WO2024067101A1 - Dielectric antenna array and integrated preparation method - Google Patents

Abstract

Provided in the present disclosure are a dielectric antenna array and an integrated preparation method. The dielectric antenna array comprises: a plurality of dielectric resonators 1 and a multi-layer dielectric substrate 11, wherein each dielectric resonator 1 is bonded onto the multi-layer dielectric substrate 11 by means of a bonding medium 2; the plurality of dielectric resonators 1 are obtained by means of performing laser etching on a printed circuit board 13; the printed circuit board 13 is bonded onto the multi-layer dielectric substrate 11 by means of a first dielectric substrate 12; and the bonding medium 2 is part of the first dielectric substrate 12.

Description

A dielectric antenna array and integrated preparation method

CROSS-REFERENCE TO RELATED APPLICATIONS

This disclosure is based on Chinese patent application CN202211202632.7 filed on September 29, 2022, entitled “A dielectric antenna array and integrated preparation method”, and claims the priority of the patent application, and all its disclosed contents are incorporated into this disclosure by reference.

Technical Field

The present disclosure relates to the field of antennas, and in particular to a dielectric antenna array and an integrated manufacturing method thereof.

Background technique

With the popularization of wireless communication systems, the number of mobile devices has increased dramatically, and the existing spectrum resources have gradually become scarce. People have gradually turned their attention to millimeter wave communication. Millimeter wave communication can provide higher transmission rates, wider bandwidths, and larger channel capacities, but it also has problems such as low radiation efficiency, large energy loss, difficult feed network design, and difficult processing. Therefore, people urgently need new technologies and materials to solve these problems.

Dielectric resonator antenna (DRA) can achieve high radiation efficiency due to the lack of metal conductors and surface wave losses and low self-loss. In addition, DRA has a variety of basic shapes and feeding methods, and its design is more flexible, so DRA has received extensive attention and research. However, in the millimeter wave frequency band, the conventional processing methods of dielectric antennas, such as high-temperature sintering, 3D printing and other preparation processes, are not accurate enough and are not conducive to integrated processing and assembly.

In addition, the surge in the number of mobile devices will also bring a huge burden to the load platform's bearing capacity, and electromagnetic interference will also increase. It has become an inevitable trend for a single antenna to replace multiple antennas. Under the premise of ensuring the antenna performance indicators, using a single antenna instead of multiple antennas can greatly reduce the load capacity of the load platform, reduce costs, and reduce electromagnetic interference. Therefore, beam scanning antennas have gradually attracted the attention of researchers. Beam scanning antennas have multiple beam pointing in the same antenna array, and the aperture efficiency of the antenna is fully utilized. Generally, beam scanning antennas have several very narrow beams, which improves the detection accuracy and sensitivity, thereby improving the signal-to-noise ratio. Therefore, beam scanning antennas have important research prospects and value. However, the realization of beam scanning requires ensuring the high gain of the main lobe and low side lobes during scanning. According to the theory of antenna arrays, the larger the scanning angle, the more the main lobe gain is reduced, and the higher the side lobes may be.

In summary, the problems existing in the prior art are: spectrum resources are becoming increasingly scarce, and it is necessary to design antennas that work in the millimeter wave frequency band, while ensuring the processing accuracy of the antenna and the antenna's good performance such as wide bandwidth, high gain, low side lobes, and wide-angle beam scanning. It is also necessary to implement a simpler integrated antenna array preparation process to eliminate the work of subsequent antenna assembly.

Summary of the invention

The embodiments of the present disclosure provide a dielectric antenna array and an integrated manufacturing method, so as to at least solve the problem in the related art that the dielectric antenna has low processing precision and is not conducive to integrated processing and assembly.

According to an embodiment of the present disclosure, a dielectric antenna array is provided, which includes: a plurality of dielectric resonators 1 and a multi-layer dielectric substrate 11, each dielectric resonator 1 is bonded to the multi-layer dielectric substrate 11 by a bonding medium 2. In the figure, the plurality of dielectric resonators 1 are obtained by laser etching a printed circuit board 13, the printed circuit board 13 is bonded to a multilayer dielectric substrate 11 through a first dielectric substrate 12, and the bonding medium 2 is part of the first dielectric substrate 12.

According to another embodiment of the present disclosure, an integrated preparation method of a dielectric antenna array is provided, the method comprising: bonding a printed circuit board 13 to a multilayer dielectric substrate 11 through a first dielectric substrate 12, wherein the dielectric constant of the printed circuit board 13 is greater than the dielectric constant of the multilayer dielectric substrate 11; laser etching waste materials on the printed circuit board 13 according to the shapes and arrangement of a plurality of pre-set dielectric resonators 1 to obtain a plurality of dielectric resonators 1, wherein each dielectric resonator 1 is bonded to the multilayer dielectric substrate 11 through an adhesive medium 2, and the adhesive medium 2 is part of the first dielectric substrate 12.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a vertical structural diagram of a dielectric antenna array according to an embodiment of the present disclosure;

FIG2 is a vertical structural diagram of a dielectric antenna array before etching according to an embodiment of the present disclosure;

FIG3 is a structural diagram of a multilayer dielectric substrate in an embodiment of the present disclosure;

FIG4 is a partial horizontal plane structural diagram of a dielectric antenna array according to an embodiment of the present disclosure;

FIG5 is a structural diagram of a dielectric antenna array and a forked strip feed network according to an embodiment of the present disclosure;

FIG6 is a physical diagram of a dielectric antenna array according to another embodiment of the present disclosure;

FIG7 is a partial structural diagram of a dielectric antenna array according to another embodiment of the present disclosure;

FIG8 is a graph showing active reflection coefficient data of a dielectric antenna array according to an embodiment of the present disclosure;

FIG9 is an array element radiation pattern of a dielectric antenna array according to an embodiment of the present disclosure;

FIG10 is a radiation pattern of a dielectric antenna array according to an embodiment of the present disclosure;

FIG. 11 is a flowchart of the integrated preparation of a dielectric antenna array according to another embodiment of the present disclosure.

In the figure, 1-dielectric resonator, 2-adhesive medium, 3-second dielectric substrate, 4-third dielectric substrate, 5-fourth dielectric substrate, 6-first metal reflector, 7-second metal reflector, 8-rectangular gap, 9-forked strip feed line, 10-metallized via, 11-multilayer dielectric substrate, 12-first dielectric substrate, 13-printed circuit board, 14-forked strip feed network, 15-T-shaped multi-way power divider, 16-port.

Detailed ways

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and in combination with the embodiments.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

According to an embodiment of the present disclosure, a dielectric antenna array is provided. FIG. 1 is a vertical structural diagram of the dielectric antenna array according to an embodiment of the present disclosure. As shown in FIG. 1 , the dielectric antenna array includes the following structure:

A plurality of dielectric resonators 1 and a multi-layer dielectric substrate 11 , each dielectric resonator 1 being bonded to the multi-layer dielectric substrate 11 via a bonding medium 2 .

FIG. 2 is a vertical structural diagram of a dielectric antenna array before etching according to an embodiment of the present disclosure.

In this embodiment, the plurality of dielectric resonators 1 are obtained by laser etching a printed circuit board 13 , the printed circuit board 13 is bonded to a multilayer dielectric substrate 11 via a first dielectric substrate 12 , and the bonding medium 2 is part of the first dielectric substrate 12 .

FIG3 is a structural diagram of a multi-layer dielectric substrate in an embodiment of the present disclosure. As shown in FIG3 , the structure of the multi-layer dielectric substrate is as follows: From top to bottom, they include:

A second dielectric substrate 3, a third dielectric substrate 4 and a fourth dielectric substrate 5;

The second dielectric substrate 3 and the fourth dielectric substrate 5 are bonded together via the third dielectric substrate 4 .

Specifically, the third dielectric substrate 4 is similar to the first dielectric substrate 12 and may be a material used for bonding such as glue.

In this embodiment, a first metal reflector 6 is disposed on the upper surface of the second dielectric substrate 3, and a second metal reflector 7 is disposed on the lower surface of the fourth dielectric substrate 5, wherein the first metal reflector 6 and the second metal reflector 7 are copper-plated surfaces of the second dielectric substrate 3 and the fourth dielectric substrate 5, or the first metal reflector 6 and the second metal reflector 7 are independent metal reflectors;

In another embodiment, the first metal reflector 6 may also be disposed on the lower surface of the second dielectric substrate 3 ; similarly, the second metal reflector 7 may also be disposed on the upper surface of the fourth dielectric substrate 5 .

In this embodiment, at least one forked strip feeding network 14 is further provided between the second dielectric substrate 3 and the fourth dielectric substrate 5. Specifically, the forked strip feeding network 14 may be located on the upper surface or the lower surface of the third dielectric substrate 4, and the forked strip feeding network 14 may also be on the same layer as the third dielectric substrate 4.

In this embodiment, the dielectric antenna array has a simple structure and can be processed through a printed circuit board (PCB) process to achieve integrated processing of the radiation structure and the feeding network, avoid the influence of later assembly misalignment errors and glue, and save the assembly work of the antenna array.

FIG4 is a partial horizontal plane structure diagram of a dielectric antenna array according to an embodiment of the present disclosure. As shown in FIG4 , the dielectric antenna array can be divided into a plurality of antenna array units, each antenna array unit corresponds to a dielectric resonator 1, and the antenna array unit further includes the following structure:

Rectangular slot 8, forked ribbon feed line 9, and metallized via 10;

In this embodiment, a circle of metallized vias 10 is formed around each of the dielectric resonators 1 , wherein the metallized vias 10 are used to connect the first metal reflection plate 6 and the second metal reflection plate 7 .

In this embodiment, the first metal reflector 6 and the second metal reflector 7 achieve a common ground effect through the metallized vias 10, thereby suppressing the planar mode when the forked strip feeding network 14 is powered on. By providing a circle of metallized vias 10 around each dielectric resonator 1 and the forked strip feeding line 9, the coupling between each antenna array unit can be reduced and the isolation can be improved.

In this embodiment, a plurality of rectangular slots 8 are etched on the first metal reflector 6 , wherein each rectangular slot 8 corresponds to a dielectric resonator 1 , and the rectangular slot 8 is located directly below the dielectric resonator 1 .

In this embodiment, the forked strip feeding line 9 is a part of a forked strip feeding network 14 , and each forked strip feeding line 9 corresponds to a dielectric resonator 1 .

In this embodiment, the antenna is coupled and fed through the rectangular slot 8. The use of a stripline as the feed line can optimize the front-to-back ratio of the directional pattern. Exemplarily, the forked stripline feed line 9 couples and excites the directional mode HEM _11δ through the rectangular slot 8.

In this embodiment, each antenna array unit and port in the dielectric antenna array is highly isolated, the scanning angle is wide, and a dielectric resonator is used as the radiator of the antenna, which meets the requirements of beam scanning for high gain of the main lobe and low side lobe.

FIG5 is a structural diagram of a dielectric antenna array and a forked strip feeding network according to an embodiment of the present disclosure. As shown in FIG5 , the forked strip feeding network 14 includes: a plurality of forked strip feeding lines 9 and a T-shaped multi-way power splitter 15;

In this embodiment, the single branch end of the T-shaped multi-way power divider 15 is connected to the signal source through the port 16 , and the multi-branch ends of the T-shaped multi-way power divider 15 are respectively connected to the multiple fork-shaped ribbon feed lines 9 .

Exemplarily, the T-shaped multi-way power splitter 15 and the forked strip feeding line 9 may be made of the same metal material, and the T-shaped multi-way power splitter 15 is integrally connected to the corresponding plurality of forked strip feeding lines 9 .

In another embodiment, the double-branch ends of the forked ribbon feeder 9 can be bent to both sides to avoid crossing or interfering with other feeders.

In this embodiment, the double-branch end of the forked strip feed line 9 couples and feeds the dielectric resonator 1 through the rectangular gap 8; the single-branch end of the forked strip feed line 9 is connected to one of the multi-branch ends of the T-shaped multi-way power divider 15; the signal source provides signals with equal amplitudes and different phase differences to each forked strip feed line 9 through the T-shaped multi-way power divider 15.

In this embodiment, the multiple dielectric resonators 1 are divided into at least one group, wherein each group of dielectric resonators is fed by a forked strip feeding network 14; the multiple dielectric resonators 1 in each group of dielectric resonators are linearly arranged along a plane parallel to the electric field; the multiple forked strip feeding lines 9 in each forked strip feeding network 14 are linearly arranged along a plane parallel to the electric field; and the multiple groups of dielectric resonators are linearly arranged along a plane parallel to the magnetic field.

Specifically, the plane parallel to the electric field is referred to as the electric plane (E plane), which is the x-axis direction in FIG. 5 , and the plane parallel to the magnetic field is referred to as the magnetic plane (H plane), which is the y-axis direction in FIG. 5 .

In the embodiment of the present disclosure, as shown in FIG5 , the antenna array units are arranged along the E plane to form 8 rows of 1×16 linear arrays, and the dielectric antenna array includes a total of 128 antenna array units. However, the present disclosure does not limit the number of each group of dielectric resonators 1 and the corresponding forked strip feed lines 9. However, since each group of forked strip feed lines 9 is connected by a T-shaped multi-way power divider 15, the number of each group is usually 4, 8, 16, etc., which is a power of 2.

In this embodiment, the signal bandwidth of the dielectric antenna array can be improved through the fork-shaped strip feeding network 14 and the coupled feeding mode.

In this embodiment, the scanning angle of the dielectric antenna array is determined based on the spacing of the dielectric resonators (1) and the wavelength of the transmitted signal. The spacing of the plurality of dielectric resonators 1 can be adjusted based on the wavelength of the transmitted signal, thereby changing the scanning angle of the dielectric antenna array, in particular the scanning angle of the E plane (a plane parallel to the electric field).

Specifically, when the spacing between the dielectric resonators 1 is equal to 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is 60°; when the spacing between the dielectric resonators 1 is less than 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is greater than 60°; when the spacing between the dielectric resonators 1 is greater than 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is less than 60°.

Exemplarily, when the frequency of the transmitted signal of the dielectric antenna array is 26 GHz, the signal wavelength is approximately 11.5 mm. Correspondingly, the spacing between each dielectric resonator in the dielectric antenna array is approximately 5.7 mm. At this time, the dielectric antenna array can achieve a scanning angle of ±60°.

In the related art, in the embodiment of the present disclosure, the H plane of the antenna unit has a wider beam width, and the E plane has a narrower beam width, but in the embodiment of the present disclosure, the scanning capability of the antenna on the E plane can be improved, and the beam width of the E plane of the antenna is increased.

In this embodiment, the dielectric resonator 1 and the adhesive medium 2 satisfy at least one of the following conditions: the shapes of the dielectric resonator 1 and the adhesive medium 2 include: a regular polygon and a circle; the dielectric resonator 1 and the adhesive medium 2 are arranged in a center-aligned manner; the planar dimensions of the dielectric resonator 1 and the adhesive medium 2 are the same.

In this embodiment, the dielectric resonator 1 and the adhesive medium 2 have the same shape and size, and the shapes include but are not limited to: a regular polygon and a circle.

Exemplarily, the dielectric resonator 1 is the main radiator of the dielectric antenna array, and its height and plane size are designed to be consistent with The frequency of the signal transmitted by the antenna is related. Specifically, for a signal with a frequency of 26 GHz, the corresponding dielectric resonator can be a cylinder with a radius of 1.5 mm and a height of 1.523 mm.

FIG6 is a physical picture of a dielectric antenna array according to another embodiment of the present disclosure. As shown in FIG6 , the dielectric antenna array includes: a multilayer dielectric substrate 11, 16 dielectric resonators 1 and a port 16, and each dielectric resonator 1 is surrounded by a circle of metallized vias 10.

In this embodiment, the electrical signal of the port 16 can be transmitted to each dielectric resonator 1 through the fork-shaped strip feeding network 14 inside the multi-layer dielectric substrate 11 .

In this embodiment, the T-shaped multi-channel power divider 15 is a 1-to-16 power divider, and power is fed through the T-shaped multi-channel power divider 15 to realize 0°, 30° and 60° beam scanning antenna arrays respectively.

FIG. 7 is a partial structural diagram of a dielectric antenna array according to another embodiment of the present disclosure. As shown in FIG. 7 , the dielectric antenna array mainly includes a dielectric resonator 1, a forked strip feed line 9, a rectangular slot 8, and parameters of a multilayer dielectric substrate 11:

The parameters of the dielectric resonator 1 may specifically include: a radius rd and a height hd;

The parameters of the forked strip feeder 9 may specifically include: the distance W1 between the double branches, the width W2 of the 50Ω line, the length L1 of the forked strip feeder 9 beyond the gap, the distance L2 from the double branch bifurcation position to the gap, and the width W3 from the double branch bifurcation position to the single branch position;

The parameters of the rectangular gap 8 may specifically include: a length Ls and a width Ws;

The parameters of the multi-layer dielectric substrate 11 may specifically include:

The thickness t of the first dielectric substrate 12 and the third dielectric substrate 4;

The thickness h1 of the second dielectric substrate 3 and the fourth dielectric substrate 5;

The first metal reflective plate 6 and the second metal reflective plate 7 have a length gx and a width gy.

In this embodiment, in order to prevent the dielectric antenna array from experiencing a gain dip within a preset scanning angle when performing beam scanning and to consider the upper limit of the array gain, it is necessary to reasonably optimize the size of the antenna array unit, appropriately reduce the gain of the unit, obtain a wide beam characteristic, and achieve a better antenna scanning effect.

Specifically, taking the 26 GHz antenna signal as an example, the size of the first metal reflector 6 and the second metal reflector 7 can be set to 88 mm×5.5 mm; the size of the rectangular gap 8 can be set to 2 mm×0.15 mm; the height of the dielectric resonator 1 is 1.524 mm and the radius is 1.5 mm.

Exemplarily, the heights of the first dielectric substrate 2 and the third dielectric substrate 4 are both 0.1 mm, the heights of the second dielectric substrate 3 and the fourth dielectric substrate 5 are 0.254 mm, and the total height of the antenna is 2.208 mm.

In this embodiment, the distance between the two branches of the forked strip feeder 9 can be set to 0.3 mm; the signal frequency and bandwidth of the antenna array can be adjusted by adjusting other parameters of the forked strip feeder 9.

Fig. 8 is a graph of active reflection coefficient of the dielectric antenna array of the embodiment of the present disclosure. As shown in Fig. 8, the horizontal axis of the active reflection coefficient graph is the signal frequency, and the vertical axis is the active S parameter. According to the active reflection coefficient curves of different S parameters in Fig. 8, it can be concluded that the antenna array has good impedance matching characteristics.

FIG. 9 is an array element radiation pattern of the dielectric antenna array according to an embodiment of the present disclosure.

Fig. 10 is a radiation pattern of the dielectric antenna array of the embodiment of the present disclosure. As shown in Fig. 10, the cross-polarization level of the pattern of the dielectric antenna array at different scanning angles is good.

In the embodiment of the present disclosure, metalized vias are added between the units to connect the upper and lower metal reflectors of the stripline feed network, thereby achieving good grounding, suppressing the flat panel mode caused by the stripline feed line, and improving the isolation between the units. The size of the element can achieve a wide-angle scanning characteristic of ±60° for the antenna array.

According to the embodiment of the present disclosure, the performance of the dielectric antenna array was simulated in full-wave simulation software, and the simulation results showed good performance. At the same time, physical processing and testing were also carried out according to the embodiment of the present disclosure, and the physical test results also showed that the dielectric antenna array can achieve the characteristics of ±60° wide-angle beam scanning, and the antenna performance is good.

FIG11 is a flow chart of the integrated preparation of a dielectric antenna array according to another embodiment of the present disclosure. As shown in FIG11 , all the plates are pressed together, and the redundant part of the radiator layer is removed by laser. The integrated preparation process of the dielectric antenna array specifically includes the following steps:

Step S1102, bonding a printed circuit board 13 to the multi-layer dielectric substrate 11 through the first dielectric substrate 2, wherein the dielectric constant of the printed circuit board 13 is greater than the dielectric constant of the multi-layer dielectric substrate 11; this step corresponds to the dielectric antenna array structure diagram before etching in FIG. 2 .

Step S1104, laser etching is performed on the waste material on the printed circuit board 13 according to the preset shapes and arrangement of the plurality of dielectric resonators 1 to obtain the plurality of dielectric resonators 1, wherein each dielectric resonator 1 is bonded to the multilayer dielectric substrate 11 by an adhesive medium 2, and the adhesive medium 2 is part of the first dielectric substrate 12. This step corresponds to the dielectric antenna array structure diagram after etching in FIG1 .

Exemplarily, step S1102 may further include pressing the second dielectric substrate 3, the fork-shaped strip feeding network 14 and the fourth dielectric substrate 5 together to form a multilayer dielectric substrate 11, and the second dielectric substrate 3 and the fourth dielectric substrate 5 are bonded together by a third dielectric substrate 4; wherein the second dielectric substrate 3 and the fourth dielectric substrate 5 are conventional PCB boards.

In this embodiment, the second dielectric substrate 3 and the fourth dielectric substrate 5 may have a metal coating. If there is no metal coating, an additional metal plate or dielectric substrate is required to be pressed together as the first metal reflector 6 and the second metal reflector 7 in step S1. This step corresponds to the dielectric antenna array structure diagram in FIG3 .

In this embodiment, step S1104 may specifically include: laser etching the waste material on the printed circuit board 13 according to the shapes and arrangement of the plurality of dielectric resonators 1 set in advance to obtain the plurality of dielectric resonators 1, wherein each dielectric resonator 1 is bonded to the multilayer dielectric substrate 11 through an adhesive medium 2, and the adhesive medium 2 is part of the first dielectric substrate 2.

Specifically, the printed circuit board 13 is a radiator layer, and the dielectric constant of this layer of board material is relatively high.

In this embodiment, the method further comprises etching a rectangular slit 8 at a position on the first metal reflector 6 corresponding to the dielectric resonator 1 .

According to the method in the embodiment of the present disclosure, the integrated processing of the dielectric antenna array radiation structure and the feeding network can be achieved, avoiding the influence of subsequent assembly misalignment errors and glue, etc., and improving the processing accuracy of the antenna.

For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

Obviously, those skilled in the art should understand that the above modules or steps of the present disclosure can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order than here, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present disclosure is not limited to any specific combination of hardware and software.

The above description is only an exemplary embodiment of the present disclosure and is not intended to limit the present disclosure. For members, the present disclosure may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims (11)

1. A dielectric antenna array, the dielectric antenna array comprising:

   A plurality of dielectric resonators (1) and a multi-layer dielectric substrate (11), each dielectric resonator (1) being bonded to the multi-layer dielectric substrate (11) via a bonding medium (2), wherein the plurality of dielectric resonators (1) are obtained by laser etching a printed circuit board (13), the printed circuit board (13) being bonded to the multi-layer dielectric substrate (11) via a first dielectric substrate (12), and the bonding medium (2) being part of the first dielectric substrate (12).
2. The dielectric antenna array according to claim 1, wherein:

   The multilayer dielectric substrate (11) comprises, from top to bottom, a second dielectric substrate (3), a third dielectric substrate (4) and a fourth dielectric substrate (5), wherein the second dielectric substrate (3) and the fourth dielectric substrate (5) are bonded together via the third dielectric substrate (4);

   A first metal reflector (6) is provided on the upper surface of the second dielectric substrate (3), and a second metal reflector (7) is provided on the lower surface of the fourth dielectric substrate (5), wherein the first metal reflector (6) and the second metal reflector (7) are copper-plated surfaces of the second dielectric substrate (3) and the fourth dielectric substrate (5), or the first metal reflector (6) and the second metal reflector (7) are independent metal reflectors;

   At least one fork-shaped ribbon feeding network (14) is arranged between the second dielectric substrate (3) and the fourth dielectric substrate (5).
3. The dielectric antenna array according to claim 2, wherein:

   Each of the dielectric resonators (1) is surrounded by a circle of metallized vias (10), wherein the metallized vias (10) are used to connect the first metal reflection plate (6) and the second metal reflection plate (7).
4. The dielectric antenna array according to claim 2, wherein:

   A plurality of rectangular slits (8) are etched on the first metal reflection plate (6), wherein each rectangular slit (8) corresponds to a dielectric resonator (1), and the rectangular slit (8) is located directly below the dielectric resonator (1).
5. The dielectric antenna array according to claim 2, wherein:

   The forked strip feeding network (14) comprises: a plurality of forked strip feeding lines (9) and a T-shaped multi-channel power splitter (15), wherein each forked strip feeding line (9) corresponds to a dielectric resonator (1), a single branch end of the T-shaped multi-channel power splitter (15) is connected to a signal source via a port (16), and a multi-branch end of the T-shaped multi-channel power splitter (15) is respectively connected to the plurality of forked strip feeding lines (9).
6. The dielectric antenna array according to claim 5, wherein:

   The double-branch ends of the forked strip feed line (9) couple and feed electricity to the dielectric resonator (1) through a rectangular gap (8);

   The single branch end of the forked ribbon feeder (9) is connected to one of the multi-branch ends of the T-shaped multi-way power divider (15);

   The signal source provides signals with equal amplitudes and different phase differences to each fork-shaped strip feeder (9) through the T-shaped multi-way power divider (15).
7. The dielectric antenna array according to claim 2, wherein:

   The plurality of dielectric resonators (1) are divided into at least one group, wherein each group of dielectric resonators is fed by a forked strip feeding network (14);

   The plurality of dielectric resonators (1) in each group of dielectric resonators are linearly arranged along a plane parallel to the electric field;

   A plurality of forked strip feeding lines (9) in each forked strip feeding network (14) are arranged linearly along a plane parallel to the electric field;

   A plurality of groups of dielectric resonators are arranged linearly along a plane parallel to the magnetic field.
8. The dielectric antenna array according to claim 1, wherein:

   The scanning angle of the dielectric antenna array is determined based on the spacing of the dielectric resonators (1) and the wavelength of the transmitted signal.
9. The dielectric antenna array according to claim 1, wherein:

   When the spacing between the dielectric resonators (1) is equal to 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is 60°;

   When the spacing between the dielectric resonators (1) is less than 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is greater than 60°;

   When the spacing between the dielectric resonators (1) is greater than 0.5 times the wavelength of the transmitted signal, the absolute value of the scanning angle of the dielectric antenna array is less than 60°.
10. The dielectric antenna array according to claim 1, wherein the dielectric resonator (1) and the bonding medium (2) satisfy at least one of the following conditions:

    The shapes of the dielectric resonator (1) and the bonding medium (2) include: regular polygon and circle;

    The dielectric resonator (1) and the bonding medium (2) are arranged in a centrally aligned manner;

    The dielectric resonator (1) and the bonding medium (2) have the same planar dimensions.
11. An integrated preparation method for a dielectric antenna array, wherein the method comprises:

    A printed circuit board (13) is bonded to a multi-layer dielectric substrate (11) via a first dielectric substrate (12), wherein the dielectric constant of the printed circuit board (13) is greater than the dielectric constant of the multi-layer dielectric substrate (11);

    According to the shapes and arrangement of the plurality of pre-set dielectric resonators (1), laser etching is performed on waste material on the printed circuit board (13) to obtain the plurality of dielectric resonators (1), wherein each dielectric resonator (1) is bonded to the multi-layer dielectric substrate (11) via a bonding medium (2), and the bonding medium (2) is part of the first dielectric substrate (12).