WO2024016119A1 - 换能装置及耳机 - Google Patents

换能装置及耳机 Download PDF

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Publication number
WO2024016119A1
WO2024016119A1 PCT/CN2022/106300 CN2022106300W WO2024016119A1 WO 2024016119 A1 WO2024016119 A1 WO 2024016119A1 CN 2022106300 W CN2022106300 W CN 2022106300W WO 2024016119 A1 WO2024016119 A1 WO 2024016119A1
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WO
WIPO (PCT)
Prior art keywords
vibration
piece
magnet
transducer device
magnet assembly
Prior art date
Application number
PCT/CN2022/106300
Other languages
English (en)
French (fr)
Inventor
张磊
朱光远
廖风云
齐心
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Priority to PCT/CN2022/106300 priority Critical patent/WO2024016119A1/zh
Publication of WO2024016119A1 publication Critical patent/WO2024016119A1/zh
Priority to US18/736,506 priority patent/US20240323593A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/041—Centering
    • H04R9/043—Inner suspension or damper, e.g. spider
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/063—Loudspeakers using a plurality of acoustic drivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • This application relates to the technical field of electronic equipment, specifically to transducer devices and earphones.
  • Electronic devices have become indispensable social and entertainment tools in people's daily lives, and people's requirements for electronic devices are getting higher and higher.
  • Electronic devices such as headphones have also been widely used in people's daily lives. They can be used in conjunction with terminal devices such as mobile phones and computers to provide users with an auditory feast.
  • terminal devices such as mobile phones and computers to provide users with an auditory feast.
  • earphones according to the working principle of earphones, they can generally be divided into air conduction earphones and bone conduction earphones; according to the way the user wears the earphones, they can generally be divided into headset earphones, earhook earphones and in-ear earphones; according to the earphones
  • the interaction methods with electronic devices can generally be divided into wired headphones and wireless headphones.
  • the embodiment of the present application provides a transducer device, which includes a magnetic circuit system, a coil, a first vibration transmission piece, and a second vibration transmission piece.
  • the magnetic circuit system includes a magnet assembly, and the coil winds around a line parallel to the vibration direction of the transducer device. The axis is sleeved on the outside of the magnet assembly. In the vibration direction, the first vibration transmission piece and the second vibration transmission piece elastically support the magnet assembly from opposite sides of the magnet assembly.
  • the embodiment of the present application provides an earphone, which includes a support component and a movement module connected to the support component.
  • the support component is used to support the movement module to be worn to a wearing position.
  • the movement module includes a movement shell and the above implementation.
  • the energy conversion device described in the example is arranged in the accommodation cavity of the movement housing.
  • the beneficial effects of this application are: compared with the related art in which one side of the magnet assembly is constrained, in this application the opposite sides of the magnet assembly in the vibration direction of the transducer device are restrained by the first vibration transmission plate and the second transmission plate respectively.
  • the vibrating piece is elastically supported so that there is no obvious shaking or other abnormal vibration, which is helpful to increase the stability of the vibration of the transducer device.
  • Figure 1 (a) to (c) are schematic diagrams of wearing various embodiments of the earphones provided by the present application;
  • FIG. 2 is a schematic structural diagram of an embodiment of the movement module provided by this application.
  • Figure 3 is a schematic structural diagram of an embodiment of the earphone provided by the present application.
  • Figure 4 is a schematic structural diagram of an embodiment of the earphone provided by the present application.
  • Figure 5 is a schematic structural diagram of an embodiment of the earphone provided by the present application.
  • Figure 6 is a schematic structural diagram of an embodiment of the earphone provided by the present application.
  • Figure 7 is a schematic structural diagram of an embodiment of the earphone provided by the present application.
  • Figure 8 is a schematic top structural view of an embodiment of the first vibration transmission plate provided by this application.
  • Figure 9 is a schematic top structural view of an embodiment of the second vibration transmission plate provided by the present application.
  • Figure 10 is a schematic top view of the structure of an embodiment of the first vibration transmission plate provided by this application.
  • Figure 11 is a schematic top structural view of an embodiment of the second vibration transmission plate provided by the present application.
  • Figure 12 is a schematic diagram of vibration test results of an embodiment of the transducer device provided by this application.
  • Figure 13 is a schematic diagram of frequency response curves of various embodiments of headphones provided by this application.
  • Figures 1 and 2 are schematic diagrams of wearing various embodiments of the earphones provided by the present application
  • Figure 2 is a schematic structural diagram of an embodiment of the movement module provided by the present application.
  • the earphone 100 may be an electronic device such as a music earphone, a hearing aid earphone, a bone conduction earphone, a hearing aid, audio glasses, a VR device, an AR device, or the like.
  • the earphone 100 may include a movement module 10 and a support component 20 , and the movement module 10 is connected to the support component 20 .
  • the movement module 10 can be used to convert electrical signals into mechanical vibrations so as to be used to hear sounds through the earphones 100;
  • the support component 20 can be used to support the movement module 10 to be worn in a wearing position, and the aforementioned wearing position can be It is a specific position on the user's head, such as the mastoid process, temporal bone, parietal bone, frontal bone, etc. of the head, and another example is the left and right sides of the head and the position in front of the user's ear on the sagittal axis of the human body.
  • the movement vibration generated by the movement module 10 can be mainly transmitted through a medium such as the user's skull (i.e., bone conduction) to form bone conduction sound, or can also be mainly transmitted through a medium such as air (i.e., air conduction) to form a sound.
  • Air conduction sound can be arranged in an annular shape and wrapped around the user's ears, for example as shown in (a) in Figure 1; it can also be provided with an ear hook and a back hanging structure to be arranged around the back of the head, for example As shown in (b) in Figure 1; it can also be configured as a head beam structure and placed around the top of the user's head, for example as shown in (c) in Figure 1.
  • both movement modules 10 can convert electrical signals into movement vibrations, mainly to facilitate the headset 100 to achieve stereo sound effects. Therefore, in other application scenarios that do not have particularly high requirements for stereo sound, such as hearing aids for hearing patients, live broadcast prompting by hosts, etc., the headset 100 can also be equipped with only one movement module 10 .
  • the support component 20 may include two earhook components and a backhook component. Two ends of the backhook component are respectively connected to one end of a corresponding earhook component, and each earhook component is away from the other end of the backhook component. Connected to a corresponding movement module 10 respectively.
  • the rear hanging component can be arranged in a curved shape for being hung around the back of the user's head, and the earhook component can also be arranged in a curved shape for being hung between the user's ears and head. , which makes it easier to meet the wearing needs of headphones.
  • the two movement modules 10 are respectively located on the left and right sides of the user's head, and the two movement modules 10 also press the user under the cooperation of the support assembly 20 The user can also hear the sound output by the headphone 100 without moving the head.
  • the movement module 10 may include a movement housing 11, a transducing device 12 and a vibration panel 13.
  • the transducing device 12 may be disposed in the accommodation cavity of the movement housing 11, and the vibration panel 13 may be connected with the transducing panel 13.
  • the transducing device 12 is connected and used to transmit the mechanical vibration generated by the transducing device 12 to the user.
  • the transducing device 12 is configured to convert electrical signals into mechanical vibrations in the energized state, and the vibration panel 13 can be in contact with the user's skin in the wearing state to act on the user's auditory nerve through the user's bones and tissues as a medium, Then bone conduction sound is formed.
  • the movement module 10 may also include a vibration-absorbing piece 14.
  • the transducing device 12 may be suspended in the accommodation cavity of the movement case 11 through the vibration-damping piece 14, that is, the edge of the vibration panel 13 is in contact with the movement case. The open end of body 11 is disconnected.
  • the vibration-absorbing piece 14 the mechanical vibration generated by the transducer device 12 can be less or even not transmitted to the movement housing 11, thereby preventing the movement housing 11 from driving the air vibration outside the earphone 100 to a certain extent. , which is beneficial to reducing the sound leakage of the earphone 100 .
  • At least one through hole (commonly known as a "leakage reduction hole") for connecting the accommodation cavity of the movement casing 11 and the outside of the earphone 100 can be opened on the movement housing 11.
  • a through hole commonly known as a "leakage reduction hole”
  • the movement module 10 may also include a face-fitting cover 15 connected to the vibration panel 13 .
  • the face-fitting cover 15 is used to contact the user's skin, that is, the vibration panel 13 can contact the user's skin through the face-fitting cover 15 .
  • the Shore hardness of the face-fitting cover 15 can be smaller than the Shore hardness of the vibration panel 13 , that is, the face-fitting cover 15 can be softer than the vibration panel 13 .
  • the face cover 15 is made of a soft material such as silicone
  • the vibration panel 13 is made of a hard material such as polycarbonate or glass fiber reinforced plastic.
  • the wearing comfort of the earphone 100 is improved, and the movement module 10 is more closely aligned with the user's skin, thereby improving the sound quality of the earphone 100 .
  • the face cover 15 can be detachably connected to the vibration panel 13 to facilitate replacement by the user.
  • the transducer device 12 may include a bracket 121, a vibration transmission piece 122, a magnetic circuit system 123 and a coil 124.
  • the vibration transmission piece 122 may connect the bracket 121 and the magnetic circuit system 123 to suspend the magnetic circuit system 123 on the machine.
  • the coil 124 can extend into the magnetic gap of the magnetic circuit system 123 along the vibration direction of the transducer device 12 .
  • the magnetic circuit system 123 may include a magnet assembly 1231 and a magnetic conductive cover 1232.
  • the magnet assembly 1231 is fixed at the bottom of the magnetic conductive cover 1232.
  • the side walls of the magnetic conductive cover 1232 and the magnet assembly 1231 are in a direction perpendicular to the vibration direction of the transducer device 12.
  • the magnetic conductive cover 1232 may be a cylindrical structure with one end open.
  • the coil 124 can be connected to the bracket 121 , and the side wall of the magnetic conductive cover 1232 can be connected to the vibration transmission piece 122 .
  • the vibration damping piece 14 can connect the bracket 121 and the movement housing 11 to suspend the transducer device 12 in the accommodation cavity of the movement housing 11; the vibration panel 13 can be connected with the bracket 121.
  • the magnet assembly 1231 is fixed on the magnetic conductive cover 1232 through a one-sided connection, that is, one side of the magnet assembly 1231 is constrained, and there is no The other side is constrained to allow the coil 124 to move relative to the magnetic circuit system 123; in the vibration direction of the transducer device 12, there needs to be a distance between the coil 124 and the bottom of the magnetic permeable cover 1232 to avoid collision between the two; In the direction perpendicular to the vibration direction of the transducer device 12, there needs to be a distance between the coil 124 and the magnet assembly 1231 and the magnetic conductive cover 1232, respectively, to prevent the coil 124 from colliding with any one of the magnet assembly 1231 and the magnetic conductive cover 1232.
  • FIG. 3 is a schematic structural diagram of an embodiment of an earphone provided by this application.
  • FIG. 4 is a schematic structural diagram of an embodiment of an earphone provided by this application.
  • FIG. 5 is a schematic structural diagram of an embodiment of an earphone provided by this application. Structural schematic diagram
  • FIG. 6 is a schematic structural diagram of an embodiment of the earphone provided by this application
  • FIG. 7 is a schematic structural diagram of an embodiment of the earphone provided by this application.
  • the transducer device 12 may include a magnetic circuit system 123 , a coil 124 , a first vibration transmission piece 125 and a second vibration transmission piece 125 .
  • the magnetic circuit system 123 may include a magnet assembly 1231, and the coil 124 may be sleeved on the outside of the magnet assembly 1231 around an axis parallel to the vibration direction of the transducer device 12.
  • the first The vibration transmission piece 125 and the second vibration transmission piece 126 can elastically support the magnet assembly 1231 from opposite sides of the magnet assembly 1231 respectively.
  • the magnet assembly 1231 is elastically supported on opposite sides in the vibration direction of the transducer device 12, so that it does not have obvious shaking or other abnormal vibrations, which is beneficial to Increase the vibration stability of the transducer device 12.
  • the magnetic circuit system 123 may also include a magnetic conductive cover 1232 placed around the axis parallel to the vibration direction of the transducer device 12 around the outside of the coil 124 , that is, The magnetic conductive cover 1232 and the magnet assembly 1231 are spaced apart in a direction perpendicular to the vibration direction of the transducer device 12; the edge area of the first vibration transmission piece 125 and the edge area of the second vibration transmission piece 126 can be separated from the magnetic conduction cover 1232 respectively. connected at both ends.
  • the magnetic conductive cover 1232 may be a cylindrical structure with open ends.
  • the magnetic conductive cover 1232 in this embodiment has a cylindrical structure with both ends open, which is beneficial to eliminating the sound cavity effect of the magnetic circuit 123, thereby reducing the headphone 100% sound leakage.
  • the sound cavity effect is mainly caused by the magnet assembly 1231 and the magnetic conductive cover 1232 forming a semi-enclosed cavity.
  • the coil 124 moves relative to the magnetic circuit system 123, it acts on the air in the semi-enclosed cavity. The air pressure changes, causing sound leakage.
  • the coil 124 can extend into the magnetic gap between the magnet assembly 1231 and the magnetic conductive cover 1232 .
  • the magnetic permeable cover 1232 can also be replaced with a non-magnetic component such as a plastic bracket. Based on this, the edge area of the first vibration transmission piece 125 and the edge area of the second vibration transmission piece 126 can be connected to two ends of a plastic bracket respectively.
  • the magnetic circuit system 123 may also include a magnetic conductive cover 1232 spaced apart from the magnet assembly 1231 in a direction perpendicular to the vibration direction of the transducer device 12 , and the magnet assembly 1231 is connected to the magnetic conductive cover 1232 .
  • the bottom of the cover 1232 is connected.
  • one of the first vibration transmission piece 125 and the second vibration transmission piece 126 can be connected to the vibration panel 13, and the other can be connected to the movement housing 11 to suspend the magnetic circuit system 123 on the movement housing.
  • the central area of the first vibration-transmitting piece 125 is connected to the magnet assembly 1231, and the edge area of the first vibration-transmitting piece 125 is connected to the vibration panel 13 through the bracket 121; one of the central area and the edge area of the second vibration-transmitting piece 126 is One is connected to the magnet assembly 1231 through the magnetic conductive cover 1232, and the other is connected to the movement housing 11.
  • the central area of the first vibration transmission piece 125 is connected to the vibration panel 13 through the bracket 121 , and the edge area of the first vibration transmission piece 125 is connected to the magnet assembly 1231 through the magnetic permeable cover 1232 .
  • the magnetic conductive cover 1232 can also be a cylindrical structure with one end open.
  • the coil 124 can extend into the magnetic gap between the magnet assembly 1231 and the magnetic conductive cover 1232 .
  • the magnetic circuit system 123 includes a magnetic conductive cover 1232 or a plastic bracket that replaces the magnetic conductive cover 1232, since the first vibration transmitting piece 125 and the second vibration transmitting piece 126 move from one another in the vibration direction of the transducer device 12 The two sides constrain the magnet assembly 1231 to make the vibration of the transducer device 12 more stable.
  • the edge area of the first vibration transmission piece 125 and the center area of the first vibration transmission piece 125 may not be coplanar, and the second vibration transmission piece 125 may not be coplanar.
  • the edge area of the plate 126 and the center area of the second vibration transmission plate 126 may not be coplanar, so that the first vibration transmission plate 125 and the second vibration transmission plate 126 are respectively connected to the magnet assembly 1231 (specifically, they may be mentioned later.
  • the first magnet 1236 and the second magnet 1237, or the first magnetic conductive plate 1234 and the second magnetic conductive plate 1235 mentioned later) then provide a preload force.
  • the natural state described in this application may refer to the structural state when the first vibration transmission piece 125 and the second vibration transmission piece 126 are assembled on the transducer device 12 and the transducer device 12 does not input an excitation signal and does not generate mechanical vibration. .
  • the elastic force of the first vibration transmission piece 125 and the second vibration transmission piece 126 will not be zero at the same time during the vibration of the transducer device 12, which is beneficial to improving the vibration of the transducer device 12.
  • stability and linearity Therefore, the first vibration transmission piece 125 and the second vibration transmission piece 126 can be flat before being assembled on the transducer device 12 to facilitate processing.
  • the first distance in the axial direction between the edge area of the first vibration transmission piece 125 and the center area of the first vibration transmission piece 125 may be greater than or equal to 0.4 mm
  • the second vibration transmission piece 125 may be greater than or equal to 0.4 mm
  • the second distance in the axial direction between the edge area of 126 and the central area of the second vibration transmission plate 126 may be greater than or equal to 0.4 mm.
  • the first distance and the second distance are too small, it is easy to cause the preload force provided by the first vibration transmission piece 125 and the second vibration transmission piece 126 to be too small to meet the actual use requirements, and it is also easy to cause the first vibration transmission piece 125 and the second vibration transmission piece 126 to be too small.
  • the plate 125 and the second vibration-transmitting plate 126 structurally interfere with the magnet assembly 1231 during the vibration process of the transducer device 12 . Further, the first spacing and the second spacing may be equal.
  • the central area of the first vibration-transmitting piece 125 can be further away from the magnet assembly 1231 than its edge area, and the central area of the second vibration-transmitting piece 126 can be farther away from the magnet assembly 1231 than its edge area. Further away from the magnet assembly 1231 than its edge area.
  • the magnetic circuit system 123 may also include a connector 1239 that passes through the magnet assembly 1231.
  • the length of the connector 1239 in the vibration direction of the transducer device 12 is greater than the thickness of the magnet assembly 1231 in the vibration direction of the transducer device 12.
  • the central areas of the first vibration-transmitting piece 125 and the second vibration-transmitting piece 126 can be fixed at both ends of the connecting member 1239 respectively. In this way, the connecting member 1239 can spread the first vibration transmission piece 125 and the second vibration transmission piece 126 along the vibration direction of the transducer device 12 .
  • the edges of the first vibration transmission piece 125 and the second vibration transmission piece 126 may be non-coplanar with the corresponding central region, for example, as shown in Figures 3 to 6; the edge regions of the first vibration transmitting piece 125 and the second vibration transmitting piece 126 may also be coplanar with the corresponding central region.
  • the magnetic conductive cover 1232 can be connected to the bracket 121 , and the bracket 121 can be connected to the movement housing 11 through the vibration damping sheet 14 to connect the energy transducer.
  • the device 12 is suspended in the accommodation cavity of the movement housing 11 .
  • the vibration panel 13 can be connected to the bracket 121 and disconnected from the open end of the movement housing 11 .
  • the ratio between the stiffness of the vibration damping piece 14 and the stiffness of the first vibration transmission piece 125 may be between 0.1 and 5
  • the ratio between the stiffness of the vibration damping piece 14 and the stiffness of the second vibration transmission piece 126 Can be between 0.1 and 5.
  • the stiffness of the damping plate 14 is too small, it will be difficult for the magnetic circuit system 123 to be stably suspended in the movement housing 11 by the damping plate 14, which will easily lead to poor stability of the transducer device 12 when vibrating; otherwise , if the stiffness of the vibration damping plate 14 is too large, the vibration of the transducer device 12 is easily transmitted to the movement housing 11 through the vibration damping plate 14 , which easily leads to excessive sound leakage of the earphone 100 .
  • the stiffness of the vibration-absorbing piece 14, the first vibration-transmitting piece 125, the second vibration-transmitting piece 126 and other structures described in this application can be measured in the same or similar manner.
  • the following takes the first vibration transmission piece 125 shown in FIG.
  • the probe of the gram-force meter with a test point such as the center of mass and the geometric center (for example, the first internal fixing part 1252) on the first vibration-transmitting piece 125, and then place the probe on the gram-force meter.
  • Each displacement may represent the distance the probe moves.
  • the movement of the probe may cause the first vibration transmission piece 125 to produce a deformation amount, and the deformation amount of the first vibration transmission piece 125 caused by each displacement may not exceed the first vibration transmission piece 125 .
  • the maximum deformation amount of piece 125 is the maximum deformation amount of piece 125.
  • the displacement-stress curve will have a curve segment that is almost parallel to the horizontal axis. This curve segment that is parallel to the horizontal axis is used when calculating the first transmission piece.
  • the stiffness of the vibrating plate 125 does not need to be considered.
  • the edge area of any one of the first vibration transmission plate 125 and the second vibration transmission plate 126 can be assembled with the machine through one or a combination of snapping, gluing, etc.
  • the open end of the core housing 11 is connected.
  • the vibration panel 13 and the movement housing 11 can also be an integrally formed structural member made of the same material.
  • the gap between the coil 124 and the magnetic permeable cover 1232 may be smaller than the gap between the coil 124 and the magnet assembly 1231 .
  • the magnet assembly 1231 is in the vibration direction of the transducer device 12.
  • the two opposite sides are elastically supported, so that there is no need to worry about the collision between the coil 124 and the magnetic conductive cover 1232, which is beneficial to reducing the vibration of the magnetic gap between the magnet assembly 1231 and the magnetic conductive cover 1232 perpendicular to the transducer device 12
  • the size in the direction of the direction thereby reducing the communication area between the semi-enclosed cavity and the outside of the magnetic circuit system 123, hindering the propagation path of sound leakage caused by the sound cavity effect, that is, suppressing the sound cavity effect, thereby reducing the headphone 100 of sound leakage.
  • the coil 124 can be fixed on the magnetic conductive cover 1232, that is, the magnetic conductive cover 1232 and the coil 124 keep following.
  • the magnet assembly 1231 may include a magnet 1233 , and a first magnetic guide plate 1234 and a second conductive plate located on opposite sides of the magnet 1233 in the vibration direction of the transducer device 12 .
  • Magnetic plate 1235, the first vibration transmission piece 125 can support the magnet assembly 1231 from the side of the first magnetic conduction plate 1234 away from the second magnetic conduction plate 1235, and the second vibration transmission piece 126 can be away from the first magnetic conduction plate 1235.
  • One side of the magnetically conductive plate 1234 supports the magnet assembly 1231 .
  • the central area of the first vibration-transmitting piece 125 is connected to the side of the first magnetic-conducting plate 1234 facing away from the second magnetic-conducting plate 1235, and the central area of the second vibration-transmitting piece 126 is connected to the side of the second magnetic-conducting plate 1235 facing away from the first conducting plate.
  • Magnetic plate 1234 is connected on one side. The edges on opposite sides of the first magnetic conductive plate 1234 and the second magnetic conductive plate 1235 can be chamfered to adjust the distribution of the magnetic field formed by the magnetic circuit system 123 .
  • two magnets can be sandwiched between the first magnetic conductive plate 1234 and the second magnetic conductive plate 1235.
  • the magnetization directions are different, for example, the polarity of the two magnets facing each other is the same and the magnetization direction is perpendicular to the junction of the two magnets.
  • the half-thickness of the magnet assembly 1231 and the half-height of the coil 124 may be at the same height. In this way, it is beneficial for the magnetic field formed by the magnetic circuit system 123 to pass through the coil 124 uniformly and concentratedly.
  • the coil 124 may include a first coil 1241 connected to a side of the first vibration transmission plate 125 facing the second vibration transmission plate 126 and a side connected to the second vibration transmission plate 126 facing the first vibration transmission plate 125
  • the second coil 1242 is connected, and the directions of the currents in the first coil 1241 and the second coil 1242 are reversed.
  • the transducing device 12 vibrates under the driving of the double coil, which is beneficial to increasing the vibration size of the transducing device 12 .
  • the half height of the first coil 1241 is equal to the half thickness of the first magnetic conductive plate 1234.
  • the half-height of the second coil 1242 and the half-thickness of the second magnetic conductive plate 1235 can also be of the same height, so that the magnetic fields adjusted through the first magnetic conductive plate 1234 and the second magnetic conductive plate 1235 can be Pass through the first coil 1241 and the second coil 1242 uniformly and concentratedly respectively.
  • the distance between the first coil 1241 and the magnetic permeable cover 1232 in the direction perpendicular to the vibration direction of the transducing device 12 may be smaller than the distance between the first coil 1241 and the first magnetic permeable plate 1234 in the direction perpendicular to the vibration direction of the transducing device 12
  • the distance between the second coil 1242 and the magnetic permeable cover 1232 in the direction perpendicular to the vibration direction of the transducer device 12 is smaller than the distance between the second coil 1242 and the second magnetic permeable plate 1235 perpendicular to the vibration direction of the transducer device 12
  • the spacing in the direction of the vibration direction; for example, the first coil 1241 and the second coil 1242 are respectively fixed on the magnetic permeable cover 1232.
  • the magnet assembly 1231 may include a first magnet 1236 and a second magnet 1237 that are stacked in the vibration direction of the transducer device 12 ; the first magnet 1236 and the second magnet 1237
  • the magnetization directions of the first magnet 1236 and the second magnet 1237 are different.
  • the magnetization directions of the first magnet 1236 and the second magnet 1237 are opposite and are perpendicular to the junction between the two.
  • the first vibration transmission plate 125 can move from the first magnet 1236 to the second magnet 1237.
  • the side of 1236 facing away from the second magnet 1237 elastically supports the magnet assembly 1231
  • the second vibration transmission plate 126 can elastically support the magnet assembly 1231 from the side of the second magnet 1237 facing away from the first magnet 1236.
  • the central area of the first vibration-transmitting piece 125 is connected to the side of the first magnet 1236 facing away from the second magnet 1237
  • the central area of the second vibration-transmitting piece 126 is connected to the side of the second magnet 1237 facing away from the first magnet 1236 .
  • the coil 124 when the coil 124 is projected onto the outer peripheral surface of the magnet assembly 1231 in a direction perpendicular to the vibration direction of the transducer device 12 , it may overlap with the junction of the first magnet 1236 and the second magnet 1237 . In this way, it is beneficial for the magnetic field formed by the magnetic circuit system 123 to pass through the coil 124 uniformly and concentratedly.
  • the magnet assembly 1231 may also include a magnetically conductive plate 1238 sandwiched between the first magnet 1236 and the second magnet 1237, and the coil 124 is projected onto the magnet assembly 1231 in a direction perpendicular to the vibration direction of the transducer device 12.
  • the outer peripheral surface may overlap with the side peripheral surface of the magnetic conductive plate 1238 .
  • the magnetization directions of the first magnet 1236 and the second magnet 1237 can be opposite, and both are perpendicular to the surface of the magnetic conductive plate 1238 facing the first magnet 1236 or the second magnet 1237 .
  • the magnetic conductive plate 1238 may be located at half the height of the coil 124.
  • a magnetic conductive plate can be provided on both sides of the first magnet 1236 and the second magnet 1237 that are opposite to each other, which is beneficial to further Reduce magnetic flux leakage.
  • both ends of the coil 124 can be connected to the first vibration transmission piece 125 and the second vibration transmission piece 126 respectively. That is, in the vibration direction of the transducer device 12, the height of the coil 124 can be greater than or equal to the height of the magnet assembly 1231. thickness. In this way, compared with the need for a distance between the coil 124 and the bottom of the magnetic permeable cover 1232 in the vibration direction of the transducer device 12, in this application, the magnet assembly 1231 in the present application is elastically spaced on opposite sides in the vibration direction of the transducer device 12.
  • the overlapping area in the direction of the vibration direction of the magnetic circuit system 123 further increases the magnetic field utilization rate of the magnetic circuit system 123 and improves the sensitivity and reliability of the transducer device 12 .
  • the height of the overlapping area formed by the orthographic projection of the magnet assembly 1231, the coil 124 and the magnetic conductive cover 1232 in the direction perpendicular to the vibration direction of the transducer device 12 in the aforementioned vibration direction is consistent with the height of the magnet assembly 1231, the coil 124 and the magnetic conductive cover 1232.
  • the size relationship between the heights of the cover 1232 in the aforementioned vibration direction will affect the magnetic field distribution and utilization of the magnetic circuit system 123 to a certain extent.
  • the height of the overlapping area formed by the orthographic projection of the magnet assembly 1231 , the coil 124 and the magnetic permeable cover 1232 in a direction perpendicular to the vibration direction of the transducer device 12 in the aforementioned vibration direction is the same as the height of the magnet assembly 1231 in the aforementioned vibration direction.
  • the ratio between heights in the directions can be between 0.15 and 0.5. In this way, the coil 124 can mainly utilize a relatively concentrated and uniform part of the magnetic field generated by the magnet assembly 1231, which is beneficial to increasing the vibration stability of the transducer device 12.
  • the height of the overlapping area formed by the orthographic projection of the magnet assembly 1231, the coil 124 and the magnetic permeable cover 1232 in a direction perpendicular to the vibration direction of the transducer device 12 in the aforementioned vibration direction is the same as the height of the coil 124 in the aforementioned vibration direction.
  • the ratio between heights in the directions can be between 0.53 and 0.83. In this way, the magnetic field formed by the magnetic circuit system 123 can pass through the coil 124 more, which is beneficial to the magnetic field utilization of the magnetic circuit system 123 .
  • the height of the overlapping area formed by the orthographic projection of the magnet assembly 1231 , the coil 124 and the magnetically permeable cover 1232 in a direction perpendicular to the vibration direction of the transducer device 12 in the aforementioned vibration direction is equal to that of the magnetically permeable cover 1232
  • the ratio between the heights in the aforementioned vibration directions may be between 0.12 and 0.32. In this way, the magnetic permeable cover 1232 can make the magnetic field generated by the magnet assembly 1231 have more relatively concentrated and uniform parts, which is beneficial to increasing the vibration stability of the transducer device 12 .
  • Figure 8 is a schematic top structural view of an embodiment of the first vibration transmission plate provided by the present application.
  • Figure 9 is a schematic top structural view of an embodiment of the second vibration transmission plate provided by the present application.
  • Figure 10 This is a schematic top structural view of an embodiment of the first vibration transmission plate provided by this application.
  • Figure 11 is a schematic top structural view of an embodiment of the second vibration transmission plate provided by this application.
  • the first vibration transmitting plate 125 may include a first radial portion 1251, and a first inner fixing portion 1252 and a first outer fixing portion 1253 connected to the first radial portion 1251 to allow the first
  • the vibration-transmitting piece 125 is connected to the magnet assembly 1231 and one end of the magnetic conductive cover 1232 through the first inner fixing part 1252 and the first external fixing part 1253 respectively;
  • the second vibration-transmitting piece 126 may include a second radial part 1261 and a third radial part 1261 .
  • the second inner fixing part 1262 and the second outer fixing part 1263 are connected by the two radial parts 1261 to allow the second vibration transmission piece 126 to be connected to the magnet assembly 1231 and the conductor through the second inner fixing part 1262 and the second outer fixing part 1263 respectively.
  • the other end of the magnetic cover 1232 is connected.
  • the first radial portion 1251 may include a plurality of first spokes spirally spread outward from the center of the first vibration-transmitting piece 125, such as the three first spokes shown in Figure 8, so that the first inner fixing portion
  • the area between 1252 and the first external fixing part 1253 has a hollow structure, so that the first vibration-transmitting piece 125 has a preset elastic coefficient;
  • the second radial part 1261 can include an area extending from the center of the second vibration-transmitting piece 126 outward.
  • a plurality of second spokes are spirally expanded, such as the three second spokes shown in Figure 9, so that the area between the second inner fixing part 1262 and the second outer fixing part 1263 has a hollow structure, so that the second spokes are
  • the vibrator 126 has a preset elastic coefficient. Further, when viewed along the vibration direction of the transducer device 12, the helical direction of the first spoke and the helical direction of the second spoke at the same position of the first vibration transmitting piece 125 and the second vibration transmitting piece 126 are opposite to each other, for example
  • the helical direction of the first spoke in Figure 8 is clockwise and the helical direction of the second spoke in Figure 9 is counterclockwise.
  • the first radial portion 1251 can be further divided into a first sub-region 125A and a second sub-region 125B that are nested with each other along the radial direction of the first vibration-transmitting plate 125 .
  • the helical directions of the first spokes in the two sub-regions 125B are opposite to each other.
  • the helical direction of the first spokes in the inner first sub-region 125A is clockwise
  • the helical direction of the first spokes in the outer second sub-region 125B is clockwise.
  • the spiral direction of the first spoke is counterclockwise.
  • the first vibration transmitting piece 125 may further include a first transition part 1254, through which the first spokes in the first sub-region 125A and the first spokes in the second sub-region 125B are connected.
  • connection point between any first spoke in the first sub-region 125A and the first transition portion 1254 may be located at two adjacent ones in the second sub-region 125B. between the connection point between the first spoke and the first transition 1254.
  • the second radial portion 1261 can be further divided into a third sub-region 126C and a fourth sub-region 126D nested with each other along the radial direction of the second vibration-transmitting plate 126 .
  • the spiral directions of the second spokes in the four sub-regions 126D are opposite to each other.
  • the spiral direction of the second spokes in the third sub-region 126C located on the inside is counterclockwise and in the fourth sub-region 126D located on the outside.
  • the spiral direction of the second spoke is clockwise.
  • the second vibration transmitting piece 126 may further include a second transition part 1264, through which the second spokes in the third sub-region 126C and the second spokes in the fourth sub-region 126D are connected.
  • connection point between any second spoke in the third sub-region 126C and the second transition portion 1264 may be located at two adjacent ones in the fourth sub-region 126D. between the connection point between the second spoke and the second transition 1264 .
  • the first vibration transmission piece 125 and the second vibration transmission piece 126 can be arranged in a rectangular shape, so that the corners of both can be selectively partially removed to accommodate the lead wires of the coil 124 solder joints.
  • Figure 12 is a schematic diagram of the vibration test results of an embodiment of the transducer device provided by the present application
  • Figure 13 is a schematic diagram of the frequency response curves of various embodiments of the earphones provided by the present application.
  • the first vibration transmission piece 125 and the second vibration transmission piece 126 elastically support opposite sides of the magnet assembly 1231 in the vibration direction of the transducer device 12 , such that Their basic principles and related structures are generally consistent. Therefore, for convenience of description, one of the embodiments shown in FIGS. 3 to 6 can be selected for exemplary description.
  • the transducer device 12 in the embodiment shown in Figure 3 is subjected to a vibration test, and the corresponding vibration test results are shown in Figure 12; the drive represented by curves 12_1 to 12_5 in Figure 12 The voltage gradually increases.
  • the magnetic circuit system 123, the coil 124, the first vibration transmission piece 125 and the second vibration transmission piece 126 are first disassembled from the movement module 10 as a whole;
  • the vibration meter is on a fixed platform of the tester, and the coil 124 can vibrate relative to the magnet assembly 1231; then a driving voltage is input to the coil 124 to cause the transducer device 12 to vibrate, and the position of the magnet assembly 1231 in the transducer device 12 is measured based on the laser triangulation method.
  • the size of the displacement that is, the amplitude
  • the abscissa and ordinate in Figure 12 can represent frequency and displacement respectively.
  • the unit of frequency is Hz and the unit of displacement is mm.
  • the curves 12_1 to 12_5 are relatively smooth, indicating that the vibration of the transducer device 12 is stable and there is no abnormal vibration such as obvious shaking.
  • the peak resonant frequency of the resonant peak of the transducer device 12 also does not change significantly.
  • the movement housing 11 in the embodiment shown in FIG. 2 is fixed on the fixed platform of a tester such as a laser vibrometer, and the vibration panel 13 can vibrate relative to the movement housing 11, also based on the laser.
  • the triangulation method measures the vibration displacement (that is, the amplitude) of the vibration panel 13 during the vibration process of the transducer device 12.
  • the vibration displacement of the vibration panel 13 can be converted into the acceleration of the vibration panel 13, and then converted into the vibration size of the vibration panel 13,
  • the curve 13_1 in Figure 13 can represent the frequency response curve of the movement module 10 in the embodiment shown in Figure 2.
  • the frequency response curve of the movement module 10 in the embodiment shown in Figure 3 can be obtained, that is, the curve 13_2 in Figure 13.
  • the abscissa of the frequency response curve can represent the frequency, and its unit is Hz; the ordinate of the frequency response curve can represent the vibration size, and its unit is dB.
  • the movement module 10 shown in Figure 3 has sufficient sensitivity, a higher low-frequency resonant frequency, and better high-frequency response.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Multimedia (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Headphones And Earphones (AREA)

Abstract

本申请主要是涉及换能装置及耳机，换能装置包括磁路系统、线圈、第一传振片和第二传振片，磁路系统包括磁体组件，线圈绕一平行于换能装置的振动方向的轴线套设在磁体组件的外侧，在振动方向上，第一传振片和第二传振片分别从磁体组件的相背两侧弹性支撑磁体组件。相较于相关技术中磁体组件的单侧被约束，本申请中磁体组件在换能装置的振动方向上的相背两侧分别被第一传振片和第二传振片弹性支撑，使之无明显晃动等异常振动，这样有利于增加换能装置振动的稳定性。

Description

换能装置及耳机 技术领域
本申请涉及电子设备的技术领域，具体是涉及换能装置及耳机。
背景技术
随着电子设备的不断普及，电子设备已经成为人们日常生活中不可或缺的社交、娱乐工具，人们对于电子设备的要求也越来越高。耳机这类电子设备，也已广泛地应用于人们的日常生活，它可以与手机、电脑等终端设备配合使用，以便于为用户提供听觉盛宴。其中，按照耳机的工作原理，一般可以分为气导式耳机和骨导式耳机；按照用户佩戴耳机的方式，一般又可以分为头戴式耳机、耳挂式耳机和入耳式耳机；按照耳机与电子设备之间的交互方式，一般还可以分为有线式耳机和无线式耳机。
发明内容
本申请实施例提供了一种换能装置，包括磁路系统、线圈、第一传振片和第二传振片，磁路系统包括磁体组件，线圈绕一平行于换能装置的振动方向的轴线套设在磁体组件的外侧，在振动方向上，第一传振片和第二传振片分别从磁体组件的相背两侧弹性支撑磁体组件。
本申请实施例提供了一种耳机，包括支撑组件和与支撑组件连接的机芯模组，支撑组件用于支撑机芯模组佩戴至佩戴位，机芯模组包括机芯壳体和上述实施例所述的换能装置，换能装置设置在机芯壳体的容置腔内。
本申请的有益效果是：相较于相关技术中磁体组件的单侧被约束，本申请中磁体组件在换能装置的振动方向上的相背两侧分别被第一传振片和第二传振片弹性支撑，使之无明显晃动等异常振动，这样有利于 增加换能装置振动的稳定性。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1中(a)至(c)是本申请提供的耳机多种实施例的佩戴示意图；
图2是本申请提供的机芯模组一实施例的结构示意图；
图3是本申请提供的耳机一实施例的结构示意图；
图4是本申请提供的耳机一实施例的结构示意图；
图5是本申请提供的耳机一实施例的结构示意图；
图6是本申请提供的耳机一实施例的结构示意图；
图7是本申请提供的耳机一实施例的结构示意图；
图8是本申请提供的第一传振片一实施例的俯视结构示意图；
图9是本申请提供的第二传振片一实施例的俯视结构示意图；
图10是本申请提供的第一传振片一实施例的俯视结构示意图；
图11是本申请提供的第二传振片一实施例的俯视结构示意图；
图12是本申请提供的换能装置一实施例的振动测试结果示意图；
图13是本申请提供的耳机各种实施例的频响曲线示意图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。本领域技术人员显式地和隐式地理解的是，本申请所描述的实施例可以与其他实施例相结 合。
参阅图1及图2，图1中(a)至(c)是本申请提供的耳机多种实施例的佩戴示意图，图2是本申请提供的机芯模组一实施例的结构示意图。
本申请例中，耳机100可以为音乐耳机、助听耳机、骨导耳机、助听器、音频眼镜、VR设备、AR设备等电子设备。
结合图1，耳机100可以包括机芯模组10和支撑组件20，机芯模组10与支撑组件20连接。其中，机芯模组10可以用于将电信号转化成机械振动，以便于用于通过耳机100听到声音；支撑组件20可以用于支撑机芯模组10佩戴至佩戴位，前述佩戴位可以为用户头部上的特定位置，例如头部的乳突、颞骨、顶骨、额骨等，再例如头部的左右两侧且在人体矢状轴上位于用户耳部前侧的位置。进一步地，机芯模组10产生的机芯振动可以主要经由用户的头骨等媒介传递(也即骨传导)而形成骨导声，也可以主要经由空气等媒介传递(也即气传导)而形成气导声。支撑组件20可以呈环状设置并绕设在用户的耳部上，例如图1中(a)所示；还可以设置成耳挂及后挂结构配合以绕设在头部的后侧，例如图1中(b)所示；也可以设置成头梁结构并绕设在用户的头顶上，例如图1中(c)所示。
需要说明的是：本申请所述的机芯模组10可以设置两个，两个机芯模组10均可以将电信号转化成机芯振动，主要是为了便于耳机100实现立体声音效。因此，在其他一些对立体声要求并不是特别高的应用场景下，例如听力患者助听、主持人直播提词等，耳机100也可以仅设置一个机芯模组10。
作为示例性地，支撑组件20可以包括两个耳挂组件和后挂组件，后挂组件的两端分别与对应的一个耳挂组件的一端连接，每一个耳挂组件背离后挂组件的另一端分别与对应的一个机芯模组10连接。进一步地，后挂组件可以设置呈弯曲状，以用于绕设在用户的头部后侧，耳挂组件也可以设置呈弯曲状，以用于挂设在用户的耳部和头部之间，进而便于实现耳机的佩戴需求。如此，以在耳机100处于佩戴状态时，两个 机芯模组10分别位于用户的头部的左侧和右侧，两个机芯模组10也在支撑组件20的配合作用下压持用户的头部，用户也能够听到耳机100输出的声音。
结合图2，机芯模组10可以包括机芯壳体11、换能装置12和振动面板13，换能装置12可以设置在机芯壳体11的容置腔内，振动面板13可以与换能装置12连接，并用于将换能装置12产生的机械振动传递至用户。其中，换能装置12设置成在通电状态下将电信号转化为机械振动，振动面板13可以在佩戴状态下与用户的皮肤接触，以通过用户的骨骼和组织作为媒介而作用于用户的听神经，进而形成骨导声。
进一步地，机芯模组10还可以包括减振片14，换能装置12可以通过减振片14悬挂在机芯壳体11的容置腔内，也即振动面板13的边缘与机芯壳体11的开口端断开。此时，因减振片14的存在，换能装置12产生的机械振动可以较少甚至不传递至机芯壳体11，从而在一定程度上避免机芯壳体11带动耳机100外部的空气振动，这样有利于降低耳机100的漏音。当然，为了降低耳机100的漏音，机芯壳体11上还可以开设至少一个用于连通机芯壳体11的容置腔与耳机100外部的通孔(俗称“降漏音孔”)，相关原理及其结构为本领域的技术人员所熟知，在此不再赘述。
进一步地，机芯模组10还可以包括与振动面板13连接的贴脸套15，贴脸套15用于与用户的皮肤接触，也即振动面板13可以通过贴脸套15与用户的皮肤接触。其中，贴脸套15的邵氏硬度可以小于振动面板13的邵氏硬度，也即贴脸套15可以比振动面板13更加柔软。例如：贴脸套15的材质为诸如硅胶的软质材料，振动面板13的材质为诸如聚碳酸酯、玻璃纤维增强塑料的硬质材料。如此，以改善耳机100的佩戴舒适度，并使得机芯模组10与用户的皮肤更加贴合，进而改善耳机100的音质。进一步地，贴脸套15可以与振动面板13可拆卸连接，以便于用户更换。
作为示例性地，换能装置12可以包括支架121、传振片122、磁路系统123和线圈124，传振片122可以连接支架121与磁路系统123， 以将磁路系统123悬挂在机芯壳体11的容置腔内，线圈124可以沿换能装置12的振动方向伸入磁路系统123的磁间隙内。其中，磁路系统123可以包括磁体组件1231和导磁罩1232，磁体组件1231固定在导磁罩1232的底部，导磁罩1232的侧壁与磁体组件1231在垂直于换能装置12的振动方向的方向上间隔设置以形成前述磁间隙。换言之，导磁罩1232可以为一端敞口的筒状结构。进一步地，线圈124可以与支架121连接，导磁罩1232的侧壁可以与传振片122连接。相应地，减振片14可以连接支架121与机芯壳体11，以将换能装置12悬挂在机芯壳体11的容置腔内；振动面板13可以与支架121连接。
值得注意的是：在诸如图2所示的机芯模组10中，磁体组件1231通过单侧连接的方式固定在导磁罩1232上，也即磁体组件1231的单侧被约束，并存在未被约束的另一侧，以允许线圈124相对于磁路系统123运动；在换能装置12的振动方向上，线圈124与导磁罩1232的底部需要存在一间距，以避免两者发生碰撞；在垂直于换能装置12的振动方向的方向上，线圈124分别与磁体组件1231和导磁罩1232需要存在一间距，以避免线圈124与磁体组件1231和导磁罩1232中的任意一者发生碰撞；换能装置12振动的过程中，线圈124与磁路系统123之间不仅具有沿其振动方向的相对运动，还可能存在绕其振动方向的扭转趋势，导致磁路系统123的磁间隙一定程度上会变大，以避免不必要的碰撞。
共同参阅图3至图7，图3是本申请提供的耳机一实施例的结构示意图，图4是本申请提供的耳机一实施例的结构示意图，图5是本申请提供的耳机一实施例的结构示意图，图6是本申请提供的耳机一实施例的结构示意图，图7是本申请提供的耳机一实施例的结构示意图。
与上述实施例的主要区别在于：本实施例中，结合图3至图7中至少一者，换能装置12可以包括磁路系统123、线圈124、第一传振片125和第二传振片126；磁路系统123可以包括磁体组件1231，线圈124可以绕一平行于换能装置12的振动方向的轴线套设在磁体组件1231的外侧，在换能装置12的振动方向上，第一传振片125和第二传振片126 可以分别从磁体组件1231的相背两侧弹性支撑磁体组件1231。如此，相较于磁体组件1231的单侧被约束，本申请中磁体组件1231在换能装置12的振动方向上的相背两侧被弹性支撑，使之无明显晃动等异常振动，这样有利于增加换能装置12振动的稳定性。
在一些实施方式中，结合图3至图6中任意一者，磁路系统123还可以包括绕平行于换能装置12的振动方向的轴线套设在线圈124外侧的导磁罩1232，也即导磁罩1232与磁体组件1231在垂直于换能装置12的振动方向的方向上间隔设置；第一传振片125的边缘区域和第二传振片126的边缘区域可以分别与导磁罩1232的两端连接。换言之，导磁罩1232可以为两端敞口的筒状结构。如此，相较于导磁罩1232为一端敞口的筒状结构，本实施例中导磁罩1232为两端敞口的筒状结构，有利于消除磁路123的音腔效应，从而降低耳机100的漏音。其中，结合图2，音腔效应主要是源于磁体组件1231与导磁罩1232形成一个半封闭的腔体，线圈124相对于磁路系统123运动时作用于前述半封闭的腔体内的空气，使之气压发生变化，产生漏音。相应地，线圈124可以伸入磁体组件1231与导磁罩1232之间的磁间隙内。当然，在其他一些诸如对磁体组件1231产生的磁场的集中度要求不是很高的实施方式中，导磁罩1232也可以替换成诸如塑胶支架的非磁性件。基于此，第一传振片125的边缘区域和第二传振片126的边缘区域可以分别与一塑胶支架的两端连接。
在其他一些实施方式中，结合图7，磁路系统123还可以包括与磁体组件1231在垂直于换能装置12的振动方向的方向上间隔设置的导磁罩1232，且磁体组件1231与导磁罩1232的底部连接。其中，第一传振片125和第二传振片126中的一者可以与振动面板13连接，另一者可以与机芯壳体11连接，以将磁路系统123悬挂在机芯壳体11内。例如：第一传振片125的中心区域与磁体组件1231连接，第一传振片125的边缘区域通过支架121与振动面板13连接；第二传振片126的中心区域和边缘区域中的一者通过导磁罩1232与磁体组件1231连接，另一者与机芯壳体11连接。再例如：第一传振片125的中心区域通过支架121 与振动面板13连接，第一传振片125的边缘区域通过导磁罩1232与磁体组件1231连接。换言之，类似于图2，导磁罩1232同样可以为一端敞口的筒状结构。相应地，线圈124可以伸入磁体组件1231与导磁罩1232之间的磁间隙内。
通过上述方式，不论磁路系统123是包括导磁罩1232还是包括替代导磁罩1232的塑胶支架，由于第一传振片125和第二传振片126在换能装置12的振动方向上从两侧约束磁体组件1231，使得换能装置12振动更加稳定。
进一步地，在第一传振片125和第二传振片126的自然状态下，第一传振片125的边缘区域与第一传振片125的中心区域可以不共面，第二传振片126的边缘区域与第二传振片126的中心区域可以不共面，以在第一传振片125和第二传振片126分别连接至磁体组件1231(具体可以为后文中提及的第一磁体1236和第二磁体1237，或者后文中提及的第一导磁板1234和第二导磁板1235)之后提供预紧力。其中，本申请所述的自然状态可以指第一传振片125和第二传振片126装配于换能装置12且换能装置12没有输入激励信号而不产生机械振动的情况下的结构状态。如此，由于预紧力的存在，第一传振片125和第二传振片126在换能装置12振动的过程中不会同时出现弹力为零的情况，这样有利于提高换能装置12振动的稳定性和线性。因此，第一传振片125和第二传振片126在装配于换能装置12之前可以呈平面状，以便于加工。
作为示例性地，在上述自然状态下，第一传振片125的边缘区域与第一传振片125的中心区域在轴向上的第一间距可以大于或者等于0.4mm，第二传振片126的边缘区域与第二传振片126的中心区域在轴向上的第二间距可以大于或者等于0.4mm。其中，如果第一间距和第二间距太小，容易导致第一传振片125和第二传振片126提供的预紧力太小而难以满足实际的使用需求，也容易导致第一传振片125和第二传振片126在换能装置12的振动过程中与磁体组件1231发生结构上的干涉。进一步地，第一间距和第二间距可以相等。
进一步地，结合图6，在换能装置12的振动方向上，第一传振片 125的中心区域可以相较于其边缘区域更加远离磁体组件1231，第二传振片126的中心区域可以相较于其边缘区域更加远离磁体组件1231。如此，有利于将第一传振片125和第二传振片126装配于换能装置12。例如：磁路系统123还可以包括穿设于磁体组件1231的连接件1239，连接件1239在换能装置12的振动方向上的长度大于磁体组件1231在换能装置12的振动方向上的厚度，第一传振片125和第二传振片126的中心区域可以分别固定在连接件1239的两端。如此，连接件1239可以将第一传振片125和第二传振片126沿换能装置12的振动方向撑开。
需要说明的是：当第一传振片125和第二传振片126装配于换能装置12且具有预设的预紧力之后，第一传振片125和第二传振片126的边缘区域可以分别与相应的中心区域不共面，例如图3至图6；第一传振片125和第二传振片126的边缘区域也可以分别与相应的中心区域共面。
在一些实施方式中，例如图3、图5及图6中任意一者，导磁罩1232可以与支架121连接，支架121则可以通过减振片14与机芯壳体11，以将换能装置12悬挂在机芯壳体11的容置腔内。此时，振动面板13可以与支架121连接，并与机芯壳体11的开口端断开。进一步地，减振片14的刚度与第一传振片125的刚度之间的比值可以介于0.1至5之间，减振片14的刚度与第二传振片126的刚度之间的比值可以介于0.1至5之间。其中，如果减振片14的刚度太小，则磁路系统123难以被减振片14稳定地悬挂在机芯壳体11内，这样容易导致换能装置12振动时的稳定性较差；反之，如果减振片14的刚度太大，则换能装置12的振动易于经由减振片14传递至机芯壳体11，这样容易导致耳机100的漏音过大。
需要说明的是：本申请所述的减振片14、第一传振片125和第二传振片126等结构的刚度可以通过相同或者相似的方式测量得到。其中，为了便于描述刚度的测量方式，下面以图8所示的第一传振片125为例进行说明：先将第一传振片125的边缘(例如第一外固定部1253)固定在诸如克力计的测试仪的固定台上，再将前述克力计的探头对准第一传 振片125上诸如质心、几何中心的测试点(例如第一内固定部1252)，然后在前述克力计的控制面板上输入多个位移的数值，并记录探头的受力、位移等参数之间的对应关系，以绘制成位移-受力曲线(其横轴和纵轴分别表示位移和力)，最后计算曲线中倾斜直线段的斜率，以得到第一传振片125的刚度。其中，每一位移可以表示探头移动的距离，探头移动可以引起第一传振片125产生一形变量，且每一位移所引起的第一传振片125的形变量可以不超过第一传振片125的最大形变量。进一步地，由于第一传振片125的形变滞后于探头的移动，使得位移-受力曲线会有一段几乎平行于横轴的曲线段，这段平行于横轴的曲线段在计算第一传振片125的刚度时可以不考虑。
在其他一些实施方式中，例如图4，第一传振片125和第二传振片126中任意一者的边缘区域可以通过卡接、胶接等组装方式中的一种或其组合与机芯壳体11的开口端连接。当然，振动面板13与机芯壳体11也可以为相同材质的一体成型结构件。
进一步地，在垂直于换能装置12的振动方向的方向上，线圈124与导磁罩1232之间的间隙可以小于线圈124与磁体组件1231之间的间隙。如此，相较于线圈124在垂直于换能装置12的振动方向的方向上分别与磁体组件1231和导磁罩1232需要存在一间距，本申请中磁体组件1231在换能装置12的振动方向上的相背两侧被弹性支撑，使之无需担心线圈124与导磁罩1232发生碰撞，这样有利于减小磁体组件1231与导磁罩1232之间的磁间隙在垂直于换能装置12的振动方向的方向上的尺寸，从而减小上述半封闭的腔体与磁路系统123外部的连通面积，阻碍因音腔效应产生的漏音的传播路径，也即抑制音腔效应，进而降低耳机100的漏音。其中，线圈124可以固定在导磁罩1232上，也即导磁罩1232与线圈124保持随动。如此，不仅有利于进一步减小前述磁间隙在垂直于换能装置12的振动方向的方向上的尺寸，还允许导磁罩1232兼作线圈124的短路环，有利于减小线圈124的电感，当然也有利于换能装置12散热。
在一些实施方式中，例如图3或者图4，磁体组件1231可以包括磁 体1233，以及在换能装置12的振动方向上位于磁体1233的相背两侧的第一导磁板1234和第二导磁板1235，第一传振片125可以从第一导磁板1234背离第二导磁板1235的一侧支撑磁体组件1231，第二传振片126可以从第二导磁板1235背离第一导磁板1234的一侧支撑磁体组件1231。例如：第一传振片125的中心区域与第一导磁板1234背离第二导磁板1235的一侧连接，第二传振片126的中心区域与第二导磁板1235背离第一导磁板1234的一侧连接。其中，第一导磁板1234和第二导磁板1235相背两侧的棱边可以进行倒角处理，以调整磁路系统123形成的磁场的分布情况。
类似于图5或者图6所示的实施方式，在换能装置12的振动方向上，第一导磁板1234和第二导磁板1235之间还可以夹设两个磁体，两个磁体的磁化方向不同，例如两个磁体彼此相向一端的极性相同且磁化方向垂直于两个磁体的交界处。
进一步地，在换能装置12的振动方向上，磁体组件1231的半厚处与线圈124的半高处可以等高。如此，有利于磁路系统123形成的磁场均匀地、集中地穿过线圈124。
作为示例性地，线圈124可以包括与第一传振片125朝向第二传振片126的一侧连接的第一线圈1241和与第二传振片126朝向第一传振片125的一侧连接的第二线圈1242，且第一线圈1241和第二线圈1242中电流的方向反向。换言之，换能装置12在双线圈的驱动下振动，这样有利于增加换能装置12的振动大小。其中，在换能装置12的振动方向上，由于第一导磁板1234和第二导磁板1235的厚度一般相等，使得第一线圈1241的半高处与第一导磁板1234的半厚处可以等高，第二线圈1242的半高处与第二导磁板1235的半厚处也可以等高，这样分别经由第一导磁板1234和第二导磁板1235调整之后的磁场可以分别均匀地、集中地穿过第一线圈1241和第二线圈1242。类似地，第一线圈1241与导磁罩1232在垂直于换能装置12的振动方向的方向上的间距可以小于第一线圈1241与第一导磁板1234在垂直于换能装置12的振动方向的方向上的间距，第二线圈1242与导磁罩1232在垂直于换能装置12 的振动方向的方向上的间距小于第二线圈1242与第二导磁板1235在垂直于换能装置12的振动方向的方向上的间距；例如第一线圈1241和第二线圈1242分别固定在导磁罩1232上。
在其他一些实施方式中，例如图5或者图6，磁体组件1231可以包括在换能装置12的振动方向上层叠设置的第一磁体1236和第二磁体1237；第一磁体1236和第二磁体1237的磁化方向不同，例如第一磁体1236和第二磁体1237的磁化方向相反且均垂直于两者的交界处；在换能装置12的振动方向上，第一传振片125可以从第一磁体1236背离第二磁体1237的一侧弹性支撑磁体组件1231，第二传振片126可以从第二磁体1237背离第一磁体1236的一侧弹性支撑磁体组件1231。例如：第一传振片125的中心区域与第一磁体1236背离第二磁体1237的一侧连接，第二传振片126的中心区域与第二磁体1237背离第一磁体1236的一侧连接。基于此，线圈124沿垂直于换能装置12的振动方向的方向正投影至磁体组件1231的外周面时可以与第一磁体1236和第二磁体1237的交界处重叠。如此，有利于磁路系统123形成的磁场均匀地、集中地穿过线圈124。
进一步地，磁体组件1231还可以包括夹设在第一磁体1236和第二磁体1237之间的导磁板1238，线圈124沿垂直于换能装置12的振动方向的方向正投影至磁体组件1231的外周面时可以与导磁板1238的侧周面重叠。基于此，第一磁体1236和第二磁体1237的磁化方向可以相反，且均垂直于导磁板1238朝向第一磁体1236或者第二磁体1237的表面。如此，有利于磁路系统123形成的磁场集中在其内部，降低漏磁。类似地，在换能装置12的振动方向上，导磁板1238可以位于线圈124的半高处。
类似于图3或者图4所示的实施方式，在换能装置12的振动方向上，第一磁体1236和第二磁体1237彼此相背的两侧可以分别设置一导磁板，这样有利于进一步降低漏磁。
进一步地，线圈124的两端可以分别与第一传振片125和第二传振片126连接，也即在换能装置12的振动方向上，线圈124的高度可以 大于或者等于磁体组件1231的厚度。如此，相较于线圈124在换能装置12的振动方向上与导磁罩1232的底部需要存在一间距，本申请中磁体组件1231在换能装置12的振动方向上的相背两侧被弹性支撑，使之无需担心线圈124与导磁罩1232发生碰撞，以允许增加线圈124在换能装置12的振动方向上的高度，这样有利于增大线圈124与磁体组件1231在垂直于换能装置12的振动方向的方向上的重叠面积，进而增加磁路系统123的磁场利用率，提高换能装置12的灵敏度及可靠性。
进一步地，磁体组件1231、线圈124和导磁罩1232沿垂直于换能装置12的振动方向的方向正投影所形成的重叠区域在前述振动方向上的高度与磁体组件1231、线圈124和导磁罩1232在前述振动方向上的高度之间的大小关系在一定程度上会影响磁路系统123的磁场分布及其利用率。
在一些实施例中，磁体组件1231、线圈124和导磁罩1232沿垂直于换能装置12的振动方向的方向正投影所形成的重叠区域在前述振动方向上的高度与磁体组件1231在前述振动方向上的高度之间的比值可以介于0.15与0.5之间。如此，线圈124可以主要是利用磁体组件1231产生的磁场中相对集中、均匀的部分，这样有利于增加换能装置12振动的稳定性。
在其他一些实施例中，磁体组件1231、线圈124和导磁罩1232沿垂直于换能装置12的振动方向的方向正投影所形成的重叠区域在前述振动方向上的高度与线圈124在前述振动方向上的高度之间的比值可以介于0.53与0.83之间。如此，磁路系统123形成的磁场可以更多地穿过线圈124，这样有利于磁路系统123的磁场利用率。
在其他另一些实施例中，磁体组件1231、线圈124和导磁罩1232沿垂直于换能装置12的振动方向的方向正投影所形成的重叠区域在前述振动方向上的高度与导磁罩1232在前述振动方向上的高度之间的比值可以介于0.12与0.32之间。如此，导磁罩1232可以使得磁体组件1231产生的磁场中相对集中、均匀的部分更多，这样有利于增加换能装置12振动的稳定性。
共同参阅图8至图11，图8是本申请提供的第一传振片一实施例的俯视结构示意图，图9是本申请提供的第二传振片一实施例的俯视结构示意图，图10是本申请提供的第一传振片一实施例的俯视结构示意图，图11是本申请提供的第二传振片一实施例的俯视结构示意图。
结合图8及图9，第一传振片125可以包括第一辐状部1251，以及与第一辐状部1251连接的第一内固定部1252和第一外固定部1253，以允许第一传振片125通过第一内固定部1252和第一外固定部1253分别与磁体组件1231和导磁罩1232的一端连接；第二传振片126可以包括第二辐状部1261，以及与第二辐状部1261连接的第二内固定部1262和第二外固定部1263，以允许第二传振片126通过第二内固定部1262和第二外固定部1263分别与磁体组件1231和导磁罩1232的另一端连接。其中，第一辐状部1251可以包括从第一传振片125的中心向外螺旋状展开的多个第一辐条，例如图8所示的三个第一辐条，以使得第一内固定部1252与第一外固定部1253之间的区域呈镂空结构，从而使得第一传振片125具有预设的弹性系数；第二辐状部1261可以包括从第二传振片126的中心向外螺旋状展开的多个第二辐条，例如图9所示的三个第二辐条，以使得第二内固定部1262与第二外固定部1263之间的区域呈镂空结构，从而使得第二传振片126具有预设的弹性系数。进一步地，沿换能装置12的振动方向观察，第一传振片125和第二传振片126在同一位置处的第一辐条的螺旋方向和第二辐条的螺旋方向互为反向，例如图8中第一辐条的螺旋方向为顺时针而图9中第二辐条的螺旋方向为逆时针。如此，当线圈124和磁路系统123在换能装置12的振动过程中绕其振动方向出现扭转趋势时，第一传振片125和第二传振片126中的一者可以阻碍这种扭转趋势，从而避免不必要的碰撞，这样有利于进一步缩小磁路系统123的磁间隙。
进一步地，结合图10，第一辐状部1251沿第一传振片125的径向可以进一步划分为彼此嵌套的第一子区域125A和第二子区域125B，第一子区域125A和第二子区域125B内的第一辐条的螺旋方向互为反向，例如图10中位于内侧的第一子区域125A内的第一辐条的螺旋方向为顺 时针而位于外侧的第二子区域125B内的第一辐条的螺旋方向为逆时针。如此，当线圈124和磁路系统123在换能装置12的振动过程中绕其振动方向出现扭转趋势时，第一传振片125因具有内外螺旋方向互为反向的第一辐条自身即可阻碍这种扭转趋势，从而避免不必要的碰撞，同样有利于进一步缩小磁路系统123的磁间隙。其中，第一传振片125还可以包括第一过渡部1254，第一子区域125A内的第一辐条和第二子区域125B内的第一辐条通过第一过渡部1254连接。进一步地，在第一传振片125的周向上，第一子区域125A内的任意一个第一辐条与第一过渡部1254之间的连接点可以位于第二子区域125B内的相邻两个第一辐条与第一过渡部1254之间的连接点之间。
类似地，结合图11，第二辐状部1261沿第二传振片126的径向可以进一步划分为彼此嵌套的第三子区域126C和第四子区域126D，第三子区域126C和第四子区域126D内的第二辐条的螺旋方向互为反向，例如图11中位于内侧的第三子区域126C内的第二辐条的螺旋方向为逆时针而位于外侧的第四子区域126D内的第二辐条的螺旋方向为顺时针。如此，当线圈124和磁路系统123在换能装置12的振动过程中绕其振动方向出现扭转趋势时，第二传振片126因具有内外螺旋方向互为反向的第一辐条自身即可阻碍这种扭转趋势，从而避免不必要的碰撞，同样有利于进一步缩小磁路系统123的磁间隙。其中，第二传振片126还可以包括第二过渡部1264，第三子区域126C内的第二辐条和第四子区域126D内的第二辐条通过第二过渡部1264连接。进一步地，在第二传振片126的周向上，第三子区域126C内的任意一个第二辐条与第二过渡部1264之间的连接点可以位于第四子区域126D内的相邻两个第二辐条与第二过渡部1264之间的连接点之间。
进一步地，沿换能装置12的振动方向观察，第一传振片125和第二传振片126可以呈矩形设置，使得两者的角落可以选择性地被部分去除以容纳线圈124的引出线的焊点。
共同参阅图12及图13，图12是本申请提供的换能装置一实施例的振动测试结果示意图，图13是本申请提供的耳机各种实施例的频响曲 线示意图。
在图3至图6所示的实施方式中，由于第一传振片125和第二传振片126均是在换能装置12的振动方向上弹性支撑磁体组件1231的相背两侧，使得他们的基本原理及其相关结构大体一致，因此为了便于描述，可以从图3至图6所示的实施方式中选择一种进行示例性的说明。例如：在不同大小的驱动电压下，对图3所示的实施方式中的换能装置12进行振动测试，相应的振动测试结果如图12所示；图12中曲线12_1至12_5所代表的驱动电压逐渐增大。具体地，先将磁路系统123、线圈124、第一传振片125和第二传振片126作为一个整体从机芯模组10内拆卸出来；再将导磁罩1232固定在诸如激光测振仪的测试仪的固定台上，且线圈124能够相对于磁体组件1231振动；然后向线圈124输入驱动电压使得换能装置12振动，并基于激光三角测量法测量磁体组件1231在换能装置12的振动过程中的位移大小(也即振幅)。因此，图12中横坐标和纵坐标可以分别表示频率和位移大小，频率的单位为Hz，位移大小的单位为mm。
结合图12，随着驱动电压逐渐增大，曲线12_1至12_5均较为平滑，表明：换能装置12振动稳定，无明显晃动等异常振动。除此之外，换能装置12的谐振峰的峰值谐振频率同样没有明显变化。
进一步地，将图2所示的实施方式中的机芯壳体11固定在诸如激光测振仪的测试仪的固定台上，且振动面板13能够相对于机芯壳体11振动，同样基于激光三角测量法测量振动面板13在换能装置12的振动过程中的振动位移(也即振幅)，振动面板13的振动位移可以换算成振动面板13的加速度，进而换算成振动面板13的振动大小，以得到振动面板13振动的频响曲线，也即图13中曲线13_1可以表示图2所示的实施方式中机芯模组10的频响曲线。同样的测试方式及其测量条件，可以得到图3所示的实施方式中机芯模组10的频响曲线，也即图13中曲线13_2。其中，本申请中，频响曲线的横坐标可以表示频率，其单位为Hz；频响曲线的纵坐标可以表示振动大小，其单位为dB。
结合图13，相较于图2所示的机芯模组10，图3所示的机芯模组 10具有足够的灵敏度，更高的低频谐振频率，以及更优异的高频相应。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种换能装置，其特征在于，所述换能装置包括磁路系统、线圈、第一传振片和第二传振片，所述磁路系统包括磁体组件，所述线圈绕一平行于所述换能装置的振动方向的轴线套设在所述磁体组件的外侧，在所述振动方向上，所述第一传振片和所述第二传振片分别从所述磁体组件的相背两侧弹性支撑所述磁体组件。
  2. 根据权利要求1所述的换能装置，其特征在于，所述磁体组件包括沿所述振动方向层叠设置的第一磁体和第二磁体，所述第一磁体和所述第二磁体的磁化方向不同，所述第一传振片的中心区域与所述第一磁体背离所述第二磁体的一侧连接，所述第二传振片的中心区域与所述第二磁体背离所述第一磁体的一侧连接。
  3. 根据权利要求2所述的换能装置，其特征在于，所述磁体组件还包括夹设在所述第一磁体与所述第二磁体之间的导磁板，所述线圈沿垂直于所述振动方向的方向正投影至所述磁体组件的外周面时与所述导磁板的侧周面重叠。
  4. 根据权利要求3所述的换能装置，其特征在于，所述第一磁体和所述第二磁体的磁化方向相反，且均垂直于所述导磁板朝向所述第一磁体或者所述第二磁体的表面。
  5. 根据权利要求1所述的换能装置，其特征在于，所述磁体组件包括磁体，以及与所述磁体沿所述振动方向的相背两侧分别连接的第一导磁板和第二导磁板，所述第一传振片的中心区域与所述第一导磁板背离所述第二导磁板的一侧连接，所述第二传振片的中心区域与所述第二导磁板背离所述第一导磁板的一侧连接。
  6. 根据权利要求5所述的换能装置，其特征在于，在所述振动方向上，所述磁体的半厚处与所述线圈的半高处等高。
  7. 根据权利要求1所述的换能装置，其特征在于，所述磁路系统还包括绕所述轴线套设在所述线圈外侧的导磁罩，所述第一传振片的边缘区域与所述导磁罩的一端连接，所述第二传振片的边缘区域与所述导 磁罩的另一端连接。
  8. 根据权利要求7所述的换能装置，其特征在于，在垂直于所述振动方向的方向上，所述线圈与所述导磁罩之间的间隙小于所述线圈与所述磁体组件之间的间隙。
  9. 根据权利要求7所述的换能装置，其特征在于，所述磁体组件、所述线圈和所述导磁罩沿垂直于所述振动方向的方向正投影所形成的重叠区域在所述振动方向上的高度与所述磁体组件在所述振动方向上的高度之间的比值介于0.15与0.5之间。
  10. 根据权利要求7所述的换能装置，其特征在于，所述磁体组件、所述线圈和所述导磁罩沿垂直于所述振动方向的方向正投影所形成的重叠区域在所述振动方向上的高度与所述线圈在所述振动方向上的高度之间的比值介于0.53与0.83之间。
  11. 根据权利要求7所述的换能装置，其特征在于，所述磁体组件、所述线圈和所述导磁罩沿垂直于所述振动方向的方向正投影所形成的重叠区域在所述振动方向上的高度与所述导磁罩在所述振动方向上的高度之间的比值介于0.12与0.32之间。
  12. 根据权利要求1所述的换能装置，其特征在于，在所述第一传振片和所述第二传振片的自然状态下，所述第一传振片的边缘区域与所述第一传振片的中心区域不共面，所述第二传振片的边缘区域与所述第二传振片的中心区域不共面，以在所述第一传振片和所述第二传振片分别连接至所述第一磁体和所述第二磁体之后提供预紧力。
  13. 根据权利要求12所述的换能装置，其特征在于，所述第一传振片的边缘区域与所述第一传振片的中心区域在轴向上的间距大于或者等于0.4，所述第二传振片的边缘区域与所述第二传振片的中心区域在轴向上的间距大于或者等于0.4。
  14. 根据权利要求1所述的换能装置，其特征在于，在所述振动方向上，所述第一传振片的中心区域相较于所述第一传振片的边缘区域更加远离所述磁体组件，所述第二传振片的中心区域相较于所述第二传振片的边缘区域更加远离所述磁体组件。
  15. 根据权利要求14所述的换能装置，其特征在于，所述磁路系统包括穿设于所述磁体组件的连接件，所述连接件在所述振动方向上的长度大于所述磁体组件在所述振动方向上的厚度，所述第一传振片和所述第二传振片的中心区域分别固定在所述连接件的两端。
  16. 根据权利要求1所述的换能装置，其特征在于，所述第一传振片包括第一辐状部，所述第一辐状部包括从所述第一传振片的中心向外螺旋状展开的多个第一辐条，所述第二传振片包括第二辐状部，所述第二辐状部包括从所述第二传振片的中心向外螺旋状展开的多个第二辐条，沿所述振动方向观察，所述第一传振片和所述第二传振片在同一位置处的所述第一辐条的螺旋方向和所述第二辐条的螺旋方向互为反向。
  17. 根据权利要求1所述的换能装置，其特征在于，所述第一传振片包括第一辐状部，所述第一辐状部包括从所述第一传振片的中心向外螺旋状展开的多个第一辐条，所述第一辐状部沿所述第一传振片的径向进一步划分为彼此嵌套的第一子区域和第二子区域，所述第一子区域和所述第二子区域内的所述第一辐条的螺旋方向互为反向，所述第二传振片包括第二辐状部，所述第二辐状部包括从所述第二传振片的中心向外螺旋状展开的多个第二辐条，所述第二辐状部沿所述第二传振片的径向进一步划分为彼此嵌套的第三子区域和第四子区域，所述第三子区域和所述第四子区域内的所述第二辐条的螺旋方向互为反向。
  18. 一种耳机，其特征在于，所述耳机包括支撑组件和与所述支撑组件连接的机芯模组，所述支撑组件用于支撑所述机芯模组佩戴至佩戴位，所述机芯模组包括机芯壳体和权利要求1-17任一项所述的换能装置，所述换能装置设置在所述机芯壳体的容置腔内。
  19. 根据权利要求18所述的耳机，其特征在于，所述机芯模组还包括减振片和振动面板，所述换能装置通过所述减振片悬挂在所述容置腔内，所述振动面板与所述换能装置连接，并用于将所述换能装置产生的机械振动传递至用户。
  20. 根据权利要求19所述的耳机，其特征在于，所述减振片的刚度与所述第一传振片的刚度之间的比值介于0.1至5之间，所述减振片 的刚度与所述第二传振片的刚度之间的比值介于0.1至5之间。
PCT/CN2022/106300 2022-07-18 2022-07-18 换能装置及耳机 WO2024016119A1 (zh)

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CN107426647A (zh) * 2017-09-24 2017-12-01 深圳市韶音科技有限公司 传振片以及使用该传振片的骨传导扬声器
CN207995381U (zh) * 2018-03-20 2018-10-19 孔玉亮 骨传导喇叭
CN110611866A (zh) * 2018-06-15 2019-12-24 深圳市韶音科技有限公司 一种骨传导扬声器及耳机
US20210168483A1 (en) * 2018-06-15 2021-06-03 Shenzhen Voxtech Co., Ltd. Speaker device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107426647A (zh) * 2017-09-24 2017-12-01 深圳市韶音科技有限公司 传振片以及使用该传振片的骨传导扬声器
CN207995381U (zh) * 2018-03-20 2018-10-19 孔玉亮 骨传导喇叭
CN110611866A (zh) * 2018-06-15 2019-12-24 深圳市韶音科技有限公司 一种骨传导扬声器及耳机
US20210168483A1 (en) * 2018-06-15 2021-06-03 Shenzhen Voxtech Co., Ltd. Speaker device

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