WO2023234042A1 - 熱デバイス - Google Patents

熱デバイス Download PDF

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Publication number
WO2023234042A1
WO2023234042A1 PCT/JP2023/018497 JP2023018497W WO2023234042A1 WO 2023234042 A1 WO2023234042 A1 WO 2023234042A1 JP 2023018497 W JP2023018497 W JP 2023018497W WO 2023234042 A1 WO2023234042 A1 WO 2023234042A1
Authority
WO
WIPO (PCT)
Prior art keywords
communication path
metal tube
thermal device
container
internal space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/018497
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
清隆 中村
尚也 藤田
明彦 北川
明彦 舟橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to EP23815801.8A priority Critical patent/EP4534942A4/en
Priority to JP2024524329A priority patent/JP7846759B2/ja
Priority to CN202380040566.4A priority patent/CN119137437A/zh
Priority to US18/868,061 priority patent/US20250354759A1/en
Publication of WO2023234042A1 publication Critical patent/WO2023234042A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing

Definitions

  • the present disclosure relates to thermal devices.
  • Patent Document 1 discloses a heat pipe that includes a sealed container and a pipe for injecting a working fluid into the sealed container.
  • Patent Document 1 discloses that the closed container and the pipe are formed of a metal with excellent heat conductivity.
  • a thermal device includes a ceramic container, a fluid, and a metal tube.
  • the container has an interior space, an opening that connects with the interior space, and a communication path that connects the interior space and the opening.
  • a fluid is located in the interior space.
  • a part of the metal tube is inserted into the communication path, and the other part is closed.
  • FIG. 1 is a perspective view of a heat dissipation device according to an embodiment.
  • FIG. 2 is a diagram of the first member according to the embodiment viewed from the Z-axis negative direction side to the Z-axis positive direction.
  • FIG. 3 is a diagram of the second member according to the embodiment viewed from the Z-axis positive direction side in the Z-axis negative direction.
  • FIG. 4 is a diagram of the intermediate member according to the embodiment viewed from the Z-axis positive direction side to the Z-axis negative direction.
  • FIG. 5 is a diagram in which the first groove forming area and the second groove forming area are superimposed on the intermediate member.
  • FIG. 6 is a diagram for explaining the flow of fluid in the heat dissipation device according to the embodiment.
  • FIG. 6 is a diagram for explaining the flow of fluid in the heat dissipation device according to the embodiment.
  • FIG. 7 is a diagram for explaining the flow of fluid in the heat dissipation device according to the embodiment.
  • FIG. 8 is a sectional view taken along the line VIII-VIII in FIG.
  • FIG. 9 is a sectional view taken along the line IX-IX in FIG.
  • FIG. 10 is a schematic diagram showing an example of pressure welding of metal tubes.
  • FIG. 11 is a schematic diagram showing a first modification.
  • each of the drawings referred to below shows an orthogonal coordinate system in which the X-axis direction, Y-axis direction, and Z-axis direction that are orthogonal to each other are defined, and the positive Z-axis direction is the vertically upward direction. There are cases.
  • Patent Document 1 The technology described in Patent Document 1 has room for further improvement in terms of improving durability.
  • the present disclosure has been made in view of the above, and provides a thermal device with excellent durability.
  • a heat dissipation device that efficiently transfers heat from a high temperature part to a low temperature part using latent heat accompanying evaporation and condensation of a fluid (an example of a working liquid or a phase change substance) will be described. Specifically, the vapor chamber will be explained.
  • a thermal device may be referred to as a heat dissipation device.
  • FIG. 1 is a perspective view of a heat dissipation device according to an embodiment.
  • the heat dissipation device 1 may include a container 2.
  • the container 2 may be made of ceramic.
  • the container 2 may include a first member 10, a second member 20 and an intermediate member 30.
  • the first member 10, the second member 20, and the intermediate member 30 may all be plate-shaped, or the intermediate member 30 may be sandwiched between the first member 10 and the second member 20.
  • the container 2 may include a first reinforcing member 40 and a second reinforcing member 50.
  • the first reinforcing member 40 may be located on the upper surface (fifth surface) of the first member 10.
  • the first reinforcing member 40 may be, for example, a laminate of two reinforcing plates 40a and 40b.
  • the present invention is not limited to this, and the first reinforcing member 40 may be made of a single reinforcing plate.
  • the second reinforcing member 50 may be located on the lower surface (sixth surface) of the second member 20.
  • the second reinforcing member 50 may be, for example, a laminate of two reinforcing plates 50a and 50b.
  • the present invention is not limited to this, and the second reinforcing member 50 may be made of a single reinforcing plate.
  • the container 2 does not necessarily need to have the first reinforcing member 40 and the second reinforcing member 50.
  • the container 2 may have an operating area 100 and a frame area 200.
  • the operating region 100 may be an internal space formed in the container 2, and a fluid as a phase change substance may be sealed in this internal space.
  • a fluid for example, a liquid such as water, a hydrocarbon compound, an organic liquid (such as ethanol and methanol), or ammonia may be used.
  • the shape of the operating region 100 when the container 2 is viewed from a direction perpendicular to the top surface of the container 2 may be circular.
  • the actuation area 100 may have a cylindrical shape.
  • the cross-sectional area of the portion where the communication path 60 and the actuation area 100 connect which will be described later, becomes larger than when the actuation area 100 has a rectangular shape in plan view.
  • the injection of gas and the exhaust of gas within the working area 100 can be performed more efficiently.
  • the frame area 200 may be an area surrounding the operating area 100.
  • the frame region 200 may be a region outside the operating region 100 of the heat dissipation device 1 .
  • the working area 100 may be generally hollow, whereas the frame area 200 may be generally solid.
  • the frame region 200 is configured such that fluid or fluid vapor leaks from the interface between the first member 10 and the intermediate member 30 or the interface between the second member 20 and the intermediate member 30, or the external atmosphere leaks from the interface.
  • This area is deliberately formed wide in order to reduce the possibility of entering the internal space of the operating area 100 (that is, to ensure airtightness).
  • the fluid may be filled, for example, at a rate of 10% by volume or more and 95% by volume or less with respect to the total volume of the internal space of the operating region 100.
  • the above ratio may be 30% by volume or more and 75% by volume or less. More preferably, the above ratio may be 40 volume % or more and 65 volume % or less.
  • the remainder of the internal space of the operating region 100 other than the fluid may be in a vacuum state or a low pressure state containing a portion of the vaporized fluid.
  • the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50 may be made of ceramic.
  • the ceramics constituting the first member 10, second member 20, intermediate member 30, first reinforcing member 40, and second reinforcing member 50 include alumina (Al 2 O 3 ), zirconia (ZrO 2 ), and silicon carbide. (SiC), silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), cordierite (Mg 2 Al 3 (AlSi 5 O 18 )), silicon-impregnated silicon carbide (SiSiC), etc. may be used.
  • the ceramic that constitutes the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50 may be a single crystal.
  • Metal heat dissipation devices have difficulty achieving rigidity due to material and construction methods, making it difficult to make them thinner. Furthermore, since the metal heat dissipation device has a metal portion that comes into contact with the fluid, there is room for improvement in terms of corrosion resistance. In contrast, in the heat dissipation device 1 according to the embodiment, the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50 are all made of ceramic. It is easier to make it thinner and has better corrosion resistance.
  • the heat dissipation device 1 is installed with the first member 10 facing upward, but the attitude of the heat dissipation device 1 is not limited to the example shown in FIG.
  • the heat dissipation device 1 may be installed with the first member 10 facing downward.
  • the heat dissipation device 1 is not limited to the horizontal arrangement as shown in FIG. 1, but may be arranged vertically.
  • the container 2 may have a plurality (in this case, two) of communication passages 60 that communicate the internal space of the operating region 100 with the outside.
  • One of the two communication paths 60 may be used, for example, as an injection hole for injecting fluid.
  • the other of the two communication passages 60 may be used, for example, as a discharge hole for discharging gas within the operating region 100.
  • fluid is injected into the internal space of the working area 100 from one communication path 60, and as a result, the gas present in the internal space of the working area 100 is transferred from the other communication path 60. It may be discharged to the outside.
  • the two communication paths 60 may be opened on the side surface of the container 2.
  • the two communication paths 60 may extend linearly from the side surface of the container 2 toward the operating area 100.
  • the two communication passages 60 may open on the same side of the container 2. In this case, by oriented the side surfaces where the two communicating passages 60 open upward, fluid can be efficiently injected into the working area 100, and gas existing in the internal space of the working area 100 can be efficiently discharged. I can do it.
  • a heat source may be placed on the top surface of the container 2. Therefore, by locating the communication passage 60 on the side surface of the container 2, a wider installation space for the heat source can be ensured compared to the case where the communication passage 60 is positioned on the upper surface of the container 2.
  • the two communication passages 60 may open on different sides of the container 2, respectively.
  • the heat dissipation device 1 does not necessarily need to have a plurality of communication paths 60.
  • the heat dissipation device 1 may be configured to have only one of the two communication paths 60 described above.
  • a metal tube 70 is inserted into the communication path 60, and the communication path 60 may be sealed by this metal tube 70.
  • the internal space of the heat dissipation device 1 is hermetically sealed, and the fluid is sealed in the operating region 100.
  • the heat dissipation device 1 may be an airtight container whose interior is sealed.
  • FIG. 2 is a diagram of the first member 10 according to the embodiment viewed from the Z-axis negative direction side to the Z-axis positive direction.
  • FIG. 2 shows the lower surface of the first member 10, specifically, the surface (third surface) facing the upper surface (first surface) of the intermediate member 30.
  • the first member 10 may have a lattice-shaped first groove portion 11 on the third surface.
  • the first groove 11 may have a first recess 11a recessed with respect to the third surface, and a plurality of first protrusions 11b located within the first recess 11a.
  • the first recess 11a is located at the center of the third surface, and may have a circular outline in plan view, for example.
  • the plurality of first protrusions 11b may be arranged in the first recess 11a at intervals in the vertical and horizontal directions.
  • the first groove portion 11 may have a lattice shape due to the first recess 11a and the plurality of first convex portions 11b.
  • the first groove forming region 110 may constitute a part of the actuation region 100. Further, the first member 10 may have a first frame region 210 having a rectangular frame shape surrounding the first groove forming region 110. The first frame area 210 may constitute a part of the frame area 200.
  • a plurality of (here, two) communication grooves 12 may be located in the first frame area 210.
  • the communication groove 12 may constitute a part of the communication path 60.
  • One end of the communication groove 12 may be located at the outer edge of the first member 10, and the other end of the communication groove 12 may be located at the outer edge of the first recess 11a.
  • the depth of the communication groove 12 in the thickness direction of the first member 10 (here, the Z-axis direction) may be deeper than the depth of the first recess 11a in the thickness direction of the first member 10.
  • the reinforcing plate 40b of the first reinforcing member 40 described above may be located at the center of the upper surface (fifth surface) located on the opposite side of the lower surface (third surface) of the first member 10.
  • FIG. 3 is a diagram of the second member 20 according to the embodiment viewed from the Z-axis positive direction side to the Z-axis negative direction.
  • FIG. 3 shows the upper surface of the second member 20, specifically, the surface (fourth surface) facing the lower surface (second surface) of the intermediate member 30.
  • the second member 20 has a grid-shaped second groove portion 21 on the fourth surface.
  • the second groove portion 21 may include a second recess 21a recessed with respect to the fourth surface, and a plurality of second convex portions 21b located within the second recess 21a.
  • the second recess 21a may be located at the center of the fourth surface, and the outline in plan view may be circular, for example.
  • the plurality of second protrusions 21b may be arranged in the second recess 21a at intervals in the vertical and horizontal directions.
  • the second groove portion 21 may have a lattice shape due to the second recess 21a and the plurality of second convex portions 21b.
  • the second groove forming region 120 may constitute a part of the actuation region 100.
  • the second member 20 may have a second frame region 220 having a rectangular frame shape surrounding the second groove forming region 120.
  • the second frame area 220 may constitute a part of the frame area 200.
  • the size of the second groove forming area 120 in the second member 20 may be the same as the size of the first groove forming area 110 in the first member 10. Further, the position of the second groove forming region 120 on the fourth surface of the second member 20 may be the same as the position of the first groove forming region 110 on the third surface of the first member 10.
  • the fluid can be efficiently circulated in the internal space of the heat dissipation device 1.
  • the shapes of the first groove portion 11 and the second groove portion 21 do not necessarily need to be grid-like.
  • a plurality of (here, two) communication grooves 22 may be located in the second frame area 220.
  • the communication groove 22 may constitute a part of the communication path 60.
  • One end of the communication groove 22 may be located at the outer edge of the second member 20, and the other end of the communication groove 22 may be located at the outer edge of the second recess 21a.
  • the depth of the communication groove 22 in the thickness direction of the second member 20 may be deeper than the depth of the second recess 21a in the thickness direction of the second member 20.
  • FIG. 4 is a diagram of the intermediate member 30 according to the embodiment viewed from the Z-axis positive direction side to the Z-axis negative direction.
  • the intermediate member 30 may have a third frame region 230 in the shape of a rectangular frame.
  • the third frame area 230 may constitute a part of the frame area 200.
  • the intermediate member 30 may be located between a central portion 32 that is circular in plan view and located inside the third frame region 230, and between the central portion 32 and the third frame region 230, and the intermediate member 30 may be located between the central portion 32 and the third frame region 230.
  • It may have a plurality of connection parts 33 that connect the third frame area 230.
  • the central portion 32 may be located at the center of the intermediate member 30.
  • the plurality of connecting portions 33 may extend radially from the central portion 32 toward the third frame region 230 while being spaced apart from each other.
  • the intermediate member 30 may further include a plurality of steam holes 36 and a plurality of reflux holes 37.
  • the plurality of steam holes 36 and the plurality of reflux holes 37 may both penetrate the upper surface (first surface) and the lower surface (second surface) of the intermediate member 30.
  • the plurality of steam holes 36 may function as part of a fluid steam flow path.
  • the plurality of steam holes 36 may be located between two adjacent connection parts 33. That is, the plural steam holes 36 and the plural connecting parts 33 may be located alternately in the circumferential direction. Similar to the plurality of connecting portions 33, the plurality of steam holes 36 may extend radially from the central portion 32 toward the third frame region 230 while being spaced apart from each other.
  • the plurality of reflux holes 37 may function as part of a fluid flow path.
  • the reflux hole 37 may be a fine hole having a smaller opening area than the steam hole 36 described above. Specifically, the reflux hole 37 may be small enough to cause capillary action to occur in the fluid passing through the reflux hole 37 .
  • a plurality (here, two) of communication holes 38 may be located in the third frame region 230.
  • the communication hole 38 may constitute a part of the communication path 60.
  • One end of the communication hole 38 may be located at the outer edge of the intermediate member 30, and the other end of the communication hole 38 may be located at the outer edge of the steam hole 36.
  • the communication hole 38 may penetrate the intermediate member 30 in the thickness direction.
  • FIG. 5 is a diagram in which the first groove forming region 110 shown in FIG. 2 and the second groove forming region 120 shown in FIG. 3 are superimposed on the intermediate member 30 shown in FIG. 4. As shown in FIG. 5, the first groove forming area 110 and the second groove forming area 120 may overlap with the third frame area 230 of the intermediate member 30.
  • the operating area 100 of the heat dissipation device 1 may have an internal space sandwiched between the first groove forming area 110 and the second groove forming area 120, and a fluid may be sealed in this internal space.
  • an intermediate member 30 may be interposed between the first groove forming area 110 and the second groove forming area 120 in the internal space, so that the operating area 100 can be connected to the first groove forming area 110 and the second groove forming area 120. It may be partitioned into a first space sandwiched between the intermediate member 30 and a second space sandwiched between the second groove forming region 120 and the intermediate member 30. These first space and second space may be connected through a steam hole 36 and a reflux hole 37 formed in the intermediate member 30.
  • FIGS. 6 and 7 are diagrams for explaining the flow of fluid in the heat dissipation device 1 according to the embodiment.
  • FIG. 6 is a diagram with the third frame region 230 omitted from the diagram shown in FIG. 5, and FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG.
  • FIGS. 6 and 7 the flow of steam is shown by white arrows, and the flow of liquid is shown by black arrows.
  • the first reinforcing member 40 and the second reinforcing member 50 are omitted.
  • the fluid is heated by a heat source and vaporizes into steam.
  • the heat source may be placed in the center of the upper surface (fifth surface) of the first member 10 (see FIGS. 1 and 2). Therefore, fluid vapor is generated in the center of the first space (the space sandwiched between the first member 10 and the intermediate member 30).
  • the fluid vapor diffuses in the in-plane direction (XY plane direction) of the heat dissipation device 1 through the first groove portion 11 of the first groove forming region 110 (see the white arrow shown in FIG. 6), and the plurality of vapors It moves to the second space (the space sandwiched between the second member 20 and the intermediate member 30) through the hole 36 (see the white arrow shown in FIG. 7).
  • the vapor that has moved to the second space condenses and becomes a liquid due to the decrease in temperature.
  • the liquefied fluid moves through the second groove forming region 120 toward the center of the heat dissipation device 1 due to the capillary force of the second groove portion 21 (see the black arrow shown in FIG. 6).
  • the fluid enters the reflux hole 37 and is returned to the first space by the capillary force of the reflux hole 37 (see the black arrow shown in FIG. 7).
  • the heat dissipation device 1 can transfer heat from the heat source.
  • FIG. 8 is a sectional view taken along the line VIII-VIII in FIG.
  • the communication path 60 may have the communication grooves 12 and 22 and the communication hole 38.
  • the depth of the communication groove 12 in the thickness direction (Z-axis direction) of the first member 10 may be deeper than the depth of the first recess 11a of the operating region 100 in the thickness direction of the first member 10.
  • the depth of the communication groove 22 in the thickness direction of the second member 20 may be deeper than the depth of the second recess 21a of the operating region 100 in the thickness direction of the second member 20. Therefore, the thickness T1 of the operating region 100 may be configured to be thinner than the thickness T2 of the communication path 60. With this configuration, the cycle of evaporation and condensation of the fluid in the working region 100 (internal space) can be repeated more quickly, and the fluid can be circulated efficiently.
  • a portion of the metal tube 70 may be inserted into the communication path 60 and the other portion may be closed to seal the communication path 60.
  • One end 701 of the metal tube 70 may be located within the communication path 60. In other words, the metal tube 70 does not need to be located in the working area 100. According to this configuration, it is possible to reduce the effective volume of the operating area 100 (internal space) from becoming smaller.
  • One end 701 of the metal tube 70 may be located closer to the operating region 100 (internal space) than the longitudinal center of the communication path 60. With this configuration, when the metal tube 70 is inserted, it is difficult to shift, and the positional accuracy of the metal tube 70 is improved. Further, the other end 702 of the metal tube 70 may be located outside the communication path 60.
  • the metal tube 70 may have an insertion portion 71, a protruding portion 72, and a collar portion 73.
  • the insertion portion 71 is a portion of the metal tube 70 located within the communication path 60.
  • the protruding portion 72 is a portion of the metal tube 70 located outside the communication path 60.
  • the length L1 of the insertion portion 71 may be shorter than the length L2 of the pop-out portion 72.
  • the length L1 of the insertion portion 71 and the length L2 of the protruding portion 72 are shown based on the lower surface of the flange portion 73, but the reference position is not limited to this. .
  • the position of the opening 201 may be used as a reference.
  • the collar portion 73 may be located at the protruding portion 72.
  • the flange portion 73 may be joined to the surface of the container 2 on which the opening 201 of the communication path 60 is located via a brazing material 74 such as silver solder. With a structure in which the flange portion 73 and the container 2 are joined via the brazing material 74, the durability of the connection between the container 2 and the metal tube 70 is high.
  • the brazing material 74 may be located not only between the flange portion 73 and the container 2, but also between the insertion portion 71 and the communication path 60, for example. According to this configuration, the connection durability between the container 2 and the metal tube 70 is high. Further, the brazing material 74 may be located so as to straddle the surface of the flange portion 73 opposite to the joint surface with the container 2 and the opening surface of the communication path 60 in the container 2. That is, the brazing material 74 may be positioned so as to entirely cover the flange portion 73. According to this configuration, the connection durability between the container 2 and the metal tube 70 is high.
  • the method for joining the metal tube 70 and the container 2 is not limited to the above method. It is sufficient if the metal tube 70 and the container 2 can be joined, and the flange portion 73 is not necessarily a necessary configuration.
  • FIG. 9 is a sectional view taken along the line IX-IX in FIG. Moreover, in FIG. 9, the first reinforcing member 40 and the second reinforcing member 50 are omitted.
  • the shape of the communication path 60 may be a polygon having a plurality of corners.
  • the first member 10, second member 20, and intermediate member 30 that constitute the container 2 are obtained by processing a laminate made of a plurality of layers.
  • the first member 10 having the communication groove 12 is obtained by processing the laminate made of the layers 10a and 10b.
  • the second member 20 having the communication groove 22 is obtained by processing the laminate made of the layers 20a and 20b.
  • the intermediate member 30 having the communicating holes 38 can be obtained by processing the laminate made of the layers 30a and 30b.
  • the communication path 60 since the communication path 60 is formed of a plurality of layers, it has a polygonal shape having a plurality of corners.
  • the shape of the metal tube 70 may be circular in cross-sectional view. Therefore, the shapes of the metal tube 70 and the communication path 60 may be dissimilar. Further, the heat dissipation device 1 may have a space between the outer peripheral surface of the metal tube 70 and the inner peripheral surface of the communication path 60.
  • the first member 10, second member 20, and intermediate member 30 that constitute the communication path 60 are made of ceramic. Ceramics generally have a higher Young's modulus, in other words, higher rigidity than metals.
  • the metal tube 70 which is made of metal, is deformed (expanded) by heat in a direction that expands the communication path 60. Then, stress is generated in the communication path 60 due to such deformation. If there is a space between the outer circumferential surface of the metal tube 70 and the inner circumferential surface of the communication path 60, even if the metal tube 70 expands, the expansion of the metal tube 70 will be more difficult than when there is no such space. It can be released into space. Therefore, since the shapes of the metal tube 70 and the communication path 60 are dissimilar in cross-sectional view, the stress applied to the container 2 due to the deformation of the metal tube 70 due to temperature changes (particularly, temperature increases) can be alleviated. I can do it.
  • one interior angle in the shape of the communication path 60 may be 90° or more, and the sum of all interior angles may be 360° or more.
  • the shape of the communication path 60 may have a vertical width W1 and a horizontal width W2 different from each other.
  • the metal tube 70 may be in contact with the communication path 60 at multiple points in a cross-sectional view.
  • FIG. 9 shows an example in which the metal tube 70 contacts the communication path 60 at two points, the metal tube 70 may contact the communication path 60 at three or more points in a cross-sectional view. With this configuration, the metal tube 70 can be supported with high precision.
  • the cross-sectional shape of the communication path 60 is not limited to the example shown in FIG. 9.
  • the communicating path 60 may have a square shape or a rectangular shape in cross-sectional view.
  • the communication path 60 may have a circular shape, for example, an elliptical shape, which is dissimilar to the cross-sectional shape of the metal tube 70 in cross-sectional view.
  • the heat dissipation device 1 may be a closed container made of ceramic. That is, the first member 10, the second member 20, and the intermediate member 30 may be made of ceramic.
  • Ceramics generally have a larger Young's modulus than metals, in other words, they have higher rigidity.
  • the metal tube 70 which is made of metal, is deformed by heat in a direction that expands the communication path 60. If the heat dissipation device is made of metal, if the metal tube 70 deforms in a direction that pushes the communication path 60 wider, the communication path 60 is also likely to deform along with this deformation. On the other hand, in the heat dissipation device 1 made of ceramic, even if the metal tube 70 deforms in a direction that pushes the communication passage 60 wider, the communication passage 60 is less likely to deform compared to a heat dissipation device made of metal. Therefore, the ceramic heat dissipation device 1 can more easily ensure airtightness against temperature changes (particularly temperature rises) than metal heat dissipation devices.
  • ceramics include most metals except for some metals such as W (tungsten), Mo (molybdenum), Ti (titanium), Nb (niobium), and Zr (zirconium).
  • the coefficient of thermal expansion is comparatively small. That is, the heat dissipation device 1 made of ceramic is less likely to be thermally deformed than a heat dissipation device made of metal. For this reason, in the ceramic heat dissipation device 1, compared to a metal heat dissipation device, the state in which the metal tube 70 presses the communication path 60 is easily maintained. Therefore, according to the ceramic heat dissipation device 1, it is easier to ensure hermeticity against thermal cycles compared to a metal heat dissipation device. Furthermore, the ceramic heat dissipation device 1 is less likely to corrode even when exposed to acid or high-temperature steam, and is less likely to oxidize even at high temperatures, compared to a metal heat dissipation device.
  • examples of the ceramic that constitutes the first member 10, the second member 20, and the intermediate member 30 include alumina, zirconia, and silicon carbide.
  • alumina is often used as the ceramic constituting the first member 10, the second member 20, and the intermediate member 30 because it is inexpensive, causes less harm to the environment, and has excellent workability. preferable.
  • the interior of the heat dissipation device 1 is in a reduced pressure state (including vacuum) when no heat source is placed on the upper surface (fifth surface) of the first member 10.
  • a heat source when placed on the upper surface of the first member 10, the fluid evaporates and expands in volume, so that the inside of the heat dissipation device 1 becomes pressurized.
  • the pressure state inside the heat dissipation device 1 changes alternately between a reduced pressure state and a pressurized state depending on the presence or absence of a heat source.
  • the metal tube 70 according to the embodiment is pressed toward the communication path 60, it is easy to ensure both hermeticity in a reduced pressure state and hermeticity in a pressurized state.
  • a green sheet is formed by a doctor blade method, a roll compaction method, or the like, and a laminate is obtained by laminating a plurality of green sheets.
  • each of the molded bodies of the first member 10, the second member 20, and the intermediate member 30 is obtained by subjecting the obtained laminate to laser processing or punching with a die.
  • a molded body of the intermediate member 30 in which a plurality of steam holes 36, a plurality of return holes 37, and a plurality of communication holes 38 are formed can be obtained.
  • a molded body of the first member 10 in which a plurality of communication grooves 12 and a first groove forming region 110 are formed is obtained.
  • a molded body of the second member 20 in which a plurality of communication grooves 22 and a second groove forming region 120 are formed is obtained.
  • the molded bodies of the first member 10, the second member 20, and the intermediate member 30 are stacked and fired in the order of the second member 20, the intermediate member 30, and the first member 10.
  • a sintered body of the container 2 in which the second member 20 and the intermediate member 30 are integrated is obtained.
  • the first member 10, the second member 20, and the intermediate member 30 are integrally molded. Therefore, since an adhesive or the like is not required, a highly reliable heat dissipation device 1 can be obtained.
  • the method for obtaining each of the molded bodies of the first member 10, the second member 20, and the intermediate member 30 is not limited to the above-mentioned method; for example, by processing green sheets and then laminating the green sheets.
  • Each molded article may be obtained.
  • the molded body of the container 2 is obtained by separately producing the molded bodies of the first member 10, the second member 20, and the intermediate member 30, and then stacking them.
  • the molded body of the container 2 may be obtained by sequentially stacking processed green sheets.
  • the insertion portions 71 of the metal tubes 70 are inserted into the plurality of communication paths 60, respectively. Thereafter, the flange portion 73 of the metal tube 70 and the container 2 are joined via the brazing material 74.
  • fluid is injected into the sintered body from, for example, one of the two metal tubes 70.
  • the gas existing inside the sintered body is discharged to the outside from the other metal tube 70 as the fluid is injected.
  • the inside of the sintered body is evacuated via the communication path 60 using a pressure reducing device such as a vacuum pump.
  • a pressure reducing device such as a vacuum pump.
  • the communication path 60 is sealed while the inside of the sintered body is evacuated. Specifically, as shown in FIG. 10, one or more locations of the protruding portion 72 (see FIG. 8) of the metal tube 70 are pressed against each other to seal the inside of the container 2.
  • the method of sealing the communication path 60 is not limited to the above example.
  • the communicating path 60 may be sealed by welding the other end 702 (see FIG. 8) of the metal tube 70.
  • the communicating path 60 may be sealed by both pressure welding and welding.
  • the length L1 of the insertion portion 71 of the metal tube 70 is shorter than the length L2 of the protruding portion 72, but the present invention is not limited to this configuration.
  • the length L1 of the insertion portion 71 may be longer than the length L2 of the protruding portion 72. This configuration makes it difficult for the metal tube 70 to come off from the container 2.
  • the thermal device includes a ceramic container (as an example, the container 2), a fluid (as an example, fluid), and a metal tube (as an example, metal tube 70).
  • the container includes an internal space (for example, the operating area 100), an opening that connects to the internal space (for example, the opening 201), and a communication path that connects the internal space and the opening (for example, the communication path 60). has.
  • a fluid is located in the interior space. A part of the metal tube is inserted into the communication path, and the other part is closed.
  • the container of the thermal device according to the embodiment is made of ceramic, it has excellent durability against temperature changes compared to the metal container described in Patent Document 1.
  • the thermal device according to the embodiment since a part of the metal tube is located in the communication path of the thermal device, even if the metal tube is deformed due to a temperature change, the entire container is not subjected to stress. It is possible to relieve stress.
  • the communication path and the metal tube are dissimilar, a gap is created between the communication path and the metal tube, and when the metal tube is deformed, stress can be further alleviated. I can do it.
  • thermal device According to the thermal device according to the embodiment, durability can be improved.
  • Thermal devices according to the present disclosure are not limited to heat dissipation devices.
  • the thermal device according to the present disclosure may be a heat storage device that stores latent heat associated with phase transformation of a heat storage material (an example of a phase change material) as thermal energy.
  • the heat storage material used is one that undergoes solid-liquid phase transformation or one that undergoes solid-solid phase transformation.
  • the phase change substance does not necessarily need to undergo gas-liquid phase transformation.
  • the phase change material does not necessarily need to be liquid, but may be solid.
  • Heat dissipation device 2 Container 10 First member 10a, 10b Layer 11 First groove 11a First recess 11b First protrusion 12 Communication groove 20 Second member 20a, 20b Layer 21 Second groove 21a Second recess 21b Second protrusion 22 Communication groove 30 Intermediate member 30a, 30b Layer 32 Central part 33 Connection part 36 Steam hole 37 Reflux hole 38 Communication hole 40 First reinforcement member 40a, 40b Reinforcement plate 50 Second reinforcement member 50a, 50b Reinforcement plate 60 Communication path 70 Metal Pipe 71 Insertion part 72 Projecting part 73 Flange part 74 Brazing material 100 Working area 110 First groove forming area 120 Second groove forming area 200 Frame area 201 Opening part 210 First frame area 220 Second frame area 230 Third frame area 701 One end 702 Other end L1 Length of the insertion part L2 Length of the protruding part T1 Thickness of the operating area T2 Thickness of the communication path W1 Vertical width W2 Width

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PCT/JP2023/018497 2022-05-31 2023-05-17 熱デバイス Ceased WO2023234042A1 (ja)

Priority Applications (4)

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EP23815801.8A EP4534942A4 (en) 2022-05-31 2023-05-17 Thermal device
JP2024524329A JP7846759B2 (ja) 2022-05-31 2023-05-17 熱デバイス
CN202380040566.4A CN119137437A (zh) 2022-05-31 2023-05-17 热器件
US18/868,061 US20250354759A1 (en) 2022-05-31 2023-05-17 Thermal device

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JP2022088973 2022-05-31

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360755A (en) * 1976-11-12 1978-05-31 Ngk Spark Plug Co Ltd Ceramic heat conducting panel and it's manufacturing
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JPS5885555A (ja) * 1981-11-17 1983-05-21 Ngk Spark Plug Co Ltd セラミツクヒ−トシンク
JPH01285791A (ja) * 1988-05-11 1989-11-16 Fujikura Ltd 高温用セラミックヒートパイプ
JP2000213881A (ja) 1999-01-26 2000-08-02 Furukawa Electric Co Ltd:The 平型ヒ―トパイプの製造方法
JP2011096994A (ja) * 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体
JP2011102691A (ja) * 2009-11-10 2011-05-26 Pegatron Corp ベーパーチャンバー及びその製造方法
US20140076995A1 (en) * 2012-09-14 2014-03-20 Chin-Wen Wang Vapor chamber and method of manufacturing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360755A (en) * 1976-11-12 1978-05-31 Ngk Spark Plug Co Ltd Ceramic heat conducting panel and it's manufacturing
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JPS5885555A (ja) * 1981-11-17 1983-05-21 Ngk Spark Plug Co Ltd セラミツクヒ−トシンク
JPH01285791A (ja) * 1988-05-11 1989-11-16 Fujikura Ltd 高温用セラミックヒートパイプ
JP2000213881A (ja) 1999-01-26 2000-08-02 Furukawa Electric Co Ltd:The 平型ヒ―トパイプの製造方法
JP2011096994A (ja) * 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体
JP2011102691A (ja) * 2009-11-10 2011-05-26 Pegatron Corp ベーパーチャンバー及びその製造方法
US20140076995A1 (en) * 2012-09-14 2014-03-20 Chin-Wen Wang Vapor chamber and method of manufacturing the same

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JP7846759B2 (ja) 2026-04-15
CN119137437A (zh) 2024-12-13
EP4534942A1 (en) 2025-04-09
JPWO2023234042A1 (https=) 2023-12-07
EP4534942A4 (en) 2026-04-29

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