WO2023272651A1

WO2023272651A1 - Chip heat dissipation structure and optical module

Info

Publication number: WO2023272651A1
Application number: PCT/CN2021/103825
Authority: WO
Inventors: 杨松; 徐鹏
Original assignee: 华为技术有限公司
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2023-01-05

Abstract

The present application provides a chip heat dissipation structure, comprising a frame portion, an elastic member, and a heat conduction block. The frame portion comprises a plurality of side plates, a region surrounded by the plurality of side plates is an accommodating cavity, each side plate is provided with, in a first direction, a first end and a second end opposite to each other, the first end is provided with a clamping member, and the clamping member is used for clamping a chip; the elastic member is connected to the second end of at least one side plate, and the elastic member is used for producing elastic deformation in the first direction; the heat conduction block is at least partially provided in the accommodating cavity, the surface of the heat conduction block facing the elastic member is used for heat transfer with a cooling member, the other surface of the heat conduction block is a bonding surface, and the bonding surface is used for elastic bonding with the chip under the action of the elastic member. The elastic member abuts against the cooling member, so that the bonding surface is elastically pressed to the chip, bonding between the bonding surface and the surface of the chip is facilitated, no gap between the chip and the bonding surface is achieved as far as possible, and thus the heat dissipation efficiency of the chip is increased. The present application further provides an optical module comprising the chip heat dissipation structure.

Description

Chip cooling structure and optical module

technical field

The present application relates to the field of heat dissipation structures, in particular to a chip heat dissipation structure and an optical module.

Background technique

In the field of communication, optical modules are widely used integrated modules for photoelectric conversion. An optical module usually consists of a light emitting device (TOSA, Transmitter Optical Subassembly, including a laser), an optical receiving device (ROSA, Receiver Optical Subassembly, including a photodetector), a functional circuit, and an optical (electrical) interface. During the working process of the optical module, the chip on the printed circuit board (PCB, Printed Circuit Board) will generate a lot of heat, and the processing chip has relatively strict temperature requirements. In order to ensure the normal operation of optical communication, the optical module needs to be The heat generated is dissipated in time.

With the rapid development of optical communication, the data carried by photoelectric modules is getting bigger and bigger, and the transmission rate is getting higher and higher. The required chip performance is constantly improving, and the power consumption of the module is also increasing. However, with the continuous evolution and improvement of chip performance and processing technology size, the thermal density continues to increase, and the heat dissipation of chips in modules has become more and more a bottleneck.

Contents of the invention

In view of this, it is necessary to provide a chip heat dissipation structure and an optical module to improve the heat dissipation efficiency of the chip.

The first aspect of the embodiments of the present application provides a chip heat dissipation structure, including a frame part, an elastic member and a heat conducting block. The frame part includes a plurality of side plates, and the area surrounded by the plurality of side plates is an accommodating cavity, and each of the side plates has a first end and a second end opposite to each other in the first direction, wherein the first One end is provided with a clamping piece, and the clamping piece is used for clamping the chip. The elastic member is disposed above the accommodating cavity along the first direction and is connected to the second end of at least one side plate, the elastic member is used for generating elastic deformation in the first direction. The heat conduction block is at least partly arranged in the accommodating cavity, the side of the heat conduction block facing the elastic member is used for heat transfer with the cooling member, and the other side of the heat conduction block facing away from the elastic member is a bonding surface, so The bonding surface is used for elastic bonding with the chip under the action of the elastic member.

This kind of chip heat dissipation structure is supported by the cooling member through the elastic member, so that the bonding surface is elastically pressed against the chip, which facilitates the bonding of the bonding surface and the surface of the chip, and as far as possible there is no gap between the chip and the bonding surface, thereby Increase the efficiency of chip heat dissipation. Wherein, the cooling element is generally a part of the casing wrapped outside the chip and the chip cooling unit. After the bonding surface of the chip and the heat conduction block is bonded, the heat emitted by the chip is directly transferred to the heat conduction block, and the heat conduction block can conduct heat quickly, so that the heat of the chip is distributed to a larger area, and the heat conduction block The large heat dissipation area enables heat to be dissipated faster, thereby improving the heat dissipation effect of the chip.

In a possible design of the first aspect, the first end of the frame part is provided with a communication port that communicates with the accommodating cavity; the bonding surface is located between the first end and the second end The part of the frame part close to the communication port forms the clamping part, and the part of the accommodating cavity close to the communication port forms the clamping chamber of the clamping part; the chip is arranged on the card When the chamber is held, the relative position of the chip and the frame portion perpendicular to the first direction is restricted.

This chip heat dissipation structure extends out of the holding chamber through the accommodating cavity, and can form a surrounding package for the chip. Thereby, the connection strength between the chip and the heat dissipation structure of the chip is improved, and the chip can also be protected. Moreover, the structure of the frame part is simplified, so that the manufacture of the frame part is easy, and the manufacturing cost of the frame part is reduced.

In a possible design of the first aspect, the elastic member includes an elastic piece, and the elastic piece has a first section and a second section, the first section is fixedly connected to the frame part, and the second section faces away from the frame part. The direction of the frame part is extended to form a resisting segment; the resisting segment can be elastically deformed in the first direction when receiving a force along the first direction.

In this chip heat dissipation structure, the elastic deformation is realized through the shrapnel, and the elastic restoring force in the first direction is provided after the shrapnel is deformed. The elastic piece has the characteristic of stable direction of the elastic restoring force, which can avoid the occurrence of the elastic force component perpendicular to the first direction as much as possible. It is possible to prevent the chip cooling structure from being subjected to the elastic force perpendicular to the direction, and excessively squeezing the chip from a position perpendicular to the first direction.

In a possible design of the first aspect, the elastic piece further has a third section, and the third section extends from the second section toward the direction close to the accommodating cavity, and the third section of the elastic piece can be opposite to The heat conducting block slides.

This kind of chip heat dissipation structure extends toward the accommodation cavity through the third section, so that after elastic deformation of the shrapnel, the first section applies elastic force to the frame part, and the third section applies elastic force to the heat conduction block in the accommodation cavity, so that the elasticity of the elastic force more evenly distributed. On the other hand, the elastic sheet forms a resisting section through the middle part, which makes the deformation of the elastic sheet more controllable, and has a larger contact area between the resisting section and the cooling element, reducing the risk of the cooling element being scratched by the resisting section.

In a possible design of the first aspect, there are multiple elastic members.

In this chip heat dissipation structure, by arranging a plurality of elastic members, the elastic recovery force of the chip heat dissipation structure can be increased, and the bonding surface can be more easily bonded to the surface of the chip.

In a possible design of the first aspect, the plurality of elastic members are arranged at the second end rotationally symmetrically around a central axis, and the central axis is parallel to the first direction.

In this chip heat dissipation structure, by distributing a plurality of elastic members symmetrically in rotation, the elastic restoring force received by the frame portion can be uniformly distributed, preventing the frame portion from being subjected to an eccentric moment, causing the frame portion to be excessively squeezed from a position perpendicular to the first direction chip.

In a possible design of the first aspect, the frame portion includes four side plates; each of the side plates is fixedly provided with the same number of elastic members.

In this chip heat dissipation structure, by arranging the same number of elastic pieces on each side plate, each side plate receives approximately the same elastic recovery force, thereby ensuring that the frame part receives a uniform elastic recovery force.

In a possible design of the first aspect, the elastic member includes two elastic pieces arranged symmetrically. The side plate is provided with a mounting plate extending toward the accommodating cavity, one end of the two elastic pieces is fixed to the mounting plate, and the other end extends away from the mounting plate.

This chip heat dissipation structure can distribute the elastic recovery force of a single side plate to the two shrapnels, reducing the pressure of the shrapnel on the cooling element.

In a possible design of the first aspect, the frame part is fixedly connected to the heat conduction block.

In this chip heat dissipation structure, the frame part and the heat conduction block move synchronously. When the elastic member is subjected to elastic force, the frame part and the heat conduction block move toward the chip together, and the accommodating cavity can guide the relative movement of the chip, so that the chip can be The determined direction is close to the thermal block. When the bonding surface is bonded to the chip, it can ensure that the chip and the bonding surface are in a preset relative position, and try to avoid dislocation between the chip and the bonding surface.

In a possible design of the first aspect, the frame part further includes a holding member. The holding member is arranged on the frame portion to form the inner wall of the holding chamber, and the holding member extends toward the holding chamber.

This chip heat dissipation structure provides more stable clamping force for the chip through the clamping member, and prevents the chip from moving along the relative frame portion perpendicular to the first direction as much as possible.

In a possible design of the first aspect, the heat conduction block has a first boss, the first boss protrudes from the second end out of the accommodating cavity, and the first boss reaches the first boss. The maximum distance between the two ends is smaller than the maximum distance between the elastic member and the second end.

In this chip heat dissipation structure, after the first boss protrudes out of the accommodating cavity, it is convenient to arrange a heat-conducting filler, so as to conduct heat conduction between the heat-conducting block and the cooling element.

In a possible design of the first aspect, on a projection plane perpendicular to the first direction, the projection of the elastic member avoids the projection of the first boss.

This chip heat dissipation structure prevents the elastic member from covering the first boss. The first boss is mainly used for heat transfer, and after the elastic member is avoided from the first boss, it is possible to prevent the elastic member from affecting the heat transfer effect of the first boss.

In a possible design of the first aspect, the heat conduction block includes one of a copper block, a silver block, a copper-aluminum alloy block, and a graphene block.

In this chip heat dissipation structure, the heat conduction block has a better heat transfer effect. When the heat conduction block is attached to the chip, the heat generated by the chip can be quickly taken away from the chip.

In a possible design of the first aspect, the frame part includes four side plates; two adjacent side plates are connected by elastic connecting plates; when the chip enters the holding chamber from the communication port, the The elastic connecting plate enables the four side plates to move elastically to hold the chip elastically.

In this chip heat dissipation structure, the elastic fit of the four side plates is realized through the elastic connecting plate, and the clamping of the chip is realized through the four side plates having a certain relative displacement.

A second aspect of the embodiments of the present application provides an optical module, including a cooling element, a substrate, a chip, and a chip heat dissipation structure. The substrate is used to carry the chip. The chip heat dissipation structure is arranged on the chip and includes a frame part, an elastic part and a heat conduction block. The frame portion includes a plurality of side plates, and the area surrounded by the plurality of side plates is an accommodating cavity, and each of the side plates has a first end and a second end opposite to each other in the first direction, wherein the The first end is provided with a clamping piece, and the clamping piece is used for clamping the chip. The elastic member is disposed above the accommodating cavity along the first direction and is connected to the second end of at least one side plate, and the end of the elastic member facing away from the accommodating cavity elastically contacts the the cooling element. The heat conduction block is at least partly disposed in the accommodating cavity, one end of the heat conduction block is connected to the cooling element, and the other end forms a bonding surface, and the bonding surface is used for contacting with the elastic element under the action of the elastic element. The chips are elastically attached.

This kind of optical module is supported by the cooling part through the elastic part, so that the bonding surface is elastically pressed against the chip, which facilitates the bonding of the bonding surface and the surface of the chip, and there is no gap or a large gap between the chip and the bonding surface as much as possible. Small, thereby increasing the efficiency of chip heat dissipation. After the chip is bonded to the bonding surface of the heat conduction block, the heat emitted by the chip is directly transferred to the heat conduction block, and the heat conduction block can conduct heat quickly, so that the heat of the chip is dispersed to a larger area. The heat is transferred to the cooling element through the heat conduction block and dissipated to the outside world. Since the heat conduction block has a large thermal conductivity, it is equivalent to directly increasing the heat dissipation area of the chip by the heat conduction block, so that the heat is quickly transferred to the cooling element.

In a possible design of the second aspect, the optical module further includes a casing, the casing cooperates with the cooling element to form an installation cavity, and the substrate is installed in the installation cavity.

In this chip heat dissipation structure, the base plate is provided with the base plate through the shell, and the shell can protect the base plate, thereby improving the stability of the entire chip heat dissipation structure.

In a possible design of the second aspect, the optical module further includes a heat conduction medium, the heat conduction medium is filled between the chip heat dissipation structure and the cooling element, and the thermal conductivity of the heat conduction block is greater than that of the heat conduction medium .

In this chip heat dissipation structure, the heat transfer effect can be further enhanced by filling the gap between the cooling element and the chip heat dissipation structure with a heat conducting medium.

In a possible design of the second aspect, the first end of the frame part is provided with a communication port that communicates with the accommodating cavity; the bonding surface is located between the first end and the second end The part of the frame part close to the communication port forms the clamping part, and the part of the accommodating cavity close to the communication port forms the clamping chamber of the clamping part; the chip is arranged on the card When the chamber is held, the relative position of the chip and the frame portion perpendicular to the first direction is limited.

In a possible design of the second aspect, the cooling element is detachably connected to the casing, the casing is provided with an installation groove, and the cooling element blocks an opening of the installation groove to form the installation cavity. The base plate is fixedly connected with the shell.

The optical module facilitates the installation of the heat dissipation structure of the substrate and the chip through the detachable cooling part and the shell part. It is also convenient for the maintenance of the heat dissipation structure of the substrate and the chip in the future.

In a possible design of the second aspect, the housing further includes a second boss, and the second boss extends from the cooling element toward the chip. The heat conduction medium is filled between the second protrusion and the chip heat dissipation structure.

In this optical module, the arrangement of the second boss enables a certain gap between the substrate and the cooling element, so as to prevent the cooling element from affecting the operation of the substrate. The second boss extends toward the chip, and can provide pressure for the elastic member, so that the heat dissipation structure of the chip is pressed against the chip, so as to ensure the bonding between the bonding surface and the chip as much as possible.

Description of drawings

Fig. 1 is a cross-sectional view of an optical module.

Fig. 2 is an exploded view of an optical module provided by an embodiment of the present application.

Fig. 3 is a cross-sectional view of an optical module provided by an embodiment of the present application.

FIG. 4 is an exploded view of a chip heat dissipation structure provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of a chip heat dissipation structure provided by an embodiment of the present application.

FIG. 6 is a schematic structural diagram of a chip heat dissipation structure provided by another embodiment of the present application.

FIG. 7 is a schematic structural diagram of a chip heat dissipation structure provided by another embodiment of the present application.

Explanation of main component symbols

Optical module 001, 001’

Chip 010,010’

Shell 020, 020’

Heat conduction medium 030, 030’

Substrate 050, 050’

Chip cooling structure 070

Cooling piece 200

The second boss 210, 210’

Shell 300

Mounting groove 310

Opening 311

Bottom wall 313

Frame Department 400

Accommodating cavity 401

Connecting port 401a

side panel 410

Raised 411

Curved plate 430

Card holder 450

Card Holder 451

Flange 470

Elastic piece 500

Shrapnel 510

First Paragraph 511

Second Paragraph 513

The third paragraph 515

Heat conduction block 600

Fitting surface 610

The first boss 630

First Direction X

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

detailed description

The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

Hereinafter, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first", "second", etc. may expressly or implicitly include one or more of that feature. In the description of the present application, unless otherwise specified, "plurality" means two or more. Orientation terms such as "upper", "lower", "left", and "right" are defined relative to the schematic placement of components in the drawings. It should be understood that these directional terms are relative concepts, and they are used With respect to description and clarification relative to it, it may change correspondingly according to the change of orientation of parts placed in the drawings.

In this application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

When the following embodiments are described in detail in conjunction with the schematic diagrams, for ease of explanation, the diagrams showing the partial structure of the device will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the protection scope of the present invention.

Fig. 1 shows an optical module 001'. This optical module 001' is applied to the double-density four-channel small pluggable optical module (Quad Small Form-factor Pluggable-Double Density, QSFP-DD). In this optical module 001', the PCB substrate 050' is set in the housing 020', the chip 010' is fixed on the PCB substrate 050', and the heat-conducting medium 030' is filled into the chip 010' and the second boss 210 of the housing 020' 'between. The part of the chip 010' that generates heat transfers the heat to the heat-conducting medium 030' through the heat-dissipating surface of the chip 010', and the heat-conducting medium 030' then transfers the heat to the second boss 210'. Due to the tolerance gap between the heat dissipation surface of the chip 010' and the second boss 210', the heat dissipation gap between the housing 020' and the heat dissipation surface of the chip 010' is relatively large, resulting in a large thermal resistance of the heat conducting medium 030' filled in the middle. Similarly, the dense wavelength splitting optical communication module (Centum gigabits Form Pluggable, CFP2) and other modules that require thermal installation of the chip 010' also generally use the form shown in Figure 1. As the power consumption of the chip 010' increases, the amount of heat dissipation increases. In this kind of optical module 001', the heat conduction medium 030' with a large thermal resistance is gradually difficult to satisfy the heat dissipation of the chip 010'.

2 and 3 show schematic diagrams of the optical module 001 in some possible scenarios. FIG. 2 is an exploded view of an optical module 001 in the embodiment of the present application. FIG. 3 is a cross-sectional view of an optical module 001 in an embodiment of the present application.

As shown in FIG. 2 and FIG. 3 , the optical module 001 includes a housing 020 , a substrate 050 , a chip 010 , a heat conducting medium 030 and a chip heat dissipation structure 070 .

The housing 020 includes a cooling member 200 and a shell member 300 . The shell 300 has a mounting slot 310 , one end of the mounting slot 310 has an opening 311 , and the end away from the opening 311 is a bottom wall 313 of the mounting slot 310 . The substrate 050 is installed in the installation groove 310 and has a certain gap with the opening 311 and the bottom wall 313 . The substrate 050 may be a PCB, and the substrate 050 is electrically connected to the chip. The cooling element 200 is detachably connected with the shell element 300 , the shell element 300 is disposed at the opening 311 of the cooling element 200 , and the shell element 300 blocks the opening 311 so that the mounting groove 310 forms a surrounding enclosed mounting cavity.

The base plate 050 is installed in the installation groove 310 in the form of clamping, and glue can also be provided on the side thereof, and the connection strength between the base plate 050 and the shell 300 can be strengthened through the glue. It can be understood that the substrate 050 can also be directly bonded to the shell 300 by glue, as long as the substrate 050 and the shell 300 have sufficient connection strength.

The chip 010 is disposed on a side of the substrate 050 facing the opening 311 . When the cooling element 200 and the shell element 300 are assembled, the chip 010 is on the side of the substrate 050 facing the cooling element 200 , and the side of the chip 010 facing the cooling element 200 is the heat dissipation surface of the chip 010 .

On the side of the cooling element 200 facing the chip 010, a second boss 210 is provided. The second boss 210 extends from the cooling element 200 to the direction of the chip 010. The second boss 210 can reduce the transmission between the chip 010 and the housing 020. Thermal distance, reduce thermal resistance. But considering the overall tolerance of the device, the second boss 210 cannot be placed too close to the chip 010 . Otherwise, in some cases, when the cooling element 200 and the shell element 300 are mated, the second boss 210 presses the chip 010 toward the bottom wall 313 .

The chip cooling structure 070 and the heat conduction medium 030 are arranged between the second boss 210 and the chip 010 , and can fill the gap between the second boss 210 and the chip 010 .

FIG. 4 is an exploded view of a chip heat dissipation structure 070 in the embodiment of the present application. FIG. 5 is a schematic structural diagram of a chip heat dissipation structure 070 in an embodiment of the present application

Please refer to FIG. 4 and FIG. 5 together, the chip cooling structure 070 includes a frame part 400 . The frame part 400 is made of metal, includes four side plates 410, and is in the shape of a quadrangular column as a whole. The direction perpendicular to the heat dissipation surface of the chip 010 is the first direction X, and the side plate 410 of the frame part 400 has a first end and a second end opposite to each other along the first direction X. A housing chamber 401 is formed in the frame part 400 , a communication port 401 a communicating with the housing chamber 401 is provided at the first end of the frame part 400 , and a through hole communicating with the housing chamber 401 is provided at the second end of the frame part 400 .

The chip cooling structure 070 also includes an elastic member 500 . The elastic member 500 is disposed above the accommodating cavity 401 and is located at the second end of the frame portion 400. The elastic member 500 and the side plate 410 are connected to the second end of the side plate 410. The elastic member 500 is subjected to a force parallel to the first direction X. Can be compressed when pressed. The compressed elastic member 500 can generate an elastic restoring force parallel to the first direction X. When the chip cooling structure 070 is disposed between the chip 010 and the second boss 210 , the elastic member 500 is located between the frame portion 400 and the second boss 210 . When the second boss 210 applies a force toward the chip 010 to the elastic member 500 , the elastic member 500 is compressed, and the elastic restoring force of the elastic member 500 makes the chip cooling structure 070 move away from the second boss 210 .

The elastic member 500 includes a plurality of elastic pieces 510 , and the elastic pieces 510 can generate an elastic restoring force with a relatively definite direction after being deformed. The elastic piece 510 includes a continuous first segment 511 , a second segment 513 and a third segment 515 , wherein one end of the first segment 511 facing away from the second segment 513 is fixed to the frame part 400 , and the other end is connected to the second segment 513 . The second segment 513 extends from the first segment 511 in a direction away from the frame part 400 . The third segment 515 extends from the second segment 513 toward the frame portion 400 . In general, the elastic piece 510 extends from the side plate 410 toward the accommodating cavity 401 , and the second section 513 forms a protrusion away from the frame portion 400 . A pressure is applied to the second section 513, and the pressure is parallel to the first direction X. When pointing from the second end to the first end, the second section 513 elastically deforms in the direction of the frame part 400, wherein the third section 515 is also due to the first The elastic deformation of the second section 513 produces a displacement relative to the side plate 410 .

Please refer to FIG. 3 , FIG. 4 and FIG. 5 in conjunction, the chip cooling structure 070 further includes a heat conduction block 600 . The heat conduction block 600 is a copper block, and the copper block has a high heat transfer coefficient. The heat conduction block 600 is disposed in the accommodating cavity 401 , and the heat conduction block 600 and the frame part 400 are welded and fixed at a position close to the second end of the frame part 400 . The heat conduction block 600 exposes the frame portion 400 through the through hole, and when the heat conduction medium 030 is filled between the chip cooling structure 070 and the second boss 210 , the heat conduction medium 030 contacts the heat conduction block 600 . The heat conduction medium 030 can transfer the heat of the heat conduction block 600 to the second boss 210 .

A surface of the heat conduction block 600 facing away from the second boss 210 forms a bonding surface 610 . The chip 010 is held by the clamping member 450 near the first end of the frame portion 400 , so that the chip 010 is aligned with the bonding surface 610 , and the relative position of the chip 010 and the frame portion 400 perpendicular to the first direction X is limited. When the second boss 210 applies a force toward the chip 010 to the elastic member 500 , the elastic member 500 is compressed, and the elastic restoring force of the elastic member 500 makes the frame part 400 and the heat conduction block 600 move toward the chip 010 . The third section 515 of the elastic member 500 can be held against the heat conduction block 600 , so that the elastic restoring force of the elastic member 500 directly acts on the frame body through the first section 511 and directly acts on the heat conduction block 600 through the second section 513 . The elastic member 500 exerts a uniform force on the frame body and the heat conducting block 600 , so that the chip heat dissipation structure 070 as a whole approaches the chip 010 . Since the bonding surface 610 is aligned with the chip 010 , the bonding surface 610 is gradually approaching the chip 010 when the heat conduction block 600 elastically moves toward the chip 010 , and finally the bonding surface 610 is elastically bonded to the chip 010 . The heat conduction medium 030 has certain fluidity, and when the chip heat dissipation structure 070 moves to the chip 010, the heat conduction medium 030 deforms itself to match the gap between the chip heat dissipation structure 070 and the second boss 210.

The heat dissipation surface of the chip 010 is located on the side of the chip 010 facing the heat conducting block 600 . After the chip 010 is bonded to the bonding surface 610 , the heat dissipation surface of the chip 010 is bonded to the bonding surface 610 . A large amount of heat on the heat dissipation surface of the chip 010 is diffused and conducted through the bonding surface 610 , then transferred to the heat conducting medium 030 , and finally exported through the housing 020 . Since the bonding surface 610 can elastically bond the chip 010 , on the one hand, the chip 010 can be prevented from being crushed, and on the other hand, gaps between the bonding surface 610 and the chip 010 can be avoided as much as possible, thereby increasing heat transfer efficiency. The heat conduction block 600 itself has a large heat transfer coefficient, thereby improving the heat transfer efficiency between the chip 010 and the second boss 210 .

Since the frame part 400 has the accommodating cavity 401 , the accommodating cavity 401 can also be used for accommodating the chip 010 while accommodating the heat conduction block 600 . When the heat conduction block 600 and the chip 010 are in the accommodating cavity 401 at the same time, the alignment of the chip 010 and the heat conduction block 600 can be directly completed. The part of the frame part 400 close to the communication port 401a forms a clamping part 450, and the clamping part 450 has a clamping chamber 451. The clamping chamber 451 is the part of the accommodating cavity 401 close to the communication port 401a. The chip 010 can enter the accommodating cavity 401 through the communication port 401a, and be clamped by the inner wall of the clamping chamber 451, thereby restricting the displacement of the chip 010 perpendicular to the first direction X relative to the frame portion 400. It can be understood that the frame part 400 may also have six side plates 410 to form a hexagonal prism, may also have eight side plates 410 to form an octagonal prism, or may set the side plates 410 as arc-shaped plates. Of course, the frame part 400 can also use a cylindrical side plate 410, so that the entire frame part 400 is cylindrical. It is only necessary to form the accommodating cavity 401 in the frame part 400 .

It can be understood that the clip 450 can also be separately provided on the frame part 400 , and the clip 450 only needs to be fixed on the first end of the side plate 410 . For example, clamping claws are provided at the first ends of the plurality of side plates 410 , and the plurality of clamping claws form the holding member 450 to hold the chip 010 .

It can be understood that when the holding member 450 is provided separately, the fitting surface 610 of the heat conduction block 600 can extend out of the accommodating cavity 401 as long as the fitting surface 610 can fit the chip 010 held by the holding member 450 .

In order for the frame part 400 to allow the chip 010 to enter the accommodating cavity 401 and to allow the inner wall of the accommodating cavity 401 to clamp the chip 010 , it is necessary to make the four side plates 410 fit elastically. The four side plates 410 can be in a first relative position, and in the first relative position, the four side plates 410 enclose to form a quadrangular prism with a larger cross-sectional area. The four side plates 410 can also be in a second relative position. In the second relative position, the four side plates 410 enclose to form a quadrangular prism with a smaller cross-sectional area. Moreover, when the four side plates 410 of the frame part 400 are located at the first relative position, they can elastically deform to the second relative position. When the four side plates 410 are in the first relative position, the chip 010 enters the accommodating cavity 401 from the communication port 401a, and the four side plates 410 tend to deform to the second relative position, so that the chip 010 is elastically clamped .

Two adjacent side plates 410 are connected by elastic connecting plates, so that the four side plates 410 can be elastically matched. The elastic connecting plate is an arc-shaped plate 430 protruding outward from the accommodating cavity 401 , through the deformation of the arc-shaped plate 430 , the relative displacement between the side plates 410 is controlled, and elastic recovery force is provided for the side plates 410 .

The chip 010 may be displaced perpendicular to the first direction X in the holding chamber 451 , and the frame part 400 further includes four protrusions 411 to avoid such deviation as much as possible. Each protrusion 411 is correspondingly disposed on the inner wall of one side plate 410 , specifically, the protrusion 411 is disposed on the inner wall of a part of the side plate 410 corresponding to the locking chamber 451 . The protrusion 411 extends from the side plate 410 into the locking chamber 451 . When the chip 010 is placed in the holding chamber 451 , the outer periphery of the chip 010 is held against by the protrusion 411 , so as to keep the chip 010 and the frame portion 400 relatively fixed in all directions perpendicular to the first direction X.

It can be understood that the number of protrusions 411 can also be other, for example, two protrusions 411 , three protrusions 411 or other numbers of protrusions 411 are provided on each side plate 410 . It is also possible to arrange different numbers of protrusions 411 on each side plate 410, which can be selected according to the clamping strength required by the chip 010.

It can be understood that the heat conduction block 600 may also use silver blocks, copper-aluminum alloy blocks, graphene blocks, and other block-shaped pieces with relatively high heat transfer coefficients. In other partial implementations, the heat conduction block 600 can also use liquid metal, and when the liquid metal is supercooled, it forms a block structure in the accommodating cavity 401 . The liquid metal is arranged in the accommodating cavity 401 , and the liquid metal covers the heating surface of the chip 010 through its own deformation. When assembling the optical module 001, the elastic member 500 causes the frame part 400 to displace in a direction away from the second boss 210. Correspondingly, the chip 010 and the liquid metal on the chip 010 are pushed to move in the direction of the second boss 210 until The liquid metal contacts the heat-conducting medium 030 and the chip 010 at the same time, and can transfer the heat of the chip 010 to the heat-conducting medium 030 quickly. The frame part 400 here is used as a container for carrying liquid metal, and the elastic member 500 can adapt to the tolerance gap, so that the frame part 400 acts on the chip 010 as elastically as possible, or makes the frame elastically resist the substrate 050, so that the frame part 400 is avoided. Rigid directly against the substrate 050 . However, when liquid metal is used, the gap between the inner wall of the accommodating cavity 401 and the chip 010 needs to be filled with other flexible fillers to avoid leakage of the liquid metal.

In order to keep the displacement path along the first direction X as far as possible when the elastic member 500 pushes the frame part 400 and the heat conduction block 600 toward the chip 010 , it is necessary to prevent the elastic restoring force from generating an eccentric moment to the frame part 400 . A plurality of elastic members 500 are rotationally symmetrically disposed on the second end of the frame portion 400 around a central axis, and the central axis is parallel to the first direction X. As shown in FIG. Rotational symmetry means: on a projection plane perpendicular to the central axis, the projections of the plurality of elastic members 500 overlap with the projections of the plurality of elastic members 500 rotated by a certain angle around the central axis. The eccentric moments generated by the elastic force exerted by the plurality of elastic members 500 on the frame part 400 and the heat conduction block 600 cancel each other, so that the frame part 400 and the heat conduction block 600 are finally subjected to a force parallel to the first direction X, so that the frame part 400 and the heat conduction block 600 are finally subjected to a force parallel to the first direction X. When the heat conduction block 600 is close to the chip 010 along the first direction X, minimize the thrust of the frame part 400 on the chip 010 perpendicular to the first direction X, and reduce the force of the chip 010 on the substrate 050 in the direction perpendicular to the first direction X. force.

Each side plate 410 is correspondingly provided with two elastic pieces 500 , and all the elastic pieces 500 are elastic pieces 510 . The side plate 410 has a symmetrical plane parallel to the first direction X, and the two elastic members 500 disposed on the same side plate 410 are symmetrical with respect to the symmetrical plane. A mounting plate is provided at the second end of the side plate 410 , the mounting plate extends from the side plate 410 toward the accommodating cavity 401 , and a symmetrical plane of the mounting plate coincides with a symmetrical plane of the side plate 410 . Two elastic pieces 500 are disposed at the end of the mounting plate away from the side plate 410 , and the two elastic pieces 500 extend in opposite directions.

The eight elastic members 500 corresponding to the four side plates 410 can provide uniform elastic recovery force for the frame part 400 and the heat conduction block 600 . The second segment 513 of the elastic member 500 has the largest dimension relative to the second end of the frame portion 400 , all the elastic members 500 have the same shape, and the largest dimension of each elastic member 500 is the same. When assembling the optical module 001 , try to ensure that all the elastic members 500 are in contact with the second boss 210 at the same time, and make all the elastic members 500 generate as consistent elastic restoring force as possible.

Since the heat conduction block 600 and the frame part 400 need to be assembled and fixed, in order to ensure that each heat conduction block 600 and the frame part 400 have a definite relative position in the first direction X, the second end of the frame part 400 is provided with a stopper Features of the thermal block 600 . Specifically, a flange 470 is provided at the second end of the frame part 400 . The flange 470 extends toward the accommodating cavity 401 at the second end of the frame portion 400 , and a side of the flange 470 facing the first end forms a stop surface. When assembling the heat conduction block 600 and the frame part 400, the heat conduction block 600 can be extended from the communication port 401a into the accommodating cavity 401, and the heat conduction block 600 is pushed to move toward the second end until the heat conduction block 600 is stopped by the stop surface, At this time, the heat conduction block 600 and the frame part 400 are in a preset relative position. The heat conduction block 600 and the frame part 400 are welded and fixed, so that the heat conduction block 600 and the frame part 400 maintain a preset relative positional relationship.

It can be understood that the frame part 400 needs to clamp the chip 010 , so it needs a certain rigidity to maintain the shape. It is difficult to clamp the chip 010 by using copper material, and it is also difficult to withstand the elastic recovery force of the elastic member 500 . Therefore, when a relatively soft copper block is used for the heat conduction block 600 , the heat conduction block 600 and the frame part 400 are made of different materials, and need to be manufactured separately and then assembled. However, if the same material is used for the heat conduction block 600 and the frame portion 400 , and the material has a certain hardness on the one hand and an excellent heat transfer coefficient on the other hand, then the frame portion 400 and the heat conduction block 600 can be integrally formed.

The heat conduction block 600 has a first boss 630 , and the first boss 630 protrudes from the second end of the frame part 400 out of the accommodating cavity 401 , that is, the first boss 630 of the heat conduction block 600 extends toward the direction of the second boss 210 , the distance between the heat conduction block 600 and the second boss 210 can be reduced as much as possible through the first boss 630, and when the first boss 630 and the second boss 210 are connected through the heat conduction medium 030, the consumption of the heat conduction medium 030 can be reduced, and the The size of the small heat-conducting medium 030 in the first direction. The maximum distance from the first boss 630 to the second end is smaller than the maximum distance from the elastic member 500 to the second end, which can control the size of the first boss 630 protruding from the accommodating cavity 401 and reduce the elasticity of the first boss 630 to the elastic member 500 deformation effects. Specifically, the end surface of the first boss 630 may be flush with the end surface of the flange 470 .

The first boss 630 is disposed away from the elastic member 500 , and on the projection plane perpendicular to the first direction X, the projection of the elastic member 500 avoids the projection of the first boss 630 . In this way, the extensions of the first segment 511 and the third segment 515 of the elastic member 500 in the first direction X are as equal as possible, so that the elastic deformation of the elastic member 500 can provide the frame part 400 and the heat conduction block 600 with an elastic recovery force as equal as possible. .

FIG. 6 is a schematic structural diagram of another chip heat dissipation structure 070 in the embodiment of the present application.

In this chip heat dissipation structure 070 , the second end of the frame part 400 is provided with two elastic members 500 , and the two elastic members 500 are arranged on two opposite side plates 410 . The two elastic members 500 are arranged rotationally symmetrically around the central axis, and the central axis is parallel to the first direction X.

Compared with the chip heat dissipation structure 070 provided with eight elastic pieces 500 , in this chip heat dissipation structure 070 , each elastic piece 500 is larger, and the arrangement of the elastic pieces 500 is simpler.

It can be understood that the elastic member 500 can be integrally formed with the frame part 400 . After molding the elastic member 500 and the frame portion 400 separately, the elastic member 500 is fixed on the second end of the frame portion 400 .

FIG. 7 is a schematic structural diagram of another chip heat dissipation structure 070 in the embodiment of the present application.

In this chip heat dissipation structure 070 , four elastic pieces 500 are disposed on the second end of the frame portion 400 , and one elastic piece 500 is disposed on each side plate 410 . The four elastic members 500 are arranged rotationally symmetrically around the central axis, and the central axis is parallel to the first direction X.

The optical module 001 provided in this application can dissipate the heat generated by the chip 010 through the chip heat dissipation structure 070 . The chip heat dissipation structure 070 is held against the housing 020 through the elastic member 500, so that the bonding surface 610 is elastically pressed against the chip 010, which facilitates the bonding of the bonding surface 610 and the surface of the chip 010, and reaches as far as possible between the chip 010 and the bonding surface 610. There is no gap between them, thereby increasing the heat dissipation efficiency of the chip 010. After the chip 010 is bonded to the bonding surface 610 of the heat conduction block 600, the heat emitted by the chip 010 is directly transferred to the heat conduction block 600, and the heat conduction block 600 can quickly conduct heat, so that the heat of the chip 010 is dispersed to a larger In terms of area, the larger heat dissipation area of the heat conduction block 600 enables heat to be dissipated faster, thereby improving the heat dissipation effect of the chip 010 .

The above is only the specific implementation of the application, but the protection scope of the application is not limited thereto, and any changes or replacements within the technical scope disclosed in the application shall be covered within the protection scope of the application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.

Claims

A chip heat dissipation structure, characterized in that it comprises:

The frame part includes a plurality of side plates, the area surrounded by the plurality of side plates is an accommodating cavity, and each of the side plates has a first end and a second end opposite to each other in the first direction, wherein the The first end is provided with a holding part, and the holding part is used to hold the chip;

an elastic member disposed above the accommodating cavity along the first direction and connected to the second end of at least one of the side plates, the elastic member is used to generate elastic deformation in the first direction ;

a heat conduction block, at least partially disposed in the accommodating cavity, one side of the heat conduction block facing the elastic member is used for heat transfer with the cooling member, and the other side of the heat conduction block facing away from the elastic member is a bonding surface, The bonding surface is used to elastically bond to the chip under the action of the elastic member.
The chip heat dissipation structure according to claim 1, wherein the frame portion is provided with a communication port at the first end to communicate with the accommodating cavity;

The fitting surface is located between the first end and the second end;

The part of the frame part close to the communication port forms the clamping part, and the part of the accommodating cavity close to the communication port forms the clamping chamber of the clamping part;

When the chip is disposed in the holding chamber, the relative position of the chip and the frame portion perpendicular to the first direction is limited.
The chip heat dissipation structure according to claim 1, wherein the elastic member comprises an elastic piece, the elastic piece has a continuous first segment and a second segment, the first segment is fixedly connected with the frame part, and the The second segment extends in a direction away from the frame portion;

The second segment can be elastically deformed in the first direction when subjected to a force in the first direction.
The chip heat dissipation structure according to claim 3, wherein the elastic piece further has a third section, and the third section extends from the second section toward the direction close to the accommodating cavity, and the elastic piece The third segment can slide relative to the heat conducting block.
The chip heat dissipation structure according to claim 1, characterized in that there are multiple elastic members.
The chip heat dissipation structure according to claim 5, wherein the plurality of elastic members are arranged at the second end symmetrically around a central axis, and the central axis is parallel to the first direction.
The chip heat dissipation structure according to claim 5, wherein the frame part comprises four side plates;

Each of the side plates is fixedly provided with the same number of elastic members.
The chip heat dissipation structure according to claim 7, wherein the elastic member comprises two elastic pieces arranged symmetrically;

The side plate is provided with a mounting plate extending toward the accommodating cavity, one end of the two elastic pieces is fixed to the mounting plate, and the other end extends away from the mounting plate.
The chip heat dissipation structure according to claim 1, wherein the frame portion is fixedly connected to the heat conducting block.
The chip heat dissipation structure according to claim 2, wherein the frame part further comprises a protrusion;

The protrusion is arranged on the frame portion to form an inner wall of the locking chamber, and the protrusion extends into the locking chamber.
The chip heat dissipation structure according to claim 1, wherein the heat conduction block has a first boss, and the first boss protrudes from the second end of the accommodating cavity, and the first boss The maximum distance from the stage to the second end is smaller than the maximum distance from the elastic member to the second end.
The chip heat dissipation structure according to claim 11, wherein, on a projection plane perpendicular to the first direction, the projection of the elastic member avoids the projection of the first boss.
The chip heat dissipation structure according to claim 1, wherein the heat conduction block comprises one of a copper block, a silver block, a copper-aluminum alloy block, and a graphene block.
The chip heat dissipation structure according to claim 2, wherein the frame part comprises four side plates;

Two adjacent side plates are connected by elastic connecting plates;

When the chip enters the holding chamber from the communication port, the elastic connecting plate enables the four side plates to elastically move to elastically hold the chip.
An optical module, characterized in that it includes: a cooling element substrate, a chip, and a chip heat dissipation structure;

The substrate is used to carry the chip;

The chip heat dissipation structure is arranged on the chip, including a frame part, an elastic member and a heat conduction block;

The frame portion includes a plurality of side plates, and the area surrounded by the plurality of side plates is an accommodating cavity, and each of the side plates has a first end and a second end opposite to each other in the first direction, wherein the The first end is provided with a holding piece, and the holding piece is used to hold the chip;

The elastic member is disposed above the accommodating cavity along the first direction and is connected to the second end of at least one side plate, and the end of the elastic member facing away from the accommodating cavity elastically contacts the the cooling element;

The heat conduction block is at least partly disposed in the accommodating cavity, one end of the heat conduction block is connected to the cooling element, and the other end forms a bonding surface, and the bonding surface is used for contacting with the elastic element under the action of the elastic element. The chips are elastically attached.
The optical module according to claim 15, further comprising a casing; the casing cooperates with the cooling element to form an installation cavity, and the substrate is installed in the installation cavity.
The optical module according to claim 16, further comprising a heat-conducting medium;

The heat conduction medium is filled between the chip heat dissipation structure and the cooling element, and the thermal conductivity of the heat conduction block is greater than that of the heat conduction medium.
The optical module according to claim 15, characterized in that, the first end of the frame part is provided with a communication port communicating with the accommodating cavity;

The fitting surface is located between the first end and the second end;

The part of the frame part close to the communication port forms the clamping part, and the part of the accommodating cavity close to the communication port forms a clamping chamber of the clamping part;

When the chip is disposed in the holding chamber, the relative position of the chip and the frame portion perpendicular to the first direction is restricted.
The optical module according to claim 16, wherein the cooling element is detachably connected to the shell element, the shell element is provided with a mounting groove, and the cooling element blocks the opening of the mounting groove to form the the installation cavity;

The base plate is fixedly connected with the shell.
The optical module according to claim 17, wherein the cooling element further comprises a second boss, and the second boss extends from the cooling element toward the chip;

The heat conduction medium is filled between the second protrusion and the chip heat dissipation structure.