin oxide) film is used as the second upper electrode layer 28a' which is the anode. However, the present invention is not limited to this example.
 図10に示す本実施形態の表示装置1dにおいては、非発光電荷移動素子6R’・6G’・6B’が、電荷移動層(電子移動層)、例えば、電子輸送層26の発光層8R・8G・8B側の面である第1の面M1と、第2上部電極層28a’の基板2’とは反対側の面である第2の面M2との間に、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層を備えている場合の一例として、第1上部電極層28’と第2上部電極層28a’とは電気的に接続されており、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28a’である場合を挙げて説明するが、これに限定されることはない。例えば、後述する実施形態7(図15参照)のように、非発光電荷移動素子は、電荷移動層(電子移動層)、例えば、電子輸送層26の発光層8R・8G・8B側の面である第1の面M1と、第2上部電極層28a’の発光層8R・8G・8B側の面である第3の面M3との間に、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層28c’を備えていてもよい。 In the display device 1d of this embodiment shown in Figure 10, the non-light-emitting charge transfer elements 6R', 6G', 6B' have a charge transfer layer (electron transfer layer), for example, a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and 1 x 10 9 Ω-cm or less between a first surface M1 which is the surface of the electron transport layer 26 facing the light-emitting layers 8R, 8G , 8B, and a second surface M2 which is the surface of the second upper electrode layer 28a' opposite the substrate 2'.As an example of a case in which the first upper electrode layer 28' and the second upper electrode layer 28a' are electrically connected, and the resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and 1 x 10 9 Ω-cm or less is the second upper electrode layer 28a', this will be described as a case in which, however, the present invention is not limited to this. For example, as in the seventh embodiment (see FIG. 15 ) described later, the non-light-emitting charge transfer element may include a charge transfer layer (electron transfer layer), for example, a resistance adjustment layer 28c' having a resistivity higher than that of the first upper electrode layer 28' and equal to or less than 1×10 9 Ω cm, between a first surface M1 which is the surface of the electron transport layer 26 facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a' facing the light-emitting layers 8R, 8G , and 8B.
 図10に示すように、表示装置1dによれば、電荷移動層(電子移動層)である電子注入層27及び電子輸送層26の少なくとも一方を介して表示領域DAから非表示領域NDA1に移動した電子eが行き場のない非表示領域NDA1に溜まっていく。非表示領域NDA1に備えられた非発光電荷移動素子6R’・6G’・6B’によれば、上述したように、抵抗調整層として第2上部電極層28a’を備えていることで、下部電極22’と第2上部電極層28a’との間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、電子eを第2上部電極層28a’に流し、非表示領域NDA1に溜まった電子eを逃がすことができる。すなわち、非発光電荷移動素子6R’・6G’・6B’においては、下部電極22’と第2上部電極層28a’との間に印加される電圧が、発光層8R・8G・8Bにおける正孔Hと電子eの再結合に必要なエネルギーよりも小さいため、発光を抑制できるとともに、電子eを第2上部電極層28a’に流すことができる。このように溜まった電子eが第2上部電極層28a’方向に移動し、非表示領域NDA1に電子eが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 10, in the display device 1d, the electrons e that have moved from the display area DA to the non-display area NDA1 through at least one of the electron injection layer 27 and the electron transport layer 26, which are charge transfer layers (electron transfer layers), accumulate in the non-display area NDA1 where they have nowhere to go. As described above, in the non-light-emitting charge transfer elements 6R', 6G', and 6B' provided in the non-display area NDA1, the second upper electrode layer 28a' is provided as a resistance adjustment layer, and thus, in the light-emitting layers 8R, 8G, and 8B, the recombination of the holes H + and the electrons e is suppressed due to the reduction in the voltage applied between the lower electrode 22' and the second upper electrode layer 28a', and the electrons e that have accumulated in the non-display area NDA1 can be made to flow to the second upper electrode layer 28a'. That is, in the non-light-emitting charge transfer elements 6R', 6G', and 6B', the voltage applied between the lower electrode 22' and the second upper electrode layer 28a' is smaller than the energy required for recombination of the holes H + and the electrons e in the light-emitting layers 8R, 8G, and 8B, so that light emission can be suppressed and the electrons e can flow to the second upper electrode layer 28a'. In this way, the accumulated electrons e move toward the second upper electrode layer 28a', and it is possible to suppress the accumulation of the electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
 図11は、図10に示す表示装置1dの表示領域DAと非表示領域NDA1の境界付近の回路図である。 FIG. 11 is a circuit diagram of the display device 1d shown in FIG. 10 near the boundary between the display area DA and the non-display area NDA1.
 図11は、表示装置1dの表示領域DAに備えられた青色発光素子5B’を含む青色サブ画素BSUBの駆動回路と、青色発光素子5B’と隣接する表示装置1dの非表示領域NDA1に備えられた非発光電荷移動素子6R’を含む第1ダミーサブ画素DRSUBの駆動回路との概略的な回路構成を示す。なお、青色発光素子5B’を含む青色サブ画素BSUBの駆動回路及び非発光電荷移動素子6R’を含む第1ダミーサブ画素DRSUBの駆動回路は、図10に示す基板2’に備えられる。なお、青色発光素子5B’を含む青色サブ画素BSUBの駆動回路と非発光電荷移動素子6R’を含む第1ダミーサブ画素DRSUBの駆動回路の回路構成については、実施形態1で上述しているので、ここでの説明は省略する。 FIG. 11 shows a schematic circuit configuration of a drive circuit for a blue subpixel BSUB including a blue light-emitting element 5B' provided in the display area DA of the display device 1d, and a drive circuit for a first dummy subpixel DRSUB including a non-emissive charge transfer element 6R' provided in the non-display area NDA1 of the display device 1d adjacent to the blue light-emitting element 5B'. The drive circuit for the blue subpixel BSUB including the blue light-emitting element 5B' and the drive circuit for the first dummy subpixel DRSUB including the non-emissive charge transfer element 6R' are provided on the substrate 2' shown in FIG. 10. The circuit configurations of the drive circuit for the blue subpixel BSUB including the blue light-emitting element 5B' and the drive circuit for the first dummy subpixel DRSUB including the non-emissive charge transfer element 6R' have been described above in embodiment 1, so a description thereof will be omitted here.
 表示領域DA及び非表示領域NDA1に、電荷移動層(電子移動層)として、電子注入層27及び電子輸送層26が設けられている図10及び図11に示す表示装置1dにおいては、上述したように、表示装置1dの非表示領域NDA1に非発光電荷移動素子6R’・6G’・6B’が設けられているので、表示装置1dの非表示領域NDA1の近くに設けられる表示領域DAの端部周辺に輝線が生じるのを抑制することができる。 In the display device 1d shown in Figures 10 and 11, in which the display area DA and non-display area NDA1 are provided with an electron injection layer 27 and an electron transport layer 26 as charge transfer layers (electron transfer layers), as described above, non-light-emitting charge transfer elements 6R', 6G', and 6B' are provided in the non-display area NDA1 of the display device 1d, so that it is possible to prevent bright lines from appearing around the edges of the display area DA that is provided near the non-display area NDA1 of the display device 1d.
 図12は、表示領域DAの端部周辺DAERに備えられた赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’で、意図した輝度より明るく発光してしまい、輝線が見えてしまう比較例である表示装置101の概略的な構成を示す断面図である。 FIG. 12 is a cross-sectional view showing the schematic configuration of a display device 101, which is a comparative example in which red light-emitting elements 5R', green light-emitting elements 5G', and blue light-emitting elements 5B' provided around the edge periphery DAER of the display area DA emit light brighter than intended, resulting in visible bright lines.
 図12に示すように、表示装置101の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた赤色サブ画素RSUBは、赤色発光層8Rを含む赤色発光素子5R’を含み、表示装置101の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた緑色サブ画素GSUBは、緑色発光層8Gを含む緑色発光素子5G’を含み、表示装置101の表示領域DAの端部周辺DAERを含む表示領域DAに備えられた青色サブ画素BSUBは、青色発光層8Bを含む青色発光素子5B’を含む。 As shown in FIG. 12, the red subpixel RSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a red light emitting element 5R' including a red light emitting layer 8R, the green subpixel GSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a green light emitting element 5G' including a green light emitting layer 8G, and the blue subpixel BSUB provided in the display area DA including the edge periphery DAER of the display area DA of the display device 101 includes a blue light emitting element 5B' including a blue light emitting layer 8B.
 図12に示す比較例である表示装置101の赤色発光素子5R’に備えられた下部電極22’と赤色発光層8Rとの間と、緑色発光素子5G’に備えられた下部電極22’と緑色発光層8Gとの間と、青色発光素子5B’に備えられた下部電極22’と青色発光層8Bとの間とには、表示領域DAの全面に形成された共通層である電荷移動層(電子移動層)として、電子注入層27及び電子輸送層26が設けられている。 In the display device 101 shown in FIG. 12, which is a comparative example, an electron injection layer 27 and an electron transport layer 26 are provided as a charge transfer layer (electron transfer layer) that is a common layer formed over the entire display area DA between the lower electrode 22' and red light-emitting layer 8R of the red light-emitting element 5R', between the lower electrode 22' and green light-emitting layer 8G of the green light-emitting element 5G', and between the lower electrode 22' and blue light-emitting layer 8B of the blue light-emitting element 5B'.
 図13は、図12に示す比較例である表示装置101の表示領域DAの端部周辺DAERにおいて輝線が見えてしまう理由を説明するための回路図である。図13においては、図12に示す比較例である表示装置101の表示領域DAの端部周辺DAERに備えられた赤色発光素子5R’を含む赤色サブ画素RSUBの駆動回路と、赤色発光素子5R’に隣接して配置された青色発光素子5B’との概略的な回路構成を示す。なお、図13に示す回路構成については、実施形態1で上述しているので、ここでの説明は省略する。 FIG. 13 is a circuit diagram for explaining why bright lines are visible around the edge DAER of the display area DA of the display device 101, which is a comparative example shown in FIG. 12. FIG. 13 shows a schematic circuit configuration of a drive circuit for a red sub-pixel RSUB including a red light-emitting element 5R' provided around the edge DAER of the display area DA of the display device 101, which is a comparative example shown in FIG. 12, and a blue light-emitting element 5B' arranged adjacent to the red light-emitting element 5R'. Note that the circuit configuration shown in FIG. 13 has been described above in embodiment 1, so a description thereof will be omitted here.
 表示領域DAの全面に形成された共通層である電荷移動層(電子移動層)として、電子注入層27及び電子輸送層26が設けられている図12に示す比較例である表示装置101においては、表示領域DAの端部周辺DAERに輝線が見えてしまう。本開示の発明者らは、図12及び図13に示すように、電荷移動層(電子移動層)である電子注入層27及び電子輸送層26を介して表示領域DAの端部周辺DAERに移動した電子eが行き場のない表示領域DAの端部周辺DAERに溜まっていき、表示領域DAの端部周辺DAERに備えられた発光素子では、このように溜まった電子eが第1上部電極層28’方向に移動し、意図した輝度より明るく発光してしまうことが、このような原因の一つであると考えている。なお、比較例である表示装置101においては、表示領域DAの全面に形成された共通層である電荷移動層(電子移動層)として、電子注入層27及び電子輸送層26を設けた場合を一例に挙げて説明したが、これに限定されることはなく、電子注入層27及び電子輸送層26の何れか一方のみが設けられている場合においても、同様に表示領域DAの端部周辺DAERに輝線が見えてしまう。 In the display device 101 shown in FIG. 12, which is a comparative example in which an electron injection layer 27 and an electron transport layer 26 are provided as a charge transfer layer (electron transfer layer) that is a common layer formed over the entire surface of the display area DA, bright lines are visible in the periphery DAER of the edge of the display area DA. The inventors of the present disclosure believe that one of the causes of this is that, as shown in FIG. 12 and FIG. 13, electrons e that have moved to the periphery DAER of the edge of the display area DA via the electron injection layer 27 and electron transport layer 26, which are charge transfer layers (electron transfer layers), accumulate in the periphery DAER of the edge of the display area DA where they have nowhere to go, and in the light-emitting element provided in the periphery DAER of the edge of the display area DA, the accumulated electrons e move toward the first upper electrode layer 28', resulting in light emission that is brighter than the intended brightness. In the comparative display device 101, an example was given in which an electron injection layer 27 and an electron transport layer 26 are provided as a charge transport layer (electron transport layer) that is a common layer formed over the entire surface of the display area DA, but this is not limited to this, and even if only one of the electron injection layer 27 and the electron transport layer 26 is provided, a bright line will be visible around the edge DAER of the display area DA.
 〔実施形態6〕
 次に、図14に基づき、本開示の実施形態6について説明する。本実施形態の表示装置1eにおいては、第1上部電極層28’が一つの連続層として非表示領域NDA1にも設けられており、非表示領域NDA1においては、第2上部電極層28a’と第1上部電極層28’とが、基板2’側からこの順に積層されている点において、上述した実施形態5とは異なる。その他については実施形態5において説明したとおりである。説明の便宜上、実施形態5の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 6]
Next, the sixth embodiment of the present disclosure will be described with reference to FIG. 14. The display device 1e of this embodiment is different from the fifth embodiment in that the first upper electrode layer 28' is also provided in the non-display area NDA1 as one continuous layer, and the second upper electrode layer 28a' and the first upper electrode layer 28' are stacked in this order from the substrate 2' side in the non-display area NDA1. The rest is as described in the fifth embodiment. For convenience of explanation, the same reference numerals are used for the members having the same functions as those shown in the drawings of the fifth embodiment, and the explanation thereof will be omitted.
 図14は、実施形態6の表示装置1eの表示領域DAに備えられた赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’と、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Ra’、緑色発光層8Gを備えた非発光電荷移動素子6Ga’及び青色発光層8Bを備えた非発光電荷移動素子6Ba’の概略的な構成を示す断面図である。 FIG. 14 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1e of embodiment 6, and a non-light-emitting charge-transfer element 6Ra' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Ga' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Ba' with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図14に示すように、表示装置1eの非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Ra’、緑色発光層8Gを備えた非発光電荷移動素子6Ga’及び青色発光層8Bを備えた非発光電荷移動素子6Ba’のそれぞれにおいては、第1上部電極層28’が一つの連続層として非表示領域NDA1にも設けられており、非表示領域NDA1においては、第2上部電極層28a’と第1上部電極層28’とが基板2’側からこの順に積層されて積層体28b’を形成している。このような場合、積層体28b’がアノードとなる。 As shown in FIG. 14, in each of the non-light-emitting charge transfer element 6Ra' with a red light-emitting layer 8R, the non-light-emitting charge transfer element 6Ga' with a green light-emitting layer 8G, and the non-light-emitting charge transfer element 6Ba' with a blue light-emitting layer 8B provided in the non-display area NDA1 of the display device 1e, the first upper electrode layer 28' is also provided in the non-display area NDA1 as one continuous layer, and in the non-display area NDA1, the second upper electrode layer 28a' and the first upper electrode layer 28' are stacked in this order from the substrate 2' side to form the laminate 28b'. In such a case, the laminate 28b' serves as the anode.
 非表示領域NDA1に備えられた非発光電荷移動素子6Ra’・6Ga’・6Ba’によれば、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層として第2上部電極層28a’を備えていることで、下部電極22’とアノードである積層体28b’との間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、電子eをアノードである積層体28b’に流し、非表示領域NDA1に溜まった電子eを逃がすことができる。このように溜まった電子eがアノードである積層体28b’方向に移動し、非表示領域NDA1に電子eが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 According to the non-light-emitting charge transfer elements 6Ra', 6Ga', and 6Ba' provided in the non-display area NDA1, the second upper electrode layer 28a' is provided as a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and a resistivity of 1×10 9 Ω·cm or less, so that the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B due to a decrease in the voltage applied between the lower electrode 22' and the anode stack 28b', and the electrons e can flow to the anode stack 28b' and the electrons e accumulated in the non-display area NDA1 can be released. In this way, the accumulated electrons e move toward the anode stack 28b', and the accumulation of the electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1 can be suppressed.
 〔実施形態7〕
 次に、図15に基づき、本開示の実施形態7について説明する。本実施形態の表示装置1fにおいては、第1上部電極層28’と第2上部電極層28a’とは、同一材料で形成された一つの連続層であり、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層28c’が、電荷移動層(電子移動層)である電子輸送層26の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28a’の発光層8R・8G・8B側の面である第3の面M3との間に備えられている点において、上述した実施形態5及び6とは異なる。その他については実施形態5及び6において説明したとおりである。説明の便宜上、実施形態5及び6の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 7]
Next, the seventh embodiment of the present disclosure will be described based on FIG. 15. In the display device 1f of this embodiment, the first upper electrode layer 28' and the second upper electrode layer 28a' are one continuous layer formed of the same material, and the resistance adjustment layer 28c', which has a resistivity higher than that of the first upper electrode layer 28' and is 1×10 9 Ω·cm or less, is provided between the first surface M1, which is the surface of the electron transport layer 26, which is the charge transfer layer (electron transfer layer), on the light-emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a' on the light-emitting layers 8R, 8G, and 8B side. The rest is as described in the fifth and sixth embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the fifth and sixth embodiments, and their explanations are omitted.
 図15は、実施形態7の表示装置1fの表示領域DAに備えられた赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’と、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Rb’、緑色発光層8Gを備えた非発光電荷移動素子6Gb’及び青色発光層8Bを備えた非発光電荷移動素子6Bb’の概略的な構成を示す断面図である。 FIG. 15 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1f of embodiment 7, and a non-light-emitting charge-transfer element 6Rb' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6Gb' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6Bb' with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図15に示すように、表示装置1fの非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6Rb’、緑色発光層8Gを備えた非発光電荷移動素子6Gb’及び青色発光層8Bを備えた非発光電荷移動素子6Bb’のそれぞれにおいては、第1上部電極層28’と第2上部電極層28a’とは、同一材料で形成された一つの連続層であり、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層28c’が、電荷移動層(電子移動層)である電子輸送層26の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28a’の発光層8R・8G・8B側の面である第3の面M3との間に備えられている。 As shown in FIG. 15, in each of the non-light-emitting charge transfer element 6Rb' having a red light-emitting layer 8R, the non-light-emitting charge transfer element 6Gb' having a green light-emitting layer 8G, and the non-light-emitting charge transfer element 6Bb' having a blue light-emitting layer 8B provided in the non-display area NDA1 of the display device 1f, the first upper electrode layer 28' and the second upper electrode layer 28a' are one continuous layer formed of the same material, and a resistance adjustment layer 28c' having a resistivity higher than that of the first upper electrode layer 28' and being 1×10 9 Ω·cm or less is provided between a first surface M1 which is the surface of the electron transport layer 26, which is a charge transfer layer (electron transfer layer), facing the light-emitting layers 8R, 8G, and 8B, and a third surface M3 which is the surface of the second upper electrode layer 28a' facing the light-emitting layers 8R, 8G, and 8B.
 本実施形態においては、抵抗調整層28c’が、正孔輸送層25と正孔注入層24との間に設けられている場合を一例に挙げて説明するが、これに限定されることはない。例えば、抵抗調整層28c’は、第2上部電極層28a’と正孔注入層24との間、正孔輸送層25と発光層8R・8G・8Bとの間、または、発光層8R・8G・8Bと電子輸送層26との間に設けられていてもよく、上述した位置の複数の位置に設けられていてもよい。 In this embodiment, the case where the resistance adjustment layer 28c' is provided between the hole transport layer 25 and the hole injection layer 24 will be described as an example, but the present invention is not limited to this. For example, the resistance adjustment layer 28c' may be provided between the second upper electrode layer 28a' and the hole injection layer 24, between the hole transport layer 25 and the light-emitting layers 8R, 8G, and 8B, or between the light-emitting layers 8R, 8G, and 8B and the electron transport layer 26, or may be provided at multiple positions among the above positions.
 非表示領域NDA1に備えられた非発光電荷移動素子6Rb’・6Gb’・6Bb’によれば、抵抗調整層28c’が、電荷移動層(電子移動層)である電子輸送層26の発光層8R・8G・8B側の面である第1の面M1と第2上部電極層28a’の発光層8R・8G・8B側の面である第3の面M3との間に備えられていることで、下部電極22’とアノードである第2上部電極層28a’との間に印加される電圧の低下により、発光層8R・8G・8Bにおいては、正孔Hと電子eの再結合が生じるのを抑制するとともに、電子eをアノードである第2上部電極層28a’に流し、非表示領域NDA1に溜まった電子eを逃がすことができる。このように溜まった電子eがアノードである第2上部電極層28a’方向に移動し、非表示領域NDA1に電子eが溜まっていくことと、非表示領域NDA1において輝線が生じることとを抑制することができる。 According to the non-light-emitting charge transfer elements 6Rb', 6Gb', and 6Bb' provided in the non-display area NDA1, the resistance adjustment layer 28c' is provided between the first surface M1, which is the surface of the electron transport layer 26, which is the charge transfer layer (electron transfer layer), on the light-emitting layers 8R, 8G, and 8B side, and the third surface M3, which is the surface of the second upper electrode layer 28a' on the light-emitting layers 8R, 8G, and 8B side, so that the voltage applied between the lower electrode 22' and the second upper electrode layer 28a', which is the anode, is reduced, and the recombination of the holes H + and the electrons e is suppressed in the light-emitting layers 8R, 8G, and 8B, and the electrons e are caused to flow to the second upper electrode layer 28a', which is the anode, and the electrons e accumulated in the non-display area NDA1 can be released. In this way, the accumulated electrons e move toward the second upper electrode layer 28a', which is the anode, and it is possible to suppress the accumulation of electrons e in the non-display area NDA1 and the occurrence of bright lines in the non-display area NDA1.
 〔実施形態8〕
 次に、図16に基づき、本開示の実施形態8について説明する。本実施形態の表示装置1gにおいては、第1上部電極層28’と第2上部電極層28a’とは、電気的に分離されており、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28a’であり、第1上部電極層28’には、第1配線を介して第1電圧が印加され、第2上部電極層28a’には、第2配線を介して第2電圧が印加され、前記第1電圧と前記第2電圧とは同じ電圧である点において、上述した実施形態5から7とは異なる。その他については実施形態5から7において説明したとおりである。説明の便宜上、実施形態5から7の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 8]
Next, an eighth embodiment of the present disclosure will be described based on FIG. 16. In the display device 1g of this embodiment, the first upper electrode layer 28' and the second upper electrode layer 28a' are electrically separated, and the second upper electrode layer 28a' is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28', 1×10 9 Ω·cm or less, and a first voltage is applied to the first upper electrode layer 28' through a first wiring, and a second voltage is applied to the second upper electrode layer 28a' through a second wiring, and the first voltage and the second voltage are the same voltage. This embodiment differs from the fifth to seventh embodiments described above. The rest is as described in the fifth to seventh embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as the members shown in the drawings of the fifth to seventh embodiments, and their explanations are omitted.
 図16は、実施形態8の表示装置1gの表示領域DAに備えられた赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’と、非表示領域NDA1に備えられた赤色発光層8Rを備えた非発光電荷移動素子6R’、緑色発光層8Gを備えた非発光電荷移動素子6G’及び青色発光層8Bを備えた非発光電荷移動素子6B’の概略的な構成を示す断面図である。 FIG. 16 is a cross-sectional view showing a schematic configuration of a red light-emitting element 5R', a green light-emitting element 5G', and a blue light-emitting element 5B' provided in the display area DA of the display device 1g of embodiment 8, and a non-light-emitting charge-transfer element 6R' with a red light-emitting layer 8R, a non-light-emitting charge-transfer element 6G' with a green light-emitting layer 8G, and a non-light-emitting charge-transfer element 6B' with a blue light-emitting layer 8B provided in the non-display area NDA1.
 図16に示すように、表示装置1gにおいては、表示領域DAの端部DAEを含む領域に、第1上部電極層28’と第2上部電極層28a’とを電気的に分離するための溝HOL’が設けられ、第1上部電極層28’と第2上部電極層28a’とは電気的に分離されている。 As shown in FIG. 16, in the display device 1g, a groove HOL' for electrically isolating the first upper electrode layer 28' and the second upper electrode layer 28a' is provided in an area including the end DAE of the display area DA, and the first upper electrode layer 28' and the second upper electrode layer 28a' are electrically isolated.
 本実施形態においては、溝HOL’が正孔輸送層25及び正孔注入層24にも設けられている場合を一例に挙げて説明するが、これに限定されることはなく、溝HOL’は、第1上部電極層28’と第2上部電極層28a’との間にのみ設けられていてもよい。 In this embodiment, an example will be described in which the groove HOL' is also provided in the hole transport layer 25 and the hole injection layer 24, but this is not limiting, and the groove HOL' may be provided only between the first upper electrode layer 28' and the second upper electrode layer 28a'.
 図16に示すように、表示装置1gにおいては、第1上部電極層28’と第2上部電極層28a’とは、電気的に分離されており、抵抗率が第1上部電極層28’よりは高く、1×10Ω・cm以下である抵抗調整層が第2上部電極層28a’であり、第1上部電極層28’には、第1配線を介して第1電圧が印加され、第2上部電極層28a’には、第2配線を介して第2電圧が印加され、前記第1電圧と前記第2電圧とは同じ電圧である。 As shown in FIG. 16, in a display device 1g, a first upper electrode layer 28' and a second upper electrode layer 28a' are electrically separated, and a second upper electrode layer 28a' is a resistance adjustment layer having a resistivity higher than that of the first upper electrode layer 28' and being 1×10 9 Ω·cm or less, a first voltage is applied to the first upper electrode layer 28' via a first wiring, and a second voltage is applied to the second upper electrode layer 28a' via a second wiring, and the first voltage and the second voltage are the same voltage.
 表示装置1gによれば、表示領域DAに備えられた赤色発光素子5R’、緑色発光素子5G’及び青色発光素子5B’が、非表示領域NDA1に備えられた非発光電荷移動素子6R’・6G’・6B’によって影響を受けることを抑制することができる。 The display device 1g can prevent the red light-emitting element 5R', green light-emitting element 5G', and blue light-emitting element 5B' provided in the display area DA from being affected by the non-light-emitting charge transfer elements 6R', 6G', and 6B' provided in the non-display area NDA1.
 〔実施形態9〕
 次に、図17に基づき、本開示の実施形態9について説明する。本実施形態の表示装置1hには、表示領域DAより内側に、撮像光を透過する撮像領域THがさらに設けられており、表示領域DAの外周を取り囲むように設けられた非表示領域(第1非表示領域)NDA1と、撮像領域THを取り囲むように設けられ非表示領域(第2非表示領域)NDA2とを含む点において、上述した実施形態1から8とは異なる。その他については実施形態1及び2において説明したとおりである。説明の便宜上、実施形態1及び2の図面に示した部材と同じ機能を有する部材については、同じ符号を付し、その説明を省略する。
[Embodiment 9]
Next, a ninth embodiment of the present disclosure will be described with reference to FIG. 17. The display device 1h of this embodiment is different from the above-described first to eighth embodiments in that an imaging region TH that transmits imaging light is further provided inside the display region DA, and includes a non-display region (first non-display region) NDA1 provided to surround the outer periphery of the display region DA and a non-display region (second non-display region) NDA2 provided to surround the imaging region TH. The rest is as described in the first and second embodiments. For convenience of explanation, the same reference numerals are used for members having the same functions as those shown in the drawings of the first and second embodiments, and their explanations are omitted.
 図17は、実施形態9の表示装置1hの概略的な構成を示す平面図である。 FIG. 17 is a plan view showing the schematic configuration of a display device 1h according to embodiment 9.
 図17に示すように、表示装置1hは、表示領域DAより内側に、撮像光を透過する撮像領域THがさらに設けられており、表示領域DAの外周を取り囲むように設けられた非表示領域(第1非表示領域)NDA1と、撮像領域THを取り囲むように設けられ非表示領域(第2非表示領域)NDA2とを含む。撮像光を透過する撮像領域THは、表示装置1hの表面から裏面までを貫通する貫通穴であってもよく、撮像光を透過するように透過性材料のみで構成された領域であってもよい。なお、撮像光とは、表示装置1hの撮像領域THと平面視において重畳するように配置され、かつ、表示装置1hの裏面側に配置される撮像素子(図示せず)で撮像を行うために必要な被写体からの反射光である。 As shown in FIG. 17, the display device 1h further includes an imaging area TH that transmits imaging light, located inside the display area DA, and includes a non-display area (first non-display area) NDA1 that is provided so as to surround the outer periphery of the display area DA, and a non-display area (second non-display area) NDA2 that is provided so as to surround the imaging area TH. The imaging area TH that transmits imaging light may be a through hole that penetrates from the front surface to the back surface of the display device 1h, or may be an area made only of a transparent material so as to transmit imaging light. The imaging light is arranged so as to overlap with the imaging area TH of the display device 1h in a plan view, and is reflected light from a subject that is necessary for capturing an image with an imaging element (not shown) that is arranged on the back side of the display device 1h.
 表示装置1hの非表示領域NDA1及び非表示領域NDA2のそれぞれは、実施形態1で上述した非表示領域NDA1と同一構成としてもよく、実施形態5で上述した非表示領域NDA1と同一構成としてもよい。 The non-display area NDA1 and the non-display area NDA2 of the display device 1h may each have the same configuration as the non-display area NDA1 described above in embodiment 1, or may each have the same configuration as the non-display area NDA1 described above in embodiment 5.
 なお、本実施形態においては、撮像領域THが円形状であり、非表示領域NDA2も円形状で形成されている場合を一例に挙げて説明するが、これに限定されることはなく、撮像領域THは、例えば、矩形状であってもよく、非表示領域NDA2も矩形状で形成されていてもよい。 In this embodiment, an example is described in which the imaging area TH is circular and the non-display area NDA2 is also formed in a circular shape, but this is not limited to this, and the imaging area TH may be, for example, rectangular, and the non-display area NDA2 may also be formed in a rectangular shape.
 図17に示すように、非表示領域NDA2は表示が行われない領域であることから、非表示領域NDA2は必要以上に広く設けないことが好ましい。したがって、本実施形態のように、画素PIXの形状が矩形である場合には、非表示領域NDA2の幅は画素PIXの対角線の長さ以下で形成されていることが好ましい。本実施形態においては、非表示領域NDA2の幅H1’・H2’・H3’が画素PIXの対角線の長さ以下となるように、非表示領域NDA2の幅H1’・H2’・H3’を画素PIXの第1方向D1の幅で形成した場合を一例に挙げて説明するが、これに限定されることはなく、非表示領域NDA2の幅H1’・H2’・H3’を画素PIXの第2方向D2の幅で形成してもよく、画素PIXの対角線の長さで形成してもよい。また、例えば、非表示領域NDA2の幅H1’・H2’・H3’は50μm以下で形成されていてもよく、5μm以上、50μm以下で形成されていることが好ましい。非表示領域NDA2の幅を上述した範囲とすることで、表示装置1hの表示領域DAをより広く確保できるとともに、表示領域DAの端部DAE’周辺に備えられた発光素子で、意図した輝度より明るく発光してしまい、輝線が見えてしまうのを抑制した表示装置1hを実現できる。 17, since the non-display area NDA2 is an area where no display is performed, it is preferable that the non-display area NDA2 is not provided wider than necessary. Therefore, when the shape of the pixel PIX is rectangular as in this embodiment, it is preferable that the width of the non-display area NDA2 is formed to be equal to or less than the diagonal length of the pixel PIX. In this embodiment, an example is given in which the widths H1', H2', and H3' of the non-display area NDA2 are formed to be equal to or less than the diagonal length of the pixel PIX, but this is not limited thereto, and the widths H1', H2', and H3' of the non-display area NDA2 may be formed to be equal to or less than the width in the second direction D2 of the pixel PIX, or may be formed to be equal to or less than the diagonal length of the pixel PIX. In addition, for example, the widths H1', H2', and H3' of the non-display area NDA2 may be formed to be equal to or less than 50 μm, and it is preferable that they are formed to be equal to or more than 5 μm and equal to or less than 50 μm. By setting the width of the non-display area NDA2 within the above-mentioned range, the display area DA of the display device 1h can be made wider, and the display device 1h can be realized in which the light-emitting elements provided around the end DAE' of the display area DA emit light brighter than intended, suppressing the appearance of bright lines.
 〔付記事項〕
 本開示は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本開示の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。
[Additional Notes]
The present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. The technical scope of the present disclosure also includes embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Furthermore, new technical features can be formed by combining the technical means disclosed in the respective embodiments.
 本開示は、表示装置に利用することができる。 This disclosure can be used in display devices.
 1、1a~1h        表示装置
 2、2’           基板
 5R、5R’         赤色発光素子(第1発光素子)
 5G、5G’         緑色発光素子(第2発光素子)
 5B、5B’         青色発光素子(第3発光素子)
 6R、6G、6B、6R’、6G’、6B’ 非発光電荷移動素子
 6Ra、6Ga、6Ba    非発光電荷移動素子
 6Ra’、6Ga’、6Ba’ 非発光電荷移動素子
 6Rb、6Gb、6Bb    非発光電荷移動素子
 6Rb’、6Gb’、6Bb’ 非発光電荷移動素子
 8R             赤色発光層(第1発光層)
 8G             緑色発光層(第2発光層)
 8B             青色発光層(第3発光層)
 22             下部電極(アノード)
 22’            下部電極(カソード)
 24             正孔注入層(電荷移動層)
 25             正孔輸送層(電荷移動層)
 26             電子輸送層(電荷移動層)
 27             電子注入層(電荷移動層)
 28             第1上部電極層(カソード)
 28a            第2上部電極層(抵抗調整層)
 28’            第1上部電極層(アノード)
 28a’           第2上部電極層(抵抗調整層)
 28c、28c’       抵抗調整層
 M1             第1の面
 M2             第2の面
 M3             第3の面
 DA             表示領域
 NDA1           非表示領域(第1非表示領域)
 NDA2           非表示領域(第2非表示領域)
 GA             額縁領域
 DAE、DAE’       表示領域の端部
 RSUB           赤色サブ画素
 GSUB           緑色サブ画素
 BSUB           青色サブ画素
 PIX            画素
 DRSUB          第1ダミーサブ画素
 DGSUB          第2ダミーサブ画素
 DBSUB          第3ダミーサブ画素
 H1、H1’、H2、H2’、H3、H3’ 非表示領域の幅
 TR1            駆動トランジスタ
 TR2            選択トランジスタ
 SL             走査信号線
 DL             データ信号線
 TH             撮像領域
1, 1a to 1h Display device 2, 2' Substrate 5R, 5R' Red light emitting element (first light emitting element)
5G, 5G' Green light-emitting element (second light-emitting element)
5B, 5B' Blue light emitting element (third light emitting element)
6R, 6G, 6B, 6R', 6G', 6B' Non-light-emitting charge transfer element 6Ra, 6Ga, 6Ba Non-light-emitting charge transfer element 6Ra', 6Ga', 6Ba' Non-light-emitting charge transfer element 6Rb, 6Gb, 6Bb Non-light-emitting charge transfer element 6Rb', 6Gb', 6Bb' Non-light-emitting charge transfer element 8R Red light-emitting layer (first light-emitting layer)
8G Green light-emitting layer (second light-emitting layer)
8B Blue light-emitting layer (third light-emitting layer)
22 Lower electrode (anode)
22' Lower electrode (cathode)
24 Hole injection layer (charge transfer layer)
25 Hole transport layer (charge transfer layer)
26 Electron transport layer (charge transfer layer)
27 Electron injection layer (charge transfer layer)
28 First upper electrode layer (cathode)
28a: Second upper electrode layer (resistance adjusting layer)
28' First upper electrode layer (anode)
28a' Second upper electrode layer (resistance adjusting layer)
28c, 28c' Resistance adjusting layer M1 First surface M2 Second surface M3 Third surface DA Display area NDA1 Non-display area (first non-display area)
NDA2 Non-display area (second non-display area)
GA Frame area DAE, DAE' Ends of display area RSUB Red subpixel GSUB Green subpixel BSUB Blue subpixel PIX Pixel DRSUB First dummy subpixel DGSUB Second dummy subpixel DBSUB Third dummy subpixel H1, H1', H2, H2', H3, H3' Width of non-display area TR1 Drive transistor TR2 Selection transistor SL Scanning signal line DL Data signal line TH Imaging area

Claims (11)

  1.  基板と、
     複数のサブ画素を含む画素が複数個備えられた前記基板上の表示領域と、
     前記表示領域の端部に沿って設けられた複数のダミーサブ画素を含み、かつ、前記表示領域から連続する領域である前記基板上の非表示領域と、
     前記表示領域及び前記非表示領域のそれぞれに設けられた複数の下部電極と、
     前記表示領域及び前記非表示領域に跨って設けられた一つの連続層である電荷移動層と、
     前記表示領域に設けられた第1上部電極層と、
     前記非表示領域に設けられた第2上部電極層と、
     前記複数のサブ画素のそれぞれに設けられた、前記下部電極と、前記電荷移動層と、発光層と、前記第1上部電極層とを、前記基板側からこの順に含む発光素子と、
     前記複数のダミーサブ画素のそれぞれに設けられた、前記下部電極と、前記電荷移動層と、発光層と、前記第2上部電極層とを、前記基板側からこの順に含む非発光電荷移動素子と、を含み、
     前記非発光電荷移動素子は、前記電荷移動層の前記発光層側の面である第1の面と、前記第2上部電極層の前記基板とは反対側の面である第2の面との間に、抵抗率が前記第1上部電極層よりは高く、1×10Ω・cm以下である抵抗調整層を備えている、表示装置。
    A substrate;
    a display region on the substrate, the display region including a plurality of pixels each including a plurality of sub-pixels;
    a non-display area on the substrate, the non-display area including a plurality of dummy sub-pixels provided along an edge of the display area and being continuous with the display area;
    A plurality of lower electrodes provided in each of the display area and the non-display area;
    a charge transport layer which is a single continuous layer provided across the display area and the non-display area;
    A first upper electrode layer provided in the display area;
    A second upper electrode layer provided in the non-display area;
    a light-emitting element provided in each of the plurality of sub-pixels, the light-emitting element including, in this order from the substrate side, the lower electrode, the charge transfer layer, a light-emitting layer, and the first upper electrode layer;
    a non-light-emitting charge transfer element provided in each of the plurality of dummy sub-pixels, the non-light-emitting charge transfer element including, in this order from the substrate side, the lower electrode, the charge transfer layer, a light-emitting layer, and the second upper electrode layer;
    the non-light-emitting charge transfer element is provided with a resistance adjustment layer between a first surface of the charge transfer layer facing the light-emitting layer and a second surface of the second upper electrode layer facing away from the substrate, the resistance adjustment layer having a resistivity higher than that of the first upper electrode layer and being 1× 10 Ω·cm or less.
  2.  前記第1上部電極層と前記第2上部電極層とは、電気的に接続されており、
     前記抵抗調整層は、前記第2上部電極層である、請求項1に記載の表示装置。
    the first upper electrode layer and the second upper electrode layer are electrically connected to each other,
    The display device according to claim 1 , wherein the resistance adjusting layer is the second upper electrode layer.
  3.  前記第1上部電極層は、一つの連続層として、前記非表示領域にも設けられており、
     前記非表示領域においては、前記第2上部電極層と前記第1上部電極層とが、前記基板側からこの順に積層されている、請求項2に記載の表示装置。
    the first upper electrode layer is also provided in the non-display area as one continuous layer,
    The display device according to claim 2 , wherein in the non-display region, the second upper electrode layer and the first upper electrode layer are laminated in this order from the substrate side.
  4.  前記第1上部電極層と前記第2上部電極層とは、同一材料で形成された一つの連続層であり、
     前記抵抗調整層は、前記第1の面と前記第2上部電極層の前記発光層側の面である第3の面との間に備えられている、請求項1に記載の表示装置。
    the first upper electrode layer and the second upper electrode layer are one continuous layer formed of the same material,
    The display device according to claim 1 , wherein the resistance adjusting layer is provided between the first surface and a third surface which is a surface of the second upper electrode layer on the light emitting layer side.
  5.  前記第1上部電極層と前記第2上部電極層とは、電気的に分離されており、
     前記抵抗調整層は、前記第2上部電極層であり、
     前記第1上部電極層には、第1配線を介して第1電圧が印加され、
     前記第2上部電極層には、第2配線を介して第2電圧が印加され、
     前記第1電圧と前記第2電圧とは同じ電圧である、請求項1に記載の表示装置。
    the first upper electrode layer and the second upper electrode layer are electrically isolated from each other;
    the resistance adjusting layer is the second upper electrode layer,
    a first voltage is applied to the first upper electrode layer via a first wiring;
    a second voltage is applied to the second upper electrode layer via a second wiring;
    The display device according to claim 1 , wherein the first voltage and the second voltage are the same voltage.
  6.  前記下部電極は、アノードであり、
     前記第1上部電極層及び前記第2上部電極層は、カソードであり、
     前記電荷移動層は、正孔注入層及び正孔輸送層の少なくとも一方である、請求項1から5の何れか1項に記載の表示装置。
    the lower electrode is an anode;
    the first upper electrode layer and the second upper electrode layer are cathodes;
    The display device according to claim 1 , wherein the charge transfer layer is at least one of a hole injection layer and a hole transport layer.
  7.  前記表示領域の前記発光層と前記第1上部電極層との間と、前記非表示領域の前記発光層と前記第2上部電極層との間には、電子注入層及び電子輸送層の少なくとも一方が設けられている、請求項6に記載の表示装置。 The display device according to claim 6, wherein at least one of an electron injection layer and an electron transport layer is provided between the light-emitting layer and the first upper electrode layer in the display area, and between the light-emitting layer and the second upper electrode layer in the non-display area.
  8.  前記下部電極は、カソードであり、
     前記第1上部電極層及び前記第2上部電極層は、アノードであり、
     前記電荷移動層は、電子注入層及び電子輸送層の少なくとも一方である、請求項1から5の何れか1項に記載の表示装置。
    the lower electrode is a cathode,
    the first upper electrode layer and the second upper electrode layer are anodes;
    The display device according to claim 1 , wherein the charge transfer layer is at least one of an electron injection layer and an electron transport layer.
  9.  前記表示領域の前記発光層と前記第1上部電極層との間と、前記非表示領域の前記発光層と前記第2上部電極層との間には、正孔注入層及び正孔輸送層の少なくとも一方が設けられている、請求項8に記載の表示装置。 The display device according to claim 8, wherein at least one of a hole injection layer and a hole transport layer is provided between the light-emitting layer and the first upper electrode layer in the display area, and between the light-emitting layer and the second upper electrode layer in the non-display area.
  10.  前記非表示領域は、前記表示領域を取り囲むように設けられている、請求項1から9の何れか1項に記載の表示装置。 The display device according to any one of claims 1 to 9, wherein the non-display area is provided so as to surround the display area.
  11.  前記非表示領域は、第1非表示領域と、第2非表示領域とを含み、
     前記表示領域より内側に、撮像光を透過する撮像領域が設けられており、
     前記第1非表示領域は、前記表示領域の外周を取り囲むように設けられ、
     前記第2非表示領域は、前記撮像領域を取り囲むように設けられている、請求項1から9の何れか1項に記載の表示装置。
    the non-display area includes a first non-display area and a second non-display area,
    an imaging area that transmits imaging light is provided inside the display area,
    the first non-display area is provided so as to surround the outer periphery of the display area,
    The display device according to claim 1 , wherein the second non-display area is provided so as to surround the imaging area.
PCT/JP2022/043436 2022-11-25 2022-11-25 Display device WO2024111104A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160260782A1 (en) * 2015-03-03 2016-09-08 Samsung Display Co., Ltd. Organic light emitting diode display and method of manufacturing the same
US20200006701A1 (en) * 2018-06-29 2020-01-02 Samsung Display Co., Ltd. Display panel and display device including display panel
US20200212134A1 (en) * 2018-12-28 2020-07-02 Lg Display Co., Ltd. Organic light-emitting display device and method of fabricating the same
US20200401273A1 (en) * 2019-06-21 2020-12-24 Samsung Display Co., Ltd. Electronic panel and electronic apparatus having the same
US20210175304A1 (en) * 2019-12-06 2021-06-10 Lg Display Co., Ltd. Electroluminescent Display Device
JP2021114426A (en) * 2020-01-20 2021-08-05 株式会社Joled Self-luminous panel and manufacturing method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160260782A1 (en) * 2015-03-03 2016-09-08 Samsung Display Co., Ltd. Organic light emitting diode display and method of manufacturing the same
US20200006701A1 (en) * 2018-06-29 2020-01-02 Samsung Display Co., Ltd. Display panel and display device including display panel
US20200212134A1 (en) * 2018-12-28 2020-07-02 Lg Display Co., Ltd. Organic light-emitting display device and method of fabricating the same
US20200401273A1 (en) * 2019-06-21 2020-12-24 Samsung Display Co., Ltd. Electronic panel and electronic apparatus having the same
US20210175304A1 (en) * 2019-12-06 2021-06-10 Lg Display Co., Ltd. Electroluminescent Display Device
JP2021114426A (en) * 2020-01-20 2021-08-05 株式会社Joled Self-luminous panel and manufacturing method therefor

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