WO2024050137A1 - Appareil et procédé pour un connecteur électrique - Google Patents

Appareil et procédé pour un connecteur électrique Download PDF

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Publication number
WO2024050137A1
WO2024050137A1 PCT/US2023/031924 US2023031924W WO2024050137A1 WO 2024050137 A1 WO2024050137 A1 WO 2024050137A1 US 2023031924 W US2023031924 W US 2023031924W WO 2024050137 A1 WO2024050137 A1 WO 2024050137A1
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WO
WIPO (PCT)
Prior art keywords
electrical connector
approximately
connector
electrical
connectors
Prior art date
Application number
PCT/US2023/031924
Other languages
English (en)
Inventor
Jonathan Buck
Jose Luis Ortega
Original Assignee
Samtec, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samtec, Inc. filed Critical Samtec, Inc.
Publication of WO2024050137A1 publication Critical patent/WO2024050137A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk

Definitions

  • the present embodiments relate generally to an electrical connector apparatus/assembly, with particular embodiments shown for an electrical connector.
  • Typical connectors intended to operate at 112G/224G may require a larger width of the die package substrate to accommodate.
  • this practice of increasing the size of the die package substrate may increase insertion loss and/or make the die package substrate more susceptible to curling, warping, and/or losing coplanarity during reflow.
  • the present invention is directed at overcoming, or at least improving upon, the disadvantages of the prior art.
  • Figure 1 is a perspective view of one embodiment of an electrical connector assembly illustrating one embodiment of an electrical connector.
  • Figure 2 is an exploded view' of the electrical connector assembly of Fig. 1.
  • Figures 3A is a perspective view of a plurality of electrical connectors of Fig. 1.
  • Figures 3B is a side view of a vertical cable of Fig. 3A.
  • Figures 3C is a side view of a right-angle cable of Fig. 3A.
  • Figure 4A is a perspective view of the right-angle cable and electrical connector of Fig. 3 A.
  • Figure 4B is a perspective view of the right-angle cable of Fig. 4A.
  • Figure 5 is a perspective view of an embodiment of the mating interface of the electrical connector of Fig. 1.
  • Figure 6 is an exploded view of the mating interface of Fig. 5.
  • Figure 7 is a perspective view of the electrical connector assembly illustrating 1024 pairs.
  • Figure 8 is a perspective view of the electrical connector assembly illustrating 1192 and/or 1280 pairs.
  • Figure 9 is a perspective view of the electrical connector, illustrating the mating interface or plates surrounding the cable connector and/or spaced from the substrate for a distance.
  • Figure 10 is a perspective view of the electrical connector with the mating surface broken away.
  • Figure 11 is a chart illustrating the impedance profile of the cable to the package for one embodiment.
  • Figure 12 is a chart illustrating the shield return path transition impact for one embodiment.
  • Figure 13 is a chart illustrating the differential FD NEXT Power Sum for one embodiment.
  • Figure 14 is a chart illustrating the differential FD FEXT Power Sum for one embodiment.
  • Figure 15 illustrates a PKG and PCB embodiment of the 64 pair blocks.
  • Figure 16A and 16B illustrate an embodiment of a retention bracket.
  • Figure 17 is a portion of the PKG substrate routing.
  • Figure 18 is an embodiment of the PKG versus the PCB, the designs are rotated for vertical routing.
  • Figures 19A-19C are views of an embodiment of the Mezzanine, illustrating a height of less than 8mm.
  • Figure 20 is another embodiment of the electrical connector, with portions of the cable connector removed to illustrate a locking mechanism.
  • Figure 20A is an enlarged sectional view of Fig. 20 illustrating the latch locking mechanism of the engagement between portions of the mating interface.
  • Figure 21 is an exploded view of Fig. 20.
  • Figure 22 is a perspective view of the mating interface, illustrating the assembled receptacle base and ground member.
  • Figure 22A is an enlarged perspective view of Fig. 22.
  • Figure 23 is an exploded view of Fig. 22.
  • Figure 24 is a perspective view of a row of cavities of the mating interface receiving a row or plurality of connectors.
  • Figure 25 is an exploded view of Fig. 24.
  • Figures 25 A and 25B are enlarged perspective views of Fig. 25.
  • Figure 26 is another embodiment of the electrical connector, with portions of the cable connector removed to illustrate a mating interface and portions of the plug connector broken away.
  • Figure 27 is a perspective view of the electrical connector of Fig. 26, with portions of the housing of the mating interface broken away and portions of the housing of the plug connector removed to illustrate an embodiment of a stiffener and a retention member.
  • Figure 28 is a perspective view of the electrical connector of Fig. 26, with the mating interface and cable connector exploded away from the plug connector, with portions of the housing of the mating interface removed.
  • Figure 29 is an exploded view of a row of cavities of the mating interface of Fig. 26 receiving a partial row or plurality of connectors.
  • Figure 30 is a chart illustrating the differential FD NEXT Power Sum for one embodiment shown in Fig. 26.
  • Figure 31 is a chart illustrating the differential FD FEXT Power Sum for one embodiment shown in Fig. 26. DETAILED DESCRIPTION
  • an embodiment provides for one or more electrical connector assemblies 20.
  • the assembly 20 may include at least one or more electrical connectors 30.
  • the electrical connectors may include a width of about 12.5 mm, operation at about 224 Gbps, and/or a package size of about 75mm.
  • the number of pairs may be 64 in less than half an inch or a density of greater than 256 pairs per square inch.
  • an electrical connector may be sized and shaped such that a plurality of the electrical connectors may fit on a single side of a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors may collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224GbpsPam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk).
  • an electrical connector may be sized and shaped such that a plurality of the electrical connectors may fit on a single side of a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -50dB of NEXT (near end crosstalk).
  • Electrical connector assembly 20 includes an electrical connector 30 and/or a plurality of cable connectors 40 configured to mate with electrical connector 30.
  • Electrical connector 30 may include or be connected to a circuit substrate 50, such as, e.g., die package substrate 50a, a printed circuit board 50b. As shown in the one embodiment, the connector 30 may be positioned/fit on a single side of the circuit substrate 50 (e.g. 50a, 50b). However, the connector 30 may be positioned on both sides in some embodiments.
  • electrical connector 30 may include a mating interface or cable head organizer 60 (e.g.
  • the mating interface 60 may include a plurality of interlocking plates 62 defining a plurality of cavities 63.
  • the connector 30 may include or is configurated to mate with one or more cable connectors 40. Each cavity 63 is sized for accepting or mating to the cable connector 40.
  • the electrical connector 30 may include one or more plug connectors 70.
  • the electrical connector 30 or plug connector 70 further includes one or more electrical contacts 71 and/or one or more ground contact elements 72. Each electrical contact 71 is positioned within the cavity 63, electrically isolated from interlocking plates 62, and configured to mate with a contact 42 (e.g. socket) of the cable connector 40.
  • Contacts 42 can be non-compression type of contacts, such as beam to beam or beam to blade versus beam to pad.
  • a plastic or dielectric web and optional button can be positioned between two immediately adjacent contacts 42, as descnbed in United States Patent No. 10,439,330, hereby incorporated by reference in its entirety.
  • Contacts 42 can be electrically conductive. Contacts of each differential signal pair can be spaced approximately
  • Differential pair to pair spacing can be approximately 1.4 mm, approximately 1.5 mm, approximately 1.6 mm, approximately 1.7 mm or approximately 1.8 mm and all lengths therebetween.
  • Row to row spacing of differential signal pairs can be approximately 1.3 mm, approximately 1.4 mm, approximately 1.5 mm, approximately 1.6 mm, approximately 1.7 mm, or approximately 1.8 mm. Some rows can be spaced unevenly in an array of differential signal pairs, such as approximately 1.3 mm for some row spacing and approximately 1.7 mm centerline to centerline spacing between other adjacent rows.
  • Each of the ground contact elements 72 may be electrically grounded and configurated to mate with at least one plate 62 (e.g. directly, indirectly, first plate, second plate).
  • the plug connector 70 e.g. ground contact elements, electrical contact
  • the circuit substrate 50 e.g. 50a, 50b.
  • the 1024 pair solution may be used.
  • a 1192 or 1280 pair solution may be used.
  • interlocking plates 62 may be electrically conductive and provides a ground connection between cable connector 40 and circuit substrate 50, or portions thereof.
  • interlocking plates 62 may be electrically conductive or insulative.
  • at least one interlocking plates 62 include a terminal end 64 spaced away from the circuit substrate 50 and a mating end 65 for electrically contacting an electrically conductive outer shield element 43 of the cable connector 40.
  • a spacing or distance D from the circuit substrate 50 e.g.
  • the package, 50a, 50b) to the terminal end 64 of the plate 62/shield 43 may be reduced by a length L of the plates 62 or cavities 63.
  • the remaining portion of the length or distance D from circuit substrate to the terminal end 64 may be at least one source of the crosstalk.
  • the plates 62 defining the cavity 63 cover or overlap about 85 to 95 percent of the length of the cable connector 40 to the package or substrate 50 to minimize the distance D.
  • the plates 62 defining the cavity 63 covering/overlapping about 90 percent or the length L of the cable connector 40 to the package to reduce the crosstalk, while the remaining portion or distance D may be about 10 percent to the substrate.
  • One embodiment of the impedance profile of the cable to package is shown in Fig. 11, the simulation shown with a TDR signal of 92Q +/- 5Q at 6ps (20%-80% rise time).
  • the terminal end 64 of the plates 62 or cavities 63 may be spaced (e.g. predetermined distance D) from the package/ substrate 50.
  • the terminal end 64 or plate 62 may abut/position/mate with the ground contact element 72 of the plug connector at the distance D.
  • the contact element 72, or portions thereof, may space the plate 62, or portion thereof, (e.g. terminal end 64) from the substrate 50 at the distance D.
  • the ground contact element 72 extends/projects from the circuit substrate 50 (e.g. 50a, 50b).
  • the ground contact element 72 may include one or more arms/blades.
  • the ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms.
  • the increase in the number of arm(s) may increase contact area/width when mating to the mating interface (e.g. plate(s))
  • the ground contact element 72 may include two arms 72a, 72b (e.g. at least two laterally offset, cantilevered beams) extending upwardly and away from each other to define a slot 73 to receive the terminal end 64 of the plate(s) 62 (e.g. first).
  • the two arms may diverge from the remaining portion of the ground contact element or body.
  • the two arms 72a may be offset by a distance from each other along the length or plane of the slot 73 receiving the plate(s) 62. Although the arms may not overlap or cross along the length of the slot, it should be understood that a portion of the arms may overlap in some embodiments.
  • the slot or one of more portions of the ground contact element 72 (e.g. arm(s)) may define a stop or vertical stopping mechanism for limiting further axial travel of the plate 62 within the slot or towards the circuit substrate. The stop may position the mating interface, plate, or cavity at the distance D.
  • the first and second arms 72a, b may be mirror images of each other with the plane of the slot 73.
  • the first arm 72a engages the interior of one cavity/plate and the second arm 72b engages the interior of the adjacent cavity/plate.
  • two ground contact elements 72 may engage adjacent and parallel plates 62 (e.g. first), and not the adjacent second plates defining the cavity 63 receiving the cable connector 40.
  • one or more ground contact elements 72 may engage one or more second plates and/or in combination with one or more first plates.
  • each arm 72a, b may be spring loaded or biased to urge towards the slot 73 or engaged plate 62. Further, each arm or distal free end of the arm may flare/curve away from the slot or engaged plate.
  • the arms 72 may be surrounded by air or free space, without contact with a plastic or insulating member. No plastic may be between the mating ends of the ground contact elements 72 and the mating ends of the signal contacts 71. The mating ends of
  • 71 and 72 may be unrestricted or not surrounded by plastic or insulating member(s).
  • the shield return path or ground contact element may include one or more solder ball/masses 74.
  • the ground contact element 72 includes at least one solder mass 74.
  • the ground contact element 72 may include one or more solder masses. For example, at least one solder mass, at least two solder masses, or at least three solder masses. In some embodiments, the two or more solder masses may be immediately adjacent to each other (e.g. linearly aligned). In some embodiments, the soldering for the contacts may be one or more elongated pads of a variety of lengths. In some implementations, the electrical/signal contacts 71 may be perpendicular to the ground contact elements 72.
  • interlocking plates 62 are metal plates formed by any suitable method, such as, e.g., metal stamping. In other embodiments, interlocking plates 62 are formed by other means, including molding and/or machining of polymeric material, molding and/or machining of metal, or construction of a metal frame overmolded with a polymeric material. In some embodiments, a plastic frame/base may be plated.
  • interlocking/interconnected plates 62 include a plurality of first plates 62a and a plurality of second plates 62b as shown in Figs. 5 and 6.
  • the plate(s) 62 may include one or more grooves 66 and/or one or more slots 67.
  • the grooves, if used, may be interlocking with the slots, if used, to define the cavities 63.
  • the first plate 62a may include a plurality of first slots 67a aligned with a plurality of first grooves 66a.
  • the second plate 62b may include a plurality of second slots 67b aligned with a plurality of second grooves 66b.
  • Second plates 62b are transversely positioned and interconnected with respect to first plates 62a by interlocking first slot 67a with the second groove 66b and interlocking the second slot 67b with the first groove 66a such that when assembled, the plurality of first plates and second plates define the plurality of cavities 63.
  • the slot/groove engagements 66, 67 or mating interface 60 provide a fully enclosed or 360 degree shield/circumference about one or more cable connectors 40.
  • the 360 shield or plates reduce the crosstalk between the cable connectors within the cavities. This may prevent or reduce gaps/holes/pathways in the cavity walls to reduce crosstalk.
  • the walls of the slot/groove engagements may abut or overlap edges of the opposing slot/groove engagement to reduce gaps.
  • the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -40dB of FEXT (far end crosstalk).
  • the simulation embodiment shown in Fig. 13 was conducted at 92 +/- 5Q at 6ps (20%-80% rise time).
  • the mating interface 60 may include a housing 68.
  • the housing 68 if used, may include a plurality of grooves 69 positioned in the inner periphery.
  • the groove(s) 69 may maintain spacing of the cavities 63/plates 62 and/or provide rigidity to the one or more plates 62.
  • the grooves 69 may receive the ends of the first plate 62a and the second plate 62b.
  • the electrical connector 30 may include one or more gaps/spaces 32 between the cable connectors 40 to reduce crosstalk.
  • the more space or distance between rows may lower NEXT of the PKG.
  • the gap 32 may be defined by one or more rows of cavities 63 defined by the plurality of plates 62 that do not contain the cable connectors 40.
  • the one or more rows without the cable connectors 40 or gaps 32 within the array of cable connectors 40 may reduce the crosstalk between the cable connectors 40.
  • the one or more rows/gaps 32 without the cable connectors 40 may be defined by a plurality of smaller cavities (e g. smaller through opening) or closer spaced plates(s).
  • the smaller row or gap 32 may be defined by at least two adjacent and parallel plates (e.g. first plates 62a and/or second plates 62b) being spaced at a less distance than the remaining parallel plates.
  • the grooves 66 and slots 67 may be positioned on the respective plates 62 to define the gap(s) 32 of a variety of row to row spacmg/distances D.
  • the intersecting plates 62 of both the first plates and the second plates may be spaced at a less distance (e.g. row to row) to define a smaller row.
  • the plurality of electrical connectors may transmit approximately
  • the assembly/connector, or portions thereof may be a 224 Gbps Pam4 signal with 92Q +/- 5Q at 6ps with 20%-80% rise time as simulated in one embodiment.
  • the bandwidth may be about 70 to 50 GHz.
  • the bandwidth may be about 56 GHz.
  • the FEXT may be about -30dB to about -45dB. For example, under or equal to -30dB, under or equal to -35dB, under or equal to -40dB, and/or under or equal to - 45dB.
  • the insertion loss may be between about OdB to about -5dB.
  • the bandwidth may be about 50 GHz to about 80 GHz.
  • the NEXT may be about -40dB to about -60dB.
  • the insertion loss may be between about OdB to about -5dB.
  • the bandwidth may be about 50 GHz to about 70 GHz.
  • the assembly 20 or electrical connector 30 may include a bend/cable organizer 80 for one or more cables 90.
  • the bend/cable organizer 80 may include a strain relief 81 in some embodiments.
  • the strain relief 81 if used, may be a hot melt.
  • the bend organizer 80 may be used with a vertical cable 90a or a right-angle cable 90b.
  • the overall height of the electrical connector 30 or assembly 20 may be less than 15mm.
  • the right-angle cable 90b with bend organizer 80 may define a height of about 15mm.
  • the vertical cable 90a with bend organizer 80 may define a height of about 10mm.
  • one or more cables 90 may be connected to the one or more cable connectors 40.
  • the cable 90 is shown as a twin cable in the one embodiment shown, it should be understood that a variety of cables may be used and still be within the scope of the invention.
  • a coax cable may be used in some embodiments.
  • Cable 90 can include a shield, such as a wrapped shield or an extruded shield or any type of ground, or reference, or EMI shield.
  • the shield can be stripped with respect to an exposed surface of the center electrical insulator, can be partially stripped, but is not limited to, a length of greater than zero mm to approximately 1 mm to 2 mm, or zero mm, or 2 mm or larger, or zero mm to 0.5 mm.
  • Any of the connectors may include electrically conductive or electrically lossy, magnetic absorbing material.
  • the assembly 20 or electrical connector may include one or more retention brackets 95.
  • a retention bracket 95 may be one or more spring fingers.
  • the retention device if used, may ensure mated parts and/or allow service.
  • Another example of the retention bracket may be latching.
  • the circuit substrate 50 may have a routing determining density.
  • the PKG or die substrate package may start with a 350 um pitch to minimize FEXT and squeeze the pitch down to 200um as route pass vias.
  • the BGA pitch of 0.35 may determine the routing density (e.g. 224 Gbps).
  • the PCB version may be about 5mm wider and deeper than the die substrate package as shown in Fig. 15.
  • one embodiment of the PKG versus the PCB embodiment is shown in Fig. 18. The designs are shown rotated for vertical routing.
  • the PKG may be 2 layers and the PCB may be 4/8 layers.
  • the electrical connector assembly may include a lower RA height option.
  • the cable organizer may be less than 8mm with compatibility.
  • the configuration may be a stacked flex 98 in a mezzanine configuration.
  • One example as shown, may be four 3 -layer flex films, stacked and one soldered to the connector.
  • the flex 98 may be converted to one or more cables for longer lengths.
  • the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and/or plug connector 70, 170 may include one or more locking mechanisms 82, or portions thereof, coupling the mating interface 160 with the plug connector 170.
  • the locking mechanism 82 may be a middle or internal locking mechanism spaced or positioned inwardly from or within the outer periphery (e.g. outer housing, walls) of the electrical connector 30/connector 170/mating interface 160.
  • the locking mechanism 82 may include one or more latches, clips, or friction locks 82a (e.g. middle, internal).
  • the one or more clips 82a are show n internal or inside to/within the plug connector 170, mating interface 160, and/or electrical connector 30 (e.g. outer periphery). Although the clips 82a are shown internal to the electrical/plug connector 30, 170 and/or mating interface 160, it should be understood that external clips (e.g. positioned on the outer periphery', wall) may be used in combination with the internal clip(s)/locking mechanism in some embodiments.
  • the one or more clips 82a project upwardly from the bottom of the plug connector 170 and/or substrate 50, and/or spaced interior of the outer periphery.
  • the clips may project upwardly from a middle or internal wall 82ab extending between or within the outer peripheral walls (e.g.
  • two spaced apart clips 82a may be spring loaded in a transverse direction (e.g. opposing directions, inwardly towards opposing sides of the internal panel 82b) to the plane of the clips 82a and/or internal wall 82ab.
  • the clips 82a apply friction to the locking mechanism 82 of the mating interface 160, or portions thereof, (e.g. internal panel 82b, catches 82ba) to reduce or prevent axial separation between the mating interface 160 and the plug connector 170.
  • the locking mechanism 82, or portions thereof, of the mating interface 160 may be one or more receptacles/catches 82ba and/or internal panel 82b releasably engaging the one or more clips 82a.
  • the clips 82a engage the internal panel 82b, or portions thereof, (e.g. upper notches/catches/receptacles 82ba) of the mating interface 160.
  • the clips 82a of the plug connector 170 interfere with the axial separation of the mating interface 1 0 or intemal/middle panel 82b.
  • the internal panel 82b may be positioned in the gap 32 between the cable connectors 40 and/or cavities 32 (e.g. rows of cable connectors).
  • the internal panel 82b may include one or more notches/catches 82ba in the upper edge thereof. If two notches 82ba are used, the notches may be spaced away from each other along the length of the panel 82b.
  • One or more portions of the locking mechanism 82 may be reversed between the mating interface 1 0 and the plug connector 170.
  • the mating interface 160 may include the clips and the plug connector 170 may include the internal panel.
  • the mating interface 160 may include a plurality of interlocking plates 62 defining at least one row R1 of cavities 63 receiving at least one row or one or more cable connectors 40.
  • the interlocking plates 62 may include at least two third/opposing/parallel plates 62c interconnected by one or more fourth/parallel plates 62d transverse to the third plate.
  • the fourth plates 62d may define opposing end plates at the opposing ends of the row of cavities or third plates 62c.
  • Each row R1 may include the third and fourth plates.
  • the mating interface 160 may include a plurality of rows R1 defined by the third and fourth plates.
  • the cavities 63 may have a through opening (e.g.
  • the third plates 62c may include one or more through apertures 62ca receiving one or more projections 62da extending from the outer periphery (e.g. opposing ends/sides) of the fourth plates 62d when assembled.
  • the third plate(s) 62c may include one or more through apertures or elongated slots 62ca (e.g. in the direction between the mating end 65 towards the terminal end 64). As shown in Figs.
  • each fourth plate 62d may include one or more protrusions or elongated protrusion 62da on opposing sides/edges, engaging the corresponding elongated slots 62ca of opposing third plates 62c.
  • the mating end 65 of one or more of the third plates 62c and/or the fourth plates 62d may include a plurality of curved edges to mate or contour with the one or more cables 90 or cable connector 40.
  • the other of the opposing/parallel third plate 62c may be longer than and extend beyond the curved edges, if used, as shown in Figs. 24 and 25.
  • solder paste may be used adjacent the engagement of the apertures/projections.
  • the cavities defined by the third and fourth plates 62c, 62d may receive the cable connectors 40.
  • the end plates or fourth plates 62d may be spaced inwardly from the opposing ends of the third plates or rows R1 to define a groove 200b.
  • the groove 200b may include a bottom opening to receive or insert the tongue member 200a of the remaining portion of the mating interface 160 (e.g. base, ground member).
  • the third/fourth plates 62c, 62d (e.g. ground, metal) may be stamped and/or plated.
  • the plates 62 may be cream solder printed, solder plated, and/or laser welded together.
  • the cavities or third and/or fourth plates may be assembled with one or more hot blades with the one or more cable connectors 40 therein.
  • a row R1 of cavities defined by the third and fourth plates 62c, 62d are positioned adjacent to one or more rows R1 of cavities.
  • Adjacent third plates 62c of adjacent cavities/rows RI may be positioned parallel to and/or in contact with each other as shown in Figs. 20, 20A, and 21.
  • the locking mechanism 82, or portions thereof, internal wall 82ab, gap 32, internal panel 82b, notch 82ba, and/or clip 82a may space two adjacent rows R1 from each other.
  • the mating interface 160 may include the plates (e.g. third, fourth, etc.), a receptacle base 160a, and/or a ground member 160b.
  • the receptacle base 160a may be, but is not limited to, molded plastic and/or the ground member 160b may be, but is not limited to, stamped metal (e.g. conductive).
  • the base 160a or mating interface 160 may include one or more internal panels 82b and/or locking mechanism(s) 82, or portions thereof, in some embodiments.
  • the base 160a may include the housing 68 having an outer peripheral wall(s) 68a defining a through opening 68b.
  • the internal panel 82b may be inside or within the outer periphery and extend between opposing walls of the outer peripheral walls 68a and/or intersecting the through opening 68b.
  • the ground member 160b may include an outer peripheral wall 68c defining a through opening 68d.
  • the outer peripheral wall 68c of the ground member 160b may include a channel 68e (e.g. U-shaped, inverted channel).
  • the ground member outer peripheral wall 68c may mate with the base outer peripheral wall 68a.
  • the channel 68e or ground member walls 68c may receive the upper edge of the base outer peripheral walls 68a.
  • the mating interface 160 may include one or more tongue and groove engagements 200.
  • Opposing walls 68c of the ground member 160b may include one or more tongue members or mating surfaces 200a, adjacent opposing walls of the base 160a.
  • the tongue members 200a are positioned along at least one wall of the base 160a/ground member 160b and may be spaced away from each adjacent tongue member 200a along the wall(s) by a slot 68f (e.g. vertical, longitudinal).
  • the slot 68f may increase in width from distal free end of the tongue towards the proximal end or upper edge of the ground member.
  • the slot may include an upper slot portion larger than a lower slot portion.
  • the tongue members may be interior to the outer peripheral walls 68a and mate/engage with the one or more grooves 200b of the one or more rows Rl/opposing ends of the third and/or fourth plates 62c, 62d of the mating interface. Although not shown, the tongue members, or portions thereof, may be spaced inwardly away from the interior surface of the base walls 68a.
  • the plates 62c, 62b may contact one or more walls 68c (e.g. opposing walls, one wall, two walls, three walls, etc.) of the ground member 160b and/or adjacent plates/rows (e.g. 62c, 62b).
  • the plates 62c, 62d defining the one or more rows R1 of cavities 63 may engage the ground member 160b and/or base 160a by one or more latches.
  • the latch may be one or more tongue and groove engagements 200 between the plates 62 (e.g. third and fourth) and the ground member 160b and/or base 160a. It should be understood that a variety of engagements or latches may be used between the plates 62 and the ground member 160b.
  • the one or more opposing tongues 200a of the base/ground member engage or are received by the opposing grooves 200b or ends of the one or more rows R1 of cavities 63 defined by the third and fourth plates, and/or positions the third plates 62d of adjacent rows R1 in contact with each other when assembled.
  • the tongues 200a and/or grooves 200b adjacent opposing walls of the ground member 160b may be adjacent the opposing ends of the internal panel 82b, if used.
  • the ends of the third plates 62c or groove 200b (e.g. a portion of the row Rl) may extend between the tongue 200a, or portions thereof (e.g. slots 681), and/or the base wall 68a to slidiable engage the tongue and groove engagement therebetween.
  • a latch locking mechanism 300 may be used in some embodiments to axially lock the tongue and groove engagement 200 or mating interface portions therebetween.
  • latch locking mechanism 300 may be a releasable engagement between the ground member 160b and the plates 62 (e.g. 62c, 62d) and/or row(s) Rl.
  • one or more third plates 62c may include one or more protrusions 300a adjacent to and projecting outwardly from the opposing ends of the one or more rows R1 that releasably mate with one or more protrusions 300b extending away from or laterally from adjacent tongues 200a into the slot 68f therebetween.
  • the protrusion(s) 300b may narrow a portion of the slot 68f between adjacent tongues 200a.
  • the latch locking mechanism 300 e.g. protrusions 300a, 300b, openings, etc.
  • the latch locking mechanism 300 may engage upon axial engagement/traveling (e.g. sliding) for a distance when engaging the tongue and groove engagements 200.
  • axial engagement/traveling e.g. sliding
  • relative sliding therebetween of the tongue and groove engagement results in engagement (e.g. axial) of the one or more protrusions 300a of the row of cavities/plates of the mating interface containing the cable connectors 40 with the one or more protrusions 300b of the ground member and/or base of the mating interface.
  • the clip(s) 82a when the mating interface 160 is assembled to the plug connector 170, the clip(s) 82a, if used, may extend upwardly between the internal panel 82b and the adjacent third plate 62c of the row(s) R1 of cavities/connectors on one or both sides of the internal panel. If two clips 82a are used as shown in the one embodiment, the clips may extend along or mate with opposing sides of the internal panel 82b of the base 160a.
  • the electrical connector 30 and/or cable connector 40 may include the shielding (e g. 60, 160) of the differential signal pairs while the plug connector 70, 170 does not provide shielding of the differential signal pairs.
  • the plug connector 70, 170 is devoid of its own, separate circumferential shielding or egg-crate shielding (e.g. crosstalk). Only the electrical connector 30 and/or cable connector 40 includes the circumferential, egg-crate shielding (e.g. crosstalk) or mating interface 60, 160 of the differential signal pairs.
  • the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and/or plug connector 70, 170 may include one or more locking mechanisms 182, or portions thereof, coupling the mating interface 160 with the plug connector 170 (e.g. housing, substrate).
  • the locking mechanism 182 may be an external locking mechanism positioned within the outer periphery (e.g. outer housing, walls) of the electrical connector 30/connector 170/mating interface 160.
  • the locking mechanism 182 may include one or more latches or clips 182a (e.g. external). The one or more clips 182a are shown external to the plug connector 170, mating interface 160, and/or electrical connector 30 (e g.
  • the clips 182a are shown external to the electrical/plug connector 30, 170 and/or mating interface 160, it should be understood that internal clips (e.g. positioned on the outer periphery, wall) may be used in combination with the external clip(s)/locking mechanism in some embodiments.
  • the one or more clips 182a project downwardly from the bottom of the mating interface 160 or be included in the housing 1 8 of the electrical connector 30.
  • the clips 182a may project downwardly from one or more exterior walls 168a (e.g. opposing) to releasably engage the plug connector 170 (e.g. housing 178, exterior wall 178a, receptacle 179).
  • One or more receptacles 170 within the housing 178 and/or exterior wall 178a of the plug connector 170 may releasably receive the one or more clips 182a.
  • the receptacle 179 may project from or engage the die package substrate 50 (e.g. 50a, 50b).
  • two spaced apart clips 182a may be spring loaded in a transverse direction (e.g. opposing directions, inwardly towards the connector) to the plane of the clips 182a.
  • the clips 182a may include one or more protrusions 182b releasably engaging one or more apertures 179a of the receptacle 179 or housing 178. It should be understood that the clips 182a and the receptacle 179 may be reversed and still be within the scope of the invention.
  • the plug connector 170 e.g. housing
  • the circuit substrate 50 may include one or more stiffeners 180.
  • the stiffeners 180 may support one or more portions of the plug connector 70, 170.
  • the one or more stiffeners 180 may attach to the board side of the circuit substrate 50 and/or engage one or more portions of the housing 178 (e.g. bottom 178b, exterior wall 178a).
  • One stiffener may engage three exterior walls 178a in some embodiments as shown, or a single exterior wall or the entire periphery of the exterior wall in some embodiments.
  • the embodiment shown includes two opposing stiffeners.
  • the stiffener may include one or more upwardly projection members/tabs 181 engaging the housing 178 (e.g. walls).
  • the tabs 181 may include one or more posts 181a received within receptacles 177 of the housing 178 and/or one or more posts 181b having an aperture 181 ba receiving a biased tab 178c of the housing 178.
  • the stiffener may support an outer periphery or edge of the bottom/substrate wall 178b or housing 178 in some embodiments.
  • the stiffener, or portions thereof, may be made of an electrically conductive material, electrically non-conductive material, or both. In some embodiments, the stiffener may be stainless steel. It should be understood that the stiffener may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention.
  • the assembly 20, cable connectors 40, and/or mating interface 60, 160 may include one or more retention members 190.
  • the one or more retention members 190 may align or retain the engagement (e.g. conductive, non-conductive) between one or more portions of the mating interface 160.
  • the retention member 190 may retain and/or align (e.g. horizontally, vertically) the plates 62, cavities 63, egg-crate shielding, or mating interface, or portions thereof, therebetween in some embodiments.
  • the retention member 190 may retain and/or align (e.g. horizontally, vertically) the egg-crate shielding, cavities 63, plates 62 with the housing 168 in some embodiments. In the one embodiment shown in Figs.
  • the retention member 190 may be a one or more elongated members or bars 191 (e.g. horizontal) engaging one or more elongated slots/apertures 192 of the housing 168 (e.g. wall(s)) and/or one or more slots/apertures 193 of the plates 62/cavities 63/egg-crate shielding.
  • the retention member, or portions thereof, may be made of an electrically conductive material, electrically non-conductive material, or both. It should be understood that the retention member/mechanism may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention.
  • one or more ends 65 of one or more plates 62 may electrically contact an electrically conductive outer shield element 43 of the cable connector 40.
  • the mating end 65 of one or more of the third plates 62c and/or second plates 62d may include a plurality of curved edges to mate or contour with the one or more cables 90 or cable connector 40 (e.g. outer shield element 43).
  • the mating end 65 may be in direct contact with the outer shield element 43 in some embodiments.
  • the mating end 65 of one or more of the third plates 62c may include a plurality of flat edges to mate or contour with the one or more cables 90 or cable connector 40 (e.g.
  • the mating interface 160 and/or connector 30 may include an epoxy 65a at one or more conductive engagements.
  • an epoxy 65a e.g. conductive
  • an epoxy 65a may be used between the planar shaped mating end 65 or one or more portions of the plate(s) 62 (e.g. mating end) and the outer shield element 43.
  • Figs. 30 and 31 illustrate the differential FD Next Power Sum and the differential FD FEXT Power Sum for one embodiment of the electrical connector shown in Figs. 26-29.
  • the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -50dB of NEXT (near end crosstalk).
  • the simulation embodiment shown in Fig. 30 is the total power sum, industry standard summation of all noise sources.
  • the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -30dB of FEXT (far end crosstalk).
  • the simulation embodiment shown in Fig. 31 is the total power sum, industry standard summation of all noise sources.
  • the assembly/connector 20, 30, or portions thereof may include at least 257 differential pairs per square inch, at least 256-264 differential pairs per square inch, at least 139- 263 differential pairs per square inch, at least 138-145 differential pairs per square inch, and/or at least 88 to 137 differential pairs per square inch.
  • the assembly/connector 20, 30, or portions thereof may include at least 257 single ended pins per square inch, at least 256-264 single ended pins per square inch, at least 139-263 single ended pins per square inch, at least 138-145 single ended pins per square inch, and/or at least 88-137 single ended pins per square inch
  • the assembly/connector 20, 30, or portions thereof may include at least 127 differential pairs per linear inch, at least 128 differential pairs per linear inch, and/or at least 129 pairs per linear inch.
  • the assembly/connector 20, 30, or portions thereof may include conductors of approximately 30, 31, 32, 33, 34, 35, and/or 36 AWG.
  • One range of the conductors may be, but is not limited to, about 30 to about 36 AWG, about 30 to about 34 AWG, and about 32 to about 36 AWG. Approximately 33 AWG and/or approximately 34 AWG are also contemplated.
  • the assembly/connector 20, 30, or portions thereof may include approximately
  • the assembly/connector 20, 30, or portions thereof may include over approximately 55dB of IL to XT separation at approximately 25GHz.
  • the assembly/connector 20, 30, or portions thereof may include over approximately 40dB of IL to XT separation at approximately 60GHz.
  • the assembly/connector 20, 30, or portions thereof may include 60GHz of bandwidth.
  • the assembly/connector 20, 30, or portions thereof may include skewless, edge- coupled connectors (fully symmetrical paths in connector).
  • the assembly/connector 20, 30, or portions thereof may include cable, mezzanine, and/or card edge connectors.
  • the assembly/connector 20, 30, or portions thereof may include a single track routing in the die package substrate.
  • the assembly/connector 20, 30, or portions thereof may include a SMT/BGA/surface mount.
  • a through hole mounting may be used.
  • Plug connector and cable connector can be separable from each other, such as repeatedly separable and reconnectable.
  • the plug connector can be a vertical connector earned by a major surface of a die package substrate.
  • the vertical connector can be configured to receive the cable connector in a direction perpendicular to the major surface of a die package substrate.
  • the ASIC may be devoid of screw hole(s) and/or through hole(s).
  • the one or more connectors may carry at least 64 differential signal pairs per connector.
  • One example is eight rows of electrical conductors with eight differential signal pairs per row. Other examples are four rows of electrical conductors or six rows of electrical conductors.
  • the four-row embodiment can also have eight differential signal pairs per row.
  • the six-row embodiment can also have eight differential signal pairs per row.
  • a two-row embodiment can also have eight differential signal pairs per row. All embodiments can also have more than eight differential signal pairs per row or less eight differential but at least one signal pairs per row.
  • differential signal pair density can be approximately 320 differential signal pairs, approximately 640 differential signal pairs, approximately 960 differential signal pairs, approximately 1280 differential signal pairs, or more than one differential signal pair and at least approximately 840 differential signal pairs, or more than one differential signal pair and at least approximately 769 differential signal pairs, or some other number of differential signal pairs Stated another way, at least twenty-eight row, eight differential signal pairs per row connectors can fit around the periphery of approximately 90 mm by approximately 90 mm die package substate.
  • At least thirteen, at least fourteen, at least fifteen, at least sixteen, at least seventeen, at least eighteen, and/or at least nineteen eight row, eight differential signal pairs per row can fit around the periphery of approximately 90 mm by approximately 90 mm die package substrate.
  • a die or keep out region of any die package substrate can be approximately 40 mm by approximately 40 mm.
  • at least four or at least five electrical connectors, each with at least eight rows of at least eight differential signal pairs per row can fit along one side of an approximate 90 mm by approximately 90 mm die package substrate.
  • Each electrical connector having eight rows of eight differential signal pairs can have a mating footprint of approximately 13 mm by approximately 13 mm, approximately 13.7 mm by approximately 13.7 mm, approximately 14 mm by approximately 14 mm, approximately 15 mm by approximately 15 mm, etc.
  • an electrical connector may be sized and shaped such that a plurality of the electrical connectors fit on a single side of die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk).
  • an electrical connector may be sized and shaped such that a plurality of the electrical connectors fit on a single side of die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit approximately 224Gbs Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -50dB of NEXT (near end crosstalk).
  • the plurality of electrical connectors may transmit signals at approximately 60GHz with no more than approximately -45 dB of FEXT. In various embodiments, the plurality of electrical connectors may transmit signals at approximately 50GHz with no more than approximately -45dB of NEXT. In some embodiments, each electrical connector in the plurality of electrical connectors may comprise an egg-crate mating interface. In various embodiments, the electrical connector may be configured to mate with a cable connector.
  • an electrical connector may include a mating interface having a plurality of interconnected plates defining a plurality of cavities therein.
  • the connector may include a plurality of cable connectors mated within the plurality of cavities.
  • each plate of the plurality of plates may include a plurality of slots aligned with a plurality of grooves.
  • the plurality of plates may define a circumference of a first cavity of the plurality of cavities without any gaps therein.
  • the plurality of plates may define a row of cavities without any of the plurality of cable connectors.
  • the plurality of plates may extend for about 90 percent of the length of the cable connector to a substrate.
  • the electrical connector may include a substrate and a ground contact element positioning the plurality of plates at a distance from the substrate.
  • the electrical connector may include a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, a plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and/or the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk) or with no more than approximately -50dB of NEXT (near end crosstalk).
  • the plurality of electrical connectors may transmit signals at approximately 60GHz with no more than approximately -45 dB of FEXT.
  • the plurality' of electrical connectors may transmit signals at approximately 50GHz with no more than approximately -45dB of NEXT.
  • an electrical connector configured to be attached to a die package may include at least a density of 256 differential pairs per square inch.
  • the electrical connector may transmit approximately 224Gbps Pam4 signals with no more than approximately -40dB of crosstalk. In some embodiments, the connector may transmit at approximately 56GHz to approximately 70GHz of bandwidth.
  • an electrical connector may include a mating interface.
  • the connector may include a plug connector having at least one ground contact element configured to mate with the mating interface.
  • the ground contact element may include at least one arm mating with the mating interface. In various embodiments, the ground contact element may include at least two arms mating with the mating interface. In some embodiments, the ground contact element may include at least three arms mating with the mating interface. In various embodiments, the ground contact element may include at least four arms mating with the mating interface. In some embodiments, the ground contact element comprises four or more arms mating with the mating interface. In various embodiments, the ground contact element may include at least one solder mass. In some embodiments, the ground contact element may include at least two solder masses immediately adj cent to each other. In various embodiments, the ground contact element comprises at least three solder masses immediately adjacent to each other.
  • an electrical connector may include at least one of a mating interface, a plug connector, and/or a cable connector.
  • the connector may include a 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.
  • the connector may include at least one of FEXT and/or insertion loss.
  • the FEXT may be under or equal to -30dB.
  • the connector may include at least one of FEXT and/or insertion loss.
  • the FEXT may be under or equal to -35dB. In various embodiments, the FEXT may be under or equal to -40dB. In some embodiments, the FEXT may be under or equal to -45dB. In various embodiments, the insertion loss may be between OdB and -IdB. In some embodiments, the insertion loss may be between -IdB and -2dB. In various embodiments, the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and -4dB. In various embodiments, the insertion loss may be between -4dB and -5dB. In some embodiments, the connectors may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and/or 80 GHz.
  • the electrical connector may include at least one of NEXT and/or insertion loss.
  • the NEXT may be under or equal to -40dB.
  • the NEXT may be under or equal to -45dB.
  • the NEXT may be under or equal to -50dB.
  • the NEXT may be under or equal to - 55dB.
  • the NEXT may be under or equal to -60dB.
  • the insertion loss may be between OdB and - IdB. In various embodiments, the insertion loss may be between -IdB and -2dB.
  • the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and - 4dB. In various embodiments, the insertion loss may be between -4dB and -5dB In some embodiments, the connectors may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, and/or 70 GHz.
  • an electncal connector may include an outer periphery.
  • the connector may include a locking mechanism positioned within the outer periphery of the electrical connector.
  • the electncal connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned within an outer periphery of at least one of the mating interface and/or the plug connector.
  • the locking mechanism may include at least one clip.
  • the locking mechanism may include at least two clips.
  • the locking mechanism may include at least one notch.
  • the locking mechanism may include at least two notches.
  • the locking mechanism may be positioned within at least one gap between adj acent rows of cavities.
  • the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be positioned between adjacent cable connectors of the plurality of cable connectors.
  • the electrical connector may include a plurality of cavities, wherein the locking mechanism may be positioned between adjacent cavities of the plurality of cavities. In some embodiments, the locking mechanism may be spaced internally away from one or more walls of the outer periphery of the electrical connector. In various embodiments, the connector may be configured to be attached to a die package having at least a density of 256 differential pairs per square inch.
  • an electrical connector may include a plurality of differential signal pairs.
  • the electrical connector may include a plurality of ground contact elements, each configured to receive a respective portion of an egg-crate shield of a mating connector, wherein the electrical connector is devoid of egg-crate crosstalk shielding, is sized and shaped such that a plurality of electrical connectors each respectively fit on a single side of a die package substrate with sides no larger than approximately 75-96mm each, including approximately 80mm ⁇ 5mm and 91mm ⁇ 5mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224Gbits/sec PAM-4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT.
  • the electrical connector further includes a first housing that carries the differential signal pairs and at least two or more of the plurality of ground contacts each define at least two laterally offset, cantilevered beams, wherein each of the at least two laterally offset, cantilevered beams has a respective free end.
  • the differential signal pairs are surface mounted to the die package substrate.
  • the differential signal pairs may each comprise first and second stamped and formed electrical conductors.
  • the electrical connector may further include electrically conductive or electrically non-conductive, magnetic absorbing material or electrically lossy material.
  • the plurality of differential signal pairs are electrically connected, physically connected, or both to corresponding, respective pads on the die package substrate.
  • an electrical connector may include a mating interface having a housing and a plurality of plates defining a plurality of cavities in the housing.
  • the electrical connector may include at least one retention member retaining at least one of the plurality of plates therebetween and/or the plurality of plates with the housing.
  • At least one retention member may retain the plurality of plates therebetween. In various embodiments, at least one retention member may retain the plurality of plates with the housing. In some embodiments, at least one retention member may retain both the plurality of plates therebetween and the plurality of plates with the housing. In various embodiments, at least one retention member may be an elongated member engaging one or more slots. In some embodiments, at least one retention member may be electrically conductive or electrically non-conductive.
  • an electrical connector may include an outer periphery.
  • the electrical connector may include a locking mechanism positioned in the outer periphery of the electrical connector.
  • the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned in an outer periphery of at least one of the mating interface and/or the plug connector.
  • the locking mechanism may include at least one clip.
  • the locking mechanism may include at least two clips.
  • the locking mechanism may include at least one receptacle releasably engaging at least one clip.
  • the electrical connector may include another locking mechanism positioned within the outer periphery.
  • an electrical connector may include a plug connector having a housing.
  • the electrical connector may include at least one stiffener coupled to the housing.
  • At least one stiffener may be attached to a board side of a die package substrate.
  • the electrical connector may include at least two of the stiffeners spaced from each other in a horizontal plane.
  • at least one stiffener may be electrically conductive or electrically non-conductive.
  • at least one stiffener may include at least one projecting tab.
  • an electrical connector may comprise a means for getting at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000, and/or at least 1024 differential signal pairs off one side of an approximately 75mm through approximately 95mm die package substrate that has at least approximately 40mm square keep out region.
  • an electrical connector may comprise a means for getting at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000, and/or at least 1024 differential signal pairs off one side of a 75mm through 95mm die package substrate.
  • an electrical connector may comprise a means for getting at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000, and/or at least 1024 differential signal pairs off one side of any size die package substrate disclosed herein that has at least approximately 40mm square keep out region.
  • an electrical connector may comprise a means for getting at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000, and/or at least 1024 differential signal pairs off one side of any size die package substrate disclosed herein.
  • a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.
  • At least one of A and B can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

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Abstract

L'invention concerne un appareil et un procédé pour un connecteur électrique. Le connecteur électrique peut comprendre un connecteur enfichable. Le connecteur électrique peut comprendre une interface d'accouplement. L'interface d'accouplement peut comprendre une pluralité de plaques. Le connecteur électrique peut comprendre un substrat. Le connecteur électrique peut comprendre un connecteur de câble. Le connecteur électrique peut avoir une densité d'au moins 213 paires différentielles par pouce carré, notamment 256 paires différentielles par pouce carré. Le connecteur électrique peut comprendre au moins un mécanisme de verrouillage interne et/ou externe.
PCT/US2023/031924 2022-09-02 2023-09-01 Appareil et procédé pour un connecteur électrique WO2024050137A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US202263403561P 2022-09-02 2022-09-02
US63/403,561 2022-09-02
US202363481702P 2023-01-26 2023-01-26
US63/481,702 2023-01-26
US202363511451P 2023-06-30 2023-06-30
US63/511,451 2023-06-30

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090233480A1 (en) * 2006-01-31 2009-09-17 3M Innovative Properties Company Electrical connector assembly
US20100291806A1 (en) * 2006-12-19 2010-11-18 Minich Steven E Shieldless, High-Speed, Low-Cross-Talk Electrical Connector
US20190245288A1 (en) * 2015-01-11 2019-08-08 Molex, Llc Wire to board connectors suitable for use in bypass routing assemblies
US20210329775A1 (en) * 2016-03-08 2021-10-21 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US20220140514A1 (en) * 2020-11-02 2022-05-05 Samtec, Inc. Flex Circuit And Electrical Communication Assemblies Related To Same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090233480A1 (en) * 2006-01-31 2009-09-17 3M Innovative Properties Company Electrical connector assembly
US20100291806A1 (en) * 2006-12-19 2010-11-18 Minich Steven E Shieldless, High-Speed, Low-Cross-Talk Electrical Connector
US20190245288A1 (en) * 2015-01-11 2019-08-08 Molex, Llc Wire to board connectors suitable for use in bypass routing assemblies
US20210329775A1 (en) * 2016-03-08 2021-10-21 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US20220140514A1 (en) * 2020-11-02 2022-05-05 Samtec, Inc. Flex Circuit And Electrical Communication Assemblies Related To Same

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