WO2024062605A1 - 回路形成装置、および回路形成方法 - Google Patents

回路形成装置、および回路形成方法 Download PDF

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Publication number
WO2024062605A1
WO2024062605A1 PCT/JP2022/035405 JP2022035405W WO2024062605A1 WO 2024062605 A1 WO2024062605 A1 WO 2024062605A1 JP 2022035405 W JP2022035405 W JP 2022035405W WO 2024062605 A1 WO2024062605 A1 WO 2024062605A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
conductive paste
electrode
resin
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/035405
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English (en)
French (fr)
Japanese (ja)
Inventor
謙磁 塚田
亮二郎 富永
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Fuji Corp
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Fuji Corp
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Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to PCT/JP2022/035405 priority Critical patent/WO2024062605A1/ja
Priority to JP2024548039A priority patent/JPWO2024062605A1/ja
Publication of WO2024062605A1 publication Critical patent/WO2024062605A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Definitions

  • the present invention relates to a circuit forming apparatus and the like that mounts electronic components so that electrodes are in contact with conductive paste.
  • Patent Document 1 listed below describes a technique for mounting electronic components so that electrodes are in contact with conductive paste.
  • the object of the present invention is to appropriately form a substrate including an electronic component mounted so that an electrode is in contact with a conductive paste.
  • the present specification provides a first coating device that applies a conductive paste to a position shifted away from the electronic component from a scheduled mounting position of an electrode of the electronic component, and a A circuit forming apparatus is disclosed that includes a mounting device for mounting the electronic component so that the electrode contacts the conductive paste applied by the device.
  • the present specification includes a coating process of applying a conductive paste to a position shifted away from the electronic component from a planned mounting position of an electrode of the electronic component, and a coating process of applying the conductive paste to a position that is shifted away from the electronic component, and a conductive paste applied in the coating process.
  • a circuit forming method including a mounting step of mounting the electronic component so that the electrodes are in contact with each other.
  • a conductive paste is applied to a position shifted away from the electronic component from the planned mounting position of the electrode of the electronic component. Then, electronic components are mounted so that the electrodes are in contact with the applied conductive paste. This makes it possible to appropriately form a substrate including an electronic component mounted so that the electrode is in contact with the conductive paste.
  • FIG. 2 is a block diagram showing a control device.
  • FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon.
  • FIG. 2 is a cross-sectional view showing a circuit board with wiring formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit board with conductive paste applied on wiring.
  • FIG. 2 is a cross-sectional view showing a circuit board with a thermosetting resin coated on a resin layer.
  • FIG. 2 is a cross-sectional view showing a circuit board with electronic components mounted thereon.
  • FIG. 3 is a cross-sectional view showing a circuit board with electronic components pressed against a resin laminate.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 13 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is a diagram showing the adhesion area ratio for each size of electronic components.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 1 shows a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control unit 26.
  • a device (see FIG. 2) 28 is provided.
  • the conveyance device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10. has been done.
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 includes a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed into a flat plate shape, and a substrate is placed on the top surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held.
  • the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.
  • the heater 66 is built into the base 60 and heats the substrate placed on the base 60 to an arbitrary temperature.
  • the first modeling unit 22 is a unit that shapes wiring on a circuit board, and includes a first printing section 72 and a firing section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner.
  • Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
  • the baking section 74 has an infrared irradiation device 78 (see Figure 2).
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is baked, and wiring is formed.
  • baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.
  • the second modeling unit 23 is a unit that models the resin layer of the circuit board, and includes a second printing section 84 and a curing section 86.
  • the second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin.
  • Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform.
  • the irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This hardens the discharged UV-curable resin, forming a resin layer.
  • the third modeling unit 24 is a unit that models connection parts between electrodes and wiring of electronic components on a circuit board, and has a third printing unit 100.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive paste.
  • the conductive paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature.
  • the metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to the metal ink.
  • the amount of conductive paste discharged by the dispenser 106 is controlled by the inner diameter of the needle, the pressure at the time of discharge, and the discharge time.
  • the conductive paste discharged by the dispenser 106 is heated by the heater 66 built into the base 60.
  • the heated conductive paste causes the resin to harden.
  • the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive paste exhibits conductivity.
  • the resin of the conductive paste is an organic adhesive, and exhibits adhesive strength by being cured by heating.
  • the fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing section 110.
  • the fourth printing section 110 has a dispenser (see FIG. 2) 116, and the dispenser 116 dispenses thermosetting resin.
  • a thermosetting resin is a resin that hardens by heating.
  • the dispenser 116 is of a piezo type using a piezoelectric element, for example.
  • the thermosetting resin discharged by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.
  • the pressing unit 26 is a unit for pressing the circuit board, and has a pressing part 120.
  • the pressing section 120 includes a pressing plate (see FIG. 8) 122, a rubber plate (see FIG. 8) 124, and a cylinder (see FIG. 2) 126.
  • the rubber plate 124 is made of silicone rubber, for example, and has a plate shape.
  • the pressing plate 122 is made of, for example, steel and has a plate shape.
  • a rubber plate 124 is attached to the lower surface of the pressing plate 122, and the pressing plate 122 is pressed toward the circuit board by the operation of the cylinder 126. As a result, the circuit board is pressed by the pressing plate 122 via the rubber plate 124. Note that by controlling the operation of the cylinder 126, the force with which the substrate is pressed can be changed in a controllable manner.
  • the mounting unit 27 is a unit for mounting electronic components on a circuit board, and includes a supply section 130 and a mounting section 132.
  • the supply unit 130 has a plurality of tape feeders (see FIG. 2) 134 that feed out taped electronic components one by one, and supplies the electronic components at a supply position.
  • the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 130 may be configured to include both a tape type and a tray type, or other types of supply devices.
  • the mounting section 132 includes a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for suctioning and holding the electronic component.
  • the suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the electronic component by suctioning air. Then, by supplying a slight positive pressure from the positive/negative pressure supply device, the electronic component is detached.
  • the moving device 138 moves the mounting head 136 between the position where the electronic components are supplied by the tape feeder 134 and the substrate placed on the base 60. As a result, in the mounting section 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • control device 28 includes a controller 140 and a plurality of drive circuits 142, as shown in FIG.
  • the plurality of drive circuits 142 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, a heater 66, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, It is connected to the dispenser 116, cylinder 126, tape feeder 134, mounting head 136, and moving device 138.
  • the controller 140 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 142. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 23 , the third modeling unit 24 , the fourth modeling unit 25 , the pressing unit 26 , and the mounting unit 27 are controlled by the controller 140 .
  • a resin laminate is formed on the base 60, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic component are electrically connected to the wiring via the conductive paste, and the electronic component is fixed with the resin, thereby forming a circuit board.
  • the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 3, a resin laminate 152 is formed on the base 60 of the stage 52.
  • the resin laminate 152 is formed by repeatedly ejecting the ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the upper surface of the base 60. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 153 is formed on the base 60.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 153.
  • the thin film-like ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet rays onto the thin film-like ultraviolet curable resin, thereby forming a layer on the thin film-like resin layer 153.
  • a thin film-like resin layer 153 is laminated.
  • the resin laminate 152 is formed by repeating the discharging of the ultraviolet curable resin onto the thin film-like resin layer 153 and the irradiation of ultraviolet rays, and by stacking a plurality of resin layers 153.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 ejects the metal ink 160 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 152, as shown in FIG. 4.
  • the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 160 is baked, and wiring 162 is formed on the upper surface of the resin laminate 152. Note that in FIG.
  • wiring 162a the wiring on the left side in FIG. 4 is described as wiring 162a
  • the wiring in the center is described as wiring 162b
  • the wiring on the right side is described as wiring 162c.
  • the stage 52 is moved below the third modeling unit 24.
  • the dispenser 106 prints on both ends of the wiring 162b, and on the wiring 162a and the wiring 162c facing both ends of the wiring 162b. Dispense conductive paste 166 onto the end.
  • the heater 66 built into the base 60 heats the resin laminate 152 according to the heating conditions of the conductive paste.
  • the heating conditions of the conductive paste are heating conditions for completely hardening the conductive paste, and are set by the manufacturer of the conductive paste.
  • the heating conditions of the conductive paste are also set according to the results of heating the conductive paste experimentally performed by a user of the conductive paste. In this way, the conductive paste 166 is heated according to the heating conditions of the conductive paste and completely hardens, thereby exhibiting conductivity.
  • the stage 52 is moved below the fourth modeling unit 25. Then, in the fourth printing section 110 of the fourth modeling unit 25, the dispenser 116 applies heat to the upper surface of the resin laminate 152 between the ends of the two wires 162a, b facing each other, as shown in FIG.
  • the thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the two wires 162b and 162c facing each other.
  • the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 7) is supplied by a tape feeder 134, and the electronic component 172 is held by a suction nozzle of a mounting head 136.
  • the electronic component 172 is a so-called chip component, and is composed of a component body 176 and two electrodes 178 disposed on the lower surface of the component body 176.
  • the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted on the upper surface of the resin laminate 152, as shown in FIG.
  • two electronic components 172 are mounted on the upper surface of the resin laminate 152, and the sizes of these two electronic components 172 are different. Therefore, a small-sized electronic component will be referred to as an electronic component 172a, and a large-sized electronic component will be referred to as an electronic component 172b. Then, the two electronic components 172a, b are connected so that the electronic component 172a is electrically connected to the two wirings 162a, b, and the electronic component 172b is electrically connected to the two wirings 162b, c. is mounted on the upper surface of the resin laminate 152.
  • electronic component 172a is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162a, b.
  • component body 176 of electronic component 172a contacts thermosetting resin 170 dispensed between wiring 162a, b.
  • Electronic component 172b is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162b, c.
  • component body 176 of electronic component 172b contacts thermosetting resin 170 dispensed between wiring 162b, c.
  • conductive paste 166 is dispensed at the intended attachment position of electrode 178 to wiring 162
  • thermosetting resin 170 is dispensed at the intended attachment position of component body 176.
  • the planned mounting position of the electrode 178 is the relative position of the electrode 178 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152 and the wiring 162, and is the position where the electrode 178 comes into contact when the electronic component 172 is mounted.
  • the planned mounting position of the component body 176 is the relative position of the component body 176 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152, and is the position where the component body 176 comes into contact when the electronic component 172 is mounted.
  • thermosetting resin 170 in contact with the component body 176 is sealed between the component body 176 and the resin laminate 152. That is, the thermosetting resin 170 is filled between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the amount of the thermosetting resin 170 dispensed by the dispenser 116 is controlled so that the thermosetting resin 170 does not spill out from between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the electronic component 172a is electrically connected to the two wirings 162a, b
  • the electronic component 172b is electrically connected to the two wirings 162b, c. connected.
  • the electronic component 172 is mounted so that the electrode 178 contacts the hardened conductive paste 166, the contact area between the electrode 178 and the conductive paste 166 at this point is small.
  • the component body 176 of the electronic component 172 contacts the thermosetting resin 170, but since the thermosetting resin 170 is uncured at this point, the contact area between the component body 176 and the thermosetting resin 170 is growing.
  • the stage 52 is moved below the pressing unit 26. Then, in the pressing section 120 of the pressing unit 26, as shown in FIG. 8, the electronic component 172 mounted on the resin laminate 152 is pressed from above to below by the pressing plate 122 via the rubber plate 124.
  • the rubber plate 124 is attached to the lower surface of the press plate 122, the rubber plate 124 is elastically deformed when the two electronic components 172 are pressed, and the two electronic components with different height dimensions are Part 172 can be pressed appropriately.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the thermosetting resin 170 is heated and hardened via the resin laminate 152.
  • the heating temperature is, for example, a temperature at which the thermosetting resin 170 is cured (for example, 85° C.). That is, the thermosetting resin 170 sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 is hardened while being pressed by the rubber plate 124 . This further increases the contact area between the component body 176 and the thermosetting resin 170, and the adhesive force of the thermosetting resin 170 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176.
  • the electronic component 172 when the electronic component 172 is pressed, that is, when the electronic component 172 mounted on the resin laminate 152 is pressed toward the resin laminate 152, it comes into contact with the electrode 178 of the electronic component 172.
  • the conductive paste 166 is deformed, and the contact area between the electrode 178 and the conductive paste 166 increases. This ensures electrical connection between the electronic component 172 and the wiring 162.
  • the electronic component 172 is fixed to the upper surface of the resin laminate 152 by the adhesive force of the thermosetting resin 170, thereby forming the circuit board 180 shown in FIG.
  • the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is smaller than the adhesive area ratio of the large-sized electronic component 172b by the thermosetting resin 170.
  • the electronic component 172a may be displaced, resulting in poor conduction.
  • the adhesive area ratio of the thermosetting resin 170 of the electronic component 172 is the ratio of the adhesive area of the electronic component 172 by the thermosetting resin 170 to the area of the mounting surface of the electronic component 172 to the circuit board, that is, the bottom surface of the electronic component 172. It is a percentage of the adhesive area.
  • the area of the mounting surface of the small-sized electronic component 172a is XA1
  • the adhesive area of the small-sized electronic component 172a with the thermosetting resin 170 is XS1. Therefore, the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is XS1/XA1.
  • the area of the mounting surface of the large-sized electronic component 172b is XA2
  • the adhesive area of the large-sized electronic component 172b with the thermosetting resin 170 is XS2. Therefore, the adhesive area ratio of the thermosetting resin 170 of the large-sized electronic component 172b is XS2/XA2.
  • the adhesion area ratio XS1/XA1 of the small-sized electronic component 172a is clearly smaller than the adhesion area ratio XS2/XA2 of the large-sized electronic component 172b.
  • thermosetting resin 170 of the small-sized electronic component 172a is considerably smaller than that of the thermosetting resin 170 of the large-sized electronic component 172b, so that the attached electronic component 172a There is a risk of misalignment and poor continuity.
  • the conductive paste 166 that connects the electrode 178 of the electronic component 172a and the wiring 162 is inserted from the planned mounting position of the electrode 178. It is applied at a position shifted in the direction away from the electronic component 172a (hereinafter referred to as the "separation direction"). Specifically, when the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the small-sized electronic component 172a, as shown in FIG. Conductive paste 166 is applied so that it overlaps center 192 .
  • the size of the small electronic component 172a is, for example, 0.6 mm x 0.3 mm (the length in the horizontal direction of the paper in FIG. 10 is 0.6 mm, and the length in the vertical direction of the paper is 0.3 mm).
  • the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the small-sized electronic component 172a, the conductive paste 166 is applied between the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178
  • the electronic component 172a contacts the thermosetting resin 170 in the space. That is, the shaded area in FIG. 10 is the adhesive area XS1 of the electronic component 172a by the thermosetting resin 170. Further, the dot portion in FIG.
  • the adhesion area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a is approximately 23%.
  • the adhesion area ratio of the electronic component 172a is approximately 23 %.
  • the conductive paste 166 is applied to a position shifted away from the intended mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 192 of the conductive paste 166 is shifted away from the center 190 of the electrode 178 of the electronic component 172a.
  • the conductive paste 166 is applied to a position shifted away from the intended attachment position of the electrode 178 in this way, a pair of conductive pastes 166 applied corresponding to a pair of electrodes 178 are separated from each other. , the space between the pair of conductive pastes 166 becomes wider.
  • the adhesive area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a becomes approximately 43%.
  • the adhesive area ratio of the electronic component 172a when the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a (hereinafter referred to as "adhesion area ratio at the separated position"). ) is approximately 43%.
  • the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a, so that the contact area ratio of the electronic component 172a increases, and the mounted electronic component It becomes possible to prevent the positional shift of 172a.
  • the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the large-sized electronic component 172a, as shown in FIG.
  • Conductive paste 166 is applied so as to overlap with each other.
  • the size of the large-sized electronic component 172b is, for example, 1.0 mm x 0.5 mm (the length in the horizontal direction of the paper in FIG. 12 is 1.0 mm, and the length in the vertical direction of the paper is 0.5 mm).
  • the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the electronic component 172b, the size of the electronic component 172b is large and the space between the pair of electrodes 178 is also relatively large.
  • the adhesive area XS2 hatchched area where 172b and thermosetting resin 170 contact is also large. Therefore, the adhesion area ratio XS2 (shaded area)/XA2 (dotted area) of the electronic component 172b is approximately 43%. In other words, the adhesion area ratio at the intended mounting position of the electrode 178 of the electronic component 172b is approximately 43%. In this way, the adhesive area ratio (approximately 43%) for the large electronic component 172b at the planned mounting position is approximately the same as the adhesive area ratio (approximately 43%) for the small electronic component 172a at the separated position.
  • the conductive paste 166 When the conductive paste 166 is applied to the component 172b, the conductive paste 166 does not need to be applied at a position shifted from the planned mounting position of the electrode 178, but is applied at the planned mounting position of the electrode 178.
  • the size of electronic component 172a is, for example, 0.6 mm x 0.3 mm, and since electronic component 172a is small, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. For this reason, even for electronic component 172a, that is, electronic components smaller than 0.6 mm x 0.3 mm, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. Specifically, as shown in FIG. 13, when conductive resin paste 166 is applied to the intended mounting position of electrode 178 of electronic component 172c smaller than 0.6 mm x 0.3 mm, for example, electronic component 172c of 0.4 mm x 0.2 mm (0.4 mm in the horizontal direction of the paper in FIG.
  • conductive paste 166 is applied so that center 210 of electrode 178 and center 212 of conductive paste 166 overlap.
  • the conductive resin paste 166 is applied in this manner to the intended mounting positions of the electrodes 178 of the electronic component 172c, the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178 come into contact with each other, and there is no space between the pair of conductive pastes 166. Therefore, when the conductive resin paste 166 is applied to the intended mounting positions of the electrodes 178 of the electronic component 172c, the contact area between the electronic component 172c and the thermosetting resin 170 is 0, and the adhesion area ratio of the electronic component 172c is 0%. In other words, the adhesion area ratio at the intended mounting positions of the electrodes 178 of the electronic component 172c is 0%.
  • the conductive paste 166 is applied to a position of the electronic component 172c that is shifted away from the planned mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 212 of the conductive paste 166 is shifted away from the center 210 of the electrode 178 of the electronic component 172c. As a result, the pair of conductive pastes 166 are separated from each other, and the adhesive area of the electronic component 172c by the thermosetting resin 170 is secured, so that the adhesive area ratio of the electronic component 172c is approximately 43%. Thereby, even if the electronic component 172c is smaller than the electronic component 172a, it is possible to prevent the electronic component 172c from being misaligned.
  • the adhesion area ratio at the scheduled mounting position for electronic components a and c (for example, 0.6 mm x 0.3 mm, for example, 0.4 mm x 0.2 mm) is as follows: Because the adhesive area ratio is lower than the bonding area ratio at the scheduled mounting position for electronic components 172b (for example, 1.0 mm x 0.5 mm) larger than c, the conductive paste was shifted from the scheduled mounting position for electronic components a and c. applied to the location.
  • the adhesion area ratio at the separated position for electronic components a and c is 40% or more, that is, the same level as the adhesion area ratio at the scheduled mounting position for electronic component 172b, which is larger in size than electronic components a and c. It becomes possible to do so.
  • the space between a pair of electrodes is larger than the space between a pair of electrodes of electronic component 172b (e.g., 1.0 mm x 0.5 mm).
  • the adhesion area ratio at the intended mounting position for electronic components having sizes of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm is larger than the adhesion area ratio at the intended mounting position for electronic component 172b (e.g., 1.0 mm x 0.5 mm).
  • the adhesion area ratio at the intended mounting position for an electronic component of 1.6 mm x 0.8 mm is about 61%
  • the adhesion area ratio at the intended mounting position for an electronic component of 2.0 mm x 1.2 mm is about 69%
  • the adhesion area ratio at the intended mounting position for an electronic component of 3.2 mm x 1.6 mm is about 80%.
  • the conductive paste 166 when the conductive paste 166 is applied to electronic components of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm, the conductive paste 166 does not need to be applied at a position shifted from the intended mounting position of the electrode 178, but is applied at the intended mounting position of the electrode 178. In other words, the conductive paste 166 is applied at the intended mounting position of the electrode 178 for electronic components of 1.0 mm x 0.5 mm or more, and is applied at a position shifted from the intended mounting position of the electrode 178 for electronic components of less than 1.0 mm x 0.5 mm.
  • the standard size for determining whether the conductive paste 166 is applied to the intended installation position or offset from the intended installation position, i.e., 1.0 mm x 0.5 mm, is set by the operator, but the standard size can be changed as desired.
  • the adhesion area ratio increases and the adhesive force of the thermosetting resin 170 for electronic components increases; however, the conductive paste 166 If the amount of deviation from the planned mounting position is too large, there is a risk that the electrical conductivity of the electronic component cannot be ensured. Specifically, for example, as shown in FIG. 16, when the conductive paste 166 is applied to the electronic component 172a, if there is too much misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166. , the conductive area ratio of the conductive paste 166 becomes smaller.
  • the conductive area ratio of the conductive paste 166 is the percentage of the contact area (shaded area) between the electrode 178 and the conductive paste 166 to the area (dot area) on the mounting surface of one electrode 178.
  • the amount of misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is too large, so that the conductive area ratio of the conductive paste 166 is about 30%.
  • the conductivity between the conductive paste 166 and the electrode 178 cannot be properly ensured.
  • the amount of deviation between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is adjusted so that the conductive area ratio of the conductive paste 166 is 50% or more.
  • the conductive area ratio of the conductive paste 166 can be increased to 50% or more. (approximately 80% in FIG. 17). This makes it possible to appropriately ensure the conductivity between the conductive paste 166 and the electrode 178.
  • the controller 140 of the control device 28 includes an application section 220 and a mounting section 222, as shown in FIG.
  • the application section 220 is a functional section for applying the conductive paste 166 to a position shifted in the direction away from the intended mounting position of the electrode 178.
  • the mounting section 222 is a functional section for mounting the electronic component 172 so that the electrode 178 comes into contact with the conductive paste 166 applied by the application section 220.
  • the circuit forming device 10 is an example of a circuit forming device.
  • Dispenser 106 is an example of a first coating device.
  • Dispenser 116 is an example of a second coating device.
  • the mounting section 132 is an example of a mounting device.
  • the conductive paste 166 is an example of a conductive paste.
  • Thermosetting resin 170 is an example of a curable resin.
  • Electronic component 172 is an example of an electronic component.
  • the component body 176 is an example of a component body.
  • Electrode 178 is an example of an electrode.
  • 1.0 mm x 0.5 mm is an example of the predetermined size.
  • the process performed by the coating unit 220 is an example of a coating process.
  • the process performed by the mounting unit 222 is an example of a mounting process.
  • the present invention is not limited to the above-mentioned embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art.
  • the present invention is applied to a mode in which the thermosetting resin 170 is applied between the pair of conductive pastes 166, but the thermosetting resin 170 is applied between the pair of conductive pastes 166.
  • the present invention may be applied to an embodiment in which the resin 170 is not applied. Specifically, for example, as shown in FIG. 13, when the conductive resin paste 166 is applied to the electronic component 172c at the intended mounting position of the electrode 178, the pair of conductive pastes 166 come into contact with each other.
  • thermosetting resin 170 is applied before the electronic component 172 is mounted, but the thermosetting resin 170 may be applied after the electronic component 172 is mounted. At this time, the thermosetting resin 170 is applied between the lower surface of the component body 176 of the mounted electronic component 172 and the upper surface of the resin laminate 152. That is, the thermosetting resin 170 is applied to the resin laminate 152 at the position where the component body 176 is scheduled to be mounted. Then, after the thermosetting resin 170 is applied between the lower surface of the component body 176 of the electronic component 172 and the upper surface of the resin laminate 152, the electronic component 172 is pressed by the rubber plate 124.
  • the size that serves as the standard for determining whether the conductive paste 166 is applied to the intended attachment position or displaced from the intended attachment position is set by the operator, but the default value is It may be entered.
  • the electronic component 172 is mounted with the conductive paste 166 completely cured, and the electronic component 172 is pressed by the rubber plate 124.
  • the electronic component 172 may be mounted with the conductive paste 166 semi-hardened, and the electronic component 172 may be pressed by the rubber plate 124.
  • the electronic component 172 may be mounted with the conductive paste 166 neither semi-cured nor completely cured, and the electronic component 172 may be pressed by the rubber plate 124. Note that when the electronic component 172 is mounted with the conductive paste 166 in a semi-cured state, neither semi-cured nor completely cured, and the electronic component 172 is pressed by the rubber plate 124, heating by the heater 66 is performed. The conductive paste is completely cured.
  • the conductive paste 166 is used as the conductive fluid that electrically connects the wiring 162 and the electrode 178 of the electronic component 172, but various pastes may be used as long as they exhibit conductivity. It is possible to employ fluids.
  • thermosetting resin is used as the curable resin for fixing the electronic component 172 to the resin laminate 152, but ultraviolet curable resin, two-component mixed curable resin, thermoplastic resin, etc. It is possible to form resin or the like.
  • an ultraviolet curing resin is used as the resin for forming the resin laminate 152
  • a thermosetting resin is used as the resin for fixing the electronic component 172.
  • the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different.
  • the same curable resin may be used.
  • the conductive paste is discharged by the dispenser 106, but it may be transferred by a transfer device or the like. Further, the conductive paste may be printed by screen printing.
  • Circuit forming device (electrical circuit forming device) 106: Dispenser (first coating device) 116: Dispenser (second coating device) 132: Mounting part (mounting device) 166: Conductive paste (conductive fluid) 170: Heat Curable resin (curable resin) 172: Electronic component 176: Component body 178: Electrode 220: Coating section (coating process) 222: Mounting section (fitting process)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2022/035405 2022-09-22 2022-09-22 回路形成装置、および回路形成方法 Ceased WO2024062605A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026033712A1 (ja) * 2024-08-08 2026-02-12 株式会社Fuji 回路形成方法、および回路形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108966A (ja) * 2003-09-29 2005-04-21 Tdk Corp 電子部品の実装方法
WO2022113186A1 (ja) * 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108966A (ja) * 2003-09-29 2005-04-21 Tdk Corp 電子部品の実装方法
WO2022113186A1 (ja) * 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026033712A1 (ja) * 2024-08-08 2026-02-12 株式会社Fuji 回路形成方法、および回路形成装置

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