CN116615051A

CN116615051A - Display module

Info

Publication number: CN116615051A
Application number: CN202310744162.5A
Authority: CN
Inventors: 张国建; 周秀峰; 李学斌; 袁海江
Original assignee: HKC Co Ltd
Current assignee: HKC Co Ltd
Priority date: 2023-06-20
Filing date: 2023-06-20
Publication date: 2023-08-18

Abstract

The application provides a display module, which comprises a display panel and a supporting component, wherein the display panel comprises a substrate, a circuit layer and a light-emitting layer; the substrate includes a front side and a back side, and a first side connecting the front side and the back side; the circuit layer and the light-emitting layer are arranged on the front surface; the front surface is provided with a binding area; the binding region is arranged close to the first side surface, and the circuit layer comprises a binding electrode positioned in the binding region; the support assembly comprises a buffer layer and a support layer; the buffer layer is arranged on the back surface of the display panel, and the support layer is at least arranged on one side of the buffer layer far away from the display panel; the support layer comprises a bottom wall and a first side wall connected with the bottom wall; the bottom wall is arranged at one side of the buffer layer far away from the display panel; the first side wall extends to at least one side of the first side surface. This display module assembly sets up the buffer layer through the back at display panel, again through setting up the supporting layer in one side that the display panel was kept away from to the buffer layer, can prevent that the display module assembly from breaking in the handling, realizes the better protection to the display module assembly.

Description

Display module

Technical Field

The application relates to the technical field of display, in particular to a display module.

Background

At present, common packaging modes of medium-size rigid OLED products mainly comprise a mode of TFT (Thin Film Transistor) glass, packaging glue and glass packaging, the strength of an integral module can be improved by the OLED packaging structure of two layers of glass, the integral thickness of the module can be increased at the same time, and the binding area cannot be fully covered by upper-layer packaging glass, so that the OLED display panel is still single-layer glass in the binding area, and a weak strength area exists.

In recent years, OLED packaging structures of single-layer glass having only TFT glass, multilayer thin film packaging (TFE), and polarizing layers have been developed. However, the OLED package structure is more fragile than the package form of the double-layer glass. In the whole machine collision test or machine disassembly process, the TFT glass of the binding area is easily damaged by external force, and the TFT glass is the binding area of the TFT densely-distributed wires, and the damage of the area is almost percentile, so that the display of the OLED display panel is poor.

Disclosure of Invention

The application provides a display module, which mainly solves the problems of poor display and damage of a binding area of the display module due to external force caused by weak strength of the existing display module.

In order to solve the technical problems, the application provides a display module, which comprises:

a display panel including a substrate, a circuit layer, and a light emitting layer; the substrate includes a front side and a back side, and a first side connecting the front side and the back side; the circuit layer and the light-emitting layer are arranged on the front surface; the front surface is provided with a binding area; the binding region is arranged close to the first side face, and the circuit layer comprises a binding electrode positioned in the binding region;

a support assembly including a buffer layer and a support layer; the buffer layer is arranged on the back surface of the display panel, and the supporting layer is at least arranged on one side of the buffer layer away from the display panel;

the support layer comprises a bottom wall and a first side wall connected with the bottom wall; the bottom wall is arranged on one side of the buffer layer away from the display panel; the first side wall extends to at least one side of the first side surface.

In a specific embodiment, an end of the first side wall remote from the bottom wall is lower than the front surface.

In a specific embodiment, the ratio of the distance between the end of the first side wall away from the bottom wall and the front surface to the width of the first side surface in the thickness direction of the substrate is 10% -20%.

In a specific embodiment, an end of the first sidewall away from the bottom wall is not lower than the front surface, and an end of the first sidewall away from the bottom wall has a notch corresponding to the binding region, so that the binding electrode is exposed.

In one embodiment, the circuit further comprises a circuit module; one end of the circuit module is bound with the binding electrode, and the other end of the circuit module extends out of the display panel from the notch.

In a specific embodiment, the support layer further comprises two extensions; the two extending parts are connected with one end of the first side wall far away from the bottom wall; the two extending parts are arranged at one side of the circuit layer far away from the substrate in a suspending way; the two extension parts are arranged at two opposite sides of the binding area at intervals, so that the binding electrode is exposed.

In a specific embodiment, an end of the first side wall away from the bottom wall is not lower than the front surface, and an insulating coating is disposed on a surface of the first side wall close to the first side surface.

In a specific embodiment, the substrate includes an annular side connecting the front side and the back side, the annular side including the first side; the support layer comprises an annular side wall connected with the bottom wall, and the annular side wall comprises a first side wall; the support layer is arcuate at the corners of the bottom wall and the annular side wall, and the substrate is chamfered at the corners of the back surface and the annular side surface.

In a specific embodiment, the buffer layer is a foam layer, and the support layer is a rigid metal or rigid alloy shell.

In a specific embodiment, the supporting component is composed of the buffer layer and the supporting layer, the thickness of the buffer layer is less than or equal to 0.05mm, and the thickness of the supporting layer is 0.05-0.15mm.

The application provides a display module, which comprises a display panel and a supporting component, wherein the display panel comprises a substrate, a circuit layer and a light-emitting layer; the substrate includes a front side and a back side, and a first side connecting the front side and the back side; the circuit layer and the light-emitting layer are arranged on the front surface; the front surface is provided with a binding area; the binding region is arranged close to the first side surface, and the circuit layer comprises a binding electrode positioned in the binding region; the support assembly comprises a buffer layer and a support layer; the buffer layer is arranged on the back surface of the display panel, and the support layer is at least arranged on one side of the buffer layer far away from the display panel; the support layer comprises a bottom wall and a first side wall connected with the bottom wall; the bottom wall is arranged at one side of the buffer layer far away from the display panel; the first side wall extends to at least one side of the first side surface. This display module assembly is through setting up the buffer layer at display panel's the back, again through setting up the supporting layer including diapire and the first lateral wall of being connected with the diapire in one side that the buffer layer was kept away from display panel, the supporting layer extends to first lateral side from the diapire back, can prevent that display module assembly from following to carry, transfer or the in-process collision of transportation from leading to the binding district of substrate broken, promotes whole yields to realize the better protection to display module assembly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of a display module according to a first embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of the display module of FIG. 1 taken along line A-A;

fig. 3 is a schematic side view of a first side portion of a display module according to a first embodiment of the present application;

FIG. 4 is a schematic view showing a part of a supporting layer in a first embodiment;

FIG. 5 is a schematic diagram of the display module of FIG. 2 after the display module is bound to the circuit module;

fig. 6 is a schematic top view of a display module according to a second embodiment of the application;

FIG. 7 is a schematic cross-sectional view of the display module of FIG. 6 taken along B-B;

fig. 8 is a schematic side view of a first side portion of a display module according to a second embodiment of the present application;

FIG. 9 is a schematic diagram of the display module of FIG. 7 after the display module is bound to the circuit module;

fig. 10 is a schematic top view of a display module according to a third embodiment of the application;

FIG. 11 is a schematic cross-sectional view of the display module of FIG. 10 taken along line C-C;

FIG. 12 is a schematic cross-sectional view of the display module of FIG. 10 taken along D-D;

fig. 13 is a schematic side view of a first side portion of a display module according to a third embodiment of the present application;

fig. 14 is a schematic top view of a display module according to a fourth embodiment of the application;

FIG. 15 is a schematic cross-sectional view of the display module of FIG. 14 taken along E-E;

FIG. 16 is a schematic cross-sectional view of the display module of FIG. 14 taken along the line F-F;

fig. 17 is a schematic side view of a first side portion of a display module according to a fourth embodiment of the present application;

fig. 18 is a schematic top view of a display module according to a fifth embodiment of the application;

FIG. 19 is a schematic cross-sectional view of the display module of FIG. 18 taken along G-G;

fig. 20 is a schematic side view of a first side portion of a display module according to a fifth embodiment of the present application;

fig. 21 is a schematic view showing a partial structure of a support layer in the fifth embodiment.

Reference numerals illustrate:

10-a display panel; 101-a substrate; 1011—front; 1012-back; 1013-a first side; 102-a circuit layer; 1021-binding electrode; 103-a light emitting layer; 104-a polarizing layer; 105-packaging layer; 20-a support assembly; 201-a buffer layer; 202-a support layer; 2021-bottom wall; 2022-first sidewall; 2022 a-notch; 2022 b-extension; 30-a circuit module; 301-a flexible circuit board; 302-a printed circuit board; 100-a display module; an H-ring shaped sidewall; k-opening; q-binding area; w-insulating coating.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.

The terms "first," "second," "third," and the like in this disclosure are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Whether the packaging structure is in a two-layer glass form of TFT glass, packaging adhesive and glass packaging or in a single-layer glass form of TFT glass, multi-layer film packaging and polarizing layer packaging structure, a composite foam copper foil adhesive tape is attached to the back surface of the TFT glass, so that the purposes of buffering and absorbing shock and heat dissipation are achieved. However, when the existing composite foam copper foil tape is attached to the TFT glass, in order to ensure the attachment yield, the design is usually in an inward shrinking form, that is, the foam copper foil tape is inward shrinking relative to the TFT glass, and cannot effectively protect the area at the edge of the TFT glass, so that the TFT glass in the binding area is easily damaged due to external force in the whole machine collision test or disassembly process.

The OLED packaging structure can effectively protect TFT glass of the binding region from being damaged due to external force.

The present application will be described in detail with reference to the accompanying drawings and examples.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic top view of a display module according to a first embodiment of the present application; FIG. 2 is a schematic cross-sectional view of the display module of FIG. 1 taken along line A-A; fig. 3 is a schematic side view of a first side portion of a display module according to a first embodiment of the present application.

The application provides a display module 100, which comprises a display panel 10 and a support assembly 20. Specifically, the display module 100 may be an OLED package structure.

Among them, the display panel 10 includes a substrate 101, a circuit layer 102, and a light emitting layer 103. The substrate 101 includes a front surface 1011 and a back surface 1012, and a first side surface 1013 connecting the front surface 1011 and the back surface 1012. The circuit layer 102 and the light-emitting layer 103 are sequentially provided on the front surface 1011. Specifically, front face 1011 also has binding region Q; the bonding region Q is disposed adjacent to the first side 1013, and the circuit layer 102 includes a bonding electrode 1021 located at the bonding region Q. In a specific embodiment, the bonding electrode 1021 of the bonding region Q is used for bonding with an electrode of the circuit module 30 (as shown in fig. 5). It can be understood that the bonding region Q in the present application is a part of the edge region of the substrate 101, the bonding region Q is provided with a bonding electrode 1021, and the bonding electrode 1021 is a part of the circuit layer 102. The circuit layer 102 also includes TFT array circuitry. The first side 1013 is a portion of the side of the substrate 101, the first side 1013 being adjacent to the binding region Q.

The support assembly 20 includes a cushioning layer 201 and a support layer 202. The buffer layer 201 is disposed on the back surface 1012 of the display panel 10, and the buffer layer 201 is used for buffering and shock-absorbing during specific transportation. Specifically, the buffer layer 201 is a foam layer. The supporting layer 202 is at least arranged on one side of the buffer layer 201 away from the display panel 10; the support layer 202 includes a bottom wall 2021 and a first side wall 2022 connected to the bottom wall 2021; the bottom wall 2021 is disposed on a side of the buffer layer 201 away from the display panel 10; the first sidewall 2022 extends to at least one side of the first side 1013. The supporting layer 202 extends from the back 1012 of the bottom wall 2021 to the first side 1013, so as to prevent the binding area Q of the substrate 101 from being broken due to collision of the display module 100 in the subsequent conveying, transferring or transporting process, and improve the yield, so as to realize better protection of the display module 100.

Specifically, the support layer 202 may be a rigid metal or rigid alloy shell, and the thickness of the support layer 202 is the same in each portion. For example, the material of the support layer 202 is one of rigid alloy materials such as titanium alloy, aluminum alloy, magnesium aluminum alloy, and nickel alloy.

In particular, the support layer 202 may be a shell of substantially uniform thickness. The thickness of the support layer 202 is 0.05-0.15mm. For example, the thickness of the support layer 202 may be 0.05mm, 0.10mm, 0.15mm.

In particular, since the support layer 202 is a rigid shell, the thickness of the buffer layer 201 may be smaller. For example, the thickness of the buffer layer 201 is 0.05mm or less. For example, the thickness of the buffer layer 201 may be 0.25mm, 0.03mm, 0.35mm, 0.04mm, 0.45mm, 0.05mm. And the edge of the buffer layer 201 opposite the substrate 101 is retracted.

In this embodiment, the support assembly 20 is composed of a buffer layer 201 and a support layer 202, wherein the thickness of the buffer layer 201 is less than or equal to 0.05mm, and the thickness of the support layer 202 is 0.05-0.15mm. And the supporting component 20 of the display module 100 only comprises the buffer layer 201 and the supporting layer 202, compared with the supporting protection module with the thickness of 0.3mm in the existing product, the thickness of the display module 100 can be reduced, so that the display module 100 is lighter and thinner.

With continued reference to fig. 2 and 3, the end of the first side wall 2022 remote from the bottom wall 2021 is lower than the front face 1011 for reducing the risk of shorting of the bonding electrode 1021. Specifically, the ratio of the distance M1 between the end of the first side wall 2022 away from the bottom wall 2021 and the front face 1011 to the width M2 of the first side surface 1013 in the thickness direction of the substrate 101 is 10% to 20%. For example, the ratio of the distance between the end of the first side wall 2022 away from the bottom wall 2021 and the front surface 1011 to the width of the first side surface 1013 in the thickness direction of the substrate 101 may be 10%, 12%, 14%, 16%, 18%, 20%. So configured, it is possible to ensure that adequate protection is provided to the substrate 101 while reducing the risk of shorting of the bonding electrode 1021. In this embodiment, the front surface 1011 and the back surface 1012 are disposed in parallel, and the width M2 of the first side 1013 in the thickness direction of the substrate 101 is equal to the thickness of the substrate 101.

Referring to fig. 2 and fig. 4 in combination, fig. 4 is a schematic view showing a part of a specific structure of a support layer in the first embodiment. In a particular embodiment, the substrate 101 includes annular sides (not shown) that connect the front surface 1011 and the back surface 1012. The annular side includes a first side 1013. The support layer 202 includes an annular sidewall H connected to the bottom wall 2021, the annular sidewall H including a first sidewall 2022. For example, the substrate 101 is a rectangular substrate, and the first side 1013 corresponds to one side of the rectangular substrate; the support layer 202 forms a rectangular housing, and the first sidewall 2022 corresponds to one side of the rectangular housing. The support layer 202 is curved at the corners of the inner surface of the bottom wall 2021 and the inner surface of the annular side wall H, and the substrate 101 is chamfered at the corners of the back surface 1012 and the annular side surface. For example, the support layer 202 is curved at the junction of the bottom wall 2021 and the annular side wall H. Since the thickness of the support layer 202 is the same in each portion, in order to ensure the workability and yield of the support layer 202 in the production, the support layer 202 is set to be circular arc-shaped at the corners of the inner surface of the bottom wall 2021 and the inner surface of the annular sidewall H for transition. The chamfering of the substrate 101 at the corners of the back surface 1012 and the annular side surface is to avoid interference with the support layer 202, and reduce the possibility of damage to the substrate 101 due to interference.

Wherein preferably the end of the entire annular side wall H remote from the bottom wall 2021 is not higher than the front face 1011, reducing the risk of the annular side wall H scratching the circuit layer 102 or the encapsulation layer 105 of the display panel 10. In this embodiment, the end of the entire annular sidewall H far from the bottom wall 2021 may be lower than the front face 1011, and the end of the entire annular sidewall H far from the bottom wall 2021 may be flush, so that the manufacturing may be facilitated. Alternatively, it is also possible to provide the annular side wall H such that only the end of the first side wall 2022 remote from the bottom wall 2021 is lower than the front face 1011, and the end of the remaining annular side wall H remote from the bottom wall 2021 may be flush with the front face 1011, so that the arrangement may provide better protection to the substrate 101. Preferably, the annular sidewall H is broken at a corner or has an opening K to facilitate placement of the display panel 10 into a housing formed by the support layer 202.

Referring further to fig. 2, the display panel 10 of the display module 100 further includes a polarizing layer 104 and an encapsulation layer 105. The encapsulation layer 105 is disposed on a side of the light emitting layer 103 away from the substrate 101 and covers the light emitting layer 103, and the polarizing layer 104 is disposed on a side of the encapsulation layer 105 away from the substrate 101. The polarizing layer 104 and the encapsulation layer 105 do not cover the binding region Q, so that the binding electrode 1021 is exposed. The polarizing layer 104 has a polarizing function and functions to reduce reflection of external ambient light. The encapsulation layer 105 may be a TFE (Thin Film Encapsulation) film cover or a glass cover and an adhesive, but the present application is not limited thereto, and more preferably, the encapsulation is performed in a film cover manner, so that the thickness of the display module 100 is not increased.

With further reference to fig. 1-3 and fig. 5, fig. 5 is a schematic structural diagram of the display module of fig. 2 after the display module is bound to the circuit module. The display module 100 further includes a circuit module 30. One end of the circuit module 30 is bonded with the bonding electrode 1021, and the other end extends from the bonding area Q to the outside of the display panel 10. Specifically, the circuit module 30 includes a flexible circuit board 301 (Flexible Printed Circuit, FPC) and a printed circuit board 302 (Printed Circuit Board Assembly, PCBA). One end of the flexible circuit board 301 is bonded to the bonding electrode 1021, and the other end extends from the bonding area Q to the outside of the display panel 10 and is bonded to the printed circuit board 302.

The display module 100 provided in this embodiment is provided with the supporting layer 202 and the buffer layer 201. The buffer layer 201 is used for buffering and shock-proofing during specific transportation. In particular, the supporting layer 202 extends from the back 1012 of the bottom wall 2021 to the first side 1013, so as to prevent the binding area Q of the substrate 101 from being broken due to collision of the display module 100 in the subsequent conveying, transferring or transporting process, and improve the yield, so as to achieve better protection of the display module 100.

Referring to fig. 6, fig. 7 and fig. 8, fig. 6 is a schematic top view of a display module according to a second embodiment of the application; FIG. 7 is a schematic cross-sectional view of the display module of FIG. 6 taken along B-B; fig. 8 is a schematic side view of a first side portion of a display module according to a second embodiment of the present application.

The specific structure and function of the display module 100 provided in this embodiment are almost the same as those of the display module 100 provided in the first embodiment, except that the end of the first side wall 2022, which is far from the bottom wall 2021, in the display module 100 provided in this embodiment is not lower than the front face 1011.

Referring to fig. 7 and 8, as shown in fig. 3, an end of the first side wall 2022 away from the bottom wall 2021 is flush with the front surface 1011, and an end of the first side wall 2022 away from the bottom wall 2021 has a notch 2022a corresponding to the binding region Q. The notch 2022a increases the distance between the bonding electrode 1021 and the first sidewall 2022 to reduce the risk of short circuit after the bonding electrode 1021 contacts the first sidewall 2022.

With further reference to fig. 6-8 and fig. 9, fig. 9 is a schematic structural diagram of the display module of fig. 7 after the display module is bound to the circuit module. The display module 100 further includes a circuit module 30. One end of the circuit module 30 is bound with the binding electrode 1021, and the other end extends from the notch 2022a to the outside of the display panel 10. Specifically, the circuit module 30 includes a flexible circuit board 301 (Flexible Printed Circuit, FPC) and a printed circuit board 302 (Printed Circuit Board Assembly, PCBA). One end of the flexible circuit board 301 is bound with the binding electrode 1021, and the other end extends out of the display panel 10 and is bound with the printed circuit board 302.

Referring to fig. 10, 11, 12 and 13, fig. 10 is a schematic top view of a display module according to a third embodiment of the present application; FIG. 11 is a schematic cross-sectional view of the display module of FIG. 10 taken along line C-C; FIG. 12 is a schematic cross-sectional view of the display module of FIG. 10 taken along D-D; fig. 13 is a schematic side view of a first side portion of a display module according to a third embodiment of the present application. The specific structure and function of the display module 100 provided in the present embodiment are almost the same as those of the display module 100 provided in the second embodiment, except that the end of the first side wall 2022 remote from the bottom wall 2021 in the present embodiment is higher than the front face 1011. The same first side wall 2022 has a notch 2022a corresponding to the binding region Q at an end far from the bottom wall 2021. The notch 2022a may expose the bonding electrode 1021 to the first sidewall 2022 side to reduce the risk of shorting of the bonding electrode 1021. One end of the flexible circuit board 301 is bonded to the bonding electrode 1021, and the other end extends from the notch 2022a to the outside of the display panel 10 and is bonded to the printed circuit board 302. Preferably, the flexible circuit board 301 may form an interference fit at the notch 2022a, thereby clamping the flexible circuit board 301, reducing bending stress generated when the flexible circuit board 301 is bent to the back surface 1012 of the substrate 101, and reducing the risk of peeling of the flexible circuit board 301.

Referring to fig. 14, 15, 16 and 17, fig. 14 is a schematic top view of a display module according to a fourth embodiment of the application; FIG. 15 is a schematic cross-sectional view of the display module of FIG. 14 taken along E-E; FIG. 16 is a schematic cross-sectional view of the display module of FIG. 14 taken along the line F-F; fig. 17 is a schematic side view of a first side portion of a display module according to a fourth embodiment of the present application.

The specific structure and function of the display module 100 provided in the present embodiment are almost the same as those of the display module 100 provided in the second embodiment, except that the end of the first side wall 2022 away from the bottom wall 2021 is higher than the front face 1011 in the present embodiment, and the support layer 202 further includes two extending portions 2022b in the present embodiment.

Specifically, two extension portions 2022b are connected to one end of the first side wall 2022 away from the bottom wall 2021; the two extending portions 2022b are suspended on the side of the circuit layer 102 away from the substrate 101, and the circuit layer 102 can be better protected by the extending portions 2022b. The two extending portions 2022b are disposed at opposite sides of the binding region Q at intervals, so that the binding electrode 1021 is exposed, so as to reduce the risk of short circuit after the binding electrode 1021 contacts the first sidewall 2022. Preferably, the extension 2022b is located on the side of the polarizing layer 104 near the binding region Q, so as not to increase the thickness of the display module 100.

With further reference to fig. 14, it can be understood that, due to the positional relationship of the two extending portions 2022b, only three sides of the substrate 101 are provided with the side walls of the supporting layer 202 in this embodiment, wherein the opposite side of the first side 1013 is not provided with the supporting layer 202, so that the display panel 10 can be conveniently inserted into the supporting assembly 20 from the side where the supporting layer 202 is not provided.

Please refer to fig. 18, 19, 20 and 21. Fig. 18 is a schematic top view of a display module according to a fifth embodiment of the application; FIG. 19 is a schematic cross-sectional view of the display module of FIG. 18 taken along G-G; fig. 20 is a schematic side view of a first side portion of a display module according to a fifth embodiment of the present application; fig. 21 is a schematic view showing a partial structure of a support layer in the fifth embodiment. The specific structure and function of the display module 100 provided in this embodiment are almost the same as those of the display module 100 provided in the third embodiment, except that the inner surface of the first sidewall 2022 is provided with the insulating coating W in this embodiment, and the end of the first sidewall 2022 away from the bottom wall 2021 is not provided with the notch 2022a corresponding to the binding region Q (see fig. 13).

Reference is made to fig. 19 and 21 in combination. In a particular embodiment, the substrate 101 includes annular sides (not shown) that connect the front surface 1011 and the back surface 1012. The annular side includes a first side 1013. The support layer 202 includes an annular sidewall H connected to the bottom wall 2021, the annular sidewall H including a first sidewall 2022, and the annular sidewall H is broken or forms an opening K at a corner of the sidewall. The surface of the first sidewall 2022 adjacent to the first side 1013 is provided with an insulating coating W, where the insulating coating W may reduce the risk of a short circuit that may exist when the bonding electrode 1021 contacts the support layer 202. The insulating coating W is provided only on the inner surface of the annular side wall H, and the inner surface of the bottom wall 2021 is not provided. The insulating coating W may be applied, deposited or electroplated, and the application is not limited in this regard.

It will be appreciated that the insulating coating W may be disposed only on the surface of the first side wall 2022 adjacent to the first side surface 1013, or may be disposed on each side of the annular side wall H, so as to reduce the risk of short circuits that may occur when the binding electrode 1021 contacts the support layer 202.

Specifically, the material of the insulating coating W may be one of insulating resin, silicon oxide, nitride, and the like.

Specifically, the thickness of the insulating coating W is 0.02-0.05mm.

The display module 100 provided by the application comprises a display panel 10 and a support assembly 20, wherein a buffer layer 201 is arranged on the back surface 1012 of the display panel 10 and is used for buffering and shockproof in a specific transportation process. The supporting layer 202 extends from the back 1012 of the bottom wall 2021 to the first side 1013, so as to prevent the binding area Q of the substrate 101 from being broken due to collision of the display module 100 in the subsequent conveying, transferring or transporting process, and improve the yield, so as to realize better protection of the display module 100. The display module 100 further reduces the risk of short circuit after the binding electrode 1021 and the support layer 202 are in contact by providing the insulating coating W. Specifically, the display module 100 improves the overall strength of the display module 100 by setting the supporting layer 202 and the buffer layer 201, so that the passing rate of the display module 100 during strength test can be improved. Meanwhile, the supporting layer 202 is a rigid metal or rigid alloy shell, and the metal alloy has high heat conductivity, so that the heat dissipation has an inherent advantage, and the service life of the display module 100 and the uniformity of the display image quality can be further improved. In addition, the supporting component 20 of the display module 100 provided by the application only comprises the buffer layer 201 and the supporting layer 202, and compared with the supporting protection module with the thickness of 0.3mm in the prior art, the thickness of the display module 100 can be reduced, so that the display module 100 is lighter and thinner.

It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.

Claims

1. A display module, comprising:

the support layer is characterized by comprising a bottom wall and a first side wall connected with the bottom wall; the bottom wall is arranged on one side of the buffer layer away from the display panel; the first side wall extends to at least one side of the first side surface.

2. The display module of claim 1, wherein an end of the first sidewall remote from the bottom wall is lower than the front surface.

3. The display module of claim 2, wherein a ratio of a distance between an end of the first side wall away from the bottom wall and the front surface to a width of the first side surface in a thickness direction of the substrate is 10% -20%.

4. The display module assembly of claim 1, wherein an end of the first sidewall away from the bottom wall is not lower than the front surface, and an end of the first sidewall away from the bottom wall has a notch corresponding to the binding region to expose the binding electrode.

5. The display module of claim 4, further comprising a circuit module; one end of the circuit module is bound with the binding electrode, and the other end of the circuit module extends out of the display panel from the notch.

6. The display module of claim 4, wherein the support layer further comprises two extensions; the two extending parts are connected with one end of the first side wall far away from the bottom wall; the two extending parts are arranged at one side of the circuit layer far away from the substrate in a suspending way; the two extension parts are arranged at two opposite sides of the binding area at intervals, so that the binding electrode is exposed.

7. The display module assembly of claim 1, wherein an end of the first sidewall remote from the bottom wall is not lower than the front surface, and a surface of the first sidewall adjacent to the first side surface is provided with an insulating coating.

8. The display module of any one of claims 1-7, wherein the substrate includes an annular side connecting the front and back sides, the annular side including the first side; the support layer comprises an annular side wall connected with the bottom wall, and the annular side wall comprises a first side wall; the support layer is arcuate at the corners of the bottom wall and the annular side wall, and the substrate is chamfered at the corners of the back surface and the annular side surface.

9. The display module of any one of claims 1-7, wherein the buffer layer is a foam layer and the support layer is a rigid metal or rigid alloy housing.

10. The display module of claim 9, wherein the support assembly is composed of the buffer layer and the support layer, the thickness of the buffer layer is 0.05mm or less, and the thickness of the support layer is 0.05-0.15mm.