WO2024058469A1 - Dispositif électronique comprenant un élément de dissipation de chaleur - Google Patents

Dispositif électronique comprenant un élément de dissipation de chaleur Download PDF

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Publication number
WO2024058469A1
WO2024058469A1 PCT/KR2023/012889 KR2023012889W WO2024058469A1 WO 2024058469 A1 WO2024058469 A1 WO 2024058469A1 KR 2023012889 W KR2023012889 W KR 2023012889W WO 2024058469 A1 WO2024058469 A1 WO 2024058469A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
heat dissipation
dissipation member
area
cooling unit
Prior art date
Application number
PCT/KR2023/012889
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English (en)
Korean (ko)
Inventor
조현제
남궁기철
박차훈
이해진
김정섭
최태호
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020220131461A external-priority patent/KR20240037119A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024058469A1 publication Critical patent/WO2024058469A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to an electronic device including a heat dissipation member.
  • the cooling structure of an electronic device may include a heat plate, a heat pipe, a cooling fin, and/or a cooling fan.
  • the heat plate can directly contact the heat source and transfer the heat generated from the heat source to the hip pipe.
  • the heat pipe can transfer the received heat to the point where the cooling fins are located.
  • the cooling fan can cool the heat reaching the cooling fins by blowing air in a direction toward the cooling fins.
  • the thickness of the cooling fan included in the cooling structure may also become thinner.
  • the cooling fan may rotate at a faster speed to satisfy cooling performance.
  • the noise generated from the cooling fan may increase to a level that does not meet predetermined reliability standards.
  • An electronic device may include a housing, a printed circuit board, a heat dissipation member, and/or a cooling unit.
  • the housing may include a first surface on which a keyboard is disposed, and a second surface located opposite the first surface and including an inlet opening through which external air flows.
  • At least one electronic component according to an embodiment of the present disclosure may be disposed on a printed circuit board.
  • the heat dissipation member according to an embodiment of the present disclosure is disposed between the first and second surfaces, extends along the longitudinal direction of the housing, and can receive heat generated from the electronic component.
  • the cooling unit allows external air flowing in from the inlet opening to cool the heat dissipation member.
  • the heat dissipation member includes a first region where a printed circuit board is disposed, two cooling units located at one end and the other end of the first region at a distance from each other in the width direction and the height direction of the electronic device, and a cooling unit being disposed. It may include a second area and a connection area connecting the first area and the second area.
  • the printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member according to an embodiment of the present disclosure.
  • a printed circuit board heat dissipation structure may include a printed circuit board on which at least one electronic component is disposed, a heat dissipation member that receives heat generated from the electronic component, and a cooling unit that cools the heat dissipation member.
  • the heat dissipation member of the printed circuit board heat dissipation structure includes a first region where the printed circuit board is disposed, and one end and the other end of the first region are spaced apart in the width and height directions of the printed circuit board heat dissipation structure. They are located on each other and may include two second areas where the cooling unit is disposed and a connection area connecting the first area and the second area.
  • the printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member.
  • An electronic device including a heat dissipation member according to an embodiment of the present disclosure can provide a low-noise cooling structure that can be placed in a thin electronic device.
  • the heat dissipation member according to an embodiment of the present disclosure may be applied to an electronic device having a thin thickness in which the printed circuit board and the cooling unit are arranged in different directions with respect to the heat dissipation member.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.
  • Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure.
  • FIG. 3 is a conceptual diagram illustrating an electronic device according to an embodiment of the present disclosure.
  • Figure 4 is a conceptual diagram showing a heat dissipation member according to an embodiment of the present disclosure.
  • 5A and 5B are diagrams showing an electronic device according to an embodiment of the present disclosure.
  • FIGS. 6A, 6B, and 6C are diagrams showing a housing, a printed circuit board, a heat dissipation member, and a cooling unit according to an embodiment of the present disclosure.
  • FIG. 7A and 7B are diagrams showing a heat dissipation member and a cooling unit according to an embodiment of the present disclosure.
  • FIGS. 8A, 8B, and 8C are diagrams showing a heat dissipation member disposed in an electronic device according to an embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network).
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 may include a main processor 121 (e.g., a central processing unit or processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 e.g., a central processing unit or processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Figure 2 is a perspective view of an electronic device 200 according to an embodiment of the present disclosure.
  • the electronic device 101 may include an electronic device 200 in the form of a laptop PC, as shown in FIG. 2.
  • the electronic device 200 may include a first housing 210 and a second housing 220 that can be folded to face each other.
  • the first housing 210 and the second housing 220 may be folded to face each other based on the folding axis of the electronic device 200 (eg, M-M axis shown in FIG. 2).
  • the electronic device 200 includes a keyboard 240 disposed in the first housing 210 and a display module 230 disposed in the second housing 220 (e.g., the display module 160 of FIG. 1). ) can be folded to face each other.
  • the first housing 210 and the second housing 220 are disposed on both sides about the folding axis (e.g., M-M axis shown in FIG. 2) of the electronic device 200, and are positioned on the folding axis. It may have an overall symmetrical shape.
  • the first housing 210 and the second housing 220 may have an asymmetric shape with respect to the folding axis of the electronic device 200.
  • the first housing 210 has a first surface 210A, a second surface 210B, and a space between the first surface 210A and the second surface 210B. It may include a surrounding side 210C.
  • the first surface 210A and the second surface 210B of the first housing 210 may be formed to be parallel.
  • the side 210C of the first housing 210 may be manufactured separately from the first side 210A of the first housing 210 and the second side 210B of the first housing 210, , It may be coupled to at least one of the first surface 210A of the first housing 210 and the second surface 210B of the first housing 210.
  • each segmented portion of the first surface 210A, the second surface 210B, and the side surface 210C of the first housing 210 can be bonded in various ways (e.g., bonded through adhesive, bonded through welding, can be connected by bolt connection).
  • the side 210C of the first housing 210 may be formed integrally with the first side 210A or the second side 210B of the first housing 210.
  • the second housing 220 may have the same configuration as the first housing 210.
  • various connector ports may be formed on the side surface 210C of the first housing 210.
  • the connector port may include a connector port (eg, a USB connector port) for transmitting and receiving power and/or data to and from an external electronic device.
  • a connector port eg, a USB connector port
  • the connector port may perform the function of transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., ear jack hole) for performing the function of transmitting and receiving audio signals. .
  • an opening (not shown) through which air inside the electronic device 300 can be discharged to the outside may be formed in the side surface 210C of the first housing 210.
  • the first housing 210 and the second housing 220 may be formed of various materials.
  • it may be formed of a metallic material and/or a non-metallic material.
  • the metallic material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium
  • the non-metallic material may include synthetic resin, ceramic, and/or engineering plastic.
  • first housing 210 and the second housing 220 may be manufactured in various ways.
  • first housing 210 and the second housing 220 may be formed by methods such as injection or die casting.
  • first housing 210 and the second housing 220 shown in FIG. 2 are merely examples and may be changed in various ways within the scope of those skilled in the art. You can.
  • FIG. 3 is a conceptual diagram illustrating an electronic device 300 according to an embodiment of the present disclosure.
  • the electronic device 300 may refer to the electronic device 200 shown in FIG. 2 or may include at least a portion of the electronic device 200.
  • the length direction of the electronic device 300 may refer to the x-axis direction
  • the height direction of the electronic device 300 may refer to the z-axis direction. there is.
  • the electronic device 300 includes a housing 310, a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, an electronic component 360, a fixing member 370, and /Or may include a keyboard 380.
  • the housing 310 may refer to the first housing 210 shown in FIG. 2 or may include at least a portion of the first housing 210 .
  • the keyboard 380 may refer to the keyboard 240 shown in FIG. 2 or may include at least a portion of the keyboard 240.
  • housing 310 may include a first side 310a and/or a second side 310b.
  • the second side 310b may be located on the opposite side of the first side 310a.
  • a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, an electronic component 360, and/or a fixing member ( 370) can be deployed.
  • the keyboard 380 may be placed on the first side 310a of the housing 310.
  • the keyboard 380 may be arranged in the positive z-axis direction with respect to the first surface 310a.
  • the keyboard 380 may include at least a portion of a thermally conductive material to dissipate heat generated from the heat dissipation member 330.
  • the keyboard 380 may include a base plate (not shown) made of aluminum to disperse heat generated from the heat dissipation member 330.
  • Other components included in the keyboard 380 eg, a rubber dome may have an insulating function and serve to reduce heat transfer inside the keyboard 380.
  • the housing 310 may include an inlet opening 311 at least in part.
  • an inlet opening 311 may be formed in the second surface 310b of the housing 310.
  • the inlet opening 311 extends in the longitudinal direction (e.g., x-axis direction) and width direction (e.g., directions perpendicular to the x-axis and z-axis) of the electronic device 300 on the second side 310b of the housing 310. It can be placed at intervals accordingly.
  • the heat dissipation member 330 may be formed to extend along the longitudinal direction (eg, x-axis direction) of the electronic device 300.
  • the heat dissipation member 330 may include a first area 331, a second area 332, and/or a connection area 333.
  • the first area 331 may be an area including the center of the heat dissipation member 330 in the x-axis direction.
  • the second area 332 may be located at one end and the other end of the first area 331, respectively.
  • a second area 332 is located spaced apart in the negative x-axis direction
  • a second area 332 is located spaced apart in the positive x-axis direction. The remaining second area 332 may be located.
  • connection area 333 may be an area that connects the first area 331 and the second area 332.
  • the heat dissipation member 330 may be bent and extended along the height direction (eg, z-axis direction) of the electronic device 300.
  • the heat dissipation member 330 extends from the second area 332 to the connection area 333 and may be at least partially bent in the z-axis direction.
  • the heat dissipation member 330 extends from the connection area 333 to the first area 331 and may be bent in the x-axis direction.
  • two second areas 332 may be arranged in symmetrical positions with respect to the first area 331 .
  • one second area 332 may be positioned at a distance from the first area 331 in the positive z-axis direction and the positive x-axis direction.
  • the remaining second area 332 may be positioned at a distance from the first area 331 in the positive z-axis direction and the negative x-axis direction.
  • the first area 331 may be located closer to the second surface 310b of the housing 310 than the second area 332. For example, based on the height direction (e.g., z-axis direction) of the electronic device 300, between the location where the second area 332 is located and the location where the second surface 310b of the housing 310 is located.
  • the first area 331 may be placed in .
  • connection area 333 may be connected to the first area 331 at one end and to the second area 332 at the other end. Since the first area 331 is located closer to the second surface 310b of the housing 310 than the second area 332, one end of the connection area 333 is closer to the housing ( It may be located closer to the second side 310b of 310).
  • the electronic component 360 may be disposed on one side of the printed circuit board 320.
  • the electronic component 360 may be disposed on the side of the printed circuit board 320 that faces the heat dissipation member 330 (eg, the side that faces the negative z-axis direction).
  • the electronic component 360 may be a component that generates heat during the operation of the electronic device 300.
  • the electronic component 360 may be a central processing unit that performs calculations when the electronic device 300 is operating.
  • the printed circuit board 320 and the electronic component 360 may be disposed in a position that overlaps the first region 331 of the heat dissipation member 330.
  • the printed circuit board 320 and the electronic component 360 may be located in the positive z-axis direction with respect to the first area 331 of the heat dissipation member 330.
  • the heat dissipation member 330 may receive heat generated from the electronic component 360.
  • the printed circuit board 320 and the electronic component 360 may be fixed to the first region 331 of the heat dissipation member 330 through a fixing member 370.
  • the fixing member 370 is disposed in the first area 331 of the heat dissipation member 330 to fix the positions of the printed circuit board 320 and the electronic component 360 with respect to the first area 331. can play a role.
  • the cooling unit 340 may be disposed in the second area 332 of the heat dissipation member 330.
  • the cooling unit 340 may be disposed on the side of the second area 332 of the heat dissipation member 330 facing the negative z-axis direction.
  • the printed circuit board 320 and the cooling unit 340 may be located in opposite directions with respect to the heat dissipation member 330.
  • the printed circuit board 320 may be located in the positive z-axis direction with respect to the heat dissipation member 330
  • the cooling unit 340 may be located in the negative z-axis direction with respect to the heat dissipation member 330. can be located
  • the cooling unit 340 may include at least a portion of the cooling unit opening 341 through which external air (IN-AIR) can be introduced.
  • the cooling unit 340 is shown as including one cooling unit opening 341, but this is an example and the cooling unit 340 may include a plurality of cooling unit openings 341.
  • the cooling unit opening 341 of the cooling unit 340 and the inlet opening 311 of the housing 310 may be formed in the same direction with respect to the heat dissipation member 330.
  • the cooling unit opening 341 is located in a direction (e.g., negative z-axis direction) toward the second surface 310b of the housing 310 based on the second area 332 of the heat dissipation member 330.
  • An inlet opening 311 may be located.
  • external air may be introduced into the electronic device 300 through the inlet opening 311 formed on the second surface 310b of the housing 310.
  • External air (IN-AIR) introduced into the electronic device 300 may be introduced into the cooling unit 340 through the cooling unit opening 341 of the cooling unit 340.
  • the cooling unit opening 341 of the cooling unit 340 and the inlet opening 311 of the housing 310 may be arranged to be spaced apart in the height direction (e.g., z-axis direction) of the electronic device 300. You can.
  • the cooling unit opening 341 of the cooling unit 340 may be positioned at a distance from the inlet opening 311 of the housing 310 in the positive z-axis direction. Since the cooling unit opening 341 and the inlet opening 311 are positioned spaced apart in the height direction (e.g., z-axis direction) of the electronic device 300, external air (IN-AIR) cools through the inlet opening 311. It may be easy to flow into the secondary opening 341.
  • IN-AIR external air
  • the cooling unit 340 may include a thermoelectric device and/or a cooling fan.
  • the cooling device included in the cooling unit 340 may produce relatively small noise generated from the device itself compared to other cooling devices.
  • the cooling device included in the cooling unit 340 discharges external air (IN-AIR) introduced into the electronic device 300 through the inlet opening 311 to the outside of the electronic device 300 to cool the heat radiation member 330 and the heat dissipation member 330.
  • the electronic device 300 can be cooled.
  • the cooling unit 340 may include a thermoelectric device.
  • the thermoelectric device can cool the electronic device 300 by absorbing heat energy emitted as electrons move on one side and emitting it on the other side.
  • a thermoelectric device may produce relatively smaller noise compared to other cooling devices (e.g., cooling fans).
  • the cooling unit 340 may include a cooling fan.
  • the cooling fan included in the cooling unit 340 may be compact so that it can be placed in the electronic device 300 having a thin thickness.
  • the cooling unit 340 may include a thermoelectric element device and/or a cooling fan, this is an example, and the cooling device included in the cooling unit 340 may not be limited thereto.
  • Figure 4 is a conceptual diagram showing a heat dissipation member 330 according to an embodiment of the present disclosure.
  • the longitudinal direction of the heat dissipation member 330 refers to the direction in which the heat dissipation member 330 is formed to be relatively long
  • the width direction of the heat dissipation member 330 may refer to the direction in which the heat dissipation member 330 is formed to be relatively short.
  • the heat dissipation member 330 may include a first area 331, a second area 332, and/or a connection area 333.
  • the second area 332 may be located at one end and the other end of the first area 331 .
  • the connection area 333 may be an area that connects the first area 331 and the second area 332.
  • the electronic component 360 may be located in one direction of the first area 331. Heat generated from the electronic component 360 may be transferred to the first region 331 of the heat dissipation member 330. Heat generated from the electronic component 360 may be transferred to the second area 332 through the first area 331 and the connection area 333.
  • the cooling unit 340 may be disposed on the heat dissipation member 330.
  • two cooling units 340 may be disposed in each of the two second areas 332 included in the heat dissipation member 330.
  • cooling units 340 are shown as being disposed in the second area 332 of the heat dissipation member 330, however, this is an example, and the number and arrangement of the cooling units 340 are not limited thereto. It may not be possible. For example, only one cooling unit 340 may be disposed in one of the two second areas 332 .
  • the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330.
  • the cooling unit 340 may be in contact with the second region 332 of the heat dissipation member 330 to cool the heat of the heat dissipation member 330.
  • one surface of the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330.
  • the entire surface of the cooling unit 340 may be in contact with the second area 332 to cool the heat of the heat dissipation member 330.
  • the area where the cooling unit 340 is in contact with the second area 332 of the heat dissipation member 330 may be substantially equal to the area of one surface of the second area 332.
  • the area of the surface of the second area 332 facing the cooling unit 340 may be substantially equal to the area of the surface of the cooling unit 340 in contact with the second area 332.
  • the cooling unit 340 may include a cooling unit opening 341.
  • the cooling unit 340 may include a plurality of cooling unit openings 341 through which external air (IN-AIR) can flow.
  • a plurality of cooling unit openings 341 may be arranged on one side of the cooling unit 340 at predetermined intervals from each other.
  • external air may be introduced into the cooling unit 340 through the opening 341 of the cooling unit 340.
  • External air may serve to cool the heat of the heat dissipation member 330.
  • the cooling unit 340 supplies exhaust air (OUT-AIR) to the outside of the cooling unit 340 through a cooling device (e.g., a thermoelectric device, a cooling fan, and/or a piezo device) included therein. can be discharged.
  • a cooling device e.g., a thermoelectric device, a cooling fan, and/or a piezo device
  • the cooling unit 340 may discharge exhaust air (OUT-AIR) in a direction toward the side (210c, see FIG. 5b) of the housing 310 (see FIG. 5b).
  • Exhaust air (OUT-AIR) may be air that receives heat from the heat dissipation member 330 and has a higher temperature than external air (IN-AIR).
  • FIGS. 5A and 5B are diagrams showing an electronic device 300 according to an embodiment of the present disclosure.
  • FIG. 5A is an exploded perspective view of an electronic device 300 according to an embodiment of the present disclosure.
  • FIG. 5B is a perspective view of an electronic device 300 according to an embodiment of the present disclosure.
  • FIG. 5B is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, the cooling unit 340, and/or the fixing member 370 are disposed inside the housing 310.
  • a portion of the housing 310 is shown in a transparent state, but this is an example to show the components disposed inside the housing 310, and the shape of the housing 310 may not be limited thereto. there is.
  • the electronic device 300 includes a housing 310, a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, and a bracket 350. ), electronic components 360, and/or fixing members 370.
  • the first direction may refer to the negative z-axis direction
  • the second direction may refer to the positive z-axis direction
  • housing 310 may include a first side 310a and/or a second side 310b.
  • the first surface 310a may be located in a second direction based on the second surface 310b.
  • the first side 310a of the housing 310 and the second side 310b of the housing 310 may include a plate shape extending along the longitudinal and width directions of the electronic device 300. there is.
  • a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, a bracket 350, and an electronic device are provided between the first side 310a and the second side 310b of the housing 310.
  • Component 360 and/or fixation member 370 may be disposed.
  • a printed circuit board 320 may be disposed on the first side 310a of the housing 310.
  • the printed circuit board 320 may be disposed in a first direction (eg, negative z-axis direction) with respect to the first surface 310a of the housing 310.
  • the electronic component 360 may be disposed on one side of the printed circuit board 320.
  • the electronic component 360 may be disposed on a side of the printed circuit board 320 that faces the first direction.
  • a plurality of printed circuit boards 320 may be disposed on the first surface 310a of the housing 310.
  • An installation space 320a in which the printed circuit board 320 is not disposed may be formed between the plurality of printed circuit boards 320 .
  • the installation space 320a is formed in one printed circuit board 320 even in an area where the printed circuit board 320 is not disposed (e.g., a groove or opening formed inside the printed circuit board 320). It could be.
  • the bracket 350 may include a shape that surrounds at least a portion of the heat dissipation member 330.
  • the bracket 350 may have a shape surrounding the second area 332 (see FIG. 4) of the heat dissipation member 330.
  • the second region 332 (see FIG. 4) of the heat dissipation member 330 may be placed on the bracket 350 and then fixed, thereby fixing the position of the heat dissipation member 330.
  • the bracket 350 is a rectangle extending in the length direction (e.g., x-axis direction) and width direction (e.g., y-axis direction) of the electronic device 300 so that the heat dissipation member 330 can be disposed. Although it is shown as including a cross-section, this is an example, and the shape included in the bracket 350 may not be limited to this.
  • the bracket 350 may include various shapes so that at least a portion of the heat dissipation member 330 can be disposed. For example, when a part of the heat dissipation member 330 has a polygonal shape rather than a square, the bracket 350 has a square shape corresponding to a part of the heat dissipation member 330 so that the part of the heat dissipation member 330 can be placed. It may also contain non-polygonal shapes.
  • the bracket 350 may be located on the opposite side of the cooling unit 340 with respect to the heat dissipation member 330. For example, based on the heat dissipation member 330, the bracket 350 may be disposed in a direction toward the first surface 310a of the housing 310, and the cooling unit 340 may be disposed on the first surface 310a of the housing 310. It can be placed in a direction facing the second surface 310b.
  • the bracket 350 may serve to fix the positions of the heat dissipation member 330 and the cooling unit 340. Additionally, the bracket 350 may serve to fix the position of the heat dissipation member 330 so that it is spaced apart from the first surface 310a of the housing 310.
  • the heat dissipation member 330 when the electronic device 300 includes the bracket 350 and the heat dissipation member 330 is disposed to be spaced apart from the first surface 310a of the housing 310, the heat of the heat dissipation member 330 Direct transmission to the first surface 310a of this housing 310 can be prevented. Since the heat of the heat dissipation member 330 is prevented from being directly transferred to the first surface 310a of the housing 310, the user of the electronic device 300 can use the keyboard placed on the first surface 310a of the housing 310. (380, see FIG. 3) may be easy to use.
  • the bracket 350 may be disposed in the installation space 320a formed between a plurality of printed circuit boards 320 and/or in the installation space 320a formed inside one printed circuit board 320. You can.
  • At least a portion of the heat dissipation member 330 may be disposed on the bracket 350 and at least a portion may be disposed on the printed circuit board 320 .
  • a portion of the heat dissipation member 330 e.g., one end and the other end of the heat dissipation member 330
  • a portion of the heat dissipation member 330 may be disposed in a first direction (eg, negative z-axis direction) with respect to the printed circuit board 320 .
  • a portion of the heat dissipation member 330 may be disposed in the first direction at a position overlapping the printed circuit board 320 and the electronic component 360 disposed on the printed circuit board 320.
  • the heat dissipation member 330 may receive heat generated from the printed circuit board 320 and the electronic component 360.
  • the fixing member 370 may be disposed on the heat dissipation member 330.
  • the fixing member 370 may be disposed in a second direction (eg, positive z-axis direction) with respect to the heat dissipation member 330 .
  • the fixing member 370 may be disposed in a first direction with respect to the electronic component 360 disposed on the printed circuit board 320.
  • the fixing member 370 is in contact with the electronic component 360 and can fix the positions of the electronic component 360 and the printed circuit board 320 with respect to the heat dissipation member 330.
  • the cooling unit 340 may be disposed in a first direction with respect to the heat dissipation member 330.
  • the heat dissipation member 330 may be in contact with the cooling unit 340 at least partially.
  • the heat dissipation member 330 has one end (e.g., a distal end facing the negative x-axis direction in the heat dissipation member 330) and the other end (e.g., a positive x-axis direction in the heat dissipation member 330).
  • the distal end facing the x-axis direction may be in contact with the cooling unit 340.
  • the cooling unit 340 may serve to cool the heat of the heat dissipation member 330.
  • the second surface 310b of the housing 310 may be located in a first direction with respect to the heat dissipation member 330 and the cooling unit 340.
  • the second surface 310b of the housing 310 may be formed in a shape corresponding to the first surface 310b of the housing 310.
  • the first side 310a and the second side 310b of the housing 310 are aligned along the length direction (e.g., x-axis direction) and width direction (e.g., y-axis direction) of the electronic device 300. It may extend by substantially the same length.
  • the second surface 310b of the housing 310 may be coupled at least in part to the first surface 310b of the housing 310.
  • the second side 310b of the housing 310 may include an inlet opening 311.
  • External air IN-AIR
  • I-AIR External air
  • the housing 310 may include a side surface 310c surrounding the space between the first surface 310a and the second surface 310b.
  • the side 310c of the housing 310 may include a discharge opening 312 at least in part.
  • the side 310c of the housing 310 where the discharge opening 312 is disposed may be a side 310c located relatively close to the cooling unit 340 among the side surfaces 310c of the housing 310.
  • the discharge opening 312 may be formed on the side 310c of the housing 310 facing the positive y-axis direction with respect to the electronic device 300.
  • the exhaust air (OUT-AIR) discharged from the cooling unit 340 may be discharged to the outside of the electronic device 300 through the exhaust opening 312 formed on the side 310c of the housing 310. .
  • FIGS. 6A, 6B, and 6C are diagrams showing the housing 310, the printed circuit board 320, the heat dissipation member 330, and the cooling unit 340 according to an embodiment of the present disclosure.
  • FIG. 6A is a diagram showing the printed circuit board 320 disposed in the housing 310.
  • FIG. 6B is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, and/or the bracket 350 are disposed in the housing 310.
  • FIG. 6C is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, the bracket 350, and/or the cooling unit 340 are disposed in the housing 310.
  • the housing 310 shown in FIGS. 6A, 6B, and 6C may refer to the first side 310a of the housing 310 shown in FIGS. 5A and 5B.
  • the printed circuit board 320 may be placed on one side of the housing 310 .
  • Figure 6a shows two printed circuit boards 320 disposed on one side of the housing 310, but this is an example and the number of printed circuit boards 320 disposed on the housing 310 is not limited to this. You can.
  • two or more printed circuit boards 320 may be placed in the housing 310, or one printed circuit board 320 may be placed in the housing 310.
  • an installation space 320a may be formed in an area where the printed circuit board 320 is not disposed.
  • the printed circuit board 320 is not disposed to cover the entire one side of the housing 310, but is disposed to cover only a portion of one side of the housing 310, so an area in which the printed circuit board 320 is not disposed.
  • An installation space 320a may be formed.
  • the installation space 320a may be a space where the bracket 350 and a portion of the heat dissipation member 330 are disposed.
  • the bracket 350 may be placed in the installation space 320a.
  • the bracket 350 is disposed in the installation space 320a and at least a portion of it may be fixed to the housing 310.
  • the heat dissipation member 330 may be formed to extend in the length direction (e.g., x-axis direction) and the width direction (e.g., y-axis direction) of the electronic device 300.
  • the heat dissipation member 330 may extend in the longitudinal and width directions of the electronic device 300 so that at least a portion of the heat dissipation member 330 overlaps the electronic component 360 .
  • the heat dissipation member 330 may extend toward the installation space 320a around the position where the electronic component 360 is disposed.
  • the heat dissipation member 330 may be formed to extend in the negative x-axis direction and the positive x-axis direction toward the installation space 320a based on the x-axis direction position where the electronic component 360 is disposed. .
  • a portion of the heat dissipation member 330 may be disposed on the bracket 350.
  • a portion of the heat dissipation member 330 may be placed on the bracket 350 and the position of the entire heat dissipation member 330 may be fixed.
  • a portion of the heat dissipation member 330 may be disposed at a position overlapping the printed circuit board 320 .
  • a portion of the heat dissipation member 330 may be disposed in a position overlapping with the printed circuit board 320 and the electronic component 360 disposed on the printed circuit board 320.
  • a fixing member 370 may be disposed on at least a portion of the heat dissipation member 330.
  • the fixing member 370 may be disposed on the side of the heat dissipation member 330 that faces the printed circuit board 320.
  • the fixing member 370 may be disposed at a position overlapping the electronic component 360 .
  • the fixing member 370 may be in contact with the electronic component 360.
  • the fixing member 370 may serve to fix the relative positions of the electronic component 360 and the heat dissipation member 330.
  • the electronic component 360 and the heat dissipation member 330 are disposed with the fixing member 370 therebetween, and their relative positions may be fixed.
  • the position of the electronic component 360 is fixed through the fixing member 370, and heat generated from the electronic component 360 can be more easily transferred to the heat dissipation member 330.
  • the cooling unit 340 may be disposed in a portion of the heat dissipation member 330 (e.g., the second area 332 (see FIG. 4 )).
  • the cooling unit 340 may be disposed on a portion of the heat dissipation member 330 disposed on the bracket 350.
  • the cooling unit 340 may be disposed on the opposite side of the heat dissipation member 330 from the side on which the bracket 350 is disposed.
  • the cooling unit 340 may include a cooling unit opening 341 at least in part. External air (IN-AIR, see FIG. 4) may flow into the cooling unit 340 through the cooling unit opening 341.
  • a plurality of cooling unit openings 341 may be arranged at intervals in the length direction (eg, x-axis direction) and width direction (eg, y-axis direction) of the electronic device 300.
  • FIGS. 7A and 7B are diagrams showing a heat dissipation member 330 and a cooling unit 340 according to an embodiment of the present disclosure.
  • FIG. 7A is a diagram illustrating the heat dissipation member 330 viewed from a direction perpendicular to the longitudinal direction (e.g., x-axis direction) and the width direction (e.g., y-axis direction) of the electronic device 300.
  • FIG. 7B is a diagram illustrating the heat dissipation member 330 viewed from a direction perpendicular to the longitudinal direction (e.g., x-axis direction) and the height direction (e.g., z-axis direction) of the electronic device 300.
  • the heat dissipation member 330 may be formed to extend in the longitudinal and width directions of the electronic device 300.
  • the heat dissipation member 330 may include a plate shape having a predetermined thickness in the height direction of the electronic device 300.
  • the heat dissipation member 330 may include a first area 331, a second area 332, and/or a connection area 333.
  • the first area 331 may be an area where the fixing member 370 is disposed.
  • the second area 332 may be an area where the cooling unit 340 is disposed.
  • the heat dissipation member 330 may include a coupling region 3321 at least in part.
  • the coupling area 3321 may be an area where the heat dissipation member 330 and the bracket 350 (see FIG. 5A) are coupled to each other.
  • the heat dissipation member 330 may include a plurality of coupling regions 3321.
  • a plurality of coupling regions 3321 may be formed in the second region 332 of the heat dissipation member 330 where the cooling unit 340 is disposed.
  • the heat dissipation member 330 is shown as including eight coupling regions 3321. However, this is an example, and the number of coupling regions 3321 included in the heat dissipation member 330 is not limited to this. It may not be possible.
  • the two second regions 332 may be arranged in a symmetrical manner with respect to the first region 331.
  • two second areas 332 may be arranged symmetrically in the positive x-axis direction and the negative x-axis direction.
  • the two second areas 332 are shown as arranged symmetrically with respect to the first area 331.
  • the two second areas 332 may be arranged in an asymmetric form. You can.
  • the second area 332 located in the positive x-axis direction with respect to the first area 331 is connected to the second area 332 located in the negative x-axis direction with respect to the first area 331.
  • the electronic device 300 may be formed longer or shorter in the longitudinal direction (eg, x-direction).
  • one electronic component 360 is located at the center of the first region 331 of the heat dissipation member 330 (e.g., the center in the x-axis direction with respect to the first region 331). ), but this is an example, and the number and arrangement of the electronic components 360 may not be limited thereto.
  • a plurality of electronic components 360 may be disposed on the printed circuit board 320 to transfer heat to the heat dissipation member 330.
  • the shape of the heat dissipation member 330 may vary depending on the number and/or arrangement of the electronic components 360 (see FIG. 5A).
  • the two second regions 332 may be arranged asymmetrically with respect to the first region 331.
  • the first region 331 e.g., the end of the first region 331 in the positive x-axis direction
  • the first The second area 332 is connected to one end of the area 331
  • the cooling unit 340 disposed in the second area 332 is connected to the second area 332 and the other end of the first area 331.
  • the electronic device 300 may be formed to be longer in the longitudinal direction (e.g., x-axis direction) and width direction (e.g., y-axis direction).
  • the first area 331 and the second area 332 may be arranged to be spaced apart in the height direction (eg, z-axis direction) of the electronic device 300.
  • the second area 332 may be located at a distance from the first area 331 in the positive z-axis direction.
  • connection area 333 may be an area that connects the first area 331 and the second area 332.
  • connection area 333 may be connected to the first area 331 at one end and to the second area 332 at the other end.
  • the fixing member 370 and the cooling unit 340 may be disposed on opposite sides of the heat dissipation member 330 .
  • the fixing member 370 may be disposed in the positive z-axis direction with respect to the heat dissipation member 330
  • the cooling unit 340 may be disposed in the negative z-axis direction with respect to the heat dissipation member 330. there is.
  • one surface of the cooling unit 340 is aligned with one surface of the first region 331 of the heat dissipation member 330 and the height direction (e.g., z-axis direction) of the electronic device 300. It can be placed in the same position as a reference.
  • the first area 331 of the heat dissipation member 330 is disposed at a position spaced apart from the second area 332 in the negative z-axis direction, and the cooling unit disposed in the second area 332 (
  • the thickness of 340 e.g., the length of the cooling unit 340 in the z-axis direction
  • the cooling unit 340 is disposed in the second area 332, and the side of the cooling unit 340 facing the negative z-axis direction and the side of the first area 331 facing the negative z-axis direction are z.
  • the axial positions may be arranged substantially on the same plane.
  • One surface of the cooling unit 340 and one surface of the first area 331 are disposed on substantially the same plane, so that the heat dissipation member 330 and the cooling unit 340 are disposed inside the electronic device 300 having a thin thickness. It can be easy.
  • connection area 333 may extend along a direction inclined by the connection inclination angle AG1 with respect to the first area 331 and the second area 332 .
  • the connection area 333 is formed by extending in a direction inclined by the connection inclination angle AG1 toward the positive z-axis direction based on the direction in which the first area 331 extends (e.g., x-axis direction). It can be.
  • the connection area 333 may be formed to extend in a direction inclined by the connection inclination angle AG1 toward the negative z-axis direction based on the direction in which the second area 332 extends (e.g., x-axis direction). .
  • connection inclination angle AG1 may be formed within a predetermined angle range.
  • the connection inclination angle AG1 may be formed within a range of approximately 7 degrees to 15 degrees. Since the connection inclination angle AG1 is formed within a predetermined angle range, it may be advantageous for the heat dissipation member 330 to be placed in an electronic device having a thin thickness (eg, a slim laptop).
  • connection area 333 is shown to extend in a straight line along a direction inclined by the connection inclination angle AG1 with respect to the first area 331 and the second area 332, but this is an example.
  • the form in which the connection area 333 extends may not be limited to this.
  • the connection area 333 may not extend in a straight line between the first area 331 and the second area 332, but may extend including a curve at least in part.
  • the connection area 333 may include a curved surface with a predetermined radius of curvature, or may include a shape that is curved at least in part.
  • the thickness t of the heat dissipation member 330 may be formed within a predetermined length range.
  • the thickness t of the heat dissipation member 330 may be approximately 0.7 mm to 1.2 mm.
  • the thickness (t) of the heat dissipation member 330 may refer to the length over which the heat dissipation member 330 extends in the height direction (eg, z-axis direction) of the electronic device 300.
  • the thickness t of the first region 331, the second region 332, and the extended region 333 of the heat dissipation member 330 may be formed to have substantially the same length.
  • the thickness (t) of the first region 331, the second region 332, and the extended region 333 may all have substantially the same value within the range of approximately 0.7 mm to 1.2 mm.
  • the thickness of the extended area 333 may be different from the thickness of the remaining areas excluding the extended area 333.
  • the thickness t of the extended region 333 may be formed to have a length different from the thickness t of the first region 331 and the second region 332 .
  • the thickness t of the extended region 333 may be longer or shorter than the thickness t of the first region 331 and the second region 332 .
  • FIGS. 8A, 8B, and 8C are diagrams showing a heat dissipation member 330 disposed in the electronic device 300 according to an embodiment of the present disclosure.
  • FIG. 8A is a diagram showing cross-section lines A-A' and cross-section lines B-B' in the electronic device 300.
  • FIG. 8B is a diagram showing the electronic device 300 viewed along the cross-sectional line A-A' shown in FIG. 8A.
  • FIG. 8B is a cross-sectional view of the electronic device 300 of FIG. 8A by cutting it along the A-A' cross-section line parallel to the longitudinal direction (e.g., x-axis direction) of the electronic device 300. It can be.
  • FIG. 8C is a diagram showing the electronic device 300 viewed along the section line B-B' shown in FIG. 8A.
  • FIG. 8C is a cross-sectional view of the electronic device 300 of FIG. 8A by cutting it along the B-B' cross-section line parallel to the width direction (e.g., y-axis direction) of the electronic device 300. It can be.
  • the electronic device 300 may include a housing 310 and/or a keyboard 380.
  • the keyboard 380 may be placed on the first side 310a of the housing 310.
  • the housing 310 may include a first side 310a and/or a second side 310b.
  • the second surface 310b may be positioned at a distance from the first surface 310a in the height direction (eg, z-axis direction) of the electronic device 300.
  • a heat dissipation member 330, a cooling unit 340, a printed circuit board 320, and/or Electronic components 360 may be disposed.
  • the printed circuit board 320, the heat dissipation member 330, the cooling unit 340, and/or the electronic component 360 are located in the positive z-axis direction based on the second side 310b of the housing 310. This can be placed.
  • the printed circuit board 320 and the cooling unit 340 may be located in different directions with respect to the heat dissipation member 330.
  • the printed circuit board 320 may be located in the positive z-axis direction
  • the cooling unit 340 may be located in the negative z-axis direction.
  • the printed circuit board 320 and the cooling unit 340 may be disposed in different areas of the heat dissipation member 330.
  • the printed circuit board 320 may be disposed in a position overlapping the first area 331 of the heat dissipation member 330.
  • the cooling unit 340 may be disposed in a position overlapping the second area 332 of the heat dissipation member 330.
  • the longitudinal end of the electronic device 300 may mean an end of the electronic device 300 that faces the longitudinal direction of the electronic device 300.
  • the longitudinal end of the electronic device 300 may mean an end of the electronic device 300 that faces the positive x-axis direction or the negative x-axis direction with respect to the electronic device 300.
  • the end of the electronic device 300 in the width direction may refer to the end of the electronic device 300 facing the width direction of the electronic device 300.
  • the end of the electronic device 300 in the width direction may mean an end of the electronic device 300 that faces the positive y-axis direction or the negative y-axis direction with respect to the electronic device 300.
  • the heat dissipation member 330 may be disposed at a distance from the longitudinal end of the electronic device 300.
  • the heat dissipation member 330 may be disposed at a distance in the negative x-axis direction from the end facing the positive x-axis direction in the electronic device 300.
  • the heat dissipation member 330 may be disposed at a distance from the end of the electronic device 300 in the width direction.
  • the heat dissipation member 330 may be disposed at a distance in the negative y-axis direction from the end facing the positive y-axis direction in the electronic device 300.
  • internal components of the electronic device 300 excluding the heat dissipation member 330 may be disposed between the heat dissipation member 330 and the end of the electronic device 300.
  • the longitudinal direction e.g., x-axis direction
  • One or more printed circuit boards 320 may be placed.
  • the electronic device 300 may include a housing 310, a printed circuit board 320, a heat dissipation member 330, and/or a cooling unit 340.
  • the housing 310 has a first surface 310a on which the keyboard 380 is disposed, is located on the opposite side of the first surface 310a, and has an inlet opening through which external air (IN-AIR) flows in. It may include a second side 310b including 311).
  • At least one electronic component 360 may be disposed on the printed circuit board 320 .
  • the heat dissipation member 330 is disposed between the first surface 310a and the second surface 310b and may extend along the longitudinal direction of the housing 310.
  • the heat dissipation member 330 may receive heat generated from the electronic component 360.
  • the cooling unit 340 may cool the heat dissipation member 330 by allowing external air (IN-AIR) to flow into the cooling unit 340.
  • IN-AIR external air
  • the heat dissipation member 330 includes a first area 331 where the printed circuit board is placed, two second areas 332 where the cooling unit 340 is placed, and a first area 331 and a second area 332 where the cooling unit 340 is placed. It may include a connection area 333 connecting the two areas 332.
  • the second area 332 may be positioned at a distance from one end and the other end of the first area 331 in the length and height directions of the electronic device 300 .
  • the printed circuit board 320 and the cooling unit 340 may be located on opposite sides of the heat dissipation member 330.
  • the housing 310 may include a side 310c that surrounds the space between the first side 310a and the second side 310b and includes a discharge opening 312.
  • outside air flows into the electronic device 300 through the inlet opening 311 of the second side 310b and enters the electronic device 300 through the outlet opening 312 of the side 310c. (300) Can be discharged to the outside.
  • connection area 333 may be formed to extend along a direction inclined by the connection inclination angle AG1 based on the direction in which the first area 331 extends.
  • connection inclination angle AG1 may range from 7 degrees to 15 degrees.
  • the heat dissipation member 330 may be formed such that the first region 331 and the second region 332 have the same thickness.
  • the electronic device 300 is disposed on the first surface 310a of the housing 310 and may include a bracket 350 that secures the heat dissipation member 330 to the electronic device 300. .
  • the second area 332 of the heat dissipation member 330 may be placed and fixed to the bracket 350.
  • the electronic device 300 may include a plurality of printed circuit boards 320 .
  • the bracket 350 may be disposed in the installation space 320a formed between the plurality of printed circuit boards 320.
  • the position of the heat dissipation member 330 is fixed by the bracket 350 and may be arranged to be spaced apart from the first surface 310a of the housing 310.
  • the cooling unit 340 may include a cooling unit opening 341 through which external air (IN-AIR) flows.
  • IN-AIR external air
  • the inlet opening 311 of the second surface 310b of the housing 310 and the cooling unit opening 341 of the cooling unit 340 are positioned spaced apart in the height direction of the electronic device 300. You can.
  • the first area 331 of the heat dissipation member 330 may be located closer to the second surface 310b of the housing 310 than the second area 332.
  • At least a portion of one surface of the first area 331 and one surface of the cooling unit 340 may be disposed at the same position based on the height direction of the electronic device 300.
  • the electronic component 360 may be disposed in a position that overlaps at least a portion of the first area 331 of the heat dissipation member 330.
  • the electronic device 300 may include a fixing member 370 disposed in the first area 331 of the heat dissipation member 330.
  • the fixing member 370 may fix the electronic component 360 so that its position does not change with respect to the first area 331 of the heat dissipation member 330.
  • the cooling unit 340 may allow external air (IN-AIR) to flow into the electronic device 300 through the inlet opening 311.
  • IN-AIR external air
  • the cooling unit 340 may discharge external air (IN-AIR) to the outside of the electronic device 300 through the discharge opening 312 on the side 310c.
  • I-AIR external air
  • the cooling unit 340 and one entire surface of the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330.
  • the heat dissipation member 330 is formed in the second region 332 of the heat dissipation member 330 and may include a coupling region 3321 where the heat dissipation member 330 and the bracket 350 are coupled to each other. You can.
  • the printed circuit board heat dissipation structure includes a printed circuit board 320 on which at least one electronic component 360 is disposed, a heat dissipation member 330 that receives heat generated from the electronic component 360, and/or It may include a cooling unit 340 that cools the heat dissipation member 330.
  • the heat dissipation member 330 of the printed circuit board heat dissipation structure includes a first area 331 where the printed circuit board 320 is disposed, and a printed circuit board heat dissipation structure at one end and the other end of the first area 331. are positioned at a distance from each other in the longitudinal and height directions, two second areas 332 where the cooling unit 340 is disposed, and a connection area 333 connecting the first area 331 and the second area 332. ) may include.
  • the printed circuit board 320 and the cooling unit 340 may be located on opposite sides of the heat dissipation member 330.
  • An electronic device may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment of the present disclosure is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • the method according to an embodiment of the present disclosure may be included and provided in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components.
  • one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un dispositif électronique, selon un mode de réalisation de la présente divulgation, peut comprendre : un boîtier comprenant un premier côté sur lequel un clavier est placé, et un second côté comprenant une ouverture d'entrée à travers laquelle de l'air externe est introduit ; une carte de circuit imprimé sur laquelle des composants électroniques sont disposés ; un élément de dissipation de chaleur disposé entre le premier côté et le second côté ; et une unité de refroidissement pour refroidir l'élément de dissipation de chaleur, l'élément de dissipation de chaleur pouvant comprendre : une première zone dans laquelle la carte de circuit imprimé est disposée ; deux secondes zones qui sont positionnées à une certaine distance d'une extrémité et de l'autre extrémité de la première zone dans les sens longitudinal et vertical du dispositif électronique, et dans laquelle l'unité de refroidissement est disposée ; et une zone de connexion qui relie la première zone et les secondes zones, et la carte de circuit imprimé et l'unité de refroidissement peuvent être situées sur des côtés opposés de l'élément de dissipation de chaleur.
PCT/KR2023/012889 2022-09-14 2023-08-30 Dispositif électronique comprenant un élément de dissipation de chaleur WO2024058469A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0115561 2022-09-14
KR20220115561 2022-09-14
KR10-2022-0131461 2022-10-13
KR1020220131461A KR20240037119A (ko) 2022-09-14 2022-10-13 방열 부재를 포함하는 전자 장치

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002123336A (ja) * 2000-10-12 2002-04-26 Nec Corp 情報処理装置
JP4167700B2 (ja) * 2006-05-31 2008-10-15 株式会社東芝 電子機器
US20110080710A1 (en) * 2009-10-02 2011-04-07 Kabushiki Kaisha Toshiba Electronic apparatus
JP5113363B2 (ja) * 2006-09-28 2013-01-09 富士通株式会社 電子機器
JP2021052090A (ja) * 2019-09-25 2021-04-01 レノボ・シンガポール・プライベート・リミテッド 電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002123336A (ja) * 2000-10-12 2002-04-26 Nec Corp 情報処理装置
JP4167700B2 (ja) * 2006-05-31 2008-10-15 株式会社東芝 電子機器
JP5113363B2 (ja) * 2006-09-28 2013-01-09 富士通株式会社 電子機器
US20110080710A1 (en) * 2009-10-02 2011-04-07 Kabushiki Kaisha Toshiba Electronic apparatus
JP2021052090A (ja) * 2019-09-25 2021-04-01 レノボ・シンガポール・プライベート・リミテッド 電子機器

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