WO2023274244A1 - 按键模组及电子设备 - Google Patents

按键模组及电子设备 Download PDF

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Publication number
WO2023274244A1
WO2023274244A1 PCT/CN2022/101999 CN2022101999W WO2023274244A1 WO 2023274244 A1 WO2023274244 A1 WO 2023274244A1 CN 2022101999 W CN2022101999 W CN 2022101999W WO 2023274244 A1 WO2023274244 A1 WO 2023274244A1
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WIPO (PCT)
Prior art keywords
reinforcement
circuit board
reinforcing piece
reinforcing
pressure
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PCT/CN2022/101999
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English (en)
French (fr)
Inventor
王强
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication of WO2023274244A1 publication Critical patent/WO2023274244A1/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/14—Operating parts, e.g. push-button

Definitions

  • the present application belongs to the field of button technology, and in particular relates to a button module and electronic equipment.
  • Electronic equipment has become one of the indispensable electronic products in people's daily life. It not only plays an important role in daily communication, but also meets people's increasing entertainment needs. For example, the user can perform touch operations on the display screen of the electronic device, so as to complete various actions during the game.
  • a button module can be arranged under the display screen, and the button module can include a circuit board, a pressure-sensitive layer, a first reinforcing part and a second reinforcing part, and the pressure-sensitive layer is arranged on the circuit board. Both the first reinforcement and the second reinforcement are arranged on the side of the circuit board away from the pressure-sensitive layer, so as to improve the structural strength of the button module.
  • first reinforcing piece and the second reinforcing piece are arranged separately, and there is a gap between them, and the pressure-sensitive layer is arranged corresponding to the gap, so that the pressure-sensitive layer has enough space for deformation.
  • the supporting effect of the two on the circuit board and the pressure-sensitive layer becomes poor, which causes the circuit board and the pressure-sensitive layer to be easily damaged due to circuit board reflexion and key presses. Cracks appear during the assembly, testing, and transfer of the module, which in turn leads to a decrease in the reliability of the button module.
  • the purpose of the embodiments of the present application is to provide a button module and electronic equipment, which can solve the problem of poor reliability of the button module.
  • a button module which includes:
  • the pressure-sensing layer is arranged on the circuit board, and the pressure-sensing layer is electrically connected to the circuit board;
  • the first reinforcing piece and the second reinforcing piece, both of the first reinforcing piece and the second reinforcing piece are arranged on the side of the circuit board away from the pressure-sensitive layer, and the first reinforcing piece There is an accommodation cavity between the member and the second reinforcing element, and in a direction perpendicular to the circuit board, the orthographic projection of the accommodation cavity at least partially coincides with the orthographic projection of the pressure-sensitive layer;
  • a third reinforcement one end of the third reinforcement is connected to the first reinforcement, the other end of the third reinforcement is connected to the second reinforcement, and the third reinforcement
  • the reinforcement is located in the accommodation cavity, the stiffness of the third reinforcement is less than that of the first reinforcement, and the stiffness of the third reinforcement is less than that of the second reinforcement; And/or, there is a gap between the third reinforcing piece and the circuit board.
  • an embodiment of the present application provides an electronic device, which includes the above-mentioned button module.
  • the embodiment of the present application adds a third reinforcing piece, the first reinforcing piece and the second reinforcing piece are connected through the third reinforcing piece, the stiffness of the third reinforcing piece is smaller than that of the first reinforcing piece, and the third reinforcing piece
  • the stiffness of the reinforcement is smaller than that of the second reinforcement, and/or there is a gap between the third reinforcement and the circuit board, so that the third reinforcement does not affect the deformation of the pressure-sensitive layer, while the first reinforcement
  • the structure formed by the reinforcement, the second reinforcement and the third reinforcement has a higher structural strength, thereby providing better support for the circuit board and the pressure-sensitive layer, so that the circuit board and the pressure-sensitive layer are not easy to be damaged by Cracks appear due to reflexion of the circuit board and assembly, testing, and transfer of the button module, thereby improving the reliability of the button module.
  • FIG. 1 is a schematic diagram of a partial structure of a button module disclosed in the first embodiment of the present application
  • Fig. 2 is a cross-sectional view of the button module disclosed in the first embodiment of the present application
  • FIG. 3 is a schematic diagram of a partial structure of the button module disclosed in the second embodiment of the present application.
  • FIG. 5 is a schematic diagram of a partial structure of the button module disclosed in the third embodiment of the present application.
  • FIG. 6 is a cross-sectional view of the button module disclosed in the third embodiment of the present application.
  • FIG. 7 is a schematic diagram of a partial structure of the button module disclosed in the fourth embodiment of the present application.
  • FIG. 8 is a cross-sectional view of the button module disclosed in the fourth embodiment of the present application.
  • 110-circuit board 120-pressure sensitive layer, 130-first reinforcement, 140-second reinforcement, 150-third reinforcement, 160-pad, 170-silver paste layer, 180-insulation protection layer, 190-adhesive layer, 101-accommodating cavity, 102-groove, 210-display screen.
  • the embodiment of the present application discloses a button module, and the button module can be a button under the display screen 210, or a game button, a volume button, etc. on the side of the electronic device.
  • the button module may include a circuit board 110 , a pressure-sensitive layer 120 , a first reinforcement 130 , a second reinforcement 140 and a third reinforcement 150 .
  • the circuit board 110 can be connected with the main board or the sub-board of the electronic equipment, so as to realize the data connection between the key module and the main board or the sub-board.
  • the circuit board 110 may be a flexible circuit board, so that the key module is deformed when the user applies pressure to the display screen 210 .
  • the pressure-sensitive layer 120 can sense the magnitude of the pressing force applied by the user. When the user applies a pressing force to the display screen 210, the pressure-sensitive layer 120 can be deformed, and the magnitude of the pressing force can be obtained by detecting the amount of deformation.
  • the pressure-sensing layer 120 is disposed on the circuit board 110 , and the pressure-sensing layer 120 is electrically connected to the circuit board 110 , so as to realize the data connection between the pressure-sensing layer 120 and the circuit board 110 .
  • the pressure-sensitive layer 120 may be pressure-sensitive glue, which can be directly bonded to the circuit board 110 .
  • a pad 160 may be provided on the circuit board 110 , and the pressure-sensing layer 120 may be connected to the pad 160 through the silver paste layer 170 , so as to realize the electrical connection between the pressure-sensing layer 120 and the circuit board 110 .
  • the button module can also include an insulating protective layer 180 and an adhesive layer 190.
  • the insulating protective layer 180 is arranged on the circuit board 110 and covers the pressure-sensitive layer 120, the pad 160 and the silver paste layer 170, thereby protecting the pressure-sensitive layer 120, solder
  • the disk 160 and the silver paste layer 170 ; the adhesive layer 190 are respectively bonded to the display screen 210 and the circuit board 110 , and the adhesive layer 190 covers the insulating protection layer 180 , so as to realize the connection between the button module and the display screen 210 .
  • the first reinforcement 130 , the second reinforcement 140 and the third reinforcement 150 are all arranged on the side of the circuit board 110 away from the pressure-sensitive layer 120 , between the first reinforcement 130 and the second reinforcement 140 There is an accommodating cavity 101 , that is to say, the first reinforcing piece 130 and the second reinforcing piece 140 are not directly connected.
  • the orthographic projection of the accommodating cavity 101 and the orthographic projection of the pressure-sensitive layer 120 at least partially coincide, that is, the accommodating cavity 101 and the pressure-sensitive layer 120 are arranged correspondingly, so that when the user presses the display screen 210, the pressure-sensitive Layer 120 can undergo relatively large deformations.
  • both the first reinforcing piece 130 and the second reinforcing piece 140 can be metal pieces, and both can be in direct contact with the circuit board 110 , so as to provide greater supporting force for the circuit board 110 .
  • the third reinforcing member 150 is connected to the first reinforcing member 130, and the other end of the third reinforcing member 150 is connected to the second reinforcing member 140.
  • the third reinforcing member 150 is located in the accommodation cavity 101, that is, the third The reinforcing member 150 is disposed corresponding to the pressure-sensitive layer 120 .
  • the stiffness of the third reinforcing piece 150 is smaller than that of the first reinforcing piece 130, and the stiffness of the third reinforcing piece 150 is smaller than that of the second reinforcing piece 140, so that the third reinforcing piece 150 is more easily deformation; and/or, there is a gap between the third reinforcing member and the circuit board 110 , so that a space for deformation of the pressure-sensitive layer 120 is reserved between the third reinforcing member 150 and the circuit board 110 .
  • the supporting force of the third reinforcing member 150 on the circuit board 110 is smaller than that of the first reinforcing member 130 on the circuit board 110, and the supporting force of the third reinforcing member 150 on the circuit board 110 is smaller than that of the second reinforcing member.
  • 140 supports the circuit board 110, in other words, the supporting effect brought by the third reinforcing piece 150 is worse than that of the first reinforcing piece 130 and the second reinforcing piece 140, so that the third reinforcing piece 150 does not limit Deformation of the pressure sensitive layer 120 .
  • the third reinforcing member 150 may be in contact with the circuit board 110, but its direct supporting force on the circuit board 110 is smaller than that of the first reinforcing member 130 and the second reinforcing member 140 on the circuit board 110.
  • the third reinforcing member 150 is not in contact with the circuit board 110, and at this moment, the direct supporting force of the third reinforcing member 150 on the circuit board 110 is basically 0, which is less than The direct supporting force of the first reinforcing piece 130 and the second reinforcing piece 140 on the circuit board 110 .
  • the circuit board 110, the pressure-sensing layer 120 and the insulating protection layer 180 can only be set in one group, but in order to improve the induction effect, the circuit board 110, the pressure-sensing layer 120 and the insulating protection layer 180 can be set in two groups, The two groups of circuit boards 110, pressure sensitive layer 120 and insulating protection layer 180 are respectively located on both sides of the first reinforcement 130, the second reinforcement 140 and the third reinforcement 150, wherein one group of circuit boards 110 is bonded to Bonding layer 190 is bonded. It should be noted that the number of the first reinforcing piece 130, the second reinforcing piece 140 and the third reinforcing piece 150 may be one, or at least two. The first reinforcing piece 130 and the second reinforcing piece 140 can be alternately set.
  • the embodiment of the present application adds a third reinforcing piece 150, the first reinforcing piece 130 and the second reinforcing piece 140 are connected through the third reinforcing piece 150, and the stiffness of the third reinforcing piece 150 is smaller than that of the first reinforcing piece 130 , and the stiffness of the third reinforcing piece 150 is less than that of the second reinforcing piece 140, and/or, there is a gap between the third reinforcing piece 150 and the circuit board 110, so that the third reinforcing piece 150 does not affect the deformation of the pressure-sensitive layer 120, and at the same time, the structure jointly formed by the first reinforcing member 130, the second reinforcing member 140 and the third reinforcing member 150 has a higher structural strength, so that the circuit board 110 and the pressure-sensitive layer 120 Better support is provided, so that the circuit board 110 and the pressure-sensitive layer 120 are not prone to cracks due to reflexion of the circuit board 110 and operations such as assembly, testing, and transfer of the
  • the end of the first reinforcing piece 130 facing the second reinforcing piece 140 and the end of the second reinforcing piece 140 facing the first reinforcing piece 130 both have a right-angled side, and the right-angled side is in contact with the circuit board 110.
  • the button module is subjected to When an external force acts, the area where the circuit board 110 is in contact with the right-angled side is prone to stress concentration, which will easily cause cracks to occur on the circuit board 110 and the pressure-sensitive layer 120 , resulting in poor reliability of the key module.
  • the first reinforcing member 130 has a first supporting surface facing the circuit board 110
  • the second reinforcing member 140 has a second supporting surface facing the circuit board 110
  • the third reinforcing member 150 has a supporting surface facing the circuit board 110 .
  • the third supporting surface of the plate 110, the first supporting surface, the second supporting surface and the third supporting surface are in the same plane.
  • the right-angled side of the first reinforcing piece 130 towards the second reinforcing piece 140 and the right-angled side of the second reinforcing piece 140 facing the first reinforcing piece 130 are reinforced by the third reinforcement.
  • the component 150 is complemented, so the right-angled edge basically does not have adverse effects on the circuit board 110 and the pressure-sensitive layer 120, thereby further improving the reliability of the button module.
  • the side of the first reinforcement 130 facing the second reinforcement 140 includes a connected first region and a second region, and the side of the second reinforcement 140 facing the first reinforcement 130 It includes a connected third area and a fourth area, the first area is connected to the third area through the third reinforcing member 150, and there is a gap between the second area and the fourth area. That is to say, the accommodating cavity 101 between the first reinforcing piece 130 and the second reinforcing piece 140 can be partially provided with the third reinforcing piece 150, and the rest of the space forms a gap. 150 plays a reinforcing role.
  • a larger deformation space can be reserved for the pressure-sensing layer 120 through the formed gap, so as to better balance the deformation requirements of the pressure-sensing layer 120 and the pressure-sensing layer 120. Reinforcement needs.
  • the third reinforcing piece 150 may be a sheet metal piece, that is, the thickness of the third reinforcing piece 150 is relatively thin, so that the third reinforcing piece 150 can be deformed after being stressed, so when the button module is deformed , the third reinforcing member 150 deforms accordingly, so that the third reinforcing member 150 is not easy to limit the deformation of the pressure-sensitive layer 120 , so that the pressure-sensitive layer 120 can sense the magnitude of the pressing force more accurately.
  • the width of the sheet metal piece can also be set smaller, so as to further improve the deformation capability of the third reinforcing piece 150 .
  • the manufacturing material of the above-mentioned third reinforcing member 150 can be the same as that of the first reinforcing member 130 and the second reinforcing member 140.
  • metal powder injection molding Metal-powder Injection Molding, MIM
  • MIM Metal-powder Injection Molding
  • other processes may also be used to process the third reinforcing member 150, which is not limited in this embodiment of the present application.
  • the number of the third reinforcing piece 150 can be one, or at least two. In order to improve the reinforcing effect of the third reinforcing piece 150, the number of the third reinforcing piece 150 can be set to at least two, each The three reinforcements 150 are arranged at intervals, and the intervals between the third reinforcements 150 can provide a larger space for the deformation of the pressure-sensing layer 120 , thereby ensuring the sensing accuracy of the pressure-sensing layer 120 . Further, the third reinforcing piece 150 may be a bar-shaped piece, and the arrangement direction of each third reinforcing piece 150 may be perpendicular to the extension direction of the third reinforcing piece 150, so as to facilitate the assembly of the button module.
  • the third reinforcing piece 150 can be set as a rigid piece, and can also be set as a flexible piece. Optionally, as shown in FIGS. Filling at least a part of the receiving cavity 101 , the third reinforcing member 150 can be deformed when the pressure-sensitive layer 120 is under pressure. That is, the third reinforcing piece 150 can be made of flexible materials such as rubber, and optionally, the third reinforcing piece 150 can be connected with the first reinforcing piece 130 and the second reinforcing piece 140 through integral injection molding.
  • the flexible material here has strong fluidity and high viscosity in a molten state, has good stress transferability after solidification, and has a good bonding effect with the first reinforcing member 130 and the second reinforcing member 140 .
  • the flexible reinforcement not only has a certain supporting effect, but also can deform when the user presses the display screen 210 , so that the pressure-sensitive layer 120 can deform along with the display screen 210 .
  • the parameters of the flexible reinforcing part are easier to control, so that the structure of the third reinforcing part 150 can be designed more conveniently according to the actual situation, so as to better balance the pressure sensitivity
  • the deformation requirements of the layer 120 and the reinforcement requirements of the circuit board 110 and the pressure-sensitive layer 120 are easier to control, so that the structure of the third reinforcing part 150 can be designed more conveniently according to the actual situation, so as to better balance the pressure sensitivity.
  • the third reinforcing piece 150 when the third reinforcing piece 150 is a flexible reinforcing piece, the third reinforcing piece 150 may be recessed relative to the first reinforcing piece 130 and the second reinforcing piece 140. In other embodiments, the third reinforcing piece The outer surface of the reinforcing member 150 is flush with the outer surface of the first reinforcing member 130 , and the outer surface of the third reinforcing member 150 is flush with the outer surface of the second reinforcing member 140 .
  • the shape of the first reinforcing piece 130 and the second reinforcing piece 140 is the same as that of the third reinforcing piece 150, and the external dimensions of the first reinforcing piece 130 and the second reinforcing piece 140 are It is equal to the external dimensions of the third reinforcing piece 150.
  • this design can make the third reinforcing piece 150 fill up the accommodation cavity 101 between the first reinforcing piece 130 and the second reinforcing piece 140, thereby preventing the accommodating Stress concentration occurs at the cavity 101, which finally achieves the effect of improving the reliability of the button module; on the other hand, the structural parameters of the first reinforcement 130, the second reinforcement 140 and the third reinforcement 150 are more consistent, So as to facilitate the processing of the three.
  • the above-mentioned third reinforcing member 150 can be set as a solid member, so as to improve its supporting effect; the third reinforcing member 150 can also be set as a hollow member, so as to make it easier to deform, so as to facilitate the pressure-sensitive layer 120 to sense .
  • the first reinforcement 130, the second reinforcement 140 and the third reinforcement 150 together form a groove 102, and the opening side of the groove 102 faces the circuit board.
  • the groove 102 here can provide space for the deformation of the pressure-sensitive layer 120 , so that the pressure-sensitive layer 120 can accurately sense the magnitude of the pressing force.
  • the groove 102 can be formed by chemical etching, computerized numerical control (Computerized Numerical Control, CNC) processing, etc., and the parameters such as the width and depth of the groove 102 can be selected according to actual needs, which is not limited in the embodiment of the present application .
  • the side of the first reinforcement 130 away from the circuit board 110 , the side of the second reinforcement 140 away from the circuit board 110 , and the side of the third reinforcement 150 away from the circuit board 110 are flush, That is, the third reinforcing member 150 is connected to the side of the first reinforcing member 130 and the second reinforcing member 140 away from the circuit board 110.
  • This arrangement makes the space in the groove 102 larger, thus making it easier for the pressure-sensitive layer to 120 deformations.
  • grooves 102 are formed on opposite sides of the third reinforcing piece 150, that is, the third reinforcing piece 150 is connected to the first reinforcing piece 130 and the second reinforcing piece 140. In the middle area, this arrangement makes the third reinforcing member 150 closer to the circuit board 110 , so as to better support the circuit board 110 and the pressure-sensing layer 120 .
  • the embodiment of the present application also discloses an electronic device, which includes the button module described in any of the above embodiments.
  • the electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles and other electronic devices, and the embodiments of the present application do not specifically limit the types of electronic devices.

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Abstract

本申请公开了一种按键模组及电子设备，按键模组包括：电路板；感压层，感压层设置于电路板，且感压层与电路板电连接；第一补强件和第二补强件，第一补强件和第二补强件均设置于电路板背离感压层的一侧，第一补强件和第二补强件之间具有容纳腔，在垂直于电路板的方向上，容纳腔的正投影与感压层的正投影至少部分重合；第三补强件，第三补强件的一端与第一补强件相连，第三补强件的另一端与第二补强件相连，第三补强件位于容纳腔内，第三补强件的刚度小于第一补强件的刚度，且第三补强件的刚度小于第二补强件的刚度；和/或，所述第三补强件与所述电路板之间具有间隙。

Description

按键模组及电子设备
交叉引用
本发明要求在2021年07月02日提交中国专利局、申请号为202110751135.1、发明名称为“按键模组及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于按键技术领域，具体涉及一种按键模组及电子设备。
背景技术
电子设备已经成为人们日常生活中不可或缺的电子产品之一，其不仅担负着日常通信联络的重要功能，还可以满足人们日渐增加的娱乐需求。例如，用户可以在电子设备的显示屏上实施触控操作，从而完成游戏过程中的各种动作。
目前的电子设备中，显示屏的下方可以设置按键模组，该按键模组可包括电路板、感压层、第一补强件和第二补强件，感压层设置于电路板上，第一补强件和第二补强件均设置于电路板背离感压层的一侧，从而起到提升按键模组的结构强度这一目的。
上述第一补强件和第二补强件分体设置，且两者之间具有间隙，感压层对应该间隙设置，从而使得感压层具有足够的变形空间。但是，第一补强件和第二补强件之间预留间隙后，两者对电路板及感压层的支撑效果变差，导致电路板及感压层容易因电路板反折以及按键模组的装配、测试和转运等操作而出现裂纹，进而导致按键模组的可靠性下降。
发明内容
本申请实施例的目的是提供一种按键模组及电子设备，能够解决按键模组的可靠性较差的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种按键模组，其包括：
电路板；
感压层，所述感压层设置于所述电路板，且所述感压层与所述电路板电连接；
第一补强件和第二补强件，所述第一补强件和所述第二补强件均设置于所述电路板背离所述感压层的一侧，所述第一补强件和所述第二补强件之间具有容纳腔，在垂直于所述电路板的方向上，所述容纳腔的正投影与所述感压层的正投影至少部分重合；
第三补强件，所述第三补强件的一端与所述第一补强件相连，所述第三补强件的另一端与所述第二补强件相连，所述第三补强件位于所述容纳腔内，所述第三补强件的刚度小于所述第一补强件的刚度，且所述第三补强件的刚度小于所述第二补强件的刚度；和/或，所述第三补强件与所述电路板之间具有间隙。
第二方面，本申请实施例提供了一种电子设备，其包括上述按键模组。
本申请实施例增加了第三补强件，第一补强件和第二补强件通过第三补强件相连，第三补强件的刚度小于第一补强件的刚度，且第三补强件的刚度小于第二补强件的刚度，和/或，第三补强件与电路板之间具有间隙，从而使得第三补强件不影响感压层的变形，同时第一补强件、第二补强件和第三补强件共同形成的结构具有更高的结构强度，从而为电路板及感压层提供更好的支撑作用，使得电路板及感压层不容易因电路板反折以及按键模组的装配、测试和转运等操作而出现裂纹，进而提升按键模组的可靠性。
附图说明
图1为本申请第一实施例公开的按键模组的部分结构的示意图；
图2为本申请第一实施例公开的按键模组的剖视图；
图3为本申请第二实施例公开的按键模组的部分结构的示意图；
图4为本申请第二实施例公开的按键模组的剖视图；
图5为本申请第三实施例公开的按键模组的部分结构的示意图；
图6为本申请第三实施例公开的按键模组的剖视图；
图7为本申请第四实施例公开的按键模组的部分结构的示意图；
图8为本申请第四实施例公开的按键模组的剖视图。
附图标记说明：
110-电路板、120-感压层、130-第一补强件、140-第二补强件、150-第三补强件、160-焊盘、170-银浆层、180-绝缘保护层、190-粘接层、101-容纳腔、102-凹槽、210-显示屏。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的按键模组及电子设备进行详细地说明。
参考图1至图2，本申请实施例公开一种按键模组，该按键模组可以是 显示屏210下方的按键，也可以是电子设备侧面的游戏按键、音量键等。按键模组可包括电路板110、感压层120、第一补强件130、第二补强件140和第三补强件150。
电路板110可与电子设备的主板或者副板相连，从而实现按键模组与主板或副板之间的数据连接。可选地，电路板110可以为柔性电路板，以便于按键模组在用户向显示屏210施加按压力的情况下发生变形。感压层120可以感应用户施加的按压力的大小，当用户向显示屏210施加按压力时，感压层120可以发生变形，通过对形变量的检测可以得到按压力的大小。感压层120设置于电路板110，且感压层120与电路板110电连接，从而实现感压层120与电路板110之间的数据连接。可选地，感压层120可以为感压胶，其可直接与电路板110粘接。此外，电路板110上可以设置焊盘160，感压层120可通过银浆层170与焊盘160相连，从而实现感压层120与电路板110之间的电连接。按键模组还可以包括绝缘保护层180和粘接层190，绝缘保护层180设置于电路板110，且覆盖感压层120、焊盘160和银浆层170，从而保护感压层120、焊盘160和银浆层170；粘接层190分别与显示屏210和电路板110粘接，且粘接层190覆盖绝缘保护层180，从而实现按键模组与显示屏210的连接。
第一补强件130、第二补强件140和第三补强件150均设置于电路板110背离感压层120的一侧，第一补强件130和第二补强件140之间具有容纳腔101，也就是说，第一补强件130和第二补强件140并不直接连接。在垂直于电路板110的方向上，容纳腔101的正投影与感压层120的正投影至少部分重合，即容纳腔101与感压层120对应设置，使得用户按压显示屏210时，感压层120可以发生较大的变形。可选地，第一补强件130和第二补强件140均可以采用金属件，两者可与电路板110直接接触，从而为电路板110提供较大的支撑力。
第三补强件150的一端与第一补强件130相连，第三补强件150的另一 端与第二补强件140相连，第三补强件150位于容纳腔101内，即第三补强件150与感压层120对应设置。第三补强件150的刚度小于第一补强件130的刚度，且第三补强件150的刚度小于第二补强件140的刚度，从而使得第三补强件150受力后更容易发生变形；和/或，第三补强件与电路板110之间具有间隙，从而在第三补强件150与电路板110之间预留供感压层120变形的空间。因此，第三补强件150对电路板110的支撑力小于第一补强件130对电路板110的支撑力，且第三补强件150对电路板110的支撑力小于第二补强件140对电路板110的支撑力，换言之，第三补强件150所带来的支撑效果比第一补强件130和第二补强件140差一些，从而使得第三补强件150不限制感压层120的变形。一种可选的实施例中，第三补强件150可以与电路板110接触，但是其对电路板110的直接支撑力小于第一补强件130和第二补强件140对电路板110的直接支撑力；另一种可选的实施例中，第三补强件150与电路板110不接触，此时第三补强件150对电路板110的直接支撑力基本为0，进而小于第一补强件130和第二补强件140对电路板110的直接支撑力。
此外，上述电路板110、感压层120和绝缘保护层180均可以仅设置一组，但是为了提升感应效果，可以将电路板110、感压层120和绝缘保护层180均设置为两组，该两组电路板110、感压层120和绝缘保护层180分别位于第一补强件130、第二补强件140和第三补强件150的两侧，其中一组电路板110与粘接层190粘接。需要说明的是，第一补强件130、第二补强件140和第三补强件150的数量可以为一个，也可以为至少两个，第一补强件130和第二补强件140可以交替设置。
本申请实施例增加了第三补强件150，第一补强件130和第二补强件140通过第三补强件150相连，第三补强件150的刚度小于第一补强件130的刚度，且第三补强件150的刚度小于第二补强件140的刚度，和/或，第三补强件150与电路板110之间具有间隙，从而使得第三补强件150不影响感压层 120的变形，同时第一补强件130、第二补强件140和第三补强件150共同形成的结构具有更高的结构强度，从而为电路板110及感压层120提供更好的支撑作用，使得电路板110及感压层120不容易因电路板110反折以及按键模组的装配、测试和转运等操作而出现裂纹，进而提升按键模组的可靠性。此外，第三补强件150将第一补强件130和第二补强件140连接为一个整体，从而可以减少按键模组的工艺步骤，进而降低按键模组的加工成本。
第一补强件130朝向第二补强件140的一端以及第二补强件140朝向第一补强件130的一端均具有直角边，该直角边与电路板110接触，当按键模组受到外力作用时，电路板110与该直角边接触的区域容易出现应力集中现象，从而导致电路板110及感压层120容易出现裂纹，导致按键模组的可靠性变差。基于此，可选地，第一补强件130具有朝向电路板110的第一支撑面，第二补强件140具有朝向电路板110的第二支撑面，第三补强件150具有朝向电路板110的第三支撑面，第一支撑面、第二支撑面和第三支撑面平齐。如此设置后，第一补强件130朝向第二补强件140的一端所具有的直角边以及第二补强件140朝向第一补强件130的一端所具有的直角边被第三补强件150补齐，因此该直角边基本不会对电路板110和感压层120产生不良影响，从而进一步提升按键模组的可靠性。
一种可选的实施例中，第一补强件130朝向第二补强件140的一面包括相连的第一区域和第二区域，第二补强件140朝向第一补强件130的一面包括相连的第三区域和第四区域，第一区域通过第三补强件150与第三区域相连，第二区域与第四区域之间具有间隙。也就是说，第一补强件130和第二补强件140之间的容纳腔101可以局部设置第三补强件150，其余空间则形成间隙，如此设置一方面可以使第三补强件150发挥补强作用，另一方面可以通过所形成的间隙给感压层120预留更大的变形空间，从而更好地平衡感压层120的变形需求以及电路板110和感压层120的补强需求。
进一步地，第三补强件150可以为片状金属件，即第三补强件150的厚 度较薄，使得第三补强件150受力后可以发生变形，因此当按键模组发生变形时，第三补强件150随之发生变形，从而使得第三补强件150不容易限制感压层120的变形，以便于感压层120更精确地感应按压力的大小。此外，该片状金属件的宽度也可以设置得较小，从而进一步提升第三补强件150的变形能力。
上述第三补强件150的制造材料可以与第一补强件130和第二补强件140的制造材料相同，为了便于加工按键模组，可以通过金属粉末注射成型(Metal–powder Injection Molding，MIM)工艺制备第三补强件150。当然，也可以采用其他工艺加工第三补强件150，本申请实施例对此不作限制。
第三补强件150的数量可以为一个，也可以为至少两个，为了提升第三补强件150的补强效果，可以将第三补强件150的数量设置为至少两个，各第三补强件150间隔设置，各第三补强件150之间的间隔可以为感压层120的变形提供较大的空间，从而保证感压层120的感应精度。进一步地，第三补强件150可以为条形件，各第三补强件150的排列方向可以垂直于第三补强件150的延伸方向，从而便于装配按键模组。
第三补强件150可以设置为刚性件，也可以设置为柔性件，可选地，如图3至图6所示，第三补强件150为柔性补强件，第三补强件150填充容纳腔101的至少一部分，在感压层120受压的情况下，第三补强件150可变形。即，第三补强件150可以采用橡胶等柔性材料制成，可选地，可以通过一体注塑的方式将第三补强件150与第一补强件130和第二补强件140相连。这里的柔性材料在熔融状态下流动性强且粘性高，固化后的应力传递性好，与第一补强件130和第二补强件140的结合效果好。柔性补强件既具有一定的支撑效果，又可以在用户按压显示屏210时发生变形，从而使得感压层120可以随显示屏210发生变形。相对于容纳腔101内局部设置刚性件的方案，这里的柔性补强件的参数更容易控制，从而可以更方便地根据实际情况设计第三补强件150的结构，从而更好地平衡感压层120的变形需求以及电路板 110和感压层120的补强需求。
可选地，当第三补强件150为柔性补强件时，第三补强件150可以相对于第一补强件130和第二补强件140凹陷，其他实施例中，第三补强件150的外表面与第一补强件130的外表面平齐，且第三补强件150的外表面与第二补强件140的外表面平齐。换言之，从外观上看，第一补强件130和第二补强件140的形状与第三补强件150的形状相同，且第一补强件130和第二补强件140的外形尺寸与第三补强件150的外形尺寸相等，这样设计一方面可以使第三补强件150填满第一补强件130和第二补强件140之间的容纳腔101，从而防止该容纳腔101处出现应力集中现象，最终达到提升按键模组的可靠性的效果；另一方面，第一补强件130、第二补强件140和第三补强件150的结构参数更加一致，从而便于加工三者。
进一步地，上述第三补强件150可以设置成实心件，从而改善其支撑效果；第三补强件150也可以设置成空心件，从而使其更容易变形，以利于感压层120进行感应。
可选地，如图5至图8所示，第一补强件130、第二补强件140和第三补强件150共同围成凹槽102，该凹槽102的开口侧朝向电路板110，这里的凹槽102可以为感压层120的变形提供空间，以便于感压层120精确地感应按压力的大小。可选地，可以通过化学蚀刻、计算机数控(Computerized Numerical Control，CNC)加工等方式形成凹槽102，该凹槽102的宽度、深度等参数可以根据实际需求选择，本申请实施例对此不作限制。
一种可选的实施例中，第一补强件130背离电路板110的一面、第二补强件140背离电路板110的一面以及第三补强件150背离电路板110的一面平齐，即第三补强件150连接于第一补强件130和第二补强件140远离电路板110的一侧，此种设置方式使得凹槽102内的空间更大，从而更便于感压层120变形。另一种可选的实施例中，第三补强件150的相背两侧均形成凹槽102，即第三补强件150连接于第一补强件130和第二补强件140的中部 区域，此种设置方式使得第三补强件150更靠近电路板110，从而更好地支撑电路板110及感压层120。
本申请实施例还公开一种电子设备，其包括上述任意实施例所述的按键模组。本申请实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等电子设备，本申请实施例对电子设备的种类不作具体限制。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种按键模组，包括：
    电路板(110)；
    感压层(120)，所述感压层(120)设置于所述电路板(110)，且所述感压层(120)与所述电路板(110)电连接；
    第一补强件(130)和第二补强件(140)，所述第一补强件(130)和所述第二补强件(140)均设置于所述电路板(110)背离所述感压层(120)的一侧，所述第一补强件(130)和所述第二补强件(140)之间具有容纳腔(101)，在垂直于所述电路板(110)的方向上，所述容纳腔(101)的正投影与所述感压层(120)的正投影至少部分重合；
    第三补强件(150)，所述第三补强件(150)的一端与所述第一补强件(130)相连，所述第三补强件(150)的另一端与所述第二补强件(140)相连，所述第三补强件(150)位于所述容纳腔(101)内，所述第三补强件(150)的刚度小于所述第一补强件(130)的刚度，且所述第三补强件(150)的刚度小于所述第二补强件(140)的刚度；和/或，所述第三补强件(150)与所述电路板(110)之间具有间隙。
  2. 根据权利要求1所述的按键模组，其中，所述第一补强件(130)具有朝向所述电路板(110)的第一支撑面，所述第二补强件(140)具有朝向所述电路板(110)的第二支撑面，所述第三补强件(150)具有朝向所述电路板(110)的第三支撑面，所述第一支撑面、所述第二支撑面和所述第三支撑面平齐。
  3. 根据权利要求1所述的按键模组，其中，所述第一补强件(130)朝向所述第二补强件(140)的一面包括相连的第一区域和第二区域，所述第二补强件(140)朝向所述第一补强件(130)的一面包括相连的第三区域和第四区域，所述第一区域通过所述第三补强件(150)与所述第三区域相连，所述第二区域与所述第四区域之间具有间隙。
  4. 根据权利要求3所述的按键模组，其中，所述第三补强件(150)为 片状金属件。
  5. 根据权利要求3所述的按键模组，其中，所述第三补强件(150)的数量为至少两个，各所述第三补强件(150)间隔设置。
  6. 根据权利要求1所述的按键模组，其中，所述第三补强件(150)为柔性补强件，所述第三补强件(150)填充所述容纳腔(101)的至少一部分，在所述感压层(120)受压的情况下，所述第三补强件(150)可变形。
  7. 根据权利要求6所述的按键模组，其中，所述第三补强件(150)的外表面与所述第一补强件(130)的外表面平齐，且所述第三补强件(150)的外表面与所述第二补强件(140)的外表面平齐。
  8. 根据权利要求1所述的按键模组，其中，所述第一补强件(130)、所述第二补强件(140)和所述第三补强件(150)共同围成凹槽(102)，所述凹槽(102)的开口侧朝向所述电路板(110)。
  9. 根据权利要求8所述的按键模组，其中，所述第一补强件(130)背离所述电路板(110)的一面、所述第二补强件(140)背离所述电路板(110)的一面以及所述第三补强件(150)背离所述电路板(110)的一面平齐；或者，
    所述第三补强件(150)的相背两侧均形成所述凹槽(102)。
  10. 一种电子设备，包括权利要求1至9中任一项所述的按键模组。
PCT/CN2022/101999 2021-07-02 2022-06-28 按键模组及电子设备 Ceased WO2023274244A1 (zh)

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CN107454738A (zh) * 2017-09-06 2017-12-08 广东欧珀移动通信有限公司 一种电子设备及其柔性电路板组件
CN212909477U (zh) * 2020-07-15 2021-04-06 Oppo广东移动通信有限公司 压感按键及电子设备
CN112217503A (zh) * 2020-09-24 2021-01-12 维沃移动通信有限公司 压力按键及电子设备
CN113555243A (zh) * 2021-07-02 2021-10-26 维沃移动通信有限公司 按键模组及电子设备

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