WO2024000475A1

WO2024000475A1 - Semiconductor packaged device and method for manufacturing thereof

Info

Publication number: WO2024000475A1
Application number: PCT/CN2022/102995
Authority: WO
Inventors: Lei Zhang; Kai Cao; Jianping Zhang; Shangqing QIU; Ergang Xu; Bangxing CHEN
Original assignee: Innoscience (suzhou) Semiconductor Co., Ltd.
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2024-01-04
Also published as: CN117916879A

Abstract

A semiconductor packaged device includes a heat dissipating substrate, a semiconductor die, a conductive structure, and a protection layer. The semiconductor die is disposed over a top surface of the heat dissipating substrate and thermally coupled to the heat dissipating substrate. The conductive structure is thermally coupled to the semiconductor die and extends from a first position over an active surface of the semiconductor die to a second position under a bottom surface of the heat dissipating substrate. The conductive structure comprises a bottom conductive portion and a top conductive portion. The bottom conductive portion is conformally disposed with the heat dissipating substrate. The top conductive portion is disposed on and makes contact with the bottom conductive portion to form a first interface therebetween. The top conductive portion covers the semiconductor die. The protection layer covers the semiconductor die and the conductive structure.

Description

SEMICONDUCTOR PACKAGED DEVICE AND METHOD FOR MANUFACTURING THE SAME

Inventors: Lei ZHANG; Kai CAO; Jianping ZHANG; Shangqing QIU; Ergang XU; Bangxing CHEN

Field of the Disclosure:

The present disclosure generally relates to a nitride-based semiconductor packaged device. More specifically, the present disclosure relates to a nitride-based semiconductor packaged device having a conductive structure.

Background of the Disclosure:

In recent years, intense research on high-electron-mobility transistors (HEMTs) has been prevalent, particularly for high power switching and high frequency applications. III-nitride-based HEMTs utilize a heterojunction interface between two materials with different bandgaps to form a quantum well-like structure, which accommodates a two-dimensional electron gas (2DEG) region, satisfying demands of high power/frequency devices. In addition to HEMTs, examples of devices having heterostructures further include heterojunction bipolar transistors (HBT) , heterojunction field effect transistor (HFET) , and modulation-doped FETs (MODFET) . III-nitride-based devices have unique packaging needs that take into account the requirement for enhanced thermal dissipation and overcome the potential for packaging degradation caused by III-nitride device heat output. Thus, there is a need in the art for improved III-nitride-based device packages.

Summary of the Disclosure:

In accordance with one aspect of the present disclosure, a semiconductor packaging device is provided. The semiconductor packaged device includes a heat dissipating substrate, a semiconductor die, a conductive structure, and a protection layer. The semiconductor die is disposed over a top surface of the heat dissipating substrate and thermally coupled to the heat dissipating substrate. The conductive structure is thermally coupled to the semiconductor die and extends from a first position over an active surface of the semiconductor die to a second position under a bottom surface of the heat dissipating substrate. The conductive structure includes a bottom conductive portion and a top conductive portion. The bottom conductive portion is conformally disposed with the heat dissipating substrate. The top conductive portion is disposed on and makes contact with the bottom conductive portion to form a first interface therebetween. The top conductive portion covers the semiconductor die. The protection layer covers the semiconductor die and the conductive structure.

In accordance with one aspect of the present disclosure, a method for manufacturing a semiconductor packaging device is provided. The method includes steps as follows. A bottom conductive portion of a conductive structure is formed to cover a heating dissipating substrate, and at least a part of a top surface of the heating dissipating substrate is exposed by the bottom conductive portion. A semiconductor die is mounted on the exposed top surface of the heat dissipating substrate. A top conductive portion of a conductive structure is formed on the bottom conductive portion and the semiconductor die, such that a first interface is formed between the top and bottom conductive portions of the conductive structure. A protection layer is formed to cover the semiconductor die and the conductive structure.

In accordance with one aspect of the present disclosure, a surface mounted device is provided. A surface mounted device includes a heating dissipating substrate, a semiconductor die, a conductive structure, and a protection layer. The semiconductor die is disposed on and thermally coupled to the heating dissipating substrate. The conductive structure is thermally coupled to the heating dissipating substrate and the semiconductor die and includes a top and a bottom conductive portions. The semiconductor die and the heating dissipating substrate are sandwiched by the top and the bottom conductive portions, such that an active surface and a back surface of the semiconductor die face toward the top conductive portion and the heating dissipating substrate, respectively and the heating dissipating substrate is wrapped by the bottom conductive portion. The protection layer covers an active surface of the semiconductor die, and top surfaces of the top and the bottom conductive portions.

By the above configuration, in the present disclosure, a semiconductor die is packaged with a substrate (i.e., heat dissipating substrate) with a high thermal conductivity coefficient. A conductive structure can be formed on an active surface of the semiconductor die. The conductive structure extends with turning downward to be in a position lower than the heat dissipating substrate, so the packaged die can be mounted to another substrate (i.e., print circuit board) . Thus, the mountability and heat dissipation ability of the semiconductor packaged device can be improved.

Brief Description of the Drawings:

Aspects of the present disclosure are readily understood from the following detailed description when read with the accompanying figures. It should be noted that various features may not be drawn to scale. That is, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Embodiments of the present disclosure are described in more detail hereinafter with reference to the drawings, in which:

FIG. 1A is a top view of a semiconductor packaged device according to some embodiments of the present disclosure;

FIG. 1B is a vertical cross-sectional view of the semiconductor packaged device taken along a line A-A’ in FIG. 1A;

FIG. 1C is a vertical cross-sectional view of the semiconductor packaged device taken along a line B-B’ in FIG. 1A;

FIG. 1D is a vertical cross-sectional view of the semiconductor packaged device taken along a line C-C’ in FIG. 1A;

FIG. 1E is a vertical cross-sectional view of the semiconductor packaged device taken along a line D-D’ in FIG. 1A;

FIG. 2A is a vertical cross-sectional view of a GaN-based transistor in the semiconductor packaged device of the FIG. 1A;

FIG. 2B is a vertical cross-sectional view of the semiconductor packaged device 1A in FIG. 1A mounted on a print circuit board;

FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, and FIG. 3F show different stages of a method for manufacturing a semiconductor packaged device according to some embodiments of the present disclosure;

FIG. 4 is a vertical cross-sectional view of a semiconductor packaged device according to some embodiments of the present disclosure;

FIG. 5 is a vertical cross-sectional view of a semiconductor packaged device according to some embodiments of the present disclosure;

FIG. 6 is a vertical cross-sectional view of the semiconductor packaged device according to some embodiments of the present disclosure;

FIG. 7 is a vertical cross-sectional view of a semiconductor packaged device according to some embodiments of the present disclosure; and

FIG. 8 is a vertical cross-sectional view of the semiconductor packaged device according to some embodiments of the present disclosure.

Detailed Description:

Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

Spatial descriptions, such as "on, " "above, " "below, " "up, " "left, " "right, " "down, " "top, " "bottom, " "vertical, " "horizontal, " "side, " "higher, " "lower, " "upper, " "over, " "under, " and so forth, are specified with respect to a certain component or group of components, or a certain plane of a component or group of components, for the orientation of the component (s) as shown in the associated figure. It should be understood that the spatial descriptions used herein are for purposes of illustration only, and that practical implementations of the structures described herein can be spatially arranged in any orientation or manner, provided that the merits of embodiments of this disclosure are not deviated from by such arrangement.

Further, it is noted that the actual shapes of the various structures depicted as approximately rectangular may, in actual device, be curved, have rounded edges, have somewhat uneven thicknesses, etc. due to device fabrication conditions. The straight lines and right angles are used solely for convenience of representation of layers and features.

In the following description, semiconductor packaged devices/dies/packages, methods for manufacturing the same, and the likes are set forth as preferred examples. It will be apparent to those skilled in the art that modifications, including additions and/or substitutions may be made without departing from the scope and spirit of the present disclosure. Specific details may be omitted so as not to obscure the present disclosure; however, the disclosure is written to enable one skilled in the art to practice the teachings herein without undue experimentation.

To satisfy market demands toward increased miniaturization and functionality, using wafer-level chip-scale packaging (WLCSP) technology to package a semiconductor die has been introduced in recent years for generally increasing density, performance, and cost-effectiveness, while decreasing the weight and size of the devices in the electronic packaging industry. Using WLCSP for packaging smaller die size devices with lower numbers of pins is usually advantageous and cost-effective. The resulting package of WLCSP is practically of the substantially same size as the semiconductor die. However, it is difficult for packaged semiconductor die to be mounted on other electronic components due to its small volume.

On the other hand, as the operating speed of the transistor increases, so does heat generation. Excessive heat may accumulate in the semiconductor packaged device, resulting in malfunction of the semiconductor packaged device. Furthermore, the quality of an encapsulant of the semiconductor packaged device will worsen due to excessive heat. With respect to the semiconductor packaged device packaged with WLCSP technology, the heat dissipation issues would become more serious because of its small size. Moreover, the semiconductor packaged device is vulnerable to be damaged during the package stage. Thus, the reliability and performance of the semiconductor packaged device would become worse.

At least for avoiding the aforesaid issues, the present disclosure provides a novel structure/arrangement for the semiconductor packaged device.

FIG. 1A is a top view of a semiconductor packaged device 1A according to some embodiments of the present disclosure. FIG. 1B is a vertical cross-sectional view of the semiconductor packaged device 1A taken along a line A-A’ in FIG. 1A.

Referring to FIGS. 1A and 1B, the semiconductor packaged device 1A includes a semiconductor die 10, a substrate 20, bonding layers 22, 24, a conductive structure (including a bottom and a top portions 302, 304) , a plating layer 40, and a protection layer 50. The semiconductor packaged device 1A can be arranged in a space defined by directions D1, D2 and D3. The directions D1, D2, and D3 are labeled in the FIGS. 1A and 1B. The directions D1, D2 and D3 are different from each other. In some embodiments, the directions D1, D2 and D3 are perpendicular to each other.

The semiconductor die 10 has an active surface AS (i.e., a top surface) , a back surface BS (i.e., a bottom surface/non-active surface) , and a pair of side surfaces SS1, SS2. The active surface AS is opposite to the back surface BS. The side surface SS1 is opposite to the side surface SS2. Each of the side surfaces SS1, SS2 connects the active surface AS to the back surface BS. In the embodiment, the semiconductor die 10 can have a rectangular profile. In some embodiments, the semiconductor die 10 can have a trapezoid profile.

The active surface AS of the semiconductor die 10 can contain analog or digital circuits implemented as active devices, passive devices, conductive layers, and dielectric layers formed within the die and electrically interconnected according to the electrical design and function of the die. For example, the circuit may include one or more transistors, diodes, or other circuit elements formed within active surface AS to implement analog circuits or digital circuits. As such, the active surface AS is the main heating surface of the semiconductor die 10. During the operation of the semiconductor packaged device 1A, the semiconductor die 10 would generate most of heat in the semiconductor packaged device 1A. Thus, the semiconductor die 10 can be viewed as a main heat source/heat-generating electronic component, which means that the highest temperature in the semiconductor packaged device 1A occurs in a region occupied by the semiconductor die 10.

FIG. 2A is a vertical cross-sectional view of a GaN-based transistor in the semiconductor packaged device of the FIG. 1A. Referring to FIG. 2A, in some embodiments, the semiconductor die 10 can include a transistor. The transistor can be formed within the active surface AS of the semiconductor die 10. The transistor includes a substrate 102, a nitride-based semiconductor layer 103, a nitride-based semiconductor layer 104,

electrodes

105, 106, a doped nitride-based semiconductor layer 107, and a gate electrode 108.

Referring to FIG. 2A, the substrate 102 may be a semiconductor substrate. The exemplary materials of the substrate 102 can include, for example but are not limited to, Si, SiGe, SiC, gallium arsenide, p-doped Si, n-doped Si, sapphire, semiconductor on insulator, such as silicon on insulator (SOI) , or other suitable substrate materials. In some embodiments, the substrate 102 can include, for example, but is not limited to, group III elements, group IV elements, group V elements, or combinations thereof (e.g., III-V compounds) . In other embodiments, the substrate 102 can include, for example but is not limited to, one or more other features, such as a doped region, a buried layer, an epitaxial (epi) layer, or combinations thereof.

In some embodiments, the transistor can include a buffer layer (not shown) . The buffer layer (not shown) can be disposed on/over/above the substrate 102. The buffer layer can be disposed between the substrate 102 and the nitride-based semiconductor layer 103. The buffer layer can be configured to reduce lattice and thermal mismatches between the substrate 102 and the nitride-based semiconductor layer 103, thereby curing defects due to the mismatches/difference. The buffer layer may include a III-V compound. The III-V compound can include, for example but are not limited to, aluminum, gallium, indium, nitrogen, or combinations thereof. Accordingly, the exemplary materials of the buffer layer can further include, for example but are not limited to, GaN, AlN, AlGaN, InAlGaN, or combinations thereof.

In some embodiments, the transistor may further include a nucleation layer (not shown) . The nucleation layer may be formed between the substrate 102 and the buffer layer. The nucleation layer can be configured to provide a transition to accommodate a mismatch/difference between the substrate 102 and a III-nitride layer of the buffer layer. The exemplary material of the nucleation layer can include, for example but is not limited to AlN or any of its alloys.

The nitride-based semiconductor layer 103 is disposed on/over/above the substrate 102. The nitride-based semiconductor layer 104 is disposed on/over/above the nitride-based semiconductor layer 103. The exemplary materials of the nitride-based semiconductor layer 103 can include, for example but are not limited to, nitrides or group III-V compounds, such as GaN, AlN, InN, In _xAl _yGa _(1–x–y) N where x+y ≤ 1, Al _xGa _(1–x) N where x ≤ 1. The exemplary materials of the nitride-based semiconductor layer 104 can include, for example but are not limited to, nitrides or group III-V compounds, such as GaN, AlN, InN, In _xAl _yGa _(1–x–y) N where x+y ≤ 1, Al _yGa _(1–y) N where y ≤ 1.

The exemplary materials of the nitride-based semiconductor layers 103 and 104 are selected such that the nitride-based semiconductor layer 104 has a bandgap (i.e., forbidden band width) greater than a bandgap of the nitride-based semiconductor layer 103, which causes electron affinities thereof different from each other and forms a heterojunction therebetween. For example, when the nitride-based semiconductor layer 103 is an undoped GaN layer having a bandgap of approximately 3.4 eV, the nitride-based semiconductor layer 104 can be selected as an AlGaN layer having bandgap of approximately 4.0 eV. As such, the nitride-based semiconductor layers 103 and 104 can serve as a channel layer and a barrier layer, respectively. A triangular well potential is generated at a bonded interface between the channel and barrier layers, so that electrons accumulate in the triangular well, thereby generating a two-dimensional electron gas (2DEG) region adjacent to the heterojunction. Accordingly, the transistor is available to include at least one GaN-based high-electron-mobility transistor (HEMT) .

The

electrodes

105 and 106 are disposed on/over/above the nitride-based semiconductor layer 104. The

electrodes

105 and 106 can make contact with the nitride-based semiconductor layer 104. In some embodiments, the electrode 105 can serve as a source electrode. In some embodiments, the electrode 105 can serve as a drain electrode. In some embodiments, the electrode 106 can serve as a source electrode. In some embodiments, the electrode 106 can serve as a drain electrode. The role of the

electrodes

105 and 106 depends on the device design.

In some embodiments, the

electrodes

105 and 106 can include, for example but are not limited to, metals, alloys, doped semiconductor materials (such as doped crystalline silicon) , compounds such as silicides and nitrides, other conductor materials, or combinations thereof. The exemplary materials of the

electrodes

105 and 106 can include, for example but are not limited to, Ti, AlSi, TiN, or combinations thereof. Each of the electrodes 1024 and 1025 may be a single layer, or plural layers of the same or different composition. The

electrodes

105 and 106 form ohmic contacts with the nitride-based semiconductor layer 104. Furthermore, the ohmic contacts can be achieved by applying Ti, Al, or other suitable materials to the

electrodes

105 and 106.

In some embodiments, each of the

electrodes

105 and 106 is formed by at least one conformal layer and a conductive filling. The conformal layer can wrap the conductive filling. The exemplary materials of the conformal layer can include, for example but are not limited to, Ti, Ta, TiN, Al, Au, AlSi, Ni, Pt, or combinations thereof. The exemplary materials of the conductive filling can include, for example but are not limited to, AlSi, AlCu, or combinations thereof.

The doped nitride-based semiconductor layer 107 is disposed on/above the nitride-based semiconductor layer 104. The gate electrode 108 is disposed/stacked on the doped nitride-based semiconductor layer 107. The doped nitride-based semiconductor layer 107 and the gate electrode 108 are disposed between the

electrodes

105 and 106.

A width of the doped nitride-based semiconductor layer 107 is greater than that of the gate electrode 108. In some embodiments, a width of the doped nitride-based semiconductor layer 107 is substantially the same as a width of the gate electrode 108. The relationship of the widths of the doped nitride-based semiconductor layer 107 and the gate electrode 108 can depend on the device design.

In the exemplary illustration of FIG. 2A, the transistor is an enhancement mode device, which is in a normally-off state when the gate electrode 108 is at approximately zero bias. Specifically, the doped nitride-based semiconductor layer 107 may create at least one p-n junction with the nitride-based semiconductor layer 104 to deplete the 2DEG region, such that at least one zone of the 2DEG region corresponding to a position below the corresponding the gate electrode 108 has different characteristics (e.g., different electron concentrations) than the remain of the 2DEG region and thus is blocked.

Due to such mechanism, the transistor has a normally-off characteristic. In other words, when no voltage is applied to the gate electrode 108 or a voltage applied to the gate electrode 108 is less than a threshold voltage (i.e., a minimum voltage required to form an inversion layer below the gate electrode 108) , the zone of the 2DEG region below the gate electrode 108 is kept blocked, and thus no current flows therethrough.

In some embodiments, the doped nitride-based semiconductor layer 107 can be omitted, such that the transistor is a depletion-mode device, which means the transistor in a normally-on state at zero gate-source voltage.

The doped nitride-based semiconductor layer 107 can be a p-type doped III-V semiconductor layer. The exemplary materials of the doped nitride-based semiconductor layer 107 can include, for example but are not limited to, p-doped group III-V nitride semiconductor materials, such as p-type GaN, p-type AlGaN, p-type InN, p-type AlInN, p-type InGaN, p-type AlInGaN, or combinations thereof. In some embodiments, the p-doped materials are achieved by using a p-type impurity, such as Be, Zn, Cd, and Mg.

In some embodiments, the nitride-based semiconductor layer 103 includes undoped GaN and the nitride-based semiconductor layer 104 includes AlGaN, and the doped nitride-based semiconductor layer 107 is a p-type GaN layer which can bend the underlying band structure upwards and to deplete the corresponding zone of the 2DEG region, so as to place the transistor into an off-state condition.

The exemplary materials of the gate electrode 108 may include metals or metal compounds. The gate electrode 108 may be formed as a single layer, or plural layers of the same or different compositions. The exemplary materials of the metals or metal compounds can include, for example but are not limited to, W, Au, Pd, Ti, Ta, Co, Ni, Pt, Mo, TiN, TaN, metal alloys or compounds thereof, or other metallic compounds.

At least to elevate the heat dissipation performance and mechanical properties of the semiconductor packaged device 1A, in the present disclosure, the semiconductor die 10 is packaged with a substrate 20 with high thermal conductivity coefficient and with a greater size than that of the semiconductor die 10. The larger-sized substrate 20 can withstand/bear at least a part of mechanical impact/shock.

The substrate 20 has a top surface 202, a bottom surface 204, and a pair of side surfaces 206, 208. The top surface 202 is opposite to the back surface 204. The side surface 206 is opposite to the side surface 208. Each of the side surfaces 206, 208 connects the top surface 202 to the bottom surface 204. In the embodiment, the substrate 20 can have a rectangular profile. In some embodiments, the substrate 20 can have a trapezoid profile.

The substrate 20, for example, can be used to facilitate heat dissipation during the operation period of the semiconductor packaged device 1A. Hence, the substrate 20 can be referred to as a heat dissipating substrate hereinafter. In some embodiments, the exemplary materials of the heat dissipating substrate 20 are selected, such that the thermal conductivity coefficient of the heat dissipating substrate 20 can be greater than that of the semiconductor die 10. The exemplary materials of the heat dissipating substrate 20 can include, for example but are not limited to, Al ₂O ₃, SiC, graphene, metal, diamond, or combinations thereof.

The bonding layer 22 is disposed on/over/above the top surface 202 of the heat dissipating substrate 20. The bonding layer 22 is disposed/inserted between the back surface BS of the semiconductor die 10 and the top surface 202 of the heat dissipating substrate 20, such that the semiconductor die 10 can be bonded/adhered to the heat dissipating substrate 20. The back surface BS of the semiconductor die 10 faces toward the heat dissipating substrate 20. The bonding layer 22 makes contact with an entirety of the back surface BS of the semiconductor die 10. In some embodiments, the bonding layer 22 can include a high-thermal die attach film (DAF) , which is an adhesive film with high thermal conductive property. Thus, the heat dissipating substrate 20 can be well thermally coupled to the back surface BS of the semiconductor die 10 through the bonding layer 22. A thermal conductive path, from the back surface BS to the heat dissipating substrate 20, is formed.

In some embodiments, the bonding layer 22 can be omitted at least for reducing the manufacturing cost of the semiconductor packaged device, and the semiconductor die 10 can directly make contact with the back surface BS of the semiconductor die 10.

In order to further improve the mountability of the semiconductor die 10 on another substrate (not shown in FIG. 1B) under the heat dissipating substrate 20, the present disclosure forms a conductive structure including a bottom and a

top portions

302, 304. The detailed configuration and effect will be fully described as follows.

Before a step of forming the conductive structure, a bonding layer 24, which is used for connection between the semiconductor die 10 and the conductive structure, is formed on the active surface AS of the semiconductor die 10. The bonding layer 24 is disposed on/over/above the active surface AS of the semiconductor die 10. The bonding layer 24 makes contact with the active surface AS of the semiconductor die 10. In the embodiment, the side surfaces SS1, SS2 of the semiconductor die 10 are free from coverage of the bonding layer 24. The exemplary materials of the bonding layer 24 can be selected as metal, metal compounds, or metal alloy with high electrical and thermal conductivity coefficients. In some embodiments, the bonding layer 24 can serve as a top metal layer on the semiconductor die 10.

In order to mount the semiconductor die 10 on another substrate (not shown in FIG. 1B) under the heat dissipating substrate 20, both of the locations of the active surface AS and the another substrate should take into consideration. In some embodiments, the profile of the conductive structure is designed to be irregular to realize connection between the semiconductor die 10 and the another substrate. At least to achieve such an irregular profile, the conductive structure is fabricated by a two-step manufacturing stages to form a bottom and a top

conductive portions

302, 304 in sequence. The conductive structure is formed to extend from a position P1 over the active surface AS the semiconductor die 10 to a position P2 under the bottom surface 204 of the heat dissipating substrate 20, such that the semiconductor die 10 and the heat dissipating substrate 20 are sandwiched by the bottom and the top

conductive portions

302, 304.

During the manufacturing process of the conductive structure, first of all, a blanket conductive layer is formed to cover an entirety of the heat dissipating substrate 20. Then, a patterning process is performed on the blanket conductive layer to form the bottom conductive portion 302. The bottom conductive portion 302 includes two separated bottom

conductive sub-portions

3021, 3022. The profiles of the two bottom

conductive sub-portions

3021, 3022, for example, are symmetrical with respect to the heat dissipating substrate 20. In some embodiments, the profiles of the two bottom

conductive sub-portions

3021, 3022 can be asymmetrical with respect to the heat dissipating substrate 20. The bottom conductive portion 302 is conformally disposed with the heating dissipating substrate 20. The bottom conductive portion 302 makes contact with a part of the top surface 202, the side surface 206/208, and a part of the bottom surface 204. A left and a right portions of the heating dissipating substrate 20 are wrapped by the bottom conductive portion 302.

Next, the bonding layer 22 is adhered on the top surface 202 to define a die attach region. The bonding layer 22 is located between two top end surfaces ES1, ES2 of the bottom

conductive sub-portions

3021, 3022. The back surface BS of the semiconductor die 10 is attached on the bonding layer 22. Then, another bonding layer 24 is formed on the active surface AS of the semiconductor die 10 to prepare for connection with the top conductive portion 304 which is formed in the following manufacturing stage.

After that, another blanket conductive layer is formed on the bottom conductive portion 302 and the bonding layer 24. Then, another patterning process is performed on the another blanket conductive layer to form the top conductive portion 304. The top conductive portion 304 includes two separated top

conductive sub-portions

3041, 3042, and profiles of the two top

conductive sub-portions

3041, 3042 are asymmetrical with respect to the heat dissipating substrate 20 on a cross-section of the semiconductor packaged device 1A in the FIG. 1B. The top conductive sub-portion 3041 is bonded to the active surface AS of the semiconductor die 10 through the bonding layer 24. The active surface AS of the semiconductor die 10 faces toward the top conductive sub-portion 3041. The semiconductor die 10 can be thermally coupled/electrically connected to the top conductive sub-portion 3041 through the bonding layer 24. The formed top conductive portion 304 is disposed on/over/above the bottom conductive portion 302, such that an interface IF1 is formed therebetween, in which the interface IF1 is within a thickness T of the semiconductor die 10. It should be noted that the interface IF1 is a result of aforesaid two-step manufacturing stages. Thus, the conductive structure is obtained.

With respect to the detail configuration of the conductive structure, the top conductive portion 304 extends from the position P1 laterally/horizontally and downward to make contact with the bottom conductive portion 302, thereby forming the interface IF1 therebetween. The bottom conductive portion 304 extends from the interface IF1 to the position P2 along the top surface 202, the side surface 206, and the bottom surface 204 of the heat dissipating substrate 20. The formed conductive structure spans across thicknesses of the semiconductor die 10 and the heat dissipating substrate 20.

The exemplary materials of the conductive structure can include, for example but are not limited to, conductive materials. The conductive structure may include a single film or multilayered film having Ag, Al, Cu, Mo, Ni, Ti, alloys thereof, oxides thereof, nitrides thereof, or combinations thereof. In some embodiments, the material of the top conductive portion 304 can be the same as that of the bottom conductive portion 302. In some embodiments, the material of the top conductive portion 304 can be different from that of the bottom conductive portion 302. The present disclosure is not limited thereto.

The plating layer 40 can be optionally formed to cover outer surfaces (i.e., a side and a bottom surfaces) of the bottom conductive portion 302 for achieving different functions. For example, in some embodiments, the plating layer 40 is formed to cover the bottom conductive portion 302 for avoiding corrosion. In some embodiments, the plating layer 40 is formed to cover the bottom conductive portion 302 to increase its conductivity. In some embodiments, the plating layer 40 is formed to cover the bottom conductive portion 302 to increase its solderability. The function of the plating layer 40 is determined by its materials. The exemplary material of the plating layer 40 can include, for example but are not limited to, Ag, Au, Cu, Ni, Pb, Fe, Sn, Zn, Cr, or a combination thereof.

FIG. 2B is a vertical cross-sectional view of the semiconductor packaged device 1A in FIG. 1A mounted on a print circuit board (PCB) 1. Referring to FIG. 2B, by the configuration of the conductive structure, a part of the conductive structure (i.e., the bottom conductive portion 302) can serve as pins. The effecting bonding region of the semiconductor die 10 can be enlarged due to the configuration of the conductive structure; and thus, the semiconductor die 10 can be mounted on the other electrical component (such as PCB 1) more easier. In some embodiments, the material of the plating layer 40 can be selected to increase solderability of the bottom conductive portion 302 of the conductive structure. Such a configuration can improve the mountability of the semiconductor packaged device 1A. The semiconductor packaged device 1A can be mounted on the PCB 1 through surface mount technology (SMT) . Hence, the semiconductor packaged device 1A can serve as a surface mount device (SMD) . The semiconductor die 10 can transmit at least one signals to the PCB 1 through the conductive structure, and vice versa.

On the other hand, in some embodiments, the conductive structure can have high thermal conductivity coefficient, such as metal. Thus, the conductive structure itself can be referred to as another thermal conductive path from the active surface AS of the semiconductor die 10 to the heat dissipating substrate 20. Hence, by the configuration of the conductive structure, the effective heat dissipating area of the semiconductor die 10 can be increased. The semiconductor die 10 is achieved to be dual-side cooled by the aforesaid two thermal conductive paths. Thus, the heat dissipating performance of the semiconductor packaged device 1A can be greatly improved.

The protection layer 50 is formed to cover/encapsulate the semiconductor die 10 and the conductive structure. The protection layer 50 covers the active surface AS of the semiconductor die 10 and a top surface of the top conductive portion 304. Therefore, the protection layer 50 can provide a good protection function to the conductive structure and the semiconductor die 10, thereby enhancing the mechanical properties of the semiconductor packaged device 1A.

Specifically, the protection layer 50 can include a bottom and a

top protection sub-layers

502, 504. The bottom protection sub-layer 502 covers the heat dissipating substrate 20, the bottom conductive portion 302 of the conductive structure, and the semiconductor die 10. The top conductive portion 304 penetrates the bottom protection sub-layer 502 of the protection layer 50, so as to make contact with the bottom conductive portion 302 of the conductive structure. At least a portion of the bottom protection sub-layer 502 is located between the semiconductor die 10 and the conductive structure. The top protection sub-layer 504 is disposed on/over/above the bottom protection sub-layer 502 and the top conductive portion 304. The top protection sub-layer 504 makes contact with the bottom protection sub-layer 502, thereby forming an interface IF2 therebetween, in which the interface IF2 is higher than the interface IF1.

The exemplary material of the protection layer 50 can include, for example but are not limited to, polymer or resin. In some embodiments, the material of the top protection sub-layer 504 can be the same as that of the bottom protection sub-layer 502. In some embodiments, the material of the top protection sub-layer 504 can be different from that of the bottom protection sub-layer 502. The present disclosure is not limited thereto.

Referring back to FIG. 1A, from the top view of the packaged semiconductor device 1A, each of the top

conductive sub-portions

3041, 3042 can have an interdigitated pattern. In some embodiments, the top conductive sub-portion 3041 can be electrically coupled to a source voltage level, which means the top conductive sub-portion 3041 can serve as a source pad. A part of the top conductive sub-portion 3042 can be electrically coupled to a drain voltage level, which means the part of the top conductive sub-portion 3041 can serve as a drain pad. Another part of the conductive sub-portion 3042 can be electrically coupled to a gate voltage level, which means the another part of the top conductive sub-portion 3041 can serve as a gate pad. As such, different portions of the conductive structure can apply a source voltage, a drain voltage, and a gate voltage to the semiconductor die 10.

Referring to the FIG. 1B again, the two separated bottom

conductive sub-portions

3021, 3022 of the bottom conductive portion 302 make contact with the two top

conductive sub-portions

3041, 3042 of the top conductive portion 304, respectively. Based on the aforesaid description of the way of applied voltage in the FIG. 1A, the bottom conductive sub-portion 3021 is electrically coupled to the top conductive sub-portion 3041, and their voltage levels are the same (i.e., the source voltage) . The bottom conductive sub-portion 3022 is electrically coupled to the top conductive sub-portion 3042 (i.e., the gate voltage) . The purpose of forming the top conductive sub-portions 3041, 3042 (or bottom conductive sub-portions 3021, 3022) to be separated from each other is at least to prevent short circuit issue.

FIG. 1C is a vertical cross-sectional view of the semiconductor packaged device 1A taken along a line B-B’ in FIG. 1A. Referring to FIG. 1C, along the line B-B’, the top

conductive sub-portions

3041, 3042 are located at the two opposite sides of the semiconductor die 10. The top conductive sub-portion 3041 can be applied to a source voltage, and the top conductive sub-portion 3042 can be applied to a drain voltage.

FIG. 1D is a vertical cross-sectional view of the semiconductor packaged device 1A taken along a line C-C’ in FIG. 1A. Referring to FIG. 1D, along the line C-C’, the top conductive sub-portion 3041 is located at a left side of the semiconductor die 10. The top conductive sub- portion 3042 extends horizontally to a position P3 on the active surface AS of the semiconductor die 10, such that at least a part of the top conductive sub-portion 3042 vertically overlaps with the semiconductor die 10. The top conductive sub-portion 3042 can be bonded to the bonding layer 24, and the semiconductor die 10 can be thermally coupled/electrically connected to the top conductive sub-portion 3042 through the bonding layer 24. The top conductive sub-portion 3041 can be applied to a source voltage, and the top conductive sub-portion 3042 can be applied to a drain voltage.

FIG. 1E is a vertical cross-sectional view of the semiconductor packaged device 1A taken along a line D-D’ in FIG. 1A. Referring to FIG. 1E, along the line D-D’, the top conductive sub-portion 3041 extends horizontally to a position P4 on the active surface AS of the semiconductor die 10, such that at least a part of the top conductive sub-portion 3041 vertically overlaps with the semiconductor die 10. The top conductive sub-portion 3041 can be bonded to the bonding layer 24, and the semiconductor die 10 can be thermally coupled/electrically connected to the top conductive sub-portion 3041 through the bonding layer 24. The top conductive sub-portion 3042 is located at a right side of the semiconductor die 10. The top conductive sub-portion 3041 can be applied to a source voltage, and the top conductive sub-portion 3042 can be applied to a drain voltage.

Different stages of a method for manufacturing the semiconductor packaged device 1A are shown in FIG. 3A, FIG. 3B, FIG. 3C, FIG 3D, FIG 3E, and FIG. 3F described below. In the following, deposition techniques can include, for example but are not limited to, atomic layer deposition (ALD) , physical vapor deposition (PVD) , chemical vapor deposition (CVD) , metal organic CVD (MOCVD) , plasma enhanced CVD (PECVD) , low-pressure CVD (LPCVD) , plasma-assisted vapor deposition, epitaxial growth, or other suitable processes.

Referring to FIG. 3A, a heat dissipating substrate 20 is provided. A blanket conductive layer CL is formed to cover an entirety of the heat dissipating substrate 20.

Referring to FIG. 3B, a patterning process is performed on the blanket conductive layer CL to expose a top and a bottom surfaces 202, 204 of the heat dissipating substrate 20, such that the remaining portion of the conductive layer CL on the heat dissipating substrate 20 serves as the bottom conductive portion 302 of a conductive structure. The bottom conductive portion 302 is formed to cover the heating dissipating substrate 20, and at least parts of the top and

bottom surfaces

202, 204 are exposed by the bottom conductive portion 302.

Referring to FIG. 3C, a bonding layer 22 is formed on the exposed top surface 202 of heat dissipating substrate 20 to define a die attach region. Then, the semiconductor die 10 is mounted/attached on the exposed top surface 202 of the heat dissipating substrate 20 through the bonding layer 22. Another bonding layer 24 is formed on an active surface AS of the semiconductor die 10. An intermediate protection layer MD1 is formed to cover the bottom conductive portion 302, the heat dissipating substrate 20, the bonding layer 24, and the semiconductor die 10.

Referring to FIG. 3D, a thinning process is performed on the intermediate protection layer MD1 until the bonding layer 24 is exposed. Then, a patterning process is performed on the thinned intermediate protection layer MD1 to form a plurality of through holes TH to expose the bottom conductive portion 302. Thus, a protection sub-layer 502 of a protection layer is formed to cover the heat dissipating substrate 20, the bottom conductive portion 302, and the semiconductor die 10.

Referring to FIG. 3E, another blanket conductive layer (not shown) is formed on the resulted structure in the FIG. 3D. Portions of the another blanket conductive layer are filled into the through holes TH to make contact with the bottom conductive portion 302 to form an interface IF1. Then, a patterning process is performed on the another blanket conductive layer to remove the excess portions thereof, thereby forming a top conductive portion 304 of the conductive structure on the bottom conductive portion 302, the bonding layer 24, and the semiconductor die 10. The interface IF1 is formed between the top and the bottom

conductive portions

304, 302. An end part of the top conductive portion 304 makes contact with the bonding layer 24, and the other end part thereof makes contact with the bottom conductive portion 302 to form the interface IF1. Thus, the conductive structure including bottom and top

conductive portions

302, 304 is obtained.

Referring to FIG. 3F, a top protection sub-layer 404 of the protection layer 40 is formed on the bottom protection sub-layer 402 to cover the top conductive portion 304 of the conductive structure. Another interface IF2 is formed between the top and bottom protection sub-layers 404, 402. The interface IF2 is formed to be higher than the interface IF1. Thus, the protection layer 40 covering the semiconductor die 10 and the conductive structure is obtained. Then, a plating layer 50 is formed to cover the bottom conductive portion 302, obtaining the configuration of the semiconductor packaged device 1A as shown in FIG. 1A.

FIG. 4 is a vertical cross-sectional view of a semiconductor packaged device 1B according to some embodiments of the present disclosure. The semiconductor packaged device 1B is similar to the semiconductor packaged device 1A as described and illustrated with reference to FIG. 1A, except that the top conductive portion 304B extends along a top and a side surfaces 242, 244 of the bonding layer 24 to make contact with the active surface AS of the semiconductor die 20. Such a configuration can meet a specific design requirement.

FIG. 5 is a vertical cross-sectional view of a semiconductor packaged device 1C according to some embodiments of the present disclosure. The semiconductor packaged device 1C is similar to the semiconductor packaged device 1A as described and illustrated with reference to FIG. 1A, except that the bonding layer 24C has different portions to cover different parts of the active surface AS of the semiconductor die 10. The two top

conductive sub-portions

3041C, 3042C are bonded to the active surface AS of the semiconductor die 10 through the bonding layer 24C. The top conductive sub-portion 3042C extends laterally to make contact with a portion of the bonding layer 24C, such that the top conductive sub-portion 3042 can be electrically connected/thermally coupled to the semiconductor die 10 through the bonding layer 24C. Also, the heat generated from the semiconductor die 10 can dissipate from the top conductive sub-portion 3042C through the bonding layer 24C; and therefore, the semiconductor packaged device 1C can have a better heat dissipation performance.

FIG. 6 is a vertical cross-sectional view of a semiconductor packaged device 1D. The semiconductor packaged device 1D is similar to the semiconductor packaged device 1A as described and illustrated with reference to FIG. 1A, except that the bonding layer 24D covers a part of the active surface AS and the side surface SS1 of the semiconductor die 10. Thus, heat generated from the semiconductor die 10 can dissipate from the active and side surfaces AS, SS1 through the bonding layer 24D to the conductive structure. Hence, the semiconductor packaged device 1D can have a better heat dissipation performance.

FIG. 7 is a vertical cross-sectional view of a semiconductor packaged device 1E. The semiconductor packaged device 1E is similar to the semiconductor packaged device 1A as described and illustrated with reference to FIG. 1A, except that a left portion of the heat dissipating substrate 20 is covered by the bottom and the top

conductive portions

302E, 304E, and a right portion of the heat dissipating substrate 20 is free from coverage of the bottom and the top

conductive portions

302E, 304E. Such a configuration can meet a specific design requirement.

FIG. 8 is a vertical cross-sectional view of a semiconductor packaged device 1F. The semiconductor packaged device 1F is similar to the semiconductor packaged device 1A as described and illustrated with reference to FIG. 1A, except that the top conductive sub-portion 3042F extends horizontally to cover the semiconductor die 10. The top conductive sub-portion 3042F is spaced apart from the semiconductor die 10 by the bottom protection sub-layer 402F. Such a configuration can meet a specific design requirement.

Based on above, in the present disclosure, a semiconductor die is packaged with a substrate (i.e., heat dissipating substrate) with high thermal conductivity coefficient and with a greater size than that of the semiconductor die, which contributes heat dissipation of the semiconductor die. The conductive structure is formed to extend from a position over the active surface of the semiconductor die to another position directly under the bottom surface of the heat dissipating substrate. Such a configuration can improve the mountability of the semiconductor packaged device. Therefore, the structure of the semiconductor packaged device can be suitable for WLCSP. Moreover, a protection layer can be disposed to cover the active surface of the semiconductor die and the conductive structure to provide a good protection.

The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical application, thereby enabling others skilled in the art to understand the disclosure for various embodiments and with various modifications that are suited to the particular use contemplated.

As used herein and not otherwise defined, the terms "substantially, " "substantial, " "approximately" and "about" are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can encompass instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can encompass a range of variation of less than or equal to ±10%of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces within micrometers of lying along a same plane, such as within 40 μm, within 30 μm, within 20 μm, within 10 μm, or within 1 μm of lying along the same plane.

As used herein, the singular terms “a, ” “an, ” and “the” may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided “on” or “over” another component can encompass cases where the former component is directly on (e.g., in physical contact with) the latter component, as well as cases where one or more intervening components are located between the former component and the latter component.

While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations are not limiting. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. Further, it is understood that actual devices and layers may deviate from the rectangular layer depictions of the FIGS. and may include angles surfaces or edges, rounded corners, etc. due to manufacturing processes such as conformal deposition, etching, etc. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and the drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations.

Claims

A semiconductor packaged device, comprising:

a heat dissipating substrate;

a semiconductor die disposed over a top surface of the heat dissipating substrate and thermally coupled to the heat dissipating substrate;

a conductive structure thermally coupled to the semiconductor die and extending from a first position over an active surface of the semiconductor die to a second position under a bottom surface of the heat dissipating substrate, wherein the conductive structure comprises:

a bottom conductive portion conformally disposed with the heat dissipating substrate; and

a top conductive portion disposed on and making contact with the bottom conductive portion to form a first interface therebetween, wherein the top conductive portion covers the semiconductor die; and

a protection layer covers the semiconductor die and the conductive structure.
The semiconductor packaged device of claim 1, wherein the first interface formed between the top and bottom conductive portions of the conductive structure is located within a thickness of the semiconductor die.
The semiconductor packaged device of claim 1, wherein the top conductive portion of the conductive structure extends from the first position laterally and downward to make contact with the bottom conductive portion, thereby forming the first interface between the top and bottom conductive portions.
The semiconductor packaged device of claim 1, wherein the bottom conductive portion of the conductive structure extends from the first interface to the second position along a top surface, a side surface and the bottom surface of the heat dissipating substrate.
The semiconductor packaged device of claim 1, wherein at least a portion of the protection layer is located between the semiconductor die and the conductive structure.
The semiconductor packaged device of claim 1, wherein the protection layer further comprises a bottom protection sub-layer and a top protection sub-layer disposed over the bottom protection sub-layer and forming a second interface therebetween,

wherein the bottom protection sub-layer covers the heat dissipating substrate, the bottom conductive portion of the conductive structure, and the semiconductor die; and

the top protection sub-layer covers the top conductive portion of the conductive structure.
The semiconductor packaged device of claim 6, wherein the second interface formed between the top protection sub-layer and the bottom protection sub-layer is higher than the first interface formed between the top and bottom conductive portions.
The semiconductor packaged device of claim 6, wherein the top conductive portion of the conductive structure penetrates the bottom protection sub-layer of the protection layer, so as to make contact with the bottom conductive portion of the conductive structure.
The semiconductor packaged device of claim 1, wherein at least one material of the heat dissipating substrate comprises Al ₂O ₃, SiC, graphene, metal, diamond, or combinations thereof.
The semiconductor packaged device of claim 1, further comprising a plating layer covering the bottom conductive portion of the conductive structure.
The semiconductor packaged device of claim 1, further comprising a first bonding layer disposed between a back surface of the semiconductor die which is opposite to the active surface and a top surface of the heat dissipating substrate, wherein the semiconductor die is thermally coupled to the heat dissipating substrate through the first bonding layer.
The semiconductor packaged device of claim 11, wherein the first bonding layer makes contact with an entirety of the back surface of the semiconductor die.
The semiconductor packaged device of claim 1, further comprising a second bonding layer disposed between the active surface of the semiconductor die and the top portion of the conductive structure, wherein the semiconductor die is thermally coupled to the conductive structure through the second bonding layer.
The semiconductor packaged device of claim 13, wherein the second bonding layer makes contact with a part of the active surface of the semiconductor die.
The semiconductor packaged device of claim 13, wherein the top conductive portion extends along a top surface and a side surface of the second bonding layer to make contact with the active surface of the semiconductor die.
A manufacturing method of a semiconductor packaged device comprising:

forming a bottom conductive portion of a conductive structure to cover a heating dissipating substrate, and at least a part of a top surface of the heating dissipating substrate is exposed by the bottom conductive portion;

mounting a semiconductor die on the exposed top surface of the heat dissipating substrate;

forming a top conductive portion of a conductive structure on the bottom conductive portion and the semiconductor die, such that a first interface is formed between the top and bottom conductive portions of the conductive structure; and

forming a protection layer to cover the semiconductor die and the conductive structure.
The method of the claim 16, wherein the step of the forming the bottom conductive portion of the conductive structure further comprises:

forming a first conductive layer to cover an entirety of the heat dissipating substrate; and

performing a patterning process on the first conductive layer to expose a top surface of the heat dissipating substrate, such that the remaining portion of the first conductive layer on the heat dissipating substrate serves as the bottom conductive portion of the conductive structure.
The method of the claim 16, further comprising:

forming a first bonding layer on an active surface of the semiconductor die prior the step of forming the top conductive portion of the conductive structure.
The method of the claim 16, wherein the step of the forming the protection layer to cover the semiconductor die and the conductive structure further comprises:

forming a bottom protection sub-layer to cover the heat dissipating substrate, the bottom conductive portion of the conductive structure, and the semiconductor die; and

forming a top protection sub-layer on the bottom protection sub-layer to cover the top conductive portion of the conductive structure.
The method of the claim 19, wherein a second interface is formed between the top and the bottom protection sub-layers.
A surface mounted device, comprising:

a heating dissipating substrate;

a semiconductor die disposed on and thermally coupled to the heating dissipating substrate;

a conductive structure thermally coupled to the heating dissipating substrate and the semiconductor die and comprising a top and a bottom conductive portions, wherein the semiconductor die and the heating dissipating substrate are sandwiched by the top and the bottom conductive portions, such that an active surface and a back surface of the semiconductor die face toward the top conductive portion and the heating dissipating substrate, respectively and the heating dissipating substrate is wrapped by the bottom conductive portion; and

a protection layer covering the active surface of the semiconductor die, and a top surface of the top conductive portion.
The surface mounted device of claim 21, wherein a thermal conductivity coefficient of the heating dissipating substrate is greater than a thermal conductivity coefficient of the semiconductor die.
The surface mounted device of claim 21, wherein the top conductive portion of the conductive structure further comprises two top conductive sub-portions, and profiles of the two top conductive sub-portions are asymmetrical with respect to the heat dissipating substrate.
The surface mounted device of claim 23, further comprising a bonding layer disposed between the top conductive portion of the conductive structure and the semiconductor die, wherein the two top conductive sub-portions are bonded to the active surface of the semiconductor die through the bonding layer.
The surface mounted device of claim 21, wherein the bottom conductive portion of the conductive structure further comprises two bottom conductive sub-portions, wherein profiles of the two bottom conductive sub-portions are symmetrical with respect to the heat dissipating substrate.