WO2024040648A1 - 麦克风芯片及麦克风 - Google Patents

麦克风芯片及麦克风 Download PDF

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Publication number
WO2024040648A1
WO2024040648A1 PCT/CN2022/119284 CN2022119284W WO2024040648A1 WO 2024040648 A1 WO2024040648 A1 WO 2024040648A1 CN 2022119284 W CN2022119284 W CN 2022119284W WO 2024040648 A1 WO2024040648 A1 WO 2024040648A1
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WIPO (PCT)
Prior art keywords
diaphragm
microphone chip
microphone
back plate
inner membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/119284
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English (en)
French (fr)
Other versions
WO2024040648A9 (zh
Inventor
王凯杰
赵转转
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to JP2022577176A priority Critical patent/JP7627707B1/ja
Priority to US18/072,669 priority patent/US12284484B2/en
Publication of WO2024040648A1 publication Critical patent/WO2024040648A1/zh
Publication of WO2024040648A9 publication Critical patent/WO2024040648A9/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor

Definitions

  • the present application relates to the technical field of condenser microphones, and in particular, to a microphone chip and a microphone.
  • the condenser microphone includes a diaphragm and a backplate, which form a MEMS sound sensing capacitor, and the MEMS sound sensing capacitor is further connected to the processing chip through the connection pad to output the sound sensing signal to the processing chip for signal processing.
  • the movement of the diaphragm in the prior art is affected by its structure, resulting in poor performance of the MEMS microphone chip.
  • the movement of the diaphragm in the prior art is affected by its structure, resulting in poor performance of the MEMS microphone chip.
  • the purpose of this application is to provide a microphone chip and a microphone, which are designed to effectively increase and adjust the stiffness of the diaphragm according to needs.
  • the present application provides a microphone chip, including a substrate with a front cavity and a capacitor system disposed on the substrate.
  • the capacitor system includes a diaphragm located on the upper part of the substrate and a back plate spaced apart from the diaphragm. , an air gap is formed between the diaphragm and the back plate,
  • the microphone chip includes a fixed part, and the diaphragm and the back plate are connected to the base through the fixed part;
  • the diaphragm includes an inner membrane part, an outer membrane part and a support part, and the inner membrane part is connected to the base through the fixed part.
  • the microphone chip also includes a support member connected to the back plate and located between the back plate and the inner membrane part.
  • the inner membrane part can be adsorbed on the support member, and the support member can separate the inner membrane portion into at least two areas.
  • the support member includes a closing part and a partition part
  • the closing portion is disposed above the inner membrane portion and close to the outer periphery of the inner membrane portion;
  • the partition part is connected to the inner periphery of the closing part.
  • the support part extends outward along the edge of the inner membrane part and is connected to the fixing part;
  • the outer membrane part is fixedly connected to the fixing part.
  • the number of supporting parts is one or more.
  • At least two of the outer membrane portions extend outward along the edge of the inner membrane portion and are arranged around the inner membrane portion;
  • one end of the outer membrane part is connected to the inner membrane part, and the other end is connected to the support part.
  • the support part extends outward along an edge of an end of the outer membrane part away from the inner membrane part and is connected to the fixing part.
  • the microphone chip further includes an electrode piece and an electrode guide;
  • the electrode sheet is disposed on a side of the back plate close to the diaphragm, and the electrode sheet is divided into at least two pieces by the support member;
  • the electrode guide is used to lead out at least two electrode sheets at the same time.
  • the back plate is provided with at least two lead-out holes
  • the electrode guide is connected to a side of the back plate away from the diaphragm, and part of the electrode guide can pass through each of the lead-out holes and be connected to each of the electrode sheets.
  • This application also provides a microphone, which includes:
  • Microphone chip the microphone chip is installed on the microphone body, and the microphone chip is the above-mentioned microphone chip.
  • the beneficial effect of this application is that the diaphragm in the working state is divided into n mutually isolated floating areas by arranging supports to enhance the stiffness of the diaphragm. Moreover, the required stiffness of the diaphragm can be adjusted by dividing the working diaphragm into 2 or 3 or 4... or n floating areas. The more the diaphragm is divided, the stronger its stiffness will be. It is feasible to reduce the thickness of the diaphragm or increase the area of the diaphragm, thereby improving the feasibility of diaphragm design.
  • Figure 1 is a cross-sectional view of the microphone chip provided by the present application in a specific embodiment
  • Figure 2 is an enlarged schematic view of part A of Figure 1;
  • Figure 3 is a schematic structural diagram of the backplate, support and diaphragm in Figure 1;
  • Figure 4 is a schematic structural diagram of the support member and diaphragm in Figure 1;
  • Figure 5 is a schematic structural diagram of the support member in Figure 1;
  • Figure 6 is a schematic structural diagram of the diaphragm in Figure 1;
  • Figure 7 is a schematic structural diagram of the microphone chip provided by the present application in another specific embodiment.
  • Figure 8 is a schematic diagram of the cooperation between the diaphragm and the fixed part in Figure 7;
  • Figure 9 is a schematic structural diagram of the diaphragm in Figure 7.
  • Figure 10 is a cross-sectional view of the microphone chip provided by this application.
  • Figure 11 is a schematic diagram of the explosion in Figure 10;
  • Figure 12 is a cross-sectional view of the electrode guide, back plate, electrode sheet and support member in Figure 10;
  • FIG. 13 is a cross-sectional view of the electrode guide in FIG. 10 .
  • This embodiment provides a microphone, which can be used in electronic equipment and is used to receive sounds and convert the sounds into electrical signals.
  • the microphone includes a microphone body and a microphone chip 1, and the microphone chip 1 is installed on the microphone body.
  • the microphone chip 1 includes a base 11 with a front cavity 111, a diaphragm 12 disposed on the base 11, and a back plate 13 spaced apart from the diaphragm.
  • the diaphragm 12 It is connected between the base 11 and the back plate 13 along its vibration direction, and an air gap is formed between the diaphragm 12 and the back plate 13 .
  • the diaphragm 12 and the back plate 13 form a capacitive system.
  • the diaphragm 12 senses the external sound pressure and vibrates, causing the distance between the diaphragm 12 and the back plate 13 to change. Produces capacitance changes to achieve conversion of sound signals to electrical signals.
  • the microphone chip 1 includes a fixing part 17, and the diaphragm 12 and the back plate 13 are connected to the base 11 through the fixing part 17.
  • the diaphragm 12 includes an inner membrane part 121, an outer membrane part 122 and a support part 123. There is a gap between the inner membrane part 121 and the outer membrane part 122.
  • the support part 123 connects the fixing part 17 and the inner membrane part 121 or connects the fixing part 17 and the inner membrane part 121.
  • the microphone chip 1 also includes a support member 14 connected to the back plate 13 and located between the back plate 13 and the inner membrane portion 121 . In the working state, the inner membrane portion 121 can be adsorbed to the support member 14, and the support member 14 can separate the inner membrane portion 121 into at least two areas.
  • the support member 14 has a certain height.
  • the inner membrane portion 121 is separated from the back plate 13 and the support member 14 .
  • the inner membrane portion 121 is attracted and adsorbed on the support member 14 by electrostatic force.
  • the support member 14 separates the inner membrane portion 121 into at least two mutually isolated floating areas.
  • the support member 14 divides the inner membrane portion 121 in the working state into n mutually isolated floating areas to enhance the rigidity of the inner membrane portion 121 .
  • the required stiffness of the diaphragm 12 can be adjusted by dividing the working diaphragm 12 into 2 or 3 or 4... or n floating areas.
  • the support 14 includes a closing portion 141 and a partition 142; along the thickness direction of the microphone chip 1, the closing portion 141 is disposed above the inner membrane portion 121 and close to the outer periphery of the inner membrane portion 121.
  • the closing part 141 supports the inner membrane part 121 to reach the working state, while avoiding the occurrence of low attenuation and improving the reliability of the microphone.
  • the partition part 142 is connected to the inner periphery of the closing part 141, and the microphone is separated by the partition part 142 when in operation.
  • the partition 142 can be configured as a rod structure.
  • Both ends of the partition 142 are connected to the inner periphery of the closing part 141.
  • the partition 142 separates the closing part 141 into two parts, thereby correspondingly dividing the inner membrane part 121 into two floating parts. area.
  • the dividing portion 142 is two connecting rods arranged crosswise, which can divide the inner membrane portion 121 during operation into four isolated floating areas.
  • the support part 123 extends outward along the edge of the inner membrane part 121 and is connected to the fixing part 17 , and the outer membrane part 122 is fixedly connected to the fixing part 17 .
  • the diaphragm 12 is processed so that the diaphragm 12 forms an inner membrane part 121, an outer membrane part 122 and a supporting part 123 as shown in FIG. 6 .
  • the support part 123 connects the inner membrane part 121 and the fixing part 17 to fix the inner membrane part 121, so that the inner membrane part 121 is in a cantilevered state to ensure that the stress of the diaphragm material is sufficient. Release and increase the compliance of the diaphragm.
  • the diaphragm 12 can be connected and fixed with a single arm, further ensuring that the stress of the diaphragm 12 is released.
  • the diaphragm 12 may be provided with a plurality of support parts 123 such as two or three.
  • the outer membrane portion 122 is arranged around the inner membrane portion 121 , and there is a gap between part of the outer membrane portion 122 and the inner membrane portion 121 , and the partial outer membrane portion 122 Connected to the inner membrane part 121 , the support part 123 connects the outer membrane part 122 and the fixing part 17 , reducing the constraints on the inner membrane part 121 and allowing the diaphragm 12 to effectively release stress.
  • FIG. 8 there is a gap between the outer membrane portion 122 and the inner periphery of the fixing portion 17 , which can effectively improve sensitivity, reduce the binding force of the diaphragm, and effectively release stress.
  • FIG. 8 there are at least two outer membrane portions 122 ; at least two outer membrane portions 122 extend outward along the edges of the inner membrane portion 121 and are arranged around the inner membrane portion 121 ; along the outer membrane portion 122 In the extending direction, one end of the outer membrane part 122 is connected to the inner membrane part 121, and the other end is connected to the support part 123, so that a gap is formed between the middle part of the outer membrane part 122 and the inner membrane part 121, which is beneficial to releasing stress and extending the vibration. Membrane 12 lifespan.
  • the microphone chip 1 also includes an electrode sheet 15.
  • the electrode sheet 15 is disposed on the side of the back plate 13 close to the diaphragm 12. Since the support 14 is provided on the back plate 13, it needs to be The electrode sheet 15 is divided so that the electrode sheet 15 is divided into at least two pieces by the support member 14 , and each electrode sheet 15 is disposed in a region separated by the partition 142 .
  • the microphone chip 1 also includes an electrode guide 16. The electrode guide 16 can pull out at least two electrode pieces 15 at the same time, so as to solve the problem that each electrode piece 15 needs to be drawn out separately.
  • the back plate 13 is provided with at least two lead-out holes 131 , and the at least two lead-out holes 131 are disposed in the middle part of the back plate 13 , and the positions of each lead-out hole 131 are consistent with each electrode sheet.
  • the electrode sheet 15 corresponding to the position of the lead-out hole 131 is not drilled.
  • the electrode guide 16 is connected to the side of the back plate 13 away from the diaphragm 12 , and part of the electrode guide 16 can pass through each lead-out hole 131 and be connected to each electrode sheet 15 .
  • the electrode guide 16 includes a connected collection portion 161 and at least two guide portions 162 .
  • the collection portion 161 is located on the side of the back plate 13 away from the diaphragm 12 .
  • Each guide portion 162 passes through the lead-out hole 131 and is connected to the corresponding electrode sheet 15 . No openings are provided at positions corresponding to the electrode sheet 15 and the electrode guide 16 .
  • the back plate 13 is also provided with a sound hole 132 for conducting sound and balancing sound pressure. The sound hole 132 is located on the outer periphery of the lead-out hole 131 .
  • the electrode sheet 15 is divided into four parts by the support member 14 .
  • the electrode guide 16 is provided with four guide portions 162
  • the back plate 13 is provided with four lead-out holes 131 .
  • the electrode guide 16 may be made of metal or other conductive materials.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本申请涉及电容式麦克风技术领域，尤其涉及一种麦克风芯片及麦克风。麦克风芯片包括具有前腔的基底以及设置于基底上的电容系统，电容系统包括位于基底上部的振膜以及与振膜间隔设置的背板，振膜与背板之间形成空气间隔，振膜与背板通过固定部与基底连接，振膜包括内膜部、外膜部以及支撑部，内膜部与外膜部之间具有间隔，支撑部连接固定部和内膜部或者连接固定部和外膜部；麦克风芯片还包括支撑件，支撑件与背板连接，位于背板与内膜部之间，在工作状态时，内膜部能够吸附于支撑件，且支撑件能够将内膜部至少分隔为两个区域。通过支撑件将工作状态的振膜分隔为多个相互隔离的浮动区域，用以根据需求有效地调节和增强振膜的刚度。

Description

麦克风芯片及麦克风 技术领域
本申请涉及电容式麦克风技术领域，尤其涉及一种麦克风芯片及麦克风。
 背景技术
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
目前常用的麦克风主要有电容式麦克风及MEMS（微电机系统）麦克风，它们广泛应用于各种终端设备中。电容式麦克风包括振膜和背板，二者构成MEMS声传感电容，且MEMS声传感电容进一步通过连接盘连接到处理芯片以将声传感信号输出给处理芯片进行信号处理。现有技术中的振膜的运动受其结构影响，使MEMS麦克风芯片的性能较差。
 技术问题
现有技术中的振膜的运动受其结构影响，使MEMS麦克风芯片的性能较差。
 技术解决方案
本申请的目的在于提供了一种麦克风芯片及麦克风，旨在根据需求有效地增大和调整振膜的刚度。
本申请提供了一种麦克风芯片，包括具有前腔的基底以及设置于所述基底上的电容系统，所述电容系统包括位于所述基底上部的振膜以及与所述振膜间隔设置的背板，所述振膜与所述背板之间形成空气间隔，
所述麦克风芯片包括固定部，所述振膜与所述背板通过所述固定部与所述基底连接；所述振膜包括内膜部、外膜部以及支撑部，所述内膜部与所述外膜部之间具有间隔，所述支撑部连接所述固定部和所述内膜部或者连接所述固定部和所述外膜部；
所述麦克风芯片还包括支撑件，所述支撑件与所述背板连接，位于所述背板与所述内膜部之间，在工作状态时，所述内膜部能够吸附于所述支撑件，且所述支撑件能够将所述内膜部至少分隔为两个区域。
在一种可能的设计中，所述支撑件包括封闭部和分隔部；
沿所述麦克风芯片的厚度方向，所述封闭部设置于所述内膜部上方，且靠近所述内膜部的外周设置；
所述分隔部连接于所述封闭部的内周。
在一种可能的设计中，所述支撑部沿所述内膜部的边缘向外延伸，并与所述固定部连接；
所述外膜部与所述固定部固定连接。
在一种可能的设计中，所述支撑部设置为一个或多个。
在一种可能的设计中，所述外膜部至少设置为两个；
至少两个所述外膜部沿所述内膜部的边缘向外延伸并围绕所述内膜部设置；
沿所述外膜部的延伸方向，所述外膜部的一端与所述内膜部连接，另一端与所述支撑部连接。
在一种可能的设计中，所述支撑部沿所述外膜部远离所述内膜部的一端的边缘部向外延伸，并与所述固定部连接。
在一种可能的设计中，所述外膜部与所述固定部的内周之间具有间隔。
在一种可能的设计中，所述麦克风芯片还包括电极片和电极引导件；
所述电极片设置于所述背板靠近所述振膜的一侧，且所述电极片被所述支撑件至少分割为两片；
所述电极引导件用于同时将至少两片所述电极片引出。
在一种可能的设计中，所述背板设有至少两个引出孔；
所述电极引导件连接于所述背板远离所述振膜的一侧，且部分所述电极引导件能够穿过各所述引出孔与各所述电极片连接。
本申请还提供了一种麦克风，所述麦克风包括：
麦克风主体；
麦克风芯片，所述麦克风芯片安装于所述麦克风主体，所述麦克风芯片为上述所述的麦克风芯片。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
 有益效果
本申请的有益效果在于：通过设置支撑件将工作状态的振膜分隔为n个相互隔离的浮动区域，增强振膜的刚度。并且，可通过将工作状态的振膜分隔为2个或3个或4个….或n个浮动区域，来调节振膜所需刚度，振膜被分隔的数量越多，其刚度越强，对于实现减薄振膜的厚度或增大振膜的面积具有可实施性，进而提高振膜设计的可行性。
 附图说明
图1为本申请所提供麦克风芯片在一种具体实施例中的剖视图；
图2为图1的A部的放大示意图；
图3为图1中背板、支撑件和振膜的结构示意图；
图4为图1中支撑件与振膜的结构示意图；
图5为图1中支撑件的结构示意图；
图6为图1中振膜的结构示意图；
图7为本申请所提供麦克风芯片在另一种具体实施例中的结构示意图；
图8为图7中振膜与固定部配合的示意图；
图9为图7中振膜的结构示意图；
图10为本申请所提供麦克风芯片的剖视图；
图11为图10的爆炸示意图；
图12为图10中电极引导件、背板、电极片和支撑件配合的剖视图；
图13为图10中电极引导件的剖视图。
附图标记：
1-麦克风芯片；
  11-基底；
    111-前腔；
  12-振膜；
    121-内膜部；
122-外膜部；
123-支撑部；
  13-背板；
    131-引出孔；
    132-声孔；
  14-支撑件；
    141-封闭部；
    142-分隔部；
  15-电极片；
  16-电极引导件；
    161-汇集部；
    162-引导部；
17-固定部。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
 本发明的最佳实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本实施例提供了一种麦克风，能够用于电子设备，其作用为接收声音并将声音转化为电信号。麦克风包括麦克风主体与麦克风芯片1，麦克风芯片1安装于麦克风主体。
具体地，如图1、图7和图11所示，麦克风芯片1包括具有前腔111的基底11以及设置于基底11上的振膜12以及与振膜间隔设置的背板13，振膜12沿其振动方向连接在基底11与背板13之间，振膜12与背板13之间形成空气间隔。振膜12与背板13形成电容系统，当外界声音通过背腔111传递至振膜12，振膜12感受到外界声压产生振动，使得振膜12与背板13之间的距离发生变化从而产生电容变化，实现声音信号到电信号的转换。
如图1、图7和图11所示，麦克风芯片1包括固定部17，振膜12与背板13通过固定部17与基底11连接。振膜12包括内膜部121、外膜部122与支撑部123，内膜部121与外膜部122之间具有间隔，支撑部123连接固定部17和内膜部121或者连接固定部17和外膜部122。麦克风芯片1还包括支撑件14，支撑件14与背板13连接，位于背板13与内膜部121之间。在工作状态时，内膜部121能够吸附于支撑件14，且支撑件14能够将内膜部121至少分隔为两个区域。
本实施例中，支撑件14具有一定高度，麦克风在未工作时，内膜部121与背板13与支撑件14处于分离状态。麦克风在工作时，在偏压下，内膜部121受到静电力吸引吸附在支撑件14上，此时，支撑件14将内膜部121至少分隔为两个相互隔离的浮动区域。通过支撑件14将工作状态的内膜部121分隔为n个相互隔离的浮动区域，增强内膜部121的刚度。其中，可通过将工作状态的振膜12分隔为2个或3个或4个….或n个浮动区域，来调节振膜12所需刚度，振膜12被分隔的数量越多，其刚度越强，对于实现减薄振膜12的厚度或增大振膜12的面积具有可实施性，进而提高振膜12设计的可行性。
如图3至图5所示，支撑件14包括封闭部141和分隔部142；沿麦克风芯片1的厚度方向，封闭部141设置于内膜部121上方，且靠近内膜部121的外周设置，麦克风工作时，内膜部121受静电力吸引吸附在封闭部141上，封闭部141支撑内膜部121以达到工作状态，同时避免低衰现象的发生，提升麦克风的可靠性。分隔部142连接于封闭部141的内周，麦克风在工作状态下，被分隔部142分隔。该分隔部142可设置为杆结构，分隔部142的两端连接与封闭部141的内周，分隔部142将封闭部141分隔为两部分，由此将内膜部121对应分隔为两个浮动区域。如图3和图4所示，该分隔部142为交叉设置的两个连杆，可将工作时的内膜部121分隔为四个相隔离的浮动区域。
如图4和图6所示，在一种具体实施例中，支撑部123沿内膜部121的边缘向外延伸，并与固定部17连接，外膜部122与固定部17固定连接。
该实施例中，对振膜12进行加工，使振膜12形成如图6所示的内膜部121、外膜部122与支撑部123。内膜部121与外膜部122之间具有间隔，支撑部123连接内膜部121与固定部17以固定内膜部121，从而使得内膜部121处于悬臂状态，保证振膜材料的应力充分释放，增大振膜顺性。
其中，如图4和图6所示，支撑部123设置为一个。即，振膜12可以单臂连接固定，进一步保证振膜12的应力得到释放。或者，振膜12也可设置2个、3个等多个支撑部123。
在另一种具体实施例中，如图7至图9所示，外膜部122围绕内膜部121设置，且部分外膜部122与内膜部121之间具有间隙，部分外膜部122与内膜部121连接，支撑部123连接外膜部122与固定部17，减小对内膜部121的约束，使振膜12有效释放应力。如图8所示，外膜部122与固定部17的内周之间具有间隔，可以有效提高灵敏度，便于减小振膜的束缚力，有效释放应力。
具体地，如图8所示，外膜部122至少设置为两个；至少两个外膜部122沿内膜部121的边缘向外延伸，并围绕内膜部121设置；沿外膜部122的延伸方向，外膜部122的一端与内膜部121连接，另一端与支撑部123连接，使外膜部122的中间部分与内膜部121之间形成间隙，有利于释放应力，延长振膜12使用寿命。
如图9所示，外膜部122被设置为四个，对应的也设置有四个支撑部123。
进一步地，如图10至图13所示，麦克风芯片1还包括电极片15，电极片15设置于背板13靠近振膜12的一侧，因在背板13上设置支撑件14，需将电极片15进行分割，使电极片15被支撑件14至少分割为两片，各电极片15设置在分隔部142分隔形成的区域内。为实现同时将各电极片15引出，麦克风芯片1还包括电极引导件16，电极引导件16能够同时将至少两片电极片15引出，以解决各个电极片15需分别引出的问题。
具体地，如图11和图12所示，背板13设有至少两个引出孔131，至少两个引出孔131设置于背板13的中间部分，且各引出孔131的位置与各电极片15的位置对应，与引出孔131位置对应的电极片15不做开孔处理。电极引导件16连接于背板13远离振膜12的一侧，且部分电极引导件16能够穿过各引出孔131与各电极片15连接。
更具体地，如图12和图13所示，电极引导件16包括相连接的汇集部161和至少两个引导部162，汇集部161位于背板13远离振膜12的一侧，各引导部162穿过引出孔131与对应的电极片15连接。电极片15与电极引导件16相对应的位置未设置开孔。背板13还设有传导声音及平衡声压的声孔132，声孔132位于引出孔131的外周。
如图13所示，电极片15被支撑件14分割为四份，对应地，电极引导件16设置四个引导部162，背板13设置有四个引出孔131。
其中，电极引导件16的材质可以为金属材质或其他导电材质。
需要指出的是，本专利申请文件的一部分包含受著作权保护的内容。除了对专利局的专利文件或记录的专利文档内容制作副本以外，著作权人保留著作权。

Claims (10)

  1. 一种麦克风芯片，包括具有前腔的基底以及设置于所述基底上的电容系统，所述电容系统包括位于所述基底上部的振膜以及与所述振膜间隔设置的背板，所述振膜与所述背板之间形成空气间隔，其特征在于，
    所述麦克风芯片包括固定部，所述振膜与所述背板通过所述固定部与所述基底连接；
    所述振膜包括内膜部、外膜部以及支撑部，所述内膜部与所述外膜部之间具有间隔，所述支撑部连接所述固定部和所述内膜部或者连接所述固定部和所述外膜部；
    所述麦克风芯片还包括支撑件，所述支撑件与所述背板连接，位于所述背板与所述内膜部之间，在工作状态时，所述内膜部能够吸附于所述支撑件，且所述支撑件能够将所述内膜部至少分隔为两个区域。
  2. 根据权利要求1所述的麦克风芯片，其特征在于，所述支撑件包括封闭部和分隔部；
    沿所述麦克风芯片的厚度方向，所述封闭部设置于所述内膜部上方，且靠近所述内膜部的外周设置；
    所述分隔部连接于所述封闭部的内周。
  3. 根据权利要求1所述的麦克风芯片，其特征在于，所述支撑部沿所述内膜部的边缘向外延伸，并与所述固定部连接；
    所述外膜部与所述固定部固定连接。
  4. 根据权利要求3所述的麦克风芯片，其特征在于，所述支撑部设置为一个或多个。
  5. 根据权利要求1所述的麦克风芯片，其特征在于，所述外膜部至少设置为两个；
    至少两个所述外膜部沿所述内膜部的边缘向外延伸，并围绕所述内膜部设置；
    沿所述外膜部的延伸方向，所述外膜部的一端与所述内膜部连接，另一端与所述支撑部连接。
  6. 根据权利要求5所述的麦克风芯片，其特征在于所述支撑部沿所述外膜部远离所述内膜部的一端的边缘部向外延伸，并与所述固定部连接。
  7. 根据权利要求5所述的麦克风芯片，其特征在于，所述外膜部与所述固定部的内周之间具有间隔。
  8. 根据权利要求1~7任一项所述的麦克风芯片，其特征在于，所述麦克风芯片还包括电极片和电极引导件；
    所述电极片设置于所述背板靠近所述振膜的一侧，且所述电极片被所述支撑件至少分割为两片；
    所述电极引导件用于同时将至少两片所述电极片引出。
  9. 根据权利要求8所述的麦克风芯片，其特征在于，所述背板设有至少两个引出孔；
    所述电极引导件连接于所述背板远离所述振膜的一侧，且部分所述电极引导件能够穿过各所述引出孔与各所述电极片连接。
  10. 一种麦克风，其特征在于，所述麦克风包括：
    麦克风主体；
    麦克风芯片，所述麦克风芯片安装于所述麦克风主体，所述麦克风芯片为权利要求1~9任一项所述的麦克风芯片。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101453683A (zh) * 2008-12-26 2009-06-10 瑞声声学科技(深圳)有限公司 硅电容式麦克风
CN101841758A (zh) * 2010-03-08 2010-09-22 瑞声声学科技(深圳)有限公司 电容mems麦克风
CN103686570A (zh) * 2013-12-31 2014-03-26 瑞声声学科技(深圳)有限公司 Mems麦克风
CN207603920U (zh) * 2017-12-19 2018-07-10 深圳市国邦电子科技有限公司 一种电容式麦克风
US20200413203A1 (en) * 2019-06-29 2020-12-31 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Piezoelectric type and capacitive type combined mems microphone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101453683A (zh) * 2008-12-26 2009-06-10 瑞声声学科技(深圳)有限公司 硅电容式麦克风
CN101841758A (zh) * 2010-03-08 2010-09-22 瑞声声学科技(深圳)有限公司 电容mems麦克风
CN103686570A (zh) * 2013-12-31 2014-03-26 瑞声声学科技(深圳)有限公司 Mems麦克风
CN207603920U (zh) * 2017-12-19 2018-07-10 深圳市国邦电子科技有限公司 一种电容式麦克风
US20200413203A1 (en) * 2019-06-29 2020-12-31 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Piezoelectric type and capacitive type combined mems microphone

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