WO2024108867A1 - 光学传声器 - Google Patents

光学传声器 Download PDF

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Publication number
WO2024108867A1
WO2024108867A1 PCT/CN2023/087211 CN2023087211W WO2024108867A1 WO 2024108867 A1 WO2024108867 A1 WO 2024108867A1 CN 2023087211 W CN2023087211 W CN 2023087211W WO 2024108867 A1 WO2024108867 A1 WO 2024108867A1
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WO
WIPO (PCT)
Prior art keywords
grating
module
flexible membrane
optical microphone
lens
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PCT/CN2023/087211
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English (en)
French (fr)
Inventor
皮埃尔 凯夫兰雅尼克
Original Assignee
瑞声声学科技(深圳)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2024108867A1 publication Critical patent/WO2024108867A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/008Transducers other than those covered by groups H04R9/00 - H04R21/00 using optical signals for detecting or generating sound
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Definitions

  • the present invention relates to the technical field of microphones, and in particular to an optical microphone.
  • the microphone works based on a capacitor, in which a diaphragm vibrates with sound waves, and the voltage is changed by changing the distance between the substrates of the capacitor, thereby achieving acoustic-electric conversion.
  • the optical microphone is a new type of microphone.
  • the optical microphone usually includes three modules, namely, the optoelectronic module, the integrated circuit module and the micro-electromechanical module.
  • the optoelectronic module can emit light directed to the micro-electromechanical module and can receive light reflected by the micro-electromechanical module.
  • the sound wave actuates the diaphragm of the micro-electromechanical module
  • the diaphragm vibrates slightly and changes the intensity and/or phase of the light reflected to the optoelectronic module.
  • the optoelectronic module converts the intensity and/or phase of the reflected light into an electrical signal and transmits it to the integrated circuit module, thereby realizing the conversion from acoustic signal to optical signal and then to electrical signal.
  • the present invention provides an optical microphone, aiming to solve the technical problem existing in the prior art, namely, the complex packaging and manufacturing of the optical microphone.
  • an optical microphone comprising: a housing, which includes an inner cavity and a sound inlet hole that communicates the inner cavity with the outside; a micro-electromechanical module, which is arranged in the inner cavity and includes a flexible film and a grating, wherein the flexible film separates the inner cavity into a front cavity and a rear cavity along the incident direction of the sound wave, the front cavity covers the sound inlet hole, and the grating is arranged on a side of the flexible film close to the rear cavity and spaced apart from the flexible film; an optoelectronic module, which is arranged in the rear cavity and includes a light source and a beam detector; and an integrated circuit module, which is arranged in the rear cavity and electrically connected to the micro-electromechanical module and the optoelectronic module.
  • the optoelectronic module and the integrated circuit module are arranged on the same chip; a reflective layer is provided on a side of the flexible film facing the light source, and another reflective layer is provided on a side of the grating facing the light source; and a portion of the light emitted from the light source is diffracted by the grating, then guided to the flexible film, and then reflected by the flexible film to the beam detector; and another portion of the light emitted from the light source is directly reflected by the grating reflective layer to the beam detector.
  • the micro-electromechanical module also includes a lens, which is arranged on the side of the grating facing the optoelectronic module and separated from the grating; when the light emitted from the light source vertically illuminates the lens, the light is refracted by the lens and then obliquely illuminates the grating; and when the light reflected by the grating or the flexible film obliquely illuminates the lens, the light is refracted by the lens and then vertically illuminates the light beam detector.
  • a lens which is arranged on the side of the grating facing the optoelectronic module and separated from the grating; when the light emitted from the light source vertically illuminates the lens, the light is refracted by the lens and then obliquely illuminates the grating; and when the light reflected by the grating or the flexible film obliquely illuminates the lens, the light is refracted by the lens and then vertically illuminates the light beam detector.
  • the flexible membrane is further provided with a sound inlet hole, and the sound inlet hole enables the front cavity to communicate with the rear cavity.
  • the grating includes a plurality of slits that are spaced apart from each other and arranged in parallel.
  • the grating is formed by a lens, and the lens has at least one diffractive surface.
  • the optoelectronic module includes a plurality of light beam detectors.
  • the housing is formed by a PCB board.
  • the flexible film has a shape that is symmetrical about its center.
  • the integrated circuit module is electrically connected to the flexible film and the grating, respectively.
  • the micro-electromechanical module further comprises a supporting component supporting the flexible membrane and fixed to the housing; and the grating is arranged at a certain interval on a side of the flexible membrane away from the sound inlet hole, and the grating is spaced apart from the flexible membrane.
  • the microphone has the following beneficial effects: fewer connecting wires and reduced crosstalk noise between wires, thereby achieving easier package manufacturing and better package miniaturization.
  • FIG1 is an isometric view of an optical microphone according to an embodiment of the present invention.
  • FIG. 2 is a front view of the optical microphone according to the embodiment of the present invention.
  • an embodiment of the present invention provides an optical microphone, comprising: a housing 1 and a micro-electromechanical module 2.
  • the housing 1 comprises an inner cavity 5 and a sound inlet hole 6, which connects the inner cavity 5 with the outside.
  • the inner cavity 5 comprises a first wall 7, a second wall 8, and a side wall 9 connecting the first wall to the second wall.
  • the first wall 7 is opposite to the second wall 8, and the sound inlet hole 6 is formed at the first wall 7.
  • the side wall 9 may be integrally formed as a part of the first wall 7 or the second wall 8, or may be formed independently.
  • the micro-electromechanical module 2 is arranged at the first wall 7 of the inner cavity 5, and includes a flexible membrane 10 and a grating 11.
  • the flexible membrane 10 separates the inner cavity into a front cavity 12 and a rear cavity 13 along the incident direction of the sound wave X.
  • the front cavity 12 covers the sound inlet hole 6, and the front cavity 12 is defined by the space between the flexible membrane 10 and the sound inlet hole 6.
  • the front cavity 12 is a cavity that does not contain any device to achieve better integration and miniaturization of the optical microphone package, and the rear cavity 13 is defined by the space between the flexible membrane 10 and the internal volume of the housing 1.
  • the flexible membrane 10 of the micro-electromechanical module 2 is arranged adjacent to the sound inlet hole 6, so that the front cavity 12 has a smaller volume and the rear cavity 13 has a larger volume, thereby further improving performance.
  • the grating 11 is disposed on a side of the flexible membrane 10 close to the back cavity 13 and is separated from the flexible membrane 10.
  • the micro-electromechanical module 2 further includes a supporting portion 14 that supports the flexible membrane 10 and is fixed to the housing 1.
  • the grating 11 is disposed on a side of the flexible membrane 10 that is away from the sound inlet hole 6 and is separated from the flexible membrane 10 by a spacer (not shown). In this way, a preset gap (not shown) is formed between the grating 11 and the flexible membrane 10.
  • the optoelectronic module 3 is disposed in the rear cavity 13 and includes a light source 15 and a light beam detector 16 .
  • the integrated circuit module 4 is disposed in the rear cavity 13 and is electrically connected to the micro-electromechanical module 2 and the optoelectronic module 3 .
  • the optoelectronic module 3 and the integrated circuit module 4 are arranged on the same chip.
  • a silicon wafer includes the integrated circuit module 4, and a III-V compound including the light source is formed on the silicon wafer.
  • the light beam detector 16 can be implemented by a silicon structure or a III-V structure.
  • the light source 15, the light beam detector 16 and the integrated circuit module 4 are all manufactured using III-V technology.
  • the optoelectronic module 3 and the integrated circuit module 4 are formed on the same chip, so that there will be fewer connecting wires, thereby reducing the crosstalk noise between the wires and the electrical contact resistance, and the impedance will be easy to control, thereby significantly achieving better integration and miniaturization of the optical microphone package, while reducing the size of the optical microphone and simplifying the packaging and manufacturing of the optical microphone.
  • Each of the flexible film 10 and the grating 11 is provided with a reflective layer (not shown) on one side thereof facing the light source 15.
  • the two reflective layers may be formed of the same material or of different materials.
  • the reflectivity is defined according to the wavelength of the light beam, and the material should be selected to maximize the reflectivity of the light beam.
  • a portion of the light emitted by the light source 15 is diffracted by the grating 11 and then guided to the flexible film 10, and then reflected by the flexible film 10 to the light beam detector 16; and another portion of the light emitted from the light source 15 is reflected by the reflective layer of the grating 11 to the light beam detector 16.
  • the light beam emitted by the light source 15 is referred to as an incident light beam A, which is directed to the center of the corresponding side of the grating 11 and the center of the corresponding side of the flexible film 10, and the light beam reflected to the light beam detector 16 is referred to as a reflected light beam B. Since the grating 11 is disposed between the light source 15 and the flexible film 10, the incident light beam A will reach the grating 11 before reaching the flexible film 10.
  • the surface of the grating 11 facing the light source 15 is highly reflective, so the incident light beam A is highly reflected to the light beam detector 16. A portion of the light is diffracted after passing through the grating 11 and then reaches the reflective surface of the flexible membrane 10. The light reflected by the flexible membrane 10 is guided to the light beam detector 16. Obviously, the two parts of the reflected light beam B have a certain amplitude difference and phase difference when reaching the light beam detector 16, and the amplitude difference and the phase difference are related to the distance between the flexible membrane 10 and the grating 11. Therefore, the micro-electromechanical module 2, the optoelectronic module 3 and the integrated circuit module 4 can realize the conversion from acoustic signal to optical signal and then to electrical signal.
  • the micro-electromechanical module 2 may further include a lens (not shown), which is arranged on a side of the grating 11 facing the optoelectronic module 3 and is separated from the grating 11.
  • a lens (not shown), which is arranged on a side of the grating 11 facing the optoelectronic module 3 and is separated from the grating 11.
  • the lens is disposed on the side of the grating 11 facing the optoelectronic module 3, so that the path of the light emitted by the light source can be changed by refraction of the light by the lens. In this way, in the case of a single die, the lens can be used to improve the position accuracy of the light beam.
  • the flexible membrane 10 is further provided with a sound inlet hole 6 to connect the front cavity 12 with the rear cavity 13.
  • the sound inlet hole 6 can connect the front cavity 12 with the rear cavity 13, thereby balancing the sound pressure inside the front cavity 12 and the rear cavity 13, which is more conducive to the beneficial effect of the flexible membrane 10 vibrating under the action of sound waves.
  • the grating 11 includes a plurality of slits that are spaced apart from each other and arranged in parallel.
  • the grating 11 may be provided with a reflective plane layer.
  • the grating 11 may use silicon as a substrate, and provide a metal film as a reflective layer on the side of the silicon facing the photovoltaic module 3 by using a specific process.
  • This metal may be gold, aluminum, silver or copper.
  • the grating is formed by a lens, and at least one diffraction layer is provided on the lens.
  • the lens may use glass as a substrate, form a regular non-flat surface (eg, a stepped surface) on the substrate to form the diffraction surface, and achieve diffraction of light through the structure of the diffraction surface.
  • a regular non-flat surface eg, a stepped surface
  • the integrated circuit module 4 is also electrically connected to the flexible film 10 and the grating 11, an electrostatic force is generated between the flexible film 10 and the grating 11.
  • the integrated circuit module 4 is electrically connected to the flexible film 10 and the grating 11, and an electrostatic force is generated by applying a voltage between the flexible film 10 and the grating through the integrated circuit module 4, thereby forming an "electrostatic spring" between the flexible film 10 and the grating 11.
  • the "electrostatic spring” provides an effect of "amplifying” or “reducing” the deformation of the flexible film 10.
  • the optoelectronic module 3 may include a plurality of light beam detectors 16 .
  • the flexible film 10 has a shape that is symmetrical about its center.
  • the shape of the flexible film 10 is not limited to a circle, and can also be any shape that is symmetrical about its center, such as a square.
  • the flexible film 10 may be formed of one or more materials, which may be single crystal silicon, silicon nitride, silicon oxide, polycrystalline silicon, polyimide, or a combination thereof.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明提供一种光学传声器,包括壳体,其包括内腔和使所述内腔与外部连通的声音入口孔;微机电模块,其位于所述内腔中并包括柔性膜和光栅;光电模块,其位于所述后腔中并包括光源和光束检测器;以及集成电路模块,其位于所述后腔中并且电连接到所述微机电模块和所述光电模块。所述光电模块和所述集成电路模块设置在同一芯片上;在所述柔性膜的面向所述光源的一侧提供反射层,并且在所述光栅的面向所述光源一侧提供另一反射层。所述传声器具有以下有益效果:连接线更少并且线之间的串扰噪声降低,从而实现更容易的封装制造和更好的封装小型化。

Description

光学传声器 技术领域
本发明涉及传声器技术领域,具体涉及一种光学传声器。
背景技术
对于传统的传声器,传声器基于电容器工作,其中振膜随着声波振动,并且通过改变电容器的基板之间的距离来改变电压,从而实现声电转换。
光学传声器是一种新型传声器。光学传声器通常包括三个模块,即光电模块、集成电路模块和微机电模块。光电模块可以发射指向微机电模块的光,并且可以接收由微机电模块反射的光。当声波致动微机电模块的振膜时,振膜轻微振动并改变反射到光电模块的光的强度和/或相位。光电模块将反射光的强度和/或相位转换为电信号并将其传输到集成电路模块,从而实现从声信号到光信号再到电信号的转换。
技术问题
随着消费者对体验的要求越来越高,需要提出一种集成度更好的光学传声器和小型化光学传声器封装。
技术解决方案
本发明提供一种光学传声器,旨在解决现有技术中存在的技术问题,即光学传声器的复杂封装制造。
本发明的一个实施例提供了一种光学传声器,包括:壳体,其包括内腔和使内腔与外部连通的声音入口孔;微机电模块,其设置在所述内腔中并包括柔性膜和光栅,其中所述柔性膜沿着声波的入射方向将所述内腔分离成前腔和后腔,所述前腔覆盖所述声音入口孔,并且所述光栅被布置在所述柔性膜的靠近所述后腔的一侧并与所述柔性薄膜间隔开;光电模块,其设置在所述后腔中并包括光源和光束检测器;以及集成电路模块,所述集成电路模块设置在所述后腔中并电连接到所述微机电模块和所述光电模块。所述光电模块和所述集成电路模块设置在同一芯片上;在所述柔性膜的面向所述光源的一侧提供反射层,并且在所述光栅的面向所述光源一侧提供另一反射层;并且从所述光源发射的光的一部分被所述光栅衍射,然后被引导到所述柔性膜,继而被所述柔性膜反射到所述光束检测器;并且从所述光源发射的光的另一部分被所述光栅反射层直接反射到所述光束检测器。
作为一种改进,所述微机电模块还包括透镜,该透镜被设置在所述光栅的面向所述光电模块的一侧并与所述光栅隔开;当从所述光源发射的光垂直地照射所述透镜时,所述光在被所述透镜折射后倾斜地照射所述光栅;并且当所述光栅或所述柔性膜反射的光倾斜地照射所述透镜时,所述光在被所述透镜折射之后垂直地照射到所述光束检测器。
作为一种改进,所述柔性膜还设置有声音入口孔,所述声音入口孔使得所述前腔与所述后腔连通。
作为一种改进,所述光栅包括多个彼此间隔开并平行布置的多个狭缝。
作为一种改进,所述光栅由透镜形成,并且所述透镜具有至少一个衍射表面。
作为一种改进,所述光电模块包括多个光束检测器。
作为一种改进,所述壳体由PCB板形成。
作为一种改进,所述柔性膜具有关于其中心对称的形状。
作为一种改进,所述集成电路模块分别地电连接到所述柔性膜和所述光栅。
作为一种改进,所述微机电模块还包括支撑所述柔性膜并固定到所述壳体的支撑部件;并且所述光栅被以一定间隔设置在所述柔性膜背离所述声音入口孔的一侧,并且所述光栅与所述柔性薄膜间隔开。
有益效果
所述传声器具有以下有益效果:连接线更少并且线之间的串扰噪声降低,从而实现更容易的封装制造和更好的封装小型化。
附图说明
为了更好地说明本发明的实施例或相关技术中的技术方案,以下简要介绍在所述实施例和相关技术中使用的相关附图。应当注意,以下描述的附图仅仅是本发明实施例的一部分,并且本领域技术人员也可以在不付出创造性努力的情况下获得其他附图。
图1是根据本发明实施例的光学传声器的轴测图;
图2是根据本发明实施例的光学传声器的前视图。
参考符号:
1-壳体;
2-微机电模块;
3-光电模块;
4-集成电路模块;
5-内腔;
6-声音入口孔;
7-第一壁;
8-第二壁;
9-侧壁;
10-柔性膜;
11-光栅;
12-前腔;
13-后腔;
14-支撑部分;
15-光源;
16-光束检测器;
本发明的实施方式
本发明的实施例将在以下说明书中详细描述。附图中示出了实施例的示例,其中相同或相似的附图标记表示相同或相似元件或具有相同或相似功能的元件。下面参照附图描述的实施例是示例性的,并且仅用于说明本发明而不限制本发明。
如图1和图2所示,本发明的一个实施例提供了一种光学传声器,包括:壳体1和微机电模块2。所述壳体1包括内腔5和声音入口孔6,该声音入口孔6使内腔5与外部连通。在该实施例中,所述内腔5包括第一壁7、第二壁8和使所述第一壁连接到所述第二壁的侧壁9。所述第一壁7与所述第二壁8相对,并且所述声音入口孔6形成在所述第一壁7处。应当注意,所述侧壁9可以整体地形成为所述第一壁7或所述第二壁8的一部分,或者可以独立地形成。
所述微机电模块2设置在所述内腔5的所述第一壁7处,并包括柔性膜10和光栅11。所述柔性膜10沿着声波X的入射方向将所述内腔分离成前腔12和后腔13。所述前腔12覆盖所述声音入口孔6,并且所述前腔12由所述柔性膜10和所述声音入口孔6之间的空间限定。所述前腔12是不包含任何器件的空腔,以实现更好的集成和小型化光学传声器封装,并且所述后腔13由所述柔性膜10和所述壳体1的内部容积之间的空间限定。在本实施例中,所述微机电模块2的所述柔性膜10被布置成与所述声音入口孔6相邻,使得所述前腔12具有较小的体积并且所述后腔13具有较大的体积,从而进一步提高性能。
所述光栅11设置在所述柔性膜10靠近所述后腔13的一侧,并与所述柔性膜10隔开。所述微机电模块2还包括支撑所述柔性膜10并固定到所述壳体1的支撑部分14。所述光栅11设置在所述柔性膜10的背离所述声音入口孔6的一侧,并通过间隔件(未示出)与所述柔性膜10隔开。以此方式,在所述光栅11和所述柔性膜10之间形成预设间隙(未示出)。
光电模块3设置在所述后腔13中,并包括光源15和光束检测器16。
集成电路模块4设置在所述后腔13中,并与所述微机电模块2和所述光电模块3电连接。
所述光电模块3和所述集成电路模块4设置在同一芯片上。在一个实施例中,硅晶片包括所述集成电路模块4,并且在所述硅晶片上形成包括所述光源的III-V族化合物。所述光束检测器16可以由硅结构或III-V结构实现。在另一个实施例中,所述光源15、光束检测器16和集成电路模块4都使用III-V技术制造。所述光电模块3和所述集成电路模块4形成在同一芯片上,从而其连接线将更少,进而减少了线与电接触电阻之间的串扰噪声,并且其阻抗将容易控制,从而显著实现更好的集成和小型化光学传声器封装,同时减小光学传声器的尺寸,并简化光学传声器的封装制造。
所述柔性膜10和所述光栅11中的每一个都在各自面向所述光源15的一侧设有反射层(未示出)。所述两个反射层可以由相同的材料形成或由不同的材料形成。反射率根据光束的波长来定义,并且材料的选择应使光束的反射率最大化。
所述光源15发出的一部分光被所述光栅11衍射,然后被引导到所述柔性膜10,继而被所述柔性膜10反射到所述光束检测器16;并且从所述光源15发射的光的另一部分被所述光栅11的反射层反射到所述光束检测器16。
当使用光学传声器时,声波通过所述声音入口孔6进入所述壳体1,以驱动所述柔性膜10的振动,从而改变所述柔性膜10和所述光栅11之间的距离。当所述柔性膜10振动时,所述柔性膜10以相反的方向向上(或向下,取决于传声器的类型)和向下(或向上,取决于传声器的类型)移动,就像标准振荡结构一样,具有特定的频率和位移。所述频率取决于所述声波的频率,所述位移取决于所述声波的压力。
所述光源15发出的光束,该光束被称为入射光束A,该入射光束A指向所述光栅11的相应侧的中心和所述柔性膜10的相应侧中心,并且被反射到所述光束检测器16的光束则被称为反射光束B。由于所述光栅11设置在所述光源15和所述柔性膜10之间,所述入射光束A将在到达所述柔性膜10之前到达所述光栅11。
面向所述光源15的所述光栅11表面具有高度反射性,因此所述入射光束A被高度反射到所述光束检测器16。一部分光在穿过所述光栅11后被衍射,然后到达所述柔性膜10的反射表面。被所述柔性膜10反射的光被引导到光束检测器16。显然,所述反射光束B的这两部分在到达所述光束检测器16时具有一定的幅度差和相位差,并且所述幅度差和所述相位差与所述柔性膜10和所述光栅11之间的距离有关。因此,所述微机电模块2、光电模块3和集成电路模块4可以实现从声信号到光信号然后到电信号的转换。
在本实施例的一个示例中,所述微机电模块2还可以包括透镜(未示出),所述透镜布置在所述光栅11面向所述光电模块3的一侧并与所述光栅11隔开。当所述光源15发出的光线垂直照射到所述透镜时,所述光线经过所述透镜折射后会倾斜地照射到所述光栅11;并且当由所述光栅11或所述柔性膜10反射的光倾斜地照射所述透镜时,在被所述透镜折射之后,所述光将在被透镜折射之后垂直地照射到所述光束检测器16。
在一个示例中,所述透镜被设置在所述光栅11的面向所述光电模块3的一侧,从而可以通过所述透镜对光的折射来改变所述光源发出的光的路径。以这种方式,在单个裸片的情况下,所述透镜可用于提高光束的位置精度。
在本实施例的一个示例中,所述柔性膜10还设有声音入口孔6使所述前腔12与所述后腔13连通。具体地,所述声音入口孔6可以使所述前腔12与所述后腔13连通,从而平衡所述前腔12和所述后腔13内部的声压,从而更有利于所述柔性膜10在声波作用下振动的有益效果。
在本实施例的一个示例中,所述光栅11包括多个彼此间隔开并平行排列的狭缝。
具体地,所述光栅11可以设置有反射平面层。例如,所述光栅11可以使用硅作为基板,并且通过使用特定工艺在所述硅的面向所述光电模块3的一侧上提供金属膜作为反射层。这种金属可以是金、铝、银或铜。
在本实施例的一个示例中,所述光栅由透镜形成,并且在所述透镜上提供至少一个衍射层。
具体地,所述透镜可以使用玻璃作为基板,通过在所述基板上形成规则的非平坦表面(例如阶梯表面)形成所述衍射表面,并通过所述衍射表面的结构实现光的衍射。
如果所述集成电路模块4也电连接到所述柔性膜10和所述光栅11,则在所述柔性膜10和所述光栅11之间产生静电力。例如,所述集成电路模块4电连接到所述柔性膜10和所述光栅11,并且通过所述集成电路模块4在所述柔性膜10和所述光栅之间施加电压来产生静电力,从而在所述柔性膜10与所述光栅11之间形成“静电弹簧”。当所述柔性膜10受到声波振动时,所述“静电弹簧”提供了“放大”或“减小”所述柔性膜10的变形的效果。
在本实施例的一个示例中,所述光电模块3可包括多个光束检测器16。
在本实施例的一个示例中,所述柔性膜10具有关于其中心对称的形状。所述柔性膜10的形状不限于圆形,也可以是关于其中心对称的任何形状,例如正方形。
所述柔性膜10可以由一种或多种材料形成,这些材料可以是单晶硅、氮化硅、氧化硅、多晶硅、聚酰亚胺或其组合。
本发明的上述结构、特征和效果在参考附图所示的上述实施例中进行了详细地描述。应当注意,上述实施例仅仅是本发明的优选实施例,其不构成对本发明的限制,并且根据本发明的概念及其等效实施例进行的任何修改或变形都应落入本发明的保护范围。

Claims (10)

  1. 一种光学传声器,包括:
    壳体,其包括内腔和使所述内腔与外部连通的声音入口孔;
    微机电模块,其设置在所述内腔中并包括柔性膜和光栅,其中所述柔性膜沿着声波的入射方向将所述内腔分离成前腔和后腔,所述前腔覆盖所述声音入口孔,并且所述光栅布置在所述柔性膜的靠近所述后腔的一侧并与所述柔性薄膜间隔开;
    光电模块,其设置在所述后腔中并包括光源和光束检测器;和
    集成电路模块,其设置在所述后腔中并电连接到所述微机电模块和所述光电模块;
    其中所述光电模块和所述集成电路模块设置在同一芯片上;
    在所述柔性膜的面向所述光源的一侧提供反射层,并且在所述光栅的面向所述光源的一侧提供另一反射层;并且
    从所述光源发射的光的一部分被所述光栅衍射,然后被引导到所述柔性膜,继而被所述柔性膜反射到所述光束检测器;并且从所述光源发射的光的另一部分被所述光栅反射层直接反射到所述光束检测器。
  2. 如权利要求1所述的光学传声器,其中所述微机电模块还包括透镜,所述透镜被设置在所述光栅的面向所述光电模块的一侧并与所述光栅隔开;
    当从所述光源发射的光垂直地照射所述透镜时,所述光在被所述透镜折射后倾斜地照射所述光栅;
    并且当所述光栅或所述柔性膜反射的光倾斜地照射所述透镜时,所述光在被所述透镜折射之后垂直地照射到所述光束检测器。
  3. 如权利要求1所述的光学传声器,其中所述柔性膜还设置有声音入口孔,所述声音入口孔使得所述前腔与所述后腔连通。
  4. 如权利要求1所述的光学传声器,其中所述光栅包括彼此间隔开并平行布置的多个狭缝。
  5. 如权利要求1所述的光学传声器,其中所述光栅由透镜形成,并且所述透镜设置有至少一个衍射表面。
  6. 如权利要求1所述的光学传声器,其中所述光电模块包括多个光束检测器。
  7. 如权利要求1所述的光学传声器,其中所述壳体由PCB板形成。
  8. 如权利要求1所述的光学传声器,其中所述柔性膜具有关于其中心对称的形状。
  9. 如权利要求1所述的光学传声器,其中所述集成电路模块分别电连接到所述柔性膜和所述光栅。
  10. 如权利要求1所述的光学传声器,其中所述微机电模块还包括支撑部,所述支撑部支撑所述柔性膜并固定到所述壳体;并且所述光栅被以一定间隔布置在所述柔性膜的背离所述声音入口孔的一侧,并且所述光栅与所述柔性薄膜间隔开。
PCT/CN2023/087211 2022-11-23 2023-04-10 光学传声器 WO2024108867A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040130728A1 (en) * 2002-03-29 2004-07-08 Degertekin Fahrettin Levent Highly-sensitive displacement-measuring optical device
US20160007108A1 (en) * 2014-07-07 2016-01-07 Apple Inc. Grating only optical microphone
CN110388980A (zh) * 2019-07-31 2019-10-29 山东大学 一种基于衍射光栅结构的微型声学传感器
CN111263283A (zh) * 2020-02-17 2020-06-09 瑞声声学科技(深圳)有限公司 光学麦克风
US20210258700A1 (en) * 2020-02-17 2021-08-19 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Optical microphone
CN217363313U (zh) * 2021-08-20 2022-09-02 瑞声声学科技(深圳)有限公司 光学麦克风

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040130728A1 (en) * 2002-03-29 2004-07-08 Degertekin Fahrettin Levent Highly-sensitive displacement-measuring optical device
US20160007108A1 (en) * 2014-07-07 2016-01-07 Apple Inc. Grating only optical microphone
CN110388980A (zh) * 2019-07-31 2019-10-29 山东大学 一种基于衍射光栅结构的微型声学传感器
CN111263283A (zh) * 2020-02-17 2020-06-09 瑞声声学科技(深圳)有限公司 光学麦克风
US20210258700A1 (en) * 2020-02-17 2021-08-19 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Optical microphone
CN217363313U (zh) * 2021-08-20 2022-09-02 瑞声声学科技(深圳)有限公司 光学麦克风

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