WO2024004846A1 - Module - Google Patents

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Publication number
WO2024004846A1
WO2024004846A1 PCT/JP2023/023279 JP2023023279W WO2024004846A1 WO 2024004846 A1 WO2024004846 A1 WO 2024004846A1 JP 2023023279 W JP2023023279 W JP 2023023279W WO 2024004846 A1 WO2024004846 A1 WO 2024004846A1
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WO
WIPO (PCT)
Prior art keywords
component
substrate
module
inner layer
plan
Prior art date
Application number
PCT/JP2023/023279
Other languages
English (en)
Japanese (ja)
Inventor
義典 金
一生 山元
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2024004846A1 publication Critical patent/WO2024004846A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Definitions

  • the present invention relates to a module.
  • Patent Document 1 discloses a semiconductor device having a structure in which a first inductor and a second inductor are separated by forming a groove in a semiconductor chip mounted on a wiring board. is disclosed. Furthermore, Patent Document 1 also discloses a structure in which a groove completely cuts a semiconductor chip and a wiring board to divide it into two semiconductor devices, and these two semiconductor devices are mounted side by side on a mounting board. has been done.
  • an object of the present invention is to provide a module that can reduce the gap between the component and the edge of the board.
  • a module based on the present invention includes a substrate having a first surface and a component mounted on the first surface.
  • the component includes an external electrode for electrical connection with the substrate. If the side of the substrate closest to the component when viewed in plan is the first side of the substrate, then the external electrode is biased in a direction away from the first side of the substrate when the component is viewed in plan. It is located.
  • the external electrodes of the component are arranged in a biased direction away from the first side of the substrate, so it is possible to reduce the gap between the component and the edge of the substrate.
  • FIG. 2 is a plan view of a module in Embodiment 1 based on the present invention. 2 is a sectional view taken along the line II-II in FIG. 1.
  • FIG. 1 is a perspective view of parts included in a module in Embodiment 1 based on the present invention.
  • FIG. It is a top view of the 1st modification of the module in Embodiment 1 based on this invention. It is a partial sectional view of the 2nd modification of the module in Embodiment 1 based on this invention. It is a partial sectional view of the 3rd modification of the module in Embodiment 1 based on this invention.
  • FIG. 7 is a first perspective view of parts included in a module according to a second embodiment of the present invention.
  • FIG. 1 is a perspective view of parts included in a module according to a second embodiment of the present invention.
  • FIG. 7 is a second perspective view of parts included in the module in Embodiment 2 based on the present invention.
  • FIG. 7 is a plan view of a module in Embodiment 2 based on the present invention. It is a top view of the 1st modification of the module in Embodiment 2 based on this invention. It is a top view of the 2nd modification of the module in Embodiment 2 based on this invention. It is a bottom view of the component with which the 3rd modification of the module in Embodiment 2 based on this invention is equipped.
  • FIG. 7 is a cross-sectional view of parts included in a module in Embodiment 3 based on the present invention.
  • FIG. 7 is a circuit diagram of components included in a module in Embodiment 3 based on the present invention.
  • FIG. 7 is a plan view of a module in Embodiment 3 based on the present invention. 17 is a sectional view taken along the line XVII-XVII in FIG. 16.
  • FIG. 7 is a bottom view of parts included in a module in Embodiment 3 based on the present invention.
  • top or bottom do not necessarily mean absolute top or bottom, but may mean relative top or bottom within the illustrated posture. .
  • FIG. 1 shows a plan view of module 101 in this embodiment.
  • FIG. 2 shows a sectional view taken along the line II-II in FIG. 1. Note that FIG. 1 shows a state in which the sealing resin 6 is removed for convenience of explanation.
  • the module 101 includes a substrate 1 and components 3.
  • the substrate 1 has a first surface 1a and a second surface 1b.
  • the component 3 is mounted on the first surface 1a.
  • the component 3 includes an external electrode 7 for electrical connection with the substrate 1. If the side of the substrate 1 closest to the component 3 when viewed in plan is the first side 81 of the substrate, the external electrode 7 is biased in the direction away from the first side 81 of the substrate when the component 3 is viewed in a plan view. It is arranged as follows. In the component 3, the direction away from the first side 81 of the substrate is the direction of the arrow 91. The length of the substrate 1 in the left-right direction in FIG. 1 is L1. The external electrode 7 is separated by a length A from the first side 81 of the substrate.
  • FIG. 7 a perspective view of the component 3 is shown in FIG.
  • the external electrode 7 is formed in an L-shape so as to cover a portion of the side surface and a portion of the bottom surface of the component 3. That is, in this example, at least a portion of the external electrode 7 covers the side surface of the component 3.
  • Two external electrodes 7 are provided for one component 3.
  • a coil (not shown) is formed inside the component 3. This coil is arranged with its winding axis parallel to the straight line 20. Both ends of this coil are connected to two external electrodes 7, respectively. As also shown in FIG. 3, the external electrodes 7 are arranged biased in the direction of the arrow 91.
  • one or more components may be mounted on the first surface 1a of the substrate 1.
  • Three other components of the same type as component 3 are mounted on the first surface 1a.
  • an IC chip 4 is mounted in the center of the first surface 1a.
  • the example shown here is just an example, and the types, sizes, and numbers of components mounted on the first surface 1a are not necessarily as shown here.
  • the first surface 1a, the component 3, the IC chip 4, etc. are covered with a sealing resin 6.
  • the solder used to connect the external electrodes of the component and the board tends to be exposed from the end surface, and the exposed solder does not prevent the module from attaching to the motherboard.
  • the heat generated during the reflow process during mounting would cause it to elute, causing poor conductivity. Therefore, in order to prevent such conduction defects, the components had to be placed at a certain distance from the edge of the board.
  • the external electrodes 7 of the component 3 are arranged in a direction that is biased away from the first side 81 of the substrate when the component 3 is viewed in plan. It can be placed closer to 81.
  • the gap between the component and the edge of the board can be reduced.
  • the dimension L1 of the substrate 1 can be reduced. If the dimensions of the substrate 1 can be reduced, the dimensions of the module 101 as a whole can be reduced.
  • the side of the component 3 close to the first side 81 of the substrate overlaps with the first side 81 of the substrate when viewed in plan.
  • the fact that the component 3 is arranged in this way means that the gap between the component 3 and the edge of the substrate is zero. This is particularly preferable because the gap between the component and the edge of the substrate can be minimized.
  • Such a configuration may be realized by exposing the end faces of the components at the same time as cutting the substrate into individual pieces when a plurality of modules are manufactured all at once using a collective substrate.
  • the module 102 has a substrate first side 81 and further has sides 82, 83, and 84. Two parts are mounted along each side. Focusing on one component 3 at the upper left in FIG. 4, the side of the substrate 1 closest to the component 3 when viewed in plan can be considered as the first side 81 of the substrate, and the external electrode 7 of the component 3 is When the component 3 is viewed from above, it is arranged so as to be biased away from the first side 81 of the substrate. This holds true for other parts as well.
  • the side of the board 1 that is closest to each component when viewed in plan can be regarded as the "first side of the board" for that component.
  • the external electrodes 7 of each component are arranged so as to be biased away from the side considered to be the first side of the substrate when the component is viewed in plan.
  • An example of such a configuration is shown in FIG. In FIG. 4, two components are mounted on each of the four sides of the module 102 board.
  • the module may include a shield film that covers the sealing resin.
  • a module including a shield film may have the configuration shown in FIG. 5, for example.
  • This module includes a sealing resin 6 that seals the component 3 on the first surface 1a and a shield film 8 that covers the sealing resin 6.
  • the component first side surface 31 is exposed from the sealing resin 6 and is in contact with the shield film 8.
  • the shield film 8 has a large surface area, the heat transmitted to the shield film 8 is easily released to the outside. Therefore, by employing this configuration, heat dissipation performance can be improved.
  • the external electrode 7 is connected to the first surface 1a of the substrate 1 via a solder 9.
  • the module may include a component 3 as shown in FIG.
  • FIG. 6 is a plan view of the component 3.
  • the component 3 has an inner layer conductor 13 built therein, and the inner layer conductor 13 is arranged to be biased away from the first side 81 of the substrate when the component 3 is viewed in plan. Since the inner layer conductor 13 is disposed unevenly in this way, the inner layer conductor 13 is disposed further away from the first side surface 31 of the component, so that the inner layer conductor 13 is undesirably placed on the first side surface 31 of the component. exposure can be avoided.
  • FIG. 7 shows a first perspective view of the component 3i.
  • FIG. 8 shows a second perspective view of the component 3i.
  • the component 3i has a bottom surface 15, and an external electrode 17 is arranged on the bottom surface 15.
  • the external electrode 17 is a land electrode.
  • the external electrodes 17 are arranged biased in the direction of the arrow 91 when the component 3i is viewed in plan.
  • FIG. 9 shows a plan view of module 103 in this embodiment. In FIG. 9, only the component 3i is shown within the overall outline of the module 103 for convenience of explanation. In the module 103, some components other than the component 3i may be arranged, and a shield film covering the sealing resin may also be provided.
  • the module 103 includes a substrate 1 having a first surface 1a and a component 3i mounted on the first surface 1a, the component 3i including an external electrode 17 for electrical connection with the substrate 1, Assuming that the side of the substrate 1 that is closest to the component 3i when viewed is the first side 81 of the substrate, the external electrode 17 is arranged so as to be biased away from the first side of the substrate when the component 3i is viewed from above. ing.
  • the external electrode 17 is a land electrode. That is, the external electrode 17 is a land electrode arranged on the surface of the component 3i facing the substrate 1.
  • the external electrodes 17 are arranged biased in the direction of the arrow 91.
  • the arrow 91 is parallel to the longitudinal direction of the component 3i, but as shown in FIG. 10, the arrow 91 may be perpendicular to the longitudinal direction of the component 3i.
  • the component 3i is arranged so that its long side overlaps the first side 81 of the substrate.
  • a configuration as shown in FIG. 11 may be used.
  • both the long side and the short side of the component 3i overlap the outline of the board.
  • the first side surface 31 of the component is arranged to overlap the first side 81 of the substrate, and the second side surface 32 of the component is arranged so as to overlap the side 82.
  • the external electrodes 17 are arranged biased in both the direction of the arrow 91 and the direction of the arrow 92. As a result, the external electrodes 17 are arranged obliquely in the direction of the arrow 93 pointing diagonally.
  • FIG. 12 is a bottom view of the component 3n.
  • the external electrode 17 arranged on the bottom surface 15 of the component 3n is visible.
  • the inner layer conductor 13 inside the component 3n is indicated by a broken line.
  • the component 3n incorporates an inner layer conductor 13, and the inner layer conductor 13 is arranged to be biased away from the first side 81 of the substrate when the component 3n is viewed in a plan view.
  • the inner layer conductor 13, like the outer electrode 17, is arranged biased in the directions of arrows 91 and 92.
  • the inner layer conductor 13 is arranged obliquely in the direction of the arrow 93 pointing diagonally.
  • Embodiment 3 A module in Embodiment 3 based on the present invention will be described with reference to FIGS. 13 to 17.
  • This module includes a component 3r.
  • a cross-sectional view of the component 3r is shown in FIG. FIG. 14 shows an exploded view showing each layer of the component 3r separately.
  • the component 3r includes an insulator 340.
  • the component 3r includes wirings 301 and 302 and conductor patterns 303 and 304 inside an insulator 340.
  • the conductor pattern 303 includes an overhang portion 303e.
  • the projecting portion 303e has an end 303f.
  • the end 303f is exposed from the side surface of the insulator 340.
  • Pad electrodes 305 and 306 are arranged on the bottom surface of the component 3r.
  • Pad electrodes 305 and 306 are external electrodes of component 3r.
  • Pad electrode 305 is an input terminal.
  • Pad electrode 306 is an output terminal.
  • Pad electrodes 305 and 306, which are external electrodes, are arranged biased in the direction of arrow 91.
  • the pad electrode 305 and one end of the wiring 301 are connected by an interlayer connection conductor 307.
  • the other end of the wiring 301 and the conductor pattern 304 are connected by an interlayer connection conductor 308.
  • the conductor pattern 304 and one end of the wiring 302 are connected by an interlayer connection conductor 309.
  • the wiring 302 and the pad electrode 306 are connected by an interlayer connection conductor 310.
  • a circuit diagram of component 3r is shown in FIG.
  • the component 3r includes inductors 321 and 322 and a capacitor 323.
  • the wiring 301 forms an inductor 321, and the wiring 302 forms an inductor 322.
  • a capacitor 323 is formed by the conductor patterns 303 and 304 facing each other
  • FIG. 16 shows a plan view of the module 106 in this embodiment.
  • the component 3r is shown within the overall outline of the module 106.
  • some components other than the component 3r may be arranged, and a shield film covering the sealing resin may also be provided.
  • the arrow 91 points away from the first side 81 of the substrate.
  • FIG. 17 shows a sectional view taken along the line XVII-XVII in FIG. 16.
  • An end 303f of the projecting portion 303e of the conductor pattern 303 is exposed on the first side surface 31 of the component and is connected to the shield film 8.
  • the component 3r is covered with a sealing resin 6.
  • the shield film 8 covers the sealing resin 6.
  • the shield film 8 is grounded by a circuit (not shown) or the like.
  • the conductor pattern 303 is connected to the shield film 8 at the end 303f, so it is in a grounded state.
  • the pad electrode 305 is connected to the first surface 1a of the substrate 1 via the solder 9.
  • the effects described in the first and second embodiments can be obtained.
  • the conductor pattern 303 is grounded via the end 303f, there is no need to draw out an interlayer connection conductor or the like for grounding the conductor pattern 303 to the bottom surface of the component 3r. Therefore, the space between the conductive pattern 303 and the bottom surface can be used for other purposes. This space can be used, for example, to arrange the wirings 301 and 302.
  • the external electrodes are not the only objects to be arranged so as to be biased away from the first side 81 of the substrate.
  • the inner layer conductors may also be arranged biased in the same way. The same applies to the inner layer ground conductor.
  • FIG. 18 is a bottom view of the component 3s.
  • the external electrode 17 arranged on the bottom surface 15 of the component 3s is visible.
  • the inner layer ground conductor 12 and the inner layer conductor 13 inside the component 3s are indicated by broken lines.
  • the inner layer conductor 13 is arranged on the back side of the outer electrode 17 in the drawing.
  • Inner layer ground conductor 12 is arranged further to the back of the inner layer conductor 13 in the drawing.
  • Inner layer ground conductor 12 includes a main portion that extends in the same area as inner layer conductor 13 and an overhang portion that extends from the main portion.
  • the main part of the inner layer ground conductor 12 is hidden behind the inner layer conductor 13 and is not visible, but the protruding portion of the inner layer ground conductor 12 is visible as it protrudes from the inner layer conductor 13.
  • An end 12f of the projecting portion of the inner layer ground conductor 12 is exposed on the side surface of the component 3s. The end 12f is connected to the shield film 8.
  • the component 3s includes an inner layer ground conductor 12, and the inner layer ground conductor 12 is electrically connected to the shield film 8 on the first side surface 31 of the component.
  • the inner layer ground conductor 12 can be grounded by the shield film 8, so there is no need to separately provide wiring for grounding the inner layer ground conductor 12.
  • a sealing resin that seals the component on the first surface; and a shield film that covers the sealing resin, Assuming that the side of the component closest to the first side of the substrate is the first side of the component, the first side of the component is exposed from the sealing resin and in contact with the shield film, any one of appendices 1 to 4.
  • the module described in Section 1. [Additional note 6]
  • the component includes an inner layer ground conductor, The module according to appendix 5, wherein the inner layer ground conductor is electrically connected to the shield film on the first side surface of the component.
  • the component includes an inner layer conductor, and the inner layer conductor is arranged biased in a direction away from the first side of the substrate when the component is viewed in a plan view.
  • Substrate 1a first surface, 1b second surface, 3, 3i, 3j, 3k, 3n, 3r parts, 4 IC chip, 6 sealing resin, 7, 17 external electrode, 8 shield film, 9 solder, 12 inner layer Ground conductor, 13 Inner layer conductor, 15 Bottom (of the component), 20 Straight line, 31 First side of the component, 32 Second side of the component, 81 First side of the board, 82, 83, 84 Side, 91, 92, 93 Arrow, 101 , 102, 103, 104, 105 module, 301, 302, 303, 304 wiring, 305, 306 pad electrode, 303e overhang, 303f end, 307, 308, 309, 310 interlayer connection conductor, 321, 322 inductor, 323 Capacitor, 340 Insulator, 341, 342, 343, 344 Insulating layer.

Abstract

L'invention concerne un module (101) comportant un substrat (1) qui a une première surface (1a), et un composant (3) qui est monté sur la première surface (1a). Le composant (3) comprend une électrode externe (7) pour une connexion électrique avec le substrat (1). Lorsqu'un côté du substrat (1) qui est le plus proche du composant (3) lorsqu'il est vu de manière plane est un premier côté de substrat (81), l'électrode externe (7) est déplacée à l'opposé du premier côté de substrat (81) lorsque le composant (3) est vu de manière plane.
PCT/JP2023/023279 2022-07-01 2023-06-23 Module WO2024004846A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-107029 2022-07-01
JP2022107029 2022-07-01

Publications (1)

Publication Number Publication Date
WO2024004846A1 true WO2024004846A1 (fr) 2024-01-04

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ID=89382899

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Application Number Title Priority Date Filing Date
PCT/JP2023/023279 WO2024004846A1 (fr) 2022-07-01 2023-06-23 Module

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WO (1) WO2024004846A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211023A (ja) * 2010-03-30 2011-10-20 Panasonic Corp モジュールとその製造方法
JP2011222704A (ja) * 2010-04-08 2011-11-04 Murata Mfg Co Ltd 回路モジュール
JP2016072325A (ja) * 2014-09-29 2016-05-09 沖電気工業株式会社 電子デバイス
WO2016181954A1 (fr) * 2015-05-11 2016-11-17 株式会社村田製作所 Module haute fréquence
JP2019062416A (ja) * 2017-09-27 2019-04-18 京セラ株式会社 水晶振動子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211023A (ja) * 2010-03-30 2011-10-20 Panasonic Corp モジュールとその製造方法
JP2011222704A (ja) * 2010-04-08 2011-11-04 Murata Mfg Co Ltd 回路モジュール
JP2016072325A (ja) * 2014-09-29 2016-05-09 沖電気工業株式会社 電子デバイス
WO2016181954A1 (fr) * 2015-05-11 2016-11-17 株式会社村田製作所 Module haute fréquence
JP2019062416A (ja) * 2017-09-27 2019-04-18 京セラ株式会社 水晶振動子

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