WO2024093585A1 - 一种显示装置 - Google Patents

一种显示装置 Download PDF

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Publication number
WO2024093585A1
WO2024093585A1 PCT/CN2023/121607 CN2023121607W WO2024093585A1 WO 2024093585 A1 WO2024093585 A1 WO 2024093585A1 CN 2023121607 W CN2023121607 W CN 2023121607W WO 2024093585 A1 WO2024093585 A1 WO 2024093585A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
display
circuit board
flexible circuit
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/121607
Other languages
English (en)
French (fr)
Inventor
杨恩建
彭星
高亮
孙浩
陈伟
都阿娟
黄小霞
黄允晖
李非凡
王永乐
吴易谦
杨虎飞
姚孟亮
曾国栋
曾乙伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/846,220 priority Critical patent/US20250212626A1/en
Publication of WO2024093585A1 publication Critical patent/WO2024093585A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display device.
  • OLEDs Flexible organic light emitting diodes
  • OLEDs are bendable and are currently widely used in electronic products such as rigid mobile phones, foldable products, and wearable products.
  • the battery capacity needs to be increased, which requires more battery installation space. How to make more room for batteries within the limited space of electronic products and increase battery capacity has become a technical problem that needs to be solved urgently.
  • the present disclosure provides a display device, and the specific scheme is as follows:
  • the present disclosure provides a display device, comprising:
  • the display panel comprises a display area and a non-display area bent to the back of the display area, and the driving chip is bound and connected to the display panel in the non-display area;
  • the flexible circuit board comprises a binding area bound to the non-display area, and a first flat area, a bending area, and a second flat area sequentially arranged in a direction away from the binding area; the flexible circuit board is located on the back of the display area, the second flat area is located between the first flat area and the display area, and at least a part of the surface of one side of the second flat area close to the display area is provided with The first electromagnetic shielding layer.
  • the first flat area and the driving chip are located on both sides of the binding area.
  • the first flat area and the driving chip are located on the same side of the binding area.
  • the flexible circuit board is provided with an opening penetrating the second flat area along a direction from the first flat area to the second flat area, the opening is used to accommodate the driving chip, and the first electromagnetic shielding layer is arranged around the driving chip.
  • the flexible circuit board includes a base layer, a first conductive layer, a first covering film and a shielding film arranged in sequence on a first surface of the base layer, and a second conductive layer and a second covering film arranged in sequence on a second surface of the base layer; the second conductive layer is bound and connected to the display panel, and a portion of the shielding film located in the second flat area is reused as the first electromagnetic shielding layer.
  • a second electromagnetic shielding layer is provided on at least part of the surface of the first flat area facing away from the display area, and a portion of the shielding film located in the first flat area is reused as the second electromagnetic shielding layer.
  • the thickness of the bending zone is smaller than the thickness of the first flat zone, and smaller than the thickness of the second flat zone.
  • the shielding film, the first conductive layer and the second conductive layer are hollowed out in the bending area.
  • a heat dissipation structure is further included on the back side of the display area, and the flexible circuit board is arranged on a side of the heat dissipation structure away from the display area.
  • it also includes a first back glue located between the first flat area and the second flat area, and a second back glue located on the surface of the first electromagnetic shielding layer on one side close to the display area.
  • the flexible circuit board is separated from the heat dissipation structure by the second adhesive.
  • One side surface of the display area is fixedly connected.
  • the flexible circuit board when the first flat area and the driving chip are located on the same side of the binding area, the flexible circuit board is fixedly connected to a surface of the non-display area facing away from the display area through the second adhesive.
  • FIG. 1 is a schematic diagram of a structure of a flexible OLED display module in the related art
  • FIG2 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG3 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG4 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG5 is an enlarged schematic diagram of one structure of area Q in FIG2 ;
  • FIG6 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG7 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG8 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG9 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure.
  • FIG. 10 is a flow chart of a method for manufacturing a display device provided in an embodiment of the present disclosure.
  • the distance value from the non-bound side of the MFPC 01 to the lower border of the display module is relatively large, which often includes the extended length of the MFPC 01, the safe distance between the bound side of the MFPC 01 and the integrated circuit (IC) chip 03 bound to the panel 02, the width of the IC chip 03 and the width of the lower border of the display module, thereby occupying the space of the whole machine; on the other hand, because the IC chip 03 is exposed to the outside, external interference can easily affect the IC chip 03, thereby affecting the working performance of the display module.
  • IC integrated circuit
  • an embodiment of the present disclosure provides a display device for saving the space of the entire device while taking into account the electromagnetic protection effect.
  • an embodiment of the present disclosure provides a display device, which includes:
  • Display panel 10 flexible circuit board 20 and driving chip 30;
  • the display panel 10 includes a display area A and a non-display area B bent to the back of the display area A, and the driving chip 30 is bound and connected to the flexible circuit board 20 in the non-display area B;
  • the flexible circuit board 20 includes a binding area C1 bound to the non-display area B, and a first flat area C2, a bending area C3 and a second flat area C4 arranged in sequence along a direction away from the binding area C1; the flexible circuit board 20 is located on the back of the display area A, the second flat area C4 is located between the first flat area C2 and the display area A, and a first electromagnetic shielding layer 40 is provided on at least a portion of the surface of the second flat area C4 on one side close to the display area A.
  • the display panel 10 includes a display area A and a non-display area B bent to the back of the display area A, wherein one of the distribution situations of the display area A and the non-display area B may be as shown in FIG. 2.
  • the driver chip 30 is bound and connected to the display panel 10 in the non-display area B, and specifically, the driver chip 30 is bound and connected to the surface of the non-display area B of the display panel 10 away from the display area A.
  • the flexible circuit board 20 includes a binding area C1 bound to the non-display area B, and a The first flat area C2, the bending area C3, and the second flat area C4 are sequentially arranged in the direction away from the binding area C1.
  • FIG. 1 One distribution of the binding area C1, the first flat area C2, the bending area C3, and the second flat area C4 is shown in FIG2.
  • the distribution of the display area A, the non-display area B, the binding area C1, the first flat area C2, the bending area C3, and the second flat area C4 can also be arranged according to actual application needs, which is not limited here.
  • the flexible circuit board 20 is located on the back of the display area A. Specifically, the electrical connection between the display panel 10 and the flexible circuit board 20 is ensured by binding the binding area C1 with the side of the non-display area B away from the display area A.
  • the display panel 10 and the flexible circuit board 20 can be connected together by a board to board (BTB) connector, a zero insertion force (Zero Insertion Force, ZIF) connector and a FOF binding.
  • BTB board to board
  • ZIF Zero Insertion Force
  • FOF field insertion force
  • the electrical connection between the display panel 10 and the flexible circuit board 20 can be achieved by using a contact pad connection method of solder.
  • the connection method between the display panel 10 and the flexible circuit board 20 can also be set according to actual application needs, which is not limited here.
  • the flexible circuit board 20 can be bent at an appropriate position, and in the bent flexible circuit board 20, the second flat area C4 is located between the first flat area C2 and the display area A.
  • the flexible circuit board 20 of the display device in the embodiment of the present disclosure is folded back to the back of the display area A, thereby reducing the numerical value of the outer boundary of the flexible circuit board 20 away from the non-display area B from the lower frame of the display panel 10, saving the whole machine space of the display device, and providing the possibility of installing a large-capacity battery.
  • at least part of the area of the side surface of the second flat area C4 close to the display area A is provided with a first electromagnetic shielding layer 40.
  • the entire area of the side surface of the second flat area C4 close to the display area A is provided with the first electromagnetic shielding layer 40.
  • the first electromagnetic shielding layer 40 is provided on part of the side surface of the second flat area C4 close to the display area A. In this way, the interference of external electromagnetic signals is effectively avoided by the first electromagnetic shielding layer 40, the electrostatic protection capability of the display device is improved, and the performance of the display device is guaranteed. In this way, the space of the whole machine can be saved while the electromagnetic protection effect can be taken into account.
  • the driving chip 30 and the flexible circuit board 20 may be arranged in the following manner.
  • the first flat area C2 and the driving chip 30 are located on both sides of the binding area C1.
  • the first flat area C2 and the driving chip 30 are located on both sides of the binding area C1, and the display panel 10 and the flexible circuit board 20 can be bound together by forward bonding.
  • the distance from the outer boundary of the flexible circuit board 20 away from the non-display area B to the lower border of the display panel 10 is shown as E in FIG. 2 .
  • E is significantly smaller than D, thereby saving the overall space of the display device and providing the possibility of installing a large-capacity battery.
  • the first flat area C2 and the driving chip 30 are located on the same side of the binding area C1 .
  • the first flat area C2 and the driving chip 30 are located on the same side of the binding area C1, and the display panel 10 and the flexible circuit board 20 can be bound together by reverse bonding.
  • the distance value from the outer boundary of the flexible circuit board 20 away from the non-display area B to the lower border of the display panel 10 is shown as F in FIG. 3 .
  • F is significantly smaller than D
  • F is also smaller than E, which further saves the overall space of the display device and provides the possibility of installing a large-capacity battery.
  • driver chip 30 and the flexible circuit board 20 may be arranged in other manners according to actual application requirements, which are not limited here.
  • the flexible circuit board 20 is provided with an opening 50 that passes through the second flat area C4 along the direction from the first flat area C2 to the second flat area C4, and the opening 50 is used to accommodate the driving chip 30, and the driving chip 30 is arranged around the driving chip 30.
  • the direction indicated by arrow X is the direction from the first flat area C2 to the second flat area C4. Accordingly, along the direction indicated by arrow X, the flexible circuit board 20 is provided with an opening 50 penetrating the second flat area C4, the opening 50 is used to accommodate the driver chip 30, and the first electromagnetic shielding layer 40 is arranged around the driver chip 30.
  • the driver chip 30 may be The area overlapping with the flexible circuit board 20 is avoided. In this way, on the one hand, the opening 50 provided on the flexible circuit board 20 effectively avoids the driver chip 30, thereby preventing the driver chip 30 from being damaged by physical collision and ensuring the performance of the display device.
  • the flexible circuit board 20 can be a two-layer board, so as to reduce the manufacturing cost of the flexible circuit board 20 while ensuring the bending performance of the flexible circuit board 20 .
  • the flexible circuit board 20 includes a base layer 200, a first conductive layer 201, a first covering film 202 and a shielding film 203 sequentially arranged on a first surface 2001 of the base layer 200, and a second conductive layer 204 and a second covering film 205 sequentially arranged on a second surface 2002 of the base layer 200; the second conductive layer 204 is bound and connected to the display panel 10, and the shielding film 203 is located in the second flat area C4. The portion is reused as the first electromagnetic shielding layer 40.
  • the flexible circuit board 20 includes a base layer 200, and the material of the base layer 200 can be polyimide (PI) or polyethylene terephthalate (PET). Of course, the material of the base layer 200 can also be set according to the actual application needs, which is not limited here.
  • the flexible circuit board 20 also includes a first conductive layer 201, a first covering film 202 and a shielding film 203 sequentially arranged on the first surface 2001 of the base layer 200, and a second conductive layer 204 and a second covering film 205 sequentially arranged on the second surface 2002 of the base layer 200.
  • the shielding film 203 can be one or more of conductive rubber, conductive cloth, conductive foam and conductive shielding glue. Of course, the shielding film 203 can be set according to the actual application needs, which is not limited here.
  • the materials of the first conductive layer 201 and the second conductive layer 204 can be copper foil.
  • the corresponding copper foil can be etched according to the arrangement of the required signal routing, which will not be described in detail here.
  • the first covering film 202 can prevent the first conductive layer 201 from being exposed to the air, thereby preventing the first conductive layer 201 from being corroded by water and oxygen;
  • the second covering film 205 can prevent the second conductive layer 204 from being exposed to the air, thereby preventing the second conductive layer 204 from being corroded by water and oxygen, thereby ensuring the performance of the display device.
  • the second conductive layer 204 and the flexible circuit board 20 binding connection, the portion of the shielding film 203 located in the second flat area C4 can be reused as the first electromagnetic shielding layer 40.
  • the required first electromagnetic shielding layer 40 can be prepared, thereby realizing the integration of the electromagnetic protection function of the flexible circuit board 20, thereby reducing the production cost of the display device while taking into account the electrostatic protection performance of the flexible circuit board 20.
  • the required second electromagnetic shielding layer 60 can be prepared at the same time, realizing the integration of the electromagnetic protection function of the flexible circuit board 20, thereby reducing the production cost of the display device while taking into account the electrostatic protection performance of the flexible circuit board 20.
  • the thickness of the bending area C3 is less than the thickness of the first flat area C2, and less than the thickness of the second flat area C3.
  • the flexible circuit board 20 is provided with only one first conductive layer 201 in the bending area C3.
  • the flexible circuit board 20 is provided with two film layers including the first conductive layer 201 and the second conductive layer 204 in the first flat area C2.
  • the flexible circuit board 20 is provided with two film layers including the first conductive layer 201 and the second conductive layer 204 in the second flat area C4.
  • the film layers of the bending area C3, the first flat area C2 and the second flat area C3 can also be set according to actual application needs, which is not limited here.
  • the shielding film 203, the first conductive layer 201 and the second conductive layer 204 are hollowed out in the bending area C3.
  • the corresponding schematic diagram may be as shown in FIG. 6, thereby improving the bending performance of the flexible circuit board 20.
  • the shielding film 203, the first conductive layer 201 and the second conductive layer 204 are all hollowed out in the bending area C3, further improving the bending performance of the flexible circuit board 20.
  • the display device further includes a heat dissipation structure 70 located on the back of the display area A, and the flexible circuit board 20 is arranged on a side of the heat dissipation structure 70 away from the display area A.
  • the display device further includes a heat dissipation structure 70 located on the back of the display area A, thereby ensuring the heat dissipation performance of the display device.
  • the heat dissipation structure 70 includes The heat dissipation structure 70 includes a mesh glue (Embossing, EMBO), foam (FOAM) and copper (Cu) foil, etc., which are sequentially stacked on the back of the display area A.
  • the heat dissipation structure 70 also includes a glue layer arranged on the opposite sides of the mesh glue, and a glue layer arranged between the foam and the copper foil. In this way, the heat dissipation structure 70 can block light, prevent light leakage, and shield the influence of related signals on the noise of the flexible circuit board 20, thereby improving the performance of the display device.
  • the display device further includes a first adhesive backing 80 located between the first flat area C2 and the second flat area C4 , and a second adhesive backing 90 located on the surface of the driving chip 30 close to the display area A.
  • the flexible circuit board 20 is fixedly connected to the surface of the heat dissipation structure 70 on the side away from the display area A through the second adhesive 90. In this way, the structural stability between the display panel 10 and the flexible circuit board 20 is ensured.
  • the display device provided by the embodiment of the present disclosure also includes a cover tape 100 (Cover Tape) arranged on the side of the driver chip 30 away from the display area, one end of the cover tape 100 is attached to the non-display area B, and the other end is attached to the first flat area C2, and the positive projection of the driver chip 30 in the display area A completely falls within the area of the positive projection of the cover tape 100 in the display area A, wherein the cover tape 100 is used to shield the interference of external electromagnetic signals on the driver chip 30, thereby ensuring the working performance of the driver chip 30 and improving the performance of the display device.
  • the cover tape 100 can be separately set according to the specific position of the driver chip 30.
  • the flexible circuit board 20 is fixedly connected to the surface of the non-display area B away from the display area A through the second adhesive 90. In this way, the structural stability between the display panel 10 and the flexible circuit board 20 is ensured.
  • the display device further includes at least one component 110 disposed on the surface of the first flat area C2 away from the display area A.
  • the at least one component 110 may be at least one of a resistor, a capacitor, an inductor, etc., and may be selected according to the actual application. It is necessary to set at least one component 110, which is not limited here.
  • the first electromagnetic shielding layer 40 is arranged around the driving chip 30.
  • the corresponding display device shown in Figure 9 does not need to separately set a covering tape 100 compared to the display device shown in Figure 8.
  • the shielding film 203 on the flexible circuit board 20 can be directly reused as the driving chip 30. While simplifying the preparation process, it saves the space of the entire machine and improves the protection capability of the display device.
  • the sum of the thicknesses of the first adhesive backing 80, the second flat area C4, the first electromagnetic shielding layer 40 and the second adhesive backing 90 is greater than the height of the driver chip 30, and the depth of the opening 50 is greater than the height of the driver chip 30.
  • the height of the driver chip 30 is H1
  • the depth of the opening 50 is H2
  • H2 is greater than H1.
  • the specific thicknesses of the first adhesive backing 80, the second flat area C4, the driver chip 30 and the second adhesive backing 90 can be set according to the specific thickness of the driver chip 30 in actual applications, and are not limited here.
  • the first adhesive 80 can be pre-bonded to the first flat area C2, and the second adhesive 90 can be pre-bonded to the area of the first electromagnetic shielding layer 40 located in the second flat area C4, and then the second flat area C4 is bent along the bending area C3 to the back of the first flat area C2; then, the flexible circuit board 20 of the desired bending shape is formed; in the actual preparation process, the display panel 10 and the flexible circuit board 20 can be prepared separately, thereby improving the preparation efficiency of the display device. Then, the bent flexible circuit board 20 is bound and connected to the display panel 10; then, the bound flexible circuit board 20 is bent to the back of the display panel 10, thereby obtaining the desired display device.
  • the display device provided in the embodiment of the present disclosure may include other film layer structures in addition to the film layer mentioned above.
  • the specific configuration can be implemented by referring to the relevant technology and will not be described in detail here.
  • the display device provided in the embodiment of the present disclosure may be an OLED flexible display device, and the corresponding product may be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • the components are all well understood by those skilled in the art and will not be elaborated herein and should not be construed as limiting the present disclosure.
  • the embodiment of the present disclosure further provides a method for manufacturing the display device as described above, the manufacturing method comprising:
  • S101 Binding and connecting the flexible circuit board to the display panel via the binding area
  • step S101 to step S102 may be, first, using relevant manufacturing processes to prepare the film layer patterns of the display panel 10 in the display area A and the non-display area B, and prepare the film layer patterns of the flexible circuit board 20 in each area; then, the flexible circuit board 20 is bound and connected to the display panel 10 through the binding area C1; then, the flexible circuit board 20 is bent to the back of the display area A.
  • an opening 50 penetrating the second flat area C4 needs to be opened in advance on the flexible circuit board 20 so as to allow the driver chip 30 to be opened.
  • the relevant preparation process will not be described in detail.
  • the display device includes a display panel 10, a flexible circuit board 20 and a driving chip 30; wherein the display panel 10 includes a display area A and a non-display area B bent to the back of the display area A, and the driving chip 30 is bound and connected to the display panel 10 in the non-display area B; the flexible circuit board 20 includes a binding area C1 bound to the non-display area B, and a first flat area C2, a bending area C3 and a second flat area C4 sequentially arranged in a direction away from the binding area C1; the flexible circuit board 20 is located on the back of the display area A, and the second flat area C4 is located between the first flat area C2 and the display area A.
  • the folded flexible circuit board 20 is arranged on the back of the display area A, thereby reducing the numerical value of the outer boundary of the flexible circuit board 20 away from the non-display area B from the lower frame of the display panel 10, saving the whole space of the display device, and providing the possibility of installing a large-capacity battery.
  • at least a portion of the surface of the second flat area C4 close to the display area A is provided with a first electromagnetic shielding layer 40.
  • the first electromagnetic shielding layer 40 effectively avoids interference from external electromagnetic signals, improves the electrostatic protection capability of the display device, and ensures the performance of the display device. In this way, the space of the whole device is saved while taking into account the electromagnetic protection effect.

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  • Engineering & Computer Science (AREA)
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Abstract

本公开提供了一种显示装置，显示装置包括：显示面板、柔性电路板和驱动芯片；所述显示面板包括显示区和弯折至所述显示区背面的非显示区，所述驱动芯片在所述非显示区与所述显示面板绑定连接；所述柔性电路板包括与所述非显示区绑定的绑定区，以及沿远离所述绑定区的方向依次设置的第一平坦区、弯折区和第二平坦区；所述柔性电路板位于所述显示区的背面，所述第二平坦区位于所述第一平坦区和所述显示区之间，且所述第二平坦区靠近所述显示区的一侧表面的至少部分区域设置有第一电磁屏蔽层。用于在节省整机空间的同时，兼顾电磁防护效果。

Description

一种显示装置
相关申请的交叉引用
本公开要求在2022年10月31日提交中国专利局、申请号为202211344097.9、申请名称为“一种显示装置及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，特别涉及一种显示装置。
背景技术
柔性有机发光二极管(Organic Light Emitting Diode，OLED)具有可弯折的特点，目前广泛应用于刚性手机、折叠产品和穿戴产品等电子产品。为提升电子产品的续航能力，需增大电池容量，这样的话，就需要更多的电池安装空间。如何在电子产品有限的空间内，为电池腾出更多空间，提升电池容量成为急需解决的技术问题。
发明内容
本公开提供了一种显示装置，具体方案如下：
本公开实施例提供了一种显示装置，其中，包括：
显示面板、柔性电路板和驱动芯片；
所述显示面板包括显示区和弯折至所述显示区背面的非显示区，所述驱动芯片在所述非显示区与所述显示面板绑定连接；
所述柔性电路板包括与所述非显示区绑定的绑定区，以及沿远离所述绑定区的方向依次设置的第一平坦区、弯折区和第二平坦区；所述柔性电路板位于所述显示区的背面，所述第二平坦区位于所述第一平坦区和所述显示区之间，且所述第二平坦区靠近所述显示区的一侧表面的至少部分区域设置有 第一电磁屏蔽层。
可选地，在本公开实施例中，所述第一平坦区和所述驱动芯片位于所述绑定区的两侧。
可选地，在本公开实施例中，所述第一平坦区和所述驱动芯片位于所述绑定区的同一侧。
可选地，在本公开实施例中，沿所述第一平坦区指向所述第二平坦区的方向，所述柔性电路板开设有贯穿所述第二平坦区的开孔，所述开孔用于容置所述驱动芯片，且所述第一电磁屏蔽层围绕所述驱动芯片设置。
可选地，在本公开实施例中，所述柔性电路板包括基底层、在所述基底层的第一表面上依次设置的第一导电层、第一覆盖膜和屏蔽膜，以及在所述基底层的第二表面上依次设置的第二导电层和第二覆盖膜；所述第二导电层与所述显示面板绑定连接，所述屏蔽膜位于所述第二平坦区的部分复用为所述第一电磁屏蔽层。
可选地，在本公开实施例中，所述第一平坦区背离所述显示区的一侧表面的至少部分区域设置有第二电磁屏蔽层，且所述屏蔽膜位于所述第一平坦区的部分复用为所述第二电磁屏蔽层。
可选地，在本公开实施例中，所述弯折区的厚度小于所述第一平坦区的厚度，且小于所述第二平坦区的厚度。
可选地，在本公开实施例中，所述屏蔽膜、所述第一导电层和所述第二导电层在所述弯折区呈镂空设置。
可选地，在本公开实施例中，还包括位于所述显示区背面的散热结构，所述柔性电路板设置在所述散热结构背离所述显示区的一侧。
可选地，在本公开实施例中，还包括位于所述第一平坦区和所述第二平坦区之间的第一背胶，以及位于所述第一电磁屏蔽层靠近所述显示区一侧表面的第二背胶。
可选地，在本公开实施例中，当所述第一平坦区和所述驱动芯片位于所述绑定区的两侧时，所述柔性电路板通过所述第二背胶与所述散热结构背离 所述显示区的一侧表面固定连接。
可选地，在本公开实施例中，当所述第一平坦区和所述驱动芯片位于所述绑定区的同一侧时，所述柔性电路板通过所述第二背胶与所述非显示区背离所述显示区的一侧表面固定连接。
附图说明
图1为相关技术中柔性OLED显示模组的其中一种结构示意图；
图2为本公开实施例提供的一种显示装置的其中一种结构示意图；
图3为本公开实施例提供的一种显示装置的其中一种结构示意图；
图4为本公开实施例提供的一种显示装置的其中一种结构示意图；
图5为图2中区域Q的其中一种结构放大示意图；
图6为本公开实施例提供的一种显示装置的其中一种结构示意图；
图7为本公开实施例提供的一种显示装置的其中一种结构示意图；
图8为本公开实施例提供的一种显示装置的其中一种结构示意图；
图9为本公开实施例提供的一种显示装置的其中一种结构示意图；
图10为本公开实施例提供的一种显示装置的制作方法的方法流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面 列举的元件或者物件及其等同，而不排除其他元件或者物件。
在相关技术中，为了给电池腾出更多空间，就需要尽量减少显示模组厚度和MFPC(Main Flexible Printed Circuit)01伸入主板方向的长度。以图1所示的柔性OLED显示模组为例，在将MFPC 01与面板02绑定(Bonding)后，一方面，该MFPC 01非绑定侧边到显示模组下边框(Border)的距离值(如图1中D所示)较大，该值往往包括MFPC 01延伸长度、MFPC 01绑定侧边与面板02绑定的集成电路(Integrated Circuit，IC)芯片03间的安全距离、IC芯片03的宽度以及显示模组下边框宽度，从而侵占了整机空间；另一方面，因IC芯片03裸露在外，外界干扰极易影响到IC芯片03，从而影响显示模组的工作性能。
有鉴于此，本公开实施例提供了一种显示装置，用于在节省整机空间的同时，兼顾电磁防护效果。
结合图2和图3所示，本公开实施例提供了一种显示装置，该显示装置包括：
显示面板10、柔性电路板20和驱动芯片30；
所述显示面板10包括显示区A和弯折至所述显示区A背面的非显示区B，所述驱动芯片30在所述非显示区B与所述柔性电路板20绑定连接；
所述柔性电路板20包括与所述非显示区B绑定的绑定区C1，以及沿远离所述绑定区C1方向依次设置的第一平坦区C2、弯折区C3和第二平坦区C4；所述柔性电路板20位于所述显示区A的背面，所述第二平坦区C4位于所述第一平坦区C2和所述显示区A之间，且所述第二平坦区C4靠近所述显示区A的一侧表面的至少部分区域设置有第一电磁屏蔽层40。
在具体实施过程中，显示面板10包括显示区A和弯折至显示区A背面的非显示区B，其中，显示区A和非显示区B的其中一种分布情况可以是如图2所示。此外，驱动芯片30在非显示区B与显示面板10绑定连接，具体可以是驱动芯片30与显示面板10的非显示区B背离显示区A的一侧表面绑定连接。而且，柔性电路板20包括与非显示区B绑定的绑定区C1，以及沿 远离绑定区C1的方向依次设置的第一平坦区C2、弯折区C3和第二平坦区C4。绑定区C1、第一平坦区C2、弯折区C3和第二平坦区C4的其中一种分布情况如图2所示。当然，还可以根据实际应用需要来设置显示区A、非显示区B、绑定区C1、第一平坦区C2、弯折区C3和第二平坦区C4的分布情况，在此不做限定。
仍结合图2和图3所示，柔性电路板20位于显示区A的背面，具体地，通过绑定区C1与非显示区B背离显示区A的一侧绑定连接，从而保证了显示面板10与柔性电路板20之间的电性连接。在其中一种示例性实施例中，可以通过板对板(Board to Board，BTB)连接器、零插入力(Zero Insertion Force，ZIF)连接器和FOF绑定中的一种将显示面板10与柔性电路板20连接在一起。在其中一种示例性实施例中，可以利用焊锡的接触垫连接方式，来实现显示面板10与柔性电路板20的电性连接。当然，还可以根据实际应用需要来设置显示面板10与柔性电路板20之间的连接方式，在此不做限定。
在具体实施过程中，可以针对柔性电路板20的适当位置进行弯折，弯折后的柔性电路板20中，第二平坦区C4位于第一平坦区C2和显示区A之间。相较于图1来说，本公开实施例中的显示装置的柔性电路板20被反折至显示区A的背面，从而减小了柔性电路板20背离非显示区B的外边界距离显示面板10下边框的数值大小，节省了显示装置的整机空间，为安装大容量的电池提供了可能性。此外，第二平坦区C4靠近显示区A的一侧表面的至少部分区域设置有第一电磁屏蔽层40。在其中一种示例性实施例中，可以是第二平坦区C4靠近显示区A的一侧表面的全部区域设置有第一电磁屏蔽层40。在其中一种示例性实施例中，可以是第二平坦区C4靠近显示区A的一侧表面的部分区域设置有第一电磁屏蔽层40。这样的话，通过第一电磁屏蔽层40有效避免了外界电磁信号的干扰，提高了显示装置的静电防护能力，保证了显示装置的使用性能。如此一来，在节省整机空间的同时，兼顾电磁防护效果。
在本公开实施例中，可以按照以下设置方式来设置驱动芯片30和柔性电路板20。在其中一种示例性实施例中，所述第一平坦区C2和所述驱动芯片 30位于所述绑定区C1的两侧。
仍结合图2所示，在该示例性实施例中，第一平坦区C2和驱动芯片30位于绑定区C1的两侧，且可以采用正向绑定(Bonding)的方式将显示面板10与柔性电路板20绑定在一起。在该示例性实施例中，在柔性电路板20背离非显示区B的外边界到显示面板10下边框(Border)的距离值如图2中E所示，相较于图1来说，在显示装置中各个部件的相关结构参数均相同的前提下，E明显小于D，从而节省了显示装置的整机空间，为安装大容量的电池提供了可能性。
在其中一种示例性实施例中，所述第一平坦区C2和所述驱动芯片30位于所述绑定区C1的同一侧。
仍结合图3所示，在该示例性实施例中，第一平坦区C2和驱动芯片30位于绑定区C1的同一侧，可以采用反向绑定(Bonding)的方式将显示面板10与柔性电路板20绑定在一起。在该示例性实施例中，柔性电路板20的背离非显示区B的外边界到显示面板10下边框(Border)的距离值如图3中F所示，相较于图1来说，在显示装置中各个部件的相关结构参数均相同的前提下，F明显小于D，且相较于图2来说，F还小于E，进一步地节省了显示装置的整机空间，为安装大容量的电池提供了可能性。
需要说明的是，除了可以采用图2和图3所示的方式，来设置驱动芯片30和柔性电路板20之外，还可以根据实际应用需要采用其它方式来设置，在此不做限定。
在本公开实施例中，沿所述第一平坦区C2指向所述第二平坦区C4的方向，所述柔性电路板20开设有贯穿所述第二平坦区C4的开孔50，所述开孔50用于容置所述驱动芯片30，且所述驱动芯片30围绕所述驱动芯片30设置。
结合图4所示，箭头X所示的方向为沿第一平坦区C2指向第二平坦区C4的方向。相应地，沿箭头X所示方向，柔性电路板20开设有贯穿第二平坦区C4的开孔50，该开孔50用于容置驱动芯片30，且第一电磁屏蔽层40围绕该驱动芯片30设置。在其中一种示例性实施例中，可以是在驱动芯片30 与柔性电路板20交叠的区域进行避空处理，如此一来，一方面，通过柔性电路板20上所开设的开孔50，对驱动芯片30进行了有效的避让，避免了驱动芯片30因受到物理碰撞而损伤，保证了显示装置的使用性能。
在本公开实施例中，如图5所示为图2中区域Q的其中一种结构放大示意图。在其中一种示例性实施例中，柔性电路板20可以为两层板，从而在降低柔性电路板20制作成本的同时，保证了柔性电路板20的弯折性能。在该示例性实施例中，仍结合图5所示，所述柔性电路板20包括基底层200、在所述基底层200的第一表面2001上依次设置的第一导电层201、第一覆盖膜202和屏蔽膜203，以及在所述基底层200的第二表面2002上依次设置的第二导电层204和第二覆盖膜205；所述第二导电层204与所述显示面板10绑定连接，所述屏蔽膜203位于所述第二平坦区C4的部分复用为所述第一电磁屏蔽层40。
在具体实施过程中，柔性电路板20包括基底层200，该基底层200的材料可以是聚酰亚胺(Polyimide，PI)，还可以是聚对苯二甲酸乙二醇酯(PET)，当然，还可以根据实际应用需要来设置基底层200的材料，在此不做限定。此外，柔性电路板20还包括在基底层200的第一表面2001上依次设置的第一导电层201、第一覆盖膜202和屏蔽膜203，以及在基底层200的第二表面2002上依次设置的第二导电层204和第二覆盖膜205。其中，屏蔽膜203可以是导电橡胶、导电布、导电泡棉和导电屏蔽胶中的一种或多种，当然，可以根据实际应用需要来设置屏蔽膜203，在此不做限定。
在其中一种示例性实施例中，第一导电层201和第二导电层204的材料可以为铜箔，在具体实施过程中，可以根据所需信号走线的排布，对相应铜箔进行刻蚀，在此不做详述。此外，第一覆盖膜202能够避免第一导电层201暴露在空气中，避免了第一导电层201的水氧侵蚀；第二覆盖膜205能够避免第二导电层204暴露在空气中，避免了第二导电层204的水氧侵蚀，从而保证了显示装置的使用性能。
仍结合图2和图5所示的示例性实施例，第二导电层204与柔性电路板 20绑定连接，屏蔽膜203位于第二平坦区C4的部分可以复用为第一电磁屏蔽层40，如此一来，在制备柔性电路板20的同时，便可以制备获得所需的第一电磁屏蔽层40，实现了柔性电路板20对电磁防护功能的集成，从而在兼顾柔性电路板20的静电防护性能的同时，降低了显示装置的制作成本。
在本公开实施例中，如图6所示，所述第一平坦区C2背离所述显示区A的一侧表面的至少部分区域设置有第二电磁屏蔽层60，且所述屏蔽膜203位于所述第一平坦区C2的部分复用为所述第二电磁屏蔽层60。如此一来，在制备柔性电路板20的同时，可以一并制备获得所需的第二电磁屏蔽层60，实现了柔性电路板20对电磁防护功能的集成，从而在兼顾柔性电路板20的静电防护性能的同时，降低了显示装置的制作成本。
在其中一种示例性实施例中，所述弯折区C3的厚度小于所述第一平坦区C2的厚度，且小于所述第二平坦区C3的厚度。比如，柔性电路板20在弯折区C3仅设置有一层第一导电层201。再比如，柔性电路板20在第一平坦区C2设置有第一导电层201和第二导电层204在内的两层膜层。再比如，柔性电路板20在第二平坦区C4设置有第一导电层201和第二导电层204在内的两层膜层。当然，还可以根据实际应用需要来设置弯折区C3、第一平坦区C2和第二平坦区C3的膜层情况，在此不做限定。
在其中一种示例性实施例中，所述屏蔽膜203、所述第一导电层201和所述第二导电层204在所述弯折区C3呈镂空设置。相应的示意图可以是如图6所示，从而提高了柔性电路板20的弯折性能。在其中一种示例性实施例中，屏蔽膜203、第一导电层201和第二导电层204在弯折区C3均呈镂空设置，进一步地提高了柔性电路板20的弯折性能。
在本公开实施例中，如图7所示，显示装置还包括位于所述显示区A背面的散热结构70，所述柔性电路板20设置在所述散热结构70背离所述显示区A的一侧。
仍结合图7所示，显示装置还包括位于显示区A背面的散热结构70，从而保证了显示装置的散热性能。在其中一种示例性实施例中，散热结构70包 括依次层叠设置在显示区A背面的网格胶(Embossing，EMBO)、泡棉(FOAM)和铜(Cu)箔等。此外，为了保证散热结构70各个膜层之间的贴合效果，散热结构70还包括设置在网格胶的相对两侧表面的胶材层，以及设置在泡棉和铜箔之间的胶材层。如此一来，通过该散热结构70可以遮挡光，防止漏光以及屏蔽相关信号对柔性电路板20噪声的影响，从而提高了显示装置的使用性能。
在本公开实施例中，如图8和图9所示，显示装置还包括位于所述第一平坦区C2和所述第二平坦区C4之间的第一背胶80，以及位于所述驱动芯片30靠近所述显示区A一侧表面的第二背胶90。
在其中一种示例性实施例中，仍结合图8所示，当所述第一平坦区C2和所述驱动芯片30位于所述绑定区C1的两侧时，所述柔性电路板20通过所述第二背胶90与所述散热结构70背离所述显示区A的一侧表面固定连接。如此一来，保证了显示面板10与柔性电路板20之间的结构稳定性。此外，仍结合图8所示，本公开实施例提供的显示装置还包括设置在驱动芯片30背离显示区一侧的覆盖带100(Cover Tape)，该覆盖带100一端与非显示区B贴合，其另一端与第一平坦区C2贴合，且驱动芯片30在显示区A的正投影完全落入覆盖带100在显示区A的正投影的区域范围内，其中，覆盖带100用于屏蔽外界电磁信号对驱动芯片30的干扰，从而保证了驱动芯片30的工作性能，提高了显示装置的使用性能。需要说明的是，在实际制备图8所示的显示装置的过程中，可以根据驱动芯片30的具体位置来单独设置覆盖带100。
在其中一种示例性实施例中，仍结合图9所示，当所述第一平坦区C2和所述驱动芯片30位于所述绑定区C1的同一侧时，所述柔性电路板20通过所述第二背胶90与所述非显示区B背离所述显示区A的一侧表面固定连接。如此一来，保证了显示面板10与柔性电路板20之间的结构稳定性。
在本公开实施例中，仍结合图9所示，显示装置还包括设置在所述第一平坦区C2背离所述显示区A一侧表面的至少一个元器件110。其中，至少一个元器件110可以是电阻、电容、电感等中的至少一个，可以根据实际应用 需要来设置至少一个元器件110，在此不做限定。
需要说明的是，在图9所示的示例性实施例中，第一电磁屏蔽层40围绕驱动芯片30设置，其对应的图9所示的显示装置相较于图8所示的显示装置来说，无需单独另外设置覆盖带100，可以直接复用柔性电路板20上的屏蔽膜203作为驱动芯片30，在简化制备工艺的同时，节省了整机空间并提高了显示装置的防护能力。
在具体实施过程中，仍结合图9所示，沿第一平坦区C2指向显示区A的方向，第一背胶80、第二平坦区C4、第一电磁屏蔽层40和第二背胶90的厚度总和大于驱动芯片30的高度，且开孔50的深度大于驱动芯片30的高度。仍以图9所示的示例性实施例为例，驱动芯片30的高度为H1，开孔50的深度为H2，H2大于H1。如此一来，通过开孔50有效避让驱动芯片30的同时，节省了显示装置沿厚度方向的空间，保证了显示装置的薄型化设计。当然，对于第一背胶80、第二平坦区C4、驱动芯片30和第二背胶90的具体厚度可以根据实际应用中驱动芯片30的具体厚度来设置，在此不做限定。
在制备本公开实施例提供的柔性电路板20的过程中，可以预先将第一背胶80粘接在第一平坦区C2，预先将第二背胶90粘接在第一电磁屏蔽层40位于第二平坦区C4的区域，然后，沿弯折区C3将第二平坦区C4弯折至第一平坦区C2的背面；然后，形成所需弯折形状的柔性电路板20；在实际制备过程中，可以分别制备显示面板10和柔性电路板20，从而提高了显示装置的制备效率。然后，将弯折后的柔性电路板20与显示面板10绑定连接；然后，将绑定后的柔性电路板20弯折至显示面板10的背面，从而获得所需的显示装置。
需要说明的是，本公开实施例提供的显示装置除了上述提及的膜层之外，还可以包括其它膜层结构，具体设置情况可以参照相关技术实现，在此不做详述。此外，本公开实施例提供的显示装置可以是OLED柔性显示装置，对应的产品可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少 的组成部分均为本领域的普通技术人员应该理解具有的，在此就不做赘述，也不应作为对本公开的限制。
基于同一公开构思，如图10所示，本公开实施例还提供了一种如上面所述的显示装置的制作方法，该制作方法包括：
S101：通过所述绑定区将所述柔性电路板与所述显示面板绑定连接；
S102：将所述柔性电路板弯折至所述显示区的背面。
在其中一种示例性实施例中，对于步骤S101至步骤S102的具体实现过程可以是，首先，采用相关制作工艺制备好显示面板10在显示区A和非显示区B的膜层图案，以及制备好柔性电路板20在各个区的膜层图案；然后，通过绑定区C1将柔性电路板20与显示面板10绑定连接；然后，将柔性电路板20弯折至显示区A的背面。
需要说明的是，在制备图9所示的显示装置时，需要预先在柔性电路板20上开设贯穿第二平坦区C4的开孔50，以便开窗避让驱动芯片30，相关制备工艺不再详述。
在本公开实施例提供的一种显示装置中，该显示装置包括显示面板10、柔性电路板20和驱动芯片30；其中，显示面板10包括显示区A和弯折至显示区A背面的非显示区B，驱动芯片30在非显示区B与显示面板10绑定连接；柔性电路板20包括与非显示区B绑定的绑定区C1，以及沿远离绑定区C1的方向依次设置的第一平坦区C2、弯折区C3和第二平坦区C4；该柔性电路板20位于显示区A的背面，第二平坦区C4位于第一平坦区C2和显示区A之间。也就是说，被反折的柔性电路板20设置在显示区A的背面，从而减小了柔性电路板20背离非显示区B的外边界距离显示面板10下边框的数值大小，节省了显示装置的整机空间，为安装大容量的电池提供了可能。此外，第二平坦区C4靠近显示区A的一侧表面的至少部分设置有第一电磁屏蔽层40。这样的话，通过第一电磁屏蔽层40有效避免了外界电磁信号的干扰，提高了显示装置的静电防护能力，保证了显示装置的使用性能。如此一来，在节省整机空间的同时，兼顾电磁防护效果。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (12)

  1. 一种显示装置，其中，包括：
    显示面板、柔性电路板和驱动芯片；
    所述显示面板包括显示区和弯折至所述显示区背面的非显示区，所述驱动芯片在所述非显示区与所述显示面板绑定连接；
    所述柔性电路板包括与所述非显示区绑定的绑定区，以及沿远离所述绑定区的方向依次设置的第一平坦区、弯折区和第二平坦区；所述柔性电路板位于所述显示区的背面，所述第二平坦区位于所述第一平坦区和所述显示区之间，且所述第二平坦区靠近所述显示区的一侧表面的至少部分区域设置有第一电磁屏蔽层。
  2. 如权利要求1所述的显示装置，其中，所述第一平坦区和所述驱动芯片位于所述绑定区的两侧。
  3. 如权利要求1所述的显示装置，其中，所述第一平坦区和所述驱动芯片位于所述绑定区的同一侧。
  4. 如权利要求3所述的显示装置，其中，沿所述第一平坦区指向所述第二平坦区的方向，所述柔性电路板开设有贯穿所述第二平坦区的开孔，所述开孔用于容置所述驱动芯片，且所述第一电磁屏蔽层围绕所述驱动芯片设置。
  5. 如权利要求1所述的显示装置，其中，所述柔性电路板包括基底层、在所述基底层的第一表面上依次设置的第一导电层、第一覆盖膜和屏蔽膜，以及在所述基底层的第二表面上依次设置的第二导电层和第二覆盖膜；所述第二导电层与所述显示面板绑定连接，所述屏蔽膜位于所述第二平坦区的部分复用为所述第一电磁屏蔽层。
  6. 如权利要求5所述的显示装置，其中，所述第一平坦区背离所述显示区的一侧表面的至少部分区域设置有第二电磁屏蔽层，且所述屏蔽膜位于所述第一平坦区的部分复用为所述第二电磁屏蔽层。
  7. 如权利要求6所述的显示装置，其中，所述弯折区的厚度小于所述第 一平坦区的厚度，且小于所述第二平坦区的厚度。
  8. 如权利要求6所述的显示装置，其中，所述屏蔽膜、所述第一导电层和所述第二导电层在所述弯折区呈镂空设置。
  9. 如权利要求6所述的显示装置，其中，还包括位于所述显示区背面的散热结构，所述柔性电路板设置在所述散热结构背离所述显示区的一侧。
  10. 如权利要求9所述的显示装置，其中，还包括位于所述第一平坦区和所述第二平坦区之间的第一背胶，以及位于所述第一电磁屏蔽层靠近所述显示区一侧表面的第二背胶。
  11. 如权利要求10所述的显示装置，其中，当所述第一平坦区和所述驱动芯片位于所述绑定区的两侧时，所述柔性电路板通过所述第二背胶与所述散热结构背离所述显示区的一侧表面固定连接。
  12. 如权利要求10所述的显示装置，其中，当所述第一平坦区和所述驱动芯片位于所述绑定区的同一侧时，所述柔性电路板通过所述第二背胶与所述非显示区背离所述显示区的一侧表面固定连接。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119992968A (zh) * 2025-04-02 2025-05-13 京东方科技集团股份有限公司 一种显示模组及其制备方法、显示装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115762337A (zh) * 2022-10-31 2023-03-07 京东方科技集团股份有限公司 一种显示装置及其制作方法
CN118629323A (zh) * 2023-03-08 2024-09-10 北京小米移动软件有限公司 显示屏和电子设备
CN116500829B (zh) * 2023-04-27 2025-03-21 合肥京东方瑞晟科技有限公司 一种背光模组的制作方法、背光模组及显示模组
CN116453426B (zh) * 2023-05-29 2025-12-05 厦门天马显示科技有限公司 一种显示装置
CN116645882B (zh) * 2023-05-30 2026-01-23 京东方科技集团股份有限公司 显示模组及其制备方法、显示装置
CN120730661A (zh) * 2024-03-29 2025-09-30 京东方科技集团股份有限公司 一种电路板、显示模组、显示装置以及包封方法
CN118522223B (zh) * 2024-06-21 2026-07-17 武汉华星光电半导体显示技术有限公司 显示模组及显示装置
CN119091750A (zh) * 2024-07-31 2024-12-06 京东方科技集团股份有限公司 显示模组、显示设备和制作方法
CN118785612A (zh) * 2024-07-31 2024-10-15 京东方科技集团股份有限公司 柔性线路板、显示模组和显示装置
CN120126377A (zh) * 2024-08-30 2025-06-10 京东方科技集团股份有限公司 显示模组和显示装置
WO2026044690A1 (zh) * 2024-08-30 2026-03-05 京东方科技集团股份有限公司 一种显示模组和显示装置
CN119920167B (zh) * 2025-01-20 2025-10-10 京东方科技集团股份有限公司 一种显示模组及其制备方法、显示装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103217A (zh) * 2013-04-10 2014-10-15 乐金显示有限公司 柔性显示装置及其制造方法
CN107484328A (zh) * 2017-08-30 2017-12-15 厦门天马微电子有限公司 一种显示装置
US20190204651A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Technology Co., Ltd. Liquid crystal display device
CN212910167U (zh) * 2020-06-05 2021-04-06 京东方科技集团股份有限公司 柔性电路板、阵列基板及显示装置
US20210242299A1 (en) * 2018-10-25 2021-08-05 Japan Display Inc. Display device
WO2022040968A1 (zh) * 2020-08-26 2022-03-03 京东方科技集团股份有限公司 电磁屏蔽膜、柔性电路板和显示装置
KR20220096974A (ko) * 2020-12-31 2022-07-07 엘지디스플레이 주식회사 디스플레이 모듈 및 이를 포함한 디스플레이 장치
CN216982207U (zh) * 2022-01-05 2022-07-15 京东方科技集团股份有限公司 柔性电路板
US20220248534A1 (en) * 2021-01-29 2022-08-04 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible display module and manufacturing method thereof
CN115762337A (zh) * 2022-10-31 2023-03-07 京东方科技集团股份有限公司 一种显示装置及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826353B (zh) * 2016-03-25 2019-08-16 京东方科技集团股份有限公司 覆晶薄膜和显示装置
CN107424519B (zh) * 2017-06-26 2019-09-24 武汉天马微电子有限公司 柔性显示面板及柔性显示装置
KR102493082B1 (ko) * 2017-11-28 2023-02-01 삼성디스플레이 주식회사 잉크 조성물, 이의 제조 방법 및 이를 이용한 윈도우 부재의 제조 방법
KR102665381B1 (ko) * 2018-11-23 2024-05-14 삼성디스플레이 주식회사 표시장치
CN110649039B (zh) * 2019-09-16 2022-03-08 武汉华星光电半导体显示技术有限公司 柔性显示装置及制备方法
CN111580699B (zh) * 2020-05-13 2023-10-24 京东方科技集团股份有限公司 显示模组及显示装置
CN111599272A (zh) * 2020-05-18 2020-08-28 京东方科技集团股份有限公司 一种显示组件及其制作方法、显示装置
CN114335092B (zh) * 2021-12-22 2025-07-04 京东方科技集团股份有限公司 显示模组和显示装置
CN217386604U (zh) * 2022-03-15 2022-09-06 京东方科技集团股份有限公司 显示模组及显示装置
CN115083291B (zh) * 2022-07-25 2023-12-12 京东方科技集团股份有限公司 显示面板和显示装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103217A (zh) * 2013-04-10 2014-10-15 乐金显示有限公司 柔性显示装置及其制造方法
CN107484328A (zh) * 2017-08-30 2017-12-15 厦门天马微电子有限公司 一种显示装置
US20190204651A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Technology Co., Ltd. Liquid crystal display device
US20210242299A1 (en) * 2018-10-25 2021-08-05 Japan Display Inc. Display device
CN212910167U (zh) * 2020-06-05 2021-04-06 京东方科技集团股份有限公司 柔性电路板、阵列基板及显示装置
WO2022040968A1 (zh) * 2020-08-26 2022-03-03 京东方科技集团股份有限公司 电磁屏蔽膜、柔性电路板和显示装置
KR20220096974A (ko) * 2020-12-31 2022-07-07 엘지디스플레이 주식회사 디스플레이 모듈 및 이를 포함한 디스플레이 장치
US20220248534A1 (en) * 2021-01-29 2022-08-04 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible display module and manufacturing method thereof
CN216982207U (zh) * 2022-01-05 2022-07-15 京东方科技集团股份有限公司 柔性电路板
CN115762337A (zh) * 2022-10-31 2023-03-07 京东方科技集团股份有限公司 一种显示装置及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119992968A (zh) * 2025-04-02 2025-05-13 京东方科技集团股份有限公司 一种显示模组及其制备方法、显示装置

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