WO2024111031A1 - Machining state prediction device and machining control device - Google Patents

Abstract

A machining state prediction device according to the present disclosure includes: a program analysis unit for analyzing command blocks upon reading a machining program for controlling operation of a thermal cutting machine; a machining path determination unit for determining a machining path of the thermal cutting machine on the basis of the analyzed command blocks; a machining condition determination unit for determining machining conditions of the thermal cutting machine on the basis of the command blocks; a condition change section determination unit for determining condition change sections, where machining conditions are changed, on the machining path on the basis of the determined machining path and machining conditions; a correction value determination unit for determining condition correction values in the condition change sections; a condition correction processing unit for determining machining condition changes in the condition change sections on the basis of the condition correction values; and a machining state output unit for outputting a prediction result of the machining state of the entire machining path on which the machining condition changes are reflected.

Description

Machining state prediction device and machining control device

This disclosure relates to a machining state prediction device and a machining control device.

For example, thermal cutting techniques such as gas cutting, laser cutting, plasma cutting, and electron beam cutting are known as techniques for cutting workpieces such as metal plates. In thermal cutting techniques, the workpiece is generally melted by irradiating it with thermal energy from a heat source, and the melted area is then removed to form a cut groove in the workpiece.

To explain this type of thermal cutting processing technology using laser cutting as an example, a laser beam is irradiated onto the workpiece to form a molten pool that penetrates the workpiece in the thickness direction, and this is then removed by an assist gas jet or the like while moving along a specified processing path to form a continuous cut groove (cut line). For example, in the case of laser cutting, the laser beam as thermal energy irradiated onto the workpiece has the property of converging at the focal position, so by adjusting this focal position relative to the workpiece surface, the degree of convergence of the laser beam can be changed and the spot diameter of the molten pool can be adjusted appropriately.

As an example of such a laser processing machine, for example, Patent Document 1 discloses a laser processing machine provided with a transient speed correction data calculation means for calculating and determining transient speed correction data based on the work cutting speed specified in the processing program stored in the first memory means and the beam diameter correction value in the processing condition file stored in the second memory means, an actual speed calculation means for detecting and calculating the actual speed of the work cutting, a correction amount calculation means for calculating and determining a correction amount based on the calculated transient speed correction data and the actual speed of the work cutting, and a correction execution means for shifting the processing path in a direction perpendicular to the cutting direction based on the calculated correction amount. It is said that this laser processing machine can reduce cutting shape errors when accelerating and decelerating the work.

Japanese Patent Application Laid-Open No. 4-86903

Workpieces come in a variety of shapes, and the specified machining path is set arbitrarily to match that shape. For example, when the machining path changes direction at a bend point, the machining speed drops near the bend point, so a laser machining machine is used that can reduce cutting shape errors during acceleration and deceleration as described above. However, the control method used in conventional laser machining detects the actual speed during actual machining and calculates the amount of correction based on the difference between the actual speed and the expected speed specified in the machining program, so correction can only be made while machining is actually taking place, and there is a problem that calculating the amount of correction after measuring the actual speed causes a delay (control delay) before the actual correction operation is performed.

In light of these circumstances, there is a demand for processing control technology that can control processing of thermal cutting machines without causing control delays that arise from the operation of measuring and correcting the actual speed during processing.

The machining state prediction device according to one aspect of the present disclosure includes a program analysis unit that reads a machining program that controls the operation of a thermal cutting machine and analyzes a command block, a machining path determination unit that determines a machining path for the thermal cutting machine based on the analyzed command block, a machining condition determination unit that determines machining conditions for the thermal cutting machine based on the analyzed command block, a condition change section determination unit that determines a condition change section on the machining path where the machining conditions are changed based on the determined machining path and machining conditions, a correction value determination unit that determines a condition correction value in the condition change section, a condition correction processing unit that determines changed machining conditions in the condition change section based on the condition correction value, and a machining state output unit that outputs a predicted result of the machining state for the entire machining path reflecting the changed machining conditions.

In addition, a processing control device according to another aspect of the present disclosure includes a program analysis unit that reads a processing program that controls the operation of a thermal cutting machine and analyzes a command block, a processing path determination unit that determines a processing path for the thermal cutting machine based on the analyzed command block, a processing condition determination unit that determines processing conditions for the thermal cutting machine based on the analyzed command block, a condition change section determination unit that determines a condition change section on the processing path where the processing conditions are changed based on the determined processing path and processing conditions, a correction value determination unit that determines a condition correction value in the condition change section, a condition correction processing unit that determines changed processing conditions in the condition change section based on the condition correction value, and a main control unit that outputs processing control commands for the entire processing path based on the processing conditions that reflect the changed processing conditions.

1 is a block diagram showing a configuration of a laser processing apparatus including a display device and a processing control device according to a first embodiment. 1 is a top view showing an arrangement of a workpiece and a machining path simulated by a machining prediction device according to a first embodiment. FIG. 13 is a graph showing an example of information on changed processing conditions. 4 is an example of a two-dimensional image showing a processing state when processing is performed based on the changed processing conditions shown in FIG. 3 . 11 is a two-dimensional image showing an example of a predicted result of a kerf groove after cutting. 1 is a top view showing an arrangement of a workpiece and another machining path simulated by the machining prediction device according to the first embodiment; FIG. 7 is an example of a two-dimensional image showing a machining state when machining is performed on another machining path shown in FIG. 6 . FIG. 11 is a block diagram showing a configuration of a machining state predicting device according to a first modified example. FIG. 11 is a top view showing an arrangement of a workpiece and a machining path simulated by a machining prediction device according to a second modified example. 13 is a graph showing an example of information on changed processing conditions in the second modified example. 11 is an example of a two-dimensional image showing a processing state when processing is performed based on the changed processing conditions shown in FIG. 10 . 13 is a two-dimensional image showing an example of a predicted result of a kerf groove after cutting according to the second modified example. 13 is a graph showing another example of information on changed processing conditions in the second modified example. 14 is an example of a two-dimensional image showing a processing state when processing is performed based on the changed processing conditions shown in FIG. 13. 14 is a two-dimensional image showing an example of a predicted result of a kerf groove after cutting based on the changed machining conditions shown in FIG. 13. FIG. 13 is a top view showing an arrangement of a workpiece and a machining path simulated by a machining prediction device according to a third modified example. 13 is a graph showing an example of information on changed processing conditions in the third modified example. 18 is an example of a two-dimensional image showing a processing state when processing is performed based on the changed processing conditions shown in FIG. 17. 13 is a two-dimensional image showing an example of a predicted result of a kerf groove after cutting according to the third modified example. 1 is a schematic diagram showing an overall configuration of a thermal cutting machine including a processing control device according to a second embodiment. FIG. FIG. 11 is a block diagram showing a configuration of a machining control device according to a second embodiment.

Below, an embodiment of a processing state prediction device and a processing control device having a function of predicting the processing state of a thermal cutting machine based on a processing program according to a representative example of the present disclosure will be described with reference to the drawings.

In this disclosure, "based on XX" means "based on at least XX," and includes cases where it is based on other elements in addition to XX. Furthermore, "based on XX" is not limited to cases where XX is used directly, but also includes cases where it is based on XX that has been calculated or processed. Here, "XX" means any element (for example, any information).

In addition, in this disclosure, a "thermal cutting machine" refers to a machine that applies thermal energy with a predetermined spot diameter to a metal object to be processed (workpiece W) to form a melt spot on the workpiece W, and then performs an operation of continuously removing the melt spot along a predetermined processing path to form a cut groove in the workpiece W. Examples of such thermal cutting machines include gas processing machines, plasma processing machines, laser processing machines, electron beam processing machines, and ion beam processing machines, but the following describes the case where a laser processing machine (laser processing device) is used.

First Embodiment
FIG. 1 is a block diagram showing a configuration of a machining state prediction device according to a first embodiment which is a representative example of the present disclosure.

As shown in FIG. 1, the machining state prediction device 100 according to the first embodiment includes, as an example, a main control unit 110, a program analysis unit 120, a machining path determination unit 130, a machining condition determination unit 132, a condition change section determination unit 134, a correction value determination unit 136, a condition correction processing unit 138, and a machining state output unit 140. This machining state prediction device 100 is configured to have the function of predicting the machining state of a thermal cutting machine based on a machining program.

The machining state prediction device 100 in this disclosure is, for example, configured with a computer including a processor, a CPU, etc., having the functions of each unit shown in FIG. 1. In this case, each component of the machining state prediction device 100 may also have a memory that temporarily stores information.

The main control unit 110 of the first embodiment controls the overall operation of the machining state prediction device 100, and is connected to peripheral devices to transmit and receive various signals. As an example, as shown in FIG. 1, the main control unit 110 reads a machining program that controls the operation of a thermal cutting machine from an external storage device or recording medium such as a database (not shown), and sends it to the program analysis unit 120, and also outputs the machining state prediction result received from the machining state output unit 140 as output data to an external display device.

As an example, the program analysis unit 120 receives a machining program from the main control unit 110, analyzes it, and determines what command blocks are included in the machining program. The program analysis unit 120 may have a function to temporarily store and save the loaded machining program and the determined command blocks. The program analysis unit 120 then sends information on the determined command blocks of the machining program to the machining path determination unit 130 and the machining condition determination unit 132.

The machining path determination unit 130 determines the machining path along which the thermal cutting machine operates based on the command block information analyzed by the program analysis unit 120. The determined machining path information is sent to the condition change section determination unit 134.

The machining condition determination unit 132 determines the machining conditions for the machining that the thermal cutting machine actually performs, based on the information of the command block analyzed by the program analysis unit 120. Information on the determined machining conditions is sent to the condition change section determination unit 134.

The condition change section determination unit 134 associates the sent processing path information with the processing condition information, determines which section of the processing path needs to have the processing conditions changed, and determines the condition change section on the processing path where the processing conditions will be changed. The procedure by which the condition change section determination unit 134 determines the condition change section will be described later. The condition change section determination unit 134 then sends information on the determined condition change section to the correction value determination unit 136 together with the above-mentioned processing path and processing condition information.

The correction value determination unit 136 determines the condition correction value for the machining conditions in the condition change section based on the transmitted machining conditions and information on the condition change section. As an example, the correction value determination unit 136 determines the condition correction value based on an arithmetic expression including various machining parameters described below. The correction value determination unit 136 then transmits information on the determined condition correction value to the condition correction processing unit 138 together with the above-mentioned machining path, machining conditions, and information on the condition change section.

The condition correction processing unit 138 determines the changed processing conditions in the condition change section based on the condition correction value sent. The condition correction processing unit 138 then sends information on the processing conditions obtained by changing the changed processing conditions in the condition change section in the processing path determined by the processing path determination unit 130, together with information on the associated processing path, to the processing state output unit 140.

The machining state output unit 140 creates output data of the predicted machining state for the entire machining path reflecting the changed machining conditions based on the machining path and machining condition information sent to it, and outputs the output data to the main control unit 110. Examples of output data created by the machining state output unit 140 include two-dimensional image data including the machining path on the workpiece W and the machined cutting groove.

Next, an overview of the machining prediction operation performed by the machining state prediction device according to the first embodiment will be described using Figures 2 to 7.

FIG. 2 is a top view showing the arrangement of the workpiece and machining path simulated by the machining prediction device according to the first embodiment. FIG. 3 is a graph showing an example of information on changed machining conditions. FIG. 4 is an example of a two-dimensional image showing the machining state when machining is performed based on the changed machining conditions shown in FIG. 3. FIG. 5 is a two-dimensional image showing an example of a predicted result of the cut groove after cutting. FIG. 6 is a top view showing the arrangement of the workpiece and other machining paths simulated by the machining prediction device according to the first embodiment. FIG. 7 is an example of a two-dimensional image showing the machining state when machining is performed on the other machining path shown in FIG. 6.

As an example of a case where it is necessary to change the processing conditions when machining along a specified machining path, consider a case where cutting is started at a machining start point P1 along a linear machining path R1 on the workpiece W and ends and stops at a machining end point P3, as shown in Figure 2. In such a case, after cutting is performed at a specified speed from the machining start point P1 on the machining path R1, it is preferable to slightly reduce the machining speed in the section after a specified midpoint P2 in order to reduce the load due to inertia on the machining device when machining ends (i.e. stops) at the machining end point P3.

More specifically, the condition change section determination unit 134 of the machining state prediction device 100 determines the position of the midpoint P2 for defining the condition change section CS for slightly slowing down the machining speed, based on the machining path and machining condition information determined by the machining path determination unit 130 and the machining condition determination unit 132. At this time, the position of the midpoint P2 is determined by appropriate calculation, taking into consideration the rigidity of the entire machining device, the time required for the entire cutting process (takt time), etc.

Then, the correction value determination unit 136 of the machining state prediction device 100 determines the machining condition items to be changed in the condition change section CS and their correction values. In the case of the machining path R1 shown in FIG. 2, as an example, the machining speed, which is one of the machining conditions in the condition change section CS, is reduced. The correction value of the machining speed at this time is determined using a relational expression between the known amount of heat input per unit time and the molten pool diameter at a specified laser output that takes into account the material and thickness of the workpiece W.

If the processing conditions (such as the output of the laser beam) from the processing start point P1 to the midpoint P2 are maintained in the condition change section CS after the midpoint P2, it will not be possible to form the same melt diameter (i.e., the width H of the cut groove shown in FIG. 5) as before. Therefore, when determining the correction value of the processing conditions by the correction value determination unit 136 described above, in order to keep the predetermined width H of the cut groove constant throughout the entire processing path R1, it is preferable to also reduce the laser output of the laser beam.

Then, the condition correction processing unit 138 of the machining state prediction device 100 determines the changed machining conditions for the entire machining path R1 in association with the machining positions, taking into account the correction values of the machining conditions in the condition change section CS, as shown in FIG. 3, for example. Then, as described above, the condition correction processing unit 138 sends information on the changed machining conditions to the machining state output unit 140.

Then, the machining state output unit 140 of the machining state prediction device 100 creates output data predicting the machining state when cutting is actually performed based on the received information on the changed machining conditions. One example of this output data is a two-dimensional image simulating the molten pool PD1 and the beam spots BS1 and BS2 of the laser beam for the machining path R1, as shown in Figure 4.

In other words, with the predicted output data, cutting begins at the processing start point P1 under processing conditions of processing speed V1, laser beam spot BS1, and molten pool PD1. Then, at midpoint P2, which is the start position of the condition change section CS where the heat capacity of the workpiece W changes, cutting is performed with processing conditions changed to processing speed V2 and beam spot BS2, until it reaches processing end point P3.

Then, in addition to the two-dimensional image shown in FIG. 4, the processing state output unit 140 can also create a two-dimensional image of the predicted shape of the kerf groove CG on the workpiece W after cutting, as shown in FIG. 5, for example. In the example shown in FIG. 5, by adjusting both the processing speed and the laser output in the condition change section CS, the width H of the kerf groove CG becomes uniform throughout the entire processing path R1.

Then, the processing state output unit 140 outputs the output data of the prediction results shown in Figs. 4 and 5 to the main control unit 110. The main control unit 110 that receives this output data can, for example, output the received output data as described above to an external display device to display the prediction results.

The above prediction of the machining state can also be applied to cutting processes that cut out the inside of a workpiece W along a circular machining path R1, as shown in FIG. 6. In other words, when cutting starts at a machining start point P1 for a circular machining path R1 and ends and stops at a machining end point P3, it can also be performed in cutting processes that reduce the machining speed at a midpoint P2 on the machining path R1.

In the case of such a machining path R1, output data such as that shown in Figure 7 is predicted. That is, at the machining start point P1, cutting processing is started under machining conditions of machining speed V1, laser beam spot BS1, and molten pool PD1, and processing continues along the circular machining path R1 under these machining conditions. Then, at the midpoint P2, which is the start position of the condition change section CS where the heat capacity of the workpiece W changes, the machining conditions are changed to machining speed V2 and beam spot BS2, and cutting processing is performed up to the machining end point P3.

Next, a modified example of the machining state prediction device and machining prediction operation according to the first embodiment will be described using Figures 8 to 19.

FIG. 8 is a block diagram showing the configuration of a machining state prediction device according to a first modified example of the first embodiment.

In the machining state prediction device 100 according to the first modified example of the first embodiment, the correction value determination unit 136 determines the condition correction value for the machining conditions in the condition change section based on the transmitted machining conditions and information on the condition change section by reading the correction value data stored in an external storage device or recording medium such as a database (not shown). At this time, the stored correction value data includes past performance values from actual cutting processing by a thermal cutting machine, machining conditions corresponding to the materials or shapes of various workpieces, etc., and the correction value determination unit 136 has a function of selecting the appropriate machining condition for the condition change section CS to be determined this time from this correction value data.

As a result, the correction value determination unit 136 does not need to calculate the correction value in the condition change section CS, which improves the prediction speed and reduces the calculation load. In addition, by using correction value data based on past processing results, it is possible to change the processing conditions in accordance with the actual processing, and as a result, the prediction accuracy can be improved.

FIG. 9 is a top view showing the arrangement of the workpiece and machining path simulated by the machining prediction device according to the second modified example of the first embodiment. FIG. 10 is a graph showing an example of information on modified machining conditions in the second modified example. FIG. 11 is an example of a two-dimensional image showing the machining state when machining is performed based on the modified machining conditions shown in FIG. 10. Furthermore, FIG. 12 is a two-dimensional image showing an example of the predicted result of the cut groove after cutting according to the second modified example.

FIG. 13 is a graph showing another example of information on modified processing conditions in the second modified example of the first embodiment. FIG. 14 is an example of a two-dimensional image showing the processing state when processing is performed based on the modified processing conditions shown in FIG. 13. FIG. 15 is a two-dimensional image showing an example of a predicted result of the cut groove after cutting processing based on the modified processing conditions shown in FIG. 13.

In the second modified example of the first embodiment, for example as shown in FIG. 9, assume a case where machining is performed along the inside of a machining path R2 that starts from a machining start point P1, bends at a midpoint P2, and reaches a machining end point P3. In such a case, since there is a section where the machining speed momentarily becomes zero near the midpoint P2 where the path bends, it is necessary to change the machining conditions in the section that includes the midpoint P2.

More specifically, the condition change section determination unit 134 of the machining state prediction device 100 identifies a change start point P4 of the condition change section CS, where deceleration begins, in the section from the machining start point P1 to the midpoint P2 on the machining route R2, based on the machining route and machining condition information determined by the machining route determination unit 130 and the machining condition determination unit 132. Specifically, if the distance from the change start point P4 to the midpoint P2 is L, the machining speed up to the change start point P4 is V, and the acceleration/deceleration time constant of the laser machining machine performing the machining is t, the relationship in the following equation (1) holds.

If the workpiece W is placed on the XY plane, and the coordinates of the machining start point P1 are (X1, Y1), the coordinates of the intermediate point P2 are (X2, Y2), and the coordinates of the change start point P4 are (X4, Y4), then the following relationship (2) holds between this and the distance L for deceleration.

Similarly, the condition change section determination unit 134 identifies a change end point P5 of the condition change section CS where re-acceleration ends in the section from the midpoint P2 to the machining end point P3, based on the machining path and machining condition information. As in the case of determining the change start point P4, assuming the relationship in formula (1), if the coordinates of the midpoint P2 are (X2, Y2), the coordinates of the machining end point P3 are (X3, Y3), and the coordinates of the change end point P5 are (X5, Y5), the relationship in formula (3) below holds with the distance L for re-acceleration.

The condition change section determination unit 134 calculates the coordinates of the change start point P4 and the change end point P5 from the above relational expressions, determines the condition change section CS based on these, and sends this information to the correction value determination unit 136. Next, the correction value determination unit 136 determines the items of processing conditions to be changed in the condition change section CS and their correction values (e.g., correction values for processing speed and laser output).

Then, as shown in FIG. 10, for example, the condition correction processing unit 138 of the machining state prediction device 100 determines changed machining conditions for the entire machining path R2 in association with the machining positions while taking into account the correction values of the machining conditions in the condition change section CS, and sends information on the changed machining conditions to the machining state output unit 140. Next, based on the received information on the changed machining conditions, the machining state output unit 140 creates output data predicting the machining state when cutting is actually performed, as shown in FIG. 11, for example.

In other words, with the predicted output data, cutting starts at the processing start point P1 under processing conditions of processing speed V1, laser beam spot BS1, and molten pool PD1. Then, at the change start point P4 of the condition change section CS, cutting is performed with the processing conditions changed to processing speed V2 and beam spot BS2, up to the midpoint P2.

Then, after the machining path R2 is bent once at midpoint P2, the cutting process continues in the condition change section CS up to the change end point P5 under machining conditions of machining speed V2, laser beam spot BS2, and molten pool PD1. Then, at the change end point P5 of the condition change section CS, the machining conditions are returned to machining speed V1 and beam spot BS1, and the cutting process continues up to the machining end point P3.

Then, the machining state output unit 140 creates a two-dimensional image of the predicted shape of the kerf groove CG on the workpiece W after cutting, as shown in FIG. 12, for example, in addition to the two-dimensional image shown in FIG. 11. In the example shown in FIG. 12, even if the machining path R2 includes a bending machining point, the width H of the kerf groove CG becomes uniform throughout the entire machining path R2 by adjusting both the machining speed and the laser output in the condition change section CS.

As another specific example of the second modified example of the first embodiment, the correction value determination unit 136 may adjust the machining conditions to be changed in the condition change section CS so that they change continuously. Next, the condition correction processing unit 138 of the machining state prediction device 100 determines the changed machining conditions for the entire machining path R2 in association with the machining positions, taking into account the correction value of the machining conditions in the condition change section CS, and sends information on the changed machining conditions to the machining state output unit 140.

In other words, the modified processing conditions are such that, for example, as shown in FIG. 13, in the section from the change start point P4 to the midpoint P2 of the condition change section CS, the laser output is continuously decelerated and reduced, and in the section from the midpoint P2 to the change end point P5, the laser output is continuously accelerated and increased.

Then, the processing state output unit 140 creates output data that predicts the processing state when cutting is actually performed, for example, as shown in FIG. 14, based on the received information on the changed processing conditions.

In other words, with the predicted output data, cutting processing begins at the processing start point P1 under processing conditions of a processing speed of V1, a laser beam spot of BS1, and a molten pool of PD1. Then, in the condition change section CS from the change start point P4 to the midpoint P2, cutting processing is performed in which the processing conditions change continuously so that the processing speed becomes zero and the beam spot becomes BS2.

Then, after the machining path R2 bends once at midpoint P2, in the condition change section CS up to the change end point P5, the cutting process continues with the machining conditions changing continuously so that the machining speed goes from zero to V1, the beam spot goes from BS2 to BS1, and the molten pool goes from PD2 to PD1. Then, at the change end point P5 of the condition change section CS, the machining conditions are returned to V1, with the machining speed and BS1 beam spot, and the cutting process continues up to the machining end point P3.

At this time, as shown in Figure 14, the diameter of the molten pool changes continuously from PD1 to PD2 in the condition change section CS, so it is preferable to move the outer periphery of the molten pool PD1 or PD2 so that it is in contact with the processing path R2 by performing position control of the irradiation point of the laser beam as is conventionally known.

Then, the machining state output unit 140 creates a two-dimensional image of the predicted shape of the kerf groove CG on the workpiece W after cutting, as shown in FIG. 15, for example, in addition to the two-dimensional image shown in FIG. 14. In the example shown in FIG. 15, even if the machining path R2 includes a bending machining point, it is possible to machine the kerf groove CG to a position closer to the midpoint P2 by continuously changing the machining speed and laser output in the condition change section CS and controlling the position of the irradiation point so that the outer periphery of the molten pool formed by the laser beam in the condition change section CS follows the machining path R2.

FIG. 16 is a top view showing the arrangement of the workpiece and machining path simulated by the machining prediction device according to the third modified example of the first embodiment. FIG. 17 is a graph showing an example of information on modified machining conditions in the third modified example. FIG. 18 is an example of a two-dimensional image showing the machining state when machining is performed based on the modified machining conditions shown in FIG. 17. Furthermore, FIG. 19 is a two-dimensional image showing an example of the predicted result of the cut groove after cutting according to the third modified example.

In the third modified example of the first embodiment, as shown in FIG. 16, for example, machining is performed along the inside of a machining path R2 that starts from a machining start point P1, bends at a midpoint P2, and reaches a machining end point P3. In contrast to the first modified example, the condition change section CS is further divided into multiple sections to change the machining conditions in multiple stages. Note that the specific example in FIG. 16 shows a case in which the section of the condition change section CS that decelerates toward the midpoint P2 is divided into two sections, a first change section CS1 and a second change section CS2, and the section of the condition change section CS that accelerates from the midpoint P2 is divided into two sections, a third change section CS3 and a fourth change section CS4.

More specifically, the condition change section determination unit 134 of the machining state prediction device 100 identifies a change start point P4 at which the first deceleration begins and a first additional change point P6 at which the second acceleration/deceleration begins in the section from the machining start point P1 to the midpoint P2 on the machining route R2, based on the machining route and machining condition information determined by the machining route determination unit 130 and the machining condition determination unit 132. At this time, the coordinate value of the first additional change point P6 can be obtained, for example, using the above-mentioned formula (2).

Similarly, the condition change section determination unit 134 identifies a second additional change point P7 at which the first re-acceleration ends and a change end point P5 at which the machining speed returns to the machining speed specified in the machining program in the section from the midpoint P2 to the machining end point P3, based on the machining path and machining condition information. At this time, the coordinate value of the second additional change point P7 can be obtained, for example, using the above-mentioned formula (3).

The condition change section determination unit 134 calculates the coordinate values of the change start point P4 and the first added change point P6 from the above relational equation to determine the first change section CS1 and the second change section CS2. Similarly, the condition change section determination unit 134 calculates the coordinate values of the second added change point P7 and the change end point P5 from the above relational equation to determine the third change section CS3 and the fourth change section CS4. The condition change section determination unit 134 then sends information on the first change section CS1 to the fourth change section CS4 determined as described above to the correction value determination unit 136.

Then, the correction value determination unit 136 determines the items of the processing conditions to be set in the first change section CS1 to the fourth change section CS4 of the condition change section CS and their correction values (e.g., correction values for processing speed and laser output).The correction value determination unit 136 then sends information on the processing conditions to be changed in the first change section CS1 to the fourth change section CS4 determined as described above and their correction values to the condition correction processing unit 138.

Then, as shown in FIG. 17, for example, the condition correction processing unit 138 of the machining state prediction device 100 determines changed machining conditions for the entire machining path R2 in association with the machining positions while taking into account the correction values of the machining conditions in the condition change section CS, and sends information on the changed machining conditions to the machining state output unit 140. Next, based on the received information on the changed machining conditions, the machining state output unit 140 creates output data predicting the machining state when cutting is actually performed, as shown in FIG. 16, for example.

In other words, with the predicted output data, cutting processing begins at processing start point P1 under processing conditions of processing speed V1, laser beam beam spot BS1, and molten pool PD1. Next, at change start point P4 of condition change section CS, the processing speed is changed to V2 and the beam spot BS3, and processing continues up to first change point P6. Next, at first change point P6, the processing speed is changed to V3 and the beam spot BS2, and processing continues up to midpoint P2.

Then, after the machining path R2 is bent once at midpoint P2, cutting continues under machining conditions of machining speed V3 and beam spot BS2. Next, at the second change point P7, the machining speed is changed to V2 and the beam spot BS3, and cutting continues up to the first change point P6. Then, at the change end point P5, the machining conditions are returned to machining speed V1 and beam spot BS1, and cutting continues up to the machining end point P3.

Then, the machining state output unit 140 creates a two-dimensional image of the shape prediction result of the kerf groove CG on the workpiece W after cutting, as shown in FIG. 19, for example, in addition to the two-dimensional image shown in FIG. 18. In the example shown in FIG. 19, even in the case of a machining path R2 that includes a bending machining point, by further dividing the condition change section CS into multiple sections and changing the machining conditions in multiple stages, it is possible to adjust the width H of the kerf groove CG more precisely.

By being equipped with the above-mentioned configuration, the processing prediction device according to the first embodiment analyzes the processing program that controls the operation of the thermal cutting machine, identifies the condition change section from the processing path and processing condition information obtained from the command block, and determines the changed processing conditions taking into account the correction value in the condition change section, thereby eliminating the control delay caused by the operation of measuring and correcting the actual speed during processing and predicting the processing state of the thermal cutting machine. Furthermore, by using the prediction result, it is possible to eliminate the above-mentioned control delay and control the processing of the thermal cutting machine.

Second Embodiment
Fig. 20 is a schematic diagram showing the overall configuration of a thermal cutting machine including a processing control device according to a second embodiment of the present disclosure. Fig. 21 is a block diagram showing the configuration of the processing control device according to the second embodiment. In the second embodiment, in the schematic diagrams shown in Figs. 1 to 19, components that may be the same as or in common with the first embodiment are denoted by the same reference numerals and will not be described again.

The thermal cutting machine 1 to which the processing control device 200 according to the second embodiment of the present disclosure is applied is, for example, a laser processing device, and as an example thereof, as shown in FIG. 20, includes a laser oscillator 10 that oscillates processing laser light LB, a processing table 20 that holds a workpiece W, a processing head 30 that irradiates the processing laser light LB onto the workpiece W, a transport mechanism 40 that moves the processing head 30 relative to the processing table 20, and a processing control device 200 that controls a predetermined laser processing operation on the workpiece W.

The laser oscillator 10 is applied with a laser source having a wavelength with high absorption efficiency according to the material of the workpiece W to be processed. Examples of such a laser oscillator 10 include a YAG laser, a _YVO4 laser, a fiber laser, a disk laser, and the like that are capable of fiber transmission. The processing laser light LB output from the laser oscillator 10 is transmitted to the processing head 30 via a transmission path 12 such as an optical fiber.

The processing table 20, for example, includes a chuck mechanism (not shown) for mounting the workpiece W, and is configured to grip and fix the workpiece W. The processing table 20 may also include a rotation mechanism, in addition to a mechanism for moving the workpiece W in three axial directions, X, Y and Z.

As an example, the processing head 30 introduces processing laser light LB from one end (upper end) and emits it from a nozzle 32 on the other end (lower end) toward the workpiece W. At this time, a focusing lens (not shown) arranged inside the processing head 30 focuses the processing laser light LB to a predetermined beam diameter at a focusing point FP on the workpiece W.

In addition, high-pressure oxygen gas or compressed air is introduced into the processing head 30 and is sprayed coaxially with the processing laser light LB from the nozzle 32 as an assist gas for the laser cutting process. Furthermore, the processing head 30 may also have a built-in output sensor (not shown) that measures the laser output value P of the processing laser light LB and has the function of transmitting the detection signal to the processing control device 200.

As an example, the transport mechanism 40 is configured as a linear drive body that moves relatively in three mutually orthogonal axial directions, XYZ, and the processing head 30 is attached to one end of the linear drive body. The transport mechanism 40 may also be configured as a 6-axis or 7-axis type industrial robot equipped with a robot arm having the processing head 30 attached to one end.

As an example, as shown in FIG. 21, the machining control device 200 according to the second embodiment includes a main control unit 210, a program analysis unit 220, a machining path determination unit 230, a machining condition determination unit 232, a condition change section determination unit 234, a correction value determination unit 236, a condition correction processing unit 238, a display device 250, and an input unit 260.

The main control unit 210 of the second embodiment controls the overall operation of the machining state prediction device 200, and is connected to peripheral devices to transmit and receive various signals. As an example, as shown in Figures 20 and 21, the main control unit 210 reads a machining program that controls the operation of the thermal cutting machine from an external storage device or recording medium such as a database (not shown), and sends it to the program analysis unit 220, and outputs various operation command signals based on the changed machining conditions received from the condition correction processing unit 238 to each component of the thermal cutting machine 1.

As in the first embodiment, the program analysis unit 220 receives the machining program from the main control unit 210, analyzes it, and determines what command blocks are included in the machining program. The program analysis unit 220 then sends information about the determined command blocks of the machining program to the machining path determination unit 230 and the machining condition determination unit 232.

As in the first embodiment, the machining path determination unit 230 determines the machining path along which the thermal cutting machine operates based on the information of the command block analyzed by the program analysis unit 220. Information on the determined machining path is sent to the condition change section determination unit 234.

As in the first embodiment, the machining condition determination unit 232 determines the machining conditions for the machining that the thermal cutting machine actually performs based on the information of the command block analyzed by the program analysis unit 220. Information on the determined machining conditions is sent to the condition change section determination unit 234.

As in the first embodiment, the condition change section determination unit 234 associates the received processing path information with processing condition information, determines which section of the processing path needs to have the processing conditions changed, and determines the condition change section on the processing path where the processing conditions will be changed. The condition change section determination unit 234 then sends information on the determined condition change section to the correction value determination unit 236 together with the above-mentioned processing path and processing condition information.

The correction value determination unit 236, as in the first embodiment, determines the condition correction value for the machining conditions in the condition change section based on the transmitted machining conditions and information on the condition change section. The correction value determination unit 236 then transmits the determined condition correction value information to the condition correction processing unit 238 together with the above-mentioned machining path, machining conditions, and information on the condition change section.

The condition correction processing unit 238 determines the changed processing conditions in the condition change section based on the condition correction value sent, as in the first embodiment. The condition correction processing unit 238 then sends information on the processing conditions obtained by changing the changed processing conditions in the condition change section in the processing path determined by the processing path determination unit 230, together with information on the associated processing path, to the main control unit 210.

The display device 250 displays various parameter command values for the cutting process executed by the thermal cutting machine 1 sent from the main control unit 210, detection information obtained from various sensors, etc. The display device 250 can also display the above-mentioned changed processing conditions as a predicted diagram of the entire processing path.

The input unit 260 is configured as a data input means that allows an operator using the machining control device 200 to directly input various machining conditions and parts of the machining program to correct or update them. Note that while Figs. 20 and 21 show an example in which the display device 250 and the input unit 260 are configured as separate entities, they may also be configured to be integrated together using, for example, a touch panel type display device.

By being equipped with the above-mentioned configuration, the processing control device according to the second embodiment can analyze the processing program and identify the condition change section where the processing conditions are changed and the correction value for that section without actually performing a test cutting process, so that the processing control of the thermal cutting machine can be performed without the control delay caused by the operation of measuring and correcting the actual speed during processing.

Although the present disclosure has been described in detail above, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible to these embodiments without departing from the gist of the present disclosure, or without departing from the gist of the present disclosure derived from the contents described in the claims and their equivalents. These embodiments can also be implemented in combination. For example, in the above-mentioned embodiments, the order of each operation and the order of each process are shown as examples, and are not limited to these. The same applies when numerical values or formulas are used to explain the above-mentioned embodiments.

For example, in the above embodiment, the processing speed and the laser output of the laser beam are changed as processing conditions that are changed in the laser cutting process. However, the spot diameter of the laser beam, the pulse frequency or duty ratio when the laser beam is pulsed, etc. may also be changed as processing conditions.

The following notes are further provided with respect to the above embodiments and variations.

(Appendix 1)
a program analysis unit that reads a processing program that controls the operation of the thermal cutting machine and analyzes a command block;
a machining path determination unit that determines a machining path of the thermal cutting machine based on the analyzed command block;
a processing condition determination unit that determines processing conditions of the thermal cutting machine based on the analyzed command block;
a condition change section determination unit that determines a condition change section on the machining path in which the machining conditions are changed based on the machining path and the machining conditions;
a correction value determination unit that determines a condition correction value in the condition changing section;
a condition correction processing unit that determines a changed processing condition in the condition change section based on the condition correction value;
a machining state output unit that outputs a prediction result of a machining state of the entire machining path in which the changed machining conditions are reflected;
A machining state prediction device comprising:
(Appendix 2)
2. The machining state predicting device according to claim 1, wherein the correction value determination unit determines the condition correction value by performing calculation processing based on a predetermined calculation formula.
(Appendix 3)
2. The machining state predicting device according to claim 1, wherein the correction value determination unit determines the condition correction value by reading out the condition correction value stored in a predetermined storage device.
(Appendix 4)
the condition-change section determination unit defines the condition-change section by a plurality of divided sections;
The machining state predicting device according to any one of Supplementary notes 1 to 3, wherein the correction value determination unit determines the condition correction value for each of the plurality of divided sections.
(Appendix 5)
The processing state prediction device according to any one of claims 1 to 4, wherein the condition correction value is an output condition of the thermal cutting machine.
(Appendix 6)
a program analysis unit that reads a processing program that controls the operation of the thermal cutting machine and analyzes a command block;
a machining path determination unit that determines a machining path of the thermal cutting machine based on the analyzed command block;
a processing condition determination unit that determines processing conditions of the thermal cutting machine based on the analyzed command block;
a condition change section determination unit that determines a condition change section on the machining path in which the machining conditions are changed based on the machining path and the machining conditions;
a correction value determination unit that determines a condition correction value in the condition changing section;
a condition correction processing unit that determines a changed processing condition in the condition change section based on the condition correction value;
A main control unit outputs a machining control command for the entire machining path based on the machining conditions reflecting the changed machining conditions;
A processing control device including:
(Appendix 7)
The processing control device according to claim 6, wherein the correction value determination unit determines the condition correction value by performing calculation processing based on a predetermined calculation formula.
(Appendix 8)
The processing control device according to claim 6, wherein the correction value determination unit determines the condition correction value by reading out the condition correction value stored in a predetermined storage device.
(Appendix 9)
the condition-change section determination unit defines the condition-change section by a plurality of divided sections;
The machining control device according to any one of Supplementary Notes 6 to 8, wherein the correction value determination unit determines the condition correction value for each of the plurality of divided sections.
(Appendix 10)
The processing control device according to any one of claims 6 to 9, wherein the condition correction value is an output condition of the thermal processing cutter.

REFERENCE SIGNS LIST 1 Thermal cutting machine 10 Laser oscillator 12 Transmission path 20 Machining table 30 Machining head 32 Nozzle 40 Conveying mechanism 100 Machining state prediction device 110 Main control unit 120 Program analysis unit 130 Machining path determination unit 132 Machining condition determination unit 134 Condition change section determination unit 136 Correction value determination unit 138 Condition correction processing unit 140 Machining state output unit 200 Machining control device 210 Main control unit 220 Program analysis unit 230 Machining path determination unit 232 Machining condition determination unit 234 Condition change section determination unit 236 Correction value determination unit 238 Condition correction processing unit 250 Display device 260 Input unit

Claims (10)

1. a program analysis unit that reads a processing program that controls the operation of the thermal cutting machine and analyzes a command block;
   a machining path determination unit that determines a machining path of the thermal cutting machine based on the analyzed command block;
   a processing condition determination unit that determines processing conditions of the thermal cutting machine based on the analyzed command block;
   a condition change section determination unit that determines a condition change section on the machining path in which the machining conditions are changed based on the machining path and the machining conditions;
   a correction value determination unit that determines a condition correction value in the condition changing section;
   a condition correction processing unit that determines a changed processing condition in the condition change section based on the condition correction value;
   a machining state output unit that outputs a prediction result of a machining state of the entire machining path in which the changed machining conditions are reflected;
   A machining state prediction device comprising:
2. The machining state predicting device according to claim 1 , wherein the correction value determination section determines the condition correction value by performing a calculation process based on a predetermined calculation formula.
3. 2. The machining state predicting device according to claim 1, wherein the correction value determining section determines the condition correction value by reading out the condition correction value stored in a predetermined storage device.
4. the condition-change section determination unit defines the condition-change section by a plurality of divided sections;
   4. The machining state predicting device according to claim 1, wherein the correction value determination unit determines the condition correction value for each of the plurality of divided sections.
5. The machining state prediction device according to any one of claims 1 to 4, wherein the condition correction value is an output condition of the thermal cutting machine.
6. a program analysis unit that reads a processing program that controls the operation of the thermal cutting machine and analyzes a command block;
   a machining path determination unit that determines a machining path of the thermal cutting machine based on the analyzed command block;
   a processing condition determination unit that determines processing conditions of the thermal cutting machine based on the analyzed command block;
   a condition change section determination unit that determines a condition change section on the machining path in which the machining conditions are changed based on the machining path and the machining conditions;
   a correction value determination unit that determines a condition correction value in the condition changing section;
   a condition correction processing unit that determines a changed processing condition in the condition change section based on the condition correction value;
   A main control unit outputs a machining control command for the entire machining path based on the machining conditions reflecting the changed machining conditions;
   A processing control device including:
7. The machining control device according to claim 6 , wherein the correction value determination unit determines the condition correction value by performing a calculation process based on a predetermined calculation formula.
8. 7. The machining control device according to claim 6, wherein the correction value determination unit determines the condition correction value by reading out the condition correction value stored in a predetermined storage device.
9. the condition-change section determination unit defines the condition-change section by a plurality of divided sections;
   The machining control device according to any one of claims 6 to 8, wherein the correction value determination unit determines the condition correction value for each of the plurality of divided sections.
10. The processing control device according to any one of claims 6 to 9, wherein the condition correction value is an output condition of the thermal cutting machine.

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