WO2023234414A1 - Method for bonding substrates containing polymers on surfaces thereof, bonding apparatus, and laminate - Google Patents

Abstract

Provided are: a method for bonding substrates containing polymers on the surfaces thereof; a bonding apparatus; and a laminate, applicable to high-frequency circuits in which substrates containing polymers on the surfaces thereof are firmly bonded with each other at low temperatures. The method for bonding substrates containing polymers on the surfaces thereof comprises: forming a precursor layer by radiating a first ultraviolet ray in a state in which a certain concentration of a crosslinking substance is present on one or both of the bonding surface of a first substrate 61 and the bonding surface of a second substrate 62; and bringing the first substrate and the second substrate into contact with each other to bond the first substrate 61 and the second substrate 62 via the precursor layer.

Description

Bonding method, bonding device, and laminate for substrates containing polymer on the surface

The present invention relates to a method for joining substrates containing a polymer on the surface, a joining device, and a laminate.

Polyimide (PI) film is used as an insulating material for flexible printed wiring boards (FPC) due to its excellent heat resistance, flexibility, and electrical insulation properties. Flexible copper clad laminates (FCCL) are used to manufacture flexible printed wiring boards, and sputtering, which is a dry method, is one of the methods for metalizing the polyimide surface, especially for flexible printed wiring boards that require fine circuit formation. It is used.

With the miniaturization and higher performance of mobile information terminals such as smartphones, there is a strong demand for lighter, thinner, shorter and smaller flexible printed wiring boards, fine pattern circuit formation, and lower costs. In particular, insulating materials used as base materials for flexible printed wiring boards must be materials that can be used in high-frequency circuits, but materials that have good properties in high-frequency circuits are generally expensive, so manufacturing costs are high. There is an issue of becoming. Therefore, consideration has been given to forming a laminate based on conventional materials and joined with materials that have good characteristics in high-frequency circuits. Therefore, there is a need to firmly join these materials together at low cost.

On the other hand, a technique using an organic adhesive has been developed to bond and laminate polymer films at low temperatures (Patent Document 1). When using organic adhesives, under special environments such as vacuum, the organic solvent evaporates from the adhesive layer of the final product over time, which reduces the mechanical strength of the joint. may occur. Furthermore, there is a risk that defects such as bubbles may occur, lowering the yield and increasing the final cost.

Japanese Patent Application Publication No. 2008-150550

In order to solve the above-mentioned problems, the present invention provides a method for bonding substrates containing a polymer on the surface, which can be used in a high frequency circuit to firmly bond substrates containing a polymer on the surface at low temperatures. An object of the present invention is to provide a bonding device, and a laminate.

In order to solve the above problems, the present invention employs the following means.
That is, the method of bonding a substrate containing a polymer to the surface of the present invention involves applying a certain concentration to either or both of the bonding surface of the first substrate and the bonding surface of the second substrate. irradiating with a first ultraviolet ray in the presence of a crosslinking substance to form a precursor layer; bringing the first base material and the second base material into contact with each other to form a precursor layer through the precursor layer; The method includes joining the first base material and the second base material.
According to this invention, the first ultraviolet rays are irradiated in a state where a certain concentration of the crosslinking substance is present on either or both of the bonding surface of the first base material and the bonding surface of the second base material. Since a precursor layer is formed, the first base material and the second base material are brought into contact with each other through this precursor layer, thereby firmly joining the first base material and the second base material. can do.

Another aspect of the present invention is a method for bonding a base material containing a polymer to a surface of the first base material and/or both of the bonding surface of the first base material and the bonding surface of the second base material. forming an insulating film on the bonding surface of the first base material and the bonding surface of the second base material in a state where a certain concentration of a crosslinking substance is present on either or both of the bonding surface of the first base material and the bonding surface of the second base material; irradiating ultraviolet rays to form a precursor layer, bringing the first base material and the second base material into contact with each other, and forming the first base material and the second base material through the precursor layer; This includes joining the base material.
According to this invention, an insulating film is formed on one or both of the bonding surface of the first base material and the bonding surface of the second base material, and further, the insulating film is formed on the bonding surface of the first base material and the bonding surface of the second base material. , a precursor layer is formed on one or both of the bonding surfaces of the second base material, so that the first base material and the second base material are brought into contact via this precursor layer. This allows the first base material and the second base material to be joined more firmly.

In one aspect of the present invention, before forming the precursor layer, a second base material is applied to one or both of the bonding surface of the first base material and the bonding surface of the second base material. irradiating with ultraviolet rays,
including.
In this embodiment, before forming the precursor layer, one or both of the bonding surface of the first base material and the bonding surface of the second base material is irradiated with the second ultraviolet rays. The surface on which the body layer is formed can be cleaned.

In one aspect of the present invention, before forming the insulating film, a third bonding surface is applied to one or both of the bonding surface of the first base material and the bonding surface of the second base material. irradiating with ultraviolet light,
including.
In this aspect, before forming the insulating film, either or both of the bonding surface of the first base material and the bonding surface of the second base material is irradiated with the third ultraviolet rays, so that the insulating film can be insulated. The surface on which the film is to be formed can be cleaned.

In one aspect of the present invention, forming the precursor layer and bonding are performed in an environment with controlled oxygen concentration and water concentration.
In this embodiment, the formation of the precursor layer and the bonding are performed in an environment where the oxygen concentration and water concentration are controlled, so that an environment suitable for each step can be prepared.

In one aspect of the present invention, the oxygen concentration and water concentration are controlled in vacuum or in an inert gas atmosphere.
In this embodiment, the oxygen concentration and moisture concentration are controlled in a vacuum or an inert gas atmosphere, so that an appropriate environment for controlling the oxygen concentration and moisture concentration can be created.

In one aspect of the present invention, the first and second base materials include LCP (liquid crystal polymer), PFA (tetrafluoroethylene perfluoroalkyl vinyl ether copolymer), PTFE (polytetrafluoroethylene), COP (cyclo Olefin polymer), PPS (polyphenylene sulfide), PEEK (polyether ether ketone), PI system (including PI (polyimide), MPI (modified polyimide)), PPE system (PPE (polyphenylene ether), mPPE (modified polyphenylene ether)) ), a graphite sheet, or a laminate of a combination thereof.
In this embodiment, an appropriate material can be selected for the base material.

In one aspect of the present invention, the first and second base materials are base materials having a circuit coated with an organic substance.
In this embodiment, even if the base material has a circuit, a laminate can be formed in the same manner as described above using a coated organic substance.

In one aspect of the present invention, the first and second base materials are base materials that include a conductive region on at least a portion of the surface.
In this embodiment, since the base materials including a conductive region on at least a portion of the surface are bonded, it is possible to form a laminate in which circuits of the base materials are connected to each other.

In one aspect of the invention, the crosslinking substance is any one or any combination selected from the group consisting of ammonia, primary alcohols, and secondary alcohols.
In this embodiment, a suitable crosslinking material can be selected.

In one aspect of the present invention, the first ultraviolet ray, the second ultraviolet ray, and the third ultraviolet ray have a main wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm. It is a combination of these.
In this embodiment, appropriate main wavelengths can be selected as the first ultraviolet ray, the second ultraviolet ray, and the third ultraviolet ray.

The bonding apparatus of the present invention includes a chamber that can freely control the atmospheric pressure, an inert gas supply pipe that supplies an inert gas to the chamber, an ultraviolet irradiation mechanism, a crosslinking substance spraying mechanism, and a crosslinking substance spraying mechanism that are arranged in the chamber. A mechanism.
According to the present invention, it is possible to provide a bonding device that can firmly bond substrates containing polymers on their surfaces at low temperatures.

A laminate in which a first base material containing a polymer on the surface, a crosslinked layer, and a second base material containing a polymer on the surface are laminated in this order.
According to the present invention, it is possible to provide a laminate that can be used in a high frequency circuit by bonding base materials containing a polymer on the surface.

According to the present invention, there is provided a joining method, a joining device, and a laminate for substrates containing a polymer on the surface, which can be used in a high-frequency circuit that firmly joins substrates containing a polymer on the surface at low temperatures. can be provided.

It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. It is a schematic diagram explaining the joining process of the 1st base material and the 2nd base material based on embodiment of this invention. FIG. 1 is a schematic perspective view of a joining device according to an embodiment of the present invention. FIG. 1 is a perspective view of a base material supported by a base material supporter according to an embodiment of the present invention. FIG. 1 is a perspective view of a base material supported by a base material supporter according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is an enlarged perspective view of main parts of a joining device according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of a laminate according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of a laminate according to an embodiment of the present invention.

<First embodiment>
FIGS. 1 to 5 are schematic diagrams illustrating a process of joining a first base material and a second base material according to the first embodiment of the present invention. With reference to these figures, the process of joining the first base material and the second base material according to the present embodiment will be described.
(Joining process 1-1. Preparation of first base material and second base material)
As shown in FIG. 1, a first base material 61 and a second base material 62 containing a polymer on their surfaces are prepared.

(Joining process 1-2. Formation of precursor layer using ultraviolet rays)
Next, as shown in FIG. 2, a state in which a certain concentration of the crosslinking substance 4 is present on either or both of the bonding surface 61a of the first base material 61 and the bonding surface 62a of the second base material 62. irradiate with the first ultraviolet light 5. In this embodiment, the first ultraviolet ray 5 is irradiated on both the bonding surface 61a of the first base material 61 and the bonding surface 62a of the second base material 62 in a state where a certain concentration of the crosslinking substance 4 is present. As shown in FIG. 3, by irradiation with the first ultraviolet ray 5, precursor layers 61a, 61a are formed on the surfaces of both base materials 61, 62.

(Joining process 1-3. Joining of first base material and second base material)
The first base material 61 and the second base material 62 on which the precursor layers 61b, 61b are formed are brought into contact with each other so that the precursor layers 61b, 61b face each other, as shown in FIG. As shown in FIG. 5, a crosslinked layer 41 is formed by the contact between the precursor layers 61b and 61b, and the first base material 61 and the second base material 62 are joined by the crosslinked layer 41. In this way, it is possible to obtain a laminate 1 in which the first base material 61, the crosslinked layer 41, and the second base material 62 are laminated in this order. During the bonding in this step, the laminate 1 may be heated, and by heating, the bonding strength can be further improved.

(Process environment)
Forming the precursor layer 61b and bonding the first base material 61 and the second base material 62 are performed in an environment with controlled oxygen concentration and water concentration. This control of oxygen concentration and moisture concentration may be performed in vacuum or in a nitrogen atmosphere. Alternatively, other inert gases may be selected instead of nitrogen. As the inert gas, for example, mixtures of nitrogen, helium, neon, argon, and any combination thereof may be selected.

(First base material, second base material)
In this embodiment, the first base material 61 and the second base material 62 are LCP (liquid crystal polymer), PFA (tetrafluoroethylene perfluoroalkyl vinyl ether copolymer), PTFE (polytetrafluoroethylene), COP (cycloolefin polymer), PPS (polyphenylene sulfide), PEEK (polyether ether ketone), PI system (including PI (polyimide), MPI (modified polyimide)), PPE system (PPE (polyphenylene ether), mPPE (modified) (including polyphenylene ether), graphite sheets, or laminates of combinations thereof. These materials may be selected based on desired high frequency circuit properties, gas permeation properties, moisture proof properties, etc. The polymer of the present invention includes not only a polymer film but also a graphite sheet obtained by sintering the film at high temperature.

(Crosslinked substance)
The crosslinking substance present during ultraviolet irradiation may be any one selected from the group consisting of ammonia, primary alcohols, and secondary alcohols, or any combination thereof. These crosslinked substances upon irradiation with ultraviolet rays may be in a gaseous state, a mist (droplets), or a mixture thereof. The above-mentioned alcohol compound is preferably one that is considered to be likely to generate hydroxyl radicals and CH radicals when irradiated with ultraviolet rays due to the bonding action described below, and as a result, to easily generate carboxyl groups. In particular, the alcohol compound preferably has 1 to 5 carbon atoms. Such alcohol compounds include methanol, ethanol, 1-propanol, 1-butanol, 1-pentanol, 2-propanol, 2-butanol, 2-pentanol, isobutyl alcohol, isoamyl alcohol, tert-butyl alcohol, and tert-butyl alcohol. - Examples include amyl alcohol. Among these, primary alcohols having 1 to 5 carbon atoms are preferable, and primary alcohols having 2 to 5 carbon atoms are preferred because they are less harmful (hardly producing harmful formaldehyde, formic acid, etc. in the human body). More preferred are primary alcohols, ethanol, 1-propanol, 1-butanol, or 1-pentanol are even more preferred, ethanol and 1-propanol are particularly preferred, and ethanol is most preferred.

(ultraviolet light)
The ultraviolet rays irradiated in the presence of a certain concentration of the crosslinking substance may have a dominant wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm. As the ultraviolet source including these wavelengths, one having a desired wavelength can be appropriately selected, such as a low-pressure mercury lamp, a high-pressure mercury lamp, an excimer lamp, and a deep ultraviolet LED.

(Precursor layer and crosslinked layer)
For example, when the base materials 61 and 62 are polyimide, the precursor layer 61b of the first base material 61 and the second base material 62 contains a crosslinkable polymer as shown in [Chemical formula 1] below. It has a structure. The broken line RR in the figure represents the vicinity of the surfaces of the base materials 61 and 62. In the figure, the terminal end of A represents -C(=O)-OH or -CH ₃ .

As shown in [Chemical Formula 1], most of the terminal ends of the alkyl chain crosslinks are -C(=O)-OH or -CH ₃ . As shown in [Chemical Formula 2] (A-1) below, when one end D and the other end E come close to each other, H ₂ O is separated and the two ends are bonded via the O atom (B-1 ). Furthermore, as shown in (A-2), in the case of CH ₃ group, it also bonds with the OH group coming from the other side, H ₂ O leaves in the same way, and both ends bond through the O atom (B- 1). The dashed line in the formula represents a hydrogen bond. Although the bonds with oxygen O in formula (B-1) can be hydrolyzed, they are reversible since they are decomposed to -C(=O)-O-H, or -CH ₃ . Therefore, even if decomposition occurs, recombination occurs at the same time, and mutual bonds are maintained.

As described above, in the method of joining the first base material and the second base material containing a polymer on the surface in this embodiment, a selected alcohol is selected from the group consisting of ammonia, primary alcohol, and secondary alcohol. A precursor layer is formed by irradiating ultraviolet rays in the presence of a certain concentration of a crosslinking material or a combination thereof. By bringing these precursor layers into contact, a cross-linked layer is formed, and the first base material and the second base material are bonded via this cross-linked layer. It is possible to provide a joining method that firmly joins materials at low temperatures. The first base material and the second base material are LCP (liquid crystal polymer), PFA (tetrafluoroethylene perfluoroalkyl vinyl ether copolymer), PTFE (polytetrafluoroethylene), COP (cycloolefin polymer), PPS. Any of the following: Since the material can be selected from a polymer film, a graphite sheet, or a laminate of a combination thereof, it is possible to appropriately select one that can be used in a high frequency circuit. Therefore, it is possible to provide a method for joining base materials whose surfaces contain a polymer, which can be used in a high frequency circuit that firmly joins a first base material and a second base material at low temperatures.

<Second embodiment>
Next, a second embodiment of the present invention will be described. The second embodiment differs from the first embodiment in that, as shown in FIGS. 2 and 3, before forming the precursor layers 61b and 61b of the first base material 61 and the second base material 62, As shown in FIG. 6, one or both of the bonding surface 61a of the first base material 61 and the bonding surface 62a of the second base material 62 is irradiated with second ultraviolet rays 8. In this embodiment, both the bonding surface 61a of the first base material 61 and the bonding surface 62a of the second base material 62 are irradiated with the second ultraviolet rays 8. The steps other than this are the same as those in the first embodiment. In addition to the first embodiment, by adding this step, in addition to the effects of the first embodiment, the bonding surface 61a of the first base material 61 before the formation of the precursor layers 61b, 61b, and the second The surface condition of the joint surface 62a of the base material 62 is improved by removing moisture and impurities from the surface, and the first base material 61 and the precursor layer 61b, and the second base material 62 and the precursor layer 61b and the film quality of the precursor layers 61b, 61b are improved, and as a result, the bonding strength between the first base material 61 and the second base material 62 can be improved. Note that the second ultraviolet ray 8 may have a dominant wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm.

<Third embodiment>
FIG. 1 and FIGS. 7 to 11 are schematic diagrams illustrating a process of joining a first base material and a second base material according to a third embodiment of the present invention. With reference to these figures, the process of joining the first base material and the second base material according to the present embodiment will be described.
(Joining process 3-1. Preparation of first base material and second base material)
As shown in FIG. 1, a first base material 61 and a second base material 62 are prepared.
(Joining process 3-2. Insulating film formation)
As shown in FIG. 7, an insulating film 61c is formed on either or both of the bonding surface 61a of the first base material 61 and the bonding surface 62a of the second base material 62. In this embodiment, an insulating film 61c is formed on both bonding surfaces 61a and 62a. The method for forming the insulating film 61c may be appropriately selected depending on the desired characteristics of the insulating film 61c, such as ion beam sputtering, ALD, magnetron sputtering, or CVD.

(Joining process 3-3. Ultraviolet irradiation)
Next, as shown in FIG. 8, the first base material 61 and the second base material 62 are bonded in a state where a certain concentration of the crosslinking substance 4 is present on either or both of the joint surfaces. 1 UV rays 5 are irradiated. In this embodiment, the first ultraviolet ray 5 is irradiated on the insulating film 61c on both the bonding surface of the first base material 61 and the bonding surface of the second base material 62 in the presence of a constant concentration of the crosslinking substance 4. do. As shown in FIG. 9, a precursor layer 61b is formed by irradiation with the first ultraviolet ray 5.

(Joining process 3-4. Joining of first base material and second base material)
The first base material 61 and the second base material 62 on which the precursor layers 61b, 61b are formed are brought into contact with each other so that the precursor layers 61b face each other, as shown in FIG. As shown in FIG. 11, a crosslinked layer 41 is formed by the contact between the precursor layers 61b, and the first base material 61 and the second base material 62 are joined by the crosslinked layer 41. In this way, it is possible to obtain a laminate 10 in which the first base material 61, the insulating film 61c, the crosslinked layer 41, the insulating film 61c, and the second base material 62 are laminated in this order. During the bonding in this step, the laminate 10 may be heated, and by heating, the bonding strength can be further improved.

This embodiment differs from the first embodiment in that an insulating film 61c is formed between the first base material 61 and the crosslinked layer 41 and between the second base material 62 and the crosslinked layer 41. be. Other steps are the same as in the first embodiment. For example, like the first embodiment, the first ultraviolet ray 5 used in this embodiment may have a dominant wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm. . The material, structure, type of crosslinking substance, etc. of the first base material 61 and the second base material 62 are the same as those in the first embodiment. Further, the structure of the precursor layer 61b formed on the insulating film 61c is the same as [Chemical formula 1] of the first embodiment, and the formation (bonding) of the bridge layer 41 is performed using the alkyl This is due to the same effect as [Chemical formula 2], which explains bonding due to the release of H ₂₀ from contact with -C(=O)-O-H or -CH ₃ , which is the terminal of chain crosslinking.

As described above, in this embodiment, when bonding the first base material 61 and the second base material 62, the insulating films 61c, 61c are formed on the bonding surfaces 61a, 62a, and the insulating films 61c, 61c are Precursor layers 61b, 61b are formed thereon. Since the first base material 61 and the second base material 62 are joined by joining the precursor layers 61b, 61b on these insulating films 61c, 61c, the precursor layers 61b, 61b made of the same material, The crosslinked layer 41 formed by the crosslinked layer 61b can be bonded relatively easily, and therefore the bonding strength between the first base material 61 and the second base material 62 can be improved.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described. The fourth embodiment differs from the third embodiment in that, as shown in FIGS. 8 and 9, before forming the precursor layer 61b of the insulating film 61c, as shown in FIG. The second ultraviolet ray 8 is applied to one or both of the insulating film 61c on the bonding surface 61a side of the second base material 61 and the insulating film 61c on the bonding surface 62a side of the second base material 62. In this embodiment, the second ultraviolet ray 8 is irradiated onto both the insulating films 61c, 61c. The steps other than this are the same as in the third embodiment. By adding this step in addition to the third embodiment, in addition to the effects of the third embodiment, the surface condition is improved by removing moisture and impurities on the surface of the insulating film 61c before forming the precursor layer 61b. The bonding between the insulating film 61c and the precursor layer 61b and the film quality of the precursor layer 61b are improved, and as a result, the bonding strength between the first base material 61 and the second base material 62 is improved. can be improved. Note that the second ultraviolet ray 8 may have a dominant wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm.

<Fifth embodiment>
Next, a fifth embodiment of the present invention will be described. The fifth embodiment differs from the third embodiment in that, as shown in FIG. 7, before forming the insulating film 61c, as shown in FIG. This is to irradiate one or both of the joint surfaces 62a of the base material 62 with the third ultraviolet rays 9. In this embodiment, both the joint surface 61a of the first base material 61 and the joint surface 62a of the second base material 62 are irradiated with the third ultraviolet ray 9. The steps other than this are the same as in the third embodiment. In addition to the third embodiment, by adding this step, in addition to the effects of the third embodiment, the bonding surface 61a of the first base material 61 and the second base material 62 before the formation of the insulating film 61c are The surface condition of the surface with the bonding surface 62a is improved by removing moisture and impurities, etc., and the bonding between the first base material 61 and the insulating film 61c and the bonding between the second base material 62 and the insulating film 61c is performed. , and the film quality of the insulating films 61c, 61c are improved, and as a result, the bonding strength between the first base material 61 and the second base material 62 can be improved. Note that the third ultraviolet ray 9 may have a dominant wavelength of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, or 308 nm.

<Sixth embodiment>
FIG. 14 is a perspective view of a joining device 200 according to a sixth embodiment of the present invention. 17 to 22 are enlarged perspective views of main parts of the joining device 200. The bonding apparatus 200 includes chambers 201a to 201f whose atmospheric pressure can be freely controlled, an inert gas supply source 202 that supplies inert gas to the chambers 201a to 201f, and an ultraviolet irradiation mechanism 203 disposed within the chambers 201a, 201c, and 201d. , a crosslinking substance spraying mechanism 204 disposed within a chamber 201d, and a bonding mechanism 209 disposed within a chamber 201e.

FIG. 15 shows a perspective view of the first base material 61 supported by the base material support 63. FIG. 16 shows a perspective view of the second base material 62 supported by the base material support 65. As shown in FIG. 14, the chambers 201a to 201f are connected by a gate valve 205. The gate valve 205 allows the first base material 61 and the second base material 62 to be transported between the chambers 201a-201f while keeping each chamber 201a-201f airtight by opening and closing the gate.

Each chamber 201a-201f is connected to an air pressure control source 215 via an air pressure control pipe 215a, and is connected to an inert gas supply source 202 via an inert gas supply pipe 202a. The atmospheric pressure control source 215 is constituted by, for example, a vacuum pump, an exhaust valve, etc., and freely controls the atmospheric pressure within each chamber 201a-201f. As the inert gas supplied from the inert gas supply source 202, for example, nitrogen, helium, neon, argon, and a mixture of any combination thereof can be supplied to each chamber. In FIG. 14, for conceptual explanation, the atmospheric pressure control source 215 is shown as being connected to each chamber 201a to 201f by an atmospheric pressure control pipe 215a, but each chamber 201a to 201f is independently connected to the atmospheric pressure control source 215. More specifically, an air pressure control source 215 is provided for each chamber 201a to 201f. Similarly, the supply of inert gas is performed independently for each chamber 201a-201f.

As shown in FIG. 17, the chamber 201a includes a gate valve 205 and an ultraviolet irradiation mechanism 203. The chamber 201a functions as a base material introduction and UV irradiation unit that introduces the base material into the bonding apparatus 200 and irradiates the bonding surface of the base materials 61 and 62 with ultraviolet rays. As shown in FIG. 18, the chamber 201b includes a gate valve 205 and an ion beam sputtering mechanism 207. The chamber 201b functions as an ion beam sputtering section that forms a thin film on the joint surface of the base materials 61 and 62 by ion beam sputtering.

As shown in FIG. 19, the chamber 201c includes a gate valve 205 and an ultraviolet irradiation mechanism 203. The chamber 201c functions as a UV irradiation unit that irradiates the joint surface of the base materials 61 and 62 with ultraviolet rays. As shown in FIG. 20, the chamber 201d includes a gate valve 205, an ultraviolet irradiation section 203, and a crosslinking substance spraying mechanism 204. The chamber 201d functions as a crosslinking substance spraying unit that sprays a crosslinking substance while irradiating the joint surface of the base materials 61 and 62 with ultraviolet rays.

As shown in FIG. 21, the chamber 201e includes a base material reversing mechanism 208 and a bonding mechanism 209. The base material reversing mechanism 208 includes a base material holding section 208a and a base material reversing section 208b. The joining mechanism 209 includes an upper pressing mechanism 209a, a lower pressing mechanism 209b, and a base material holding mechanism 209c. In the substrate chamber 201e, a substrate reversing mechanism 208 holds one substrate, inverts the other substrate and brings them into contact, and a bonding mechanism 209 joins the substrates 61 and 62. function as a department. As shown in FIG. 22, the chamber 201f includes a gate valve 205. The chamber 201f functions as a base material unloading section that transports the joined base materials 61 and 62 to the outside of the joining apparatus 200.

Next, the operation of the bonding apparatus 200 configured as described above will be explained. First, the first base material 61 is set in the chamber 201a (substrate introduction and UV irradiation section) with its joint surface facing downward. The gate valve 205 is closed, and after setting the chamber 201a to a desired atmosphere, the ultraviolet ray irradiation mechanism 203 irradiates the bonding surface of the first base material 61 with ultraviolet rays. After the ultraviolet irradiation is completed, the gate valve 205 is opened, the first base material 61 is transferred to the chamber 201b, and the gate valve 205 is closed. Further, a second base material 62 is set in the same manner as the first base material 61, and is subjected to the same processing as the first base material. Here, each chamber 201b-201f is set to a predetermined atmosphere.

The first base material 61 transported to the chamber 201b (ion beam sputtering section) is passed over the upper part of the chamber 201b by the ion beam sputtering mechanism 207 while the inside of the chamber 201b is in a desired atmosphere. An insulating film is formed on the surface. The gate valve 205 is opened and the first base material 61 on which the insulating film has been formed is transported to the chamber 201c. Subsequently, the second base material 62 is transported to the chamber 201b and subjected to the same treatment as the first base material 61.

The first base material 61 transported to the chamber 201c (UV irradiation unit) is irradiated with ultraviolet rays on its joint surface by the ultraviolet ray irradiation mechanism 203 while the inside of the chamber 201c is in a desired atmosphere. The first base material 61 that has been irradiated with ultraviolet light is transported to the chamber 201d with the gate valve 205 opened. Subsequently, the second base material 62 is transported to the chamber 201c and subjected to the same treatment as the first base material 61.

The first base material 61 transported to the chamber 201d (crosslinking substance spraying section) is sprayed with a crosslinking substance into the chamber 201d by the crosslinking substance spraying mechanism 204 while the inside of the chamber 201d is in a desired atmosphere. . The bonding surface of the first base material 61 is irradiated with ultraviolet light by the ultraviolet irradiation mechanism 203 in a state where a certain concentration of the crosslinking substance is present on the bonding surface. The first base material 61 that has been irradiated with ultraviolet light is transported to the chamber 201e with the gate valve 205 opened. Subsequently, the second base material 62 is transported to the chamber 201e and subjected to the same treatment as the first base material 61.

The first base material 61 conveyed to the chamber 201e (substrate joint part) is transferred to the base material holding part disposed above the base material reversing mechanism 208 while the inside of the chamber 201d is in a desired atmosphere. 208a and held there. Next, a second base material 62 that has undergone the same treatment as the first material 61 is transported to the chamber 201e. The second base material 62 is held by the material reversing section 208b of the material reversing mechanism 208 and is inverted 180 degrees so that the joint surface of the second base material 62 faces upward. The first base material 61 held above is lowered to the position of the second base material 62, their joint surfaces are brought into contact with each other, and the joint surfaces are brought into contact with each other to be integrated, and then transported to the joining mechanism 209.

In the joining mechanism 209, a first material 61 and a second base material 62 that are integrated are held in a base material holding mechanism 209c, and an upper pressurizing mechanism 209a located above the upper pressurizing mechanism 209a and a lower pressurizing mechanism located below it. Pressure is applied from both the upper and lower directions by the mechanism 209b. The upper pressurizing mechanism 209a and the lower pressurizing mechanism 209b are provided with heaters (not shown) to obtain a desired bonded state depending on the type of the first material 61 and the second base material 62. is heated to the desired temperature. By pressurizing the upper pressurizing mechanism 209a and the lower pressurizing mechanism 209b, the first material 61 and the second base material 62 are contacted and pressurized via the precursor formed on their respective joint surfaces, Ultimately, it becomes a crosslinked layer, and the first material 61 and the second base material 62 are firmly joined by this crosslinked layer. The first material 61 and the second base material 62, which have been joined and become one body, are transported to the chamber 201f.

After the gate valve 205 is closed, the joined first base material 61 and second base material 62 that have been transported to the chamber 201f (base material carrying out section) are returned to atmospheric pressure in the chamber 201d, and The bonding device 200 is carried out to the outside.

As described above, in the bonding apparatus 200 of this embodiment, the step of bonding the first base material 61 and the second base material 62 is sequentially performed in the chambers 201a to 201f in which the atmospheric pressure, moisture concentration, etc. are adjusted. be exposed. The bonding process consists of the following steps a) to f).
a) Ultraviolet irradiation of the bonding surface as pretreatment (chamber 201a),
b) Formation of insulating film (chamber 201b)
c) UV irradiation to the insulating film (chamber 201c)
d) Precursor layer formation by ultraviolet irradiation in the presence of a constant concentration of crosslinking substance (chamber 201d)
e) Bonding of base materials (chamber 201e)
f) Carrying out the joined base materials (chamber 201f)
Therefore, the laminate can be efficiently produced by sequentially performing the necessary steps.

Since the bonding apparatus 200 includes a chamber 201d that irradiates the bonding surface with ultraviolet rays while spraying the crosslinking substance with the crosslinking substance spraying mechanism 204, a precursor layer is formed on the bonding surface of the base materials 61 and 62, and this precursor layer is The base materials 61 and 62 can be firmly joined together at low temperature by the crosslinked layer formed by bringing the body layers into contact.

Note that if an insulating film is not required depending on the type of base material and the bonding state, step b) (champer 201b) may be omitted. Similarly, the ultraviolet irradiation in steps a) and c) may be omitted depending on the type of base material and the bonding state. Since the bonding device 200 is configured by connecting a plurality of chambers 201a to 201f, it may be configured by removing unnecessary chambers by combining bonding processes.

<Seventh embodiment>
FIG. 23 is a cross-sectional view of a laminate 300 according to a seventh embodiment of the present invention. The method for forming the laminate 300 in this embodiment is the same as in the first embodiment. The difference is that base materials 67, 67 in which an organic substance is coated on the circuit are used as the first base material and the second base material. As shown in FIG. 23, a base material 67 having a circuit coated with an organic substance has a circuit layer 67b formed on a substrate 67a, and an organic substance 67c coated on the circuit of the circuit layer 67b. . Other configuration functions are similar to those of the first embodiment, and have the same functions and effects as the first embodiment. According to this embodiment, even if the base materials include a circuit layer, the base materials 67 can be firmly bonded to each other at a low temperature by the crosslinked layer 41 adjacent to the organic substance 67a. Since bonding can be performed at low temperatures, a laminate can be formed without damaging the circuit.

<Eighth embodiment>
FIG. 24 is a cross-sectional view of a laminate 400 according to the eighth embodiment of the present invention. The method for forming the laminate 400 in this embodiment is the same as in the first embodiment. The difference is that base materials 69, 69 partially including conductive regions are used as the first base material and the second base material. As shown in FIG. 24, the base material 69 partially including a conductive region has a conductive region 69b penetrating the circuit layer 69a and electrically connecting the circuit layers 69a to each other. Other configuration functions are similar to those of the first embodiment, and have the same functions and effects as the first embodiment. According to this embodiment, even if the base materials include the circuit layer 69a, the crosslinked layer 41 can firmly join the base materials 69 to each other at a low temperature. Since bonding can be performed at low temperatures, a laminate can be formed without damaging the circuit. Further, the crosslinked layer 41 does not have a resistance so high as to inhibit electrical connection between the conductive regions 69b, so that the circuit layers 69a of the base material 69 can be electrically connected to each other.

Examples will be described below. [Table 1] is a summary of the data obtained by irradiating VUV (172 nm/185 nm) on the bonding surface in the atmosphere and measuring the contact angle and bonding strength as a result of changes in irradiation time. The contact angle is measured as a parameter to confirm that OH, CHO, COOH, etc. are formed. In Table 1 below, data was obtained for sample A without treatment, and then for samples B, C, D, and E, with different irradiation times of 60 sec, 120 sec, 180 sec, and 300 sec. A single 110W low-pressure mercury lamp used for VUV irradiation has an irradiation distance of 20 mm and an irradiation capacity of 30 mW/cm ² or more at a wavelength of 254 nm and 5 mW/cm ² or more at a wavelength of 185 nm. As can be seen from [Table 1], the contact angle decreases and the bonding strength increases by VUV irradiation. When the irradiation time was 120 seconds or more, both the contact angle and the bonding strength reached a constant value, indicating that sufficient bonding strength was obtained.

Regarding the description of the above specification, the scope of the claims encompasses numerous modifications to the embodiments without departing from the technical idea of the present invention. Accordingly, the embodiments disclosed herein are presented by way of example and should not be considered as limiting the scope of the invention.

1, 10, 300, 400 Laminated body 4 Crosslinked substance 41 Crosslinked layer 5 First ultraviolet ray 8 Second ultraviolet ray 9 Third ultraviolet ray 61 First base material 61a Bonding surface 61b of first base material Precursor layer 61c Insulating film 62 Second base material 62a Bonding surface 67 of second base material Base material 67b coated with an organic substance on the circuit Circuit (layer)
67c Organic substance 69 Base material 69b partially including a conductive region Conductive region 200 Bonding devices 201a to 201f Chamber 202a Inert gas supply pipe 203 Ultraviolet irradiation mechanism 204 Crosslinking substance spraying mechanism 209 Bonding mechanism

Claims (13)

1. A method for joining a substrate containing a polymer on the surface, the method comprising:
   A first ultraviolet ray is irradiated to form a precursor layer in a state where a certain concentration of a crosslinking substance is present on either or both of the bonding surface of the first base material and the bonding surface of the second base material. thing,
   joining the first base material and the second base material via the precursor layer by bringing the first base material and the second base material into contact;
   A method for joining a substrate having a surface containing a polymer.
2. A method for joining a substrate containing a polymer on the surface, the method comprising:
   forming an insulating film on one or both of the bonding surface of the first base material and the bonding surface of the second base material;
   A first ultraviolet ray is irradiated to form a precursor layer in a state where a certain concentration of crosslinking substance is present on either or both of the bonding surface of the first base material and the bonding surface of the second base material. to form,
   joining the first base material and the second base material via the precursor layer by bringing the first base material and the second base material into contact;
   A method for joining a substrate having a surface containing a polymer.
3. Before forming the precursor layer, irradiating one or both of the bonding surface of the first base material and the bonding surface of the second base material with a second ultraviolet ray;
   A method for joining a substrate containing a polymer on the surface according to claim 1 or 2, comprising:
4. Before forming the insulating film, irradiating either or both of the bonding surface of the first base material and the bonding surface of the second base material with a third ultraviolet ray;
   A method for joining a substrate containing a polymer on the surface according to claim 2, comprising:
5. The surface containing a polymer according to any one of claims 1 to 4, wherein forming the precursor layer and bonding are performed in an environment with controlled oxygen concentration and water concentration. How to join base materials.
6. The method for joining substrates containing a polymer on the surface according to claim 5, wherein the oxygen concentration and moisture concentration are controlled in a vacuum or an inert gas atmosphere.
7. The first and second base materials are polyimides containing liquid crystal polymer, tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer, polytetrafluoroethylene, cycloolefin polymer, polyphenylene sulfide, polyether ether ketone, polyimide, and modified polyimide. 7. The polymer on the surface of any one of claims 1 to 6, which is a laminate of a polyphenylene ether type, a polyphenylene ether type polymer film including a polyphenylene ether type, a modified polyphenylene ether type, a graphite sheet, or a combination thereof. A method for joining a base material containing.
8. The method for joining substrates containing a polymer on the surface according to any one of claims 1 to 6, wherein the first and second substrates are substrates having a circuit coated with an organic substance.
9. The base material containing a polymer on the surface according to any one of claims 1 to 6, wherein the first and second base materials are base materials that include a conductive region on at least a part of the surface. Joining method.
10. A polymer on the surface according to any one of claims 1 to 9, wherein the crosslinking substance is any one or any combination selected from the group consisting of ammonia, primary alcohol, and secondary alcohol. How to join the containing base materials.
11. The first ultraviolet ray, the second ultraviolet ray, and the third ultraviolet ray have a dominant wavelength of any one or a combination of 156 nm, 172 nm, 185 nm, 206 nm, 222 nm, 254 nm, 283 nm, and 308 nm. Item 11. A method for joining a substrate containing a polymer on the surface according to any one of Items 1 to 10.
12. A chamber that can freely control the atmospheric pressure,
    an inert gas supply pipe that supplies inert gas to the chamber;
    disposed within the chamber;
    an ultraviolet irradiation mechanism;
    a crosslinked substance spraying mechanism;
    A joining device comprising a joining mechanism.
13. A laminate in which a first base material containing a polymer on the surface, a crosslinked layer, and a second base material containing a polymer on the surface are laminated in this order.

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