WO2024037177A1 - Winding device, transformer, and inductor - Google Patents
Winding device, transformer, and inductor Download PDFInfo
- Publication number
- WO2024037177A1 WO2024037177A1 PCT/CN2023/101593 CN2023101593W WO2024037177A1 WO 2024037177 A1 WO2024037177 A1 WO 2024037177A1 CN 2023101593 W CN2023101593 W CN 2023101593W WO 2024037177 A1 WO2024037177 A1 WO 2024037177A1
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- WIPO (PCT)
- Prior art keywords
- winding device
- film layer
- metal sheet
- polyimide film
- sheet conductor
- Prior art date
Links
- 238000004804 winding Methods 0.000 title claims abstract description 85
- 239000004020 conductor Substances 0.000 claims abstract description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 229920001721 polyimide Polymers 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000001962 electrophoresis Methods 0.000 claims abstract description 28
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 76
- 238000010586 diagram Methods 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000003878 thermal aging Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910001308 Zinc ferrite Inorganic materials 0.000 description 1
- PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 description 1
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical group [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
Definitions
- the present application relates to the technical field of circuit components, and in particular to a winding device, a transformer and an inductor.
- Winding devices are key components in various circuit components such as transformers and inductors and are widely used in the field of circuit equipment. For winding devices, they can be roughly divided into two types based on the different structures of their conductors. One is a winding formed by winding a conductor coil turn by turn, and the other is a winding formed by stacking flat conductors layer by layer.
- each flat conductor needs to be provided with insulating film layers and other film layers with various functions to ensure good working performance of the winding device.
- film layers with different functions can improve the working performance of winding devices to a certain extent, they also increase the thickness of each flat conductor to a certain extent, thereby increasing the space occupied by the winding devices.
- the purpose of this application is to provide a winding device, a transformer and an inductor that, on the basis of good working performance, can greatly reduce the space occupied by the winding device, and are conducive to the miniaturization and high performance of the winding device. , thus facilitating the wider application of winding devices.
- the present application provides a winding device, which includes a plurality of metal sheet conductors stacked in sequence to form a winding device; each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process.
- the thickness of the polyimide film layer is 1 ⁇ m-250 ⁇ m.
- it also includes a magnetic core penetrating the inner ring of each metal sheet conductor.
- the surface of the magnetic core is provided with a second polyimide film layer formed by an electrophoresis process.
- the thickness of the second polyimide film layer is 1 ⁇ m-250 ⁇ m.
- the magnetic core is a ferrite core and/or a metal alloy core.
- a transformer includes a winding device as described in any one of the above.
- An inductor includes a winding device as described in any one of the above.
- the present application provides a winding device, a transformer and an inductor.
- the winding device includes a plurality of metal sheet conductors stacked in sequence to form a winding device; each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process.
- the film layer provided on the metal sheet conductor in the winding device of the present application is a polyimide film layer formed by the electrophoresis process. That is to say, the polyimide film layer in the present application is directly attached to the metal sheet conductor. Compared with the conventional insulating film layer that is attached to a metal sheet conductor by being attached to an adhesive tape and wound around the metal sheet conductor, the polyamide layer structure is realized in this application without the aid of a glue layer or other adhesive layer.
- the adhesion of the imine film layer on the surface of the metal sheet conductor greatly reduces the thickness of the film layer attached to the surface of each metal sheet conductor, thereby reducing the overall volume of the winding device, making the structure of the winding device more compact and concentrated.
- the imide film layer has good insulation, heat resistance and corona resistance properties.
- the winding device in this application can greatly reduce the space occupied by the winding device on the basis of good working performance, which is conducive to the miniaturization and high performance of the winding device, and thus is conducive to a wider range of winding devices.
- Figure 1 is a schematic structural diagram of a winding device provided by an embodiment of the present application.
- Figure 2 is a partial cross-sectional structural diagram of the metal sheet conductor in Figure 1;
- FIG. 3 is a schematic diagram of the magnetic core structure in the winding device provided by the embodiment of the present application.
- the insulating film layer on the surface of the conductor is mostly wrapped around the conductor surface with a tape with an insulating layer on the surface, or the conductor surface is painted with an insulating paint layer to achieve the insulating film layer on the winding device.
- the tape with adhesive properties greatly increases the overall thickness of the insulating layer; and for the insulating layer formed in this way, as the use time of the winding device increases, the It is more prone to cracking problems, which will affect the service life of the entire winding device.
- each flat conductor will It is difficult to compactly stack the conductors, which also increases the thickness of the winding device to a certain extent.
- this application provides a technical solution for arranging a polyimide film layer formed by electrophoresis process on the metal sheet conductor in the winding device, which can reduce the space occupied by the winding device to a great extent. This makes the structure of the winding device more compact.
- Figure 1 is a schematic structural diagram of a winding device provided by an embodiment of the present application
- Figure 2 is a schematic partial cross-sectional structural diagram of the metal sheet conductor in Figure 1.
- FIG. 3 is a schematic diagram of the magnetic core structure in the winding device provided by the embodiment of the present application.
- the winding device 10 in this application may specifically include:
- each metal sheet conductor 11 is provided with a first polyimide film layer 12 formed by an electrophoresis process.
- first polyimide film layer 12 In the process of actually forming the first polyimide film layer 12 on the metal sheet conductor 11, First, a metal sheet conductor 11 with a substantially flat annular structure is formed, and then the first polyimide film layer 12 is formed on the metal sheet conductor 11 through an electrophoresis process.
- the surface of the metal sheet conductor 11 can be cleaned by alkali cleaning, pickling, solvent cleaning, laser cleaning or plasma cleaning; and then the cleaned metal sheet conductor 11 is completely immersed in the polyimide electrophoresis solution.
- the polyimide electrophoresis solution is a mixture of polyimide, alkaline compounds, organic or inorganic fillers, alcohols or ketones, water-soluble polar solvents and deionized water; use the metal sheet conductor 11 as the positive electrode and apply voltage 20 ⁇ 80V, energize for electrophoresis, control the amount of charge by controlling the current and energization time, so that the amount of charge is 0.01 ⁇ 350C, by controlling the amount of charge, the polyimide film slowly grows on the surface of the metal sheet conductor 11, and the first Polyimide film layer 12; after the electrophoresis is completed, take out the metal sheet conductor 11 wrapped with the first polyimide film layer 12, use airflow to blow off the remaining electrophoresis liquid on the surface, and heat and dry it
- the electrophoresis process is a relatively common film growth process.
- the focus of this application is not on how to use the electrophoresis process to form the first polyimide film layer 12, but on the surface of the metal sheet conductor 11 of this application.
- the film layer structure of the first polyimide film layer 12 is a film layer structure that can be formed by the electrophoresis process. Therefore, the process and process principles of the electrophoresis process will not be introduced in detail in this embodiment. Refer to the conventional electrophoresis process. Just craftsmanship.
- the first polyimide film layer 12 formed on the surface of the metal sheet conductor 11 using the electrophoresis process is directly attached and grown on the surface of the metal sheet conductor 11, and the metal sheet conductor 11 is an equal layer during the electrophoresis process.
- the potential body ensures that the thickness of the first polyimide film layer 12 formed on the surface of the metal sheet conductor 11 at different positions is uniform.
- the thickness of the first polyimide film layer 12 can be 1 ⁇ m-250 ⁇ m, because the first polyimide film layer 12 does not need to rely on other adhesive tapes to realize the first polyimide film.
- the layer 12 is adhered to the surface of the metal sheet conductor 11, thereby reducing the thickness of the insulation film on the surface of the metal sheet conductor 11 to a great extent.
- each metal sheet conductor 11 can be stacked in sequence to form a winding device as shown in Figure 1. Because the thickness of the first polyimide film layer 12 on the surface of the metal sheet conductor 11 is greatly reduced compared to the thickness of the insulating film layer on the conductor surface of the conventional winding device, the space occupied by the winding device formed by stacking each metal sheet conductor 11 The size has also obviously been reduced to a great extent.
- the first polyimide film layer 12 itself is a good insulating material and thermal conductive material, which can have good insulating properties and is conducive to rapid heat dissipation of the metal sheet conductor 11; in addition, it only needs to be placed in the first polyimide film layer 12.
- inorganic particles commonly used to improve the corona resistance of the material can be introduced into the polyimide electrophoresis solution to achieve the corona resistance of the first polyimide film layer 12. Improvement; for example, polymers and finely distributed alumina are common inorganic particles used to improve the corona resistance of the film layer, which will not be explained too much in this application.
- the thickness of the first polyimide film layer 12 on the surface of the metal sheet conductor 11 is set to 40 ⁇ m and 60 ⁇ m, and the first polyimide film layer with two different thicknesses is Conduct performance tests on the metal sheet conductors corresponding to the film layer 12. For example, you can conduct: voltage resistance characteristics test, insulation resistance test, corona resistance performance test, temperature index test, oil immersion resistance test, thermal conductivity test, thermal shock resistance test, softening impact test Wear temperature test, etc. The experimental results are shown in Table 1 below.
- the withstand voltage can reach 10KV, and the insulation resistance reaches DC1kV and 5s. 17G ⁇ , leakage current DC2.7kV, less than 0.2 ⁇ A in 60s, indicating that it has excellent insulation properties; breakdown field strength greater than 5kV, indicating that it has excellent electrical aging resistance; temperature index greater than 220°C, indicating that it has good electrical aging resistance Thermal aging resistance; the thermal conductivity is greater than 0.2W/m ⁇ K, indicating that it has good heat dissipation performance; resistance to oil immersion and thermal shock resistance, indicating that it has good resistance to oil immersion and thermal shock resistance.
- the first polyimide film layer 12 Due to the existence of the first polyimide film layer 12, compared with insulating films made of other materials, its electrical aging resistance time is increased by at least 20 times, and the decomposition temperature is also increased by at least 20°C. Therefore, it has better electrical aging resistance and thermal aging resistance.
- each metal sheet conductor 11 is generally an annular structure with a through hole in the middle area.
- the metal sheet conductors 11 are stacked in sequence, and the through holes in the middle of each metal sheet conductor 11 can jointly form a cylindrical hole.
- a magnetic core 20 penetrating the inner ring through hole of each metal sheet conductor 11 may be further provided in the cylindrical hole formed by each metal sheet conductor 11 .
- the magnetic core 20 may be a ferrite core (such as a manganese-zinc ferrite core, a nickel-zinc ferrite core, a magnesium-zinc ferrite core, etc.) and/or a metal alloy core (for example, iron cores, iron-nickel alloy cores, silicon steel cores, amorphous alloy cores, nanocrystalline alloy cores, etc.).
- a ferrite core such as a manganese-zinc ferrite core, a nickel-zinc ferrite core, a magnesium-zinc ferrite core, etc.
- a metal alloy core for example, iron cores, iron-nickel alloy cores, silicon steel cores, amorphous alloy cores, nanocrystalline alloy cores, etc.
- the material of the magnetic core 20 is relatively hard and has different shapes and often has sharp edges and corners.
- the existing insulation method of the magnetic core 20 is to use an insulating tape coating method to insulate it.
- the insulating layer on the surface of the magnetic core often causes friction with the metal sheet conductor 11, causing damage to the insulating film.
- a second polyimide film layer formed through an electrophoresis process can be further provided on the surface of the magnetic core 20 .
- the thickness of the second polyimide film layer may be 1 ⁇ m-250 ⁇ m.
- the thickness of the second polyimide film is 40 ⁇ m-90 ⁇ m.
- the insulating film layer of the magnetic core has heat resistance. Risk of failure due to poor performance.
- the second polyimide film layer formed by electrophoresis process is used as the insulating layer of the magnetic core 20, which can not only reduce the thickness of the insulating layer on the surface of the magnetic core 20 to a certain extent, but also improve the insulation performance and ensure the The resistance of the insulation layer of the magnetic core 20 Thermal properties, thereby ensuring the working performance of the magnetic core 20.
- the conductors in the winding device in this application are metal sheet conductors, each metal sheet conductor is stacked in sequence to form the winding device, and the surface of each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process; so that The surface of the conductor in this winding device can be directly attached with a single film layer, which can reduce the space occupied by the overall structure of the winding device on the basis of ensuring good working performance of the winding device, which is conducive to the miniaturization and high performance of the winding device. ization, thus facilitating the wider application of winding devices.
- this application further discloses a transformer, which may include any of the above winding devices.
- the metal sheet conductor of the winding device is provided with a single layer of polyimide film layer formed by the electrophoresis process, the thickness of the winding device in the direction perpendicular to the metal sheet conductor can be reduced to a great extent, thereby improving the For a transformer using this winding device, a transformer with a flat structure can be formed, which is conducive to the wide application of the transformer in electronic devices such as tablet computers that require high thickness of the transformer.
- winding components are not only key components in transformers, but also important components in inductors.
- an inductor is further disclosed, which may include any of the above winding devices.
- the inductor can also be widely used in electrical appliances or electronic equipment requiring a relatively small thickness of the inductor.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Insulating Of Coils (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
Provided are a winding device (10), a transformer, and an inductor. The winding device (10) comprises a plurality of metal sheet conductors (11) which are sequentially stacked to form the winding device (10), wherein each metal sheet conductor (11) is provided with a polyimide film layer (12) formed by an electrophoresis process. The film layer arranged on each metal sheet conductor (11) in the winding device (10) is a polyimide film layer (12) formed by an electrophoresis process, so that the thickness of the insulating film layer (12) on the outer surface of each metal sheet conductor (11) is greatly reduced, thereby reducing the overall size of the winding device (10), and making the structure of the winding device (10) more compact. In addition, the polyimide film layer (12) has good insulation, heat resistance, corona resistance, and the like, so that the space occupied by the winding device (10) can be greatly reduced while the winding device (10) has good working performance, thereby facilitating the miniaturization and high performance of the winding device (10), and thus facilitating wider application of the winding device (10).
Description
本申请要求于2022年08月18日提交中国专利局、申请号为202222177941.5、发明名称为“一种绕组器件、变压器以及电感器”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application submitted to the China Patent Office on August 18, 2022, with the application number 202222177941.5 and the invention name "a winding device, transformer and inductor", the entire content of which is incorporated herein by reference. Applying.
本申请涉及电路元器件技术领域,特别是涉及一种绕组器件、变压器以及电感器。The present application relates to the technical field of circuit components, and in particular to a winding device, a transformer and an inductor.
绕组器件是变压器、电感器等各种电路元件中的关键部件,在电路设备领域中被广泛应用。对于绕组器件而言,基于其导体的结构不同可以大体上分为两种,一种是由导体线圈逐圈缠绕形成的绕组,另一种是通过扁平导体逐层堆叠形成的绕组。Winding devices are key components in various circuit components such as transformers and inductors and are widely used in the field of circuit equipment. For winding devices, they can be roughly divided into two types based on the different structures of their conductors. One is a winding formed by winding a conductor coil turn by turn, and the other is a winding formed by stacking flat conductors layer by layer.
以扁平导体堆叠形成的绕组器件为例,绕组器件在实际应用中,各个扁平导体表面需要设置绝缘膜层等具有各种不同功能膜层,以保证绕组器件良好的工作性能。尽管各种不同功能的膜层可以在一定程度上提升绕组器件的工作性能,但也在一定程度上增加了各个扁平导体的厚度,进而使得绕组器件所占的空间体积增大。Taking the winding device formed by stacking flat conductors as an example, in the actual application of winding devices, the surface of each flat conductor needs to be provided with insulating film layers and other film layers with various functions to ensure good working performance of the winding device. Although film layers with different functions can improve the working performance of winding devices to a certain extent, they also increase the thickness of each flat conductor to a certain extent, thereby increasing the space occupied by the winding devices.
发明内容Contents of the invention
本申请的目的是提供一种绕组器件、变压器以及电感器,在具有良好工作性能的基础上,能够极大程度上减小绕组器件所占空间体积,有利于绕组器件的小型化和高性能化,从而有利于绕组器件的更加广泛的应用。The purpose of this application is to provide a winding device, a transformer and an inductor that, on the basis of good working performance, can greatly reduce the space occupied by the winding device, and are conducive to the miniaturization and high performance of the winding device. , thus facilitating the wider application of winding devices.
为解决上述技术问题,本申请提供一种绕组器件,包括多片依次堆叠设置形成绕组器件的金属片导体;各个所述金属片导体上设置有电泳工艺形成的聚酰亚胺膜层。In order to solve the above technical problems, the present application provides a winding device, which includes a plurality of metal sheet conductors stacked in sequence to form a winding device; each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process.
在本申请的一种可选地实施例中,所述聚酰亚胺膜层的厚度为1μm-250μm。
In an optional embodiment of the present application, the thickness of the polyimide film layer is 1 μm-250 μm.
在本申请的一种可选地实施例中,还包括贯穿各个所述金属片导体内环的磁芯。In an optional embodiment of the present application, it also includes a magnetic core penetrating the inner ring of each metal sheet conductor.
在本申请的一种可选地实施例中,所述磁芯的表面设置有电泳工艺形成的第二聚酰亚胺膜层。In an optional embodiment of the present application, the surface of the magnetic core is provided with a second polyimide film layer formed by an electrophoresis process.
在本申请的一种可选地实施例中,所述第二聚酰亚胺膜层的厚度为1μm-250μm。In an optional embodiment of the present application, the thickness of the second polyimide film layer is 1 μm-250 μm.
在本申请的一种可选地实施例中,所述磁芯为铁氧体磁芯和/或金属合金磁芯。In an optional embodiment of the present application, the magnetic core is a ferrite core and/or a metal alloy core.
一种变压器,包括如上任一项所述的绕组器件。A transformer includes a winding device as described in any one of the above.
一种电感器,包括如上任一项所述的绕组器件。An inductor includes a winding device as described in any one of the above.
本申请所提供了一种绕组器件、变压器以及电感器,该绕组器件包括多片依次堆叠设置形成绕组器件的金属片导体;各个金属片导体上设置有电泳工艺形成的聚酰亚胺膜层。The present application provides a winding device, a transformer and an inductor. The winding device includes a plurality of metal sheet conductors stacked in sequence to form a winding device; each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process.
本申请的绕组器件中的金属片导体上所设置的膜层是电泳工艺形成的聚酰亚胺膜层,也即是说,本申请中的聚酰亚胺膜层是直接附着于金属片导体表面的膜层结构,相对于常规的通过附着在带有粘性的胶带缠绕粘接在金属片导体上的绝缘膜层而言,本申请中而无需借助于胶层或者其他粘接层实现聚酰亚胺膜层在金属片导体表面的粘接,也就使得各个金属片导体表面附着的膜层厚度大大减小,从而减小绕组器件的整体体积,使得绕组器件的结构更为紧凑,并且聚酰亚胺膜层具有良好的绝缘、耐热以及耐电晕等性能。由此使得本申请中绕组器件在具有良好工作性能的基础上,能够极大程度上减小绕组器件所占空间体积,有利于绕组器件的小型化和高性能化,从而有利于绕组器件更加广泛的应用。The film layer provided on the metal sheet conductor in the winding device of the present application is a polyimide film layer formed by the electrophoresis process. That is to say, the polyimide film layer in the present application is directly attached to the metal sheet conductor. Compared with the conventional insulating film layer that is attached to a metal sheet conductor by being attached to an adhesive tape and wound around the metal sheet conductor, the polyamide layer structure is realized in this application without the aid of a glue layer or other adhesive layer. The adhesion of the imine film layer on the surface of the metal sheet conductor greatly reduces the thickness of the film layer attached to the surface of each metal sheet conductor, thereby reducing the overall volume of the winding device, making the structure of the winding device more compact and concentrated. The imide film layer has good insulation, heat resistance and corona resistance properties. As a result, the winding device in this application can greatly reduce the space occupied by the winding device on the basis of good working performance, which is conducive to the miniaturization and high performance of the winding device, and thus is conducive to a wider range of winding devices. Applications.
为了更清楚的说明本申请实施例或现有技术的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单的介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
In order to more clearly explain the embodiments of the present application or the technical solutions of the prior art, the following will briefly introduce the drawings needed to describe the embodiments or the prior art. Obviously, the drawings in the following description are only For some embodiments of the present application, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.
图1为本申请实施例提供的绕组器件的结构示意图;Figure 1 is a schematic structural diagram of a winding device provided by an embodiment of the present application;
图2为图1中的金属片导体的局部剖面结构示意图;Figure 2 is a partial cross-sectional structural diagram of the metal sheet conductor in Figure 1;
图3为本申请实施例提供的绕组器件中的磁芯结构示意图。FIG. 3 is a schematic diagram of the magnetic core structure in the winding device provided by the embodiment of the present application.
在常规的绕组器件中,其导体表面的绝缘膜层多是采用表面设置有绝缘层的胶带缠绕于导体表面,或者是将导体表面涂刷绝缘漆层等方式实现绕组器件上绝缘膜层。对于胶带缠绕于导体表面的绝缘层而言,具有粘接性能的胶带极大的增加了设置绝缘层的整体厚度;并且对于这种方式形成的绝缘层,随着绕组器件使用时间的延长,也较为容易出现开裂的问题,进而影响整个绕组器件的使用寿命。而通过涂刷绝缘漆层的方式设置的绝缘层而言,往往难以保证绝缘漆层厚度的均匀性,在扁平导体相互堆叠设置时,因受绝缘漆层厚度不平整性的影响,使得各个扁平导体之间难以紧凑堆叠,从而也在一定程度上增加了绕组器件的厚度。In conventional winding devices, the insulating film layer on the surface of the conductor is mostly wrapped around the conductor surface with a tape with an insulating layer on the surface, or the conductor surface is painted with an insulating paint layer to achieve the insulating film layer on the winding device. For the insulating layer wrapped with tape on the surface of the conductor, the tape with adhesive properties greatly increases the overall thickness of the insulating layer; and for the insulating layer formed in this way, as the use time of the winding device increases, the It is more prone to cracking problems, which will affect the service life of the entire winding device. For the insulating layer installed by painting the insulating paint layer, it is often difficult to ensure the uniformity of the thickness of the insulating paint layer. When flat conductors are stacked on top of each other, due to the uneven thickness of the insulating paint layer, each flat conductor will It is difficult to compactly stack the conductors, which also increases the thickness of the winding device to a certain extent.
由此,本申请中提供了一种对绕组器件中的金属片导体上设置通过电泳工艺形成的聚酰亚胺膜层的技术方案,能够在很大程度上减小绕组器件所占空间体积,使得该绕组器件结构更为紧凑。Therefore, this application provides a technical solution for arranging a polyimide film layer formed by electrophoresis process on the metal sheet conductor in the winding device, which can reduce the space occupied by the winding device to a great extent. This makes the structure of the winding device more compact.
为了使本技术领域的人员更好地理解本申请方案,下面结合附图和具体实施方式对本申请作进一步的详细说明。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
参照图1和图2,图1为本申请实施例提供的绕组器件的结构示意图,图2为图1中的金属片导体的局部剖面结构示意图。图3为本申请实施例提供的绕组器件中的磁芯结构示意图。本申请中的绕组器件10具体可以包括:Referring to Figures 1 and 2, Figure 1 is a schematic structural diagram of a winding device provided by an embodiment of the present application, and Figure 2 is a schematic partial cross-sectional structural diagram of the metal sheet conductor in Figure 1. FIG. 3 is a schematic diagram of the magnetic core structure in the winding device provided by the embodiment of the present application. The winding device 10 in this application may specifically include:
多片依次堆叠设置形成绕组器件10的金属片导体11;各个金属片导体11上设置有电泳工艺形成的第一聚酰亚胺膜层12。Multiple pieces are stacked in sequence to form the metal sheet conductor 11 of the winding device 10; each metal sheet conductor 11 is provided with a first polyimide film layer 12 formed by an electrophoresis process.
在实际形成该金属片导体11上的第一聚酰亚胺膜层12的过程中,可
以先形成大体上成扁平环形结构的金属片导体11,再对该金属片导体11上通过电泳工艺形成第一聚酰亚胺膜层12。In the process of actually forming the first polyimide film layer 12 on the metal sheet conductor 11, First, a metal sheet conductor 11 with a substantially flat annular structure is formed, and then the first polyimide film layer 12 is formed on the metal sheet conductor 11 through an electrophoresis process.
具体地,可以将金属片导体11表面采用碱洗、酸洗、溶剂洗、激光清洗或等离子清洗等清洗方式进行清洗;再将清洗干净的金属片导体11完全浸入到聚酰亚胺电泳液中,该聚酰亚胺电泳液是聚酰亚胺、碱性化合物、有机或无机填料、醇或酮、水溶性极性溶剂和去离子水的混合液;将金属片导体11作为正极,加电压20~80V,通电进行电泳,通过控制电流和通电时间控制电荷量,使电荷量为0.01~350C,通过控制电荷量让聚酰亚胺膜慢慢在金属片导体11表面进行生长,得到第一聚酰亚胺膜层12;电泳完成后取出包裹有第一聚酰亚胺膜层12的金属片导体11,用气流吹掉其表面残留的电泳液,并进行升温干燥成膜,即可获得表面具有第一聚酰亚胺膜层12的金属片导体11。Specifically, the surface of the metal sheet conductor 11 can be cleaned by alkali cleaning, pickling, solvent cleaning, laser cleaning or plasma cleaning; and then the cleaned metal sheet conductor 11 is completely immersed in the polyimide electrophoresis solution. , the polyimide electrophoresis solution is a mixture of polyimide, alkaline compounds, organic or inorganic fillers, alcohols or ketones, water-soluble polar solvents and deionized water; use the metal sheet conductor 11 as the positive electrode and apply voltage 20~80V, energize for electrophoresis, control the amount of charge by controlling the current and energization time, so that the amount of charge is 0.01~350C, by controlling the amount of charge, the polyimide film slowly grows on the surface of the metal sheet conductor 11, and the first Polyimide film layer 12; after the electrophoresis is completed, take out the metal sheet conductor 11 wrapped with the first polyimide film layer 12, use airflow to blow off the remaining electrophoresis liquid on the surface, and heat and dry it to form a film, and you can obtain The metal sheet conductor 11 has a first polyimide film layer 12 on its surface.
需要说明的是,电泳工艺是一种较为常见的膜生长工艺,本申请中重点并不在于如何利用电泳工艺形成第一聚酰亚胺膜层12,而在于本申请的金属片导体11表面的第一聚酰亚胺膜层12的膜层结构是采用电泳工艺所能够形成的膜层结构,由此,本实施例中对电泳工艺的工艺过程以及工艺原理不做详细介绍,参照常规的电泳工艺即可。It should be noted that the electrophoresis process is a relatively common film growth process. The focus of this application is not on how to use the electrophoresis process to form the first polyimide film layer 12, but on the surface of the metal sheet conductor 11 of this application. The film layer structure of the first polyimide film layer 12 is a film layer structure that can be formed by the electrophoresis process. Therefore, the process and process principles of the electrophoresis process will not be introduced in detail in this embodiment. Refer to the conventional electrophoresis process. Just craftsmanship.
由此可见,采用电泳工艺在金属片导体11表面形成的第一聚酰亚胺膜层12是直接在金属片导体11表面附着生长而成,而金属片导体11在电泳工艺过程中是一个等势体,也就保证了其各个不同位置的金属片导体11表面生长形成的第一聚酰亚胺膜层12的厚度均匀。该第一聚酰亚胺膜层12的厚度可以为1μm-250μm,因为该第一聚酰亚胺膜层12无需再借助于其他类似于具有粘接性的胶带实现第一聚酰亚胺膜层12在金属片导体11表面的附着粘接,从而在很大程度上减小了金属片导体11表面的绝缘膜层厚度。在金属片导体11表面形成该第一聚酰亚胺膜层12之后,即可将各个金属片导体11依次堆叠形成如图1所示的绕组器件。因为金属片导体11表面的第一聚酰亚胺膜层12的厚度相对于常规绕组器件的导体表面的绝缘膜层厚度大大减小,经过各个金属片导体11堆叠形成的绕组器件所占的空间体积显然也在很大程度上减小。
It can be seen that the first polyimide film layer 12 formed on the surface of the metal sheet conductor 11 using the electrophoresis process is directly attached and grown on the surface of the metal sheet conductor 11, and the metal sheet conductor 11 is an equal layer during the electrophoresis process. The potential body ensures that the thickness of the first polyimide film layer 12 formed on the surface of the metal sheet conductor 11 at different positions is uniform. The thickness of the first polyimide film layer 12 can be 1 μm-250 μm, because the first polyimide film layer 12 does not need to rely on other adhesive tapes to realize the first polyimide film. The layer 12 is adhered to the surface of the metal sheet conductor 11, thereby reducing the thickness of the insulation film on the surface of the metal sheet conductor 11 to a great extent. After the first polyimide film layer 12 is formed on the surface of the metal sheet conductor 11, each metal sheet conductor 11 can be stacked in sequence to form a winding device as shown in Figure 1. Because the thickness of the first polyimide film layer 12 on the surface of the metal sheet conductor 11 is greatly reduced compared to the thickness of the insulating film layer on the conductor surface of the conventional winding device, the space occupied by the winding device formed by stacking each metal sheet conductor 11 The size has also obviously been reduced to a great extent.
相对于常规的绕组器件中导体表面设置有多层膜层结构而言,本申请中仅仅只需要设置单层的第一聚酰亚胺膜层12,能够有效解决多层粘合绝缘膜层在电老化和热老化过程常出现的膜层脱落现象,又可保证绕组器件良好的工作性能。Compared with conventional winding devices in which a multi-layer film structure is provided on the conductor surface, only a single first polyimide film layer 12 needs to be provided in this application, which can effectively solve the problem of multi-layer adhesive insulating film layers. The phenomenon of film layer peeling that often occurs during electrical aging and thermal aging can also ensure the good working performance of winding devices.
对于第一聚酰亚胺膜层12而言,其本身就是较好的绝缘材料以及导热材料,能够具有较好的绝缘性能并有利于金属片导体11的快速散热;此外只需要在第一聚酰亚胺膜层12进行电泳生长过程中,向聚酰亚胺电泳液中引入常用于提高材料耐电晕性能的无机粒子,即可实现第一聚酰亚胺膜层12的耐电晕性能的提升;例如,含有聚合物和细分布的氧化铝等都是常见的用于提升膜层耐电晕性能常见的无机粒子,对此本申请中不过多的说明。The first polyimide film layer 12 itself is a good insulating material and thermal conductive material, which can have good insulating properties and is conducive to rapid heat dissipation of the metal sheet conductor 11; in addition, it only needs to be placed in the first polyimide film layer 12. During the electrophoretic growth process of the imide film layer 12, inorganic particles commonly used to improve the corona resistance of the material can be introduced into the polyimide electrophoresis solution to achieve the corona resistance of the first polyimide film layer 12. Improvement; for example, polymers and finely distributed alumina are common inorganic particles used to improve the corona resistance of the film layer, which will not be explained too much in this application.
在本申请的一种具体实施例中,将金属片导体11表面的第一聚酰亚胺膜层12的厚度设置为40μm和60μm两种,并对两种不同厚度的第一聚酰亚胺膜层12对应的金属片导体进行性能测试,例如可以进行:耐电压特性测试、绝缘阻抗测试、耐电晕性能测试、温度指数测试、耐油浸泡测试、导热系数测试、耐热冲击测试、软化击穿温度测试等,实验结果见下表1。In a specific embodiment of the present application, the thickness of the first polyimide film layer 12 on the surface of the metal sheet conductor 11 is set to 40 μm and 60 μm, and the first polyimide film layer with two different thicknesses is Conduct performance tests on the metal sheet conductors corresponding to the film layer 12. For example, you can conduct: voltage resistance characteristics test, insulation resistance test, corona resistance performance test, temperature index test, oil immersion resistance test, thermal conductivity test, thermal shock resistance test, softening impact test Wear temperature test, etc. The experimental results are shown in Table 1 below.
表1:
Table 1:
Table 1:
由上述实验数据可知,本申请中的绕组器件,当第一聚酰亚胺膜层12厚度为60μm时,耐电压就可达到10KV,绝缘阻抗DC1kV、5s下达到
17GΩ、漏电流DC2.7kV、60s下小于0.2μA,表明其具有优异的绝缘性能;击穿场强大于5kV,表明其具有优异的耐电老化性能;温度指数大于220℃,表明其具有良好的耐热老化性能;导热系数大于0.2W/m·K,表明其具有良好的散热性能;耐油浸泡、耐热冲击通过,表明其具有良好的耐油浸泡和耐热冲击性能。It can be seen from the above experimental data that when the thickness of the first polyimide film layer 12 of the winding device in this application is 60 μm, the withstand voltage can reach 10KV, and the insulation resistance reaches DC1kV and 5s. 17GΩ, leakage current DC2.7kV, less than 0.2μA in 60s, indicating that it has excellent insulation properties; breakdown field strength greater than 5kV, indicating that it has excellent electrical aging resistance; temperature index greater than 220℃, indicating that it has good electrical aging resistance Thermal aging resistance; the thermal conductivity is greater than 0.2W/m·K, indicating that it has good heat dissipation performance; resistance to oil immersion and thermal shock resistance, indicating that it has good resistance to oil immersion and thermal shock resistance.
由于第一聚酰亚胺膜层12的存在,较之其他材料组成的绝缘薄膜来说,其耐电老化时间至少提升20倍,分解温度也上升至少20℃。因而具有更为优异的耐电老化和耐热老化的性能。Due to the existence of the first polyimide film layer 12, compared with insulating films made of other materials, its electrical aging resistance time is increased by at least 20 times, and the decomposition temperature is also increased by at least 20°C. Therefore, it has better electrical aging resistance and thermal aging resistance.
另外参照图1可知,各个金属片导体11一般均是中间区域具有通孔的环形结构,各个金属片导体11依次堆叠,各个金属片导体11中间位置的通孔即可共同形成一个柱形孔。参照图3,在本申请的一种可选地实施例中,可以进一步地在各个金属片导体11形成的柱形孔内设置贯穿各个金属片导体11的内环通孔的磁芯20。In addition, referring to FIG. 1 , it can be seen that each metal sheet conductor 11 is generally an annular structure with a through hole in the middle area. The metal sheet conductors 11 are stacked in sequence, and the through holes in the middle of each metal sheet conductor 11 can jointly form a cylindrical hole. Referring to FIG. 3 , in an optional embodiment of the present application, a magnetic core 20 penetrating the inner ring through hole of each metal sheet conductor 11 may be further provided in the cylindrical hole formed by each metal sheet conductor 11 .
可选地,该磁芯20可以为铁氧体磁芯(例如锰锌铁氧体磁芯、镍锌铁氧体磁芯、镁锌铁氧体磁芯等)和/或金属合金磁芯(例如铁芯、铁镍合金磁芯、硅钢片磁芯、非晶合金磁芯、纳米晶合金磁芯等)。Optionally, the magnetic core 20 may be a ferrite core (such as a manganese-zinc ferrite core, a nickel-zinc ferrite core, a magnesium-zinc ferrite core, etc.) and/or a metal alloy core ( For example, iron cores, iron-nickel alloy cores, silicon steel cores, amorphous alloy cores, nanocrystalline alloy cores, etc.).
一般来说,磁芯20的材质比较坚硬;而形状各异且往往存在尖锐的棱角。现有磁芯20的绝缘方式是使用绝缘胶带覆膜方式对其进行绝缘。在覆膜过程中,由于工艺限制,极易出现边角等异形处出现绝缘过薄、包覆不良等缺陷,且对于磁芯内部空间,则难以完全包覆。磁芯表面的绝缘层也经常会与金属片导体11之间形成有磨擦而导致其绝缘膜层破损。Generally speaking, the material of the magnetic core 20 is relatively hard and has different shapes and often has sharp edges and corners. The existing insulation method of the magnetic core 20 is to use an insulating tape coating method to insulate it. During the coating process, due to process limitations, defects such as thin insulation and poor coating at corners and other irregular shapes are very easy to occur, and it is difficult to completely cover the internal space of the magnetic core. The insulating layer on the surface of the magnetic core often causes friction with the metal sheet conductor 11, causing damage to the insulating film.
为此,在本申请的另一可选地实施例中,可以进一步地在磁芯20表面设置经过电泳工艺形成的第二聚酰亚胺膜层。该第二聚酰亚胺膜层的厚度可以在1μm-250μm,优选地,该第二聚酰亚胺膜的厚度为40μm-90μm。To this end, in another optional embodiment of the present application, a second polyimide film layer formed through an electrophoresis process can be further provided on the surface of the magnetic core 20 . The thickness of the second polyimide film layer may be 1 μm-250 μm. Preferably, the thickness of the second polyimide film is 40 μm-90 μm.
需要说明的是,当绕组器件用于电感器、变压器等器件时,磁芯20中存在磁场,电磁感应产生的损耗都以热量的形式出现,因此,其磁芯的绝缘膜层存在耐热性能差而失效的风险。本实施例中采用电泳工艺形成的第二聚酰亚胺膜层作为磁芯20的绝缘层,不仅仅能够在一定程度上减小该磁芯20表面的绝缘层厚度,提升绝缘性能还保证了磁芯20的绝缘层的耐
热性,从而保证磁芯20的工作性能。It should be noted that when the winding device is used in inductors, transformers and other devices, there is a magnetic field in the magnetic core 20, and the losses caused by electromagnetic induction appear in the form of heat. Therefore, the insulating film layer of the magnetic core has heat resistance. Risk of failure due to poor performance. In this embodiment, the second polyimide film layer formed by electrophoresis process is used as the insulating layer of the magnetic core 20, which can not only reduce the thickness of the insulating layer on the surface of the magnetic core 20 to a certain extent, but also improve the insulation performance and ensure the The resistance of the insulation layer of the magnetic core 20 Thermal properties, thereby ensuring the working performance of the magnetic core 20.
综上所述,本申请中的绕组器件中的导体为金属片导体,各个金属片导体依次堆叠形成绕组器件,并且每个金属片导体的表面设置电泳工艺形成的聚酰亚胺膜层;使得该绕组器件中的导体表面可以直接附着单层膜层,即可在保证绕组器件良好的工作性能的基础上,减小了绕组器件整体结构所占空间体积,有利于绕组器件小型化和高性能化,从而有利于绕组器件更加广泛的应用。To sum up, the conductors in the winding device in this application are metal sheet conductors, each metal sheet conductor is stacked in sequence to form the winding device, and the surface of each metal sheet conductor is provided with a polyimide film layer formed by an electrophoresis process; so that The surface of the conductor in this winding device can be directly attached with a single film layer, which can reduce the space occupied by the overall structure of the winding device on the basis of ensuring good working performance of the winding device, which is conducive to the miniaturization and high performance of the winding device. ization, thus facilitating the wider application of winding devices.
基于上述绕组器件的实施例,本申请还进一步公开了一种变压器,该变压器可以包括上述任一项所述的绕组器件。Based on the above embodiments of the winding device, this application further discloses a transformer, which may include any of the above winding devices.
因为该绕组器件的金属片导体上设置有单层的且通过电泳工艺形成的聚酰亚胺膜层,在很大程度上可以减小绕组器件垂直于金属片导体方向上的厚度,由此对于采用该绕组器件的变压器而言,即可形成一个扁平结构的变压器,有利于变压器在类似于平板电脑等对变压器厚度要求高的电子设备中广泛应用。Because the metal sheet conductor of the winding device is provided with a single layer of polyimide film layer formed by the electrophoresis process, the thickness of the winding device in the direction perpendicular to the metal sheet conductor can be reduced to a great extent, thereby improving the For a transformer using this winding device, a transformer with a flat structure can be formed, which is conducive to the wide application of the transformer in electronic devices such as tablet computers that require high thickness of the transformer.
可以理解的是,绕组器件不仅仅是变压器中的关键部件,也是电感器中的重要器件。为此,在本申请的另一可选地实施例中,还进一步的公开了一种电感器,该电感器可以包括上述任一项的绕组器件。It can be understood that winding components are not only key components in transformers, but also important components in inductors. To this end, in another optional embodiment of the present application, an inductor is further disclosed, which may include any of the above winding devices.
对于该电感器也可以广泛应用于要求电感器的厚度相对较小的电器或电子设备。The inductor can also be widely used in electrical appliances or electronic equipment requiring a relatively small thickness of the inductor.
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。另外,
本申请实施例提供的上述技术方案中与现有技术中对应技术方案实现原理一致的部分并未详细说明,以免过多赘述。It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises,""comprises," or any other variation thereof are intended to cover a non-exclusive inclusion such that elements inherent in a process, method, article, or apparatus include a list of elements. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or apparatus that includes the stated element. in addition, Among the above technical solutions provided by the embodiments of the present application, those parts that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive redundancy.
本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以对本申请进行若干改进和修饰,这些改进和修饰也落入本申请权利要求的保护范围内。
This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art, several improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims (8)
- 一种绕组器件,其特征在于,包括多片依次堆叠设置形成绕组器件的金属片导体;各个所述金属片导体上设置有电泳工艺形成的第一聚酰亚胺膜层。A winding device, characterized in that it includes a plurality of metal sheet conductors stacked in sequence to form a winding device; each of the metal sheet conductors is provided with a first polyimide film layer formed by an electrophoresis process.
- 如权利要求1所述的绕组器件,其特征在于,所述第一聚酰亚胺膜层的厚度为1μm-250μm。The winding device according to claim 1, wherein the thickness of the first polyimide film layer is 1 μm-250 μm.
- 如权利要求1所述的绕组器件,其特征在于,还包括贯穿各个所述金属片导体内环的磁芯。The winding device according to claim 1, further comprising a magnetic core penetrating the inner ring of each metal sheet conductor.
- 如权利要求3所述的绕组器件,其特征在于,所述磁芯的表面设置有电泳工艺形成的第二聚酰亚胺膜层。The winding device according to claim 3, wherein a second polyimide film layer formed by an electrophoresis process is provided on the surface of the magnetic core.
- 如权利要求4所述的绕组器件,其特征在于,所述第二聚酰亚胺膜层的厚度为1μm-250μm。The winding device according to claim 4, wherein the thickness of the second polyimide film layer is 1 μm-250 μm.
- 如权利要求3所述的绕组器件,其特征在于,所述磁芯为铁氧体磁芯和/或金属合金磁芯。The winding device according to claim 3, characterized in that the magnetic core is a ferrite magnetic core and/or a metal alloy magnetic core.
- 一种变压器,其特征在于,包括如权利要求1至6任一项所述的绕组器件。A transformer, characterized by comprising the winding device according to any one of claims 1 to 6.
- 一种电感器,其特征在于,包括如权利要求1至6任一项所述的绕组器件。 An inductor, characterized by comprising the winding device according to any one of claims 1 to 6.
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CN202222177941.5 | 2022-08-18 |
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CN218004582U (en) * | 2022-08-18 | 2022-12-09 | 合肥汉之和新材料科技有限公司 | Winding device, transformer and inductor |
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JP2012120302A (en) * | 2010-11-30 | 2012-06-21 | Toyota Motor Corp | Method of manufacturing coil |
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