WO2024036886A1

WO2024036886A1 - Vapor chamber and electronic device

Info

Publication number: WO2024036886A1
Application number: PCT/CN2023/073637
Authority: WO
Inventors: 吴召洪
Original assignee: 荣耀终端有限公司
Priority date: 2022-08-17
Filing date: 2023-01-29
Publication date: 2024-02-22
Also published as: CN218570720U

Abstract

The embodiments of the present application relate to the technical field of heat dissipation. Provided are a vapor chamber and an electronic device. When the thickness of the vapor chamber is less than or equal to 0.3 mm, the thermal conductivity and temperature uniformity are good. The vapor chamber is divided into a heat source section and a condensation section. The vapor chamber comprises: a shell, a capillary structure, a heat dissipation working medium, and a plurality of support structures, wherein the plurality of support structures form a plurality of support structure columns arranged in a first direction, and each support structure column comprises a plurality of support structures arranged in a second direction, the second direction being a direction from the heat source section to the condensation section, and the first direction being perpendicular to the second direction; and a steam channel is formed between every two adjacent support structure columns; the steam channels comprise at least one first steam channel and at least one second steam channel, and the width of the first steam channel is greater than that of the second steam channel.

Description

Vapor chamber and electronic equipment

This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 17, 2022, with application number 202222171466.0 and application name "Vapor Chamber and Electronic Equipment", the entire content of which is incorporated into this application by reference. middle.

Technical field

The present application relates to the field of heat dissipation technology, and in particular to a vapor chamber and electronic equipment.

Background technique

As the functions of electronic devices such as mobile phones, tablets, and laptops continue to be upgraded, the power of functional devices in electronic devices is also increasing, and the heat generated is also increasing.

In order to prevent functional devices from being damaged due to excessive temperature, some heat dissipation structures such as vacuum chambers (VC) are usually installed in electronic equipment.

Since the current trend of thinning and thinning electronic equipment has become the mainstream, the vapor chamber must be thinned simultaneously to meet the demand for thinner and lighter electronic equipment. How to improve the heat dissipation performance of the vapor chamber while thinning the vapor chamber is still a problem. Problems that technicians in the field urgently need to solve.

Utility model content

In order to solve the above technical problems, this application provides a vapor chamber and electronic equipment. When the thickness of the vapor chamber is less than or equal to 0.3 mm, the temperature uniformity of the vapor chamber can also be ensured, which is beneficial to the thin and light design of electronic equipment.

In a first aspect, embodiments of the present application provide a vapor chamber, which is divided into a heat source section and a condensation section. The heat source section is the part of the vapor chamber corresponding to the heating element, and the condensation section is the part of the vapor chamber other than the heat source section. part; the vapor chamber includes: a shell, the shell includes a first cover plate and a second cover plate, the first cover plate and the second cover plate form a sealed cavity; a capillary structure is located in the sealed cavity and attached to the shell; heat dissipation The working medium is located in the sealed cavity; a plurality of support structures are supported between the first cover plate and the second cover plate; the multiple support structures constitute a plurality of support structure rows arranged along the first direction, each support structure The structure row includes a plurality of support structures arranged along a second direction. The second direction is the direction in which the heat source section points to the condensation section. The first direction is perpendicular to the second direction; along the first direction, between two adjacent support structure rows A steam channel is formed; wherein the steam channel includes at least one first steam channel and at least one second steam channel, and along the first direction, the width of the first steam channel is greater than the width of the second steam channel.

By increasing the width of part of the steam channel, when the steam is transmitted from the heat source section to the condensation section, the resistance is reduced, so that the heat can be quickly transferred to the farthest end of the condensation section, avoiding premature phase change condensation of the steam, and the steam will be condensed due to flow resistance. The reduction makes the transmission farther, realizing the rapid transportation of working fluid and satisfying the design of thinner and longer vapor chambers. In addition, since there is a gap between two adjacent support structures along the direction from the heat source section to the condensation section, steam can not only be transported in the direction from the heat source section to the condensation section, but also perpendicular to the direction from the heat source section to the condensation section. Directional transmission, that is, steam can also be transmitted between steam channels and steam channels, further improving the temperature uniformity of the vapor chamber. Thus, When the thickness of the vapor chamber is very thin, the temperature uniformity of the vapor chamber can also be ensured, which is beneficial to the thin and light design of electronic equipment.

The second direction is the direction in which the heat source section points to the condensation section. For example, the second direction may be the direction in which one point of the heat source section points to another point in the condensation section, or the direction in which one point of the heat source section points to the point farthest from the heat source section in the condensation section, or it may be the direction of heat dissipation. The flow direction of the working fluid can also be the extension direction of the vapor chamber.

Exemplarily, the steam channel includes at least one first steam channel and at least one second steam channel. The steam channel may include a first steam channel and at least one second steam channel located on one side of the first steam channel; it may also be The steam channel includes a first steam channel and at least one second steam channel located on both sides of the first steam channel. That is, each side of the first steam channel includes at least one second steam channel. The steam channel may also include multiple steam channels. (Two or more) first steam channels and at least one second steam channel, multiple first steam channels are arranged adjacently, that is, no second steam channel is provided between two adjacent first steam channels, and the second steam channel Located on at least one side of multiple first steam channels; the steam channels may also include multiple (two or more) first steam channels and multiple (two or more) second steam channels, the first steam channels and the second steam channels The channels are arranged at intervals, that is, at least one second steam channel is arranged between two adjacent first steam channels, and at least one first steam channel is arranged between two adjacent second steam channels.

In some possible implementations, the first steam channel is a channel corresponding to the heating element among the steam channels, and the second steam channel is a steam channel among the steam channels except the first steam channel. With this arrangement, the heat generated by the heating element can be quickly transmitted to the end of the vapor chamber through the first steam channel.

Of course, the first steam channel can also be a channel that does not correspond to the heating element, for example, it can be a steam channel adjacent to the heating element; or other steam channels, after verification, when the first steam channel is a channel that does not correspond to the heating element , when the steam is transmitted from the heat source section to the condensation section, the resistance can also be reduced, so that the heat can be quickly transferred to the farthest end of the condensation section, avoiding premature phase change condensation of the steam, and the steam is transferred due to the reduction of flow resistance. The ground is further away to realize rapid transportation of working fluid and meet the design of thinner and longer vapor chambers.

In some possible implementations, the condensation section is located on one side of the heat source section; the condensation section is the part including the end of the vapor chamber that is farthest away from the heat source section. In this case, a first steam channel is provided in the heat source section and the condensation section, which can make the steam transmit farther and help improve the temperature uniformity of the vapor chamber.

In some possible implementations, the condensation section is located on at least two sides of the heat source section; the condensation section includes at least a first condensation section and at least a second condensation section, and the first condensation section includes the furthest distance from the heat source section in the vapor chamber. The second condensation end is the condensation section including the other ends of the vapor chamber. Specifically, the steam channel formed by the support structure in the heat source section and the first condensation section includes at least one first steam channel and at least one second steam channel located on at least one side of the first steam channel, and the width of the first steam channel is greater than the width of the second steam channel, and the steam channel formed by the support structure in the heat source section and the second condensation section includes at least one first steam channel and at least one second steam channel located on at least one side of the first steam channel, and The width of the first steam channel is greater than the width of the second steam channel.

That is to say, when the condensation section is located on at least two sides of the heat source section, the above-mentioned first steam passage is provided on each side. Instead of just setting the first steam channel between the condensation section and the heat source section including the end farthest from the heat source section, steam can be quickly transmitted to each end of the vapor chamber, further improving The temperature uniformity of the vapor chamber.

In some possible implementations, the capillary structure has a hollow portion, and the hollow portion is arranged corresponding to the first steam channel. That is, the height of the first steam channel is increased, and the size of the first steam channel is further expanded. In this way, when the steam is transmitted from the heat source section to the condensation section, the resistance is further reduced, and the steam is transferred due to the reduction in flow resistance. farther.

In some possible implementations, the width L1 of the first steam channel and the width L2 of the second steam channel satisfy: 1.2L2≤L1≤5L2. With this arrangement, the steam resistance reduction effect will not be achieved because the width of the first steam channel is narrow, nor will the upper cover plate collapse due to the wider width of the first steam channel.

For example, the width of the first steam channel is 1.2 times, 1.5 times, 2 times, 2.5 times, 3 times, 4.5 times, 5 times, etc., the width of the second steam channel.

In some possible implementations, on the basis that the width L1 of the first steam channel 542a and the width L2 of the second steam channel satisfy 1.5L2≤L1≤5L2, 1.5L2≤L1≤3L2. It has been verified that when the width L1 of the first steam channel and the width L2 of the second steam channel satisfy 1.5L2≤L1≤3L2, the steam can be transmitted further.

In some possible implementations, the thickness of the vapor chamber is less than or equal to 0.3 mm. That is to say, even if the thickness of the vapor chamber is reduced to 0.3 mm or less, the thermal conductivity and temperature equalization performance of the vapor chamber can still be guaranteed. When the vapor chamber is used in electronic equipment, it is conducive to the thinning of electronic equipment. design.

In some possible implementations, the widths of each second steam channel are the same. That is to say, the spacing between the support structures on both sides of the second steam channel is the same. This arrangement ensures that the heat is quickly transferred to the farthest end of the condensation section, and at the same time, it can also provide better support to the shell in the width direction to avoid Problems such as collapse occur.

In some possible implementation methods, the distance between two adjacent support structures in each support structure column is the same. That is, in the direction from the heat source section to the condensation section, the distance between two adjacent support structures in the same support structure column is the same, and the distance between two adjacent support structures in different support structure columns is the same. Exemplarily, the plurality of support structure rows include a first support structure row and a second support structure row. The distance between two adjacent support structures in the first support structure row is the same, and the distance between two adjacent support structures in the second support structure row is the same. The distance between the two support structure rows is the same, and the distance between the two adjacent support structures in the first support structure row is equal to the distance between the two adjacent support structures in the second support structure row. The distance is set in this way to ensure that heat is quickly transferred to the farthest end of the condensation section, and at the same time, it can also better support the shell in the length direction to avoid problems such as collapse.

In some possible implementation methods, the shape of the orthographic projection of the support structure on the first reference plane is a circle, a long strip, a square, an arc, an S shape, or an ellipse, where the first reference plane is perpendicular to the uniform heat plane in the thickness direction of the plate. The embodiments of the present application do not limit the shape of the support structure, and those skilled in the art can make adjustments based on the actual situation. row settings.

When the shape of the support structure is arc-shaped, S-shaped or elliptical, etc., it can avoid the occurrence of vortices during the flow of steam, thereby avoiding resistance to the flow of steam, making the flow of steam smoother, and thus flowing at a faster speed. flow.

In a second aspect, embodiments of the present application provide an electronic device, including the vapor chamber of the first aspect, and having all the beneficial effects of the first aspect.

Description of drawings

Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Figure 2 is a partial structural schematic diagram of an electronic device provided by an embodiment of the present application;

Figure 3 is a partial structural schematic diagram of yet another electronic device provided by an embodiment of the present application;

Figure 4 is a partial structural schematic diagram of yet another electronic device provided by an embodiment of the present application;

Figure 5 is a cross-sectional view along the direction AA' of Figure 2;

Figure 6 is a top view distribution view of a support structure provided by an embodiment of the present application;

Figure 7 is another cross-sectional view along the direction AA' of Figure 2;

Figure 8 is a top view of another support structure provided by the embodiment of the present application;

Figure 9 is a top view of another support structure provided by the embodiment of the present application;

Figure 10 is a top view of another support structure provided by the embodiment of the present application;

Figure 11 is a top view of another support structure provided by the embodiment of the present application;

Figure 12 is another cross-sectional view along the direction AA' of Figure 2;

Figure 13 is a top view of another support structure provided by the embodiment of the present application;

Figure 14 is a top view of another support structure provided by the embodiment of the present application;

Figure 15 is a top view of another support structure provided by the embodiment of the present application;

Figure 16 is a top view of another support structure provided by the embodiment of the present application;

Figure 17 is a top view of another support structure provided by the embodiment of the present application;

Figure 18 is another cross-sectional view along the direction AA' of Figure 2;

Figure 19 is another cross-sectional view along the direction AA' of Figure 2;

Figure 20 is a top view distribution view of a capillary structure provided by an embodiment of the present application;

Figure 21 is a top view distribution view of another capillary structure provided by the embodiment of the present application;

Figure 22 is a top view of another support structure provided by the embodiment of the present application;

Figure 23 is a top view of another support structure provided by the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

The term "and/or" in this article is just an association relationship that describes related objects, indicating that three relationships can exist. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and they exist alone. B these three situations.

The terms “first” and “second” in the description and claims of the embodiments of this application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first target object, the second target object, etc. are used to distinguish different target objects, rather than to describe a specific order of the target objects.

In the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concept in a concrete manner.

In the description of the embodiments of this application, unless otherwise specified, the meaning of “plurality” refers to two or more. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

Embodiments of the present application provide an electronic device. The electronic device provided by the embodiment of the present application may be a mobile phone, a computer, a tablet computer, a personal digital assistant (PDA for short), a vehicle-mounted computer, a television, a smart wearable device, a smart phone Electronic equipment such as household equipment that dissipates heat through vapor chambers. The embodiments of the present application do not specifically limit the specific form of the above-mentioned electronic equipment. For convenience of explanation, the following description takes the electronic device as a mobile phone as an example.

Referring to Figure 1, Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As shown in FIG. 1 , a mobile phone 100 includes a middle frame 10 , a rear case 20 and a display panel 30 . The back case 20 and the display panel 30 are arranged oppositely, and the middle frame 10 is located between the back case 20 and the display panel 30 . The middle frame 10, the rear case 20 and the display screen 30 may enclose a receiving cavity.

Referring to Figure 2, Figure 2 is a partial structural schematic diagram of an electronic device provided by an embodiment of the present application. As shown in FIG. 2 , the accommodation cavity is provided with structures such as a heating element 40 (also called a heat source) and a vapor chamber 50 . The vapor chamber 50 is located on the heating element 40, and the heat generated by the heating element 40 is transferred to the vapor chamber 50 located on its upper side, and the heat is dissipated through the vapor chamber 50.

Among them, the heating element 40 may include, for example, a battery, a power management unit (PMU), a radio frequency chip (Radio Frequency Integrated Circuit, RF IC), a system on chip (System On Chip, SOC), etc. It can be understood that the heating element 40 is not limited to the above examples.

The vapor chamber 50 includes a heat source section 50a and a condensation section 50b, wherein the heat source section 50a is: along the thickness direction of the vapor chamber 50, the portion of the vapor chamber 50 corresponding to the heating element 40, that is, the vapor chamber 50 is at the first The area where the orthographic projection of the reference plane overlaps with the orthographic projection of the heating element 40 on the first reference plane, where the first reference plane is the thickness direction of the vapor chamber 50 (also the direction in which the heating element 40 points toward the vapor chamber 50 ) vertical plane. The condensation section 50b is the part of the vapor chamber 50 except the heat source section 50a.

It should be noted that the overlap in the embodiment of the present application may be a partial overlap, that is, the orthographic projection of the vapor chamber 50 on the first reference plane partially overlaps with the orthographic projection of the heating element 40 on the first reference plane; it may also be is overlap, that is, the orthographic projection of the vapor chamber 50 on the first reference plane overlaps with the orthographic projection of the heating element 40 on the first reference plane, that is, the area of the orthographic projection of the vapor chamber 50 on the first reference plane overlaps with the area of the heating element 40 The areas of the orthographic projections on the first reference plane are equal; it can also be that one of them is located within the other, that is, the orthographic projection of the vapor chamber 50 on the first reference plane is located at the origin. The heating element 40 is within the orthographic projection of the first reference plane, or the orthographic projection of the heating element 40 on the first reference plane is located within the orthographic projection of the vapor chamber 50 on the first reference plane. Unless otherwise specified, the overlapping meanings involved in the following embodiments have the same meaning, and will not be described again in the following embodiments.

It should also be noted that the embodiment of the present application does not limit the positional relationship between the heat source section 50a and the condensation section 50b. Those skilled in the art can set the positional relationship of the heating element 40 according to the actual situation. The position and the position of the corresponding vapor chamber 50 further define the positions of the heat source section 50a and the condensation section 50b. For example, the condensation section 50b can be located on one side of the heat source section 50a, that is, the heating element 40 is located at the end of the vapor chamber 50, as shown in Figures 2 and 3; it can also be that the condensation section 50b is located on at least one side of the heat source section 50a. Both sides, that is, the heating elements 40 are located at the non-end portions of the vapor chamber 50, as shown in FIG. 4 . It should be noted here that, unless otherwise specified, the following examples are all based on the example that the condensation section 50b is located on one side of the heat source section 50a.

In the above case, the shape of the vapor chamber 50 may be a regular shape, such as a rectangle (as shown in FIG. 2 ), a circle (not shown in the figure), or a square (not shown in the figure). Of course, it can also be a special shape, such as an inverted "L" shape (as shown in Figure 3), a "T" shape (as shown in Figure 4), etc.

Referring to Figure 5, Figure 5 is a cross-sectional view along the direction AA' of Figure 2. As shown in FIG. 5 , the vapor chamber 50 includes a shell 51 , a capillary structure 52 , a sealed cavity 53 and a support structure 54 .

The housing 51 is a housing with a hollow structure. The housing 51 includes a first cover plate 511 and a second cover plate 512 . The first cover plate 511 is located on a side of the second cover plate 512 away from the heating element 40 . The first cover plate 511 and the second cover plate 512 surround to form a closed sealed cavity 53 . For example, the first cover plate 511 and the second cover plate 512 can be integrally formed; they can also be formed separately and fixedly connected. When the first cover plate 511 and the second cover plate 512 are formed separately, the first cover plate 511 and the second cover plate 512 can be fixedly connected together through, for example, solder paste. Regarding the materials of the first cover plate 511 and the second cover plate 512, the embodiment of the present application does not limit the materials of the first cover plate 511 and the second cover plate 512. For example, the first cover plate 511 and the second cover plate 512 are made of materials. The material of the plate 512 is, for example, stainless steel or copper.

The cross-sectional shape of the housing 51 along the width direction (i.e., AA' direction) is, for example, flat. The flat shape includes, for example, a rectangular ring (as shown in FIG. 5 ), a track-shaped ring (not shown in the figure), or a rounded rectangular ring (not shown in the figure). It can be understood that the racetrack shape can be a shape in which two arcs and a rectangle are surrounded by two opposite sides, wherein the two arcs are oppositely arranged, and the two arcs are adjacent to the two opposite sides respectively. It should be noted that the following examples are all based on the case that the cross-sectional shape of the housing 51 is a rectangular ring.

The capillary structure 52 is located in the sealed cavity 53 and attached to the housing 51 . For example, the capillary structure 52 can only be attached to the inner surface of the first cover plate 511 (the surface of the first cover plate 511 located in the sealed cavity 53); it can also be attached only to the inner surface of the second cover plate 512 ( The second cover plate 512 is located on the surface of the sealed cavity 53 ); it can also be attached to the inner surface of the first cover plate 511 and the inner surface of the second cover plate 512 . It should be noted here that the embodiments of the present application are all described by taking the capillary structure 52 attached to the inner surface of the second cover plate 512 as an example. For the material, shape and formation process of the capillary structure 52, reference can be made to existing technologies, and will not be described again in the embodiment of the present application. For example, the material of the capillary structure 52 is, for example, copper, and the shape is, for example, wire mesh, fiber, or powder. The capillary structure 52 is formed, for example, through sintering or other processes. A heat dissipation working fluid 55 is also provided in the sealed cavity 53 , where the heat dissipation working fluid 55 may be a liquid working fluid, such as water.

A plurality of support structures 54 are distributed between the first cover plate 511 and the second cover plate 512 to support the housing 51 . The support structure 54 is formed integrally with the first cover plate 511, for example, through an etching process, computer digital The first cover plate 511 with the support structure 54 is formed by computer numerical control (CNC) technology and other cutting processes. Of course, the support structure 54 can also be formed separately from the first cover plate 511 and fixed on the first cover plate 511 by welding or gluing. When the support structure 54 is integrally formed with the first cover plate 511, the process steps can be simplified.

Combined with Fig. 6, Fig. 6 is a top distribution view of a support structure provided by an embodiment of the present application. As shown in FIG. 6 , multiple support structures 54 constitute multiple support structure rows 541 . The multiple support structure rows 541 are arranged along the first direction. Each support structure row 541 includes multiple support structures 54 arranged along the second direction. , and the distance between two adjacent support structure rows 541 is the same to better support the shell 51. The second direction is the direction in which the heat source section 50a points to the condensation section 50b, and the first direction is perpendicular to the second direction. direction. A steam channel 542 is formed between two adjacent support structure rows 541 .

Based on the above structure of the vapor chamber 50 , the working principle of the vapor chamber 50 is explained: the heat generated by the heating element 40 is conducted to the heat source section 50 a of the vapor chamber 50 . When the heat source section 50a is heated, the heat dissipation working medium 55 in this area evaporates and vaporizes. At this time, it absorbs heat and rapidly expands in volume. The gas phase heat dissipation working medium 55 will be quickly transported to the condensation section 50b through the steam channel 542. Since the temperature of the condensation section 50b is relatively low, the gas-phase heat dissipation working medium 55 condenses into a liquid after releasing heat in the condensation section 50b. The liquid then returns to the heat source section 50a with the help of the capillary force generated by the capillary structure 52, thus completing a heat transfer. cycle.

As the trend of thinner and lighter mobile phones becomes mainstream, accordingly, the vapor chamber 50 must be simultaneously thinned to meet the thinner and lighter demand. For example, when the thickness of the vapor chamber 50 is between 0.30 and 0.50 mm, the heat generated by the heating element 40 can be quickly taken out to the external environment by using the vapor chamber 50 , achieving good heat conduction and uniformity. temperature effect. However, after research, it is found that when the thickness of the vapor chamber 50 is less than or equal to 0.3 mm, that is, when the thickness of the vapor chamber 50 is further reduced, that is, when the height of the steam channel 542 is further reduced, the steam is transmitted to the condensation section in the heat source section 50a During the process of 50b, the resistance increases, and the steam will condense before it reaches the farthest end (the farthest position from the heat source section 50a in the condensation section 50b), resulting in a low temperature at the farthest end of the condensation section 50b, while the temperature of the heat source section 50a When the temperature is high, the heat conduction performance and temperature equalization performance of the vapor chamber 50 are poor.

Based on this, embodiments of the present application also provide a vapor chamber. Referring to Figures 7 and 8, Figure 7 is another cross-sectional view along the direction AA' of Figure 2, and Figure 8 is another top distribution view of the support structure provided by the embodiment of the present application. As shown in FIGS. 7 and 8 , along the first direction, the steam channel 542 includes at least one first steam channel 542a and at least one second steam channel 542b. The width L1 of the first steam channel 542a is greater than the width L1 of the second steam channel 542b. L2.

For example, referring to FIG. 8 , the first steam channel 542 a can be, for example: the channel corresponding to the heating element 40 in the steam channel 542 , that is, the orthographic projection of the steam channel 542 on the first reference plane and the heating element 40 on the first reference plane. Planar orthographic projections of overlapping channels. Among the steam channels 542, the channels other than the first steam channel 542a are second steam channels 542b. That is to say, the orthographic projection of the heating element 40 on the first reference plane may be located within the orthographic projection of the first steam channel 542a on the first reference plane, as shown in FIG. 8 ; or part of it may be located on the first steam channel 542a and part of it may be located on the first reference plane. The second steam channel 542b is shown in Figure 9 or Figure 10 .

Of course, the first steam channel 542a may also be a channel that does not correspond to the heating element 40. For example, referring to FIG. 11 , the orthographic projection of the heating element 40 on the first reference plane does not overlap with the orthographic projection of the first steam channel 542 a on the first reference plane. The steam channel 542a is at the first reference level The orthographic projections of the faces are adjacent. The following examples all take the first steam channel 542a as the channel corresponding to the heating element 40 in the steam channel 542.

By increasing the width of the steam channel 542, when the steam is transmitted from the heat source section 50a to the condensation section 50b, the resistance is reduced, so that the heat can be quickly transferred to the farthest end of the condensation section 50b. This avoids early phase change and condensation of the steam, and the steam travels further due to the reduction in flow resistance, and the heat source heat is evenly distributed through the phase change of the heat dissipation working medium 55 in the condensation section 50b, realizing rapid transportation of the working medium and meeting the requirements of thinner , longer vapor chamber design.

In addition, since the support structures 54 are arranged at intervals along the second direction, that is, there is a gap between two adjacent support structures 54 along the second direction, therefore, the steam can not only flow along the second direction (indicated by the solid arrow in FIG. 8 direction), it can also be transmitted along the first direction (the direction pointed by the dotted arrow in Figure 8), that is, the steam can also be transmitted between the steam channel 542 and the steam channel 542, further improving the uniformity of the vapor chamber 50. Warm nature. Further, along the second direction, the gaps between two adjacent support structures 54 are equal, that is, the distance between two adjacent support structures 54 is equal, so as to better support the shell 51 in the length direction. Avoid problems such as collapse.

In addition, the width of each second steam channel 542b is the same, that is to say, along the first direction, the spacing between the support structures 54 on both sides of the second steam channel 542b is the same. Such an arrangement ensures rapid transfer of heat to the condensation chamber. At the same time, the farthest end of the section 50b can also be better supported in the width direction of the shell 51 to avoid problems such as collapse.

In summary, by increasing the width of the steam channel 542, even if the thickness of the vapor chamber 50 is reduced to 0.3 mm or less, the thermal conductivity and temperature equalization performance of the vapor chamber 50 can be ensured, which is beneficial to electronics. Thin and light design of the device.

Further, it has been verified through experiments that the width L1 of the first steam channel 542a and the width L2 of the second steam channel 542b satisfy: 1.2L2≤L1≤5L2, that is, the width of the first steam channel 542a is the width of the second steam channel 542b. 1.2~5 times. Furthermore, 1.5L2≤L1≤3L2, that is, the width of the first steam channel 542a is 1.5 to 3 times the width of the second steam channel 542b. For example, the width of the first steam channel 542a is 1.2 times, 1.5 times, 2 times, 2.5 times, 3 times, 4.5 times, 5 times, etc., the width of the second steam channel 542b.

With this arrangement, the steam resistance reduction effect will not be achieved because the width of the first steam channel 542a is narrow, nor will the upper cover 411 collapse due to the wide width of the first steam channel 542a.

It should be noted that the above example (as shown in FIG. 8 ) takes the steam channel 542 to include a first steam channel 542a and a second steam channel 542b located on both sides of the first steam channel 542a. However, this does not constitute an explanation of the present invention. Limitation of application examples. In other optional embodiments of the present application, the steam channel 542 may also include two first steam channels 542a, three first steam channels 542a (not shown in the figure), etc., with multiple first steam channels 542a being arranged adjacently. , that is, no second steam channel 542b is provided between two adjacent first steam channels 542a, and the second steam channel 542b is located on at least one side of the plurality of first steam channels 542a (as shown in Figures 12 and 13); It may also include at least one first steam channel 542a and at least one second steam channel 542b located on one side of the first steam channel 542a (as shown in Figure 14); it may also be that the steam channel includes multiple (more than two) first steam channels Steam channel 542a and multiple (more than two) second steam channels 542b. The first steam channel 542a and the second steam channel 542b are arranged at intervals, that is, at least one second steam channel 542a is arranged between two adjacent first steam channels 542a. Steam channel 542b, at least one first steam channel 542a is provided between two adjacent second steam channels 542b (as shown in Figure 15). In the following examples, the steam channel 542 includes a first steam channel 542a and a second steam channel 542b located at the first The description is given taking both sides of the steam channel 542a as an example.

It should also be noted that the above example (Fig. 8) assumes that the condensation section 50b is located on one side of the heat source section 50a, that is, the heating element 40 is located at the end of the vapor chamber 50, and the shape of the vapor chamber 50 is a regular shape (such as rectangle) is explained as an example, but this does not constitute a limitation on the embodiments of the present application. In other optional embodiments of the present application, see FIG. 16 , which is a top view distribution view of yet another support structure provided by an embodiment of the present application. As shown in Figure 16, when the condensation section 50b is located on one side of the heat source section 50a, that is, the heating element 40 is located at the end of the vapor chamber 50, and the shape of the vapor chamber 50 is a special shape (such as an inverted "L" shape) , also satisfies the above rule, that is, the steam channel 542 includes at least one first steam channel 542a and at least one second steam channel 542b located on at least one side of the first steam channel 542a, and the width L1 of the first steam channel 542a is greater than the second steam channel 542a. Width L2 of channel 542b.

It is worth noting that referring to Figure 17, Figure 17 is a top view of another support structure provided by an embodiment of the present application. As shown in Figure 17, when the condensation section 50b is located on at least two sides of the heat source section 50a (in Figure 17, the condensation section 50b is located on three sides of the heat source section 50a), the condensation section 50b includes at least a first condensation section 50b1 and at least a third Two condensation sections 50b2, the first condensation section 50b1 is a condensation section including the end of the vapor chamber 50 farthest from the heat source section 50a, and the second condensation end 50b2 is a condensation section including other ends of the vapor chamber 50, FIG. 17 illustrates using the example that the condensation section 542b includes a first condensation section 50b1 and two second condensation sections 50b2. The steam channel 542 formed by the support structure 54 in the heat source section 50a and the first condensation section 50b1 and the steam channel 542 formed by the support structure 54 in the heat source section 50a and the second condensation section 50b2 all satisfy the above rules, that is, the heat source section 50a and the second condensation section 50b2 meet the above rules. The steam channel 542 formed by the support structure 54 in the condensation section 50b1 includes at least one first steam channel 542a and at least one second steam channel 542b located on at least one side of the first steam channel 542a, and the width L1 of the first steam channel 542a is greater than the width L2 of the second steam channel 542b, and the steam channel 542 formed by the support structure 54 in the heat source section 50a and the second condensation section 50b2 includes at least one first steam channel 542a and at least one side of the first steam channel 542a. There is at least one second steam channel 542b, and the width L1 of the first steam channel 542a is greater than the width L2 of the second steam channel 542b.

That is to say, when the condensation section 50b is located on at least two sides of the heat source section 50a, the above-mentioned first steam channel 542a is provided on each side, instead of only in the condensation section including the end farthest from the heat source section 50a ( That is, a first steam channel 542a is provided between the first condensation section 50b1) and the heat source section 50a in FIG. Uniformity of temperature.

In order to further enlarge the size of the first steam channel 542a. Referring to Figures 18, 19 and 20, Figure 18 is another cross-sectional view along the AA' direction of Figure 2, Figure 19 is another cross-sectional view along the AA' direction of Figure 2, and Figure 20 is provided for the embodiment of the present application. A top-view distribution diagram of a capillary structure. The capillary structure 52 includes a hollow portion 521, which is arranged corresponding to the first steam channel 542a, that is, the capillary structure 52 at the position of the first steam channel 542a is completely (as shown in Figure 18) or partially hollowed out (as shown in Figure 19) ), that is to say, the orthographic projection of the hollow portion 521 on the first reference plane overlaps the orthographic projection of the first steam channel 542a on the first reference plane. When the hollow portion 521 is arranged corresponding to the first steam channel 542a, the height of the first steam channel 542a increases, and when the steam is transmitted from the heat source section 50a to the condensation section 50b, the resistance is further reduced, and the steam flows due to the reduction in flow resistance. Delivered further.

It can be known from the foregoing that the capillary structure 52 can be attached to the inner surface of the first cover plate 511 and the inner surface of the second cover plate 512 . In this case, the capillary structure 52 includes a hollow portion 521. The capillary structure 52 on the inner surface of the first cover plate 411 can be hollowed out to form the hollow portion 521; it can also be that only the capillary structure 52 on the inner surface of the second cover plate 412 is hollowed out. capillary knot The structure 52 can be hollowed out to form the hollow portion 521; the capillary structure 52 on the inner surface of the first cover plate 511 and the capillary structure 52 on the inner surface of the second cover plate 512 can both be hollowed out to form the hollow portion 521.

It can be understood that the position of the capillary structure 52 corresponding to the heating element 40 is not designed to be hollowed out.

It should be noted here that, regarding the size of the hollow portion 521, the embodiment of the present application limits the size of the hollow portion 521, and those skilled in the art can set it according to the actual situation. Of course, the capillary structure 52 does not need to be hollowed out, as shown in Figure 21 .

Regarding the shape of the support structure 54, the embodiment of the present application does not limit the shape of the support structure 54, and those skilled in the art can set it according to actual conditions. Exemplarily, the shape of the orthographic projection of the support structure 54 on the first reference plane is a circle (as shown in Figure 8), a long strip (as shown in Figure 22), a square (as shown in Figure 23), or an arc. (not shown in the figure), "S" shape (not shown in the figure), oval shape (not shown in the figure), etc.

In summary, the vapor chamber provided by the embodiments of the present application increases the width of the steam channel corresponding to the heating element (that is, increases the distance in the first direction between adjacent support structures at the corresponding position of the heating element). When the steam is in When transmitting from the heat source section to the condensation section, the resistance is reduced, so that the heat can be quickly transferred to the farthest end of the condensation section, preventing the steam from phase change and condensation in advance. The steam is transferred farther due to the reduction in flow resistance, realizing the work Rapid transport of quality to meet thinner and longer vapor chamber designs. In addition, since there is a gap between two adjacent support structures along the direction from the heat source section to the condensation section, steam can not only be transported in the direction from the heat source section to the condensation section, but also perpendicular to the direction from the heat source section to the condensation section. Directional transmission, that is, steam can also be transmitted between steam channels and steam channels, further improving the temperature uniformity of the vapor chamber. That is to say, even if the vapor chamber provided by the embodiments of the present application is very thin, it can ensure the temperature uniformity of the vapor chamber, which is beneficial to the thin and light design of electronic equipment.

In order to explain this beneficial effect in detail, the following will describe a vapor chamber with a first evaporation channel (hereinafter referred to as a vapor chamber with a non-uniform channel) and a vapor chamber without a first evaporation channel (hereinafter referred to as a vapor chamber with a uniform channel). The vapor chamber of the channel) is illustrated by comparison with a vapor chamber with the same distance between two adjacent support structure columns in the direction perpendicular to the heat source section and toward the condensation section.

Table 1 shows the comparative simulation results of a vapor chamber with uniform channels and a vapor chamber with non-uniform channels. The simulation was carried out with the thickness of the vapor chamber being 0.25 mm and the heat source power being 3.5 watts.

As can be seen from Table 1, after simulating 20 vapor chambers, it was found that for a vapor chamber with uniform channels, the temperature difference between the heat source section and the condensation section is more than 5°C, while when the vapor chamber is a vapor chamber with non-uniform channels, At this time, the temperature difference between the heat source section and the condensation section is below 5°C, or even less than 4°C. That is, at a thickness of 0.25 mm, the vapor chamber has such a small temperature difference. Among them, those skilled in the art know that when the temperature difference between the heat source section and the condensation section is above 5°C, the vapor chamber is unqualified; when the temperature difference between the heat source section and the condensation section is within 5°C, the vapor chamber is qualified.

Therefore, it can be seen through simulation that the vapor chamber provided by the embodiment of the present application has a thickness of less than 0.3 mm and can also have good thermal conductivity and temperature equalization performance, which is beneficial to the thin and light design of electronic equipment.

It should be noted that the above is a simulation conducted with a heat source power of 3.5 watts. Those skilled in the art can understand that during actual settings, the heat source power changes, that is, different heat sources are set according to different situations. In this case, this Those skilled in the art can predict that the non-uniform channel solution in the embodiment of the present application is better than the uniform channel solution.

It should also be noted that the above is an example of a batch of vapor chambers, and is intended to show that the first steam channel set up in this proposal can make the temperature difference between the heat source section and the condensation section of the vapor chamber smaller. Actual vapor chamber heat source section and condensation The temperature difference value of the segment is not limited to this.

Table 1

As mentioned above, the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still make the foregoing technical solutions. The technical solutions described in each embodiment may be modified, or some of the technical features may be equivalently replaced; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions in each embodiment of the present application.

Claims

A vapor chamber, characterized in that it is divided into a heat source section and a condensation section, the heat source section is the part of the vapor chamber corresponding to the heating element, and the condensation section is the vapor chamber except the heat source section. other parts;

The vapor chamber includes: a shell, the shell includes a first cover plate and a second cover plate, the first cover plate and the second cover plate form a sealed cavity;

A capillary structure located in the sealed cavity and attached to the housing;

The heat dissipation working medium is located in the sealed cavity;

A plurality of support structures are supported between the first cover plate and the second cover plate; the plurality of support structures constitute a plurality of support structure rows arranged along the first direction, each of the support structures The structural row includes a plurality of the support structures arranged along a second direction, the second direction is the direction in which the heat source section points to the condensation section, and the first direction is perpendicular to the second direction;

Along the first direction, a steam channel is formed between two adjacent support structure rows;

Wherein, the steam channel includes at least one first steam channel and at least one second steam channel, and along the first direction, the width of the first steam channel is greater than the width of the second steam channel.
The vapor chamber according to claim 1, wherein the first steam channel is a channel corresponding to the heating element in the steam channel, and the second steam channel is a steam channel other than the first steam channel. Steam channel outside the channel.
The vapor chamber according to claim 1, wherein the condensation section is located on one side of the heat source section; the condensation section includes the end of the vapor chamber that is farthest from the heat source section. part of the department.
The vapor chamber according to claim 1, wherein the condensation section is located on at least two sides of the heat source section; the condensation section includes at least one first condensation section and at least one second condensation section, The first condensation section is a condensation section including the end of the vapor chamber that is farthest from the heat source section, and the second condensation end is a condensation section including other ends of the vapor chamber.
The vapor chamber according to claim 1, wherein the capillary structure has a hollow portion, and the hollow portion is provided corresponding to the first steam channel.
The vapor chamber according to any one of claims 1 to 5, characterized in that the width L1 of the first steam channel and the width L2 of the second steam channel satisfy: 1.2L2≤L1≤5L2.
The vapor chamber according to claim 6, characterized in that 1.5L2≤L1≤3L2.
The vapor chamber according to any one of claims 1 to 5, wherein the thickness of the vapor chamber is less than or equal to 0.3 mm.
The vapor chamber according to any one of claims 1 to 5, wherein the width of each second steam channel is the same.
The vapor chamber according to any one of claims 1 to 5, characterized in that the distance between two adjacent support structures in each support structure row is the same.
The vapor chamber according to any one of claims 1 to 5, characterized in that the shape of the orthographic projection of the support structure on the first reference plane is circular, rectangular, square, arc, S-shaped, Oval shape, wherein the first reference plane is a plane perpendicular to the thickness direction of the vapor chamber.
An electronic device, characterized by including the vapor chamber according to any one of claims 1-11.