WO2024008452A1 - Procédé de tranchage simultané d'une pluralité de tranches à partir d'une pièce à travailler au moyen d'une scie à fil - Google Patents

Procédé de tranchage simultané d'une pluralité de tranches à partir d'une pièce à travailler au moyen d'une scie à fil Download PDF

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Publication number
WO2024008452A1
WO2024008452A1 PCT/EP2023/066805 EP2023066805W WO2024008452A1 WO 2024008452 A1 WO2024008452 A1 WO 2024008452A1 EP 2023066805 W EP2023066805 W EP 2023066805W WO 2024008452 A1 WO2024008452 A1 WO 2024008452A1
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WO
WIPO (PCT)
Prior art keywords
wire
workpiece
cutting
saw
liquid
Prior art date
Application number
PCT/EP2023/066805
Other languages
German (de)
English (en)
Inventor
Georg Pietsch
Alexander Rieger
Katharina Weindl
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of WO2024008452A1 publication Critical patent/WO2024008452A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the subject of the invention is a method for simultaneously separating a plurality of slices from a workpiece using a wire saw, comprising a cutting grinding process, wherein a workpiece is moved perpendicular to a longitudinal axis of the workpiece against a wire frame of a sawing wire stretched between two wire guide rollers and which is moved in the longitudinal direction of the sawing wire , is delivered, wherein a cooling lubricant is supplied to the wire mesh, and discs are created between wire sections of the wire mesh, which are attached to a strip and between which there are separating gaps; and that is pulling the bar and the discs out of the wire gate.
  • disks made of single-crystalline semiconductor material for structuring microelectronic components are required.
  • Such disks are obtained, for example, by cutting off a cylindrical workpiece made of single-crystalline silicon using wire saws.
  • a method and a device for wire sawing are known, for example, from DE 102016 211 883 A1.
  • saw wire is guided in a spiral around at least two wire guide rollers, so that two wire guide rollers span a wire grid made of parallel wire sections facing the workpiece.
  • the lateral surfaces of the wire guide rollers are provided with a large number of circularly closed grooves which run in planes perpendicular to the axes of the wire guide rollers and which guide the saw wire. Rotating the wire guide rollers in the same direction creates a relative movement between the wire sections and the workpiece.
  • a wire saw also has a feed device to which the workpiece is attached via a strip to which it is glued and which feeds the workpiece vertically onto the wire frame.
  • the workpiece that has been cut into slices must be pulled out of the wire mesh by reversing the direction of movement of the feed device (Ingot Retrieval).
  • Saw wire is usually made of hypereutectic pearlitic steel (piano wire).
  • Straight (smooth) saw wires plain wire, straight wire
  • structured (structured wire, crimped wire) saw wires are used.
  • the cutting agent In wire cutting lapping, the cutting agent usually consists of silicon carbide (SiC) and the carrier fluid usually consists of oil or glycol.
  • the cutting agent When cutting wire, the cutting agent usually consists of water, possibly with a wetting agent and defoamer added, and the abrasive anchored in the saw wire is usually diamonds.
  • the bar is made of a plastic composite material or sintered carbon.
  • the saw wire When wire sawing, the saw wire is removed from a first supply, usually in the form of a first coil onto which the saw wire is wound, and after consumption is fed to a second supply, usually also in the form of a second coil.
  • the First coil is called fresh wire coil and the second coil is called old wire coil.
  • Wire sawing can be done with unidirectional or bidirectional wire movement. With unidirectional wire sawing, the saw wire is moved in a longitudinal direction from the fresh wire to the old wire coil over the entire duration of the cutting process.
  • wire sawing with bidirectional wire movement the saw wire is moved during the cutting process by means of at least one pair of directional reversals, a pair of directional reversals comprising first moving the saw wire by a first length in a first wire longitudinal direction and a second moving the saw wire by a second length in a second , the first includes exactly the opposite direction.
  • wire sawing with bidirectional wire movement can include a large number of such pairs of wire direction reversals, with the first length being chosen to be greater than the second length, so that overall the wire supply shifts from the fresh wire to the old wire coil during the cutting process.
  • the latter method is referred to as wire sawing in mit mode (pilgrim mode slicing, wirereciprocating slicing).
  • the main cutting surface When wire sawing without rocking, the main cutting surface extends along the entire arc length from the entry of the saw wire into the cutting gap to the exit of the saw wire from the cutting gap.
  • the main cutting surface at all times only consists of the short arc section with which the saw wire comes into contact with the curved dividing line between the workpiece and the separating gap due to the rocking.
  • Rocking improves the supply of cooling lubricant or slurry to the separating gaps, even for workpieces with large diameters.
  • the material removal rate is proportional to the pressure on the main cutting surface.
  • the material removal rate increases disproportionately with the pressure on the main cutting surface.
  • the workpiece cut into slices is pulled out of the wire frame by resetting the feed of the workpiece.
  • the saw wire is slowly moved in the longitudinal direction of the wire and cutting fluid is added in order to draw cutting fluid into the cutting gap as a cooling lubricant and to prevent friction of the saw wire in the cutting gap and jamming of individual wire sections between the opposite secondary cutting surfaces of a cutting gap.
  • the slow wire movement causes most of the slurry to drip off the saw wire before it enters the cutting gap, so that the thickness of the slurry film covering the saw wire in the separation gap is significantly smaller than the thickness of the slurry film during the previous separation process.
  • the saw wire has play in the cutting gap and does not get jammed. This promotes uniform sliding of the wire mesh through the separation gap and ultimately out of it, without the saw wire getting jammed between the secondary rake surfaces of the gap or causing material to be removed from the secondary rake surfaces.
  • the feed device is reset further.
  • the sawing wire is consequently deflected in the transverse direction of the wire and thereby elastically stretched in the longitudinal direction of the wire.
  • the saw wire experiences an increasing restoring force.
  • the saw wire jumps from the cutting depth at which it jammed during retrieval to a lower cutting depth where it jams again and so on (stick-and-slip movement of the saw wire). If the tensile force due to the longitudinal wire elongation as a result of the transverse deflection of the saw wire exceeds the material strength of the saw wire, the saw wire will break during ingot retrieval.
  • the workpiece must be completely returned from the defective wire frame, the wire residues must be removed from the cutting gaps by hand, and the wire frame must be repaired before the next cutting process.
  • This is time-consuming and costly.
  • the saw wire breaks during the cutting process due to overloading or material defects in the saw wire.
  • the partially separated workpiece must then be moved out of the defective wire mesh by resetting the feed device, the wire residues removed from the separation gaps, the wire mesh repaired, the wire sections re-threaded into the existing separation gaps and the workpiece up to the cutting depth at which the Wire breakage occurred must be closed again in order to be able to complete the cutting process.
  • the workpiece When wire cutting lapping, the workpiece can be threaded and fed into the wire mesh effortlessly and without the saw wire getting caught at certain cutting depths, as the saw wire has sufficient play in the cutting gap due to the surrounding slurry film.
  • the saw wire During wire cutting, where the saw wire has no freedom of movement, the saw wire jams when the workpiece is fed and notches are created.
  • Discs for solar applications that are removed after the separation process has been completed and Remove from the wire saw, still hanging with its adhesive joint on the saw strip (sacrificial strip), and immerse it in a cleaning bath.
  • the joints are supplied with rinsing liquid from several separate spray nozzles. Where rinsing liquid is sprayed in, the separation gap in the water bath widens, increasing the cleaning effect.
  • rinsing liquid is sprayed in, the separation gap in the water bath widens, increasing the cleaning effect.
  • JP 2006-66793 A describes a similar process in which a block of cut disks is sprayed laterally with a spray liquid using spray nozzles after the cutting process has been completed and removed from the wire saw for cleaning.
  • US 2011/0168212 describes a similar process for cleaning thin, easily fragile solar wafers after sawing and removing the cut workpiece from the wire saw.
  • JP2004-106360 describes a method in which, after wire cutting lapping and ingot retrieval of a workpiece, a rinsing liquid is sent through channels in the strip to clean the cutting gaps.
  • the object of the invention is to avoid stick-and-slip movements of the saw wire and their disadvantageous consequences.
  • the object of the invention is achieved by a method for simultaneously separating a plurality of disks from a workpiece using a wire saw, comprising a cutting-off grinding process, wherein a workpiece is held perpendicular to a longitudinal axis of the workpiece against a wire frame of a saw wire stretched between two wire guide rollers, which is in the longitudinal direction of the Saw wire is moved, is delivered, a cooling lubricant being supplied to the wire gate, and discs are created between wire sections of the wire frame, which are attached to a bar and between which there are separating gaps, and pulling the strip and the discs out of the wire mesh; characterized by spraying the separation gap with a liquid using a spray device while the strip and the disks are being pulled out until the wire sections have left the separation gap, the liquid being supplied under high pressure through nozzles which are attached to nozzle strips which are parallel to the longitudinal axis of the workpiece can be moved in an oscillating manner, with the liquid and entrained air temporarily causing the disks to oscillate.
  • the nozzles spray liquid onto the separation gap during extraction.
  • the surrounding air is swirled and the panes are caused to vibrate using the Bernoulli effect.
  • the nozzle strips carry out an oscillating lifting movement parallel to the workpiece axis, which is why liquid from at least one nozzle in the plane of the corresponding separating gap temporarily impinges on each separating gap. In this way, liquid gets deep into the separation gaps and the change in spray pressure caused by the oscillating movement causes a continuous, periodic fanning out of all the separation gaps while the strip and the disks are pulled out of the separation gaps.
  • the pressure at which the liquid is supplied through the nozzles is preferably selected so that the exit speed of the flushing agent corresponds to the speed at which the wire is moved relative to the workpiece.
  • the nozzles are preferably part of a spraying device, each comprising at least one nozzle strip, which are arranged on the side of the wire guide rollers of the wire mesh between the respective wire guide roller and the workpiece.
  • the nozzle strips can perform a lifting movement parallel to the workpiece axis and are preferably arranged parallel to the axes of rotation of the wire guide rollers.
  • nozzle strips are preferably aligned in such a way that each nozzle produces a partial jet of liquid that is oriented tangentially to the wire gate and in one of the planes in which the separation gaps run.
  • the amplitude of the oscillating movement with which the respective Nozzle bar is moved parallel to the longitudinal axis of the workpiece is preferably at least half the distance between two adjacent nozzles.
  • the total stroke corresponding to the double amplitude is at least the distance between two nozzles. In this way it is ensured that after a period of oscillating movement, each nozzle sweeps over all the separation gaps that are located between this nozzle and the adjacent nozzle.
  • the number of nozzles per nozzle strip is preferably 10 to 50.
  • the highest possible number of nozzles is particularly preferred.
  • the number is only limited by the dimensions of the nozzles. The required stroke of the oscillatory movement of the nozzle bar is therefore smaller and the separation gap is swept over at shorter intervals.
  • the workpiece is fed using a feed device.
  • the wire guide rollers rotate in the same direction, so that the wire sections describe a relative movement to the workpiece and material is removed when engaging the workpiece as a result of the feed movement.
  • the workpiece is completely cut and a large number of parallel cutting gaps are created between disks, which are held by the bar.
  • Pulling the strip and the disks out of the separating gaps involves resetting the feed device while moving the wire sections in the longitudinal direction of the wire in the presence of cooling lubricant.
  • the workpiece is preferably a circular cylindrical rod made of single-crystalline semiconductor material.
  • the method preferably also includes pivoting the workpiece about an axis parallel to the longitudinal axis of the workpiece during the cut-off process, wherein the workpiece performs a plurality of pairs of pivoting movements, and a pair of pivoting movements includes a first pivoting about a first angle at a first angular speed and a subsequent second pivoting through a second angle with a second angular velocity.
  • the first and second angular velocities and the first and second Angles of two pairs of consecutive pairs of pivoting movements are preferably different.
  • the sawing wire is preferably a hypereutectic pearl itic steel wire (piano wire), on the surface of which cutting means are fixed.
  • the cutting means are preferably diamonds.
  • Moving the saw wire in the longitudinal direction during the cutting process can take place without or with reversal of direction.
  • the saw wire is moved by means of a plurality of vocational steps, each vocational step being a first movement of the wire in a first longitudinal direction by a first length and a second movement of the saw wire in a second direction exactly opposite to the first longitudinal direction of the wire Longitudinal direction includes a second length and the first length is greater than the second length.
  • the cooling lubricant and the liquid preferably consist of water, which optionally contains a liquid additive. Both can be identical or have different compositions.
  • the liquid additive is preferably a wetting agent, an anti-corrosion agent, an agent influencing the viscosity, for example glycol and/or methyl cellulose, a defoaming agent or any mixture of these agents.
  • the procedure according to the invention is preferably also used to react appropriately to an interruption of the cutting process, in particular as a result of a crack in the saw wire. It avoids that when the workpiece is pulled out after the wire breaks and when the workpiece is returned to the position before the wire breaks, wire sections get caught and grooves or elastic deformations impair the quality of the discs.
  • Interrupting the cutting process occurs while continuing to move the saw wire in the longitudinal direction and includes pulling the workpiece out of the cutting gaps, returning the workpiece to the cutting gap and continuing the cutting process. While the workpiece is being returned, liquid flows through the nozzles into the separation gap sprayed and the nozzle bars are moved parallel to the longitudinal axis of the workpiece.
  • the movement of the saw wire in the longitudinal direction during the cut-off process takes place at a speed that is at least ten times faster than the speed of movement of the saw wire in the longitudinal direction when pulling out and returning the workpiece in the course of interrupting the cut-off process.
  • Fresh saw wire is removed from a first wire supply, the so-called fresh wire spool (direction 9), and used saw wire is fed to a second wire supply, the so-called old wire spool (direction 10).
  • the wire saw also has a delivery device to which the workpiece 1 is attached by gluing 25 to a bar 2 and which delivers the workpiece vertically onto the wire frame (direction 3).
  • the relative movement and the presence of an abrasive cutting agent produce material removal from the workpiece when the workpiece and the wire mesh come into contact.
  • each wire section of the wire mesh 24 forms a separation gap 22 by means of continued material removal from the workpiece.
  • the side walls of a separation gap 22 each delimit the back of one and the front of a second disk 34 of a pair of immediately adjacent disks.
  • the cutting means are diamonds 33, which are firmly embedded in the surface of the wire 1.
  • a cooling lubricant 15 which itself does not contain any abrasive cutting agents (hard materials)
  • the cutting process is finished when the entire wire mesh has worked its way completely through the workpiece and has come to rest in the bar 2.
  • the discs 34 of the completely separated workpiece then hang like the teeth of a comb, only connected to the strip 2 by the adhesive joint 25, on the half-cut strip.
  • the wire saw shown is provided with a left nozzle bar 16 and a right nozzle bar 17.
  • the nozzle strips 16, 17 carry a plurality of nozzles 20 which spray a liquid 21 onto the separating gap 22 of the workpiece 1.
  • the axes 18 and 19 of the nozzle strips are arranged parallel to one another and parallel to the axes of rotation 7 and 8 of the wire guide rollers 5 and 6 spanning the wire gate 24 and perpendicular to the separating gaps 22 of the workpiece 1 or parallel to the longitudinal axis 26 of the workpiece 1.
  • the nozzle strips carry out oscillating movements 27 and 28 in the directions of their axes 18 and 19.
  • Fig. 1 shows the nozzle bar 16 to the left of the workpiece 1, i.e. on the fresh wire input side, and the nozzle bar 17 to the right of the workpiece 1, i.e. on the old wire output side, and both, viewed from the direction of the feed device, below the wire gate 24. Deviating from this The nozzle strips can also be arranged above the wire gate 24.
  • the method according to the invention can also be carried out with a wire saw, in which the workpiece can be pivoted about an axis parallel to the longitudinal axis of the workpiece during the cutting process. With this rocking, only a portion of the entire wire section running within a separation gap comes into material-removing contact with the workpiece at any given time. Viewed in the longitudinal direction of the wire, gaps are formed between the saw wire and the workpiece in front of and behind this instantaneous contact surface, extending in the direction of the workpiece infeed. If the nozzle strips are arranged above the wire grid, the liquid can get particularly easily between the saw wire and the workpiece.
  • the nozzle strips are arranged below the wire grid, hardly any liquid can get between the saw wire and the workpiece despite rocking.
  • the separated parts of the workpiece that protrude under the wire mesh - the later disks - are particularly well stimulated to oscillate by the Bernoulli effect of the jet of liquid and thus periodically increase and decrease the cutting gap width.
  • the left nozzle bar 16 When the left nozzle bar 16 has completed the oscillating movement 27 in the direction of the axis 18, it reaches the position of the other end of its oscillating movement shown in Fig. 2 (B).
  • the nozzles 31, some of whose jets press liquid into a separation gap and thus widen it, are now in a different position and expand different separation gaps than those in the arrangement according to FIG. 2 (A).
  • the amplitude of the oscillating movement 27 is at least the value of the distance between two adjacent nozzles.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un procédé de tranchage simultané d'une pluralité de tranches (34) à partir d'une pièce à travailler (1) au moyen d'une scie à fil, comprenant un procédé de tranchage-meulage, une pièce à travailler (1) étant déplacée perpendiculairement à un axe longitudinal (26) de la pièce à travailler vers une nappe de fils (24) d'un fil de sciage (4) étiré entre deux rouleaux de guidage de fil (5, 6), ledit fil de sciage (4) étant déplacé dans la direction longitudinale du fil de sciage, un lubrifiant de refroidissement étant fourni à la nappe de fils (24) et des tranches (34), qui sont fixées à un ruban (2) et entre lesquelles se trouvent des espaces de tranchage (22), étant produites entre des sections de fil de la nappe de fils (24) et le ruban (2), et le retrait du ruban (2) et des tranches (34) de la nappe de fils (24), dans lequel, pendant le retrait du ruban (2) et des tranches (34), les espaces de tranchage (22) sont aspergés d'un liquide (21) au moyen d'un dispositif de pulvérisation jusqu'à ce que les sections de fil aient quitté les espaces de tranchage (22), le liquide (21) étant fourni à haute pression à travers des buses (14) fixées à des rubans de buse (16, 17) qui sont déplacés de manière oscillante parallèlement à l'axe longitudinal (26) de la pièce à travailler (1), le liquide (21) et l'air entraîné (35) excitant de manière sporadique les tranches (34) en vibration.
PCT/EP2023/066805 2022-07-07 2023-06-21 Procédé de tranchage simultané d'une pluralité de tranches à partir d'une pièce à travailler au moyen d'une scie à fil WO2024008452A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP22183659.6A EP4302952A1 (fr) 2022-07-07 2022-07-07 Procédé de séparation simultanée d'une pluralité de disques d'une pièce au moyen d'une scie à fils
EP22183659.6 2022-07-07

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WO2024008452A1 true WO2024008452A1 (fr) 2024-01-11

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EP (1) EP4302952A1 (fr)
TW (1) TW202411040A (fr)
WO (1) WO2024008452A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106360A (ja) 2002-09-19 2004-04-08 Komatsu Electronic Metals Co Ltd スリット入りウェーハ支持部材およびウェーハ洗浄装置
JP2006066793A (ja) 2004-08-30 2006-03-09 Naoetsu Electronics Co Ltd ウエハ洗浄方法及びその装置
US20090223539A1 (en) 2008-03-07 2009-09-10 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
US20110168212A1 (en) 2008-01-15 2011-07-14 Rec Scanwafer As Wafer stack cleaning
EP2955745A1 (fr) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Système pour nettoyer des plaquettes semiconductrices
DE102016211883A1 (de) 2016-06-30 2018-01-04 Siltronic Ag Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
US20220134600A1 (en) 2019-07-24 2022-05-05 Xuzhou Xinjing Semiconductor Technology Co., Ltd. Method for cutting silicon rod and apparatus for dimaond multi-wire cutting

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106360A (ja) 2002-09-19 2004-04-08 Komatsu Electronic Metals Co Ltd スリット入りウェーハ支持部材およびウェーハ洗浄装置
JP2006066793A (ja) 2004-08-30 2006-03-09 Naoetsu Electronics Co Ltd ウエハ洗浄方法及びその装置
US20110168212A1 (en) 2008-01-15 2011-07-14 Rec Scanwafer As Wafer stack cleaning
US20090223539A1 (en) 2008-03-07 2009-09-10 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
EP2955745A1 (fr) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Système pour nettoyer des plaquettes semiconductrices
DE102016211883A1 (de) 2016-06-30 2018-01-04 Siltronic Ag Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
US20220134600A1 (en) 2019-07-24 2022-05-05 Xuzhou Xinjing Semiconductor Technology Co., Ltd. Method for cutting silicon rod and apparatus for dimaond multi-wire cutting

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EP4302952A1 (fr) 2024-01-10
TW202411040A (zh) 2024-03-16

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