WO2024046391A1 - 用于稀释制冷机内的集成装置及量子计算机 - Google Patents

用于稀释制冷机内的集成装置及量子计算机 Download PDF

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Publication number
WO2024046391A1
WO2024046391A1 PCT/CN2023/115919 CN2023115919W WO2024046391A1 WO 2024046391 A1 WO2024046391 A1 WO 2024046391A1 CN 2023115919 W CN2023115919 W CN 2023115919W WO 2024046391 A1 WO2024046391 A1 WO 2024046391A1
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WIPO (PCT)
Prior art keywords
signal
adapter
metal
integrated device
fixing
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Application number
PCT/CN2023/115919
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English (en)
French (fr)
Inventor
孔伟成
张冬洋
Original Assignee
本源量子计算科技（合肥）股份有限公司
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Priority claimed from CN202222325898.2U external-priority patent/CN218214171U/zh
Priority claimed from CN202222325833.8U external-priority patent/CN217982411U/zh
Priority claimed from CN202211061103.XA external-priority patent/CN115470917A/zh
Priority claimed from CN202222409077.7U external-priority patent/CN218446590U/zh
Application filed by 本源量子计算科技（合肥）股份有限公司 filed Critical 本源量子计算科技（合肥）股份有限公司
Publication of WO2024046391A1 publication Critical patent/WO2024046391A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control

Definitions

  • the present application relates to the field of quantum computing technology, and more specifically, to an integrated device and a quantum computer used in a dilution refrigerator.
  • Quantum computing is a new computing model that follows the laws of quantum mechanics to control basic information units for calculation.
  • the basic information unit of classical computing is the classical bit
  • the basic information unit of quantum computing is the qubit.
  • Classical bits can only be in one state, that is, 0 or 1.
  • qubits can be in a variety of states. The superposition state of possibilities, therefore the computational efficiency of quantum computing far exceeds that of classical computing.
  • the quantum processor In a superconducting system quantum computer, the quantum processor needs to work in an extremely low temperature environment, such as around 10mK. In order to control and measure the qubits at the lowest level, cables carrying quantum measurement and control signals need to pass through the cooling plate at the bottom of the dilution refrigerator and enter the mixing chamber (Mixed Chamber, MXC); at the same time, various types of applications need to be applied to the cables. Corresponding electronic devices process and optimize quantum measurement and control signals, such as attenuators, filters, amplifiers, synthesizers, etc.
  • Quantum measurement and control circuits used to control and measure qubits include DC drive signal circuits, pulse drive signal circuits, microwave drive signal circuits, etc.
  • the need for quantum measurement and control circuits increases accordingly, and the number of applied electronic devices also increases, especially for the bottom cooling plate, which requires more and more electronic devices.
  • the quantum measurement and control circuit needs to pass through the cooling plate and be connected to one end of the electronic device, and then the other end of the electronic device is connected to the signal port of the quantum processor through a cable.
  • the cable connections in the mixing room are messy, difficult to connect, and prone to wiring errors.
  • This application provides an integrated device and quantum computer used in a dilution refrigerator. Each aspect involved in this application is introduced below.
  • an integrated device for a dilution refrigerator including: a support member fixedly connected to a refrigeration plate with the lowest temperature in the dilution refrigerator; an adapter plate located below the refrigeration plate and connected to the The support parts are fixedly connected, A plurality of signal adapters are arranged in an array on the adapter board. One end of the signal adapter is connected to the quantum measurement and control circuit, and the other end of the signal adapter is connected to an electronic device; a plurality of first fixing parts are located at the Below the adapter plate and fixedly connected to the support member, it is used to fix the electronic device; wherein, each of the first fixing members is stacked, and the position of the first fixing member and the signal adapter is correspond.
  • the support member includes a first support member and a second support member arranged in parallel, and the adapter plate is provided with a passage for the first support member and the second support member to pass through. hole.
  • the first fixing member is disposed vertically on panels in opposite directions of the first support member and the second support member; or, the first fixing member is disposed vertically on the first support member.
  • the support member and the second support member are on opposite sides of the panel.
  • the cross-sectional shape of the first fixing member includes a C-shape or a U-shape.
  • the first fixing member is provided with a plurality of mounting holes for installing the electronic device, and the electronic device is installed on the first fixing member through the mounting holes.
  • the integrated device further includes a plurality of second fixing members arranged parallel to the support member and fixedly connected to the adapter plate.
  • the second fixing members are symmetrically arranged around the adapter plate. .
  • the adapter board includes a first integration area provided with a first signal adapter located in the middle area, and several second integration areas provided with second signal adapters, and the plurality of second integration areas are provided with second signal adapters.
  • the second integration area is arranged around the first integration area, wherein the first signal adapter is used to transfer the first microwave signal line that controls the quantum state, and the second signal adapter is used to transfer DC signal line and pulse signal line; the first fixing member is located below the second integration area and is used to fix the signal synthesizer that processes the DC signal line and the pulse signal line; the integrated device also A third fixing part is included, the third fixing part is located under the first integration area and is used to fix the quantum processor.
  • several second integration areas are symmetrically arranged on the adapter board; or, the first signal adapter of the first integration area and the second signal adapter of the second integration area Adapters are array configured.
  • the second integration area includes several adjacent sub-areas, and the second signal adapters in adjacent sub-areas are respectively used to connect the DC signal line and the pulse signal line.
  • the signal input ports of the signal synthesizer respectively correspond to the second signal adapters in adjacent sub-regions; or, each of the first fixing members is arranged in a stack, and the first fixing members
  • the fixed signal synthesizer corresponds to the position of the second signal adapter.
  • a third signal adapter for connecting a second microwave signal line is also provided on a side of the second integration area away from the first integration area.
  • the integrated device further includes a plurality of fourth fixing members arranged parallel to the support member and fixedly connected to the adapter plate.
  • the fourth fixing members are used to fix the third fixing member to the adapter plate.
  • Signal adapter is an electronic device that electrically connects.
  • the fourth fixing member is symmetrically arranged around the adapter plate.
  • a first through hole is opened on the support member, and the first through hole is used for the DC signal line or the pulse signal line or the first microwave signal line to pass through, and/ Or, a second through hole is opened in the support member, and the second through hole is used for passing a cable connecting the second signal adapter and the signal synthesizer.
  • the sizes of the stacked first fixing members are proportionally increased or reduced.
  • the integrated device further includes a heat-conducting belt through which the refrigeration plate of the dilution refrigerator provides cold energy to the metal parts in the dilution refrigerator;
  • the heat-conducting belt includes a metal braided belt And metal plates located at both ends of the metal braided belt;
  • the metal braided belt includes several strands of metal strands;
  • the metal plate is formed by crimping the metal stranded wires, and the metal plate at one end is used to connect and fix the dilution refrigeration The metal plate at the other end is used to connect the metal parts that fix the measurement and control circuits and electronic devices.
  • the metal plate includes a crimped metal stranded wire and a metal post, a third through hole is provided in the metal post, and an end of the metal stranded wire is accommodated in the third through hole. inside the hole.
  • the diameter of a single strand of the metal stranded wire is no greater than 0.15 mm; or, the materials of the metal stranded wire and the metal column include copper, and the copper includes oxygen-free copper; or, the The surface of the metal plate is plated with a metal layer, and the material of the metal layer includes gold.
  • a second aspect provides a quantum computer, which is characterized in that it includes a dilution refrigerator, an integrated device as described in any one of the first aspects located in the dilution refrigerator, and a quantum processor.
  • the integrated device of the present application includes an adapter plate fixed by a support member and several first fixing members.
  • the support member is fixedly connected to the refrigeration plate with the lowest temperature in the dilution refrigerator.
  • the adapter plate is located below the refrigeration plate and is connected to the support member.
  • an array on the adapter board is provided with multiple signal adapters, one end of the signal adapter is connected to the quantum measurement and control circuit, and the other end of the signal adapter is connected to the electronic device; the first fixing piece for fixing the electronic device is located
  • the adapter plate is underneath and is fixedly connected to the support member, wherein each first fixing member is stacked, and the first fixing member corresponds to the array position of the signal adapter to ensure that after the electronic device is installed on the first fixing member, the electronic device is connected to the first fixing member.
  • the position of the signal adapter in the direction of the vertical signal adapter is corresponding.
  • the two ends of the cable can be fixedly connected to the corresponding electronic devices and signal adapters respectively to avoid bending and winding of the cable and improve the efficiency of the cable. Improves the integration of electronic devices and cable connection efficiency.
  • Figure 1 is a schematic structural diagram of an integrated device used in a dilution refrigerator provided in Embodiment 1 of the present application.
  • Figure 2 is a schematic structural diagram of another integrated device for a dilution refrigerator provided in Embodiment 1 of the present application.
  • Figure 3 is a schematic structural diagram of another integrated device for a dilution refrigerator provided in Embodiment 1 of the present application.
  • Figure 4 is a schematic structural diagram of an integrated device used in a dilution refrigerator provided in Embodiment 2 of the present application.
  • Figure 5 is a schematic diagram of the integration area division of an adapter board provided in Embodiment 2 of the present application.
  • FIG. 6 is a schematic diagram of the division of a second integration area provided in Embodiment 2 of the present application.
  • FIG. 7 is a schematic diagram of the division of area A in a second integration area provided in Embodiment 2 of the present application.
  • FIG. 8 is a schematic diagram of the division of area B in the second integration area provided in Embodiment 2 of the present application.
  • FIG. 9 is a schematic diagram of the stacked structure of a first fixing member provided in Embodiment 2 of the present application.
  • FIG. 10 is a schematic diagram of area division of a third signal adapter provided in Embodiment 2 of the present application.
  • Figure 11 is a schematic structural diagram of a third fixing member provided in Embodiment 2 of the present application.
  • Figure 12 is a schematic diagram of a through hole of a support member provided in Embodiment 2 of the present application.
  • Figure 13 is a schematic structural diagram of a conductive belt provided in Embodiment 3 of the present application.
  • Figure 14 is a schematic diagram of the crimping of a heat-conducting tape provided in Embodiment 3 of the present application.
  • the embodiment of the present application proposes an integrated device for a dilution refrigerator, including a support 1 fixedly connected to the refrigeration plate 2 with the lowest temperature in the dilution refrigerator; an adapter plate 3, Located below the refrigeration plate 2 and fixedly connected to the support 1, a plurality of signal adapters 4 are arranged in an array on the adapter plate 3. One end of the signal adapters 4 is connected to the quantum measurement and control circuit.
  • the other end of the signal adapter 4 is connected to an electronic device; a plurality of first fixing members 5 are located below the adapter plate 3 and fixedly connected to the support member 1 for fixing the electronic device; wherein, each The first fixing parts are arranged in a stack, and the positions of the first fixing parts and the signal adapter correspond to each other.
  • the cooling plate 2 is provided with a plurality of inlet holes for the quantum measurement and control circuits to pass through.
  • the quantum measurement and control circuits can be connected to the signal adapter 4 on the adapter plate 3 by passing through each inlet hole. Since the quantum measurement and control circuits there are many types, including but not limited to DC drive signal circuits, pulse drive signal circuits and microwave drive signal circuits; among them, DC drive signal circuits are used to adjust the operating frequency of the qubit to the qubit operating point; pulse drive signal circuits, It is used to deviate the working frequency of the qubit from the working point of the qubit; the DC drive signal and the pulse drive signal jointly realize the frequency control of the qubit of the quantum processor; the microwave drive signal line is used to control the frequency of the qubit on the quantum processor. Quantum state changes.
  • the signal synthesizer is used to synthesize the DC drive signal transmitted by the DC drive signal line and the pulse drive signal transmitted by the pulse drive signal line, and transmit the synthesized signal to the quantum processor to realize quantum processing. Frequency control of qubits on the processor.
  • a plurality of signal adapters 4 are arranged in an array on the adapter board 3. One end of each signal adapter 4 is connected to a cable, and the other end is connected to an electronic device.
  • several first fixing parts 5 for fixing electronic devices are provided below the adapter plate 3.
  • the first fixing parts 5 are fixedly connected to the support part 1, wherein each first fixing part 5 is on the vertical adapter plate. They are stacked in the direction of 3, and the first fixing part 5 corresponds to the position of the signal adapter 4 in the projection direction of the adapter plate 3.
  • Several first fixing parts 5 are stacked in a direction perpendicular to the adapter plate 3. By providing multiple layers of first fixing parts 5, more electronic devices can be fixed to meet the integration needs of more quantum measurement and control circuits.
  • the electronic devices fixed on several stacked first fixing members 5 are connected to the signal adapter 4 located above through cables, and the electronic devices fixed by the first fixing members 5 correspond to the array position of the signal adapter 4 , ensure that after the electronic device is installed on the first fixing member 5, the positions of the electronic device and the signal adapter 4 in the direction of the vertical adapter plate 3 are corresponding, and the two ends of the cable are connected to the corresponding electronic devices and signals up and down respectively. Only 4 adapters are needed, which avoids multiple windings, improves the simplicity of the cable and improves the efficiency of cable connection.
  • Figures 1 and 2 only illustrate the number of several first fixing members 5 on the support member 1. In actual application, there can be any number of first fixing members 5, and there is no specific limitation here. .
  • the dimensions of the stacked first fixing members 5 are increased or reduced in equal proportions.
  • the support member 1 includes a first support member and a second support member arranged in parallel, and the adapter plate 3 is provided with a hole for the first support member and the second support member. via hole through which the component passes.
  • the first fixing member 5 when installing the first fixing member 5 , can be vertically disposed on the side of the first support member away from the second support member;
  • the first fixing part 5 is arranged vertically on the side of the second supporting part away from the first supporting part; or, the first fixing part 5 is arranged vertically on the first supporting part and the second supporting part. side.
  • the signal adapters 4 on the adapter board 3 are arranged from the middle area to the peripheral array.
  • the first fixing part 5 at the corresponding position below the signal adapter 4 selects the corresponding fixing position and method. Specifically, when the signal is transferred When the device 4 adds a row array along the direction perpendicular to the first support member and the second support member to realize the array arrangement, the first fixing member 5 is provided on the panel in the opposite direction of the first support member and the second support member; when the signal When the adapter 4 adds a row array in a direction parallel to the first support member and the second support member to realize the array arrangement, the first fixing member 5 is disposed on the panels on opposite sides of the first support member and the second support member. .
  • the cross-sectional shape of the first fixing member 5 includes a C-shape or a U-shape.
  • the C-shaped or U-shaped structure can make it easier to install electronic devices and connect electronic devices to cables.
  • the space of the first fixing part 5 can also be fully utilized, and multiple first fixing parts 5 can be provided on the first supporting part and the second supporting part according to actual needs.
  • the shape of the first fixing part 5 may also include other shapes, such as L-shape.
  • the first fixing member 5 is provided with a plurality of mounting holes for installing the electronic components, and the electronic components are installed on the first fixing member 5 by screws or bolts.
  • the outer side of the fixing member 5 makes the signal port of the electronic device face outward to facilitate the connection of cables.
  • FIG. 3 as an implementation method of the embodiment of the present application, it also includes a plurality of second fixing members 6 arranged parallel to the support member and fixedly connected to the adapter plate 3.
  • the components 6 are arranged symmetrically around the adapter plate 3 .
  • the electronic device for quantum signal processing installed on the second fixing member 6 can be any one or a combination of a circulator and a signal amplifier. .
  • the plurality of second fixing parts 6 are all fixedly connected to the lower panel of the adapter plate 3 , and the second fixing parts 6 are symmetrically arranged around the outer edge of the adapter plate 3 . Since the signal adapters 4 are arranged in an array from the middle area on the adapter board 3 and a number of first fixing parts 5 are already provided below them, a plurality of second fixing parts 6 are arranged at the outer edge of the adapter board 3 , on the one hand, the space of the adapter board 3 can be fully utilized, on the other hand, such a setting will not interfere with the normal construction of the quantum measurement and control circuit.
  • the specific position of the second fixing member 6 can be any position on the adapter board 3 that does not affect the normal construction of the quantum measurement and control circuit, and is not specifically limited here.
  • a plurality of mounting holes for installing the electronic devices are opened on the second fixing part 6 , and the electronic devices are installed on the outer side of the second fixing part 6 .
  • the electronic device is installed on the outer side of the second fixing member 6 by screws or bolts, so that the signal port of the electronic device faces outward to facilitate the connection of cables.
  • the integrated device used in the dilution refrigerator in the embodiment of the present application specifically includes a support 1, an adapter plate 3 fixedly connected to the support 1, and several first fixed 5, and the third fixing member 8;
  • the adapter plate 3 includes a first integration area 31 in the middle area with a first signal adapter 311, and several second signal adapters 321.
  • second integration area 32, several second integration areas 32 are arranged around the first integration area 31, wherein the first signal adapter 311 is used to transfer the first microwave signal line for controlling quantum states,
  • the second signal adapter 321 is used to transfer the DC signal line and the pulse signal line;
  • the first fixing part 5 is located below the second integration area 32 and is used to fix the DC signal line and the pulse signal line.
  • the signal synthesizer 7 processes the pulse signal circuit;
  • the third fixing member 8 is located below the first integration area 31 and is used to fix the quantum processor.
  • the integrated device of the embodiment of the present application is arranged in an extremely low temperature zone.
  • a refrigeration plate 2 is provided in the extremely low temperature zone of the dilution refrigerator.
  • the support 1 is vertically arranged and fixedly connected to the refrigeration plate 2.
  • the support 1 is used to fix the adapter plate 3 , several first fixing parts 5, and third fixing parts 8, and are also used to transfer the cold energy of the cooling plate 2 to the adapter plate 3, several first fixing parts 5, and third fixing parts 8. heat dissipation.
  • the cooling plate 2 is provided with a plurality of wire inlet holes for the quantum measurement and control circuits to pass through.
  • the quantum measurement and control circuits are connected to the first integration area 31 on the adapter plate 3 through the wire inlet holes.
  • the regulated DC signal line and the pulse signal line are connected to the second signal adapter 321 .
  • the first microwave signal line is connected to the first signal adapter 311 in the first integration area 31, and the first signal adapter 311 is connected to the first signal adapter 311 located below through a cable.
  • the signal ports of the quantum processor on the three fixing members 8 have the same cable type, length and shape, making them easy to connect and install.
  • several first fixing members 5 are provided below the second signal adapter for installing signal synthesizers 7 that synthesize DC signal lines and pulse signal lines.
  • the first integration area 31 and the second integration area 32 in Figure 5 are only schematic range areas.
  • the number of bits of the quantum processor is different, and the number of required first microwave signal lines will also be different.
  • the adapter board The range of the first integration area 31 where the first signal adapter 311 is provided on 3 will also be different, and the same is true for the second integration area 32.
  • the integration area on the adapter board 3 is divided according to the type and specific number of quantum measurement and control circuits, and corresponding first signal adapters 311 and second signal adapters 321 are provided in the integration area. Meet the needs of quantum processors with corresponding bits.
  • several second integration areas 32 are symmetrically arranged on the adapter board 3 .
  • the quantum processor is located on the third fixing member 8 below the first integration area 31, and several second integration areas 32 are arranged around the first integration area 31 to ensure that the DC signal lines and pulse signal lines connected to the second integration area 32 surround
  • the quantum processor setting makes it easy to connect cables, and the symmetrical setting ensures that the load-bearing weight is evenly distributed after the quantum measurement and control circuit is connected to the adapter board 3, improving the stability of the adapter board 3.
  • the first signal adapter 311 of the first integration area 31 and the second signal adapter of the second integration area 32 321 are arranged in an array on the adapter board 3 .
  • several through holes are provided in an array in both the first integration area and the second integration area on the adapter board 3, and the first signal adapter 311 is installed on the adapter board 3 in the first integration area through the through holes.
  • the second signal adapter 321 is installed on the adapter board 3 in the second integration area.
  • both ends of the first signal adapter 311 and the second signal adapter 321 are provided with SMA type connectors, which can be recorded as the first end of the SMA connector to connect the first microwave signal line or DC signal line or pulse Signal line, the SMA connector at the second end is connected to the quantum processor or signal synthesizer 7.
  • the SMA connector at the second end can also be connected to an attenuator or filter first, and then to the quantum processor or signal synthesizer 7 .
  • the specific situation needs to be selected according to the driving signal transmitted in the quantum measurement and control circuit.
  • the second integration area 32 includes several adjacent sub-areas 33, and the second signal adapters 321 of the adjacent sub-areas 33 are respectively used for Connect the DC signal line and the pulse signal line.
  • the second integration area 32 is used to connect DC signal lines and pulse signal lines.
  • the second integration area 32 is divided into several adjacent sub-areas 33.
  • Each sub-area 33 is used to connect a type of quantum measurement and control circuit, such as a DC signal. lines or pulse signal lines; and the adjacent sub-area 33 is used to connect different types of quantum measurement and control lines.
  • Figure 7 is a schematic diagram of a second integrated area 32 at position A of the adapter plate 3 in Figure 6 divided into three sub-areas 33.
  • the middle area along the adapter plate 3 is divided into multiple sub-areas from the inside to the outside.
  • several second signal adapters 321 are arranged in an array in each sub-area 33.
  • adjacent sub-regions 33 connect different types of quantum measurement and control circuits.
  • the second signal adapter 321 in the inner sub-area 33 (that is, located at the bottom of Figure 7) is connected to the DC signal line, and the middle one (that is, located in the middle of Figure 7)
  • the second signal adapter 321 in the sub-area 33 is connected to the pulse signal line
  • the second signal adapter 321 in the outer sub-area 33 (that is, located at the top of FIG. 7 ) is connected to the DC signal line.
  • Figure 8 is a schematic diagram of a second integrated area 32 at position B of the adapter board 3 in Figure 6 divided into two sub-areas 33.
  • the second signal in the inner sub-area 33 ie, the left side of Figure 8
  • the adapter 321 is connected to the DC signal line
  • the second signal adapter 321 in the outer sub-area 33 that is, located on the right side of FIG. 8
  • the DC signal line By setting up adjacent sub-areas 33 and connecting the second signal adapters 321 in the sub-areas to different types of DC signal lines and pulse signal lines respectively, it is ensured that the signal port of the signal synthesizer 7 below the sub-area 33 passes through the cable.
  • Connect the DC signal line and the pulse signal line to prevent the cable from being wound due to the position of the signal port of the signal synthesizer 7, so that the cable connection method in the integrated device is simple and easy to connect.
  • the signal input ports of the signal synthesizer 7 respectively correspond to the second signal adapters 321 in the adjacent sub-regions 33 .
  • the signal synthesizer 7 has a plurality of signal input ports, and each signal input port is connected to the second signal adapter 321 in the sub-area 33 at the corresponding position above.
  • the signal input port corresponds to the position of the second signal adapter 321 , just connect through cables.
  • the shape of the cable is simple, no winding is required, and the installation and connection efficiency is high.
  • each of the first fixing members 5 is stacked in a direction vertical to the adapter plate 3, and the signal synthesizer 7 fixed by the first fixing members 5 Corresponds to the position of the second signal adapter 321 .
  • Several first fixing pieces 5 are provided below the adapter plate 3 for fixing the signal synthesizer 7.
  • Several first fixing pieces 5 are arranged vertically and fixedly connected to the support member 1. Among them, several first fixing pieces 5 are arranged along the The vertical adapter boards 3 are stacked in a direction, and by providing multiple layers of first fixing members 5, a greater number of signal synthesizers 7 can be fixed to meet the integration needs of more quantum measurement and control circuits.
  • the signal synthesizer 7 fixed on several first fixing members 5 arranged in a stack is connected to the second signal adapter 321 in the upper second integration area 32 through a cable.
  • the signal synthesizer 7 and the second signal adapter The array positions of 321 correspond to each other. Ensure that after the signal synthesizer 7 is installed on the first fixing member 5, the positions of the signal synthesizer 7 and the second signal adapter 321 in the direction vertical to the adapter plate 3 are corresponding.
  • the cable The two ends are connected to the corresponding signal synthesizer 7 and the second signal adapter 321 respectively, which avoids multiple windings and improves the simplicity of the cable and the efficiency of cable connection.
  • the sizes of the stacked first fixing members 5 are increased or reduced in equal proportions. Specifically, in the direction away from the adapter plate 3, the sizes of the stacked first fixing members 5 are increased or reduced in proportion.
  • the size of the first fixing part 5 is increased proportionally, which provides a better operating space for cable connection.
  • the cross-sectional shape of the first fixing member 5 includes a C-shape or a U-shape.
  • the C-shaped or U-shaped structure can make it easier to install the signal synthesizer 7 and connect the signal synthesizer 7 to the cable. At the same time, it can also make full use of the space of the first fixing part 5. It can be installed according to actual needs.
  • a plurality of first fixing members 5 are provided on the support member 1 .
  • the shape of the first fixing part 5 may also include other shapes, such as L-shape.
  • the first fixing part 5 is provided with a plurality of mounting holes for installing the signal synthesizer 7, and the signal combiner 7 is installed on the outer side of the first fixing part 5 by screws or bolts, so that the signal synthesizer 7 The signal port 7 is exposed for easy cable connection.
  • a third signal for connecting a second microwave signal line is also provided on the side of the second integration area 32 away from the first integration area 31.
  • Adapter 322 in which the second microwave signal is used for quantum state measurement.
  • the quantum state information of the qubits integrated on the quantum processor needs to be measured through microwave signals, and multiple qubits are measured through the measurement bus, so the number of second microwave signals that need to be applied is smaller.
  • a third signal adapter 322 for connecting the second microwave signal line is provided on the adapter board 3, and the second microwave signal is transmitted to the measurement bus on the quantum processor through the third signal adapter 322, Several rows or columns of third signal adapters 322 are provided on the side of the second integration area 32 away from the first integration area 31 to connect the second microwave signal lines to achieve measurement of qubits.
  • the fourth fixing member 9 is arranged parallel to the support member and fixedly connected to the adapter plate. It is used to fix the electronic device 10 electrically connected to the third signal adapter 322 .
  • the fourth fixing member 9 is arranged symmetrically around the adapter plate 3 .
  • the fourth fixing member 9 is symmetrically arranged along the outer edge of the adapter plate 3 and is arranged close to the third signal adapter 322 .
  • the support 1 is provided with a first through hole 11, and the first through hole 11 is used for the DC signal line or the pulse signal. line or the first microwave signal line passes through.
  • the support member 1 is provided with a second through hole 12 for passing the cable connecting the second signal adapter 321 and the signal synthesizer 7 .
  • the first through hole 11 is opened on the support plate 1 between the cooling plate 2 and the adapter plate 3
  • the second through hole 12 is opened on the support plate 1 between the adapter plate 3 and the first fixing part 5. s position.
  • the embodiment of the present application provides an integrated device for use in a dilution refrigerator, which also includes a heat-conducting belt as shown in Figure 13.
  • the cooling plate can provide cooling power to the metal parts through the heat-conducting belt.
  • the conductive belt includes a metal braided belt 21 and metal plates 22 located at both ends of the metal braided belt 21; the metal braided belt 21 includes a plurality of strands of metal strands; the metal plate 22 is formed by pressing the metal braided belt 21, The metal plate 22 at one end is used to connect and fix the refrigeration plate of the dilution refrigerator, and the metal plate 22 at the other end is used to connect the metal parts that fix the measurement and control circuits and electronic devices.
  • the metal plate 22, the metal plate 22 and the metal braid 21 are an integrated structure.
  • the shape of the metal plate 22 is a plate-like structure with a flat contact surface.
  • the metal plate 22 can have good contact with metal parts and the cooling plate, greatly improving the thermal conductivity.
  • the diameter of a single strand of the metal stranded wire is not greater than 0.15 mm. It can be understood that metal strands with very fine diameter are used, and multiple strands are twisted together to form the metal braid 21. The multiple strands of metal strands are braided tightly and have good contact, so that the metal braid formed after braiding is 21 has a higher thermal conductivity.
  • the metal plate 22 includes crimped metal strands and a metal pillar 23.
  • the metal pillar 23 is provided with a third through hole 231, so The end of the metal stranded wire is received in the third through hole 231 .
  • the metal plate 22 is formed by a crimping process of multiple strands of metal strands. During crimping, the multiple strands of metal strands can be directly crimped to form the metal plate 22 , or the ends of the metal strands can be accommodated with the metal.
  • the metal pillar 23 is pressed and bonded to form the metal plate 22.
  • the metal pillars 23 are set on both ends of the stranded metal wires for crimping.
  • the shape of the metal block formed after crimping is easy to fix, and the surface is flat, which is conducive to heat conduction.
  • the material of the metal strands and the metal pillar includes copper.
  • Metal strands and metal columns are used for heat conduction.
  • Metal materials with good thermal conductivity include gold, silver, copper, aluminum, etc. Among them, silver and copper have the best thermal conductivity. Using copper, the cost is relatively low.
  • copper includes red copper, brass, white copper, etc.
  • deoxidizing elements or other elements such as ordinary red copper (T1, T2, T3, T4), oxygen-free copper (TU0, TU1, TU2 and high-purity, vacuum oxygen-free copper), deoxidized copper (TUP, TUMn), and special copper with a small amount of alloying elements added (arsenic copper, tellurium copper, silver copper) to improve materials and performance.
  • oxygen-free copper TU0 is preferred, which is suitable for low-temperature environments and has better thermal conductivity.
  • the surface of the metal plate 22 is machined.
  • the metal plate 22 at one end of the metal braided belt 21 is used to connect the refrigeration plate of the dilution refrigerator, and the metal plate 22 at the other end of the metal braided belt 21 is used to connect the metal parts that fix the measurement and control circuits and electronic devices.
  • the metal plate formed by crimping The surface of the metal plate 22 is machined to make the surface of the metal plate 22 smooth and flat, and has better contact when fixedly connected with the cooling plate and metal parts, so as to facilitate heat conduction.
  • the surface of the metal plate 22 is plated with a metal layer.
  • the material of the metal layer includes gold.
  • the metal plate 22 is placed in the dilution refrigerator. The ambient temperature is relatively low and is prone to oxidation.
  • a metal layer made of gold is electroplated on the surface of the metal plate 22 to prevent oxidation and ensure the stability of the thermal conductivity.
  • a fourth through hole 221 is opened in the center of the metal plate 22 .
  • a fourth through hole 221 is opened in the center of the metal plate 22, and the metal plate 22 is fixedly connected to the cooling plate and metal parts through screws, threads, or bolts.
  • embodiments of the present application also provide a quantum computer, including a dilution refrigerator, the above-mentioned integrated device located in the dilution refrigerator, and a quantum processor.

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Abstract

提供了一种用于稀释制冷机内的集成装置及量子计算机，其特征在于，包括：支撑件，与稀释制冷机内温度最低的制冷盘固定连接；转接板，位于所述制冷盘下方且与所述支撑件固定连接，所述转接板上阵列设置有多个信号转接器，所述信号转接器的一端连接量子测控线路，所述信号转接器的另一端连接电子器件；若干第一固定件，位于所述转接板下方且与所述支撑件固定连接，用于固定所述电子器件；其中，各所述第一固定件层叠设置，且所述第一固定件与所述信号转接器的位置对应。在本申请中，第一固定件与信号转接器的阵列位置对应，确保电子器件安装在第一固定件上后，电子器件与信号转接器在垂直方向上的位置对应，提高了电子器件的集成及线缆连接效率。

Description

用于稀释制冷机内的集成装置及量子计算机
本申请要求于2022年8月31日提交中国专利局、申请号为202222325833.8、申请名称为“用于稀释制冷机内的集成装置及量子计算机”的中国专利申请的优先权，要求于2022年8月31日提交中国专利局、申请号为202211061103.X、申请名称为“用于稀释制冷机内的集成装置及量子计算机”的中国专利申请的优先权，要求于2022年8月31日提交中国专利局、申请号为202222325898.2、申请名称为“用于稀释制冷机内的集成装置及量子计算机”的中国专利申请的优先权，要求于2022年9月8日提交中国专利局、申请号为202222409077.7、申请名称为“用于稀释制冷机内的导热带、制冷设备及量子计算机”的中国专利申请的优先权，这些专利的全部内容通过引用结合在本申请中。
技术领域
本申请涉及量子计算技术领域，并且更为具体地，涉及一种用于稀释制冷机内的集成装置及量子计算机。
背景技术
量子计算是一种遵循量子力学规律调控基本信息单元进行计算的新型计算模式。经典计算的基本信息单元是经典比特，量子计算的基本信息单元是量子比特，经典比特只能处于一种状态，即0或1，而基于量子力学态叠加原理，量子比特的状态可以处于多种可能性的叠加状态，因而量子计算的计算效率远远超过经典计算的计算效率。
在超导体系的量子计算机中，量子处理器需要工作在极低温环境，例如10mK左右。为了操控和测量最底层的量子比特，需要有携带量子测控信号的线缆穿过稀释制冷机最底层的制冷盘通入混合室(Mixed Chamber，MXC)；同时，在线缆上需要施加各类相应的电子器件对量子测控信号进行处理优化，如衰减器、滤波器、放大器、合成器等。
用于操控和测量量子比特的量子测控线路包括直流驱动信号线路、脉冲驱动信号线路、微波驱动信号线路等。随着量子处理器上量子比特数的扩展，量子测控线路需要相应的增多，所施加电子器件的数量也随之增多，特别是最底层的制冷盘处，所需电子器件的数量及种类更多，量子测控线路需要穿过制冷盘与电子器件的一端连接，然后电子器件的另通过线缆连接量子处理器的信号端口。现有技术中，混合室的线缆连接杂乱无章，连线难度大且容易连线错误。
因此，如何提高稀释制冷机内混合室电子器件的集成及线缆连接效率成为本领域亟待解决的技术问题。
发明内容
本申请提供一种用于稀释制冷机内的集成装置及量子计算机。下面对本申请涉及的各个方面进行介绍。
第一方面，提供了一种用于稀释制冷机内的集成装置，包括：支撑件，与稀释制冷机内温度最低的制冷盘固定连接；转接板，位于所述制冷盘下方且与所述支撑件固定连接， 所述转接板上阵列设置有多个信号转接器，所述信号转接器的一端连接量子测控线路，所述信号转接器的另一端连接电子器件；若干第一固定件，位于所述转接板下方且与所述支撑件固定连接，用于固定所述电子器件；其中，各所述第一固定件层叠设置，且所述第一固定件与所述信号转接器的位置对应。
在一些实现方式中，所述支撑件包括平行设置的第一支撑件和第二支撑件，所述转接板上开设有供所述第一支撑件和所述第二支撑件穿过的过孔。
在一些实现方式中，所述第一固定件垂直设置于所述第一支撑件和所述第二支撑件的相反方向的面板上；或，所述第一固定件垂直设置于所述第一支撑件和所述第二支撑件的相对侧的面板上。
在一些实现方式中，其特征在于，所述第一固定件的横切面形状包括C字形或U字形。
在一些实现方式中，所述第一固定件上开设有多个用于安装所述电子器件的安装孔，所述电子器件通过安装孔安装于所述第一固定件上。
在一些实现方式中，所述集成装置还包括与所述支撑件平行设置且与所述转接板固定连接的若干个第二固定件，所述第二固定件环绕所述转接板对称设置。
在一些实现方式中，所述转接板包括位于中间区域的设置有第一信号转接器的第一集成区域、以及设置有第二信号转接器的若干个第二集成区域，若干个所述第二集成区域环绕所述第一集成区域设置，其中，所述第一信号转接器用于转接对量子态进行操控的第一微波信号线路，所述第二信号转接器用于转接直流信号线路和脉冲信号线路；所述第一固定件位于所述第二集成区域下方，用于固定对所述直流信号线路和所述脉冲信号线路进行处理的信号合成器；所述集成装置还包括第三固定件，所述第三固定件位于所述第一集成区域下方，用于固定量子处理器。
在一些实现方式中，若干个所述第二集成区域在所述转接板上对称设置；或，所述第一集成区域的第一信号转接器和所述第二集成区域的第二信号转接器均阵列设置。
在一些实现方式中，所述第二集成区域包括相邻设置的若干子区域，相邻子区域的第二信号转接器分别用于连接所述直流信号线路和所述脉冲信号线路。
在一些实现方式中，所述信号合成器的信号输入端口分别与相邻子区域内的第二信号转接器对应；或，各所述第一固定件层叠设置，且所述第一固定件固定的信号合成器与所述第二信号转接器的位置对应。
在一些实现方式中，所述第二集成区域上远离所述第一集成区域的一侧还设置有用于连接第二微波信号线路的第三信号转接器。
在一些实现方式中，所述集成装置还包括与所述支撑件平行设置且与所述转接板固定连接的若干个第四固定件，所述第四固定件用于固定与所述第三信号转接器电连接的电子器件。
在一些实现方式中，所述第四固定件环绕所述转接板对称设置。
在一些实现方式中，所述支撑件上开设有第一通孔，所述第一通孔用于所述直流信号线路或所述脉冲信号线路或所述第一微波信号线路穿过，和/或，所述支撑件上开设有第二通孔，所述第二通孔用于连接所述第二信号转接器和所述信号合成器的线缆穿过。
在一些实现方式中，层叠设置的所述第一固定件的尺寸等比例增加或缩小。
在一些实现方式中，所述集成装置还包括导热带，所述稀释制冷机的制冷盘通过所述导热带为所述稀释制冷机内的金属件提供冷量；所述导热带包括金属编织带及位于所述金属编织带两端的金属板；所述金属编织带包括若干股金属绞线；所述金属板由所述金属绞线压接形成，一端的所述金属板用于连接固定稀释制冷机的制冷盘，另一端的所述金属板用于连接固定测控线路和电子器件的金属件。
在一些实现方式中，所述金属板包括压接后的金属绞线和金属柱，所述金属柱内设有第三通孔，所述金属绞线的端部容置于所述第三通孔内。
在一些实现方式中，单股所述金属绞线的直径不大于0.15毫米；或，所述金属绞线和所述金属柱的材料均包括铜，所述铜包括无氧铜；或，所述金属板表面镀有金属层，所述金属层的材料包括金。
第二方面，提供了一种量子计算机，其特征在于，包括稀释制冷机、位于所述稀释制冷机内的如第一方面任一项所述的集成装置、以及量子处理器。
本申请的集成装置，包括通过支撑件固定的转接板和若干个第一固定件，其中，支撑件与稀释制冷机内温度最低的制冷盘固定连接，转接板位于制冷盘下方与支撑件固定连接，转接板上阵列设置有多个信号转接器，信号转接器的一端连接量子测控线路，信号转接器的另一端连接电子器件；用于固定电子器件的第一固定件位于转接板下方且与支撑件固定连接，其中，各第一固定件层叠设置，第一固定件与信号转接器的阵列位置对应，确保电子器件安装在第一固定件上后，电子器件与信号转接器在垂直信号转接器的方向上的位置是对应的，线缆的两端分别固定连接上下对应的电子器件和信号转接器即可，避免线缆弯折、绕制，提高了电子器件的集成及线缆连接效率。
附图说明
图1为本申请实施例一提供的一种用于稀释制冷机内的集成装置的结构示意图。
图2为本申请实施例一提供的另一种用于稀释制冷机内的集成装置的结构示意图。
图3为本申请实施例一提供的另一种用于稀释制冷机内的集成装置的结构示意图。
图4为本申请实施例二提供的一种用于稀释制冷机内的集成装置的结构示意图。
图5为本申请实施例二提供的一种转接板的集成区域划分示意图。
图6为本申请实施例二提供的一种第二集成区域的划分示意图。
图7为本申请实施例二提供的一种第二集成区域中A区域的划分示意图。
图8为本申请实施例二提供的一种第二集成区域中B区域的划分示意图。
图9为本申请实施例二提供的一种第一固定件的层叠结构示意图。
图10为本申请实施例二提供的一种第三信号转接器的区域划分示意图。
图11为本申请实施例二提供的一种第三固定件的结构示意图。
图12为本申请实施例二提供的一种支撑件的通孔示意图。
图13为本申请实施例三提供的一种导热带的结构示意图。
图14为本申请实施例三提供的一种导热带的压接示意图。
附图标记说明：
1-支撑件，2-制冷盘，3-转接板，4-信号转接器，5-第一固定件，6-第二固定件，7-信
号合成器，8-第三固定件，9-第四固定件，10-电子器件，11-第一通孔，12-第二通孔，21- 金属编织带，22-金属板，23-金属柱，31-第一集成区域，32-第二集成区域，33-子区域，221-第四通孔，231-第三通孔，311-第一信号转接器，321-第二信号转接器，322-第三信号转接器。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。应理解，下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能解释为对本申请的限制。另外，以下详细描述仅是说明性的，并不旨在限制实施例和/或实施例的应用或使用。此外，无意受到前面的“背景技术”或“实用新型内容”部分或“具体实施方式”部分中呈现的任何明示或暗示信息的约束。
为使本申请实施例的目的、技术方案和优点更加清楚，现在参考附图描述一个或多个实施例，其中，贯穿全文相似的附图标记用于指代相似的组件。在下面的描述中，出于解释的目的，阐述了许多具体细节，以便提供对一个或多个实施例的更透彻的理解。然而，很明显，在各种情况下，可以在没有这些具体细节的情况下实践一个或多个实施例，各个实施例在不矛盾的前提下可以相互结合相互引用。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
实施例一
结合图1和图2所示，本申请实施例提出一种用于稀释制冷机内的集成装置，包括支撑件1，与稀释制冷机内温度最低的制冷盘2固定连接；转接板3，位于所述制冷盘2下方且与所述支撑件1固定连接，所述转接板3上阵列设置有多个信号转接器4，所述信号转接器4的一端连接量子测控线路，所述信号转接器4的另一端连接电子器件；若干第一固定件5，位于所述转接板3下方且与所述支撑件1固定连接，用于固定所述电子器件；其中，各所述第一固定件层叠设置，且所述第一固定件与所述信号转接器的位置对应。
制冷盘2上开设有多个用于供量子测控线路穿过的进线孔，量子测控线路能够通过穿过各个进线孔与转接板3上的信号转接器4相连，由于量子测控线路种类较多，包括但不限于直流驱动信号线路、脉冲驱动信号线路和微波驱动信号线路；其中，直流驱动信号线路，用于将量子位的工作频率调至量子位工作点；脉冲驱动信号线路，用于使量子位的工作频率偏离量子位的工作点；直流驱动信号与脉冲驱动信号共同实现对量子处理器的量子位的频率调控；微波驱动信号线路，用于调控量子处理器上量子位的量子态变化。
为了确保输出至量子处理器的驱动信号强度和精度符合要求，需要在信号转接器4与量子处理器之间的线缆中设置若干种电子器件，包括但不限于衰减器、滤波器、信号合成器等。其中，信号合成器用于将直流驱动信号线路传输的直流驱动信号与脉冲驱动信号线路传输的脉冲驱动信号进行信号合成，将合成后的信号传输至量子处理器，实现对量子处 理器上的量子位的频率调控。
在转接板3上阵列设置多个信号转接器4，每一个信号转接器4的一端都连接一根线缆，另一端连接电子器件。此外，位于转接板3下方设置用于固定电子器件的若干个第一固定件5，第一固定件5与所述支撑件1固定连接，其中，各第一固定件5在垂直转接板3的方向上层叠设置，且在转接板3的投影方向上第一固定件5与信号转接器4的位置对应。若干个第一固定件5在垂直转接板3的方向上层叠设置，通过设置多层第一固定件5，可以固定的电子器件数量更多，满足更多的量子测控线路的集成需求。
此外，层叠设置的若干个第一固定件5上固定的电子器件通过线缆连接位于上方的信号转接器4，通过第一固定件5固定的电子器件与信号转接器4的阵列位置对应，确保电子器件安装在第一固定件5上后，电子器件与信号转接器4在垂直转接板3方向上的位置是对应的，线缆的两端分别连接上下对应的电子器件和信号转接器4即可，避免多次绕制，提高了线缆的简洁度并提高了线缆连接效率。在图1以及图2中仅示例性的示意支撑件1上的若干第一固定件5的数量，在实际的运用过程中，可以是任意数量的第一固定件5，在此不做具体限定。
作为本申请实施例的一种实施方式，层叠设置的所述第一固定件5的尺寸等比例增加或缩小。将若干个第一固定件5层叠设置，并且将若干个第一固定件5的尺寸等比例改变，可以确保第一固定件5固定电子器件后，多层电子器件的信号端口是相互错开的，且与信号连接器4的位置对应，线缆可以直接连接电子器件的信号端口与信号连接器4，提高线缆连接效率。
作为本申请实施例的一种实施方式，支撑件1包括平行设置的第一支撑件和第二支撑件，所述转接板3上开设有供所述第一支撑件和所述第二支撑件穿过的过孔。通过设置两个平行的第一支撑件和所述第二支撑件垂直固定连接制冷盘2，一方面可以确保结构支撑的稳定性，另一方面第一支撑件和第二支撑件上都可以安装第一固定件5，大大提高可以集成的电子器件的数量。
结合图1和图2所示，在安装第一固定件5时，可以将所述第一固定件5垂直设置于所述第一支撑件的远离所述第二支撑件的一面；也可以将所述第一固定件5垂直设置于所述第二支撑件的远离所述第一支撑件的一面；再或者，将所述第一固定件5垂直设置与第一支撑件和第二支撑件的侧面。
转接板3上的信号转接器4由中间区域位置向外围阵列排布，信号转接器4下方对应位置的第一固定件5选择对应的固定位置和方式，具体的，当信号转接器4沿着垂直第一支撑件和第二支撑件的方向增加行阵列实现阵列设置时，第一固定件5设置于第一支撑件的和第二支撑件的相反方向的面板上；当信号转接器4沿着平行与第一支撑件和第二支撑件的方向增加行阵列实现阵列设置时，第一固定件5设置于第一支撑件的和第二支撑件的相对侧的面板上。通过灵活设置第一固定件5的固定位置和方向，确保信号转接器4下方对应位置均设置有固定件，且在固定件上设置电子器件，进而确保电子器件与信号转接器4在垂直方向上的位置是对应的，线缆的两端分别固定连接上下对应的电子器件和信号转接器4即可，避免线缆弯折、绕制，提高了电子器件的集成及线缆连接效率。
作为本申请实施例的一种实施方式，所述第一固定件5的横切面形状包括C字形或U字形。C字形或U字形的结构能够更加便于电子器件的安装以及电子器件与线缆的连接， 同时，也能对第一固定件5的空间进行充分的利用，可以根据实际需要，在第一支撑件和第二支撑件上设置多个第一固定件5。此外，第一固定件5的形状也可以包括其他形状，如L型。
作为本申请实施例的一种实施方式，所述第一固定件5上开设有多个用于安装所述电子器件的安装孔，通过螺钉或者螺栓固定的方式将电子器件安装于所述第一固定件5的外侧面，使得电子器件的信号端口朝向外侧，便于线缆的连接。
如图3所示，作为本申请实施例的一种实施方式，还包括与所述支撑件平行设置且与所述转接板3固定连接的若干个第二固定件6，所述第二固定件6环绕所述转接板3对称设置。
在量子计算机中，量子测控线路中设置的电子器件的种类非常多，不仅包括设置于驱动线路中的电子器件，还包括用于测量和读取线路中的电子器件。在本申请的实施例中，第二固定件6上安装的用于量子信号处理的电子器件可以是环形器、信号放大器的任意一种或者组合。。
多个第二固定件6均固定连接转接板3的下面板，并且第二固定件6环绕所述转接板3的外边缘对称设置。由于转接板3上信号转接器4自中间区域位置阵列排布，而且其下方已经对应设置若干第一固定件5，将多个第二固定件6设置于转接板3的外边缘处，一方面能够对转接板3的空间进行充分的利用，另一方面，这样的设置并不会干扰量子测控线路的正常搭建。在一些其他的实施方案中，第二固定件6设置的具体位置可以是转接板3上任意不影响量子测控线路正常搭建的位置，在此不做具体限定。
作为本申请实施例的一种实施方式，第二固定件6上开设有多个用于安装所述电子器件的安装孔，所述电子器件安装于所述第二固定件6的外侧面。通过螺钉或者螺栓固定的方式将电子器件安装于第二固定件6的外侧面，使得电子器件的信号端口朝向外侧，便于线缆的连接。
实施例二
结合图4和图5所示，本申请实施例中用于稀释制冷机内的集成装置，具体包括支撑件1、以及与所述支撑件1固定连接的转接板3、若干个第一固定件5、以及第三固定件8；所述转接板3包括位于中间区域的设置有第一信号转接器311的第一集成区域31、以及设置有第二信号转接器321的若干个第二集成区域32，若干个第二集成区域32环绕所述第一集成区域31设置，其中，所述第一信号转接器311用于转接对量子态进行操控的第一微波信号线路，所述第二信号转接器321用于转接直流信号线路和脉冲信号线路；所述第一固定件5位于所述第二集成区域32下方，用于固定对所述直流信号线路和所述脉冲信号线路进行处理的信号合成器7；所述第三固定件8位于所述第一集成区域31下方，用于固定量子处理器。
目前常用的制冷设备是稀释制冷机，采用分级制冷技术，在极低温区利用氦元素的相变吸热进行进一步的制冷，得到极低温区，例如10mK，极低温环境可以有效降低热噪声对量子处理器的影响。本申请实施例的集成装置设置于极低温区，稀释制冷机的极低温区内设置有制冷盘2，支撑件1与制冷盘2垂直设置且固定连接，支撑件1用于固定转接板3、若干个第一固定件5、以及第三固定件8的同时，还用于将制冷盘2的冷量传递到转接板3、若干个第一固定件5、以及第三固定件8进行散热。
如图4所示，制冷盘2上开设有多个用于供量子测控线路穿过的进线孔，量子测控线路通过进线孔连接到转接板3上的第一集成区域31内的第一信号转接器311和若干个第二集成区域32内的第二信号转接器321，其中，对量子态进行操控的第一微波信号线路连接第一信号转接器311，对工作频率进行调节的直流信号线路和脉冲信号线路连接第二信号转接器321。通过在转接板3上设置若干个第二集成区域32，满足直流信号线路和脉冲信号线路的数量需求，并且设置第一集成区域31和第二集成区域32能够将不同种类的量子测控线路分隔开来，避免量子测控线路出现混乱。
具体的，对于第一集成区域31而言，第一微波信号线路连接第一集成区域31内的第一信号转接器311，并通过线缆将第一信号转接器311连接到下方位于第三固定件8上的量子处理器的信号端口，线缆类型、长度和形状均相同，易于连接和安装。对于第二集成区域32而言，在第二信号转接器的下方设置若干个第一固定件5，用于安装对直流信号线路和脉冲信号线路进行合成的信号合成器7。通过将信号合成器7的信号端口与第二集成区域32内的第二信号转接器321的位置一一对应，确保连接信号合成器7的信号端口和第二信号转接器321的线缆类型、长度和形状均相同，且信号合成器7的另一端统一连接量子处理器，使得线缆连接和安装难度低，大大提高了稀释制冷机内混合室的线缆连接效率。
其中，图5中的第一集成区域31和第二集成区域32仅为示意的范围区域，量子处理器的位数不同，需要的第一微波信号线路数量也会不同，对应的，转接板3上设置有第一信号转接器311的第一集成区域31的范围也会不同，第二集成区域32也是同理。本实施例中，根据量子测控线路的类型以及具体数量对转接板3上的集成区域进行划分，并在集成区域内设置对应的第一信号转接器311和第二信号转接器321，满足相应位数的量子处理器的需求。
如图5所示，作为本申请实施例的一种实施方式，若干个所述第二集成区域32在所述转接板3上对称设置。量子处理器位于第一集成区域31下方的第三固定件8上，将若干个第二集成区域32环绕第一集成区域31设置，确保第二集成区域32连接的直流信号线路和脉冲信号线路围绕量子处理器设置，易于线缆的连接，而且通过对称设置确保转接板3上连接好量子测控线路之后承重量均匀分布，提高转接板3的稳定性。
结合图4和图5所示，作为本申请实施例的一种实施方式，所述第一集成区域31的第一信号转接器311和所述第二集成区域32的第二信号转接器321均阵列设置在所述转接板3上。具体的，在转接板3上第一集成区域和第二集成区域均阵列开设若干个通孔，并通过通孔在第一集成区域内的转接板3安装第一信号转接器311，在第二集成区域内的转接板3安装第二信号转接器321。其中，第一信号转接器311和第二信号转接器321的两端均设置有SMA型连接器，可记为第一端的SMA连接器连接第一微波信号线路或直流信号线路或脉冲信号线路，第二端的SMA连接器连接量子处理器或者信号合成器7。
需要补充的是，第二端的SMA连接器，也可以先连接衰减器或者滤波器，在连接量子处理器或信号合成器7。具体情况需要根据量子测控线路中传输的驱动信号选择。
如图6所示，作为本申请实施例的一种实施方式，所述第二集成区域32包括相邻设置的若干子区域33，相邻子区域33的第二信号转接器321分别用于连接所述直流信号线路和所述脉冲信号线路。
第二集成区域32用于连接直流信号线路和脉冲信号线路，将第二集成区域32划分若干相邻的子区域33，每一个子区域33用于连接一种类型的量子测控线路，如直流信号线路或脉冲信号线路；而且相邻的子区域33用于连接不同类型的量子测控线路。
示例的，图7为图6中转接板3的A位置的一个第二集成区域32划分为3个子区域33的示意图，沿着转接板3的中间区域位置由内向外划分为多个子区域33，每个子区域33内都阵列设置若干个第二信号转接器321。其中，相邻子区域33连接不同类型的量子测控线路。以图7所述的子区域33为例，内侧的(即位于图7下方的)的子区域33中的第二信号转接器321连接直流信号线路，中间的(即位于图7中间的)子区域33中的第二信号转接器321连接脉冲信号线路，外侧的(即位于图7上方的)子区域33中的第二信号转接器321连接直流信号线路。
示例的，图8为图6中转接板3的B位置的一个第二集成区域32划分为2个子区域33的示意图，内侧的(即图8左侧的)子区域33中的第二信号转接器321连接直流信号线路，外侧的(即位于图8右侧的)子区域33中的第二信号转接器321连接直流信号线路。通过设置相邻子区域33，并将子区域中的第二信号转接器321分别连接不同类型的直流信号线路和脉冲信号线路，确保子区域33下方的信号合成器7的信号端口通过线缆连接直流信号线路和脉冲信号线路，避免线缆因为信号合成器7的信号端口位置而绕制，使得集成装置内的线缆连接方式简洁，易于连线。
结合图4和图9所示，作为本申请实施例的一种实施方式，所述信号合成器7的信号输入端口分别与相邻子区域33内的第二信号转接器321的对应。信号合成器7具有多个信号输入端口，各信号输入端口分别连接上方对应位置的子区域33内的第二信号转接器321，信号输入端口与第二信号转接器321的位置是对应的，通过电缆连接即可，线缆的形状简单、无须绕线，安装和连接效率高。
如图9所示，作为本申请实施例的一种实施方式，各所述第一固定件5沿垂直转接板3的方向层叠设置，且所述第一固定件5固定的信号合成器7与所述第二信号转接器321的位置对应。转接板3下方设置若干个第一固定件5用于固定信号合成器7，若干个第一固定件5与所述支撑件1垂直设置且固定连接，其中，若干个第一固定件5沿垂直转接板3的方向层叠设置，通过设置多层第一固定件5，可以固定的信号合成器7数量更多，满足更多的量子测控线路的集成需求。此外，层叠设置的若干个第一固定件5上固定的信号合成器7通过线缆连接上方第二集成区域32内的第二信号转接器321，信号合成器7与第二信号转接器321的阵列位置对应，确保信号合成器7安装在第一固定件5上后，信号合成器7与第二信号转接器321在垂直转接板3的方向上的位置是对应的，线缆的两端分别连接上下对应的信号合成器7和第二信号转接器321，避免多次绕制，提高了线缆的简洁度和线缆连接效率。
如图9所示，作为本申请实施例的一种实施方式，层叠设置的所述第一固定件5的尺寸等比例增加或缩小，具体的，沿远离转接板3的方向，层叠设置的所述第一固定件5的尺寸等比例增加，为线缆连接提供了较好的操作空间。将若干个第一固定件5层叠设置，并且将若干个第一固定件5的尺寸等比例改变，确保第一固定件5固定信号合成器7后，多层信号合成器7的信号端口是相互错开的，且与第二集成区域32内的第二信号连接器221的位置对应，线缆可以直接连接信号合成器7的信号端口与第二信号连接器221，提 高线缆连接效率。
作为本申请实施例的一种实施方式，第一固定件5的横截面形状包括C字形或U字形。C字形或U字形的结构能够更加便于信号合成器7的安装以及信号合成器7与线缆的连接，同时，也能对第一固定件5的空间进行充分的利用，可以根据实际需要，在支撑件1上设置多个第一固定件5。此外，第一固定件5的形状也可以包括其他形状，如L型。
此外，第一固定件5上开设有多个用于安装信号合成器7的安装孔，通过螺钉或者螺栓固定的方式将信号合成器7安装于第一固定件5的外侧面，使得信号合成器7的信号端口裸露便于线缆的连接。
如图10所示，作为本申请实施例的一种实施方式，所述第二集成区域32上远离所述第一集成区域31的一侧还设置有用于连接第二微波信号线路的第三信号转接器322，其中，第二微波信号用于量子态测量。量子处理器上集成的量子位的量子态信息需要通过微波信号进行测量，通过测量总线对多个量子位进行测量，因此需要施加的第二微波信号的数量较少。具体的，在转接板3上设置用于连接第二微波信号线路的第三信号转接器322，通过第三信号转接器322将第二微波信号传输至量子处理器上的测量总线，在第二集成区域32上远离所述第一集成区域31的一侧设置若干行或若干列第三信号转接器322连接第二微波信号线路，实现对量子位的测量。
如图11所示，作为本申请实施例的一种实施方式，还包括与所述支撑件平行设置且与所述转接板固定连接的若干个第四固定件9，所述第四固定件用于固定与所述第三信号转接器322电连接的电子器件10。其中，所述第四固定件9环绕所述转接板3对称设置。具体的，第四固定件9沿转接板3的外边缘对称设置且靠近所述第三信号转接器322的设置。通过第二微波信号线路对量子处理器进行测量时，线路中还需要设置多种对测量信号进行处理的电子器件10，如环形器、放大器等。
如图12所示，作为本申请实施例的一种实施方式，所述支撑件1上开设有第一通孔11，所述第一通孔11用于所述直流信号线路或所述脉冲信号线路或所述第一微波信号线路穿过。所述支撑件1上开设有第二通孔12，所述第二通孔12用于连接所述第二信号转接器321和所述信号合成器7的线缆穿过。具体的，第一通孔11开设于支撑板1上制冷盘2和转接板3之间的位置，第二通孔12开设于支撑板1上转接板3和第一固定件5之间的位置。
实施例三
现有技术中，在稀释制冷机中通过制冷盘对固定测控线路和电子器件的金属件进行降温时，因为没有直接接触或者接触面积小或者接触不良的原因导致热传导效率低，测控线路和电子器件不能及时、有效的降温，影响量子处理器的工作性能。
基于此，本申请实施例提供的一种用于稀释制冷机内的集成装置还包括图13所示的导热带，制冷盘可以通过导热带为金属件提供冷量。该导热带包括金属编织带21及位于所述金属编织带21两端的金属板22；所述金属编织带21包括若干股金属绞线；所述金属板22由所述金属编织带21压制形成，一端的所述金属板22用于连接固定稀释制冷机的制冷盘，另一端的所述金属板22用于连接固定测控线路和电子器件的金属件。
采用多股金属绞线编织形成金属编织带21，在确保导热性能的同时还能确保导热带的柔软性，便于弯折和安装；且采用压接工艺将金属编织带21的两端通过压接工艺加工形成 金属板22，金属板22与金属编织带21为一体结构，金属板22的形状为板状结构，接触面平整，金属板22与金属件和制冷盘均可以良好接触，极大提高导热性能。
作为本申请实施例的一种实施方式，单股所述金属绞线的直径不大于0.15毫米。可以理解的是，采用线径很细的金属绞线，并将多股绞在一起形成金属编织带21，多股金属绞线之间编织紧实且接触良好，使得编织后形成的金属编织带21的热导性更高。
如图14所示，作为本申请实施例的一种实施方式，所述金属板22包括压接后的金属绞线和金属柱23，所述金属柱23内设有第三通孔231，所述金属绞线的端部容置于所述第三通孔231内。金属板22由多股金属绞线通过压接工艺形成，在压接时，可以直接对多股金属绞线进行压接形成金属板22，也可以采用将金属绞线的端部容置与金属柱23的第三通孔231内，对金属柱23进行压接形成金属板22。相比较而言，采用金属柱23套设在多股金属绞线的两端进行压接，压接后形成的金属块形状容易固定，且表面平整，利于导热。
作为本申请实施例的一种实施方式，所述金属绞线和所述金属柱的材料包括铜。金属绞线和金属柱用于导热，导热性能良好的金属材料包括金、银、铜、铝等，其中，银和铜的导热性能最优，采用铜，成本相对较低。
具体的，铜包括紫铜、黄铜、白铜等，在紫铜加工的时候，还加入少量脱氧元素或其他元素，如普通紫铜(T1、T2、T3、T4)、无氧铜(TU0、TU1、TU2和高纯、真空无氧铜)、脱氧铜(TUP、TUMn)、添加少量合金元素的特种铜(砷铜、碲铜、银铜)四类，以改善材质和性能。本实施例中优选无氧铜TU0，适用于低温环境，导热性能更优。
作为本申请实施例的一种实施方式，对所述金属板22的表面机加工处理。金属编织带21一端的金属板22用于连接固定稀释制冷机的制冷盘，金属编织带21另一端的金属板22用于连接固定测控线路和电子器件的金属件，将压接形成的金属板22的表面进行机加工处理，使得金属板22的表面光滑平整，与制冷盘和金属件固定连接的时候接触更好，便于导热。
作为本申请实施例的一种实施方式，所述金属板22表面镀有金属层。所述金属层的材料包括金。金属板22设置于稀释制冷机内，环境温度比较低，容易氧化，通过在金属板22的表面电镀上一层材料为金的金属层，防止氧化，确保导热性能的稳定性。
作为本申请实施例的一种实施方式，所述金属板22的中心位置开设有第四通孔221。在金属板22中心位置开设第四通孔221，金属板22通过螺钉、螺纹、或者螺栓等方式与制冷盘和金属件固定连接。
基于同一申请构思，本申请实施例还提供一种量子计算机，包括稀释制冷机、位于所述稀释制冷机内的如上所述的集成装置、以及量子处理器。
以上依据图式所示的实施例详细说明了本申请的构造、特征及作用效果，以上所述仅为本申请的较佳实施例，但本申请不以图面所示限定实施范围，凡是依照本申请的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本申请的保护范围内。

Claims (19)

  1. 一种用于稀释制冷机内的集成装置，其特征在于，包括：
    支撑件，与稀释制冷机内温度最低的制冷盘固定连接；
    转接板，位于所述制冷盘下方且与所述支撑件固定连接，所述转接板上阵列设置有多个信号转接器，所述信号转接器的一端连接量子测控线路，所述信号转接器的另一端连接电子器件；
    若干第一固定件，位于所述转接板下方且与所述支撑件固定连接，用于固定所述电子器件；其中，各所述第一固定件层叠设置，且所述第一固定件与所述信号转接器的位置对应。
  2. 根据权利要求1所述的集成装置，其特征在于，所述支撑件包括平行设置的第一支撑件和第二支撑件，所述转接板上开设有供所述第一支撑件和所述第二支撑件穿过的过孔。
  3. 根据权利要求1或2所述的集成装置，其特征在于，所述第一固定件垂直设置于所述第一支撑件和所述第二支撑件的相反方向的面板上；或，
    所述第一固定件垂直设置于所述第一支撑件和所述第二支撑件的相对侧的面板上。
  4. 根据权利要求1-3中任一项所述的集成装置，其特征在于，所述第一固定件的横切面形状包括C字形或U字形。
  5. 根据权利要求1-4中任一项所述的集成装置，其特征在于，所述第一固定件上开设有多个用于安装所述电子器件的安装孔，所述电子器件通过安装孔安装于所述第一固定件上。
  6. 根据权利要求1-5中任一项所述的集成装置，其特征在于，所述集成装置还包括与所述支撑件平行设置且与所述转接板固定连接的若干个第二固定件，所述第二固定件环绕所述转接板对称设置。
  7. 根据权利要求1所述的集成装置，其特征在于，所述转接板包括位于中间区域的设置有第一信号转接器的第一集成区域、以及设置有第二信号转接器的若干个第二集成区域，若干个所述第二集成区域环绕所述第一集成区域设置，其中，所述第一信号转接器用于转接对量子态进行操控的第一微波信号线路，所述第二信号转接器用于转接直流信号线路和脉冲信号线路；
    所述第一固定件位于所述第二集成区域下方，用于固定对所述直流信号线路和所述脉冲信号线路进行处理的信号合成器；
    所述集成装置还包括第三固定件，所述第三固定件位于所述第一集成区域下方，用于固定量子处理器。
  8. 根据权利要求7所述的集成装置，其特征在于，若干个所述第二集成区域在所述转接板上对称设置；或，
    所述第一集成区域的第一信号转接器和所述第二集成区域的第二信号转接器均阵列设置。
  9. 根据权利要求7-8中任一项所述的集成装置，其特征在于，所述第二集成区域包括相邻设置的若干子区域，相邻子区域的第二信号转接器分别用于连接所述直流信号线路和所述脉冲信号线路。
  10. 根据权利要求7-9中任一项所述的集成装置，其特征在于，所述信号合成器的信 号输入端口分别与相邻子区域内的第二信号转接器对应；或，
    各所述第一固定件层叠设置，且所述第一固定件固定的信号合成器与所述第二信号转接器的位置对应。
  11. 根据权利要求7-10中任一项所述的集成装置，其特征在于，所述第二集成区域上远离所述第一集成区域的一侧还设置有用于连接第二微波信号线路的第三信号转接器。
  12. 根据权利要求11所述的集成装置，其特征在于，所述集成装置还包括与所述支撑件平行设置且与所述转接板固定连接的若干个第四固定件，所述第四固定件用于固定与所述第三信号转接器电连接的电子器件。
  13. 根据权利要求12所述的集成装置，其特征在于，所述第四固定件环绕所述转接板对称设置。
  14. 根据权利要求7-13中任一项所述的集成装置，其特征在于，所述支撑件上开设有第一通孔，所述第一通孔用于所述直流信号线路或所述脉冲信号线路或所述第一微波信号线路穿过，和/或，
    所述支撑件上开设有第二通孔，所述第二通孔用于连接所述第二信号转接器和所述信号合成器的线缆穿过。
  15. 根据权利要求1-14中任一项所述的集成装置，其特征在于，层叠设置的所述第一固定件的尺寸等比例增加或缩小。
  16. 根据权利要求1-15中任一项所述的集成装置，其特征在于，所述集成装置还包括导热带，所述稀释制冷机的制冷盘通过所述导热带为所述稀释制冷机内的金属件提供冷量；
    所述导热带包括金属编织带及位于所述金属编织带两端的金属板；
    所述金属编织带包括若干股金属绞线；
    所述金属板由所述金属绞线压接形成，一端的所述金属板用于连接固定稀释制冷机的制冷盘，另一端的所述金属板用于连接固定测控线路和电子器件的金属件。
  17. 根据权利要求16所述的集成装置，其特征在于，所述金属板包括压接后的金属绞线和金属柱，所述金属柱内设有第三通孔，所述金属绞线的端部容置于所述第三通孔内。
  18. 根据权利要求17所述的集成装置，其特征在于，单股所述金属绞线的直径不大于0.15毫米；或，
    所述金属绞线和所述金属柱的材料均包括铜，所述铜包括无氧铜；或，
    所述金属板表面镀有金属层，所述金属层的材料包括金。
  19. 一种量子计算机，其特征在于，包括稀释制冷机、位于所述稀释制冷机内的如权利要求1-18中任一项所述的集成装置、以及量子处理器。
PCT/CN2023/115919 2022-08-31 2023-08-30 用于稀释制冷机内的集成装置及量子计算机 WO2024046391A1 (zh)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210323273U (zh) * 2019-06-21 2020-04-14 合肥本源量子计算科技有限责任公司 一种量子芯片测试系统
US20200333263A1 (en) * 2019-04-18 2020-10-22 International Business Machines Corporation Measurement scheme for superconducting qubits using low-frequency microwave signals within a dilution refrigerator
CN217181555U (zh) * 2022-03-18 2022-08-12 合肥本源量子计算科技有限责任公司 一种用于稀释制冷机内的量子信号处理器件集成装置
CN217982411U (zh) * 2022-08-31 2022-12-06 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN115470917A (zh) * 2022-08-31 2022-12-13 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN115481743A (zh) * 2022-03-18 2022-12-16 合肥本源量子计算科技有限责任公司 一种用于稀释制冷机内的量子信号处理器件集成装置
CN218214171U (zh) * 2022-08-31 2023-01-03 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN218446590U (zh) * 2022-09-08 2023-02-03 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的导热带、制冷设备及量子计算机

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200333263A1 (en) * 2019-04-18 2020-10-22 International Business Machines Corporation Measurement scheme for superconducting qubits using low-frequency microwave signals within a dilution refrigerator
CN210323273U (zh) * 2019-06-21 2020-04-14 合肥本源量子计算科技有限责任公司 一种量子芯片测试系统
CN217181555U (zh) * 2022-03-18 2022-08-12 合肥本源量子计算科技有限责任公司 一种用于稀释制冷机内的量子信号处理器件集成装置
CN115481743A (zh) * 2022-03-18 2022-12-16 合肥本源量子计算科技有限责任公司 一种用于稀释制冷机内的量子信号处理器件集成装置
CN217982411U (zh) * 2022-08-31 2022-12-06 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN115470917A (zh) * 2022-08-31 2022-12-13 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN218214171U (zh) * 2022-08-31 2023-01-03 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的集成装置及量子计算机
CN218446590U (zh) * 2022-09-08 2023-02-03 合肥本源量子计算科技有限责任公司 用于稀释制冷机内的导热带、制冷设备及量子计算机

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