WO2024043059A1 - 光ファイバ着色被覆用の樹脂組成物、光ファイバ、及び光ファイバリボン - Google Patents

光ファイバ着色被覆用の樹脂組成物、光ファイバ、及び光ファイバリボン Download PDF

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WO2024043059A1
WO2024043059A1 PCT/JP2023/028794 JP2023028794W WO2024043059A1 WO 2024043059 A1 WO2024043059 A1 WO 2024043059A1 JP 2023028794 W JP2023028794 W JP 2023028794W WO 2024043059 A1 WO2024043059 A1 WO 2024043059A1
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Prior art keywords
meth
acrylate
resin layer
optical fiber
resin composition
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PCT/JP2023/028794
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English (en)
French (fr)
Japanese (ja)
Inventor
勝史 浜窪
矩章 岩口
未歩 池川
千明 徳田
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to CN202380052747.9A priority Critical patent/CN119486982A/zh
Priority to JP2024542725A priority patent/JPWO2024043059A1/ja
Publication of WO2024043059A1 publication Critical patent/WO2024043059A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/104—Coating to obtain optical fibres
    • C03C25/1065—Multiple coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C03C25/285—Acrylic resins
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/40—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/475—Coatings containing composite materials containing colouring agents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/48—Coating with two or more coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6226—Ultraviolet
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

Definitions

  • the present disclosure relates to a resin composition for colored coating of an optical fiber, an optical fiber, and an optical fiber ribbon.
  • an optical fiber has a coating resin layer for protecting the glass fiber that is an optical transmission body.
  • the coating resin layer includes, for example, a primary resin layer and a secondary resin layer.
  • the outermost layer of the coating resin layer is composed of a colored resin layer for identifying the optical fiber (see, for example, Patent Documents 1 to 3).
  • a resin composition for colored coating of an optical fiber contains a photopolymerizable compound, a polydimethylsiloxane compound, a photoinitiator, and titanium oxide, and the photopolymerizable compound comprises: Contains epoxy di(meth)acrylate, the content of epoxy di(meth)acrylate is 30 parts by mass or more and 75 parts by mass or less based on 100 parts by mass of the total amount of the photopolymerizable compound and the polydimethylsiloxane compound, and the polydimethylsiloxane
  • the compound has dimethylsiloxane units and alkylene oxide units, and the molar ratio of dimethylsiloxane units is 12 mol% or more and 80 mol% or less, based on the total amount of dimethylsiloxane units and alkylene oxide units.
  • FIG. 1 is a schematic cross-sectional view showing an example of an optical fiber according to this embodiment.
  • FIG. 2 is a schematic cross-sectional view showing an example of the optical fiber according to this embodiment.
  • FIG. 3 is a schematic cross-sectional view showing an example of the optical fiber ribbon according to this embodiment.
  • the resin composition for forming the colored resin layer contains an inorganic pigment such as titanium oxide. Since the inorganic pigment has a higher specific gravity than the resin component, sedimentation of the inorganic pigment may occur while the prepared resin composition is being stored. Furthermore, when forming the colored resin layer, if the resin composition is not uniformly applied, the coating diameter may vary and the optical fiber may break. Therefore, resin compositions for colored coating of optical fibers are required to have not only excellent storage stability but also excellent coating properties.
  • An object of the present disclosure is to provide a resin composition for colored coating of an optical fiber, an optical fiber, and an optical fiber ribbon that have excellent storage stability and coatability.
  • a resin composition for colored coating of an optical fiber according to one aspect of the present disclosure contains a photopolymerizable compound, a polydimethylsiloxane compound, a photoinitiator, and titanium oxide, and contains a photopolymerizable compound.
  • the compound contains epoxy di(meth)acrylate, and the content of epoxy di(meth)acrylate is 30 parts by mass or more and 75 parts by mass or less with respect to 100 parts by mass of the total amount of the photopolymerizable compound and the polydimethylsiloxane compound,
  • the polydimethylsiloxane compound has a dimethylsiloxane unit and an alkylene oxide unit, and the molar ratio of the dimethylsiloxane unit based on the total amount of the dimethylsiloxane unit and the alkylene oxide unit is 12 mol% or more and 80 mol% or less.
  • Such a resin composition achieves both storage stability and coatability by specifying the content of epoxy di(meth)acrylate used as a photopolymerizable compound and containing a polydimethylsiloxane compound having a specific structure. be able to.
  • the polydimethylsiloxane compound may have a (meth)acryloyl group from the viewpoint of further improving the storage stability of the resin composition.
  • the viscosity of the resin composition according to the present embodiment is 800 mPa ⁇ s or more and less than 10,000 mPa ⁇ s at 25°C, from the viewpoint of further improving the coating properties of the resin composition. It's okay.
  • the photopolymerizable compound is an alkylene oxide-modified di(meth)acrylate or an alkylene oxide-modified tri(meth)acrylate. It may further contain at least one selected from the group consisting of.
  • An optical fiber according to one aspect of the present disclosure includes a glass fiber including a core and a cladding, a primary resin layer that contacts the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer. a colored resin layer covering the secondary resin layer, the colored resin layer containing a cured product of the resin composition according to any one of (1) to (4) above.
  • An optical fiber according to one aspect of the present disclosure includes a glass fiber including a core and a cladding, a primary resin layer that contacts the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer.
  • the secondary resin layer contains a cured product of the resin composition according to any one of (1) to (4) above.
  • an optical fiber ribbon In an optical fiber ribbon according to one aspect of the present disclosure, a plurality of the optical fibers described in (5) or (6) above are arranged in parallel and coated with ribbon resin. Such an optical fiber ribbon does not cause color peeling when the optical fibers are taken out, and the optical fibers can be easily identified.
  • the resin composition for colored coating of optical fibers contains a photopolymerizable compound, a polydimethylsiloxane compound, a photopolymerization initiator, and titanium oxide, and the photopolymerizable compound is epoxy di( meth)acrylate, the content of epoxy di(meth)acrylate is 30 parts by mass or more and 75 parts by mass or less based on 100 parts by mass of the total amount of the photopolymerizable compound and the polydimethylsiloxane compound, and the polydimethylsiloxane compound is , has a dimethylsiloxane unit and an alkylene oxide unit, and the molar ratio of the dimethylsiloxane unit is 12 mol% or more and 80 mol% or less, based on the total amount of the dimethylsiloxane unit and the alkylene oxide unit.
  • the polydimethylsiloxane compound according to this embodiment has a dimethylsiloxane unit (-Si(CH 3 ) 2 O-) composed of two methyl groups bonded to a silicon atom and an oxygen atom in the main chain as a repeating unit. It has an alkylene oxide unit in the side chain or at the end.
  • a dimethylsiloxane unit (-Si(CH 3 ) 2 O-) composed of two methyl groups bonded to a silicon atom and an oxygen atom in the main chain as a repeating unit. It has an alkylene oxide unit in the side chain or at the end.
  • the amounts of dimethylsiloxane units (hereinafter referred to as "DMS units”) and alkylene oxide units (hereinafter referred to as "RO units") contained in the polydimethylsiloxane compound are determined by 1 H NMR of the polydimethylsiloxane compound. It can be calculated by measuring. From the viewpoint of further improving the storage stability of the resin composition, the molar ratio of the DMS units is 14 mol% or more, 16 mol% or more, 20 mol% or more, or 25 mol% based on the total amount of DMS units and RO units. % or more.
  • the molar ratio of the DMS unit is 70 mol% or less, 60 mol% or less, 55 mol% or less, based on the total amount of DMS units and RO units. , or 50 mol% or less.
  • alkylene oxides examples include ethylene oxide (EO) and propylene oxide (PO).
  • the polydimethylsiloxane compound may have a (meth)acryloyl group.
  • the polydimethylsiloxane compound may have a (meth)acryloyl group in the side chain or at the end.
  • the (meth)acryloyl group may be bonded to an alkylene oxide unit.
  • a polydimethylsiloxane compound having a (meth)acryloyl group can be copolymerized with a photopolymerizable compound described below. In this embodiment, a polydimethylsiloxane compound having a (meth)acryloyl group is not included in the photopolymerizable compounds.
  • the number of (meth)acryloyl groups that the polydimethylsiloxane compound has may be 1 or more, 2 or more, 6 or less, 5 or less, or 4 or less. From the viewpoint of further improving the storage stability of the resin composition, the polydimethylsiloxane compound has 1 to 6 (meth)acryloyl groups, and the molar ratio of DMS units is 14 mol% to 70 mol%. Good too.
  • the content of the polydimethylsiloxane compound is 0.5 parts by mass or more, 1. It may be 0 parts by mass or more, 1.5 parts by mass or more, or 2.0 parts by mass or more, and 12.0 parts by mass or less, 10.0 parts by mass or less, 8.0 parts by mass or less, or 6.0 parts by mass or less. It may be less than parts by mass.
  • the photopolymerizable compound according to this embodiment is distinguished from a polydimethylsiloxane compound having a (meth)acryloyl group in that it does not have a dimethylsiloxane skeleton.
  • the photopolymerizable compound can increase the strength of the colored resin layer by including epoxy di(meth)acrylate.
  • epoxy di(meth)acrylate a reaction product of a diglycidyl ether compound having a bisphenol skeleton and a compound having a (meth)acryloyl group such as (meth)acrylic acid can be used.
  • epoxy di(meth)acrylates examples include (meth)acrylic acid adducts of bisphenol A diglycidyl ether, (meth)acrylic acid adducts of bisphenol AF diglycidyl ether, and (meth)acrylic acid adducts of bisphenol F diglycidyl ether. Examples include adducts.
  • the content of epoxy di(meth)acrylate is 30 parts by mass or more, and 35 parts by mass based on 100 parts by mass of the total amount of the photopolymerizable compound and the polydimethylsiloxane compound. parts or more, 40 parts by mass or more, or 42 parts by mass or more, and from the viewpoint of improving the coating properties of the resin composition, it is 75 parts by mass or less, and 72 parts by mass or less, 70 parts by mass or less, or 69 parts by mass or less. It may be less than parts by mass.
  • the photopolymerizable compound according to the present embodiment can further include a photopolymerizable compound (hereinafter referred to as a "monomer") other than epoxy di(meth)acrylate.
  • a photopolymerizable compound hereinafter referred to as a "monomer”
  • a monofunctional monomer having one polymerizable group and a polyfunctional monomer having two or more polymerizable groups can be used.
  • a mixture of two or more monomers may be used.
  • monofunctional monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, s-butyl (meth)acrylate, tert-butyl (meth)acrylate, Isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, isoamyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3-phenoxybenzyl acrylate, phenoxydiethylene glycol acryl
  • polyfunctional monomers examples include polyethylene glycol di(meth)acrylate, isocyanuric acid ethylene oxide-modified di(meth)acrylate, ethylene oxide-modified bisphenol F di(meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, and polypropylene.
  • the photopolymerizable compound according to the present embodiment may contain an alkylene oxide-modified polyfunctional monomer from the viewpoint of adjusting the Young's modulus of the resin layer.
  • the alkylene oxide-modified polyfunctional monomer may have at least one type selected from the group consisting of ethylene oxide (EO) chains and propylene oxide (PO) chains.
  • EO ethylene oxide
  • PO propylene oxide
  • An ethylene oxide chain can be represented as "(EO)n”
  • a propylene oxide chain can be represented as "(PO)n”.
  • n is an integer of 1 or more, may be 2 or more, or 3 or more, and may be 30 or less, 25 or less, or 20 or less.
  • the photopolymerizable compound may further contain at least one selected from the group consisting of alkylene oxide-modified di(meth)acrylates and alkylene oxide-modified tri(meth)acrylates from the viewpoint of adjusting the viscosity of the resin composition.
  • alkylene oxide-modified di(meth)acrylates examples include polyethylene glycol di(meth)acrylate, isocyanuric acid ethylene oxide-modified di(meth)acrylate, ethylene oxide-modified bisphenol F di(meth)acrylate, and ethylene oxide-modified bisphenol A di(meth)acrylate.
  • Meth)acrylates include polypropylene glycol di(meth)acrylate, propylene oxide-modified bisphenol A di(meth)acrylate, and propylene oxide-modified neopentyl glycol di(meth)acrylate.
  • alkylene oxide-modified tri(meth)acrylates include trimethylolpropane tri(meth)acrylate, trimethyloloctane tri(meth)acrylate, trimethylolpropane polyethoxytri(meth)acrylate, and trimethylolpropane polypropoxytri(meth)acrylate.
  • the photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators.
  • the photopolymerization initiator include 1-hydroxycyclohexylphenylketone (Omnirad 184, manufactured by IGM Resins), 2,2-dimethoxy-2-phenylacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2 -Methylpropan-1-one, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane- 1-one (Omnirad 907, manufactured by IGM Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO, manufactured by IGM Resins), and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide ( Omnirad 819, manufactured by IGM Resin
  • the content of the photopolymerization initiator is 1 part by mass or more and 10 parts by mass or less, 2 parts by mass or more and 8 parts by mass or less, or 3 parts by mass or more, based on 100 parts by mass of the total amount of the photopolymerizable compound and polydimethylsiloxane compound. It may be 7 parts by mass or less.
  • the resin composition may further contain a silane coupling agent, a leveling agent, an antifoaming agent, an antioxidant, a sensitizer, and the like.
  • the silane coupling agent is not particularly limited as long as it does not interfere with curing of the resin composition.
  • Examples of the silane coupling agent include tetramethylsilicate, tetraethylsilicate, mercaptopropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris( ⁇ -methoxy-ethoxy)silane, ⁇ -(3,4-epoxycyclohexyl) )-Ethyltrimethoxysilane, dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -methacryloxy Propyltrimethoxysilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropyltrimeth
  • the resin composition according to this embodiment can further contain titanium oxide particles.
  • titanium oxide particles surface-treated titanium oxide particles may be used.
  • Surface-treated titanium oxide particles are titanium oxide particles that have been surface-treated with an inorganic substance, and have excellent dispersibility in a resin composition.
  • Examples of inorganic substances used for surface treatment include aluminum oxide, silicon dioxide, and zirconium dioxide.
  • the surface-treated titanium oxide particles have a surface-treated layer containing at least one member selected from the group consisting of aluminum oxide, silicon dioxide, and zirconium dioxide, dispersibility can be further improved.
  • the surface treatment layer may be formed on at least a portion of the surface of titanium oxide, or may be formed on the entire surface of titanium oxide.
  • the surface treatment layer is formed by surface treatment of titanium oxide.
  • the amount of the surface treatment layer in the surface-treated titanium oxide particles may be 1% by mass or more, 1.5% by mass or more, or 2% by mass or more from the viewpoint of improving dispersibility, and from the viewpoint of increasing hiding power. , 10% by mass or less, 9% by mass or less, or 8% by mass or less.
  • the amount of the surface treatment layer can be calculated by measuring the amount of titanium element and inorganic elements other than titanium contained in the surface treated titanium oxide particles using inductively coupled mass spectrometry (ICP-MS).
  • the average primary particle size of the surface-treated titanium oxide particles may be 300 nm or less, 295 nm or less, or 290 nm or less, from the viewpoint of improving the lateral pressure resistance of the coating resin layer.
  • the average primary particle size of the surface-treated titanium oxide particles may be 100 nm or more, 150 nm or more, or 200 nm or more, or 200 nm or more and 300 nm or less, from the viewpoint of increasing hiding power.
  • the average primary particle size can be measured, for example, by image analysis of electron micrographs, light scattering method, BET method, etc.
  • the content of the surface-treated titanium oxide particles is 0.6% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass based on the total amount of the resin composition. It may be more than that. From the viewpoint of increasing the curability of the resin composition, the content of the surface-treated titanium oxide particles is 20% by mass or less, 15% by mass or less, 10% by mass or less, or 8% by mass or less based on the total amount of the resin composition. There may be.
  • the viscosity at 25° C. of the resin composition according to the present embodiment may be 800 mPa ⁇ s or more, 1000 mPa ⁇ s or more, 1500 mPa ⁇ s or more, or 2000 mPa ⁇ s or more, from the viewpoint of further improving storage stability. From the viewpoint of further improving coating properties, it may be less than 10,000 mPa ⁇ s, 9,000 mPa ⁇ s or less, or 8,500 mPa ⁇ s or less.
  • the resin film obtained by curing the resin composition according to the present embodiment with an integrated light amount of 900 mJ/cm 2 or more and 1100 mJ/cm 2 or less is 6% or more and 50% or less at 23°C, the resin has excellent toughness.
  • a layer can be formed.
  • the elongation at break of the resin film may be 6.5% or more, 7% or more, or 10% or more, and may be 45% or less, 40% or less, or 30% or less.
  • the Young's modulus of the resin film may be 500 MPa or more, 600 MPa or more, or 700 MPa or more at 23°C. From the viewpoint of forming a resin layer with excellent toughness, the Young's modulus of the resin film may be 1600 MPa or less, 1500 MPa or less, or 1450 MPa or less at 23°C.
  • the resin composition according to this embodiment can be suitably used as a colored coating material for optical fibers.
  • the outermost layer of the coating resin layer using a colored coating material containing the resin composition according to this embodiment, the single-fiber separability of the optical fiber can be improved.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of an optical fiber according to one embodiment.
  • the optical fiber 1 includes a glass fiber 10 and a coating resin layer 20 that is in contact with the glass fiber 10 and covers the outer periphery of the glass fiber 10.
  • the glass fiber 10 is a light-guiding optical transmission body that transmits the light introduced into the optical fiber 1.
  • the glass fiber 10 is a member made of glass, and is configured using, for example, silica (SiO 2 ) glass as a base material (main component).
  • the glass fiber 10 includes a core 12 and a cladding 14 that covers the core 12. Glass fiber 10 transmits the light introduced into optical fiber 1.
  • the core 12 is provided, for example, in a region including the central axis of the glass fiber 10.
  • the core 12 is made of, for example, pure SiO 2 glass or SiO 2 glass containing GeO 2 and/or fluorine element.
  • the cladding 14 is provided in a region surrounding the core 12.
  • the cladding 14 has a refractive index lower than the refractive index of the core 12.
  • the cladding 14 is made of, for example, pure SiO 2 glass or SiO 2 glass doped with fluorine element.
  • the outer diameter of the glass fiber 10 is approximately 100 ⁇ m to 125 ⁇ m, and the diameter of the core 12 constituting the glass fiber 10 is approximately 7 ⁇ m to 15 ⁇ m.
  • the coating resin layer 20 is an ultraviolet curing resin layer that covers the cladding 14.
  • the coating resin layer 20 includes a primary resin layer 22 that covers the outer periphery of the glass fiber 10 and a secondary resin layer 24 that covers the outer periphery of the primary resin layer 22.
  • the primary resin layer 22 is in contact with the outer peripheral surface of the clad 14 and covers the entire clad 14.
  • the secondary resin layer 24 is in contact with the outer peripheral surface of the primary resin layer 22 and covers the entire primary resin layer 22.
  • the thickness of the primary resin layer 22 is, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the secondary resin layer 24 is, for example, 10 ⁇ m or more and 40 ⁇ m or less.
  • the resin composition according to this embodiment can be applied to the secondary resin layer 24.
  • the secondary resin layer 24 can be formed by curing the resin composition. By including the cured product of the resin composition according to this embodiment, the secondary resin layer 24 can improve the single-fiber separability of the optical fiber.
  • the coating resin layer 20 may further include a colored resin layer 26 that covers the outer periphery of the secondary resin layer 24.
  • FIG. 2 is a schematic cross-sectional view showing the configuration of an optical fiber according to one embodiment. As shown in FIG. 2, the optical fiber 1A of this embodiment includes a glass fiber 10 and a coating resin layer 20 that is in contact with the glass fiber 10 and covers the outer periphery of the glass fiber 10.
  • the coating resin layer 20 includes a primary resin layer 22, a secondary resin layer 24, and a colored resin layer 26.
  • the thickness of the colored resin layer 26 is, for example, 3 ⁇ m or more and 10 ⁇ m or less.
  • the resin composition according to this embodiment can be applied to the colored resin layer 26.
  • the colored resin layer 26 can be formed by curing the resin composition.
  • the colored resin layer 26 can improve the single-fiber separability of the optical fiber.
  • the secondary resin layer 24 in the fiber 1A may be formed using a conventionally known resin composition, for example, by curing a resin composition containing urethane (meth)acrylate, a monomer, and a photopolymerization initiator. I can do it.
  • the primary resin layer 22 can be formed, for example, by curing a resin composition containing urethane (meth)acrylate, a monomer, a photopolymerization initiator, and a silane coupling agent. Conventionally known techniques can be used for the resin composition for the primary resin layer.
  • optical fiber ribbon An optical fiber ribbon can be manufactured using the optical fiber according to this embodiment.
  • the optical fiber ribbon has a plurality of the optical fibers arranged in parallel and is coated with a ribbon resin.
  • FIG. 3 is a schematic cross-sectional view showing the optical fiber ribbon according to this embodiment.
  • the optical fiber ribbon 100 includes a plurality of optical fibers 1A and a connecting resin layer 40 in which the optical fibers 1A are coated with ribbon resin and connected. Although four optical fibers are shown as an example in FIG. 3, the number is not particularly limited.
  • a resin material generally known as a ribbon material can be used as the resin for the ribbon.
  • Ribbon resins are thermosetting resins such as silicone resins, epoxy resins, and urethane resins, or ultraviolet curing resins such as epoxy acrylates, urethane acrylates, and polyester acrylates, from the viewpoint of preventing damage to the optical fibers and making them easy to split. It may also contain resin.
  • the optical fiber ribbon according to the present embodiment does not cause color peeling when removing the connecting resin layer from the optical fiber ribbon to take out the optical fibers, and it is easy to remove the optical fibers. can be identified.
  • Measurement device Fourier transform nuclear magnetic resonance device (“Ascend500+AVANCE III HD” manufactured by Bruker Biospin) Probe: 5mm BBFO BB/19F-1H/D Probe Measurement solvent: chloroform-d Sample concentration: 20% (mL/mL) Measurement nuclide: 1H Measurement method: 1D Accumulated number of times: 128 times
  • Photopolymerizable compound bisphenol A epoxy diacrylate (EA), polypropylene glycol diacrylate (PPGDA), EO modified trimethylolpropane triacrylate (TMP(EO) 3 TA), EO modified bisphenol A diacrylate (BPA(EO) 30 DA) was prepared.
  • EA bisphenol A epoxy diacrylate
  • PPGDA polypropylene glycol diacrylate
  • TMP(EO) 3 TA EO modified trimethylolpropane triacrylate
  • BPA(EO) 30 DA EO modified bisphenol A diacrylate
  • titanium oxide particles surface-treated titanium oxide particles having a surface treatment layer containing aluminum oxide (Al 2 O 3 ) were prepared.
  • the average primary particle size of the surface-treated titanium oxide particles was 200 to 300 nm, and the amount of Al 2 O 3 calculated by ICP-MS measurement was 2.5% by mass.
  • viscosity The viscosity of the resin composition at 25° C. was measured using a rheometer (“MCR-102” manufactured by Anton Paar) under the conditions of a cone plate CP25-2 and a shear rate of 10 s ⁇ 1 .
  • a resin film was punched into a JIS K 7127 type No. 5 dumbbell shape, and tested using a tensile tester at a tensile speed of 1 mm/min and a gauge line spacing of 25 mm under the conditions of 23 ⁇ 2°C and 50 ⁇ 10% RH. Tensile, stress-strain curves were obtained. Young's modulus was determined using the 2.5% secant line.
  • a urethane acrylate oligomer obtained by reacting polypropylene glycol with a molecular weight of 4000, isophorone diisocyanate, hydroxyethyl acrylate, and methanol was prepared. 75 parts by mass of this urethane acrylate oligomer, 12 parts by mass of nonylphenol EO modified acrylate, 6 parts by mass of N-vinylcaprolactam, 2 parts by mass of 1,6-hexanediol diacrylate, 1 part by mass of Omnirad TPO, and 3-
  • a resin composition P was prepared by mixing 1 part by mass of mercaptopropyltrimethoxysilane.
  • (Resin composition for secondary resin layer) Acrylic acid addition of 40 parts by mass of urethane acrylate oligomer which is a reaction product of polypropylene glycol having a molecular weight of 600, 2,4-tolylene diisocyanate and 2-hydroxyethyl acrylate, 35 parts by mass of isobornyl acrylate, and bisphenol A diglycidyl ether.
  • a resin composition S was prepared by mixing 24 parts by mass of epoxy acrylate, 1 part by mass of Omnirad TPO, and 1 part by mass of Omnirad 184.
  • a primary resin layer with a thickness of 17.5 ⁇ m is formed using resin composition P on the outer periphery of a glass fiber with a diameter of 125 ⁇ m consisting of a core and a cladding, and a secondary resin layer with a thickness of 15 ⁇ m is further formed on the outer periphery using resin composition S.
  • a resin layer was formed to produce an optical fiber.
  • a colored resin layer with a thickness of 5 ⁇ m was formed on the outer periphery of the secondary resin layer using the resin compositions of Test Examples 1 to 7 while rewinding the optical fiber using a coloring machine.
  • An optical fiber having a diameter of 200 ⁇ m (hereinafter referred to as "colored optical fiber") having a colored resin layer was produced.
  • the linear speed when forming each resin layer was 1500 m/min.

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  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
PCT/JP2023/028794 2022-08-26 2023-08-07 光ファイバ着色被覆用の樹脂組成物、光ファイバ、及び光ファイバリボン Ceased WO2024043059A1 (ja)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501403A (ja) * 2000-06-22 2004-01-15 ディーエスエム　エヌ．ブイ． 照射硬化可能な着色されたコーティング組成物
JP2004504250A (ja) * 2000-06-22 2004-02-12 ピレリー・カビ・エ・システミ・ソチエタ・ペル・アツィオーニ 着色された光ファイバー及びこのファイバーを含む光ファイバーリボン集成体
JP2005165227A (ja) * 2003-12-05 2005-06-23 Sumitomo Electric Ind Ltd 光ファイバ着色心線、及び光ファイバテープ心線
JP2016124731A (ja) * 2014-12-26 2016-07-11 古河電気工業株式会社 光ファイバの製造方法
JP2022115744A (ja) * 2021-01-28 2022-08-09 古河電気工業株式会社 光ファイバ心線の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501403A (ja) * 2000-06-22 2004-01-15 ディーエスエム　エヌ．ブイ． 照射硬化可能な着色されたコーティング組成物
JP2004504250A (ja) * 2000-06-22 2004-02-12 ピレリー・カビ・エ・システミ・ソチエタ・ペル・アツィオーニ 着色された光ファイバー及びこのファイバーを含む光ファイバーリボン集成体
JP2005165227A (ja) * 2003-12-05 2005-06-23 Sumitomo Electric Ind Ltd 光ファイバ着色心線、及び光ファイバテープ心線
JP2016124731A (ja) * 2014-12-26 2016-07-11 古河電気工業株式会社 光ファイバの製造方法
JP2022115744A (ja) * 2021-01-28 2022-08-09 古河電気工業株式会社 光ファイバ心線の製造方法

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