WO2024011727A1

WO2024011727A1 - Electronic device

Info

Publication number: WO2024011727A1
Application number: PCT/CN2022/115994
Authority: WO
Inventors: 李治福; 张海泽; 韩文
Original assignee: 武汉华星光电半导体显示技术有限公司
Priority date: 2022-07-13
Filing date: 2022-08-30
Publication date: 2024-01-18
Also published as: CN115206191A; CN115206191B

Abstract

Provided in the present application is an electronic device. An organic light-emitting diode display panel assembly is provided with a display area and a bonding area located outside the display area; a first bonding end of a flexible connector for electrical signal transmission is bonded to the bonding area of the organic light-emitting diode display panel assembly; and a second bonding end of the flexible connector extends into a second accommodating cavity of a second housing assembly, thereby reducing the space of a non-display area that needs to be occupied by the flexible connector in a first accommodating cavity, and thus reducing the size of a frame of the electronic device.

Description

Electronic equipment

Technical field

The present application relates to the field of display technology, and in particular to an electronic device.

Background technique

Narrow borders of notebook computers are one of the market demands. However, notebook computers prepared with existing organic light-emitting diode display panels have a problem of large borders.

Therefore, how to reduce the frame of a notebook computer prepared with an organic light-emitting diode display panel is a technical problem that needs to be solved.

technical problem

The purpose of this application is to provide an electronic device that is conducive to reducing the frame size of the electronic device.

Technical solutions

An electronic device, the electronic device includes:

a first housing assembly, the first housing assembly including a first accommodation cavity;

An organic light-emitting diode display panel assembly, the organic light-emitting diode display panel assembly is disposed in the first accommodation cavity, the organic light-emitting diode display panel assembly has a display area and a binding area located outside the display area;

a second housing component, the second housing component is rotationally connected to the first housing component, the second housing component has a second accommodation cavity; and

Flexible connector, the flexible connector is used to transmit electrical signals, the flexible connector has a first binding end and a second binding end that are oppositely arranged, the first binding end of the flexible connector is bound to Positioned at the binding area of the organic light emitting diode display panel assembly, the second binding end of the flexible connector extends into the second receiving cavity of the second housing assembly.

In the electronic device of some embodiments, the electronic device further includes:

An adhesive layer is used to bond the organic light-emitting diode display panel component and the first housing component.

In the electronic device of some embodiments, the organic light-emitting diode display panel assembly includes a flexible organic light-emitting diode display panel, and the adhesive layer is respectively connected to the back side of the light-emitting surface of the flexible organic light-emitting diode display panel and the first shell. Surface contact of body components.

In some embodiments of the electronic device, the display area is coplanar with the binding area.

A driver chip bound to the binding area of the organic light-emitting diode display panel assembly; and

The functional layer is arranged in the first accommodation cavity and is located on the light emitting side of the organic light-emitting diode display panel assembly. The functional layer that is farthest from the organic light-emitting diode display panel assembly is away from the organic light-emitting diode display panel assembly. The surface of the diode display panel assembly is located on a side of the driving chip away from the surface of the organic light-emitting diode display panel assembly and close to the organic light-emitting diode display panel assembly. The first housing assembly includes a A groove, at least part of the driver chip is located in the groove.

In some embodiments of the electronic device, the first housing assembly includes:

The back cover includes the first accommodation cavity; and

The frame is located on a side of the functional layer away from the organic light-emitting diode display panel assembly, and includes the groove.

In the electronic device of some embodiments, the organic light-emitting diode display panel assembly includes a color filter layer, and the functional layer includes:

A hard layer is located on the light exit surface of the organic light emitting diode display panel assembly and is in contact with the light exit surface of the organic light emitting diode display panel assembly.

In the electronic device of some embodiments, the organic light-emitting diode display panel assembly does not include a color filter layer, and the functional layer includes:

A polarizer arranged on the light-emitting side of the organic light-emitting diode display panel assembly; and

A hard layer is provided on a surface of the polarizer away from the organic light-emitting diode display panel assembly.

A logic circuit board is provided in the second accommodation cavity.

In the electronic device of some embodiments, the part of the flexible connector other than the first binding end and located in the first receiving cavity is located at the position of the organic light-emitting diode display panel assembly perpendicular to the The organic light emitting diode display panel assembly has one side in a thickness direction.

In the electronic device of some embodiments, at least part of the flexible connector is meanderingly bent in the first accommodating cavity and/or the second accommodating cavity.

In the electronic device of some embodiments, there is a gap between the organic light-emitting diode display panel assembly and the first housing assembly in a direction perpendicular to the thickness of the organic light-emitting diode display panel assembly, and the flexible The connecting member is meanderingly bent along the thickness direction of the organic light emitting diode display panel assembly.

beneficial effects

The present application provides an electronic device. An organic light-emitting diode display panel assembly has a display area and a binding area located outside the display area. The first binding end of a flexible connector that transmits electrical signals is bound to the organic light-emitting diode display panel. In the binding area of the component, the second binding end of the flexible connector extends into the second accommodation cavity of the second housing assembly to reduce the non-display area space that the flexible connector needs to occupy in the first accommodation cavity. , thereby reducing the frame size of electronic devices.

Description of drawings

Figure 1 is a schematic cross-sectional view of a display module in a traditional notebook computer;

Figure 2 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application;

Figure 3 is a partial side view of the electronic device shown in Figure 2;

Figure 4 is an exploded schematic view of the display screen of the electronic device shown in Figure 2;

Figure 5 is a first cross-sectional schematic view of the display screen of the electronic device shown in Figure 2;

Figure 6 is a schematic cross-sectional view of the organic light emitting diode display panel assembly shown in Figure 4;

Figure 7 is a schematic cross-sectional view of the host of the electronic device shown in Figure 2;

Figure 8 is a second schematic cross-sectional view of the display screen of the electronic device shown in Figure 2;

Figure 9 is a third schematic cross-sectional view of the display screen of the electronic device shown in Figure 2;

Figure 10 is a fourth schematic cross-sectional view of the display screen of the electronic device shown in Figure 2;

Figure 11 is a schematic diagram of the organic light emitting diode display panel assembly shown in Figure 10;

Figure 12 is a schematic cross-sectional view of a display screen of an electronic device according to another embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of the organic light emitting diode display panel assembly shown in FIG. 12 .

Embodiments of the invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application.

Please refer to Figure 1, which is a schematic cross-sectional view of a flexible display module of a display body in a traditional notebook computer. The flexible display module 100 includes a flexible display panel 11, a first polarizer 12, a first protective cover 13, a first supporting back plate 141, a second supporting back plate 142, a buffer layer 15, a first heat dissipation layer 16, a first The adhesive layer 17 , the first flexible connector 18 , the first logic circuit board 19 and the first driver chip 120 .

The flexible display panel 11 includes a first straight portion 111 , a curved portion 112 and a second straight portion 113 . The curved portion 112 is connected between the first straight portion 111 and the second straight portion 113 . The first straight portion 111 is flat and used for display. The curved portion 112 is curved and cannot be displayed. The second straight portion 113 is flat and cannot be displayed. The curved portion 112 is connected between the first straight portion 111 and the second straight portion 113 . The second straight portion 113 is located on the back side of the light exit surface of the first straight portion 111 and the second straight portion 113 is connected to the first straight portion 113 . The straight portions 111 overlap in the thickness direction of the flexible display panel 11 .

The first polarizer 12 is located on the light exit side of the flexible display panel 11 and on the first straight portion 111 . The first protective cover 13 is located on the side of the first polarizer 12 away from the flexible display panel 11 . The first supporting back plate 141 is located on the side of the first straight portion 111 away from the first polarizer 12 . The buffer layer 15 is located on the side of the first supporting back plate 141 away from the first straight portion 111 . The first heat dissipation layer 16 is located on the side of the buffer layer 15 away from the first supporting back plate 141 . The second supporting back plate 142 is located on the surface of the second straight portion 113 close to the first straight portion 111 , and the first adhesive layer 17 bonds the first heat dissipation layer 16 and the second supporting back plate 142 . The first driver chip 120 is bound to the side of the second straight portion 113 away from the first straight portion 111 . The first flexible connector 18 is bound to the second straight portion 113 and is located on the back side of the light-emitting surface of the flexible display panel 11 . The first logic circuit board 19 is connected to the first flexible connector 18 and is located on the back side of the light-emitting surface of the flexible display panel 11 .

In order to achieve narrow bezels, traditional flexible display modules need to bend the second straight portion 113 of the flexible display panel bound to the first driver chip 120 to the back of the light-emitting surface of the flexible display panel, resulting in a thicker overall thickness of the flexible display module. Thick, it is not conducive to reducing the thickness of the display screen in the notebook computer, and thus is not conducive to reducing the thickness of the entire notebook computer.

In order to solve the problems of traditional technology, the electronic device of the present application has a display area and a binding area located outside the display area through an organic light-emitting diode display panel assembly. The binding area and the display area are co-planar, so that the organic light-emitting diode display panel assembly is straight. status, the thickness of the organic light-emitting diode display panel assembly is reduced, which improves the traditional technology. The binding end of the flexible organic light-emitting diode panel is bent to the back side of the display surface of the flexible organic light-emitting diode, resulting in a thicker thickness of the flexible organic light-emitting diode display panel. The problem.

Moreover, the first binding end of the flexible connector for transmitting electrical signals is bound to the binding area of the organic light emitting diode display panel assembly, and the second binding end of the flexible connector extends to the second binding end of the second housing assembly. in the first accommodation cavity to reduce the non-display area space that the flexible connector needs to occupy in the first accommodation cavity, thereby reducing the size of the non-display area of the electronic device. Therefore, the electronic device of the present application can achieve thin thickness and narrow frame at the same time.

Please refer to FIGS. 2 and 3 . FIG. 2 is a perspective view of an electronic device according to an embodiment of the present application. FIG. 3 is a partial side view of the electronic device shown in FIG. 2 . The electronic device 200 is a tablet notebook computer. The electronic device 200 includes a display screen 21 and a host 22. The display screen 21 and the host 22 are rotationally connected through a rotating assembly.

Please refer to FIGS. 4 and 5 . FIG. 4 is an exploded schematic view of the display screen body of the electronic device shown in FIG. 2 , and FIG. 5 is a first cross-sectional schematic view of the display screen body of the electronic device shown in FIG. 2 . The display screen 21 includes a first housing assembly 211 and a display module.

The first housing assembly 211 includes a first back cover 2111 and a frame 2112. The first back cover 2111 includes a first bottom plate 2113 and four first side plates 2114. The first bottom plate 2113 is rectangular. The four first side plates 2114 are arranged along the edges of the first bottom plate 2113. Two adjacent first side plates 2114 are arranged along the edge of the first bottom plate 2113. Plates 2114 are adjacent. The first bottom plate 2113 and the four first side plates 2114 enclose a first accommodation cavity 2113a. The first back cover 2111 and the frame 2112 are made of materials including but not limited to plastic.

The display module includes an organic light-emitting diode display panel assembly 213, a plurality of functional layers 214, a second driver chip 216, a second flexible connector 215 and a second logic circuit board 217.

The organic light emitting diode display panel assembly 213 is disposed in the first receiving cavity 2113a. Please refer to FIG. 6 , which is a schematic cross-sectional view of the organic light-emitting diode display panel assembly shown in FIG. 4 . The organic light emitting diode display panel assembly 213 has a display area 213a and a binding area 213b located outside the display area 213a. The binding area 213b is coplanar with the display area 213a.

Compared with the traditional technology in which some non-display parts of the flexible display panel are bent to the back side of the light-emitting surface of the flexible display panel, the binding area 213b of the organic light-emitting diode display panel assembly of the present application is coplanar with the display area 213a, so that the organic light emitting The diode display panel assembly 213 is in a straight state. Correspondingly, the binding area 213b of the organic light-emitting diode display panel assembly 213 will not be bent to the back side of the light-emitting surface of the organic light-emitting diode display panel assembly 213. The organic light-emitting diode display panel assembly 213 is in a straight state. The thickness of 213 is reduced, which improves the problem in traditional technology that the flexible organic light-emitting diode display panel is thicker due to the bending of the binding end of the flexible organic light-emitting diode panel to the back side of the display surface of the flexible organic light-emitting diode.

It should be noted that a wiring area 213c is also provided between the display area 213a and the binding area 213b of the organic light-emitting diode display panel assembly 213. The wiring area 213c is provided with metal wiring, and the binding area 213b is provided with binding pins. .

The organic light-emitting diode display panel assembly 213 includes a sequentially stacked glass substrate 2131 and a flexible organic light-emitting diode display panel 2135. The flexible organic light-emitting diode display panel 2135 includes a sequentially stacked flexible substrate 2132, a light-emitting pixel layer 2133, and a film encapsulation layer 2134. The light-emitting pixel layer 2133 includes a thin film transistor array layer and an organic light-emitting diode array layer.

The flexible substrate 2132 is disposed on the glass substrate 2131, and the flexible substrate 2132 includes a polyimide layer. The thin film transistor array layer is disposed on the flexible substrate 2132, and the thin film transistor array layer includes a plurality of thin film transistors arranged in an array. The organic light-emitting diode array layer is disposed on the thin-film transistor array layer. The organic light-emitting diode array layer includes a plurality of organic light-emitting diodes arranged in an array. The organic light-emitting diodes are electrically connected to the thin film transistor. The thin film encapsulation layer 2134 is disposed on the organic light emitting diode array layer. The thin film encapsulation layer 2134 includes two inorganic layers and an organic layer located between the two inorganic layers.

As shown in FIG. 5 , the organic light emitting diode display panel assembly 213 and the first housing assembly 211 are bonded through the second adhesive layer 220 . Specifically, the second adhesive layer 220 is in contact with both the glass substrate 2131 of the organic light-emitting diode display panel assembly 213 and the first bottom plate 2113 of the first back cover 2111.

The second adhesive layer 220 is made of foam glue, which serves to bond the glass substrate 2131 and the first bottom plate 2113 of the first back cover 2111 and at the same time play a buffering role.

The display module of the embodiment of the present application removes the backplane support layer, foam buffer layer, heat dissipation layer, etc. in the traditional display module, so that there is no backplane support layer between the glass substrate 2131 and the first bottom plate 2113 of the first back cover 2111 , foam buffer layer, heat dissipation layer and other functional layers, use a rigid glass substrate 2131 to replace the backplane support layer, foam buffer layer, heat dissipation layer and other functional layers on the back of the traditional flexible display panel to play a supporting role to further thin the The thickness of the display screen 21 is reduced.

It should be noted that the flexible organic light-emitting diode display panel 2135 is formed using a glass substrate 2131 as a carrier. After the flexible organic light-emitting diode display panel 2135 is formed on the glass substrate 2131, traditional technology requires that the flexible organic light-emitting diode display panel 2135 be removed from the glass substrate 2131. The glass substrate 2131 is peeled off to obtain a flexible organic light-emitting diode display panel 2135, and then the flexible organic light-emitting diode display panel 2135 is bent to achieve a narrow frame.

However, in the embodiment of the present application, when the organic light-emitting diode display panel assembly 213 is in a flat state to achieve thinning of the display body 21, the organic light-emitting diode display panel assembly 213 of the present application does not need to be bent. In order to achieve a narrow frame, this application does not require the organic light-emitting diode display panel assembly 213 to be flexible. This application does not peel off the flexible organic light-emitting diode display panel 2135 from the glass substrate 2131, but retains the glass substrate 2131 in the flexible organic light-emitting diode. Under the diode display panel 2135, the glass substrate 2131 carrying the flexible organic light-emitting diode display panel 2135 is placed in the first accommodation cavity 2113a to reduce the risk of peeling off the flexible organic light-emitting diode display panel 2135 from the glass substrate 2131. Damage caused to the display panel 2135 can improve the yield of the flexible organic light-emitting diode display panel 2135 and simplify the manufacturing process of the electronic device.

In addition, as mentioned above, the glass substrate 2131 plays a rigid supporting role for the flexible organic light-emitting diode display panel 2135, so that the backplane support layer, foam buffer layer and heat dissipation layer in the traditional display module can be removed, further reducing The thickness of the display screen 21 is beneficial to reducing the overall thickness of the electronic device 200 .

The thickness of the glass substrate 2131 is greater than or equal to 30 microns and less than or equal to 200 microns. For example, the thickness of the glass substrate 2131 is 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns or 120 microns.

Compared with the traditional glass substrate with a thickness of 500 microns, the thickness of the glass substrate 2131 in the embodiment of the present application is thinned. The glass substrate 2131 not only plays a supporting role, but also further reduces the thickness of the display body 21, which is conducive to reducing the cost of electronics. The overall thickness of the device.

The second driving chip 216 is directly bound to the bonding area 213b of the organic light-emitting diode display panel assembly 213. It can be understood that the second driver chip 216 can also be disposed on the flip-chip film, and the flip-chip film is bound to the binding area 213b of the organic light-emitting diode display panel assembly 213.

The plurality of functional layers 214 are located on the light exit side of the organic light emitting diode display panel assembly 213 and located in the first accommodation cavity 2113a. Among the plurality of functional layers 214 , the functional layer 214 that is farthest from the organic light-emitting diode display panel assembly 213 is away from the surface of the organic light-emitting diode display panel assembly 213 , and is located on the surface of the second driver chip 216 that is far away from the organic light-emitting diode display panel assembly 213 . One side of the diode display panel assembly 213.

Specifically, the plurality of functional layers 214 include a second polarizer 2141 and a second protective cover 2142 . The second protective cover 2142 is a glass cover or an organic transparent protective cover. The second polarizer 2141 is disposed on the light-emitting side of the organic light-emitting diode display panel assembly 213, and the second polarizer 2141 and the organic light-emitting diode display panel assembly 213 are bonded through a third adhesive layer 2143. The second protective cover 2142 is disposed on the side of the second polarizer 2141 away from the organic light-emitting diode display panel assembly 213 . The second protective cover 2142 and the second polarizer 2141 are bonded through the fourth adhesive layer 2144 .

The second driving chip 216 has a first surface 216a. The first surface 216a is a surface of the second driving chip 216 away from the organic light-emitting diode display panel assembly 213. The second protective cover 2142 is the functional layer 214 farthest from the organic light-emitting diode display panel assembly 213 among the plurality of functional layers 214. The second protective cover 2142 has a second surface 2142a, and the second surface 2142a is the second protective cover. 2142 is away from the surface of the organic light emitting diode display panel assembly 213, and the first surface 216a is located on a side of the second surface 2142a close to the organic light emitting diode display panel assembly 213.

The frame 2112 includes a frame body and an opening 2112a. The frame 2112 is located above the second protective cover 2142 and the second driver chip 216. The frame body overlaps with the binding area 213b and the wiring area 213c, so that the frame body blocks the non-display area of the organic light-emitting diode display panel assembly 213, and the opening 2112a overlaps with the display area of the display module, so that the organic light-emitting diode displays The light emitted from the display area 213a of the panel assembly 213 can pass through.

Please refer to FIG. 7 , which is a schematic cross-sectional view of the host of the electronic device shown in FIG. 2 . The host 22 includes a second housing assembly 223. The second housing assembly 223 includes a second back cover 221 and a cover 222. The second back cover 221 includes a second bottom plate 2211 and four second side plates 2212. The second bottom plate 2211 It is rectangular, with four second side plates 2212 arranged along the four edges of the second bottom plate 2211. Two adjacent second side plates 2212 are adjacent to each other. The second bottom plate 2211 and the four second side plates 2212 form a second volume. Place cavity 22a.

The second flexible connector 215 is used to transmit electrical signals. The second flexible connector 215 is a flexible printed circuit board, but is not limited thereto. The second flexible connector 215 may also be a chip-on-chip film.

Please refer to FIG. 3 and FIG. 5 at the same time. The second flexible connector 215 has a first binding end 2151 and a second binding end 2152 arranged oppositely. The first binding end 2151 of the second flexible connector 215 is bound to the organic In the binding area 213b of the LED display panel assembly 213, the portion between the second binding end 2152 and the first binding end 2151 of the second flexible connector 215 passes through the first side plate 2114 of the first back cover 2111 and The gap between the frames 2112 extends into the second accommodation cavity 22a of the host 22, and the second binding end 2152 of the second flexible connector 215 extends into the second accommodation cavity 22a of the second housing assembly 223. The second logic circuit board 217 is disposed in the second accommodation cavity 22a. The second binding end 2152 of the second flexible connector 215 is connected to the second logic circuit board 217. The second flexible connector 215 is connected to the second driver chip 216. They are electrically connected through lines in the thin film transistor array layer.

In the embodiment of the present application, when the organic light-emitting diode display panel assembly 213 is in a flat state to achieve thinning of the display body 21 , the first flexible connector 215 is used to transmit electrical signals. The binding end 2151 is bound to the binding area 213b of the organic light-emitting diode display panel assembly 213, and the second binding end 2152 of the second flexible connector 215 extends to the second receiving cavity 22a of the second housing assembly 223, And the second logic circuit board 217 is disposed in the second accommodation cavity 22a of the host 22 to reduce the need for the second flexible connector 215 and the second logic circuit board 217 to occupy the non-display area space in the first accommodation cavity 2113a. To reduce the size of the non-display area of the display screen 21, thereby reducing the size of the non-display area of the electronic device. Therefore, the electronic device according to the embodiment of the present application can achieve thin thickness and narrow frame at the same time.

The portion of the second flexible connector 215 other than the first binding end 2151 and located in the first receiving cavity 2113a is located on the organic light-emitting diode display panel assembly 213 in a direction perpendicular to the thickness of the organic light-emitting diode display panel assembly 213 side, so that the second flexible connector 215 will not be bent to the back of the organic light-emitting diode display panel assembly 213 to further reduce the display module after the second flexible connector 215 is bound to the organic light-emitting diode display panel assembly 213. overall thickness.

The rotating assembly includes a first connecting member 231 and a rotating shaft (not shown). The first connecting member 231 is connected to the first side plate 2114 close to the binding area 213b of the organic light-emitting diode display panel assembly 213. The first connecting member 231 includes a connecting member 231 and a rotating shaft (not shown). hole 231a, the rotating shaft passes through the connecting hole 231a and is clamped on the second back cover 221, thereby realizing a rotational connection between the display screen body 21 and the host 22.

Please refer to FIG. 8 , which is a second schematic cross-sectional view of the display screen of the electronic device shown in FIG. 2 . The display screen shown in Figure 8 is basically similar to the display screen shown in Figure 5, and the similarities will not be repeated. The differences include that the electronic device 200 also includes a light-shielding layer 24 and a second heat dissipation layer 25. The light-shielding layer 24 and the second heat dissipation layer 25. The two heat dissipation layers 25 are both disposed in the first accommodation cavity 2113a.

The light-shielding layer 24 is disposed on the back side of the light-emitting surface of the organic light-emitting diode display panel assembly 213 to reduce the reflection of ambient light by the display screen 21 when the screen is in a rest state, and to reduce the reflection of ambient light in the non-display area of the organic light-emitting diode display panel assembly 213 . The wiring acts as a shield. Specifically, the light-shielding layer 24 is disposed on the back side of the light-emitting surface of the organic light-emitting diode display panel assembly 213 .

The light-shielding layer 24 is a black ink layer, and the thickness of the light-shielding layer 24 is greater than or equal to 8 microns and less than or equal to 10 microns. When the light-shielding layer 24 is a black ink layer, the light-shielding layer 24 can be formed on the back of the light-emitting surface of the organic light-emitting diode display panel assembly 213 by printing or coating.

The second heat dissipation layer 25 is disposed on the back side of the light emitting surface of the organic light emitting diode display panel assembly 213 for heat dissipation. The thickness of the second heat dissipation layer 25 is greater than or equal to 15 microns and less than or equal to 25 microns. The second heat dissipation layer 25 is made of copper. It can be understood that the second heat dissipation layer 25 may also be made of graphene.

Specifically, the second heat dissipation layer 25 is disposed on the surface of the light shielding layer 24 away from the organic light emitting diode display panel assembly 213 . The second heat dissipation layer 25 is fixed on the first bottom plate 2113 of the first back cover 2111 through the second adhesive layer 220 .

Please refer to FIG. 9 , which is a third schematic cross-sectional view of the display screen of the electronic device shown in FIG. 2 . The display screen shown in Figure 9 is basically similar to the display screen shown in Figure 5, and the similarities will not be repeated. The differences include that the functional layer 214 that is the largest distance from the organic light-emitting diode display panel assembly 213 is far away from the organic light-emitting diode display panel. The surface of the assembly 213 is located on the side of the driving chip 216 away from the organic light-emitting diode display panel assembly 213 and close to the organic light-emitting diode display panel assembly 213. The first housing assembly 211 includes a groove 211a corresponding to the driving chip 216. The driving chip 216 At least part of them is located in the groove 211a, so as to thin the thickness of the display screen 21 and at the same time avoid the problem of assembly interference between the frame 2112 of the first housing assembly 211 and the driving chip 216.

Specifically, the plurality of functional layers 214 include the second polarizer 2141 instead of the second protective cover 2142 to reduce the impact of ambient light on the display effect of the organic light-emitting diode display panel assembly 213. At this time, the organic light emitting diode display panel assembly 213 does not include a color filter film. The second polarizer 2141 is located on the light-emitting side of the organic light-emitting diode display panel assembly 213. The second polarizer 2141 and the organic light-emitting diode display panel assembly 213 are bonded through the fifth adhesive layer 2146.

The functional layer 214 also includes a hard layer 2145, which is disposed on the surface of the second polarizer 2141 away from the organic light-emitting diode display panel assembly 213. The hard layer 2145 is used to replace the protective cover, which not only plays a protective role, but also further thins the thickness of the display module.

The hard layer 2145 has a third surface 2145a. The third surface 2145a is the surface of the hard layer 2145 away from the organic light-emitting diode display panel assembly 213. The third surface 2145a is located on the side of the first surface 216a close to the organic light emitting diode display panel assembly 213, so that the thickness of the display module is thinned.

The frame 2112 includes a groove 211a corresponding to the driver chip 216. The depth of the groove 211a is smaller than the thickness of the frame 2112. The driver chip 216 is partially located in the groove 211a to avoid assembly interference problems when the frame 2112 is assembled.

Please refer to FIGS. 10 and 11 . FIG. 10 is a fourth schematic cross-sectional view of the display screen of the electronic device shown in FIG. 2 . FIG. 11 is a schematic view of the organic light-emitting diode display panel assembly shown in FIG. 10 . The display screen shown in Figure 10 is basically similar to the display screen shown in Figure 9, and the similarities will not be repeated. The differences include that the display module shown in Figure 10 does not include the second polarizer 2141, and the organic film shown in Figure 10 The light-emitting diode display panel assembly 213 also includes a color filter layer 2136. The color filter layer 2136 is located on the side of the thin film encapsulation layer 2134 away from the light-emitting pixel layer 2133. The hard layer 2145 is in contact with the light exit surface of the organic light-emitting diode display panel assembly 213. To further reduce the thickness of the display module, thereby thinning the thickness of the display screen 21 .

Please refer to FIG. 12 , which is a schematic cross-sectional view of a display screen of an electronic device according to another embodiment of the present application. The display screen shown in Figure 12 is basically similar to the display screen shown in Figure 5, and the similarities will not be repeated. The differences include that at least part of the second flexible connection member 215 of the display screen shown in Figure 12 is in the first The accommodating cavity 2113a and/or the second accommodating cavity 22a is bent in a roundabout way so that the second flexible connecting member 215 has a stretchable margin when the display body 21 and the host 22 are relatively rotated, so as to prevent the display body from being damaged. The second flexible connecting member 215 is damaged due to over-stretching during relative rotation between 21 and the main unit 22 .

Specifically, in a direction perpendicular to the thickness of the organic light-emitting diode display panel assembly 213, there is a gap L between the organic light-emitting diode display panel assembly 213 and the first housing assembly 211. The second flexible connection member 215 is in addition to the first binding member. At least part of the fixed end 2151 located in the first accommodation cavity 2113a is meanderingly bent in the gap L along the thickness direction of the organic light-emitting diode display panel assembly 213, so as to allow the second second time when the display body 21 and the host 22 are relatively rotated. The flexible connector 215 has a stretch margin, which prevents the second flexible connector 215 from being damaged due to over-stretching when the display body 21 and the host 22 are relatively rotated, and is conducive to thinning the thickness of the display module. .

It can be understood that the part of the second flexible connecting member 215 can also be bent in a circuitous manner in the second receiving cavity 22a of the second housing assembly 223. Alternatively, while a part of the second flexible connecting member 215 is bent in the first accommodation cavity 2113a, another part of the second flexible connecting member 215 is bent in a roundabout way in the second accommodation cavity 22a of the second housing assembly 223. fold.

It should be noted that at least part of the second flexible connecting member 215 may be bent once, twice, or more than twice. The shape of the second flexible connecting member 215 being bent once includes but is not limited to a V-shape and a U-shape.

As shown in FIG. 13 , it is a schematic cross-sectional view of the organic light-emitting diode display panel assembly shown in FIG. 12 . The differences between the display screen shown in Figure 12 and the display screen shown in Figure 5 include that, as shown in Figure 13, the organic light-emitting diode display panel assembly 213 does not include a glass substrate 2131 and is only a flexible organic light-emitting diode display panel 2135. Correspondingly, the second adhesive layer 220 is in contact with both the back side of the light-emitting surface of the flexible organic light-emitting diode display panel 2135 and the surface of the first housing component 211 . Specifically, the second adhesive layer 220 is in contact with the back surface of the light-emitting surface of the flexible organic light-emitting diode display panel 2135 and the first bottom plate 2113 of the first back cover 2111 .

The electronic device according to the embodiment of the present application peels off the flexible organic light-emitting diode display panel 2135 from the glass substrate 2131, and removes the backplane support layer, foam buffer layer, heat dissipation layer, etc. in the traditional display module. 2135 is directly bonded to the first base plate 2113 of the first housing assembly 211 through the second adhesive layer 220. The first base plate 2113 supports the flexible organic light emitting diode display panel 2135 to further reduce the thinning of the display. The thickness of the screen body 21.

It should be noted that any combination of different and compatible solutions in the above-mentioned electronic devices can be performed, and details will not be described here.

The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or modify some of them. Equivalent substitutions are made for the features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present application.

Claims

An electronic device, wherein the electronic device includes:

a first housing assembly, the first housing assembly including a first accommodation cavity;

An organic light-emitting diode display panel assembly, the organic light-emitting diode display panel assembly is disposed in the first accommodation cavity, the organic light-emitting diode display panel assembly has a display area and a binding area located outside the display area;

a second housing component, the second housing component is rotationally connected to the first housing component, the second housing component has a second accommodation cavity; and

Flexible connector, the flexible connector is used to transmit electrical signals, the flexible connector has a first binding end and a second binding end that are oppositely arranged, the first binding end of the flexible connector is bound to Positioned at the binding area of the organic light emitting diode display panel assembly, the second binding end of the flexible connector extends into the second receiving cavity of the second housing assembly.
The electronic device according to claim 1, wherein the electronic device further includes:

An adhesive layer is used to bond the organic light-emitting diode display panel component and the first housing component.
The electronic device according to claim 2, wherein the organic light-emitting diode display panel assembly includes a flexible organic light-emitting diode display panel, and the adhesive layer is respectively connected to the back surface of the light-emitting surface of the flexible organic light-emitting diode display panel and the Surface contact of the first housing component.
The electronic device according to claim 2, wherein the organic light-emitting diode display panel assembly includes sequentially stacked glass substrates and a flexible organic light-emitting diode display panel, and the adhesive layer and the organic light-emitting diode display panel assembly are The glass substrate is in contact with the surface of the first housing component.
The electronic device according to claim 4, wherein the thickness of the glass substrate is greater than or equal to 30 microns and less than or equal to 200 microns.
The electronic device according to claim 2, wherein the adhesive layer is foam glue.
The electronic device of claim 1, wherein the display area is coplanar with the binding area.
The electronic device according to claim 7, wherein the electronic device further includes:

A driver chip bound to the binding area of the organic light-emitting diode display panel assembly; and

The functional layer is arranged in the first accommodation cavity and is located on the light emitting side of the organic light-emitting diode display panel assembly. The functional layer that is farthest from the organic light-emitting diode display panel assembly is away from the organic light-emitting diode display panel assembly. The surface of the diode display panel assembly is located on a side of the driving chip away from the surface of the organic light-emitting diode display panel assembly and close to the organic light-emitting diode display panel assembly. The first housing assembly includes a A groove, at least part of the driver chip is located in the groove.
The electronic device of claim 8, wherein the first housing assembly includes:

The back cover includes the first accommodation cavity; and

The frame is located on a side of the functional layer away from the organic light-emitting diode display panel assembly, and includes the groove.
The electronic device according to claim 8, wherein the organic light-emitting diode display panel assembly includes a color filter layer, and the functional layer includes:

A hard layer is located on the light exit surface of the organic light emitting diode display panel assembly and is in contact with the light exit surface of the organic light emitting diode display panel assembly.
The electronic device according to claim 8, wherein the organic light-emitting diode display panel assembly does not include a color filter layer, and the functional layer includes:

A polarizer arranged on the light-emitting side of the organic light-emitting diode display panel assembly; and

A hard layer is provided on a surface of the polarizer away from the organic light-emitting diode display panel assembly.
The electronic device according to claim 1, wherein the electronic device further includes:

A logic circuit board is provided in the second accommodation cavity.
The electronic device according to claim 1, wherein the part of the flexible connector other than the first binding end and located in the first accommodation cavity is located in the organic light emitting diode display panel assembly. One side in a direction perpendicular to the thickness of the organic light emitting diode display panel assembly.
The electronic device according to claim 13, wherein at least part of the flexible connector is meanderingly bent in the first receiving cavity.
The electronic device according to claim 1, wherein at least part of the flexible connection member is meanderingly bent in the second accommodation cavity.
The electronic device according to claim 13, wherein there is a gap between the organic light-emitting diode display panel assembly and the first housing assembly in a direction perpendicular to the thickness of the organic light-emitting diode display panel assembly, The flexible connector is meanderingly bent along the thickness direction of the organic light emitting diode display panel assembly.
The electronic device of claim 1, wherein the flexible connector includes at least one of a flexible printed circuit board and a chip-on-chip film.