WO2024037939A1 - Architecture blindée modulaire pour l'atténuation d'interférence électromagnétique dans la conception d'irm - Google Patents

Architecture blindée modulaire pour l'atténuation d'interférence électromagnétique dans la conception d'irm Download PDF

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Publication number
WO2024037939A1
WO2024037939A1 PCT/EP2023/071993 EP2023071993W WO2024037939A1 WO 2024037939 A1 WO2024037939 A1 WO 2024037939A1 EP 2023071993 W EP2023071993 W EP 2023071993W WO 2024037939 A1 WO2024037939 A1 WO 2024037939A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
communication interface
galvanic communication
galvanic
emi shielding
Prior art date
Application number
PCT/EP2023/071993
Other languages
English (en)
Inventor
Bruce Geoffrey APPLETON
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Publication of WO2024037939A1 publication Critical patent/WO2024037939A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/42—Screening
    • G01R33/422—Screening of the radio frequency field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
    • G01R33/36—Electrical details, e.g. matching or coupling of the coil to the receiver
    • G01R33/3692—Electrical details, e.g. matching or coupling of the coil to the receiver involving signal transmission without using electrically conductive connections, e.g. wireless communication or optical communication of the MR signal or an auxiliary signal other than the MR signal

Definitions

  • the present disclosure is directed generally to modular system architecture in a magnetic resonance imaging (MRI) environment, comprising electromagnetic interference (EMI) shielded components configured to communicate using non-galvanic methods.
  • MRI magnetic resonance imaging
  • EMI electromagnetic interference
  • MRI is a medical imaging modality that uses a magnetic field to create detailed images of a subject’s internal structures. MRI has become a ubiquitous component of health care.
  • the MRI environment is a hostile environment.
  • the magnetic field of the MRI system is extremely strong, and thus any ferromagnetic objects within the MRI environment can become airborne projectiles with high velocity.
  • This includes surgical tools, monitors, and other healthcare equipment commonly used with patients. It also includes consumer equipment such as smartphones, watches, and other consumer equipment.
  • consumer equipment such as smartphones, watches, and other consumer equipment.
  • Careful screening of people and objects entering the MRI environment is critical.
  • the MRI system In addition to the magnetic field, the MRI system generates a radiofrequency (RF) field that can cause other complications within the MRI environment.
  • RF radiofrequency
  • the RF field can induce currents within any wires inside the MRI environment, and can seriously disrupt communications within the MRI environment.
  • the MRI environment and equipment is susceptible to external risks and influences. These external risks and influences can be considered during design of the MRI equipment in order to attempt to mitigate the risks and influences.
  • electromagnetic interference one of the risks for MRI equipment is electromagnetic interference.
  • An MRI system is extremely sensitive to external electromagnetic noise, which can cause MRI image artifacts. This presents a significant challenge when designing systems that operate in proximity to an MRI system. If the system generates too much electromagnetic interference, it can impact the very sensitive MRI equipment and can result in the MRI image artifacts.
  • the present disclosure is directed to inventive methods and systems for preventing electromagnetic interference within an MRI environment.
  • Various embodiments and implementations herein are directed to a modular system architecture in an MRI environment, comprising EMI-shielded components configured to communicate using non-galvanic methods.
  • the system includes two or more electronic components each at least partially surrounded by EMI shielding.
  • the two or more electronic components each comprise a non-galvanic communication interface configured to communicate data via non-galvanic communication with one or more other of the two or more electronic components.
  • an electronic system configured for use within an MRI environment.
  • the system includes: (i) a power supply; (ii) a first electronic component configured to receive power from the power supply, wherein the first electronic component comprises a non-galvanic communication interface, and further wherein the first electronic component is at least partially encased within electromagnetic interference (EMI) shielding, the EMI shielding allowing passage of a portion of the power supply therethrough to contact the first electronic component; and (iii) a second electronic component, wherein the second electronic component comprises a non-galvanic communication interface, and further wherein the second electronic component is at least partially encased within EMI shielding; wherein the first electronic component EMI shielding and/or the second electronic component EMI shielding comprises a gap configured to enable non-galvanic communication between the non-galvanic communication interface of the first electronic component and the non-galvanic communication interface of the second electronic component.
  • the power supply comprises a power filter configured to
  • the first electronic component is a processor.
  • the second electronic component is a front-end board or a data acquisition board.
  • the non-galvanic communication comprises optical communication.
  • the non-galvanic communication interface of the first electronic component and the non-galvanic communication interface of the second electronic component comprises an opto-isolator or a fiber-optic high speed data link.
  • each of the power supply, the first electronic component, and the second electronic component are fully encased within the respective EMI shielding.
  • an electronic system configured for use within an MRI environment.
  • the system includes: (i) a power supply; (ii) a processor board or similar configured to receive power from the power supply, wherein the processor comprises a non-galvanic communication interface, and further wherein the processor is at least partially encased within electromagnetic interference (EMI) shielding, the EMI shielding allowing passage of a portion of the power supply therethrough to contact the processor; and (iii) a second electronic component, wherein the second electronic component comprises a non-galvanic communication interface, and further wherein the second electronic component is at least partially encased within EMI shielding, and further wherein the second electronic component is a front-end board or a data acquisition board; wherein the processor EMI shielding and/or the second electronic component EMI shielding comprises a gap configured to enable non-galvanic communication between the non- galvanic communication interface of the processor and the non-galvanic communication interface of the second electronic component, wherein the non-galvanic
  • FIG. 1 is a schematic representation of a prior art systems, in accordance with an embodiment.
  • FIG. 2 is a schematic representation of a modular shielded architecture, in accordance with an embodiment.
  • FIG. 3 is a schematic representation of a modular shielded architecture, in accordance with an embodiment.
  • the present disclosure describes various embodiments of a modular system architecture for an electronic system within an MRI environment. More generally, Applicant has recognized and appreciated that it would be beneficial to provide systems designed to operate in proximity to MRI equipment without causing electromagnetic interference detected by that MRI equipment.
  • various embodiments and implementations herein are directed to a modular system architecture in an MRI environment, comprising EMI-shielded components configured to communicate using non-galvanic methods.
  • the system includes two or more electronic components each at least partially surrounded by EMI shielding.
  • the two or more electronic components each comprise a non-galvanic communication interface configured to communicate data via non-galvanic communication with one or more other of the two or more electronic components.
  • the electronic system may be any electronic system within the MRI environment, including a component of the MRI system or another electronic system operating within and independently of the MRI system.
  • This electronic system comprises, for example, a power supply or board 110, a first electronic component 120 such as a processor, and a second electronic component 130 such as a sensor, communication interface, front-end board, data acquisition board, or other electronic component.
  • the system may comprise additional electronic components.
  • the power supply and the electronic components are interconnected via a galvanic connection such as wiring 140, 150, 160, and 170, as shown in this example. In this design, wires such as those entering or leaving the system pose an EMI risk, behaving as antennas. This can cause, for example, image artifacts and other negative impacts or influences on the MRI system.
  • the risk of EMI impacting the MRI system is minimized.
  • the system limits internal EMI coupling (both radiated and conducted) between boards and/or subsystems of the system by utilizing galvanic separation. Limiting internal coupling limits the risk of cables and wires becoming sources of EMI as with the prior art shown in FIG. 1.
  • the electronic system 200 may be any electronic system within the MRI environment, including a component of the MRI system or another electronic system operating within and independently of the MRI system.
  • the electronic system can be any of the systems described or otherwise envisioned herein.
  • the electronic system can be a single system or multiple different systems.
  • the system comprises a power supply or board 210/212.
  • the power supply or board provides power to the first electronic component 220 and/or the second electronic component 230, among other possible electronic components.
  • power supply 210/212 is in contact with the first electronic component 220, passing through EMI shielding 216 and/or 226.
  • the portion of the power supply or board 210/220 passing through EMI shielding 216 and/or 226 is heavily filtered by power filter 214 to limit board-to-board conducted EMI.
  • the power filter 214 can be any power filter that is capable of limiting board-to-board conducted EMI.
  • the power supply or board 210/212 is at least partially encased within EMI shielding 216.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • many types of EMI shielding are known.
  • the EMI shielding can comprise carbons, ceramics, cement, polymers, hybrids, and composites.
  • the EMI shielding may not comprise ferromagnetic material.
  • the system comprises a first electronic component 220.
  • the first electronic component may be any electronic component of the system, including but not limited to a processor.
  • the processor is powered by the power supply, as shown in FIG. 2, optionally with filtering to limit board-to-board conducted EMI.
  • the first electronic component 220 comprises a non- galvanic communication interface 222.
  • the non-galvanic communication interface 222 can be any interface or component configured to enable non-galvanic communication with another electronic component of the system.
  • methods of non-galvanic communication include but are not limited to optical, acoustic, and mechanical.
  • the non-galvanic communication interface 222 comprises one or more components designed or configured to facilitate these non-galvanic communication methods, such as an opto-isolator configured to communicate electrical signals between two isolated circuits or components by using light, or a fiber-optic high speed data link.
  • the first electronic component 220 is at least partially encased within EMI shielding 226.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • many types of EMI shielding are known.
  • the EMI shielding can comprise carbons, ceramics, cement, polymers, hybrids, and composites.
  • the EMI shielding may not comprise ferromagnetic material.
  • the system comprises a second electronic component 230.
  • the second electronic component may be any electronic component of the system, including but not limited to a front-end board, a data acquisition board, or any other board or component.
  • the second electronic component 230 may be powered by the power supply or powered by any other source.
  • the second electronic component 230 comprises a non- galvanic communication interface 232.
  • the non-galvanic communication interface 232 can be any interface or component configured to enable non-galvanic communication with another electronic component of the system.
  • methods of non-galvanic communication include but are not limited to optical, acoustic, and mechanical.
  • the non-galvanic communication interface 232 comprises one or more components designed or configured to facilitate these non-galvanic communication methods, such as an opto-isolator configured to communicate electrical signals between two isolated circuits or components by using light, or a fiber-optic high speed data link.
  • the second electronic component 230 is at least partially encased within EMI shielding 236.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • many types of EMI shielding are known.
  • the EMI shielding can comprise carbons, ceramics, cement, polymers, hybrids, and composites.
  • the EMI shielding may not comprise ferromagnetic material.
  • the EMI shielding 226/236 - which may be a single shielding element or multiple shielding elements - comprises a non-galvanic communication gap 240.
  • the non-galvanic communication interfaces 222 and 232 communicate data through the gap using non- galvanic communication.
  • the non-galvanic communication interfaces 222 and 232 may communicate data through the gap using light, among other possible mechanisms.
  • system 200 is shown with only first and second electronic components, it should be understood that the system may comprise additional electronic components. Some or all of these additional electronic components may comprise a non-galvanic communication interface, and may be at least partially encased within EMI shielding. That EMI shielding may also be configured to enable non-galvanic communication between additional electronic components as described or otherwise envisioned herein.
  • FIG. 3 in one embodiment, is three-dimensional schematic representation of a modular system architecture 300 comprising EMI-shielded components configured to communicate using non-galvanic methods.
  • the system comprises a power supply or board 310.
  • the power supply or board provides power to a first electronic component 320, which in this example is a processor board, and/or to a second electronic component 330, which in this example is a frontend board.
  • power supply 320 is in contact with the first electronic component 320, passing directly through the bottom portion of the EMI shielding 326.
  • the portion of the power supply 320 passing through EMI shielding 326 is heavily filtered by power filter 314 to limit board-to-board conducted EMI.
  • the power supply or board 310 is at least partially encased within EMI shielding 316.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • the first electronic component 320 is a processor powered by the power supply, as shown in FIG. 2, optionally with filtering to limit board-to-board conducted EMI.
  • the first electronic component 320 comprises a non- galvanic communication interface (not shown).
  • the non-galvanic communication interface can be any interface or component configured to enable non-galvanic communication with another electronic component of the system.
  • methods of non-galvanic communication include but are not limited to optical, acoustic, and mechanical.
  • the non-galvanic communication interface comprises one or more components designed or configured to facilitate these non-galvanic communication methods.
  • the first electronic component 320 is at least partially encased within EMI shielding 326.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • the system comprises a second electronic component 330, which in this example is a front-end board.
  • the second electronic component 330 may be powered by the power supply or powered by any other source.
  • the second electronic component 330 comprises a non-galvanic communication interface (not shown).
  • the non-galvanic communication interface can be any interface or component configured to enable non-galvanic communication with another electronic component of the system.
  • the second electronic component 330 is at least partially encased within EMI shielding 336.
  • the EMI shielding can be any shielding configured to prevent or minimize electromagnetic energy from escaping from the component and the area around the component, where that energy could negatively affect the MRI equipment.
  • the EMI shielding 326/336 - which may be a single shielding element or multiple shielding elements - comprises a non-galvanic communication gap 340.
  • the non- galvanic communication interfaces communicate data through the gap using non-galvanic communication.
  • the non-galvanic communication interfaces may communicate data through the gap using light, among other possible mechanisms.
  • system 300 is shown with only first and second electronic components, it should be understood that the system may comprise additional electronic components. Some or all of these additional electronic components may comprise a non-galvanic communication interface, and may be at least partially encased within EMI shielding. That EMI shielding may also be configured to enable non-galvanic communication between additional electronic components as described or otherwise envisioned herein.
  • the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements.
  • This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.
  • inventive embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed.
  • inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un système électronique configuré pour être utilisé dans un environnement d'IRM, comprenant: (i) une alimentation électrique; (ii) un premier composant électronique configuré pour recevoir de l'énergie provenant de l'alimentation électrique, le premier composant électronique comprenant une interface de communication non galvanique, et en outre le premier composant électronique étant au moins partiellement enfermé dans un blindage contre les interférences électromagnétiques (IEM); (iii) un second composant électronique, le second composant électronique comprenant une interface de communication non galvanique, et le second composant électronique étant en outre au moins partiellement enfermé dans un blindage IEM; le premier blindage IEM de composant électronique et/ou le second blindage IEM de composant électronique comprennent un espace configuré pour permettre une communication non galvanique entre l'interface de communication non galvanique du premier composant électronique et l'interface de communication non galvanique du second composant électronique.
PCT/EP2023/071993 2022-08-18 2023-08-09 Architecture blindée modulaire pour l'atténuation d'interférence électromagnétique dans la conception d'irm WO2024037939A1 (fr)

Applications Claiming Priority (2)

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US202263398877P 2022-08-18 2022-08-18
US63/398,877 2022-08-18

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050107681A1 (en) * 2003-07-23 2005-05-19 Griffiths David M. Wireless patient monitoring device for magnetic resonance imaging
US20170235342A1 (en) * 2016-02-15 2017-08-17 Neocoil, Llc Magnetic Resonance Imaging Compatible Mobile Computing Device
US20170293002A1 (en) * 2014-12-24 2017-10-12 Toshiba Medical Systems Corporation Magnetic resonance imaging apparatus and method of installing magnetic resonance imaging apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050107681A1 (en) * 2003-07-23 2005-05-19 Griffiths David M. Wireless patient monitoring device for magnetic resonance imaging
US20170293002A1 (en) * 2014-12-24 2017-10-12 Toshiba Medical Systems Corporation Magnetic resonance imaging apparatus and method of installing magnetic resonance imaging apparatus
US20170235342A1 (en) * 2016-02-15 2017-08-17 Neocoil, Llc Magnetic Resonance Imaging Compatible Mobile Computing Device

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