WO2023245606A1 - 一种激光切割系统 - Google Patents

一种激光切割系统 Download PDF

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Publication number
WO2023245606A1
WO2023245606A1 PCT/CN2022/101057 CN2022101057W WO2023245606A1 WO 2023245606 A1 WO2023245606 A1 WO 2023245606A1 CN 2022101057 W CN2022101057 W CN 2022101057W WO 2023245606 A1 WO2023245606 A1 WO 2023245606A1
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Prior art keywords
grating
laser
spectrum
parallel
reflector
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PCT/CN2022/101057
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English (en)
French (fr)
Inventor
全峰
蒋礼
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深圳优普莱等离子体技术有限公司
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Priority to CN202280002613.1A priority Critical patent/CN115279539A/zh
Priority to PCT/CN2022/101057 priority patent/WO2023245606A1/zh
Publication of WO2023245606A1 publication Critical patent/WO2023245606A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors

Definitions

  • the present invention relates to the technical field of laser cutting, and in particular to a laser cutting system.
  • Laser cutting uses a high-energy-density laser beam to heat the workpiece, causing the temperature to rise rapidly and reach the boiling point of the material in a very short time.
  • the material begins to vaporize and form steam.
  • the ejection speed of these vapors is very high. While the vapors are ejected, cuts are formed on the material to achieve the purpose of cutting the material.
  • the method of direct laser focus cutting is generally used.
  • this direct laser focus cutting method because the laser energy decays slowly near the focus, the laser is generally incident parallel to the target to be cut.
  • the surface of the material has a large bevel angle after being cut, so this method requires more material when cutting the material, and it takes a long time to polish the surface of the material after the cutting is completed.
  • Embodiments of the present invention provide a laser cutting system for first spatially dispersing the incident beam of the laser to obtain a spatially separated first spectrum, and then collimating the light of the first spectrum to obtain the collimated Finally, the collimated parallel spectrum is focused and vertically incident on the surface of the sample to be cut, because the energy of the dispersed parallel spectrum decays faster near the focused focus, so that the material to be cut is cut along the cutting thickness (along the The loss in the direction of light incidence (thickness) is less, and there is no bevel angle caused by cutting.
  • the embodiment of the present application provides a laser cutting system, including:
  • the laser is used to provide an incident beam, the spectral width of the laser is not less than 1 nm, and the laser has adjustable positive dispersion;
  • the time compression and spatial dispersion system includes a first grating and a first and second mirrors arranged perpendicularly to each other, or two second and third gratings arranged in parallel and with the same grating parameters, wherein, The time compression and spatial dispersion system is used to perform spatial dispersion on the incident light beam to obtain a spatially separated first spectrum, and collimate the first spectrum to obtain a collimated parallel spectrum;
  • the laser focusing system is used to focus the parallel spectrum and make the focused light spot vertically incident on the surface of the sample to be cut.
  • the time compression and spatial dispersion system includes a first grating and a first reflector and a second reflector arranged perpendicularly to each other
  • the first grating is used to spatially disperse the incident light beam, so as to A spatially separated first spectrum is obtained
  • the first reflecting mirror and the second reflecting mirror arranged perpendicularly to each other are used to reflect the first spectrum to the first grating to collimate the first spectrum. to obtain collimated parallel spectra.
  • the first grating is a transmission grating or a reflection grating
  • the time compression and spatial dispersion system also includes: an axial displacement platform, the axial displacement platform is interconnected with a first reflector and a second reflector arranged perpendicularly to each other;
  • first reflecting mirror and the second reflecting mirror arranged perpendicularly to each other are used to inject the first spectrum emitted from the first grating into the first grating in anti-parallel manner;
  • Adjust the axis displacement platform to adjust the optical path of the first spectrum of light between the first grating and the first and second mirrors arranged perpendicularly to each other to compensate for the laser focusing system
  • the parallel spectra cause temporal dispersion.
  • the time compression and spatial dispersion system includes two second gratings and a third grating that are arranged in parallel and have the same grating parameters
  • the second grating is used to spatially disperse the incident light beam, so as to A spatially separated first spectrum is obtained
  • the third grating is used to collimate the first spectrum to obtain a collimated parallel spectrum.
  • the optical path of the first spectrum of light between the second grating and the third grating is adjustable.
  • the time compression and spatial dispersion system further includes an adjustment device for adjusting the spacing between the second grating and the third grating;
  • the adjustment device is adjusted to adjust the optical path of the light of the first spectrum between the second grating and the third grating to compensate for the temporal dispersion caused by the laser focusing system on the parallel spectrum.
  • the time compression and spatial dispersion system also includes an axial displacement platform and a first and second reflective mirrors arranged perpendicularly to each other.
  • the axial displacement platform and the first and second reflectors arranged perpendicularly to each other.
  • the two reflectors are connected to each other;
  • first reflector and the second reflector arranged perpendicularly to each other are used to inject the first spectrum emitted from the second grating into the third grating in anti-parallel manner;
  • Adjust the axis displacement platform to adjust the optical path of the first spectrum of light between the second grating, the first reflecting mirror and the second reflecting mirror, and the third grating for Compensate for the temporal dispersion caused by the laser focusing system on the parallel spectrum.
  • both the second grating and the third grating are reflective gratings; or,
  • Both the second grating and the third grating are transmission gratings; or,
  • One of the second grating and the third grating is a reflection grating, and the other is a transmission grating.
  • the time compression and spatial dispersion system also includes:
  • the first small hole is used to collimate the incident beam of the laser.
  • the fifth reflective mirror is used to collimate the incident beam of the laser. reflected to the second grating.
  • the time compression and spatial dispersion system also includes:
  • the laser cutting system also includes:
  • a seventh reflector the seventh reflector is disposed between the time compression and spatial dispersion system and the laser focusing system, for changing the direction of the incident light of the parallel spectrum, so that the parallel light after changing the direction The spectrum is incident on the laser focusing system.
  • the positive dispersion amount of the laser is adjusted to compensate for the negative dispersion amount caused by the first grating, or the second grating and the third grating to the incident beam of the laser.
  • the numerical aperture of the laser focusing system is not less than 0.25.
  • the laser cutting system also includes:
  • a sample holder and a three-axis displacement platform wherein the sample holder and the three-axis displacement platform are connected to each other, the sample holder is used to fix the sample, and the three-axis displacement platform is used to adjust the sample in a three-dimensional space.
  • Sample holder is used to fix the sample, and the three-axis displacement platform is used to adjust the sample in a three-dimensional space.
  • the sample is a transparent material
  • the transparent material includes diamond
  • the laser includes a nanosecond laser, a femtosecond laser, or a picosecond laser.
  • the laser cutting system also includes a numerical control system, which is used to control the movement of the laser and the three-axis displacement platform in three-dimensional space;
  • the numerical control system controls the number of pulses output by the laser in unit time to be evenly distributed within the displacement of the three-axis displacement platform in any direction in the three-dimensional space in unit time.
  • the laser cutting system in the embodiment of the present application includes: a laser, a time compression and spatial dispersion system, and a laser focusing system; wherein the laser is used to provide an incident beam, the spectral width of the laser is not less than 1 nm, and the laser
  • the laser has adjustable positive dispersion;
  • the time compression and spatial dispersion system includes a first grating and a first and second reflector arranged perpendicularly to each other, or two second gratings arranged in parallel and with the same grating parameters.
  • time compression and spatial dispersion system is used to spatially disperse the incident beam to obtain a spatially separated first spectrum, and collimate the first spectrum to obtain a quasi- Direct parallel spectrum;
  • laser focusing system is used to focus the parallel spectrum, and incident the focused light spot to the place to be cut at a preset depth on the lower surface of the sample.
  • the incident beam is spatially dispersed through a time compression and spatial dispersion system to obtain a spatially separated first spectrum
  • the first spectrum is collimated to obtain a collimated Parallel spectrum
  • the parallel spectrum is focused through the laser focusing system, and the focused light spot is incident on the lower surface of the sample at a preset depth to be cut, because the spatially separated parallel spectrum has a greater energy attenuation near the focus. It is fast, so that the material to be cut has less loss in the cutting thickness (thickness along the direction of light incidence), and there is no bevel angle caused by cutting.
  • Figure 1 is a schematic diagram of an embodiment of the laser cutting system in the embodiment of the present application.
  • Figure 2 is a schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application, including a first grating (transmission grating) and a first reflector and a second reflector arranged perpendicularly to each other;
  • Figure 3 is a schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application including a first grating (reflection grating) and a first reflector and a second reflector arranged perpendicularly to each other;
  • Figure 4 is a schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application, which includes two second gratings (transmission grating) and a third grating (transmission grating) arranged in parallel and with the same grating parameters;
  • Figure 5 is a schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application, which includes two second gratings (reflection grating) and a third grating (reflection grating) arranged in parallel and with the same grating parameters;
  • Figure 6 is a schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application, which includes two second gratings (reflection grating) and a third grating (transmission grating) arranged in parallel and with the same grating parameters;
  • Figure 7 is a schematic diagram of an embodiment of the time compression and spatial dispersion system in the laser cutting system in the embodiment of the present application.
  • Figure 8 is a schematic diagram of another embodiment of the time compression and spatial dispersion system in the laser cutting system in the embodiment of the present application.
  • Figure 9 is a schematic diagram of another embodiment of the time compression and spatial dispersion system in the laser cutting system in the embodiment of the present application.
  • Figure 10 is a schematic diagram of an embodiment of the laser cutting system in the embodiment of the present application.
  • Embodiments of the present invention provide a laser cutting system for first spatially dispersing the incident beam of the laser to obtain a spatially separated first spectrum, and then collimating the light of the first spectrum to obtain the collimated Finally, the collimated parallel spectrum is focused and vertically incident on the surface of the sample to be cut, because the energy of the dispersed parallel spectrum decays faster near the focused focus, so that the material to be cut is cut along the cutting thickness (along the The loss in the direction of light incidence (thickness) is less, and there is no bevel angle caused by cutting.
  • An embodiment of the laser cutting system in this application includes:
  • Laser 101 time compression and spatial dispersion system 102, and laser focusing system 103;
  • the laser 101 is used to provide an incident beam, and the laser in the embodiment of the present application has a wider spectrum width.
  • the laser spectrum width in the embodiment of the present application is not less than 1 nm, and the laser has adjustable positive dispersion. .
  • the laser in the embodiment of the present application has a wider spectrum, that is, the pulse width of the laser in the embodiment of the present application is narrower
  • the laser in the embodiment of the present application is preferably a nanosecond laser, a femtosecond laser or a picosecond laser. seconds laser.
  • dispersion refers to the phenomenon that an incident beam with a certain spectrum width (assuming the spectrum width is ⁇ ) is spatially dispersed into multiple single-wavelength beams, and this incident beam with a certain spectrum width is spatially dispersed into multiple beams.
  • the phenomenon of a single wavelength beam is called spatial dispersion, and multiple single wavelength beams have different propagation speeds in the same medium (the propagation speed of low-frequency beams is faster than the propagation speed of high-frequency beams), resulting in single wavelengths of different frequencies.
  • the phenomenon of light beams appearing at different locations one after another is called temporal dispersion. Positive dispersion means that the low-frequency beam appears first in time, and the dispersion phenomenon of the high-frequency beam appears later. Conversely, negative dispersion means that the dispersion phenomenon of the high-frequency beam appears first in time, and then the low-frequency beam appears.
  • the time compression and spatial dispersion system 102 specifically includes a first grating 1021 and a first reflection mirror 10221 and a second reflection mirror 10222 arranged perpendicularly to each other, or two second gratings 1023 and a third grating 1024 arranged in parallel;
  • the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other
  • the first grating 1021 is used to separate the light of different wavelengths in the laser incident beam. Diffracted to different angles to achieve spatial separation and produce so-called spatial dispersion to obtain a spatially separated first spectrum.
  • the first reflector 10221 and the second reflector 10222 arranged perpendicularly to each other are used to reflect the first spectrum to the third spectrum.
  • a grating 1022 "collimates" the light beams of different wavelengths to achieve a "parallel spectrum" in which the light beams of different wavelengths are spatially separated but are parallel to each other and propagate in the same direction.
  • the first grating 1021 in the embodiment of the present application can be a transmission grating or a reflection grating, and there is no specific limitation here.
  • the time compression and spatial dispersion system 102 includes two second gratings 1023 and a third grating 1024 that are arranged in parallel and have the same grating parameters
  • the second grating 1023 is used to diffract light of different wavelengths in the laser incident beam to different angles.
  • the third grating 1024 is used to collimate light beams of different wavelengths in the first spectrum to obtain a spatially separated but parallel and Parallel spectra propagating in the same direction;
  • the second grating 1023 and the third grating 1024 may both be reflection gratings, or both may be transmission gratings, or one of them may be a reflection grating and the other may be a transmission grating.
  • the second grating 1023 and the third grating may be There are no specific restrictions on the type of triple grating 1024.
  • the laser focusing system 103 is used to focus the parallel spectrum and vertically incident the focused light spot to the place to be cut at a preset depth on the lower surface of the sample, where the preset depth determines the thickness of the cut sample.
  • the positive dispersion amount of the laser can be adjusted in the embodiment of the present application. Compensate the negative dispersion amount produced by the first grating, or the second grating and the third grating on the incident laser beam.
  • the incident beam of the laser is first spatially dispersed through the first grating, and then the first reflection mirror and the second reflection mirror arranged perpendicularly to each other are used to reflect the first spectrum to the first
  • the grating is used to collimate the first spectrum to obtain a collimated parallel spectrum, or the incident beam of the laser is spatially dispersed through the second grating, and then the third grating is used to collimate the first spectrum. , to obtain the collimated parallel spectrum.
  • the parallel spectrum is focused through the laser focusing system, and the focused light spot is vertically incident to the place to be cut at a preset depth on the lower surface of the sample, where the preset depth (sample The thickness from the surface to the focus) determines the thickness of the cutting, and because the energy of the spatially separated parallel spectrum decays faster near the focus, the material to be cut is cut in the direction of the cutting thickness (thickness along the direction of light incidence) The loss is less and there is no bevel caused by cutting.
  • Figure 2 shows an optical path diagram of the time compression and spatial dispersion system 102 including a first grating 1021 (transmission grating) and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other
  • Figure 3 shows The time compression and spatial dispersion system 102 includes a first grating 1021 (reflection grating) and an optical path diagram of a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other.
  • Figure 4 shows the time compression and spatial dispersion system 102 including two The optical path diagram of a second grating 1023 (transmission grating) and a third grating 1024 (transmission grating) arranged in parallel and with the same grating parameters.
  • Figure 5 shows that the time compression and spatial dispersion system 102 includes two parallel gratings.
  • Figure 6 shows that the time compression and spatial dispersion system 102 includes two second gratings arranged in parallel and with the same grating parameters.
  • the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other
  • the compression and spatial dispersion system 102 in the laser cutting system will be described in detail below.
  • Figure 7, is a schematic diagram of an embodiment of the time compression and spatial dispersion system 102 in the laser cutting system:
  • the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other, wherein the first reflector 10221 and the second reflector 10221 arranged perpendicularly to each other 10222 is used to make the first spectrum emitted from the first grating 1021 anti-parallel incident to the first grating 1021 .
  • the time compression and spatial dispersion system 102 also includes an axis displacement platform 1025, wherein the axis displacement platform 1025 is connected to a first reflector and a second reflector arranged perpendicularly to each other.
  • the axis displacement platform 1025 is adjusted, The optical path of the light of the first spectrum between the first grating and the mutually perpendicular first reflecting mirror 10221 and the second reflecting mirror 10222 is adjusted to compensate for the temporal dispersion caused by the laser focusing system 103 on the parallel spectrum.
  • the axis displacement platform 1025 is disposed in a direction parallel to the light of the first spectrum.
  • FIG. 7 shows the optical path diagram when the incident beam of the laser passes through the first grating 1021 (transmission grating), the first reflector 10221 and the second reflector 10222 arranged perpendicularly to each other, and the laser focusing system 103.
  • Figure 8 is a schematic diagram of another embodiment of the time compression and spatial dispersion system 102 in the laser cutting system:
  • the time compression and spatial dispersion system 102 includes two second gratings 1023 and third gratings 1024 that are arranged in parallel and have the same grating parameters
  • the light of the first spectrum is between the second grating 1023 and the third grating 1024
  • the light path is adjustable.
  • the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024 when adjusting the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024, it may be configured to adjust the distance between the second grating 1023 and the third grating 1024.
  • the spacing adjustment device 1026 is used to adjust the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024 by adjusting the adjustment device 1026 to compensate for the time caused by the laser focusing system 103 to the parallel spectrum. dispersion.
  • FIG. 8 shows an optical path diagram of the incident beam of the laser passing through the second grating 1023 and the third grating 1024 when both the second grating 1023 and the third grating 1024 are transmission gratings.
  • an axis displacement platform 1025 may also be provided, as well as a first vertically disposed first grating 1025.
  • the optical path of the light of the first spectrum between the second grating 1023, the first and second reflecting mirrors 10221 and 10222, and the third grating 1024 can be adjusted to supplement the laser focus.
  • the axis displacement platform 1025 is disposed in a direction parallel to the light of the first spectrum.
  • Figure 9 shows that when the second grating 1023 and the third grating 1024 are both transmission gratings, the incident beam of the laser passes through the second grating 1023, the first reflecting mirror 10221 and the second reflecting mirror 10222, and the third grating.
  • the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024 can be adjusted through an adjustment device or an axis displacement platform, thereby compensating the laser focusing system 103 for The time dispersion of the parallel spectrum, so the light spot focused on the focus in the embodiment of the present application can achieve the "spatial and temporal double focusing effect" to produce extremely high peak light intensity in a small range at the focus to preset the lower surface of the sample. Cut at the depth to be cut.
  • Figure 10 is another embodiment of the laser cutting system in the embodiment of the present application:
  • the time compression and spatial dispersion system 102 in the embodiment of the present application also includes:
  • the first small hole 1027 and the third reflective mirror 1028 are coaxially arranged.
  • the first small hole 1027 is used to collimate the incident beam of the laser 101
  • the third reflective mirror 1028 is used to collimate the laser beam.
  • the incident beam is reflected to the second grating to save the space occupied by the laser cutting system.
  • the time compression and spatial dispersion system 102 in the embodiment of the present application also includes:
  • the second small hole 1029 and the fourth reflective mirror 1030 are coaxially arranged, wherein the fourth reflective mirror 1030 is used to reflect the parallel spectrum emitted from the third grating 1024 to the second small hole 1029, and the second small hole 1029 is used to The parallel spectrum is collimated, and the collimated parallel spectrum is incident on the laser focusing system 103 .
  • the laser cutting system also includes: a fifth reflector 104,
  • the fifth mirror 104 is disposed between the time compression and spatial dispersion system 102 and the laser focusing system 103 to change the incident light direction of the parallel spectrum, so that the changed direction of the parallel spectrum is incident on the laser focusing system 103 .
  • the laser spot needs to be focused on a spot as small as possible to increase the laser energy density per unit area, and in the embodiment of the present application, the energy of the laser near the focus is required to decay quickly.
  • the laser focusing system 103 is required to have a smaller spot and a shorter light waist after focusing, so the laser focusing system 103 in the embodiment of the present application is required to have a larger numerical aperture, as an optional Embodiment, the numerical aperture of the laser focusing system in the embodiment of the present application is generally not less than 0.25.
  • the laser cutting system in the embodiment of the present application also includes a sample holder 105 and a three-axis displacement platform 106.
  • the sample holder is used to fix the sample
  • the three-axis displacement platform is used to move the sample in a three-dimensional space.
  • Condition sample holder location is used to fix the sample.
  • the laser cutting system in the embodiment of the present application may also include: a numerical control system 107, which is used to control the laser and the three-axis displacement platform in a three-dimensional space. of movement.
  • the numerical control system controls the number of pulses output by the laser in unit time to be evenly distributed on the three-axis displacement platform along any direction in the three-dimensional space in unit time. within the displacement amount.
  • the laser is required to output the first pulse when the displacement of the three-dimensional displacement platform along the X-axis direction is 0mm, and to output the second pulse when the displacement along the X-axis direction is 1/3mm.
  • the third pulse is output.
  • the samples in the embodiments of this application are generally transparent materials, such as diamond, quartz, corundum, rutile, etc.

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Abstract

一种激光切割系统，包括：激光器（101），时间压缩和空间色散系统（102），以及激光聚焦系统（103）。激光器（101）用于提供入射光束，时间压缩和空间色散系统（102）包括第一光栅（1021）和相互垂直设置的第一反射镜（10221）和第二反射镜（10222），或两个平行设置的且光栅参数相同的第二光栅（1023）和第三光栅（1024）。其中，时间压缩和空间色散系统（102）用于对入射光束进行空间色散，以得到在空间上分开的第一光谱，对第一光谱进行准直，以得到准直后的平行光谱。激光聚焦系统（103）用于将平行光谱聚焦，并将光束聚焦至样品下表面预设深度的待切割处。该激光切割系统可使得待切割材料的切割厚度薄，切割损耗低，且不存在切割造成的斜角。

Description

一种激光切割系统 技术领域
本发明涉及激光切割技术领域，尤其涉及一种激光切割系统。
背景技术
激光切割是利用高能量密度的激光束加热工件，使温度迅速上升，在非常短的时间内达到材料的沸点，材料开始汽化，形成蒸气。这些蒸气的喷出速度很大，在蒸气喷出的同时，在材料上形成切口，以达到切割材料的目的。
目前在利用激光切割样品材料时，一般是采用直接激光聚焦切割的方法，但这种直接激光聚焦切割的方法因为激光能量在焦点附近能量衰落的较慢，故一般是将激光平行入射至待切割材料表面，使得材料表面被切割后存在较大的斜角，故该方法在切割材料时需要耗费更多的材料，且在切割完成后需要较长的时间打磨材料表面。
发明内容
本发明实施例提供了一种激光切割系统，用于先将激光器的入射光束进行空间色散，以得到在空间上分开的第一光谱，再将第一光谱的光线进行准直，得到准直后的平行光谱，最后将准直后的平行光谱聚焦后垂直入射至样品的待切割表面，因为色散后的平行光谱在聚焦的焦点附近能量衰落的较快，从而使得待切割材料在切割厚度(沿光线入射方向的厚度)方向上的损耗较少，且不存在切割造成的斜角。
本申请实施例提供了一种激光切割系统，包括：
激光器，时间压缩和空间色散系统，以及激光聚焦系统；
其中，所述激光器用于提供入射光束，所述激光器的谱宽不小于1nm，且所述激光器具有可调节的正色散；
所述时间压缩和空间色散系统，包括第一光栅和相互垂直设置的第一反射镜和第二反射镜，或两个平行设置的且光栅参数相同的第二光栅和第三光栅，其中，所述时间压缩和空间色散系统用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，对所述第一光谱进行准直，以得到准直后的平行 光谱；
所述激光聚焦系统，用于将所述平行光谱进行聚焦，并将聚焦后的光斑垂直入射至样品的待切割表面。
可选的，若所述时间压缩和空间色散系统包括第一光栅和相互垂直设置的第一反射镜和第二反射镜，则所述第一光栅用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，所述相互垂直设置的第一反射镜和第二反射镜用于将所述第一光谱反射至所述第一光栅，以对所述第一光谱进行准直，以得到准直后的平行光谱。
可选的，所述第一光栅为透射光栅或反射光栅；
所述时间压缩和空间色散系统还包括：轴位移平台，所述轴位移平台与相互垂直设置的第一反射镜和第二反射镜相互连接；
其中，相互垂直设置的第一反射镜和第二反射镜用于将从所述第一光栅出射的第一光谱反向平行入射至所述第一光栅；
调节所述轴位移平台，以调节第一光谱的光线在所述第一光栅和相互垂直设置的第一反射镜和第二反射镜之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
可选的，若所述时间压缩和空间色散系统包括两个平行设置的且光栅参数相同的第二光栅和第三光栅，则所述第二光栅用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，所述第三光栅用于对所述第一光谱进行准直，以得到准直后的平行光谱。
可选的，第一光谱的光线在所述第二光栅和所述第三光栅之间的光程可调节。
可选的，所述时间压缩和空间色散系统还包括调节所述第二光栅和第三光栅之间间距的调节装置；
调节所述调节装置，以调节第一光谱的光线在所述第二光栅和所述第三光栅之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
可选的，所述时间压缩和空间色散系统还包括轴位移平台和相互垂直设置的第一反射镜和第二反射镜，所述轴位移平台和所述相互垂直设置的第一反射 镜和第二反射镜相互连接；
其中，相互垂直设置的第一反射镜和第二反射镜用于将从所述第二光栅出射的第一光谱反向平行入射至所述第三光栅；
调节所述轴位移平台，以调节第一光谱的光线在所述第二光栅、所述第一反射镜和所述第二反射镜，以及所述第三光栅之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
可选的，所述第二光栅和所述第三光栅都为反射光栅；或，
所述第二光栅和所述第三光栅都为透射光栅；或，
所述第二光栅和所述第三光栅中的一个为反射光栅，另一个为透射光栅。
可选的，所述时间压缩和空间色散系统还包括：
同轴设置的第一小孔和第五反射镜，所述第一小孔用于对所述激光器的入射光束进行准直，所述第五反射镜用于将准直后的激光器的入射光束反射至所述第二光栅。
可选的，所述时间压缩和空间色散系统还包括：
同轴设置的第二小孔和第六反射镜，所述第六反射镜用于将从第三光栅出射的平行光谱反射至所述第二小孔，所述第二小孔用于对所述平行光谱进行准直，并使得准直后的平行光谱入射至所述激光聚焦系统。
可选的，所述激光切割系统还包括：
第七反射镜，所述第七反射镜设置于所述时间压缩和空间色散系统，与所述激光聚焦系统之间，以用于改变所述平行光谱的入射光方向，使得改变方向后的平行光谱入射至所述激光聚焦系统。
可选的，调节所述激光器的正色散量，以用于补偿所述第一光栅，或，所述第二光栅和所述第三光栅对所述激光器的入射光束造成的负色散量。
可选的，所述激光聚焦系统的数值孔径不小于0.25。
可选的，所激光切割系统还包括：
样品支架和三轴位移平台，其中，所述样品支架和所述三轴位移平台相互连接，所述样品支架用于固定所述样品，所述三轴位移平台用于在三维空间内调节所述样品支架。
可选的，所述样品为透明材料，所述透明材料包括金刚石，所述激光器包 括纳秒激光器、飞秒激光器或皮秒激光器。
可选的，所述激光切割系统还包括数控系统，所述数控系统用于控制所述激光器及所述三轴位移平台在三维空间内的移动；
其中，在切割所述样品时，所述数控系统控制所述激光器在单位时间内输出脉冲的个数平均分配在所述三轴位移平台沿三维空间内任一方向在单位时间内的位移量内。
从以上技术方案可以看出，本发明实施例具有以下优点：
本申请实施例中的激光切割系统，包括：激光器，时间压缩和空间色散系统，以及激光聚焦系统；其中，所述激光器用于提供入射光束，所述激光器的谱宽不小于1nm，且所述激光器具有可调节的正色散；所述时间压缩和空间色散系统，包括第一光栅和相互垂直设置的第一反射镜和第二反射镜，或两个平行设置的且光栅参数相同的第二光栅和第三光栅，其中，所述时间压缩和空间色散系统用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，对所述第一光谱进行准直，以得到准直后的平行光谱；所述激光聚焦系统，用于将所述平行光谱进行聚焦，并将聚焦后的光斑入射至样品下表面预设深度的待切割处。
因为本申请实施例中，通过时间压缩和空间色散系统对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，对所述第一光谱进行准直，以得到准直后的平行光谱，最后通过激光聚焦系统，对平行光谱进行聚焦，并将聚焦后的光斑入射至样品下表面预设深度的待切割处，因为在空间上分开的平行光谱在焦点附近的能量衰落的较快，从而使得待切割材料在切割厚度(沿光线入射方向的厚度)方向上的损耗较少，且不存在切割造成的斜角。
附图说明
图1为本申请实施例中激光切割系统的一个实施例示意图；
图2为本申请实施例中时间压缩和空间色散系统包括第一光栅(透射光栅)和相互垂直设置的第一反射镜和第二反射镜的光路示意图；
图3为本申请实施例中时间压缩和空间色散系统包括第一光栅(反射光 栅)和相互垂直设置的第一反射镜和第二反射镜的光路示意图；
图4为本申请实施例中时间压缩和空间色散系统包括两个平行设置的且光栅参数相同的第二光栅(透射光栅)和第三光栅(透射光栅)的光路示意图；
图5为本申请实施例中时间压缩和空间色散系统包括两个平行设置的且光栅参数相同的第二光栅(反射光栅)和第三光栅(反射光栅)的光路示意图；
图6为本申请实施例中时间压缩和空间色散系统包括两个平行设置的且光栅参数相同的第二光栅(反射光栅)和第三光栅(透射光栅)的光路示意图；
图7为本申请实施例中激光切割系统中时间压缩和空间色散系统的一个实施例示意图；
图8为本申请实施例中激光切割系统中时间压缩和空间色散系统的另一个实施例示意图；
图9为本申请实施例中激光切割系统中时间压缩和空间色散系统的另一个实施例示意图；
图10为本申请实施例中激光切割系统的一个实施例示意图。
具体实施方式
本发明实施例提供了一种激光切割系统，用于先将激光器的入射光束进行空间色散，以得到在空间上分开的第一光谱，再将第一光谱的光线进行准直，得到准直后的平行光谱，最后将准直后的平行光谱聚焦后垂直入射至样品的待切割表面，因为色散后的平行光谱在聚焦的焦点附近能量衰落的较快，从而使得待切割材料在切割厚度(沿光线入射方向的厚度)方向上的损耗较少，且不存在切割造成的斜角。
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分的实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
为方便理解，下面对本申请中的激光切割系统进行描述，请参阅图1，本申请中激光切割系统的一个实施例，包括：
激光器101、时间压缩和空间色散系统102，以及激光聚焦系统103；
其中，激光器101用于提供入射光束，且本申请实施例中的激光器具有较宽的谱宽，一般情况下，本申请实施例中的激光谱宽不小于1nm，且激光器具有可调节的正色散。
具体的，因为本申请实施例中的激光器具有较宽的光谱，也即本申请实施例中激光器的脉冲宽度较窄，故本申请实施例中的激光器优选为纳秒激光器、飞秒激光器或皮秒激光器。
所谓色散，是指具有一定谱宽的入射光束(假设谱宽为Δλ)在空间上被分散为多个单一波长光束的现象，而这种具有一定谱宽的入射光束在空间上被分散为多个单一波长光束的现象称之为空间色散，而多个单一波长的光束因为在同一介质中传播速度不同(低频光束的传播速度比高频光束的传播速度快)，而导致不同频率的单一波长光束先后出现在不同位置的现象称之为时间色散。而正色散，是指在时间上先出现低频光束，后出现高频光束的色散现象，反之，负色散是指在时间上先出现高频光束，后出现低频光束的色散现象。
时间压缩和空间色散系统102具体包括第一光栅1021和相互垂直设置的第一反射镜10221和第二反射镜10222，或两个平行设置的第二光栅1023和第三光栅1024；
其中，若时间压缩和空间色散系统102包括第一光栅1021和相互垂直设置的第一反射镜10221和第二反射镜10222时，所述第一光栅1021用于将激光器入射光束中不同波长的光衍射到不同的角度实现空间分离而产生所谓的空间色散，以得到在空间上分开的第一光谱，相互垂直设置的第一反射镜10221和第二反射镜10222用于将第一光谱反射至第一光栅1022，将不同波长的光束“准直”实现不同波长的光束在空间上分开但是都相互平行且同向传播的“平行光谱”。
具体的，本申请实施例中的第一光栅1021可以是透射光栅或反射光栅，此处不做具体限制。
若时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023和第三光栅1024，则第二光栅1023用于将激光器入射光束中不同波长的光衍射到不同的角度实现空间分离而产生所谓的空间色散以得到在空间上分开的第一光谱，第三光栅1024用于对第一光谱中不同波长的光束进行准直，以得到在空间上分开但都相互平行且同向传播的平行光谱；
具体的，此处的第二光栅1023和第三光栅1024，可以都为反射光栅，或都为透射光栅，或其中一个为反射光栅，另一个为透射光栅，此处对第二光栅1023和第三光栅1024的类型也不做具体限制。
所述激光聚焦系统103，用于将平行光谱进行聚焦，并将聚焦后的光斑垂直入射至样品下表面预设深度的待切割处，其中，该预设深度决定了切割样品的厚度。
因为本申请实施例中的第一光栅，或第二光栅和第三光栅在对激光入射光束进行色散时，产生的是负色散，故本申请实施例中可以通过调节激光器的正色散量，以补偿第一光栅，或第二光栅和第三光栅对激光入射光束所产生的负色散量。
因为本申请实施例中，先通过第一光栅对激光器的入射光束进行空间色散，然后通过相互垂直设置的第一反射镜和第二反射镜用于将所述第一光谱反射至所述第一光栅，以对所述第一光谱进行准直，以得到准直后的平行光谱，或者是先通过第二光栅对激光器的入射光束进行空间色散，再利用第三光栅对 第一光谱进行准直，以得到准直后的平行光谱，最后通过激光聚焦系统，对平行光谱进行聚焦，并将聚焦后的光斑垂直入射至样品下表面预设深度的待切割处，其中，该预设深度(样本表面至焦点处的厚度)决定了切割的厚度，又因为在空间上分开的平行光谱在焦点附近的能量衰落的较快，从而使得待切割材料在切割厚度(沿光线入射方向的厚度)方向上的损耗较少，且不存在切割造成的斜角。
为方便理解，图2给出了时间压缩和空间色散系统102包括第一光栅1021(透射光栅)和相互垂直设置的第一反射镜10221和第二反射镜10222的光路图，图3给出了时间压缩和空间色散系统102包括第一光栅1021(反射光栅)和相互垂直设置的第一反射镜10221和第二反射镜10222的光路图，图4给出了时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023(透射光栅)和第三光栅1024(透射光栅)的光路图，图5给出了时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023(反射光栅)和第三光栅1024(反射光栅)的光路图，图6给出了时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023(反射光栅)和第三光栅1024(透射光栅)的光路图。
具体的，当时间压缩和空间色散系统102包括第一光栅1021和相互垂直设置的第一反射镜10221和第二反射镜10222时，下面接着对激光切割系统中的压缩和空间色散系统102做详细描述，请参阅图7，图7为激光切割系统中的时间压缩和空间色散系统102的一个实施例示意图：
具体的，当时间压缩和空间色散系统102包括第一光栅1021和相互垂直设置的第一反射镜10221和第二反射镜10222时，其中，相互垂直设置的第一反射镜10221和第二反射镜10222用于将从第一光栅1021出射的第一光谱反向平行入射至第一光栅1021。
除此以外，时间压缩和空间色散系统102还包括轴位移平台1025，其中，轴位移平台1025与相互垂直设置的第一反射镜和第二反射镜相互连接，当调节轴位移平台1025时，可以调节第一光谱的光线在第一光栅和相互垂直的第一反射镜10221和第二反射镜10222之间的光程，以用于补偿激光聚焦系统103对平行光谱造成的时间色散。
作为一种可选的实施方式，轴位移平台1025设置在与第一光谱的光线平行的方向上。
为方便理解，图7给出了激光器的入射光束经过第一光栅1021(透射光栅)、相互垂直设置的第一反射镜10221和第二反射镜10222，以及激光聚焦系统103时的光路图。
当时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023和第三光栅1024时，下面接着对激光切割系统中的压缩和空间色散系统102做详细描述，请参阅图8，图8为激光切割系统中时间压缩和空间色散系统102的另一个实施例示意图：
具体的，当时间压缩和空间色散系统102包括两个平行设置的且光栅参数相同的第二光栅1023和第三光栅1024时，第一光谱的光线在第二光栅1023和第三光栅1024之间的光程可调节。
作为一种可选的实施例，在调节第一光谱的光线在第二光栅1023和第三光栅1024之间的光程时，可以是设置用于调节第二光栅1023和第三光栅1024之间间距的调节装置1026，以通过调节调节装置1026，来调节第一光谱的光线在第二光栅1023和第三光栅1024之间的光程，从而达到补偿激光聚焦系统103对平行光谱所造成的时间色散。
为方便理解，图8给出了第二光栅1023和第三光栅1024都为透射光栅时，激光器的入射光束经过第二光栅1023和第三光栅1024的一种光路图。
作为另一种可选的实施例，在调节第一光谱的光线在第二光栅1023和第三光栅1024之间的光程时，还可以是设置轴位移平台1025，以及相互垂直设置的第一反射镜10221和第二反射镜10222，其中，轴位移平台1025与相互垂直设置的第一反射镜10221和第二反射镜10222相互连接，相互垂直设置的第一反射镜10221和第二反射镜10222用于将从第二光栅1023出射的第一光谱反向平行入射至所述第三光栅1024，以将第一光谱进行准直，得到准直后的平行光谱；
当调节轴位移平台1025时，可以调节第一光谱的光线在第二光栅1023、第一反射镜10221和第二反射镜10222、和第三光栅1024之间的光程，以用于补充激光聚焦系统103对平行光谱造成的时间色散。
作为一种可选的实施方式，轴位移平台1025设置在与第一光谱的光线平行的方向上。
为方便理解，图9给出了第二光栅1023和第三光栅1024都为透射光栅时，激光器的入射光束经过第二光栅1023、第一反射镜10221和第二反射镜10222，以及第三光栅1024的一种光路图。
因为本申请实施例中的激光切割系统，可以通过调节装置或轴位移平台，来调节第一光谱的光线在第二光栅1023和第三光栅1024之间的光程，从而补偿激光聚焦系统103对平行光谱的时间色散，故本申请实施例中在焦点上聚焦的光斑可以实现在“时空双聚焦效应”在焦点处很小的范围内产生极高的峰值光强，以对样品下表面预设深度的待切割处进行切割。
基于图9所述的实施例，下面接着对本申请实施例中的激光切割系统进行描述，请参阅图10，图10为本申请实施例中激光切割系统的另一个实施例：
为了节约激光切割系统所占用的空间体积，即为了实现激光切割系统的小型化，本申请实施例中的时间压缩和空间色散系统102还包括：
同轴设置的第一小孔1027和第三反射镜1028，其中，第一小孔1027用于对激光101器的入射光束进行准直，第三反射镜1028用于将准直后的激光器的入射光束反射至第二光栅，以用于节省激光切割系统所占用的空间体积。
为了进一步实现激光切割系统的小型化，作为一种可选的实施例，本申请实施例中的时间压缩和空间色散系统102还包括：
同轴设置的第二小孔1029和第四反射镜1030，其中，第四反射镜1030用于将从第三光栅1024出射的平行光谱反射至第二小孔1029，第二小孔1029用于对平行光谱进行准直，并将准直后的平行光谱入射至激光聚焦系统103。
作为一种可选的实施例，激光切割系统还包括：第五反射镜104，
其中，第五反射镜104设置于时间压缩和空间色散系统102和激光聚焦系统103之间，以用于改变平行光谱的入射光方向，使得改变方向后的平行光谱入射至激光聚焦系统103。
进一步，在进行激光切割时，需要将激光的光斑聚焦在一块尽可能小的光斑上，以提高单位面积上的激光能量密度，且本申请实施例中要求激光在焦点附近的能量衰落的较快，也即本申请实施例中要求激光聚焦系统103聚焦后的 光斑较小且光腰较短，故本申请实施例中的激光聚焦系统103要求有较大的数值孔径，作为一种可选的实施例，本申请实施例中激光聚焦系统的数值孔径一般不小于0.25。
进一步，为了实现对样品的固定，本申请实施例中的激光切割系统还包括样品支架105、三轴位移平台106，其中，样品支架用于固定样品，而三轴位移平台用于在三维空间内条件样品支架的位置。
而为了实现对三轴位移平台106和激光器101的精确控制，本申请实施例中的激光切割系统还可以包括：数控系统107，该数控系统107用于控制激光器和三轴位移平台在三维空间内的移动。
具体的，本申请实施例中的激光切割系统在对样品进行切割时，数控系统控制激光器在单位时间内输出脉冲的个数平均分配在三轴位移平台沿三维空间内任一方向在单位时间内的位移量内。
为方便理解，下面举例说明：
假设激光器在单位时间内(1ns)输出的激光脉冲个数为3，而三维位移平台沿x轴方向匀速运动，且三维位移平台在单位时间内(1ns)内移动的距离为1mm,则本申请实施例中则要求激光器在三维位移平台沿X轴方向上的位移为0mm时，输出第一个脉冲，沿X轴方向上的位移为1/3mm时,输出第二个脉冲，而在沿X轴方向上的位移为2/3mm时,输出第三个脉冲。
作为一种可选的实施例，本申请实施例中的样品一般为透明材料，如金刚石、石英、刚玉和金红石等。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (16)

  1. 一种激光切割系统，其特征在于，包括：
    激光器，时间压缩和空间色散系统，以及激光聚焦系统；
    其中，所述激光器用于提供入射光束，所述激光器的谱宽不小于1nm，且所述激光器具有可调节的正色散；
    所述时间压缩和空间色散系统，包括第一光栅和相互垂直设置的第一反射镜和第二反射镜，或两个平行设置的且光栅参数相同的第二光栅和第三光栅，其中，所述时间压缩和空间色散系统用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，对所述第一光谱进行准直，以得到准直后的平行光谱；
    所述激光聚焦系统，用于将所述平行光谱进行聚焦，并将聚焦后的光斑入射至样品下表面预设深度的的待切割处。
  2. 根据权利要求1所述的激光切割系统，其特征在于，若所述时间压缩和空间色散系统包括第一光栅和相互垂直设置的第一反射镜和第二反射镜，则所述第一光栅用于对所述入射光束进行空间色散，以得到在空间上分开的第一光谱，所述相互垂直设置的第一反射镜和第二反射镜用于将所述第一光谱反射至所述第一光栅，以对所述第一光谱进行准直，以得到准直后的平行光谱。
  3. 根据权利要求2所述的激光切割系统，其特征在于，所述第一光栅为透射光栅或反射光栅；
    所述时间压缩和空间色散系统还包括：轴位移平台，所述轴位移平台与相互垂直设置的第一反射镜和第二反射镜相互连接；
    其中，相互垂直设置的第一反射镜和第二反射镜用于将从所述第一光栅出射的第一光谱反向平行入射至所述第一光栅；
    调节所述轴位移平台，以调节第一光谱的光线在所述第一光栅和相互垂直设置的第一反射镜和第二反射镜之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
  4. 根据权利要求1所述的激光切割系统，其特征在于，若所述时间压缩和空间色散系统包括两个平行设置的且光栅参数相同的第二光栅和第三光栅，则所述第二光栅用于对所述入射光束进行空间色散，以得到在空间上分开的第 一光谱，所述第三光栅用于对所述第一光谱进行准直，以得到准直后的平行光谱。
  5. 根据权利要求4所述的激光切割系统，其特征在于，第一光谱的光线在所述第二光栅和所述第三光栅之间的光程可调节。
  6. 根据权利要求5所述的激光切割系统，其特征在于，所述时间压缩和空间色散系统还包括调节所述第二光栅和第三光栅之间间距的调节装置；
    调节所述调节装置，以调节第一光谱的光线在所述第二光栅和所述第三光栅之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
  7. 根据权利要求5所述的激光切割系统，其特征在于，所述时间压缩和空间色散系统还包括轴位移平台和相互垂直设置的第一反射镜和第二反射镜，所述轴位移平台和所述相互垂直设置的第一反射镜和第二反射镜相互连接；
    其中，相互垂直设置的第一反射镜和第二反射镜用于将从所述第二光栅出射的第一光谱反向平行入射至所述第三光栅；
    调节所述轴位移平台，以调节第一光谱的光线在所述第二光栅、所述第一反射镜和所述第二反射镜，以及所述第三光栅之间的光程，以用于补偿所述激光聚焦系统对所述平行光谱造成的时间色散。
  8. 根据权利要求1所述的激光切割系统，其特征在于，所述第二光栅和所述第三光栅都为反射光栅；或，
    所述第二光栅和所述第三光栅都为透射光栅；或，
    所述第二光栅和所述第三光栅中的一个为反射光栅，另一个为透射光栅。
  9. 根据权利要求3或7所述的激光切割系统，其特征在于，所述时间压缩和空间色散系统还包括：
    同轴设置的第一小孔和第五反射镜，所述第一小孔用于对所述激光器的入射光束进行准直，所述第五反射镜用于将准直后的激光器的入射光束反射至所述第二光栅。
  10. 根据权利要求9所述的激光切割系统，其特征在于，所述时间压缩和空间色散系统还包括：
    同轴设置的第二小孔和第六反射镜，所述第六反射镜用于将从第三光栅出 射的平行光谱反射至所述第二小孔，所述第二小孔用于对所述平行光谱进行准直，并使得准直后的平行光谱入射至所述激光聚焦系统。
  11. 根据权利要求1所述的激光切割系统，其特征在于，所述激光切割系统还包括：
    第七反射镜，所述第七反射镜设置于所述时间压缩和空间色散系统，与所述激光聚焦系统之间，以用于改变所述平行光谱的入射光方向，使得改变方向后的平行光谱入射至所述激光聚焦系统。
  12. 根据权利要求1所述的激光切割系统，其特征在于，调节所述激光器的正色散量，以用于补偿所述第一光栅，或，所述第二光栅和所述第三光栅对所述激光器的入射光束造成的负色散量。
  13. 根据权利要求1所述的激光切割系统，其特征在于，所述激光聚焦系统的数值孔径不小于0.25。
  14. 根据权利要求1所述的激光切割系统，其特征在于，所激光切割系统还包括：
    样品支架和三轴位移平台，其中，所述样品支架和所述三轴位移平台相互连接，所述样品支架用于固定所述样品，所述三轴位移平台用于在三维空间内调节所述样品支架。
  15. 根据权利要求1所述的激光切割系统，其特征在于，所述样品为透明材料，所述透明材料包括金刚石，所述激光器包括纳秒激光器、飞秒激光器或皮秒激光器。
  16. 根据权利要求14或15所述的激光切割系统，其特征在于，所述激光切割系统还包括数控系统，所述数控系统用于控制所述激光器及所述三轴位移平台在三维空间内的移动；
    其中，在切割所述样品时，所述数控系统控制所述激光器在单位时间内输出脉冲的个数平均分配在所述三轴位移平台沿三维空间内任一方向在单位时间内的位移量内。
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CN107529467A (zh) * 2017-08-21 2018-01-02 成都莱普科技有限公司 一种硅基mems晶圆多焦点激光切割系统及切割方法
CN107727250A (zh) * 2017-09-06 2018-02-23 中国科学院上海光学精密机械研究所 光栅波前倾斜色散补偿装置
CN113745951A (zh) * 2020-05-27 2021-12-03 深圳市欧凌镭射科技有限公司 一种激光器

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