WO2024014672A1 - Caméra et dispositif électronique la comprenant - Google Patents

Caméra et dispositif électronique la comprenant Download PDF

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Publication number
WO2024014672A1
WO2024014672A1 PCT/KR2023/005826 KR2023005826W WO2024014672A1 WO 2024014672 A1 WO2024014672 A1 WO 2024014672A1 KR 2023005826 W KR2023005826 W KR 2023005826W WO 2024014672 A1 WO2024014672 A1 WO 2024014672A1
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WO
WIPO (PCT)
Prior art keywords
magnet
camera
disposed
driver
carrier
Prior art date
Application number
PCT/KR2023/005826
Other languages
English (en)
Korean (ko)
Inventor
유영복
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220108855A external-priority patent/KR20240010374A/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2024014672A1 publication Critical patent/WO2024014672A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G03B13/36—Autofocus systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/04—Vertical adjustment of lens; Rising fronts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/035—DC motors; Unipolar motors

Definitions

  • This disclosure relates to cameras and electronic devices including the same.
  • a camera can record an image of a subject using light.
  • the camera may be configured to adjust the focus of the lens when photographing a subject.
  • the focus of a lens can be automatically adjusted by an actuator.
  • the camera includes a lens having an optical axis, a first carrier configured to move in a first direction substantially parallel to the optical axis direction, and a first carrier disposed on a side surface of the first carrier and magnetized in the first direction.
  • a first actuator including one magnet, a first coil facing the first magnet, and a first driver disposed in the first direction from the first magnet, a yoke facing the first magnet and the first coil , and may include a printed circuit board including an image sensor disposed in the optical axis direction from the lens.
  • an electronic device may include a housing and a camera disposed in the housing.
  • the camera includes a lens having an optical axis, a first carrier configured to move in a first direction substantially parallel to the optical axis direction, a first magnet disposed on a side surface of the first carrier and magnetized in the first direction, and the first magnet disposed on a side surface of the first carrier and magnetized in the first direction.
  • a first actuator including a first coil facing a magnet and a first driver disposed in the first direction from the first magnet, a yoke facing the first magnet and the first coil, and from the lens It may include a printed circuit board including an image sensor disposed in the optical axis direction.
  • a camera includes a lens having an optical axis, a carrier configured to move in a first direction intersecting the optical axis direction, a magnet disposed on a side surface of the carrier and magnetized in the first direction, and when facing the magnet, It may include an actuator including a coil, and a driver disposed from the magnet in a second direction parallel to the optical axis direction and intersecting the first direction.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG. 2A is a perspective view of an electronic device according to an embodiment.
  • Figure 2b is a perspective view of an electronic device according to one embodiment.
  • Figure 2C is an exploded perspective view of an electronic device according to an embodiment.
  • Figure 3 is a block diagram of a camera module according to one embodiment.
  • Figure 4 is a perspective view of a camera according to one embodiment.
  • Figure 5 is an exploded perspective view of a camera according to an embodiment.
  • FIG. 6 is a cross-sectional view taken along line 6-6 of the camera of FIG. 4 according to an embodiment.
  • Figure 7 is a diagram showing a magnet and driver in a camera according to an embodiment.
  • Figure 8 is a perspective view of a yoke according to one embodiment.
  • Figure 9 is a perspective view of a yoke according to one embodiment.
  • Figure 10 is an exploded perspective view of a camera according to an embodiment.
  • Figure 11 is a cross-sectional view of a camera according to one embodiment.
  • Figure 12 is a diagram showing a magnet and driver in a camera according to an embodiment.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. You can.
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Embodiments of this document include one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140).
  • a processor e.g., processor 120
  • a device e.g., electronic device 101
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • the method according to the embodiments disclosed in this document may be provided and included in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component eg, a module or program of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or Alternatively, one or more other operations may be added.
  • FIG. 2A is a perspective view of an electronic device according to an embodiment.
  • Figure 2b is a perspective view of an electronic device according to one embodiment.
  • Figure 2C is an exploded perspective view of an electronic device according to an embodiment.
  • the electronic device 201 (e.g., the electronic device 101 of FIG. 1) has a first side 210a (e.g., the front) and a second side 210b (e.g., the back). ), and a housing 210 having a third surface 210c (eg, side) surrounding the space between the first surface 210a and the second surface 210b.
  • first side 210a e.g., the front
  • second side 210b e.g., the back
  • a housing 210 having a third surface 210c (eg, side) surrounding the space between the first surface 210a and the second surface 210b.
  • the first surface 210a may be formed at least in part by a substantially transparent first plate 211a.
  • the first plate 211a may include a glass plate or a polymer plate including at least one coating layer.
  • the second surface 210b may be formed by a substantially opaque second plate 211b.
  • the second plate 211b may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination thereof.
  • the third surface 210c may be formed by a frame 211c that is combined with the first plate 211a and the second plate 211b and includes metal and/or polymer.
  • the second plate 211b and the frame 211c may be formed seamlessly. In one embodiment, the second plate 211b and the frame 211c may be formed of substantially the same material (eg, aluminum).
  • the first plate 211a may include a plurality of first edge areas 212a-1.
  • a plurality of first edge areas 212a-1 may face the second plate 211b from at least a portion of the first surface 210a.
  • a plurality of first edge areas 212a-1 may contact the frame 211c.
  • the plurality of first edge areas 212a-1 may extend in one direction (eg, +/-Y direction).
  • the first plate 211a may include a plurality of second edge areas 212a-2.
  • a plurality of second edge areas 212a-2 may face the second plate 211b from at least a portion of the first surface 210a.
  • a plurality of second edge areas 212a-2 may contact the frame 211c.
  • the plurality of second edge areas 212a-2 may extend in a direction different from the extension direction (e.g. +/-Y direction) of the plurality of first edge areas 212a-1 (e.g. +/-X direction). You can.
  • the first plate 211a may include a plurality of third edge areas 212a-3.
  • a plurality of third edge areas 212a-3 may face the second plate 211b from at least a portion of the first surface 210a.
  • a plurality of third edge areas 212a-3 may contact the frame 211c.
  • a plurality of third edge areas 212a-3 may be disposed between a plurality of first edge areas 212a-1 and a plurality of second edge areas 212a-2.
  • the second plate 211b may include a plurality of fourth edge areas 212b-1.
  • the plurality of fourth edge areas 212b-1 may face the first plate 211a from at least a portion of the second surface 210b.
  • the plurality of fourth edge areas 212b-1 may contact the frame 211c.
  • the plurality of fourth edge areas 212b-1 may extend in one direction (eg, +/-Y direction).
  • the second plate 211b may include a plurality of fifth edge areas 212b-2.
  • the plurality of fifth edge areas 212b-2 may face the first plate 211a from at least a portion of the second surface 210b.
  • the plurality of fifth edge areas 212b-2 may contact the frame 211c.
  • the plurality of fifth edge regions 212b-2 may extend in a direction (e.g., +/-X direction) different from the extension direction (e.g., +/-Y direction) of the plurality of fourth edge regions 212b-1. You can.
  • the second plate 211b may include a plurality of sixth edge areas 212b-3.
  • a plurality of sixth edge areas 212b-3 may face the first plate 211a from at least a portion of the second surface 210b.
  • a plurality of sixth edge areas 212b-3 may contact the frame 211c.
  • a plurality of sixth edge areas 212b-3 may be disposed between a plurality of fourth edge areas 212b-1 and a plurality of fifth edge areas 212b-2.
  • the electronic device 201 may include a display 261 (eg, the display module 160 of FIG. 1).
  • the display 261 may be located on the first side 210a.
  • the display 261 includes at least a portion of the first plate 211a (e.g., a plurality of first edge regions 212a-1, a plurality of second edge regions 212a-2, and/or It may be visible through a plurality of third edge regions 212a-3.
  • the display 261 may have a shape substantially the same as the shape of the outer edge of the first plate 211a. In an embodiment, the edge of the display 261 may substantially coincide with the outer edge of the first plate 211a.
  • the display 261 may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.
  • the display 261 may include a screen display area 261a that is visually exposed and displays content through pixels.
  • the screen display area 261a may include a sensing area 261a-1.
  • the sensing area 261a-1 may overlap with at least a portion of the screen display area 261a.
  • the sensing area 261a-1 may allow the transmission of an input signal related to the sensor module 276 (eg, the sensor module 176 of FIG. 1).
  • the sensing area 261a-1 can display content similarly to the screen display area 261a that does not overlap the sensing area 261a-1.
  • the sensing area 261a-1 may display content while the sensor module 276 is not operating.
  • the screen display area 261a may include a camera area 261a-2.
  • Camera area 261a-2 may allow transmission of optical signals associated with the first camera module 280a (eg, camera module 180 of FIG. 1).
  • At least a portion of the camera area 261a-2 that overlaps the screen display area 261a may display content similarly to the screen display area 261a that does not overlap the camera area 261a-2.
  • the camera area 261a-2 may display content while the first camera module 280a is not operating.
  • the electronic device 201 may include an audio module 270 (eg, the audio module 170 of FIG. 1). In one embodiment, audio module 270 may be located on third side 210c. In one embodiment, the audio module 270 may acquire sound through at least one hole.
  • the electronic device 201 may include a sensor module 276.
  • sensor module 276 may be located on first side 210a.
  • the sensor module 276 may form a sensing area 261a-1 in at least a portion of the screen display area 261a.
  • the sensor module 276 may receive an input signal passing through the sensing area 261a-1 and generate an electrical signal based on the received input signal.
  • the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound).
  • the input signal may include a signal related to the user's biometric information (eg, fingerprint).
  • the electronic device 201 may include a first camera module 280a (eg, the camera module 180 of FIG. 1).
  • the first camera module 280a may be located on the first side 210a. In one embodiment, at least a portion of the first camera module 280a may be located below the display 261. In one embodiment, the first camera module 280a may receive an optical signal passing through the camera area 261a-2.
  • the electronic device 201 may include a second camera module 280b (eg, the camera module 180 of FIG. 1).
  • the second camera module 280b may be located on the second side 210b.
  • the second camera module 280b may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
  • the electronic device 201 may include a flash 280c.
  • Flash 280c may be located on second side 210b.
  • flash 280c may include a light emitting diode or xenon lamp.
  • the electronic device 201 may include an audio output module 255 (eg, the audio output module 155 of FIG. 1).
  • the sound output module 255 may be located on the third side 210c.
  • the audio output module 255 may include one or more holes.
  • the electronic device 201 may include an input module 250 (eg, the input module 150 of FIG. 1). In one embodiment, the input module 250 may be located on the third side 210c. In one embodiment, the input module 250 may include at least one key input device.
  • the electronic device 201 may include a connection terminal 278 (eg, the connection terminal 178 in FIG. 1).
  • the connection terminal 278 may be located on the third side 210c.
  • the connection terminal 278 is located substantially in the center of the third side 210c, with the connection terminal 278 as the reference.
  • the audio output module 255 may be located on one side (e.g., right side).
  • the electronic device 201 may include a support 240, a first circuit board 251, a second circuit board 252, and a battery 289 (e.g., battery 189 in FIG. 1). You can. At least a portion of the support 240 may form the housing 210 together with the first plate 211a and the second plate 211b.
  • the support 240 may include a first frame structure 241, a second frame structure 243, and a plate structure 242.
  • the first frame structure 241 may surround the edge of the plate structure 242.
  • the first frame structure 241 may connect the edge of the first plate 211a and the edge of the second plate 211b.
  • the first frame structure 241 may surround the space between the first plate 211a and the second plate 211b. At least a portion of the first frame structure 241 may form the third surface 210c of the electronic device 201.
  • the second frame structure 243 may be positioned between the first frame structure 241 and the second plate 211b.
  • the first frame structure 241 and the second frame structure 243 may at least partially form the frame 211c.
  • the plate structure 242 may include a first part 242a that accommodates the first circuit board 251 and a second part 242b that accommodates the second circuit board 252.
  • the display 261 may be located on one side (eg, the lower surface or the +Z-axis direction) of the plate structure 242.
  • the first circuit board 251 and the second circuit board 252 may be located on the other surface (eg, top surface or -Z axis direction) of the plate structure 242.
  • plate structure 242 may include opening 245.
  • Opening 245 may be located between first portion 242a and second portion 242b. Opening 245 may pass through both sides of plate structure 242. Opening 245 can accommodate battery 289.
  • one or more embodiment(s) disclosed in this document may include electronic devices of various shapes/forms (e.g., foldable electronic devices, slideable electronic devices, digital cameras, digital video devices) in addition to the electronic devices shown in FIGS. 2A to 2C. It can also be applied to cameras, tablets, electronic devices in the form of notes, and other electronic devices).
  • electronic devices of various shapes/forms e.g., foldable electronic devices, slideable electronic devices, digital cameras, digital video devices
  • Figure 3 is a block diagram of a camera module according to one embodiment.
  • the camera module 380 (e.g., the camera module 180 in FIG. 1 or the first camera module 280a and/or the second camera module 280b in FIGS. 2A to 2C) includes a lens. It may include an assembly 310, a flash 320, an image sensor 330, an image stabilizer 340, a memory 350 (eg, buffer memory), or an image signal processor 360.
  • the lens assembly 310 may collect light emitted from a subject that is the target of image capture. Lens assembly 310 may include one or more lenses.
  • the camera module 380 may include a plurality of lens assemblies 310.
  • the camera module 380 may form, for example, a dual camera, a 360-degree camera, or a spherical camera.
  • Some of the plurality of lens assemblies 310 have the same lens properties (e.g., angle of view, focal length, autofocus, f number, or optical zoom), or at least one lens assembly is different from another lens assembly. It may have one or more lens properties that are different from the lens properties of .
  • the lens assembly 310 may include, for example, a wide-angle lens or a telephoto lens.
  • the flash 320 may emit light used to enhance light emitted or reflected from a subject.
  • the flash 320 may include one or more light emitting diodes (eg, red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp.
  • the image sensor 330 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 310 into an electrical signal.
  • the image sensor 330 is one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having different properties or a plurality of image sensors having different properties.
  • Each image sensor included in the image sensor 330 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.
  • CCD charged coupled device
  • CMOS complementary metal oxide semiconductor
  • the image stabilizer 340 moves at least one lens or image sensor 330 included in the lens assembly 310 in a specific direction in response to the movement of the camera module 380 or the electronic device 301 including the same.
  • the operating characteristics of the image sensor 330 can be controlled (e.g., adjusting read-out timing, etc.). This allows to compensate for at least some of the negative effects of said movement on the image being captured.
  • the image stabilizer 340 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 380. It is possible to detect such movement of the camera module 380 or the electronic device 301 using .
  • the image stabilizer 340 may be implemented as, for example, an optical image stabilizer.
  • the memory 350 may at least temporarily store at least a portion of the image acquired through the image sensor 330 for the next image processing task. For example, when image acquisition is delayed due to the shutter or when multiple images are acquired at high speed, the acquired original image (e.g., Bayer-patterned image or high-resolution image) is stored in the memory 350. , the corresponding copy image (e.g., low resolution image) may be previewed through the display module 360. Thereafter, when a specified condition is satisfied (eg, user input or system command), at least a portion of the original image stored in the memory 350 may be obtained and processed, for example, by the image signal processor 360. According to one embodiment, the memory 350 may be configured as at least part of the memory 330 or as a separate memory that operates independently.
  • a specified condition eg, user input or system command
  • the image signal processor 360 may perform one or more image processes on an image acquired through the image sensor 330 or an image stored in the memory 350.
  • the one or more image processes may include, for example, depth map creation, three-dimensional modeling, panorama creation, feature point extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring). may include blurring, sharpening, or softening.
  • the image signal processor 360 may include at least one of the components included in the camera module 380 (e.g., an image sensor). (330)) may perform control (e.g., exposure time control, lead-out timing control, etc.).
  • the image processed by the image signal processor 360 is stored back in the memory 350 for further processing.
  • the image signal processor 360 may be configured as at least part of a processor (e.g., processor 120), or may be configured as a separate processor that operates independently of the processor. Image signal processor 360 If the processor is configured with a separate processor, at least one image processed by the image signal processor 360 is displayed through a display module (e.g., display module 160) as is or after additional image processing by the processor. can be displayed.
  • a display module e.g., display module 160
  • the electronic device 301 may include a plurality of camera modules 380, each having different properties or functions.
  • at least one of the plurality of camera modules 380 may be a wide-angle camera and at least another one may be a telephoto camera.
  • at least one of the plurality of camera modules 380 may be a front camera, and at least another one may be a rear camera.
  • Figure 4 is a perspective view of a camera according to one embodiment.
  • Figure 5 is an exploded perspective view of a camera according to an embodiment.
  • FIG. 6 is a cross-sectional view taken along line 6-6 of the camera of FIG. 4 according to an embodiment.
  • a camera 400 may include a lens assembly 410 (eg, the lens assembly 310 of FIG. 3).
  • the lens assembly 410 may include a lens 411 having an optical axis OA (eg, Z axis).
  • the lens assembly 410 may include a lens housing 412 that at least partially accommodates the lens 411.
  • the lens housing 412 may at least partially surround the lens 411.
  • camera 400 may include an actuator 420.
  • the actuator 420 may be configured to adjust the focus of the lens 411.
  • the actuator 420 may include an image stabilizer (eg, image stabilizer 340 in FIG. 3).
  • the actuator 420 may include a carrier 421.
  • Carrier 421 may be configured to carry lens housing 412.
  • the carrier 421 may be configured to move in a direction substantially parallel to the optical axis OA (eg, +/-Z direction).
  • the carrier 421 may be configured to move along the optical axis OA.
  • the carrier 421 has a first carrier side 421A (e.g., the front of the carrier), a second carrier side 421B opposite the first carrier side 421A (e.g., the back of the carrier), and It may include at least one side carrier surface 421C between the first carrier surface 421A and the second carrier surface 421B.
  • the carrier 421 may include a plurality (eg, four) side carrier surfaces 421C.
  • a plurality of side carrier surfaces 421C may form corner areas.
  • the first carrier surface 421A may include a through hole that accommodates at least a portion of the lens housing 412.
  • the second carrier surface 421B can be at least partially open.
  • the actuator 420 may include a magnet 422.
  • the magnet 422 may include a permanent magnet, an electromagnet, and/or a magnetized magnet of any other shape.
  • the magnet 422 may be placed on the carrier 421.
  • the magnet 422 may be disposed on at least one side carrier surface 421C.
  • the magnet 422 may be attached to at least one side carrier surface 421C.
  • the magnet 422 may be at least partially accommodated in a recess formed in at least one side carrier surface 421C.
  • magnet 422 may include a unipolar magnet.
  • the magnet 422 may have a polarity (eg, N-S) magnetized in one direction (eg, +/-Z direction) of the magnet 422.
  • the magnet 422 may include a multi-pole magnet.
  • the magnet 422 may have a polarity (e.g., N-S) magnetized in one direction (e.g., +Z direction) of the magnet 422 and a polarity (e.g., S-N) magnetized in the opposite direction (e.g., -Z direction). there is.
  • the magnet 422 may be magnetized in a direction substantially parallel to the optical axis OA (eg, +/-Z direction).
  • actuator 420 may include a coil 423.
  • the coil 423 may be configured to be electromagnetically coupled to the magnet 422 when electric energy (eg, current) is applied to the coil 423.
  • the coil 423 may be wound around a central axis (eg, X-axis).
  • coil 423 includes wound coil material 4231 forming slits 4232 extending in a direction (e.g., +/-Y direction) transverse to a central axis (e.g., X-axis). can do.
  • the coil 423 may be arranged to face the magnet 422.
  • the coil 423 and the magnet 422 may be arranged in one direction (eg, +/-X direction).
  • the coil 423 may at least partially overlap the magnet 422.
  • the actuator 420 faces the coil 423 and may not include a printed circuit board (eg, a flexible printed circuit board) electrically connected to the coil 423. If the driver 424 is placed around the coil 423, a flexible printed circuit board may be required to be placed around the coil 423. When placing a flexible printed circuit board around the coil 423, a process using surface mount technology (SMT) may be required. The number of component(s) included in the actuator 420 may be reduced by removing the printed circuit board facing the coil 423 from the actuator 420 . Removing the printed circuit board may eliminate risks (eg, cracks) that may be posed to the printed circuit board. Removing the printed circuit board may render the camera 400 robust to electrical signals (eg, RF signals). Removing the printed circuit board can simplify the process of manufacturing the camera 400.
  • a printed circuit board eg, a flexible printed circuit board
  • actuator 420 may include driver 424.
  • the driver 424 may include a control circuit configured to control the intensity and/or direction of the current flowing in the coil 423.
  • Driver 424 may include at least one magnetic sensor.
  • the magnetic sensor may include a Hall sensor.
  • Driver 424 may include a magnetic sensor circuit.
  • the driver 424 may be configured to sense the movement of the magnet 422.
  • the driver 424 may be configured to detect changes in the field as the magnet 422 moves.
  • the driver 424 may be disposed from the magnet 422 in a direction parallel to the optical axis OA (eg, +/-Z direction).
  • the magnet 422 and driver 424 may be arranged in the above direction.
  • the magnet 422 and driver 424 may be arranged substantially on the same line.
  • the magnet 422 and driver 424 may be substantially aligned in this direction.
  • actuator 420 may include a guide 425.
  • the guide 425 may be configured to guide the movement (eg, movement in +/-Z direction) of the carrier 421.
  • the guide 425 may have a groove shape.
  • the guide 425 may be disposed on at least one side carrier surface 421C of the carrier 421.
  • Guide 425 may be disposed around the magnet 422 on at least one side carrier surface 421C.
  • the actuator 420 may include a plurality of guides 425 (eg, two). One guide 425 among the plurality of guides 425 may be disposed on one side of the magnet 422 and the other guide 425 may be disposed on the other side of the magnet 422 . A plurality of guides 425 may be disposed in corner areas of the carrier 421. In one embodiment, the plurality of guides 425 may include a groove shape.
  • actuator 420 may include at least one ball 426.
  • Ball 426 may be configured to roll within guide 425 .
  • Ball 426 may be at least partially disposed in guide 425.
  • the ball 426 may have a substantially circular or oval cross-sectional shape.
  • the actuator 420 may include a plurality of balls 426.
  • a plurality of balls 426 may be disposed on at least one guide 425. Among the plurality of balls 426, some of the balls 426 are placed on the guide 425 placed on one side of the magnet 422, and other balls 426 are placed on the other side of the magnet 422. It may be placed on the guide 425.
  • the number of balls 426 disposed on both guides 425 may be different. In one embodiment, the number of balls 426 disposed on both guides 425 may be the same.
  • the camera 400 may include an image sensor 430 (eg, image sensor 330 in FIG. 3).
  • the image sensor 430 may be disposed in the optical axis direction (eg, +/-Z direction) from the lens 411.
  • camera 400 may include a printed circuit board 450.
  • the printed circuit board 450 may connect the camera 400 and another printed circuit board (eg, the first circuit board 251 of FIG. 2C).
  • the printed circuit board 450 may include a substrate portion 451, a connector portion 452, and a connection portion 453 connecting the substrate portion 451 and the connector portion 452.
  • the image sensor 430 may be disposed on the substrate portion 451.
  • driver 424 may be disposed on substrate portion 451.
  • Driver 424 may be adjacent to image sensor 430.
  • camera 400 may include housing assembly 480.
  • Housing assembly 480 may include a camera housing 481 configured to at least partially accommodate lens assembly 410 and actuator 420 .
  • the camera housing 481 includes a first housing surface 481A (e.g., the front of the housing), a second housing surface 481B opposite the first housing surface 481A (e.g., the rear of the housing), and a first housing surface ( at least one inner side housing face 481C between the first housing face 481A) and the second housing face 481B, and at least one outer side housing face 481D between the first housing face 481A and the second housing face 481B ) may include.
  • a magnet 422 may be disposed on at least one inner side housing surface 481C.
  • a coil 423 may be disposed on at least one outer side housing surface 481D.
  • the camera housing 481 may include a first opening 481E disposed on the second housing surface 481B.
  • the first opening 481E may be defined by edges of the inner side housing surface 481C.
  • the image sensor 430 may be at least partially disposed in the first opening 481E.
  • the camera housing 481 may include a second opening 481F disposed on the second housing surface 481B.
  • the second opening 481F may be separated from the first opening 481E by a partition 481G protruding from the second housing surface 481B toward the first housing surface 481A.
  • the driver 424 may be at least partially disposed in the second opening 481F.
  • housing assembly 480 may include cover 482.
  • the cover 482 may be configured to be coupled to the camera housing 481.
  • the cover 482 includes a first cover surface 482A (e.g., the front of the cover), a second cover surface 482B (e.g., the back of the cover) opposite the first cover surface 482A, and a first cover surface 482A. ) and an inner side cover surface 482C between the second cover surface 482B, and an outer side cover surface 482D between the first cover surface 482A and the second cover surface 482B.
  • at least a portion of the first cover surface 482A may include a through hole (H).
  • the through hole (H) may be configured to expose at least a portion of the lens housing 412.
  • at least a portion of the second cover surface 482B may be open.
  • the housing assembly 480 may include a yoke 483.
  • the yoke 483 may face the magnet 422 and the coil 423.
  • the yoke 483 may be configured to cover the coil 423.
  • yoke 483 may be disposed on the outer side housing surface 481D.
  • yoke 483 may be disposed on inner side cover surface 482C.
  • the magnet 422 supports the at least one ball 426 to limit the movement of the carrier 421 so that the carrier 421 moves substantially in the optical axis direction (e.g., +/-Z direction). You can.
  • housing assembly 480 may include insulator 484.
  • the insulator 484 may be configured to insulate at least a portion of the coil 423 and the yoke 483.
  • the insulator 484 may have a sheet shape.
  • the insulator 484 may be disposed between the coil 423 and the yoke 483.
  • the insulator 484 may be at least partially received in the yoke 483 .
  • Figure 7 is a diagram showing a magnet and driver in a camera according to an embodiment.
  • the camera 400 may include a magnet 422 and a driver 424.
  • the magnet 422 may be magnetized in a direction substantially parallel to the optical axis direction (eg, +/-Z direction).
  • the magnet 422 may be configured to move in the optical axis direction (eg, +/-Z direction) when coupled with the coil 423 of FIGS. 5 and 6.
  • the driver 424 may be configured to sense the position of the magnet 422.
  • a processor eg, processor 120 in FIG. 1
  • Figure 8 is a perspective view of a yoke according to one embodiment.
  • Figure 9 is a perspective view of a yoke according to one embodiment.
  • the yoke 483 may include a plurality of parts P1 and P2 separated from each other.
  • the first part (P1) and the second part (P2) may be spaced apart by the gap (G).
  • the size of the gap G may be constant.
  • the first part P1 may include clamps C11 and C12.
  • the clamps C11 and C12 may be configured to clamp the first part P1 to the camera housing 481 of FIGS. 5 and 6 .
  • the first part (P1) may include a first clamp (C11) disposed on one edge (eg, upper edge) of the first part (P1).
  • the first part P1 may include a second clamp C12 disposed on the other edge (eg, lower edge) of the first part P1.
  • the first clamp C11 and the second clamp C12 may be arranged opposite to each other.
  • the first part P1 may include notches N11 and N12. Notches N11 and N12 may be disposed around the clamps C11 and C12 at the edges of the first part P1. In one embodiment, the first part P1 may include a first notch N11 disposed on at least one side of the first clamp C11. In one embodiment, the first part P1 may include a second notch N12 disposed on at least one side of the second clamp C21. In one embodiment, the first notch N11 and the second notch N12 may be arranged opposite to each other.
  • the first part (P1) may include a first recess (R1).
  • the first recess R1 may be configured to accommodate at least a portion of the insulator 484.
  • the first recess R1 may be formed on one side of the first part P1.
  • the first part (P1) may include a first connection terminal (T1).
  • the first connection terminal T1 may be electrically connected to the coil 423.
  • the first connection terminal T1 may be electrically connected to an external component (eg, the driver 424 of FIGS. 5 and 6).
  • the first connection terminal T1 may be disposed on one side of the first part P1 where the first recess R1 is formed.
  • the second part (P2) may include clamps (C21, C22).
  • the clamps C21 and C22 may be configured to clamp the second part P2 to the camera housing 481 of FIGS. 5 and 6 .
  • the second part P2 may include a third clamp C21 disposed on one edge (eg, upper edge) of the second part P2.
  • the second part P2 may include a fourth clamp C22 disposed on the other edge (eg, lower edge) of the second part P2.
  • the third clamp C21 and the fourth clamp C22 may be arranged opposite to each other.
  • the second part P2 may include notches N21 and N22. Notches N21 and N22 may be disposed around the clamps C21 and C22 at the edges of the second part P2. In one embodiment, the second part P2 may include a third notch N21 disposed on at least one side of the third clamp C21. In one embodiment, the second part P2 may include a fourth notch N22 disposed on at least one side of the fourth clamp C22. In one embodiment, the third notch N21 and the fourth notch N22 may be arranged opposite to each other.
  • the second part (P2) may include a second recess (R2).
  • the second recess R2 may be configured to accommodate at least a portion of the insulator 484.
  • the second recess R2 may be formed on one side of the second part P2.
  • the second part (P2) may include a second connection terminal (T2).
  • the second connection terminal T2 may be electrically connected to the coil 423.
  • the second connection terminal T1 may be electrically connected to an external component (eg, the driver 424 of FIGS. 5 and 6).
  • the second connection terminal T2 may be disposed on one side of the second part P2 where the second recess R2 is formed.
  • Figure 10 is an exploded perspective view of a camera according to an embodiment.
  • Figure 11 is a cross-sectional view of a camera according to one embodiment.
  • the camera 500 (e.g., the camera 400 in FIGS. 4 to 6) includes a lens assembly 510 (e.g., the lens assembly 410 in FIGS. 4 to 6). can do.
  • the lens assembly 510 may include a lens 511 (e.g., lens 411 in FIGS. 4 to 6) and a lens housing 512 (e.g., lens housing 412 in FIGS. 4 to 6). You can.
  • the lens 511 may have an optical axis (OA).
  • the camera 500 may include a first actuator 520 (eg, the actuator 420 of FIGS. 4 to 6).
  • the first actuator 520 may be configured to adjust the focus of the lens 511.
  • the first actuator 520 may include a first carrier 521 (eg, the first carrier 421 in FIGS. 4 to 6).
  • the first carrier 521 may be configured to move in a direction substantially parallel to the optical axis OA (eg, +/-Z direction).
  • the first actuator 520 may include a first magnet 522 (eg, the magnet 422 of FIGS. 4 to 6 or the AF magnet).
  • the first magnet 522 may be disposed on one surface of the first carrier 521 (eg, a side carrier surface oriented in the +X normal direction).
  • the first actuator 520 may include a first coil 523 (eg, the coil 423 of FIGS. 4 to 6 or the AF coil).
  • the first actuator 520 faces the first coil 523 and may not include a printed circuit board (eg, a flexible printed circuit board) electrically connected to the first coil 523.
  • a printed circuit board eg, a flexible printed circuit board
  • the first actuator 520 may include a first driver 524 (eg, the driver 424 of FIGS. 4 to 6 or the AF driver).
  • a first driver 524 eg, the driver 424 of FIGS. 4 to 6 or the AF driver.
  • the first actuator 520 includes a first guide 525 (e.g., guide 425 in FIGS. 4-6 ) and at least one first ball 526 (e.g., in FIGS. 4-6 It may include the ball 426 or the AF ball).
  • a first guide 525 e.g., guide 425 in FIGS. 4-6
  • at least one first ball 526 e.g., in FIGS. 4-6 It may include the ball 426 or the AF ball).
  • the camera 500 may include an image sensor 530 (eg, the image sensor 430 in FIGS. 4 to 6 ).
  • the camera 500 may include a printed circuit board 550 (eg, the printed circuit board 450 of FIGS. 4 to 6).
  • the camera 500 may include a second actuator 540.
  • the second actuator 540 may include an image stabilizer (eg, image stabilizer 340 in FIG. 3).
  • the second actuator 540 may include a second carrier 541.
  • the second carrier 541 may be configured to carry the lens housing 512.
  • the second carrier 541 is positioned in a first direction (e.g., +/- It may be configured to move in a second direction (eg, +/-Y direction).
  • the second actuator 540 may include a plurality of second magnets 542A and 542B.
  • the plurality of second magnets 542A and 542B may include permanent magnets, electromagnets, and/or other magnetized magnets of any shape.
  • One of the plurality of second magnets 542A and 542B e.g., the first OIS magnet
  • is positioned on one side of the second carrier 541 e.g., the side oriented in the +X normal direction). carrier surface
  • another second magnet 542B e.g., a second OIS magnet
  • a plurality of second magnets 542A and 542B may each be attached to one surface of the corresponding second carrier 541. In one embodiment, the plurality of second magnets 542A and 542B may be at least partially accommodated in a recess formed on one surface of the corresponding second carrier 541.
  • the plurality of second magnets 542A and 542B may include unipolar magnets. In an embodiment not shown, at least one second magnet among the plurality of second magnets 542A and 542B may include a multi-pole magnet.
  • the plurality of second magnets 542A and 542B may be magnetized in directions crossing the optical axis OA.
  • the first OIS magnet 542A may be magnetized in the first direction in which the second carrier 541 moves (eg, +/-X direction).
  • the second OIS magnet 542B may be magnetized in the second direction in which the second carrier 541 moves (eg, +/-Y direction).
  • the second actuator 540 may include a plurality of second coils 543A and 543B.
  • One of the plurality of second coils 543A and 543B (e.g., first OIS coil) generates electrons with the first OIS magnet 542A when electrical energy (e.g., current) is applied. It can be configured to couple spontaneously.
  • another second coil 543B (e.g., second OIS coil) generates electrons with the second OIS magnet 542B when electrical energy (e.g., current) is applied. It can be configured to couple spontaneously.
  • the first OIS coil 543A may be wound around a first central axis (eg, X-axis). In one embodiment, the first OIS coil 543A may be wound to form a slit extending in a direction crossing the first central axis (eg, +/-Y direction).
  • the first OIS coil 543A may be arranged to face the first OIS magnet 542A. In one embodiment, the first OIS coil 543A and the first OIS magnet 542A may be arranged in a first direction (eg, +/-X direction). In one embodiment, the first OIS coil 543A and the first OIS magnet 542A may at least partially overlap.
  • the second OIS coil 543B may be wound around a second central axis (eg, Y axis). In one embodiment, the second OIS coil 543B may be wound to form a slit extending in a direction intersecting the second central axis (eg, +/-X direction).
  • the second OIS coil 543B may be arranged to face the second OIS magnet 542B. In one embodiment, the second OIS coil 543B and the second OIS magnet 542B may be arranged in a second direction (eg, +/-Y direction). In one embodiment, the second OIS coil 543B and the second OIS magnet 542B may at least partially overlap.
  • the second actuator 540 faces the first OIS coil 543A and may not include a printed circuit board (eg, a flexible printed circuit board) electrically connected to the first coil 543A.
  • a printed circuit board eg, a flexible printed circuit board
  • the second actuator 540 faces the second OIS coil 543B and may not include a printed circuit board (eg, a flexible printed circuit board) electrically connected to the second coil 543B.
  • a printed circuit board eg, a flexible printed circuit board
  • the second actuator 540 may include a plurality of second drivers 544A and 544B.
  • the plurality of second drivers 544A and 544B may include at least one magnetic sensor.
  • the magnetic sensor may include a Hall sensor.
  • the plurality of second drivers 544A and 544B may include a magnetic sensor circuit.
  • one second driver 544A (e.g., first OIS driver) among the plurality of second drivers 544A and 544B may be configured to detect movement of the first OIS magnet 542A. there is.
  • Another second driver 544B (eg, a second OIS driver) among the plurality of second drivers 544A and 544B may be configured to detect the movement of the second OIS magnet 542B.
  • At least one OIS driver of the first OIS driver 544A and the second OIS driver 544B may include a plurality of magnetic sensors.
  • one of the OIS magnets 542A, 542B moves in a direction (e.g., +Z direction) away from the corresponding OIS driver 544A, 544B.
  • a processor e.g., processor 120 of FIG. 1 may use a plurality of magnetic sensors to perform a sum operation and a differential operation to cancel out the difference in magnetic force generated by movement of the OIS magnets 542A and 542B.
  • the first OIS driver 544A may be disposed from the first OIS magnet 542A in a direction parallel to the optical axis OA (eg, +/-Z direction).
  • the first OIS magnet 542A and the first OIS driver 544A may be arranged in the above direction.
  • the first OIS magnet 542A and the first OIS driver 544A may be arranged substantially on the same line.
  • the first OIS magnet 542A and the first OIS driver 544A may be substantially aligned in the above direction.
  • the second OIS driver 544B may be disposed from the second OIS magnet 542B in a direction parallel to the optical axis OA (eg, +/-Z direction).
  • the second OIS magnet 542B and the second OIS driver 544B may be arranged in the above direction.
  • the second OIS magnet 542B and the second OIS driver 544B may be arranged substantially on the same line.
  • the second OIS magnet 542B and the second OIS driver 544B may be substantially aligned in the above direction.
  • the second actuator 540 may include a second guide 545.
  • the second guide 545 may be configured to guide the movement (eg, movement in the +/-X direction and/or movement in the +/-Y direction) of the second carrier 541.
  • the second guide 545 includes a first groove configured to guide movement of the second carrier 541 in a first direction (e.g., +/-X direction) relative to the first carrier 521. can do.
  • the first groove may be disposed in corner areas of one surface (eg, top surface) of the second guide 545.
  • the second guide 545 includes a second groove configured to guide movement of the second carrier 541 in a second direction (e.g., +/-Y direction) relative to the first carrier 521. can do.
  • the second groove may be disposed in corner areas of the other surface (eg, lower surface) of the second guide 545.
  • the second guide 545 may be disposed between the first carrier 521 and the second carrier 541.
  • the second actuator 540 may include a plurality of second balls 546A and 546B.
  • the second actuator 540 may include at least one first OIS ball 546A and at least one second OIS ball 546B.
  • At least one first OIS ball 546A may be configured to roll within the first groove. At least one first OIS ball 546A may be placed in the first groove of the second guide 545. At least one first OIS ball 546A may be at least partially disposed in the first groove. At least one first OIS ball 546A may have a substantially circular or oval cross-sectional shape.
  • each of the plurality of first OIS balls 546A may be disposed in a corresponding first groove formed in corner areas of the second carrier 541.
  • At least one second OIS ball 546B may be configured to roll within the second groove. At least one second OIS ball 546B may be placed in the second groove of the second guide 545. At least one second OIS ball 546B may be at least partially disposed in the second groove. At least one second OIS ball 546B may have a substantially circular or oval cross-sectional shape.
  • each of the plurality of second OIS balls 546B may be disposed in a corresponding second groove formed in corner areas of the second carrier 541.
  • the camera 500 may include a housing assembly 580 (e.g., the housing assembly 480 of FIGS. 4-6).
  • the housing assembly 580 may include a camera housing 581 (eg, the camera housing 481 in FIGS. 4 to 6).
  • the housing assembly 580 may include a cover 582 (eg, cover 482 in FIGS. 4 to 6 ).
  • the first OIS coil 543A and the second OIS coil 543B may be disposed on the inner side surface of the camera housing 581.
  • the housing assembly 580 may include a plurality of second yokes or OIS yokes. Each OIS yoke may be arranged to face one corresponding OIS coil (543A, 543B).
  • the housing assembly 580 includes an insulator (e.g., insulator 484 in FIGS. 4-6 ) disposed between each second yoke (not shown) and the corresponding OIS coil 543A, 543B. ) may include.
  • the insulators can each be at least partially received in the corresponding second yoke.
  • Figure 12 is a diagram showing a magnet and driver in a camera according to an embodiment.
  • the camera 500 may include a second OIS magnet 542B and a second OIS driver 544B.
  • the second OIS magnet 542B may be magnetized in a direction (eg, +/-Y direction) that intersects (eg, orthogonal to) the optical axis direction (eg, +/-Z direction).
  • the second OIS magnet 542B may be configured to move in a magnetized direction (eg, +/-Y direction) when coupled with the second OIS coil 543B of FIGS. 10 and 11.
  • the second OIS driver 544B may be configured to detect the position of the second OIS magnet 542B.
  • a processor eg, processor 120 in FIG. 1
  • the second OIS magnet (542B) and the second OIS driver (544B) are shown and explained with reference thereto, but the above description is similar to the first OIS magnet (542A) shown in FIGS. 10 and 11 and It can be similarly applied to the first OIS driver 544A.
  • the first OIS magnet 542A may be configured to move in the +/-X direction.
  • One aspect of the present disclosure can provide a camera including an actuator and an electronic device including the same without a flexible printed circuit board for circuit connection.
  • the cameras 400 and 500 may include lenses 411 and 511 having an optical axis (OA).
  • Cameras 400 and 500 may include first actuators 420 and 520 .
  • the first actuator (420; 520) may include a first carrier (421; 521) configured to move in a first direction substantially parallel to the optical axis direction.
  • the first actuator (420; 520) may include a first magnet (422; 522) disposed on the side surface of the first carrier (421; 521).
  • the first magnets 422 and 522 may be magnetized in a first direction.
  • the first actuator (420; 520) may include a first coil (423; 523) facing the first magnet (422; 522).
  • the first actuator (420; 520) may include a first driver (424; 524) disposed in a first direction from the first magnet (422; 522).
  • Cameras 400 and 500 may include yokes 483 and 583 .
  • the yoke (483; 583) may face the first magnet (422; 522) and the first coil (423; 523).
  • Cameras 400 and 500 may include printed circuit boards 450 and 550 .
  • the printed circuit board (450; 550) may include an image sensor (430; 530).
  • the image sensor 430; 530 may be arranged in the optical axis direction from the lens 411; 511.
  • the number of component(s) constituting the camera can be reduced by designing the actuator without a flexible printed circuit board.
  • risks eg, cracks
  • the actuator may be robust to electrical signals (e.g., RF signals).
  • the process of manufacturing a camera can be simplified by arranging a driver (eg, Hall sensor).
  • the first magnet (422; 522) may be configured to move in a first direction relative to the first driver (424; 524).
  • the first magnet 422 (522) may be a unipolar magnet.
  • the first driver 424; 524 may be disposed on a printed circuit board 450; 550.
  • the arrangement of the first driver (424; 524) may allow the flexible printed circuit board for circuit connection from the first actuator (420; 520) to be removed.
  • the yoke 483 may include connection terminals T1 and T2 configured to be electrically connected to an external component.
  • the external component may include a first driver (424; 524).
  • the yoke 483; 583 may include a plurality of parts P1 and P2.
  • the plurality of parts (P1, P2) may be separated from each other.
  • the first actuator 420; 520 may include at least one first ball 426; 526. At least one first ball (426; 526) may be configured to guide the first carrier (421; 521) in a first direction. At least one first ball (426; 526) may be adsorbed by the yoke (483; 583). At least one first ball (426; 526) may be adsorbed by the first magnet (422; 522). Adsorption of the yoke (483; 583) can ensure movement of the first carrier (421; 521) in the first direction.
  • the camera 400; 500 may include an insulator 484 disposed between the first coil 423; 523 and the yoke 483; 583.
  • the first coil (423; 523) may be electrically connected to the yoke (483; 583).
  • the first driver 424 (524) may include a Hall sensor.
  • the camera 500 may include a second actuator 540.
  • the second actuator 540 may include a second carrier 541 configured to move in a second direction intersecting (eg, orthogonal to) the first direction.
  • the second actuator 540 may include a second magnet 542A disposed on the side surface of the second carrier 541.
  • the second magnet 542A may be magnetized in a second direction.
  • the second actuator 540 may include a second coil 543A facing the second magnet 542A.
  • the second actuator 540 may include a second driver 544A disposed in a first direction from the second magnet 542A.
  • the second driver 544A may include a plurality of Hall sensors.
  • a plurality of Hall sensors may enable the processor 120 to perform a sum operation and a differential operation.
  • the second driver 544A may reduce or cancel out the difference in magnetic force generated when the second magnet 542A moves away from the second driver 544A in the first direction.
  • the circuitry of the second driver 544A may be placed in the image sensor 530 or adjacent to the image sensor 530.
  • the second magnet 542A may be configured to move in a second direction relative to the second driver 544A.
  • the second driver 544A may be disposed on the printed circuit board 550.
  • the second carrier 541 may be configured to move in a third direction that intersects (eg, is perpendicular to) the first direction and the second direction, respectively.
  • the second actuator 540 may include a third magnet 542B disposed on the side surface of the second carrier 541.
  • the side surface of the second carrier 541 on which the third magnet 542B is disposed may be different from the side surface of the second carrier 541 on which the second magnet 542A is disposed.
  • the third magnet 542B may be magnetized in a third direction.
  • the second actuator 540 may include a third driver 544B disposed in a first direction from the third magnet 542B.
  • the third magnet 542B may be configured to move in a third direction with respect to the third driver 544B.
  • the third driver 544B may include a plurality of Hall sensors.
  • the electronic device 101; 201; 301 may include a housing 210 and cameras 280a, 280b; 380; 400; 500 disposed in the housing 210.
  • the camera 500 may include a lens 511 having an optical axis (OA).
  • Camera 500 may include an actuator 540.
  • the actuator 540 may include a carrier 541 configured to move in a first direction intersecting (eg, orthogonal to) the optical axis direction.
  • the actuator 540 may include magnets 542A and 542B disposed on the side surface of the carrier 541.
  • the magnets 542A and 542B may be magnetized in a first direction.
  • Actuator 540 may include coils 543A and 543B facing magnets 542A and 542B.
  • the actuator 540 may include drivers 544A and 544B arranged in a second direction parallel to the optical axis direction and intersecting (eg, orthogonal to) the first direction.

Abstract

La présente caméra peut comprendre : une lentille ayant un axe optique ; un premier actionneur comprenant un premier support conçu pour se déplacer dans une première direction qui est sensiblement parallèle à une direction d'axe optique, un premier aimant disposé sur une surface latérale du premier support et magnétisé dans la première direction, une première bobine qui fait face au premier aimant, et un premier dispositif d'entraînement disposé dans la première direction à partir du premier aimant ; une culasse qui fait face au premier aimant et à la première bobine ; et une carte de circuit imprimé qui comprend un capteur d'image disposé dans la direction d'axe optique à partir de la lentille.
PCT/KR2023/005826 2022-07-15 2023-04-27 Caméra et dispositif électronique la comprenant WO2024014672A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220087424 2022-07-15
KR10-2022-0087424 2022-07-15
KR1020220108855A KR20240010374A (ko) 2022-07-15 2022-08-30 카메라 및 이를 포함하는 전자 장치
KR10-2022-0108855 2022-08-30

Publications (1)

Publication Number Publication Date
WO2024014672A1 true WO2024014672A1 (fr) 2024-01-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2023/005826 WO2024014672A1 (fr) 2022-07-15 2023-04-27 Caméra et dispositif électronique la comprenant

Country Status (1)

Country Link
WO (1) WO2024014672A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160045988A (ko) * 2014-10-17 2016-04-28 (주)옵토라인 카메라 모듈 조립체
KR20190034876A (ko) * 2017-09-25 2019-04-03 삼성전자주식회사 다른 자기장의 방향을 갖는 복수의 구동부를 포함하는 카메라 모듈
KR20200088729A (ko) * 2019-01-15 2020-07-23 주식회사 엠씨넥스 흔들림 보정 기능을 가지는 카메라 장치
KR20220080477A (ko) * 2020-12-07 2022-06-14 삼성전자주식회사 광학식 줌을 지원하는 카메라 모듈 및 이를 포함하는 전자 장치
KR20220089353A (ko) * 2020-12-21 2022-06-28 삼성전자주식회사 카메라 모듈 및 이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160045988A (ko) * 2014-10-17 2016-04-28 (주)옵토라인 카메라 모듈 조립체
KR20190034876A (ko) * 2017-09-25 2019-04-03 삼성전자주식회사 다른 자기장의 방향을 갖는 복수의 구동부를 포함하는 카메라 모듈
KR20200088729A (ko) * 2019-01-15 2020-07-23 주식회사 엠씨넥스 흔들림 보정 기능을 가지는 카메라 장치
KR20220080477A (ko) * 2020-12-07 2022-06-14 삼성전자주식회사 광학식 줌을 지원하는 카메라 모듈 및 이를 포함하는 전자 장치
KR20220089353A (ko) * 2020-12-21 2022-06-28 삼성전자주식회사 카메라 모듈 및 이를 포함하는 전자 장치

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