WO2024016602A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2024016602A1
WO2024016602A1 PCT/CN2022/142794 CN2022142794W WO2024016602A1 WO 2024016602 A1 WO2024016602 A1 WO 2024016602A1 CN 2022142794 W CN2022142794 W CN 2022142794W WO 2024016602 A1 WO2024016602 A1 WO 2024016602A1
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WO
WIPO (PCT)
Prior art keywords
cavity
side plate
light
optical
circuit board
Prior art date
Application number
PCT/CN2022/142794
Other languages
English (en)
Chinese (zh)
Inventor
杨世海
张洪浩
刘飞
崔伟
张强
赵其圣
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210858615.2A external-priority patent/CN117471619A/zh
Priority claimed from CN202221892469.7U external-priority patent/CN218272816U/zh
Priority claimed from CN202210858621.8A external-priority patent/CN117471620A/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2024016602A1 publication Critical patent/WO2024016602A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • the present disclosure relates to the field of optical communication technology, and in particular, to an optical module.
  • optical communication technology optical modules are tools for realizing mutual conversion of photoelectric signals and are one of the key components in optical communication equipment.
  • the transmission rate of optical modules continues to increase, such as 1.6T/ 3.2T.
  • the present disclosure provides an optical module, which includes a circuit board with a first data processor and a second data processor disposed on the front; an optical transceiver component is electrically connected to the circuit board and is configured to transmit and receive multiple channels of light.
  • a light emitting component disposed on the front side of the circuit board, electrically connected to the second data processor, configured to generate multiple emitted lights
  • a light receiving component disposed on the back side of the circuit board, electrically connected to the second data processor, It is configured to receive multi-channel receiving light
  • the optical fiber adapter is hard-connected to the optical transceiver component, is connected to the optical transmitting component and the optical receiving component respectively through the optical fiber pigtail, and is configured to transmit light
  • the optical transceiver component includes: a tube shell, It includes a first cavity and a third cavity. The first cavity and the third cavity are stacked up and down. One end of the circuit board is inserted into the first cavity, and the third cavity is located below the back of the circuit board.
  • the first cavity and the third cavity pass through the optical port.
  • Hardly connected to the fiber optic adapter; the light emitting device is disposed in the first cavity and is electrically connected to the first data processor; is configured to emit multiple emitted lights; the light receiving device is disposed in the third cavity and is connected to the first data processor.
  • the processor is electrically connected and configured to receive multiple channels of received light.
  • the present disclosure provides an optical module, including a circuit board with a first data processor on the front and a protruding plate and a notch on one end; an optical transceiver component is electrically connected to the circuit board and is configured to transmit and receive multiple path light; the optical fiber adapter is hard-connected to the optical transceiver component and is configured to transmit light; wherein the optical transceiver component includes: a tube shell, including a first cavity, a second cavity, a third cavity and a fourth cavity, the first cavity and The third cavity is arranged in a stack, the first cavity and the second cavity are arranged side by side, and the third cavity and the fourth cavity are arranged side by side; the circuit board at the notch is inserted into the first cavity, the protruding plate is inserted into the second cavity, and the third cavity is located in the circuit Under the back of the board; the first cavity and the third cavity are hard-connected to the optical fiber adapter through the optical port; the first cover plate covers the first cavity and forms a
  • the present disclosure provides an optical module, including a circuit board, the front surface of which is provided with a first DSP chip and the second DSP chip, and the back surface of which is provided with a light receiving component; the front surface and the back surface of one end are both An electrical connector is provided, the back surface of the other end of which is provided with a detector group; the bottom side of the tube shell is provided with a protruding reflective prism, the reflective surface of the reflective prism faces the photosensitive surface of the detector group; its top side A circuit board is provided, the front surface of the circuit board is electrically connected to the inside of the tube shell through wires; the first DSP chip is electrically connected to the detector group and the wires respectively, and the second DSP chip is electrically connected to the light receiving component; the optical fiber adapter includes The optical fiber docking interface is layered up and down, and the optical fiber docking interface is inserted into the tube casing.
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • Figure 5 is a schematic diagram of the assembly of a circuit board, a light emitting component and a light receiving component in an optical module according to some embodiments;
  • Figure 6 is a schematic diagram 2 of the assembly of a circuit board, a light emitting component and a light receiving component in an optical module according to some embodiments;
  • Figure 7 is a partially exploded schematic diagram of a circuit board, optical transmitting component, optical receiving component and optical fiber adapter in an optical module according to some embodiments;
  • Figure 8 is a schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • Figure 9 is a schematic structural diagram of an optical transceiver component in an optical module according to some embodiments.
  • Figure 10 is a partially exploded schematic diagram of an optical transceiver component in an optical module according to some embodiments.
  • Figure 11 is a partially exploded schematic diagram 2 of an optical transceiver component in an optical module according to some embodiments
  • Figure 12 is a schematic structural diagram of a tube housing in an optical module according to some embodiments.
  • Figure 13 is a schematic structural diagram of an optical transceiver component in an optical module according to some embodiments.
  • Figure 14 is a schematic diagram 2 of the structure of a tube housing in an optical module according to some embodiments.
  • Figure 15 is a schematic diagram 2 of the structure of an optical transceiver component in an optical module according to some embodiments.
  • Figure 16 is a partial assembly cross-sectional view of an optical transceiver component and a circuit board in an optical module according to some embodiments;
  • Figure 17 is a schematic structural diagram of a light emitting component in an optical module according to some embodiments.
  • Figure 18 is a partially exploded schematic diagram of a light emitting component and a circuit board in an optical module according to some embodiments
  • Figure 19 is a schematic structural diagram of a second emission cover in an optical module according to some embodiments.
  • Figure 20 is a partial structural diagram of a light emitting component in an optical module according to some embodiments.
  • Figure 21 is a partial assembly cross-sectional view of the light emitting component and the circuit board in an optical module according to some embodiments
  • Figure 22 is a schematic structural diagram of a light receiving component in an optical module according to some embodiments.
  • Figure 23 is a partially exploded schematic diagram of a light receiving component and a circuit board in an optical module according to some embodiments
  • Figure 24 is a partial structural diagram of a light receiving component in an optical module according to some embodiments.
  • Figure 25 is a partially assembled cross-sectional view of a light receiving component and a circuit board in an optical module according to some embodiments.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more unless otherwise specified.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and includes the following combinations of A, B and C: A only, B only, C only, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical signals are used to carry information to be transmitted, and the optical signals carrying information are transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since light has passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to distinguish between information transmission equipment such as optical fibers or optical waveguides and computers and other information processing equipment To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • Optical modules realize the mutual conversion function of the above-mentioned optical signals and electrical signals in the field of optical communication technology.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (for example, optical modem) through the electrical port.
  • the electrical connection It is mainly configured for power supply, I2C signal transmission, data information transmission, grounding, etc.; the optical network terminal transmits electrical signals to computers and other information processing equipment through network cables or wireless fidelity technology (Wi-Fi).
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103.
  • the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200.
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of thousands of meters (6 kilometers to 8 kilometers). On this basis, if a repeater is used, unlimited distance transmission can be theoretically achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.
  • the local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to access the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101;
  • the electrical port is configured to access the optical network terminal 100, so that The optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical module 200 realizes mutual conversion between optical signals and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100.
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101. Since the optical module 200 is a tool for converting optical signals and electrical signals and does not have the function of processing data, the information does not change during the above-mentioned photoelectric conversion process.
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 and a network cable interface 104 provided on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 Establish a two-way electrical signal connection.
  • the optical module 200 and the network cable 103 are connected through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the optical module. 200 job.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT), etc.
  • the remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 only shows the parts of the optical network terminal 100 related to the optical module 200. structure. As shown in Figure 2, the optical network terminal 100 also includes a circuit board 105 provided in the housing, a cage 106 provided on the surface of the circuit board 105, a heat sink 107 provided on the cage 106, and electrical connections provided inside the cage 106. device.
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protrusions that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments
  • FIG. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a shell, a circuit board 300 and an optical transceiver component arranged in the shell.
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings; the outer contour of the housing generally presents a square body.
  • the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and the cover plate covers both sides of the lower case 202 . a lower side plate to form the above-mentioned shell.
  • the lower shell 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper shell 201 includes a cover plate and two lower side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two lower side plates to realize that the upper housing 201 is covered on the lower housing 202.
  • the direction of the connection line between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends from the electrical port and is inserted into the host computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 so that the external The optical fiber 101 connects the optical transceiver components inside the optical module 200 .
  • the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver components and other components into the housing, and the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the optical module 200 also includes an unlocking component 203 located outside its housing.
  • the unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 and has a snap component that matches the upper computer cage (for example, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part 203; when the unlocking part 203 is pulled, the engaging parts of the unlocking part 203 move accordingly, thereby changing
  • the connection relationship between the engaging component and the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit wiring, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
  • Chips include, for example, Microcontroller Unit (MCU), laser driver chip, limiting amplifier (limiting amplifier), clock and data recovery (Clock and Data Recovery, CDR) chip, power management chip, digital signal processing (Digital Signal Processing, DSP) chip.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board The circuit board can also provide smooth loading; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.
  • the circuit board 300 also includes a gold finger 301 formed on an end surface thereof, and the gold finger 301 is composed of a plurality of mutually independent pins.
  • the circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector in the cage 106 by the gold finger 301 .
  • the gold finger 301 can be disposed only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or can be disposed on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required.
  • the golden finger 301 is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • a flexible circuit board can be used to connect the rigid circuit board and the optical transceiver component.
  • the DSP chip on the circuit board 300 receives the electrical signal transmitted by the gold finger 301, and then transmits the electrical signal to the laser driver chip on the circuit board 300 via the signal line.
  • the laser driver chip converts the electrical signal into a drive signal, and the drive signal is configured In order to drive the light emitting device in the optical transceiver component to emit an optical signal; and after the external optical signal is converted into an electrical signal by the optical receiving device in the optical transceiver component, the electrical signal is transmitted to the DSP chip for processing through the signal line, and after processing by the DSP chip Transmitted to the host computer through Goldfinger 301.
  • the DSP chip can only provide 8-channel 100G PAM4 data transmission, or 16-channel 50G PAM4 data transmission, which cannot meet the 1.6T capacity transmission. It cannot meet the 2km application scenario of the data center.
  • this disclosure is developed based on the current 800G DSP technology, and the circuit and optical engine layout are optimized inside the optical module, so that both the optical port and the electrical port adopt 16-channel 100G PAM4 data transmission to achieve 16-channel 1.6T data transmission.
  • Figure 5 is a schematic diagram of the assembly of the circuit board, light emitting component and light receiving component in an optical module according to some embodiments
  • Figure 6 is a circuit board, light emitting component and light receiving component in an optical module according to some embodiments. Assembly diagram of components 2.
  • the optical module provided by some embodiments of the present disclosure includes an optical transceiver component 400, an optical transmitter component 500, and an optical receiver component 600.
  • the optical transceiver component 400 is disposed at the end of the circuit board 300, and is connected to the optical fiber.
  • the adapter 700 is connected by hard connection to realize the emission of 8-channel transmitting light and the reception of 8-channel receiving light;
  • the light-emitting component 500 is arranged on the front surface of the circuit board 300 and is connected to the fiber optic adapter 700 using a pigtail connection.
  • the light receiving component 600 is arranged on the back surface of the circuit board 300, and is connected to the optical fiber adapter 700 using a pigtail connection method, so as to realize the reception of 8-channel received light.
  • 16 channels of 100G data transmission are realized through the 8 channels of emitted light in the optical transceiver assembly 400 and the 8 channels of emitted light in the optical transmitter assembly 500. Through the 8 channels of received light in the optical transceiver assembly 400 and the 8 channels in the optical receiving assembly 600 The receiving light realizes 16 channels of 100G data transmission.
  • Figure 7 is a partially exploded schematic diagram of a circuit board, a light emitting component, a light receiving component and a fiber optic adapter in an optical module according to some embodiments.
  • Figure 8 is a schematic structural diagram of a circuit board in an optical module according to some embodiments. As shown in Figures 7 and 8, a first DSP chip 310 and a second DSP chip 320 are provided on the front surface of the circuit board 300. The first DSP chip 310 and the second DSP chip 320 are respectively connected to the gold finger 301 through signal lines. .
  • the first DSP chip 310 and the second DSP chip 320 can be disposed on the surface of the circuit board 300 in the left-right direction, with the first DSP chip 310 close to the fiber optic adapter 700 and the second DSP chip 320 located on the right side of the first DSP chip 310 .
  • the first DSP chip 310 and the second DSP chip 320 may be located on the same side of the circuit board 300, such as the first DSP chip 310 and the second DSP chip 320 being located on the front surface or the back surface of the circuit board 300; first The DSP chip 310 and the second DSP chip 320 can also be located on different sides of the circuit board 300 .
  • the first DSP chip 310 is located on the front surface or the back surface of the circuit board 300
  • the second DSP chip 320 is located on the back surface or the front surface of the circuit board 300 .
  • the first DSP chip 310 and the second DSP chip 320 are located on the same side and are arranged on the circuit board. 300 on the front surface.
  • the end of the circuit board 300 opposite to the golden finger 301 is provided with a protruding plate 303.
  • the protruding plate 303 extends from the left end of the circuit board 300 toward the optical fiber adapter 700.
  • the rear side of the protruding plate 303 is opposite to the rear side of the circuit board 300.
  • a gap 304 is provided between the front side of the protruding plate 303 and the front side of the circuit board 300, so that the left portion of the circuit board 300 is L-shaped.
  • the protruding plate 303 of the circuit board 300 is inserted into the optical transceiver assembly 400, so that the light emitting device in the optical transceiver assembly 400 is opposite to the notch 304 of the circuit board 300, and the light receiving device in the optical transceiver assembly 400 is located on the back surface of the circuit board 300. , so that the front surface of the circuit board 300 can be flush with the light emitting device, and the back surface of the circuit board 300 can be flush with the light receiving device, so as to facilitate the electrical connection between the first DSP chip 310 and the optical transceiver component 400 .
  • the circuit board 300 is provided with a through-mounting hole 302, the light-emitting component 500 is embedded in the mounting hole 302, and the second DSP chip 320 is electrically connected to the light-emitting component 500 through a signal line to drive light emission.
  • the component 500 emits signal light; the light receiving component 600 is electrically connected to the second DSP chip 320 through a signal line to transmit the electrical signal output by the light receiving component 600 to the second DSP chip 320 .
  • the optical fiber adapter 700 includes 8 optical fiber interfaces, forming 8 optical fiber transmission channels with the outside of the optical module. As long as the overall size of the optical module does not change significantly, the width of the optical module can accommodate 4 optical fiber interfaces. In order to accommodate 8 optical fiber interfaces, the optical fiber adapter 700 is made into an upper and lower layered structure, and 4 are provided in a single layer. Optical fiber interface.
  • the single set of optical transceiver structures includes a DSP chip, an optical transmitting device and an optical receiving device.
  • the DSP chip provides or receives high-speed electrical signals. In order to achieve low-loss, high-quality transmission of high-speed signals, the light-emitting device and the light-receiving device need to be placed close to the DSP chip.
  • Both the optical module and the circuit board 300 adopt a rectangular structure, and the two sets of optical transceiver structures are arranged in the length direction of the rectangle according to the shape and size restrictions of the optical module and the circuit board.
  • the light-emitting device and the light-receiving device adopt a multi-channel optical solution respectively, multiple laser chips and light-receiving chips need to be used, so the DSP chip, light-emitting device and light-receiving device cannot be placed on the circuit board in a single set of optical transceiver structure. of the same side.
  • the high-speed signal provided by the DSP chip to the laser chip has higher transmission quality requirements than receiving high-speed electrical signals.
  • a more direct high-speed signal transmission line design is adopted, so the light-emitting device is placed on the same side of the circuit as the DSP. board, and the light-receiving device is placed on the circuit board on the other side.
  • Figure 9 is a schematic structural diagram of an optical transceiver component in an optical module according to some embodiments.
  • Figure 10 is a partially exploded schematic diagram of an optical transceiver component in an optical module according to some embodiments.
  • Figure 11 is a schematic diagram of the optical transceiver component in an optical module according to some embodiments. Partial decomposition diagram of the optical transceiver component in an optical module 2.
  • the optical transceiver assembly 400 includes a tube shell 401.
  • the tube shell 401 includes a first cavity 402, a second cavity 403, a third cavity 404, and a fourth cavity 405.
  • the first cavity 402 The second cavity 403 is located above the front of the circuit board 300, the third cavity 404 and the fourth cavity 405 are located below the back of the circuit board 300, the first cavity 402 and the third cavity 404 are arranged oppositely, the second cavity 403 and the fourth cavity are 405 are arranged oppositely, and the first cavity 402 and the third cavity 404 and the second cavity 403 and the fourth cavity 405 are separated by partitions.
  • the first cavity 402 and the third cavity 404 are stacked up and down, and the first cavity 402 and the third cavity 404 are located in the gap 304 of the circuit board 300, and the circuit board 300 is inserted into the first cavity 402;
  • the second cavity 403 and the fourth cavity 405 are stacked up and down, and the second cavity 403 and the fourth cavity 405 are opposite to the protruding plate 303, and the protruding plate 303 is inserted into the second cavity 403.
  • the optical transceiver assembly 400 also includes a first cover 4101.
  • the first cover 4101 covers the first cavity 402; the first cavity 402 is provided with light emitting devices such as lasers and lenses.
  • the first cavity 402 and the first cover 4101 forms a sealed cavity, and light-emitting devices such as lasers and lenses are located in the sealed cavity.
  • the optical transceiver assembly 400 also includes a second cover 4201.
  • the second cover 4201 covers the third cavity 404; the third cavity 404 is provided with light receiving devices such as lenses and reflective prisms.
  • the third cavity 404 and the second cover The plate 4201 forms a sealed cavity, and light receiving devices such as lenses and reflective prisms are located in the sealed cavity.
  • the transmitting optical port is set on the top layer and the receiving optical port is set on the bottom layer in the protocol
  • the light-emitting device and the light-receiving device are set back-to-back through the first cavity 402 and the third cavity 404, and the light-emitting device is located at On the front side of the circuit board 300, the light receiving device is located on the back side of the circuit board 300.
  • FIG. 12 is a schematic diagram 1 of the structure of a tube shell in an optical module according to some embodiments.
  • FIG. 13 is a schematic diagram 1 of the structure of an optical transceiver component in an optical module according to some embodiments.
  • the tube shell 401 includes a first side plate 4013, a second side plate 4011 and a third side plate 4012.
  • the second side plate 4011 and the third side plate 4012 are arranged opposite to each other.
  • the third side plate 4012 is connected to the first side plate 4013 respectively, and the first side plate 4013, the second side plate 4011 and the third side plate 4012 enclose the first cavity 402.
  • the first side plate 4013 is located on the left side of the first cavity 402
  • the second side plate 4011 is located on the front side of the first cavity 402
  • the third side plate 4012 is located on the rear side of the first cavity 402
  • the first side plate 4011 is located on the front side of the first cavity 402.
  • the right side of the cavity 402 opens, so the first cavity 402 is a U-shaped cavity that opens on the right side.
  • the first side plate 4013 extends from the third side plate 4012 to the rear side, so that the first side plate 4013 protrudes from the third side plate 4012.
  • the first side plate 4013 and the third side plate 4012 enclose the second cavity 403.
  • the first side plate 4013 is located on the left side of the second cavity 403, and the third side plate 4012 is located on the front side of the second cavity 403. Openings are provided on the back and right sides of the second cavity 403, so that the second cavity 403 is connected to the second cavity 403.
  • a cavity 402 is separated by a third side panel 4012 .
  • the first cavity 402 includes a first mounting surface 4021, a second mounting surface 4022, a third mounting surface 4023, and a fourth mounting surface 4024.
  • the first mounting surface 4021 faces the circuit board 300, and the second mounting surface 4022 and the first mounting surface 4021 connection, the fourth mounting surface 4024 is connected to the first side plate 4013, and the third mounting surface 4023 is connected to the second mounting surface 4022 and the fourth mounting surface 4024 respectively.
  • the second mounting surface 4022 is recessed in the first mounting surface 4021
  • the fourth mounting surface 4024 is recessed in the third mounting surface 4023
  • one end of the circuit board 300 containing the notch 304 is inserted into the first cavity 402 through the opening.
  • the back surface of the circuit board 300 is in contact with the first mounting surface 4021.
  • the first semiconductor refrigerator 4102 is disposed on the second mounting surface 4022.
  • the first laser group 4103 and the second laser group 4104 are disposed on the cooling surface of the first semiconductor refrigerator 4102.
  • the first laser group 4103 and the second laser group 4104 are disposed on the second mounting surface 4022. They are arranged side by side on the first semiconductor refrigerator 4102 in the front-to-back direction.
  • the first laser group 4103 may include four lasers, and the four lasers may be arranged side by side along the front-to-back direction; the second laser group 4104 may include four lasers, and the four lasers may be arranged side by side along the front-to-back direction. In this way, eight lasers are arranged side by side in the front-to-back direction on the cooling surface of the first semiconductor refrigerator 4102.
  • the first DSP chip 310 on the front side of the circuit board 300 is an 8-channel 800G DSP, so that each channel of the first DSP chip 310 can transmit 100Gb/s electrical signals, and the 100Gb/s electrical signals can drive 100Gb /s laser, so each laser in the first cavity 402 is a 100Gb/s laser.
  • the wiring heights of the first laser group 4103 and the second laser group 4104 are located on the same plane as the front surface of the circuit board 300, so that the first laser group 4103 and the second laser group
  • the wiring distance between 4104 and the front surface of the circuit board 300 is the shortest, which can reduce losses.
  • a first laser driver chip is also disposed on the front surface of the circuit board 300.
  • the first laser driver chip is located between the first DSP chip 310 and the optical transceiver component 400.
  • the first DSP chip 310 converts the electrical signal Transmitted to the first laser driver chip via the signal line, the first laser driver chip converts the electrical signal into a driving electrical signal, and the driving electrical signal is transmitted to the first laser group 4103 and the second laser group 4104 to drive the first laser group 4103 , the second laser group 4104 respectively generates 4 channels of emitted light.
  • a first collimating lens group 4105 and a second collimating lens group 4106 are also provided on the cooling surface of the first semiconductor refrigerator 4102.
  • the first collimating lens group 4105 is located in the light emitting direction of the first laser group 4103.
  • the straight lens group 4106 is located in the light emitting direction of the second laser group 4104, and the collimating lenses are arranged in one-to-one correspondence with the lasers, so that the emitted light emitted by each laser is converted into collimated light by the collimating lens.
  • a first wavelength division multiplexer 4107 and a second wavelength division multiplexer 4108 are provided on the third mounting surface 4023.
  • the first wavelength division multiplexer 4107 includes four input terminals and one output terminal.
  • a collimating lens group 4105 is arranged in one-to-one correspondence, so that the four collimated lights output by the first collimating lens group 4105 are all injected into the first wavelength division multiplexer 4107, and the four channels are combined through the first wavelength division multiplexer 4107.
  • the collimated light is multiplexed into one channel of composite light, and one channel of composite light is emitted through the output terminal;
  • the second wavelength division multiplexer 4108 includes four input terminals and one output terminal, and the four input terminals correspond to the second collimating lens group 4106 one-to-one Set up so that the four collimated lights output by the second collimating lens group 4106 are all injected into the second wavelength division multiplexer 4108, and the four collimated lights are multiplexed by the second wavelength division multiplexer 4108 to form a composite light.
  • a composite light is emitted through the output end.
  • a first condensing lens 4109 and a second condensing lens 4110 are provided on the fourth mounting surface 4024.
  • the first condensing lens 4109 is disposed corresponding to the output end of the first wavelength division multiplexer 4107, so as to combine the first wavelength division multiplexer 4107 with The output composite light is converted into condensed light;
  • the second condensing lens 4110 is configured corresponding to the second wavelength division multiplexer 4108 to convert the composite light output from the second wavelength division multiplexer 4108 into condensed light.
  • the first side panel 4013 is provided with a first light outlet 4025 and a second light outlet 4026.
  • the first light outlet 4025 and the second light outlet 4026 are both connected to the first cavity 402, so that the first cavity 402 passes through the first light outlet. 4025.
  • the second light outlet 4026 is hard-connected to the fiber optic adapter 700, so that the condensed light emitted by the first condensing lens 4109 is injected into the fiber optic adapter 700 through the first light outlet 4025, and the condensed light emitted by the second condensing lens 4110 is transmitted through the second light outlet 4025.
  • the light outlet 4026 is injected into the optical fiber adapter 700, thereby realizing the emission of 2 channels of composite light (8 channels of emitted light).
  • the first light outlet 4025 and the second light outlet 4026 are hard-connected to the fiber optic adapter 700 using MDC optical ports, thereby realizing the hard connection assembly of the first cavity 402 and the fiber optic adapter 700 .
  • the second cavity 403 includes a fifth mounting surface 4031 extending from the first side plate 4013 toward the circuit board 300 , and the fifth mounting surface 4031 is connected to the mounting surface in the first cavity 402
  • the surfaces are arranged side by side, and the length dimension of the fifth mounting surface 4031 in the left-right direction is smaller than the length dimension of the third side plate 4012 in the left-right direction.
  • the protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the back surface of the protruding plate 303 is in contact with the fifth mounting surface 4031.
  • the first side panel 4013 is also provided with a third light outlet 4032 and a fourth light outlet 4033.
  • the third light outlet 4032 and the fourth light outlet 4033 are both connected to the second cavity 403, so that the second cavity 403 passes through the third light outlet.
  • the port 4032 and the fourth light outlet 4033 are connected to the optical fiber adapter 700 .
  • FIG. 14 is a schematic diagram 2 of the structure of a tube shell in an optical module according to some embodiments.
  • FIG. 15 is a schematic diagram 2 of the structure of an optical transceiver component in an optical module according to some embodiments.
  • the tube shell 401 also includes a fourth side plate 4014 and a fifth side plate 4015.
  • the fourth side plate 4014 and the fifth side plate 4015 are arranged opposite to each other.
  • the fourth side plate 4014 and the fifth side plate 4015 are respectively connected to the first side plate 4013, and the first side plate 4013, the fourth side plate 4014, and the fifth side plate 4015 surround the third cavity 404.
  • the first side plate 4013 is located on the left side of the third cavity 404
  • the fourth side plate 4014 is located on the rear side of the third cavity 404
  • the fifth side plate 4015 is located on the front side of the third cavity 404.
  • the right side of the cavity 404 is open, so the third cavity 404 is a U-shaped cavity with a right side opening.
  • the second side panel 4011 may be flush with the fourth side panel 4014
  • the third side panel 4012 may be flush with the fifth side panel 4015.
  • the first side plate 4013 extends from the fifth side plate 4015 to the front side, so that the first side plate 4013 protrudes from the fifth side plate 4015.
  • the first side plate 4013 and the fifth side plate 4015 form a fourth cavity 405.
  • the first side plate 4013 is located on the left side of the fourth cavity 405, and the fifth side plate 4015 is located on the rear side of the fourth cavity 405. Openings are provided on both the front and rear sides of the fourth cavity 405, so that the fourth cavity 405 is connected to the fourth cavity 405.
  • the three chambers 404 are separated by a fifth side plate 4015.
  • the third cavity 404 includes a sixth mounting surface 4041, a seventh mounting surface 4045 and an eighth mounting surface 4046.
  • the sixth mounting surface 4041 is connected to the first side plate 4013.
  • the eighth mounting surface 4046 faces the circuit board 300.
  • the seventh mounting surface 4045 is located between the sixth mounting surface 4041 and the eighth mounting surface 4046, and the eighth mounting surface 4046 is recessed in the seventh mounting surface 4045.
  • a stopper 4042 is provided at one end of the seventh mounting surface 4045 facing the sixth mounting surface 4041.
  • the stopper 4042 divides the seventh mounting surface 4045 into a first channel 4043 and a second channel 4044.
  • the sixth mounting surface 4041 passes through the first channel 4043.
  • the second channel 4044 is connected with the seventh mounting surface 4045.
  • the first side panel 4013 is provided with a first light entrance 4047 and a second light entrance 4048.
  • the first light entrance 4047 and the second light entrance are both connected to the third cavity 404, that is, the two transmission paths of the optical fiber adapter 700.
  • the composite received light is respectively injected into the third cavity 404 through the first light entrance 4047 and the second light entrance 4048.
  • the first light entrance 4047 and the second light entrance 4048 are connected to the fiber optic adapter 700 using an MDC optical port, thereby realizing a hard connection assembly between the third cavity 404 and the fiber optic adapter 700 .
  • the first collimating lens 4202 and the second collimating lens 4203 are disposed on the sixth mounting surface 4041.
  • the first collimating lens 4202 and the second collimating lens 4203 are disposed side by side on the sixth mounting surface 4041.
  • the first collimating lens 4202 is disposed corresponding to the first light entrance 4047, so that the composite light incident through the first light entrance 4047 is converted into collimated light through the first collimating lens 4202; the second collimating lens 4203 and The second light entrance 4048 is provided correspondingly, so that the other compound light incident through the second light entrance 4048 is converted into collimated light through the second collimating lens 4203.
  • the seventh installation surface 4045 is provided with a first wave demultiplexer 4204 and a second wave demultiplexer 4205.
  • the first wave demultiplexer 4204 has one input terminal and four output terminals.
  • the first wave demultiplexer 4205 The input end of the device 4204 is set correspondingly to the first collimating lens 4202, so that the collimated light emitted by the first collimating lens 4202 is injected into the first wave demultiplexer 4204, and the first wave demultiplexer 4204 combines one path
  • the optical demultiplexing is used to receive four channels of light, and the four channels of received light are emitted through four output terminals respectively.
  • the second wave demultiplexer 4205 has one input terminal and four output terminals.
  • the input terminal of the second wave demultiplexer 4205 is set correspondingly to the second collimating lens 4203, so that the collimated light emitted by the second collimating lens 4203 is The light enters the second wave demultiplexer 4205.
  • the second wave demultiplexer 4205 demultiplexes one channel of composite light into four channels of received light. The four channels of received light are emitted through four output terminals respectively.
  • a first converging lens group 4206 and a second converging lens group 4207 are provided on the eighth mounting surface 4046.
  • the first converging lens group 4206 includes four converging lenses, each converging lens is connected to each of the first wave demultiplexer 4204.
  • the output terminals are set correspondingly, so that the four-channel received light output by the first wave demultiplexer 4204 is converted into condensed light through the first condensing lens group 4206.
  • the second condensing lens group 4207 includes four condensing lenses, and each condensing lens is arranged corresponding to each output end of the second wave demultiplexer 4205, so that the four-channel received light output by the second wave demultiplexer 4205 passes through the third wave demultiplexer 4205.
  • the two converging lens groups 4207 convert the condensed light.
  • the first detector group 305 and the second detector group 306 are disposed on the back surface of the circuit board 300, the first detector group 305, the second detector group 306 and the eighth mounting surface 4046 There is a height difference between them; and the receiving directions of the first detector group 305 and the second detector group 306 are perpendicular to the back surface of the circuit board 300, and the received light emitted by the first converging lens group 4206 and the second condensing lens group 4207 is transmitted The direction is parallel to the back surface of circuit board 300 .
  • a reflector needs to be installed between the first condensing lens group 4206, the second condensing lens group 4207 and the first detector group 305, the second detector group 306 to change the first condensing lens group 4206, the second condensing lens group 4206
  • the group 4207 emits the transmission direction of the received light, so that the received light enters the first detector group 305 and the second detector group 306 .
  • the eighth mounting surface 4046 is also provided with a first reflective prism 4208 and a second reflective prism 4209.
  • One end of the first reflective prism 4208 is provided corresponding to the first converging lens group 4206, and the other end of the first reflective prism 4208 is provided with a reflective surface.
  • the reflective surface is located above the first detector group 305 . In this way, the reflective surface of the first reflective prism 4208 reflects the four received lights emitted from the first condensing lens group 4206, and the reflected four received lights are respectively injected into the corresponding detectors of the first detector group 305.
  • One end of the second reflective prism 4209 is provided corresponding to the second condensing lens group 4207 , and the other end of the second reflective prism 4209 is provided with a reflective surface, and the reflective surface is located above the second detector group 306 .
  • the reflective surface of the second reflective prism 4209 reflects the four received lights emitted from the second condensing lens group 4207, and the reflected four received lights are respectively injected into the corresponding detectors of the second detector group 306.
  • the fourth cavity 405 includes a ninth mounting surface 4051 , the ninth mounting surface 4051 and the fifth mounting surface 4031 are arranged vertically opposite, and the ninth mounting surface 4051 extends from the first side plate 4013 to the circuit board 300
  • the ninth mounting surface 4051 is arranged side by side with the mounting surface in the third cavity 404 .
  • the length dimension of the ninth mounting surface 4051 in the left-right direction is smaller than the length dimension of the fifth side plate 4015 in the left-right direction.
  • the protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the ninth mounting surface 4051 is located below the back of the circuit board 300.
  • the first side panel 4013 is also provided with a third light entrance 4052 and a fourth light entrance 4053.
  • the third light entrance 4052 and the fourth light entrance 4053 are both connected to the fourth cavity 405.
  • the fourth cavity 405 It is connected to the optical fiber adapter 700 through the third light entrance 4052 and the fourth light entrance 4053.
  • Figure 16 is a partially assembled cross-sectional view of an optical transceiver component and a circuit board in an optical module according to some embodiments.
  • the first cavity 402 and the third cavity 404 are stacked up and down, and the first laser group 4103, the second laser group 4104, the first collimation lens group 4105, the second collimation lens group 4106, the first After the wavelength division multiplexer 4107, the second wavelength division multiplexer 4108, the first convergence lens 4109, and the second convergence lens 4110 are respectively installed in the first cavity 402, the Tx pad of the first DSP chip 310 is connected to the first DSP chip 310 through a high-speed signal line.
  • the first laser driver chip is connected, and the first laser driver chip is connected to the first laser group 4103 and the second laser group 4104 respectively through signal lines, so that the electrical signal output by the first DSP chip 310 is transmitted to the first laser driver chip.
  • the laser driver chip outputs a driving electrical signal according to the electrical signal to drive the first laser group 4103 and the second laser group 4104 to generate multiple channels of emitted light.
  • the four channels of emitted light emitted by the second laser group 4104 are converted into four channels of collimated light by the second collimating lens group 4106.
  • the four channels of collimated light are multiplexed by the second wavelength division multiplexer 4108 into one channel of composite light.
  • the light is converted into condensed light through the second condenser lens 4110, and the condensed light is coupled to the fiber optic adapter 700 through the second light outlet 4026.
  • a first isolator and a second isolator 4111 can be provided on the fourth mounting surface 4024.
  • the first isolator is provided between the first wavelength division multiplexer 4107 and the first converging lens 4109. , the first isolator is configured to isolate the reflected light occurring at the fiber end face to prevent the reflected light from returning to the first laser group 4103.
  • the second isolator 4111 is disposed between the second wavelength division multiplexer 4108 and the second condensing lens 4110.
  • the second isolator 4111 is configured to isolate the reflected light occurring at the fiber end face to prevent the reflected light from returning to the second laser. Group 4104.
  • the first collimating lens 4202, the second collimating lens 4203, the first wave demultiplexer 4204, the second wave demultiplexer 4205, the first converging lens group 4206, the second condensing lens group 4207, the first reflection After the prism 4208 and the second reflective prism 4209 are respectively installed in the third cavity 404, the two-channel composite light transmitted by the optical fiber adapter 700 is injected into the third cavity 404 through the first light entrance 4047 and the second light entrance 4048 respectively.
  • One channel of composite light incident on the second cavity 403 is converted into collimated light through the second collimating lens 4203, and the collimated light is demultiplexed by the second wave demultiplexer 4205 into four channels of received light, and the four channels of received light are passed through the second wave demultiplexer 4205.
  • the two converging lens groups 4207 convert the four converging lights into four converging lights, which are reflected by the second reflecting prism 4209 and then enter the second detector group 306.
  • the second detector group 306 is electrically connected to the Rx pad of the first DSP chip 310 through a high-speed signal line. In this way, after the second detector group 306 converts the optical signal into an electrical signal, the electrical signal is transmitted to the first DSP chip through the high-speed signal line. DSP chip 310, the first DSP chip 310 transmits the processed electrical signal to the host computer through the golden finger 301.
  • vias can be disposed on the circuit board 300 and the Rx of the first DSP chip 310
  • the pad is connected to one end of the via hole, and a high-speed signal line is arranged on the back surface of the circuit board 300.
  • One end of the high-speed signal line is connected to the other end of the via hole, and the other end of the high-speed signal line is connected to the detector, thereby realizing the connection between the detector and the via hole. Electrical connection of the first DSP chip 310 .
  • This disclosure integrates two sets of light emitting devices and two sets of light receiving devices into an integrated structure.
  • the light emitting device and the light receiving device share a tube shell and are arranged back to back.
  • the light emitting device is located on the upper layer of the tube shell, and the light receiving device is located on the lower layer of the tube shell. , realizing 8-channel 800G transmitting data transmission and 8-channel 800G receiving data transmission.
  • FIG. 17 is a schematic structural diagram of a light emitting component in an optical module according to some embodiments.
  • FIG. 18 is a partially exploded schematic diagram of a light emitting component and a circuit board in an optical module according to some embodiments.
  • the optical module provided by some embodiments of the present disclosure also includes a light emitting assembly 500.
  • the light emitting assembly 500 includes a first emitting cover plate 501, a second emitting cover plate 502 and a support plate 504.
  • the support plate 504 is disposed on the front surface of the circuit board 300.
  • the support plate 504 is provided with light-emitting devices such as lenses.
  • the first emission cover 501 is covered on the support plate 504 to set the lens and other light-emitting devices on the first In the cavity formed by the launch cover plate 501 and the support plate 504 .
  • the circuit board 300 is provided with a mounting hole 302.
  • a laser is embedded in the mounting hole 302, and the laser is fixed in the second emission cover 502.
  • the top surface of the second emission cover 502 is in contact with the back surface of the circuit board 300. , so that the laser located in the mounting hole 302 is disposed in the cavity formed by the second emission cover 502 and the circuit board 300 .
  • FIG. 19 is a schematic structural diagram of a second emitting cover in an optical module according to some embodiments.
  • FIG. 20 is a partial structural schematic diagram of a light emitting component in an optical module according to some embodiments.
  • the second launch cover 502 includes a mounting slot 5021 and a support block 5022.
  • the installation bottom surface of the mounting slot 5021 is recessed in the top surface of the second launch cover 502.
  • a third launcher is provided in the mounting slot 5021.
  • a first laser array 505 and a second laser array 511 are provided on the cooling surface of the second semiconductor refrigerator 503.
  • the first laser array 505 and the second laser array 511 are arranged side by side in the front and rear directions on the second semiconductor refrigerator 503.
  • the first laser array 505 may include four lasers, and the four lasers may be arranged side by side along the front-to-back direction; the second laser array 511 may include four lasers, and the four lasers may be arranged side by side along the front-to-back direction. In this way, on the cooling surface of the second semiconductor refrigerator 503, eight lasers are arranged side by side in the front and rear directions.
  • the second DSP chip 320 on the front of the circuit board 300 is an 8-channel 800G DSP. Therefore, each channel of the second DSP chip 320 can transmit a 100Gb/s electrical signal, and the 100Gb/s electrical signal can drive a 100Gb/s laser. In this way, each laser of the first laser array 505 and the second laser array 511 is a 100Gb/s laser.
  • the wiring heights of the first laser array 505 and the second laser array 511 are located on the same plane as the front surface of the circuit board 300. In this way, the first laser array 505 and the second laser array
  • the wiring distance between 511 and the front surface of the circuit board 300 is the shortest, which can reduce losses.
  • a second laser driver chip is also disposed on the front surface of the circuit board 300.
  • the second laser driver chip is located between the second DSP chip 320 and the light emitting component 500.
  • the second DSP chip 320 converts the electrical signal It is transmitted to the second laser driver chip through the signal line, and the second laser driver chip converts the electrical signal into a driving electrical signal.
  • the driving electrical signal is transmitted to the first laser array 505 and the second laser array 511 to drive the first laser array 505 , the second laser array 511 generates four channels of emitted light respectively.
  • a first collimating lens array 506 and a second collimating lens array 512 are also provided on the cooling surface of the second semiconductor refrigerator 503.
  • the first collimating lens array 506 is located in the light emitting direction of the first laser array 505.
  • the straight lens array 512 is located in the light emitting direction of the second laser array 511, and the collimating lenses are arranged in one-to-one correspondence with the lasers, so that the emitted light emitted by each laser is converted into collimated light by the collimating lens.
  • the support plate 504 is disposed on the front surface of the circuit board 300, so that the wiring height of the lasers is consistent with the support. There is a height difference between the mounting surfaces on the board 504, so a translation prism 507 can be set between the first collimation lens array 506, the second collimation lens array 512 and the support plate 504, and the propagation of the emitted light can be changed by the translation prism 507. direction.
  • one end of the translation prism 507 is disposed on the support block 5022 through the mounting hole 302, and the other end of the translation prism 507 is located above the front of the circuit board 300 so as to be flush with the front of the circuit board 300.
  • the reflection of the emitted light is translated to the top of the front surface of the circuit board 300 .
  • the support plate 504 is provided with a first assembly surface 5041, a second assembly surface 5042 and a third assembly surface 5043.
  • the first assembly surface 5041 is recessed in the second assembly surface 5042, and the second assembly surface 5042 is recessed in the third assembly surface 5043.
  • the third assembly surface 5043 faces the translation prism 507, the first assembly surface 5041 faces the fiber optic adapter 700, and the second assembly surface 5042 is located between the first assembly surface 5041 and the third assembly surface 5043.
  • a third wavelength division multiplexer 508 and a fourth wavelength division multiplexer 513 are arranged side by side on the third assembly surface 5043.
  • the third wavelength division multiplexer 508 includes four input terminals and one output terminal. The four input terminals and The output end of the translation prism 507 is set accordingly, so that the four collimated lights emitted by the first collimating lens array 506 are translated by the optical path of the translation prism 507 and then enter the third wavelength division multiplexer 508.
  • the third wavelength division multiplexer 508 multiplexes four channels of emitted light into one channel of composite light, which is emitted through an output end.
  • the fourth wavelength division multiplexer 513 includes four input terminals and one output terminal.
  • the four input terminals are arranged corresponding to the output terminals of the translation prism 507. In this way, the four-way collimated light emitted by the second collimating lens array 512 passes through the translation prism.
  • the optical path of 507 is translated and then injected into the fourth wavelength division multiplexer 513.
  • the fourth wavelength division multiplexer 513 multiplexes four channels of emitted light into one channel of composite light, and one channel of composite light is emitted through an output end.
  • a third converging lens 509 and a fourth converging lens 514 are arranged side by side on the second assembly surface 5042.
  • the third condensing lens 509 is disposed corresponding to the output end of the third wavelength division multiplexer 508.
  • the output of the third wavelength division multiplexer 508 is The composite light is converted into condensed light by the third condensing lens 509.
  • the fourth condensing lens 514 is arranged corresponding to the output end of the fourth wavelength division multiplexer 513, and the composite light output by the fourth wavelength division multiplexer 513 is converted into condensed light by the fourth condensing lens 514.
  • the first optical coupler 510 and the second optical coupler 515 are arranged side by side on the first assembly surface 5041.
  • One end of the first optical coupler 510 is arranged corresponding to the third condensing lens 509, so that the converging light emitted by the third condensing lens 509 Coupled to the first optical coupler 510; the other end of the first optical coupler 510 is connected to the optical fiber adapter 700 through an internal optical fiber to transmit a path of composite light to the optical fiber adapter 700.
  • One end of the second optical coupler 515 is disposed corresponding to the fourth condensing lens 514, so that the condensing light emitted by the fourth condensing lens 514 is coupled to the second optical coupler 515; the other end of the second optical coupler 515 connects to the optical fiber through the internal optical fiber.
  • the adapter 700 is connected to transmit one path of composite light to the fiber optic adapter 700 .
  • An internal optical fiber connected to the first optical coupler 510 passes through the third light outlet 4032 and is connected to the optical fiber adapter 700, and another internal optical fiber connected to the second optical coupler 515 passes through the fourth light outlet 4033 and is connected to the optical fiber adapter 700, so The light emitting component 500 is connected to the optical fiber adapter 700 using a pigtail connection.
  • Figure 21 is a partially assembled cross-sectional view of a light emitting component and a circuit board in an optical module according to some embodiments.
  • the second semiconductor refrigerator 503 is installed into the installation slot 5021 of the second emission cover 502, and the first laser array 505 and the second laser array 511 are arranged side by side in the cooling area of the second semiconductor refrigerator 503.
  • the first collimating lens array 506 and the second collimating lens array 512 are arranged side by side on the cooling surface of the second semiconductor refrigerator 503, and the first collimating lens array 506 is located at the light output of the first laser array 505 direction, the second collimating lens array 512 is located in the light emitting direction of the second laser array 511; then the translation prism 507 is installed on the support block 5022 of the second emission cover 502; and then the assembled second emission cover is The top surface of 502 is fixed to the back surface of the circuit board 300, and the first laser array 505, the second laser array 511, the first collimating lens array 506, the second collimating lens array 512, The translation prism 507 is located in the mounting hole 302; then the third wavelength division multiplexer 508 and the fourth wavelength division multiplexer 513 are installed on the third assembly surface 5043 of the support plate 504, and the third converging lens 509 and the fourth converging lens 509 are installed on the third assembly surface 5043 of the support plate 504.
  • a third isolator may be provided in the first optical coupler 510 .
  • the third isolator is configured to isolate the reflected light that occurs at the fiber end face to prevent the reflected light from returning to the first laser array 505 .
  • a fourth isolator 516 is provided within the second optical coupler 515 , and the fourth isolator 516 is configured to isolate the reflected light occurring at the fiber end face to prevent the reflected light from returning to the second laser array 511 .
  • the Tx pad of the second DSP chip 320 is connected to the second laser driver chip through a high-speed signal line, and the second laser driver chip is respectively connected to the first laser array 505 and the second laser array 511 through the signal line. connection, the second laser driver chip outputs a driving electrical signal to drive the first laser array 505 to generate four channels of emitted light.
  • the four channels of emitted light are converted into four channels of collimated light by the first collimating lens array 506.
  • the four channels of collimated light pass through The reflection of the translation prism 507 is translated and then injected into the third wavelength division multiplexer 508.
  • the third wavelength division multiplexer 508 multiplexes the four reflected lights into one composite light.
  • the composite light is converged to the first light through the third converging lens 509. Coupler 510, the composite light output by the first optical coupler 510 is transmitted to the optical fiber adapter 700 through the internal optical fiber, realizing the emission of four-channel emitted light.
  • the second laser driver chip outputs a driving electrical signal to drive the second laser array 511 to generate four channels of emitted light.
  • the four channels of emitted light are converted into four channels of collimated light by the second collimating lens array 512.
  • the four channels of collimated light pass through the translation prism. 507 reflects the translation and then enters the fourth wavelength division multiplexer 513.
  • the fourth wavelength division multiplexer 513 multiplexes the four reflected lights into one composite light.
  • the composite light is converged to the second optical coupler through the fourth condensing lens 514. 515.
  • the composite light output by the second optical coupler 515 is transmitted to the optical fiber adapter 700 through the internal optical fiber, realizing the emission of four-channel emitted light.
  • Figure 22 is a schematic structural diagram of a light receiving component in an optical module according to some embodiments.
  • Figure 23 is a partially exploded schematic diagram of a light receiving component and a circuit board in an optical module according to some embodiments.
  • Figure 24 is a schematic diagram of a light receiving component and a circuit board in an optical module according to some embodiments.
  • the optical module provided by some embodiments of the present disclosure also includes a light receiving assembly 600.
  • the light receiving assembly 600 includes a receiving cover 601 and a first fixing plate disposed on the receiving cover 601. 602.
  • the first fixed plate 602 and the second fixed plate 603 are provided with light receiving devices such as wavelength demultiplexers, lenses, and reflective prisms.
  • the light receiving devices are located on the first fixed plate 602 and the second fixed plate. In the cavity between the plate 603 and the receiving cover 601.
  • the first fixing plate 602 is disposed along the left-right direction, and the first fixing plate 602 is fixed on the back surface of the circuit board 300 .
  • a first optical collimator 604 is provided on the left side of the first fixed plate 602. One end of the first optical collimator 604 is connected to the optical fiber adapter 700 through an internal optical fiber. The composite light transmitted by the optical fiber adapter 700 is transmitted to the third optical fiber via the internal optical fiber.
  • the first optical collimator 604 collimates the composite light; a third wave demultiplexer 606 is provided on the right side of the first optical collimator 604.
  • the third wave demultiplexer 606 The collimated light output by the first optical collimator 604 is demultiplexed into four channels of received light; a first condensing lens array 608 is provided on the right side of the third wave demultiplexer 606, and the four channels of received light are condensed by the first The lens array 608 converts four channels of condensed light.
  • the first detector array 307 is disposed on the back surface of the circuit board 300, and the first converging lens array 608 is disposed on the first fixed plate 602. In this way, there is a height difference between the first detector array 307 and the first converging lens array 608. Moreover, the receiving direction of the first detector array 307 is perpendicular to the back surface of the circuit board 300 , and the transmission direction of the received light emitted by the first condensing lens array 608 is parallel to the back surface of the circuit board 300 .
  • a third reflector 610 needs to be disposed between the first condensing lens array 608 and the first detector array 307, and the third reflector 610 is used to change the transmission direction of the received light emitted from the first condensing lens array 608, so that the reflected light The received light is incident on the first detector array 307 .
  • the second fixing plate 603 is arranged side by side with the first fixing plate 602 , and the second fixing plate 603 is fixed on the back surface of the circuit board 300 .
  • a second optical collimator 605 is provided on the left side of the second fixed plate 603.
  • One end of the second optical collimator 605 is connected to the optical fiber adapter 700 through an internal optical fiber.
  • the other compound light transmitted by the optical fiber adapter 700 is transmitted to The second optical collimator 605 collimates the composite light;
  • a fourth wave demultiplexer 607 is provided on the right side of the second optical collimator 605.
  • the fourth wave demultiplexer 607 607 demultiplexes the collimated light output by the second optical collimator 605 into four channels of received light; a second converging lens array 609 is provided on the right side of the fourth wave demultiplexer 607, and the four channels of received light pass through the second The condensing lens array 609 converts four channels of converging light.
  • a second detector array 308 is disposed on the back surface of the circuit board 300.
  • a fourth reflector 611 is disposed between the second converging lens array 609 and the second detector array 308. The second converging lens array is changed by the fourth reflector 611. 609 emits the transmission direction of the received light, so that the reflected received light enters the second detector array 308 .
  • the internal optical fiber connected to the first optical collimator 604 passes through the third light outlet 4032 and is connected to the optical fiber adapter 700
  • the internal optical fiber connected to the second optical collimator 605 passes through the fourth light outlet 4033 and is connected to the optical fiber.
  • the adapter 700 is connected, so that the light receiving component 600 is connected to the optical fiber adapter 700 using a pigtail connection.
  • Figure 25 is a partially assembled cross-sectional view of a light receiving component and a circuit board in an optical module according to some embodiments.
  • the first fixing plate 602 is fixed on the back surface of the circuit board 300, and the first optical collimator 604, the third wave demultiplexer 606, the first condensing lens array 608, the third reflection
  • the mirrors 610 are sequentially arranged on the first fixed plate 602 along the left and right directions, so that the composite light transmitted by the optical fiber adapter 700 is transmitted to the first optical collimator 604 through the internal optical fiber, and the first optical collimator 604 converts the composite light into collimator Direct light and collimated light are demultiplexed by the third wave demultiplexer 606 into four-way received light.
  • the four-way received light is converted into four-way condensed light by the first condensing lens array 608.
  • the four-way condensed light is reflected by the third After reflection by the mirror 610, it enters the first detector array 307.
  • the second fixing plate 603 is fixed on the back surface of the circuit board 300, and the second optical collimator 605, the fourth wave demultiplexer 607, the second condensing lens array 609, and the fourth reflecting mirror 611 are arranged in sequence along the left and right directions. It is arranged on the second fixed plate 603, so that the other composite light transmitted by the optical fiber adapter 700 is transmitted to the second optical collimator 605 through the internal optical fiber, and the second optical collimator 605 converts the composite light into collimated light.
  • the light is demultiplexed by the fourth wave demultiplexer 607 into four channels of received light.
  • the four channels of received light are converted into four channels of condensed light by the second converging lens array 609.
  • the four channels of condensed light are reflected by the fourth reflector 611 and then emitted. into the second detector array 308.
  • the first detector array 307 and the second detector array 308 are electrically connected to the Rx pad of the second DSP chip 320 through high-speed signal lines. In this way, the first detector array 307 and the second detector array 308 convert the optical signal into After processing the electrical signal, the electrical signal is transmitted to the second DSP chip 320 through the high-speed signal line, and the second DSP chip 320 transmits the processed electrical signal to the host computer through the gold finger 301 .
  • the first detector array 307 and the second detector array 308 are disposed on the back surface of the circuit board 300 and the second DSP chip 320 is disposed on the front surface of the circuit board 300, it can be A via hole is provided, and the Rx pad of the second DSP chip 320 is connected to one end of the via hole.
  • a high-speed signal line is arranged on the back surface of the circuit board 300. One end of the high-speed signal line is connected to the other end of the via hole, and the other end of the high-speed signal line is connected to the via hole. One end is connected to the first detector array 307 and the second detector array 308 to realize the electrical connection between the first detector array 307 and the second detector array 308 and the second DSP chip 320 .
  • the light emitting component 500 is disposed on the front surface of the circuit board 300, the laser of the light emitting component 500 is embedded in the mounting hole 302 of the circuit board 300, the light receiving component 600 is disposed on the back surface of the circuit board 300, and the light emitting component 500 is disposed on the front surface of the circuit board 300.
  • the component 500 and the light receiving component 600 are electrically connected to the second DSP chip 320 respectively, realizing 8-channel 800G transmitting data transmission and 8-channel 800G receiving data transmission.
  • the optical transceiver component 400, the optical transmitter component 500, and the optical receiver component 600 cannot all be connected to the fiber optic adapter 700 using pigtail connections, nor can they all be connected using hard connections. Connect with fiber optic adapter 700.
  • the optical module includes a total of 4 groups of light-emitting devices and 4 groups of light-receiving devices.
  • 2 groups of light-emitting devices and 2 groups of light-receiving devices are integrated into an integrated structure.
  • the two groups share a tube and are arranged back-to-back.
  • the 2 groups of light-emitting devices are The device and the two sets of optical receiving devices are electrically connected to the first DSP chip, and are assembled by hard connection with the MDC optical port and the optical fiber adapter.
  • Two groups of light-emitting devices form a light-emitting component.
  • the light-emitting component is arranged on the front side of the circuit board, and part of the structure of the light-emitting component is embedded in the mounting hole of the circuit board.
  • Two groups of light-receiving devices form a light-receiving component.
  • the light-receiving component is arranged on the back of the circuit board; the light-emitting component and the light-receiving component are electrically connected to the second DSP chip, and are connected to the optical fiber adapter using a pigtail connection method.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module optique (200), comprenant : une carte de circuit imprimé (300), qui est pourvue d'une première puce DSP (310) et d'une seconde puce DSP (320) sur une surface avant, est pourvue d'un ensemble de réception optique (600) sur une surface arrière, est pourvue de connecteurs électriques sur une surface avant et une surface arrière d'une partie d'extrémité, et est pourvue d'ensembles de détecteurs (305, 306) sur une surface arrière de l'autre partie d'extrémité ; un boîtier (401), qui est pourvu de prismes réfléchissants saillants (4208, 4209) sur une partie latérale inférieure, avec des surfaces réfléchissantes des prismes réfléchissants (4208, 4209) faisant face à des surfaces photosensibles des ensembles de détecteurs (305, 306), la surface avant de la carte de circuit imprimé (300) étant électriquement connectée à l'intérieur du boîtier (401) au moyen de fils de liaison, la première puce DSP (310) étant électriquement connectée aux ensembles de détecteurs (305, 306) et aux fils de liaison, et la seconde puce DSP (320) étant électriquement connectée à l'ensemble de réception optique (600) ; et un adaptateur de fibre optique (700), qui comprend des ports de connexion de fibre optique agencés dans des couches supérieure et inférieure et insérés dans le boîtier (401).
PCT/CN2022/142794 2022-07-20 2022-12-28 Module optique WO2024016602A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202210858615.2A CN117471619A (zh) 2022-07-20 2022-07-20 光模块
CN202221892469.7U CN218272816U (zh) 2022-07-20 2022-07-20 光模块
CN202210858615.2 2022-07-20
CN202221892469.7 2022-07-20
CN202210858621.8 2022-07-20
CN202210858621.8A CN117471620A (zh) 2022-07-20 2022-07-20 光模块

Publications (1)

Publication Number Publication Date
WO2024016602A1 true WO2024016602A1 (fr) 2024-01-25

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PCT/CN2022/142794 WO2024016602A1 (fr) 2022-07-20 2022-12-28 Module optique

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WO (1) WO2024016602A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190391348A1 (en) * 2018-02-19 2019-12-26 Infinera Corporation Heterogeneous common substrate multi-chip package including photonic integrated circuit and digital signal processor
US20210278614A1 (en) * 2020-03-04 2021-09-09 Fujitsu Optical Components Limited Optical module
WO2021223448A1 (fr) * 2020-05-08 2021-11-11 青岛海信宽带多媒体技术有限公司 Module optique
CN114488423A (zh) * 2020-10-27 2022-05-13 青岛海信宽带多媒体技术有限公司 一种光模块
CN114624829A (zh) * 2020-12-14 2022-06-14 青岛海信宽带多媒体技术有限公司 一种光模块
CN114675383A (zh) * 2022-03-30 2022-06-28 青岛海信宽带多媒体技术有限公司 一种光模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190391348A1 (en) * 2018-02-19 2019-12-26 Infinera Corporation Heterogeneous common substrate multi-chip package including photonic integrated circuit and digital signal processor
US20210278614A1 (en) * 2020-03-04 2021-09-09 Fujitsu Optical Components Limited Optical module
WO2021223448A1 (fr) * 2020-05-08 2021-11-11 青岛海信宽带多媒体技术有限公司 Module optique
CN114488423A (zh) * 2020-10-27 2022-05-13 青岛海信宽带多媒体技术有限公司 一种光模块
CN114624829A (zh) * 2020-12-14 2022-06-14 青岛海信宽带多媒体技术有限公司 一种光模块
CN114675383A (zh) * 2022-03-30 2022-06-28 青岛海信宽带多媒体技术有限公司 一种光模块

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