WO2024067341A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2024067341A1
WO2024067341A1 PCT/CN2023/120335 CN2023120335W WO2024067341A1 WO 2024067341 A1 WO2024067341 A1 WO 2024067341A1 CN 2023120335 W CN2023120335 W CN 2023120335W WO 2024067341 A1 WO2024067341 A1 WO 2024067341A1
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WO
WIPO (PCT)
Prior art keywords
conductive
electronic device
substrate
supporting
conductive medium
Prior art date
Application number
PCT/CN2023/120335
Other languages
English (en)
French (fr)
Inventor
李恒
熊真敏
李艳波
唐巍
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024067341A1 publication Critical patent/WO2024067341A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Definitions

  • the present application relates to the field of radio frequency technology, and in particular to an electronic device.
  • the antennas of electronic devices such as mobile phones and tablets are usually set on the printed circuit board (PCB) or the casing inside the electronic device, generally located on the back or side of the electronic device.
  • PCB printed circuit board
  • the user's hand may block the location of the antenna, affecting the antenna's reception and transmission of radio frequency signals.
  • AOD antenna on display
  • the antenna is set under the display screen, where the antenna can be, for example, a millimeter wave antenna.
  • the antenna can be, for example, a millimeter wave antenna.
  • how to feed the antenna under the screen has become a problem that needs to be solved urgently.
  • An embodiment of the present application provides an electronic device for solving the feeding problem of an under-screen antenna.
  • An embodiment of the present application provides an electronic device, including:
  • a shell the shell includes a rear shell and a side wall; a display screen, the display screen is arranged on the side wall; a conductive structure, the conductive structure is arranged on the display screen; a feeding structure, the feeding structure is arranged in the shell, the feeding structure includes a first substrate stacked along the height direction of the side wall, a supporting conductive component electrically connected to the first substrate, and a first conductive medium electrically connected to the supporting conductive component; one end of the first conductive medium away from the supporting conductive component is electrically connected to the conductive structure, and the first substrate is away from the supporting conductive component and faces the rear shell.
  • a feeding structure is designed along the thickness direction of the electronic device for the conductive structure arranged on the display screen, and the first substrate in the feeding structure realizes the transmission of radio frequency signals with the conductive structure through the supporting conductive component and the first conductive medium.
  • the size of the supporting conductive component and/or the first conductive medium can be adjusted based on the specific size and applicable scenario of the electronic device, so that the feeding structure is applicable to electronic devices of various sizes on the basis of ensuring the reliability of feeding.
  • the first conductive medium may be a conductive medium with elasticity, such as conductive silicone, springs, conductive foam, conductive graphite, compressible porous conductive material, etc.
  • the feeding structure is elastically connected to the conductive structure through the first conductive medium, which reduces the impact of the feeding structure on the conductive structure during the disassembly and assembly process to a certain extent, thereby reducing the probability of damage to the conductive structure.
  • the first conductive medium can fully contact the conductive structure under the action of elastic force, ensuring the reliability of feeding the conductive structure set under the screen.
  • the first conductive medium may be selected to be conductive silicone provided with through holes (the conductive silicone of this structure is sometimes also referred to as a conductive terminal).
  • the direction in which the through holes are opened may be perpendicular to the height direction (i.e., the thickness direction of the electronic device).
  • the conductive silicone is a non-rigid material and can be in soft contact with the conductive structure to avoid damage to the conductive structure during disassembly and assembly.
  • the conductive silicone provided with pores has good compression performance, which can not only make the conductive structure and the first conductive medium fully abut under the action of elastic force, thereby ensuring the reliability of the electrical connection between the conductive structure and the first conductive medium, but also avoid the first conductive medium being difficult to compress, resulting in excessive elastic force, making the display screen difficult to install.
  • the supporting conductive component and the first conductive medium are fixedly connected.
  • soldering may be performed using a soldering material capable of conducting electricity (eg, tin).
  • a soldering material capable of conducting electricity eg, tin
  • the supporting conductive component and the first conductive medium are electrically connected by a fixed connection, which can ensure the reliability of the electrical connection.
  • the problem of interference of stray electric fields or magnetic fields on the transmission of radio frequency signals is avoided, thereby ensuring the stability and reliability of the radio frequency signal during the transmission process.
  • the supporting conductive component includes at least one second substrate.
  • the number of layers of the second substrate can be adjusted according to the thickness of the electronic device to achieve feeding of the conductive structure in electronic devices of different thicknesses, making the feeding structure more widely applicable.
  • the second substrate can be a hard substrate, for example, a substrate based on Land Grid Array (LGA).
  • LGA Land Grid Array
  • the second substrate adopts the grid array packaging substrate, which ensures the stability of RF signal transmission while saving costs.
  • the optional second substrate may also be a soft substrate, for example, a flexible printed circuit (FPC), an FPC based on liquid crystal polymer (LCP), etc.
  • FPC flexible printed circuit
  • LCP liquid crystal polymer
  • the soft substrate may be folded or wrapped in a support plate (such as an insulating support plate) to improve the support capacity of the soft substrate.
  • the supporting conductive component and the first substrate are fixedly connected.
  • soldering may be performed using a soldering material capable of conducting electricity (eg, tin).
  • a soldering material capable of conducting electricity eg, tin
  • the supporting conductive component and the first substrate are electrically connected by a fixed connection method, thereby ensuring the reliability of the electrical connection.
  • the problem of interference of stray electric fields or magnetic fields on the transmission of radio frequency signals is avoided, thereby ensuring the stability and reliability of the radio frequency signal during the transmission process.
  • a second conductive medium is disposed on the first substrate, and the supporting conductive component is electrically connected to the first substrate through the second conductive medium.
  • the second conductive medium may be a conductive elastic member, such as a spring sheet, a weldable conductive spring foot, or other conductive and elastic structure.
  • the height of the supporting conductive component is increased by the second conductive medium, so that the height design value of the first conductive medium can be reduced to reduce the probability of damage to the first conductive medium during the disassembly and assembly of the electronic device.
  • the electronic device further includes a bracket, the bottom of the bracket abuts against the first substrate, a portion of the bracket and a portion of the first substrate form a receiving space, the supporting conductive component is fixed in the receiving space, and the first conductive medium protrudes from the top of the bracket.
  • the bracket is a fixed structure, the height of the accommodation space formed between the bracket and the first substrate is fixed, and the second conductive medium has elasticity, when the supporting conductive component is installed, the dimensional tolerance of the supporting conductive component will be offset by the elasticity of the second conductive medium, that is, the dimensional tolerance of the supporting conductive component will not affect the design tolerance of the electronic device. Therefore, the design of the bracket and the second conductive medium can reduce the design tolerance of the electronic device and improve the quality of the electronic device.
  • the bracket includes a first support arm and a second support arm, the first support arm and the second support arm are arranged opposite to each other, the bottoms of the first support arm and the second support arm abut against the first substrate, and the first support arm, the second support arm and a portion of the first substrate form a receiving space; the first conductive medium is located between the first support arm and the second support arm, and the top of the first conductive medium is higher than the top of the bracket.
  • a protection plate is provided on the same side of the first support arm and the second support arm and extends in a direction toward the first substrate, and the protection plate, the first support arm, the second support arm and the first substrate form the accommodation space.
  • a protection plate is designed to protect the supporting conductive components, thereby reducing the possibility of the supporting conductive components being damaged during the process of disassembling and assembling the electronic device.
  • guide rails are respectively provided on opposite sides of the first support arm and the second support arm, and grooves are respectively provided on the side of the supporting conductive component facing the first support arm and the side facing the second support arm.
  • the top of the supporting conductive component is fixedly connected to the bracket, for example, by gluing.
  • a low-temperature solder is disposed on the conductive structure, and the conductive structure is electrically connected to the first conductive medium through the low-temperature solder.
  • the first conductive medium can achieve electrical connection under the welding action of low-temperature solder by only contacting with the conductive structure, without the need for the first conductive medium to provide a large elastic force, thereby reducing the height design value of the first conductive medium to reduce the probability of damage to the first conductive medium.
  • the low-temperature solder ensures the firmness of the electrical connection between the first conductive medium and the conductive structure, thereby ensuring the stability of RF signal transmission.
  • the conductive structure is disposed on a side of the display screen facing the rear housing.
  • the conductive structure can be made into a film form and directly attached to the display screen, thereby improving assembly efficiency.
  • the conductive structure includes a conductor and a feeding pad electrically connected to the conductor, the antenna is disposed in the display screen, the feeding pad is disposed on a side of the display screen facing the rear housing, and the feeding pad is electrically connected to the first conductive medium.
  • the display screen and the side wall are connected by back-screen adhesive.
  • the back screen glue has the advantages of low price, environmental protection and long shelf life.
  • the display screen and the side wall are connected by the back screen glue, which not only ensures the reliability of the connection between the two, but also saves the production cost.
  • FIG1 is a structural schematic diagram 1 of an electronic device provided in an embodiment of the present application.
  • FIG2 is a second structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG3 is a schematic structural diagram of a supporting conductive component provided in an embodiment of the present application.
  • FIG4 is a schematic structural diagram of a first conductive medium provided in an embodiment of the present application.
  • FIG5 is a third structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG6 is a fourth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG7 is a fifth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG8 is a sixth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG9 is a schematic diagram of the front structure of a bracket provided in an embodiment of the present application.
  • FIG10 is a schematic diagram of the back structure of a bracket provided in an embodiment of the present application.
  • FIG11 is a seventh structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG12 is a schematic structural diagram 8 of an electronic device provided in an embodiment of the present application.
  • FIG13 is a schematic diagram of the structure of a bracket and a supporting conductive component provided in an embodiment of the present application.
  • FIG. 14 is a ninth structural diagram of an electronic device provided in an embodiment of the present application.
  • Conductive structure 301. Feed pad; 302. Conductor; 303. Low-temperature solder;
  • Feeding structure 401. First substrate; 402. Supporting conductive component; 403. First conductive medium; 404. Second conductive medium;
  • an embodiment of the present application provides an electronic device, which designs a feeding structure for the under-screen antenna, which can improve the feeding reliability and make it suitable for electronic devices of various sizes while ensuring the feeding reliability.
  • first and second are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • installed can be a fixed connection, a detachable connection, or an integral connection
  • it can be directly connected or indirectly connected through an intermediate medium
  • it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the specific meanings of the above terms in this application can be understood according to specific circumstances. righteous.
  • electrical connection should be understood in a broad sense.
  • current conduction can be achieved by direct connection, or electrical energy conduction can be achieved by capacitive coupling.
  • a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.
  • a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • a first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
  • a and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone.
  • the housing 1 includes a rear housing 101 and a side wall 102.
  • the side wall 102 is connected to the rear housing 101 at the edge of the rear housing 101.
  • the rear housing 101 and the side wall 102 are integrally formed.
  • a storage space A is formed between the housing 1 and the display screen 2, and the storage space A can be used to accommodate other components of the electronic device, such as batteries, various PCBs (for example, including a main board, a sub-board, etc.), adapter cables, a conductive structure 3, a bracket (or referred to as a frame, a middle frame, etc.), a camera, etc.
  • batteries for example, including a main board, a sub-board, etc.
  • adapter cables for example, including a main board, a sub-board, etc.
  • a conductive structure 3 for example, including a main board, a sub-board, etc.
  • a bracket or referred to as a frame, a middle frame, etc.
  • a camera etc.
  • the display screen 2 can be adhered to the side wall 102 by means of a back screen adhesive 6.
  • the housing 1 can be a metal housing or a non-metal housing (such as glass, etc.).
  • the display screen 2 can be a liquid crystal display (LCD) with integrated touch function, or an organic light-emitting diode (OLED) display with integrated touch function.
  • LCD liquid crystal display
  • OLED organic light-emitting diode
  • the material of the housing 1 and the type of the display screen 2 can be specifically selected according to the actual product design requirements of the electronic device, and this application does not impose any restrictions on this.
  • the conductive structure 3 is arranged on the display screen 2, and the feeding structure 4 is arranged in the housing 1 along the thickness direction of the electronic device, that is, the bottom of the feeding structure 4 is placed on the rear shell 101 of the electronic device.
  • the top of the feeding structure 4 is against the conductive structure 3 to achieve electrical connection with the conductive structure 3 so as to feed the conductive structure 3.
  • the feeding here refers to enabling the transmission of radio frequency signals between the conductive structure 3 and the feeding structure 4. That is, the conductive structure 3 can be used as an antenna component of the electronic device, and can transmit the received radio frequency signals from other devices to the feeding structure 4, so that the feeding structure 4 can perform relevant signal processing on the radio frequency signals of other devices, and the feeding structure 4 can transmit the radio frequency signals to be sent to other devices to the conductive structure 3, so that the conductive structure 3 can send the radio frequency signals to other devices.
  • the conductive structure 3 may be disposed in a non-display area of the display screen 2, that is, a black frame (Black Matrix, BM) area at the edge of the display screen 2.
  • the conductive structure 3 may also be disposed in a display area, for example, in the middle of the display area, or at an edge of the display area.
  • the conductive structure 3 may include a feed pad 301 and a conductor 302.
  • the conductor 302 may be a transparent radiator, such as a millimeter wave antenna.
  • the feed pad 301 may also be called a conductive plane, which is used to transmit the radio frequency signals received and sent by the conductor 302, that is, to transmit the radio frequency signals received by the antenna from other devices to the feed structure 4, and to transmit the radio frequency signals transmitted by the feed structure 4 to the conductor 302, so that the antenna can send radio frequency signals to other devices.
  • the feed pad 301 and the conductor 302 can be made into an antenna film (or called an antenna patch) and arranged on the side of the display screen 2 facing the rear housing 101.
  • the conductive structure 3 can be directly attached to the display screen 2.
  • the conductive structure 3 is placed at a designated position, and the feeding pad 301 of the conductive structure 3 faces the rear housing 101. Therefore, after the display screen 2 is mounted on the housing 1, the top of the feeding structure 4 can abut against the upper feeding pad 301, thereby achieving electrical connection between the conductive structure 3 and the feeding structure 4.
  • the under-screen antenna is separated from the motherboard/housing setting, which makes the under-screen antenna prone to damage under external force impact.
  • the conductor 302 may be damaged, causing the electronic device to be unable to receive and transmit radio frequency signals normally.
  • the feed pad 301 is damaged, causing the feed pad 301 to be unable to feed normally, thereby causing the electronic device to be unable to receive and transmit radio frequency signals normally.
  • the conductive structure 3 can also be directly integrated on the display screen 2 to improve the impact resistance of the conductive structure 3 and reduce the possibility of the conductive structure 3 being damaged during the assembly process.
  • the conductor 302 may be disposed in the display screen 2, such as the conductor 302 may be disposed in the back panel of the display screen 2, and the feeding pad 301 may be disposed on the surface of the display screen 2 (i.e., the side facing the rear shell 101), and the conductor 302 and the feeding pad 301 may be electrically connected by wiring in the display screen (such as wiring on the back panel).
  • the display screen 2 provides support for the conductive structure 3, improves the impact resistance of the conductive structure 3, ensures the stability of the antenna in the conductive structure 3 in receiving and transmitting radio frequency signals to a certain extent, and reduces the risk of damaged parts.
  • the feeding structure 4 includes a first substrate 401, a supporting conductive component 402 electrically connected to the first substrate 401, and a first conductive medium 403 electrically connected to the supporting conductive component 402.
  • the first substrate 401, the supporting conductive component 402, and the first conductive medium 403 are sequentially stacked along the height direction of the side wall 102.
  • the first conductive medium 403 is electrically connected to the conductive structure 3, and a side of the first substrate 401 away from the supporting conductive component 402 faces the rear housing 101, and the supporting conductive component 402 is arranged between the first conductive medium 403 and the first substrate 401.
  • the first substrate 401 may be a mainboard of an electronic device.
  • Various control circuits e.g., battery control circuit, radio frequency circuit, drive circuit
  • processors e.g., central processing unit (CPU)
  • memory e.g., a central processing unit (CPU)
  • sensors
  • the so-called feeding specifically refers to the transmission of RF signals between the conductor 302 and the RF circuit on the first substrate 401.
  • the conductor 302 when it receives RF signals from other devices, it can transmit the RF signals to the RF circuit through the feeding pad 301, so that the RF circuit can convert the RF signal into a baseband signal and transmit it to the processor, and the processor converts the baseband signal into data for processing and controls the electronic device to respond.
  • the processor performs baseband processing on the data to be sent, outputs the baseband signal to the RF circuit for RF processing, and obtains the RF signal.
  • the RF circuit transmits the RF signal to the feeding pad 301 to send it to the conductor 302, and sends it outward in the form of electromagnetic waves through the conductor 302.
  • the electrical connection between the first substrate 401 and the conductive structure 3 is achieved specifically by supporting the conductive component 402 and the first conductive medium 403 , and the radio frequency signal is transmitted between the first substrate 401 and the conductive structure 3 .
  • the supporting conductive component 402 may be a supporting structure with a signal transmission function.
  • the supporting conductive component 402 may include at least one second substrate.
  • the at least one second substrate may be a hard substrate, such as a substrate based on an LGA package (hereinafter referred to as an LGA substrate).
  • the LGA substrate has a low manufacturing cost, and the LGA substrate has a high hardness and is not prone to wear, which can effectively ensure the stability of RF signal transmission.
  • the second substrates may also be a soft substrate, for example, a flexible printed circuit (FPC), an FPC based on liquid crystal polymer (LCP), etc.
  • the soft substrate may be folded to increase the thickness of the soft substrate and improve the support capacity of the soft substrate.
  • the soft substrate may also be wrapped on a support plate (such as an insulating support plate) having a certain hardness, and the support plate provides a support function in the thickness direction, and the soft substrate provides a transmission function of the radio frequency signal.
  • the at least two layers of second substrates may include a hard substrate and a soft substrate.
  • the supporting conductive component 402 includes two layers of second substrates, namely, an LGA substrate and an FPC substrate.
  • the number of layers of the second substrate can be flexibly adjusted according to the actual thickness of the electronic device to ensure that the feeding structure 4 feeds the conductive structure 3 and adapts to electronic devices of different sizes.
  • the second substrates can be electrically connected to each other in a fixed connection manner to ensure the stability and reliability of the transmission of the radio frequency signal between the second substrates.
  • the supporting conductive component 402 may also be a cable, and the electrical connection between the first substrate 401 and the first conductive medium 403 is achieved through the cable.
  • the supporting conductive component 402 and the first substrate 401 can be electrically connected in a fixed connection manner.
  • the first substrate 401 is provided with a contact point of the radio frequency circuit, and the bottom of the supporting conductive component 402 can be welded to the corresponding contact point, so that the supporting conductive component 402 can transmit radio frequency signals with the radio frequency circuit.
  • the patch welding method can effectively avoid the problem of interference of stray electric fields or magnetic fields on the transmission of radio frequency signals, thereby ensuring the stability and reliability of radio frequency signals during the transmission process.
  • the top of the supporting conductive component 402 is electrically connected to the first conductive medium 403.
  • the first conductive medium 403 can be a conductive medium with elasticity, such as conductive silicone, springs, conductive foam, conductive graphite, compressible porous conductive materials, etc. Since the conductive structure 3 is an under-screen antenna structure, it is easy to be damaged under the impact of external forces during the assembly process, resulting in the electronic device being unable to normally receive and send radio frequency signals. Therefore, in the embodiment of the present application, the first conductive medium 403 is elastically connected to the conductive structure 3 to reduce the impact of the feed structure 4 on the conductive structure 3 during the assembly process, thereby reducing the probability of damage to the conductive structure 3.
  • the first conductive medium 403 can be an elastic conductive medium with a certain compression space, as shown in FIG4 , the first conductive medium 403 can be selected to be a conductive silicone provided with a through hole (the conductive silicone of the structure is sometimes also referred to as a conductive terminal).
  • the conductive silicone is a non-rigid material, which can be in soft contact with the conductive structure 3 to avoid damage to the conductive structure 3 during disassembly and assembly.
  • the conductive silicone provided with pores has good compression performance, which can make the conductive structure 3 and the first conductive medium 403 fully abut under the action of elastic force, ensure the reliability of the electrical connection between the conductive structure 3 and the first conductive medium 403, and avoid the first conductive medium 403 being difficult to compress and causing excessive elastic force, making it difficult to install the display screen 2.
  • the first substrate 401, the supporting conductive component 402 and the first conductive medium 403 can be assembled together to form an integrated feeding structure 4.
  • the feeding structure 4 can be assembled by patch welding.
  • contact points of the radio frequency circuit are provided on the first substrate 401, and contact points are provided at the bottom and the top of the supporting conductive component 402, respectively, and the contact points at the bottom and the contact points at the top are connected through wiring provided in the supporting conductive component 402 for transmitting radio frequency signals.
  • the contact points at the bottom of the supporting conductive component 402 can be fixedly connected to the contact points of the radio frequency circuit on the first substrate 401, and then the contact points at the top of the supporting conductive component 402 can be fixedly connected to the bottom of the first conductive medium 403 to obtain an integrated feeding structure 4.
  • the fixed connection is achieved by welding with a conductive welding material (such as tin), which can effectively avoid the problem of interference of stray electric or magnetic fields on the transmission of RF signals, thereby improving the stability and reliability of RF signals when transmitted in the feeding structure 4.
  • a conductive welding material such as tin
  • the thickness H1 of the feed structure 4 i.e., the distance between the bottom of the first substrate 401 and the top of the first conductive medium 403 is greater than the sum H2 of the height of the side wall 102 of the housing 1 and the thickness of the back screen glue 6. Therefore, as shown in FIG5, before the first substrate 401 is placed on the back shell 101 of the housing 1 and the display screen 2 is installed, the top of the first conductive medium 403 extends out of the housing 1.
  • the feed pad 301 of the conductive structure 3 is aligned with the top of the first conductive medium 403, and the first conductive medium 403 is retracted by the pressure of the display screen 2, so that the display screen 2 can be pasted on the housing 1, and the assembly of the electronic device is completed.
  • the first conductive medium 403 is compressed and also generates elastic force, which is applied to the conductive structure 3, so that the conductive structure 3 and the first conductive medium 403 are fully abutted under the action of the elastic force, ensuring the reliability of the electrical connection between the conductive structure 3 and the first conductive medium 403.
  • a feeding structure 4 is designed along the thickness direction of the electronic device for the conductive structure 3 arranged on the display screen 2, and the first substrate 401 in the feeding structure 4 realizes the transmission of radio frequency signals with the conductive structure through the supporting conductive component 402 and the first conductive medium 403.
  • the feeding structure 4 is elastically connected to the conductive structure 3 through the first conductive medium 403, which reduces the impact of the feeding structure 4 on the conductive structure 3 during the disassembly and assembly process to a certain extent, thereby reducing the probability of damage to the conductive structure 3.
  • the first conductive medium 403 can be fully in contact with the feeding pad 301 of the conductive structure 3 under the action of elastic force, thereby ensuring the feeding reliability of the conductive structure 3 arranged under the screen.
  • the size of the supporting conductive component 402 and/or the first conductive medium 403 can be adjusted based on the specific size and applicable scenario of the electronic device.
  • the feeding structure 4 is adapted to electronic devices of various sizes while ensuring the reliability of the feeding.
  • the height of the first conductive medium 403 can be specifically determined according to the limit tolerance of the accommodation space A of the electronic device, the material size of the first substrate 401, the size of the supporting conductive component 402, and the working range (i.e., the compression rate range) of the first conductive medium 403.
  • the limit tolerance of the accommodation space A is a
  • the height design value of the first conductive medium 403 can be d+0.2d+a.
  • the limit tolerance of the system can be offset by the compression performance of the first conductive medium 403.
  • the height of the first conductive medium 403 is approximately d+0.2d+a, and the top of the first conductive medium 403 is higher than the height of the back screen glue 6 on the housing 1 by approximately 0.2d+a. After the electronic device is assembled, in the accommodation space A, the height of the first conductive medium 403 is compressed to d.
  • the elastic force generated after the first conductive medium 403 is compressed may be too large, which may cause the display screen 2 to be easily debonded under high temperature and high humidity conditions (that is, the display screen 2 is separated from the housing 1).
  • the first conductive medium 403 is a conductive silicone as shown in Figure 4.
  • the height design value of the conductive silicone may exceed 3mm.
  • the elastic force of the conductive silicone on the display screen 2 after compression exceeds 1.5N, which may cause the display screen 2 to be easily debonded under high temperature and high humidity conditions.
  • the conductive structure 3 is designed in the display area or near the display area, water ripples and red and blue spots may appear in the display area near the conductive structure 3.
  • the first conductive medium 403 can also be electrically connected via the low-temperature solder 303.
  • the low-temperature solder 303 can be disposed on the feed pad 301 of the conductive structure 3.
  • the display screen 2 is attached to the housing 1 via the back screen adhesive 6, the display screen 2 is locally heated in the area where the conductive structure 3 is disposed, so that the low-temperature solder 303 is melted at the top of the first conductive medium 403 and electrically connected to the first conductive medium 403.
  • the welding temperature of the low-temperature solder 303 is between 56°C (degrees Celsius) and 100°C, and the welding material can be used for welding without burning other components in the electronic device.
  • the welding material can be SnBiInZr (tin bismuth indium zirconium) alloy, or other solders with lower welding temperatures. This application does not impose any restrictions on this.
  • the first conductive medium 403 does not need to rely on a large elastic force to maintain a reliable electrical connection with the conductive structure 3.
  • the reliability of the electrical connection between the first conductive medium 403 and the conductive structure 3 can be ensured by the low-temperature solder 303. Therefore, when designing the first conductive medium 403, the height can be reduced, that is, in consideration of the limit tolerance, the height design value of the first conductive medium 403 can be d+a. That is, when the display screen 2 is not installed, the height of the first conductive medium 403 is higher than the height of the back screen glue 6 by approximately a limit tolerance a, so as to offset the limit tolerance of the electronic device.
  • the height of the first conductive medium 403 is reduced, so that the elastic force of the first conductive medium 403 on the display screen 2 is reduced after compression. At the same time, the height of the first conductive medium 403 is reduced, which can also reduce the probability of damage to the first conductive medium 403 during the disassembly and assembly of the electronic device.
  • the first conductive medium 403 is the conductive silicone as shown in FIG4
  • the limit tolerance is 0.6 mm
  • H2 4.7 mm
  • the height of the conductive silicone is less than 3 mm
  • the elastic force of the conductive silicone on the display screen 2 after compression is about 1.09 N.
  • the display screen 2 does not debond under high temperature and high humidity conditions. No water ripples or red and blue spots appear in the display area near the conductive structure 3.
  • a second conductive medium 404 may also be provided on the first substrate 401 .
  • the second conductive medium 404 may be fixedly connected to a corresponding position of the first substrate 401 (ie, a contact point of the RF circuit) and electrically connected to the supporting conductive component 402 .
  • the height design value of the first conductive medium 403 can be reduced, so as to reduce the probability of damage of the first conductive medium 403 during the disassembly and assembly of the electronic device.
  • the second conductive medium 404 may be a conductive elastic member with elasticity, such as a spring sheet, a weldable conductive spring foot, or other conductive and elastic structure.
  • the tolerance of each part in the electronic device affects the design tolerances such as the limit tolerance and statistical tolerance of the electronic device, thereby affecting the quality of the electronic device.
  • the tolerances of each part include the dimensional tolerance of the first substrate 401 (assuming it is ⁇ 0.07 mm), the dimensional tolerance of the supporting conductive component 402 (for example, at least one layer of LGA , assuming ⁇ 0.25mm), the dimensional tolerance of the first conductive medium 403 (for example, assuming ⁇ 0.1mm), the thickness tolerance of the rear shell 101 (assuming ⁇ 0.1mm), the design tolerance of the conductive structure 3 (for example, in the form of a diaphragm, the design tolerance is assumed to be ⁇ 0.01mm), the compression tolerance of the back screen glue 6 (assuming ⁇ 0.01mm), the design tolerance of the display screen 2 (assuming ⁇ 0.02mm), the dimensional tolerance of the solder used for patch welding between the first conductive medium 403 and the supporting conductive component 402
  • the present application reduces the design tolerance of the electronic device by designing the bracket 5 and the second conductive medium 404.
  • the electronic device also includes a bracket 5, the bottom of which abuts against the first substrate 401, dividing the space between the first substrate 401 and the display screen 2 into an upper and lower part.
  • the first conductive medium 403 protrudes from the top of the bracket 5, and is used to be electrically connected to the conductive structure 3 provided on the display screen 2.
  • the lower space is a receiving space A formed between the bracket 5 and the first substrate 401, and the supporting conductive component 402 is fixed in the receiving space A, and the bottom of the supporting conductive component 402 is electrically connected to the first substrate 401 through the second conductive medium 404, and the top is electrically connected to the first conductive medium 403.
  • the design of the bracket 5 and the second conductive medium 404 can reduce the design tolerance of the electronic device and improve the quality of the electronic device.
  • the bracket 5 may be a box-shaped structure with top and bottom openings, the bottom opening being larger than the size of the supporting conductive component 402, and the top opening being larger than the size of the first conductive medium 403 and smaller than the size of the supporting conductive component 402.
  • the top of the bracket 5 facing the first substrate 401 is fixedly connected (for example, adhesively fixed) to the top of the supporting conductive component 402 to fix the supporting conductive component 402 in the accommodation space A.
  • the first conductive medium 403 electrically connected to the supporting conductive component 402 may pass through the top opening of the bracket 5 to facilitate electrical connection with the conductive structure 3.
  • the bracket 5 may also be a structure designed based on the extension of the bracket (sometimes also called a frame, etc.) in the electronic device.
  • the electronic device generally includes one or more brackets for dividing the accommodation space A of the electronic device to fix and support the parts (such as batteries, various PCBs, interfaces, cameras, cables, etc.) that need to be placed in the accommodation space A.
  • the shapes and sizes of the brackets are different.
  • the first support arm 501 and the second support arm 502 are inverted “L” shaped structures, and the bracket 5 may include the first support arm 501 and the second support arm 502, and the first support arm 501 and the second support arm 502 are arranged opposite to each other.
  • the bottoms of the first support arm 501 and the second support arm 502 abut against the first substrate 401.
  • the first support arm 501, the second support arm 502 and the first substrate 401 form a receiving space A.
  • the top of the supporting conductive component 402 can be fixed to the first support arm 501 and the second support arm 502 by adhesive, that is, the supporting conductive component 402 is fixed to the bracket 5 by a reverse sticking method, and the bottom of the supporting conductive component 402 is elastically connected (electrically connected) to the first substrate 401 through the second conductive medium 404.
  • the dimensional tolerance of the supporting conductive component 402 can be offset by the elasticity of the second conductive medium 404, so that the dimensional tolerance of the supporting conductive component 402 does not affect the design tolerance of the electronic device.
  • the first conductive medium 403 is located between the first support arm 501 and the second support arm 502 , and the top of the first conductive medium 403 is higher than the top of the first support arm 501 and the second support arm 502 .
  • the height position of the top of the first support arm 501 and the second support arm 502 can be located at two-thirds of the height position of the first conductive medium 403.
  • the first support arm 501 and the second support arm 502 can protect the first conductive medium 403 to a certain extent, reduce the probability of the first conductive medium 403 being damaged or the electrical connection between the first conductive medium 403 and the supporting conductive component 402 being damaged during the disassembly and assembly of the electronic device, and ensure the feeding effect of the feeding structure 4.
  • the top of the first support arm 501 and the second support arm 502 need to be lower than the top of the back screen glue 6 to avoid affecting the installation of the display screen 2.
  • one side of the first support arm 501 and the second support arm 502 extends toward the first substrate 401.
  • a protective plate 503 is provided, and the first substrate 401, the protective plate 503, the first support arm 501 and the second support arm 502 form a receiving space A.
  • the protective plate 503 is used to protect the supporting conductive component 402 to prevent the supporting conductive component 402 from being damaged during the disassembly and assembly process of the electronic device.
  • first support arm 501, the second support arm 502 and the protection plate 503 may be an integrated plastic bracket.
  • the first support arm 501 and the second support arm 502 are provided with guide rails on opposite sides, and the supporting conductive component 402 is provided with grooves on the side facing the first support arm 501 and the side facing the second support arm 502.
  • the supporting conductive component 402 can be pushed into and fixed between the first support arm 501 and the second support arm 502 from the bottom of the first support arm 501 and the second support arm 502 along the guide rails, so that the guide rails on both sides of the supporting conductive component 402 are respectively abutted in the corresponding grooves.
  • the supporting conductive component 402 is prevented from shaking in the bracket 5, thereby affecting the feeding effect of the supporting conductive component 402.
  • the second conductive medium 404 when assembling the electronic device, can be first welded to the contact point of the radio frequency circuit provided on the first substrate 401 by means of fixed connection on the first substrate 401. Then the contact point at the top of the supporting conductive component 402 is fixedly connected with the bottom of the first conductive medium 403 to form an integrated structure.
  • the top of the supporting conductive component 402 is abutted against the top of the bracket 5, and the top of the first conductive medium 403 protrudes from the top of the bracket 5.
  • the second conductive medium 404 is elastically connected to the contact point at the bottom of the supporting conductive component 402.
  • the display screen 2 is adhered to the housing 1 by the back screen adhesive 6, the feed pad 301 of the conductive structure 3 is aligned with the top of the first conductive medium 403, and the first conductive medium 403 is compressed by the pressure of the display screen 2, thereby realizing the electrical connection between the first conductive medium 403 and the conductive structure 3, so that the display screen 2 can be adhered to the housing 1, and the assembly of the electronic device is completed.
  • a low-temperature solder 303 may be provided on the feeding pad 301 of the conductive structure 3.
  • the display screen 2 is locally heated in the area where the conductive structure 3 is provided, so that the low-temperature solder 303 is melted on the top of the first conductive medium 403 and electrically connected to the first conductive medium 403, thereby completing the assembly of the electronic device.

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Abstract

本申请公开了一种电子设备，涉及射频技术领域，能够解决屏下天线的馈电问题。电子设备包括：外壳(1)，外壳(1)包括后壳(101)以及侧壁(102)，显示屏(2)，显示屏(2)设置在侧壁(102)上，导电结构(3)，导电结构(3)设置在显示屏(2)上。馈电结构(4)，馈电结构(4)设置于外壳(1)内，馈电结构(4)包括沿着侧壁(102)的高度方向层叠设置的第一基板(401)、与第一基板(401)电连接的支撑导电组件(402)，和与支撑导电组件(402)电连接的第一导电介质(403)；第一导电介质(403)远离支撑导电组件(402)的一端与导电结构(3)电连接，第一基板(401)远离支撑导电组件(402)一面面向后壳(101)。

Description

一种电子设备
本申请要求于2022年09月30日提交国家知识产权局、申请号为202211217087.9、申请名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及射频技术领域，尤其涉及一种电子设备。
背景技术
手机、平板等电子设备的天线通常设置在电子设备内的印刷电路板(Printed Circuit Broad，PCB)或者外壳上，一般位于电子设备的背面或者侧面。当用户手持电子设备时，用户的手可能会遮挡在天线所在的位置，影响天线对射频信号的收发。为此，屏下天线(Antenna on Display，AOD)的设计理念应运而生。将天线设置于显示屏下，其中天线可以例如为毫米波天线。然而，如何对屏下天线进行馈电成为亟需解决的问题。
发明内容
本申请的实施例提供一种电子设备，用于解决屏下天线的馈电问题。
为达到上述目的，本申请的实施例采用如下技术方案：
本申请实施例提供了一种电子设备，包括：
外壳，外壳包括后壳以及侧壁；显示屏，显示屏设置在侧壁上；导电结构，导电结构设置在显示屏上；馈电结构，馈电结构设置于外壳内，馈电结构包括沿着侧壁的高度方向层叠设置的第一基板、与第一基板电连接的支撑导电组件，和与支撑导电组件电连接的第一导电介质；第一导电介质远离支撑导电组件的一端与导电结构电连接，第一基板远离支撑导电组件一面面向后壳。
在本申请提供的电子设备中，针对设置于显示屏上的导电结构，沿着电子设备的厚度方向设计了馈电结构，馈电结构中的第一基板通过支撑导电组件和第一导电介质实现与导电结构之间射频信号的传输。且可以基于电子设备的具体尺寸和适用场景，对支撑导电组件和/或第一导电介质的尺寸进行调节，以在保证馈电可靠性的基础上，使得馈电结构适用于各种尺寸的电子设备。
可选的，第一导电介质可以为具备弹性的导电介质，例如导电硅胶、弹片、导电泡棉、导电石墨、可压缩的多孔隙导电材料等。
基于该可选的方式，馈电结构通过第一导电介质与导电结构之间弹性连接，在一定程度上降低了拆装过程中馈电结构对导电结构的冲击，从而降低了导电结构出现损件的概率。同时使得第一导电介质能够在弹力作用下与导电结构充分接触，保证了对屏下设置的导电结构的馈电可靠性。
在一些可能的实现方式中，第一导电介质可以选择设置有通孔的导电硅胶(该结构的导电硅胶有时也称为导电端子)。示例性的，通孔的开设方向可以与高度方向(即电子设备的厚度方向)垂直。一方面，导电硅胶为非刚性材质，能够与导电结构之间软接触，避免拆装过程中损坏导电结构。另一方面，设置有孔隙的导电硅胶的压缩性能较好，既能够使得导电结构和第一导电介质在弹力作用下充分抵接，保证导电结构和第一导电介质之间电连接的可靠性，又能够避免第一导电介质难以压缩而导致弹力过大，导致显示屏难以安装。
在一些可能的实现方式中，支撑导电组件和第一导电介质之间固定连接。
例如，可以采用能够导电的焊接材料(例如锡)进行焊接。
通过采用上述方案，支撑导电组件和第一导电介质采用固定连接的方式实现电连接，能够保证电连接的可靠性，在传输射频信号的过程中，避免了出现杂散电场或磁场对射频信号的传输造成干扰的问题，进而保证了传递过程中射频信号的稳定性和可靠性。
在一些可能的实现方式中，支撑导电组件包括至少一层第二基板。
通过采用上述方案，可以根据电子设备的厚度调节第二基板的层数，以实现不同厚度的电子设备内对导电结构的馈电，使得馈电结构的适用性更广。
其中，第二基板可以均为硬质基板，例如，基于栅格阵列封装(Land Grid Array，LGA)的基板。
通过采用上述方案，由于栅格阵列封装技术的制作成本较低，且栅格阵列封装的基板硬度较高，不易产生磨损，因此，第二基板采用栅格阵列封装的基板，在节约成本的前提下保证了射频信号传输的稳定性。
可选的第二基板也可以均为软质基板，例如，软性线路板(Flexible Printed Circuit，FPC)、基于液晶聚合物(Liquid Crystal Polymer，LCP)制成的FPC等。可选的，为了避免软质基板在与第一基板电连接时，软质基板发生形变，影响馈电效果，软质基板可以折叠设置，或包裹在支撑板(例如绝缘支撑板)，提高软质基板的支撑能力。
在一些可能的实现方式中，支撑导电组件和第一基板之间固定连接。
例如，可以采用能够导电的焊接材料(例如锡)进行焊接。
通过采用上述方案，支撑导电组件和第一基板采用固定连接的方式实现电连接，保证电连接的可靠性，在传输射频信号的过程中，避免了出现杂散电场或磁场对射频信号的传输造成干扰的问题，进而保证了传递过程中射频信号的稳定性和可靠性。
在一些可能的实现方式中，第一基板上设置有第二导电介质，支撑导电组件通过第二导电介质与第一基板电连接。
可选的，第二导电介质可以是导电弹性件，例如弹片、可焊接导电弹脚等能够导电且具备弹性的结构。
在上述可选的方式中，通过第二导电介质加高支撑导电组件的高度，从而可以降低第一导电介质的高度设计值，以降低在电子设备拆装过程中第一导电介质的损件概率。
在一些可能的实现方式中，电子设备还包括支架，支架的底部抵接在第一基板上，支架的一部分与第一基板的一部分形成容纳空间，支撑导电组件固定于容纳空间内，第一导电介质凸出于支架的顶部。
基于上述可能的实现方式，由于支架为固定结构，支架与第一基板之间形成的容纳空间的高度是固定的，而第二导电介质具备弹性，那么在安装支撑导电组件时，支撑导电组件的尺寸公差将被第二导电介质的弹性抵消，也就是说支撑导电组件的尺寸公差将不影响电子设备的设计公差。因此，通过支架和第二导电介质的设计可以减小电子设备的设计公差，提高电子设备的质量。
在一些可能的实现方式中，支架包括第一支撑臂和第二支撑臂，第一支撑臂和第二支撑臂相对设置，第一支撑臂和第二支撑臂的底部抵接在第一基板上，第一支撑臂、第二支撑臂和第一基板的一部分形成容纳空间；第一导电介质位于第一支撑臂和第二支撑臂之间，且第一导电介质的顶部高于支架的顶部。
在一些可能的实现方式中，第一支撑臂和第二支撑臂的同一侧朝向第一基板的方向延伸设置有保护板，保护板、第一支撑臂、第二支撑臂和第一基板形成该容纳空间。
基于上述可能的实现方式，设计保护板对支撑导电组件进行保护，降低在拆装电子设备的过程中支撑导电组件被损坏的可能性。
在一些可能的实现方式中，第一支撑臂和第二支撑臂上相对的两侧分别设置有导轨，支撑导电组件面向第一支撑臂的一侧和面向第二支撑臂的一侧分别设置有凹槽，支撑导电组件固定于该容纳空间时，两侧的导轨分别抵接在对应的凹槽内。
在一些可能的实现方式中，支撑导电组件固定于容纳空间时，支撑导电组件的顶部与支架固定连接。例如，可以通过粘贴的方式固定连接。
在一些可能的实现方式中，导电结构上设置有低温焊料，导电结构通过低温焊料与第一导电介质电连接。
通过采用上述方案，第一导电介质只需与导电结构接触即可在低温焊料的焊接作用下实现电连接，无需第一导电介质提供较大的弹力，从而减小第一导电介质的高度设计值，以降低第一导电介质的损件概率。通过低温焊料保证了第一导电介质和导电结构电连接的牢固性，进而保证了射频信号传输的稳定性。
在一些可能的实现方式中，导电结构设置在显示屏面向后壳的一面。
在上述可能的实现方式中，导电结构可以制成膜片形式，直接贴在显示屏上即可，提高组装效率。
在一些可能的实现方式中，导电结构包括导体和与导体电连接的馈电焊盘，天线设置在显示屏内，馈电焊盘设置在显示屏面向后壳的一面，馈电焊盘与第一导电介质电连接。
在一些可能的实现方式中显示屏和侧壁通过背屏胶连接。
通过采用上述方案，背屏胶具有价格低廉、环保和保存时间长等优点，本申请实施例中显示屏和侧壁通过背屏胶连接，既保证了两者之间连接的可靠性，又节约了制作成本。
附图说明
图1为本申请实施例提供的一种电子设备的结构示意图一；
图2为本申请实施例提供的一种电子设备的结构示意图二；
图3为本申请实施例提供的一种支撑导电组件的结构示意图；
图4为本申请实施例提供的一种第一导电介质的结构示意图；
图5为本申请实施例提供的一种电子设备的结构示意图三；
图6为本申请实施例提供的一种电子设备的结构示意图四；
图7为本申请实施例提供的一种电子设备的结构示意图五；
图8为本申请实施例提供的一种电子设备的结构示意图六；
图9为本申请实施例提供的一种支架的正面结构示意图；
图10为本申请实施例提供的一种支架的背面结构示意图；
图11为本申请实施例提供的一种电子设备的结构示意图七；
图12为本申请实施例提供的一种电子设备的结构示意图八；
图13为本申请实施例提供的一种支架和支撑导电组件的结构示意图；
图14为本申请实施例提供的一种电子设备的结构示意图九。
附图标记：
1、外壳；101、后壳；102、侧壁；
2、显示屏；
3、导电结构；301、馈电焊盘；302、导体；303、低温焊料；
4、馈电结构；401、第一基板；402、支撑导电组件；403、第一导电介质；404、第二导电介质；
5、支架；501、第一支撑臂；502、第二支撑臂；503、保护板；
6、背屏胶。
具体实施方式
基于屏下天线的设计理念，本申请实施例提供一种电子设备，设计了针对屏下天线的馈电结构，能够提高馈电可靠性，且在保证馈电可靠性的基础上，使得能够适用于各种尺寸的电子设备。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请实施例的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。
在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含 义。
术语“电连接”应做广义理解，例如，可以是通过直接连接的方式实现电流导通，也可以是通过电容耦合的方式实现电能量传导。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本申请的描述中，需要理解的是，术语“内”、“外”、“侧”、“上”、“底”、“前”、“后”等指示的方位或者位置关系(若有的话)为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
还需说明的是，本申请实施例中以同一附图标记表示同一组成部分或同一零部件，对于本申请实施例中相同的零部件，图中可能仅以其中一个零件或部件为例标注了附图标记，应理解的是，对于其他相同的零件或部件，附图标记同样适用。
如图1所示为本申请实施例提供的电子设备的结构示意图，至少包括外壳1、显示屏2、导电结构3和馈电结构4。其中，外壳1包括后壳101以及侧壁102。在一个实施例中，侧壁102与后壳101在后壳101的边沿处连接。在一个实施例中，后壳101和侧壁102为一体成型。当将显示屏2设置在侧壁102上后，外壳1与显示屏2之间形成容纳空间A，该容纳空间A可用于容纳该电子设备的其他零部件，例如电池、各个PCB(例如包括主板、副板等)、转接排线、导电结构3、支架(或者称为框架、中框等)、摄像头等。
可选的，如图1所示，显示屏2可以通过背屏胶6粘贴在侧壁102上。在本申请实施例中，外壳1可以是金属外壳也可以是非金属外壳(例如玻璃等)。显示屏2可以是集成有触控功能的液晶显示屏(Liquid Crystal Display，LCD)，或者是集成有触控功能的有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏等。外壳1的材质以及显示屏2的类型具体可以根据电子设备的实际产品设计需求进行选择，对此本申请不做限制。
在本申请实施例中，导电结构3设置在显示屏2上，馈电结构4沿着电子设备的厚度方向设置于外壳1内，即馈电结构4的底部放置在电子设备的后壳101上，将显示屏2安装在安装外壳1上之后，馈电结构4的顶端抵在导电结构3上，与导电结构3实现电连接，以对导电结构3进行馈电。
值得说明的是，这里的馈电是指使得导电结构3与馈电结构4之间能够传输射频信号。即导电结构3可以作为电子设备的天线组件，能够将接收到的来自其他设备的射频信号传输给馈电结构4，以使得馈电结构4能够对其他设备的射频信号进行相关信号处理，以及馈电结构4能够将待发送给其他设备的射频信号传输给导电结构3，以使得导电结构3能够将射频信号发送给其他设备。
示例性的，导电结构3可以设置在显示屏2的非显示区，即位于显示屏2边缘的黑框(Black Matrix，BM)区域。导电结构3也可以设置在显示区，例如，设置在显示区的中间，或者显示区的边缘位置。
其中，导电结构3可以包括馈电焊盘301和导体302，导体302可以是透明的辐射体，例如毫米波天线，馈电焊盘301也可以称为导电平面，用于传输导体302收发的射频信号，即将天线接收到的来自其他设备发送的射频信号传输给馈电结构4，以及将馈电结构4传输的射频信号传输给导体302，以使得天线可以向其他设备发送射频信号。
在本申请实施例中，如图1所示，馈电焊盘301和导体302可以制成天线膜片(或者称为天线贴片)，设置在显示屏2面向后壳101的一面。例如，导电结构3可以直接粘贴在显示屏2的 指定位置上，并使得导电结构3的馈电焊盘301朝向后壳101。从而当将显示屏2安装在外壳1上之后，馈电结构4的顶部能够抵接在上馈电焊盘301，实现导电结构3与馈电结构4之间的电连接。
在另一个示例中，相比于常规的天线(即直接制备在外壳或者主板上的天线)，屏下天线由于脱离主板/外壳设置，导致屏下天线在外力冲击下容易出现损件的问题。例如，导体302可能被折损，导致电子设备无法正常收发射频信号。和/或，馈电焊盘301被损坏，导致馈电焊盘301无法正常馈电，从而导致电子设备无法正常收发射频信号。因此，在本申请实施例中，导电结构3也可以直接集成在显示屏2上，提高导电结构3的抗冲击性能，降低导电结构3在组装过程中被损坏的可能性。
例如，如图2所示，可以将导体302设置在显示屏2内，比如可以将导体302设置在显示屏2的背板内，将馈电焊盘301设在在显示屏2的表面(即面向后壳101的一面)，导体302和馈电焊盘301之间通过在显示屏内布线(比如在背板上布线)实现电连接。
可以理解的是，在该示例中，由于导体302设置在显示屏2内，馈电焊盘301设置于显示屏2表面，用于与馈电结构4电连接。因此，显示屏2为对导电结构3提供了支撑，提高了导电结构3的抗冲击性能，在一定程度上保证了导电结构3中天线接收和传递射频信号的稳定性，降低了出现损件的风险。
如图1所示，馈电结构4包括第一基板401、与第一基板401电连接的支撑导电组件402，和与支撑导电组件402电连接的第一导电介质403。第一基板401、支撑导电组件402和第一导电介质403沿着侧壁102的高度方向依次层叠设置。其中，第一导电介质403与导电结构3电连接，第一基板401远离支撑导电组件402的一面面向后壳101，支撑导电组件402设置与第一导电介质403和第一基板401之间。
其中，第一基板401可以为电子设备的主板。第一基板401上集成有电子设备的各种控制电路(例如，电池控制电路、射频电路、驱动电路)、处理器、存储器、各种传感器等模块，各个模块之间通过第一基板401上部署的走线连接。
在本申请实施例中，所谓馈电具体是指在导体302与第一基板401上的射频电路之间的传输射频信号。例如，当导体302接收来自其他设备的射频信号时，能够通过馈电焊盘301将射频信号传输给射频电路，以使得射频电路可以将该射频信号转换成基带信号并传输给处理器，处理器将该基带信号转换为数据进行处理，并控制电子设备进行响应。以及，当需要向其他设备发送数据时，处理器对待发送的数据进行基带处理后，输出基带信号至射频电路进行射频处理，得到射频信号，射频电路将该射频信号传输给馈电焊盘301，以发送至导体302，通过导体302以电磁波的形式向外发送。
在本申请实施例提供的馈电结构4中，具体通过支撑导电组件402和第一导电介质403实现第一基板401与导电结构3之间的电连接，在第一基板401与导电结构3传输射频信号。
其中，支撑导电组件402可以是具备信号传输功能的支撑结构，例如，支撑导电组件402可以包括至少一层第二基板。至少一个第二基板可以均为硬质基板，例如基于LGA封装的基板(以下称为LGA基板)。LGA基板的制作成本较低，且LGA基板的硬度较高，不易产生磨损，能够有效保证射频信号传输的稳定性。
可选的，至少一个第二基板也可以均为软质基板，例如，软性线路板(Flexible Printed Circuit，FPC)、基于液晶聚合物(Liquid Crystal Polymer，LCP)制成的FPC等。在该实施例中，可以将软质基板折叠设置，增大软质基板的厚度，提高软质基板的支撑能力。或者，为避免软质基板在安装过程中发生形变，影响射频信号的传输，如图3所示，也可以将软质基板包裹在具备一定硬度的支撑板(例如绝缘支撑板)上，通过支撑板提供厚度方向上的支撑功能，通过软质基板提供射频信号的传输功能。
可选的，当设置至少两层第二基板时，该至少两层第二基板可以包括硬质基板和软质基板，例如，支撑导电组件402包括两层第二基板，分别为一层LGA基板和一层FPC。
在本申请实施例中，可以根据电子设备的实际厚度灵活调节第二基板的层数，以保证馈电结构4的对导电结构3馈电的情况下，适应不同尺寸的电子设备。当支撑导电组件402设置至少两 层第二基板时，第二基板与第二基板之间可以固定连接的方式进行电连接，保证射频信号在第二基板与第二基板之间传输的稳定性和可靠性。
可选的，若电子设备的厚度较大，支撑导电组件402也可以是线缆，通过线缆实现第一基板401与第一导电介质403之间的电连接。
在本申请实施例中，支撑导电组件402和第一基板401可以固定连接的方式进行电连接，例如，第一基板401上设置有射频电路的接触点，具体可以将支撑导电组件402的底部焊接在对应的接触点上，以使得支撑导电组件402能够与射频电路传输射频信号。贴片焊接的方式，能够有效避免杂散电场或磁场对射频信号的传输造成干扰的问题，进而保证了传递过程中射频信号的稳定性和可靠性。
支撑导电组件402的顶部与第一导电介质403电连接。第一导电介质403可以为具备弹性的导电介质，例如导电硅胶、弹片、导电泡棉、导电石墨、可压缩的多孔隙导电材料等。由于导电结构3是屏下天线结构，在组装过程中，容易在外力冲击下损件，导致电子设备无法正常收发射频信号，因此，在本申请实施例中，通过第一导电介质403与导电结构3弹性连接，降低组装过程中馈电结构4对导电结构3的冲击，从而降低导电结构3损件的概率。
在本申请的一个实施例中，在一个实施例中，第一导电介质403可以为有一定压缩空间的弹性导电介质，如图4所示，第一导电介质403可以选择设置有通孔的导电硅胶(该结构的导电硅胶有时也称为导电端子)。当第一导电介质403应用于该馈电结构4中时，该通孔的开设方向与电子设备的厚度方向垂直。如此，一方面，导电硅胶为非刚性材质，能够与导电结构3之间软接触，避免拆装过程中损坏导电结构3。另一方面，设置有孔隙的导电硅胶的压缩性能较好，既能够使得导电结构3和第一导电介质403在弹力作用下充分抵接，保证导电结构3和第一导电介质403之间电连接的可靠性，又能够避免第一导电介质403难以压缩而导致弹力过大，导致显示屏2难以安装。
例如，在组装电子设备时，可以先将第一基板401、支撑导电组件402和第一导电介质403组装在一起，形成一体化的馈电结构4。示例性的，在本申请实施例中，可以采用贴片焊接的方式组装馈电结构4。例如，第一基板401上设置有射频电路的接触点，支撑导电组件402的底部和顶部分别设置有接触点，且底部的接触点和顶部的接触点通过支撑导电组件402内设置的布线连接，用于传输射频信号。可以将支撑导电组件402底部的接触点与第一基板401上射频电路的接触点固定连接，然后将支撑导电组件402顶部的接触点与第一导电介质403的底部固定连接，得到一体化的馈电结构4。
示例性的，采用能够导电的焊接材料(例如锡)焊接的方式实现上述固定连接，能够有效避免杂散电场或磁场对射频信号的传输造成干扰的问题，从而提高射频信号在馈电结构4中传递时的稳定性和可靠性。
需要说明的是，在本申请实施例中，馈电结构4的厚度H1(即第一基板401的底部到第一导电介质403的顶部之间的距离)大于外壳1的侧壁102的高度与背屏胶6的厚度之和H2。因此，如图5所示，在将第一基板401放置到外壳1的后壳101上，安装显示屏2之前，第一导电介质403的顶部伸出外壳1。之后，在将导电结构3通过背屏胶6粘贴在外壳1上时，导电结构3的馈电焊盘301与第一导电介质403的顶部对齐，第一导电介质403受到显示屏2的压力而回缩，使得显示屏2能够粘贴外壳1上，完成电子设备的组装。而组装完成后，第一导电介质403受到压缩的同时也产生弹力，施加在导电结构3上，使得导电结构3和第一导电介质403在弹力作用下充分抵接，保证了导电结构3和第一导电介质403之间电连接的可靠性。
可以理解的是，在本申请提供的电子设备中，针对设置于显示屏2上的导电结构3，沿着电子设备的厚度方向设计了馈电结构4，馈电结构4中的第一基板401通过支撑导电组件402和第一导电介质403实现与导电结构之间射频信号的传输。一方面，馈电结构4通过第一导电介质403与导电结构3之间弹性连接，在一定程度上降低了拆装过程中馈电结构4对导电结构3的冲击，从而降低了导电结构3出现损件的概率。同时使得第一导电介质403能够在弹力作用下与导电结构3的馈电焊盘301充分接触，保证了对屏下设置的导电结构3的馈电可靠性。另一方面，可以基于电子设备的具体尺寸和适用场景，对支撑导电组件402和/或第一导电介质403的尺寸进行调 节，以在保证馈电可靠性的基础上，使得馈电结构4适用于各种尺寸的电子设备。
在本申请实施例中，第一导电介质403的高度具体可以根据电子设备的容纳空间A的极限公差、第一基板401的物料尺寸、支撑导电组件402的尺寸、以及第一导电介质403的工作范围(即压缩率范围)来确定。例如，容纳空间A的极限公差为a，根据容纳空间A的高度H2以及第一基板401的物料尺寸b(厚度)、支撑导电组件402的物料尺寸c(厚度)，确定第一导电介质403的自然高度至少为d(假设H2-b-c＝d)。假设第一导电介质403的工作范围为20％～45％之间，为了保证第一导电介质403与导电结构3之间电连接的可靠性，那么，第一导电介质403的高度设计值可以为d+0.2d+a。通过第一导电介质403的压缩性能，可以抵消系统的极限公差。
可以理解的是，组装电子设备之前，或者电子设备拆机之后，第一导电介质403的高度大约为d+0.2d+a，第一导电介质403的顶部高于外壳1上背屏胶6大约0.2d+a的高度。而在组装好电子设备后，在容纳空间A内，第一导电介质403的高度被压缩为d。
在一种可能的情况下，当第一导电介质403设计的高度较高时，可能会导致第一导电介质403被压缩后产生的弹力过大，从而导致显示屏2在高温高湿度条件下容易发生脱胶(即显示屏2从外壳1上脱离)。例如，第一导电介质403为如图4所示的导电硅胶，当极限公差为0.6mm，H2＝4.7mm时，导电硅胶的高度设计值可能超过3mm，那么当将电子设备组装完成后，导电硅胶压缩后对显示屏2的弹力超过1.5N，从而导致显示屏2在高温高湿度条件下容易发生脱胶。且若导电结构3设计在显示区或者靠近显示区的位置，导电结构3附近的显示区可能还会出现水波纹和红蓝斑。
为此，在一个实例中，第一导电介质403还可以通过低温焊料303进行电连接。例如，如图6所示，在外壳1上安装显示屏2之前，可以在导电结构3的馈电焊盘301上设置低温焊料303。在外壳1上通过背屏胶6粘贴上显示屏2后，在设置导电结构3的区域对显示屏2进行局部加热，使得低温焊料303熔接在第一导电介质403的顶端，与第一导电介质403电连接。
其中，低温焊料303的焊接温度在56℃(摄氏度)～100℃之间，能够在不烧坏电子设备中其他器件的情况下，实现焊接的焊接材料，例如，可以是SnBiInZr(锡铋铟锆)合金，也可以是其他焊接温度较低的焊料，对此，本申请不做限制。
可以理解的是，在该示例中，第一导电介质403无需依赖于较大的弹力与导电结构3之间维持可靠的电连接，通过低温焊料303即可保证第一导电介质403与导电结构3之间电连接的可靠性，因此在设计第一导电介质403时，可以减小高度，即在考虑到极限公差的情况下，第一导电介质403的高度设计值可以为d+a。即在未安装显示屏2时，第一导电介质403的高度高于背屏胶6大约一个极限公差a的高度，用以抵消电子设备的极限公差。在设计低温焊料303的情况下，第一导电介质403的高度减小，从而使得第一导电介质403在压缩后对显示屏2的弹力减小。同时第一导电介质403的高度减小，也能够降低在电子设备拆装过程中第一导电介质403的损件概率。
相应的，当第一导电介质403为如图4所示的导电硅胶，在同样的测试条件下，当极限公差为0.6mm，H2＝4.7mm时，导电硅胶的高度小于3mm，压缩后导电硅胶对显示屏2的弹力大约在1.09N左右，在高温高湿度条件下显示屏2未发生脱胶现象。导电结构3附近的显示区也没有出现水波纹和红蓝斑。
可选的，如图7所示，第一基板401上也可以设置有第二导电介质404，第二导电介质404可以固定连接在第一基板401对应的位置(即射频电路的接触点)上，并与支撑导电组件402电连接。
通过第二导电介质404加高支撑导电组件402的高度，从而可以降低第一导电介质403的高度设计值，以降低在电子设备拆装过程中第一导电介质403的损件概率。
可选的，第二导电介质404可以是具备弹性的导电弹性件，例如弹片、可焊接导电弹脚等能够导电且具备弹性的结构。
可以理解的是，电子设备中的各个零件的公差影响着电子设备的极限公差、统计公差等设计公差，从而影响着电子设备的质量。例如，针对如图1所示的电子设备，各个零件的公差包括第一基板401的尺寸公差(假设为±0.07mm)，支撑导电组件402的尺寸公差(例如至少一层LGA 的尺寸公差，假设为±0.25mm)，第一导电介质403的尺寸公差(例如，假设为±0.1mm)，后壳101的厚度公差(假设为±0.1mm)，导电结构3的设计公差(例如，膜片形式下，设计公差假设为±0.01mm)，背屏胶6的压缩公差(假设为±0.01mm)，显示屏2的设计公差(假设为±0.02mm)，第一导电介质403与支撑导电组件402在贴片焊接时使用的焊锡尺寸公差(假设为±0.02mm)等。当要求电子设备的容纳空间A的高度为4.7mm时，电子设备的极限公差为0.6mm，统计公差为0.4mm。
为此，本申请通过支架5和第二导电介质404的设计来减小电子设备的设计公差。示例性的，如图8所示，电子设备还包括支架5，支架5的底部抵接在第一基板401上，将第一基板401到显示屏2之间空间划分为上下两部分。在上半部分空间中，第一导电介质403凸出于支架5的顶部，用于与显示屏2上设置的额导电结构3电连接。下部分空间为支架5与第一基板401之间形成的容纳空间A，支撑导电组件402固定于该容纳空间A内，支撑导电组件402的底部通过第二导电介质404与第一基板401电连接，顶部与第一导电介质403电连接。
可以理解的是，由于支架5为固定结构，容纳空间A的高度是固定的，而第二导电介质404具备弹性，那么在安装支撑导电组件402时，支撑导电组件402的尺寸公差将被第二导电介质404的弹性抵消，也就是说支撑导电组件402的尺寸公差(例如，上述列举的0.25mm的尺寸公差)将不影响电子设备的设计公差。相应的，当要求电子设备的容纳空间A的高度为4.7mm时，通过设计支架5和第二导电介质404，电子设备的极限公差缩小为0.35mm，统计公差缩小为0.2mm。因此，通过支架5和第二导电介质404的设计可以减小电子设备的设计公差，提高电子设备的质量。
示例性的，如图8所示，支架5可以是顶部和底部开口设置的盒状结构，底部开口大于支撑导电组件402的尺寸，顶部开口大于第一导电介质403的尺寸，且小于支撑导电组件402的尺寸。支架5的顶部面向第一基板401的一面与支撑导电组件402的顶部固定连接(例如，粘接固定)，以将支撑导电组件402固定在容纳空间A内。与支撑导电组件402电连接的第一导电介质403可穿过支架5的顶部开口，以便于与导电结构3电连接。
可选的，支架5也可以是基于电子设备中的支架(有时也称为边框等)延伸设计的结构。电子设备中一般包括一个或多个支架，用于分割电子设备的容纳空间A，以固定、支撑需要放置在该容纳空间A中的零件(例如电池、各个PCB、接口、摄像头、排线等)，各个支架的形状大小不尽相同。
在一个示例中，如图9所示的正面结构示意图，和如图10所示的背面结构示意图，第一支撑臂501和第二支撑臂502为倒“L”形结构，支架5可以包括第一支撑臂501和第二支撑臂502，第一支撑臂501和第二支撑臂502相对设置。
如图11所示的正面结构示意图，和如图12所示的背面结构示意图，第一支撑臂501和第二支撑臂502的底部抵接在第一基板401上。第一支撑臂501、第二支撑臂502和第一基板401形成容纳空间A。支撑导电组件402的顶部可以通过粘胶固定在第一支撑臂501和第二支撑臂502上，也就是说支撑导电组件402采用反贴的方式固定在支架5上，支撑导电组件402的底部通过第二导电介质404与第一基板401弹性连接(电连接)。如此，在保护板503与第一基板401之间的固定空间内，支撑导电组件402的尺寸公差，可以被第二导电介质404的弹性抵消，使得支撑导电组件402的尺寸公差不影响电子设备的设计公差。
第一导电介质403位于第一支撑臂501和第二支撑臂502之间，且第一导电介质403的顶部高于第一支撑臂501和第二支撑臂502的顶部。
例如，如图11所示，以外壳1的侧壁102的底部为基准，第一支撑臂501和第二支撑臂502顶部所在高度位置可以位于第一导电介质403的三分之二所在高度位置，如此，第一支撑臂501和第二支撑臂502能够在一定程度上对第一导电介质403进行保护，降低在电子设备的拆装过程中，第一导电介质403被损坏或者第一导电介质403与支撑导电组件402之间的电连接被损坏的概率，保证馈电结构4的馈电效果。当然，可以理解的是，第一支撑臂501和第二支撑臂502顶部需低于背屏胶6的顶部，避免影响显示屏2的安装。
可选的，如图11所示，第一支撑臂501和第二支撑臂502的一侧朝向第一基板401的方向延 伸设置有保护板503，第一基板401、保护板503、第一支撑臂501和第二支撑臂502形成容纳空间A。该保护板503用于保护支撑导电组件402，避免支撑导电组件402在电子设备的拆装过程中被损坏。
可选的，第一支撑臂501、第二支撑臂502和保护板503可以是一体化设置的塑胶支架。
可选的，如图13所示，第一支撑臂501和第二支撑臂502相对的两侧分别设置有导轨，支撑导电组件402面向第一支撑臂501的一侧和面向第二支撑臂502的一侧分别设置有凹槽。可以将支撑导电组件402从第一支撑臂501和第二支撑臂502的底部，沿着导轨推入并固定在第一支撑臂501和第二支撑臂502之间，使得支撑导电组件402两侧的导轨分别抵接在对应的凹槽内。通过导轨和凹槽的设计，避免支撑导电组件402在支架5内晃动从而影响支撑导电组件402的馈电效果。
可以理解的是，针对支架5和第二导电介质404的设计，在组装电子设备时，可以先在第一基板401上固定连接的方式，将第二导电介质404焊接在第一基板401上设置的射频电路的接触点上。然后支撑导电组件402顶部的接触点与第一导电介质403的底部固定连接在一起，形成一体化结构。在将第一导电介质403和支撑导电组件402安装入支架5内，使得支撑导电组件402顶部与支架5的顶部抵接，第一导电介质403的顶部凸出于支架5的顶部。在将焊接有第二导电介质404的第一基板401、组装在一起的支架5和第一导电介质403以及支撑导电组件402放入外壳1内，使得第二导电介质404与支撑导电组件402底部的接触点弹性连接。最后在显示屏2通过背屏胶6粘贴在外壳1上时，导电结构3的馈电焊盘301与第一导电介质403的顶部对齐，第一导电介质403受到显示屏2的压力而被压缩，实现第一导电介质403与导电结构3的电连接，使得显示屏2能够粘贴外壳1上，完成电子设备的组装。
可选的，如图14所示，在安装显示屏2之前，也可以在导电结构3的馈电焊盘301上设置低温焊料303。在外壳1上粘贴上显示屏2后，在设置导电结构3的区域对显示屏2进行局部加热，使得低温焊料303熔接在第一导电介质403的顶端，与第一导电介质403电连接，完成电子设备的组装。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (17)

  1. 一种电子设备，其特征在于，所述电子设备包括：
    外壳(1)，所述外壳(1)包括后壳(101)以及侧壁(102)；
    显示屏(2)，所述显示屏(2)设置在所述侧壁(102)上；
    导电结构(3)，所述导电结构(3)设置在所述显示屏(2)上；
    馈电结构(4)，所述馈电结构(4)设置于所述外壳(1)内，所述馈电结构(4)包括沿着所述侧壁(102)的高度方向层叠设置的第一基板(401)、与所述第一基板(401)电连接的支撑导电组件(402)，和与所述支撑导电组件(402)电连接的第一导电介质(403)；所述第一导电介质(403)远离所述支撑导电组件(402)的一端与所述导电结构(3)电连接，所述第一基板(401)远离所述支撑导电组件(402)一面面向所述后壳(101)。
  2. 根据权利要求1所述的电子设备，其特征在于，所述第一导电介质(403)为导电硅胶。
  3. 根据权利要求2所述的电子设备，其特征在于，所述导电硅胶上设置有通孔，所述通孔的开设方向与所述高度方向垂直。
  4. 根据权利要求1-3任一项所述的电子设备，其特征在于，所述支撑导电组件(402)和所述第一导电介质(403)之间固定连接。
  5. 根据权利要求1-4任一项所述的电子设备，其特征在于，所述支撑导电组件(402)包括第二基板。
  6. 根据权利要求5所述的电子设备，其特征在于，所述第二基板为基于栅格阵列封装LGA的基板。
  7. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述支撑导电组件(402)和所述第一基板(401)之间固定连接。
  8. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述第一基板(401)上设置有第二导电介质(404)，所述支撑导电组件(402)通过所述第二导电介质(404)与所述第一基板(401)电连接。
  9. 根据权利要求8所述的电子设备，其特征在于，所述第二导电介质(404)为导电弹脚。
  10. 根据权利要求8或9所述的电子设备，其特征在于，所述电子设备还包括支架(5)，所述支架(5)的底部抵接在所述第一基板(401)上，所述支架(5)的一部分与所述第一基板(401)的一部分形成容纳空间，所述支撑导电组件(402)固定于所述容纳空间内，所述第一导电介质(403)凸出于所述支架(5)的顶部。
  11. 根据权利要求10所述的电子设备，其特征在于，所述支架(5)包括第一支撑臂(501)和第二支撑臂(502)，所述第一支撑臂(501)和所述第二支撑臂(502)相对设置，所述第一支撑臂(501)和所述第二支撑臂(502)的底部抵接在所述第一基板(401)上，所述第一支撑臂(501)、所述第二支撑臂(502)和所述第一基板(401)的一部分形成所述容纳空间；所述第一导电介质(403)位于所述第一支撑臂(501)和所述第二支撑臂(502)之间，且所述第一导电介质(403)的顶部高于所述支架(5)的顶部。
  12. 根据权利要求11所述的电子设备，其特征在于，所述第一支撑臂(501)和所述第二支撑臂(502)的同一侧朝向所述第一基板(401)的方向延伸设置有保护板(503)，所述保护板(503)、所述第一支撑臂(501)、所述第二支撑臂(502)和所述第一基板(401)形成所述容纳空间。
  13. 根据权利要求11或12所述的电子设备，其特征在于，所述第一支撑臂(501)和所述第二支撑臂(502)上相对的两侧分别设置有导轨，所述支撑导电组件(402)面向所述第一支撑臂(501)的一侧和面向所述第二支撑臂(502)的一侧分别设置有凹槽，所述支撑导电组件(402)固定于所述容纳空间时，两侧的所述导轨分别抵接在对应的所述凹槽内。
  14. 根据权利要求10-12任一项所述的电子设备，其特征在于，所述支撑导电组件(402)固定于所述容纳空间时，所述支撑导电组件(402)的顶部与所述支架(5)固定连接。
  15. 根据权利要求1-14任一项所述的电子设备，其特征在于，所述导电结构(3)上设置有低温焊料，所述导电结构(3)通过所述低温焊料与所述第一导电介质(403)电连接。
  16. 根据权利要求1-15任一项所述的电子设备，其特征在于，所述导电结构(3)设置在所述显示屏(2)面向所述后壳(101)的一面。
  17. 根据权利要求1-16任一项所述的电子设备，其特征在于，所述导电结构(3)包括导体(302)和与所述导体(302)电连接的馈电焊盘(301)，所述导体(302)设置在所述显示屏(2)内，所述馈电焊盘(301)设置在所述显示屏(2)面向所述后壳(101)的一面，所述馈电焊盘(301)与所述第一导电介质(403)电连接。
PCT/CN2023/120335 2022-09-30 2023-09-21 一种电子设备 WO2024067341A1 (zh)

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CN112578925A (zh) * 2019-09-29 2021-03-30 昆山国显光电有限公司 触控显示面板及触控显示装置
CN112701445A (zh) * 2019-10-22 2021-04-23 北京小米移动软件有限公司 天线装置及移动终端
CN113782965A (zh) * 2021-09-28 2021-12-10 维沃移动通信有限公司 屏幕组件和电子设备
WO2022025539A1 (ko) * 2020-07-31 2022-02-03 삼성전자 주식회사 차폐 및 방열 구조를 포함하는 전자 장치
CN114512828A (zh) * 2020-11-16 2022-05-17 华为技术有限公司 屏下天线的管理方法及装置
CN114597633A (zh) * 2022-04-18 2022-06-07 高创(苏州)电子有限公司 设备主板和电子设备
WO2022121765A1 (zh) * 2020-12-08 2022-06-16 维沃移动通信有限公司 显示屏模组及电子设备

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CN112578925A (zh) * 2019-09-29 2021-03-30 昆山国显光电有限公司 触控显示面板及触控显示装置
CN112701445A (zh) * 2019-10-22 2021-04-23 北京小米移动软件有限公司 天线装置及移动终端
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WO2022121765A1 (zh) * 2020-12-08 2022-06-16 维沃移动通信有限公司 显示屏模组及电子设备
CN113782965A (zh) * 2021-09-28 2021-12-10 维沃移动通信有限公司 屏幕组件和电子设备
CN114597633A (zh) * 2022-04-18 2022-06-07 高创(苏州)电子有限公司 设备主板和电子设备

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