WO2024108846A1

WO2024108846A1 - Dimming device and preparation method therefor

Info

Publication number: WO2024108846A1
Application number: PCT/CN2023/084834
Authority: WO
Inventors: 周孟超; 王飞; 张宏伟; 李莉; 李雨婷
Original assignee: 江苏集萃智能液晶科技有限公司
Priority date: 2022-11-21
Filing date: 2023-03-29
Publication date: 2024-05-30
Also published as: CN118057234A

Abstract

A method for preparing a dimming device, and a dimming device prepared by the method. The method mainly includes the following steps: cleaning a transparent conductive substrate, preparing a composite layer (400), making a box, filling with a dimming component (500), and curing for sealing, such that a dimming device is finally obtained. In a process of preparing the composite layer (400), spacers and an alignment agent are uniformly mixed in proportion, then coated on conductive layers (201, 202) of the transparent conductive substrate, and cured to form the composite layer (400). The composite layer (400) comprises an alignment layer (401) and a support structure layer (402). The composite layer (400) is prepared by means of one-step coating, which omits the procedure of coating a bonding layer for fixing the spacers to form the support structure layer or of separately spraying the spacers to form the support structure layer in the prior art, such that the process is simple, and the cost is low.

Description

A dimming device and preparation method thereof

This application claims the priority of an invention patent application with an application date of November 21, 2022, application number CN202211455232.7, and invention name “A dimming device and preparation method”, all contents of which are incorporated by reference into this application.

Technical Field

The present invention relates to the technical field of optoelectronic devices, and in particular to a dimming device and a preparation method thereof.

Background technique

As a new dimming technology, dimming devices can control the propagation of light through electrical control, temperature control, voltage control and other methods, and can be applied to various fields. Common dimming device technologies mainly include PDLC dimming technology, dye liquid crystal dimming technology, SPD dimming technology, EC electrochromic technology and bistable dimming technology. According to the physical form of the dimming layer, it can be divided into three types: solid, semi-solid and liquid. However, for liquid dimming devices, because the internal part is an unfixed liquid, it is easy to deform during use. Therefore, a supporting structure is often set inside the liquid dimming device. Because the field of dimming device technology is a new technical field developed later, although the performance of dimming devices is very different from that of liquid crystal displays, their structure is similar to that of liquid crystal displays, including upper and lower substrates and a filling layer in the middle. Therefore, the support structure of liquid dimming devices often draws on the preparation method of the support structure in the field of liquid crystal display technology, such as: spacer fixing method and PS (Photo Spacer) technology.

Regarding the spacer fixing method: China's public patent CN101802696A discloses a spacer fixing method, in the process of preparing the liquid crystal panel, a spacer with a polymer coating layer is prefabricated by spraying, and the spacer is fixed by heating treatment in the later stage. However, because the liquid crystal panel industry has high requirements on the orientation effect of the alignment layer, it is necessary to make the orientation layer first, perform the alignment treatment after curing, and then spray the spacer. In order to achieve the fixation of the spacer, the surface of the spacer needs to be specially treated, and the bonding point between the spacer and the contact layer is only located at the contact point. Orientation is performed first and then the spacer is sprayed, which avoids the influence of the orientation process on the spacer. When the above method is used in the field of dimming device technology, in order to enhance the fixation of the spacer, the spacer needs to be pretreated so that it has stickiness or can be cured and bonded under heating or light conditions, so it is limited by raw materials and size. Compared with the LCD panel industry, dimming devices need to undergo deep processing and face specific application scenarios in the later stage. Among them: the deep processing process includes lamination and hollow assembly. Especially during the lamination process, the dimming devices will be squeezed by large external forces. Most of the specific application scenarios are building doors and windows, cars, airplanes, high-speed rail and other transportation vehicles, which are easily affected by wind pressure. During deep processing and specific use, they will be subjected to different degrees of extrusion, impact and other processes. The bonding effect is limited only by the bonding points between the spacer and the contact layer, which limits the scope of use of this technology.

Regarding PS technology: Liquid crystal displays achieve the desired display effect by controlling the electric field between the upper and lower substrates and changing the arrangement of liquid crystal materials, and the gap control material (Spacer) between the two substrates plays a role in controlling the thickness and uniformity between the substrates. With the development of technology, in the TFT-LCD process, PS (Photo spacer) technology is used to replace the traditional spacer support method, that is, a photoreactive material, the so-called photoresist material, can be divided into positive photoresist and negative photoresist according to different reaction mechanisms. Photo-spacer uses the photolithography process to directly coat the photoresist material on the ITO glass substrate, and then obtains the required thickness of the substrate gap control through exposure, development, baking and other steps. However, its preparation process is complicated, the equipment cost is high, and the gap height cannot take into account a higher value, which limits the application scope of the technology.

Therefore, it is necessary to provide a simple and effective method for preparing a dimming device that is applicable to a high cell thickness and a fixed support structure.

Summary of the invention

The purpose of the present application is to provide a simple and effective method for preparing a dimming device with a supporting structure layer, which is used to solve a series of problems such as uneven box thickness caused by movement and misalignment of the internal supporting structure during deep processing or later installation and use of the dimming device, thereby ensuring the product's usage characteristics and performance.

To achieve the above-mentioned purpose, the present application provides a method for preparing a dimming device, comprising the following steps: S1, preparing a transparent conductive substrate: cleaning the transparent conductive substrate, drying it and setting it aside; S2, preparing a composite layer: first, mixing a spacer and an orientation agent in proportion to form an orientation agent mixed solution in which the spacer is evenly dispersed, and secondly, coating the orientation agent mixed solution on the conductive layer of the transparent conductive substrate in step S1, and forming a composite layer after curing to obtain a transparent conductive substrate with a composite layer, wherein: the composite layer includes an orientation layer and a supporting structure layer, the orientation layer is formed after the orientation agent is cured, and the supporting structure layer is composed of a spacer; S3, preparing a box body: using a sealing glue to bond two transparent conductive substrates arranged in a parallel position, and forming a box body after curing, at least one of the two transparent conductive substrates is the transparent conductive substrate with a composite layer in step S2; S4, filling the dimming component into the box body in step S3, forming a dimming layer, and curing and sealing to obtain a dimming device.

As a further improvement of the present application, step S5 is further included after step S2 and before step S3, and step S5 is an orientation process: orientation is performed on the composite layer of the transparent conductive substrate with the composite layer in step S2 to obtain a transparent conductive substrate with an aligned composite layer; in step S3, at least one of the two transparent conductive substrates is the transparent conductive substrate with the aligned composite layer in step S5.

As a further improvement of the present application, in step S2, the thickness of the alignment layer is 0.1 nm to 2 μm, and the thickness of the support structure layer is 1 μm to 200 μm.

As a further improvement of the present application, the distribution density of the spacers in the support structure layer is 1 particle/mm ² to 200 particles/mm ² .

As a further improvement of the present application, the spacer is an adhesive spacer or a non-adhesive spacer.

As a further improvement of the present application, the spacer is in any one of a spherical shape, a rod shape, an elliptical shape, and a sheet shape.

As a further improvement of the present application, the material of the spacer is resin or inorganic material, the resin is more preferably polystyrene, and the inorganic material is more preferably glass fiber or silica.

As a further improvement of the present application, the alignment agent is any one of IPS, TN, STN and VA type alignment layers.

As a further improvement of the present application, in step S5, the orientation is friction orientation, and the steps of the friction orientation are: A roller with flannel is used to perform rubbing orientation along one direction on the composite layer of the transparent conductive substrate with a composite layer in step S2 to obtain a transparent conductive substrate with an oriented composite layer. The parameters of the rubbing orientation are set as follows: the number of rubbing times is 1-4 times, the friction pressure is 0.05mm-0.7mm, the rotation speed of the rubbing roller is 200r/min-1200r/min, and the advancement speed of the transparent conductive substrate with a composite layer is 3m/min-60m/min.

To achieve the above-mentioned purpose, the present application also provides a dimming device, comprising two transparent conductive substrates arranged in parallel and opposite to each other and a sealing frame structure sandwiched between the two transparent conductive substrates, the two transparent conductive substrates and the sealing frame structure together form a receiving cavity, and the dimming component is filled in the receiving cavity, at least one of the two transparent conductive substrates is a transparent conductive substrate with a composite layer, and the transparent conductive substrate with a composite layer is a transparent conductive substrate with a composite layer that has been subjected to a friction orientation treatment or has not been subjected to a friction orientation treatment; the dimming device is prepared by the preparation method of the dimming device described above.

As a further improvement of the present application, a composite layer is provided on at least a local area of the conductive layer of the transparent conductive substrate with a composite layer.

As a further improvement of the present application, the shape of the composite layer is at least one of circular, linear, diamond, rectangular, and polygonal.

The beneficial effect of the present application is that the present application provides a method for preparing a dimming device, and when preparing the composite layer in the dimming device: first, the spacer and the orientation agent are evenly mixed in proportion to form an orientation agent mixed solution with uniform spacer dispersion, and then the orientation agent mixed solution is applied to the conductive layer of the transparent conductive substrate, and after curing, a composite layer is formed, and the composite layer includes an orientation layer and a support structure layer. The method takes into account the functions of preparing the support structure layer and the orientation layer at the same time, saves the coating of the bonding layer for fixing the spacer in the traditional technology, is easy to operate, and has low cost.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a dimming device in state 1;

FIG2 is a schematic structural diagram of a dimming device in state 2;

FIG3 is a schematic structural diagram of a dimming device in state 3;

FIG4 is a schematic structural diagram of a dimming device in state 4;

FIG5 is a schematic structural diagram of a dimming device in state 5;

FIG6 is a schematic structural diagram of a composite layer of a dimming device in state 1;

FIG. 7 is a schematic structural diagram of a composite layer of a dimming device in state 2 .

In the figure: 101, first transparent substrate; 201, first transparent conductive layer; 102, second transparent substrate; 202, second transparent conductive layer; 300, sealing frame structure; 400, composite layer; 401, orientation layer; 402, supporting structure layer; 500, dimming component.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with the specific embodiments and drawings of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments, and are not intended to limit the scope of the present invention. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

The embodiment of the present application provides a method for preparing a dimming device, comprising the following steps: S1, preparing a transparent conductive substrate: cleaning the transparent conductive substrate, drying it and setting it aside; S2, preparing a composite layer: first, mixing the spacer and the orientation agent in proportion to form an orientation agent mixed solution in which the spacer is evenly dispersed, and secondly, applying the orientation agent mixed solution to the conductive layer of the transparent conductive substrate in step S1, and forming a composite layer after curing, to obtain a transparent conductive substrate with a composite layer, wherein: the composite layer includes an orientation layer and a supporting structure layer, the orientation layer is formed after the orientation agent is cured, and the supporting structure layer is composed of a spacer; S3, preparing a box body: using a sealing glue to bond two transparent conductive substrates arranged in a position, and curing them to form a box body, at least one of the two transparent conductive substrates is the transparent conductive substrate with a composite layer in step S2; S4, filling the dimming component into the box body in step S3, forming a dimming layer, and curing and sealing to obtain a dimming device. Preferably, the spacer and the orientation agent are mixed by stirring or ultrasonic dispersion.

In this embodiment, when preparing a composite layer composed of an orientation layer and a support structure layer, the orientation agent for preparing the orientation layer and the spacer for preparing the support structure layer are mixed in proportion, coated on the conductive layer of the transparent conductive substrate at one time, and a composite layer is formed after curing. The preparation method of this composite layer takes into account both the support and orientation effects, which is simpler than the preparation method of "preparing the orientation layer first, and then applying the adhesive to bond the spacer to the orientation layer" in the prior art, and can be applied to the preparation of high box thickness and large-size products. The technology of this application is applicable to dimming devices, but not to liquid crystal panels. The coating equipment used in the actual production of the liquid crystal panel industry is mainly APR printing equipment and inkjet printing equipment. These two equipments cannot use the technical solution of this application because the process does not meet the requirements, that is, the mixed solution after the spacer and the orientation agent are evenly mixed in proportion is applied to the glass substrate through the APR printing equipment or the inkjet printing equipment. After the technical solution of this application is applied to the liquid crystal panel, the prepared composite layer cannot meet the performance requirements of the display panel, affecting the display performance. The dimming device technology of this application is a non-display application of liquid crystal, and the requirements for it are relatively low, which can meet the performance requirements of the dimming device.

Optionally, the transparent conductive substrate in step S1 includes a transparent substrate layer and a transparent conductive layer that are stacked. In this embodiment, the material of the transparent substrate layer can be one or more of glass, PET, PEN, PC, PP, PMMA, PBT, PVC, PI, and cellulose. The present application is not limited thereto, and other materials with light transmittance that meets the requirements can also be used. Classified by material, the transparent conductive layer can be a carbon-based conductive film, a metal nanowire conductive film, a metal oxide film, and the like. Among them: the preparation material of the carbon-based conductive film can be graphene oxide, carbon nanotubes, and the like, the preparation material of the metal nanowire conductive film can be silver nanowires, copper nanowires, and the like, and the preparation material of the metal oxide film can be indium tin oxide, indium oxide, tin oxide, zinc oxide, and a mixed system of other metal oxides, and the like. In this embodiment, a suitable implementation method is selected based on the material selected for the transparent conductive layer, and the transparent conductive layer can be magnetically It is prepared by controlled sputtering, vacuum evaporation, chemical vapor deposition, sol-gel, pulsed laser deposition, screen printing, coating, etc.

Optionally, in step S2, the thickness of the alignment layer is 0.1 nm to 2 μm, and the alignment agent is generally an organic polymer material, such as PVB, siloxane, polyimide material, etc. The present application is not limited thereto, and other alignment agent materials that meet the requirements may also be used.

Optionally, in step S2, the thickness of the support structure layer is 1 μm to 200 μm, and the distribution density of the spacer in the support structure layer is 1 particle/ ^mm2 to 200 particles/ ^mm2 . The material of the spacer is resin or inorganic material, and the resin is more preferably polystyrene, and the inorganic material is more preferably glass fiber or silica. The present application is not limited to this, and other materials that meet the requirements can also be used. The spacer is a sticky spacer or a non-sticky spacer. The spacer can be any one of spherical, rod-shaped, elliptical, sheet-shaped, etc. The present application is not limited to this, and other shapes that meet the requirements can also be used. Optionally, in step S2, the coating method can be any one of spin coating, immersion, screen printing, spraying, slit coating, etc.

Optionally, in step S3, a certain mass concentration of viscous frame-sealing glue for fixing and supporting is prepared before lamination, and vacuum degassing is performed. The frame-sealing glue is applied to a transparent conductive substrate or a transparent conductive substrate with a composite layer by screen printing or dispensing coating technology, and a frame structure is formed after curing. The size of the frame structure is set as required to support the two transparent conductive substrates arranged in alignment and to seal the dimming component. The frame-sealing glue can be a heat-curing glue, a light-curing glue, or a UV heating mixed glue, wherein: the heat-curing glue can be an epoxy resin, and the light-curing glue can be a UV glue.

Optionally, in step S4, the dimming component can be filled by vacuum injection, drip spraying, coating, etc. The dimming component can be a liquid crystal dimming material, and the liquid crystal dimming material can be a cholesteric liquid crystal composition, a dye liquid crystal composition, or other liquid crystal components.

In a feasible specific embodiment of the present application, after step S2 and before step S3, step S5 is also included, and step S5 is an orientation process: orientation is performed on the composite layer of the transparent conductive substrate with a composite layer in step S2 to obtain a transparent conductive substrate with an alignment composite layer; in step S3, at least one of the two transparent conductive substrates is the transparent conductive substrate with an alignment composite layer in step S5. The orientation method is any one of rubbing orientation, photo-controlled orientation, tilted evaporation orientation and LB film orientation. Among them: the rubbing orientation is contact-type, and the polymer material used in the rubbing orientation is at least one of polystyrene and its derivatives, polyvinyl alcohol, polyester, epoxy resin, polyurethane, polysiloxane, and polyimide. The photo-controlled orientation, tilted evaporation orientation and LB film orientation belong to non-contact orientation technology, the material used in the photo-controlled orientation is photosensitive modified polyimide, the material used in the tilted evaporation orientation is inorganic materials such as metals, oxides, and fluorides, and the material used in the LB film orientation is polyimide. The technical solution of the present application is mainly based on the rubbing orientation technology, but is not limited to it.

Optionally, after rubbing orientation is performed on the composite layer of the transparent conductive substrate with the composite layer, the orientation layer forms an alignment layer. The orientation agent can be any one of the IPS, TN, STN, and VA type alignment layers. When the liquid crystal molecules are arranged on the alignment layer, the angle formed by the long axis direction of the molecules and the surface of the alignment layer is different, so the alignment layer formed includes IPS, TN, STN, and VA type alignment layers. The concentration of the alignment agent solution can be adjusted according to the thickness of the desired alignment layer and the requirements of the pretilt angle. The present application is not limited to this, and other alignment agent materials that meet the requirements can also be used.

Optionally, in step S5, the friction orientation step is: using a roller with flannel cloth to perform friction orientation along one direction on the composite layer of the transparent conductive substrate with a composite layer in step S2 to obtain a transparent conductive substrate with an oriented composite layer, and the friction orientation parameters are set as follows: the number of frictions is 1, the friction pressure is 0.6 mm, the friction roller speed is 1200 r/min, the travel speed of the friction orientation equipment base is 20 m/min, the transparent conductive substrate with a composite layer is placed on the equipment base and moves accordingly, that is, the advancement speed of the transparent conductive substrate with a composite layer (platform) is 20 m/min.

Optionally, in step S5, the material of the flannel cloth used for friction orientation can be any one of cotton, nylon, synthetic fiber and the like, the friction orientation angle is not limited to a certain angle, and the friction method can be traditional plane friction or wrapping friction.

Based on the same inventive concept, the embodiment of the present application provides a dimming device, including two transparent conductive substrates arranged in parallel and opposite to each other and a sealing frame structure sandwiched between the two transparent conductive substrates, the two transparent conductive substrates and the sealing frame structure enclose a receiving cavity, the dimming component is filled in the receiving cavity, at least one of the two transparent conductive substrates is a transparent conductive substrate with a composite layer, and the transparent conductive substrate with a composite layer is a transparent conductive substrate with a composite layer that has been subjected to a friction orientation treatment or has not been subjected to a friction orientation treatment; the dimming device is prepared by the preparation method of the dimming device described above. When in use, the dimming device of the present application is connected to the control drive component to realize the switching between the transparent state and the fog state of the local area.

Optionally, a composite layer is provided on at least a local area of the conductive layer of the transparent conductive substrate with a composite layer. Preferably, the composite layer has a shape of at least one of a circle, a line, a diamond, a rectangle, and a polygon.

With respect to the dimming device of the present application, the embodiments of the present application provide several dimming devices with specific structures for detailed description.

Example 1

Referring to the structural schematic diagrams of FIG. 1 and FIG. 2 , the dimming device of the embodiment of the present application includes a first transparent conductive substrate and a second transparent conductive substrate arranged in parallel and opposite to each other, and a sealing frame structure 300 sandwiched between the first transparent conductive substrate and the second transparent conductive substrate. The first transparent conductive substrate, the second transparent conductive substrate and the sealing frame structure 300 enclose a receiving cavity. The first transparent conductive substrate includes a first transparent substrate 101 and a first transparent conductive layer 201 arranged in a stacked manner, and the first transparent conductive layer 201 is arranged adjacent to the receiving cavity. The second transparent conductive substrate includes a second transparent substrate 102 and a second transparent conductive layer 202 arranged in a stacked manner, and the second transparent conductive layer 202 is arranged adjacent to the receiving cavity. A composite layer 400 is arranged on the first transparent conductive layer 201 and/or the second transparent conductive layer 202. The steps for forming the composite layer 400 refer to the steps for preparing the composite layer 400 in the above-mentioned method for preparing the dimming device, and a dimming component 500 is filled in the receiving cavity. The first transparent conductive substrate and the second transparent conductive substrate of the present embodiment are used to carry the various film layers thereon and form a flat external protective structure of the dimming device.

In a feasible implementation, the thickness of the alignment layer 401 in this embodiment is 0.1 nm to 2 μm, and the alignment layer 401 in this embodiment is made of polyimide material. The material of the alignment layer 401 in this embodiment is not limited thereto, and may also be PVB, siloxane, etc.

In a feasible implementation, the thickness of the support structure layer 402 in this embodiment is 1 μm to 200 μm, and the distribution density of the spacers in the support structure layer 402 is 1 particle/mm ² to 200 particles/mm ² . The material of the spacers is polystyrene. The material of the spacers in this embodiment is not limited thereto, and can also be glass fiber or silicon dioxide.

In a feasible implementation, the dimming component 500 in this embodiment may be a liquid crystal dimming material, and the liquid crystal dimming material may be a cholesteric liquid crystal composition, a dye liquid crystal composition, or other liquid crystal components.

In a feasible implementation, the material of the first transparent substrate 101 and/or the second transparent substrate 102 in this embodiment can be one or more transparent polymer materials such as glass, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PP (polypropylene), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), PVC (polyvinyl chloride), PI (polyimide), cellulose, etc.

In a feasible implementation, the first transparent conductive layer 201 and/or the second transparent conductive layer 202 in this embodiment may be ITO, a carbon-based conductive film, a metal nanowire conductive film, a metal oxide film, etc. Among them: the preparation material of the carbon-based conductive film may be graphene oxide, carbon nanotubes, etc., the preparation material of the metal nanowire conductive film may be silver nanowires, copper nanowires, etc., and the preparation material of the metal oxide film may be indium tin oxide, indium oxide, tin oxide, zinc oxide, a mixed system of other metal oxides, etc.

In a feasible implementation, the composite layer 400 in this embodiment may be subjected to a rubbing orientation treatment or may not be subjected to a rubbing orientation treatment.

Example 2

The similarities between this embodiment and embodiment 1 are not repeated here. The difference lies in that, in this embodiment, a composite layer 400 is provided on the first transparent conductive layer 201 and/or the second transparent conductive layer 202, and the composite layer 400 is bonded to at least a partial area of the first transparent conductive layer 201 and/or the second transparent conductive layer 202. Referring to the structural schematic diagrams of FIGS. 3 , 4 and 5 , the shape of the composite layer 400 is at least one of a circle, a line, a diamond, a rectangle and a polygon, and the spacing between the composite layers 400 is determined according to specific requirements and is not limited.

In a feasible implementation, the composite layer 400 in this embodiment may be displayed in the form of an array on the first transparent conductive layer 201 and/or the second transparent conductive layer 202 , with reference to the structural schematic diagrams of FIG. 6 or FIG. 7 .

The present application also compares the optical performance of the dimming device of Example 1 with the dimming device prepared by the spacer fixing method and the dimming device prepared by the PS technology. Except for the different spacer fixing methods in different technical schemes, other materials and process steps are consistent. The dimming material used in this embodiment is a liquid crystal dimming system. The optical performance data of each dimming device are shown in Table 1.1.

Table 1.1 Optical performance data of various dimming devices

By comparison, the optical performance of the dimming device prepared by the technical solution of the present application is closest to the optical performance of the dimming device prepared by the spacer fixing method, and is better than the optical performance of the dimming device prepared by the PS technology.

The high-pressure gas purging method was further used to test the fixing effect of the spacers of the dimming device of Example 1 and the dimming devices prepared by the two spacer fixing methods. In the high-pressure gas purging method, the gas pressure values were set to 1.0 kgf/ ^cm2 , 2.0 kgf/ ^cm2 , and 3.0 kgf/ ^cm2 , respectively, the gas nozzle diameter was 2.0 mm, the gas purging distance was 30 mm, and the purging time was 15 s. The fixing effect was compared by counting the residual amount of the spacers before and after purging. The specific residual rate is shown in Table 1.2.

Table 1.2 Spacer fixation effect test

After analysis, it is found that the fixing effect of the spacer of the dimming device prepared by the technical solution of the present application is better than the fixing effect of the dimming device prepared by the spacer fixing technical solution.

In summary, the present application provides a new method for preparing the composite layer inside a dimming device. This method takes into account the functions of preparing the supporting structure layer and the orientation layer at the same time, eliminates the coating of the adhesive layer for fixing the spacer in the traditional technology, and the method is simple and can be applied to the preparation of high box thickness and large-size products.

Although this specification is described according to implementation modes, not every implementation mode includes only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

A method for preparing a dimming device, characterized in that it comprises the following steps:

S1. Prepare a transparent conductive substrate: clean the transparent conductive substrate and dry it for later use;

S2, preparing a composite layer: first, mixing the spacer and the alignment agent in proportion to form an alignment agent mixed solution in which the spacer is evenly dispersed, and then coating the alignment agent mixed solution on the conductive layer of the transparent conductive substrate in step S1, and forming a composite layer after curing, thereby obtaining a transparent conductive substrate with a composite layer, wherein: the composite layer includes an alignment layer and a supporting structure layer, the alignment layer is formed by curing the alignment agent, and the supporting structure layer is composed of the spacer;

S3, preparing a box body: using a frame sealing adhesive to bond two aligned transparent conductive substrates, and curing them to form a box body, wherein at least one of the two transparent conductive substrates is the transparent conductive substrate with a composite layer in step S2;

S4, filling the dimming component into the box body in step S3 to form a dimming layer, and then curing and sealing to obtain a dimming device.
The method for preparing a dimming device according to claim 1 is characterized in that, after step S2 and before step S3, it further comprises step S5, wherein step S5 is an orientation process: orienting the composite layer of the transparent conductive substrate with the composite layer in step S2 to obtain a transparent conductive substrate with an aligned composite layer;

In step S3, at least one of the two transparent conductive substrates is the transparent conductive substrate with the alignment composite layer in step S5.
The method for preparing a dimming device according to claim 1 or 2, characterized in that, in step S2, the thickness of the alignment layer is 0.1 nm to 2 μm, and the thickness of the support structure layer is 1 μm to 200 μm.
The method for preparing a dimming device according to claim 3, characterized in that the distribution density of the spacers in the support structure layer is 1 piece/mm 2 to 200 pieces/mm 2 .
The method for preparing a dimming device according to claim 3, characterized in that the spacer is a sticky spacer or a non-sticky spacer.
The method for preparing a dimming device according to claim 3 is characterized in that the spacer is in any one of a spherical shape, a rod shape, an elliptical shape, and a sheet shape.
The method for preparing a dimming device according to claim 3 is characterized in that the material of the spacer is resin or inorganic material, the resin is polystyrene, and the inorganic material is glass fiber or silicon dioxide.
The method for preparing a dimming device according to claim 3 is characterized in that the orientation agent is used to prepare any one of IPS, TN, STN, and VA type alignment layers.
The method for preparing a dimming device according to claim 2 is characterized in that in step S5, the orientation is rubbing orientation, and the rubbing orientation step is: using a roller with flannel to rub the composite layer of the transparent conductive substrate with the composite layer in step S2 in one direction to obtain a transparent conductive substrate with an aligned composite layer,

The parameters of the friction orientation are set as follows: the number of frictions is 1-4 times, the friction indentation is 0.05mm-0.7mm, the friction roller speed is 200r/min-1200r/min, and the advancement speed of the transparent conductive substrate with the composite layer is 3m/min-60m/min.
A dimming device, characterized in that it comprises two transparent conductive substrates arranged in parallel and opposite to each other and a sealing frame structure sandwiched between the two transparent conductive substrates, the two transparent conductive substrates and the sealing frame structure enclose a receiving cavity, and a dimming component is filled in the receiving cavity, at least one of the two transparent conductive substrates is a transparent conductive substrate with a composite layer, and the transparent conductive substrate with a composite layer is a transparent conductive substrate with a composite layer that has been subjected to a rubbing orientation treatment or has not been subjected to a rubbing orientation treatment;

The dimming device is prepared by the dimming device preparation method according to any one of claims 1 to 9.
The dimming device according to claim 10 is characterized in that a composite layer is provided on at least a partial area of the conductive layer of the transparent conductive substrate with a composite layer.
The dimming device according to claim 11 is characterized in that the shape of the composite layer is at least one of circular, linear, diamond, rectangular, and polygonal.