WO2024005328A1

WO2024005328A1 - Electronic device for wireless power transmission and operating method thereof

Info

Publication number: WO2024005328A1
Application number: PCT/KR2023/005464
Authority: WO
Inventors: 하민철; 김동조; 노윤정; 유태현; 정형구
Original assignee: 삼성전자 주식회사
Priority date: 2022-06-28
Filing date: 2023-04-21
Publication date: 2024-01-04

Abstract

An electronic device according to various embodiments may comprise a coil, a conductive pattern positioned at the center part of the coil, and a controller. The controller may be configured to detect a change in capacitance due to an external object through the conductive pattern, in a power saving mode of the electronic device. The controller may be configured to compare the amount of the change in the capacitance with a threshold value, on the basis of detection of the change in the capacitance. The controller may be configured to apply a designated first power to the coil so as to transmit a ping signal if the amount of the change in the capacitance is greater than the threshold value. The controller may be configured to maintain the power saving mode if the amount of the change in the capacitance is not greater than the threshold value. Various other embodiments may be possible.

Description

Electronic device that transmits power wirelessly and method of operation thereof

Various embodiments relate to an electronic device that wirelessly transmits power and a method of operating the same.

Wireless charging technology uses wireless power transmission and reception. For example, the mobile phone's battery can be automatically charged by simply placing the mobile phone on a wireless power transmitting device (e.g. charging pad) without connecting a separate charging connector. It speaks of technology. This wireless charging technology can improve the waterproof function by eliminating the need for a connector to supply power to electronic products, and can increase the portability of electronic devices by eliminating the need for a wired charger.

As wireless charging technology develops, methods for charging by supplying power from one electronic device (e.g., wireless power transmission device) to various other electronic devices (e.g., wireless power reception device) are being studied. Wireless charging technology includes an electromagnetic induction method, a resonance method using resonance, and an RF/microwave radiation method that converts electrical energy into microwaves and transmits them.

For example, wireless charging technology using electromagnetic induction or resonance is being spread mainly in electronic devices such as smartphones. When a wireless power transmitting unit (PTU) (e.g., a wireless power transmitting device) and a wireless power receiving unit (PRU) (e.g., a smartphone or wearable electronic device) come into contact or approach within a certain distance, wireless power is generated. The battery of the wireless power receiver may be charged by methods such as electromagnetic induction or electromagnetic resonance between the transmitting coil (or transmitting resonator) of the transmitter and the receiving coil (or receiving resonator) of the wireless power receiver.

Electronic devices according to various embodiments may include a coil, a conductive pattern located in the center of the coil, and a controller. The controller may be set to detect a change in capacitance due to an external object through the conductive pattern in a power saving mode of the electronic device. The controller may be configured to compare the amount of change in capacitance to a threshold based on detecting the change in capacitance. The controller may be set to apply a first power designated to transmit a ping signal to the coil when the amount of change in the capacitance is greater than the threshold. The controller may be set to maintain the power saving mode if the amount of change in the capacitance is not greater than the threshold.

A method of operating an electronic device according to various embodiments may include detecting a change in capacitance due to an external object through a conductive pattern included in the electronic device. Here, the conductive pattern may be located in the center of the coil included in the electronic device. The method of operating the electronic device may include comparing the amount of change in capacitance with a threshold based on detecting the change in capacitance. The method of operating the electronic device may include applying first power designated to transmit a ping signal to the coil when the amount of change in the capacitance is greater than the threshold. The method of operating the electronic device may include maintaining the power saving mode if the amount of change in the capacitance is not greater than the threshold.

1 is a block diagram of an electronic device that wirelessly transmits power and a wireless power reception device according to various embodiments.

Figure 2 is a block diagram showing a wireless charging system according to various embodiments.

FIG. 3 is a block diagram illustrating a method in which an electronic device uses a conductive pattern according to various embodiments.

FIG. 4 is a flow chart to explain a method in which an electronic device transmits a ping signal based on a change in capacitance identified using a conductive pattern, according to various embodiments.

FIG. 5 is a diagram illustrating the structure and arrangement of conductive patterns included in an electronic device according to various embodiments.

FIGS. 6A, 6B, and 6C are diagrams to explain how a sensor circuit included in an electronic device according to various embodiments detects a change in capacitance due to an external object through a conductive pattern.

FIG. 7 is a graph showing a change in capacitance of an electronic device according to various embodiments due to an external object identified through a conductive pattern.

FIGS. 8A, 8B, 8C, 8D, and 8E are diagrams of conductive patterns having various patterns according to various embodiments.

9A and 9B are diagrams of the arrangement of conductive patterns having various patterns according to various embodiments.

FIG. 10 is a graph showing a signal transmitted through a conductive pattern and a ping signal transmitted through a transmission coil by an electronic device according to various embodiments.

11 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1, an electronic device 101 according to various embodiments may wirelessly transmit power 103 to a wireless power reception device 195. In one example, the electronic device 101 may transmit power 103 according to an inductive method. When the electronic device 101 is inductive, the electronic device 101 may include, for example, a power source, a direct current-to-alternating current conversion circuit, an amplifier circuit, an impedance matching circuit, at least one capacitor, at least one coil, or It may include a communication modulation/demodulation circuit, etc. At least one capacitor may be included in a resonant circuit along with at least one coil. The electronic device 101 may be implemented in a manner defined in the wireless power consortium (WPC) standard (or Qi standard). In another example, the electronic device 101 may transmit power 103 according to a resonance method. In the case of a resonance method, the electronic device 101 may include, for example, a power source, a direct current-to-alternating current conversion circuit, an amplifier circuit, an impedance matching circuit, at least one capacitor, at least one coil, or out-of-band communication. It may include a circuit (e.g., BLE (bluetooth low energy) communication circuit), etc. At least one capacitor and at least one coil may be included in the resonance circuit. The electronic device 101 may be implemented in a manner defined in the Alliance for Wireless Power (A4WP) standard (or air fuel alliance (AFA) standard). The electronic device 101 may include a coil that can generate an induced magnetic field when current flows according to a resonance method or an induction method. The process in which the electronic device 101 generates an induced magnetic field can be expressed as the electronic device 101 wirelessly transmitting power 103. In addition, the wireless power receiving device 195 may include a coil in which induced electromotive force is generated by a magnetic field whose size changes with time formed around the coil. The process of generating induced electromotive force through a coil can be expressed as the wireless power receiving device 195 receiving power 103 wirelessly. For example, the electronic device 101 is a standard for wireless power transmission, defined in the airFuel inductive (e.g., power matters alliance (PMA)) or airfuel resonant (e.g., rezence) standards, or in the Qi standard. It can also be implemented in a certain way.

The electronic device 101 according to various embodiments may perform communication with the wireless power reception device 195. For example, the electronic device 101 may communicate with the wireless power reception device 195 according to an in-band method. The electronic device 101 may modulate data to be transmitted according to, for example, a frequency shift keying (FSK) modulation method, and the wireless power receiving device 195 may perform modulation according to an amplitude shift keying (ASK) modulation method. Modulation can be performed accordingly. The electronic device 101 and/or the wireless power receiving device 195 may determine data transmitted from the other device based on the frequency and/or amplitude of the current, voltage, or power of the coil. The operation of performing modulation based on the ASK modulation method and/or the FSK modulation method can be understood as an operation of transmitting data according to the in-band communication method. The operation of determining data transmitted from the other device by performing demodulation based on the frequency and/or amplitude of the coil's current, voltage, or power is an operation of receiving data according to the in-band communication method. It can be understood. For example, the electronic device 101 may communicate with the wireless power reception device 195 according to an out-of-band method. The electronic device 101 or the wireless power reception device 195 may transmit and/or receive data using a communication circuit (eg, BLE communication module) provided separately from the coil or patch antenna.

In various embodiments of this document, the electronic device 101 or the wireless power receiving device 195 performing a specific operation may be performed using various hardware included in the electronic device 101 or the wireless power receiving device 195, for example. For example, it may mean that a control circuit such as a processor (e.g., a transmission IC and/or a micro controller unit (MCU)) or a coil performs a specific operation. Alternatively, the electronic device 101 or the wireless power receiving device 195 performing a specific operation may mean that the processor controls other hardware to perform a specific operation. Alternatively, when the electronic device 101 or the wireless power receiving device 195 performs a specific operation, the specific operation stored in the storage circuit (e.g., memory) of the electronic device 101 or the wireless power receiving device 195 is performed. It may also mean causing a processor or other hardware to perform a specific operation as at least one instruction to perform is executed.

Referring to FIG. 2, a wireless charging system according to various embodiments may include an electronic device 101 and a wireless power reception device 195. For example, when the wireless power receiving device 195 is mounted on the electronic device 101, the electronic device 101 can wirelessly supply power to the wireless power receiving device 195.

According to various embodiments, the electronic device 101 may include a power transmission circuit 211, a control circuit 212, a communication circuit 213, or a sensing circuit 214.

According to various embodiments, the power transmission circuit 211 includes a power adapter 211a that receives power (or power) from the outside, appropriately converts the voltage of the input power, and a power generation circuit 211b that generates power. ), or may include a matching circuit 211c that improves transmission efficiency between the coil 211L and the coil 221L.

According to various embodiments, the control circuit 212 may perform overall control of the electronic device 101. The control circuit 212 may generate various messages (eg, instructions) necessary for wireless power transmission and transmit them to the communication circuit 213. In one embodiment, the control circuit 212 may calculate power (or amount of power) to be transmitted to the wireless power reception device 195 based on information received from the communication circuit 213. In one embodiment, the control circuit 212 may control the power transmission circuit 211 so that the power generated by the coil (or radiator) 211L is transmitted to the wireless power reception device 195.

According to various embodiments, the communication circuit 213 may include at least one of a first communication circuit 213a or a second communication circuit 213b. For example, the first communication circuit 213a is connected to the first communication circuit 223a of the wireless power reception device 195 using a frequency that is the same as or adjacent to the frequency used by the coil 211L to transmit power. Communication can be done based on the in-band (IB) communication method.

The first communication circuit 213a may communicate with the first communication circuit 223a of the wireless power reception device 195 using the transmission coil 211L. Data (or communication signal) generated by the first communication circuit 213a may be transmitted using the coil 211L. The first communication circuit 213a may transmit data to the wireless power reception device 195 using a frequency shift keying (FSK) modulation technique. According to various embodiments, the first communication circuit 213a can communicate with the first communication circuit 223a of the wireless power reception device 195 by changing the frequency of the power signal transmitted through the coil 211L. You can. Alternatively, the first communication circuit 213a may communicate with the first communication circuit 223a of the wireless power reception device 195 by including data in the power signal generated by the power generation circuit 211b. For example, the first communication circuit 213a may perform modulation by increasing or decreasing the frequency of the power transmission signal. The wireless power receiving device 195 can confirm data from the electronic device 101 by performing demodulation based on the frequency of the signal measured by the coil 221L.

For example, the second communication circuit 213b communicates with the second communication circuit 223b of the wireless power receiving device 195 using a frequency different from the frequency used for power transmission by the coil 211L. Communication can be done based on out-of-band (OOB) communication method. For example, the second communication circuit 213b performs second communication using any one of various short-distance communication methods such as Bluetooth, Bluetooth low energy (BLE), Wi-Fi, or near field communication (NFC). Information related to the charging state from the circuit 223b (e.g., voltage value after rectifier, rectified voltage value (e.g., Vrect) information, current information (e.g., Iout) flowing from the coil 221L or the rectifier circuit 221b, various packets, authentication information, and/or messages) may be obtained.

According to various embodiments, the sensing circuit 214 may include at least one sensor, and may detect at least one state of the electronic device 101 using at least one sensor.

According to various embodiments, the sensing circuit 214 may include at least one of a temperature sensor, a motion sensor, a magnetic field sensor (hall sensor), or a current (or voltage) sensor, and uses the temperature sensor to detect an electronic device ( 101) can detect the temperature state of the electronic device 101, can detect the movement state of the electronic device 101 using a motion sensor, and can detect whether or not it is coupled to the wireless power receiving device 195 using a magnetic field sensor. , the state of the output signal of the electronic device 101, for example, the current level, voltage level, and/or power level, can be detected using a current (or voltage) sensor.

According to one embodiment, a current (or voltage) sensor may measure a signal in the power transmission circuit 211. The current (or voltage) sensor may measure a signal in at least a portion of the matching circuit 211c or the power generation circuit 211b. For example, a current (or voltage) sensor may include a circuit that measures a signal in front of the coil 211L.

According to various embodiments, the sensing circuit 214 may include a circuit for foreign object detection (eg, foreign object detection (FOD)).

According to various embodiments, the sensing circuit 214 may check a change in capacitance due to an external object. For example, the sensing circuit 214 may check the change in capacitance as an external object approaches or touches (or is placed on) the electronic device 101. Additionally, the sensing circuit 214 may provide a sensing value (or capacitance change amount) indicating a change in capacitance to the control circuit 212. For example, the sensing circuit 214 may include a coil and a sensor IC to detect changes in capacitance.

According to various embodiments, the wireless power reception device 195 includes a power reception circuit 221, a processor 222, a communication circuit 223, sensors 224, a display 225, or a sensing circuit 226. may include. Sensors 224 may include a sensing circuit 226.

According to various embodiments, the power receiving circuit 221 includes a coil 221L that wirelessly receives power from the electronic device 101, an Rx IC 227, and a charging circuit 221d (e.g., PMIC, DCDC converter, It may include a switched capacitor, or voltage divider), or a battery 221e. In one embodiment, the Rx IC 227 includes a matching circuit 221a connected to the coil 221L, a rectifier circuit 221b that rectifies the received AC power to DC, or an adjustment circuit that adjusts the charging voltage (e.g., LDO )(221c).

According to various embodiments, the processor 222 may perform overall control of the wireless power reception device 195. The processor 222 can generate various messages necessary for wireless power reception and transmit them to the communication circuit 223.

According to various embodiments, the communication circuit 223 may include at least one of a first communication circuit 223a or a second communication circuit 223b. The first communication circuit 223a may communicate with the electronic device 101 through the coil 221L.

The first communication circuit 223a may communicate with the first communication circuit 213a of the electronic device 101 using the coil 221L. Data (or communication signal) generated by the first communication circuit 223a may be transmitted using the coil 221L. The first communication circuit 223a may transmit data to the electronic device 101 using an amplitude shift keying (ASK) modulation technique. For example, the first communication circuit 223a may cause a change in the load of the electronic device 101 depending on the modulation method. Accordingly, at least one of the magnitude of voltage, current, or power measured at the coil 211L may be changed. The first communication circuit 213a of the electronic device 101 can confirm data from the wireless power reception device 195 by demodulating the change in size. The second communication circuit 223b may communicate with the electronic device 101 using any one of various short-range communication methods such as Bluetooth, BLE, Wi-Fi, or NFC.

In various embodiments of this document, packets, information, or data transmitted and received by the electronic device 101 and the wireless power receiving device 195 are at least one of the first communication circuit 223a or the second communication circuit 223b. Can be transmitted and/or received through.

According to various embodiments, the sensors 224 may include at least some of a current/voltage sensor, a temperature sensor, an illumination sensor, or an acceleration sensor.

According to various embodiments, the sensing circuit 226 may detect the electronic device 101 by detecting a search signal or power received from the electronic device 101. The sensing circuit 226 detects signal changes at the input/output terminals of the coil 221L, the matching circuit 221a, or the rectifier circuit 221b due to the coil 221L signal generated by the signal output from the electronic device 101. can be detected. According to various embodiments, the sensing circuit 226 may be included in the receiving circuit 221.

According to various embodiments, the display 225 may display various display information required for wireless power transmission and reception.

An electronic device that transmits power wirelessly according to electromagnetic induction may detect whether a wireless power receiving device is mounted and periodically transmit a ping signal (or ping energy) to wake up the receiver. At this time, the wireless power receiving device may need to wake up the RX IC only with a ping signal (or ping energy) provided from the electronic device without supplying power through a separate battery. Accordingly, the electronic device may periodically transmit a ping signal (or ping energy) with a certain interval to confirm the mounting point of the wireless power receiving device 195. That is, the electronic device can consume power to periodically transmit a ping signal even when the wireless power receiver is not installed.

The electronic device 101 according to various embodiments uses a separate conductive pattern (e.g., the conductive pattern 330 in FIG. 3) disposed in the area where the coil 211L is located to protect against external objects (or wireless power reception devices). (195)), the change in capacitance due to approach or placement can be confirmed. The electronic device 101 may transmit a ping signal when the approach or installation of an external object (or a wireless power receiving device) is confirmed based on a change in capacitance. Accordingly, the electronic device 101 according to various embodiments transmits a ping signal (or ping energy) only when the capacitance change satisfies a specified condition in the area where the coil 211L is located, so that the electronic device 101 Can reduce standby power consumption. At this time, the conductive pattern 330 may have a specific pattern that does not affect the electronic device 101 transmitting power wirelessly.

Referring to FIG. 3 , the sensing circuit 214 may include a sensor circuit 320 and a conductive pattern 330. The control circuit 212 may apply designated power to the conductive pattern 330 . For example, the control circuit 212 may apply designated power to the conductive pattern 330 continuously or periodically.

According to various embodiments, the conductive pattern 330 may have a specific shape that does not affect the electronic device 101 transmitting power wirelessly. For example, the conductive pattern 330 may include an open loop or single ended coil. For example, based on the end point of the conductive pattern 330, one point is connected to the control circuit 212 (or sensor circuit 320), and at least one other point is connected to the control circuit 212 (or sensor circuit 320). For example, an end point of the conductive pattern 330 that is not connected to the control circuit 212 (or the sensor circuit 320) may be in an open state.

According to various embodiments, the conductive pattern 330 may have a specific pattern that does not affect the electronic device 101 transmitting power wirelessly. For example, the conductive pattern 330 may include a coil having a grid-shaped pattern on a substrate. Alternatively, the conductive pattern 330 may include a plurality of layers (or coils having a plurality of layers) arranged in different layers with respect to the substrate. The plurality of layers (or coils having a plurality of layers) may be arranged to form a grid-shaped pattern. Each of the plurality of layers (or coils having a plurality of layers) may be electrically connected through one point of the substrate.

According to various embodiments, the conductive pattern 330 may be placed in a location that does not affect the electronic device 101 transmitting power wirelessly. The conductive pattern 330 may be located in the center area of the area where the coil 211L is disposed. For example, the conductive pattern 330 may be disposed in an empty center space inside (or within) the coil 211L so as not to overlap the coil 211L.

According to various embodiments, the sensor circuit 320 may detect the conductive pattern 330 and the external object as an external object (e.g., the wireless power receiving device 195) approaches or touches (or is mounted on) the electronic device 101. You can check the capacitance value between. The sensor circuit 320 may transmit information about the confirmed capacitance value (capacitance value, a value representing a change in capacitance, or amount of change in capacitance) to the control circuit 212.

According to various embodiments, the control circuit 212 may determine whether to transmit a ping signal based on information about the capacitance value. For example, the control circuit 212 may compare the amount of capacitance change corresponding to the capacitance change to a specified threshold. The control circuit 212 may determine whether to transmit a ping signal based on a comparison between the capacitance change amount and the threshold value. For example, the capacitance change is the difference between the capacitance value confirmed when the external object is not approaching or mounted on the electronic device 101 and the capacitance value confirmed when the external object is approaching or mounted on the electronic device 101. It can mean.

Through this, the control circuit 212 transmits a ping signal (or ping energy) only when the capacitance change in the area where the coil 211L is located is greater than the threshold, thereby reducing standby power consumption of the electronic device 101. can be reduced.

At least some of the operations of the electronic device 101 described below may be performed by the control circuit 212. However, for convenience of explanation, the electronic device 101 will be described as performing the corresponding operations.

Referring to FIG. 4, according to various embodiments, an electronic device (e.g., electronic device 101 of FIG. 1) transmits power to an external electronic device (e.g., wireless power reception device 195 of FIG. 1). Power can be provided for. For example, power provided to the electronic device 101 may be provided from a wired or wirelessly applied power source, or may be provided from a battery included in the electronic device 101.

According to various embodiments, in operation 401, the electronic device 101 may be driven in a power saving mode (or power protection state). For example, the power saving mode may mean a mode or state in which the electronic device 101 operates at specified power (eg, specified low power). For example, the electronic device 101 may be operated at lower power in the power saving mode than in the power transmission mode (e.g., a mode in which power is transmitted to an external electronic device (e.g., the wireless power receiver 195)). For example, the electronic device 101 may not transmit a ping signal in power saving mode. Accordingly, the electronic device 101 may not apply the designated first power for transmitting the ping signal to the coil 211L. The electronic device 101 may apply a designated second power to a conductive pattern (eg, the conductive pattern 330 of FIG. 3) in the power saving mode. For example, the designated second power may be lower than the designated first power.

According to various embodiments, in operation 403, the electronic device 101 may check a change in capacitor due to an external object through the conductive pattern 330. For example, the electronic device 101 may check the change in capacitor due to the approach or contact of an external object to the electronic device 101 in the power saving mode. For example, an external object may mean an external object containing metal. For example, the external object may include a wireless power reception device 195 for receiving wireless power.

According to various embodiments, in operation 405, the electronic device 101 may compare the capacitance change amount according to the capacitance change with a specified threshold value. For example, in operation 405, the electronic device 101 may check whether the amount of capacitance change is greater than the threshold. For example, the amount of capacitance change may mean the degree to which the capacitance value changes based on the state in which an external object approaches or does not contact the electronic device 101. For example, the threshold may mean a value (e.g., capacitance value) designated to start transmitting a ping signal.

According to various embodiments, when it is confirmed that the capacitance change is greater than the threshold (example of operation 405), in operation 407, the electronic device 101 may transmit a ping signal through the coil 211L. For example, the electronic device 101 may apply designated first power to the coil 211L to transmit a ping signal. At this time, the electronic device 101 may not apply the designated second power to the conductive pattern 330. For example, the electronic device 101 may be driven in a ping signal transmission mode (or ping phase mode).

According to various embodiments, if it is determined that the amount of capacitance change is not greater than the threshold (No in operation 405), the electronic device 101 may maintain the power saving mode. At this time, the electronic device 101 may not transmit a ping signal through the coil 211L. Additionally, the electronic device 101 can check whether an external object is approaching or mounted through the conductive pattern 330.

According to various embodiments, in operation 409, the electronic device 101 may check whether a designated in-band packet (eg, a secure simple pairing (SSP) packet) has been authorized. For example, the electronic device 101 may check whether a designated in-band packet has been received from the wireless power reception device 195.

According to various embodiments, if it is confirmed that the designated in-band packet is not authorized (No in 409), in operation 411, the electronic device 101 may check the duration of the ping signal transmission operation. For example, the electronic device 101 may transmit a ping signal until a designated time. If the duration of the ping signal exceeds a specified time (eg, 60 seconds) (example of operation 411), the electronic device 101 may enter a power saving mode. At this time, the electronic device 101 may stop transmitting the ping signal through the coil 211L. Additionally, the electronic device 101 can check whether an external object is approaching or mounted through the conductive pattern 330.

According to various embodiments, if it is confirmed that the designated in-band packet has been approved (yes in 409), in operation 413, the electronic device 101 may transmit power wirelessly. For example, the electronic device 101 may wirelessly transmit power to the wireless power reception device 195, which transmits a designated in-band packet. For example, the electronic device 101 may be driven in power transfer mode.

According to various embodiments, in operation 415, the electronic device 101 may check a condition for terminating power transmission. If the condition for ending power transmission is not confirmed (No in operation 415), the electronic device 101 may transmit power to the wireless power transmission device. If the condition for ending power transmission is confirmed (yes in operation 415), the electronic device 101 may not transmit power to the wireless power transmission device. For example, conditions for terminating power transmission may be specified. For example, the condition for terminating power transmission may include a state in which the mounted arrangement of the wireless power receiving device 195 is distorted or a state in which the wireless power receiving device 195 is released. Additionally, the condition for ending power transmission may include a state in which the wireless power reception device 195 is fully charged.

According to various embodiments, when the condition for terminating power transmission is confirmed (example of operation 415), in operation 417, the electronic device 101 may compare the capacitance change amount and the threshold value through the conductive pattern 330. When the electronic device 101 confirms that the capacitance change is greater than the threshold (Yes in 417), it may transmit the ping signal again. Alternatively, if it is confirmed that the amount of capacitance change is not greater than the threshold (No in 417), the electronic device 101 may enter the power saving mode. At this time, the electronic device 101 may not transmit a ping signal through the coil 211L. Additionally, the electronic device 101 can check whether an external object is approaching or mounted through the conductive pattern 330. For example, when the wireless power receiving device 195 is mounted on the electronic device 101 while the wireless power receiving device 195 is fully charged, the electronic device 101 determines the amount of capacitance change exceeding the threshold. Since it does not work, it can enter power saving mode. For example, the electronic device 101 may transmit a ping signal when the wireless power receiving device 195 is released from its mount because the amount of capacitance change exceeding the threshold is confirmed.

Through this, the electronic device 101 transmits a ping signal (or ping energy) only when the amount of capacitance change in the area where the coil 211L is located is greater than the threshold, and the electronic device 101 due to the transmission of the ping signal can reduce power consumption. For example, the electronic device 101 confirms the proximity or mounting of an external object (e.g., the wireless power receiving device 195) through the conductive pattern 330, which consumes less power, and then pings the coil 211L. A signal can be transmitted.

Referring to FIG. 5, according to various embodiments, the conductive pattern 520 (e.g., the conductive pattern 330 of FIG. 3) allows an electronic device (e.g., the electronic device 101 of FIG. 1) to wirelessly receive power. It can be placed in a location that does not affect transmission. The conductive pattern 520 may be located in the center area of the transmission coil 510 (eg, coil 211L in FIG. 2). For example, the conductive pattern 520 may be positioned to overlap the empty center space inside (or within) the transmitting coil 510 so as not to overlap the transmitting coil 510 when viewed from above on one side of the coil 610. You can.

Meanwhile, the shape and shape of the transmitting coil 510 and the conductive pattern 520 shown in FIG. 5 are merely exemplary, and the technical idea of the present invention may not be limited thereto.

FIGS. 6A to 6C are diagrams for explaining how a sensor circuit included in an electronic device according to various embodiments detects a change in capacitance due to an external object through a conductive pattern.

6A to 6C, the electronic device 101 includes a coil 610 (e.g., coil 211L in FIG. 2), a housing 615, and a conductive pattern 620 (e.g., the conductive pattern in FIG. 3). It may include a pattern 330). The coil 610 and the conductive pattern 620 may be disposed in the internal space of the housing 615. When viewed from above on one side of the coil 610, the conductive pattern 630 may be positioned to overlap the empty center space inside (or inside) the coil 610 so as not to overlap the coil 610.

Referring to FIGS. 6A and 6B, an external object 605 (e.g., the wireless power receiving device 195 of FIG. 1) may be mounted on a holder located outside the housing 615 of the electronic device 101. there is. The sensor circuit 620 (e.g., the sensor circuit 320 in FIG. 3) connected to the conductive pattern 630 can check the capacitance value (C) between the external object 605 and the conductive pattern 630. The sensor circuit 620 may transmit information about the capacitance value C to a control circuit (eg, the control circuit 214 of FIG. 2).

Referring to FIG. 6C, when the external object 605 (e.g., the wireless power receiving device 195 of FIG. 1) is not mounted on the housing 615 of the electronic device 101, the sensor circuit 620 is conductive. The capacitance value can be confirmed through the pattern 630. At this time, because the external object 605 is not mounted, the capacitance value (C) may not be confirmed.

Referring to FIGS. 6 and 7, the sensor circuit 620 mounts an external object (or wirelessly receives power) to an electronic device (e.g., the electronic device 101 of FIG. 1) through the conductive pattern 630. You can check the capacitance value 710, which indicates whether it is close enough to do so. For example, the sensor circuit 620 may check a capacitance value 710 close to 0 when an external object is not mounted (or close enough to receive power wirelessly). For example, when an external object is not mounted (or close enough to receive power wirelessly), the capacitance value 710 may be less than the threshold. Additionally, the sensor circuit 620 may check a capacitance value 710 close to “C” when an external object is mounted (or close enough to receive power wirelessly). If an external object is mounted (or close enough to receive power wirelessly), the capacitance value 710 may be greater than the threshold.

According to various embodiments, the sensor circuit 620 may transmit information about the capacitance value 710 indicating whether an external object is mounted (or close enough to receive power wirelessly) to the control circuit 212. there is. The control circuit 212 may determine whether to transmit a ping signal based on the capacitance value 710.

8A to 8E are diagrams of conductive patterns having various patterns according to various embodiments.

8A to 8E, according to various embodiments, the

conductive patterns

810, 820, 830, 840, 850, and 855 have a specific shape that does not affect the electronic device 101 transmitting power wirelessly. You can have it. For example, the

conductive patterns

810, 820, 830, 840, 850, and 855 may include an open loop or single ended coil. For example, at least one of the end points of the

conductive patterns

810, 820, 830, 840, 850, and 855 (eg, 811, 821, 831, and 841) may be in an open state. For example, one of the end points (e.g., 812, 822, 832, 842) of the conductive patterns (810, 820, 830, 840, 850, and 855) is connected to a sensor circuit (e.g., sensor circuit 320 of FIG. 3). ) can be connected to.

According to various embodiments, the

conductive patterns

810, 820, 830, 840, 850, and 855 may have a specific pattern that does not affect the electronic device 101 wirelessly transmitting power. For example, the

conductive patterns

810, 820, 830, 840, 850, and 855 may include coils having various patterns on the substrate. Referring to FIG. 8A, the conductive pattern 810 may be implemented as an open loop or single ended coil. For example, one point 812 of the conductive pattern 810 may be connected to a sensor circuit (e.g., the sensor circuit 320 in FIG. 3) based on the end point, and the other point 811 may be open. . For example, the conductive pattern 810 may have a spiral pattern with one turn. As another example, referring to FIG. 8B, the conductive pattern 820 may have a spiral pattern with 3 turns. As another example, referring to FIG. 8C, the conductive pattern 830 may have a spiral pattern with 3 turns. However, the conductive pattern 830 may be implemented in a different form from the conductive pattern 820 of FIG. 8B.

According to various embodiments, referring to FIG. 8D, the conductive pattern 840 may be arranged in a grid-like pattern having one layer on the substrate. For example, one point 812 of the conductive pattern 840 is connected to a sensor circuit (e.g., the sensor circuit 320 of FIG. 3) based on a plurality of end points, and a plurality of other points of the conductive pattern 840 are connected to each other. (841) may be in an open state.

According to various embodiments, referring to FIG. 8E, the

conductive patterns

850 and 855 may be formed as a grid-shaped pattern having a plurality of layers arranged in different layers with respect to the substrate. Each of the

coils

850 and 855 arranged in a grid-like pattern may be implemented in an open loop form or a single ended form. For example, one point 812 of the

conductive pattern

850 or 855 is connected to a sensor circuit (e.g., the sensor circuit 320 of FIG. 3) based on a plurality of end points, and a plurality of

conductive patterns

850 or 855 are connected to each other. Other points may be open. At this time, each of the plurality of layers (or coils having a plurality of layers) may be electrically connected through a point 860 of the substrate. For example, one point of the substrate may be formed as a via.

Meanwhile, the shapes and shapes of the conductive patterns shown in FIGS. 8A to 8E are merely exemplary, and the technical idea of the present invention may not be limited thereto. For example, conductive patterns according to various embodiments may have various patterns in an open loop or single ended form.

Referring to FIG. 9A , according to various embodiments, a conductive pattern (eg, conductive pattern 330 of FIG. 3 ) may include a coil 920 disposed on a substrate 910 . For example, the substrate 910 may refer to the base layer of the coil 920. For example, the substrate 910 may be implemented as a field programmable gate array (FPGA). The coil 920 may be implemented with metal having various patterns. For example, the coil 920 may be implemented in an open loop form or a single ended form. For example, the

conductive patterns

810, 820, 830, and 840 shown in FIGS. 8A to 8D may be implemented in the arrangement shown in FIG. 9A. Alternatively, the conductive pattern may be implemented in the form of a substrate having various patterns made of metal.

Referring to FIG. 9B, according to various embodiments, a conductive pattern (e.g., the conductive pattern 330 of FIG. 3) is disposed on the first coil 930 on the top of the substrate 915 and on the bottom of the substrate 915. It may include a second coil 940. For example, the substrate 915 may refer to the base layer of the first coil 930 and the second coil 940. For example, the substrate 915 may be implemented as a field programmable gate array (FPGA). The first coil 930 and the second coil 940 may be implemented with metal having various patterns. For example, the first coil 930 and the second coil 940 may be implemented in an open loop form or a single ended form. The first coil 930 and the second coil 940 may be disposed on the substrate 915 through different layers. The first coil 930 may be electrically connected to the second coil 940 through a VIA. For example, the conductive pattern 850 shown in FIG. 8E may be implemented in the arrangement shown in FIG. 9B.

Referring to FIG. 10, the electronic device 101 mounts a wireless power receiving device (e.g., the wireless power receiving device 195 of FIG. 1) through a conductive pattern (e.g., the conductive pattern 330 of FIG. 3). or approach) is confirmed, a ping signal can be transmitted through a transmitting coil (e.g., coil 211L in FIG. 2).

According to various embodiments, the electronic device 101 may transmit the detection signal 1001 through the conductive pattern 330 in the first section (and the third section). At this time, the electronic device 101 may not transmit the ping signal 1003. For example, the first section (and the third section) may mean a section in which the wireless power reception device 195 is not mounted on the electronic device 101. Alternatively, the first section (and the third section) may mean a section in which the wireless power receiving device 195 is not located in the area where the coil 211L is located. The electronic device 101 may apply designated second power to the conductive pattern 330 in order to transmit the detection signal 1001 in the first section (and the third section).

According to various embodiments, the electronic device 101 may transmit the ping signal 1003 through the coil 211L in the second section (and the fourth section). For example, the signal size of the ping signal 1003 may be larger than the signal size of the detection signal 1001. At this time, the electronic device 101 may not transmit the detection signal 1001. For example, the second section (and the fourth section) may refer to a section in which the wireless power reception device 195 is mounted on the electronic device 101. Alternatively, the second section (and fourth section) may refer to a section in which the wireless power receiving device 195 is located in the area where the coil 211L is located. The electronic device 101 may apply designated first power to the conductive pattern 330 in order to transmit the ping signal 1003 in the second section (and the fourth section). For example, the specified first power may be greater than the specified second power.

According to various embodiments, the electronic device 101 transmits a detection signal 1001 that consumes less power than transmitting a ping signal 1003 so that the wireless power receiving device 195 determines where the coil 211L is located. You can check whether it is located in the area or not. Through this, the electronic device 101 can reduce power consumption for detecting the wireless power reception device 195.

The above-described electronic device 101 and wireless power receiving device 195 may be implemented in the same or similar manner as the following

electronic devices

1101, 1102, and 1104.

FIG. 11 is a block diagram of an electronic device 1101 in a network environment 1100, according to various embodiments. Referring to FIG. 11, in the network environment 1100, the electronic device 1101 communicates with the electronic device 1102 through a first network 1198 (e.g., a short-range wireless communication network) or a second network 1199. It is possible to communicate with at least one of the electronic device 1104 or the server 1108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 1101 may communicate with the electronic device 1104 through the server 1108. According to one embodiment, the electronic device 1101 includes a processor 1120, a memory 1130, an input module 1150, an audio output module 1155, a display module 1160, an audio module 1170, and a sensor module ( 1176), interface 1177, connection terminal 1178, haptic module 1179, camera module 1180, power management module 1188, battery 1189, communication module 1190, subscriber identification module 1196. , or may include an antenna module 1197. In some embodiments, at least one of these components (eg, the connection terminal 1178) may be omitted, or one or more other components may be added to the electronic device 1101. In some embodiments, some of these components (e.g., sensor module 1176, camera module 1180, or antenna module 1197) are integrated into one component (e.g., display module 1160). It can be.

The processor 1120, for example, executes software (e.g., program 1140) to operate at least one other component (e.g., hardware or software component) of the electronic device 1101 connected to the processor 1120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 1120 stores commands or data received from another component (e.g., sensor module 1176 or communication module 1190) in volatile memory 1132. The commands or data stored in the volatile memory 1132 can be processed, and the resulting data can be stored in the non-volatile memory 1134. According to one embodiment, the processor 1120 may include a main processor 1121 (e.g., a central processing unit or an application processor) or an auxiliary processor 1123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 1101 includes a main processor 1121 and a auxiliary processor 1123, the auxiliary processor 1123 may be set to use lower power than the main processor 1121 or be specialized for a designated function. You can. The auxiliary processor 1123 may be implemented separately from the main processor 1121 or as part of it.

The auxiliary processor 1123 may, for example, act on behalf of the main processor 1121 while the main processor 1121 is in an inactive (e.g., sleep) state, or while the main processor 1121 is in an active (e.g., application execution) state. ), together with the main processor 1121, at least one of the components of the electronic device 1101 (e.g., the display module 1160, the sensor module 1176, or the communication module 1190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 1123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 1180 or communication module 1190). there is. According to one embodiment, the auxiliary processor 1123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 1101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 1108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 1130 may store various data used by at least one component (eg, the processor 1120 or the sensor module 1176) of the electronic device 1101. Data may include, for example, input data or output data for software (e.g., program 1140) and instructions related thereto. Memory 1130 may include volatile memory 1132 or non-volatile memory 1134.

The program 1140 may be stored as software in the memory 1130 and may include, for example, an operating system 1142, middleware 1144, or application 1146.

The input module 1150 may receive commands or data to be used in a component of the electronic device 1101 (e.g., the processor 1120) from outside the electronic device 1101 (e.g., a user). The input module 1150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 1155 may output sound signals to the outside of the electronic device 1101. The sound output module 1155 may include, for example, a speaker or receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 1160 can visually provide information to the outside of the electronic device 1101 (eg, a user). The display module 1160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 1160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 1170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 1170 acquires sound through the input module 1150, the sound output module 1155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 1101). Sound may be output through an electronic device 1102 (e.g., speaker or headphone).

The sensor module 1176 detects the operating state (e.g., power or temperature) of the electronic device 1101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 1176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 1177 may support one or more designated protocols that can be used to directly or wirelessly connect the electronic device 1101 to an external electronic device (eg, the electronic device 1102). According to one embodiment, the interface 1177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1178 may include a connector through which the electronic device 1101 can be physically connected to an external electronic device (eg, the electronic device 1102). According to one embodiment, the connection terminal 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1180 can capture still images and moving images. According to one embodiment, the camera module 1180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1188 can manage power supplied to the electronic device 1101. According to one embodiment, the power management module 1188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 1189 may supply power to at least one component of the electronic device 1101. According to one embodiment, the battery 1189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

Communication module 1190 provides a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 1101 and an external electronic device (e.g., electronic device 1102, electronic device 1104, or server 1108). It can support establishment and communication through established communication channels. Communication module 1190 operates independently of processor 1120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 1190 may be a wireless communication module 1192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 1198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1199 (e.g., legacy It may communicate with an external electronic device 1104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 1192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1196 within a communication network such as the first network 1198 or the second network 1199. The electronic device 1101 can be confirmed or authenticated.

The wireless communication module 1192 may support 5G networks and next-generation communication technologies after 4G networks, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 1192 may support high frequency bands (e.g., mmWave bands), for example, to achieve high data rates. The wireless communication module 1192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 1192 may support various requirements specified in the electronic device 1101, an external electronic device (e.g., electronic device 1104), or a network system (e.g., second network 1199). According to one embodiment, the wireless communication module 1192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 1197 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 1197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 1197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 1198 or the second network 1199, is connected to the plurality of antennas by, for example, the communication module 1190. can be selected. Signals or power may be transmitted or received between the communication module 1190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, radio frequency integrated circuit (RFIC)) in addition to the radiator may be additionally formed as part of the antenna module 1197.

According to various embodiments, antenna module 1197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 1101 and the external electronic device 1104 through the server 1108 connected to the second network 1199. Each of the external

electronic devices

1102 or 1104 may be of the same or different type as the electronic device 1101. According to one embodiment, all or part of the operations performed in the electronic device 1101 may be executed in one or more of the external

electronic devices

1102, 1104, or 1108. For example, when the electronic device 1101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1101 does not execute the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 1101. The electronic device 1101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 1101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1104 may include an Internet of Things (IoT) device. Server 1108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 1104 or server 1108 may be included in the second network 1199. The electronic device 1101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

The electronic device 101 according to various embodiments may include a coil 211L, a conductive pattern 330 located in the center of the coil, and a controller 214. The controller operates through the conductive pattern. , can be set to detect changes in capacitance due to the external object 195. The controller may be configured to compare the amount of change in capacitance to a threshold based on detecting the change in capacitance. The controller may be set to apply a first power designated to transmit a ping signal to the coil when the amount of change in the capacitance is greater than the threshold. The controller may be set to maintain the power saving mode if the amount of change in the capacitance is not greater than the threshold.

The controller according to various embodiments may be set to detect a change in the capacitance through the conductive pattern without applying the first power to the coil in the power saving mode.

The controller according to various embodiments may be set to apply a second power less than the first power to the conductive pattern in the power saving mode.

The controller according to various embodiments transmits the ping signal through the coil, detects an external electronic device, transmits power to the external electronic device through the coil, and sets a specified condition for terminating the transmission of the power. If confirmed, it can be set to detect a change in the capacitance through the conductive pattern.

The controller according to various embodiments is configured to, based on detecting a change in the capacitance, compare the amount of change in the capacitance with a threshold and, if the amount of change in the capacitance is greater than the threshold, retransmit a ping signal. When the first power is applied to the coil and the amount of change in the capacitance is not greater than the threshold, the electronic device may be set to drive in the power saving mode.

The conductive pattern according to various embodiments may be implemented in an open loop or open ended form.

The conductive pattern according to various embodiments may have a grid-shaped pattern.

The conductive pattern according to various embodiments may have the grid-shaped pattern through the plurality of layers disposed in different layers.

The plurality of layers according to various embodiments are respectively disposed on the top and bottom of the substrate, and each of the plurality of layers may be connected through one point of the substrate.

The conductive pattern according to various embodiments may be disposed in a central space inside the coil so as not to overlap the coil.

A method of operating an electronic device 101 according to various embodiments includes detecting a change in capacitance due to an external object 195 through a conductive pattern 330 included in the electronic device in a power saving mode of the electronic device. may include. Here, the conductive pattern may be located in the center of the coil 211L included in the electronic device. The method of operating the electronic device may include comparing the amount of change in capacitance with a threshold based on detecting the change in capacitance. The method of operating the electronic device may include applying first power designated to transmit a ping signal to the coil when the amount of change in the capacitance is greater than the threshold. The method of operating the electronic device may include maintaining the power saving mode if the amount of change in the capacitance is not greater than the threshold.

The operation of maintaining the power saving mode according to various embodiments may include detecting a change in the capacitance through the conductive pattern without applying the first power to the coil in the power saving mode.

The operation of detecting a change in external capacitance due to the external object according to various embodiments may include applying a second power less than the first power to the conductive pattern in the power saving mode.

A method of operating the electronic device according to various embodiments includes detecting an external electronic device by transmitting the ping signal through the coil, transmitting power to the external electronic device through the coil, and transmitting the power to the external electronic device. When a specified condition for terminating transmission is confirmed, the method may further include detecting a change in the capacitance through the conductive pattern.

A method of operating the electronic device according to various embodiments includes an operation of comparing the amount of change in the capacitance with a threshold based on detecting a change in the capacitance, and if the amount of change in the capacitance is greater than the threshold, generating a ping signal. The method may further include applying the first power designated to retransmit to the coil, and driving the electronic device into the power saving mode if the amount of change in the capacitance is not greater than the threshold.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are one or more instructions stored in a storage medium (e.g., built-in memory 1136 or external memory 1138) that can be read by a machine (e.g., electronic device 1101). It may be implemented as software (e.g., program 1140) including these. For example, a processor (e.g., processor 1120) of a device (e.g., electronic device 1101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims

In electronic devices,

coil;

A conductive pattern located in the center of the coil; and

A controller comprising:

In a power saving mode of the electronic device, detecting a change in capacitance due to an external object through the conductive pattern,

Based on detecting the change in the capacitance, comparing the amount of change in the capacitance to a threshold value,

If the amount of change in the capacitance is greater than the threshold, a first power designated to transmit a ping signal is periodically applied to the coil,

An electronic device configured to maintain the power saving mode if the amount of change in the capacitance is not greater than the threshold.
The method of claim 1, wherein the controller:

In the power saving mode, an electronic device configured to detect a change in the capacitance through the conductive pattern without applying the first power to the coil.
The method of claim 1, wherein the controller:

An electronic device configured to apply a second power less than the first power to the conductive pattern in the power saving mode.
The method of claim 1, wherein the controller:

Detecting an external electronic device by transmitting the ping signal through the coil,

Transmitting power to the external electronic device through the coil,

An electronic device configured to detect a change in the capacitance through the conductive pattern when a specified condition terminating the transmission of the power is confirmed.
The method of claim 4, wherein the controller:

Based on detecting the change in the capacitance, comparing the amount of change in the capacitance to a threshold value,

If the amount of change in the capacitance is greater than the threshold, applying the first power designated to retransmit a ping signal to the coil,

An electronic device configured to drive the electronic device in the power saving mode when the amount of change in the capacitance is not greater than the threshold.
According to paragraph 1,

The conductive pattern is an electronic device implemented in an open loop or open ended form.
According to clause 6,

An electronic device wherein the conductive pattern has a grid-like pattern.
In clause 7,

The conductive pattern is an electronic device having the grid-shaped pattern through the plurality of layers disposed in different layers.
According to clause 8,

An electronic device wherein the plurality of layers are respectively disposed on an upper and lower part of a substrate, and each of the plurality of layers is connected through a point of the substrate.
According to paragraph 1,

The electronic device wherein the conductive pattern is disposed in a central space inside the coil so as not to overlap the coil.
In a method of operating an electronic device,

In the power saving mode of the electronic device, an operation of detecting a change in capacitance due to an external object through a conductive pattern included in the electronic device, where the conductive pattern is located in the center of a coil included in the electronic device,

Based on detecting the change in the capacitance, comparing the amount of change in the capacitance with a threshold value;

If the amount of change in the capacitance is greater than the threshold, applying first power designated to transmit a ping signal to the coil; and

A method of operating an electronic device, including maintaining the power saving mode when the amount of change in the capacitance is not greater than the threshold.
The method of claim 11, wherein the operation of maintaining the power saving mode includes:

In the power saving mode, a method of operating an electronic device comprising detecting a change in the capacitance through the conductive pattern without applying the first power to the coil.
The method of claim 11, wherein the operation of detecting a change in vocal capacitance due to the external object comprises:

A method of operating an electronic device including applying a second power less than the first power to the conductive pattern in the power saving mode.
According to clause 11,

detecting an external electronic device by transmitting the ping signal through the coil;

transmitting power to the external electronic device through the coil; and

A method of operating an electronic device further comprising detecting a change in the capacitance through the conductive pattern when a specified condition for terminating the transmission of the power is confirmed.
According to clause 14,

Based on detecting the change in the capacitance, comparing the amount of change in the capacitance with a threshold value;

If the amount of change in the capacitance is greater than the threshold, applying the first power designated to retransmit a ping signal to the coil; and

If the amount of change in the capacitance is not greater than the threshold, driving the electronic device into the power saving mode.