WO2024066528A1

WO2024066528A1 - Lens, backlight module, display device, and method for manufacturing backlight module

Info

Publication number: WO2024066528A1
Application number: PCT/CN2023/102524
Authority: WO
Inventors: 蒋冲; 李沛; 李健林
Original assignee: 惠州视维新技术有限公司
Priority date: 2022-09-28
Filing date: 2023-06-26
Publication date: 2024-04-04
Also published as: CN117148619A

Abstract

A lens (30), a backlight module (100), a display device, and a method for manufacturing the backlight module (100). The lens (30) comprises a light exit surface (31) and a mounting surface (32) provided opposite to the light exit surface (31). An accommodating groove (321) is formed at the center of the mounting surface (32). The accommodating groove (321) is used for accommodating at least one light-emitting chip (20). The mounting surface (32) is provided with microstructures (322), such that the mounting surface (32) of the lens (30) forms an uneven structure, thereby improving the reliability of the mounting of the lens (30), and effectively preventing an adhesive (220) from being accumulated on the surface of the light-emitting chip (20), so as to increase the light uniformity of the backlight module (100).

Description

Lens, backlight module, display device and method for manufacturing backlight module

This application claims the priority of the Chinese patent application filed with the China Patent Office on September 28, 2022, with application number 202211188195.8 and invention name “Lens, backlight module, display device and method for manufacturing backlight module”, all contents of which are incorporated by reference in this application.

Technical Field

The present invention relates to the field of display technology, and in particular to a lens, a backlight module, a display device and a method for manufacturing the backlight module.

Background technique

With the development of society, liquid crystal displays are widely used in electronic products such as televisions, smart phones, and tablet computers. Liquid crystal displays usually include backlight modules and liquid crystal modules. Since the liquid crystal module itself does not emit light, the backlight module is required to provide a uniform and stable light source for the liquid crystal module. The backlight module mainly includes direct-type backlight modules and edge-type backlight modules. Among them, the direct-type backlight module is widely used in the industry due to its superior performance advantages and has gradually become the mainstream structure of liquid crystal displays.

technical problem

In a direct-type backlight module, LEDs are used as light sources. Since the light-emitting angle of LEDs is limited, a lens needs to be set on the LEDs. The lens can not only encapsulate and protect the LEDs, but also make the light emitted by the LEDs evenly dispersed. In the prior art, a lens is usually formed above the LEDs by dispensing glue. Since the viscosity and fluidity of the glue are difficult to control, there is a problem of glue accumulation or insufficient glue when dispensing glue directly above the LEDs, which leads to poor light uniformity between different LEDs, making the backlight module appear unevenly bright and dark, which brings bad visual effects to users.

Technical Solutions

In a first aspect, an embodiment of the present application provides a lens, wherein the lens comprises:

Bright surface;

The mounting surface is arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to receive at least one light emitting chip, and a microstructure is arranged on the mounting surface.

In a second aspect, an embodiment of the present application further provides a backlight module, the backlight module comprising:

Substrate;

A light-emitting chip is disposed on the substrate;

A lens is arranged on the light-emitting chip, wherein the lens is the lens described in any of the above embodiments, and an adhesive is arranged on the mounting surface of the lens, and the adhesive is used to fix the lens on the substrate.

In a third aspect, an embodiment of the present application further provides a display device, which includes the backlight module described in any of the above embodiments.

In a fourth aspect, the present application also provides a method for manufacturing a backlight module, comprising:

providing a substrate;

At least one light-emitting chip is arranged on the substrate;

Providing a lens, and placing adhesive on the mounting surface of the lens;

Mounting the lens on the light-emitting chip;

The lens comprises a light emitting surface and a mounting surface arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to receive at least one light emitting chip, and the mounting surface is provided with a microstructure.

Beneficial Effects

The lens, backlight module, display device and method for manufacturing the backlight module provided in the embodiments of the present application, the lens includes a light emitting surface and a mounting surface arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to accommodate at least one light emitting chip, wherein the mounting surface is provided with a microstructure; by providing the microstructure, the mounting surface of the lens forms an uneven structure, so that no vacuum layer is formed between the lens and a carrier coated with adhesive, so that the lens can easily dip the adhesive on the carrier, and when the lens is mounted on the light emitting chip, the amount of adhesive mounted on each lens and the light emitting chip can be kept consistent, thereby improving the reliability of lens mounting, effectively preventing the adhesive from accumulating on the surface of the light emitting chip and affecting the light emitting effect of the light emitting chip, and thereby increasing the light uniformity of the backlight module.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of a first flow chart of a method for manufacturing a backlight module provided in an embodiment of the present application.

FIG. 2 is a schematic diagram of a second flow chart of a method for manufacturing a backlight module provided in an embodiment of the present application.

FIG. 3 is a schematic diagram of mounting a lens according to an embodiment of the present application.

FIG. 4 is a first cross-sectional schematic diagram of a lens provided in an embodiment of the present application.

FIG. 5 is a schematic diagram of a first structure of a lens provided in an embodiment of the present application.

FIG. 6 is a schematic diagram of a second structure of a lens provided in an embodiment of the present application.

FIG. 7 is a schematic diagram of a third structure of a lens provided in an embodiment of the present application.

FIG8 is a second cross-sectional schematic diagram of a lens provided in an embodiment of the present application.

FIG. 9 is a schematic diagram of the structure of a backlight module provided in an embodiment of the present application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

The embodiments of the present application provide a lens, a backlight module, a display device and a method for manufacturing the backlight module to solve the problem that the amount of glue is uneven when glue is directly dispensed on the light-emitting chip, which affects the light-emitting effect of the light-emitting chip and causes poor visual effects for users. The following will be described in conjunction with the accompanying drawings.

Please refer to FIG1 , which is a schematic diagram of a first process flow of a method for manufacturing a backlight module provided in an embodiment of the present application. The method for manufacturing a backlight module comprises the following steps:

S510, providing a substrate, and disposing at least one light-emitting chip on the substrate.

Among them, the substrate can be a PCB circuit board or a flexible circuit board. The substrate is an important electronic component, a support for electronic components, and a carrier for electrical connections between electronic components.

The light-emitting chip may be a Micro-LED chip or a Mini-LED chip. A Micro-LED chip is a micro light-emitting diode, and a Mini-LED chip is a sub-millimeter light-emitting diode. A Micro-LED chip has a smaller size than a Mini-LED chip. Preferably, the light-emitting chip in the embodiment of the present application is a Mini-LED chip.

The light-emitting chip is disposed on the substrate and is electrically connected to the substrate. Specifically, the light-emitting surface of the light-emitting chip faces the side away from the substrate, that is, the light is emitted upward, and the side of the light-emitting chip away from the light-emitting surface is used for mounting on the substrate. Exemplarily, a solder pad is provided at a corresponding position of the substrate, and a solder foot is provided on the side of the light-emitting chip away from the light-emitting surface, and the solder foot of the light-emitting chip is soldered to the corresponding solder pad of the substrate through solder paste.

In the embodiments of the present application, the number of light-emitting chips is multiple, and the multiple light-emitting chips are arranged at intervals and arranged on the substrate in an array, or arranged on the substrate in other regular or irregular ways, and the present application does not make specific restrictions on this. For example, the light-emitting chips are arranged on the surface of the substrate in M rows and N columns, and M and N are both positive integers not less than 2.

S520, providing a lens, and setting adhesive on a mounting surface of the lens.

It should be noted that the light-emitting chip can be encapsulated by the lens. The lens can not only maintain the airtightness of the light-emitting chip and protect the light-emitting chip from the temperature and humidity of the surrounding environment, but also prevent the light-emitting chip from being damaged by mechanical vibration and impact or causing changes in characteristics that affect its light-emitting performance. The light is refracted, reflected or scattered to increase the light output angle and light mixing uniformity of the light emitting chip, which is beneficial to reduce the number of light emitting chips used, thereby reducing the cost of the backlight module.

The lens includes a light-emitting surface and a mounting surface arranged opposite to the light-emitting surface, and the mounting surface can be understood as a surface where the lens is attached to the substrate. A receiving groove is provided at the center of the mounting surface, and the receiving groove is used to accommodate at least one light-emitting chip. The mounting surface is also provided with a microstructure, and the microstructure can be understood as a protrusion or depression formed on the mounting surface.

The lens can be made of transparent materials such as glass, ceramic, or polymer materials such as polytetrafluoroethylene (PTFE), methyl methacrylate (PMMA), PEMA, polycarbonate, silicone and other polymer mixtures. The lens can be formed by injection molding or compression molding.

In the prior art, glue is usually dispensed on the light-emitting chip to form a lens, or the lens is attached after glue is dispensed on the light-emitting chip. Since the viscosity and fluidity of the glue are difficult to control, and the light-emitting chip is relatively small, it is easy to cause excessive glue dispensing, and the adhesive is accumulated on the surface of the light-emitting chip, affecting the light-emitting effect of the light-emitting chip; or too little glue is dispensed, affecting the airtightness and reliability of the lens package, and there is a risk of the lens falling off the substrate. In the embodiment of the present application, by setting the adhesive on the mounting surface of the lens, the uniformity of the glue amount on the lens mounting surface can be maintained, so that the amount of glue for each lens and the light-emitting chip can be consistent, and the adhesive can be prevented from contaminating the surface of the light-emitting chip, thereby improving the light-emitting effect of the light-emitting chip.

It should be noted that in the embodiment of the present application, the mounting surface of the lens is also provided with a microstructure. By providing the microstructure, the contact area between the mounting surface and the adhesive can be increased, which helps to improve the stability of the mounting of the lens and the substrate.

S530, mounting a lens on the light emitting chip.

Specifically, a receiving groove is provided at the center of the lens mounting surface. After the lens is attached to the substrate, the light emitting chip is located in the receiving groove, and the light emitted by the light emitting chip is incident on the lens toward the groove wall of the receiving groove, that is, the groove wall of the receiving groove is equivalent to the light incident surface. The lens can refract, reflect and diffuse the light emitted by the light emitting chip and then emit it from the light emitting surface of the lens, thereby increasing the light emission range of the light emitting chip.

Compared with the traditional method of forming a lens by dispensing glue on the light-emitting chip, the present application directly mounts the lens on the light-emitting chip, which is simple and easy to operate; and the lens is formed by injection molding or compression molding, and the shape of each lens can be kept consistent, which is beneficial to improving the light uniformity of the backlight module.

S540, baking or irradiating the lens with UV light to cure the adhesive.

Since the adhesive is a liquid adhesive, the lens needs to be baked or irradiated with UV light to solidify the adhesive so that the lens can be firmly bonded to the substrate.

S550, a reflective layer is disposed on the substrate, wherein the reflective layer includes a hollow area, and the light emitting chip is located on the substrate exposed in the hollow area.

Exemplarily, the reflective layer may be a reflective sheet attached to the substrate, the reflective sheet including a plurality of hollow areas, and the hollow areas may expose the light emitting chip disposed on the substrate. Specifically, when attaching the reflective sheet to the substrate, each hollow area is first aligned with each light emitting chip, and then the reflective sheet is pressed and assembled onto the substrate to expose the light emitting chip.

In some embodiments, the reflective layer may also be a reflective coating sprayed on the substrate, such as a metal coating, etc. When spraying the reflective coating, the hollow area may be covered, and the uncovered area may be sprayed with the reflective coating to form the reflective layer.

It should be noted that by providing a reflective layer, the brightness of the surface light source of the backlight module can be further improved, the utilization rate of the light emitted by the light-emitting chip can be maximized, and the uniformity of light mixing can be improved. At the same time, the light emitted by the light-emitting chip to the substrate can also enter the lens again after being reflected by the reflective layer, which can prevent the light leakage problem of the light-emitting chip and further improve the performance of the backlight module.

Please refer to FIG. 1 and FIG. 2 and FIG. 3 , FIG. 2 is a second flow chart of the method for manufacturing a backlight module provided in an embodiment of the present application, and FIG. 3 is a schematic diagram of mounting a lens provided in an embodiment of the present application. Step S520 includes:

S521, providing a carrier board, and coating a layer of adhesive on a surface of the carrier board.

Please refer to Figure 3, the carrier 210 is equivalent to the tray of the POP feeder in the placement machine. First, the adhesive 220 is injected onto the carrier 210, and then the adhesive 220 is scraped flat by a scraper. By adjusting the height and tilt angle of the scraper, the coating thickness of the adhesive 220 on the carrier 210 can be adjusted. Preferably, the thickness of the adhesive 220 is adapted to the height of the microstructure 322 set on the mounting surface 32 of the lens 30, so that the lens 30 can dip the adhesive 220. In actual use, the coating thickness of the adhesive 220 can also be set accordingly according to actual needs, and this application does not make specific limitations.

S522, the lens is moved to the carrier plate, and the mounting surface of the lens can be dipped into the adhesive.

The lens 30 can be fed by a tape or a vibrating plate, and then sucked by the nozzle 230 of the placement machine and moved to the carrier 210 . At this time, the microstructure 322 of the mounting surface 32 of the lens 30 contacts the carrier 210 and is dipped in the adhesive 220 .

In the related art, the mounting surface of the lens is usually a smooth plane. When the lens is dipped in adhesive on a carrier, a vacuum layer is formed between the mounting surface and the carrier. Under the action of atmospheric pressure, a large force is required to remove the lens from the carrier, which is inconvenient to operate.

In the embodiment of the present application, the mounting surface 32 of the lens 30 is provided with a microstructure 322, which can be understood as a protrusion or depression formed on the mounting surface 32. Exemplarily, the microstructure 322 includes a plurality of protrusions, which are spaced apart and arranged around the receiving groove 321, for example, the plurality of protrusions are arranged in concentric circles around the receiving groove 321. In other embodiments, the protrusion is in a strip shape, and the protrusion includes a first end and a second end opposite to each other, the first end is located at the periphery of the receiving groove 321, and the second end extends to the periphery of the lens 30, and the width of the protrusion gradually increases from the first end to the second end.

In other embodiments, the microstructure 322 may also be a depression formed by the mounting surface 32, and the depression is arranged around the receiving groove 321. Exemplarily, the microstructure 322 includes a plurality of depressions, and the plurality of depressions are spaced apart and arranged around the receiving groove 321, for example, the plurality of depressions are arranged in concentric circles around the receiving groove 321.

It can be understood that by providing the microstructure 322 on the mounting surface 32 of the lens 30, the mounting surface 32 of the lens 30 forms an uneven structure, which is equivalent to increasing the contact area between the mounting surface 32 and the adhesive 220, which helps to improve the stability of the mounting of the lens 30 and the substrate 10; at the same time, due to the provision of the microstructure 322, during the process of the lens 30 being dipped in the adhesive 220 on the carrier 210, there will be air holes between the mounting surface 32 of the lens 30 and the carrier 210, and external air enters the air holes to reduce the pressure difference between the inside and outside of the mounting surface 32, so that no vacuum layer is formed between the mounting surface 32 and the carrier 210, thereby reducing the adsorption force between the mounting surface 32 and the carrier 210, and when the lens 30 is dipped in the adhesive, the suction nozzle 230 can easily suck up the lens 30. In some embodiments, the mounting surface 32 of the lens 30 is also provided with at least one groove, one end of which is connected to the receiving groove 321, and the other end of which extends to the periphery of the lens 30. The groove can not only reduce the adsorption force between the mounting surface 32 of the lens 30 and the carrier 210, but also release the gas generated inside the lens 30 during the heating and curing process of the lens 30; on the other hand, the groove also has the function of an overflow cavity. Since the adhesive 220 is liquid, when the amount of adhesive 220 is too much, the lens 30 is prone to slippage and cause installation deviation. With the setting of the groove, excess adhesive 220 can enter the groove, reducing the slippage of the lens 30 during the attachment process, thereby ensuring that the lens 30 can be accurately attached to the substrate 10, improving the yield of the lens 30 mounting, and ensuring the light output effect of the product.

Please continue to refer to Figure 3. After the mounting surface 32 of the lens 30 is dipped in glue, the adhesive 220 fills the gap in the microstructure 322. Then the lens 30 dipped in glue is sucked by the suction nozzle 230, and the lens 30 is removed from the carrier 210. Finally, the lens 30 is installed on the light-emitting chip 20. The adhesive 220 stably fixes the lens 30 on the substrate 10.

The center of the mounting surface 32 is provided with a receiving groove 321, the lens 30 is attached to the substrate 10, the light emitting chip 20 is embedded in the receiving groove 321, and the light emitted by the light emitting chip 20 is incident on the lens 30 toward the groove wall of the receiving groove 321, that is, the groove wall of the receiving groove 321 is equivalent to the light incident surface. The lens 30 can refract, reflect and diffuse the light emitted by the light emitting chip 20 and then emit it from the light emitting surface 31 of the lens 30, thereby increasing the light emission range of the light emitting chip 20.

Compared with the traditional method of directly dispensing glue on the light-emitting chip 20, the method for manufacturing the backlight module provided in the embodiment of the present application sets an adhesive 220 on the mounting surface 32 of the lens 30, and then mounts the lens 30 on the light-emitting chip 20, so that the amount of glue mounted on each lens 30 and the light-emitting chip 20 is consistent, thereby improving the reliability of the mounting of the lens 30, effectively preventing the adhesive 220 from accumulating on the surface of the light-emitting chip 20 and affecting the light emitting effect of the light-emitting chip 20, and helping to increase the light uniformity of the backlight module.

On the other hand, since the light-emitting chips are small and there are many of them, the traditional method of dispensing glue on the light-emitting chips requires three to four dispensing positions around the light-emitting chips. The efficiency of dispensing glue and lens mounting is extremely low, and the glue can easily overflow onto the light-emitting chips. The chip affects the light-emitting effect of the light-emitting chip. The method for manufacturing the backlight module provided in the embodiment of the present application is to set the adhesive 220 on the lens 30. First, the lens 30 is sucked by the suction nozzle 230, and the lens 30 is moved to the carrier 210 coated with the adhesive 220, so that the mounting surface 32 of the lens 30 contacts the carrier 210 and dips the adhesive 220. The operation is simple and convenient, which greatly improves the mounting efficiency of the lens 30 and helps to reduce the production cost.

Please refer to Figures 4 to 7, Figure 4 is a first cross-sectional schematic diagram of the lens provided in an embodiment of the present application, Figure 5 is a first structural schematic diagram of the lens provided in an embodiment of the present application, Figure 6 is a second structural schematic diagram of the lens provided in an embodiment of the present application, and Figure 7 is a third structural schematic diagram of the lens provided in an embodiment of the present application.

The embodiment of the present application further provides a lens 30, which is the lens described in the method for manufacturing the backlight module 100 described in any of the above embodiments. The lens 30 includes a light emitting surface 31 and a mounting surface 32 arranged opposite to the light emitting surface 31, wherein a receiving groove 321 is arranged at the center of the mounting surface 32, the receiving groove 321 is used to accommodate at least one light emitting chip 20, and a microstructure 322 is arranged on the mounting surface 32, and the mounting surface 32 can be understood as a side where the lens 30 is bonded to the substrate 10.

As shown in FIG4 , the light emitting surface 31 is an outwardly convex arc surface, and a conical groove 313 is concavely provided in the center of the arc surface, wherein the conical groove 313 is arranged opposite to the receiving groove 321. It can also be understood that the light emitting surface 31 includes a first surface 311 and a second surface 312, and the connection between the first surface 311 and the second surface 312 is arranged to be concave toward the mounting surface 32, so that part of the light emitted by the light emitting chip 20 in the receiving groove 321 can achieve a primary light diffusion effect at the connection between the first surface 311 and the second surface 312, so that the light that should be emitted to the connection between the first surface 311 and the second surface 312 is refracted or reflected by the first surface 311 and the second surface 312, and the light is emitted to both sides with a larger deflection angle, thereby increasing the diffusion angle of the light and enabling a uniform light spot to be formed after the light is emitted.

The groove wall of the tapered groove 313 is a first arcuate groove wall 3131, and the first arcuate groove wall 3131 is protruded toward the center of the tapered groove 313. The protruding first arcuate groove wall 3131 can diverge the central light toward the outside of the lens 30, avoid focusing the center of the lens 30, and further prevent the central brightness of the light source from being high, thereby ensuring the uniformity of light output from the light emitting chip 20.

Please continue to refer to Figures 4 to 7. The mounting surface 32 of the lens 30 is concavely formed to form a receiving groove 321. The receiving groove 321 is used to accommodate at least one light-emitting chip 20. When the lens 30 is mounted on the substrate 10, the light-emitting chip 20 is embedded in the receiving groove 321. Among them, the receiving groove 321 is an arc-shaped groove, and the groove wall of the receiving groove 321 is a second arc-shaped groove wall 3211. The second arc-shaped groove wall 3211 is protruded toward the side away from the center of the receiving groove 321. The light emitted by the light-emitting chip 20 is directed toward the groove wall of the receiving groove 321 toward the lens 30, and is reflected and refracted inside the lens 30 and then transmitted from the light-emitting surface 31. The groove wall of the receiving groove 321 is equivalent to the light-incoming surface. The second arc-shaped groove wall 3211 protruding outward of the receiving groove 321 can also diverge the central light toward the outside of the lens 30, avoiding the center of the lens 30 from focusing, thereby preventing the central brightness of the light source from being high, thereby ensuring the uniformity of the light output of the light-emitting chip 20.

In the lens 30 shown in the embodiment of the present application, the shape of the receiving groove 321 is conical, wherein the central axis of the conical groove 313 coincides with the central axis of the receiving groove 321 .

As shown in Fig. 4 to Fig. 7, the mounting surface 32 of the lens 30 is further provided with a microstructure 322, which can be understood as a protrusion 3221 or a recess 3222 provided on the mounting surface 32. Exemplarily, the microstructure 322 includes a plurality of protrusions 3221, which are spaced apart and arranged around the receiving groove 321, for example, the plurality of protrusions 3221 are arranged in concentric circles around the receiving groove 321.

In other embodiments, the protrusion 3221 is in a strip shape, and the protrusion 3221 includes a first end and a second end relative to each other, the first end is located at the periphery of the accommodating groove 321, and the second end extends to the periphery of the lens 30, and the width of the protrusion 3221 gradually increases from the first end to the second end.

Please refer to Figure 8, which is a second cross-sectional schematic diagram of the lens provided in an embodiment of the present application. In some other embodiments, the microstructure 322 can also be a recess 3222 formed by the mounting surface 32, and the recess 3222 is arranged around the receiving groove 321. Exemplarily, the microstructure 322 includes a plurality of recesses 3222, and the plurality of recesses 3222 are spaced apart and arranged around the receiving groove 321, for example, the plurality of recesses 3222 are arranged in concentric circles around the receiving groove 321.

It should be noted that the microstructure 322 arranged on the mounting surface 32 is not limited to the several methods shown in the figure, but also includes various other symmetrical or asymmetrical arrangement methods, which are not specifically limited in this application.

The lens 30 may be made of transparent materials such as glass, ceramic, or polymer materials such as polytetrafluoroethylene (PTFE), methyl methacrylate (PMMA), PEMA, polycarbonate, silicone and other polymer mixtures. The lens 30 may be formed by injection molding or compression molding.

It can be understood that by providing the microstructure 322 on the mounting surface 32 of the lens 30, the mounting surface 32 of the lens 30 forms an uneven structure, which is equivalent to increasing the contact area between the mounting surface 32 and the adhesive 220, which helps to improve the stability of the mounting of the lens 30 and the substrate 10; at the same time, due to the provision of the microstructure 322, when the lens 30 is dipped in the adhesive 220 on the carrier 210, there will be pores between the mounting surface 32 of the lens 30 and the carrier 210, and air will enter the pores, reducing the air pressure difference between the inside and outside of the mounting surface 32, so that no vacuum layer is formed between the mounting surface 32 and the carrier 210, thereby reducing the adsorption force between the lens 30 and the carrier 210, and the suction nozzle 230 can easily suck up the lens 30 after the lens 30 is dipped in the adhesive. Please continue to refer to Figures 4 to 7. In some embodiments, the mounting surface 32 of the lens 30 is further provided with at least one groove 323, one end of the groove 323 is connected to the receiving groove 321, and the other end of the groove 323 extends to the periphery of the lens 30. The groove 323 can not only reduce the adsorption force between the mounting surface 32 of the lens 30 and the carrier 210, but also release the gas generated inside the lens 30 during the heating and curing process of the lens 30; on the other hand, the groove 323 also has the function of an overflow cavity. Since the adhesive 220 is liquid, when the amount of adhesive 220 is too much, the lens 30 is prone to slippage and cause installation deviation. With the provision of the groove 323, the excess adhesive 220 can enter the groove 323, reducing the lens 30. The lens 30 slips during the attachment process, thereby ensuring that the lens 30 can be accurately attached to the substrate 10, improving the yield rate of the lens 30 mounting, and ensuring the light output effect of the product.

The embodiment of the present application also provides a backlight module 100, which is a direct-type backlight module 100, which has multiple backlight partitions and can realize the partition light control function. The direct-type backlight module 100 is mainly used in display devices such as LCD TVs, smart phones, and tablet computers to provide a backlight source for LCD display panels.

Please refer to Figure 9, which is a schematic diagram of the structure of the backlight module provided in the embodiment of the present application. The backlight module 100 provided in the embodiment of the present application includes a substrate 10, a light-emitting chip 20 and a lens 30. Among them, the light-emitting chip 20 is arranged on the substrate 10, and the lens 30 is arranged on the light-emitting chip 20 and fixedly connected to the substrate 10. The lens 30 is the lens described in any of the above embodiments.

The substrate 10 may be a PCB circuit board or a flexible circuit board. The substrate 10 is an important electronic component, a support for electronic components, and a carrier for electrical connections between electronic components.

The light-emitting chip 20 may be a Micro-LED chip or a Mini-LED chip. Preferably, the light-emitting chip 20 is a flip-chip Mini-LED chip. The light-emitting chip 20 is disposed on the substrate 10 and is electrically connected to the substrate 10. In the embodiment of the present application, the number of the light-emitting chips 20 is multiple, and the multiple light-emitting chips 20 are arranged at intervals and arranged on the substrate 10 in an array, or arranged on the substrate 10 in other regular or irregular ways, and the present application does not impose specific restrictions on this. For example, the light-emitting chip 20 is arranged on the surface of the substrate 10 in an M row * N column arrangement, and M and N are both positive integers not less than 2.

Among them, the mounting surface 32 of the lens 30 is provided with an adhesive 220, and the adhesive 220 is used to fix the lens 30 on the substrate 10. The mounting surface 32 of the lens 30 is concave to form a receiving groove 321, and the receiving groove 321 is used to accommodate at least one light-emitting chip 20. When the lens 30 is mounted on the substrate 10, the light-emitting chip 20 is embedded in the receiving groove 321. The light-emitting chip 20 can be packaged by the lens 30. The lens 30 can not only maintain the airtightness of the light-emitting chip 20 and protect the light-emitting chip 20 from the temperature and humidity in the surrounding environment, but also prevent the light-emitting chip 20 from being damaged by mechanical vibration and impact or causing changes in characteristics and affecting its luminous performance. At the same time, the lens 30 can also refract, reflect or scatter the light emitted by the light-emitting chip 20 to increase the light output angle and light mixing uniformity of the light-emitting chip 20, which is conducive to reducing the number of light-emitting chips 20 used, thereby reducing the cost of the backlight module 100.

Please continue to refer to FIG. 9 . The backlight module 100 provided in the embodiment of the present application further includes a reflective layer 40 . The reflective layer 40 is disposed on the substrate 10 . The reflective layer 40 includes a plurality of hollow areas. The light-emitting chip 20 is located on the substrate 10 exposed in the hollow areas.

Exemplarily, the reflective layer 40 may be a reflective sheet attached to the substrate 10, the reflective sheet including a plurality of hollow areas, and the hollow areas may expose the light emitting chip 20 disposed on the substrate 10. Specifically, when attaching the reflective sheet to the substrate 10, first First, each hollow area is aligned with each light emitting chip 20 , and then the reflective sheet is pressed and assembled onto the substrate 10 to expose the light emitting chip 20 .

In some embodiments, the reflective layer 40 may also be a reflective coating sprayed on the substrate 10 , such as a metal coating, etc. When spraying the reflective coating, the hollow area may be covered, and the uncovered area may be sprayed with the reflective coating to form the reflective layer 40 .

It should be noted that, by providing the reflective layer 40, the brightness of the surface light source of the backlight module 100 can be further improved, the utilization rate of the light emitted by the light emitting chip 20 can be maximized, and the uniformity of light mixing can be improved. At the same time, the light emitted by the light emitting chip 20 toward the substrate 10 can also enter the lens 30 again after being reflected by the reflective layer 40, which can prevent the light leakage problem of the light emitting chip 20 and further improve the performance of the backlight module 100.

In some embodiments, the backlight module 100 further includes a diffuser 50, which is disposed on the side of the lens 30 away from the substrate 10. The diffuser 50 has the functions of light uniformity and atomization, and the diffuser 50 refracts or scatters the light in different directions, thereby changing the path of the light, fully scattering the light to produce an optical diffusion effect, and making the light incident on the liquid crystal display module softer.

The embodiment of the present application also provides a display device, which includes the backlight module 100 shown in any of the above embodiments, and the backlight module 100 provides a backlight source for the display device. The display device can be: a liquid crystal display panel, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function, which is not limited in the embodiment of the present application. The display device provided in the embodiment of the present application adopts the above-mentioned backlight module 100, which can achieve a uniform backlight source and bring good visual effects to users.

The lens, backlight module, display device and manufacturing method of the backlight module provided by the embodiments of the present application, the lens includes a light emitting surface and a mounting surface arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to accommodate at least one light emitting chip, wherein the mounting surface is provided with a microstructure; due to the arrangement of the microstructure, the mounting surface of the lens forms an uneven structure, and no vacuum layer is formed between the lens and the carrier coated with adhesive, so that the lens can be dipped in the adhesive on the carrier, and then the lens is mounted on the light emitting chip, so that the amount of adhesive mounted on each lens and the light emitting chip is consistent, thereby improving the reliability of lens mounting, effectively preventing the adhesive from accumulating on the surface of the light emitting chip and affecting the light emitting effect of the light emitting chip, thereby increasing the light uniformity of the backlight module.

In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

The above describes in detail the manufacturing method of the backlight module, lens, backlight module, and display device provided in the embodiments of the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of the present application, in a specific There may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present application.

Claims

A lens, comprising:

Bright surface;

The mounting surface is arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to receive at least one light emitting chip, and a microstructure is arranged on the mounting surface.
The lens according to claim 1, wherein the microstructure comprises a plurality of protrusions, and the plurality of protrusions are spaced apart and arranged around the receiving groove.
The lens according to claim 2, wherein a plurality of said protrusions are arranged in concentric circles around said receiving groove.
The lens according to claim 2, wherein the protrusion is in a strip shape, and the protrusion includes a first end and a second end opposite to each other, the first end is located at the periphery of the accommodating groove, the second end extends to the periphery of the lens, and the width of the protrusion gradually increases from the first end to the second end.
The lens according to claim 1, wherein the microstructure is a depression formed by the mounting surface being concave, and the depression is arranged around the receiving groove.
The lens according to claim 1, wherein the mounting surface is provided with at least one groove, one end of the groove is connected to the accommodating groove, and the other end of the groove extends to the periphery of the lens.
The lens according to claim 1, wherein the light emitting surface is an outwardly convex arc surface, a conical groove is concavely provided at the center of the arc surface, and the conical groove is arranged opposite to the accommodating groove.
The lens according to claim 7, wherein the receiving groove is conical in shape.
The lens according to claim 8, wherein a central axis of the tapered groove coincides with a central axis of the receiving groove.
A backlight module, comprising:

Substrate;

A light-emitting chip is disposed on the substrate;

A lens is arranged on the light-emitting chip, wherein the lens is the lens according to any one of claims 1 to 7, and an adhesive is arranged on the mounting surface of the lens, and the adhesive is used to fix the lens on the substrate.
The backlight module according to claim 10, further comprising a reflective layer, wherein the reflective layer is disposed on the substrate, the reflective layer comprises a plurality of hollow areas, and the light-emitting chip is located on the substrate exposed in the hollow areas.
A display device, wherein the display device comprises the backlight module according to claim 10 or 11.
A method for manufacturing a backlight module, comprising:

providing a substrate;

At least one light-emitting chip is arranged on the substrate;

Providing a lens, and placing adhesive on the mounting surface of the lens;

Mounting the lens on the light-emitting chip;

The lens comprises a light emitting surface and a mounting surface arranged opposite to the light emitting surface, a receiving groove is arranged at the center of the mounting surface, the receiving groove is used to receive at least one light emitting chip, and the mounting surface is provided with a microstructure.
According to the method for manufacturing a backlight module according to claim 13, wherein the step of providing adhesive on the mounting surface of the lens comprises:

Provide carrier board;

Coating a layer of adhesive on the surface of the carrier;

The lens is moved onto the carrier plate, and the mounting surface of the lens is dipped into the adhesive.
According to the method for manufacturing a backlight module according to claim 14, wherein the step of coating a layer of adhesive on the surface of the carrier comprises:

Injecting adhesive into the carrier board;

Use a scraper to smooth the adhesive.
The method for manufacturing a backlight module according to claim 15, wherein the step of flattening the adhesive with a scraper comprises:

When the adhesive is flattened by a scraper, the height and the tilt angle of the scraper are adjusted so that the coating thickness of the adhesive on the carrier plate matches the height of the microstructure arranged on the lens mounting surface.
The method for manufacturing a backlight module according to claim 13, wherein after mounting the lens on the light-emitting chip, the method further comprises:

The lens is baked to cure the adhesive.
The method for manufacturing a backlight module according to claim 17, wherein after baking the lens to solidify the adhesive, the method further comprises:

A reflective layer is disposed on the substrate, the reflective layer includes a plurality of hollow areas, and the light-emitting chip is located on the substrate exposed in the hollow areas.
The method for manufacturing a backlight module according to claim 13, wherein after mounting the lens on the light-emitting chip, the method further comprises:

The lens is irradiated with UV light to cure the adhesive.
The method for manufacturing a backlight module according to claim 19, wherein after irradiating the lens with UV light to cure the adhesive, the method further comprises:

A reflective layer is disposed on the substrate, the reflective layer includes a plurality of hollow areas, and the light-emitting chip is located on the substrate exposed in the hollow areas.