WO2024056127A1 - Manutention de pièces, en particulier de tranches - Google Patents

Manutention de pièces, en particulier de tranches Download PDF

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Publication number
WO2024056127A1
WO2024056127A1 PCT/DE2023/100657 DE2023100657W WO2024056127A1 WO 2024056127 A1 WO2024056127 A1 WO 2024056127A1 DE 2023100657 W DE2023100657 W DE 2023100657W WO 2024056127 A1 WO2024056127 A1 WO 2024056127A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
effector
workpiece
workpieces
receptacle
Prior art date
Application number
PCT/DE2023/100657
Other languages
German (de)
English (en)
Inventor
Florian Schäffner
Armin Silcher
Herbert Wituschek
Original Assignee
Mafu Robotics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mafu Robotics GmbH filed Critical Mafu Robotics GmbH
Publication of WO2024056127A1 publication Critical patent/WO2024056127A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
    • H02K2201/18—Machines moving with multiple degrees of freedom

Definitions

  • the invention relates to systems for treating workpieces, in particular wafers, carriers for such a system for treating workpieces and methods for transferring a workpiece to or from such a carrier.
  • a system for treating substrates for photovoltaic thin-film cells is known, which are processed in a treatment room with a controlled atmosphere.
  • the treatment room is enclosed gas-tight.
  • the system contains a conveyor system with rotating shafts that convey the thin-film cells by rotating inside the treatment room.
  • the drive i.e. the rotational movement of the shafts, is transmitted contactlessly via coupling elements from a shaft located outside the treatment room to the shafts inside the treatment room.
  • This system proves to be functional, but shows weaknesses in operational safety and damage to the thin-film cells due to the generation of abrasion by the rotating shafts for transport.
  • a system for treating workpieces according to the preamble is known.
  • This shows a housing with a shell which delimits a treatment room and which separates the controlled atmosphere of the treatment room from the atmosphere present outside the shell.
  • the system for treating workpieces has a conveyor system through which workpieces can be conveyed in a treatment room, as well as at least one coupling means that is coupled to at least one coupling unit of the conveyor system.
  • the coupling means and the coupling units are coupled to one another without contact through the gas-tight casing.
  • the coupling means are designed as electromagnetic stators outside the gas-tight envelope.
  • the conveyor system has at least one carrier, which has at least one permanent magnet as a coupling unit, and through which Workpieces can be conveyed in the treatment room. Due to the interaction of the coupling means and the coupling units, the carrier can be kept in suspension without contact with the casing and can be conveyed into the treatment room.
  • the workpieces to be processed are placed on the carrier using additional robots in the lock, so that they can be introduced from the carrier via the lock into the treatment room and conveyed there. This arrangement proves to be complex and complicated to handle.
  • the invention is based on the object of specifying a system for treating workpieces that is improved compared to the prior art, or a carrier for such a system, or a method for transferring a workpiece to or from such a carrier. This should be characterized by easy handling and little effort. In addition, the goal is to enable special operational reliability and a high level of product safety.
  • the object is achieved according to the invention with a system for treating workpieces which has the features specified in claim 10.
  • This object is further achieved according to the invention with a carrier for a system for treating workpieces, which has the features specified in claim 1.
  • this object is achieved according to the invention with a method for transferring a workpiece to or from a carrier, which has the features specified in claim 13.
  • Advantageous embodiments of the invention are the subject of the subclaims.
  • the carrier according to the invention is designed and provided for a system for the treatment of workpieces, in particular for wafers, which is provided with a housing which delimits a treatment space in which there is a controlled atmosphere and which comprises a gas-tight envelope, the envelope being the controlled Separates the atmosphere from the atmosphere outside the envelope.
  • the system has a conveyor system through which workpieces can be conveyed in the treatment room and is provided with at least one coupling means that is coupled to at least one coupling unit of the conveyor system.
  • the gas-tight casing is present between the coupling means(s) and the coupling unit(s) and these are coupled to one another without contact through the gas-tight casing.
  • the coupling means or means are designed as electromagnetic stators outside the gas-tight casing and the conveying system has at least one carrier, with workpieces being able to be conveyed into the treatment room by means of the carrier.
  • the carrier has at least one permanent magnet as a coupling unit and can be kept in suspension without contact with the casing and conveyed in the treatment room due to the interaction of the at least one coupling means and the at least one coupling unit connected to the carrier.
  • At least one carrier is provided with a receptacle for an effector and shows such an effector, which is firmly connected to the carrier using the receptacle.
  • the effector is designed in such a way that it projects laterally beyond the carrier and for the lateral reception of the workpieces to be treated is provided .
  • This carrier thus shows a different type of conveyance in a system for treating workpieces, in particular wafers, than in the prior art.
  • the treatment room is intended to be suitable for maintaining a vacuum with the help of the envelope or, alternatively or additionally, for enabling a protective gas atmosphere. All possible products or intermediate products have proven to be suitable as workpieces, which are to be processed and treated in an environment with such a controlled atmosphere. This system is particularly suitable for the treatment of semiconductor, sensor and optical substrates.
  • the conveyor system of such a system By designing the conveyor system of such a system, on the one hand, with one or more magnetic coupling units designed as permanent magnets on or in the carrier with an effector and, on the other hand, with one or more coupling means arranged as electromagnetic stators outside the gas-tight shell, which interact in such a way that the carrier with the Since the effector can be kept in suspension or lifted without contact with the casing and can be conveyed in the treatment room, it is possible, on the one hand, to form the carrier without cables and control lines, and to handle the carrier, especially when transferring a workpiece to the carrier with the effector or from to simplify this carrier with an effector and to convey the workpiece and to make the conveyance very low-damage to the workpiece and, on the other hand, to keep the risk of damage to the gas-tight casing and thus of a disruption to the system, for example due to leaks, low and thus an extremely safe one To create a system for the treatment of workpieces in a controlled sphere.
  • the coupling means designed as electromagnetic stators are controlled in such a way that the at least one carrier with an effector is kept in suspension in the treatment room, this being independent of the workpiece arranged or not arranged on the effector on the carrier.
  • a vertical movement or guidance in the different directions or rotation about the vertical of the carrier with an effector is also optionally possible for a vertical movement or guidance in the different directions or rotation about the vertical of the carrier with an effector to be provided. This is preferably ensured by a corresponding sensor and control circuit for controlling the coupling means.
  • the effector projects beyond the carrier at least by the width of the carrier, in particular by several times the width of the carrier.
  • the width is the lateral extent of the support, which in the case of a rectangle is chosen to be smaller than the length. Due to this significant lateral protrusion over the carrier, the lateral offset for receiving the workpiece on or to the effector is particularly large, so that the advantageous movement under the position of the workpiece to be processed during transfer is particularly easy, especially when the overall height of the transfer area is low . Due to the large length of the lateral projection, tilting the carrier through appropriate control using the coupling means and the associated control of the system has a particularly advantageous effect and enables an even lower height of the transfer area. This creates a particularly advantageous possibility of varying the design of the system with the potential transfer areas.
  • the carrier with the effector is designed to be movable in at least four degrees of freedom, with the possibility of displacement in the three independent directions x, y and z directions and additionally the Possibility of rotational movement at least around one of the three independent axes of rotation Rx, Ry and Rz axis is .
  • the possibility of a displacement in the three independent directions x, y and z-direction and the possibility of a rotational movement about all three independent axes of rotation Rx, Ry and Rz axes are provided and thus a possibility of moving the Carrier with the effector created in six degrees of freedom.
  • the effector has a fork-shaped structure.
  • This preferably shows several, in particular two, legs running parallel to one another, which define a plane and are suitable for holding the workpiece, in particular a wafer, in this plane.
  • the legs of the fork-shaped structure preferably show three support points, which together define a support plane and have a low but sufficient height, which enable the workpiece to be safely transferred to or from the carrier or to or from the effector of the carrier.
  • one of these three points is arranged in the end region of two legs and one in the middle region of the connecting piece of these two legs.
  • the effector is designed to be detachable from the receptacle on the carrier.
  • This design of the effector allows different effectors with different dimensions and in particular with different arrangements and designs of the support points to be selected and exchanged in a targeted manner as required, in particular depending on the different workpiece to be treated. This ensures particularly safe handling during operation or when using the carrier in such a system for treating workpieces.
  • the carrier with the effector is equipped with a measuring system for determining the load on the effector and/or the carrier, in particular due to the applied the workpiece to be treated is provided.
  • this makes it possible to determine the extent of necessary maintenance or damage to the carrier or the effector and thereby increase operational safety.
  • the possibility is also created to differentiate the transfer of a workpiece to or from such a carrier depending on the extent of the load, in particular on the extent of the weight load.
  • a measuring system is selected which determines the weight load on the effector or the bending or elongation on the effector caused by the applied weight of the workpiece and feeds this to a control of the system for treating the workpiece with the carrier with a measuring system, so that this control controls the system in particular the carrier with the effector is controlled differently.
  • the carrier according to the invention in such a way that the effector connected to the carrier is equipped with a drive to change its length, its orientation and/or its reception for the workpiece is provided.
  • This makes it possible to react flexibly and without complex modification work to the system with the carrier with effector to different workpieces to be treated and to ensure a safe transfer to the effector or safe conveyance in the system, especially through the treatment room .
  • the system according to the invention for the treatment of workpieces, in particular for wafers, is provided with a housing which delimits a treatment room in which a controlled atmosphere is present and comprises a gas-tight envelope, the envelope containing the controlled atmosphere from the atmosphere present outside the envelope separates.
  • the system has a conveyor system through which workpieces can be conveyed in the treatment room and is provided with at least one coupling means that is coupled to at least one coupling unit of the conveyor system.
  • the gas-tight casing is present between the one or more coupling means and the one or more coupling units and these are coupled to one another without contact through the gas-tight casing.
  • the coupling means or means are designed as electromagnetic stators outside the gas-tight casing and the conveying system has at least one carrier, with workpieces being able to be conveyed in the treatment room by means of a carrier.
  • the carrier has at least one permanent magnet as a coupling unit and can be kept in suspension without contact with the casing and conveyed in the treatment room due to the interaction of the at least one coupling means and the at least one coupling unit connected to the carrier.
  • the at least one carrier is provided with a receptacle for an effector and shows such an effector, which is firmly connected to the receptacle of the carrier.
  • the effector is designed in such a way that it projects laterally beyond the carrier and is intended to accommodate the workpieces to be treated from the side.
  • This carrier of the system thus shows a different type of funding in a system for treating workpieces, in particular wafers, than in the prior art. This becomes particularly clear when transferring a workpiece to or from a carrier with such an effector, because the carrier does not have to be brought under the workpiece to be picked up or the workpiece to be treated does not have to be placed on or lifted off the carrier.
  • the system according to the invention for treating workpieces in such a way that it has at least one further carrier for conveying workpieces in the system, which is provided with a receptacle for the workpiece, which is used to hold the workpiece to be treated above of the carrier is provided.
  • the differentiated design of the carriers of the system for the treatment of workpieces, in particular wafers creates a particularly diverse transport option, which depends on needs, in particular depending on what is to be conveyed Workpiece can be selected, which increases operational safety and, on the other hand, reduces the need for adaptation of the system to changed conditions, in particular changed workpieces, which require or suggest a differentiated training of the carrier.
  • This control of the system ensures the flexibility of the system to a particular extent; in particular, the selection of the carrier for conveying the workpiece can be selected and adapted as required, in particular depending on the general conditions in the area of the system through which the workpiece is conveyed. This also makes it possible to simplify the handling of the system and, on the other hand, to increase operational safety, in particular The need to convert the system, in particular the treatment room, to adapt to different workpieces or changed conditions can be limited.
  • a method according to the invention for transferring a workpiece to or from a carrier with an effector shows at least three phases, an approach phase, a transfer phase and a vertical phase.
  • the effector with its holder is moved below the workpiece to be treated and raised until it is first touched.
  • the orientation of the effector's recording is pivoted so that several points of contact are created.
  • the workpiece to be treated is raised by vertical displacement and lifted off the support on which the workpiece is prepared for acceptance.
  • the workpiece comes to rest in the holder of the effector and can therefore be conveyed into and through the system or the treatment room of the system.
  • the differentiated handling of the three phases makes it possible to reduce the load on the workpiece, especially a wafer, by reducing or preventing one-sided loads on the wafer or bending of the wafer.
  • the approach phase and the differentiated transfer phase are particularly important here, since the load on the workpiece can be kept minimal in the approach phase and can also be kept very low in the transfer phase.
  • the workpiece In the vertical phase, the workpiece is held at several points of contact th and thus compensated, in particular evenly supported and accordingly raised with little load on the workpiece and finally inserted into the receptacle of the reflector. This makes it possible to increase the process reliability and operational reliability of the system for treating a workpiece, in particular a wafer, when using the method according to the invention.
  • This increase in the contact points without lifting ensures a statically well-defined position of the workpiece, in particular the wafer, during the transfer from the holder of the effector to the support in the transfer area or vice versa.
  • This statically well-defined position enables a subsequent vertical raising or lowering of the workpiece or the wafer with a very low load on the workpiece. This makes it possible to increase the process reliability and operational reliability of the system for treating a workpiece, in particular a wafer, when using the method according to the invention.
  • the displacement movement can be carried out either by a movement of the carrier with an effector through the conveyor system and or by an active drive on the carrier or on the effector, which shifts the holder on the effector in one direction without causing a torsional or rotational movement comes .
  • This simple displacement movement of the effector or the By incorporating the effector it is possible to ensure a very simple and safe displacement movement, which, in contrast to a rotary movement or pivoting movement, enables a lower load and a lower risk of damage to the workpiece. This makes it possible to keep process reliability and operational reliability high.
  • the at least one carrier with an effector has a support structure with at least one receiving space enclosed with webs for at least one permanent magnet.
  • This receiving space is preferably designed to face the at least one coupling means.
  • the at least one carrier with an effector has a support structure made of light metal, which is formed in particular as a milled part and/or made of aluminum, an aluminum alloy or a magnesium alloy.
  • a support structure made of light metal which is formed in particular as a milled part and/or made of aluminum, an aluminum alloy or a magnesium alloy.
  • the gas-tight casing has a base that separates the coupling means from the treatment space with a carrier with an effector and is made of stainless steel or aluminum in the area of the coupling means.
  • Stainless steel has proven to be particularly preferred or the aluminum in the area of the coupling agent with a
  • Wall thickness of about 0.5 mm or less. This makes it possible to limit the distance and the influence of the ground on the magnetic field between the coupling elements of the conveyor system and thus on the carrier for conveying the workpiece to be treated, thereby creating a very efficient conveyor system for the system with a gas-tight shell.
  • a particularly preferred development of the system shows the possibility that the base made of stainless steel or aluminum in the area of the coupling agent(s) encloses the coupling agent in a U-shape and at least partially accommodates the coupling agent.
  • This makes it possible for the coupling means to be surrounded by the stainless steel or aluminum in a mechanically stable U-shape and thereby the coupling means form a unit with the stainless steel or aluminum of the base and are therefore mechanically robust and also arranged and gas-tight close to the gas-tight shell or the base are trained.
  • a preferred development of the system according to the invention for treating workpieces shows a lock with at least one movable lock wall, which is suitable for separating the treatment room from the lock room in a gas-tight manner in a closed position or for making it continuous in an open position.
  • the lock wall can be moved from the open position into a closed position or vice versa by means of a vertical and then lateral movement.
  • the lock wall is sealed in a closed position against the shell in the transition area to the treatment room on the side of the lock room by means of at least one O-ring seal, so that the treatment room and the lock room are separated from one another in a gas-tight manner.
  • a particularly preferred development of the system for treating workpieces shows coupling means arranged in the floor, which are arranged both in the area of the lock room and in the area of the treatment room. At least one coupling means is arranged in the area of the treatment room at least partially under the casing section of the lock, which is connected to the remaining casing.
  • This arrangement of the coupling means which are designed in particular as electromagnetic stators, enables transport to be as uniform and efficient as possible and thus a uniform and efficient conveyance of the carrier from the treatment room into the lock or back.
  • the system is provided with a control for controlling the coupling agent or devices, which is suitable for keeping a carrier with an effector in suspension and for promoting it in the treatment room and/or lock room of the system to pivot the carrier with the effector in the X direction, in the Y direction and/or in the Z direction as well as in the directions of rotation around the Rx, Ry and/or Rz axis of rotation.
  • a control for controlling the coupling agent or devices which is suitable for keeping a carrier with an effector in suspension and for promoting it in the treatment room and/or lock room of the system to pivot the carrier with the effector in the X direction, in the Y direction and/or in the Z direction as well as in the directions of rotation around the Rx, Ry and/or Rz axis of rotation.
  • Fig. 1 shows a schematic sectional view of an exemplary system according to the invention for treating workpieces
  • Fig. 2 shows a schematic sectional view of an exemplary carrier with an effector of a system according to the invention for treating workpieces
  • Fig. 3 shows a schematic top view
  • Fig. 4a shows a schematic flow representation of an exemplary method for transferring a workpiece from a support to a carrier with an effector from a support and
  • Fig. 4b shows a schematic flow representation of an exemplary method for transferring a workpiece from a carrier with an effector to a support.
  • Fig. 1 shows a schematic diagram of a system A for treating workpieces.
  • Appendix A shows a housing which delimits a treatment room B, in which there is a controlled atmosphere with a very low pressure, also called a vacuum, and which is enclosed by a gas-tight envelope 1.
  • Appendix A shows two different areas, on the one hand a lock S and on the other hand a system area with the treatment room B, which can be sealed off from each other via a lock wall SW. Workpieces can be fed to the system A via the lock S, whereby this takes place via a usual locking process with sequential opening and closing of the access opening Z or the lock wall SW to the treatment room B.
  • a carrier 30 without an effector is shown in the lock S, which floats in the space of the lock S and is therefore without contact with the casing 1 including the floor 2.
  • the carrier 30 without an effector workpieces can be conveyed in the system A on the surface of the carrier 30 or in a receptacle on the surface.
  • the carrier 30a with effector 35 which has a receptacle 38 for the workpiece to be treated, workpieces to be treated can be conveyed efficiently in the system A and through it.
  • the bottom 2 of the gas-tight envelope 1 contains several stainless steel or aluminum areas 2a, which are formed from a stainless steel or aluminum plate with a thickness of just under 0.5 mm and which are assigned to the various electromagnetic stators 11 and enclose them in a U-shape, the electromagnetic stators 11 partially secured and separated spatially and sealingly from the lock room SR or the treatment room B.
  • the edges of the stainless steel or aluminum areas 2a are designed as collars 8, which adjoin the U-shaped ends of the stainless steel or aluminum areas 2a and are aligned with the adjacent collars 8.
  • the electromagnetic stators 11, which are at least partially accommodated in the stainless steel or aluminum areas 2a are connected to one another flatly using a low-viscosity adhesive 3 and are thereby secured.
  • the floor contains 2 connecting pieces 2b, which connect the individual stainless steel or aluminum areas 2a so that the floor 2 has a flat surface.
  • An O-ring seal 7 is inserted between the connecting pieces 2b and the collar 8 of the stainless steel or aluminum areas 2a.
  • Stiff frame 5 is arranged from several stiffeners 4, which is screwed to the connecting pieces 2b via a series of screws 6 in such a way that the collars 8 of the stainless steel or aluminum areas 2a are connected to the O-ring seals 7 between the connecting pieces 2b and the Common, rigid frame 5 is held clampingly and sealingly.
  • the floor 2 shows such a comparable structure not only in the area of the treatment room B but also in the area of the lock S, which on the one hand proves to be gas-tight and on the other hand due to the stiffeners 4 below the stainless steel or aluminum areas 2a despite the low Material thickness of the stainless steel or aluminum areas 2a proves to be extremely robust and stable against the stresses caused by the controlled atmosphere in the treatment room B.
  • the coupling means 10 and the coupling units 20 are therefore separated from one another by the gas-tight stainless steel or aluminum areas 2a, which are part of the base 2 and thus of the casing 1, and are still able to interact magnetically in such a way that the carrier 30, 30a can be kept in suspension and promoted.
  • the carrier 30, 30a can be moved in a straight line (displacement) in all 3 directions, the Direction can be rotated and thus pivoted. It is precisely through the pivoting that an inclination of the carrier 30a is made possible with the effector 35 projecting laterally beyond the carrier 30a. This tilting makes it possible to reduce the necessary height in the area where a workpiece is transferred from or to the carrier 30a with the effector 35.
  • the coupling units 20 are on the carrier 30, 30a arranged and thus located in the treatment room B or in the associated lock room SR, while the coupling means 10 are arranged outside the gas-tight shell 1, i.e. on the side of the stainless steel or aluminum areas 2a, which faces away from the treatment room B or the lock room SR.
  • the lock S with its floor 2 which has a comparable structure to the floor 2 in the area of the treatment room B, also shows a movable lock wall SW, an access opening Z, which are connected to one another via a gas-tight cover 1, and a cover section 42 which is connected in a gas-tight manner to the remaining gas-tight shell 1 of the system A in the area of the treatment room B.
  • the movable lock wall SW including its drive, is integrated gas-tight into the shell 1 of the lock S.
  • FIG. 2 and in Fig. 3 shows schematically an exemplary carrier 30a with effector 35, although the entire length of effector 35 is not shown in FIG. 2.
  • the carrier 30a has a flat and closed surface 32 on its upper side. On this surface 32 there is a receptacle 34 for the effector 35 attached, which surrounds the flat effector 35 at the edge in three places so that the weight of the effector 35 can be applied with its receptacle 38 for a workpiece to be treated.
  • the weight force is statically absorbed by the carrier 30a and as a result the carrier 30a with the effector 35 and with the workpiece arranged thereon in the receptacle 38 can be loaded or unloaded in a positionally stable manner, in particular without tilting or without swaying or wobbling. Furthermore, the effector 35 can be detached from the carrier 30a by pulling it out and, if necessary, replaced by another effector 35.
  • the effector 35 is connected to the carrier 30a via the receptacle 34 in such a way that it projects laterally beyond the carrier 30a by a multiple of its width and thereby the receptacle 38 for the workpiece at the free end of the effector 35 is at a large distance from the carrier 30a has.
  • the effector 35 is designed as a dimensionally stable plate made of light metal or carbon material and has a fork-shaped section 36 at the free end with two webs running parallel to one another, which are connected to one another in a U-shape via a cross connection.
  • the cross connection is followed by a strip-shaped plate which is inserted into the receptacle 34 for the effector 35 on the carrier 30a and is releasably fixed.
  • the fork-shaped section 36 On the fork-shaped section 36, three receiving points 37 made of elastic material, designed as elevations, are arranged, which together have a parallel to the effector 35. define the running plane, which together with the fork-shaped section 36 form the receptacle 38 for a workpiece and two of which are arranged in the front end region of the legs and one of which is arranged in the central region of the cross connection of the fork-shaped section 36.
  • This design of the receptacle 38 for a workpiece on the effector 35 proves to be very robust and safe and thereby enables a very reliable and safe transfer of a workpiece as well as a very reliable and safe transport into or through the system A.
  • the carrier 30, 30a is realized as a milled part made of aluminum, which has several webs 31 on its underside, which form a support structure, which gives the carrier 30, 30a a very stiff and robust structure with a low weight.
  • the webs 31 form two or more receiving spaces AR, into which the coupling units 20 designed as permanent magnets 21 are introduced and fixed.
  • the coupling units 20 are fixed in the receiving spaces AR by gluing using a vacuum-suitable adhesive 33, which is characterized by very low outgassing under the influence of vacuum.
  • the two receiving spaces AR with the coupling units 20 are arranged on the underside of the carrier 30 so that they face the coupling means 10 arranged outside the gas-tight shell 1 with the stainless steel or aluminum areas 2a, thereby ensuring a very efficient and safe magnetic interaction to create the floating state and the conveyance is guaranteed.
  • Fig. 4a shows a schematic representation of the process of transferring a workpiece from a support to the carrier 30a with effector 35.
  • the effector 35 with its receptacle 38 which is formed by the fork-shaped section 36, is displaced below the workpiece to be treated and then raised until it is first touched.
  • the first contact of the holder 38 with the workpiece that lies on the support and is to be transferred to the effector 35 so that the workpiece with the effector 35 and the carrier 30a can be conveyed through the system A is done with the help of a measuring system 50 to determine the load on the effector 35.
  • the approach phase begins in the immediate vicinity of the support and is preferably carried out exclusively by displacement without rotation or pivoting. This enables a very reliable approach up to the first contact.
  • the orientation of the receptacle 38 of the effector 35 is pivoted so that, using the example of a receptacle 38 according to Figures 2 and 3, three points of contact are created between the receptacle 38 and the workpiece using the three elevations, without a point of contact of the Workpiece is lifted from the support.
  • the pivoting is preferably carried out exclusively by rotational movements and therefore without displacement movements.
  • a lifting of the workpiece is recorded using the measuring system 50 by detecting an abrupt increase in the load. As soon as such a selective, abrupt increase is detected, the pivoting is immediately adjusted, thereby preventing the workpiece from being lifted.
  • the workpiece is then lifted in a vertical phase by moving it vertically and is thus lifted off the support.
  • This displacement is preferably carried out without rotational movement, which ensures a very differentiated and safe vertical movement of the workpiece and thus a secure reception of the workpiece in or on the receptacle 38 of the effector 35 of the carrier 30a and thus a conveyance in or through the system A is .
  • the load on the workpiece is very low, because the workpiece rests in a statically defined manner on the several contact points, here three contact points, and in this way prevents damage to the workpiece, particularly through unnecessary bending or slipping.
  • FIG. 4b shows a schematic representation of the process of transferring a workpiece from the carrier 30a with the effector 35 to a support.
  • the effector 35 with its receptacle 38 and the workpiece picked up is moved into the area above the support and then lowered until the first contact is made.
  • the receptacle 38 is formed by the fork-shaped section 36.
  • the first contact of the workpiece with the support, which lies on the receptacle 38 of the effector 35 and is to be transferred to the support, is recorded using a measuring system 50 to determine the load on the effector 35 by detecting an abrupt decrease in the load .
  • the vertical lowering is immediately stopped, so that the workpiece is prevented from being lifted from the holder 38.
  • the approach phase begins in the immediate vicinity above the support and is preferably carried out exclusively by vertical displacement without rotation or pivoting. This enables a very reliable approach up to the first contact.
  • the orientation of the receptacle 38 of the effector 35 is pivoted so that several points of contact arise between the support and the workpiece, without a contact point of the workpiece being lifted off the receptacle 38 by the support.
  • the pivoting is preferably carried out exclusively by rotational movements and therefore without displacement movements.
  • lifting of the workpiece is detected using the measuring system 50 by detecting an abrupt decrease in the load.
  • the pivoting is immediately adjusted and thus prevents the workpiece from being lifted off. This ensures that the receptacle 38 rests against the workpiece with three points of contact and thus touches the workpiece without transmitting relevant forces to the workpiece that could move the workpiece or change its shape.
  • the workpiece is then lowered in a vertical phase by moving it vertically and is thus placed on the support.
  • the vertical displacement is preferably carried out without a rotational movement, which results in a very differentiated and safe vertical movement of the workpiece and thus a safe transfer of the workpiece from the receptacle 38 of the effector 35 of the carrier 30a to the support, for example for potential removal from system A is .
  • the load on the workpiece is very low because the workpiece rests in a statically defined manner on the multiple contact points and in this way prevents damage to the workpiece, particularly through unnecessary bending or slipping.
  • the system A shown in the figures enables extremely safe and gentle treatment of the workpiece during the transfer from or to a carrier 30a as well as during conveyance, but also during treatment in the treatment room B, since it is characterized by extremely good operational safety, especially in the with regard to the controlled atmosphere.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de manutention de pièces A ou un agencement constitué de plusieurs systèmes de ce type. Selon l'invention, le système de manutention de pièces A comprend un boîtier qui délimite une chambre de manutention B, dans laquelle règne une atmosphère contrôlée, avec un compartiment étanche au gaz (1) qui sépare l'atmosphère contrôlée de l'atmosphère à l'extérieur du compartiment (1). Le système de manutention de pièces A comprend un système de transport qui permet de transporter des pièces dans une chambre de manutention, ainsi qu'au moins un moyen de couplage (10) qui est couplé à au moins une unité de couplage (20) du système de transport. Les moyens de couplage (10) et les unités de couplage (20) sont couplés sans contact les uns aux autres à travers le compartiment étanche au gaz (1). Les moyens de couplage (10) se présentent sous la forme de stators électromagnétiques (11) à l'extérieur du compartiment étanche aux gaz (1). Le système de transport comprend au moins un support (30) avec au moins un aimant permanent (21) utilisé en tant qu'unité de couplage (20), le ou les supports (30) permettant de transporter des pièces dans la chambre de manutention B. La coopération des moyens de couplage (10) et des unités de couplage (20) permet de maintenir le support (30) en suspension sans contact par rapport au compartiment (1) et de le transporter dans la chambre de manutention B. L'invention est caractérisée par une sécurité de fonctionnement et une sécurité du produit particulièrement élevées.
PCT/DE2023/100657 2022-09-12 2023-09-06 Manutention de pièces, en particulier de tranches WO2024056127A1 (fr)

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DE102022123236.0A DE102022123236A1 (de) 2022-09-12 2022-09-12 Behandlung von Werkstücken insbesondere von Wafern
DE102022123236.0 2022-09-12

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720010A (en) * 1995-08-22 1998-02-17 Ebara Corporation Control system for a linear actuator including magnetic bearings for levitating a robot arm
US6634845B1 (en) * 1999-06-18 2003-10-21 Tokyo Electron Limited Transfer module and cluster system for semiconductor manufacturing process
DE102009038756A1 (de) 2009-05-28 2010-12-09 Semilev Gmbh Vorrichtung zur partikelfreien Handhabung von Substraten
DE102012200220A1 (de) * 2011-06-20 2012-12-20 Semilev Gmbh Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters
DE102011116136A1 (de) 2011-10-15 2013-04-18 Eisenmann Ag Anlage zur Behandlung von Werkstücken
US20150214086A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate Transport Vacuum Platform
US20180308735A1 (en) * 2015-01-23 2018-10-25 Applied Materials, Inc. Semiconductor process equipment
US20200111692A1 (en) * 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US20210265188A1 (en) * 2020-02-20 2021-08-26 Brooks Automation, Inc. Substrate process apparatus
US20210296150A1 (en) * 2020-03-20 2021-09-23 Applied Materials, Inc. Substrate transfer systems and methods of use thereof
DE202021106150U1 (de) 2021-11-10 2021-11-22 Mafu Robotics GmbH Anlage zur Behandlung von Werkstücken
DE102020212223A1 (de) * 2020-09-29 2022-03-31 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720010A (en) * 1995-08-22 1998-02-17 Ebara Corporation Control system for a linear actuator including magnetic bearings for levitating a robot arm
US6634845B1 (en) * 1999-06-18 2003-10-21 Tokyo Electron Limited Transfer module and cluster system for semiconductor manufacturing process
DE102009038756A1 (de) 2009-05-28 2010-12-09 Semilev Gmbh Vorrichtung zur partikelfreien Handhabung von Substraten
DE102012200220A1 (de) * 2011-06-20 2012-12-20 Semilev Gmbh Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters
DE102011116136A1 (de) 2011-10-15 2013-04-18 Eisenmann Ag Anlage zur Behandlung von Werkstücken
US20150214086A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate Transport Vacuum Platform
US20180308735A1 (en) * 2015-01-23 2018-10-25 Applied Materials, Inc. Semiconductor process equipment
US20200111692A1 (en) * 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US20210265188A1 (en) * 2020-02-20 2021-08-26 Brooks Automation, Inc. Substrate process apparatus
US20210296150A1 (en) * 2020-03-20 2021-09-23 Applied Materials, Inc. Substrate transfer systems and methods of use thereof
DE102020212223A1 (de) * 2020-09-29 2022-03-31 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung
DE202021106150U1 (de) 2021-11-10 2021-11-22 Mafu Robotics GmbH Anlage zur Behandlung von Werkstücken

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