WO2023273198A1

WO2023273198A1 - Duplexer and packaging method therefor, and electronic device

Info

Publication number: WO2023273198A1
Application number: PCT/CN2021/138102
Authority: WO
Inventors: 陈景
Original assignee: 展讯通信（上海）有限公司
Priority date: 2021-06-30
Filing date: 2021-12-14
Publication date: 2023-01-05
Also published as: CN113422590A

Abstract

Embodiments of the present application provide a duplexer and a packaging method therefor, and an electronic device. The duplexer comprises a substrate and a piezoelectric chip, a transmit filter and a receive filter are disposed on a first surface of the piezoelectric chip, the transmit filter is connected in series between a transmit end and an antenna end, the receive filter is connected in series between a receive end and the antenna end, and the first surface of the piezoelectric chip covers a first surface of the substrate; the transmit filter comprises a first parallel branch and a first inductor, the first parallel branch is connected in series to the first inductor, and the first inductor is grounded; the first parallel branch is a first parallel branch close to the transmit end in the transmit filter, and a winding direction of the first inductor on the first surface is a counterclockwise direction. In the duplexer provided in the embodiments of the present application, a winding direction of an inductor connected to the ground in series with the first parallel branch close to the transmit end is a counterclockwise direction, such that deterioration of the degree of isolation of the duplexer can be avoided, and the degree of isolation of the duplexer in a receive frequency band is effectively guaranteed.

Description

Duplexer, packaging method thereof, and electronic equipment

This application claims the priority of the Chinese patent application with the application number 202110742707.X and the application name "duplexer and its packaging method, electronic equipment" submitted to the China Patent Office on June 30, 2021, the entire content of which is incorporated by reference incorporated in this application.

technical field

The embodiments of the present application relate to the technical field of mobile communications, and in particular to a duplexer, a packaging method thereof, and electronic equipment.

Background technique

In the mobile terminal, the duplexer uses the frequency difference between the transmitted signal and the received signal to filter the two signals, thereby realizing the separation of the transmitted signal and the received signal.

The existing duplexer is mainly composed of receiving filter and transmitting filter. In order to meet the insertion loss, isolation and out-of-band suppression indicators, the receiving filter and transmitting filter generally have several grounding inductances realized on the substrate. .

However, in the existing duplexer design process, due to the electromagnetic coupling between the grounding inductance and the surrounding circuits, the isolation of the duplexer may be insufficient, which affects the performance of the duplexer.

Contents of the invention

Embodiments of the present application provide a duplexer, a packaging method thereof, and an electronic device, which can solve the technical problem that the isolation of the existing duplexer may be insufficient.

In the first aspect, the embodiment of the present application provides a duplexer, including a substrate and a piezoelectric chip, a transmit filter and a receive filter are arranged on the first surface of the piezoelectric chip, and the transmit filter is connected in series with the transmit Between the end and the antenna end, the receiving filter is connected in series between the receiving end and the antenna end, and the first surface of the piezoelectric chip is upside down on the first surface of the substrate;

The transmit filter includes a first parallel branch and a first inductor, the first parallel branch is connected in series with the first inductor, and the first inductor is grounded;

Wherein, the first parallel branch is the first parallel branch close to the transmitting end in the transmitting filter, and the winding direction of the first inductor on the first surface is counterclockwise.

In a feasible implementation manner, the first inductor is a three-dimensional laminated inductor.

In a feasible implementation manner, the transmitting filter is a surface acoustic wave (Surface Acoustic Wave, SAW) filter or a bulk acoustic wave (bulk acoustic wave, BAW) filter.

In a feasible implementation manner, the first parallel branch includes at least one resonator.

In a feasible implementation manner, the transmitting end, the receiving end and the antenna end are all arranged on the first surface of the piezoelectric chip.

In a feasible implementation manner, the receiving filter is a SAW filter or a BAW filter.

In the second aspect, the embodiment of the present application provides a duplexer packaging method, including:

Provide substrates and piezoelectric chips;

A transmitting filter and a receiving filter are arranged on the first surface of the piezoelectric chip, the transmitting filter is connected in series between the transmitting end and the antenna end, and the receiving filter is connected in series between the receiving end and the antenna end;

buckling the first surface of the piezoelectric chip on the first surface of the substrate;

Wherein, the transmitting filter includes a first parallel branch and a first inductor, the first parallel branch is the first parallel branch close to the transmitting end in the transmitting filter; the first parallel branch A circuit is connected in series with the first inductor, the first inductor is grounded, and the winding direction of the first inductor on the first surface is counterclockwise.

In a feasible embodiment, it also includes:

The receiving end, the transmitting end and the antenna end are arranged on the first surface of the piezoelectric chip.

In a third aspect, an embodiment of the present application provides an electronic device, including a duplexer, where the duplexer is the duplexer provided in the first aspect.

The duplexer and its packaging method and electronic equipment provided in the embodiments of the present application, the duplexer includes a substrate and a piezoelectric chip, a transmitting filter and a receiving filter are arranged on the first surface of the piezoelectric chip, and the transmitting filter is connected in series Between the transmitting end and the antenna end, the receiving filter is connected in series between the receiving end and the antenna end, the first surface of the piezoelectric chip is buckled on the first surface of the substrate, and the first parallel branch close to the transmitting end The winding direction of the inductance connected in series to the ground is counterclockwise, thereby avoiding deterioration of the isolation of the duplexer and effectively ensuring the isolation of the duplexer in the receiving frequency band.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present application or the prior art. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic diagram of a pad of a duplexer provided in an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a duplexer provided in an embodiment of the present application;

FIG. 4 is a simplified schematic circuit diagram of a duplexer provided in an embodiment of the present application;

FIG. 5 is a schematic diagram of the top layer of a substrate of a duplexer provided in an embodiment of the present application;

FIG. 6 is a schematic diagram of an isolation performance simulation of a duplexer provided in an embodiment of the present application.

detailed description

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application. In addition, although the disclosures in this application are introduced as exemplary one or several examples, it should be understood that each aspect of these disclosures can also independently constitute a complete implementation.

It should be noted that the brief description of the terms in this application is only for the convenience of understanding the implementations described below, and is not intended to limit the implementations of this application. These terms are to be understood according to their ordinary and usual meaning unless otherwise stated.

The terms "first" and "second" in the description and claims of this application and the above drawings are used to distinguish similar or similar objects or entities, and do not necessarily mean limiting a specific order or sequence. Unless otherwise noted. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, for example, they can be implemented in a sequence other than those shown in the illustrations or descriptions of the embodiments of the present application.

Furthermore, the terms "comprising" and "having" and any variations thereof, are intended to cover but not exclusively include, for example, a product or device comprising a series of components need not be limited to those components explicitly listed, but may include other components not expressly listed or inherent in these products or equipment.

The duplexer is the main accessory of the different-frequency duplex radio and repeater. Its function is to isolate the transmitting and receiving signals, so as to ensure that both receiving and transmitting can work normally at the same time. It is composed of two sets of band-pass filters with different frequencies to prevent the transmission signal from the machine from being transmitted to the receiver.

An embodiment of the present application provides a duplexer, which can be applied to various types of electronic equipment. Exemplarily, the electronic equipment can be various types of computer system equipment that are mobile or portable and perform wireless communication any of the. Specifically, the electronic device can be a mobile phone or a smart phone (for example, based on iPhone TM, a phone based on Android TM), a portable game device (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices and such as watches, earphones, pendants, earphones, etc., electronic devices can also be other wearable devices (for example, such as electronic glasses, electronic clothes, e-bracelets, e-necklaces, e-tattoos, head-mounted devices (HMD) for electronic devices or smart watches).

In some cases, the aforementioned electronic devices can perform multiple functions (eg, play music, display video, store pictures, and receive and send phone calls). If desired, the electronic device may be a portable device such as a cellular telephone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.

As shown in FIG. 1, FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application. In some implementations, the electronic device 10 may include one or more of the following components: a processor component 102, a memory 104, A power component 106 , a multimedia component 108 , an audio component 110 , an input/output (I/O) interface 112 , and a communication component 116 .

Among other things, the processor component 102 generally controls the overall operations of the electronic device 10, such as those associated with display, phone calls, data communications, camera operations, and recording operations. Processor component 102 may include one or more processors to execute instructions. Additionally, processor component 102 may include one or more modules to facilitate interaction between the processor and other components. For example, processor component 102 may include a multimedia module to facilitate interaction between multimedia component 108 and processor component 102 .

The memory 104 is configured to store various types of data to support operations at the electronic device 10 . Examples of such data include instructions for any application or method operating on electronic device 10, contact data, phonebook data, messages, pictures, videos, and the like. The memory 104 can be implemented by any type of volatile or non-volatile storage device or their combination, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), Magnetic Memory, Flash Memory, Magnetic or Optical Disk.

The power supply component 106 provides power to various components of the electronic device 10 . Power supply components 106 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for electronic device 10 .

Multimedia component 108 includes a screen that provides an output interface between electronic device 10 and a user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may not only sense a boundary of a touch or swipe action, but also detect duration and pressure associated with the touch or swipe action. In some embodiments, the multimedia component 108 includes a front camera and/or a rear camera. When the electronic device 10 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capability.

The audio component 110 is configured to output and/or input audio signals. For example, the audio component 110 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 10 is in operation modes, such as call mode, recording mode and voice recognition mode. Received audio signals may be further stored in memory 104 or sent via communication component 116 .

In some embodiments, the audio component 110 also includes a speaker for outputting audio signals.

The I/O interface 112 provides an interface between the processor component 102 and a peripheral interface module, which may be a keyboard, a click wheel, a button, and the like. These buttons may include, but are not limited to: a home button, volume buttons, start button, and lock button.

The communication component 116 is configured to facilitate wired or wireless communication between the electronic device 10 and other devices. The electronic device 10 can access a wireless network based on communication standards, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 116 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 116 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra Wide Band (UWB) technology, Bluetooth (BT) technology and other technologies.

The communication component 116 may include analog and digital input-output interface circuits, and wireless communication circuits based on radio frequency signals and/or optical signals. Wireless communication circuitry in communication component 116 may include radio frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, duplexers, and antennas. For example, the communication component 116 may include a near field communication antenna and a near field communication transceiver, and may also include a cellular phone transceiver and antenna, a wireless local area network transceiver circuit and antenna, and the like.

The electronic device 10 may further include sensors. Sensors can include ambient light sensors, optical and capacitive based proximity sensors, touch sensors (e.g., optical based touch sensors and/or capacitive touch sensors, where the touch sensor can be part of the touch display or can be used as a touch sensor. The sensor structure is used independently), acceleration sensor, and other sensors, etc.

Electronic device 10 may also include one or more displays. The display may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, and displays using other display technologies.

Among them, the isolation of the duplexer refers to the stop-band attenuation of the two equivalent band-stop filters. Except for some specific occasions, the attenuation of the stop-band in the receiving channel and the transmitting channel of the general duplexer is also That is, the isolation between the receiving end and the transmitting end of the duplexer to the antenna end is equivalent.

Usually, based on the consideration of the attenuation of the transmitting end, it is to make the receiving frequency signal not generate intermodulation interference to the transmitter under the condition of strong receiving signal, and the general isolation can meet the requirements when it is above 60db. Based on the consideration of the attenuation of the receiving end, it is enough to prevent the RF power output from the transmitter to the antenna to the input end of the receiver to interfere with the normal operation of the receiver. Therefore, the receiving channel of the duplexer is one corresponding to the transmitting frequency of the whole machine. band stop filter. Among them, the transmitting power of the repeater is above 25W, and the receiving sensitivity is around 0.35UV. Take this as an example, that is to say, the level difference between the transmitting channel and receiving channel of the duplexer is about 145db, and the difference is even larger for a repeater with higher power and higher receiving sensitivity. In order not to affect the normal operation of the receiver due to the transmission power, it is necessary to attenuate the transmission power by a certain amount at the input end of the receiver. Generally speaking, except for a few special frequency points, the spurious immunity of the receiver is above 80db. It can be known from the above example that the attenuation of at least 145-80=65db at the frequency point corresponding to the transmission frequency in the receiving channel of the duplexer is required to basically meet the requirements.

In the duplexer design process, after the inductance value of the grounding inductor is determined in the circuit schematic simulation, the designer will combine the laminated structure of the substrate to draw and simulate the electromagnetic model of the inductor. When designing the electromagnetic model of the inductor, because the traditional design method does not limit the winding direction of the inductor, this leads to multiple implementations of the inductor with the same inductance value on the same substrate. Moreover, due to the electromagnetic coupling between the inductor and the surrounding circuits, if the winding direction of the inductor is not limited, the isolation of the duplexer may deteriorate. Especially for the transmit filter part, the ground inductance of the first parallel branch close to the transmit end may deteriorate the isolation of the receive frequency band, thereby affecting the performance of the duplexer.

In order to solve the above technical problems, an embodiment of the present application provides a duplexer. On the top layer of the duplexer substrate, the ground inductance of the first parallel branch close to the transmitting end of the transmit filter part is wound counterclockwise, It can effectively improve the isolation of the duplexer in the receiving frequency band.

Referring to FIG. 2 , FIG. 2 is a schematic diagram of a pad of a duplexer provided in an embodiment of the present application.

In some embodiments, the duplexer includes a substrate 200 and a piezoelectric chip, and the bottom surface of the substrate 200 is provided with an antenna terminal (Antenna hardware interface, referred to as ANT) pad, a transmitter (TX) pad, and a receiver (RX) pad. ) pad.

Wherein, taking FIG. 2 as an example, the antenna terminal (ANT) pad is located at the middle and upper part of the bottom surface of the substrate 200, the receiving terminal (RX) pad is located at the bottom left of the substrate 200 bottom surface, and the transmitting terminal (TX) pad is located at the bottom surface of the substrate 200. bottom right of the . The remaining positions are ground (GND) pads.

Wherein, the substrate 200 includes a bottom surface and a top surface, wherein, the bottom surface is the surface welded with the circuit board where the duplexer is located, and the top surface is provided with an antenna terminal (ANT)/transmitting terminal (TX)/ Receiver (RX) top pad connected by bump solder. That is, in the embodiment of the present application, the above-mentioned first surface of the substrate 200 may be understood as the top surface of the substrate 200 .

In some embodiments, the first surface of the piezoelectric chip is provided with a transmitting filter and a receiving filter, the first surface of the piezoelectric chip is turned upside down on the top surface of the substrate 200, and the transmitting filter is connected in series to the transmitting end ( TX) and the antenna end (ANT), and the receiving filter is connected in series between the receiving end (RX) and the antenna end (ANT).

In order to better understand the embodiment of the present application, refer to FIG. 3 , which is a schematic cross-sectional view of a duplexer provided in the embodiment of the present application.

In FIG. 3 , the substrate 200 includes a bottom surface 202 and a top surface 201 , the bottom surface 202 is soldered to the circuit board where the duplexer is located, and the piezoelectric chip 300 is buckled on the top surface 201 . Wherein, the surface of the piezoelectric chip 300 close to the top surface 201 is provided with a transmitting filter and/or a receiving filter.

Optionally, both the transmitting filter and the receiving filter may be ladder filters, and may include a series-parallel network composed of multiple acoustic resonators and multiple inductors.

In some embodiments, a matching network, such as an LC impedance matching network, may also be provided between the antenna end (ANT) and the transmitting filter, and between the antenna end (ANT) and the receiving filter.

Referring to FIG. 4 , FIG. 4 is a simplified schematic circuit diagram of a duplexer provided in an embodiment of the present application.

In some embodiments, the transmit filter is connected in series between the transmit end (TX) and the antenna end (ANT), and the receive filter is connected in series between the receive end (RX) and the antenna end (ANT).

Wherein, the transmit filter includes at least one parallel branch.

In the embodiment of the present application, the first parallel branch close to the transmitting end (TX) in the transmitting filter is connected in series with the first inductor L, and the first inductor L is grounded.

Wherein, the winding direction of the first inductor L on the first surface of the substrate 200 is counterclockwise.

Optionally, at least one resonator is included in the parallel branch.

In order to better understand the embodiment of the present application, refer to FIG. 5 , which is a schematic diagram of a top layer of a substrate of a duplexer provided in the embodiment of the present application.

Taking the LTE Band1 duplexer as an example, FIG. 5 shows the layout of the first inductor L described in this application on the first surface of the substrate 200. Wherein, the winding direction of the first inductor L on the first surface of the substrate is counterclockwise.

In a feasible implementation manner, the first inductor L may be a three-dimensional (3D) laminated inductor, and different layers thereof are connected through via holes.

In a feasible implementation manner, the transmitting filter may be a surface acoustic wave (Surface Acoustic Wave, SAW) filter or a bulk acoustic wave (bulk acoustic wave, BAW) filter.

In a feasible implementation manner, the receiving filter may also be a SAW filter or a BAW filter.

Based on the content described in the foregoing embodiments, refer to FIG. 6 , which is a schematic diagram of an isolation performance simulation of a duplexer provided in an embodiment of the present application.

In the embodiment of the present application, the LTE Band1 duplexer is also taken as an example, assuming that the transmitting frequency band is 1920MHz-1980MHz, and the receiving frequency band is 2110-2170MHz.

After the LTE Band1 duplexer adopts the structure provided in the embodiment of this application, when the transmitting frequency is 1.956GHz, the worst value m1 of the isolation in the transmitting frequency band is 67dB; when the receiving frequency is 2.17GHz, in the receiving frequency band The worst value m2 of the isolation degree is 61.1dB, which all meet the isolation requirement of the current radio frequency front-end system for the duplexer.

In the duplexer provided by the embodiment of the present application, the winding direction of the inductance connected in series with the first parallel branch close to the transmitting end to the ground is counterclockwise, thereby avoiding the deterioration of the isolation of the duplexer and effectively ensuring The isolation of the duplexer in the receiving frequency band.

Based on the content described in the above embodiments, a duplexer packaging method is also provided in the embodiments of the present application, and the method includes:

Step a, providing a substrate and a piezoelectric chip.

Step b, setting a transmitting filter and a receiving filter on the first surface of the piezoelectric chip, wherein the transmitting filter is connected in series between the transmitting end and the antenna end, and the receiving filter is connected in series between the receiving end and the antenna end;

Step c. Upside down the first surface of the piezoelectric chip to the first surface of the substrate.

Wherein, the transmitting filter includes a first parallel branch and a first inductor, and the first parallel branch is the first parallel branch close to the transmitting end in the transmitting filter. The first parallel branch is connected in series with the first inductor, the first inductor is grounded, and the winding direction of the first inductor on the first surface is counterclockwise.

In a feasible implementation manner, the foregoing transmit filter may be a SAW filter or a BAW filter.

In a feasible implementation manner, the above method also includes:

A receiving end, a transmitting end and an antenna end are arranged on the first surface of the piezoelectric chip.

In a feasible implementation manner, the above receiving filter may be a SAW filter or a BAW filter.

In the duplexer packaging method provided by the embodiment of the present application, the winding direction of the inductance to ground connected in series with the first parallel branch close to the transmitter in the duplexer is counterclockwise, thereby avoiding the isolation of the duplexer The degree deteriorates, and the isolation degree of the duplexer in the receiving frequency band is effectively guaranteed.

In the several embodiments provided in this application, it should be understood that the disclosed devices and methods may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the modules is only a logical function division. In actual implementation, there may be other division methods, for example, multiple modules can be combined or integrated. to another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or modules may be in electrical, mechanical or other forms.

The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional module in each embodiment of the present application may be integrated into one processing unit, each module may exist separately physically, or two or more modules may be integrated into one unit.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit it; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present application. scope.

Claims

A duplexer, characterized in that it includes a substrate and a piezoelectric chip, a transmitting filter and a receiving filter are arranged on the first surface of the piezoelectric chip, and the transmitting filter is connected in series between the transmitting terminal and the antenna terminal Between, the receiving filter is connected in series between the receiving end and the antenna end, and the first surface of the piezoelectric chip is upside down on the first surface of the substrate;

The transmit filter includes a first parallel branch and a first inductor, the first parallel branch is connected in series with the first inductor, and the first inductor is grounded;

Wherein, the first parallel branch is the first parallel branch close to the transmitting end in the transmitting filter, and the winding direction of the first inductor on the first surface is counterclockwise.
The duplexer according to claim 1, wherein the first inductor is a three-dimensional stacked inductor.
The duplexer according to claim 1, wherein the transmit filter is a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter.
The duplexer according to claim 1, wherein the receiving filter is a SAW filter or a BAW filter.
The duplexer according to claim 1, wherein at least one resonator is included in the first parallel branch.
The duplexer according to claim 1, wherein the transmitting end, the receiving end and the antenna end are all disposed on the first surface of the piezoelectric chip.
A duplexer packaging method, characterized in that, comprising:

Provide substrates and piezoelectric chips;

A transmitting filter and a receiving filter are arranged on the first surface of the piezoelectric chip, the transmitting filter is connected in series between the transmitting end and the antenna end, and the receiving filter is connected in series between the receiving end and the antenna end;

buckling the first surface of the piezoelectric chip on the first surface of the substrate;

Wherein, the transmitting filter includes a first parallel branch and a first inductor, the first parallel branch is the first parallel branch close to the transmitting end in the transmitting filter; the first parallel branch A circuit is connected in series with the first inductor, the first inductor is grounded, and the winding direction of the first inductor on the first surface is counterclockwise.
The method according to claim 7, wherein the first inductor is a three-dimensional laminated inductor.
The method according to claim 7, further comprising:

The receiving end, the transmitting end and the antenna end are arranged on the first surface of the piezoelectric chip.
An electronic device, characterized by comprising a duplexer, and the duplexer is the duplexer according to any one of claims 1 to 6.