WO2024070624A1

WO2024070624A1 - Storage system

Info

Publication number: WO2024070624A1
Application number: PCT/JP2023/033003
Authority: WO
Inventors: 裕之島田; 浩二増田; 泰斗上野山; 弘章三橋; 修坪井; 光哉徳本; 世志紀隅田; 貴志吉村
Original assignee: 村田機械株式会社
Priority date: 2022-09-27
Filing date: 2023-09-11
Publication date: 2024-04-04

Abstract

[Problem] To provide a storage system capable of broadly ensuring available floor space while densely storing products. [Solution] A storage system 100 which is equipped with: a port 10 in which a first container 11 for storing a semiconductor wafer W is positioned; a transfer device 30 for transferring the semiconductor wafer W from the first container 11 positioned in the port 10 to a second container 12 which stores semiconductor wafers W more densely than does the first container 11; and a storage device 50 which is hung from the ceiling C and has a shelf 55 on which the second container 12 to which the semiconductor wafer W was transferred is placed.

Description

Storage System

The present invention relates to a storage system.

For example, in a semiconductor manufacturing facility, semiconductor wafers, which are items, are stored in a first container, and an overhead transport vehicle transports the first container. In addition, in a semiconductor manufacturing facility, the semiconductor wafers may be stored in a storage system for reasons of the manufacturing process. A known configuration of this storage system is one in which a transfer device removes the semiconductor wafers from the transported first container, and the removed semiconductor wafers are transferred to a second container that stores semiconductor wafers at a higher density than the first container, and then stored in the storage device (see, for example, Patent Document 1).

International Publication No. 2021/044791

In buildings in which semiconductor manufacturing equipment is installed, it is desirable to ensure sufficient passage and work space for workers on the floor, and to be able to place many processing devices, etc. within the building. As mentioned above, even if semiconductor wafers are transferred from the first container to the second container, if a storage device and transfer device for storing the second container are installed on the floor of the building, the floor space will be occupied by this storage device, etc., which is undesirable. Therefore, a configuration that miniaturizes the storage device can be considered to reduce the occupied floor space. However, with this configuration, the number of second containers that can be stored will be reduced, and the number of semiconductor wafers that can be stored will be reduced, which may cause problems in the manufacturing process.

The objective of the present invention is to provide a storage system that can store items at a high density while ensuring a large amount of free floor space.

A storage system according to an embodiment of the present invention includes a port on which a first container for storing items is placed, a transfer device for transferring items from the first container placed on the port to a second container that stores items at a higher density than the first container, and a storage device that is suspended from the ceiling and has a shelf on which the second container with the transferred items is placed.

The storage system according to the above aspect allows items to be stored in the second container at a high density, and furthermore, because the storage device that stores the second container is suspended from the ceiling, the storage device does not occupy the floor, and a large amount of free space on the floor can be secured. As a result, passage space and work space for workers can be secured on the floor, and many processing devices, etc. can be installed within the building.

Furthermore, in the storage system according to the above aspect, the port and the transfer device may be arranged in a state of being suspended from the ceiling. According to this configuration, the port on which the first container is placed and the transfer device that transfers the item from the first container to the second container are suspended from the ceiling, so that the area required for the installation of the port and the transfer device is reduced from the floor surface, and more free floor space can be secured. Furthermore, in the storage system according to the above aspect, the height from the floor surface to the bottom end of the port, the transfer device, and the storage device may be set to a predetermined height that allows workers to pass through or allows devices to be installed. According to this configuration, the area below the port, the transfer device, and the storage device can be used for workers to pass through or for installing devices, so that the floor surface can be used effectively.

In addition, in the storage system according to the above aspect, the storage device includes a crane, a crane ceiling track along which the crane travels while suspended, and a platform on which the second container to which the item has been transferred by the transfer device is placed, and the crane travels along the crane ceiling track to transport the second container and includes a transfer section for transferring the second container to each of the shelf and the platform, and the shelf may be arranged along the crane ceiling track. According to this configuration, the second container can be efficiently transferred to each of the shelf and the platform by using a crane that travels along the crane ceiling track. Also, in the storage system according to the above aspect, the shelf may be provided in multiple stages in the vertical direction and multiple rows in the horizontal direction below and to the side of the crane ceiling track. According to this configuration, since multiple shelves are provided in the vertical and horizontal directions, many second containers can be stored in the storage device.

Furthermore, in the storage system according to the above aspect, a plurality of cranes may be arranged on the overhead crane track. According to this configuration, by using a plurality of cranes, the second container can be transported efficiently. Furthermore, in the storage system according to the above aspect, the overhead crane track may be provided to include a circular track that surrounds the storage device in a plan view. According to this configuration, by having the crane move around the circular track, the crane can be moved in a circular motion in addition to moving back and forth on the track, and when a plurality of cranes are used, interference between the cranes can be prevented.

Furthermore, in the storage system according to the above aspect, the overhead track for the crane may be provided including a lift track that allows the crane to be raised and lowered while suspended. According to this configuration, maintenance of the crane, replacement of the crane, etc. can be easily performed by placing the crane on the lift track and lowering the lift track. Furthermore, in the storage system according to the above aspect, multiple sets of ports and transfer devices may be arranged along the overhead track for the crane. According to this configuration, since multiple sets of ports and transfer devices are arranged, the work of transferring items from the first container to the second container can be performed in multiple locations, and the work of transferring items can be performed efficiently.

In addition, the storage system according to the above aspect may include a ceiling transport vehicle that delivers the first container to the port, and a ceiling track for the transport vehicle along which the ceiling transport vehicle runs while suspended, the ceiling track for the transport vehicle having a plurality of intrabay tracks corresponding to the destinations of the first container and an interbay track connecting the intrabay tracks, and a set of a port and a transfer device may be provided corresponding to each of the plurality of intrabay tracks. According to this configuration, the ceiling transport vehicle can deliver the first container from any of the plurality of intrabay tracks.

FIG. 2 is a diagram showing an example of a storage system according to an embodiment, as viewed from the X direction. FIG. 13 is a diagram showing an example of a storage device as viewed from the X direction. FIG. 13 is a diagram showing an example of a storage system as viewed from the Z direction. FIG. 2 is a diagram showing an example of an overhead track for a crane and an overhead track for a transport vehicle. FIG. 2 is a diagram showing an example of a first container. FIG. 2 is a diagram illustrating an example of a ceiling transport vehicle. FIG. 4 is a diagram showing an example of a second container. FIG. 4 is a diagram showing an example of a configuration of a second container. FIG. 13 shows the second container in an open state. FIG. 1 illustrates an example of a robot hand. FIG. 1 is a diagram illustrating an example of a crane. 13 is a diagram showing a state in which the first container has been delivered from the ceiling transport vehicle to the port. FIG. FIG. 13 shows a state in which an article is handed over from the first container to the aligner. FIG. 13 shows the state in which the article has been transferred from the aligner to the second container. 13 is a diagram showing the state in which the second container is transferred from the placement table to the shelf by the crane. FIG. 13A and 13B are diagrams showing other examples of an overhead track for a crane and an overhead track for a transport vehicle.

Below, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the contents described below. In addition, in order to explain the embodiment in the drawings, some parts are enlarged or emphasized, and the scale is appropriately changed, and the shape, dimensions, etc. may differ from the actual product. In each of the following figures, the directions in the figures will be explained using the XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is the XY plane. In this XY plane, the traveling direction of the ceiling transport vehicle 20 and the crane 52 is represented as the X direction, and the direction perpendicular to the X direction is represented as the Y direction. In addition, the direction perpendicular to the XY plane is represented as the Z direction. The X, Y, and Z directions will be explained assuming that the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

FIG. 1 is a view of an example of a storage system 100 according to an embodiment, as viewed from the X direction. FIG. 2 is a view of an example of a storage device 50, as viewed from the X direction. FIG. 3 is a view of an example of a storage system 100, as viewed from the Z direction. FIG. 4 is a diagram showing an example of an overhead track 53 for a crane and an overhead track R for a transport vehicle. As shown in FIGS. 1 to 4, the storage system 100 comprises a port 10, a transfer device 30, and a storage device 50. Each of the transfer device 30 and the storage device 50 is arranged in a state of being suspended from the ceiling C of a building such as a factory by a hanging bracket 5.

The port 10, the transfer device 30, and the storage device 50 have a predetermined height H from the floor surface F to their respective bottom ends that is set to a height that is greater than or equal to the height at which workers can pass through or at which equipment can be installed. Therefore, the space below the port 10, the transfer device 30, and the storage device 50 can be used for workers to pass through or for equipment installation, and the building floor surface F can be used effectively. Note that in this embodiment, the port 10 and the transfer device 30 are arranged in a state where they are suspended from the ceiling C, but this is not limited to this form. At least one of the port 10 and the transfer device 30 may be placed on the floor surface F, for example.

The port 10 is used to place the first container 11 for storing items. The port 10 is used to transfer the first container 11 between the ceiling transport vehicle 20 or the worker and the transfer device 30. The port 10 is suspended from the ceiling C by being provided via a support 10a fixed to the frame 30a of the transfer device 30. The port 10 may be suspended from the ceiling C by a hanging bracket 5 separate from the transfer device 30. As shown in FIG. 3, two ports 10 are provided for the transfer device 30, but this is not limited to this configuration and one or three or more ports may be provided.

The first container 11 can store a plurality of semiconductor wafers W as an article. The semiconductor wafers W are an example of an article. The first container 11 is, for example, a FOUP (Front Opening Unified Pod) or a FOSB (Front Opening Shipping Box). However, the first container 11 may be any container capable of storing semiconductor wafers W, and is not limited to a FOUP or FOSB.

A single first container 11 contains semiconductor wafers W that have been subjected to the same process or unprocessed semiconductor wafers W, but a single first container 11 may contain semiconductor wafers W that have been subjected to different processes. Here, the processes performed on the semiconductor wafers W include, for example, surface treatments on the semiconductor wafers W, such as film formation, exposure, etching, and grinding.

5 is a diagram showing an example of the configuration of the first container 11. As shown in FIG. 5, the first container 11 includes a support portion 111, an opening 112, a lid portion 113, and a flange portion 114. A plurality of support portions 111 are arranged vertically so as to protrude inward from the side wall of the first container 11. The opposing support portions 111 are used as a set to form a slot 115 that supports a part of the outer periphery of the semiconductor wafer W. A plurality of slots 115 are formed so as to hold the semiconductor wafer W at regular intervals in the vertical direction. The opening 112 is provided on the side wall of the first container 11 to a size that allows the semiconductor wafer W to be inserted and removed. The lid portion 113 is provided, for example, detachably on the opening 112. The flange portion 114 is provided on the top of the first container 11 and is gripped during transport by the ceiling transport vehicle 20. The first container 11 can accommodate a semiconductor wafer W in each of the plurality of slots 115.

The ceiling transport vehicle 20 travels along a ceiling track R for transport vehicles that is provided near the ceiling C. The ceiling track R for transport vehicles is arranged in a state where it is suspended from the ceiling C by a hanging bracket 5. The ceiling transport vehicle 20 also delivers a first container 11 to the port 10. The first container 11 is transported by the ceiling transport vehicle 20 and placed on the port 10. The first container 11 placed on the port 10 is also transported from the port 10 to another location by the ceiling transport vehicle 20.

FIG. 6 is a diagram showing an example of a ceiling transport vehicle 20. The ceiling transport vehicle 20 has a running section 21 and a main body section 22. The running section 21 is equipped with a running drive section and multiple drive wheels 21a (not shown), and runs along the ceiling track R for the transport vehicle. The running drive section may be, for example, an electric motor provided on the running section 21 for driving the drive wheels 21a, or a linear motor provided using the ceiling track R for the transport vehicle. The operation of the running section 21 is controlled, for example, by a control device (not shown) provided on the main body section 22. The ceiling transport vehicle 20 is controlled to run in one direction on the ceiling track R for the transport vehicle.

The main body 22 is suspended from the bottom of the running section 21 via the mounting section 22a. The main body 22 has a holding section 23 that holds the first container 11, a lifting drive section 24 that suspends and raises the holding section 23, a side-moving mechanism 25 that moves the lifting drive section 24 from the main body 22 to the side (horizontal direction) of the ceiling track R for the transport vehicle, and a cover 26. The holding section 23 holds the first container 11 in a suspended state by grasping and holding the flange section 114 of the first container 11 from above. The holding section 23 is, for example, a chuck having multiple claw sections 23a that can advance and retreat horizontally, and holds the first container 11 in a suspended state by inserting the claw sections 23a below the flange section 114 of the first container 11 and raising the holding section 23. The holding unit 23 moves up and down while suspended from the lifting drive unit 24 by a hanging member 23b such as a wire or belt.

The lifting drive unit 24 is, for example, a hoist, which lowers the holding unit 23 by paying out the hanging member 23b, and raises the holding unit 23 by winding up the hanging member 23b. The lifting drive unit 24 is controlled by a control device (not shown) or the like, and lowers or raises the holding unit 23 at a predetermined speed. The lifting drive unit 24 is also controlled by a control device or the like, and holds the holding unit 23 at a target height.

The side-pushing mechanism 25 has movable plates 25a arranged, for example, in a vertical direction. The movable plates 25a can move to the side of the traveling direction of the traveling part 21 (in a direction perpendicular to the traveling direction). The lifting drive part 24 is attached to the lowermost movable plate 25a. The main body part 22 has a guide (not shown) that guides the side-pushing mechanism 25, and a drive part (not shown) that drives the side-pushing mechanism 25. The side-pushing mechanism 25 moves the lifting drive part 24 along the guide between the side-pushing position and the storage position by the driving force from a drive part such as an electric motor. The side-pushing position is a position where the holding part 23 protrudes laterally from the main body part 22. The storage position is a position where the holding part 23 is stored in the main body part 22. Note that a rotation mechanism for rotating the lifting drive part 24 (holding part 23) around an axis in the vertical direction may be provided between the side-pushing mechanism 25 and the lifting drive part 24.

The cover 26 surrounds the holding part 23, the lifting drive part 24, and the side-extending mechanism 25, and is provided by cutting out the part that allows the side-extending mechanism 25 to extend the movable plate 25a to the side. The cover 26 is provided so as to surround the first container 11 held by the holding part 23 when the side-extending mechanism 25 places the lifting drive part 24 in the storage position.

The ceiling transport vehicle 20 can raise and lower the first container 11 using the lifting drive unit 24, and transfer the first container 11 between either of the two ports 10. The ceiling transport vehicle 20 places the first container 11 on the port 10 by lowering the holding unit 23 using the lifting drive unit 24 while the lifting drive unit 24 is extended laterally above the port 10 using the lateral extension mechanism 25. The ceiling transport vehicle 20 also holds the first container 11 placed on the port 10 with the holding unit 23, and receives the first container 11 by raising the holding unit 23 using the lifting drive unit 24.

The transfer device 30 transfers the semiconductor wafers W from the first container 11 placed on the port 10 to the second container 12. The transfer device 30 also transfers the semiconductor wafers W from the second container 12 to the first container 11 placed on the port 10. The second container 12 stores the semiconductor wafers W at a higher density than the first container 11. Details of the high density (high density) will be described later. The transfer device 30 is provided as one set (one group) with one or more ports 10. In the example shown in FIG. 3, one transfer device 30 and two ports 10 form one set. However, this is not limited to this form, and one set may be one transfer device 30 and one port 10, or three or more transfer devices 30 and one port 10 may form one set. A plurality of sets of ports 10 and transfer devices 30 may be arranged along the overhead track R for the transport vehicle and the overhead track 53 for the crane.

The transfer device 30 transports the semiconductor wafer W between the first container 11 placed on the port 10 and the second container 12 placed on the placement table 51. The transfer device 30 is, for example, an EFEM (Equipment Front End Module). The transfer device 30 removes the semiconductor wafer W contained in the first container 11 and places it in the second container 12 placed on the placement table 51. The transfer device 30 also removes the semiconductor wafer W contained in the second container 12 and places it in the first container 11 placed on the port 10. Details of the storage device 50 will be described later.

The second container 12 stores the semiconductor wafers W transported by the transfer device 30. The second container 12 stores the semiconductor wafers W at a higher density than the first container 11. Here, the density is expressed by the weight (or number) of the semiconductor wafers W relative to the volume of the container. Therefore, in the second container 12, the intervals between the semiconductor wafers W arranged vertically are narrower than in the first container 11, so that the number of semiconductor wafers W per unit volume is greater than that of the first container 11. In other words, the second container 12 can store the semiconductor wafers W at a higher density than the first container 11. For example, if one second container 12 can store the same number of semiconductor wafers W as the first container 11, the height (length in the vertical direction) of the second container 12 is lower than the height of the first container 11. FIG. 7 is a schematic perspective view showing an example of the configuration of the second container 12. As shown in FIG. 7, the second container 12 includes a bottom 121, a lid 122, and a plurality of supports 123. The multiple supports 123 are arranged between the bottom 121 and the lid 122. Each support 123 is capable of supporting a semiconductor wafer W.

8 shows an example of the support 123 constituting the second container 12, where (A) is a diagram showing the first support 123A and (B) is a diagram showing the second support 123B. As shown in FIG. 8, the support 123 includes a plurality of first supports 123A and a plurality of second supports 123B. The first supports 123A and the second supports 123B are stacked alternately in the vertical direction (Z direction). The first supports 123A and the second supports 123B have the same or almost the same outer edge shape in a planar view. Note that a planar view is synonymous with a view from above (+Z direction) or below (-Z direction). The first support 123A has a frame 124A and a first holding portion 125A. The first holding portion 125A is provided so as to extend upward from a plurality of points (for example, four points) of the frame 124A and then curve downward, and supports the semiconductor wafer W at its tip portion. Similarly, the second support 123B has a frame 124B and a second holding portion 125B, and supports the semiconductor wafer W by the second holding portion 125B.

When the first support 123A and the second support 123B are stacked, the first holding portion 125A and the second holding portion 125B are arranged so that they do not overlap in a plan view. Furthermore, when stacked, the first holding portion 125A of the first support 123A penetrates the frame 124B of the second support 123B that is stacked on top of the first support 123A. Similarly, when stacked, the second holding portion 125B of the second support 123B penetrates the frame 124A of the first support 123A that is stacked on top of the second support 123B.

The second container 12 is transported between the placement platform 51 and the shelf 55 of the storage device 50 by the crane 52. The second container 12 is removed from the shelf 55 by the crane 52 and placed on the placement platform 51. The second container 12 is also removed from the placement platform 51 by the crane 52 and placed on the shelf 55. The placement platform 51 is suspended from the ceiling C by being fixed to the frame 30a of the transfer device 30. The placement platform 51 may be suspended from the ceiling C by a hanging bracket 5 separate from the transfer device 30 or the storage device 50. As shown in FIG. 3, one placement platform 51 is provided for the transfer device 30, but this is not limited to this configuration and two or more may be provided.

The opening and closing devices 54 open and close the second container 12, and when opened, make it possible to insert and remove the semiconductor wafer W. The opening and closing devices 54 are arranged on the +X side and -X side of the mounting table 51. The opening and closing devices 54 lift either the multiple first supports 123A or the multiple second supports 123B of the second container 12, making it possible to insert and remove the semiconductor wafer W. The opening and closing devices 54 are provided corresponding to the mounting table 51, and when multiple mounting tables 51 are provided, one is provided for each mounting table 51. The opening and closing devices 54 are arranged on the +X side and -X side of the mounting table 51.

FIG. 9 is a diagram showing the state in which the second container 12 is opened by the opening/closing device 54. As shown in FIG. 9, the opening/closing device 54 includes a support 56, a first support piece 57, and a second support piece 58. The first support piece 57 and the second support piece 58 can advance and retreat between the multiple supports 123 by a drive unit (not shown), and can also move vertically along the support 56. Note that the first support piece 57 and the second support piece 58 are not in contact with the semiconductor wafer W during the opening and closing operation of the second container 12.

The first support piece 57 can lift, for example, the second support 123B, and the second support piece 58 can lift, for example, the first support 123A. The first support piece 57 supports and lifts the second support 123B above the first support 123A, which is the object of transfer of the semiconductor wafer W. The second support piece 58 supports and lifts the first support 123A, which is the object of transfer of the semiconductor wafer W. The distance between the first support piece 57 and the second support piece 58 is set to a distance that forms a space D for the transfer of the semiconductor wafer W by the transfer unit 31 relative to the first support 123A. Note that by lifting the first support 123A with the second support piece 58, interference with the second support 123B below can be avoided when transferring the semiconductor wafer W.

The transfer device 30 includes a transport unit 31 and an aligner 32. FIG. 10 is a diagram showing an example of the configuration of the transport unit 31. As shown in FIG. 10, the transport unit 31 includes a base 33, a lifting shaft 34, and a support unit 35. The base 33 is fixed to the bottom of the frame 30a (see FIG. 1) of the transfer device 30. The base 33 may be provided so as to be movable in the X direction by a travel drive unit (not shown) along an X direction rail provided on the frame 30a. The lifting shaft 34 extends upward (in the +Z direction) from the top surface of the base 33, and is raised and lowered (moves in the Z direction) by a lifting drive unit (not shown). The support unit 35 is provided at the upper end of the lifting shaft 34, and is raised and lowered together with the lifting shaft 34.

The support section 35 is provided with a first arm section 41, a second arm section 42, and a hand section 43, which constitute a robot arm (horizontal articulated robot). One end of the first arm section 41 is provided on the upper surface of the support section 35 so as to be rotatable by a drive section (not shown). One end of the second arm section 42 is provided on the other end of the first arm section 41 so as to be rotatable by a drive section (not shown). One end of the hand section 43 is provided on the other end of the second arm section 42 so as to be rotatable by a drive section (not shown). The other end of the hand section 43 is an end effector equipped with a suction pad capable of suctioning, for example, the bottom or top surface of the semiconductor wafer W.

The hand portion 43 is not particularly limited in the manner in which it holds the semiconductor wafer W, as long as it is capable of holding the semiconductor wafer W. In addition, in this embodiment, the support portion 35 is provided with a set of a first arm portion 41, a second arm portion 42, and a hand portion 43, but this is not limited to the manner. The support portion 35 may also be provided with multiple sets of first arm portions 41, etc. In this case, the support portion 35 may be provided to be rotatable around an axis in the vertical direction.

The transport unit 31, which has the first arm 41, the second arm 42, and the hand 43, can remove the semiconductor wafer W from the first container 11 placed on the port 10, and is formed with dimensions capable of accommodating the semiconductor wafer W in the second container 12 placed on the mounting table 51. Therefore, the transport unit 31 can, for example, scoop up and remove the semiconductor wafer W from the first container 11, and place the removed semiconductor wafer W on the first support 123A or the second support 123B of the second container 12 placed on the mounting table 51. The configuration of the transport unit 31 is not limited to the above-mentioned form. The transport unit 31 is not limited to using a horizontal articulated robot composed of the first arm 41, etc., and may be configured using, for example, an expandable member, etc.

The aligner 32 is used to detect the amount of misalignment of the semiconductor wafer W transported by the transport unit 31. As shown in FIG. 3, the aligner 32 is installed in the frame 30a of the transfer device 30. For example, the aligner 32 rotates the semiconductor wafer W placed by the transport unit 31 and detects the edge of the semiconductor wafer W to detect the amount of misalignment in the planar direction and the rotational direction relative to a reference position. The aligner 32 may have any configuration, and any configuration capable of detecting the misalignment of the semiconductor wafer W relative to a reference position may be applied. In addition, it is optional whether or not the transfer device 30 is equipped with the aligner 32. The transfer device 30 does not have to be equipped with the aligner 32.

As shown in FIG. 1, the storage device 50 has a mounting table 51, a crane 52, an overhead track for the crane 53, an opening/closing device 54, and a shelf 55. The storage device 50 stores the second container 12 containing the semiconductor wafers W. The second container 12 is transported from the shelf 55 to the mounting table 51 by the crane 52, and is also transported from the mounting table 51 to the shelf 55 by the crane 52. A plurality of cranes 52 may be arranged on the overhead track for the crane 53. By using a plurality of cranes 52, the second container 12 can be efficiently transported between the mounting table 51 and the shelf 55.

FIG. 11 is a diagram showing an example of the configuration of the crane 52. As shown in FIG. 11, the crane 52 includes a traveling cart 61, two masts 62, a lifting platform 63, and a transfer unit 64. The traveling cart 61 travels in the X direction along the crane ceiling track 53 suspended from the ceiling C by the hanging bracket 5 by a travel drive unit (not shown). The traveling cart 61 is controlled so as to be capable of reciprocating movement (movement in one direction and the opposite direction) on the crane ceiling track 53. The two masts 62 are provided in the vertical direction with a gap between them on the +X side and -Y side of the traveling cart 61. The lifting platform 63 is disposed between the two masts 62 and moves up and down along the masts 62 by a lifting drive unit (not shown). The lifting platform 63 is provided with a transfer unit 64 for transferring the second container 12.

The transfer unit 64 is, for example, a robot arm, and supports the underside of the bottom 121 of the second container 12. By using the traveling cart 61, the lifting platform 63, and the transfer unit 64, the crane 52 can transport the second container 12 placed on the platform 51 to the shelf 55, and can also transport the second container 12 placed on the shelf 55 to the platform 51.

As described above, the opening/closing device 54 forms a space D in the second container 12, enabling the transfer unit 31 to transfer the semiconductor wafer W. After the transfer unit 31 stores the semiconductor wafer W in the second container 12 via the space D, the opening/closing device 54 lowers the first support piece 57 and the second support piece 58, and overlaps the first support 123A and the second support 123B to close the second container 12. The crane 52 scoops up the closed second container 12 from the mounting table 51, supports it, and transfers it in this state.

The shelves 55 store multiple second containers 12. As shown in Figures 2 and 3, the shelves 55 are arranged in multiple vertical stages and multiple horizontal rows in a frame 55a suspended from the ceiling C by the hanging brackets 5. The size of the frame 55a is arbitrary, and for example, the size is set to match the straight portion of the crane overhead track 53 in a plan view. The lower end of the frame 55a is set to be equal to or higher than a predetermined height H (see Figure 1). The shelves 55 may be arranged to correspond to the curved portion of the crane overhead track 53 in a plan view. The shelves 55 may also be arranged on the +X and -X sides of the mounting platform 51 as shown in Figure 3.

Each shelf 55 is provided with a size that allows one second container 12 to be placed thereon. Each shelf 55 may be provided with a gas supply mechanism (not shown) that supplies an inert gas such as nitrogen gas to the placed second container 12. The shelves 55 are arranged along the crane ceiling track 53. Specifically, as shown in FIG. 2 and FIG. 4, the shelves 55 are provided in multiple vertical stages and multiple horizontal rows below and to the side of the crane ceiling track 53. Since multiple shelves 55 are provided in the vertical and horizontal directions, many second containers 12 can be stored in the storage device 50. The vertical spacing of the shelves 55 is wider than the height of the second storage container 12 but narrower than the height of the first storage container 11. Unlike the present embodiment, for example, if the vertical spacing of the shelves 55 is wider than the height of the first storage container 11 in order to store the first storage container 11 on the shelf 55, the storage device 50 will become larger in size in order to store the same number of first storage containers 11 as the second storage containers 12. In other words, the storage device 50 of this embodiment realizes space-efficient storage of many semiconductor wafers W by allowing the second container 12 to store semiconductor wafers W at a higher density than the first container 11, as described above, and by narrowing the vertical spacing of the shelves 55.

As shown in FIG. 4, the crane overhead track 53 includes circulating

tracks

53A and 53B, a connecting track 53C, and a lifting track 53D. The circulating track 53B is provided inside the circulating track 53A. The circulating

tracks

53A and 53B are provided so as to surround the shelves 55 of the storage device 50 in a plan view. The shelves 55 are also provided outside the circulating track 53A. By having the circulating

tracks

53A and 53B, the crane 52 can be moved in a circular motion in addition to moving back and forth on the crane overhead track 53, and when multiple cranes 52 are used, interference between the cranes 52 can be prevented.

The connecting track 53C connects the

orbital tracks

53A and 53B. The crane 52 can move from the orbital tracks 53A to 53B via the connecting track 53C, and from the orbital tracks 53B to 53A via the connecting track 53C. The crane 52 is equipped with an obstacle sensor, and if there is, for example, a stopped crane 52 ahead in the traveling direction, the crane 52 stops traveling based on the detection result of the obstacle sensor. In this way, even when multiple cranes 52 are operating on the crane overhead track 53, interference between the cranes 52 is prevented.

The lifting track 53D is provided by branching off from a part of the circular track 53A. The lifting track 53D can be raised and lowered with the crane 52 suspended from it. By placing the crane 52 on the lifting track 53D and lowering the lifting track 53D, the crane 52 can be lowered to the vicinity of the floor surface F. Therefore, by lowering the lifting track 53D from which the crane 52 is suspended, maintenance of the crane 52 and replacement of the crane 52 can be easily performed. In addition, the lifting track 53D and the track part that branches off from the circular track 53A and connects to the lifting track 53D can also be used as a waiting track for the crane 52. For example, when some of the multiple cranes 52 are not in operation, the crane 52 can be kept waiting on the lifting track 53D, etc., to prevent the non-operating crane 52 from running wastefully.

Multiple sets of ports 10 and transfer devices 30 (including the mounting platform 51) are arranged between the overhead track R for the transport vehicle and the overhead track 53 for the crane in a plan view. Since multiple sets of ports 10 and transfer devices 30 are arranged, the work of transferring the semiconductor wafers W from the first container 11 to the second container 12 can be performed in multiple locations, and the work of transferring items can be performed efficiently. In addition, as shown in FIG. 4, the overhead track R for the transport vehicle may be provided with a buffer 60 on which the first container 11 can be temporarily placed. The buffer 60 is provided, for example, in a state suspended from the ceiling C, and is provided in a position where the first container 11 can be handed over by the ceiling transport vehicle 20.

Next, the operation of the storage system 100 according to this embodiment will be described. FIGS. 12 to 15 are diagrams showing an example of the operation of the storage system 100. The operation of the storage system 100 is controlled by a control device (not shown). The ceiling transport vehicle 20 travels along the ceiling track R for the transport vehicle with the first container 11 stored in the storage position of the main body 22. The control device instructs the ceiling transport vehicle 20 to deliver the first container 11 to the port 10. The ceiling transport vehicle 20 travels along the ceiling track R for the transport vehicle with the first container 11 held by the holding part 23, moves to the side of the port 10 and stops, and protrudes the side-discharge mechanism 25 to position the first container 11 above the port 10. Next, the lifting drive part 24 is driven to lower the holding part 23 and the first container 11, so that the first container 11 is delivered from the holding part 23 to the port 10 as shown in FIG. 12.

Next, in the transfer device 30, the transport unit 31 removes the semiconductor wafer W contained in the first container 11 as shown in FIG. 13, and transports the removed semiconductor wafer W to the aligner 32. The aligner 32 receives the semiconductor wafer W from the transport unit 31 and detects the position of the received semiconductor wafer W. The aligner 32 calculates the amount of positional deviation between the detected position of the semiconductor wafer W and a preset reference position. The aligner 32 transmits the calculation result to the transport unit 31.

Then, the transport unit 31 receives the semiconductor wafer W from the aligner 32 with the positional deviation corrected, and transports it. The second container 12 is placed on the mounting table 51 by the crane 52. The opening and closing device 54 opens the second container 12 placed on the mounting table 51 to form a space D. As shown in FIG. 14, the transport unit 31 causes the semiconductor wafer W to enter the space D of the second container 12, and places the semiconductor wafer W on the first support 123A or the second support 123B of the second container 12. A control device (not shown) has acquired storage destination information regarding the storage destination of the semiconductor wafer W in the second container 12 in advance, and controls the transport unit 31 to transport the semiconductor wafer W to the designated storage destination. After the semiconductor wafer W is stored, the opening and closing device 54 closes the second container 12.

Then, the crane 52 travels on the crane ceiling track 53 and stops to the side of the mounting table 51. Then, as shown in FIG. 15, the crane 52 receives the second container 12 placed on the mounting table 51 and transports it to a predetermined shelf 55. In this way, the semiconductor wafers W in the first container 11 are stored by the storage device 50 while being stored in the second container 12. Note that when the semiconductor wafers W stored in the second container 12 in the storage device 50 are transferred to the first container 11, the above procedure is reversed.

FIG. 16 is a diagram showing another example of the ceiling track 53 for the crane and the ceiling track R for the transport vehicle. As shown in FIG. 16, in the storage system 100A, the ceiling track R for the transport vehicle has multiple intrabay tracks R1 and interbay tracks R2 in a plan view. The intrabay tracks R1 are provided corresponding to the various processing devices and ports 10 to which the first container 11 is transported. The interbay tracks R2 connect the multiple intrabay tracks R1 together. The ceiling transport vehicle 20 can enter any of the multiple intrabay tracks R1 from the interbay track R2, and can also enter the interbay track R2 from the intrabay track R1.

The crane ceiling track 53 is arranged to orbit around the area sandwiched between multiple intrabay tracks R1. Multiple cranes 52 (three in the example shown in Figure 16) are arranged on the crane ceiling track 53. A set of ports 10 and transfer devices 30 is arranged in the area sandwiched between the intrabay track R1 and the crane ceiling track 53 in a plan view. In the example shown in Figure 16, there are four areas sandwiched between the intrabay track R1 and the crane ceiling track 53, and a port 10 and transfer device 30 are arranged in each of them. That is, four sets of ports 10 and transfer devices 30 are arranged, but this is not limited to the form and there may be three sets or less.

The storage device 50 is also provided along the crane ceiling track 53, inside and outside the crane ceiling track 53, which is a circular track. With this configuration, the ceiling transport vehicle 20 can deliver the first container 11 to the port 10 on any of the multiple intra-bay tracks R1. Furthermore, the crane 52 can deliver the second container 12 on any of the multiple loading platforms 51 or any of the multiple shelves 55 by traveling on the crane ceiling track 53.

In this way, according to the storage system 100 of this embodiment, semiconductor wafers W can be stored at high density in the second container 12, and further, since the storage device 50 that stores the second container 12 is suspended from the ceiling C, the storage device 50 does not occupy the floor surface F, and a large amount of free space on the floor surface F can be secured. As a result, it is possible to secure passage space and working space for workers on the floor surface F, or it is possible to install many processing devices, etc. on the floor surface F.

Although the embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the above-mentioned embodiments. It is clear to those skilled in the art that various modifications or improvements can be made to the above-mentioned embodiments. Furthermore, forms with such modifications or improvements are also included in the technical scope of the present invention. One or more of the requirements described in the above-mentioned embodiments may be omitted. Furthermore, the requirements described in the above-mentioned embodiments may be combined as appropriate. Furthermore, to the extent permitted by law, the disclosures of Japanese Patent Application No. 2022-153343 and all documents cited in the above-mentioned embodiments are to be referred to as part of the description in this document. Furthermore, the execution order of each operation shown in the embodiment can be realized in any order as long as the result of the previous operation is not used in the subsequent operation. Furthermore, even if the operations in the above-mentioned embodiments are described using "first," "next," "followed," etc. for convenience, it is not necessary to perform them in this order.

C: ceiling H: predetermined height F: floor R: ceiling track for transport vehicle R1: intrabay track R2: interbay track W: semiconductor wafer (item)
5... Suspension fitting 10... Port 11... First container 12... Second container 20... Ceiling transport vehicle 30... Transfer device 31... Transport section 32... Aligner 40... Transport device 50... Storage device 51... Placement platform 52... Crane 53... Ceiling track for

crane

53A, 53B... Circulating track 53D... Lifting track 54... Opening/closing device 55... Shelf 64...

Transfer section

100, 100A... Storage system

Claims

a port on which a first container for storing an item is placed;
a transfer device that transfers the object from the first container placed on the port to a second container that stores the object at a higher density than the first container;
a storage device arranged in a suspended state from a ceiling and having a shelf on which the second container to which the item has been transferred is placed.
The storage system according to claim 1, wherein the port and the transfer device are arranged in a suspended state from the ceiling.
The storage system according to claim 2, wherein the height from the floor surface to the bottom end of the port, the transfer device, and the storage device is set to a predetermined height that allows workers to pass through or allows devices to be installed.
The storage device includes:
A crane and
A crane overhead track along which the crane travels while suspended;
a placement table for placing the second container to which the article has been transferred by the transfer device,
The crane includes a transfer unit that travels along the crane overhead track to transport the second container and transfers the second container to each of the shelf and the placement table,
The storage system of claim 1 , wherein the shelves are positioned along the crane overhead track.
The storage system according to claim 4, wherein the shelves are arranged in multiple vertical stages and multiple horizontal rows below and to the sides of the crane overhead track.
The storage system according to claim 4, wherein a plurality of the cranes are arranged on the overhead crane track.
The storage system according to claim 4, wherein the crane overhead track includes a circular track that surrounds the storage device in a plan view.
The storage system according to claim 4, wherein the crane ceiling track includes a lift track that allows the crane to be raised and lowered while suspended.
The storage system according to claim 4, wherein a plurality of sets of the port and the transfer device are arranged along the overhead track for the crane.
a ceiling transport vehicle for delivering the first container to the port;
a ceiling track for the overhead transport vehicle along which the overhead transport vehicle runs in a suspended state;
The overhead track for the transport vehicle includes a plurality of intra-bay tracks corresponding to the transport destinations of the first container and an inter-bay track connecting the intra-bay tracks,
The storage system according to claim 9 , wherein the set of the port and the transfer device is provided corresponding to each of the plurality of intrabay tracks.