WO2024049124A1

WO2024049124A1 - Capacitor module and inverter module

Info

Publication number: WO2024049124A1
Application number: PCT/KR2023/012678
Authority: WO
Inventors: 박성준; 정태복
Original assignee: 엘지이노텍 주식회사
Priority date: 2022-08-30
Filing date: 2023-08-25
Publication date: 2024-03-07
Also published as: KR20240030454A

Abstract

A capacitor module according to an embodiment of the present invention comprises: a housing including an accommodation groove in which a capacitor is disposed; a substrate disposed above the accommodation groove; and at least one capacitor mounted to the one surface and accommodated in the accommodation groove.

Description

Capacitor module and inverter module

The present invention relates to a capacitor module and an inverter module including the same, and more specifically, to a capacitor module that forms a link capacitor as a separate module and an inverter module including the same.

Solar power generation is an eco-friendly energy generation method that is becoming widely used, replacing existing chemical or nuclear power generation. There are two types of solar power generation: stand-alone, where a battery is connected to a converter, and connected, which is connected to the power system. In general, stand-alone power generation consists of solar cells, storage batteries, power conversion devices, etc., and power grid-connected systems are connected to commercial power sources. It is configured to allow mutual exchange of power with the load system line.

The power generated by solar panels is difficult to use directly in homes or buildings, so it is converted into usable power through a power conversion device such as an inverter.

In the inverter, the link capacitor component is large in size and has a large mounting quantity, so it takes up a large area on the PCB, which leads to a shortage of PCB mounting space, and there is a problem that the product size increases as the PCB size increases. In addition, there is a problem that the mounting space for PCBs stacked in two layers on the main PCB is insufficient, and there are restrictions on the shape of the stacked PCBs, resulting in restrictions on the mounting location of connectors between the stacked PCBs and the main PCB.

The technical problem to be solved by the present invention is to provide a capacitor module that forms a link capacitor as a separate module and an inverter module including the same.

In order to solve the above technical problem, a capacitor module according to an embodiment of the present invention includes a housing including a receiving groove in which a capacitor is disposed; A substrate disposed above the receiving groove; and at least one capacitor mounted on one surface of the substrate and accommodated in the receiving groove.

Additionally, a plurality of first connectors electrically connected to the capacitor may be disposed on the other side of the substrate.

Additionally, the capacitor may include a link capacitor.

Additionally, it may include a plurality of heat dissipation fins extending from the outer surface of the receiving groove.

Additionally, the receiving groove includes a base; first and second side walls extending from the base and facing each other; And it may include a third side wall and a fourth side wall that are perpendicular to the first side wall and the second side wall and face each other.

Additionally, the receiving groove includes: a first receiving groove in which the capacitor is accommodated; and an inductor disposed therein, including a second receiving groove spaced apart from the first receiving groove, electrically connected to one surface of the substrate, and at least one inductor received in the second receiving groove. there is.

Additionally, the second receiving groove includes a base; and a fifth side wall extending from the base and having a circular shape.

Additionally, the inductor may include two inductors, and the two inductors may be stacked in two layers in the depth direction of the second receiving groove and connected to one surface of the substrate with a wire.

Additionally, a plurality of second connectors electrically connected to the inductor may be disposed on the other side of the substrate.

Additionally, a capacitor or an inductor may be accommodated and molded in the receiving groove.

In order to solve the above technical problem, an inverter module according to an embodiment of the present invention includes a first housing including a base including a first hole and a main board disposed therein; a cover covering the first housing; a heat dissipation plate coupled to the first housing in response to the first hole and including a plurality of heat dissipation fins extending in an outward direction; and a capacitor module disposed on a portion of an outer surface of the heat sink, the capacitor module comprising: a second housing including a receiving groove in which a capacitor is disposed; a first substrate disposed above the receiving groove; and at least one capacitor mounted on one surface of the first substrate and accommodated in the receiving groove.

Additionally, a plurality of first connectors electrically connected to the capacitor are disposed on the other surface of the first substrate, and the heat sink may include a through hole in an area corresponding to the plurality of first connectors.

Additionally, the plurality of first connectors may pass through the through hole and be connected to the main board.

Additionally, the first connector may include at least one of an SMD spacer, a wire connector, and a bus bar terminal block.

Additionally, the main substrate may include a first main substrate and a second main substrate that is stacked and spaced apart from the first main substrate.

Additionally, the receiving groove of the capacitor module includes: a first receiving groove in which the capacitor is accommodated; and an inductor disposed therein, including a second receiving groove spaced apart from the first receiving groove, electrically connected to one surface of the substrate, and including at least one first inductor accommodated in the second receiving groove. can do.

In addition, the first inductor includes two first inductors, and the two first inductors are stacked in two layers in the depth direction of the second receiving groove, and may be connected to one surface of the first substrate with a wire. .

In addition, it includes an inductor module disposed in another portion of the outer surface of the heat sink, wherein the inductor module includes a third housing including a third receiving groove in which the second inductor is disposed; And it may include at least one second inductor accommodated in the third receiving groove.

According to embodiments of the present invention, it is possible to minimize the product size by securing the main PCB mounting area as much as possible. Additionally, efficient heat dissipation is possible by placing the link capacitor externally as a separate module. Furthermore, by separating and fastening it into a separate module, the weight of the link capacitor can be stably supported.

1 is a perspective view of a capacitor module according to an embodiment of the present invention.

Figure 2 is an exploded perspective view of a capacitor module according to an embodiment of the present invention.

3 to 5 are diagrams for explaining each configuration of a capacitor module according to an embodiment of the present invention.

Figure 6 is a perspective view of an inverter module according to an embodiment of the present invention.

Figure 7 is a cross-sectional view of an inverter module according to an embodiment of the present invention.

8 to 16 are diagrams for explaining each configuration of an inverter module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining or replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as “at least one (or more than one) of A and B and C”, it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and are not limited to the essence, order, or order of the component.

And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, that component is directly 'connected', 'coupled', or 'connected' to that other component. In addition to cases, it may also include cases where the component is 'connected', 'coupled', or 'connected' by another component between that component and that other component.

Additionally, when described as being formed or disposed “on top” or “bottom” of each component, “top” or “bottom” means that the two components are directly adjacent to each other. This includes not only the case of contact, but also the case where one or more other components are formed or disposed between the two components. In addition, when expressed as “top” or “bottom,” the meaning of not only the upward direction but also the downward direction can be included based on one component.

1 is a perspective view of a capacitor module according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of a capacitor module according to an embodiment of the present invention, and FIGS. 3 to 5 are diagrams of a capacitor module according to an embodiment of the present invention. This is a drawing to explain each configuration. Figure 6 is a perspective view of an inverter module according to an embodiment of the present invention, Figure 7 is a cross-sectional view of the inverter module according to an embodiment of the present invention, and Figures 8 to 16 are angle views of the inverter module according to an embodiment of the present invention. This is a drawing to explain the configuration.

The capacitor module 100 according to an embodiment of the present invention is composed of a housing 110, a substrate 120, and a capacitor 130.

The housing 110 includes a receiving groove in which the capacitor 130 is disposed, the substrate 120 is disposed on the upper part of the receiving groove, and the capacitor 130 is mounted on one surface of the substrate 120. Accepted into a receiving home.

The housing 110 includes a receiving groove in which at least one capacitor 130 is disposed. The receiving home inverter module 200 may be formed in a shape corresponding to the shape of the capacitor 130 so as to accommodate the capacitor 130 disposed therein. The receiving groove may be composed of a base on which the inductor is placed and a side wall that forms an internal space. The internal space of the receiving groove may be hexahedral, cylindrical, or polygonal. The receiving groove may include a base, first and second side walls extending from the base and facing each other, and third and fourth side walls facing each other and perpendicular to the first and second side walls. A hexahedral shape can be formed through the base and four side walls. It is natural that the shape of the receiving groove can be formed in various shapes depending on the shape or size of the part accommodated therein.

A capacitor 130 or an inductor 140 may be accommodated in the receiving groove. The receiving groove may include a first receiving groove 111 in which the capacitor 130 is placed and a second receiving groove 112 in which the inductor 140 is placed.

The first receiving groove 111 and the second receiving groove 112 may have different areas or shapes. A capacitor 130 may be accommodated in the first receiving groove, and an inductor 140 may be accommodated in the second receiving groove 112. Alternatively, components mounted together with the inductor 140 may be accommodated. The size of the first receiving groove 111 may be larger than the second receiving groove 112. The first receiving groove 111 and the second receiving groove 112 may have different lengths in directions perpendicular to the first direction and the second direction. A partition is formed between the first receiving groove 111 and the second receiving groove 112 so that they can be independently separated from each other. It is possible to prevent them from being electrically connected to each other, and also to prevent the heat generated from each of them from affecting each other.

As described above, the first receiving groove 111 includes a base corresponding to the capacitor 130 to be accommodated, a first side wall and a second side wall extending from the base and facing each other, and the first side wall and the second side wall. It may include a third side wall and a fourth side wall that are perpendicular to and face each other.

The capacitor 130 may include a link capacitor. The link capacitor is a capacitor connected to DC-Link and is a capacitor to stabilize the voltage of DC-Link by eliminating or minimizing noise. The capacitor 130 may have a rectangular parallelepiped shape, and a plurality of capacitors may be connected in parallel to form the required capacitor capacity. Alternatively, it is natural that they can be connected in series or in parallel. The capacitor 130 has a large component size and a large mounting quantity, so the size of the device containing it can be minimized by forming the capacitor 130 as a separate module, and the space where the capacitor 130 is mounted can be utilized. there is.

The capacitor 130 is disposed inside the first receiving groove 111. The capacitor 130 may include at least one capacitor or a plurality of capacitors. For example, if the capacitor module 100 is a capacitor module applied to a three-phase inverter module, it may include four capacitors, and the four capacitors may be arranged in line and placed in the first receiving groove 111. there is. In the case of a single-phase inverter module, it may contain 10 or more capacitors.

The capacitor 130 may be mounted on one side of the substrate 120. 2 and 4, the capacitor 130 may be mounted on one side of the substrate 120 opposite the housing 110. At this time, a plurality of holes are formed in the substrate 120, a plurality of connection pins are formed in the capacitor 130, and the connection pins are soldered through the plurality of holes formed in the substrate 120 to form the substrate 120. It can be mounted on one side of . The capacitor 130 is electrically connected to the substrate 120, and a plurality of first connectors electrically connected to the capacitor 130 may be disposed on the other side of the substrate 120. The connection pin of the capacitor 130 and the first connector may be electrically connected through the board 120.

The second receiving groove 112 may include a base, a fifth side wall extending from the base, and having a circular shape, corresponding to the inductor 140 being received. Alternatively, it may include a base and first to fourth side walls, corresponding to the first receiving groove. This may vary depending on the shape of the inductor 140 and the arrangement direction of the inductor 140 when a plurality of inductors 140 are included.

The inductor 140 includes two

inductors

141 and 142, and the two inductors may be stacked in two layers in the depth direction of the second receiving groove. At this time, the two

inductors

141 and 142 may be stacked and insulated from each other. To be placed in the capacitor module 100 together with the capacitor 130, the inductor 140 may be stacked. The size of the capacitor 130 is larger than the inductor 140, and when placed in line with the capacitor 130, there may be insufficient space to place the inductor 140. To solve this problem, the inductor 140 can be stacked in the depth direction of the second receiving groove 112 perpendicular to the arrangement direction of the capacitor 130, and through this, space can be utilized efficiently.

The inductor 140 is formed by winding a coil in a circular shape, and may be formed by being wrapped around a bobbin that includes a hole therein. At this time, the inductor 140 may be connected to one surface of the substrate 120 through a wire led out into the hole. A plurality of second connectors electrically connected to the inductor 140 may be disposed on the other side of the substrate 120. The wire of the ductor inverter module 200 and the second connector may be electrically connected through the board 120.

The inductor 140 is an element formed of a coil. The inductor is relatively large in size compared to other elements, and generates more heat than other elements when performing power conversion. The inductor 140 may be an inductor 140 that constitutes a DC-DC converter. The inductor 140 may be disposed in the second receiving groove 112. The inductor 140 generates a lot of heat, and the heat generated from the inductor 140 may affect not only the inductor itself but also other elements affected by heat, which may result in deterioration of the power conversion function or failure, etc. This can happen. Therefore, it is necessary to dissipate heat by dissipating heat from the inductor 140 to the outside.

In order to dissipate heat from the capacitor 130 and the inductor 140, the capacitor 130 may be mounted and molded in the first receiving groove 111, and the inductor 140 may be accommodated and molded in the second receiving groove 112. there is. After the capacitor 130 and the inductor 140 are placed in the receiving groove, molding is performed to increase thermal conductivity. Molding is a process of filling and solidifying a liquid material in a frame of a predetermined shape. The heat generated from the capacitor 130 or the inductor 140 is transferred to the housing 110 along the molded material, and the housing ( 110), the heat dissipation effect can be increased by being released to the outside. In addition, the inductor 140 is placed in the second receiving groove 112 and fixed through molding, so the inductor can be fixed inside the housing 110 without a separate coupling member for fixing the inductor 140. .

The outside of the housing 110 may include a plurality of heat dissipation fin inverter modules 200 extending from the outer surface of the receiving groove. Heat dissipation fin The inverter module 200 may include first to third heat dissipation fins extending from the housing 110 . The first heat dissipation fin extends in a first direction downward from the base of the housing 110, the second heat dissipation fin extends in a second direction perpendicular to the first direction, and the third heat dissipation fin is perpendicular to the first direction. It may extend in the opposite direction of the second direction.

The first heat dissipation fin extends from the base of the housing 110 in a first downward direction. Here, the first direction may be the downward direction of the housing 110. It may extend in a first direction from the rear surface, which is the outer surface of the base. Heat generated from the capacitor 130 or the inductor 140 may be conducted along the extension direction of the first heat dissipation fin and discharged to the outside. The first heat dissipation fin extends from the outer surface of the base in the first direction, and extends from the outer surface of the first side wall in a third direction perpendicular to the first direction and the second direction, and may be formed integrally. The first heat dissipation fin may not extend only in the first direction toward the bottom of the base, but may extend in three directions. As shown in FIG. 3, it may not only extend from the outer surface of the base in a first direction, but may also extend from the outer surface of the first side wall in a third direction perpendicular to the first direction and the second direction. Alternatively, it may extend in only one of the first direction or the third direction. Heat generated from the capacitor or inductor 140 is not only emitted in the first direction, but is also emitted in the third direction or in a direction opposite to the third direction, thereby increasing the heat dissipation effect.

The first heat dissipation fin may include a plurality of heat dissipation fins spaced apart at predetermined intervals in the second direction. The direction in which the first heat dissipation fin is disposed may vary depending on the heat conduction direction. For example, the first heat dissipation fin may be formed to have a plate shape in a third direction and may include a plurality of heat dissipation fins spaced apart at a preset interval in the second direction. The spacing between adjacent heat dissipation fins may be set in consideration of heat dissipation efficiency. At this time, each heat dissipation fin is a heat sink, and may be formed as a thin plate with a structure for dissipating heat and spaced apart from each other.

The second heat dissipation fin may extend in a second direction perpendicular to the first direction, and the third heat dissipation fin may be perpendicular to the first direction and extend in an opposite direction to the second direction. The second heat dissipation fin may extend from the outer surface of the third side wall, and the third heat dissipation fin may extend from the outer surface of the fourth side wall. The second heat dissipation fin and the third heat dissipation fin may include a plurality of heat dissipation fins spaced apart at predetermined intervals in the first direction. The detailed description of the shape and spacing of the plurality of heat dissipation fins corresponds to the detailed description of the first heat dissipation fin. Each of the first heat dissipation fins, the second heat dissipation fin, and the third heat dissipation fin has a plate shape erected in the same third direction, and when coupled to the inverter module, the third direction becomes the up and down direction, so heat is transferred smoothly. It can be done.

Due to the extension of the first heat dissipation fin in the first direction, the third direction, and the direction opposite to the third direction, the second heat dissipation fin in the second direction, and the direction opposite to the second direction of the third heat dissipation fin, heat is transferred in five directions. This makes it possible to dissipate heat in five directions excluding the top surface that must be coupled to the inverter module 200, thereby increasing the effectiveness of heat dissipation.

The capacitor module 100 according to an embodiment of the present invention may be coupled to the inverter module 200. As shown in FIG. 6, the inverter module 200 according to an embodiment of the present invention includes a first housing 210, a cover 220, a heat sink 230, a

main board

241 and 242, and a capacitor module 100. It is composed of and may include an inductor module 250. The detailed description of the capacitor module 100 constituting the inverter module 200 corresponds to the detailed description of the capacitor module 100 of FIGS. 1 to 5, and redundant description will be omitted below.

The inverter module 200 may be a PV inverter module. A PV inverter module is a device that receives power from a PV panel or PV MLPE and converts it into power that can be used in a home or building. It receives DC power from a PV converter, converts it to AC power, and outputs it. At this time, DC power is transmitted to the inverter driver through a wire, the inverter driver converts the power, and the converted power can be transmitted to the load through the wire. In order to convert power, the inverter driver may include a power conversion element and a switching element or MCU that controls the same. The power conversion element may include passive elements such as inductors or capacitors, may include switching elements implemented with FETs or diodes, and may include an MCU that controls the switching elements. In addition, various elements for converting power may be included, or elements for implementing functions other than power conversion may be included.

The first housing 210 includes a base including a first hole, and a main board is disposed therein. The cover 220 may cover the first housing 210 . At this time, the first housing 210 may form an internal space and the cover 220 may cover it, or the cover 220 may form an internal space and cover the first housing 210. In addition, it can be formed in various forms to form the internal space.

Elements other than those disposed in the capacitor module 100 or the inductor module 250 may be disposed on the main board. The main board may include a printed circuit board (PCB). It is natural that various types of boards other than printed circuit boards may be included. The main substrate 241 may be formed as a single layer or a double layer. The main substrate may include a first main substrate 241 and a second main substrate 242 that is stacked and spaced apart from the first main substrate 241. As the capacity and functions of the inverter module 200 are diversified, a greater number of elements may be placed, or the main board may be formed as a multi-layer in the process of reducing the size of the inverter module 200. At this time, the capacitor 130, which has a large component size, may interfere with stacking the substrate, but it is possible to stack the main substrate by using a separate capacitor module 100 to place it outside the first housing 210 rather than inside it. Space can be secured.

The heat sink 230 is coupled to the first housing 210 in correspondence with the first hole of the first housing 210 and includes a plurality of heat dissipation fins extending in an outward direction. The main board 241 is disposed inside the first hole, and heat generated from the main board 241 is transferred to the heat sink 230 and discharged to the outside through a plurality of heat dissipation fins.

The capacitor module 100 is disposed in the lower part of the first housing 210, that is, in a partial area of the outer surface of the heat sink 230. The capacitor module 100 includes a second housing 110 including a receiving groove in which the capacitor 130 is disposed, a first substrate 120 disposed on the receiving groove, and one surface of the first substrate 120. It is mounted and includes at least one capacitor 130 accommodated in the receiving groove.

The receiving groove of the capacitor module 100 includes a first receiving groove 111 in which the capacitor 130 is accommodated, an inductor 140 disposed therein, and a second receiving groove spaced apart from the first receiving groove 111. It may include a receiving groove 112, be electrically connected to one surface of the substrate 120, and include at least one first inductor 140 accommodated in the second receiving groove.

At this time, the first inductor 140 includes two

first inductors

141 and 142, and the two

first inductors

141 and 142 are stacked in two layers in the depth direction of the second receiving groove, It may be connected to one side of the first substrate 120 with a wire.

The first substrate 120 may include a plurality of first connectors on the other side electrically connected to the capacitor 130 and a plurality of second connectors electrically connected to the

first inductors

141 and 142. .

At this time, the heat sink may include a through hole in an area corresponding to the first connector or the second connector, and the first connector or the second connector may pass through the through hole and be connected to the main board.

The capacitor module 100 includes a main board 241 and a separate first board 120, and the capacitor 130 or inductor 140 can be connected to the main board 241 through the first board 120. there is.

As shown in FIGS. 7 to 9 , the capacitor module 100 is disposed under a portion of the heat sink 230 and its position is fixed, but the capacitor module 100 is connected to the main board 241 through the first connector or the second connector of the first board 120. ), the connection position of the capacitor 130 or the inductor 140 with the main board 241 is not limited and can be changed to various positions. Through this, the degree of freedom in design can be increased in the arrangement of devices placed on the main board 241. In addition, by combining the capacitor module 100 on the outside of the heat sink 230, space within the housing can be secured, thereby securing sufficient space to implement the main board 241 as a multi-layer.

In addition, by separating the capacitor module 100 into a separate module and fastening it together, heat can be dissipated outside the housing, enabling efficient heat dissipation and stable support for the weight of the capacitor.

The inductor module 250 may be placed in another area of the outer surface of the heat sink 230. The inductor module 250 may be arranged to be spaced apart from the capacitor module 100, and by being spaced apart, heat generated from the capacitor module 100 may not affect each other. The inductor module 250 includes a third housing 251 including a third receiving groove in which the second inductor 252 is disposed, and at least one second inductor 252 accommodated in the third receiving groove. can do. The inductor module 250 may include an inverter side inductor, and the second inductor 252 disposed in the inductor module 250 is an inductor 140 disposed in the second receiving groove 112 of the capacitor module 100. It is a different inductor. At this time, the second inductor 252 includes a plurality of second inductors, and the plurality of second inductors 252 may be arranged in the inductor module 250 in a row rather than in a stack, as shown in FIG. 10 . The inductor module 250 may have a separate heat dissipation structure. Like the capacitor module 100, it may include first to third heat dissipation fins so that heat can be dissipated in three different directions. Efficient heat dissipation is possible by placing the second inductor 252 outside the first housing 210.

The capacitor module 100 or the inductor module 250 may be coupled to the heat sink 230 through a fastening portion, and the heat sink 230 may be coupled to the first housing 210 through a fastening portion. The capacitor module 100 or the inductor module 250 may be coupled to the heat sink 230 and the first housing 210 through a fastening part. At this time, bolt connection is possible. To this end, a coupling hole may be formed on the surface of the capacitor module 100 or the inductor module 250 in contact with the heat sink 230, and a coupling groove may be formed at a position of the heat sink 230 corresponding to the coupling hole. The coupling groove is not open for waterproofing, but is formed as a threaded groove, and can be coupled with a bolt inserted through the coupling hole of the inductor heat dissipation module inverter module 200. For waterproofing and dustproofing when combined, a sealing structure such as a sealing member may be formed.

As described above, the first substrate 120 of the capacitor module 100 is connected to the main substrate 241 and the heat sink 230 through a through hole. In this case, the first connector or the first connector of the capacitor module 100 2 The connector may include at least one of an SMD spacer, a wire connector, and a busbar terminal block.

11 and 12, the first connector or the second connector may be formed of an SMD spacer 151. The connection between the first board 120 and the main board 241 is supported by an SMD spacer 151 with an empty space formed inside, and a bus bar or harness penetrating the SMD spacer 151 is installed. You can connect through. When using the SMD spacer 151, a separate through hole 231 may not be formed.

Alternatively, as shown in FIGS. 13 and 14, the first connector or the second connector may be formed as a wire connector 152. The wire connector 152, which has a wire through-hole formed inside, passes through the through-hole 231 of the heat sink 230 to support the connection between the first board 120 and the main board 241, and the wire connector 152 It can be connected through a wire that passes through.

Alternatively, as shown in FIGS. 15 and 16, the first connector or the second connector may be formed as a bus bar terminal block 153. A bus bar terminal block 153 is placed on the main board 241 and the first board 120, respectively, passes through the through hole 231 of the heat sink 230 through the bus bar 153, and is fixed with a screw 155. By doing so, it can be connected through the bus bar 153.

In addition, the first substrate 120, which is a separate substrate, and the main substrate 241 can be connected in various ways.

As described above, the present invention has been described with specific details such as specific components and limited embodiments and drawings, but this is only provided to facilitate a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , those skilled in the art can make various modifications and variations from this description.

Accordingly, the spirit of the present invention should not be limited to the described embodiments, and the scope of the patent claims described below as well as all modifications that are equivalent or equivalent to the scope of this patent claim shall fall within the scope of the spirit of the present invention. .

Claims

A housing including a receiving groove in which a capacitor is disposed;

A substrate disposed above the receiving groove; and

A capacitor module mounted on one surface of the substrate and including at least one capacitor accommodated in the receiving groove.
According to paragraph 1,

A capacitor module in which a plurality of first connectors electrically connected to the capacitor are disposed on the other side of the substrate.
According to paragraph 1,

The capacitor is a capacitor module including a link capacitor.
According to paragraph 1,

A capacitor module including a plurality of heat dissipation fins extending from an outer surface of the receiving groove.
According to paragraph 1,

The receiving groove is,

Base;

first and second side walls extending from the base and facing each other; and

A capacitor module including a third side wall and a fourth side wall that are perpendicular to the first side wall and the second side wall and face each other.
According to paragraph 1,

The receiving groove is,

a first receiving groove in which the capacitor is accommodated; and

An inductor is disposed therein, and includes a second receiving groove spaced apart from the first receiving groove,

A capacitor module electrically connected to one surface of the substrate and including at least one inductor accommodated in the second receiving groove.
According to clause 6,

The second receiving groove is,

Base; and

A capacitor module extending from the base and including a fifth sidewall that is circular.
According to clause 6,

The inductor includes two inductors,

The two inductors are stacked in two layers in the depth direction of the second receiving groove,

A capacitor module connected to one side of the board with a wire.
According to clause 6,

A capacitor module in which a plurality of second connectors electrically connected to the inductor are disposed on the other side of the substrate.
According to paragraph 1,

A capacitor module in which a capacitor or inductor is accommodated and molded in the receiving groove.