WO2024095997A1 - Dispositif de polissage, procédé de traitement d'informations et programme - Google Patents

Dispositif de polissage, procédé de traitement d'informations et programme Download PDF

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Publication number
WO2024095997A1
WO2024095997A1 PCT/JP2023/039209 JP2023039209W WO2024095997A1 WO 2024095997 A1 WO2024095997 A1 WO 2024095997A1 JP 2023039209 W JP2023039209 W JP 2023039209W WO 2024095997 A1 WO2024095997 A1 WO 2024095997A1
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WIPO (PCT)
Prior art keywords
polishing
polishing pad
dresser
sensor
pad
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PCT/JP2023/039209
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English (en)
Japanese (ja)
Inventor
佑多 鈴木
太郎 高橋
裕史 大滝
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株式会社荏原製作所
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Publication of WO2024095997A1 publication Critical patent/WO2024095997A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a polishing device, an information processing device, and a program.
  • polishing surface of the polishing pad is reconditioned.
  • polishing pad gradually wears out.
  • polishing abnormalities can occur. For example, this can cause a decrease in the polishing rate of the polishing pad, an uneven polishing profile (polishing uniformity), and anomalies that can cause wafer cracks or scratches, as well as affect the detection rate of the polishing endpoint.
  • the polishing pad is replaced based on the accumulated usage time of the polishing pad, but there is a possibility that the pad may be replaced even when there is no polishing abnormality as described above (when the pad is usable), which may be undesirable from a cost perspective.
  • polishing abnormalities include abnormalities in the polishing rate, abnormalities in the polishing profile, an increase in the rate of abnormalities, and a deterioration in the detection rate of the polishing endpoint.
  • the present invention was made in consideration of the above problems, and aims to provide a polishing device, information processing device, and program that make it possible to predict polishing abnormalities in advance.
  • the polishing apparatus comprises a polishing table that supports a polishing pad, a polishing head that can press a substrate against the polishing surface of the polishing pad, and a processor that estimates the polishing index of the polishing apparatus by inputting state reflection information that reflects the state of the polishing pad of the polishing apparatus into a machine learning model that has been trained by machine learning to determine the correlation between state reflection information that reflects the state of other polishing pads and the polishing index of the other polishing pads.
  • the user of the polishing device can understand the polishing index, making it possible to predict polishing abnormalities in advance.
  • the polishing apparatus is the polishing apparatus according to the first aspect, further comprising a dresser for dressing the polishing surface of the polishing pad, and the state reflection information is a characteristic quantity related to the frictional force between the dresser and the polishing pad.
  • the accuracy of predicting polishing abnormalities can be improved by inputting features related to the frictional force between the dresser and the polishing pad into a machine learning model.
  • the polishing apparatus is the polishing apparatus according to the second aspect, further comprising a sensor that detects a physical quantity reflecting the frictional force between the dresser and the polishing pad, and the feature quantity related to the frictional force between the dresser and the polishing pad is a feature quantity of a sensor value measured by the sensor, and when estimating the polishing index, the processor determines the feature quantity of the sensor value measured by the sensor and inputs the feature quantity into the machine learning model as the state reflection information, thereby estimating the polishing index.
  • the feature quantities of the sensor values can be input into a machine learning model, improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus according to the fourth aspect of the present invention is the polishing apparatus according to the third aspect, and the sensor value is the sensor value when the dresser is dressing.
  • the user of the polishing device can understand the polishing index, making it possible to predict polishing abnormalities in advance and improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus according to the fifth aspect of the present invention is the polishing apparatus according to the fourth aspect, in which the sensor is provided on the dresser.
  • the polishing apparatus is the polishing apparatus according to the third aspect, and the sensor is an AE sensor that detects sound during dressing, an ultrasonic microphone that detects sound during dressing, an acceleration sensor that detects acceleration in the swing direction of the dresser, a strain sensor that detects distortion of the dresser arm, a force sensor that detects deflection of the dresser arm, or a roughness sensor that detects roughness of the polishing pad.
  • the sensor is an AE sensor that detects sound during dressing, an ultrasonic microphone that detects sound during dressing, an acceleration sensor that detects acceleration in the swing direction of the dresser, a strain sensor that detects distortion of the dresser arm, a force sensor that detects deflection of the dresser arm, or a roughness sensor that detects roughness of the polishing pad.
  • the polishing apparatus is the polishing apparatus according to the second aspect, wherein the dresser has a third motor that rotates the contact surface of the dresser with respect to the polishing pad and a fourth motor that moves the contact surface relatively in a direction along the surface of the polishing pad, and the characteristic quantity related to the frictional force between the dresser and the polishing pad includes at least one of the current value of the third motor, the torque command value of the third motor, the current value of the fourth motor, the torque command value of the fourth motor, and statistics thereof.
  • the current value of the third motor, the torque command value of the third motor, the current value of the fourth motor, the torque command value of the fourth motor, and at least one of these statistics are input into the machine learning model, thereby improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is the polishing apparatus according to the first aspect, in which the status reflection information is polishing pad status information indicating the status of the polishing pad.
  • polishing pad condition information is input into the machine learning model, improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is the polishing apparatus according to the eighth aspect, in which the polishing pad status information includes at least one of the amount of wear of the polishing pad, the temperature of the polishing pad during polishing or a statistical amount of time series data of the temperature, and the thickness of the polishing pad.
  • At least one of the polishing pad condition information, the amount of wear on the polishing pad, the temperature of the polishing pad during polishing or the statistics of the time series data of that temperature, and the thickness of the polishing pad is input into the machine learning model, improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is the polishing apparatus according to the first aspect, and is equipped with a table rotation motor that rotates the polishing table, and a control device that controls the polishing table to rotate at a constant speed, and the state reflection information includes at least one of the current value of the table rotation motor, the torque command value of the table rotation motor, and the statistics thereof.
  • the current value of the table rotation motor or the torque command value of the table rotation motor is input into the machine learning model, improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is the polishing apparatus according to the first aspect, and includes a polishing head having a polishing head shaft for rotating the substrate and a polishing head swinging arm for moving the substrate relative to the polishing pad in a direction along the surface of the polishing pad, a polishing head for pressing the substrate against the polishing pad, a first motor for rotating the polishing head shaft, and a second motor for swinging the polishing head swinging arm, and the state reflection information includes at least one of the current value of the first motor for rotating the polishing head shaft, the torque command value of the first motor for rotating the polishing head shaft, the current value of the second motor for swinging the polishing head swinging arm, the torque command value of the second motor for swinging the polishing head swinging arm, and these statistics.
  • the current value of the first motor, the torque command value of the first motor, the current value of the second motor, the torque command value of the second motor, and at least one of these statistics are input into the machine learning model, thereby improving the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is the polishing apparatus according to the first aspect, further comprising a dresser for dressing the polishing surface of the polishing pad, and a sensor for detecting a physical quantity reflecting the frictional force between the dresser and the substrate, and the status reflection information further includes operation log information indicating the operation history of the polishing apparatus, and the operation log information includes at least one of the usage time of the polishing pad, the usage time of the dresser, the detection time of the polishing end point of the substrate, the number of the substrates processed, and the operation time of the sensor.
  • This configuration can improve the accuracy of predicting polishing abnormalities.
  • the polishing device according to the thirteenth aspect of the present invention is the polishing device according to the first aspect, and the status reflection information further includes the number of errors detected by the polishing device.
  • This configuration can improve the accuracy of predicting polishing abnormalities.
  • the polishing apparatus is a polishing apparatus according to any one of the first to thirteenth aspects, wherein the polishing index includes at least one of the polishing rate or statistics of the polishing rate, the polishing profile of the substrate after polishing or statistics of the polishing profile, the incidence rate of polishing abnormalities or statistics of the incidence rate, and the detection rate of the polishing end point of the substrate or statistics of the detection rate, and the polishing abnormalities include polishing rate abnormalities, film thickness distribution abnormalities, substrate cracks, or scratches.
  • This configuration can improve the accuracy of predicting polishing abnormalities.
  • the information processing device includes a processor that estimates the polishing index of a target polishing device by inputting state reflection information that reflects the state of the polishing pad of the target polishing device into a machine learning model that has been trained by machine learning to learn the correlation between state reflection information that reflects the state of another polishing pad and the polishing index of the other polishing pad.
  • the user of the polishing device can understand the polishing index, making it possible to predict polishing abnormalities in advance.
  • the program according to the sixteenth aspect of the present invention is a program for causing a computer to execute a procedure for estimating the polishing index of a target polishing apparatus by inputting state reflection information reflecting the state of a polishing pad of the target polishing apparatus into a machine learning model that has been trained by machine learning to learn the correlation between state reflection information reflecting the state of another polishing pad and the polishing index of the other polishing pad.
  • the user of the polishing device can understand the polishing index, making it possible to predict polishing abnormalities in advance.
  • FIG. 1 is a schematic perspective view showing an embodiment of a polishing apparatus.
  • FIG. 1 is a schematic diagram for explaining a machine learning model.
  • FIG. 1 is a schematic diagram for explaining a machine learning model.
  • FIG. 1 is a schematic perspective view showing one embodiment of a polishing apparatus.
  • the polishing apparatus 1 is an apparatus for chemically and mechanically polishing a workpiece W.
  • the workpiece W is a substrate such as a wafer or a panel.
  • the polishing apparatus 1 is equipped with a polishing table 5 supporting a polishing pad 2 having a polishing surface 2a, a polishing head 7 for pressing the workpiece W against the polishing surface 2a, a polishing liquid supply nozzle 8 for supplying a polishing liquid (e.g., a slurry containing abrasive grains) to the polishing surface 2a, and a control device 10 for controlling the operation of the polishing apparatus 1.
  • the polishing head 7 is configured so as to be able to hold the workpiece W on its underside.
  • the workpiece W has a film to be polished.
  • the control device 10 is composed of at least one computer.
  • the control device 10 includes a storage device 10a in which a program is stored, and an arithmetic device 10b that executes calculations according to instructions included in the program.
  • the storage device 10a includes a main storage device such as a RAM, and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD).
  • Examples of the arithmetic device 10b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).
  • the specific configuration of the control device 10 is not limited to these examples.
  • the polishing apparatus 1 further comprises a base 12, a support shaft 14 provided on the base 12, a polishing head swing arm 16 connected to the upper end of the support shaft 14, and a polishing head shaft 18 rotatably supported on the free end of the polishing head swing arm 16.
  • the polishing head 7 is fixed to the lower end of a polishing head shaft 18.
  • a polishing head rotating mechanism (not shown) including a first motor 161 and the like is disposed inside the polishing head swing arm 16. This polishing head rotating mechanism is connected to the polishing head shaft 18, and is configured to rotate the polishing head shaft 18 and the polishing head 7 in the direction indicated by the arrow.
  • a second motor 162 is provided on the base 12 to swing the support shaft 14 and swing the polishing head swing arm 16.
  • the second motor is, for example, a servo motor.
  • the polishing head shaft 18 is connected to a polishing head lifting mechanism (including a ball screw mechanism, etc.) not shown.
  • This polishing head lifting mechanism is configured to move the polishing head shaft 18 up and down relative to the polishing head swing arm 16.
  • the up and down movement of the polishing head shaft 18 allows the polishing head 7 to move up and down relative to the polishing head swing arm 16 and the polishing table 5, as shown by the arrows.
  • the polishing apparatus 1 further includes a table rotation motor 21 that rotates the polishing pad 2 and the polishing table 5 around their respective axes.
  • the table rotation motor 21 is disposed below the polishing table 5, and the polishing table 5 is connected to the table rotation motor 21 via a table shaft 5a.
  • the polishing table 5 and the polishing pad 2 are rotated by the table rotation motor 21 around the table shaft 5a in the direction indicated by the arrow.
  • the polishing pad 2 is affixed to the upper surface of the polishing table 5.
  • the exposed surface of the polishing pad 2 constitutes a polishing surface 2a for polishing a workpiece W such as a wafer.
  • the workpiece W is polished as follows.
  • the workpiece W is held by the polishing head 7 with its surface to be polished facing downward. While the polishing head 7 and the polishing table 5 are rotated, a polishing liquid (e.g., a slurry containing abrasive grains) is supplied onto the polishing surface 2a of the polishing pad 2 from a polishing liquid supply nozzle 8 provided above the polishing table 5.
  • the polishing pad 2 rotates integrally with the polishing table 5 around its central axis.
  • the polishing head 7 is moved to a predetermined height by a polishing head lifting mechanism (not shown). Furthermore, while the polishing head 7 is maintained at the above-mentioned predetermined height, it presses the workpiece W against the polishing surface 2a of the polishing pad 2.
  • the workpiece W rotates integrally with the polishing head 7. With the polishing liquid present on the polishing surface 2a of the polishing pad 2, the workpiece W is brought into sliding contact with the polishing surface 2a.
  • the surface of the workpiece W is polished by a combination of the chemical action of the polishing liquid and the mechanical action of the abrasive grains contained in the polishing liquid and the polishing pad 2.
  • the polishing apparatus 1 is equipped with a dresser 40 that dresses the polishing surface 2a of the polishing pad 2.
  • the dresser 40 is equipped with a dressing disk 50 that is in sliding contact with the polishing surface 2a of the polishing pad 2, a dresser shaft 51 to which the dressing disk 50 is connected, a dresser swing arm 55 that rotatably supports the dresser shaft 51, a support shaft 58 that supports the dresser swing arm 55, and a base 59 that supports the support shaft 58.
  • the lower surface of the dressing disk 50 constitutes the dressing surface 50a, and this dressing surface 50a is composed of abrasive grains (e.g., diamond particles).
  • the dresser shaft 51 is connected to a disk pressing mechanism (including, for example, an air cylinder) (not shown) disposed in the dresser swing arm 55.
  • This disk pressing mechanism is configured to press the dressing surface 50a of the dressing disk 50 against the polishing surface 2a of the polishing pad 2 via the dresser shaft 51.
  • the dresser shaft 51 is connected to a disk rotation mechanism including a third motor 71 (not shown) disposed in the dresser swing arm 55.
  • the third motor 71 is configured to rotate the dressing disk 50 in the direction indicated by the arrow via the dresser shaft 51. In this manner, the third motor 71 rotates the contact surface of the dresser with respect to the polishing pad.
  • a fourth motor 72 is provided on the base 59, which swings the support shaft 58 to swing the dresser swing arm 55.
  • the fourth motor 72 is, for example, a servo motor. In this manner, the fourth motor 72 moves the contact surface relatively in a direction along the surface of the polishing pad.
  • the dressing of the polishing surface 2a of the polishing pad 2 is performed as follows.
  • the polishing pad 2 is rotated together with the polishing table 5 by the table rotation motor 21, while pure water is supplied to the polishing surface 2a from a pure water supply nozzle (not shown).
  • the dressing disk 50 is rotated around the dresser shaft 51 by a disk rotation mechanism (not shown), while the dressing surface 50a of the dressing disk 50 is pressed against the polishing surface 2a by a disk pressing mechanism (not shown). With pure water present on the polishing surface 2a, the dressing disk 50 is brought into sliding contact with the polishing surface 2a.
  • the control device 10 rotates the dresser swing arm 55 around the support shaft 58 to swing the dressing disk 50 in the radial direction of the polishing surface 2a. In this way, the polishing pad 2 is scraped off by the dressing disk 50, and the polishing surface 2a is dressed (regenerated). Dressing of the polishing surface 2a of the polishing pad 2 is performed during or after polishing of the workpiece W.
  • the polishing apparatus 1 includes a sensor 60, which is provided on the dresser as an example, and is fixed to the dresser swing arm 55 (sometimes simply referred to as the arm), for example.
  • the sensor 60 detects a physical quantity reflecting the frictional force between the dresser 40 and the substrate.
  • the sensor 60 may be composed of at least one of an acoustic emission sensor (hereinafter referred to as an AE sensor) that detects sound during dressing, an ultrasonic microphone that detects sound during dressing, an acceleration sensor that detects acceleration in the swing direction of the dresser 40, a strain sensor that detects strain in the dresser swing arm 55 of the dresser 40, a force sensor that detects deflection of the dresser swing arm 55 of the dresser, or a roughness sensor that detects roughness of the polishing pad 2.
  • the sensor 60 may be fixed to the dressing disk 50.
  • the polishing apparatus 1 includes an information processing device 63 electrically connected to the sensor 60.
  • the information processing device 63 can acquire, for example, the time series output of the sensor 60.
  • the information processing device 63 is composed of at least one computer.
  • the information processing device 63 includes a storage device 63a in which a program is stored, a processor 63b that executes calculations according to instructions included in the program, and, for example, a display device 63c.
  • the storage device 63a includes a main storage device such as a RAM, and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD).
  • Examples of the processor 63b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).
  • the specific configuration of the information processing device 63 is not limited to these examples.
  • the information processing device 63 may be configured integrally with the control device 10. In other words, the information processing device 63 and the control device 10 may be configured by at least one computer including a storage device in which a program is stored, and a calculation device that executes calculations according to instructions included in the program.
  • Fig. 2 is a graph showing an example of the relationship between the output value of the AE sensor and time.
  • the vertical axis represents the sensor value of the AE sensor
  • the horizontal axis represents time.
  • the output value of the AE sensor decreases as the amount of wear of the polishing pad increases. From this, since there is a correlation between the amount of wear of the polishing pad and the output value of the AE sensor, it is possible to make a model learn the correlation by machine learning.
  • the output value of the AE sensor is correlated not only with the wear of the polishing pad, but also with the polishing rate, the polishing profile of the substrate after polishing, the occurrence rate of polishing abnormalities, and the detection rate of the polishing end point of the substrate.
  • the polishing abnormalities include polishing rate abnormalities, film thickness distribution abnormalities, cracks in the substrate, and scratches.
  • the output values of the other sensors are correlated not only with the amount of wear of the polishing pad 2 but also with the polishing rate, the polishing profile of the substrate after polishing, the incidence of polishing abnormalities, and the detection rate of the polishing endpoint of the substrate.
  • the low-frequency sound transmitted through the dresser 40 also changes depending on the frictional force of the polishing pad 2, so there is a correlation between the output value of the ultrasonic sensor detected during polishing and the amount of wear of the polishing pad 2, the polishing rate, the polishing profile of the substrate after polishing, the occurrence rate of polishing abnormalities, or the detection rate of the polishing end point of the substrate.
  • the acceleration of the dresser 40 in the swing direction changes depending on the frictional force between the polishing pad 2 and the dressing disk 50
  • the distortion of the dresser swing arm 55 of the dresser 40 when the dresser swings changes, so there is a correlation between the output value of the distortion sensor and the amount of wear on the polishing pad, the polishing rate, the polishing profile of the substrate after polishing, the occurrence rate of polishing abnormalities, or the detection rate of the polishing end point of the substrate.
  • the deflection of the dresser arm changes, so there is a correlation between the output value of the force sensor that detects this deflection and the amount of wear on the polishing pad, the polishing rate, the polishing profile of the substrate after polishing, the occurrence rate of polishing abnormalities, or the detection rate of the substrate polishing end point.
  • Fig. 3 is a schematic diagram for explaining a machine learning model.
  • the machine learning model in Fig. 2 is a model that learns the correlation between state reflection information reflecting the state of other polishing pads and the polishing index of the other polishing pads by machine learning.
  • the machine learning model is a model that is machine-learned using a learning data set in which state reflection information is input (also called explanatory variable) and the polishing index is output (objective variable).
  • This machine learning model may be created for each type of consumable (e.g., polishing pad type, slurry type, dresser type).
  • Processor 63b estimates the polishing index of the polishing device by inputting state reflection information reflecting the state of the polishing pad of the polishing device into a machine learning model that has been trained by machine learning to determine the correlation between state reflection information reflecting the state of other polishing pads and the polishing index of the other polishing pads.
  • the polishing index includes at least one of (1) the polishing rate or statistics of the polishing rate, (2) the polishing profile of the substrate after polishing or statistics of the polishing profile (e.g., the flatness of the substrate), (3) the rate of occurrence of abnormalities in polishing or statistics of the rate of occurrence of abnormalities, and (4) the detection rate of the end point of polishing of the substrate (also called the end point detection rate) or statistics of the detection rate.
  • the polishing rate is the thickness that can be polished per unit time.
  • the polishing profile of the substrate is the spatial distribution of the unevenness of the substrate after polishing.
  • the polishing end point is the timing indicating the end of polishing, and the end point detection rate is the probability that the polishing end point can be correctly detected.
  • the polishing rate may be estimated by the processor 63b from the state of the polishing pad, data within the polishing apparatus (torque command value or rotation speed of each motor, various equipment positions, slurry flow rate), and film thickness data of the substrate.
  • the polishing profile may be estimated by the processor 63b from the state of the polishing pad, data in the polishing apparatus (torque command value or rotation speed of each motor, various equipment positions, slurry flow rate, etc.), and film thickness data of the substrate.
  • the state of the polishing pad may be estimated by the processor 63b from the sensor 60 mounted on the dresser 40 and data in the polishing apparatus to determine whether it is in a state where polishing can be performed normally (specifically, for example, whether the groove depth exceeds the standard, whether foreign matter is present, etc.).
  • the abnormality occurrence rate may be estimated by the processor 63b from the state of the polishing pad, data in the polishing apparatus (torque command value or rotation speed of each motor, various equipment positions, slurry flow rate, etc.), and an abnormality occurrence log.
  • the end point detection rate may be estimated by the processor 63b from the state of the polishing pad, data in the polishing apparatus (torque command value or rotation speed of each motor, various equipment positions, slurry flow rate, etc.), end point detection time, and the determination result of whether the end point was detected.
  • the state reflection information is, for example, a feature amount related to the frictional force between the dresser 40 and the polishing pad 2 .
  • the feature amount related to the frictional force between the dresser 40 and the polishing pad 2 is, for example, a feature amount of a sensor value measured by the sensor 60.
  • the sensor value is, for example, a sensor value when the dresser 40 is dressing.
  • the processor 63b may determine a feature of the sensor value measured by the sensor 60 and input the feature to the machine learning model as the state reflection information, thereby estimating the polishing index.
  • the feature may be a statistical value of the sensor value (maximum, minimum, average, median, mode, standard deviation, skewness, kurtosis, etc.), or may be the effective value, energy value, amplitude, frequency analysis result by Fourier transform of the sensor value, or a statistical value of these (maximum, minimum, average, median, mode, standard deviation, skewness, kurtosis, etc.).
  • the features related to the frictional force between the dresser 40 and the polishing pad 2 may include at least one of the current value of the third motor 71, the torque command value of the third motor 71, the current value of the fourth motor 72, the torque command value of the fourth motor 72, and statistics thereof.
  • the status reflecting information may be polishing pad status information indicating the status of the polishing pad.
  • the polishing pad status information may include at least one of the amount of wear of the polishing pad, the temperature of the polishing pad during polishing or a statistical amount of time series data of the temperature, and the thickness of the polishing pad.
  • the control device 10 controls the polishing table to rotate at a constant speed. Therefore, if the polishing pad 2 wears out and the frictional force decreases, the resistance decreases, and the current value of the table rotation motor 21 or the torque command value of the table rotation motor 21 decreases, so there is a correlation between them. Therefore, the state reflection information may be at least one of the current value of the table rotation motor 21, the torque command value of the table rotation motor 21, and the statistics thereof.
  • the status reflection information may include at least one of the current value of the first motor 161 that rotates the polishing head shaft, the torque command value of the first motor 161 that rotates the polishing head shaft, the current value of the second motor 162 that swings the polishing head swing arm, and the torque command value of the second motor 162 that swings the polishing head swing arm.
  • the status reflection information may further include operation log information indicating an operation history of the polishing apparatus in addition to any one of the first to third pieces of information described above.
  • the operation log information may include at least one of the usage time of the polishing pad, the usage time of the dresser, the detection time of the polishing end point of the substrate, the number of the processed substrates, and the operation time of the sensor.
  • the status reflection information may further include the number of errors detected by the polishing apparatus in addition to any one of the first to third pieces of information.
  • the processor 63b may cause the display device 63c to display the polishing indicator, or may cause the display device 63c to display information encouraging the user to replace the polishing pad 2 based on the polishing indicator.
  • the processor 63b may also monitor the polishing state using values from various sensors other than the sensor 60. This can improve the accuracy of estimating the polishing index.
  • the polishing apparatus 1 includes a polishing table 5 that supports a polishing pad, a polishing head 7 that can press a substrate against the polishing surface of the polishing pad, and a processor 63b that estimates the polishing index of the polishing apparatus by inputting state reflection information that reflects the state of the polishing pad of the polishing apparatus into a machine learning model that has been trained by machine learning to determine the correlation between state reflection information that reflects the state of other polishing pads and the polishing index of the other polishing pads.
  • the user of the polishing device can understand the polishing index, making it possible to predict polishing abnormalities in advance.
  • the information processing device 63 described in the above embodiment may be configured as hardware or software. If configured as software, a program that realizes at least a part of the functions of the information processing device 63 may be stored in a computer-readable recording medium and read and executed by a computer.
  • the recording medium is not limited to removable ones such as magnetic disks and optical disks, but may be fixed recording media such as hard disk drives and memories.
  • a program that realizes at least a part of the functions of the information processing device 63 may be distributed via a communication line (including wireless communication) such as the Internet.
  • the program may be encrypted, modulated, or compressed and distributed via a wired line or wireless line such as the Internet, or stored on a recording medium.
  • the information processing device 63 may be operated by one or more information devices.
  • one of the devices may be a computer, and the computer may execute a predetermined program to realize the functions as at least one of the means of the information processing device 63.
  • all processes may be realized by automatic control using a computer.
  • each process may be performed by a computer, while progress control between processes may be performed manually.
  • at least some of the processes may be performed manually.
  • the present invention is not limited to the above-described embodiment as it is, and in the implementation stage, the components can be modified and embodied without departing from the gist of the invention.
  • various inventions can be formed by appropriately combining the multiple components disclosed in the above-described embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, components from different embodiments may be appropriately combined.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Ce dispositif de polissage comprend : une table de polissage qui supporte un tampon de polissage ; une tête de polissage capable de presser un substrat sur une surface de polissage du tampon de polissage ; et un processeur qui estime un indice de polissage du dispositif de polissage en entrant des informations de réflexion d'état reflétant l'état du tampon de polissage du dispositif de polissage, dans un modèle d'apprentissage automatique qui a appris, par apprentissage automatique, une corrélation entre des informations de réflexion d'état reflétant l'état d'un autre tampon de polissage et l'indice de polissage de l'autre tampon de polissage.
PCT/JP2023/039209 2022-11-04 2023-10-31 Dispositif de polissage, procédé de traitement d'informations et programme WO2024095997A1 (fr)

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JP2022177182A JP2024067256A (ja) 2022-11-04 2022-11-04 研磨装置、情報処理装置及びプログラム

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021146493A (ja) * 2020-03-24 2021-09-27 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
JP2022055703A (ja) * 2020-09-29 2022-04-08 株式会社荏原製作所 研磨装置、および研磨パッドの交換時期を決定する方法
JP2022127883A (ja) * 2021-02-22 2022-09-01 キオクシア株式会社 基板処理の制御方法
US20220283082A1 (en) * 2021-03-03 2022-09-08 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021146493A (ja) * 2020-03-24 2021-09-27 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
JP2022055703A (ja) * 2020-09-29 2022-04-08 株式会社荏原製作所 研磨装置、および研磨パッドの交換時期を決定する方法
JP2022127883A (ja) * 2021-02-22 2022-09-01 キオクシア株式会社 基板処理の制御方法
US20220283082A1 (en) * 2021-03-03 2022-09-08 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring

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