WO2024095568A1 - インダクタ部品 - Google Patents

インダクタ部品 Download PDF

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Publication number
WO2024095568A1
WO2024095568A1 PCT/JP2023/030176 JP2023030176W WO2024095568A1 WO 2024095568 A1 WO2024095568 A1 WO 2024095568A1 JP 2023030176 W JP2023030176 W JP 2023030176W WO 2024095568 A1 WO2024095568 A1 WO 2024095568A1
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WIPO (PCT)
Prior art keywords
coil
wiring
wirings
wide
coil wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/030176
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English (en)
French (fr)
Japanese (ja)
Inventor
由雅 吉岡
剛 高松
秀基 加茂
健司 豊島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202380076047.3A priority Critical patent/CN120188239A/zh
Priority to JP2024554271A priority patent/JP7816559B2/ja
Publication of WO2024095568A1 publication Critical patent/WO2024095568A1/ja
Priority to US19/194,282 priority patent/US20250273376A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core

Definitions

  • This disclosure relates to inductor components.
  • the inductor component has an element body, a coil provided within the element body and wound along the axial direction, and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil.
  • the coil has multiple coil patterns stacked along the axis. Adjacent coil patterns in the axial direction are connected via conductive vias.
  • the coil pattern has a wiring portion extending in a direction perpendicular to the axis, and a pad portion provided at the end of the wiring portion and connecting to the conductive via. The width of the pad portion is wider than the width of the wiring portion to improve the connectivity between the pad portion and the conductive via.
  • the width of the pad portion is wider than the width of the wiring portion, so part of the pad portion is located radially inward of the coil relative to the wiring portion. This makes the inner diameter of the coil smaller, and the efficiency of obtaining inductance is not necessarily high.
  • the present disclosure aims to provide an inductor component that can increase the efficiency of obtaining inductance.
  • an inductor component comprises: an element body including a first main surface and a second main surface opposed to each other; a coil provided on the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with The axis of the coil is disposed parallel to the first major surface;
  • the coil is a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis; a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on an opposite side of the axi
  • the axis refers to the intersection line between a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring.
  • the maximum axial width of the wide coil wiring refers to the maximum value of the axial width of the wide coil wiring as viewed from a direction perpendicular to the first main surface of the element body.
  • the maximum axial width of at least one of the inner coil wirings is defined in the same manner.
  • the external electrodes are provided on the element body specifically means that the external electrodes are provided on the outer surface side of the element body, including cases where the external electrodes are provided directly on the outer surface of the element body, cases where the external electrodes are provided on the outside of the element body via a separate member on the element body, and cases where the external electrodes are provided on the outer surface of the element body with part of them embedded in the element body.
  • the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil can be increased and the efficiency of obtaining inductance can be increased. Also, by increasing the efficiency of obtaining inductance, the Q value can be increased. Furthermore, when viewed from a direction perpendicular to the first main surface of the element body, at least a portion of the wide coil wiring can be disposed in dead spaces that existed at both ends in the axial direction of the element body, where no coil wiring had existed in the past. As a result, the dead space of the element body can be effectively utilized while the electrical resistance of the entire coil can be reduced compared to the past, and the Q value of the inductor component can be increased.
  • the wide coil wiring has a maximum width in the axial direction that is greater than the maximum width in the axial direction of all of the inner coil wirings.
  • the electrical resistance of the entire coil can be further reduced compared to conventional methods, and the Q value of the inductor component can be increased.
  • the first external electrode is provided on the first main surface of the element body,
  • the wide coil wiring is included only in the plurality of first coil wirings.
  • connection reliability between the first external electrode and the coil can be improved.
  • the first external electrode is provided on the first main surface of the element body,
  • the wide coil wiring is included only in the plurality of second coil wirings.
  • the distance between the wide coil wiring and the first external electrode can be increased compared to when the wide coil wiring is included in multiple first coil wirings. This reduces the parasitic capacitance between the wide coil wiring and the first external electrode, thereby increasing the self-resonant frequency (SRF).
  • SRF self-resonant frequency
  • the width of the wide coil wiring in the axial direction is not constant in a direction perpendicular to the axial direction.
  • the dead space of the element body can be utilized more effectively.
  • the first external electrode has a via portion connected to the coil, the via portion is connected to the wide coil wiring,
  • the area of a contact surface of the wide coil wiring with the via portion is larger than the area of a contact surface of at least one of the inner coil wirings with the first through wiring.
  • connection strength between the first external electrode and the wide coil wiring can be improved.
  • the first external electrode has a plurality of via portions connected to the coil;
  • the wide coil wiring is connected to the plurality of via portions.
  • multiple via portions are connected to the wide coil wiring, so the connection strength between the first external electrode and the wide coil wiring can be improved compared to when a single via portion is connected.
  • the thickness of the wide coil wire is smaller than the thickness of at least one of the inner coil wires.
  • Wide coil wiring has a relatively large maximum axial width, so even if the thickness is reduced, the increase in electrical resistance can be suppressed. Therefore, according to the above embodiment, the electrical resistance of the entire coil can be reduced compared to conventional methods, and a thin inductor component can be realized.
  • the wide coil wiring is included in only one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings,
  • the thickness of all of the coil wirings in the group including the wide coil wiring out of the first group and the second group is thinner than the thickness of all of the coil wirings in the group not including the wide coil wiring.
  • a thinner inductor component can be realized.
  • Either the plurality of first coil wirings or the plurality of second coil wirings is composed of only the wide coil wirings.
  • the electrical resistance of the entire coil can be reduced compared to conventional methods.
  • a ratio of a total area of the plurality of first coil wirings to an area of the first main surface is 50% or more and 95% or less;
  • a ratio of a total area of the plurality of second coil wirings to an area of the first main surface is 50% or more and 95% or less.
  • the ratio of the total area of the multiple first coil wirings by setting the ratio of the total area of the multiple first coil wirings to the area of the first main surface to 50% or more, leakage of magnetic flux radially outward from the coil can be suppressed.
  • the ratio of the total area of the multiple first coil wirings By setting the ratio of the total area of the multiple first coil wirings to the area of the first main surface to 95% or less, it can be easily diced into inductor components.
  • the ratio of the total area of the multiple second coil wirings by setting the ratio of the total area of the multiple second coil wirings to the area of the first main surface to 50% or more, leakage of magnetic flux radially outward from the coil can be suppressed.
  • the ratio of the total area of the multiple second coil wirings By setting the ratio of the total area of the multiple second coil wirings to the area of the first main surface to 95% or less, it can be easily diced into inductor components.
  • the wide coil wiring is included in at least one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings, When viewed from a direction perpendicular to the first main surface, The ratio of a total area of all the coil wirings in the group including the wide coil wiring of the first group and the second group to an area of the first main surface is 65% or more.
  • leakage of magnetic flux radially outward from the coil can be further suppressed.
  • the wide coil wiring is included in only one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings, When viewed from a direction perpendicular to the first main surface, The ratio of the total area of all coil wirings in the group including the wide coil wiring among the first and second groups to the area of the first main surface is greater than the ratio of the total area of all coil wirings in the group not including the wide coil wiring to the area of the first main surface.
  • the wide coil wiring is included in both the plurality of first coil wirings and the plurality of second coil wirings.
  • the electrical resistance of the entire coil can be further reduced compared to conventional methods.
  • the wide coil wiring When viewed from a direction perpendicular to the first main surface, the wide coil wiring has a corner portion on a radially outer side of the coil and on a central side of the element body along the axial direction, The wide coil wiring is connected to the first through wiring at the corner portion.
  • the coil length can be shortened, allowing the Q value to be increased.
  • the outer shape of the wide coil wiring has a portion that follows the outer shape of the element body, and a portion that follows the outer shape of the coil wiring of the first coil wiring and the second coil wiring that is adjacent to the wide coil wiring in the axial direction on the same plane as the wide coil wiring.
  • the wide coil wiring when viewed from a direction perpendicular to the first main surface, can be arranged in a dead space that may occur between the outer shape of the element body and the outer shape of the coil wiring, of the first coil wiring and the second coil wiring, that is adjacent to the wide coil wiring in the axial direction on the same plane as the wide coil wiring, with the gap with the element body being minimized.
  • This allows more effective use of the dead space of the element body, making it possible to increase the maximum axial width of the wide coil wiring.
  • the electrical resistance of the entire coil can be further reduced compared to conventional methods, and the Q value of the inductor component can be further increased.
  • the wide coil wiring is connected to the first through wiring,
  • the area of a contact surface of the wide coil wiring with the first through wiring is larger than the area of a contact surface of at least one of the inner coil wirings with the first through wiring.
  • the electrical resistance of the first through-wire connected to the wide coil wiring can be reduced more than the electrical resistance of the other first through-wires.
  • the electrical resistance of the entire coil can be reduced more than in the past.
  • a first end surface of the first through wiring in an extending direction thereof is connected to one of the first coil wiring and the second coil wiring; a second end surface of the first through wiring in an extending direction thereof is connected to the other of the first coil wiring and the second coil wiring; the wide coil wiring is connected to at least the first end surface of the first end surface and the second end surface; The area of the first end face is greater than the area of the second end face.
  • the electrical resistance of the first through-wire connected to the wide coil wiring can be reduced more than the electrical resistance of the other first through-wires.
  • the electrical resistance of the entire coil can be reduced more than in the past.
  • the inductor component according to one aspect of the present disclosure can improve the efficiency of obtaining inductance.
  • FIG. 2 is a schematic bottom view of the inductor component of the first embodiment as viewed from the bottom side.
  • FIG. This is a cross-sectional view of FIG.
  • FIG. 3 is a cross-sectional view taken along line III-III of FIG.
  • FIG. 2 is an enlarged view of a portion of FIG. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • FIG. 11 is a cross-sectional view showing a first modified example of an inductor component.
  • FIG. 11 is a cross-sectional view showing a second modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a third modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a fourth modified example of the inductor component.
  • 13 is a schematic bottom view of the inductor component of the second embodiment as viewed from the bottom side.
  • FIG. 13 is a schematic bottom view of the inductor component of the third embodiment as viewed from the bottom side.
  • FIG. IX-IX cross-sectional view of FIG. 8. 13 is a schematic bottom view of the inductor component of the fourth embodiment as viewed from the bottom side.
  • FIG. 13 is a schematic bottom view of the inductor component of the fifth embodiment as viewed from the bottom side.
  • FIG. This is a cross-sectional view of Figure 11 along XII-XII.
  • 13 is a schematic bottom view of the inductor component of the sixth embodiment as viewed from the bottom side.
  • FIG. 14 is an enlarged view of a portion of FIG. 13.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • FIG. 11 is a cross-sectional view showing a first modified example of an inductor component.
  • FIG. 11 is a cross-sectional view showing a second modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a third modified example of the inductor component.
  • Fig. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side.
  • Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.
  • Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1.
  • external electrodes are depicted by two-dot chain lines in Fig. 1.
  • the element body 10 is depicted as transparent so that the structure can be easily understood, but it may be semi-transparent or opaque.
  • the inductor component 1 is a surface mount type inductor component used, for example, in a high frequency signal transmission circuit. As shown in Figures 1, 2 and 3, the inductor component 1 includes an element body 10, a coil 110 provided on the element body 10 and wound in a spiral shape along an axis AX, and a first external electrode 121 and a second external electrode 122 provided on the element body 10 and electrically connected to the coil 110.
  • the element body 10 has a length, width, and height.
  • the element body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction.
  • the outer surface 100 of the element body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t.
  • the bottom face 100b corresponds to an example of a "first main face” as described in the claims
  • the top face 100t corresponds to an example of a "second main face” as described in the claims.
  • the length direction (longitudinal direction) of the element body 10, which is the direction from the first end face 100e1 to the second end face 100e2, is referred to as the X direction.
  • the width direction of the element body 10, which is the direction from the first side face 100s1 to the second side face 100s2, is referred to as the Y direction.
  • the height direction of the element body 10, which is the direction from the bottom face 100b to the top face 100t, is referred to as the Z direction.
  • the X direction, Y direction, and Z direction are mutually perpendicular, and when arranged in the order X, Y, Z, they form a right-handed system.
  • the "outer surface 100 of the element body” including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the element body 10 does not simply mean a surface facing the outer periphery of the element body 10, but a surface that is the boundary between the outside and the inside of the element body 10. Furthermore, “above the outer surface 100 of the element body 10” does not mean an absolute direction such as vertically upward as defined by the direction of gravity, but refers to a direction toward the outside of the outside and the inside with the outer surface 100 as a boundary, based on the outer surface 100. Therefore, "above the outer surface 100” is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above” with respect to a certain element includes not only an upper side away from the element, that is, an upper position through another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).
  • the axis AX of the coil 110 is arranged parallel to the bottom surface 100b.
  • the coil 110 includes a plurality of bottom surface wirings 11b arranged on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top surface wirings 11t arranged on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom surface wirings 11b toward the top surface wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom surface wirings 11b toward the top surface wirings 11t, arranged on the opposite side of the first through wirings 13 with respect to the axis AX and arranged along the axis AX.
  • the bottom wiring 11b corresponds to an example of the "first coil wiring” described in the claims
  • the top wiring 11t corresponds to an example of the "second coil wiring” described in the claims.
  • the axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t, and a second plane passing through the center between the first through wiring 13 and the second through wiring 14.
  • the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110.
  • the axis AX of the coil 110 has no dimension in a direction perpendicular to the axis AX.
  • the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14.
  • the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil 110 can be increased and the efficiency of obtaining inductance can be increased. Furthermore, by increasing the efficiency of obtaining inductance, the Q value can be increased.
  • the pad portion of a conventional inductor component and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for the wiring that penetrates the element body (the conductive vias of a conventional inductor component and the first through wiring 13 and second through wiring 14 of this embodiment), and therefore have a shape that extends perpendicularly in the direction that penetrates the element body.
  • the pad portion extends in a direction perpendicular to the axis of the coil, and is likely to have a structure that blocks magnetic flux generated in the axial direction of the coil.
  • the first through wiring 13 and the second through wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, so the bottom wiring 11b and the top wiring 11t extend in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are unlikely to have a structure that blocks magnetic flux generated in the direction of the axis AX. In other words, with this embodiment, a structure that is unlikely to block magnetic flux can be achieved, improving the inductance acquisition efficiency and Q value.
  • At least one of the two bottom wirings 11b located at both ends in the axial AX direction among the multiple bottom wirings 11b and the two top wirings 11t located at both ends in the axial AX direction among the multiple top wirings 11t is a wide coil wiring.
  • the two bottom wirings 11b at both ends correspond to an example of the "first coil wiring at both ends" described in the claims, and are also referred to as both end bottom wirings 11b.
  • the two top wirings 11t at both ends correspond to an example of the "second coil wiring at both ends" described in the claims, and are also referred to as both end top wirings 11t.
  • the two bottom wirings 11b located at both ends in the axial AX direction among the multiple bottom wirings 11b and the two top wirings 11t located at both ends in the axial AX direction among the multiple top wirings 11t are all wide coil wirings.
  • the wide coil wiring among the multiple bottom wirings 11b that is located closest to the first end surface 100e1 will be referred to as the "first wide coil wiring W1
  • the wide coil wiring among the multiple bottom wirings 11b that is located closest to the second end surface 100e2 will be referred to as the “second wide coil wiring W2”
  • the wide coil wiring among the multiple top wirings 11t that is located closest to the first end surface 100e1 will be referred to as the "third wide coil wiring W3”
  • the wide coil wiring among the multiple top wirings 11t that is located closest to the second end surface 100e2 will be referred to as the "fourth wide coil wiring W4.”
  • the coil wiring other than the two bottom wirings 11b (both end bottom wirings 11b) located at both ends in the axis AX direction is referred to as the "narrow bottom wiring 11nb”
  • the coil wiring other than the two top wirings 11t (both end top wirings 11t) located at both ends in the axis AX direction is referred to as the "
  • FIG. 4 is an enlarged view of a portion of FIG. 1. Specifically, FIG. 4 is an enlarged view of the first wide coil wiring 11w1, the narrow bottom wiring 11nb adjacent to the first wide coil wiring 11w1 in the axial direction AX, the third wide coil wiring 11w3, and the narrow top wiring 11nt adjacent to the third wide coil wiring 11w3 in the axial direction AX.
  • the first wide coil wiring 11w1 has a maximum width W1 in the axial direction AX that is greater than the maximum width in the axial direction of at least one of the narrow bottom wiring 11nb and the narrow top wiring 11nt.
  • the third wide coil wiring 11w3 has a maximum width W3 in the axial direction AX that is greater than the maximum width in the axial direction of at least one of the narrow bottom wiring 11nb and the narrow top wiring 11nt.
  • the maximum width W1 of the first wide coil wiring 11w1 in the axial direction AX refers to the maximum value of the width of the first wide coil wiring 11w1 in the axial direction AX when viewed from a direction perpendicular to the bottom surface 100b (Z direction).
  • the maximum width W3 of the third wide coil wiring 11w3 is defined in the same way.
  • the shape of the first wide coil wiring 11w1 is a substantially triangular shape when viewed from the Z direction, with the width in the axial AX direction increasing from the second side surface 100s2 side toward the first side surface s1 side.
  • the shape of the first wide coil wiring 11w1 is a substantially triangular shape when viewed from the Z direction, with three sides: one side parallel to the X direction, one side parallel to the Y direction, and one side parallel to the extension direction of the adjacent narrow bottom wiring 11nb in the axial AX direction.
  • the maximum width W1 in the axial direction of the first wide coil wiring 11w1 is greater than the maximum width W2 in the axial direction of the narrow bottom wiring 11nb.
  • the maximum width W1 in the axial direction of the first wide coil wiring 11w1 is greater than the maximum width W4 in the axial direction of the narrow top wiring 11nt. Note that the maximum width W1 may be greater than either the maximum width W2 or the maximum width W4.
  • the shape of the third wide coil wiring 11w3 is a substantially rectangular shape extending in the Y direction when viewed from the Z direction. Specifically, the shape of the third wide coil wiring 11w3 is a substantially rectangular shape having four sides, two sides parallel to the X direction and two sides parallel to the Y direction, when viewed from the Z direction.
  • the maximum width W3 in the axial direction of the third wide coil wiring 11w3 is greater than the maximum width W2 in the axial direction of the narrow bottom wiring 11nb.
  • the maximum width W3 in the axial direction of the third wide coil wiring 11w3 is greater than the maximum width W4 in the axial direction of the narrow top wiring 11nt.
  • the maximum width W2 and the maximum width W4 are defined in the same way as the maximum width W1. Note that the maximum width W3 may be greater than either the maximum width W2 or the maximum width W4.
  • the maximum widths of the first wide coil wiring W1 and the third wide coil wiring W3 have been described above, the same is true for the maximum widths of the second wide coil wiring W2 and the fourth wide coil wiring W4. That is, the maximum width in the axial direction of the second wide coil wiring 11w2 is greater than the maximum width in the axial direction of at least one of the narrow bottom wiring 11nb and the narrow top wiring 11nt. The maximum width in the axial direction of the fourth wide coil wiring 11w4 is greater than the maximum width in the axial direction of at least one of the narrow bottom wiring 11nb and the narrow top wiring 11nt.
  • the dead spaces of the element body 10 can be effectively utilized while the electrical resistance of the entire coil 110 can be reduced compared to the past, and the Q value of the inductor component 1 can be increased.
  • the bottom wiring 11b located closest to the first end face 100e1 side is not a wide coil wiring, but extends linearly in a direction parallel to the adjacent narrow bottom wiring 11nb in the axis AX direction and has the same wiring width as the narrow bottom wiring 11nb, a dead space where the bottom wiring 11b does not exist may be generated at the corner of the element body 10 where the first end face 100e1 and the first side face 100s1 intersect.
  • the first wide coil wiring 11w1 since the first wide coil wiring 11w1 has a relatively large maximum width W1 in the axis AX direction, a part of the first wide coil wiring 11w1 can be arranged in this dead space.
  • the electrical resistance of the entire coil 110 can be reduced compared to the conventional case while effectively utilizing the dead space of the element body 10, and the Q value of the inductor component 1 can be increased.
  • the volume of the inductor component 1 is preferably 0.08 mm3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less.
  • the size of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, refers to the length in the X direction. According to the above configuration, the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, so that the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the necessary mounting strength can be obtained.
  • the thickness of the inductor component 1 is preferably 200 ⁇ m or less. This allows the inductor component 1 to be made thin.
  • the size of the inductor component 1 (length (X direction) x width (Y direction) x height (Z direction)) is 0.6 mm x 0.3 mm x 0.3 mm, 0.4 mm x 0.2 mm x 0.2 mm, 0.25 mm x 0.125 mm x 0.120 mm, etc. Furthermore, the width and height do not have to be equal, and may be, for example, 0.4 mm x 0.2 mm x 0.3 mm.
  • the element body 10 preferably contains SiO2 . This can provide insulation and rigidity to the element body 10.
  • the element body 10 is made of, for example, a sintered glass body.
  • the sintered glass body may contain alumina, which can further increase the strength of the element body.
  • the glass sintered body is formed, for example, by stacking multiple insulating layers containing glass.
  • the stacking direction of the multiple insulating layers is the Z direction.
  • the insulating layers are in a layered form having main surfaces extending in the XY plane. Note that, due to firing or the like, the interfaces between the multiple insulating layers of the element body 10 may not be clear.
  • the element body 10 may be made of, for example, a glass substrate.
  • the glass substrate may be a single-layer glass substrate, and since the majority of the element body is made of glass, losses such as eddy current losses at high frequencies can be suppressed.
  • the coil 110 includes a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14.
  • the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in sequence to form at least a portion of the coil 110 wound in the axial direction AX.
  • the coil 110 is a so-called helical-shaped coil 110, so that in a cross section perpendicular to the axis AX, the area in which the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel to the winding direction of the coil 110 can be reduced, thereby reducing the stray capacitance in the coil 110.
  • a helical shape refers to a shape in which the number of turns in the entire coil is greater than one turn, and the number of turns in the coil in a cross section perpendicular to the axis is less than one turn.
  • One turn or more refers to a state in which, in a cross section perpendicular to the axis, the coil wiring has parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction
  • “less than one turn” refers to a state in which, in a cross section perpendicular to the axis, the coil wiring does not have parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction.
  • the narrow bottom wiring 11nb extends in only one direction. Specifically, the narrow bottom wiring 11nb extends in the Y direction at a slight incline toward the X direction.
  • the narrow bottom wirings 11nb are arranged parallel to the X direction.
  • the maximum width of each of the narrow bottom wirings 11nb in the axial AX direction may be the same or different, but in this embodiment, they are the same.
  • modified illumination such as annular illumination or dipole illumination is used in the photolithography process
  • the pattern resolution in a specific direction can be improved to form a finer pattern.
  • fine narrow bottom wiring 11nb can be formed by using modified illumination in the photolithography process, for example, and the inductor component 1 can be made smaller.
  • the narrow top wiring 11nt extends in only one direction. Specifically, the narrow top wiring 11nt extends in the Y direction.
  • the multiple narrow top wirings 11nt are arranged in parallel along the X direction.
  • the maximum width of each of the multiple narrow top wirings 11nt in the axis AX direction may be the same or different, but in this embodiment, they are made the same. According to the above configuration, since the narrow top wiring 11nt extends in only one direction, fine narrow top wiring 11nt can be formed by using, for example, modified illumination in the photolithography process, and the inductor component 1 can be made smaller.
  • the bottom wiring 11b and the top wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy of these.
  • the bottom wiring 11b and the top wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste.
  • the bottom wiring 11b and the top wiring 11t may also be a multi-layer structure in which multiple metal layers are stacked.
  • the thickness of the bottom wiring 11b and the top wiring 11t is preferably 5 ⁇ m or more and 50 ⁇ m or less.
  • the first through wiring 13 is disposed on the first side surface 100s1 side of the axis AX within the through hole V of the element body 10, and the second through wiring 14 is disposed on the second side surface 100s2 side of the axis AX within the through hole V of the element body 10.
  • the first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. This allows the lengths of the first through wiring 13 and the second through wiring 14 to be shortened, thereby suppressing the direct current resistance (Rdc).
  • the multiple first through wirings 13 and the multiple second through wirings 14 are each disposed in parallel along the X direction.
  • the first through wiring 13 contains SiO 2. According to this, when the element body 10 contains SiO 2 , the linear expansion coefficient of the first through wiring 13 can be matched to the linear expansion coefficient of the element body 10, and cracks between the first through wiring 13 and the element body 10 can be suppressed.
  • a conductive paste is used for the first through wiring 13.
  • the conductive material is Ag, Cu, or the like.
  • the second through wiring 14 similarly contains SiO 2 .
  • At least one of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 includes a void portion or a resin portion.
  • a void portion or a resin portion This allows the stress caused by the difference in linear expansion coefficient between the wiring and the element body 10 to be absorbed by the void portion or resin portion, and the stress can be alleviated.
  • a method for forming the void portion for example, a material that is burned away by sintering is used as the wiring material, and the void portion can be formed by sintering the wiring.
  • a method for forming the resin portion for example, a conductive paste can be used as the wiring material to form the resin portion.
  • At least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO 2.
  • the linear expansion coefficient of the wiring can be matched to the linear expansion coefficient of the element body 10, and cracks between the wiring and the element body 10 can be suppressed.
  • the first external electrode 121 is provided on the bottom surface 100b of the element body 10, and the wide coil wiring is included only in the multiple bottom surface wirings 11b. In this case, the wide coil wiring is not included in the multiple top surface wirings 11t.
  • This configuration can improve the connection reliability between the first external electrode 121 and the coil 110. Specifically, since the wide coil wiring has a relatively large maximum width in the axis AX direction, the contact area between the first external electrode 121 and the wide coil wiring can be made larger than in the past. In addition, even if at least one of the first external electrode 121 and the wide coil wiring is misaligned, the wide coil wiring can suppress the effect of this misalignment and more reliably connect the first external electrode 121 and the wide coil wiring. As a result, the connection reliability between the first external electrode 121 and the coil 110 can be improved.
  • the wide coil wiring is included in both the multiple bottom wirings 11b and the multiple top wirings 11t.
  • the electrical resistance of the entire coil 110 can be further reduced compared to conventional methods.
  • the width of the wide coil wiring in the axial direction AX is not constant in a direction perpendicular to the axial direction AX.
  • the width in the axial direction AX in the central region excluding both ends in a direction perpendicular to the axial direction AX is not constant in a direction perpendicular to the axial direction AX.
  • the maximum width of each of the first to fourth wide coil wirings 11w1 to 11w4 in the axial direction is greater than the maximum width of all the narrow bottom wirings 11nb and all the narrow top wirings 11nt in the axial direction.
  • the first wide coil wiring 11w1 when viewed from a direction perpendicular to the bottom surface 100b, has a corner C1 on the radial outside of the coil 110 and toward the center of the base body 10, and the first wide coil wiring 11w1 is connected to the first through wiring 13 at the corner C1.
  • the coil length of the coil 110 can be shortened, thereby making it possible to increase the Q value.
  • the coil length refers to the length of the coil 110 in the axial AX direction.
  • the fourth wide coil wiring 11w4 when viewed from a direction perpendicular to the bottom surface 100b, has a corner on the radial outside of the coil 110 and toward the center of the base body 10, and the fourth wide coil wiring 11w4 is connected to the first through wiring 13 at the corner.
  • the third wide coil wiring 11w3 has a corner C2 on the radial outside of the coil 110 and toward the center of the element body 10, and the third wide coil wiring 11w3 is connected to the second through wiring 14 at the corner C2.
  • the coil length of the coil 110 can be shortened, thereby making it possible to increase the Q value.
  • the second wide coil wiring 11w2 when viewed from a direction perpendicular to the bottom surface 100b, has a corner on the radial outside of the coil 110 and toward the center of the base body 10, and the second wide coil wiring 11w2 is connected to the second through wiring 14 at the corner.
  • the outer shape of the first wide coil wiring 11w1 when viewed from a direction perpendicular to the bottom surface 100b, has a portion that follows the outer shape of the element body 10, and a portion that follows the outer shape of the coil wiring of the bottom surface wiring 11b and the top surface wiring 11t that is adjacent to the first wide coil wiring 11w1 in the axial AX direction on the same plane as the first wide coil wiring 11w1.
  • the outer shape of the first wide coil wiring 11w1 has a portion that follows the outer shape of the element body 10, and a portion that follows the outer shape of the coil wiring of the bottom surface wiring 11b and the top surface wiring 11t that is adjacent to the first wide coil wiring 11w1 in the axial AX direction on the same plane as the first wide coil wiring 11w1.
  • the outer shape of the first wide coil wiring 11w1 has a portion P1 that follows the outer shape of the first end surface 100e1 of the element body 10, a portion P2 that follows the outer shape of the first side surface 100s1 of the element body 10, and a portion P3 that follows the outer shape of the narrow bottom surface wiring 11nb that is adjacent to the first wide coil wiring 11w1 in the axial AX direction on the same plane as the first wide coil wiring 11w1.
  • the portions P1 and P2 are shown by dashed lines, and the portion P3 is shown by dashed lines.
  • the first wide coil wiring 11w1 can be arranged in the dead space that may occur between the outer shape of the element body 10 and the outer shape of the narrow bottom wiring 11nb when viewed from a direction perpendicular to the bottom surface 100b, minimizing the gap with the element body 10.
  • This allows the dead space of the element body 10 to be more effectively utilized, making it possible to increase the maximum width W1 of the first wide coil wiring 11w1 in the axial AX direction.
  • the electrical resistance of the entire coil 110 can be further reduced compared to the conventional case, and the Q value of the inductor component 1 can be further increased.
  • the outer shapes of the second to fourth wide coil wirings 11w2 to 11w4 may have a portion that follows the outer shape of the base body 10, and a portion that follows the outer shape of the bottom surface wiring 11b and the top surface wiring 11t that are adjacent to the wide coil wiring in the axial AX direction on the same plane as the wide coil wiring.
  • the ratio of the total area of the multiple bottom surface wirings 11b to the area of the bottom surface 100b is 50% or more and 95% or less, and the ratio of the total area of the multiple top surface wirings 11t to the area of the bottom surface 100b is 50% or more and 95% or less.
  • the ratio of the total area of the multiple bottom wirings 11b to the area of the bottom surface 100b to 50% or more, it is possible to suppress leakage of magnetic flux to the radial outside of the coil 110.
  • the electrical resistance of the bottom wiring 11b can be further reduced.
  • the strength of the element body 10 can be improved and the heat dissipation of the inductor component 1 can be enhanced.
  • the ratio of the area of the multiple bottom wirings 11b to the area of the bottom surface 100b to 95% or less, it is possible to easily separate into the inductor component 1.
  • the ratio of the area of the multiple top wirings 11t to the area of the bottom surface 100b to 50% or more, it is possible to suppress leakage of magnetic flux to the radial outside of the coil 110.
  • the electrical resistance of the top wiring 11t can be further reduced.
  • the strength of the element body 10 can be improved and the heat dissipation of the inductor component 1 can be enhanced.
  • the ratio of the area of the multiple top wirings 11t to the area of the bottom surface 100b to 95% or less, it is possible to easily separate into the inductor component 1.
  • the coil wiring pattern is repeated in the same shape, and the coil wiring pattern is formed inside the element body 10 so that the coil wiring is not exposed to the outside of the element body 10. Therefore, it was difficult to increase the above ratio.
  • the multiple bottom wirings 11b and the multiple top wirings 11t include wide coil wiring, so the above ratio can be increased.
  • the above ratio is 100% or almost 100%, the coil wiring and the element body 10 are made of different materials, so the difficulty of processing increases during individualization. Furthermore, if the coil wiring is formed deviated from the design position or due to processing variations, the coil wiring may be exposed from the element body 10.
  • a side gap is provided from the outer surface of the element body 10 to the inside to restrict the area where the coil wiring is formed. For example, if the dimensions of the bottom surface 100b are 0.4 mm x 0.2 mm and the side gap is 10 um, the above ratio is 93%.
  • the wide coil wiring is included in at least one of a first group consisting of a plurality of bottom wirings 11b and a second group consisting of a plurality of top wirings 11t, and when viewed from a direction perpendicular to the bottom surface 100b, the ratio of the area of all the coil wirings in the first and second groups including the wide coil wiring to the area of the bottom surface 100b is 65% or more. With this configuration, it is possible to further suppress leakage of magnetic flux radially outward from the coil 110.
  • the first external electrode 121 is connected to a first end of the coil 110, and the second external electrode 122 is connected to a second end of the coil 110.
  • the first external electrode 121 is provided on the first end face 100e1 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10.
  • the second external electrode 122 is provided on the second end face 100e2 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are preferably located inside the outer surface 100 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are preferably located inside the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are not in contact with the outer surface 100 of the element body 10, so when the inductor components are singulated, the load on the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.
  • the first external electrode 121 may be provided continuously on the bottom surface 100b and the first end surface 100e1. In this way, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when the inductor component 1 is mounted on a mounting board. Similarly, the second external electrode 122 may be provided continuously on the bottom surface 100b and the second end surface 100e2.
  • the first external electrode 121 has a bottom portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b.
  • the via portion 121v is connected to the bottom portion 121b.
  • the via portion 121v is connected to the first wide coil wiring 11w.
  • the second external electrode 122 has a bottom portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b.
  • the via portion 122v is connected to the bottom portion 122b.
  • the via portion 122v is connected to the second wide coil wiring 11w2.
  • the first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 that covers the underlayer 121e1.
  • the underlayer 121e1 includes a conductive material such as Ag or Cu.
  • the plating layer 121e2 includes a conductive material such as Ni or Sn.
  • a part of the bottom portion 121b and the via portion 121v are composed of the underlayer 121e1.
  • Another part of the bottom portion 121b is composed of the plating layer 121e2.
  • the second external electrode 122 has an underlayer and a plating layer that covers the underlayer.
  • the first external electrode 121 and the second external electrode 122 may be composed of a single layer of conductive material.
  • the first external electrode 121 has a plurality of via portions 121v. Specifically, the first external electrode 121 has two via portions 121v arranged side by side in the Y direction. The two via portions 121v are connected to the end of the first wide coil wiring 11w1 on the second side surface 100s2 side.
  • the second external electrode 122 has a plurality of via portions 121v. Specifically, the second external electrode 122 has two via portions 122v arranged side by side in the Y direction. The two via portions 122v are connected to the end of the second wide coil wiring 11w2 on the first side surface 100s1 side.
  • the number of each of the via portions 121v and the via portions 122v is not particularly limited and may be three or more. Also, only one of the via portions 121v and the via portions 122v may be present in multiples.
  • the connection strength between the first external electrode 121 and the first wide coil wiring 11w1 can be improved compared to when a single via portion 121v is connected.
  • the connection strength between the second external electrode 122 and the second wide coil wiring 11w2 can be improved compared to when a single via portion 122v is connected.
  • Figures 5A to 5M are views corresponding to the cross section II-II of Figure 1.
  • Figures 5I, 5J, and 5M are views corresponding to the cross section III-III of Figure 1.
  • a first insulating layer 1011 is provided on a base substrate 1000 by printing.
  • the material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc.
  • the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.
  • the second insulating layer 1012 is provided on the first insulating layer 1011 by printing.
  • a groove 1012a is provided in the second insulating layer 1012.
  • the groove 1012a is formed, for example, by a photolithography process. Note that the groove may be formed from the beginning as a printing pattern.
  • a top conductor layer 1011t is provided in the groove 1012a by printing.
  • the material of the top conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc.
  • the top conductor layer 1011t is formed as a printing pattern so that it remains only in the groove 1012a. Note that after the top conductor layer 1011t is printed on the second insulating layer 1012, a photolithography process may be used to make the top conductor layer 1011t remain only in the groove 1012a.
  • a third insulating layer 1013 is provided on the second insulating layer 1012 by printing.
  • a first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013.
  • the first groove 1013a and the second groove 1013b are formed in the same manner as in FIG. 5B.
  • the first through conductor layer 1131 of the first layer is provided by printing in the first groove 1013a
  • the second through conductor layer 1141 of the first layer is provided by printing in the second groove 1013b.
  • the first through conductor layer 1131 of the first layer and the second through conductor layer 1141 of the first layer are formed in the same manner as in FIG. 5C.
  • a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second-layer first penetrating conductor layer 1132 and a second-layer second penetrating conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third-layer first penetrating conductor layer 1133 and a third-layer second penetrating conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015.
  • a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove provided in the sixth insulating layer 1016.
  • the material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t.
  • a seventh insulating layer 1017 is provided on the sixth insulating layer 1016.
  • a groove 1017a is provided in the seventh insulating layer 1017 so that a portion of the bottom conductor layer 1011b is exposed.
  • an underlying conductor layer 1121e1 is provided on the seventh insulating layer 1017 and in the groove 1017a.
  • the material of the underlying conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.
  • the entire laminate is sintered in a high-temperature (e.g., 500°C or higher) furnace.
  • the first to seventh insulating layers 1011-1017 are sintered to form the base body 10
  • the top conductor layer 1011t is sintered to form the top wiring 11t
  • the bottom conductor layer 1011b is sintered to form the bottom wiring 11b
  • the first through conductor layers 1131-1133 of the first to third layers are sintered to form the first through wiring 13
  • the second through conductor layers 1141-1143 of the first to third layers are sintered to form the second through wiring 14
  • the base conductor layer 1121e1 is sintered to form the base layer 121e1.
  • the strength can be improved by sintering the insulating layers, and the conductor layers are sintered to volatilize unnecessary resin components contained in the conductor layers and fuse the conductor material contained in the conductor layers to achieve high conductivity.
  • the base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before or after sintering, or may be chemically removed by etching or the like before or after sintering.
  • the chip is cut into individual pieces along cut lines C.
  • a plating layer 121e2 is formed by barrel plating so as to cover the base layer 121e1, forming a first external electrode 121. In this way, the inductor component 1 is manufactured as shown in FIG. 2.
  • Fig. 6A is a view showing a first modified example of an inductor component corresponding to the II-II cross section of Fig. 1.
  • the first through wire 13 and the second through wire 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This makes it possible to increase the distance between the first through wire 13 and the second through wire 14, thereby making it possible to increase the inner diameter of the coil 110 and improve the Q value.
  • the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction.
  • the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the center in the Z direction.
  • the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 and the second through wiring 14 are each formed by stacking multiple conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.
  • FIG. 6B is a view showing a second modified example of the inductor component, corresponding to the cross section taken along line II-II in Fig. 1.
  • the first through wire 13 and the second through wire 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This makes it possible to increase the distance between the first through wire 13 and the second through wire 14, thereby making it possible to increase the inner diameter of the coil 110 and improve the Q value.
  • the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top wiring 11t in the Z direction.
  • the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 as far as the top wiring 11t in the Z direction.
  • the coil 110 has a trapezoidal shape when viewed from the axis AX direction.
  • FIG. 6C is a view showing a third modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1.
  • an inductor component 1C of the third modified example includes a first coil 110A and a second coil 110B, as compared with the inductor component 1A of the first modified example shown in Fig. 6A.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.
  • the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1A of the first modified example.
  • the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction.
  • the first through wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 is formed by stacking multiple conductor layers, the conductor layers of each layer are stacked with a shift, so that the first through wiring 13 can be easily formed in a stepped shape.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.
  • the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1A of the first modified example.
  • the first through wiring 13 has a linear shape parallel to the Z direction.
  • the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction.
  • the second through wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through wiring 14 is formed by stacking multiple conductor layers, the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.
  • FIG. 6D is a view showing a fourth modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1.
  • an inductor component 1D of the fourth modified example includes a first coil 110A and a second coil 110B, as compared with the inductor component 1B of the second modified example shown in Fig. 6B.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.
  • the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1B of the second modified example.
  • the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t side.
  • the first through wiring 13 and the second through wiring 14 can be formed in a linear shape and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.
  • the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1B of the second modified example.
  • the first through wiring 13 has a linear shape parallel to the Z direction.
  • the second through wiring 14 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t.
  • FIG. 7 is a schematic bottom view showing a second embodiment of an inductor component as viewed from the bottom side.
  • the external electrodes are drawn with two-dot chain lines for convenience.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the second end face side of the element body is omitted for convenience.
  • the second embodiment differs from the first embodiment in the configuration of the via portion of the external electrode, and this different configuration will be described below. The other configurations are the same as those of the first embodiment, and description thereof will be omitted.
  • the first external electrode 121E has a via portion 121vE that is connected to the coil 110, and the via portion 121vE is connected to the first wide coil wiring 11w1, and the area of the contact surface CF1 with the via portion 121vE in the first wide coil wiring 11w1 is larger than the area of the contact surface CF2 with the first through wiring 13 in the narrow bottom wiring 11nb and the narrow top wiring 11nt.
  • the first external electrode 121E has a single via portion 121vE.
  • the via portion 121vE is connected to the end of the first wide coil wiring 11w1 on the second side surface 100s2 side.
  • the shape of the via portion 121vE is an ellipse with a major axis parallel to the Y direction.
  • the area of the contact surface CF1 between the first wide coil wiring 11w1 and the via portion 121vE is larger than the area of the contact surface CF2 between the narrow bottom wiring 11nb and the first through wiring 13. This configuration can improve the connection strength between the first external electrode 121E and the first wide coil wiring 11w1.
  • the via portion of the second external electrode 122 may have a similar configuration to the via portion 121vE, and has the same effect as the above-mentioned via portion 121vE.
  • FIG. 8 is a schematic bottom view showing the third embodiment of the inductor component as viewed from the bottom side.
  • FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8.
  • the external electrodes are drawn with two-dot chain lines for convenience.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the second end surface side of the element body is omitted for convenience.
  • the third embodiment differs from the first embodiment in that there is no wide coil wiring on the bottom wiring side and in the thickness of the wide coil wiring on the top wiring side, and this different configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and their description will be omitted.
  • the thickness of the third wide coil wiring 11w3 is thinner than the thickness of the narrow bottom wiring 11nb and the narrow top wiring 11nt.
  • the bottom wiring 11b located closest to the first end surface 100e1 is not a wide coil wiring.
  • This bottom wiring 11b extends linearly in a direction parallel to the narrow bottom wiring 11nb.
  • the wiring width of this bottom wiring 11b is the same as the wiring width of the narrow bottom wiring 11nb.
  • the thickness of this bottom wiring 11b in the Z direction is the same as the thickness of the narrow bottom wiring 11nb in the Z direction.
  • the Z-direction thickness t2 of the third wide coil wiring 11w3 is thinner than the Z-direction thickness t1 of the bottom wiring 11b located closest to the first end face 100e1.
  • the Z-direction thickness t2 of the third wide coil wiring 11w3 is thinner than the Z-direction thickness of the narrow bottom wiring 11nb (not shown). Note that it is sufficient that the thickness t2 of the third wide coil wiring 11w3 is thinner than the thickness of at least one of the multiple narrow bottom wirings 11nb and the multiple narrow top wirings 11nt.
  • the third wide coil wiring 11w3 has a relatively large maximum width in the axial direction AX, so that an increase in electrical resistance can be suppressed even if the thickness is reduced. Therefore, with the above configuration, the electrical resistance of the entire coil 110F can be reduced compared to conventional methods, and a thin inductor component 1F can be realized.
  • the first external electrode 121 is provided on the bottom surface 100b of the element body 10, and the wide coil wiring is included only in the multiple top surface wirings 11t.
  • the distance between the wide coil wiring and the first external electrode 121 can be increased compared to when the wide coil wiring is included in the multiple bottom surface wirings 11b. This reduces the parasitic capacitance between the wide coil wiring and the first external electrode 121, and increases the self-resonant frequency (SRF).
  • the second external electrode 122 may be provided on the bottom surface 100b of the element body 10, and the wide coil wiring may be included only in the multiple top surface wirings 11t.
  • the wide coil wiring is included in only one of the first group consisting of multiple bottom wirings 11b and the second group consisting of multiple top wirings 11t, and the thickness of all the coil wirings in the group that includes the wide coil wiring out of the first and second groups is thinner than the thickness of all the coil wirings in the group that does not include the wide coil wiring.
  • This configuration makes it possible to realize a thinner inductor component 1F.
  • FIG. 10 is a schematic bottom view showing the fourth embodiment of the inductor component as viewed from the bottom side.
  • the external electrodes are drawn with two-dot chain lines.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the second end surface side of the element body is omitted.
  • the fourth embodiment differs from the third embodiment in the configuration of the first through wiring connected to the wide coil wiring, and this different configuration will be described below. The other configurations are the same as those of the third embodiment, and the description thereof will be omitted.
  • the first wide coil wiring 11w1 is connected to the first through wiring 13G, and the area of the contact surface CF3 of the first wide coil wiring 11w1 with the first through wiring 13G is larger than the area of the contact surface CF4 of the narrow bottom wiring 11nb and the narrow top wiring 11nt with the first through wiring 13.
  • the first through wiring 13G located closest to the first end face 100e1 is connected to the end of the first wide coil wiring 11w1 on the first side face 100s1 side.
  • the shape of the first through wiring 13G is an ellipse with a major axis parallel to the X direction.
  • the area of the contact surface CF3 between the first wide coil wiring 11w1 and the first through wiring 13G is larger than the area of the contact surface CF4 between the narrow bottom wiring 11nb and the first through wiring 13.
  • the electrical resistance of the first through wiring 13G connected to the first wide coil wiring 11w1 can be reduced below the electrical resistance of the other first through wirings 13.
  • the electrical resistance of the entire coil 110G can be reduced compared to the conventional case.
  • the second through wiring connected to the second wide coil wiring 11w2 may have a configuration similar to that of the first through wiring 13G, and has the same effect as the first through wiring 13G described above.
  • FIG. 11 is a schematic bottom view showing the fifth embodiment of the inductor component as viewed from the bottom side.
  • FIG. 12 is a cross-sectional view taken along the line XII-XII of FIG. 11.
  • the external electrodes are drawn by two-dot chain lines for convenience.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the second end surface side of the element body is omitted for convenience.
  • the fifth embodiment differs from the third embodiment in the configuration of the first through wiring connected to the wide coil wiring, and this different configuration will be described below. The other configurations are the same as those of the third embodiment, and their description will be omitted.
  • a first end face EF1 in the extension direction of the first through wiring 13H is connected to the top surface wiring 11t.
  • the first end face EF1 is the end face of the first through wiring 13H on the top surface 100t side.
  • a second end face EF2 in the extension direction of the first through wiring 13H is connected to the bottom surface wiring 11b.
  • the second end face EF2 is the end face of the first through wiring 13H on the bottom surface 100b side.
  • the third wide coil wiring 11w3 is connected to the first end face EF1.
  • the area of the first end face EF1 is larger than the area of the second end face EF2.
  • the first through wiring 13H located closest to the first end face 100e1 has a stepped side such that the width in the X direction increases stepwise from the bottom face 100b toward the top face 100t in a cross section including the extension direction of the first through wiring 13H. Therefore, the area of the first end face EF1 is larger than the area of the second end face EF2.
  • the electrical resistance of the first through wiring 13H connected to the third wide coil wiring 11w3 can be reduced below the electrical resistance of the other first through wirings 13.
  • the electrical resistance of the entire coil 110H can be reduced compared to the conventional case.
  • the shape of the first through wiring 13H does not have to be stepped, so long as the area of the first end face EF1 is larger than the area of the second end face EF2.
  • the side of the first through wiring 13H may be linear, curved, or a combination of these, so that the width in the X direction increases from the bottom face 100b toward the top face 100t in a cross section including the center line of the first through wiring 13H.
  • the area of the cross section perpendicular to the extension direction of the first through wiring 13H may increase continuously or stepwise from the second end face EF2 toward the first end face EF1.
  • the second through-hole wiring located closest to the second end face 100e2 may have the same configuration as the first through-hole wiring 13H and has the same effect as the first through-hole wiring H described above.
  • FIG. 13 is a schematic bottom view showing the sixth embodiment of the inductor component as viewed from the bottom side.
  • FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. 13.
  • the insulating layer is omitted, and the external electrodes are drawn by two-dot chain lines.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the sixth embodiment differs from the first embodiment mainly in the position of the coil axis, the configuration of the wide coil wiring, the direction of the through wiring, the material of the element body, and the provision of the insulating layer, and these different configurations will be mainly described below.
  • the other configurations are the same as those of the first embodiment, and their description will be omitted.
  • each part (inductor component 1I) 13, in the inductor component 1I the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the element body 10 in the X direction. This can reduce the interference with the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, thereby improving the efficiency of obtaining inductance.
  • the length of coil 110 in the axial direction AX is shorter than the inner diameter of coil 110. This allows the coil length to be short and the coil inner diameter to be large, improving the Q value.
  • the inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of the region surrounded by coil 110 when viewed through the axial direction AX.
  • the element body 10 is an inorganic insulator.
  • the material of the element body 10 is preferably glass, which has high insulating properties and can suppress eddy currents and increase the Q value.
  • the element body 10 preferably contains silicon, which provides high thermal stability of the element body 10 and therefore can suppress fluctuations in dimensions of the element body 10 due to heat and reduce variations in electrical characteristics.
  • the element body 10 is preferably a single-layer glass plate. This ensures the strength of the element body 10. Furthermore, in the case of a single-layer glass plate, the dielectric loss is small, so the Q value at high frequencies can be increased. Furthermore, since there is no sintering process as in the case of sintered bodies, deformation of the element body 10 during sintering can be suppressed, which suppresses pattern misalignment, making it possible to provide an inductor component with a small inductance tolerance.
  • the material of the single-layer glass plate is preferably a photosensitive glass plate such as Foturan II (registered trademark of Schott AG).
  • the single-layer glass plate preferably contains cerium oxide (ceria: CeO 2 ), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.
  • the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry/wet etching using a photoresist/metal mask, laser processing, etc., it may be a glass plate that does not have photosensitivity.
  • the single-layer glass plate may be made by sintering a glass paste, or may be formed by a known method such as the float method.
  • the inductor component 1I has an insulator 22.
  • the insulator 22 covers both the bottom surface 100b and the top surface 100t of the element body 10. Note that the insulator 22 may be provided only on the bottom surface 100b out of the bottom surface 100b and the top surface 1100t.
  • the insulator 22 is a member that covers the wiring (bottom wiring 11b, top wiring 11t) to protect the wiring from external forces, prevent damage to the wiring, and improve the insulation of the wiring.
  • the insulator 22 is preferably an organic insulator.
  • the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form.
  • the insulator 22 is preferably made of a material with a low dielectric constant, which can reduce the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 when the insulator 22 is present between the coil 110 and the external electrodes 121 and 122.
  • the insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or by applying a paste-like resin and thermally curing it.
  • the insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulation properties and thin film forming properties.
  • the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b.
  • the organic insulator is easily given fluidity, and when the wiring (bottom surface wiring 11b, top surface wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wirings, improving insulation.
  • the organic insulator since the organic insulator is not in contact with the outer surface of the mechanical insulator, the load on the organic insulator can be reduced when singulating into individual inductor components, and deformation and peeling of the organic insulator can be suppressed.
  • the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction. The bottom wirings 11b are arranged in parallel along the Y direction. In this embodiment, the wiring width of each bottom wiring 11b is the same, and the coil wirings located at both ends of the axis AX direction among the bottom wirings 11b are not wide coil wirings.
  • the multiple top surface wirings 11t are composed only of wide coil wirings. Specifically, the multiple top surface wirings 11t are composed of a fifth wide coil wiring 11w5 arranged on the second side surface 100s2 side of the element body 10, and a sixth wide coil wiring 11w6 arranged on the first side surface 100s1 side of the element body 10.
  • the fifth wide coil wiring 11w5 is approximately triangular in shape with its width in the axial AX direction narrowing from the first end surface 100e1 side of the element body 10 toward the second end surface 100e2 side when viewed from the Z direction.
  • the sixth wide coil wiring 11w6 is approximately triangular in shape with its width in the axial AX direction narrowing from the second end surface 100e2 side of the element body 10 toward the first end surface 100e1 side when viewed from the Z direction.
  • the first through wiring 13 is disposed on the first end face 100e1 side with respect to the axis AX within the through hole V of the element body 10
  • the second through wiring 14 is disposed on the second end face 100e2 side with respect to the axis AX within the through hole V of the element body 10.
  • the first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t.
  • the multiple first through wirings 13 and the multiple second through wirings 14 are each disposed in parallel along the Y direction.
  • FIG. 15 is an enlarged view of a portion of FIG. 13. Specifically, FIG. 15 is an enlarged view of the fifth wide coil wiring 11w5 and the narrow bottom wiring 11nb. As shown in FIG. 15, the maximum width W5 in the axial direction of the fifth wide coil wiring 11w5 is greater than the maximum width W6 in the axial direction of the narrow bottom wiring 11nb. The same is true for the sixth wide coil wiring 11w6. That is, the maximum width in the axial direction of the sixth wide coil wiring 11w6 is greater than the maximum width W6 in the axial direction of the narrow bottom wiring 11nb.
  • the multiple top surface wiring 11t is composed only of wide coil wiring, the electrical resistance of the entire coil 110 can be reduced compared to conventional inductor components with a small number of turns.
  • the wide coil wiring is included in only one of the first group consisting of multiple bottom wirings 11b and the second group consisting of multiple top wirings 11t, and when viewed from a direction perpendicular to the bottom surface 100b, the ratio of the total area of all the coil wirings in the first and second groups that include the wide coil wiring to the area of the bottom surface 100b is greater than the ratio of the total area of all the coil wirings in the group that does not include the wide coil wiring.
  • the coil 110 includes the fifth wide coil wiring 11w5 and the sixth wide coil wiring 11w6 as the wide coil wiring, and the fifth wide coil wiring 11w5 and the sixth wide coil wiring 11w6 are included only in the second group of the first and second groups.
  • the ratio of the total area of all the top surface wirings 11t i.e., the fifth wide coil wiring 11w5 and the sixth wide coil wiring 11w6 in the second group to the area of the bottom surface 100b is greater than the ratio of the total area of all the bottom surface wirings 11b in the first group to the area of the bottom surface 100b.
  • the ratio of the total area of all the top surface wirings 11t is 70.5%
  • the ratio of the total area of all the bottom surface wirings 11b is 55.7%.
  • each top wiring 11 can be considered to have a shape that is slightly inclined in the Y direction and extends linearly in the X direction. In this case, the number of turns is approximately 2 turns, and the above ratio is smaller than when the multiple top wirings 11t include wide coil wiring.
  • the above configuration makes it possible to increase the above ratio compared to when the multiple top wirings 11t do not include wide coil wiring while ensuring the number of turns of approximately 2 turns.
  • copper foil 2001 is provided on a base substrate 2000 by printing.
  • the material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.
  • a glass substrate 2010 that will become the element body 10 is provided on a base substrate 2000.
  • the base substrate 2000 and the glass substrate 2010 are attached to each other using a jig such as conductive tape, pins, or a frame.
  • the glass substrate 2010 has a through hole V.
  • the glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate.
  • a TGV substrate is a substrate in which a through hole has been formed in advance by a laser, photolithography, or the like.
  • the glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be something else.
  • Ti/Cu or other necessary conductive materials may be deposited in advance as a seed on the surface of the glass substrate 2010 by sputtering or the like.
  • a first through conductor layer 2013 that will become the first through wiring 13 is formed in the through hole V of the glass substrate 2010.
  • a second through conductor layer that will become the second through wiring 14 is similarly formed in the through hole V.
  • electrolytic plating is performed in the through hole V of the glass substrate 2010 to form the first through conductor layer 2013.
  • a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through hole V by sputtering or the like, and a through conductor layer may be formed by known methods such as filled plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portions are removed by polishing, CMP, wet etching (etch-back), or dry etching.
  • the base substrate 2000 is peeled off from the glass substrate 2010.
  • the base substrate 2000 may be removed mechanically by grinding or the like, or may be removed chemically by etching or the like.
  • a bottom conductor layer 2011b that will become the bottom wiring 11b and a top conductor layer 2011t that will become the top wiring 11t are formed on a glass substrate 2010.
  • a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer.
  • a copper layer is formed by electrolytic plating on the seed layer in the openings of the photoresist.
  • the photoresist and seed layer are removed by wet etching or dry etching. This forms the bottom conductor layer 2011b and the top conductor layer 2011t that are patterned into any shape.
  • the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.
  • insulating layers 2022 that become insulators 22 are provided on the top and bottom surfaces of glass substrate 2010 so as to cover the conductor layers.
  • bottom-side insulating layer 2022 and top-side insulating layer 2022 may be formed one at a time, or both may be formed simultaneously.
  • holes 2022a are provided on bottom conductor layer 2011b of bottom-side insulating layer 2022 using photolithography or laser processing.
  • a first external electrode conductor layer 2121 that will become the first external electrode 121 is provided on the bottom insulating layer 2022.
  • the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b through the hole 2022a.
  • a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and a Ni, Au plating layer is formed by electroless plating.
  • a patterned photoresist is formed on the plating layer. The plating layer in the opening of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned into an arbitrary shape.
  • a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer.
  • the seed layer in the opening of the photoresist is removed by wet etching or dry etching.
  • a Ni, Au plating layer may be formed on the remaining seed layer by electroless plating.
  • a second external electrode conductor layer that will become the second external electrode 122 is similarly provided on the bottom insulating layer 2022.
  • the first external electrode conductor layer 2121 is formed to follow the shape of the upper surface of the bottom-side insulating layer 2022, so that the upper surface of the first external electrode conductor layer 2121 has a depression in the area that overlaps with the hole 2022a. Note that the upper surface of the first external electrode conductor layer 2121 may be formed to be flat.
  • the chip is cut into individual pieces along cut lines C. This produces inductor component 1I as shown in FIG. 14.
  • Modification (First Modification) 17A is a view showing a first modified example of the inductor component, corresponding to the XIV-XIV cross section of FIG. 13.
  • the first external electrode 121 is connected to the first through wire 13, not to the bottom wiring 11b. That is, the first end of the first through wire 13 is connected to the first external electrode 121, and the second end of the first through wire 13 is connected to the fifth wide coil wiring 11w5. This makes it possible to easily connect the coil to the first external electrode 121 even if the number of turns of the coil is changed.
  • the second external electrode 122 may be connected to the second through wire 14, not to the bottom wiring 11b.
  • FIG. 17B is a view showing a second modified example of the inductor component, corresponding to the XIV-XIV cross section of Fig. 13.
  • the first through wiring 13 extends in a direction perpendicular to the bottom wiring 11b, and the cross-sectional area of each of the two end portions 13e in the extending direction of the first through wiring 13 is larger than the cross-sectional area of the central portion 13m in the extending direction of the first through wiring 13. That is, in the cross section along the extending direction of the first through wiring 13, the width in the direction perpendicular to the extending direction of the first through wiring 13 increases continuously from the central portion 13m toward the two end portions 13e.
  • the cross-sectional area of one end 13e of the first through-hole wiring 13 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13.
  • the cross-sectional area of at least one end of the second through-hole wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13.
  • Fig. 17C is a view showing a third modified example of an inductor component corresponding to the XIV-XIV cross section of Fig. 13.
  • the first through wiring 13 has a conductive layer 13s located on the outer periphery side as viewed from the extending direction of the first through wiring 13, and a non-conductive layer 13u located inside the conductive layer 13s.
  • current mainly flows through the surface of the first through wiring 13 due to the skin effect, so that the Q value is not lowered by providing the conductive layer 13s on the outer periphery side.
  • the non-conductive layer 13u on the inner side stress can be alleviated, and the manufacturing cost can be reduced by not using a conductor.
  • a seed layer is provided on the inner surface of the through hole V of the element body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electrolytic plating. In this way, multiple conductive layers 13s such as Ti/Cu/electrolytic Cu or Pd/electroless Cu/electrolytic Cu can be formed on the outer periphery of the first through wiring 13. After that, the inside of the conductive layer 13s is sealed with resin by printing or heat pressing to form a non-conductive layer 13u made of resin. In this way, stress can be relieved by the non-conductive layer 13u inside the first through wiring 13 while current flows through the surface (conductive layer 13s) of the first through wiring 13.
  • the second through-hole wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through-hole wiring 14 extends, and a non-conductive layer located inside the conductive layer.
  • the multiple bottom wirings and the multiple top wirings included two or more wide coil wirings, but it is sufficient that at least one wide coil wiring is included.
  • the thickness of the third wide coil wiring was relatively thin, but if the coil includes other wide coil wirings, such as the first wide coil wiring, the second wide coil wiring, and the fourth wide coil wiring, the thickness of these other wide coil wirings may be relatively thin.
  • the bottom wiring located closest to the first end surface of the element body was not wide coil wiring, and the top wiring located closest to the first end surface of the element body was wide coil wiring, but the bottom wiring located closest to the first end surface of the element body may be wide coil wiring, and the top wiring located closest to the first end surface of the element body may not be wide coil wiring.
  • the first through wiring located closest to the first end surface of the element body may have an end face area on the bottom wiring side larger than the end face area on the top wiring side. The same applies to the second through wiring located closest to the second end surface of the element body.
  • the multiple top surface wirings were composed only of wide coil wiring, but the multiple bottom surface wirings may be composed only of wide coil wiring. In this case, the multiple top surface wirings do not need to include wide coil wiring.
  • the present disclosure includes the following aspects. ⁇ 1> an element body including a first main surface and a second main surface opposed to each other; a coil provided on the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with The axis of the coil is disposed parallel to the first major surface;
  • the coil is a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis; a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on an opposite side of the axis from the first through wiring, and
  • ⁇ 2> The inductor component according to ⁇ 1>, wherein the wide coil wiring has a maximum width in the axial direction that is greater than the maximum width in the axial direction of all of the inner coil wirings.
  • the first external electrode is provided on the first main surface of the element body, The inductor component according to ⁇ 1> or ⁇ 2>, wherein the wide coil wiring is included only in the plurality of first coil wirings.
  • the first external electrode is provided on the first main surface of the element body, The inductor component according to ⁇ 1> or ⁇ 2>, wherein the wide coil wiring is included only in the plurality of second coil wirings.
  • ⁇ 5> An inductor component according to any one of ⁇ 1> to ⁇ 4>, wherein the axial width of the wide coil wiring is not constant in a direction perpendicular to the axial direction.
  • the first external electrode has a via portion connected to the coil, the via portion is connected to the wide coil wiring,
  • the first external electrode has a plurality of via portions connected to the coil;
  • the wide coil wiring is included in only one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings
  • a ratio of a total area of the plurality of first coil wirings to an area of the first main surface is 50% or more and 95% or less
  • the wide coil wiring is included in at least one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings, When viewed from a direction perpendicular to the first main surface, An inductor component described in any one of ⁇ 1> to ⁇ 11>, wherein a ratio of a total area of all coil wirings in the group including the wide coil wiring among the first group and the second group to an area of the first main surface is 65% or more.
  • the wide coil wiring is included in only one of a first group consisting of the plurality of first coil wirings and a second group consisting of the plurality of second coil wirings, When viewed from a direction perpendicular to the first main surface, An inductor component described in any one of ⁇ 1> to ⁇ 12>, wherein a ratio of a total area of all coil wirings in a group including the wide coil wiring among the first and second groups to an area of the first main surface is greater than a ratio of a total area of all coil wirings in a group not including the wide coil wiring to an area of the first main surface.
  • the wide coil wiring is included in both the plurality of first coil wirings and the plurality of second coil wirings.
  • the wide coil wiring has a corner portion on a radially outer side of the coil and on a central side of the element body along the axial direction,
  • ⁇ 16> When viewed from a direction perpendicular to the first main surface, An inductor component described in any one of ⁇ 1> to ⁇ 15>, wherein the outer shape of the wide coil wiring has a portion that follows the outer shape of the body, and a portion that follows the outer shape of one of the first coil wiring and the second coil wiring that is adjacent to the wide coil wiring in the axial direction on the same plane as the wide coil wiring. ⁇ 17> the wide coil wiring is connected to the first through wiring, An inductor component described in any one of ⁇ 1> to ⁇ 16>, wherein the area of the contact surface of the wide coil wiring with the first through wiring is larger than the area of the contact surface of at least one of the inner coil wirings with the first through wiring.
  • a first end surface of the first through wiring in an extending direction thereof is connected to one of the first coil wiring and the second coil wiring; a second end surface of the first through wiring in an extending direction thereof is connected to the other of the first coil wiring and the second coil wiring; the wide coil wiring is connected to at least the first end surface of the first end surface and the second end surface;
  • the inductor component according to any one of ⁇ 1> to ⁇ 17>, wherein an area of the first end face is larger than an area of the second end face.

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Publication number Priority date Publication date Assignee Title
WO2012124561A1 (ja) * 2011-03-16 2012-09-20 株式会社 村田製作所 電子部品
WO2018123410A1 (ja) * 2016-12-28 2018-07-05 株式会社村田製作所 インダクタおよびｄｃ－ｄｃコンバータ
JP2022050298A (ja) * 2020-09-17 2022-03-30 株式会社村田製作所 インダクタ部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012124561A1 (ja) * 2011-03-16 2012-09-20 株式会社 村田製作所 電子部品
WO2018123410A1 (ja) * 2016-12-28 2018-07-05 株式会社村田製作所 インダクタおよびｄｃ－ｄｃコンバータ
JP2022050298A (ja) * 2020-09-17 2022-03-30 株式会社村田製作所 インダクタ部品

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