WO2024099358A1 - 一种工艺步骤终点检测方法和半导体工艺设备 - Google Patents

一种工艺步骤终点检测方法和半导体工艺设备 Download PDF

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Publication number
WO2024099358A1
WO2024099358A1 PCT/CN2023/130459 CN2023130459W WO2024099358A1 WO 2024099358 A1 WO2024099358 A1 WO 2024099358A1 CN 2023130459 W CN2023130459 W CN 2023130459W WO 2024099358 A1 WO2024099358 A1 WO 2024099358A1
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Prior art keywords
time
expected
process step
timing
final inspection
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English (en)
French (fr)
Inventor
刘思源
张园园
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present invention relates to the field of semiconductor process technology, and in particular to a process step endpoint detection method and a semiconductor process equipment.
  • the current manual endpoint detection method is to provide the user with a manual operation final inspection button in the software interface. The user can click this button at any time during the process, and the process will immediately end the current process step and enter the execution of the next process step.
  • the existing manual endpoint detection technology is simple in design and has a single application scenario. It only provides a manual final inspection button for users to perform manual final inspection operations, and the manual final inspection function lacks intelligence. Due to the complexity and diversity of etching machine models and process types, the existing manual endpoint detection function can no longer meet the needs of some special processes of users.
  • embodiments of the present invention are proposed to provide a method for overcoming the above problems or at least A process step endpoint detection method and a corresponding semiconductor process equipment partially solve the above problems.
  • an embodiment of the present invention discloses a process step endpoint detection method, comprising:
  • the first timing monitor is triggered to start timing monitoring, and when the timing time of the first timing monitor reaches the delayed final inspection time, a skipping process for the process step is triggered.
  • the method further comprises:
  • the calculating the delayed final inspection time of the process step according to the expected process time and the executed process time includes:
  • the delayed final inspection time of the process step is calculated according to the expected process time and the executed process time.
  • it also includes:
  • it also includes:
  • the calculating the delayed final inspection time of the process step according to the expected process time and the executed process time includes:
  • the delayed final inspection time is obtained by subtracting the executed process time from the expected process time.
  • the method further includes:
  • the start time of the first timing monitor is reset to zero.
  • it also includes:
  • a second timing monitor When the process step starts, a second timing monitor is started, the second timing monitor is used to time the process step and monitor the abnormal process state, process execution delay time, and abnormal state duration of the process step;
  • the second timing monitor is turned off.
  • it also includes:
  • the expected process time is set.
  • the method further includes:
  • the preset code modules are loaded in sequence; the preset code modules include a final inspection module and a timing monitoring module; the timing monitoring module is used to trigger the first timing monitor to start timing monitoring;
  • timing monitoring module Before loading the timing monitoring module, assigning a logic channel of the final inspection module that is not dynamically generated to a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logic channel assigned to the preset string variable;
  • the terminal is generated according to the preset string variable.
  • the logic channel of the inspection module is used to execute and send an instruction to jump out of the process step through the logic channel of the final inspection module.
  • the embodiment of the present invention further discloses a semiconductor process equipment, the semiconductor process equipment comprising:
  • the controller is used to obtain the executed process time and the expected process time for the process step during the execution of the process step; calculate the delayed final inspection time of the process step according to the expected process time and the executed process time; trigger the first timing monitor to start timing monitoring, and trigger the skipping process for the process step when the timing time of the first timing monitor reaches the delayed final inspection time.
  • the controller is also used to obtain the recipe setting time for completing multiple process steps; determine whether the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time; when the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, calculate the delayed final inspection time of the process step based on the expected process time and the executed process time.
  • the controller is further configured to issue an alarm if the expected process time is less than the executed process time, so as to remind that the expected process time is unreasonable.
  • the controller is further configured to issue an alarm if the expected process time is greater than the recipe setting time, so as to remind that the expected process time is unreasonable.
  • the controller is used to subtract the executed process time from the expected process time to obtain the delayed final inspection time.
  • the controller is also used to reset the expected process time to zero based on the delayed final inspection time.
  • the controller is further configured to start a second timing monitoring
  • the second timing monitor is used to time the process step and monitor the abnormal process state, process execution delay time, and abnormal state duration of the process step; when the process step is completed, the second timing monitor is turned off.
  • the controller is also used to determine whether the process step needs to shorten the process time based on the monitored spectral curve and the etching effect of the chip during the execution of the process step; when the process step needs to shorten the process time, set the expected process time.
  • the controller is also used to load a preset code module after the lower computer is started;
  • the preset code module includes a final inspection module and a timing monitoring module;
  • the timing monitoring module is used to trigger a first timing monitor to start timing monitoring; before loading the timing monitoring module, the logical channel of the final inspection module that is not dynamically generated is assigned to a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logical channel assigned to the preset string variable; when the loading of the preset code module is completed, the logical channel of the final inspection module is generated according to the preset string variable, so as to execute and send an instruction to jump out of the process step through the logical channel of the final inspection module.
  • the executed process time and the expected process time for the process step are obtained; based on the expected process time, the executed process time, the delayed final inspection time of the process step is calculated; based on the delayed final inspection time, the first timing monitor is triggered to start timing monitoring, and when the timing time of the first timing monitor reaches the delayed final inspection time, the skipping process for the process step is triggered, so that the endpoint time of the process step can be flexibly changed according to the expected process time set by the user, ensuring that the actual execution time of the process step meets the user's expected process time; the present invention allows users to flexibly set the expected process time in the software operation interface. At the same time, when the timing time of the timing monitor reaches the endpoint delay time, the skipping function can be automatically executed without the need to manually trigger the manual final inspection button, which is more automated.
  • FIG1 is a flowchart of a process step endpoint detection method provided by an embodiment of the present invention.
  • FIG2 is a schematic diagram of a solution for predicting expected process time to implement delayed final inspection provided by an embodiment of the present invention
  • FIG. 3 is a flow chart of a solution for predicting the execution time of process steps provided by an embodiment of the present invention
  • FIG. 4 is a structural block diagram of a semiconductor process equipment provided by an embodiment of the present invention.
  • the existing manual endpoint detection scheme is: the process engineer edits the EPD configuration file that needs to collect spectral data in the recipe setting in advance.
  • the EPD configuration file is a file that pre-sets the spectrum acquisition parameters in the EPD endpoint detection software, which mainly includes setting the monitoring element spectrum line and wavelength, setting the data acquisition interval time and spectrum acquisition intensity, setting the filtering method and the endpoint judgment method, etc. Then select the endpoint detection mode (EndMode) according to different process types to wait for the endpoint signal. Then execute the process and start the process monitor (Monitor) and step timer.
  • the EPD software collects spectral data and waits for the process endpoint conditions. The operator will perform a manual termination of the process step after receiving the endpoint signal in the EPD software Local mode. If it is determined that the process step is manually terminated, the control software process will skip the execution of the current step and enter the next process step. Otherwise, the process monitor and step timer will be stopped after the current entire process step time is completed, and the process step
  • the existing manual endpoint detection function of the etcher only provides a button for manually skipping steps in the software interface.
  • the function design is simple and lacks intelligence. With the continuous development and progress of etching technology, this solution that relies on customer experience for manual endpoint detection can no longer meet the process requirements of some infrared etchers. Therefore, it is necessary to develop a more intelligent manual endpoint detection solution.
  • the camera installed in the chamber of the etcher can be used to monitor the etching status of the wafer in real time, and the end point detection software can be used to collect spectral data in real time.
  • the process etching time needs to be adjusted.
  • the existing manual final inspection function and the function of capturing the end point by the spectrometer can no longer meet the needs.
  • the etching accuracy is required to be high. Users will observe the etching effect of the actual wafer during the etching process to ensure that there is no over-etching. Therefore, it is necessary to develop a control solution that allows users to modify the expected etching process time to delay the execution of manual endpoint detection to meet the accuracy requirements of some etching machines for wafer morphology effects.
  • One of the core concepts of an embodiment of the present invention is to provide a process step endpoint detection method, which allows the user to flexibly change the expected process time on the upper computer according to the observed process conditions.
  • the lower computer can calculate the delayed final inspection time based on the changed expected process time, and trigger the monitor to monitor the delayed final inspection time of the process step, and automatically execute the skip function when the timing time reaches the delayed final inspection time.
  • the embodiment of the present invention is described by taking the etching process steps as an example, but the present invention is not limited to this.
  • it may be a process step of introducing process gas and controlling chamber pressure, a process step of loading RF power to ignite, a process step of desorbing the wafer, a process step of blowing air (for blowing back helium gas into the wafer to detect whether the wafer is sticky), a deposition process step, etc.
  • the present invention can support predicting the expected process execution time in each process step, and the embodiment of the present invention is not limited here.
  • Step 101 in the process of executing a process step, obtaining the executed process time and the expected process time for the process step.
  • FIG. 2 a method for predicting an expected process according to an embodiment of the present invention is provided.
  • Schematic diagram of the delayed final inspection scheme which is realized by the joint action of the acquisition module, monitoring module, host computer, and slave computer to realize the delayed final inspection skipping step.
  • the acquisition module can collect the spectral curve of the wafer etching in real time through the end point detector software, and the monitoring module can monitor and shoot the wafer etching morphology image in real time through the camera in the process chamber.
  • the user can predict the execution time of the current process step based on the observed spectral curve of the wafer and the wafer etching morphology image.
  • the host computer can provide the user with an operation button that can set the expected process time, and the user can enter the expected process time of the current process step in the host computer interface.
  • the host computer can set the expected process time based on the expected process time entered by the user and pass it to the slave computer.
  • the upper computer can transmit the expected process time parameters to the lower computer via TCP/IP network port communication.
  • a function class (the class name can be defined as EndStepDelayTimeSetter) for predicting the expected execution time of the process step can be added to the lower computer software, and the service (call_SetExpectStepTime) for setting the user's expected process time can be encapsulated in this class, and then multiple readable and writable pointer type member variables can be defined to obtain some key time parameters in the process step.
  • Pointer type is a data type often used in software programming. By defining pointer type member variables, the relevant time parameter values of the current process step execution can be obtained in real time in the code control process.
  • the recipe setting time parameter (m_pSetStepTime), the total time of all process steps set; the executed process time parameter (m_pElapsedStepTime), the time the current process step has been executed; the delayed final inspection time parameter (m_pManualDelayTime), the time the current process step needs to delay the execution of the final inspection; the expected process time parameter (m_pExpectStepTime), the expected process step execution time set by the user after prediction.
  • a service calling interface and button may be added to the software interface of the host computer to set the expected process time in the software interface of the host computer.
  • the process step based on the monitored spectrum curve and the etching effect of the wafer, it is determined whether the process step needs to shorten the process time; when the process step When you need to shorten the process time, set the desired process time.
  • a longer expected step time can be set in advance and the spectral curve of chip etching and the chip etching morphology image can be monitored in real time.
  • the etching rate of the current process step can be determined based on the real-time monitoring of the spectral curve of chip etching and the real-time monitoring of the chip etching morphology image. If the etching rate is fast, the execution of the current process step needs to be terminated in advance, and the expected process time can be modified again.
  • a second timing monitor when a process step starts, a second timing monitor is started, and the second timing monitor is used to time the process step and monitor the abnormal process state, process execution delay time, and abnormal state duration of the process step; when the process step ends, the second timing monitor is turned off.
  • the timing monitoring of the process step can be realized by the second timing monitor, and the second timing monitor can be started and stopped in units of process steps.
  • the second timing monitor is triggered to turn on, and when the process step ends, the second timing monitor is triggered to turn off.
  • the second timing monitor can start the monitoring check item to monitor the abnormal process state, process execution delay time, and abnormal state duration during the process step. For example, if the gas flow rate during the process step exceeds the preset range, the abnormal process state condition is triggered, and the duration of the gas flow abnormality is monitored at the same time. For example, when the process step starts, the corresponding software is already opened. Since the hardware response takes a certain amount of time, there is a certain delay in not being able to start the process in time. It is necessary to monitor how long the delay is after the process step starts.
  • Step 102 calculating the delayed final inspection time of the process step according to the expected process time and the executed process time.
  • a schematic diagram of a delayed final inspection scheme for predicting the expected process time provided in an embodiment of the present invention.
  • the lower computer can calculate the delayed final inspection time based on the acquired expected process time and the executed process time, and obtain the current remaining etching time after setting the expected process time.
  • the delayed final inspection time of the process step is calculated according to the expected process time and the executed process time, including: subtracting the executed process time from the expected process time to obtain the delayed final inspection time.
  • a recipe setup time for completing multiple process steps is obtained; and a delayed final inspection time of the process step is calculated based on the expected process time and the executed process time, including: determining whether the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time; when the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time, calculating the delayed final inspection time of the process step based on the expected process time and the executed process time.
  • a wafer may include multiple process steps during the process, and the user may input the recipe setting time for completing the multiple process steps in advance in the recipe editing interface of the host computer.
  • the expected process time it can be determined whether the expected process time meets a preset condition based on the acquired expected process time. If the expected process time meets the preset condition, it means that the expected process time set by the user is reasonable.
  • the delayed final inspection time of the process step is calculated based on the expected process time and the executed process time.
  • the lower computer when the lower computer obtains the expected process time set by the user, it can determine whether the expected process time set by the user is less than or equal to the recipe setting time and greater than or equal to the executed process time. If the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, the process time that needs to be delayed to perform manual final inspection can be calculated based on the expected process time and the executed process time.
  • an alarm is issued to remind that the expected process time is unreasonable.
  • the process time of the etching process step is 100 seconds, and the executed process time is 50 seconds.
  • the user sets the expected process time of the etching process step to 20 seconds. Therefore, the setting of the expected process time is unreasonable, and an alarm can be issued to remind the user that the setting of the expected process time is unreasonable.
  • an alarm is issued to remind that the expected process time is unreasonable.
  • the user pre-sets the recipe setting time in the recipe editing interface to 200 seconds.
  • the user sets the expected process time to 300 seconds.
  • the etching equipment cannot complete all the process steps. Therefore, the setting of the expected process time is unreasonable.
  • An alarm can be issued to remind the user that the setting of the expected process time is unreasonable.
  • the lower computer can check the expected process time parameters transmitted by the upper computer before executing the service of setting the user expected process time (call_SetExpectStepTime).
  • the check conditions are as follows:
  • Step 103 triggering the first timing monitor to start timing monitoring, and triggering the skipping process for the process step when the timing time of the first timing monitor reaches the delayed final inspection time.
  • the first timing monitor when the delayed final inspection time is calculated, can be started and the first timing monitor starts timing until the timing time of the first timing monitor reaches the delayed final inspection time.
  • the lower computer control software can issue a command to terminate the current process step, end the execution of the current process step, and immediately jump to the next process step.
  • the upper computer obtains the executed process time and the expected process time for the process step and transmits them to the lower computer at the same time. Then the lower computer calculates the delayed final inspection time of the process step based on the expected process time and the executed process time.
  • These actions can be executed instantly through software code, and the time consumed is the computer's memory processor speed and can be ignored. Therefore, in the above step 103, the triggering time point for triggering the first timing monitor to start timing monitoring can be regarded as the time point when the upper computer obtains the executed process time and the expected process time for the process step, for example, when the user Enter the desired process time on the host computer interface.
  • the timing monitoring of the delayed final inspection (i.e., during the normal process execution, whether the action of receiving the expected step time input by the user to trigger the first timing monitor to start timing monitoring) can be monitored at the beginning of the process step, without setting the delayed monitoring time, and can meet the requirements of predicting the process time and setting the expected step time at any moment in the process step, that is, the life cycle of the timing monitoring of the delayed final inspection includes the entire process from the beginning to the end of the process step, ensuring that the timing monitoring of the delayed final inspection can be performed at any time point of the process execution, so there is no need to set the delayed monitoring time.
  • the monitoring condition of the delayed final inspection is immediately triggered, the first timing monitor is started, the process steps are executed normally according to the calculated delayed final inspection time, and after the process of the delayed final inspection time is executed, the current process step is jumped out.
  • the timing monitoring scheme of the embodiment of the present invention can support multiple settings of the expected process time, and has high flexibility. For example, after setting the first expected step time and before reaching the corresponding delayed final inspection time, if the user finds that the etching effect of the chip is not good and the supplementary etching time must be increased, the new expected process time can be reset in the software interface, so that the first timing monitor can calculate according to the new expected process time and the executed process time to obtain a new delayed final inspection time, and execute the final inspection jump step when the timing time of the first timing monitor reaches the new delayed final inspection time.
  • a preset code module is loaded; the preset code module includes a final inspection module and a timing monitoring module; the timing monitoring module is used to trigger the first timing monitor to start timing monitoring; before loading the timing monitoring module, the logical channel of the final inspection module that is not dynamically generated is assigned to a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logical channel assigned to the preset string variable; when the loading of the preset code module is completed, the logical channel of the final inspection module is generated according to the preset string variable, so as to execute and send an instruction to jump out of the process step through the logical channel of the final inspection module.
  • the timing monitoring part of the first timing monitor of the present invention can be implemented through a configuration file.
  • the lower computer software startup is different code modules in a certain order and steps.
  • the preset code modules can be loaded in sequence.
  • the preset code module can include a final inspection module and a timing monitoring module.
  • the timing monitoring module is generated before the final inspection module (ManualEndStep).
  • the logical channel resources of the final inspection module ManualEndStep
  • the lower computer has not yet dynamically created the logical channel of ManualEndStep, and the lower computer software fails to start.
  • the logical channel of the final inspection module that is not dynamically generated can be assigned to a string variable indicating a preset path.
  • the ManualEndStepAcutator class final inspection actuator class
  • the SetManualEndStepActuatorCh set final inspection actuator channel
  • the logical channel of ManualEndStep that is not dynamically generated can be assigned to a string variable indicating a preset path through the SetManualEndStepActuatorCh function, so that the timing monitoring module is loaded based on the logical channel assigned to the preset string variable, so that the lower computer will not access the logical channel of ManualEndStep that is not dynamically generated when starting up, avoiding the problem of software startup failure caused by failure to access the logical channel that is not dynamically generated.
  • the creation of the ManualEndStep logic channel can be postponed to the end of the lower computer software startup process by accessing the string variable after the software is started, thereby avoiding logical confusion caused by different startup orders of the software code modules.
  • the logic channel of the final inspection module can be generated according to the preset string variable, so as to execute and send an instruction to jump out of the process step through the logic channel of the final inspection module.
  • the start time of the first timing monitor is reset to zero.
  • the start time of the first timing monitor can be reset to zero to ensure that the timing accuracy of the first timing monitor is guaranteed each time a new expected step time is set.
  • the user executes an etching process step of 200 seconds.
  • the etching process step runs to 15 seconds
  • the user sets the expected process time of the etching process step to 20 seconds in the software interface of the upper computer.
  • the lower computer control software will immediately reset the starting time of the first timing monitor to zero, and the first timing monitor will start timing the remaining 5 seconds from 0.
  • the lower computer control software can issue a command to jump out of the current step to achieve the delayed final inspection jump step.
  • the lower computer control software will reset the starting time of the first timing monitor to zero again, and then the first timing monitor will re-time the remaining etching process time, thereby ensuring the timing accuracy of each delayed final inspection jump step.
  • FIG3 a flow chart of a scheme for predicting the execution time of process steps provided in an embodiment of the present invention is provided.
  • the user edits the process recipe, selects an EPD profile including spectrum collection parameters and an endpoint mode, and then executes the process.
  • the user can edit the EPD configuration file in the EPD endpoint detection software in advance, for example, select the element spectrum lines and wavelength range to be collected according to the etching material of the actual chip, and set the filtering method and endpoint judgment method; select the edited EPD configuration file and endpoint detection mode in the etcher recipe editing interface, and then issue the process task and execute the process according to the recipe settings.
  • the lower computer may start to execute the process according to the process recipe and control the second monitoring timer to start.
  • the second monitoring timer may include a monitor and a timer.
  • the endpoint detector may start Collect spectral data; at the same time, the camera in the etcher process chamber starts to monitor and capture the wafer etching morphology image in real time.
  • the user predicts the remaining etching time and sets the expected process time.
  • the user when the spectral curve of the EPD software is monitored to have certain changes at a certain moment during the execution of a process step (for example, the appearance of a peak in a certain etching curve), the user combines the observed spectral curve and the wafer etching morphology image to predict the expected process time for the current process step to achieve the target etching effect, and sets the expected process time through the operation button on the host computer interface.
  • the user can first set a longer expected step time and continue to track and observe the curve and take pictures. If the etching rate is fast and the current step needs to be terminated early, the user can modify the expected step time again.
  • the lower computer when the lower computer receives the expected process time sent by the upper computer, it can perform a parameter validity check on the expected process time.
  • the lower computer software can calculate the remaining etching time and reset the trigger time of the expected step time event to zero to ensure that each time a new expected process time is set, the timing accuracy of the first timing monitor can be guaranteed.
  • the lower computer starts the timing of the delay time
  • the device monitors the mechanism and accurately times the remaining etching time.
  • the lower computer sends a command to jump out of the current step through the executor that executes the delayed final inspection, ends the execution of the current process step and immediately jumps to the next process step to ensure that the actual execution time of the process step meets the expected step time set by the user, thereby achieving the purpose of the user's predicted step time and delayed execution of the final inspection.
  • the next process step may be a deposition step, or a new etching step using another process gas and ignition power, or a wafer desorption step, etc. Those skilled in the art may determine the next process step according to actual process requirements, and the present invention is not limited thereto.
  • the second timing monitor stops timing monitoring and updates the actual time of the process step.
  • the executed process time and the expected process time for the process step are obtained; based on the expected process time, the executed process time, the delayed final inspection time of the process step is calculated; based on the delayed final inspection time, the first timing monitor is triggered to start timing monitoring, and when the timing time of the first timing monitor reaches the delayed final inspection time, the skipping process for the process step is triggered, so that the endpoint time of the process step can be flexibly changed according to the expected process time set by the user, ensuring that the actual execution time of the process step meets the user's expected process time; the present invention allows users to flexibly set the expected process time in the software operation interface. At the same time, when the timing time of the timing monitor reaches the endpoint delay time, the skipping function can be automatically executed without the need to manually trigger the manual final inspection button, which is more automated.
  • the semiconductor process equipment 401 may include:
  • Controller 4011 is used to obtain the executed process time and expected process time for the process step during the execution of the process step; calculate the delayed final inspection time of the process step according to the expected process time and the executed process time; trigger the first timing monitor to start timing monitoring, and trigger the skipping processing for the process step when the timing time of the first timing monitor reaches the delayed final inspection time.
  • the controller is also used to obtain the recipe setting time for completing multiple process steps; determine whether the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time; when the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, calculate the delayed final inspection time of the process step based on the expected process time and the executed process time.
  • the controller is further configured to issue an alarm if the expected process time is less than the executed process time, so as to remind that the expected process time is unreasonable.
  • the controller is further configured to issue an alarm if the expected process time is greater than the recipe setting time, so as to remind that the expected process time is unreasonable.
  • the controller is used to subtract the executed process time from the expected process time to obtain the delayed final inspection time.
  • the controller after calculating the delayed final inspection time of the current process step based on the expected process time and the executed process time, and before triggering the first timing monitor to start timing monitoring, the controller is also used to reset the expected process time to zero based on the delayed final inspection time.
  • the controller is also used to start a second timing monitor when the process step starts, and the second timing monitor is used to time the process step and monitor the abnormal process state, process execution delay time, and abnormal state duration of the process step; when the process step ends, the second timing monitor is turned off.
  • the controller is further configured to: Based on the monitored spectral curve and the etching effect of the wafer, it is determined whether the process step needs to shorten the process time; when the process step needs to shorten the process time, the expected process time is set.
  • the controller is applied to a lower computer and is also used to load preset code modules in sequence after the lower computer is started;
  • the preset code module includes a final inspection module and a timing monitoring module;
  • the timing monitoring module is used to trigger a first timing monitor to start timing monitoring; before loading the timing monitoring module, the logical channel of the final inspection module that is not dynamically generated is assigned to a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logical channel assigned to the preset string variable; when the preset code module is loaded, the logical channel of the final inspection module is generated according to the preset string variable, so as to execute and send an instruction to jump out of the process step through the logical channel of the final inspection module.
  • the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.
  • the embodiments of the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.
  • computer-usable storage media including but not limited to disk storage, CD-ROM, optical storage, etc.
  • These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate A machine that causes instructions executed by a processor of a computer or other programmable data processing terminal device to produce means for implementing the functions specified in one or more processes in a flowchart and/or one or more blocks in a block diagram.
  • These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.
  • These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce computer-implemented processing, so that the instructions executed on the computer or other programmable terminal device provide steps for implementing the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

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Abstract

本发明实施例提供了一种工艺步骤终点检测方法和半导体工艺设备，该方法包括：在执行工艺步骤的过程中，获取针对工艺步骤的已执行工艺时间和期望工艺时间；根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间；触发第一计时监测器启动计时监测，并在第一计时监测器的计时时间达到延时终检时间时，触发针对工艺步骤的跳步处理。可以根据用户设置的期望工艺时间，实现工艺步骤终点时间的灵活变动，确保工艺步骤实际执行时间满足用户期望工艺时间；当计时监测器的计时时间达到延时终检时间时，可自动执行跳步，无需人工触发手动终检的按钮，更加自动化。

Description

一种工艺步骤终点检测方法和半导体工艺设备 技术领域
本发明涉及半导体工艺技术领域，特别是涉及一种工艺步骤终点检测方法和一种半导体工艺设备。
背景技术
在刻蚀工艺步骤的过程中，目前手动终点检测方法是在软件界面提供手动操作终检的按钮给用户，用户在工艺过程中能够在步骤运行的任一时刻点击此按钮，这样工艺会立即结束当前工艺步骤进入下一工艺步骤的执行。
这种方案的使用场景主要有两种，一是当机台在本地模式下使用终点检测器(End Point Detector，EPD，利用从蚀刻工艺开始到结束为止特定的波长的光强度的变化，检测出蚀刻工艺的最合适的终点)终点检测软件抓取到刻蚀终点时，用户会在软件界面点击手动操作终检按钮立即结束当前工艺步骤；二是用户在编辑工艺配方时无法准确预计刻蚀时间，此时会将步骤刻蚀时间设置的较长一些，实际工艺执行过程中会随时根据工艺执行效果点击手动终检按钮结束当前步骤。
现有的手动终点检测技术设计简单，应用场景单一，对用户只开放了一个手动操作终检的按钮用于执行手动终点检测的操作，手动终检功能缺乏智能化。由于刻蚀机机型及工艺类型的复杂多样，现有的手动终点检测功能已无法满足用户的某些特殊工艺。
发明内容
鉴于上述问题，提出了本发明实施例以便提供一种克服上述问题或者至 少部分地解决上述问题的工艺步骤终点检测方法和相应的一种半导体工艺设备。
为了解决上述问题，本发明实施例公开了一种工艺步骤终点检测方法，包括：
在执行工艺步骤的过程中，获取针对所述工艺步骤的已执行工艺时间和期望工艺时间；
根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间；
触发第一计时监测器启动计时监测，并在所述第一计时监测器的计时时间达到所述延时终检时间时，触发针对所述工艺步骤的跳步处理。
可选地，所述方法还包括：
获取完成多个所述工艺步骤的配方设置时间；
所述根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间，包括：
判断所述期望工艺时间是否小于或等于所述配方设置时间且大于或等于所述已执行工艺时间；
当所述期望工艺时间小于或等于所述配方设置时间且大于或等于所述已执行工艺时间时，根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间。
可选地，还包括：
若所述期望工艺时间小于所述已执行工艺时间，则发出报警，以提醒所述期望工艺时间不合理。
可选地，还包括：
若所述期望工艺时间大于所述配方设置时间，则发出报警，以提醒所述期望工艺时间不合理。
可选地，所述根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间，包括：
将所述期望工艺时间减去所述已执行工艺时间，得到所述延时终检时间。
可选地，在所述根据所述期望工艺时间和所述已执行工艺时间，计算当前工艺步骤的延时终检时间之后，且在所述触发第一计时监测器启动计时监测之前，还包括：
根据所述延时终检时间，将所述第一计时监测器的起始时间归零处理。
可选地，还包括：
当所述工艺步骤开始时，启动第二计时监测器，所述第二计时监测器用于对所述工艺步骤进行计时，并监测所述工艺步骤的异常工艺状态、工艺执行延迟时间、异常状态持续时间；
当所述工艺步骤结束时，关闭所述第二计时监测器。
可选地，还包括：
在执行工艺步骤的过程中，基于监测的光谱曲线和晶片的刻蚀效果，判断所述工艺步骤是否需要缩短工艺时间；
当所述工艺步骤需要缩短工艺时间时，设置所述期望工艺时间。
可选地，应用于下位机，所述方法还包括：
在所述下位机启动后，依次加载预设代码模块；所述预设代码模块包括终检模块和计时监控模块；所述计时监控模块用于触发第一计时监测器启动计时监测；
在加载所述计时监控模块之前，将未动态生成的所述终检模块的逻辑通道赋值为指示预设路径的字符串变量，以使所述计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载；
当加载所述预设代码模块完成后，根据所述预设字符串变量生成所述终 检模块的逻辑通道，以通过所述终检模块的逻辑通道执行发送跳出所述工艺步骤的指令。
本发明实施例还公开了一种半导体工艺设备，所述半导体工艺设备包括：
控制器，用于在执行工艺步骤的过程中，获取针对所述工艺步骤的已执行工艺时间和期望工艺时间；根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间；触发第一计时监测器启动计时监测，并在所述第一计时监测器的计时时间达到所述延时终检时间时，触发针对所述工艺步骤的跳步处理。
可选地，所述控制器，还用于获取完成多个所述工艺步骤的配方设置时间；判断所述期望工艺时间是否小于或等于所述配方设置时间且大于或等于所述已执行工艺时间；当所述期望工艺时间小于或等于所述配方设置时间且大于或等于所述已执行工艺时间时，根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间。
可选地，所述控制器，还用于若所述期望工艺时间小于所述已执行工艺时间，则发出报警，以提醒所述期望工艺时间不合理。
可选地，所述控制器，还用于若所述期望工艺时间大于所述配方设置时间，则发出报警，以提醒所述期望工艺时间不合理。
可选地，所述控制器，用于将所述期望工艺时间减去所述已执行工艺时间，得到所述延时终检时间。
可选地，在所述根据所述期望工艺时间和所述已执行工艺时间，计算当前工艺步骤的延时终检时间之后，且在所述触发第一计时监测器启动计时监测之前，所述控制器，还用于根据所述延时终检时间，将所述期望工艺时间归零处理。
可选地，所述控制器，还用于当所述工艺步骤开始时，启动第二计时监 测器，所述第二计时监测器用于对所述工艺步骤进行计时，并监测所述工艺步骤的异常工艺状态、工艺执行延迟时间、异常状态持续时间；当所述工艺步骤结束时，关闭所述第二计时监测器。
可选地，所述控制器，还用于在执行工艺步骤的过程中，基于监测的光谱曲线和晶片的刻蚀效果，判断所述工艺步骤是否需要缩短工艺时间；当所述工艺步骤需要缩短工艺时间时，设置所述期望工艺时间。
可选地，应用于下位机，所述控制器，还用于在下位机启动后，加载预设代码模块；所述预设代码模块包括终检模块和计时监控模块；所述计时监控模块用于触发第一计时监测器启动计时监测；在加载所述计时监控模块之前，将未动态生成的所述终检模块的逻辑通道赋值为指示预设路径的字符串变量，以使所述计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载；当加载所述预设代码模块完成后，根据所述预设字符串变量生成所述终检模块的逻辑通道，以通过所述终检模块的逻辑通道执行发送跳出所述工艺步骤的指令。
本发明实施例包括以下优点：
在本发明实施例中，在执行工艺步骤的过程中，获取针对工艺步骤的已执行工艺时间和期望工艺时间；根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间；根据延时终检时间，触发第一计时监测器启动计时监测，并在第一计时监测器的计时时间达到延时终检时间时，触发针对工艺步骤的跳步处理，从而可以根据用户设置的期望工艺时间，实现工艺步骤终点时间的灵活变动，确保工艺步骤实际执行时间满足用户期望工艺时间；本发明可以使用户在软件操作界面灵活设置期望工艺时间，同时，当计时监测器的计时时间达到终点延迟时间时，可以自动执行跳步功能，无需人工触发手动终检的按钮，更加自动化。
附图说明
图1是本发明实施例提供的一种工艺步骤终点检测方法的步骤流程图；
图2是本发明实施例提供的一种预判期望工艺时间实现延时终检方案示意图；
图3是本发明实施例提供的一种可预判工艺步骤执行时间方案的流程图；
图4是本发明实施例提供的一种半导体工艺设备的结构框图。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。
现有的手动终点检测方案是：工艺工程师预先在配方设置中，编辑需要采集光谱数据的EPD配置文件。EPD配置文件是在EPD终点检测软件预先设置采集光谱参数的文件，主要包含设置监控元素谱线及波长、设置数据采集间隔时间及光谱采集强度、设置滤波方法和终点判断方法等。然后根据不同工艺类型来选择终点检测模式(EndMode)，以等待终点信号。接着执行工艺并启动工艺监测器(Monitor)和步骤计时器，EPD软件进行光谱数据的采集和工艺终点条件的等待判断，操作人员会在EPD软件Local模式下收到终点信号后执行手动中止工艺步骤。若判断出工艺步骤是人为手动中止的，则控制软件流程会跳过当前步骤的执行，进入下一个工艺步骤，否则继续执行完当前整个工艺步骤时间后停止工艺监测器和步骤计时器，工艺步骤正常结束。
现有的刻蚀机手动终点检测功能只是在软件界面提供了手动跳过步骤执行的按钮，功能设计单一，缺乏智能化。随着刻蚀工艺的不断发展进步，这种需要凭借客户经验进行手动终点检测的方案对于一些红外刻蚀机已无法满足其工艺需求。因此有必要研发一种更加智能的手动终点检测方案。
通过对用户的需求分析，发现用户需要机台具备能够通过预判刻蚀时间 进行手动终检跳步的功能。例如，红外刻蚀机在进行晶片刻蚀工艺时，可以通过刻蚀机腔室安装的摄像头实时拍照监控晶片的刻蚀情况，可以通过终点检测检测软件实时采集光谱数据，当用户观察到晶片的刻蚀曲线到达某个刻蚀峰值时，则需要调整工艺刻蚀时间，而现有的手动操作终检功能和光谱仪(Optical Emission Spectrometry，OES)抓取终点的功能已无法满足需求。
由于现有的OES抓取终点的光谱曲线存在延迟，并且晶片包括多层材料，对于刻蚀的准确性要求较高，用户会在刻蚀过程中通过观察实际晶片的刻蚀效果来确保不会过刻。因此需要开发一种可供用户修改期望刻蚀工艺时间的控制方案来延时执行手动终点检测，以满足一些刻蚀机台对于晶片形貌效果的准确性要求。
本发明实施例的核心构思之一在于，提供一种工艺步骤终点检测方法，可以使用户根据观察到的工艺情况，在上位机灵活更改期望工艺时间，下位机可以根据更改期望工艺时间计算延时终检时间，并触发监测器计时监测工艺步骤的延时终检时间，并在计时时间达到延时终检时间时，自动执行跳步功能。
本发明实施例以刻蚀工艺步骤为例进行说明，但本发明并不仅限于此，例如，可以是通入工艺气体和腔室控压工艺步骤、加载射频功率启辉工艺步骤、解吸附晶片工艺步骤、吹气工艺步骤(用于给晶片吹入背氦气体用于检测晶片是否粘片)，沉积工艺步骤等等，本发明可以支持在每个工艺步骤都能够预判期望工艺执行时间，本发明实施例在此不做限制。
参照图1，示出了本发明实施例提供的一种工艺步骤终点检测方法的步骤流程图，方法具体可以包括如下步骤：
步骤101，在执行工艺步骤的过程中，获取针对工艺步骤的已执行工艺时间和期望工艺时间。
作为一种示例，如图2所示，为本发明实施例提供的一种预判期望工艺 时间实现延时终检方案示意图，由采集模块、监控模块、上位机、下位机共同作用来实现延时终检跳步。在刻蚀工艺步骤的过程中，采集模块可以通过终点检测器软件实时采集晶片刻蚀的光谱曲线，监控模块可以通过工艺腔室中的摄像头实时监控拍摄晶片刻蚀形貌图像，用户可以根据观测到的晶片的光谱曲线晶片刻蚀形貌图像，预判当前工艺步骤的执行时间。上位机可以提供能够设置期望工艺时间的操作按钮给用户，用户可以在上位机界面输入当前工艺步骤期望工艺时间。上位机可以根据用户输入的期望工艺时间，设置期望工艺时间并传递给下位机。
作为一种示例，上位机可以将期望工艺时间参数通过TCP/IP网口通讯方式传输到下位机。
在本发明实施例中，可以在下位机软件增加一个用于预判工艺步骤期望执行时间的功能类(类名可以定义为EndStepDelayTimeSetter)，将设置用户期望工艺时间的服务(call_SetExpectStepTime)封装在这个类里面，然后可以定义多个可读写的指针类型成员变量，用于获取工艺步骤中的一些关键时间参数。指针类型是软件编程中常常用到的数据类型，通过定义指针类型成员变量可以在代码控制流程中实时获取到当前工艺步骤执行的相关时间参数值。例如，配方设置时间参数(m_pSetStepTime)，设置的所有工艺步骤的总时间；已执行工艺时间参数(m_pElapsedStepTime)，当前工艺步骤已经执行的时间；延时终检时间参数(m_pManualDelayTime)，当前工艺步骤需要延时执行终检的时间；期望工艺时间参数(m_pExpectStepTime)，用户经过预判后设置的期望工艺步骤执行时间。
作为一种示例，可以在上位机的软件界面增加服务调用的接口及按钮，用于在上位机软件界面设置期望工艺时间。
在本发明的一种实施例中，在执行工艺步骤的过程中，基于监测的光谱曲线和晶片的刻蚀效果，判断工艺步骤是否需要缩短工艺时间；当工艺步骤 需要缩短工艺时间时，设置期望工艺时间。
作为一种示例，可以预先设置一个较长的期望步骤时间并实时监测晶片刻蚀的光谱曲线和实时监控拍摄晶片刻蚀形貌图像，根据实时监测晶片刻蚀的光谱曲线和实时监控拍摄晶片刻蚀形貌图像，确定当前工艺步骤的刻蚀速率，若刻蚀速率较快，则需提前结束当前工艺步骤的执行，可以再次修改期望工艺时间。
在本发明的一种实施例中，当工艺步骤开始时，启动第二计时监测器，第二计时监测器用于对工艺步骤进行计时，并监测工艺步骤的异常工艺状态、工艺执行延迟时间、异常状态持续时间；当工艺步骤结束时，关闭第二计时监测器。
作为一种示例，可以通过第二计时监测器实现工艺步骤的计时监控，第二计时监测器可以以工艺步骤为单位进行启停。当工艺步骤开始时，触发第二计时监测器打开，当该工艺步骤结束时，触发第二计时监测器关闭。
作为一种示例，在工艺步骤开始时，第二计时监测器可以启动监测检查项以监测工艺步骤过程中的异常工艺状态、工艺执行延迟时间、异常状态持续时间。例如，若工艺步骤过程中的气体流量超出预设范围，则异常工艺状态条件被触发，同时监测该气体流量异常的持续时间。例如，工艺步骤开始时，相应的软件已打开，由于硬件的响应需要一定的时间，不能及时开始执行工艺存在一定的延迟，需要监测工艺步骤开始后延迟多长时间。
步骤102，根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间。
作为一种示例，如图2所示，为本发明实施例提供的一种预判期望工艺时间实现延时终检方案示意图，下位机可以根据获取的期望工艺时间和已执行工艺时间，进行延时终检时间计算，得到设置期望工艺时间后的当前剩余刻蚀时间。
在本发明的一种实施例中，根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间，包括：将期望工艺时间减去已执行工艺时间，得到延时终检时间。
在本发明的一种实施例中，获取完成多个工艺步骤的配方设置时间；根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间，包括：判断期望工艺时间是否小于或等于配方设置时间且大于或等于已执行工艺时间；当期望工艺时间小于或等于配方设置时间且大于或等于已执行工艺时间时，根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间。
作为一种示例，晶片在工艺过程中可以包括多个工艺步骤，用户可以预先在上位机的配方编辑界面输入完成多个工艺步骤的配方设置时间。
在本发明实施例中，可以根据获取的期望工艺时间，判断期望工艺时间是否满足预设条件，若期望工艺时间满足预设条件，则说明用户设置的期望工艺时间合理。
在满足预设条件的情况下，根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间。
示例性地，当下位机获取到用户设置的期望工艺时间时，可以判断用户设置的期望工艺时间是否小于或等于配方设置时间且大于或等于已执行工艺时间，在期望工艺时间是否小于或等于配方设置时间且大于或等于已执行工艺时间的情况下，可以根据期望工艺时间和已执行工艺时间，计算需要延时执行手动终检工艺时间。
在本发明的一种实施例中，若期望工艺时间小于已执行工艺时间，则发出报警，以提醒期望工艺时间不合理。
例如，刻蚀工艺步骤的工艺时间为100秒，已执行工艺时间为50秒，此时用户设置了刻蚀工艺步骤的期望工艺时间为20秒，因此，该期望工艺时间的设置不合理，可以发出报警，以提醒用户期望工艺时间的设置不合理。
在本发明的一种实施例中，若期望工艺时间大于配方设置时间，则发出报警，以提醒期望工艺时间不合理。
例如，用户预先在配方编辑界面设置的配方设置时间为200秒，在进行刻蚀工艺步骤的过程中，用户设置期望工艺时间为300秒，则刻蚀设备无法完成所有的工艺步骤，因此，该期望工艺时间的设置不合理，可以发出报警，以提醒用户期望工艺时间的设置不合理。
作为一种示例，下位机可以在执行设置用户期望工艺时间(call_SetExpectStepTime)服务前，针对上位机传递的期望工艺时间参数进行检查，检查条件如下：
a.当工艺步骤中的期望工艺时间小于已执行工艺的时间，下位机控制软件抛出报警提示参数不合理。
b.当工艺步骤中的期望工艺时间大于预先设置的配方设置时间，下位机控制软件抛出报警提示参数不合理。
步骤103，触发第一计时监测器启动计时监测，并在第一计时监测器的计时时间达到延时终检时间时，触发针对工艺步骤的跳步处理。
示例性地，当计算出延时终检时间时，可以启动第一计时监测器，第一计时监测器开始进行计时，直至第一计时监测器的计时时间达到延时终检时间时，下位机控制软件可以下发中止当前工艺步骤的命令，结束当前工艺步骤的执行，并立即跳到下一个工艺步骤。
需要说明的是，上位机获取到针对工艺步骤的已执行工艺时间和期望工艺时间，同时传输到下位机，然后下位机根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间，这些动作可以通过软件代码瞬间执行，耗时时间属于计算机的内存处理器速度，可忽略不计。因此，上述步骤103中，触发第一计时监测器启动计时监测的触发时间点可以视为是上位机获取到针对工艺步骤的已执行工艺时间和期望工艺时间的时间点，例如是用户在 上位机界面输入期望工艺时间的动作时间点。
作为一种示例，延时终检的计时监控(即，在正常的工艺执行过程中，是否接收到用户输入的期望步骤时间的动作，以触发第一计时监测器启动计时监测)可以在工艺步骤开始时进行监控，不需要设置延迟监测时间，能够满足在工艺步骤中的任一时刻进行工艺时间的预判和期望步骤时间的设置，即，延时终检的计时监控的生命周期包含了工艺步骤从开始到结束的整个过程，确保在工艺执行的任何一个时间点都能够进行延时终检的计时监控，因此不需要设置延迟监测时间。在用户设置期望工艺时间后，随即触发了延时终检的监控条件，第一计时监测器启动，按照计算的延时终检时间正常执行工艺步骤，并在执行完延时终检时间的工艺后，跳出当前工艺步骤。
本发明实施例的计时监测方案可以支持多次设置期望工艺时间，具备较高的灵活性。例如，用户在设置了第一次期望步骤时间并在达到对应的延时终检时间之前，发现晶片的刻蚀效果不佳必须增加补刻时间，则可以在软件界面重新设置新的期望工艺时间，这样第一计时监测器可以按照新的期望工艺时间和已执行工艺时间进行计算，得出新的延时终检时间，并在第一计时监测器的计时时间达到新的延时终检时间时，执行终检跳步。
在本发明的一种实施例中，在下位机启动后，加载预设代码模块；预设代码模块包括终检模块和计时监控模块；计时监控模块用于触发第一计时监测器启动计时监测；在加载计时监控模块之前，将未动态生成的终检模块的逻辑通道赋值为指示预设路径的字符串变量，以使计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载；当加载预设代码模块完成后，根据预设字符串变量生成终检模块的逻辑通道，以通过终检模块的逻辑通道执行发送跳出工艺步骤的指令。
作为一种示例，本发明的第一计时监测器的计时监控部分，可以是通过配置文件来实现。下位机软件启动是不同的代码模块按照一定的顺序和步骤 来完成的，在下位机启动后，可以依次加载预设代码模块。预设代码模块可以包括终检模块和计时监控模块，计时监控模块生成顺序在终检模块(ManualEndStep)之前。当计时监控模块生成时，需要使用终检模块(ManualEndStep)的逻辑通道资源，此时下位机还没有动态创建出的ManualEndStep的逻辑通道，下位机软件启动失败。
作为一种示例，可以在加载计时监控模块之前，将未动态生成的终检模块的逻辑通道赋值为指示预设路径的字符串变量。例如，设计ManualEndStepAcutator类(终检执行器类)用于给未动态生成的逻辑通道ManualEndStep设值，定义SetManualEndStepActuatorCh(设置终检执行器通道)方法，可以通过SetManualEndStepActuatorCh函数将未动态生成的ManualEndStep的逻辑通道赋值为指示预设路径的字符串变量，使计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载，这样下位机起机时不会去访问未动态生成的ManualEndStep的逻辑通道，避免了由于访问未动态生成的逻辑通道失败引发软件启动失败的问题。
由于ManualEndStep的逻辑通道是本方案执行延时终检跳步的执行器通道，是必须要创建的，所以可以在软件启动之后通过访问该字符串变量，将ManualEndStep逻辑通道创建的时机推迟到下位机软件启动流程的最后面，从而避免软件各代码模块启动顺序不同造成的逻辑混乱问题。
作为一种示例，当预设代码模块加载完成后，可以根据预设字符串变量生成终检模块的逻辑通道，以通过终检模块的逻辑通道执行发送跳出工艺步骤的指令。
在本发明的一种实施例中，在根据期望工艺时间和已执行工艺时间，计算当前工艺步骤的延时终检时间之后，且在触发第一计时监测器启动计时监测之前，还包括：根据延时终检时间，将第一计时监测器的起始时间归零处理。
示例性地，可以在下位机计算出延时终检时间之后，将第一计时监测器的起始时间归零，以确保每次设置新的期望步骤时间都能够保证第一计时监测器的计时准确性。
例如，用户执行一个时间为200秒的刻蚀工艺步骤，当刻蚀工艺步骤运行到15秒时，用户在上位机的软件界面设定该刻蚀工艺步骤的期望工艺时间为20秒，此时，下位机控制软件会立即将第一计时监测器的起始时间归零，第一计时监测器会从0开始计时剩余的5秒，当5秒时间计时到达的时候，下位机控制软件可以下发跳出当前步骤的命令来实现延时终检跳步。若用户将设定的期望工艺时间20秒再次修改为40秒，则下位机控制软件会再次将第一计时监测器的起始时间归零，然后第一计时监测器重新计时剩余的刻蚀工艺时间，从而保证每一次延时终检跳步的计时准确性。
作为一种示例，如图3所示，为本发明实施例提供的一种可预判工艺步骤执行时间方案的流程图。
S301，开始。
S302，用户编辑工艺配方，选择包含光谱收集参数的EPD配置文件和终点模式，然后执行工艺。
作为一种示例，用户可以预先在EPD终点检测软件里编辑EPD配置文件，例如根据实际晶片的刻蚀材料选择需采集的元素谱线和波长范围，并设置滤波方法和终点判断方法；在刻蚀机配方编辑界面选择编辑好的EPD配置文件和终点检测模式，然后下发工艺任务，按照配方设置执行工艺。
S303，下位机软件开始采集工艺数据，第二计时监测器启动。
作为一种示例，下位机可以根据工艺配方开始执行工艺，并控制第二监测计时器打开。其中，第二监测计时器可以包括监控器和计时器。
S304，收集光谱数据以及实时监控拍摄晶片刻蚀形貌图像。
作为一种示例，终点检测器可以根据EPD配置文件的配置参数，开始 采集光谱数据；同时，刻蚀机工艺腔室中的摄像头开始实时监控拍摄晶片刻蚀形貌图像。
S305，用户预判剩余刻蚀时间，设置期望工艺时间。
作为一种示例，当工艺步骤执行的某一时刻监控到EPD软件的光谱曲线发生某些变化(例如出现某个刻蚀曲线峰值)时，用户结合观测到的光谱曲线和晶片刻蚀形貌图像预判当前工艺步骤达到目标刻蚀效果的期望工艺时间，并通过上位机界面上的操作按钮设置期望工艺时间。
例如，用户可以先设置一个较长的期望步骤时间并持续跟踪观察曲线和拍照效果，若刻蚀速率较快需提前结束当前步骤执行，则用户可以再次修改期望步骤时间。
S306，判断期望工艺时间是否大于或等于已执行工艺时间且小于或等于配方设置时间。
作为一种示例，下位机接收到上位机发送的期望工艺时间时，可以对期望工艺时间进行参数合法性检查。
S307，若期望工艺时间小于已执行工艺时间或大于配方设置时间，则抛出报警，提示用户期望工艺时间设置不合理。
S308，若期望工艺时间大于或等于已执行工艺时间且小于或等于配方设置时间，计算剩余刻蚀时间。
S309，将期望工艺时间归零。
作为一种示例，若设置的期望工艺时间满足合法性检查，则可以由下位机软件计算出剩余刻蚀时间，并将监控期望步骤时间事件的触发时间归零，以确保每次设置新的期望工艺时间都能够保证第一计时监测器的计时准确性。
S310，启动第一计时监测器进行计时监控。
作为一种示例，当计算出剩余刻蚀时间时，下位机启动延时时间的计时 器监控机制，并进行剩余刻蚀时间的准确计时。
S311，当执行完计算出的剩余时间，下位机下发中止工艺步骤的命令。
作为一种示例，当计时时间到达延时终检时间时，下位机通过执行延时终检的执行器，下发跳出当前步骤的命令，结束当前工艺步骤的执行并立即跳到下一个工艺步骤执行，以确保工艺步骤实际执行时间满足用户设定的期望步骤时间，达到用户预判步骤时间和延时执行终检的目的。
其中，下一个工艺步骤可以沉积步，也可以是使用另一个工艺气体和启辉功率来进行新的刻蚀，也可以是解除晶片吸附等等。本领域技术人员可以根据实际的工艺需求确定下一工艺步骤，本发明实施例在此不作限制。
S312，第二计时监控器停止计时监控，并更新工艺步骤实际时间。
S313，结束。
在本发明实施例中，在执行工艺步骤的过程中，获取针对工艺步骤的已执行工艺时间和期望工艺时间；根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间；根据延时终检时间，触发第一计时监测器启动计时监测，并在第一计时监测器的计时时间达到延时终检时间时，触发针对工艺步骤的跳步处理，从而可以根据用户设置的期望工艺时间，实现工艺步骤终点时间的灵活变动，确保工艺步骤实际执行时间满足用户期望工艺时间；本发明可以使用户在软件操作界面灵活设置期望工艺时间，同时，当计时监测器的计时时间达到终点延迟时间时，可以自动执行跳步功能，无需人工触发手动终检的按钮，更加自动化。
需要说明的是，对于方法实施例，为了简单描述，故将其都表述为一系列的动作组合，但是本领域技术人员应该知悉，本发明实施例并不受所描述的动作顺序的限制，因为依据本发明实施例，某些步骤可以采用其他顺序或者同时进行。其次，本领域技术人员也应该知悉，说明书中所描述的实施例均属于优选实施例，所涉及的动作并不一定是本发明实施例所必须的。
参照图4，示出了本发明实施例提供的一种半导体工艺设备的结构框图，半导体工艺设备401可以包括：
控制器4011，用于在执行工艺步骤的过程中，获取针对工艺步骤的已执行工艺时间和期望工艺时间；根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间；触发第一计时监测器启动计时监测，并在第一计时监测器的计时时间达到延时终检时间时，触发针对工艺步骤的跳步处理。
在一种可选的实施例中，控制器，还用于获取完成多个工艺步骤的配方设置时间；判断期望工艺时间是否小于或等于配方设置时间且大于或等于已执行工艺时间；当期望工艺时间小于或等于配方设置时间且大于或等于已执行工艺时间时，根据期望工艺时间和已执行工艺时间，计算工艺步骤的延时终检时间。
在一种可选的实施例中，控制器，还用于若期望工艺时间小于已执行工艺时间，则发出报警，以提醒期望工艺时间不合理。
在一种可选的实施例中，控制器，还用于若期望工艺时间大于配方设置时间，则发出报警，以提醒期望工艺时间不合理。
在一种可选的实施例中，控制器，用于将期望工艺时间减去已执行工艺时间，得到延时终检时间。
在一种可选的实施例中，在根据期望工艺时间和已执行工艺时间，计算当前工艺步骤的延时终检时间之后，且在触发第一计时监测器启动计时监测之前，控制器，还用于根据延时终检时间，将期望工艺时间归零处理。
在一种可选的实施例中，控制器，还用于当工艺步骤开始时，启动第二计时监测器，第二计时监测器用于对工艺步骤进行计时，并监测工艺步骤的异常工艺状态、工艺执行延迟时间、异常状态持续时间；当工艺步骤结束时，关闭第二计时监测器。
在一种可选的实施例中，控制器，还用于在执行工艺步骤的过程中，基 于监测的光谱曲线和晶片的刻蚀效果，判断工艺步骤是否需要缩短工艺时间；当工艺步骤需要缩短工艺时间时，设置期望工艺时间。
在一种可选的实施例中，应用于下位机，控制器，还用于在下位机启动后，依次加载预设代码模块；预设代码模块包括终检模块和计时监控模块；计时监控模块用于触发第一计时监测器启动计时监测；在加载计时监控模块之前，将未动态生成的终检模块的逻辑通道赋值为指示预设路径的字符串变量，以使计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载；当预设代码模块加载完成后，根据预设字符串变量生成终检模块的逻辑通道，以通过终检模块的逻辑通道执行发送跳出工艺步骤的指令。
对于装置实施例而言，由于其与方法实施例基本相似，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
本领域内的技术人员应明白，本发明实施例的实施例可提供为方法、装置、或计算机程序产品。因此，本发明实施例可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且，本发明实施例可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。
本发明实施例是参照根据本发明实施例的方法、终端设备(系统)、和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理终端设备的处理器以产生 一个机器，使得通过计算机或其他可编程数据处理终端设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理终端设备以特定方式工作的计算机可读存储器中，使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品，该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理终端设备上，使得在计算机或其他可编程终端设备上执行一系列操作步骤以产生计算机实现的处理，从而在计算机或其他可编程终端设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
尽管已描述了本发明实施例的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上对本发明所提供的一种工艺步骤终点检测方法和一种半导体工艺设备，进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (10)

  1. 一种工艺步骤终点检测方法，其特征在于，包括：
    在执行工艺步骤的过程中，获取针对所述工艺步骤的已执行工艺时间和期望工艺时间；
    根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间；
    触发第一计时监测器启动计时监测，并在所述第一计时监测器的计时时间达到所述延时终检时间时，触发针对所述工艺步骤的跳步处理。
  2. 根据权利要求1所述的方法，其特征在于，所述方法还包括：
    获取完成多个所述工艺步骤的配方设置时间；
    所述根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间，包括：
    判断所述期望工艺时间是否小于或等于所述配方设置时间且大于或等于所述已执行工艺时间；
    当所述期望工艺时间小于或等于所述配方设置时间且大于或等于所述已执行工艺时间时，根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间。
  3. 根据权利要求2所述的方法，其特征在于，还包括：
    若所述期望工艺时间小于所述已执行工艺时间，则发出报警，以提醒所述期望工艺时间不合理。
  4. 根据权利要求2所述的方法，其特征在于，还包括：
    若所述期望工艺时间大于所述配方设置时间，则发出报警，以提醒所述期望工艺时间不合理。
  5. 根据权利要求1所述的方法，其特征在于，所述根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间，包括：
    将所述期望工艺时间减去所述已执行工艺时间，得到所述延时终检时间。
  6. 根据权利要求1所述的方法，其特征在于，在所述根据所述期望工艺时间和所述已执行工艺时间，计算当前工艺步骤的延时终检时间之后，且在所述触发第一计时监测器启动计时监测之前，还包括：
    将所述第一计时监测器的起始时间归零处理。
  7. 根据权利要求1所述的方法，其特征在于，还包括：
    当所述工艺步骤开始时，启动第二计时监测器，所述第二计时监测器用于对所述工艺步骤进行计时，并监测所述工艺步骤的异常工艺状态、工艺执行延迟时间、异常状态持续时间；
    当所述工艺步骤结束时，关闭所述第二计时监测器。
  8. 根据权利要求1所述的方法，其特征在于，还包括：
    在执行工艺步骤的过程中，基于监测的光谱曲线和晶片的刻蚀效果，判断所述工艺步骤是否需要缩短工艺时间；
    当所述工艺步骤需要缩短工艺时间时，设置所述期望工艺时间。
  9. 根据权利要求1所述的方法，其特征在于，应用于下位机，所述方法还包括：
    在所述下位机启动后，加载预设代码模块；所述预设代码模块包括终检模块和计时监控模块；所述计时监控模块用于触发第一计时监测器启动计时监测；
    在加载所述计时监控模块之前，将未动态生成的所述终检模块的逻辑通道赋值为指示预设路径的字符串变量，以使所述计时监控模块基于赋值为预设字符串变量的逻辑通道进行加载；
    当加载所述预设代码模块完成后，根据所述预设字符串变量生成所述终检模块的逻辑通道，以通过所述终检模块的逻辑通道执行发送跳出所述工艺步骤的指令。
  10. 一种半导体工艺设备，其特征在于，所述半导体工艺设备包括：
    控制器，用于在执行工艺步骤的过程中，获取针对所述工艺步骤的已执行工艺时间和期望工艺时间；根据所述期望工艺时间和所述已执行工艺时间，计算所述工艺步骤的延时终检时间；触发第一计时监测器启动计时监测，并在所述第一计时监测器的计时时间达到所述延时终检时间时，触发针对所述工艺步骤的跳步处理。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288258A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd エッチング終点判定方法並びにドライエッチング方法及びその装置
KR19980075882A (ko) * 1997-04-02 1998-11-16 윤종용 건식식각설비의 식각량 제어 장치
JP2001068459A (ja) * 1999-08-30 2001-03-16 Gakugei Computer:Kk プラズマエッチング装置用終点検出装置
US20030056899A1 (en) * 2001-09-27 2003-03-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor processing apparatus and manufacturing method of semiconductor device
CN115642102A (zh) * 2022-11-09 2023-01-24 北京北方华创微电子装备有限公司 一种工艺步骤终点检测方法和半导体工艺设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7053994B2 (en) * 2003-10-28 2006-05-30 Lam Research Corporation Method and apparatus for etch endpoint detection
CN102142384B (zh) * 2010-12-02 2013-01-09 深圳市华星光电技术有限公司 金属蚀刻终点侦测方法及金属蚀刻终点侦测机
CN102347197B (zh) * 2011-10-31 2014-03-05 中微半导体设备(上海)有限公司 刻蚀终点动态检测方法
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288258A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd エッチング終点判定方法並びにドライエッチング方法及びその装置
KR19980075882A (ko) * 1997-04-02 1998-11-16 윤종용 건식식각설비의 식각량 제어 장치
JP2001068459A (ja) * 1999-08-30 2001-03-16 Gakugei Computer:Kk プラズマエッチング装置用終点検出装置
US20030056899A1 (en) * 2001-09-27 2003-03-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor processing apparatus and manufacturing method of semiconductor device
CN115642102A (zh) * 2022-11-09 2023-01-24 北京北方华创微电子装备有限公司 一种工艺步骤终点检测方法和半导体工艺设备

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