WO2024043736A1 - Dsp slurry concentration measuring device - Google Patents
Dsp slurry concentration measuring device Download PDFInfo
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- WO2024043736A1 WO2024043736A1 PCT/KR2023/012608 KR2023012608W WO2024043736A1 WO 2024043736 A1 WO2024043736 A1 WO 2024043736A1 KR 2023012608 W KR2023012608 W KR 2023012608W WO 2024043736 A1 WO2024043736 A1 WO 2024043736A1
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- reagent
- vessel
- fitting
- contraction
- sample
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- 239000002002 slurry Substances 0.000 title claims abstract description 53
- 239000003153 chemical reaction reagent Substances 0.000 claims description 99
- 230000035939 shock Effects 0.000 claims description 64
- 230000008602 contraction Effects 0.000 claims description 49
- 238000004140 cleaning Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 6
- 239000006096 absorbing agent Substances 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims description 5
- 238000005070 sampling Methods 0.000 claims description 5
- 230000008439 repair process Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 33
- 230000008859 change Effects 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101100420681 Caenorhabditis elegans tir-1 gene Proteins 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
Definitions
- the present invention relates to a DSP slurry concentration measurement device.
- a slurry concentration meter is installed in a measurement pipe through which a fluid flows, and the slurry concentration of the fluid flowing through the pipe of the measurement pipe is measured using a detection sensor installed in the measurement pipe.
- the above-mentioned background technology is technical information that the inventor possessed for deriving the present invention or acquired in the process of deriving the present invention, and cannot necessarily be said to be known technology disclosed to the general public before filing the application for the present invention. .
- the purpose of the present invention is to minimize the consumption of reagents by applying a 25ml Mixing Vessel. It can be used for online or laboratory analysis, and can be easily installed inside another device, making it convenient and efficient. Provides a DSP slurry concentration measurement device that can measure the concentration of slurry.
- the DSP slurry concentration measuring device may include a main body located parallel to the wall.
- a DSP slurry concentration measuring device includes a step control unit located on the upper surface of the main body to manipulate each step of measuring the concentration of the DSP slurry; an operation time control unit provided at the top of one side of the main body and controlling the operation time of each step of measuring the concentration of the DSP slurry, the concentration of which is measured by the step control unit; A first opening/closing unit that protects the outer surface of the operation time control unit and has the other side connected to the main body, but has one side that can be opened and closed from the main body and can be rotated to open and close on one side; and a second opening and closing unit, the other side of which is connected to the main body, but one side of which can be opened and closed from the main body, and is located at the bottom of the first opening and closing unit and can be opened and closed by rotating to one side to cope with an error situation and repair the main body when an error occurs. It may further include ;.
- the main body is fixed to the wall and can measure the concentration of DSP slurry.
- the concentration of the DSP slurry includes the following steps: After checking the initial state, removing bubbles from the reagent input line into which the reagent is introduced to prevent analysis errors; Emptying the reagent vessel containing the reagent introduced through the reagent input line (Vessel Empty); Cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container; Cleaning the reagent vessel using the sample loop pipe after cleaning the sample root pipe (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; Extracting a sample (sampling) through the sample loop; Transferring the extracted sample (sample) to a reagent container (Sample Transfer); Measuring (analyzing) the sample transferred to the reagent container under set conditions; Initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent; Emptying
- the main body may be further provided with a support at the bottom to maintain the main body at a certain height from the floor and protect it from shock or vibration generated from the floor.
- the support plate is formed in the shape of a square plate with a predetermined height and is provided in a pair so as to be located at the bottom of the main body and at the same time on the floor;
- a pair of attachment portions located at the center of one side of the support plate provided as a pair and one side of which is attached to the support plate;
- a pair of fitting parts formed in the shape of a circular band having a predetermined thickness and formed in the shape of a coil spring and attached to the other side of the attachment part provided as a pair; and a shock absorbing portion located in the empty center of the fitting portion and absorbing shock or vibration generated from the outside.
- the shock absorbing part is formed with a diameter that can be inserted through the fitting located at the upper end of the pair of fitting parts and is fixed to the fitting located at the upper end of the pair of fitting parts.
- upper fastening part A first contraction/relaxation part located at the bottom of the upper fastening part, formed in the shape of a cylinder and having a diameter larger than the diameter of the upper fastening part, and driven to contract or relax by an external shock or vibration; a first support part located at the bottom of the first contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; a second contraction/relaxation part located at the bottom of the first support part, formed in the shape of a cylinder, with a diameter smaller than that of the first support part, and driven to contract or relax by an external shock or vibration; a second support part located at the bottom of the second contraction/re
- the upper fastening part may be provided with an attachment material on the upper surface to prevent the upper fastening part from being separated from the fitting part located at the upper end due to external shock or vibration.
- the first contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
- the second contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
- the first contraction/relaxation part and the second contraction/relaxation part are formed to have different thicknesses and can primarily and secondaryly absorb shocks generated from the outside, respectively.
- the fitting part has a fitting reinforcement formed at one end, and is fixed while wrapping the outer surface of the upper fastening part or the lower fastening part of the shock absorbing part, so that the diameter of the upper fastening part or the lower fastening part is centered. After penetrating, the fitting can be strengthened.
- the DSP slurry concentration measurement method can wait as a circuit in the initial state of All Valve Off, Syringe Initialize command execution, and Stir Pad Off.
- the initial state is constantly checked to maintain the LS (Leak Sensor) and LC (Load Cell), and the output voltage of each electrode is checked - the range of the electrode status is determined.
- the check process can be omitted when the device is first turned on, and the check can be performed after adding water to the vessel.
- the method of measuring the concentration of the DSP slurry includes the steps of removing bubbles from the reagent input line into which the reagent is input, after checking the initial state, to prevent analysis errors from occurring; Emptying the reagent vessel containing the reagent introduced through the reagent input line (Vessel Empty); Cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container; Cleaning the reagent vessel using the sample loop pipe after cleaning the sample root pipe (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; Extracting a sample (sampling) through the sample loop; Transferring the extracted sample (sample) to a reagent container (Sample Transfer); Measuring (analyzing) the sample transferred to the reagent container under set conditions; Initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the
- each step may be performed through a control unit of the DSP slurry concentration measuring device.
- the DSP slurry concentration measuring device includes a body located parallel to the wall, fixed to the wall, and measuring the concentration of the DSP slurry; A step control unit located on the upper surface of the main body to manipulate each step of measuring the concentration of the DSP slurry; an operation time control unit provided at the top of one side of the main body and controlling the operation time of each step of measuring the concentration of the DSP slurry, the concentration of which is measured by the step control unit; A first opening/closing unit that protects the outer surface of the operation time control unit and has the other side connected to the main body, but has one side that can be opened and closed from the main body and can be rotated to open and close on one side; and a second opening and closing unit, the other side of which is connected to the main body, but one side of which can be opened and closed from the main body, and is located at the bottom of the first opening and closing unit and can be opened and closed by rotating to one side to cope with an error situation and repair the main body when an error occurs.
- the main body may be further provided with a support at the bottom to maintain the main body at a certain height from the floor and protect it from shock or vibration generated from the floor.
- the support plate is formed in the shape of a square plate with a predetermined height and is provided in a pair so as to be located at the bottom of the main body and at the same time on the floor;
- a pair of attachment portions located at the center of one side of the support plate provided as a pair and one side of which is attached to the support plate;
- a pair of fitting parts formed in the shape of a circular band having a predetermined thickness and formed in the shape of a coil spring and attached to the other side of the attachment part provided as a pair; and a shock absorbing portion located in the empty center of the fitting portion and absorbing shock or vibration generated from the outside.
- the shock absorbing part is formed with a diameter that can be inserted through the fitting located at the upper end of the pair of fitting parts and is fixed to the fitting located at the upper end of the pair of fitting parts.
- upper fastening part A first contraction/relaxation part located at the bottom of the upper fastening part, formed in the shape of a cylinder and having a diameter larger than the diameter of the upper fastening part, and driven to contract or relax by an external shock or vibration;
- a first support part located at the bottom of the first contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate;
- a second contraction/relaxation part located at the bottom of the first support part, formed in the shape of a cylinder and having a diameter smaller than that of the first support part, and driven to contract or relax by an external shock or vibration;
- a second support part located at the bottom of the second contraction
- the upper fastening part may be provided with an attachment material on the upper surface to prevent the upper fastening part from being separated from the fitting part located at the upper end due to external shock or vibration.
- the first contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
- the second contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
- the first contraction/relaxation part and the second contraction/relaxation part are formed to have different thicknesses and can primarily and secondaryly absorb shocks generated from the outside, respectively.
- the fitting part has a fitting reinforcement formed at one end, and is fixed while wrapping the outer surface of the upper fastening part or the lower fastening part of the shock absorbing part, so that the diameter of the upper fastening part or the lower fastening part is centered. After penetrating, the fitting can be strengthened.
- the DSP slurry concentration measurement device for analyzing the H2O2 concentration in the slurry proposed by the present invention can minimize the consumption of reagents by applying a 25ml Mixing Vessel.
- the main body is equipped with a step control unit and an operation time control unit, so that the step operation and operation time operation for measuring the concentration of the slurry can be controlled separately, so even managers who are confused or are beginners can easily operate it.
- the base support is provided in the empty space formed at a certain distance from the bottom of the main body, the main body is fixed more firmly and can be protected from shock or vibration generated from the floor.
- the insertion part that secures the shock absorber is formed with a reinforcing part, which can strengthen the degree of fit of the shock absorber, thereby preventing the shock absorber from being separated from the support plate even if shock or vibration occurs regularly from the outside.
- the first contracted part is driven downward into the second contracted part by the contraction drive of the bellows driving part, the air moves in the direction of the air layer by the driving of the bellows driving part, and the elastic part is driven by the air flowing into the air layer. It can be driven upward by a spring to absorb shock or vibration occurring from the outside.
- Figure 1 is a diagram showing the configuration of a DSP slurry concentration measuring device according to an embodiment of the present invention.
- FIGS. 2 to 30 are circuit diagrams showing a method for measuring DSP slurry concentration according to an embodiment of the present invention.
- Figures 31 to 35 are diagrams showing the configuration of a support, which is a part of a DSP slurry concentration measuring device according to another embodiment of the present invention.
- 1 is a diagram showing the configuration of a DSP slurry concentration measuring device for measuring the concentration of DSP slurry.
- the DSP slurry concentration measuring device 100 for measuring the concentration of DSP slurry includes a main body 110, a step control unit 130, an operation time control unit 150, a first opening and closing unit 170, and a second opening/closing unit 170. It may include an opening/closing unit 190.
- the main body 110 is positioned parallel to the wall and fixed to the wall, and can measure the concentration of the DSP slurry.
- the bottom of the main body 110 may be further provided with a support support to maintain it at a certain height from the floor and protect it from shock or vibration generated from the floor, which will be described later with reference to FIGS. 31 to 35. do.
- the stage control unit 130 is located on the upper surface of the main body 110 and can operate each stage of measuring the concentration of the DSP slurry.
- the operation time control unit 150 is provided at the top of one side of the main body 110 and can control the operation time of each step of measuring the concentration of the DSP slurry whose concentration is measured by the step control unit 130.
- the first opening and closing unit 170 protects the outer side of the operation time control unit 150, and the other side is connected to the main body, but one side can be opened and closed from the main body 110, so that it can be opened and closed by rotating to one side.
- the second opening and closing part 190 is connected to the main body 110 on the other side, but one side can be opened and closed from the main body 110 and is located at the bottom of the first opening and closing part 170 to cope with the error situation when an error occurs. (110) can be opened and closed by rotating on one side to repair.
- the DSP slurry concentration measuring device 100 proposed by the present invention utilizes the quantitative reaction of the substance to be measured in the sample and a standard reagent whose concentration is known, and determines the concentration of the sample by the amount of reagent consumed up to the endpoint. It can be measured automatically.
- the DSP slurry concentration measurement device 100 proposed by the present invention applies dosing technology, which is a technology for quantitatively injecting reagents.
- dosing technology is a technology for quantitatively injecting reagents.
- a certain amount of liquid can be injected using an auto pipette, syringe pump, and peristatic pump. There is, and control of the fine injection amount is very important.
- the DSP slurry concentration measurement device 100 proposed by the present invention applies sensing technology, and electrodes, Ph, ORP, ISE Electrode, etc. are generally used to measure the reactivity of samples and reagents, and are used for product sales rather than technology development. It is common to verify performance before applying.
- Sensing technology is applied to products with high chemical resistance and stability of measured values (sensor output voltage), and the stability of the sensor signal can be secured by applying a low noise filter.
- 2 to 30 are diagrams sequentially showing a circuit diagram for measuring DSP slurry concentration and a method for measuring DSP slurry concentration.
- SD2, 3, 4, 5 Valve Change, SD2 Push UP, SD3 Push UP, SD4 Push UP, and SD5 Push UP are used to remove bubbles in the syringe introduced from the reagent input pipe. ), removing the
- SD2, SD3, SD4, SD5 Valve Change, SD2 Pull Down, SD3 Pull Down, SD4 Pull Down, and SD5 Pull Down are used to refill the syringe with reagents. May include steps.
- the step (Vessel Empty) of emptying the reagent vessel containing the reagent introduced through the reagent input line can be confirmed.
- It may include the step of turning ON AV10-1, 2, and 3 in the circuit diagram and turning ON AV3-1, 2, and 3 to drain the contaminated water (reagent + DIW) in the vessel into which the reagent has been added.
- the reagent container may be provided as a 25ml Mixing Vessel.
- AV4-1, 2, and 3 are turned ON, AV5B, AV6B, and AV7B are turned ON, Stir1, 2, and 3 are turned ON, AV10-1, 2, and 3 are turned ON, and AV4-1, 2, and 3 are turned ON. It may include a step of cleaning the vessel before measuring by turning it off.
- the step of emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty) can be confirmed.
- It may include the step of turning AV2-1, 2, and 3 in the circuit diagram Off, turning AV5B, AV6B, and AV7B Off, and turning AV3-1, 2, and 3 ON to drain the DIW in the vessel into which the reagent has been added.
- the step of emptying the vent pipe connected to the reagent container can be confirmed.
- This may include the step of removing DIW in the vent opening remaining during vessel cleaning by turning AV10-1, 2, and 3 in the circuit diagram off and turning AV4-1, 2, and 3 on.
- AV3-1, 2, and 3 are turned off, AV4-1, 2, and 3 are turned off, AV5A, AV6A, and AV7A are turned on, and AV1-1, 2, and 3 are turned on to capture samples in the sample loop. May include steps.
- the step of transferring the extracted sample (sample) to the reagent container (Sample Transfer) can be confirmed.
- AV1-1, 2, and 3 are turned off, AV5A, AV6A, and AV7A are turned off, AV4-1 is turned ON, and AV7B is turned ON. SD1 is pushed up, and Stir is turned ON to capture the sample in the sample loop. Step of introducing into the vessel,
- SD1 By driving AV2-2 Off and AV6A Off in the circuit diagram, SD1 is changed as a valve, by driving AV4-3 ON and AV5B ON, SD1 is pushed up, and by driving Stir ON, the sample captured in the sample loop is It may include the step of putting it into a vessel.
- AV5A is turned off and AV4-1 and 2 are turned on to change the valves of SD2, SD3, SD4, and SD5, and SD2, SD3, and SD4 are pushed up to analyze the sample under the set recipe conditions.
- the step of initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent can be confirmed.
- This may include the steps of turning off AV4-1, 2, and 3 in the circuit diagram to change the valves of SD2, SD3, SD4, and SD5, and initializing the syringe by driving All Syringe Initialize, and draining DIW and reagents.
- the step of emptying the reagent vessel from which the reagent has been removed (Vessel Empty) can be confirmed.
- It can include the steps of turning ON AV3-1, 2, and 3 in the circuit diagram, turning ON AV10-1, 2, and 3, and driving SD1, SD2, SD3, SD4, and SD5 through valve change to drain the sample for which analysis has been completed. there is.
- circuit diagram it includes the steps of cleaning the sample loop after measuring by turning AV3-1, 2, and 3 off, turning AV10-1, 2, and 3 off, turning Stir off, and turning AV2-1, 2, and 3 ON. can do.
- the step of cleaning the reagent vessel (Vessel Cleaning) can be confirmed.
- the step of emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty) can be confirmed.
- It may include the step of draining the DIW in the vessel by turning AV2-1, 2, and 3 in the circuit diagram Off, driving AV5B, AV6B, and AV7B Off, and turning AV3-1, 2, and 3 ON.
- the step of emptying the vent pipe connected to the reagent container can be confirmed.
- This may include the step of removing DIW in the vent opening remaining during vessel cleaning by turning AV10-1, 2, and 3 in the circuit diagram off and turning AV4-1, 2, and 3 on.
- This may include the step of turning AV10-1, 2, and 3 in the circuit diagram OFF and turning AV4-1, 2, and 3 ON to fill the vessel with DIW and wait for the next analysis.
- Figures 31 to 35 are diagrams showing the configuration of a support, which is a part of a DSP slurry concentration measuring device according to another embodiment of the present invention.
- the main body according to another embodiment of the present invention is provided with a base support 200 in an empty space formed at a certain distance from the floor surface, so that the main body is more firmly fixed and It can protect against shock or vibration.
- the step control unit 130 or the operation time control unit 150 or the operation time control unit 150 or the operation time control unit 150 or the operation time control unit 150 is operated, or the main body is protected from vibration occurring during operation. can do.
- the base support may include a support plate (210, 210'), an attachment part (230, 230'), a fitting part (250), and a shock absorbing part (290).
- the support plates 210 and 210' are formed in the shape of a square plate with a predetermined height and may be provided as a pair so that they are located at the bottom of the main body 110 and at the same time on the floor.
- a pair of support plates 210 and 210' may be positioned facing each other, just as the lower end of the main body 110 faces the floor.
- the attachment portions (230, 230') are located at the center of one side of the support plates (210, 210') provided as a pair, and one side may be attached to the support plates (210, 210'). They may be provided on the support plates 210 and 210', respectively, to form a pair.
- the fitting portion 250 is formed in the shape of a circular band with a predetermined thickness and is formed in the shape of a coil spring, and a pair of fitting portions 250 are formed by a pair of attachment portions 230 and 230'. It may be attached to the attachment portions 230 and 230', respectively.
- the fitting part 250 has a fitting reinforcement part 270, 270' formed at one end, and is fixed to the upper part by wrapping the outer surface of the upper fastening part 296 or the lower fastening part 297 of the shock absorbing part 290.
- the diameter of the fastening part 296 or the lower fastening part 297 can be strengthened to be inserted and fixed after penetrating the center.
- the fitting reinforcement parts 270 and 270' can be fixed by wrapping the outer surfaces of the upper fastening part 296 and the lower fastening part 297, the outer surfaces of which are surrounded by the fitting part 250, once again. Rather than fitting and fixing the upper fastening part 296 and the lower fastening part 297 by the part 250 alone, the fastening force can be increased because the reinforcing fitting parts 270 and 270' are wrapped once more.
- the fitting part 250 that fixes the shock absorbing part 290 is formed with fitting reinforcing parts 270 and 270', so that the shock absorbing part 290 is fitted.
- the degree can be strengthened, and thus the shock absorbing part 290 can be prevented from being separated from the support plates 210 and 210' even if external shock or vibration occurs regularly.
- the shock absorbing part 290 is located in the empty center of the fitting part 250 and can absorb shock or vibration generated from the outside.
- the shock absorbing part 290 includes an upper fastening part 296, a first contraction/relaxation part 295, a first support part 291, a second contraction/relaxation part 292, a second support part 293, and a lower fastening part. It may include (297).
- the upper fastening part 296 is formed with a diameter that can be inserted through the fitting part 250 located at the upper end of the pair of fitting parts 250, and is located at the upper end of the pair of fitting parts 250. It can be fixed at (250).
- the upper fastening part 296 may be provided with an attachment material 294 on its upper surface to prevent it from being separated from the fitting part 250 located at the upper end due to external shock or vibration.
- the first contraction/relaxation part 295 is located at the bottom of the upper fastening part 296, and is formed in the shape of a cylinder with a diameter larger than the diameter of the upper fastening part 296, and is resistant to shock or vibration occurring from the outside. It can be driven to contract or relax.
- the first contraction/relaxation portion 295 may be made of a material that can be formed into the shape of a bellows to allow for shock or relaxation generated from the outside.
- the first support part 291 is located at the bottom of the first contraction and relaxation part 295 and is formed in the shape of a disk with a predetermined height and a diameter larger than the diameter of the first contraction and relaxation part 295, but the width of the support plate. It can be formed into a smaller diameter.
- the second contraction/relaxation part 292 is located at the bottom of the first support part 291 and is formed in the shape of a cylinder with a diameter smaller than the diameter of the first support part 291, and is formed by shock or vibration generated from the outside. It can be driven to contract or relax.
- the second contraction/relaxation portion 292 may be made of a material that can be formed into a bellows shape to allow for shock or relaxation generated from the outside.
- the first contraction/relaxation part 295 and the second contraction/relaxation part 292 are formed with different thicknesses and can respectively absorb external shocks primary and secondary.
- the second support part 293 is located at the lower end of the second contraction and relaxation part 292 and is formed in the shape of a disk with a predetermined height and a diameter larger than the diameter of the first contraction and relaxation part 295.
- the support plate 210 , 210') may be formed with a diameter smaller than the width.
- the lower fastening part 297 is formed with a diameter that can be inserted through the fitting part 250 located at the bottom of the pair of fitting parts 250, and is located at the lower end of the pair of fitting parts 250. It can be fixed at (250).
- the shock absorbing part 300 includes a first contracted part 310, a contracted frame 330, an elastic part 350, and a second contracted part ( 260) and a fitting protrusion 370.
- the first contracted portion 310 is formed in the shape of a cylinder with a predetermined diameter and height, and is located at the top so that it can be driven to contract or relax by shock or vibration generated from the outside.
- the first contracted part 310 may include an upper forming part 314, a lower forming part 316, and an air layer 312.
- the upper forming part 314 is formed in the longitudinal direction of the upper end and may be located at the top of the second contracted part 260, and the lower forming part 316 is located inside the second contracted part 260 and has a hemispherical shape. It may be formed in the shape of, and the air layer 312 may be located in the center of the bottom forming portion 316 and may be formed as an empty space.
- the shrinking frame 330 may be located inside the first shrinking portion 310.
- the shrinkable frame may include an inner elastic portion 333, an upper and lower space portion 332, and a shrinkage limiting portion 336.
- the inner elastic portion 333 is in contact with the inner side of the upper forming portion 314 and is formed in the shape of ' ⁇ ' and ' ⁇ ' and is positioned to face each other, and is formed in the shape of ' ⁇ ' and ' ⁇ ' at the top.
- the portion protruding outward may be fitted and fixed into the fitting portion 250.
- the inner elastic portion 333 may have a diameter that can be fitted and fixed into the fitting portion 250.
- the inner elastic portion 333 may be formed to contract and drive as the elastic portion 350 moves toward the upper end by the contraction drive of the elastic portion 350.
- the inner elastic portion 333 may be formed of a material such as rubber or silicone to enable contraction as the elastic portion 350 moves in the upper direction by the contraction drive of the elastic portion 350, but is limited thereto. However, as long as it is a material that is driven to contract by the pressure of the elastic portion 350, it can be included regardless of its name.
- the upper and lower space parts 332 may refer to an empty space formed so that the elastic part 350 is located.
- the shrinkage limiting portion 336 is located at the lower left side of the inner elastic portion 333, which is formed in an 'L' shape, and can limit the shrinkage length of the elastic portion 350 located in the upper and lower space portions 332.
- the contraction limiting portion 336 is formed of a hard material that does not contract, unlike the inner elastic portion 333, and can limit the distance that the elastic portion 350 moves in the upper direction by contracting.
- the elastic part 350 is located at the inner bottom of the first contracted part 310, but the upper end is fixed to the contracted frame 330, and on the outside is a spring ( 354) is provided so it can be moved up and down.
- the elastic part 350 may be provided with an elastic support part 352 formed in the shape of ' ⁇ ' at the center.
- the elastic support portion 352 may be positioned with the upper protruding portion inserted into the upper and lower space portions 332 formed between the inner elastic portions 333 positioned to face each other.
- the elastic support portion 352 is located at its lower end in the upper and lower space portions 332 and moves in the direction of the upper end by the spring 354 positioned to surround the outside, and then moves in the direction of the inner elastic portion 333 and the contraction limiting portion 336. Movement toward the top may be restricted due to contact with the bottom.
- the lower end of the inner elastic part 333 which is formed in the shape of ' ⁇ ', can be contracted and driven to absorb the recoil that occurs when the elastic support part 352 moves in the upper direction by the spring 354.
- the second contracted part 260 is formed with a diameter larger than that of the first contracted part 310 and is located at the bottom of the first contracted part 310, and can be driven to contract or relax by an external shock or vibration. there is.
- the second contracting part 260 is provided with a bellows driving part 326 formed in a bellows shape at the lower center of the inner side, and can be driven to contract or relax by shock or vibration generated from the outside.
- the second contracted part 260 may have an insertion groove (not shown) formed at the top into which the first contracted part 310 is inserted.
- the bellows driving part 326 may be formed in a shape corresponding to the shape of the lower end of the first contracted part 310, and its upper end may be in contact with the lower end of the first contracted part 310.
- bellows driving part 326 may be driven to contract or relax to absorb shock or vibration applied to the first contracted part 310.
- the fitting protrusion 370 is located at the bottom of the second contracted part 260 and is formed to have a diameter that penetrates the fitting part 250 and can be fixed to the fitting part 250.
- the shock absorber 300 moves the first contracted part 310 downward into the second contracted part 260 by the contraction drive of the bellows driving part 326, and is driven by the bellows driving part 326.
- the air moves in the direction of the air layer 312, and the elastic portion 350 is driven upward by the spring 354 by the air flowing into the air layer 312 to absorb shock or vibration occurring from the outside. can perform its role.
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Abstract
The present invention relates to a DSP slurry concentration measuring device, which can comprise a main body positioned parallel to a wall.
Description
본 발명은 DSP 슬러리 농도 측정 장치에 관한 것이다.The present invention relates to a DSP slurry concentration measurement device.
슬러리농도계를 유체가 흐르는 측정관에 설치하고, 측정관의 파이프를 통해 흐르는 유체의 슬러리 농도 등을 측정관에 설치된 감지센서를 이용하여 측정하게 된다.A slurry concentration meter is installed in a measurement pipe through which a fluid flows, and the slurry concentration of the fluid flowing through the pipe of the measurement pipe is measured using a detection sensor installed in the measurement pipe.
그런데 상기 측정관의 파이프를 따라 흐르는 유체의 농도를 측정할 경우에 유체가 슬러리(slurry)인 경우에는 슬러리가 유체의 슬러리 농도를 감지하는 감지센서에 달라붙어 감지센서의 센싱기능이 저하되는 문제점이 있다.However, when measuring the concentration of the fluid flowing along the pipe of the measuring tube, if the fluid is slurry, the slurry sticks to the sensor that detects the slurry concentration of the fluid, causing a problem that the sensing function of the sensor is deteriorated. there is.
한편, 전술한 배경 기술은 발명자가 본 발명의 도출을 위해 보유하고 있었거나, 본 발명의 도출 과정에서 습득 한 기술 정보로서, 반드시 본 발명의 출원 전에 일반 공중에게 공개된 공지기술이라 할 수는 없다.Meanwhile, the above-mentioned background technology is technical information that the inventor possessed for deriving the present invention or acquired in the process of deriving the present invention, and cannot necessarily be said to be known technology disclosed to the general public before filing the application for the present invention. .
본 발명의 목적은25ml Mixing Vessel을 적용하여 시약의 소모량을 최소화할 수 있으며, 온라인(Online) 또는 연구실(Lab) 분석 겸욕으로 사용될 수 있으며, 다른 장치의 내부에 간단하게 설치가 가능하여 편리하고 효율적으로 슬러리의 농도를 측정할 수 있는 DSP 슬러리 농도 측정 장치를 제공한다.The purpose of the present invention is to minimize the consumption of reagents by applying a 25ml Mixing Vessel. It can be used for online or laboratory analysis, and can be easily installed inside another device, making it convenient and efficient. Provides a DSP slurry concentration measurement device that can measure the concentration of slurry.
본 발명의 기술적 과제는 이상에서 언급한 기술적 과제로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The technical problem of the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.
본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 장치는, 벽과 평행하게 위치한 본체;를 포함할 수 있다.The DSP slurry concentration measuring device according to an embodiment of the present invention may include a main body located parallel to the wall.
본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 장치는, 상기 본체의 상단면에 위치하여 상기 DSP 슬러리의 농도를 측정하는 각 단계를 조작하는 단계제어부; 상기 본체의 일측면 상단에 구비되어 있으며, 상기 단계제어부에 의해 농도가 측정되는 DSP 슬러리의 농도 측정의 각 단계의 동작 시간을 제어하는 동작시간제어부; 상기 동작시간제어부의 외측면을 보호하며 타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가능하여 일측면으로 회전 개폐 가능한 제1 개폐부; 및 타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가 가능하여 상기 제1 개폐부의 하단에 위치하여 오류 발생 시 오류 상황에 대처하여 본체를 수리하도록 일측면으로 회전 개폐 가능한 제2 개폐부;를 더 포함할 수 있다.A DSP slurry concentration measuring device according to an embodiment of the present invention includes a step control unit located on the upper surface of the main body to manipulate each step of measuring the concentration of the DSP slurry; an operation time control unit provided at the top of one side of the main body and controlling the operation time of each step of measuring the concentration of the DSP slurry, the concentration of which is measured by the step control unit; A first opening/closing unit that protects the outer surface of the operation time control unit and has the other side connected to the main body, but has one side that can be opened and closed from the main body and can be rotated to open and close on one side; and a second opening and closing unit, the other side of which is connected to the main body, but one side of which can be opened and closed from the main body, and is located at the bottom of the first opening and closing unit and can be opened and closed by rotating to one side to cope with an error situation and repair the main body when an error occurs. It may further include ;.
일 실시예에 따른, 상기 본체는, 벽에 고정되며 DSP 슬러리의 농도를 측정할 수 있다.According to one embodiment, the main body is fixed to the wall and can measure the concentration of DSP slurry.
일 실시예에 따른, 상기 DSP 슬러리의 농도는, 상기 초기 상태 체크 후, 시약이 투입되는 시약 투입 라인(Reagent Input Line)의 거품(Bubble)을 제거하여 분석 오차 발생을 방지하는 단계; 상기 시약 투입 라인을 통해 투입되는 시약이 담아지는 시약 용기를 비우는 단계(Vessel Empty); 상기 시약 용기에 담아진 상기 시약의 정확한 샘플을 추출하도록 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계; 상기 샘플 루트 배관의 세척 후 상기 샘플 루프 배관을 이용해 상기 시약 용기를 세척하는 단계(Vessel Cleaning); 상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계; 샘플(견본, Sampling)을 상기 샘플 루프를 통해 추출하는 단계; 추출한 상기 샘플(견본)을 시약 용기로 전송하는 단계(Sample Transfer); 상기 시약 용기에 전송된 상기 샘플을 설정된 조건으로 측정(분석, Measuring)하는 단계; 상기 시약이 흡입되는 흡입부를 초기화시켜(Syringe Initialize) DIW 및 시약을 빼내(Drain)는 단계; 시약이 제거된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계; 상기 시약 용기를 세척하는 단계(Vessel Cleaning); 상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계; 및 상기 시약 용기를 측정(분석, Measuring)이 필요한 다른 시약으로 채우는 단계(Vessel Refill);를 통해 측정할 수 있다.According to one embodiment, the concentration of the DSP slurry includes the following steps: After checking the initial state, removing bubbles from the reagent input line into which the reagent is introduced to prevent analysis errors; Emptying the reagent vessel containing the reagent introduced through the reagent input line (Vessel Empty); Cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container; Cleaning the reagent vessel using the sample loop pipe after cleaning the sample root pipe (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; Extracting a sample (sampling) through the sample loop; Transferring the extracted sample (sample) to a reagent container (Sample Transfer); Measuring (analyzing) the sample transferred to the reagent container under set conditions; Initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent; Emptying the reagent vessel from which the reagent has been removed (Vessel Empty); Cleaning the sample loop pipe; Cleaning the reagent vessel (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; And it can be measured through a step of filling the reagent vessel with another reagent that needs to be measured (analysis, measuring) (Vessel Refill).
일 실시예에 따른, 상기 본체는, 하단에 바닥면으로부터 일정 높이 유지하도록 지지하며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호하는 받침지지대가 더 구비되어 있을 수 있다.According to one embodiment, the main body may be further provided with a support at the bottom to maintain the main body at a certain height from the floor and protect it from shock or vibration generated from the floor.
일 실시예에 따른, 상기 받침지지대는, 소정의 높이를 갖는 사각 판의 형상으로 형성되어 있으며 상기 본체의 하단에 위치함과 동시에 바닥면에 위치하도록 한 쌍으로 구비되는 지지판; 한 쌍으로 구비된 상기 지지판의 일면 중앙에 위치하여 일측면은 상기 지지판에 부착되어 있는 한 쌍의 부착부; 소정의 두께를 갖는 원형 띠의 형상으로 형성되되 코일 스프링의 형상으로 형성되고, 한 쌍으로구비되는 상기 부착부의 타측면에 부착되는 한 쌍의 끼움부; 및 상기 끼움부의 비어 있는 중앙에 끼워진 채 위치하고, 외부로부터 발생하는 충격 또는 진동을 흡수하는 충격흡수부;를 포함할 수 있다.According to one embodiment, the support plate is formed in the shape of a square plate with a predetermined height and is provided in a pair so as to be located at the bottom of the main body and at the same time on the floor; A pair of attachment portions located at the center of one side of the support plate provided as a pair and one side of which is attached to the support plate; A pair of fitting parts formed in the shape of a circular band having a predetermined thickness and formed in the shape of a coil spring and attached to the other side of the attachment part provided as a pair; and a shock absorbing portion located in the empty center of the fitting portion and absorbing shock or vibration generated from the outside.
일 실시예에 따른, 상기 충격흡수부는, 한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부에 고정되는 상단체결부; 상기 상단체결부의 하단에 위치하며, 원기둥의 형상으로 형성되되 상기 상단체결부의 직경보다 큰 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제1 수축이완부; 상기 제1 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제1 지지부; 상기 제1 지지부의 하단에 위치하고, 원기둥의 형상으로 형성되되 상기 제1 지지부의 직경보다 작은 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제2 수축이완부; 상기 제2 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제2 지지부; 및 한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부에 고정되는 하단체결부;를 포함할 수 있다.According to one embodiment, the shock absorbing part is formed with a diameter that can be inserted through the fitting located at the upper end of the pair of fitting parts and is fixed to the fitting located at the upper end of the pair of fitting parts. upper fastening part; A first contraction/relaxation part located at the bottom of the upper fastening part, formed in the shape of a cylinder and having a diameter larger than the diameter of the upper fastening part, and driven to contract or relax by an external shock or vibration; a first support part located at the bottom of the first contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; a second contraction/relaxation part located at the bottom of the first support part, formed in the shape of a cylinder, with a diameter smaller than that of the first support part, and driven to contract or relax by an external shock or vibration; a second support part located at the bottom of the second contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; And a lower fastening part formed to a diameter that can be fitted through the fitting located at the lower end of the pair of fitting parts and fixed to the fitting part located at the lower end of the pair of fitting parts. .
일 실시예에 따른, 상기 상단체결부는, 외부로부터 발생하는 충격 또는 진동에 의해 상단에 위치한 상기 끼움부로부터 이탈되는 것을 방지하도록 상단면에 부착소재가 구비되어 있을 수 있다.According to one embodiment, the upper fastening part may be provided with an attachment material on the upper surface to prevent the upper fastening part from being separated from the fitting part located at the upper end due to external shock or vibration.
일 실시예에 따른, 상기 제1 수축이완부는, 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.According to one embodiment, the first contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
일 실시예에 따른, 상기 제2 수축이완부는, 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.According to one embodiment, the second contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
일 실시예에 따른, 상기 제1 수축이완부 및 상기 제2 수축이완부는, 각각 다른 두께로 형성되어 외부로부터 발생하는 충격을 1차 및 2차적으로 각각 흡수할 수 있다.According to one embodiment, the first contraction/relaxation part and the second contraction/relaxation part are formed to have different thicknesses and can primarily and secondaryly absorb shocks generated from the outside, respectively.
일 실시예에 따른, 상기 끼움부는, 일단에 끼움보강부가 형성되어 있어 상기 충격흡수부의 상기 상단체결부 또는 상기 하단체결부의외측면을 감싼 채 고정하여 상기 상단체결부 또는 상기 하단체결부의 직경이 중앙을 관통한 후 끼움 고정되는 것을 강화할 수 있다.According to one embodiment, the fitting part has a fitting reinforcement formed at one end, and is fixed while wrapping the outer surface of the upper fastening part or the lower fastening part of the shock absorbing part, so that the diameter of the upper fastening part or the lower fastening part is centered. After penetrating, the fitting can be strengthened.
본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 방법은, All Valve Off, Syringe Initialize 명령 실행 및 Stir Pad Off의 초기 상태로 회로로 대기할 수 있다.The DSP slurry concentration measurement method according to an embodiment of the present invention can wait as a circuit in the initial state of All Valve Off, Syringe Initialize command execution, and Stir Pad Off.
본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 방법은, 상기 초기 상태는, LS(Leak Sensor), LC(Load Cell)를 유지하도록 상시 체크하여 각 전극 Output Voltage 체크 - 전극 상태를 Range를 결정하되, 기기 전원 최초 투입시에는 체크 과정을 생략하고, Vessel에 물 투입 동작 후 체크할 수 있다.In the DSP slurry concentration measurement method according to an embodiment of the present invention, the initial state is constantly checked to maintain the LS (Leak Sensor) and LC (Load Cell), and the output voltage of each electrode is checked - the range of the electrode status is determined. , The check process can be omitted when the device is first turned on, and the check can be performed after adding water to the vessel.
일 실시예에 따른, 상기 DSP 슬러리 농도 측정 방법은, 상기 초기 상태 체크 후, 시약이 투입되는 시약 투입 라인(Reagent Input Line)의 거품(Bubble)을 제거하여 분석 오차 발생을 방지하는 단계; 상기 시약 투입 라인을 통해 투입되는 시약이 담아지는 시약 용기를 비우는 단계(Vessel Empty); 상기 시약 용기에 담아진 상기 시약의 정확한 샘플을 추출하도록 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계; 상기 샘플 루트 배관의 세척 후 상기 샘플 루프 배관을 이용해 상기 시약 용기를 세척하는 단계(Vessel Cleaning); 상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계; 샘플(견본, Sampling)을 상기 샘플 루프를 통해 추출하는 단계; 추출한 상기 샘플(견본)을 시약 용기로 전송하는 단계(Sample Transfer); 상기 시약 용기에 전송된 상기 샘플을 설정된 조건으로 측정(분석, Measuring)하는 단계; 상기 시약이 흡입되는 흡입부를 초기화시켜(Syringe Initialize) DIW 및 시약을 빼내(Drain)는 단계; 시약이 제거된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계; 상기 시약 용기를 세척하는 단계(Vessel Cleaning); 상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty); 상기 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계; 및 상기 시약 용기를 측정(분석, Measuring)이 필요한 다른 시약으로 채우는 단계(Vessel Refill);를 포함할 수 있다.According to one embodiment, the method of measuring the concentration of the DSP slurry includes the steps of removing bubbles from the reagent input line into which the reagent is input, after checking the initial state, to prevent analysis errors from occurring; Emptying the reagent vessel containing the reagent introduced through the reagent input line (Vessel Empty); Cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container; Cleaning the reagent vessel using the sample loop pipe after cleaning the sample root pipe (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; Extracting a sample (sampling) through the sample loop; Transferring the extracted sample (sample) to a reagent container (Sample Transfer); Measuring (analyzing) the sample transferred to the reagent container under set conditions; Initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent; Emptying the reagent vessel from which the reagent has been removed (Vessel Empty); Cleaning the sample loop pipe; Cleaning the reagent vessel (Vessel Cleaning); Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty); Emptying the vent pipe connected to the reagent container; And a step of filling the reagent vessel with another reagent that requires measurement (analysis, measuring) (Vessel Refill).
일 실시예에 따른, 상기 DSP 슬러리 농도 측정 방법은, DSP 슬러리 농도 측정 장치의 제어부를 통해 각 단계가 수행될 수 있다.According to one embodiment, in the method for measuring the DSP slurry concentration, each step may be performed through a control unit of the DSP slurry concentration measuring device.
일 실시예에 따른, 상기 DSP 슬러리 농도 측정 장치는, 벽과 평행하게 위치하여 벽에 고정되며 DSP 슬러리의 농도를 측정하는 본체; 상기 본체의 상단면에 위치하여 상기 DSP 슬러리의 농도를 측정하는 각 단계를 조작하는 단계제어부; 상기 본체의 일측면 상단에 구비되어 있으며, 상기 단계제어부에 의해 농도가 측정되는 DSP 슬러리의 농도 측정의 각 단계의 동작 시간을 제어하는 동작시간제어부; 상기 동작시간제어부의 외측면을 보호하며 타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가능하여 일측면으로 회전 개폐 가능한 제1 개폐부; 및 타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가 가능하여 상기 제1 개폐부의 하단에 위치하여 오류 발생 시 오류 상황에 대처하여 본체를 수리하도록 일측면으로 회전 개폐 가능한 제2 개폐부;를 포함할 수 있다.According to one embodiment, the DSP slurry concentration measuring device includes a body located parallel to the wall, fixed to the wall, and measuring the concentration of the DSP slurry; A step control unit located on the upper surface of the main body to manipulate each step of measuring the concentration of the DSP slurry; an operation time control unit provided at the top of one side of the main body and controlling the operation time of each step of measuring the concentration of the DSP slurry, the concentration of which is measured by the step control unit; A first opening/closing unit that protects the outer surface of the operation time control unit and has the other side connected to the main body, but has one side that can be opened and closed from the main body and can be rotated to open and close on one side; and a second opening and closing unit, the other side of which is connected to the main body, but one side of which can be opened and closed from the main body, and is located at the bottom of the first opening and closing unit and can be opened and closed by rotating to one side to cope with an error situation and repair the main body when an error occurs. May include ;.
일 실시예에 따른, 상기 본체는, 하단에 바닥면으로부터 일정 높이 유지하도록 지지하며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호하는 받침지지대가 더 구비되어 있을 수 있다.According to one embodiment, the main body may be further provided with a support at the bottom to maintain the main body at a certain height from the floor and protect it from shock or vibration generated from the floor.
일 실시예에 따른, 상기 받침지지대는, 소정의 높이를 갖는 사각 판의 형상으로 형성되어 있으며 상기 본체의 하단에 위치함과 동시에 바닥면에 위치하도록 한 쌍으로 구비되는 지지판; 한 쌍으로 구비된 상기 지지판의 일면 중앙에 위치하여 일측면은 상기 지지판에 부착되어 있는 한 쌍의 부착부; 소정의 두께를 갖는 원형 띠의 형상으로 형성되되 코일 스프링의 형상으로 형성되고, 한 쌍으로구비되는 상기 부착부의 타측면에 부착되는 한 쌍의 끼움부; 및 상기 끼움부의 비어 있는 중앙에 끼워진 채 위치하고, 외부로부터 발생하는 충격 또는 진동을 흡수하는 충격흡수부;를 포함할 수 있다.According to one embodiment, the support plate is formed in the shape of a square plate with a predetermined height and is provided in a pair so as to be located at the bottom of the main body and at the same time on the floor; A pair of attachment portions located at the center of one side of the support plate provided as a pair and one side of which is attached to the support plate; A pair of fitting parts formed in the shape of a circular band having a predetermined thickness and formed in the shape of a coil spring and attached to the other side of the attachment part provided as a pair; and a shock absorbing portion located in the empty center of the fitting portion and absorbing shock or vibration generated from the outside.
일 실시예에 따른, 상기 충격흡수부는, 한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부에 고정되는 상단체결부; 상기 상단체결부의 하단에 위치하며, 원기둥의 형상으로 형성되되 상기 상단체결부의 직경보다 큰 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제1 수축이완부; 상기 제1 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제1 지지부; 상기 제1 지지부의 하단에 위치하고, 원기둥의 형상으로 형성되되 상기 제1 지지부의 직경보다 작은 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제2 수축이완부; 상기 제2 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제2 지지부; 및 한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부에 고정되는 하단체결부;를 포함할 수 있다.According to one embodiment, the shock absorbing part is formed with a diameter that can be inserted through the fitting located at the upper end of the pair of fitting parts and is fixed to the fitting located at the upper end of the pair of fitting parts. upper fastening part; A first contraction/relaxation part located at the bottom of the upper fastening part, formed in the shape of a cylinder and having a diameter larger than the diameter of the upper fastening part, and driven to contract or relax by an external shock or vibration; A first support part located at the bottom of the first contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; a second contraction/relaxation part located at the bottom of the first support part, formed in the shape of a cylinder and having a diameter smaller than that of the first support part, and driven to contract or relax by an external shock or vibration; a second support part located at the bottom of the second contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; And a lower fastening part formed to a diameter that can be fitted through the fitting located at the lower end of the pair of fitting parts and fixed to the fitting part located at the lower end of the pair of fitting parts. .
일 실시예에 따른, 상기 상단체결부는, 외부로부터 발생하는 충격 또는 진동에 의해 상단에 위치한 상기 끼움부로부터 이탈되는 것을 방지하도록 상단면에 부착소재가 구비되어 있을 수 있다.According to one embodiment, the upper fastening part may be provided with an attachment material on the upper surface to prevent the upper fastening part from being separated from the fitting part located at the upper end due to external shock or vibration.
일 실시예에 따른, 상기 제1 수축이완부는, 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.According to one embodiment, the first contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
일 실시예에 따른, 상기 제2 수축이완부는, 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.According to one embodiment, the second contraction/relaxation part may be formed of a material that can be formed in the shape of a bellows to allow for shock or relaxation generated from the outside.
일 실시예에 따른, 상기 제1 수축이완부 및 상기 제2 수축이완부는, 각각 다른 두께로 형성되어 외부로부터 발생하는 충격을 1차 및 2차적으로 각각 흡수할 수 있다.According to one embodiment, the first contraction/relaxation part and the second contraction/relaxation part are formed to have different thicknesses and can primarily and secondaryly absorb shocks generated from the outside, respectively.
일 실시예에 따른, 상기 끼움부는, 일단에 끼움보강부가 형성되어 있어 상기 충격흡수부의 상기 상단체결부 또는 상기 하단체결부의외측면을 감싼 채 고정하여 상기 상단체결부 또는 상기 하단체결부의 직경이 중앙을 관통한 후 끼움 고정되는 것을 강화할 수 있다.According to one embodiment, the fitting part has a fitting reinforcement formed at one end, and is fixed while wrapping the outer surface of the upper fastening part or the lower fastening part of the shock absorbing part, so that the diameter of the upper fastening part or the lower fastening part is centered. After penetrating, the fitting can be strengthened.
상술한 본 발명의 일측면에 따르면, 본 발명이 제안하는 슬러리 내의 H2O2 농도를 분석하는 DSP 슬러리 농도 측정 장치는 25ml Mixing Vessel을 적용하여 시약의 소모량을 최소화할 수 있다.According to one aspect of the present invention described above, the DSP slurry concentration measurement device for analyzing the H2O2 concentration in the slurry proposed by the present invention can minimize the consumption of reagents by applying a 25ml Mixing Vessel.
또한, 온라인(Online) 또는 연구실(Lab) 분석 겸욕으로 사용될 수 있으며, 다른 장치의 내부에 간단하게 설치가 가능하여 편리하고 효율적으로 슬러리의 농도를 측정할 수 있다.In addition, it can be used for online or laboratory analysis, and can be easily installed inside another device to conveniently and efficiently measure the concentration of slurry.
또한, 본체에 단계제어부 및 동작시간제어부가 각각 구비되어 있어 슬러리의 농도를 측정하기 위한 단계 조작과 동작시간 조작을 각각 제어할 수 있어 관리자가 헷갈리거나 초보더라도 쉽게 조작할 수 있다.In addition, the main body is equipped with a step control unit and an operation time control unit, so that the step operation and operation time operation for measuring the concentration of the slurry can be controlled separately, so even managers who are confused or are beginners can easily operate it.
또한, 본체의 바닥면과 일정 간격 형성되어 있는 빈 공간에 받침지지대가 구비되어 있어 본체는 보다 견고하게 고정되며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호할 수 있다.In addition, since the base support is provided in the empty space formed at a certain distance from the bottom of the main body, the main body is fixed more firmly and can be protected from shock or vibration generated from the floor.
또한, 충격흡수부를 고정하는 끼움부는 끼움보강부가 형성되어 있어 충격흡수부의 끼움 정도를 강화할 수 있고, 이에 따라 외부로부터 충격 또는 진동이 규칙적으로 발생하더라도 충격흡수부가 지지판으로부터 이탈되는 것을 방지할 수 있다.In addition, the insertion part that secures the shock absorber is formed with a reinforcing part, which can strengthen the degree of fit of the shock absorber, thereby preventing the shock absorber from being separated from the support plate even if shock or vibration occurs regularly from the outside.
또한, 충격흡수부는 자바라구동부의 수축 구동에 의해 제1 수축부가 제2 수축부의 내부로 하강 구동하고, 자바라구동부의 구동에 의해 공기층의 방향으로 공기가 이동하고, 공기층으로 유입된 공기에 의해 탄성부는 스프링에 의해 상단 방향으로 구동하여 외부로부터 발생하는 충격 또는 진동을 흡수할 수 있다.In addition, in the shock absorbing part, the first contracted part is driven downward into the second contracted part by the contraction drive of the bellows driving part, the air moves in the direction of the air layer by the driving of the bellows driving part, and the elastic part is driven by the air flowing into the air layer. It can be driven upward by a spring to absorb shock or vibration occurring from the outside.
본 발명의 효과는 이상에서 언급한 효과들로 제한되지 않으며, 미만에서 설명할 내용으로부터 통상의 기술자에게 자명한 범위 내에서 다양한 효과들이 포함될 수 있다.The effects of the present invention are not limited to the effects mentioned above, and various effects may be included within the range apparent to those skilled in the art from the details described below.
도 1은 본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 장치의 구성이 도시된 도면이다.Figure 1 is a diagram showing the configuration of a DSP slurry concentration measuring device according to an embodiment of the present invention.
도 2 내지 도 30은 본 발명의 일 실시예에 따른 DSP 슬러리 농도 측정 방법이 도시된 회로도이다.2 to 30 are circuit diagrams showing a method for measuring DSP slurry concentration according to an embodiment of the present invention.
도 31 내지 도 35는 본 발명의 다른 실시예에 따른 DSP 슬러리 농도 측정 장치의 일부 구성인 받침지지대에 대한 구성이 도시된 도면이다.Figures 31 to 35 are diagrams showing the configuration of a support, which is a part of a DSP slurry concentration measuring device according to another embodiment of the present invention.
후술하는 본 발명에 대한 상세한 설명은, 본 발명이 실시될 수 있는 특정 실시예를 예시로서 도시하는 첨부 도면을 참조한다. 이들 실시예는 당업자가 본 발명을 실시할 수 있기에 충분하도록 상세히 설명된다. 본 발명의 다양한 실시예는 서로 다르지만 상호 배타적일 필요는 없음이 이해되어야 한다. 예를 들어, 여기에 기재되어 있는 특정 형상, 구조 및 특성은 일 실시예와 관련하여 본 발명의 정신 및 범위를 벗어나지 않으면서 다른 실시예로 구현될 수 있다. The detailed description of the present invention described below refers to the accompanying drawings, which show by way of example specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different from one another but are not necessarily mutually exclusive. For example, specific shapes, structures and characteristics described herein may be implemented in one embodiment without departing from the spirit and scope of the invention.
어떤 구성요소가 다른 구성요소에 "연결되어" 있다거나 "체결되어" 있다고 언급된 때에는, 그 다른 구 성요소에 직접적으로 연결되어 있거나 또는 체결되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에 어떤 구성요소가 다른 구성요소에 "직접 연결되어" 있다거나 "직접 체결되어" 있다고 언급된 때에는 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다.When a component is said to be “connected” or “coupled” to another component, it is understood that it may be directly connected to or fastened to that other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is "directly connected" or "directly fastened" to another component, it should be understood that there are no other components in the middle.
또한, 각각의 개시된 실시예 내의 개별 구성요소의 위치 또는 배치는 본 발명의 정신 및 범위를 벗어나지 않으면서 변경될 수 있음이 이해되어야 한다. 따라서, 후술하는 상세한 설명은 한정적인 의미로서 취하려는 것이 아니며, 본 발명의 범위는, 적절하게 설명된다면, 그 청구항들이 주장하는 것과 균등한 모든 범위와 더불어 첨부된 청구항에 의해서만 한정된다. 도면에서 유사한 참조부호는 여러 측면에 걸쳐서 동일하거나 유사한 기능을 지칭한다.Additionally, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Accordingly, the detailed description that follows is not intended to be taken in a limiting sense, and the scope of the invention is limited only by the appended claims, together with all equivalents to what those claims assert, if properly described. Similar reference numbers in the drawings refer to identical or similar functions across various aspects.
미만, 도면들을 참조하여 본 발명의 바람직한 실시예들을 보다 상세하게 설명하기로 한다.Below, preferred embodiments of the present invention will be described in more detail with reference to the drawings.
도 1은 DSP 슬러리의 농도를 측정하기 위한 DSP 슬러리 농도 측정 장치의 구성이 도시된 도면이다.1 is a diagram showing the configuration of a DSP slurry concentration measuring device for measuring the concentration of DSP slurry.
도 1을 참조하면, DSP 슬러리의 농도를 측정하기 위한 DSP 슬러리 농도 측정 장치(100)는 본체(110), 단계제어부(130), 동작시간제어부(150), 제1 개폐부(170) 및 제2 개폐부(190)를 포함할 수 있다.Referring to FIG. 1, the DSP slurry concentration measuring device 100 for measuring the concentration of DSP slurry includes a main body 110, a step control unit 130, an operation time control unit 150, a first opening and closing unit 170, and a second opening/closing unit 170. It may include an opening/closing unit 190.
본체(110)는 벽과 평행하게 위치하여 벽에 고정되며 DSP 슬러리의 농도를 측정할 수 있다.The main body 110 is positioned parallel to the wall and fixed to the wall, and can measure the concentration of the DSP slurry.
한편, 본체(110)의 하단에는 바닥면으로부터 일정 높이 유지하도록 지지하며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호하는 받침지지대가 더 구비되어 있을 수 있는데, 이는 도 31 내지 도 35를 통해 후술하기로 한다.Meanwhile, the bottom of the main body 110 may be further provided with a support support to maintain it at a certain height from the floor and protect it from shock or vibration generated from the floor, which will be described later with reference to FIGS. 31 to 35. do.
단계제어부(130)는 본체(110)의 상단면에 위치하여 DSP 슬러리의 농도를 측정하는 각 단계를 조작할 수 있다.The stage control unit 130 is located on the upper surface of the main body 110 and can operate each stage of measuring the concentration of the DSP slurry.
동작시간제어부(150)는 본체(110)의 일측면 상단에 구비되어 있으며, 단계제어부(130)에 의해 농도가 측정되는 DSP 슬러리의 농도 측정의 각 단계의 동작 시간을 제어할 수 있다.The operation time control unit 150 is provided at the top of one side of the main body 110 and can control the operation time of each step of measuring the concentration of the DSP slurry whose concentration is measured by the step control unit 130.
제1 개폐부(170)는 동작시간제어부(150)의 외측면을 보호하며 타측면은 본체에 연결되어 있으나 일측면은 본체(110)로부터 개폐가능하여 일측면으로 회전 개폐할 수 있다.The first opening and closing unit 170 protects the outer side of the operation time control unit 150, and the other side is connected to the main body, but one side can be opened and closed from the main body 110, so that it can be opened and closed by rotating to one side.
제2 개폐부(190)는 타측면은 본체(110)에 연결되어 있으나 일측면은 본체(110)로부터 개폐가 가능하여 제1 개폐부(170)의 하단에 위치하여 오류 발생 시 오류 상황에 대처하여 본체(110)를 수리하도록 일측면으로 회전 개폐할 수 있다.The second opening and closing part 190 is connected to the main body 110 on the other side, but one side can be opened and closed from the main body 110 and is located at the bottom of the first opening and closing part 170 to cope with the error situation when an error occurs. (110) can be opened and closed by rotating on one side to repair.
본 발명이 제안하는 DSP 슬러리 농도 측정 장치(100)는 샘플 안의 측정하고자 하는 물질과 농도를 알고 있는 표준시약이 정량적으로 반응하는 것을 이용해서, 종말점(endpoint)까지 소모된 시약소비량으로 샘플의 농도를 자동으로 측정할 수 있다.The DSP slurry concentration measuring device 100 proposed by the present invention utilizes the quantitative reaction of the substance to be measured in the sample and a standard reagent whose concentration is known, and determines the concentration of the sample by the amount of reagent consumed up to the endpoint. It can be measured automatically.
한편, 본 발명이 제안하는 DSP 슬러리 농도 측정 장치(100)는 시약을 정량적으로 주입하는 기술인 Dosing 기술을 적용하는데, 일반적으로 Auto pipette, Syringe pump 및 Peristatic pump등을 이용하여 일정량의 액체를 주입할 수 있고, 이는 미세 주입량의 콘트롤이 매우 중요하다.Meanwhile, the DSP slurry concentration measurement device 100 proposed by the present invention applies dosing technology, which is a technology for quantitatively injecting reagents. Generally, a certain amount of liquid can be injected using an auto pipette, syringe pump, and peristatic pump. There is, and control of the fine injection amount is very important.
또한, 본 발명이 제안하는 DSP 슬러리 농도 측정 장치(100)는 센싱 기술을 적용하는데, 일반적으로 샘플 및 시약의 반응성을 측정하기 위한 전극, Ph, ORP, ISE Electrode 등이 사용되고, 기술개발보다는 판매품의 성능을 검증하여 적용하는 것이 일반적이다.In addition, the DSP slurry concentration measurement device 100 proposed by the present invention applies sensing technology, and electrodes, Ph, ORP, ISE Electrode, etc. are generally used to measure the reactivity of samples and reagents, and are used for product sales rather than technology development. It is common to verify performance before applying.
센싱 기술은 케미컬에 대한 내화학성과 측정값(센서 출력 Voltage)의 안정성이 높은 제품에 적용되고, Low noise filter를 적용하여 센서 시그널의 안정성을 확보할 수 있다.Sensing technology is applied to products with high chemical resistance and stability of measured values (sensor output voltage), and the stability of the sensor signal can be secured by applying a low noise filter.
도 2 내지 도 30은 DSP 슬러리 농도 측정을 위한 회로도와, DSP 슬러리 농도 측정 방법이 순차적으로 도시된 도면이다.2 to 30 are diagrams sequentially showing a circuit diagram for measuring DSP slurry concentration and a method for measuring DSP slurry concentration.
DSP 슬러리 농도 측정의 각 방법은 각 단계에 해당하는 도면을 참조하여 후술하도록 한다.Each method of measuring DSP slurry concentration will be described later with reference to the drawings corresponding to each step.
도 4 내지 도 7를 참조하면, 초기 상태 체크 후, 시약이 투입되는 시약 투입 라인(Reagent Input Line)의 거품(Bubble)을 제거하여 분석 오차 발생을 방지하는 단계를 확인할 수 있다.Referring to Figures 4 to 7, after checking the initial state, you can see the steps to prevent analysis errors by removing bubbles in the reagent input line where reagents are introduced.
회로도의 AV7A를 ON구동한 후, SD1 Valve Change, SD2 Valve Change, SD3 Valve Change, SD4 Valve Change되고, SD5 Valve Change한 후, AV2-3를 ON구동 하여, SD1 Pull Down, SD2 Pull Down, SD3 Pull Down, SD4 Pull Down, SD5 Pull Down되도록 구동시켜 시약 투입 배관에 있는 버블(Bubble)을 제거하여 분석 오차 발생을 방지하는 단계,After turning ON AV7A in the circuit diagram, SD1 Valve Change, SD2 Valve Change, SD3 Valve Change, SD4 Valve Change, and after SD5 Valve Change, turning ON AV2-3, SD1 Pull Down, SD2 Pull Down, SD3 Pull Step to prevent analysis errors by removing bubbles in the reagent input pipe by operating Down, SD4 Pull Down, and SD5 Pull Down;
회로도의 AV2-3 및 AV7A를 Off구동한 후, SD2, 3, 4, 5 Valve Change, SD2 Push UP, SD3 Push UP, SD4 Push UP, SD5 Push UP되어 시약 투입 배관에서 유입된 Syringe내의 버블(Bubble)을 제거하는 단계,After turning off AV2-3 and AV7A in the circuit diagram, SD2, 3, 4, 5 Valve Change, SD2 Push UP, SD3 Push UP, SD4 Push UP, and SD5 Push UP are used to remove bubbles in the syringe introduced from the reagent input pipe. ), removing the
회로도의 S tir 1, 2, 3을 ON구동한 후, AV4-1,2,3 ON, Vessel 내부를 대기압상태로 만들고, SD2, 3, 4, 5 Valve Change, SD2 Push UP, SD3 Push UP, SD4 Push UP, SD5 Push UP되어 대기상태에서 발생된 시약 투입 배관에 있는 버블(Bubble)을 제거하는 단계, 및After turning ON S tir 1, 2, 3 in the circuit diagram, AV4-1, 2, 3 ON, bring the inside of the vessel to atmospheric pressure, SD2, 3, 4, 5 Valve Change, SD2 Push UP, SD3 Push UP, SD4 Push UP, SD5 Push UP to remove bubbles in the reagent input pipe generated in the standby state, and
회로도의 AV4-1, 2, 3를 Off구동한 후, SD2, SD3, SD4, SD5 Valve Change, SD2 Pull Down, SD3 Pull Down, SD4 Pull Down, SD5 Pull Down되어 시약을 Syringe에 리필(Refiil)하는 단계를 포함할 수 있다.After turning off AV4-1, 2, and 3 in the circuit diagram, SD2, SD3, SD4, SD5 Valve Change, SD2 Pull Down, SD3 Pull Down, SD4 Pull Down, and SD5 Pull Down are used to refill the syringe with reagents. May include steps.
도 8을 참조하면, 시약 투입 라인을 통해 투입되는 시약이 담아지는 시약 용기를 비우는 단계(Vessel Empty)를 확인할 수 있다.Referring to Figure 8, the step (Vessel Empty) of emptying the reagent vessel containing the reagent introduced through the reagent input line can be confirmed.
회로도의 AV10-1,2,3를 ON구동 및 AV3-1,2,3를 ON구동하여 시약이 투입된 Vessel 내의 오염수(시약 + DIW)를 Drain하는 단계를 포함할 수 있다.It may include the step of turning ON AV10-1, 2, and 3 in the circuit diagram and turning ON AV3-1, 2, and 3 to drain the contaminated water (reagent + DIW) in the vessel into which the reagent has been added.
여기서 시약 용기는 25ml Mixing Vessel로 구비될 수 있다.Here, the reagent container may be provided as a 25ml Mixing Vessel.
도 9를 참조하면, 시약 용기에 담아진 시약의 정확한 샘플을 추출하도록 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계를 확인할 수 있다.Referring to FIG. 9, you can see the step of cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container.
회로도의 AV3-1,2,3를 Off구동, AV10-1,2,3를 Off구동, Stir Off구동 및 AV2-1,2,3 ON구동하여 샘플링(Sampling) 전에 샘플 루프(Sample Loop)를 클리닝(Cleaning)하는 단계를 포함할 수 있다.In the circuit diagram, turn AV3-1,2,3 off, AV10-1,2,3 turn off, stir off, and AV2-1,2,3 turn on to create a sample loop before sampling. It may include a cleaning step.
도 10 및 도 11을 참조하면, 샘플 루트 배관의 세척 후 샘플 루프 배관을 이용해 시약 용기를 세척하는 단계(Vessel Cleaning)를 확인할 수 있다.Referring to Figures 10 and 11, you can see the step of cleaning the reagent vessel using the sample loop pipe (vessel cleaning) after cleaning the sample root pipe.
회로도의 AV4-1,2,3를 ON구동, AV5B, AV6B, AV7B를 ON구동, Stir1,2,3를 ON구동, AV10-1,2,3를 ON 구동 및 AV4-1,2,3를 Off구동하여 측정(Measuring) 전에 Vessel을 클리닝(Cleaning)하는 단계를 포함할 수 있다.In the circuit diagram, AV4-1, 2, and 3 are turned ON, AV5B, AV6B, and AV7B are turned ON, Stir1, 2, and 3 are turned ON, AV10-1, 2, and 3 are turned ON, and AV4-1, 2, and 3 are turned ON. It may include a step of cleaning the vessel before measuring by turning it off.
도 12를 참조하면, 샘플 루프 배관을 통해 세척이 완료된 시약 용기를 비우는 단계(Vessel Empty)를 확인할 수 있다.Referring to FIG. 12, the step of emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty) can be confirmed.
회로도의 AV2-1, 2, 3를 Off구동 및 AV5B, AV6B, AV7B를 Off구동, AV3-1, 2, 3 ON구동하여 시약이 투입된 Vessel 내의 DIW를 Drain하는 단계를 포함할 수 있다.It may include the step of turning AV2-1, 2, and 3 in the circuit diagram Off, turning AV5B, AV6B, and AV7B Off, and turning AV3-1, 2, and 3 ON to drain the DIW in the vessel into which the reagent has been added.
도 13을 참조하면, 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계를 확인할 수 있다.Referring to FIG. 13, the step of emptying the vent pipe connected to the reagent container can be confirmed.
회로도의 AV10-1, 2, 3를 Off구동 및 AV4-1, 2, 3 ON구동하여 Vessel Cleaning시 남아있는 Vent 개관내의 DIW 제거하는 단계를 포함할 수 있다.This may include the step of removing DIW in the vent opening remaining during vessel cleaning by turning AV10-1, 2, and 3 in the circuit diagram off and turning AV4-1, 2, and 3 on.
도 14를 참조하면, 샘플(견본, Sampling)을 샘플 루프를 통해 추출하는 단계를 확인할 수 있다.Referring to FIG. 14, you can see the step of extracting a sample (sampling) through a sample loop.
회로도의 AV3-1,2,3를 Off구동, AV4-1,2,3를 Off구동, AV5A, AV6A, AV7A를 ON구동 및 AV1-1,2,3 ON구동하여 샘플을 Sample loop에 Capture하는 단계를 포함할 수 있다.In the circuit diagram, AV3-1, 2, and 3 are turned off, AV4-1, 2, and 3 are turned off, AV5A, AV6A, and AV7A are turned on, and AV1-1, 2, and 3 are turned on to capture samples in the sample loop. May include steps.
도 15 내지 도 19를 참조하면, 추출한 샘플(견본)을 시약 용기로 전송하는 단계(Sample Transfer)를 확인할 수 있다.Referring to Figures 15 to 19, the step of transferring the extracted sample (sample) to the reagent container (Sample Transfer) can be confirmed.
회로도의 AV1-1, 2, 3를 Off구동, AV5A, AV6A, AV7A를 Off구동, AV4-1를 ON구동 및 AV7B ON구동하여 SD1가 Push Up되고, Stir을 ON구동하여 Sample loop에 Capture된 Sample을 Vessel로 투입하는 단계,In the circuit diagram, AV1-1, 2, and 3 are turned off, AV5A, AV6A, and AV7A are turned off, AV4-1 is turned ON, and AV7B is turned ON. SD1 is pushed up, and Stir is turned ON to capture the sample in the sample loop. Step of introducing into the vessel,
회로도의 AV7B를 Off 구동, AV4-1를 Off 구동, AV7A를 ON 구동, AV2-3를 ON 구동, SD1 Pull Down구동하여 Sample Transfer를 위한 Syringe Refill하는 단계,Steps to refill the syringe for sample transfer by driving AV7B Off in the circuit diagram, driving AV4-1 Off, driving AV7A ON, driving AV2-3 ON, and driving SD1 Pull Down,
회로도의 AV2-3를 Off 구동 및 AV7A를 Off 구동하여 SD1가 Valve Change되고, AV4-2를 ON 구동, AV6B를 ON 구동하여 SD1가 Push Up되고, Stir ON구동하여 Sample loop에 Capture된 Sample을 Vessel로 투입하는 단계,In the circuit diagram, by driving AV2-3 Off and AV7A Off, SD1 is changed as a valve, AV4-2 is driven ON, and AV6B is driven ON to push up SD1, and by driving Stir ON, the sample captured in the sample loop is placed in a vessel. The step of putting it into
회로도의 AV6B를 Off 구동, AV4-2를 Off 구동, AV6A를 ON 구동, AV2-2를 ON 구동 및 SD1를 Pull Down구동하여 Sample Transfer를 위한 Syringe Refill하는 단계,Steps to refill the syringe for sample transfer by driving AV6B Off in the circuit diagram, driving AV4-2 Off, driving AV6A ON, driving AV2-2 ON, and pulling down SD1,
회로도의 AV2-2를 Off 구동 및 AV6A를 Off 구동하여 SD1가 Valve Change되고, AV4-3를 ON 구동 및 AV5B를 ON 구동하여 SD1가 Push Up되고, Stir를 ON구동하여 Sample loop에 Capture된 Sample을 Vessel로 투입하는 단계를 포함할 수 있다.By driving AV2-2 Off and AV6A Off in the circuit diagram, SD1 is changed as a valve, by driving AV4-3 ON and AV5B ON, SD1 is pushed up, and by driving Stir ON, the sample captured in the sample loop is It may include the step of putting it into a vessel.
도 20 내지 도 22를 참조하면, 시약 용기에 전송된 샘플을 설정된 조건으로 측정(분석, Measuring)하는 단계를 확인할 수 있다.Referring to FIGS. 20 to 22, you can see the step of measuring (analyzing) the sample transferred to the reagent container under set conditions.
회로도의 AV5A를 Off 구동, AV4-1, 2를 ON 구동하여 SD2, SD3, SD4, SD5가 Valve Change되고, SD2, SD3, SD4를 Push Up구동하여 Sample을 설정된 Recipe 조건으로 분석하는 단계,In the circuit diagram, AV5A is turned off and AV4-1 and 2 are turned on to change the valves of SD2, SD3, SD4, and SD5, and SD2, SD3, and SD4 are pushed up to analyze the sample under the set recipe conditions.
회로도의 SD2, SD3를 Push Up구동하여 Sample을 설정된 Recipe 조건으로 분석하는 단계,Step of analyzing the sample under the set recipe conditions by pushing up SD2 and SD3 of the circuit diagram,
회로도의 SD2, SD3, SD5를 Push Up구동하여 Sample을 설정된 Recipe 조건으로 분석하는 단계를 포함할 수 있다.It may include the step of analyzing the sample under set recipe conditions by pushing up SD2, SD3, and SD5 in the circuit diagram.
도 23을 참조하면, 시약이 흡입되는 흡입부를 초기화시켜(Syringe Initialize) DIW 및 시약을 빼내(Drain)는 단계를 확인할 수 있다.Referring to Figure 23, the step of initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent can be confirmed.
회로도의 AV4-1, 2, 3를 Off구동하여 SD2, SD3, SD4, SD5가 Valve Change되고, All Syringe Initialize구동하여 Syringe를 초기화 시켜, DIW 및 시약을 Drain하는 단계를 포함할 수 있다.This may include the steps of turning off AV4-1, 2, and 3 in the circuit diagram to change the valves of SD2, SD3, SD4, and SD5, and initializing the syringe by driving All Syringe Initialize, and draining DIW and reagents.
도 24를 참조하면, 시약이 제거된 시약 용기를 비우는 단계(Vessel Empty)를 확인할 수 있다.Referring to Figure 24, the step of emptying the reagent vessel from which the reagent has been removed (Vessel Empty) can be confirmed.
회로도의 AV3-1, 2, 3를 ON구동, AV10-1, 2, 3를 ON구동 및 SD1, SD2, SD3, SD4, SD5를 Valve Change구동하여 분석이 완료된 Sample을 Drain하는 단계를 포함할 수 있다.It can include the steps of turning ON AV3-1, 2, and 3 in the circuit diagram, turning ON AV10-1, 2, and 3, and driving SD1, SD2, SD3, SD4, and SD5 through valve change to drain the sample for which analysis has been completed. there is.
도 25를 참조하면, 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계를 확인할 수 있다.Referring to Figure 25, you can see the steps for cleaning the sample loop pipe.
회로도의 AV3-1, 2, 3를 Off 구동, AV10-1, 2, 3를 Off구동, Stir를 Off구동 및 AV2-1,2,3를 ON구동하여 Measuring 후의 Sample loop를 Cleaning하는 단계를 포함할 수 있다.In the circuit diagram, it includes the steps of cleaning the sample loop after measuring by turning AV3-1, 2, and 3 off, turning AV10-1, 2, and 3 off, turning Stir off, and turning AV2-1, 2, and 3 ON. can do.
도 26 및 도 27을 참조하면, 시약 용기를 세척하는 단계(Vessel Cleaning)를 확인할 수 있다.Referring to Figures 26 and 27, the step of cleaning the reagent vessel (Vessel Cleaning) can be confirmed.
회로도의 AV4-1,2,3를 ON구동, AV5B, AV6B, AV7B를 ON구동 및 Stir1,2,3 ON를구동하여 Measuring 전에 Vessel을 Cleaning하는 단계,Step of cleaning the vessel before measuring by turning ON AV4-1, 2, and 3 in the circuit diagram, turning ON AV5B, AV6B, and AV7B, and turning Stir1, 2, and 3 ON.
회로도의 AV10-1,2,3를 ON 구동 및 AV4-1,2,3를 Off구동하여 Measuring 전에 Vessel을 Cleaning하는 단계를 포함할 수 있다.It may include the step of cleaning the vessel before measuring by turning ON AV10-1, 2, and 3 in the circuit diagram and turning AV4-1, 2, and 3 off.
도 28을 참조하면, 샘플 루프 배관을 통해 세척이 완료된 시약 용기를 비우는 단계(Vessel Empty)를 확인할 수 있다.Referring to FIG. 28, the step of emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty) can be confirmed.
회로도의 AV2-1, 2, 3를 Off 구동, AV5B, AV6B, AV7B를 Off구동 및 AV3-1, 2, 3 ON구동하여 Vessel 내의 DIW를 Drain하는 단계를 포함할 수 있다.It may include the step of draining the DIW in the vessel by turning AV2-1, 2, and 3 in the circuit diagram Off, driving AV5B, AV6B, and AV7B Off, and turning AV3-1, 2, and 3 ON.
도 29를 참조하면, 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계를 확인할 수 있다.Referring to FIG. 29, the step of emptying the vent pipe connected to the reagent container can be confirmed.
회로도의 AV10-1, 2, 3를 Off구동 및 AV4-1, 2, 3 ON구동하여 Vessel Cleaning시 남아있는 Vent 개관내의 DIW 제거하는 단계를 포함할 수 있다.This may include the step of removing DIW in the vent opening remaining during vessel cleaning by turning AV10-1, 2, and 3 in the circuit diagram off and turning AV4-1, 2, and 3 on.
도 30을 참조하면, 시약 용기를 측정(분석, Measuring)이 필요한 다른 시약으로 채우는 단계(Vessel Refill)를 확인할 수 있다.Referring to Figure 30, you can see the step (Vessel Refill) of filling a reagent vessel with another reagent that requires measurement (analysis).
회로도의 AV10-1, 2, 3를 Off 구동 및 AV4-1, 2, 3 ON구동하여 Vessel에 DIW를 충진시켜 다음 분석을 대기하는 단계를 포함할 수 있다.This may include the step of turning AV10-1, 2, and 3 in the circuit diagram OFF and turning AV4-1, 2, and 3 ON to fill the vessel with DIW and wait for the next analysis.
도 31 내지 도 35는 본 발명의 다른 실시예에 따른 DSP 슬러리 농도 측정 장치의 일부 구성인 받침지지대에 대한 구성이 도시된 도면이다.Figures 31 to 35 are diagrams showing the configuration of a support, which is a part of a DSP slurry concentration measuring device according to another embodiment of the present invention.
도 31 내지 도 33을 참조하면, 본 발명의 다른 실시예에 따른 본체는 바닥면과 일정 간격 형성되어 있는 빈 공간에 받침지지대(200)가 구비되어 있어 본체는 보다 견고하게 고정되며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호할 수 있다.Referring to Figures 31 to 33, the main body according to another embodiment of the present invention is provided with a base support 200 in an empty space formed at a certain distance from the floor surface, so that the main body is more firmly fixed and It can protect against shock or vibration.
뿐만 아니라, 본체(110)의 작동을 위하여 단계제어부(130) 또는 동작시간제어부(150) 또는 동작시간제어부(150) 또는 동작시간제어부(150)를 조작하거나, 작동 중 발생하는 진동으로부터 본체를 보호할 수 있다.In addition, in order to operate the main body 110, the step control unit 130 or the operation time control unit 150 or the operation time control unit 150 or the operation time control unit 150 is operated, or the main body is protected from vibration occurring during operation. can do.
더욱 구체적으로, 받침지지대는 지지판(210, 210'), 부착부(230, 230'), 끼움부(250) 및 충격흡수부(290)를 포함할 수 있다.More specifically, the base support may include a support plate (210, 210'), an attachment part (230, 230'), a fitting part (250), and a shock absorbing part (290).
지지판(210, 210')은 소정의 높이를 갖는 사각 판의 형상으로 형성되어 있으며 본체(110)의 하단에 위치함과 동시에 바닥면에 위치하도록 한 쌍으로 구비될 수 있다.The support plates 210 and 210' are formed in the shape of a square plate with a predetermined height and may be provided as a pair so that they are located at the bottom of the main body 110 and at the same time on the floor.
즉, 지지판(210, 210')은 본체(110)의 하단면이 바닥면에 마주보고 있는 것과 같이 한 쌍의 지지판(210, 210')도 서로 마주보고 위치할 수 있다.That is, a pair of support plates 210 and 210' may be positioned facing each other, just as the lower end of the main body 110 faces the floor.
부착부(230, 230')는 한 쌍으로 구비된 지지판(210, 210')의 일면 중앙에 위치하여 일측면은 지지판(210, 210')에 부착되어 있을 수 있으며, 한 쌍으로 구비되어 있는 지지판(210, 210')에 각각 구비되어 한 쌍을 이룰 수 있다.The attachment portions (230, 230') are located at the center of one side of the support plates (210, 210') provided as a pair, and one side may be attached to the support plates (210, 210'). They may be provided on the support plates 210 and 210', respectively, to form a pair.
끼움부(250)는 소정의 두께를 갖는 원형 띠의 형상으로 형성되되 코일 스프링의 형상으로 형성되고, 한 쌍으로 구비되는 부착부(230, 230')에 의해 한 쌍의 끼움부(250)가 부착부(230, 230')에 각각 부착될 수 있다.The fitting portion 250 is formed in the shape of a circular band with a predetermined thickness and is formed in the shape of a coil spring, and a pair of fitting portions 250 are formed by a pair of attachment portions 230 and 230'. It may be attached to the attachment portions 230 and 230', respectively.
끼움부(250)는 일단에 끼움보강부(270, 270')가 형성되어 있어 충격흡수부(290)의 상단체결부(296) 또는 하단체결부(297)의 외측면을 감싼 채 고정하여 상단체결부(296) 또는 하단체결부(297)의 직경이 중앙을 관통한 후 끼움 고정되는 것을 강화할 수 있다.The fitting part 250 has a fitting reinforcement part 270, 270' formed at one end, and is fixed to the upper part by wrapping the outer surface of the upper fastening part 296 or the lower fastening part 297 of the shock absorbing part 290. The diameter of the fastening part 296 or the lower fastening part 297 can be strengthened to be inserted and fixed after penetrating the center.
즉, 끼움보강부(270, 270')는 끼움부(250)에 의해 외측면이 감싸지는 상단체결부(296) 및 하단체결부(297)의 외측면을 한번 더 감싼 채 고정시킬 수 있어 끼움부(250)가 단독으로 상단체결부(296) 및 하단체결부(297)를 끼움 고정하는 것보다 끼움보강부(270, 270')가 한번 더 감싸져 있어 고정력을 증가시킬 수 있다.That is, the fitting reinforcement parts 270 and 270' can be fixed by wrapping the outer surfaces of the upper fastening part 296 and the lower fastening part 297, the outer surfaces of which are surrounded by the fitting part 250, once again. Rather than fitting and fixing the upper fastening part 296 and the lower fastening part 297 by the part 250 alone, the fastening force can be increased because the reinforcing fitting parts 270 and 270' are wrapped once more.
본 발명의 다른 실시예에 따른 받침지지대(200)는 충격흡수부(290)를 고정하는 끼움부(250)는 끼움보강부(270, 270')가 형성되어 있어 충격흡수부(290)의 끼움 정도를 강화할 수 있고, 이에 따라 외부로부터 충격 또는 진동이 규칙적으로 발생하더라도 충격흡수부(290)가 지지판(210, 210')으로부터 이탈되는 것을 방지할 수 있다.In the base support 200 according to another embodiment of the present invention, the fitting part 250 that fixes the shock absorbing part 290 is formed with fitting reinforcing parts 270 and 270', so that the shock absorbing part 290 is fitted. The degree can be strengthened, and thus the shock absorbing part 290 can be prevented from being separated from the support plates 210 and 210' even if external shock or vibration occurs regularly.
충격흡수부(290)는 끼움부(250)의 비어 있는 중앙에 끼워진 채 위치하고, 외부로부터 발생하는 충격 또는 진동을 흡수할 수 있다.The shock absorbing part 290 is located in the empty center of the fitting part 250 and can absorb shock or vibration generated from the outside.
한편 충격흡수부(290)는 상단체결부(296), 제1 수축이완부(295), 제1 지지부(291), 제2 수축이완부(292), 제2 지지부(293) 및 하단체결부(297)를 포함할 수 있다.Meanwhile, the shock absorbing part 290 includes an upper fastening part 296, a first contraction/relaxation part 295, a first support part 291, a second contraction/relaxation part 292, a second support part 293, and a lower fastening part. It may include (297).
상단체결부(296)는 한 쌍으로 위치한 끼움부(250) 중 상단에 위치한 끼움부(250)를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 끼움부(250) 중 상단에 위치한 끼움부(250)에 고정될 수 있다.The upper fastening part 296 is formed with a diameter that can be inserted through the fitting part 250 located at the upper end of the pair of fitting parts 250, and is located at the upper end of the pair of fitting parts 250. It can be fixed at (250).
상단체결부(296)는 외부로부터 발생하는 충격 또는 진동에 의해 상단에 위치한 끼움부(250)로부터 이탈되는 것을 방지하도록 상단면에 부착소재(294)가 구비되어 있을 수 있다.The upper fastening part 296 may be provided with an attachment material 294 on its upper surface to prevent it from being separated from the fitting part 250 located at the upper end due to external shock or vibration.
제1 수축이완부(295)는 상단체결부(296)의 하단에 위치하며, 원기둥의 형상으로 형성되되 상단체결부(296)의 직경보다 큰 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동할 수 있다.The first contraction/relaxation part 295 is located at the bottom of the upper fastening part 296, and is formed in the shape of a cylinder with a diameter larger than the diameter of the upper fastening part 296, and is resistant to shock or vibration occurring from the outside. It can be driven to contract or relax.
제1 수축이완부(295)는 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.The first contraction/relaxation portion 295 may be made of a material that can be formed into the shape of a bellows to allow for shock or relaxation generated from the outside.
제1 지지부(291)는 제1 수축이완부(295)의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 제1 수축이완부(295)의 직경보다 큰 직경으로 형성되되 지지판의 너비보다 작은 직경으로 형성될 수 있다.The first support part 291 is located at the bottom of the first contraction and relaxation part 295 and is formed in the shape of a disk with a predetermined height and a diameter larger than the diameter of the first contraction and relaxation part 295, but the width of the support plate. It can be formed into a smaller diameter.
제2 수축이완부(292)는 제1 지지부(291)의 하단에 위치하고, 원기둥의 형상으로 형성되되 제1 지지부(291)의 직경보다 작은 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동할 수 있다.The second contraction/relaxation part 292 is located at the bottom of the first support part 291 and is formed in the shape of a cylinder with a diameter smaller than the diameter of the first support part 291, and is formed by shock or vibration generated from the outside. It can be driven to contract or relax.
제2 수축이완부(292)는 외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성될 수 있다.The second contraction/relaxation portion 292 may be made of a material that can be formed into a bellows shape to allow for shock or relaxation generated from the outside.
제1 수축이완부(295) 및 제2 수축이완부(292)는 각각 다른 두께로 형성되어 외부로부터 발생하는 충격을 1차 및 2차적으로 각각 흡수할 수 있다.The first contraction/relaxation part 295 and the second contraction/relaxation part 292 are formed with different thicknesses and can respectively absorb external shocks primary and secondary.
제2 지지부(293)는 제2 수축이완부(292)의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 제1 수축이완부(295)의 직경보다 큰 직경으로 형성되되 지지판(210, 210')의 너비보다 작은 직경으로 형성될 수 있다.The second support part 293 is located at the lower end of the second contraction and relaxation part 292 and is formed in the shape of a disk with a predetermined height and a diameter larger than the diameter of the first contraction and relaxation part 295. The support plate 210 , 210') may be formed with a diameter smaller than the width.
하단체결부(297)는 한 쌍으로 위치한 끼움부(250) 중 하단에 위치한 끼움부(250)를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 끼움부(250) 중 하단에 위치한 끼움부(250)에 고정될 수 있다.The lower fastening part 297 is formed with a diameter that can be inserted through the fitting part 250 located at the bottom of the pair of fitting parts 250, and is located at the lower end of the pair of fitting parts 250. It can be fixed at (250).
도 34 및 도 35를 참조하면, 본 발명의 또 다른 실시예에 따른 충격흡수부(300)는 제1 수축부(310), 수축프레임(330), 탄성부(350), 제2 수축부(260) 및 끼움돌출부(370)를 포함할 수 있다.Referring to Figures 34 and 35, the shock absorbing part 300 according to another embodiment of the present invention includes a first contracted part 310, a contracted frame 330, an elastic part 350, and a second contracted part ( 260) and a fitting protrusion 370.
제1 수축부(310)는 소정의 직경 및 높이를 갖는 원기둥의 형상으로 형성되고, 상단에 위치하여 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동할 수 있다.The first contracted portion 310 is formed in the shape of a cylinder with a predetermined diameter and height, and is located at the top so that it can be driven to contract or relax by shock or vibration generated from the outside.
한편, 제1 수축부(310)는 상단형성부(314), 하단형성부(316) 및 공기층(312)을 포함할 수 있다.Meanwhile, the first contracted part 310 may include an upper forming part 314, a lower forming part 316, and an air layer 312.
상단형성부(314)는 상단의 길이 방향으로 형성되어 있으며 제2 수축부(260)의 상단에 위치할 수 있고, 하단형성부(316)는 제2 수축부(260)의 내측에 위치하며 반구의 형상으로 형성될 수 있고, 공기층(312)은 하단형성부(316)의 중앙에 위치하며 비어 있는 공간으로 형성될 수 있다.The upper forming part 314 is formed in the longitudinal direction of the upper end and may be located at the top of the second contracted part 260, and the lower forming part 316 is located inside the second contracted part 260 and has a hemispherical shape. It may be formed in the shape of, and the air layer 312 may be located in the center of the bottom forming portion 316 and may be formed as an empty space.
수축프레임(330)는 제1 수축부(310)의 내측에 위치할 수 있다.The shrinking frame 330 may be located inside the first shrinking portion 310.
더욱 구체적으로, 수축프레임은 내측탄성부(333), 상하단공간부(332) 및 수축제한부(336)를 포함할 수 있다.More specifically, the shrinkable frame may include an inner elastic portion 333, an upper and lower space portion 332, and a shrinkage limiting portion 336.
내측탄성부(333)는 상단형성부(314)의 내측과 맞닿아 있으며 'ㄱ'과 '『'의 형상으로 형성되어 서로 마주보도록 위치하고, 'ㄱ'과 '『'의 형상으로 형성되어 상단의 외측 방향으로 돌출되어 있는 부분은 끼움부(250)에 끼움 고정될 수 있다.The inner elastic portion 333 is in contact with the inner side of the upper forming portion 314 and is formed in the shape of 'ㄱ' and '『' and is positioned to face each other, and is formed in the shape of 'ㄱ' and '『' at the top. The portion protruding outward may be fitted and fixed into the fitting portion 250.
내측탄성부(333)의 직경은 끼움부(250)에 끼움 고정될 수 있는 직경으로 형성될 수 있다.The inner elastic portion 333 may have a diameter that can be fitted and fixed into the fitting portion 250.
또한, 내측탄성부(333)는 탄성부(350)의 수축 구동에 의해 탄성부(350)가 상단의 방향으로 이동됨에 따라 수축 구동하도록 형성될 수 있다.Additionally, the inner elastic portion 333 may be formed to contract and drive as the elastic portion 350 moves toward the upper end by the contraction drive of the elastic portion 350.
여기서, 내측탄성부(333)는 탄성부(350)의 수축 구동에 의해 탄성부(350)가 상단의 방향으로 이동됨에 따라 수축 구동 가능하도록 고무 또는 실리콘의 소재로 형성될 수 있으나, 이에 한정되는 것은 아니고 탄성부(350)의 가압에 의해 수축 구동하는 소재라면 그 명칭에 구애됨없이 모두 포함할 수 있다.Here, the inner elastic portion 333 may be formed of a material such as rubber or silicone to enable contraction as the elastic portion 350 moves in the upper direction by the contraction drive of the elastic portion 350, but is limited thereto. However, as long as it is a material that is driven to contract by the pressure of the elastic portion 350, it can be included regardless of its name.
상하단공간부(332)는 탄성부(350)가 위치하도록 형성된 빈 공간을 의미할 수 있다.The upper and lower space parts 332 may refer to an empty space formed so that the elastic part 350 is located.
수축제한부(336)는 내측탄성부(333)의 'ㄱ' 형상으로 형성된 좌측의 하단에 위치하여 상하단공간부(332)에 위치한 탄성부(350)의 수축 길이를 제한할 수 있다.The shrinkage limiting portion 336 is located at the lower left side of the inner elastic portion 333, which is formed in an 'L' shape, and can limit the shrinkage length of the elastic portion 350 located in the upper and lower space portions 332.
즉, 수축제한부(336)는 내측탄성부(333)와 달리 수축되지 않는 단단한 소재로 형성되어 탄성부(350)가 수축 구동하여 상단 방향으로 이동되는 거리를 제한할 수 있다.That is, the contraction limiting portion 336 is formed of a hard material that does not contract, unlike the inner elastic portion 333, and can limit the distance that the elastic portion 350 moves in the upper direction by contracting.
탄성부(350)는 제1 수축부(310)의 내측 하단에 위치하되 상단은 수축프레임(330)에 끼움 고정되어 있고, 외측에외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 스프링(354)이 구비되어 있어 상하단으로 이동할 수 있다.The elastic part 350 is located at the inner bottom of the first contracted part 310, but the upper end is fixed to the contracted frame 330, and on the outside is a spring ( 354) is provided so it can be moved up and down.
한편, 탄성부(350)는 중앙에 'ㅗ'의 형상으로 형성된 탄성지지부(352)가 구비되어 있을 수 있다.Meanwhile, the elastic part 350 may be provided with an elastic support part 352 formed in the shape of 'ㅗ' at the center.
탄성지지부(352)는 상단의 돌출된 부분은 마주보도록 위치한 내측탄성부(333)의 사이에 형성된 상하단공간부(332)에 삽입된 채 위치할 수 있다.The elastic support portion 352 may be positioned with the upper protruding portion inserted into the upper and lower space portions 332 formed between the inner elastic portions 333 positioned to face each other.
또한, 탄성지지부(352)는 하단은 상하단공간부(332)에 위치하여 외측에 감싸도록 위치한 스프링(354)에 의해 상단의 방향으로 이동하다가 내측탄성부(333) 및 수축제한부(336)의 하단과 맞닿아 상단 방향으로의 이동이 제한될 수 있다.In addition, the elastic support portion 352 is located at its lower end in the upper and lower space portions 332 and moves in the direction of the upper end by the spring 354 positioned to surround the outside, and then moves in the direction of the inner elastic portion 333 and the contraction limiting portion 336. Movement toward the top may be restricted due to contact with the bottom.
이를 통해 내측탄성부(333)는 '『'의 형상으로 형성된 하단은 탄성지지부(352)가 스프링(354)에 의해 상단 방향으로 이동할 때 발생하는 반동을 흡수하도록 수축 구동할 수 있다.Through this, the lower end of the inner elastic part 333, which is formed in the shape of '『', can be contracted and driven to absorb the recoil that occurs when the elastic support part 352 moves in the upper direction by the spring 354.
제2 수축부(260)는 제1 수축부(310)의 직경보다 큰 직경으로 형성되되 제1 수축부(310)의 하단에 위치하고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동할 수 있다.The second contracted part 260 is formed with a diameter larger than that of the first contracted part 310 and is located at the bottom of the first contracted part 310, and can be driven to contract or relax by an external shock or vibration. there is.
제2 수축부(260)는 내측 중앙 하단에 자바라 형상으로 형성된 자바라구동부(326)가 구비되어 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동할 수 있다.The second contracting part 260 is provided with a bellows driving part 326 formed in a bellows shape at the lower center of the inner side, and can be driven to contract or relax by shock or vibration generated from the outside.
한편, 제2 수축부(260)는 상단에 제1 수축부(310)가 삽입하는 삽입홈(미도시)이 형성되어 있을 수 있다.Meanwhile, the second contracted part 260 may have an insertion groove (not shown) formed at the top into which the first contracted part 310 is inserted.
자바라구동부(326)는 제1 수축부(310)의 하단 형상에 대응되는 형상으로 형성되어 상단은 제1 수축부(310)의 하단과 맞닿아 있을 수 있다.The bellows driving part 326 may be formed in a shape corresponding to the shape of the lower end of the first contracted part 310, and its upper end may be in contact with the lower end of the first contracted part 310.
또한, 자바라구동부(326)는 제1 수축부(310)에 가해지는 충격 또는 진동을 흡수하도록 수축 또는 이완 구동할 수 있다.Additionally, the bellows driving part 326 may be driven to contract or relax to absorb shock or vibration applied to the first contracted part 310.
끼움돌출부(370)는 제2 수축부(260)의 하단에 위치하되 끼움부(250)를 관통하여 끼워지는 직경으로 형성되어 끼움부(250)에 끼움 고정될 수 있다.The fitting protrusion 370 is located at the bottom of the second contracted part 260 and is formed to have a diameter that penetrates the fitting part 250 and can be fixed to the fitting part 250.
결론적으로, 충격흡수부(300)는 자바라구동부(326)의 수축 구동에 의해 제1 수축부(310)가 제2 수축부(260)의 내부로 하강 구동하고, 자바라구동부(326)의 구동에 의해 공기층(312)의 방향으로 공기가 이동하고, 공기층(312)으로 유입된 공기에 의해 탄성부(350)는 스프링(354)에 의해 상단 방향으로 구동하여 외부로부터 발생하는 충격 또는 진동을 흡수하는 역할을 수행할 수 있다.In conclusion, the shock absorber 300 moves the first contracted part 310 downward into the second contracted part 260 by the contraction drive of the bellows driving part 326, and is driven by the bellows driving part 326. The air moves in the direction of the air layer 312, and the elastic portion 350 is driven upward by the spring 354 by the air flowing into the air layer 312 to absorb shock or vibration occurring from the outside. can perform its role.
상술된 실시예들은 예시를 위한 것이며, 상술된 실시예들이 속하는 기술분야의 통상의 지식을 가진 자는 상술된 실시예들이 갖는 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 상술된 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The above-described embodiments are for illustrative purposes, and those skilled in the art will recognize that the above-described embodiments can be easily modified into other specific forms without changing the technical idea or essential features of the above-described embodiments. You will understand. Therefore, the above-described embodiments should be understood in all respects as illustrative and not restrictive. For example, each component described as unitary may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.
본 명세서를 통해 보호받고자 하는 범위는 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태를 포함하는 것으로 해석되어야 한다.The scope sought to be protected through this specification is indicated by the patent claims described later rather than the detailed description, and should be interpreted to include the meaning and scope of the claims and all changes or modified forms derived from the equivalent concept.
Claims (3)
- 벽과 평행하게 위치한 본체;를 포함하는, DSP 슬러리 농도 측정 장치.A DSP slurry concentration measurement device comprising: a body positioned parallel to the wall.
- 제 1 항에 있어서,According to claim 1,상기 본체의 상단면에 위치하여 상기 DSP 슬러리의 농도를 측정하는 각 단계를 조작하는 단계제어부;A step control unit located on the upper surface of the main body to manipulate each step of measuring the concentration of the DSP slurry;상기 본체의 일측면 상단에 구비되어 있으며, 상기 단계제어부에 의해 농도가 측정되는 DSP 슬러리의 농도 측정의 각 단계의 동작 시간을 제어하는 동작시간제어부;an operation time control unit provided at the top of one side of the main body and controlling the operation time of each step of measuring the concentration of the DSP slurry, the concentration of which is measured by the step control unit;상기 동작시간제어부의 외측면을 보호하며 타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가능하여 일측면으로 회전 개폐 가능한 제1 개폐부; 및A first opening/closing unit that protects the outer surface of the operation time control unit and has the other side connected to the main body, but has one side that can be opened and closed from the main body and can be rotated to open and close on one side; and타측면은 상기 본체에 연결되어 있으나 일측면은 상기 본체로부터 개폐가 가능하여 상기 제1 개폐부의 하단에 위치하여 오류 발생 시 오류 상황에 대처하여 본체를 수리하도록 일측면으로 회전 개폐 가능한 제2 개폐부;를 더 포함하고,The other side is connected to the main body, but one side can be opened and closed from the main body, so that it is located at the bottom of the first opening and closing part and can be opened and closed by rotating to one side to cope with the error situation and repair the main body when an error occurs; It further includes,상기 본체는,The main body is,벽에 고정되며 DSP 슬러리의 농도를 측정하고,It is fixed to the wall and measures the concentration of DSP slurry.상기 DSP 슬러리의 농도는,The concentration of the DSP slurry is,상기 초기 상태 체크 후, 시약이 투입되는 시약 투입 라인(Reagent Input Line)의 거품(Bubble)을 제거하여 분석 오차 발생을 방지하는 단계;After checking the initial state, removing bubbles from the reagent input line where the reagent is introduced to prevent analysis errors;상기 시약 투입 라인을 통해 투입되는 시약이 담아지는 시약 용기를 비우는 단계(Vessel Empty);Emptying the reagent vessel containing the reagent introduced through the reagent input line (Vessel Empty);상기 시약 용기에 담아진 상기 시약의 정확한 샘플을 추출하도록 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계;Cleaning the sample loop pipe to extract an accurate sample of the reagent contained in the reagent container;상기 샘플 루트 배관의 세척 후 상기 샘플 루프 배관을 이용해 상기 시약 용기를 세척하는 단계(Vessel Cleaning);Cleaning the reagent vessel using the sample loop pipe after cleaning the sample root pipe (Vessel Cleaning);상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty);Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty);상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계;Emptying the vent pipe connected to the reagent container;샘플(견본, Sampling)을 상기 샘플 루프를 통해 추출하는 단계;Extracting a sample (sampling) through the sample loop;추출한 상기 샘플(견본)을 시약 용기로 전송하는 단계(Sample Transfer);Transferring the extracted sample (sample) to a reagent container (Sample Transfer);상기 시약 용기에 전송된 상기 샘플을 설정된 조건으로 측정(분석, Measuring)하는 단계;Measuring (analyzing) the sample transferred to the reagent container under set conditions;상기 시약이 흡입되는 흡입부를 초기화시켜(Syringe Initialize) DIW 및 시약을 빼내(Drain)는 단계;Initializing the suction part through which the reagent is sucked (Syringe Initialize) and draining the DIW and the reagent;시약이 제거된 상기 시약 용기를 비우는 단계(Vessel Empty);Emptying the reagent vessel from which the reagent has been removed (Vessel Empty);상기 샘플 루프(Sample Loop) 배관을 세척(Cleaning)하는 단계;Cleaning the sample loop pipe;상기 시약 용기를 세척하는 단계(Vessel Cleaning);Cleaning the reagent vessel (Vessel Cleaning);상기 샘플 루프 배관을 통해 세척이 완료된 상기 시약 용기를 비우는 단계(Vessel Empty);Emptying the cleaned reagent vessel through the sample loop pipe (Vessel Empty);상기 상기 시약 용기와 연결되어 있는 환기구(Vent) 배관을 비우는(Empty) 단계; 및Emptying the vent pipe connected to the reagent container; and상기 시약 용기를 측정(분석, Measuring)이 필요한 다른 시약으로 채우는 단계(Vessel Refill);를 통해 측정하는, DSP 슬러리 농도 측정 장치.A DSP slurry concentration measuring device that measures through a step (vessel refill) of filling the reagent vessel with another reagent that requires measurement (analysis, measuring).
- 제 1 항에 있어서,According to claim 1,상기 본체는,The main body is,하단에 바닥면으로부터 일정 높이 유지하도록 지지하며 바닥면으로부터 발생하는 충격 또는 진동으로부터 보호하는 받침지지대가 더 구비되어 있고,There is a further support at the bottom to maintain a certain height from the floor and protect against shock or vibration from the floor,상기 받침지지대는,The base support is,소정의 높이를 갖는 사각 판의 형상으로 형성되어 있으며 상기 ~의 하단에 위치함과 동시에 바닥면에 위치하도록 한 쌍으로 구비되는 지지판;A support plate formed in the shape of a square plate with a predetermined height and provided in pairs so as to be located at the bottom of the ~ and at the same time located on the floor;한 쌍으로 구비된 상기 지지판의 일면 중앙에 위치하여 일측면은 상기 지지판에 부착되어 있는 한 쌍의 부착부;A pair of attachment portions located at the center of one side of the support plate provided as a pair and one side of which is attached to the support plate;소정의 두께를 갖는 원형 띠의 형상으로 형성되되 코일 스프링의 형상으로 형성되고, 한 쌍으로구비되는 상기 부착부의 타측면에 부착되는 한 쌍의 끼움부; 및A pair of fitting parts formed in the shape of a circular band having a predetermined thickness and formed in the shape of a coil spring and attached to the other side of the attachment part provided as a pair; and상기 끼움부의 비어 있는 중앙에 끼워진 채 위치하고, 외부로부터 발생하는 충격 또는 진동을 흡수하는 충격흡수부;를 포함하고,It includes a shock absorbing part located in the empty center of the fitting part and absorbing shock or vibration generated from the outside,상기 충격흡수부는,The shock absorbing part,한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 상단에 위치한 상기 끼움부에 고정되는 상단체결부;An upper fastening part formed to a diameter that can be fitted through the fitting located at the upper end of the pair of fitting parts and fixed to the fitting part located at the upper end of the pair of fitting parts;상기 상단체결부의 하단에 위치하며, 원기둥의 형상으로 형성되되 상기 상단체결부의 직경보다 큰 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제1 수축이완부;A first contraction/relaxation part located at the bottom of the upper fastening part, formed in the shape of a cylinder and having a diameter larger than the diameter of the upper fastening part, and driven to contract or relax by an external shock or vibration;상기 제1 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제1 지지부;a first support part located at the bottom of the first contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate;상기 제1 지지부의 하단에 위치하고, 원기둥의 형상으로 형성되되 상기 제1 지지부의 직경보다 작은 직경으로 형성되고, 외부로부터 발생하는 충격 또는 진동에 의해 수축 또는 이완 구동하는 제2 수축이완부;a second contraction/relaxation part located at the bottom of the first support part, formed in the shape of a cylinder, with a diameter smaller than that of the first support part, and driven to contract or relax by an external shock or vibration;상기 제2 수축이완부의 하단에 위치하고, 소정의 높이를 갖는 원판의 형상으로 형성되되 상기 제1 수축이완부의 직경보다 큰 직경으로 형성되되 상기 지지판의 너비보다 작은 직경으로 형성되는 제2 지지부; 및a second support part located at the bottom of the second contraction/relaxation part, formed in the shape of a disk having a predetermined height, and having a diameter larger than the diameter of the first contraction/relaxation part, but smaller than the width of the support plate; and한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부를 관통하여 끼움 체결 가능한 직경으로 형성되어 한 쌍으로 위치한 상기 끼움부 중 하단에 위치한 상기 끼움부에 고정되는 하단체결부;를 포함하고,It includes a lower fastening part that is formed to a diameter that can be fitted through the fitting located at the lower end of the pair of fitting parts and is fixed to the fitting part located at the lower end of the pair of fitting parts,상기 상단체결부는,The upper fastening part,외부로부터 발생하는 충격 또는 진동에 의해 상단에 위치한 상기 끼움부로부터 이탈되는 것을 방지하도록 상단면에 부착소재가 구비되어 있고,An attachment material is provided on the upper surface to prevent it from being separated from the fitting part located at the top due to external shock or vibration,상기 제1 수축이완부는,The first contraction and relaxation part,외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성되고,It is made of a material that can be formed into the shape of a bellows to allow for shock or relaxation from the outside,상기 제2 수축이완부는,The second contraction and relaxation part,외부로부터 발생하는 충격 또는 이완 가능하도록 자바라의 형상으로 형성 가능한 소재로 형성되고,It is made of a material that can be formed into the shape of a bellows to allow for shock or relaxation from the outside,상기 제1 수축이완부 및 상기 제2 수축이완부는,The first contraction and relaxation part and the second contraction and relaxation part,각각 다른 두께로 형성되어 외부로부터 발생하는 충격을 1차 및 2차적으로 각각 흡수하고,They are each formed with different thicknesses to absorb external shocks both primary and secondary, respectively.상기 끼움부는,The fitting part,일단에 끼움보강부가 형성되어 있어 상기 충격흡수부의 상기 상단체결부 또는 상기 하단체결부의외측면을 감싼 채 고정하여 상기 상단체결부 또는 상기 하단체결부의 직경이 중앙을 관통한 후 끼움 고정되는 것을 강화하는, DSP 슬러리 농도 측정 장치.A fitting reinforcement is formed at one end to surround and secure the outer surface of the upper fastening part or the lower fastening part of the shock absorber to strengthen the fit and fixation after the diameter of the upper fastening part or the lower fastening part penetrates the center. , DSP slurry concentration measurement device.
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